Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
  • H01G2/02—Mountings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
  • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M3/00—Conversion of DC power input into DC power output
  • H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
  • H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
  • H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC

Definitions

• Embodiments of the present invention relate to capacitors and capacitor assemblies.
• capacitors equipped with plate terminals have been designed to reduce size, improve cooling performance, and reduce inductance.
• the problem that this invention aims to solve is to provide a capacitor and capacitor assembly that can be made smaller, have lower inductance, and have improved cooling performance through improvements to the terminal connection structure.
• the capacitor and capacitor assembly of this embodiment have a capacitor body and plate-shaped terminals.
• the capacitor body has a planar plate surface.
• the plate terminals have connection surfaces parallel to the plate surface that can be used to connect to mating components.
• the connection surfaces of the positive and negative plate-shaped terminals are offset from each other in the normal direction of the plate surface.
• FIG. 2 is a circuit diagram illustrating an example of a DAB circuit according to the embodiment.
• 1 is a perspective view of a power conversion device according to an embodiment
• FIG. 2 is a perspective view of a capacitor of the power conversion device according to the embodiment.
• FIG. 2 is a perspective view of a capacitor pack of the capacitor according to the embodiment.
• 5 is a cross-sectional view taken along the line VV in FIG. 4;
• FIG. 10 is a perspective view of the capacitor pack with a first conductive plate attached thereto.
• FIG. 7 is a perspective view of a state in which a second conductor plate is further attached to the state shown in FIG. 6 .
• 4A and 4B are explanatory diagrams of a terminal butting portion of the capacitor assembly according to the embodiment.
• Fig. 1 is a circuit diagram showing an example of a DAB (Dual Active Bridge) circuit 1 according to an embodiment.
• Fig. 2 is a perspective view of a power conversion device 2 according to an embodiment.
• arrow Y in the figure indicates the front-to-rear direction
• arrow X the left-to-right direction
• arrow Z the up-to-down direction.
• arrow FR indicates the forward direction in the Y direction
• arrow LH the leftward direction in the X direction
• arrow UP the upward direction in the Z direction.
• the front-to-rear and left-to-right directions in the embodiment do not limit the arrangement of the power conversion device 2.
• the power conversion device 2 constitutes a DAB circuit 1, a type of circuit method that performs DC/DC conversion while maintaining isolation.
• the DAB circuit 1 comprises two bridge circuits (active bridges) and a high-frequency transformer 6.
• the power conversion device 2 is a distribution board, panel board, control panel, etc. that constitutes a power supply device, motor drive device, etc.
• Each power conversion device 2 comprises various circuit components such as semiconductor elements, conductors, fuses, capacitors, transformers, switches, circuit breakers, and measuring instruments.
• the input and output capacitors 3A, 3B and semiconductor circuit units 4A, 4B are arranged on the front side (forward side), and the high-frequency transformer 6 is arranged on the back side (rear side).
• the power conversion device 2 has an overall configuration in which the components are arranged in a U-shaped fold when viewed from above.
• the DAB circuit 1 of the power conversion device 2 includes a full bridge circuit (first full bridge circuit) consisting of two switching legs, in which semiconductor switching elements Q11 to Q14 are connected as positive and negative semiconductor elements between the positive terminal (high potential side DC terminal) Np1 and negative terminal (low potential side DC terminal) Nn1 of the input-side capacitor 3A.
• the DAB circuit 1 of the power conversion device 2 also includes a full bridge circuit (second full bridge circuit) consisting of two switching legs, in which semiconductor switching elements Q21 to Q24 are connected as positive and negative semiconductor elements between the positive terminal Np2 and negative terminal Nn2 of the output-side capacitor 3B.
• the power conversion device 2 includes input-side and output-side semiconductor circuit units 4A, 4B, input-side and output-side capacitors 3A, 3B connected to the respective semiconductor circuit units 4A, 4B, and a transformer 6 to which the respective semiconductor circuit units 4A, 4B are connected.
• the power conversion device 2 has the following components connected in this order: input side capacitor 3A, input side semiconductor circuit section 4A, transformer 6, output side semiconductor circuit section 4B, and output side capacitor 3B.
• Fig. 3 is a perspective view of the capacitor 3A or 3B of the power conversion device 2 according to the embodiment.
• Fig. 4 is a perspective view of a capacitor pack 15A of the capacitor 3A or 3B according to the embodiment.
• Fig. 5 is a cross-sectional view taken along line VV in Fig. 4. 2 and 3, an input-side semiconductor circuit unit 4A and a capacitor 3A are disposed on one of the left and right sides (right side in the figures) of the front side of the transformer 6.
