WO2025118985A1 - 支架及芯片组件 - Google Patents

支架及芯片组件 Download PDF

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Publication number
WO2025118985A1
WO2025118985A1 PCT/CN2024/133487 CN2024133487W WO2025118985A1 WO 2025118985 A1 WO2025118985 A1 WO 2025118985A1 CN 2024133487 W CN2024133487 W CN 2024133487W WO 2025118985 A1 WO2025118985 A1 WO 2025118985A1
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WO
WIPO (PCT)
Prior art keywords
bracket
axis
chip
legs
angle
Prior art date
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Pending
Application number
PCT/CN2024/133487
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English (en)
French (fr)
Inventor
周炜
施皆佩
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NIO Technology Anhui Co Ltd
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NIO Technology Anhui Co Ltd
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Filing date
Publication date
Application filed by NIO Technology Anhui Co Ltd filed Critical NIO Technology Anhui Co Ltd
Publication of WO2025118985A1 publication Critical patent/WO2025118985A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Definitions

  • the present application relates to the field of chip components, and specifically provides a bracket and a chip component.
  • the device that is matched with the chip also includes a circuit board, a heat dissipation structure and a bracket.
  • the bracket is used to connect to the heat dissipation structure in the chip assembly, and abut with the circuit board arranged between the bracket and the heat dissipation structure, so that the chip arranged between the circuit board and the heat dissipation structure can fit tightly with the heat dissipation structure, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure and increasing the heat dissipation effect of the chip.
  • the legs in the bracket are usually arranged completely symmetrically.
  • the completely symmetrical legs cannot meet the layout requirements of the chip.
  • the present application aims to solve the above technical problem, namely, the problem in the prior art that completely symmetrical legs cannot meet the layout requirements of the chip.
  • the present application provides a bracket, wherein the bracket is arranged axially symmetrically along an x-axis and a y-axis, and the x-axis and the y-axis are perpendicular to each other.
  • the bracket includes a body and a plurality of legs, wherein the plurality of legs are arranged on the body and extend out of the body along the body.
  • the angle between any of the legs and the x-axis is not equal to the angle between the legs and the y-axis.
  • a hole is opened on the body, and the circumferential edge of the hole is recessed to form the convex bump.
  • bracket there are multiple convex hulls, and the multiple convex hulls are distributed at intervals along the circumferential edge of the hole.
  • the support leg includes a first connecting leg and a second connecting leg.
  • the first connecting leg extends along the bracket body in a direction away from the convex bump.
  • the second connecting leg extends along the first connecting leg in a direction away from the bracket body.
  • a first connection structure is provided on the edge of the second connection leg.
  • the first connection structure is a mounting hole.
  • the mounting hole extends to the edge of the support leg to form a notch, and the opening of the notch is arranged away from the bracket body.
  • bracket there is a first angle between the plane where the first connecting leg is located and the plane where the bracket body is located, and the first angle is greater than 90° and less than 180°.
  • a second angle is formed between a plane where the first connecting leg is located and a plane where the second connecting leg is located, and the second angle is greater than or equal to the first angle.
  • the bracket provided by the present application is arranged axially symmetrically along the x-axis and the y-axis, and the x-axis and the y-axis are perpendicular to each other.
  • the bracket includes a body and a plurality of legs, and the plurality of legs are arranged on the body and extend out of the body along the body. The angle between any leg and the x-axis is not equal to the angle between the leg and the y-axis.
  • the bracket provided by the present application sets the angle between the leg and the x-axis to be unequal to the angle between the leg and the y-axis, so that the design of the leg is not completely symmetrical, has greater adjustability, and can meet the requirements of the peripheral layout of the chip.
  • the bracket provided in the present application limits the circumferential edge of the hole to be recessed to form a convex bump, so that after the bracket is connected to the heat dissipation structure in the chip assembly, the convex bump can abut against the circuit board arranged between the bracket and the heat dissipation structure, so that the chip arranged between the circuit board and the heat dissipation structure and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure and increasing the heat dissipation effect of the chip.
  • the bracket provided in the present application limits the plurality of convex bumps to be spaced apart along the circumferential edge of the hole, so that the force exerted by the convex bumps on the circuit board is more uniform, thereby making the force between the chip and the heat dissipation structure more uniform, thereby improving the heat dissipation effect of the chip.
