Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/34—Heterocyclic compounds having nitrogen in the ring
  • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
  • C08K5/3445—Five-membered rings
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/49—Phosphorus-containing compounds
  • C08K5/50—Phosphorus bound to carbon only
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds

Definitions

• the present invention relates to a resin composition for injection molding and a method for injection molding the composition. Developments are underway regarding injection molding of semiconductor encapsulation materials. Injection molding can improve productivity because the encapsulation material is supplied as is.
• Patent Document 1 discloses an epoxy resin composition containing, as essential components, an epoxy resin, a phenolic compound curing agent, a curing accelerator, and an inorganic filler. The same document also states that wax may be included in the epoxy resin composition.
• Patent Document 2 discloses an epoxy resin injection molding material that contains only a multifunctional epoxy resin, a difunctional epoxy resin, an epoxy resin curing agent, a curing accelerator, an inorganic filler, a silane coupling agent, and a mold release agent, is solid at room temperature, and satisfies specified physical properties. Carnauba wax is mentioned as the mold release agent. The document also states that the epoxy resin injection molding material has excellent moldability.
• the present invention can be described as follows:
• thermosetting resin a thermosetting resin
• curing agent a curing agent
• C an inorganic filler
• D a curing accelerator
• TMA thermomechanical analysis
• the minimum torque value a is 3.3 N m or less;
• the curing accelerator (D) includes a phosphorus-based curing accelerator and an imidazole-based curing accelerator.
• the phosphorus-based curing accelerator is at least one selected from organic phosphines, tetra-substituted phosphonium compounds, and phosphobetaine compounds.
• the organic phosphine is tris(4-methylphenyl)phosphine or tris(4-methoxyphenyl)phosphine
• the tetra-substituted phosphonium compound is tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrakis(4-methylphenyl)borate, tetraphenylphosphonium bis(naphthalene-2,3-dioxy)phenylsilicate, a molecular compound of tetraphenylphosphonium and a bisphenol, or a complex salt of tetraphenylphosphonium and a dihydroxynaphthalene,
• the resin composition for injection molding according to [5], wherein the phosphobetaine compound is 2-(triphenylphosphonium)phenolate, 4-hydroxy-2-(triphenylphosphonium)phenolate, 3-(triphenylphosphonium)phenolate, or an
• the resin composition for injection molding according to any one of [1] to [9] In the DSC curve obtained by using a differential scanning calorimeter and heating from 30°C to 330°C at a heating rate of 10°C/min, The peak temperature of the maximum exothermic peak is 135°C or higher and lower than 175°C, a resin composition for injection molding, wherein the full width at half maximum of the maximum exothermic peak is 32°C or less, as determined using as a baseline a straight line connecting the point at which the heat flow rate is smallest before the maximum exothermic peak and the point at which the heat flow rate is smallest after the maximum exothermic peak.
• An injection unit including a cylinder, a screw inserted into the cylinder, and a nozzle through which a melt of a resin composition for injection molding melt-kneaded by the screw in the cylinder is injected; a mold including a sprue serving as a passage for the injected molten material and a cavity into which the molten material is filled via the sprue;
• a resin composition for injection molding used in an injection molding apparatus comprising: The temperature inside the cylinder is between room temperature (25°C) and 140°C, The temperature inside the nozzle is 100°C or higher and 140°C or lower, The resin composition for injection molding according to any one of [1] to [10], wherein the temperature inside the cavity is 120°C or higher and 180°C or lower.
• An injection unit including a cylinder, a screw inserted into the cylinder, and a nozzle through which a molten material melted and kneaded by the screw in the cylinder is injected; a mold including a sprue serving as a passage for the injected molten material and a cavity into which the molten material is filled via the sprue;
• An injection molding method using an injection molding apparatus comprising: a step of melt-kneading the resin composition for injection molding according to any one of [1] to [11] in the cylinder; Injecting the resulting melt from the nozzle using the screw; a step of filling the injected molten material into the cavity through the sprue;
• An injection molding method comprising: [13] The temperature inside the cylinder is from room temperature (25°C) to 140°C, The temperature inside the nozzle is 100°C or higher and 140°C or lower, [13] The injection molding method according to [12], wherein the temperature inside the cavity is 120°
• the injection molding resin composition of the present invention has a well-balanced combination of thermal stability and curability during injection molding, suppresses molding defects when injection molding the resin composition, and provides excellent manufacturing stability during injection molding. Furthermore, an injection molding method using the composition can be provided.
• FIG. 1 is a cross-sectional view schematically illustrating an example of an injection molding apparatus according to an embodiment of the present invention.
