CN105789059B

CN105789059B - The method detached after wafer bonding

Info

Publication number: CN105789059B
Application number: CN201610247519.9A
Authority: CN
Inventors: 唐昊
Original assignee: Brilliant Microelectronics Of Zhejiang Zhong Na Science And Technology Ltd
Current assignee: Brilliant Microelectronics Of Zhejiang Zhong Na Science And Technology Ltd
Priority date: 2016-04-19
Filing date: 2016-04-19
Publication date: 2018-08-03
Anticipated expiration: 2036-04-19
Also published as: CN105789059A

Abstract

The present invention provides a kind of method detached after wafer bonding, it includes the following steps：Step 1: the slide glass of the wafer after bonding is placed up, then tool is utilized to destroy slide glass；Step 2: the slide glass after destruction is taken away, it is left with isolation film and is bonded the wafer of glue；Step 3: tearing isolation film, it is left bonding glue and wafer, then cleaning bonding glue, completes the separation of wafer.The above method is used, although destroying slide glass, the cost of slide glass wants much lower, within tolerance interval, and the device detached can be very simple, and the cost of device can substantially reduce, and need not be aligned, then the time spent can also reduce very much, improve production efficiency.

Description

The method detached after wafer bonding

Technical field：

It is especially a kind of method detached after wafer bonding the present invention relates to microelectronics technology.

Background technology：

Direction with the people requirement to electronic product towards miniaturization is developed, and electronic chip is also towards more and more thinner Direction is developed, if but when being thinned to 100 microns or less as the thickness of the wafer of material using silicon, being very easy to occur Fragment or be when being processed to wafer due to stress cause wafer bow deformation etc., this ultra-thin wafers can not be carried out Direct working process.Therefore, in order to this kind of ultra-thin wafers of working process, need by this ultra-thin wafer first with a slide glass Interim bonding, after bonding, wafer is integrated with the viscous section of slide glass, so that it may wafer to be thinned, the manufacture of TSV, be connected up again The manufacture of layer forms the making of the techniques such as intraconnection.Then wafer is detached with slide glass again, and to be thinned after wafer into The techniques such as row cleaning, cutting, complete the processing technology to this ultra-thin wafer.

Currently, the patent application of Publication No. CN104485294A discloses a kind of wafer bonding method, this method is It is surface-treated on slide glass, forms one layer of isolation film, the bond degree between isolation film and slide glass is moderate, deliberately do not go to tear In the case of, film will not be detached from from slide glass, but when force is torn, can be removed film from slide glass, when being then bonded Coating between the front of slide glass with isolation film and wafer be bonded glue, wafer and slide glass are bonded together, elder generation when separation Certain gap is separated between the isolation film and slide glass of the side of wafer after bonding, slide glass is then adsorbed on using vacuum cup The back side, force remove slide glass from isolation film.Although more convenient than the prior art using this separation method, however, there remains It is exerted a force by sucker and removes from isolation film slide glass, operation or trouble, and also if to be suitable for industrialized production also need Manipulator is wanted, complicated, cost is higher.

For this purpose, the patent application of Publication No. CN104979262A has also been proposed a kind of method detached after wafer bonding, It produces the air-flow of the junction towards wafer and slide glass bonding using air-stream generating device, makes wafer and slide glass by air-flow Separation.In this way, the junction that gas nozzle is aligned to wafer and slide glass is needed, and in order to make wafer and slide glass be easier Separation, generally can also produce a gap in the isolation film of the junction of wafer and slide glass, then by air-flow against gap It blows so that wafer and slide glass are easier to detach, and using this structure, need an air-stream generating device, still can be more complicated, If manufacturing gap or the junction of gas nozzle alignment wafer and slide glass being made to need more accurate aligning equipment, cost Still relatively high.

Invention content：

Present invention solves the technical problem that being to overcome existing technological deficiency, a kind of, separation letter simple using equipment is provided The method detached after single and lower-cost wafer bonding.

Technical solution provided by the invention is：The present invention provides a kind of method detached after wafer bonding, it includes following Step：

Step 1: the slide glass of the wafer after bonding is placed up, then tool is utilized to destroy slide glass；

Step 2: the slide glass after destruction is taken away, it is left with isolation film and is bonded the wafer of glue；

Step 3: tearing isolation film, it is left bonding glue and wafer, then cleaning bonding glue, completes the separation of wafer.

