CN105789059A - Method for separating bonded wafers - Google Patents
Method for separating bonded wafers Download PDFInfo
- Publication number
- CN105789059A CN105789059A CN201610247519.9A CN201610247519A CN105789059A CN 105789059 A CN105789059 A CN 105789059A CN 201610247519 A CN201610247519 A CN 201610247519A CN 105789059 A CN105789059 A CN 105789059A
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- China
- Prior art keywords
- slide glass
- wafer
- bonding
- isolating membrane
- bonding glue
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a method for separating bonded wafers. The method includes the steps of placing the bonded wafers with the carrying sheet side facing upward, damaging the carrying sheet side with a tool, removing the damaged carrying sheet, leaving the wafers with isolated films and bonding glue, tearing off the isolated films, leaving the wafers with bonding glue and washing out the bonding glue to complete wafer separation. In the method, the carrying sheet is damaged. The cost of the carrying sheet is much lower and acceptable, while the separating device can be much simpler and cheaper. No aligning is needed, time for separating can be shortened, and the production efficiency is improved.
Description
Technical field:
The present invention relates to microelectronics technology, a kind of method separated after being especially wafer bonding.
Background technology:
Along with the requirement of electronic product is developed by people towards the direction of miniaturization, electronic chip also develops towards increasingly thinner direction, if but when being thinned to 100 microns using silicon as the thickness of the wafer of material or be following, it is very easy to fragment occur or when wafer is processed owing to stress causes wafer bow deformation etc., it is impossible to this ultra-thin wafers is carried out direct processed.Therefore, in order to enable this kind of ultra-thin wafers of processed, it is necessary to first this ultra-thin wafer is bonded with a slide glass, after bonding temporarily, the viscous joint of wafer and slide glass is integrated, it is possible to wafer carries out the manufacture of thinning, the manufacture of TSV, again wiring layer, forms the techniques such as intraconnection and make.Then again wafer and slide glass are easily separated, and the wafer after thinning is carried out, the technique such as cutting, complete the processing technique to this ultra-thin wafer.
At present, the patent application that publication number is CN104485294A discloses a kind of wafer bonding method, this method is to do surface treatment on slide glass, form one layer of isolating membrane, bond degree between isolating membrane and slide glass is moderate, when deliberately not going to tear, thin film will not depart from from slide glass, but when force is torn, thin film can be peeled off from slide glass, then during bonding, coating between front and the wafer of the slide glass with isolating membrane is bonded glue, wafer and slide glass are bonded together, certain gap is separated between isolating membrane and the slide glass of the first side of wafer after bonding during separation, then vacuum cup is adopted to be adsorbed on the slide glass back side, exert a force and slide glass is peeled off from isolating membrane.Although adopting this separation method more convenient than prior art, but need nonetheless remain for being peeled off from isolating membrane by slide glass by sucker force, operation trouble, and if to be applicable to industrialized production and also need to mechanical hand, structure complexity, relatively costly.
For this, publication number is a kind of method separated after the patent application of CN104979262A also been proposed wafer bonding, and it adopts air-stream generating device to produce the air-flow of the junction being bonded towards wafer and slide glass, makes wafer separate with slide glass by air-flow.Adopt in this way, need to be directed at valve the junction of wafer and slide glass, and in order to make wafer and slide glass be easier to separate, generally also can produce a gap at the isolating membrane of wafer and the junction of slide glass, then pass through air-flow to blow facing to gap, wafer and slide glass is made to be easier to separate, adopt this structure, need an air-stream generating device, still can be more complicated, if manufacturing gap or making the junction of valve alignment wafer and slide glass need more accurate aligning equipment, cost is still higher.
Summary of the invention:
Present invention solves the technical problem that and be, overcome existing technological deficiency, it is provided that a kind of adopt that equipment is simple, separate simple and lower-cost wafer bonding after the method that separates.