• 1 is a cross-sectional view schematically illustrating an example of an in-vehicle electronic control unit according to an embodiment.
• 1 is a DSC curve obtained by DSC measurement of the encapsulating resin composition for injection molding obtained in Example 1.
• the resin composition for injection molding of the present embodiment is (A) a thermosetting resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing accelerator;
• the glass transition temperature of the resin composition for use in injection molding is 160°C or higher and 220°C or lower, as measured by thermomechanical analysis (TMA) at a heating rate of 10°C/min;
• TMA thermomechanical analysis
• the reduction rate of spiral flow after storage at 30°C for 7 days is 17% or less.
• the injection molding resin composition of this embodiment contains components (A) to (D), and because the glass transition temperature and spiral flow reduction rate are within the specified ranges, molding defects during injection molding are suppressed, resulting in excellent manufacturing stability.
• the present inventors have focused on the glass transition temperature and the rate of decrease in spiral flow of a resin composition for injection molding, and have found that by using these as indicators, it is possible to evaluate the thermal stability and curability of a resin composition in the injection molding process, as well as the balance between these. Based on this finding, the present inventors have conducted further intensive research and found that by setting these values within a specific range, a good balance of these properties can be achieved, thereby suppressing molding defects in injection molding and improving production stability, and have completed the present invention.
• the rate of decrease in spiral flow after storage at 30°C for 7 days can be 17% or less, preferably 15% or less, more preferably 12% or less, and even more preferably 10% or less.
• the minimum torque value a is 3.3 N m or less
• the minimum torque value b is 1.2 N ⁇ m or less.
• the time T1 during which the torque value is equal to or less than twice the minimum torque value a is 60 seconds or more and 200 seconds or less
• the time T1′ during which the torque value is equal to or less than twice the minimum torque value b is 35 seconds or more and 100 seconds or less.
• the resin composition for injection molding exhibits superior fluidity and filling properties during injection molding, as well as even superior molding stability.
• the time T1 can be set to 60 seconds or more and 200 seconds or less, preferably 65 seconds or more and 150 seconds or less, more preferably 70 seconds or more and 120 seconds or less, and even more preferably 75 seconds or more and 100 seconds or less.
• the time T1' can be set to 35 seconds or more and 100 seconds or less, preferably 35 seconds or more and 80 seconds or less, more preferably 35 seconds or more and 70 seconds or less, and even more preferably 35 seconds or more and 55 seconds or less.
• the half-width of the maximum exothermic peak can be 32°C or less, preferably 25°C or less, and more preferably 20°C or less.
• the lower limit is not particularly limited, but is 5°C or more.
• thermosetting resin (A) contained in the resin composition for injection molding of this embodiment includes, for example, one or more resins selected from the group consisting of epoxy resins, phenolic resins, oxetane resins, (meth)acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins.
• resins selected from the group consisting of epoxy resins, phenolic resins, oxetane resins, (meth)acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins.
• an epoxy resin from the viewpoint of improving curability, storage stability, heat resistance, moisture resistance, and chemical resistance.
• the epoxy resins include one or more selected from the group consisting of phenol aralkyl epoxy resins such as aralkyl epoxy resins, phenol aralkyl epoxy resins having a biphenylene skeleton, and naphthol aralkyl epoxy resins having a biphenylene skeleton; naphthol epoxy resins such as dihydroxynaphthalene epoxy resins and epoxy resins obtained by glycidyl etherifying a dihydroxynaphthalene dimer; triazine nucleus-containing epoxy resins such as triglycidyl isocyanurate and monoallyl diglycidyl isocyanurate; and bridged cyclic hydrocarbon compound-modified phenolic epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins.
• phenol aralkyl epoxy resins such as aralkyl epoxy resins, phenol aralkyl epoxy resins having a biphenylene skeleton, and naphthol
• the thermosetting resin (A) more preferably contains a thermosetting resin having a softening point of 110° C. or less.
• a thermosetting resin having a softening point of 110° C. or less By using a thermosetting resin having a softening point of 110° C. or less, a resin composition for injection molding having a low viscosity can be obtained, and continuous injection molding becomes possible, resulting in superior productivity.
• the softening point of the thermosetting resin (A) is preferably 100° C. or lower, more preferably 90° C. or lower.
• the curing agent (B) contained in the resin composition for injection molding of this embodiment can be roughly divided into three types: polyaddition type curing agents, catalyst type curing agents, and condensation type curing agents.
• the catalytic curing agent used as curing agent (B) includes one or more selected from the group consisting of tertiary amine compounds such as benzyldimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); and Lewis acids such as BF3 complexes.