  • the bracket provided in the present application defines a first connecting pin and a second connecting pin, wherein the first connecting pin is mainly used to realize pressure control, and the angle can be adjusted according to the force requirements, which is also convenient for mass production.
  • the force difference caused by the difference in material parameters can be compensated by the angle;
  • the second connecting pin is mainly to ensure that the corners of the fastener and the bracket can be in surface contact and the force is evenly distributed.
  • the bracket provided in the present application defines a first connection structure, so that the fastener can be in surface contact with the first connection structure, thereby facilitating increasing the connection strength of the second connection member.
  • the bracket provided in the present application defines the first connection structure as a mounting hole to facilitate screwing and installation of the fastener.
  • the present application can reduce the strength of the support leg by providing a notch structure, thereby making it easier for the fastener to contact the first connection structure surface.
  • the bracket provided in the present application limits the first angle, which is conducive to adjusting the force of the convex bump acting on the circuit board, and then can adjust the fitting force between the chip and the heat dissipation structure, thereby helping to reduce the thermal resistance between the chip and the heat dissipation structure and improve the heat dissipation effect of the chip.
  • the bracket provided in the present application limits the second angle so that the fastener can contact the first connection structure surface, thereby facilitating increasing the uniformity of the force exerted by the bump on the circuit board.
  • the present application further provides a chip assembly, the chip assembly comprising a circuit board, a heat dissipation structure, a chip and a bracket as in the above embodiment,
  • the bracket and the chip are arranged on different sides of the circuit board, and the heat dissipation structure is arranged on a side of the chip away from the bracket.
  • the chip assembly provided by the present application is connected to the heat dissipation structure through a bracket, so that the convex bump can abut against the circuit board in the chip assembly, so that the chip and the heat dissipation structure can fit tightly, thereby reducing the contact thermal resistance between the chip and the heat dissipation structure, increasing the heat dissipation effect of the chip, and solving the problem of poor heat dissipation effect of the chip due to large thermal resistance between the chip and the heat dissipation structure.
  • FIG1 is a structural diagram of a bracket provided by the present application according to one or more embodiments.
  • FIG2 is a structural diagram of a chip assembly provided by the present application according to one or more embodiments.
  • FIG. 3 is a cross-sectional view of a chip assembly provided by the present application according to one or more embodiments. Reference numerals:
  • the terms “upper”, “lower”, “inside”, “middle”, “outside”, “front”, “back” and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term “upper” may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
  • FIG1 is a schematic diagram of the structure of the bracket provided by the present application.
  • the present application provides a bracket 1, which is axially symmetrically arranged along the x-axis and the y-axis, and the x-axis and the y-axis are perpendicular to each other, wherein the bracket 1 includes a main body 11 and a plurality of legs 12, and the plurality of legs 12 are all arranged on the main body, and extend out of the main body 11 along the main body 11, and the angle between any leg 12 and the x-axis is not equal to the angle between the leg 12 and the y-axis.
  • the bracket 1 provided by the present application sets the angle between the leg 12 and the x-axis to be unequal to the angle between the leg 12 and the y-axis, so that the design of the leg 12 is not completely symmetrical, and has greater adjustability, thereby meeting the requirements of the peripheral layout of the chip.
  • the body 11 is a sheet metal stamping part, and its material is high carbon steel with a carbon content of 0.6.
  • the body 11 of this material has a high yield strength.
  • the shape of the body 11 is rectangular, and a hole 111 is opened in the middle part, and the hole 111 is a rounded rectangular hole.
  • the edges of the rounded rectangular hole are concave to form a convex 112, and the convex surfaces of the four convex 112 are all planes, which are rounded rectangles, and the planes of the four convex 112 are all on the same plane, so that the four convex 112 can abut against the circuit board 2.
  • the convex 112 on both sides of the length direction of the body 11 are symmetrically arranged, and the convex 112 on both sides of the width direction (the upper and lower sides as shown in Figure 1) are symmetrically arranged.
  • the material and shape of the body 11 are not fixed in this application, and those skilled in the art can adjust them according to specific application scenarios.
  • the material of the body 11 can also be high-carbon steel with other carbon contents, such as high-carbon steel with a carbon content of 0.7, 0.8 or other values.