Present invention provide the technical scheme that a kind of method that the present invention separates after providing wafer bonding, it comprises the following steps:
Step one, face up placements by the slide glass of wafer after bonding, then utilizes instrument destruction slide glass；
Step 2, the slide glass after destroying is taken away, the remaining wafer with isolating membrane and bonding glue；
Step 3, tear isolating membrane, remaining bonding glue and wafer, then cancel key rubber alloy, complete the separation of wafer.
After adopting said method, the mode destroying slide glass is utilized to separate slide glass and wafer, adopt in this way, need to destroy slide glass, owing to the bonding force between slide glass and isolating membrane is more weak, then the slide glass after destruction is taken away from wafer, after taking away, just directly isolating membrane can be torn it down from wafer, be left with bonding glue and wafer, now during cancel key rubber alloy, the general mode cancel key rubber alloy soaked, one side owing to being bonded glue exposes, and therefore bonding glue and cleanout fluid can be fully contacted, cleaning efficiency than prior art high a lot.Adopt said method, although destroy slide glass, but the cost of slide glass is much lower, within tolerance interval, and the device separated can be very simple, and the cost of device can be substantially reduced, and need not be aligned, then the time of cost also can reduce a lot, improves production efficiency.
In described step one, described destruction slide glass is to adopt cutter to be cut open from centre by slide glass, cuts out opening in the centre of slide glass.Adopt in this way, after cutting slide glass from centre, owing to the bonding force major part between slide glass and isolating membrane is in edge, the bond degree of slide glass mid portion is relatively low, therefore, it is easy for being taken away from isolating membrane by slide glass, and is no longer necessary to the equipment that air blowing or sucker etc. exert a force, and adopt the mode of cutting slide glass to be not easy to destroy the wafer being bonded together with slide glass.
Accompanying drawing illustrates:
The schematic diagram of the wafer that accompanying drawing 1 separates for the inventive method；
Accompanying drawing 2 is the structural representation of embodiments of the invention
The structural representation of 3 another embodiment of the present invention of accompanying drawing；
As shown in the figure: 1, slide glass, 2 wafers, 3, isolating membrane, 4, bonding glue.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is elaborated:
As shown in Figure 1-Figure 3: the wafer after the bonding that the inventive method to separate is the structure shown in Fig. 1, slide glass 1 is cooked surface treatment, form one layer of isolating membrane 3, bond degree between isolating membrane 3 and slide glass 1 is moderate, when deliberately not going to tear, thin film will not depart from from slide glass, but when force is torn, thin film can be peeled off from slide glass, then during bonding, coating between front and the wafer 2 of the slide glass 1 with isolating membrane 3 is bonded glue 4, wafer and slide glass are bonded together, namely when slide glass faces up placement, it is followed successively by slide glass 1 from top to bottom, isolating membrane 3, bonding glue 4 and wafer 2.Bonding force between isolating membrane and slide glass mostlys come from the marginal portion that slide glass contacts with isolating membrane.
Present invention provide the technical scheme that a kind of method that the present invention separates after providing wafer bonding, it comprises the following steps:
Step one, face up placements by the slide glass of wafer after bonding, then utilizes instrument destruction slide glass；
Step 2, the slide glass after destroying is taken away, the remaining wafer with isolating membrane and bonding glue；
Step 3, tear isolating membrane, remaining bonding glue and wafer, then cancel key rubber alloy, complete the separation of wafer.
After adopting said method, the mode destroying slide glass is utilized to separate slide glass and wafer, adopt in this way, need to destroy slide glass, owing to the bonding force between slide glass and isolating membrane is more weak, then the slide glass after destruction is taken away from wafer, after taking away, just directly isolating membrane can be torn it down from wafer, be left with bonding glue and wafer, now during cancel key rubber alloy, the general mode cancel key rubber alloy soaked, one side owing to being bonded glue exposes, and therefore bonding glue and cleanout fluid can be fully contacted, cleaning efficiency than prior art high a lot.Adopt said method, although destroy slide glass, but the cost of slide glass is much lower, within tolerance interval, and the device separated can be very simple, and the cost of device can be substantially reduced, and need not be aligned, then the time of cost also can reduce a lot, improves production efficiency.