• BDMA benzyldimethylamine
• DMP-30 2,4,6-trisdimethylaminomethylphenol
• Lewis acids such as BF3 complexes.
• the curing accelerator (curing catalyst) (D) contained in the resin composition for injection molding of this embodiment may be any known one that accelerates the reaction between the thermosetting resin and the curing agent.
• Examples of the curing accelerator (D) include phosphorus-based curing accelerators, imidazole-based curing accelerators, and nitrogen-based curing accelerators.
• Phosphorus-based curing accelerators include organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds, and at least one selected from these can be used.
• organic phosphines include primary phosphines such as ethylphosphine and phenylphosphine; secondary phosphines such as dimethylphosphine and diphenylphosphine; and tertiary phosphines such as trimethylphosphine, triethylphosphine, tributylphosphine, tris(4-methylphenyl)phosphine and tris(4-methoxyphenyl)phosphine, and one or more selected from these may be used in combination.
• the organic phosphine is preferably tris(4-methylphenyl)phosphine or tris(4-methoxyphenyl)phosphine.
• Examples of tetra-substituted phosphonium compounds include compounds represented by the following general formula (6):
• the compound represented by the general formula (6) can be obtained, for example, as follows. First, a tetra-substituted phosphonium halide, an aromatic organic acid, and a base are mixed uniformly in an organic solvent to generate an aromatic organic acid anion in the solution. Then, water is added to precipitate a compound represented by general formula (6).
• R4 , R5 , R6 , and R7 bonded to the phosphorus atom are preferably phenyl groups
• AH is a compound having a hydroxyl group on the aromatic ring, i.e., a phenol
• A is an anion of the phenol.
• tetra-substituted phosphonium compounds include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrakis(4-methylphenyl)borate, tetraphenylphosphonium bis(naphthalene-2,3-dioxy)phenylsilicate, molecular compounds of tetraphenylphosphonium and bisphenols, and complex salts of tetraphenylphosphonium and dihydroxynaphthalenes.
• Examples of phosphobetaine compounds include compounds represented by the following general formula (7):
• P represents a phosphorus atom.
• R8 represents an alkyl group having 1 to 3 carbon atoms, and R9 represents a hydroxyl group.
• f is 0 to 5
• g is 0 to 3.
• the compound represented by the general formula (7) can be obtained, for example, as follows. First, a triaromatic-substituted phosphine, which is a tertiary phosphine, is brought into contact with a diazonium salt to substitute the diazonium group of the diazonium salt with the triaromatic-substituted phosphine.
• the phosphobetaine compound examples include 2-(triphenylphosphonium)phenolate, 4-hydroxy-2-(triphenylphosphonium)phenolate, 3-(triphenylphosphonium)phenolate, and an adduct of triphenylphosphine and 1,4-benzoquinone.
• Examples of the adduct of a phosphine compound and a quinone compound include compounds represented by the following general formula (8).
• P represents a phosphorus atom.
• R 10 , R 11 and R 12 represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and may be the same or different.
• R 13 , R 14 and R 15 represent a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms, and may be the same or different from one another, and R 14 and R 15 may be bonded to form a cyclic structure.
• Phosphine compounds used in the adduct of a phosphine compound and a quinone compound are preferably those that are unsubstituted or have a substituent such as an alkyl group or alkoxyl group on the aromatic ring, such as triphenylphosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, trinaphthylphosphine, or tris(benzyl)phosphine, and examples of the substituent such as an alkyl group or alkoxyl group include those having 1 to 6 carbon atoms. From the standpoint of availability, triphenylphosphine is preferred.
• examples of quinone compounds used in the adduct of a phosphine compound and a quinone compound include benzoquinone and anthraquinones, with p-benzoquinone being preferred in terms of storage stability.
• the adduct of a phosphine compound and a quinone compound can be produced by contacting and mixing the organic tertiary phosphine and benzoquinone in a solvent that can dissolve both.
• Suitable solvents include ketones such as acetone and methyl ethyl ketone, which have low solubility in the adduct.
• the solvent is not limited to these.
• a compound in which R 10 , R 11 , and R 12 bonded to the phosphorus atom are phenyl groups, and R 13 , R 14 , and R 15 are hydrogen atoms, i.e., a compound in which 1,4-benzoquinone and triphenylphosphine are added, is preferred in terms of reducing the hot elastic modulus of the cured product of the encapsulating resin composition.
• An example of an adduct of a phosphonium compound and a silane compound is a compound represented by the following general formula (9):
• R20 is an organic group bonded to Y2 and Y3 .
• R21 is an organic group bonded to groups Y4 and Y5 .