  • the shape of the body 11 can also be circular, triangular, pentagonal or other shapes.
  • the shape of the hole 111 is not fixed in the present application, and those skilled in the art can adjust it as needed.
  • the shape of the hole 111 can also be circular, triangular, pentagonal or other shapes.
  • the shape of the hole 111 can be the same as the shape of the body 11, such as the shape of the hole 111 and the shape of the body 11 can both be rectangular.
  • the shape of the hole 111 can also be different from the shape of the bracket 1, such as the shape of the hole 111 can be circular, and the shape of the body 11 can be rectangular.
  • the number and shape of the convex hulls 112 are not fixed in the present application, and those skilled in the art can adjust them as needed.
  • the number of convex hulls 112 can also be 1, 8, 12 or other numbers.
  • the plane of the convex hull 112 can be circular, arc-shaped or other shapes.
  • the convex hull 112 is 1, the convex hull 112 is arranged circumferentially along the circumferential edge of the hole 111, and the convex hull 112 is an annular convex hull 112.
  • the number of convex hulls 112 is 8
  • two convex hulls 112 can be arranged on both sides of the hole 111 along its length direction and on both sides of the width direction.
  • the hole 111 is not required, and those skilled in the art can make a choice as needed.
  • the number of convex humps 112 can be one or more.
  • the number of convex humps 112 is one, it can be seen that the convex humps 112 are arranged in the middle of the body 11, and the plane area of the convex humps 112 is relatively large.
  • the number of convex humps 112 is multiple, the multiple convex humps 112 can be evenly spaced and distributed along the outer periphery of the body 11.
  • the support leg 12 includes a first connecting leg 121 and a second connecting leg 122.
  • the first connecting leg 121 is arranged obliquely upward along the main body 11, and the second connecting leg 122 is arranged obliquely upward along the first connecting leg 121 toward an end away from the main body 11.
  • the first connecting leg 121 is mainly used to control the pressure, and the angle can be adjusted according to the force requirements. It is also convenient for mass production to compensate for the force difference caused by the difference in material parameters, which can be compensated by the angle; the second connecting leg 122 is mainly used to ensure that the corners of the fastener and the bracket 1 can be in surface contact and the force is evenly distributed.
  • the four corners of the body 11 are provided with legs 12, and the four legs 12 extend along the body 11 in a direction away from the body 11, and the body 11 is connected to the legs 12 with arc chamfers.
  • the edge of the second connecting leg 122 of the leg 12 is provided with a first connecting structure 123, and by providing the first connecting structure 123, the fastener can be in surface contact with the first connecting structure 123, thereby facilitating the increase of the connection strength of the second connecting leg 122.
  • the first connection structure 123 is a mounting hole, which is convenient for screwing and installing the fastener, and the mounting hole extends to the edge of the leg 12 to form a U-shaped notch 124, and the opening of the U-shaped notch 124 is arranged away from the body 11.
  • the aperture of one group of diagonally arranged mounting holes is smaller than the aperture of the other group of diagonally arranged mounting holes, and the group of mounting holes with a small aperture can be used for positioning, that is, after the group of mounting holes with a small aperture is preferentially installed with the heat dissipation structure by screws, the connection stability between the bracket 1 and the heat dissipation structure is good, and at this time, it is convenient for the mounting holes with other apertures to be connected to the heat dissipation structure by screws.
  • the support leg 12 and the body 11 can also be connected by a straight chamfer, or the support leg 12 and the body 11 can be directly connected.
  • the shape of the notch 124 is not fixed in this application, and those skilled in the art can adjust it according to the specific application scenario.
  • first angle between the first connecting leg 121 and the body of the leg 12, wherein the first angle is greater than 90° and less than 180°.
  • second angle between the first connecting leg 121 and the second connecting leg 122, and the second angle is greater than the angle between the first connecting leg 121 and the body 11, so that when the bracket 1 is connected to the heat dissipation structure by screws, the nut of the screw can contact the surface of the second connecting leg 122, so that when the bracket 1 is connected to the heat dissipation structure, the force applied to the circuit board 2 is more uniform.
  • the second angle is not fixed in the present application, and those skilled in the art can adjust it according to specific application scenarios.
