WO2025102769A1 - 发声模组和电子设备 - Google Patents

发声模组和电子设备 Download PDF

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Publication number
WO2025102769A1
WO2025102769A1 PCT/CN2024/103963 CN2024103963W WO2025102769A1 WO 2025102769 A1 WO2025102769 A1 WO 2025102769A1 CN 2024103963 W CN2024103963 W CN 2024103963W WO 2025102769 A1 WO2025102769 A1 WO 2025102769A1
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WO
WIPO (PCT)
Prior art keywords
sound
magnetic circuit
vibration component
module
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/103963
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English (en)
French (fr)
Inventor
蔡晓东
李波波
刘松
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Goertek Inc
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Goertek Inc
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Filing date
Publication date
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Publication of WO2025102769A1 publication Critical patent/WO2025102769A1/zh
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present invention relates to the technical field of electroacoustic conversion, and in particular to a sound module and an electronic device using the sound module.
  • micro speakers Due to their small size, micro speakers are widely used in modern portable, communication, and smart devices, and users' demand for high sound quality is also increasing. Especially for some portable smart devices, users are no longer satisfied with the presence or absence of sound, but are more pursuing good sound quality.
  • the effective frequency band of micro speakers in smart mobile terminals is narrow, the tone is relatively monotonous, and the sound quality is poor.
  • the main purpose of the present invention is to provide a sound module and an electronic device, aiming to provide a sound module, the sound unit of which includes a first vibration component and a second vibration component arranged at an angle, which can expand the bandwidth of the sound module and improve the sound effect.
  • a sound module which includes:
  • a sound-emitting monomer wherein the sound-emitting monomer is provided with a first vibration component and a second vibration component, the vibration direction of the first vibration component is arranged at an angle with the vibration direction of the second vibration component, and the size of the sound-emitting monomer along the vibration direction of the first vibration component is smaller than the size of the sound-emitting monomer along the vibration direction of the second vibration component;
  • a module housing wherein the module housing has a receiving space, the sound-emitting unit is arranged in the receiving space and forms a rear sound cavity with the module housing;
  • the module shell has a supporting wall and a sound output part connected to the supporting wall, the sound-emitting unit is provided with a side of the first vibration component connected to the supporting wall, the sound-emitting unit is provided with a side of the second vibration component connected to the sound output part, and the sound output part transmits the sound waves of the first vibration component and the sound waves of the second vibration component to the outside.
  • the sound output portion is located at a peripheral side of the module housing, the sound output portion is opposite to and connected to the second vibration component, and the sound waves of the second vibration component are radiated outward through the sound output portion;
  • a first front cavity is formed between the first vibration component and the module shell, the support wall is provided with a first break, the first front cavity is connected with the sound output part through the first break, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, and the sound output part.
  • the sound output portion has a first sound output channel
  • the first break is connected to the first sound output channel
  • the sound waves of the first vibration component and the sound waves of the second vibration component are both radiated outward through the first sound output channel.
  • a sound-guiding pipe is provided between the sound-emitting portion and the second vibration component, the sound-guiding pipe is connected to the periphery of the second vibration component and is correspondingly connected to the first sound-emitting channel, the sound-guiding pipe is provided with a first avoidance channel, and the first avoidance channel is opposite to and connected to the first break.
  • the sound output portion has a second sound output channel and a third sound output channel, the second sound output channel and the third sound output channel are isolated from each other, the second sound output channel is opposite to and connected to the second vibration component, and the sound waves of the second vibration component are radiated outward through the second sound output channel;
  • the first break is connected to the third sound outlet channel, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, and the third sound outlet channel.
  • the third sound outlet channels include two, and the two third sound outlet channels are respectively arranged on two opposite sides of the second sound outlet channel.
  • a sound guide pipe is provided between the sound output portion and the second vibration component, the sound guide pipe is connected to the periphery of the second vibration component and is correspondingly connected to the second sound output channel, and the sound waves of the second vibration component are radiated outward through the sound guide pipe and the second sound output channel;
  • a second avoidance channel is provided between the sound outlet and the sound guiding pipe, the second avoidance channel is opposite to and connected with the first break, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, the second avoidance channel and the third sound outlet channel.
  • the module housing includes
  • a module lower shell wherein the module lower shell is provided with the support wall and the sound output portion;
  • the module upper shell is connected with the module lower shell and encloses the receiving space, and the rear sound cavity is formed between the sound-emitting unit, the module upper shell and the module lower shell.
  • a step structure is provided on the side of the sound unit facing away from the first vibration component and the second vibration component, a vibration space is formed in the sound unit, and the step structure is provided with an air leakage hole connecting the vibration space and the rear sound cavity;
  • the sound module also includes a breathable isolation piece provided on the step structure, the breathable isolation piece covers the air leakage hole, the rear sound cavity is filled with sound-absorbing particles, and the breathable isolation piece is used to prevent the sound-absorbing particles from entering the vibration space.
  • the first vibration component is used for producing bass sounds
  • the second vibration component is used for producing treble sounds.
  • the sound-emitting unit includes:
  • a housing comprising a first housing and a second housing arranged at an angle
  • a vibration system includes the first vibration component and the second vibration component, the first vibration component is connected to the first shell and is opposite to the magnetic circuit system, the second vibration component is connected to the second shell and is opposite to the magnetic circuit system, and the vibration direction of the first vibration component is set at an angle to the vibration direction of the second vibration component.