• An output-side semiconductor circuit unit 4B and a capacitor 3B are disposed on the other left and right side (left side in the figures) of the front side of the transformer 6.
• Each capacitor 3A, 3B includes a pair of left and right capacitor packs 15A, 15B formed into a rectangular parallelepiped shape by arranging a plurality of unit cells, for example.
• Each capacitor pack 15A, 15B has a rectangular parallelepiped shape with its thickness oriented in the left-right direction, and is flattened in the thickness direction by reducing its dimension.
• a flat positive conductor plate 16a and a flat negative conductor plate 16b are sandwiched between the pair of capacitor packs 15A, 15B.
• Each of these conductor plates 16a, 16b forms front terminals 17a, 17b and rear terminals 18a, 18b for connecting external components.
• Each capacitor 3A, 3B is configured as a capacitor assembly 14, which is an integral assembly of a pair of left and right capacitor packs 15A, 15B and each of the conductor plates 16a, 16b.
• FIG 4 shows, for example, the capacitor pack (first capacitor pack) 15A on the right side in Figure 3.
• the capacitor pack (second capacitor pack) 15B on the left side in Figure 3 has the same configuration except for the displacement height of the positive electrode terminal 15d and negative electrode terminal 15e, which will be described later, and detailed description thereof will be omitted.
• connection terminals 15d, 15e protrude from the upper and lower edges of one side in the left-right direction of the rectangular parallelepiped main body (capacitor body) 15c of the capacitor pack 15A.
• the connection terminals 15d, 15e are positive terminals 15d and negative terminals 15e.
• the positive terminals 15d and negative terminals 15e are arranged alternately in the front-to-back direction.
• the positive electrode terminal 15d and the negative electrode terminal 15e are strip-shaped with their widths aligned in the front-to-rear direction.
• the positive electrode terminal 15d and the negative electrode terminal 15e each have an upright portion 15d1, 15e1 that extends normal to (left-right from) the side surface (disk surface) 15c1 on one left-right side of the capacitor body 15c of the capacitor pack 15A, and a connecting portion 15d2, 15e2 that bends and extends from the tip of the upright portion 15d1, 15e1 toward the outside (upward or downward) of the capacitor pack 15A in a side view.
• connection portions 15d2, 15e2 of the positive and negative terminals 15d, 15e are formed as flat plates parallel to the side surface 15c1 of the capacitor pack 15A.
• the connection portions 15d2, 15e2 of the positive and negative terminals 15d, 15e have openings that penetrate in the left-right direction (notches that open upward or downward in this embodiment), allowing connection to external components using fasteners (not shown).
• the connection portions 15d2, 15e2 of the positive and negative terminals 15d, 15e are formed so that they do not protrude (upward or downward) beyond the upper and lower edges of the capacitor pack 15A in a side view.
• the positive terminal 15d and the negative terminal 15e have different displacement amounts D1, D2 from the side surface 15c1 on one side in the left-right direction of the capacitor body 15c.
• Displacement amounts D1, D2 are the displacement amounts from the side surface 15c1 on one side in the left-right direction of the capacitor pack 15A to the side surfaces (connection surfaces 15d3, 15e3) on one side in the left-right direction of the connection portions 15d2, 15e2.
• the displacement amount D1 of the positive terminal 15d is larger by a certain amount than the displacement amount D2 of the negative terminal 15e.
• the connection portion 15d2 of the positive terminal 15d and the connection portion 15e2 of the negative terminal 15e are arranged in a staggered manner.
• the difference between the displacement amounts D1 and D2 of the positive electrode terminal 15d and the negative electrode terminal 15e is set to be greater than the thickness of the conductor plates 16a and 16b.
• the upright portions 15d1 and 15e1 may have different vertical heights, but they may also have the same vertical height.
• Fig. 6 is a perspective view of the capacitor pack 15A with the positive conductor plate 16a attached.
• Fig. 7 is a perspective view of the capacitor pack 15A with the negative conductor plate 16b attached.
• Fig. 8 is an explanatory diagram of the terminal butting portion of the capacitor assembly 14 according to the embodiment. 3 and 8, flat conductive plates 16a and 16b, each having a thickness oriented in the left-right direction, are sandwiched between the pair of capacitor packs 15A and 15B.
• the pair of left and right conductor plates 16a, 16b are the positive conductor plate 16a connected to the positive terminal 15d of the capacitor pack 15A, and the negative conductor plate 16b connected to the negative terminal 15e of the capacitor pack 15A.
• the positive conductor plate 16a and the negative conductor plate 16b are arranged so that they entirely overlap each other when viewed from the left and right.
• the positive conductor plate 16a and the negative conductor plate 16b are arranged with a specified clearance S1 between them in the left and right direction.