  • the second angle can be equal to the first angle.
  • first connecting leg 121 and the second connecting leg 122 are integrally formed to form the support leg 12, and the support leg 12 is integrally formed with the body 11.
  • the support leg 12 and the body 11 are made of the same material, which is also high carbon steel with a carbon content of 0.6.
  • the present application does not have a fixed connection method for the first connecting leg 121 and the second connecting leg 122 and the connection method between the first connecting leg 121 and the main body 11, and those skilled in the art can adjust it according to specific application scenarios.
  • the first connecting leg 121 and the second connecting leg 122 can be connected by welding.
  • the first connecting leg 121 and the main body 11 can be connected by welding.
  • the material of the support leg 12 and the main body 11 can be different.
  • the material of the support leg 12 is iron or other metal.
  • the main body 11 can be high carbon steel with a carbon content of 0.6 or other values.
  • the present application further provides a chip assembly, which includes a circuit board 2, a heat dissipation structure 3, a chip 4, and a bracket 1 as described in the above embodiment, wherein the bracket 1 and the chip 4 are arranged on different sides of the circuit board 2, and the heat dissipation structure 3 is arranged on a side of the chip 4 away from the bracket 1.
  • the chip assembly provided by the present application is connected to the heat dissipation structure 3 through the bracket 1, so that the convex bump 112 can abut against the circuit board 2 in the chip assembly, so that the chip 4 and the heat dissipation structure 3 can fit closely, thereby reducing the contact thermal resistance between the chip 4 and the heat dissipation structure 3, increasing the heat dissipation effect of the chip 4, and solving the problem that the heat dissipation effect of the chip 4 is poor due to the large thermal resistance between the chip 4 and the heat dissipation structure 3.