In described step one, described destruction slide glass adopts cutter to be cut open from centre by slide glass, cuts out opening in the centre of slide glass.Adopt in this way, after cutting slide glass from centre, owing to the bonding force major part between slide glass and isolating membrane is in edge, the bond degree of slide glass mid portion is relatively low, therefore, it is easy for being taken away from isolating membrane by slide glass, and is no longer necessary to the equipment that air blowing or sucker etc. exert a force, and adopt the mode of cutting slide glass to be not easy to destroy the wafer being bonded together with slide glass.
Fig. 2 is one of embodiment, on slide glass, two cuttves have been cut by cutter, slide glass is cut into 4 parts from centre, so just it is easy to from isolating membrane, take away these 4 portions of slide glasses in the middle of slide glass, certainly when cutting, control cutting the degree of depth, with do not hurt bonding glue be as the criterion, thus more will not be damaged to wafer.
Fig. 3 is the two of embodiment, has cut three cuttves by cutter on slide glass, and slide glass divide into 6 parts.So when processing some bigger wafers, it is possible to adopt the mode cutting a few cutter to destroy slide glass more.Certainly no matter is on slide glass, carry out any cutting mode, as long as by then all should within the application protection domain from what isolating membrane was separated by slide glass in the way of destroying slide glass.
Claims (2)
1. the method separated after a wafer bonding, it is characterised in that: it comprises the following steps:
Step one, face up placements by the slide glass of wafer after bonding, then utilizes instrument destruction slide glass；
Step 2, the slide glass after destroying is taken away, the remaining wafer with isolating membrane and bonding glue；
Step 3, tear isolating membrane, remaining bonding glue and wafer, then cancel key rubber alloy, complete the separation of wafer.
2. the method separated after wafer bonding according to claim 1, it is characterised in that: in described step one, described destruction slide glass is to adopt cutter to be cut open from centre by slide glass, cuts out opening in the centre of slide glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610247519.9A CN105789059B (en) | 2016-04-19 | 2016-04-19 | The method detached after wafer bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610247519.9A CN105789059B (en) | 2016-04-19 | 2016-04-19 | The method detached after wafer bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105789059A true CN105789059A (en) | 2016-07-20 |
| CN105789059B CN105789059B (en) | 2018-08-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610247519.9A Active CN105789059B (en) | 2016-04-19 | 2016-04-19 | The method detached after wafer bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105789059B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111745531A (en) * | 2020-07-01 | 2020-10-09 | 长江存储科技有限责任公司 | Curved surface grinding device and chip extraction method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090181519A1 (en) * | 2008-01-11 | 2009-07-16 | Disco Corporation | Lamination device manufacturing method |
| CN102460677A (en) * | 2009-04-16 | 2012-05-16 | 休斯微技术股份有限公司 | Improved apparatus for temporary wafer bonding and debonding |
| CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
-
2016
- 2016-04-19 CN CN201610247519.9A patent/CN105789059B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090181519A1 (en) * | 2008-01-11 | 2009-07-16 | Disco Corporation | Lamination device manufacturing method |
| CN102460677A (en) * | 2009-04-16 | 2012-05-16 | 休斯微技术股份有限公司 | Improved apparatus for temporary wafer bonding and debonding |
| CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111745531A (en) * | 2020-07-01 | 2020-10-09 | 长江存储科技有限责任公司 | Curved surface grinding device and chip extraction method |
| CN111745531B (en) * | 2020-07-01 | 2021-08-27 | 长江存储科技有限责任公司 | Curved surface grinding device and chip extraction method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105789059B (en) | 2018-08-03 |
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