  • the magnetic circuit system has a first magnetic gap and a second magnetic gap
  • the first vibration component includes a first diaphragm and a first voice coil, the first diaphragm is connected to the first housing, one end of the first voice coil is connected to the first diaphragm, and the other end of the first voice coil is suspended in the first magnetic gap;
  • the second vibration component includes a second diaphragm and a second voice coil, the second diaphragm is connected to the second shell, the second voice coil is connected to the second diaphragm, and the second voice coil is arranged in the second magnetic gap.
  • the magnetic circuit system comprises:
  • the first magnetic circuit portion is opposite to and spaced from the first vibration component, the first magnetic circuit portion comprises a central magnetic circuit portion and a side magnetic circuit portion provided on a side of the magnetic conductive yoke facing the housing, the side magnetic circuit portion is provided outside the central magnetic circuit portion and spaced from the central magnetic circuit portion to form the first magnetic gap;
  • the second magnetic circuit portion is arranged on the magnetic yoke, opposite to and spaced from the second vibration component, and the second magnetic circuit portion is located on the side of the first magnetic circuit portion facing away from the first vibration component, and cooperates with the first magnetic circuit portion to form the second magnetic gap.
  • the central magnetic circuit portion includes a central magnetic circuit and a first common magnetic circuit connected to each other
  • the side magnetic circuit portion includes a side magnetic circuit and a second common magnetic circuit
  • the side magnetic circuit is located outside the central magnetic circuit and is spaced to form a first sub-gap
  • the second common magnetic circuit is located on a side of the first common magnetic circuit that is away from the central magnetic circuit and is spaced to form a second sub-gap
  • the first sub-gap is connected to the second sub-gap to form the first magnetic gap
  • the second magnetic circuit portion includes a first magnet and a second magnet arranged at an interval, the first magnet is opposite to and spaced from the first common magnetic circuit to form a third sub-gap, the second magnet is opposite to and spaced from the second common magnetic circuit to form a fourth sub-gap, the third sub-gap and the fourth sub-gap are connected to form the second magnetic gap.
  • the second voice coil is a flat voice coil
  • the second voice coil includes two long axis sides and two short axis sides connected end to end, each of the short axis sides is arranged between the two long axis sides, one of the long axis sides is arranged in the third sub-gap, and the other long axis side is arranged in the fourth sub-gap.
  • the side magnetic circuit portion includes a side magnetic circuit and a second common magnetic circuit, a first sub-gap is formed between the side magnetic circuit and the central magnetic circuit, a second sub-gap is formed between the second common magnetic circuit and the central magnetic circuit, and the first sub-gap is connected to the second sub-gap to form the first magnetic gap;
  • the second magnetic circuit portion includes a third magnet, and the third magnet is opposite to the second common magnetic circuit and forms the second magnetic gap therebetween.
  • the second voice coil is a flat voice coil
  • the second voice coil includes two long axis sides and two short axis sides connected end to end, each of the short axis sides is arranged between the two long axis sides, one of the long axis sides is connected to the second diaphragm, and the other long axis side is arranged in the second magnetic gap.
  • the magnetic yoke includes a first section, a second section and a third section connected in sequence, the first section and the third section are respectively arranged at an angle with the second section and are located on opposite sides of the second section, part of the first magnetic circuit is arranged in the first section, and part of the second magnetic circuit is arranged in the third section.
  • the present invention also proposes an electronic device, comprising a device housing and the above-mentioned sound module, wherein the device housing comprises a display surface, a back surface opposite to the display surface, and a side surface connecting the display surface and the back surface, and the sound module is arranged in the device housing.
  • the sound module is located at the top of the electronic device, and a first sound hole and a second sound hole are provided on the top of the device shell, the first sound hole and the second sound hole are both connected to the sound output part, and the second sound hole and the sound output part are arranged relative to each other, the first sound hole is provided on the display surface or on the connecting area between the display surface and the side surface, and the second sound hole is provided on the side surface.
  • the sound module is disposed at the bottom of the electronic device, the bottom of the device housing has a bottom sound hole, the bottom sound hole is opposite to and connected to the sound emitting part, and the bottom sound hole is disposed on the side.
  • the sound module of the technical solution of the present invention arranges the first vibration component and the second vibration component on the sound unit so that the vibration direction of the first vibration component is set at an angle with the vibration direction of the second vibration component, and radiates the sound waves of the first vibration component and the second vibration component to the outside through the sound output part, thereby broadening the frequency band of the sound module and making the sound of the sound module richer and fuller.
  • FIG1 is a schematic plan view of a sound module according to an embodiment of the present invention.
  • Fig. 2 is a schematic cross-sectional view along line A-A in Fig. 1;
  • FIG3 is a three-dimensional schematic diagram of a sound module in one embodiment of the present invention with part of the module housing removed;
  • FIG4 is a schematic structural diagram of a lower shell of a sound module in an embodiment of the present invention.
  • FIG5 is an exploded schematic diagram of a sound module according to an embodiment of the present invention.
  • FIG6 is a plan view of a sound module according to an embodiment of the present invention.
  • Fig. 7 is a schematic cross-sectional view along line B-B in Fig. 1;
  • Fig. 8 is a schematic cross-sectional view along line C-C in Fig. 1;
  • FIG9 is a three-dimensional schematic diagram of a sound module in one embodiment of the present invention with part of the module housing removed;
  • FIG10 is a schematic structural diagram of a lower shell of a sound module in one embodiment of the present invention.