  • a 4 mm thick Mylar film (not marked in the figures) is arranged between the convex bump 112 and the circuit board 2.
  • the Mylar film can play an insulating role to prevent a short circuit between the convex bump 112 and the circuit board 2.
  • it can also make the force applied by the bracket 1 on the circuit board 2 more uniform.
  • the specific form of the insulating film in this application is not fixed, and those skilled in the art can adjust it according to the specific application scenario.
  • the insulating film can also be a rubber gasket.
  • the thickness value of the insulating film in this application is not fixed, and those skilled in the art can adjust it according to the specific application scenario.
  • the thickness of the insulating film can also be 3mm, 5mm or other thickness values.

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请涉及芯片组件领域，具体提供一种支架及芯片组件。旨在解决现有技术中，完全对称的支脚无法满足芯片的布局要求的问题。为此，本申请提供的支架，沿x轴和y轴均呈轴对称设置，且x轴和y轴相互垂直，支架包括本体和多个支脚，多个支脚均设置在本体上，且沿本体伸出至本体外，任一支脚和x轴之间的夹角与该支脚和y轴之间的夹角不相等。基于上述结构设置，本申请提供的支架通过设置支脚和x轴之间的夹角与该支脚和y轴之间的夹角不相等，使得支脚的设计并不完全对称，具有更大的可调节性，进而可以满足芯片周边布局的要求。

Description

支架及芯片组件 技术领域
本申请要求2023年12月08日提交的、发明名称为“支架及芯片组件”的中国专利申请CN202323368898.1的优先权，上述中国专利申请的全部内容通过引用并入本申请中。
本申请涉及芯片组件领域，具体提供一种支架及芯片组件。
背景技术
随着科技的发展，电子产品日趋智能及复杂化，电子元件的体积趋于微小化，单位面积上的元件密度愈来愈高。对于车辆控制器来而言，由于车辆在运行过程中需要多个芯片的支持，这些芯片在运行过程中会产生很大的热量，使用过程中必须进行降温处理，以保证芯片的正常运行。与芯片配套设置的装置还包括电路板、散热结构以及支架。其中，支架用于与芯片组件中的散热结构连接，并与设置在支架与散热结构之间的电路板抵接，使得设置在电路板与散热结构之间的芯片与散热结构能够紧密贴合，从而能够减小芯片与散热结构之间的接触热阻，增加芯片的散热效果。
现有技术中，为了保证支架的美观性，通常将支架中的支脚完全对称设置，然而，由于芯片周边布局复杂，因此，完全对称的支脚无法满足芯片的布局要求。
因此，本领域需要一种支架及芯片组件来解决上述技术问题。
发明内容
本申请旨在解决上述技术问题，即现有技术中，完全对称的支脚无法满足芯片的布局要求的问题。
第一方面，本申请提供了一种支架，所述支架沿x轴和y轴均呈轴对称设置，且所述x轴和所述y轴相互垂直，
所述支架包括本体和多个支脚，所述多个支脚均设置在所述本体上，且沿所述本体伸出至所述本体外，
任一所述支脚和所述x轴之间的夹角与该支脚和所述y轴之间的夹角不相等。
在上述支架的具体实施方式中，所述本体上开设有孔洞，所述孔洞的周向边缘凹陷形成有所述凸包。
在上述支架的具体实施方式中，所述凸包的数量为多个，多个所述凸包沿所述孔洞的周向边缘间隔分布。
在上述支架的具体实施方式中，所述支脚包括第一连接脚和第二连接脚，
所述第一连接脚沿所述支架本体倾斜向远离所述凸包的方向延伸，
所述第二连接脚沿所述第一连接脚向远离所述支架本体的方向延伸。