• Each conductor plate 16a, 16b has a rectangular main body 16c that is narrower in vertical width than the capacitor pack 15A in side view but has roughly the same front-to-back width, conductor terminals 19a, 19b that protrude upward or downward from the top and bottom edges of the main body 16c, front terminals 17a, 17b that protrude forward from the front edge of the main body 16c, and rear terminals 18a, 18b that protrude rearward from the rear edge of the main body 16c.
• the front terminals 17a, 17b include a front positive terminal 17a extending forward from the upper half of the front edge of the positive conductor plate 16a, and a front negative terminal 17b extending forward from the lower half of the front edge of the negative conductor plate 16b.
• the front positive terminal 17a and the front negative terminal 17b are divided into two sections, upper and lower.
• the front terminals 17a, 17b are provided at their front ends with connection portions 17c having openings (e.g., endless through-holes). Each opening (through-hole) is a fastening hole for connecting to an external component with a bolt or the like extending in the left-right direction.
• the front positive terminal 17a and the front negative terminal 17b are each formed in a plate shape with a width along the surface (front-to-back and up-down directions), contributing to low inductance.
• the rear terminals 18a, 18b include a rear positive terminal 18a and a rear negative terminal 18b that extend rearward at different lengths from the entire rear edge of each conductor plate 16a, 16b (including, for example, the upper and lower conductor terminals 19a, 19b).
• the rear positive terminal 18a extends rearward from the rear edge of the positive conductor plate 16a
• the rear negative terminal 18b extends rearward from the rear edge of the negative conductor plate 16b.
• the rear positive terminal 18a formed on the positive conductor plate 16a on the other left-right side extends rearward further than the rear negative terminal 18b formed on the negative conductor plate 16b on one left-right side.
• the rear portions (extending tips) of the rear positive terminal 18a and the rear negative terminal 18b are each provided with a plurality of connection portions 18c with openings (e.g., endless through-holes) in the left-right direction.
• Each opening (through-hole) is a fastening hole for connecting to an external component (in this embodiment, each semiconductor circuit unit 4A, 4B) with a bolt or the like extending in the left-right direction.
• the rear positive terminal 18a which extends rearward, has work holes 18d, which are circular in side view, for example, between the rear edge of the main body 16c and each connection portion 18c in the front-to-back direction. Each work hole 18d is formed in a position that overlaps with each connection portion 18c of the rear negative terminal 18b in side view. This makes it possible to fasten external components to each connection portion 18c of the rear negative terminal 18b.
• the rear positive terminal 18a and rear negative terminal 18b are each formed in a plate shape with a width along the surface (front-to-back and up-to-down directions), which contributes to low inductance.
• conductor terminals 19a (hereinafter referred to as positive conductor terminals 19a) that overlap the positive terminal 15d of the capacitor pack 15A protrude from the top and bottom of the positive conductor plate 16a. Portions of the positive conductor plate 16a that avoid the positive conductor terminal 19a are cut out.
• Conductor terminals 19b (hereinafter referred to as negative conductor terminals 19b) that overlap the negative terminal 15e of the capacitor pack 15A protrude from the top and bottom of the negative conductor plate 16b. Portions of the negative conductor plate 16b that avoid the negative conductor terminal 19b are cut out.
• the tip of each conductor terminal 19a, 19b serves as a connection portion 19c that can be used to fasten external components.
• capacitor pack 15A positive terminal 15d, which is displaced relatively greatly in the left-right direction, is connected to positive conductor terminal 19a of positive conductor plate 16a.
• negative terminal 15e which is displaced relatively little in the left-right direction, is connected to negative conductor terminal 19b of negative conductor plate 16b.
• the difference between the displacement amounts D1 and D2 of the positive and negative terminals 15d and 15e is greater than the thickness of each conductor plate 16a and 16b. Therefore, when the positive and negative conductor terminals 19a and 19b are connected to the positive and negative terminals 15d and 15e of the capacitor pack 15A, a specified clearance S1 is formed between the positive and negative conductor plates 16a and 16b.
• a pair of capacitor packs 15A, 15B can be divided into capacitor pack 15A, in which the positive terminal 15d has a large displacement amount D1 and the negative terminal 15e has a small displacement amount D2, and capacitor pack 15B, in which the positive terminal 15d has a small displacement amount D2 and the negative terminal 15e has a large displacement amount D1.
• capacitor pack 15A, 15B in which the positive terminal 15d has a small displacement amount D1 butts up against the positive terminal 15d with the small displacement amount D2.
• the negative terminal 15e with the small displacement amount D2 butts up against the negative terminal 15e with the large displacement amount D1.
• the positive terminal 15d of the positive conductor plate 16a is sandwiched between the abutted positive terminals 15d.