  • FIG11 is an exploded schematic diagram of a sound module according to an embodiment of the present invention.
  • FIG12 is a cross-sectional schematic diagram of a sound-emitting unit in one embodiment of the present invention.
  • FIG13 is a cross-sectional schematic diagram of an electronic device in one embodiment of the present invention.
  • FIG. 14 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.
  • micro speakers Due to their small size, micro speakers are widely used in modern portable, communication, and smart devices, and users' demand for high sound quality is also increasing. Especially for some portable smart devices, users are no longer satisfied with the presence or absence of sound, but are more pursuing good sound quality.
  • the effective frequency band of micro speakers in smart mobile terminals is narrow, the tone is relatively monotonous, and the sound quality is poor.
  • the present invention proposes a sound module 100. It can be understood that the sound module 100 is applied to an electronic device 200, and the electronic device 200 can be a mobile phone, a tablet, a computer, an earphone, a watch or a TV, etc., which is not limited here.
  • the sound module 100 includes a sound unit 1 and a module shell 2, wherein the module shell 2 has a receiving space, the sound unit 1 is received in the receiving space, the sound unit 1 is provided with a first vibration component 131 and a second vibration component 132, the vibration direction of the first vibration component 131 is arranged at an angle to the vibration direction of the second vibration component 132, the module shell 2 has a support wall 212 and a sound output portion 211 connected to the support wall 212, and the sound unit 1 is provided with One side of the first vibration component 131 is connected to the support wall 212 , and one side of the second vibration component 132 of the sound-emitting unit 1 is connected to the sound-emitting portion 211 , and the sound-emitting portion 211 transmits the sound waves of the first vibration component 131 and the second vibration component 132 to the outside.
  • the sound unit 1 is arranged in the accommodating space and forms a rear sound cavity 3 with the module shell 2.
  • the rear sound cavity 3 can be further used to fill sound-absorbing particles, thereby effectively improving the low-frequency performance and acoustic performance of the sound module 100.
  • the vibration direction of the first vibration component 131 and the vibration direction of the second vibration component 132 are arranged at an angle, and the sound waves of the first vibration component 131 and the second vibration component 132 are radiated to the outside through the sound output part 211, thereby broadening the frequency band of the sound module 100 and making the sound of the sound module 100 richer and fuller.
  • the size of the sound-emitting monomer 1 along the vibration direction of the first vibration component 131 is smaller than the size of the sound-emitting monomer 1 along the vibration direction of the second vibration component 132.
  • the sound-emitting monomer 1 has a flat structure, which facilitates the thin design of the application end when adapted to the application end, thereby improving the user experience.
  • the sound outlet 211 is located on the peripheral side of the module shell 2, the sound outlet 211 is opposite to and connected to the second vibration component 132, the sound waves of the second vibration component 132 are radiated outwardly through the sound outlet 211, a first front cavity 1310 is formed between the first vibration component 131 and the module shell 2, the support wall 212 is provided with a first break 2121, the first front cavity 1310 is connected to the sound outlet 211 through the first break 2121, and the sound waves of the first vibration component 131 are radiated outwardly through the first front cavity 1310, the first break 2121, and the sound outlet 211.
  • a dustproof net 26 is further provided on the sound outlet 211 to prevent external dust or impurities from entering the interior of the sound outlet 211 and affecting its sound effect.
  • the sound outlet 211 has a first sound outlet channel 2111, the first break 2121 is connected to the first sound outlet channel 2111, and the sound waves of the first vibration component 131 and the sound waves of the second vibration component 132 are radiated outward through the first sound outlet channel 2111.
  • the first sound outlet channel 2111 is a hollow structure, so that the sounds emitted by the first vibration component 131 and the second vibration component 132 can be smoothly transmitted through the first sound outlet channel 2111, thereby improving the sound effect of the sound module 100.
  • the radiation path of the sound waves of the second vibration component 132 and the first vibration component 131 is The paths are connected, and the sound waves of the second vibration component 132 and the sound waves of the first vibration component 131 are mixed and radiated to the outside through the first sound outlet channel 2111. In this way, the frequency band of the sound module 100 can be further widened and the sound effect can be improved.
  • a sound guide pipe 23 is provided between the sound outlet 211 and the second vibration component 132, the sound guide pipe 23 is connected to the periphery of the second vibration component 132 and is correspondingly connected to the first sound outlet channel 2111, and the sound guide pipe 23 is provided with a first avoidance channel 231, and the first avoidance channel 231 is opposite to and connected to the first break 2121.
  • the sound guide pipe 23 is a hollow structure, so that the sound emitted by the first vibration component 131 and the second vibration component 132 can be smoothly transmitted through the sound guide pipe 23, thereby improving the sound effect of the sound module 100.
  • a sound-conducting tube 23 is provided between the sound-emitting part 211 and the second vibration component 132, that is, a sound-conducting tube 23 is provided between the sound-emitting unit 1 and the module shell 2.
  • a sealing foam 25 is provided on the surface of the sound-conducting pipe 23 away from the second vibration component 132, so as to improve the sealing between the sound-conducting pipe 23 and the external device and improve the sound quality of the sound module 100. It can be understood that the sealing foam 25 is annular and has a first avoidance groove 251 connected to the first avoidance channel 231.