After the above method, needed brokenly in this way in the way of destruction slide glass to detach slide glass and wafer Then slide glass after destruction is taken away from wafer since the bonding force between slide glass and isolation film is weaker, takes it away by bad slide glass Afterwards, so that it may directly isolation film to tear it down from wafer, it is left with bonding glue and wafer, at this time when cleaning bonding glue, one As the mode impregnated clean bonding glue, due to the one side exposure of bonding glue, bonding glue can come into full contact with cleaning solution, clearly It is more much higher than the prior art to wash efficiency.The above method is used, although destroying slide glass, the cost of slide glass wants much lower, Within tolerance interval, and the device detached can be very simple, and the cost of device can substantially reduce, and does not need pair Standard improves production efficiency then the time spent can also reduce very much.

In the step 1, the destruction slide glass is to be cut slide glass open from centre using cutter, is cut in the centre of slide glass Go out opening.In this way, from centre cut slide glass after, due to the bonding force between slide glass and isolation film be largely The bond degree of edge, slide glass middle section is relatively low, therefore, it is very easy to slide glass can be taken away from isolation film, and no longer The equipment of the forces such as air blowing or sucker is needed, and does not allow destructible to be bonded together with slide glass by the way of cutting slide glass Wafer.

Description of the drawings：

Attached drawing 1 is the schematic diagram of the separated wafer of the method for the present invention；

Attached drawing 2 is the structural schematic diagram of the embodiment of the present invention

The structural schematic diagram of 3 another embodiment of the present invention of attached drawing；

As shown in the figure：1, slide glass, 2 wafers, 3, isolation film, 4, bonding glue.

Specific implementation mode

It elaborates in the following with reference to the drawings and specific embodiments to the present invention：

As shown in Figure 1-Figure 3：The method of the present invention wafer after bonding to be separated be structure shown in FIG. 1, on slide glass 1 It is surface-treated, forms one layer of isolation film 3, the bond degree between isolation film 3 and slide glass 1 is moderate, the case where deliberately not going to tear Under, film will not be detached from from slide glass, but when force is torn, can be removed film from slide glass, by band when being then bonded There is coating between the front of the slide glass 1 of isolation film 3 and wafer 2 to be bonded glue 4, wafer and slide glass are bonded together, that is, work as slide glass When placing up, it is followed successively by slide glass 1, isolation film 3, bonding glue 4 and wafer 2 from top to bottom.Between isolation film and slide glass Bonding force mostlys come from the marginal portion of slide glass and isolation film contact.

In the step 1, the destruction slide glass is cut slide glass open from centre using cutter, is cut out in the centre of slide glass Opening.In this way, after cutting slide glass from centre, since the bonding force between slide glass and isolation film is largely on side At edge, the bond degree of slide glass middle section is relatively low, therefore, it is very easy to can take slide glass from isolation film away, and no longer needs It blows or the equipment of the forces such as sucker, and does not allow destructible to be bonded together with slide glass by the way of cutting slide glass Wafer.

Fig. 2 is one of embodiment, has cut two knives on slide glass by cutter, slide glass has been cut into 4 parts from centre, in this way from load It is just easy to take away this 4 portions of slide glasses from isolation film among piece, certainly in cutting, the depth of cutting is controlled, not hinder To subject to bonding glue, it thus will not more be damaged to wafer.

Fig. 3 is the two of embodiment, has cut three knives on slide glass by cutter, slide glass is divided into 6 parts.In this way in processing one A bit when larger wafer, it may be used and cut the mode of several knives to destroy slide glass more.Certainly it is carried out either on slide glass any Cutting mode, as long as in a manner of destroying slide glass then model should all be protected in the application by what slide glass was separated from isolation film Within enclosing.

Claims

1. a kind of method detached after wafer bonding, it is characterised in that：It includes the following steps：

2. the method detached after wafer bonding according to claim 1, it is characterised in that：It is described broken in the step 1 Bad slide glass is to be cut slide glass open from centre using cutter, and opening is cut out in the centre of slide glass.