在上述支架的具体实施方式中，所述第二连接脚上的边沿上设置有第一连接结构。
在上述支架的具体实施方式中，所述第一连接结构为安装孔。
在上述支架的具体实施方式中，所述安装孔延伸至所述支脚的边缘形成缺口，所述缺口的开口远离所述支架本体设置。
在上述支架的具体实施方式中，所述第一连接脚所在平面与所述支架本体所在平面之间具有第一夹角，所述第一夹角大于90°且小于180°。
在上述支架的具体实施方式中，所述第一连接脚所在平面与所述第二连接脚所在平面之间具有第二夹角，所述第二夹角大于或等于所述第一夹角。
在采用上述技术方案的情况下，本申请提供的支架，沿x轴和y轴均呈轴对称设置，且x轴和y轴相互垂直，支架包括本体和多个支脚，多个支脚均设置在本体上，且沿本体伸出至本体外，任一支脚和x轴之间的夹角与该支脚和y轴之间的夹角不相等。基于上述结构设置，本申请提供的支架通过设置支脚和x轴之间的夹角与该支脚和y轴之间的夹角不相等，使得支脚的设计并不完全对称，具有更大的可调节性，进而可以满足芯片周边布局的要求。
进一步地，本申请提供的支架限定了孔洞的周向边缘凹陷形成有凸包，使得支架与芯片组件中的散热结构连接后，凸包能够与设置在支架与散热结构之间的电路板抵接，使得设置在电路板与散热结构之间的芯片与散热结构能够紧密贴合，从而能够减小芯片与散热结构之间的接触热阻，增加芯片的散热效果。
进一步地，本申请提供的支架限定了多个所述凸包沿所述孔洞的周向边缘间隔分布，能够使得凸包作用在电路板上的力更加均匀，进而使得芯片与散热结构之间的力也更加均匀，进而提高芯片的散热效果。
进一步地，本申请提供的支架限定了第一连接脚和第二连接脚，其中，第一连接脚主要是实现压力的控制，角度可以根据力的需求进行调整，也方便量产时候材料参数差异带来的力的差异，可以通过角度补偿；第二连接脚主要是保证紧固件和支架的角落可以面接触，受力均匀。
进一步地，本申请提供的支架限定了第一连接结构，使得紧固件能够与第一连接结构面接触，进而利于增加第二连接件的连接强度。
进一步地，本申请提供的支架限定了第一连接结构为安装孔，便于紧固件的旋拧安装。
进一步地，本申请通过设置缺口结构，能够降低支脚的强度，从而更加利于紧固件与第一连接结构面接触。
进一步地，本申请提供的支架通过限定第一夹角，利于调整凸包作用在电路板上的力的大小，进而能够调整芯片与散热结构之间的贴合力，从而利于减小芯片与散热结构之间的热阻，提高芯片的散热效果。
进一步地，本申请提供的支架通过限定第二夹角，使得紧固件能够与第一连接结构面接触，进而利于增加凸包作用在电路板上的力的均匀性。
第二方面，本申请还提供了一种芯片组件，芯片组件包括电路板、散热结构、芯片以及如上述实施例的支架，
支架与芯片设置在电路板的不同侧，且散热结构设置在芯片远离支架的一侧。
基于上述结构设置，本申请提供的芯片组件，通过支架与散热结构连接，使得凸包能够与芯片组件中的电路板抵接，使得芯片与散热结构能够紧密贴合，从而能够减小芯片与散热结构之间的接触热阻，增加芯片的散热效果，解决了目前芯片与散热结构之间因热阻大导致芯片散热效果差的问题。
附图说明
下面结合附图来描述本申请的优选实施方式，附图中：
图1是根据一个或多个实施例中本申请提供的支架的结构图；
图2是根据一个或多个实施例中本申请提供的芯片组件的结构图；
图3是根据一个或多个实施例中本申请提供的芯片组件的剖视图。
附图标记：
1、支架；11、本体；111、孔洞；112、凸包；12、支脚；121、第一连接脚；122、第二连接脚；123、第一连接结构；124、缺口；2、电路板；3、散热结构；4、芯片。
具体实施方式
下面参照附图来描述本申请的优选实施方式。本领域技术人员应当理解的是，这些实施方式仅用于解释本申请的技术原理，并非旨在限制本申请的保护范围。本领域技术人员可以根据需要对其作出调整，以便适应具体的应用场合。例如，虽然本具体实施方式是结合支架应用于芯片组件的情形来进行描述的，但是，本申请的支架显然还可以用于其他情景中。这种有关应用场景的改变并不偏离本申请的基本原理，属于本申请的保护范围。
本公开实施例中，术语“上”、“下”、“内”、“中”、“外”、“前”、“后”等指示的方位或位置关系为基于附图所示的方位或位置关系。这些术语主要是为了更好地描述本公开实施例及其实施例，并非用于限定所指示的装置、元件或组成部分必须具有特定方位，或以特定方位进行构造和操作。并且，上述部分术语除了可以用于表示方位或位置关系以外，还可能用于表示其他含义，例如术语“上”在某些情况下也可能用于表示某种依附关系或连接关系。对于本领域普通技术人员而言，可以根据具体情况理解这些术语在本公开实施例中的具体含义。