  • the side of the sound-conducting tube 23 away from the second vibration component 132 is an inclined surface, that is, there is an angle between the inclined surface and the mounting surface of the second vibration component 132.
  • the inclined surface of the sound-conducting tube 23 can also be tightened by force, thereby improving the operability of the sound-conducting unit 1 during assembly.
  • the distance between the end of the inclined surface close to the first vibration component 131 and the second vibration component 132 is smaller than the distance between the end of the inclined surface away from the first vibration component 131 and the second vibration component 132.
  • the sound outlet portion 211 has a second sound outlet channel 2112 and a third sound outlet channel 2113, the second sound outlet channel 2112 and the third sound outlet channel 2113 are isolated from each other, the second sound outlet channel 2112 is opposite to and connected with the second vibration component 132, and the sound waves of the second vibration component 132 radiate outward through the second sound outlet channel 2112; the first break 2121 and the third sound outlet channel 2113 are connected, and the sound waves of the first vibration component 131 radiate outward through the first front cavity 1310, the first break 2121, and the third sound outlet channel 2113.
  • the second sound outlet channel 2112 and the third sound outlet channel 2113 are hollow.
  • the sound emitted by the second vibration component 132 can be smoothly transmitted through the second sound output channel 2112, and the sound emitted by the first vibration component 131 can be smoothly transmitted through the third sound output channel 2113, thereby improving the sound effect of the sound module 100.
  • the second sound outlet channel 2112 and the third sound outlet channel 2113 are isolated from each other, that is, the sound waves of the first vibration component 131 and the sound waves of the second vibration component 132 are radiated outward through different radiation paths. In this way, the space between the first vibration component 131 and the second vibration component 132 and the module shell 2 is divided into different radiation paths, which can improve the high-frequency performance of the sound module 100.
  • the third sound outlet channel 2113 includes two, and the two third sound outlet channels 2113 are respectively arranged on opposite sides of the second sound outlet channel 2112, so that the second sound outlet channel 2112 can be directly opposite to the second vibration component 132, so that the sound waves of the second vibration component 132 are directly radiated to the outside, thereby improving the high-frequency performance of the sound module 100.
  • the first break 2121 and the second sound outlet channel 2112 are isolated from each other, and the first break 2121 is divided into two parts located on both sides of the second sound outlet channel 2112, which are respectively connected to a third sound outlet channel 2113.
  • the third sound outlet channel 2113 and the second sound outlet channel 2112 are flared, and the caliber of the side away from the sound unit 1 is larger than the caliber of the side close to the sound unit 1.
  • the third sound outlet channel 2113 can also be one, which is not limited here.
  • a sound-guiding pipe 23 is provided between the sound-emitting portion 211 and the second vibration component 132, the sound-guiding pipe 23 is connected to the periphery of the second vibration component 132 and is correspondingly connected to the second sound outlet channel 2112, and the sound waves of the second vibration component 132 are radiated outward through the sound-guiding pipe 23 and the second sound outlet channel 2112;
  • a second avoidance channel 24 is provided between the sound-emitting portion 211 and the sound-guiding pipe 23, the second avoidance channel 24 is opposite to and connected to the first break 2121, and the sound waves of the first vibration component 131 are radiated outward through the first front cavity 1310, the first break 2121, the second avoidance channel 24 and the third sound outlet channel 2113.
  • the sound-guiding pipe 23 is a hollow structure, so that the sound emitted by the second vibration component 132 can be smoothly transmitted through the sound-guiding pipe 23, thereby improving the sound effect of the sound module 100.
  • the inner wall of the sound outlet portion 211 is connected to the outer wall of the sound guide pipe 23, and the second avoidance channel 24 is formed between the sound guide pipe 23 and the sound outlet portion 211, specifically between the inner wall of the sound outlet portion 211 and the outer wall of the sound guide pipe 23.
  • the second avoidance channel 24 is formed by the inner wall forming the third sound outlet channel 2113 being recessed in a direction away from the second vibration component 132 relative to the inner wall forming the second sound outlet channel 2112.
  • the outer wall of the sound guide pipe 23 corresponding to the third sound outlet channel 2113 may also be recessed in a direction close to the second vibration component 132, so as to form a first break 2121 between the two.
  • the second avoidance passage 24 is connected.
  • a sound-conducting tube 23 is provided between the sound-emitting part 211 and the second vibration component 132, that is, a sound-conducting tube 23 is provided between the sound-emitting unit 1 and the module shell 2.
  • a sealing foam 25 is provided on the surface of the sound-conducting pipe 23 away from the second vibration component 132, thereby improving the sealing between the sound-conducting pipe 23 and the external device and improving the sound quality of the sound module 100. It can be understood that the sealing foam 25 is annular and has a second avoidance groove 252 connected to the third sound outlet channel 2113.
  • the side of the sound-conducting pipe 23 away from the second vibration component 132 is an inclined surface, that is, there is an angle between the inclined surface and the mounting surface of the second vibration component 132.
  • the inclined surface of the sound-conducting pipe 23 can also be tightened by force, thereby improving the operability of the sound-emitting unit 1 during assembly.
  • the distance between the end of the inclined surface close to the first vibration component 131 and the second vibration component 132 is smaller than the distance between the end of the inclined surface away from the first vibration component 131 and the second vibration component 132.