• Y2 and Y3 are groups formed by a proton-donating group releasing a proton, and groups Y2 and Y3 in the same molecule bond to a silicon atom to form a chelate structure.
• Y4 and Y5 are groups formed by a proton-donating group releasing a proton, and groups Y4 and Y5 in the same molecule bond to a silicon atom to form a chelate structure.
• Groups R20 and R21 may be the same or different, and groups Y2 , Y3 , Y4 , and Y5 may be the same or different.
• -Y2 - R20 - Y3- and Y4 - R21 - Y5 The group represented by - is constituted by a group formed by a proton donor releasing two protons, and as the proton donor, an organic acid having at least two carboxyl groups or hydroxyl groups in the molecule is preferred, and an aromatic compound having at least two carboxyl groups or hydroxyl groups on adjacent carbons constituting an aromatic ring is more preferred, and an aromatic compound having at least two hydroxyl groups on adjacent carbons constituting an aromatic ring is more preferred, and examples thereof include catechol, pyrogallol, 1,2-dihydro- Examples of the dihydroxynaphthalene include xynaphthalene, 2,3-dihydroxynaphthalene, 2,2'-biphenol, 1,1'-bi
• Z1 in general formula (9) represents an organic group or an aliphatic group having an aromatic ring or a heterocyclic ring, and specific examples thereof include aliphatic hydrocarbon groups such as methyl, ethyl, propyl, butyl, hexyl, and octyl groups; aromatic hydrocarbon groups such as phenyl, benzyl, naphthyl, and biphenyl groups; glycidyloxy groups such as glycidyloxypropyl, mercaptopropyl, and aminopropyl groups; mercapto groups; alkyl groups having amino groups; and reactive substituents such as vinyl groups.
• methyl, ethyl, phenyl, naphthyl, and biphenyl groups are more preferred in terms of thermal stability.
• the method for producing the adduct of a phosphonium compound and a silane compound is, for example, as follows.
• a silane compound such as phenyltrimethoxysilane and a proton donor such as 2,3-dihydroxynaphthalene are dissolved in a flask containing methanol, and then a sodium methoxide-methanol solution is added dropwise at room temperature with stirring.
• a previously prepared solution of a tetra-substituted phosphonium halide such as tetraphenylphosphonium bromide dissolved in methanol is then added dropwise at room temperature with stirring, resulting in the precipitation of crystals.
• the precipitated crystals are filtered, washed with water, and vacuum dried to obtain an adduct of a phosphonium compound and a silane compound.
• the phosphorus-based curing accelerator be at least one selected from organic phosphines, tetra-substituted phosphonium compounds, and phosphobetaine compounds.
• Imidazole-based curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole (EMI24), 2-phenyl-4-methylimidazole (2P4MZ), 2-phenyl-1H-imidazole 4,5-dimethanol, 2-phenyl-4,5-dihydroxymethylimidazole, 1-benzyl-2-phenylimidazole, 1- Benzyl-2-methylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undec
• At least one imidazole-based curing accelerator selected from 2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-benzyl-2-phenylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 2-phenyl-1H-imidazole-4,5-dimethanol, and 2-phenyl-4,5-dihydroxymethylimidazole.
• the lower limit of the content of the curing accelerator (D) is, for example, preferably 0.01 mass% or more, and more preferably 0.15 mass% or more, based on the total solids content of the resin composition for injection molding.
• the upper limit of the content of the curing accelerator is, for example, preferably 5.0 mass% or less, and more preferably 3.0 mass% or less, based on the total solids content of the resin composition for injection molding.
• the resin composition for injection molding of this embodiment may contain, as needed, one or more of various additives such as a silane coupling agent, a colorant, an ion scavenger, an oil, a stress reducing agent, and a flame retardant.
• various additives such as a silane coupling agent, a colorant, an ion scavenger, an oil, a stress reducing agent, and a flame retardant.
• the resin composition for injection molding of this embodiment can be obtained by mixing the above components by a conventionally known method.
• the resulting mixture was then finely pulverized using a continuous rotary ball mill (Dynamic Mill MYD25, manufactured by Nippon Coke Engineering Co., Ltd., screw rotation speed: 500 rpm, alumina ball diameter: 10 mm, ball volume filling rate relative to the device volume: 50%) at a material supply rate of 200 kg/hr while maintaining the material temperature at 30°C or below.
• the finely pulverized mixture was then kneaded using two 10-inch roll mills. The roll temperatures were set to 105°C and 15°C, respectively.
• the kneading time was 5 minutes.
• the kneading time for Example 4 was 20 minutes, and that for Example 5 was 40 minutes.