• the negative terminal 15e of the negative conductor plate 16b is sandwiched between the abutted negative terminals 15e.
• the positive conductor plate 16a and the negative conductor plate 16b are held in positions offset from each other in the left-right direction between the two capacitor packs 15A, 15B. At this time, a left-right clearance S1 is formed between the two conductor plates 16a, 16b.
• the capacitor packs 15A and 15B of the embodiment comprise a capacitor body 15c having a planar plate surface 15c1, and plate terminals 15d and 15e having connection surfaces 15d3 and 15e3 parallel to the plate surface 15c1 to which mating components can be connected, with the connection surface 15d3 of the positive plate terminal 15d and the connection surface 15e3 of the negative plate terminal 15e being offset from each other in the normal direction of the plate surface 15c1.
• the capacitor assembly 14 of the embodiment includes capacitor packs 15A and 15B each including a capacitor body 15c having a planar board surface 15c1, and plate-shaped terminals 15d and 15e that can connect mating components to connection surfaces 15d3 and 15e3 parallel to the board surface 15c1, a first conductor plate 16a that is plate-shaped and parallel to the board surface 15c1 and is connected to the connection surface 15d3 of the plate-shaped terminal 15d on the positive side of the capacitor packs 15A and 15B, and a first conductor plate 16b that is connected to the connection surface 15d3 of the plate-shaped terminal 15d on the positive side of the capacitor packs 15A and 15B.
• connection surface 15d3 of the positive electrode side plate terminal 15d and the connection surface 15e3 of the negative electrode side plate terminal 15e are positioned so as to be offset from each other in the normal direction of the plate surface 15c1, and a gap S1 is formed between the first conductor plate 16a and the second conductor plate 16b in the normal direction of the plate surface 15c1.
• connection surface 15d3 of positive terminal 15d and connection surface 15e3 of negative terminal 15e at different levels, it is possible to attach flat conductor plates 16a and 16b parallel to board surface 15c1 to each of connection surfaces 15d3 and 15e3 of positive terminal 15d and negative terminal 15e, respectively. This prevents conductor plates 16a and 16b from protruding in the normal direction of board surface 15c1, thereby enabling the terminal connection structure to be made more compact.
• the positive-side conductor plate 16a and the negative-side conductor plate 16b are fixed at different heights in the normal direction of the board surface 15c1, allowing a gap S1 to be formed between the two conductor plates 16a and 16b.
• This allows the conductor plates 16a and 16b to be used as effective heat dissipation members, improving cooling performance.
• the wide conductor plates 16a and 16b along the board surface 15c1 of the capacitor packs 15A and 15B, low inductance can be achieved.
• the capacitor packs 15A and 15B include a first capacitor pack 15A in which the connection surface 15d3 of the positive plate terminal 15d is positioned higher from the panel surface 15c1 than the connection surface 15e3 of the negative plate terminal 15e by a specified amount (gap S1), and a second capacitor pack 15B in which the connection surface 15e3 of the negative plate terminal 15e is positioned higher from the panel surface 15c1 than the connection surface 15d3 of the positive plate terminal 15d by a specified amount (gap S1).
• the first capacitor pack 15A and the second capacitor pack 15B are joined by arranging their panel surfaces 15c1 facing each other and butting their positive and negative connection surfaces 15d3 against each other.
• a first capacitor pack 15A in which the connection surface 15d3 of the positive terminal 15d is located higher than the connection surface 15e3 of the negative terminal 15e
• a second capacitor pack 15B in which the connection surface 15e3 of the negative terminal 15e is located higher than the connection surface 15d3 of the positive terminal 15d
• the higher-positioned positive terminal 15d butts against the lower-positioned positive terminal 15d
• the lower-positioned negative terminal 15e butts against the higher-positioned negative terminal 15e.
• 1...DAB circuit 2...power conversion device, 3A...input capacitor, 3B...output capacitor, 14...capacitor assembly, 15A...first capacitor pack (capacitor), 15B...second capacitor pack (capacitor), 15c...capacitor body, 15c1...side surface (plate surface), 15d...positive terminal (plate terminal), 15d3...connection surface, 15e...negative terminal (plate terminal), 15e3...connection surface, 16a...first conductor plate, 16b...second conductor plate, S1...gap

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Inverter Devices (AREA)
• Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

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Citations (10)

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• 2024
  • 2024-05-15 JP JP2025523488A patent/JPWO2025238737A1/ja not_active Withdrawn
  • 2024-05-15 WO PCT/JP2024/017907 patent/WO2025238737A1/ja active Pending
  • 2024-05-15 CN CN202480039111.5A patent/CN121359227A/zh active Pending

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