  • the module housing 2 includes a module upper shell 22 and a module lower shell 21, the module lower shell 21 and the module upper shell 22 are connected and enclosed to form a receiving space, the module lower shell 21 is provided with a support wall 212 and a sound outlet 211, and a rear sound cavity 3 is formed between the module lower shell 21, the sound unit 1, the module upper shell 22, and the module lower shell 21.
  • the module housing 2 as shown in Figures 5 and 11, by setting the module housing 2 as a two-part structure of the module lower shell 21 and the module upper shell 22, the installation and fixation of the sound unit 1 is facilitated, and the module upper shell 22 and the module lower shell 21 can be fixed by bonding, welding, etc., which is not limited here.
  • a vibration space 14 is formed in the sound unit 1, and a step structure is provided on the side of the sound unit 1 facing away from the first vibration component 131 and the second vibration component 132, and the step structure is provided with an air leakage hole connecting the vibration space 14 and the rear sound cavity 3;
  • the sound module 100 also includes a breathable isolation member provided in the rear sound cavity 3, which is used to prevent the sound-absorbing particles from entering the vibration space 14 of the sound unit 1 when the rear sound cavity 3 is filled with sound-absorbing particles.
  • the first step surface of the step structure is provided with an air leakage hole, and the air-permeable spacer is arranged in contact with the first step surface and covers the air leakage hole; or, the second step surface of the step structure is provided with an air leakage hole, and the air-permeable spacer is arranged in contact with the second step surface and covers the air leakage hole; or, the first step surface of the step structure is provided with an air leakage hole, and the air-permeable spacer is arranged in contact with the second step surface and covers the air leakage hole.
  • the first step surface and the second step surface are both provided with air leakage holes, and the air-permeable isolation piece is arranged in contact with the first step surface and the second step surface and covers the air leakage holes.
  • the first step surface corresponds to the first vibration component
  • the second step surface corresponds to the second vibration component
  • the first step surface is provided with multiple air leakage holes
  • the second step surface is provided with multiple air leakage holes
  • the breathable isolation member includes multiple, each breathable isolation member covers an air leakage hole setting, which is not limited here.
  • an air leakage hole is provided on the step structure, so that the vibration space 14 and the rear sound cavity 3 are connected by the air leakage hole to balance the air pressure of the vibration space 14 and the rear sound cavity 3.
  • a breathable spacer is provided in the rear sound cavity 3, so that the breathable spacer can be used to prevent sound-absorbing particles from entering the interior of the sound-emitting monomer 1 through the air leakage hole, thereby affecting the acoustic performance of the sound-emitting monomer 1.
  • the breathable spacer can be arranged in accordance with the step structure of the sound unit 1 and cover the vent hole, so that the volume of the filling cavity can be increased to achieve full filling of the sound module 100.
  • the breathable spacer can also be arranged in the rear sound cavity 3 and separate the rear sound cavity 3 from the filling cavity, that is, the breathable spacer cooperates with the module shell 2 to form the filling cavity, and the breathable spacer and the step structure interval of the sound unit 1 are not limited here.
  • the module housing 2 is provided with a damping hole connected to the rear sound cavity 3, and the sound module 100 further includes a damping member 5, which is provided at the damping hole.
  • the damping hole and the damping member 5 are used to balance the air pressure between the rear sound cavity 3 and the outside, and on the other hand, sound-absorbing particles can be filled into the filling cavity of the rear sound cavity 3 through the damping hole.
  • the damping member 5 is a breathable isolation member such as a breathable membrane or film, which is not limited here.
  • the sound module 100 also includes a flexible circuit board 6, which is used to connect to an external circuit.
  • One end of the flexible circuit board 6 extends into the rear sound cavity 3 and is electrically connected to the sound unit 1.
  • the flexible circuit board 6 has an inner pad 61 connected to the sound unit 1 and an outer pad 62 connected to the external circuit.
  • a flexible circuit board 6 is provided so as to connect the external circuit to the sound unit 1 by using the flexible circuit board 6 to ensure the normal operation of the sound unit 1.
  • the flexible circuit board 6 is made of FPCB.
  • the first vibration component 131 is used for bass sounding
  • the second vibration component 132 is used for treble sounding. In this way, the bandwidth of the sound module 100 can be expanded, making the timbre of the sound module 100 fuller and rounder.
  • the sound module 100 has a frequency division point F1, and the sound module 100 is used in the electronic device 200
  • Fh front cavity resonance frequency
  • F1>Fh the frequency division point
  • F1 is greater than or equal to 6kHz, so that the sound pressure level curve of the sound module 100 formed by combining the first vibration component 13131 and the second vibration component 132 is relatively smooth, does not produce a large trough, and sounds natural.
  • the crossover point F1 is greater than or equal to 6kHz and less than or equal to 10kHz, and the crossover point F1 can be 6kHz, 6.5KHz, 7kHz, 7.5kHz, 8kHz, 8.5kHz, 9kHz, 9.5kHz, 10kHz, etc.
  • the sound pressure levels of the first vibration component 13131 and the second vibration component 13232 can be better connected at the crossover point, and the sound quality is richer and more natural.
  • the bass of the sound module 100 in this embodiment is deep and powerful, and the treble is clear and rich.
  • the sound unit 1 includes a housing 11, a magnetic circuit system 12 and a vibration system 13, wherein the housing 11 includes a first shell and a second shell arranged at an angle, the magnetic circuit system 12 is connected to the first shell and the second shell, and the vibration system 13 includes a first vibration component 131 and a second vibration component 132, the first vibration component 131 is connected to the first shell and is opposite to the magnetic circuit system 12, the second vibration component 132 is connected to the second shell and is opposite to the magnetic circuit system 12, and the vibration direction of the first vibration component 131 is arranged at an angle to the vibration direction of the second vibration component 132.