• Thermosetting resin/epoxy resin orthocresol novolac epoxy resin (EPICLON N-670, manufactured by DIC Corporation), epoxy equivalent 210 g/Eq, softening point 72°C
• Curing agent/phenolic resin novolac type phenolic resin (PR-51470, manufactured by Sumitomo Bakelite Co., Ltd.)
• Curing accelerator/curing catalyst 1 2-phenyl-4,5-dihydroxymethylimidazole (melting point 225-235°C, molecular weight 204) represented by the following chemical formula
• Curing catalyst 2 4-hydroxy-2-(triphenylphosphonium)phenolate
• Curing catalyst 3 2-phenylimidazole (melting point 137-147°C, molecular weight 144, active temperature range 105-125°C)
• Curing catalyst 4 triphenylphosphine
• Low-stress agent Silicone rubber (Kane Ace M711, manufactured by Kaneka Corporation)
• Release agent Carnauba wax
• Colorant Carbon black
• Tg Glass transition temperature
• Thermal Stability Test ISO 178 dumbbell test pieces (test pieces) were molded using a 100-ton electric injection molding machine (product number: EC-100SXR, manufactured by Shibaura Machine Co., Ltd.). The mold temperature of the 100-ton electric injection molding machine was set to 165°C, and the nozzle temperatures were set to 85°C/65°C/45°C. The injection time was set to 15 seconds, and the cure time was set to 100 seconds. The injection speed was 5 mm/s, and the dwell pressure was set to 30 MPa for 5 seconds. Injection molding was performed with an injection waiting time of 0 or 5 minutes after weighing, and the total weight of the resulting test pieces (2 ISO test pieces + sprue + runner) was measured.
• the weight when injection molded with a waiting time of 0 minutes was defined as W0, and the weight when injection molded with a waiting time of 5 minutes was defined as W5.
• Test pieces with a (W5/W0) x 100 of 98% or more were rated A, and those with a value of less than 98% were rated C.
• DSC measurement The encapsulating resin composition obtained in each Example and Comparative Example was finely pulverized in a mortar, and 3 to 5 mg was weighed into an aluminum pan to prepare a sample. Differential scanning calorimetry was then performed on the sample using a differential scanning calorimeter (DSC7020, Hitachi High-Tech Science Corporation) under the following conditions: starting temperature 30°C, measurement temperature range 30 to 330°C, and heating rate 10°C/min. From the obtained DSC curve, the peak temperature (°C) of the maximum exothermic peak and the half-width (°C) of the maximum exothermic peak were calculated.
• Example 3 is a DSC curve obtained by DSC measurement of the encapsulating resin composition obtained in Example 1.
• the half-width (°C) of the maximum exothermic peak was calculated as follows. First, a straight line connecting point A (minimum temperature before the maximum exothermic peak) where the heat flow is minimum before the maximum exothermic peak and point B (minimum temperature after the maximum exothermic peak) where the heat flow is minimum after the maximum exothermic peak was defined as a baseline.
• point D was defined as the intersection point between the baseline and a perpendicular line to the X-axis passing through point C where the heat flow of the exothermic peak is maximum.
• a straight line passing through point E, the midpoint of line CD, and parallel to the X-axis was drawn, and the points at which it intersects with the DSC curve were defined as points F and F', respectively.
• the length of line FF' was then defined as the half-width.
• the times T1, T1', and minimum torque value were measured for the encapsulating resin compositions obtained in each example and each comparative example as follows. First, the melt torque of the encapsulating resin composition was measured over time using a Labo Plastomill tester (4C150, manufactured by Toyo Seiki Seisakusho, Ltd.) at a rotation speed of 30 rpm and a measurement temperature of 130°C. Next, the time T1 at which the torque value was equal to or less than twice the minimum torque value was calculated based on the measurement results.
• a Labo Plastomill tester 4C150, manufactured by Toyo Seiki Seisakusho, Ltd.
• the measurement start point was the point at which the torque started to decrease after the material was placed in the Labo Plastomill tester and the torque rose sharply.
• the minimum torque value a was also calculated from the measurement results.
• the melt torque of the encapsulating resin composition was measured over time at a rotation speed of 30 rpm and a measurement temperature of 150°C, and the time T1' at which the torque value was equal to or less than twice the minimum torque value and the minimum torque value b were calculated based on the measurement results.
• the results are shown in Table 1.
• the times T1 and T1' are in seconds
• the minimum torque values a and b are in N m.
• the injection molding resin compositions of the examples exhibit excellent thermal stability, high Tg, and excellent curing properties, and because these properties are well-balanced, they are stable against heat treatment during injection molding and are suitable for use in injection molding, which has a short molding cycle.

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