需要说明的是，在本优选实施方式的描述中，除非另有明确的规定和限定，术语“相连”、“连通”应作广义理解，例如，可以是直接相连，也可以通过中间媒介间接相连，还可以是两个元件内部的相连，这些都不能被理解为对本申请的限制。此外，术语“第一”、“第二”、仅用于描述目的，对于本领域技术人员而言，可根据具体情况理解上述术语在本申请中的具体含义。
首先，参见图1，图1是本申请提供的支架的结构示意图。如图1所示，本申请提供了一种支架1，该支架1沿x轴和y轴均呈轴对称设置，且x轴和y轴相互垂直，其中支架1包括本体11和多个支脚12，多个支脚12均设置在本体上，且沿本体11伸出至本体11外，任一支脚12和x轴之间的夹角与该支脚12和y轴之间的夹角不相等。基于上述结构设置，本申请提供的支架1通过设置支脚12和x轴之间的夹角与该支脚12和y轴之间的夹角不相等，使得支脚12的设计并不完全对称，具有更大的可调节性，进而可以满足芯片周边布局的要求。
在本优选实施例中，本体11为钣金冲压件，其材质为含碳量0.6的高碳钢，该材质的本体11具有高的屈服强度。本体11的形状为矩形，其中间部位开设有孔洞111，该孔洞111为圆角矩形孔。圆角矩形孔的四周边缘凹陷形成凸包112，且这四个凸包112的凸面均为平面，该平面为圆角矩形，且四个凸包112的平面均在同一平面上，以使得四个凸包112均能够与电路板2相抵接。本体11长度方向两侧(如图1示出的左右侧)的凸包112对称设置，宽度方向两侧(如图1示出的上下侧)的凸包112对称设置。
当然，本申请对本体11的材质、形状并非固定，本领域技术人员可以根据具体的应用场景进行调整。如，本体11的材质也可以为其他含碳量的高碳钢，如含碳量为0.7、0.8或其他数值的高碳钢。并且/或者，本体11的形状还可以为圆形、三角形、五边形或其他形状。
此外，本申请对孔洞111的形状并非一成不变，本领域技术人员可以根据需要进行调整。如，孔洞111的形状还可以为圆形、三角形、五边形或其他形状。需要说明的是，孔洞111的形状与本体11的形状可以相同，如孔洞111与本体11的形状可以均为矩形。或者，孔洞111的形状与支架1的形状也可以不同，如孔洞111的形状可以为圆形，本体11的形状可以为矩形。
此外，本申请对凸包112的数量以及形状并非固定，本领域技术人员可以根据需要进行调整。如，凸包112的数量还可以为1个、8个、12个或其他数量。并且/或者，凸包112的平面可以为圆形、弧形或者其他形状。当凸包112的数量为1个时，该凸包112沿孔洞111的周向边缘环向设置，此时凸包112为环向凸包112。当凸包112的数量为8个时，孔洞111沿其长度方向的两侧、宽度方向的两侧分别可以各设置2个凸包112。
还需要说明的是，在其他优选的实施方式中，孔洞111的设置并非必须，本领域技术人员可以根据需要进行选择。当本体11上未开设孔洞111时，凸包112的数量可以为1个或多个。当凸包112数量为1个时，此时凸包112可知设置在本体11的中间部位，且凸包112上平面面积相对较大。当凸包112数量为多个时，多个凸包112可以沿着本体11的外周均匀地间隔分布。
在本优选实施例中，支脚12包括第一连接脚121和第二连接脚122，第一连接脚121沿本体11倾斜向上设置，第二连接脚122沿第一连接脚121向远离本体11的一端倾斜向上设置，其中，第一连接脚121主要是实现压力的控制，角度可以根据力的需求进行调整，也方便量产时候材料参数差异带来的力的差异，可以通过角度补偿；第二连接脚122主要是保证紧固件和支架1的角落可以面接触，受力均匀。
在本优选实施例中，本体11的四个角均设置有支脚12，且四个支脚12均沿本体11向远离本体11的方向延伸，且本体11与支脚12圆弧倒角连接。其中，支脚12的第二连接脚122的边沿上设置有第一连接结构123，通过设置第一连接结构123，使得紧固件能够与第一连接结构123面接触，进而利于增加第二连接脚122的连接强度。
优选地，第一连接结构123为安装孔，便于紧固件的旋拧安装，且安装孔延伸至支脚12的边缘形成U型缺口124，U型缺口124的开口远离本体11设置。其中一组对角设置的安装孔的孔径小于另一组对角设置的安装孔的孔径，孔径小的一组安装孔能够用来进行定位，即该组孔径小的安装孔优先通过螺钉与散热结构安装后，支架1与散热结构的连接稳定性好，此时可利于其他孔径的安装孔与散热结构通过螺钉连接。
需要说明的是，支脚12与本体11之间除了可以圆弧倒角连接外，还可以采用直线倒角的方式连接，或者支脚12与本体11直接连接。另外，本申请对缺口124的形状并非固定，本领域技术人员可以根据具体的应用场景进行调整。
在本优选实施例中，第一连接脚121与支脚12本体之间具有第一夹角，其中第一夹角大于90°且小于180°。第一连接脚121与第二连接脚122之间具有第二夹角，第二夹角大于第一连接脚121与本体11之间的夹角，使得支架1与散热结构通过螺钉连接时，螺钉的螺帽能够与第二连接脚122面接触，使得支架1与散热结构连接时，施加在电路板2上的力更加均匀。