  • the vibration direction of the first vibration component 131 is arranged perpendicular to the vibration direction of the second vibration component 132.
  • the housing 11 is used to install, fix, support and protect the vibration system 13, the magnetic circuit system 12 and other components, that is, the housing 11 provides an installation base for the vibration system 13, the magnetic circuit system 12 and other components.
  • the housing 11 can be a structure such as a mounting shell, a shell or a box body with a mounting cavity, that is, the housing 11 defines a receiving space, which is not limited here.
  • first shell and the second shell are integrally formed, thereby improving the structural strength and stability of the housing 11. It can be understood that the first shell and the second shell are enclosed to form a mounting cavity, and the mounting cavity can be a through cavity or a through groove structure. Optionally, the first shell and the second shell are vertically arranged.
  • the first shell is a rectangular structure, and the first shell has two opposite long sides and two short sides, and the two ends of the short sides are respectively connected to the two long sides, and the two ends of the long sides are respectively connected to the two short sides.
  • the second shell is connected to the long side or the short side of the first shell, so that the second shell is arranged perpendicular to the first shell.
  • the second shell can be optionally a rectangular structure, and the second shell has two opposite long sides and two short sides, and the two ends of the short sides are respectively connected to the two long sides, and the two ends of the long sides are respectively connected to the two short sides.
  • the first shell and the second shell share a long side or a short side.
  • the two long sides and the two short sides of the first shell define a first opening
  • the two long sides and the two short sides of the second shell define a second opening
  • the first opening and the second opening are respectively connected to the installation cavity.
  • the first opening and the second opening are located on two adjacent surfaces of the shell 11.
  • the magnetic circuit system 12 is fixed to the housing 11 by bonding or welding.
  • the side magnetic conductive plate of the magnetic circuit system 12 is first injection molded into the housing 11 as an insert, or the magnetic circuit system 12 is fixed to the housing 11 by bonding, and then other parts are bonded and fixed, which is not limited here.
  • the magnetic circuit system 12 is disposed in the mounting cavity of the housing 11 and is connected to the first shell and the second shell of the housing 11.
  • the vibration system 13 is connected to the first shell and the second shell of the housing 11 and is opposite to the magnetic circuit system 12. It can be understood that the first vibration component 131 of the vibration system 13 is connected to the first shell and covers the first opening, and the second vibration component 132 is connected to the second shell and covers the second opening, so that the first shell and the second shell of the housing 11, the first vibration component 131 and the second vibration component 132 and the magnetic circuit system 12 together enclose a vibration space 14.
  • the first vibration component 131 is opposite to the magnetic circuit system 12, and the second vibration component 132 is opposite to the magnetic circuit system 12, so that the first vibration component 131 and the second vibration component 132 share the magnetic circuit system 12, that is, the magnetic circuit system 12 provides a magnetic field and a driving force for the first vibration component 131 and the second vibration component 132 to drive the first vibration component 131 and the second vibration component 132 to vibrate and make sounds respectively, thereby improving the utilization rate of the magnetic field while reducing the size of the sound-emitting unit 1 and reducing the cost of the sound-emitting unit 1.
  • the sound-emitting unit 1 of the sound-emitting module 100 of the present invention is configured such that the housing 11 is configured as a first housing and a second housing that are configured at an angle, so that the first housing and the second housing are an integrally formed structure and enclose a mounting cavity, thereby utilizing the mounting cavity to mount and fix the magnetic circuit system 12 while improving the structural strength of the housing 11.
  • the vibration system 13 is configured with a first vibration component 131 and a second vibration component 132, so that the first vibration component 131 is connected to the first housing and is opposite to the magnetic circuit system 12, and the second vibration component 132 is connected to the second housing and is opposite to the magnetic circuit system 12.
  • the magnetic circuit system 12 is utilized to simultaneously provide a magnetic field and a driving force for the first vibration component 131 and the second vibration component 132, so as to improve the utilization rate of the magnetic field while reducing the cost, and further align the vibration direction of the first vibration component 131 with the second vibration component 132.
  • the vibration direction of 132 is set at an angle, so that the vibration system 13 can form two independent vibration radiation surfaces set at an angle, which not only broadens the frequency band of the sound module 100, but also reduces the size of the sound unit 1.
  • the magnetic circuit system 12 has a first magnetic gap 1221 and a second magnetic gap 1231
  • the first vibration component 131 includes a first diaphragm 1311 and a first voice coil 1312
  • the first diaphragm 1311 is connected to the first housing
  • one end of the first voice coil 1312 is connected to the first diaphragm 1311
  • the other end is arranged in the first magnetic gap 1221
  • the second vibration component 132 includes a second diaphragm 1321 and a second voice coil 1322
  • the second diaphragm 1321 is connected to the second housing
  • the second voice coil 1322 is arranged in the second magnetic gap 1231.
  • the magnetic circuit system 12 provides the first magnetic gap 1221 and the second magnetic gap 1231, when the first voice coil 1312 is energized, it cuts the magnetic flux lines in the first magnetic gap 1221 to generate vibration, driving the first diaphragm 1311 to vibrate and produce sound, and when the second voice coil 1322 is energized, it cuts the magnetic flux lines in the second magnetic gap 1231 to generate vibration, driving the second diaphragm 1321 to vibrate and produce sound.
  • the magnetic circuit system 12 includes a magnetic yoke 121, a first magnetic circuit portion 122 and a second magnetic circuit portion 123, wherein the first magnetic circuit portion 122 is disposed on the magnetic yoke 121, and is opposite to and spaced from the first vibration component 131, the first magnetic circuit portion 122 is provided with a first magnetic gap 1221, the second magnetic circuit portion 123 is disposed on the magnetic yoke 121, and is opposite to and spaced from the second vibration component 132, the second magnetic circuit portion 123 is located on the side of the first magnetic circuit portion 122 facing away from the first vibration component 131, and cooperates with the first magnetic circuit portion 122 to form a second magnetic gap 1231.
  • the magnetic yoke 121 of the magnetic circuit system 12 provides an installation and fixing basis for the first magnetic circuit portion 122 and the second magnetic circuit portion 123, and the first magnetic circuit portion 122 and the second magnetic circuit portion 123 are arranged on the side of the magnetic yoke 121 facing the outer shell 11, and the magnetic circuit system 12 is connected to the first shell and the second shell of the outer shell 11 through the first magnetic circuit portion 122 and the second magnetic circuit portion 123.
  • first magnetic circuit portion 122 and the second magnetic circuit portion 123 can be connected and fixed to the magnetic yoke 121 by bonding.
  • the magnetic yoke 121 can be a magnetic conductive plate or other structure, which is not limited here.
  • the first magnetic circuit portion 122 and the second magnetic circuit portion 123 can be connected to the first shell and the second shell of the housing 11 by bonding, welding, etc., which is not limited here.
  • the first magnetic gap 1221 is used to provide an escape and vibration space for the first vibration component 131.
  • the second magnetic circuit portion 123 By setting the second magnetic circuit portion 123 on the side of the first magnetic circuit portion 122 facing away from the first vibration component 131, Opposite to and spaced from the second vibration component 132, the second magnetic circuit portion 123 cooperates with part of the first magnetic circuit portion 122 to form a second magnetic gap 1231, thereby utilizing the second magnetic gap 1231 to provide avoidance and vibration space for the second vibration component 132 while allowing the first vibration component 131 and the second vibration component 132 to share part of the first magnetic circuit portion 122, thereby improving the magnetic field utilization rate of the magnetic circuit system 12 while effectively reducing costs.
  • the magnetic yoke 121 includes a first section 1211, a second section 1212 and a third section 1213 connected in sequence, and the first section 1211 and the third section 1213 are respectively arranged at an angle with the second section 1212 and are located on opposite sides of the second section 1212; part of the first magnetic circuit part 122 is arranged in the first section 1211, and the second magnetic circuit part 123 is arranged in the third section 1213. It can be understood that the first section 1211 and the second section 1212 of the magnetic yoke 121 form a step structure on the side away from the first shell and the second shell.
  • the first section 1211, the second section 1212 and the third section 1213 of the magnetic yoke 121 are an integrally formed structure.
  • the first section 1211, the second section 1212 and the third section 1213 form a Z-shaped structure, so that the second section 1212 is used to form a height difference between the first section 1211 and the third section 1213, so that it is convenient to use the first section 1211 of the magnetic yoke 121 to install and fix the first magnetic circuit part 122, and use the second section 1212 and the third section 1213 of the magnetic yoke 121 to install and fix the second magnetic circuit part 123, and make the second magnetic circuit part 123 located below the part of the first magnetic circuit part 122 corresponding to the third section 1213, so that the compactness of the structure is improved, and the second vibration component 132 shares part of the first magnetic circuit part 122.
  • first section 1211 and the third section 1213 are parallel to the first shell, or the second section 1212 is parallel to the second shell, so that the appearance of the sound module 100 is more regular and convenient to be assembled in the external environment.
  • the second magnetic circuit part 123 can be further connected to the second section 1212 to increase the connection reliability of the second magnetic circuit.
  • the first magnetic circuit portion 122 includes a central magnetic circuit portion 1222 and a side magnetic circuit portion 1223 .
  • the side magnetic circuit portion 1223 is disposed outside the central magnetic circuit portion 1222 and is spaced apart from the central magnetic circuit portion 1222 to form a first magnetic gap 1221 .
  • part of the central magnetic circuit part 1222 and part of the side magnetic circuit part 1223 of the first magnetic circuit part 122 are mounted and fixed to the first section 1211 of the magnetic yoke 121, and the first magnetic circuit part 122 is connected and fixed to the first shell of the housing 11 through the side magnetic circuit part 1223.
  • the magnetic yoke 121 is bonded to the central magnetic circuit part 1222 and the side magnetic circuit part 1223, and the side magnetic circuit part 1223 is bonded and connected to the first shell of the housing 11 .
  • the central magnetic circuit portion 1222 includes a stacked central magnet and a central magnetic conductive plate, the central magnet is disposed between the central magnetic conductive plate and the magnetic conductive yoke 121, and the side magnetic circuit portion 1223 includes a stacked side magnet and a side magnetic conductive plate, the side magnet is disposed between the side magnetic conductive plate and the magnetic conductive yoke 121. It is understandable that the side magnetic conductive plate of the side magnetic circuit portion 1223 can be bonded to the housing 11, or the side magnetic conductive plate and the housing 11 are an integrally formed structure.