当然，本申请对第二夹角的大小并非固定，本领域技术人员可以根据具体的应用场景进行调整。如，第二夹角可以等于第一夹角。
在本优选实施例中，第一连接脚121与第二连接脚122一体成型形成支脚12，且支脚12与本体11一体成型。支脚12与本体11的材质相同，也为含碳量0.6的高碳钢。
当然，本申请对第一连接脚121和第二连接脚122以及第一连接脚121与本体11的连接方式并非固定，本领域技术人员可以根据具体的应用场合进行调整。如，第一连接脚121与第二连接脚122可以采用焊接的方式连接。并且/或者，第一连接脚121与本体11可以采用焊接的方式连接。此外，支脚12与本体11的材质可以不相同。如，支脚12的材质为铁或其他材质的金属。并且/或者，本体11可以为含碳量0.6或者其他数值的高碳钢。
另外，结合图2和图3，本申请还提供了一种芯片组件，该芯片组件包括电路板2、散热结构3、芯片4以及如上述实施例所述的支架1，其中，支架1与芯片4设置在电路板2的不同侧，且散热结构3设置在芯片4远离支架1的一侧。基于上述结构设置，本申请提供的芯片组件，通过支架1与散热结构3连接，使得凸包112能够与芯片组件中的电路板2抵接，使得芯片4与散热结构3能够紧密贴合，从而能够减小芯片4与散热结构3之间的接触热阻，增加芯片4的散热效果，解决了目前芯片4与散热结构3之间因热阻大导致芯片4散热效果差的问题。
接着结合图1至图3，凸包112与电路板2之间设置有4mm厚的麦拉膜(图中未标出)，该麦拉膜一方面能够起到绝缘的作用，防止凸包112与电路板2之间发生短路，另一方面还可以使得支架1施加在电路板2的上的力更加均匀。
当然，本申请对绝缘膜的具体形式并非固定，本领域技术人员可以根据具体的应用场景进行调整。如，绝缘膜还可以为橡胶垫片。另外，本申请对绝缘膜的厚度值也并非一成不变，本领域技术人员可以根据具体的应用场景进行调整。如，绝缘膜的厚度还可以为3mm、5mm或其他厚度值。
需要说明的是，上述实施方式仅仅用来阐述本申请的原理，并非旨在与限制本申请的保护范围，在不偏离本申请原理的条件下，本领域技术人员能够对上述结构进行调整，以便本申请能够应用于更加具体的应用场景。
至此，已经结合附图所示的优选实施方式描述了本申请的技术方案，但是，本领域技术人员容易理解的是，本申请的保护范围显然不局限于这些具体实施方式。在不偏离本申请的原理的前提下，本领域技术人员可以对相关技术特征作出等同的更改或替换，这些更改或替换之后的技术方案都将落入本申请的保护范围之内。

Claims (10)

  1. 一种支架，其特征在于，所述支架沿x轴和y轴均呈轴对称设置，且所述x轴和所述y轴相互垂直，
    所述支架包括本体和多个支脚，所述多个支脚均设置在所述本体上，且沿所述本体伸出至所述本体外，
    任一所述支脚和所述x轴之间的夹角与该支脚和所述y轴之间的夹角不相等。
  2. 根据权利要求1所述的支架，其特征在于，所述本体上开设有孔洞，所述孔洞的周向边缘凹陷形成有凸包。
  3. 根据权利要求2所述的支架，其特征在于，所述凸包的数量为多个，多个所述凸包沿所述孔洞的周向边缘间隔分布。
  4. 根据权利要求2所述的支架，其特征在于，所述支脚包括第一连接脚和第二连接脚，
    所述第一连接脚沿所述支架本体倾斜向远离所述凸包的方向延伸，
    所述第二连接脚沿所述第一连接脚向远离所述支架本体的方向延伸。
  5. 根据权利要求4所述的支架，其特征在于，所述第二连接脚的边沿上设置有第一连接结构。
  6. 根据权利要求5所述的支架，其特征在于，所述第一连接结构为安装孔。
  7. 根据权利要求6所述的支架，其特征在于，所述安装孔延伸至所述支脚的边缘形成缺口，所述缺口的开口远离所述支架本体设置。
  8. 根据权利要求4所述的支架，其特征在于，所述第一连接脚所在平面与所述支架本体所在平面之间具有第一夹角，所述第一夹角大于90°且小于180°。
  9. 根据权利要求8所述的支架，其特征在于，所述第一连接脚所在平面与所述第二连接脚所在平面之间具有第二夹角，所述第二夹角大于或等于所述第一夹角。
  10. 一种芯片组件，其特征在于，所述芯片组件包括电路板、散热结构、芯片以及如权利要求1-9任一项所述的支架，
    所述支架与所述芯片设置在所述电路板的不同侧，且所述散热结构设置在所述芯片远离所述支架的一侧。
PCT/CN2024/133487 2023-12-08 2024-11-21 支架及芯片组件 Pending WO2025118985A1 (zh)

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