  • the side magnetic circuit portion 1223 can be an annular structure, and the annular side magnetic circuit portion 1223 surrounds the central magnetic circuit portion 1222 and is spaced from the central magnetic circuit portion 1222 to form an annular first magnetic gap 1221.
  • the side magnetic circuit portion 1223 can be in a circular ring shape, or in a polygonal shape such as a quadrilateral, pentagon, or hexagon.
  • the side magnetic circuit parts 1223 include multiple side magnetic circuit parts 1223, which are spaced apart and arranged around the central magnetic circuit part 1222, and are spaced apart from the central magnetic circuit part 1222 to form a first magnetic gap 1221, and two adjacent side magnetic circuit parts 1223 are spaced apart to form a gap connecting the first magnetic gap 1221.
  • the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223 of the first magnetic circuit portion 122 are magnetized along the vibration direction of the first vibration component 131, and the magnetization directions of the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223 are opposite. It can be understood that the central magnet of the central magnetic circuit portion 1222 and the side magnet of the side magnetic circuit portion 1223 are magnetized along the vibration direction of the first vibration component 131, and the magnetization directions of the central magnet and the side magnet are opposite. It can be understood that such a setting can achieve the optimization of the nonlinear performance of the BL.
  • the second magnetic circuit portion 123 is opposite to and spaced from a portion of the central magnetic circuit portion 1222 and a portion of the side magnetic circuit portion 1223 to cooperate to form a second magnetic gap 1231. It can be understood that the second magnetic circuit portion 123 is opposite to and spaced from a portion of the central magnetic circuit portion 1222 to form a third sub-gap, the second magnetic circuit portion 123 is opposite to and spaced from a portion of the side magnetic circuit portion 1223 to form a fourth sub-gap, the third sub-gap and the fourth sub-gap are connected to form a second magnetic gap 1231.
  • the central magnetic circuit portion 1222 includes a central magnetic circuit 12221 and a first common magnetic circuit 12222 that are connected to each other
  • the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232
  • the side magnetic circuit 12231 is located on the outside of the central magnetic circuit 12221, and are spaced to form a first sub-gap
  • the second common magnetic circuit 12232 is located on the side of the first common magnetic circuit 12222 that is away from the central magnetic circuit 12221, and are spaced to form a second sub-gap
  • the first sub-gap is connected to the second sub-gap to form a first magnetic gap 1221
  • the second magnetic circuit portion 123 is opposite to and spaced from the first common magnetic circuit 12222 to form a third sub-gap
  • the second The magnetic circuit portion 123 is opposite to and spaced from the second common magnetic circuit 12232 to form a fourth sub-gap
  • the second magnetic circuit portion 123 can be an integral structure or a split structure.
  • the second magnetic circuit portion 123 includes a first magnet 1232 and a second magnet 1233 that are spaced apart, wherein the first magnet 1232 is located below the first common magnetic circuit 12222, and is opposite to and spaced from the first common magnetic circuit 12222 to form a third sub-gap, and the second magnet 1233 is located below the second common magnetic circuit 12232, and is opposite to and spaced from the second common magnetic circuit 12232 to form a fourth sub-gap, and the third sub-gap is connected to the fourth sub-gap to form a second magnetic gap 1231.
  • the second magnetic circuit portion 123 is an integral structure
  • the first magnet 1232 is a magnetized region of the second magnetic circuit portion 123
  • the second magnet 1233 is a magnetized region of the second magnetic circuit portion 123 .
  • the central magnetic circuit 12221 and the first common magnetic circuit 12222 of the central magnetic circuit part 1222 can be an integrally formed structure, or a split structure connected as a whole by bonding or the like. It can be understood that the central magnetic circuit 12221 and the first common magnetic circuit 12222 both include a central magnet and a central magnetic conductive plate, and the central magnetic conductive plates of the central magnetic circuit 12221 and the first common magnetic circuit 12222 can be an integral structure, that is, the central magnetic circuit 12221 and the first common magnetic circuit 12222 share a central magnetic conductive plate, which is not limited here.
  • the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232, that is, part of the side magnetic circuit portion 1223 is the second common magnetic circuit 12232, and another part of the side magnetic circuit portion 1223 is the side magnetic circuit 12231.
  • the side magnetic circuit 12231 and the second common magnetic circuit 12232 of the side magnetic circuit portion 1223 can be an integrally connected structure or can be separately arranged.
  • the side magnetic circuit portion 1223 includes a plurality of side magnetic circuit portions 1223, and the plurality of side magnetic circuit portions 1223 include a side magnetic circuit 12231 and a second common magnetic circuit 12232.
  • the side magnetic circuit portion 1223 includes four, one of which is the second common magnetic circuit 12232, and three of which are side magnetic circuits 12231.
  • the three side magnetic circuits 12231 are arranged at intervals on the outside of the central magnetic circuit 12221, and are spaced apart from the central magnetic circuit 12221 to form a first sub-gap
  • the second common magnetic circuit 12232 is located on the side of the first common magnetic circuit 12222 that is away from the central magnetic circuit 12221, and is spaced apart to form a second sub-gap
  • the first sub-gap is connected to the second sub-gap to form a first magnetic gap 1221.
  • the side magnetic circuit 12231 and the second common magnetic circuit 12232 both include stacked side magnets and side magnetic conductive plates, and the side magnets are disposed between the side magnetic conductive plates and the magnetic conductive yoke 121 .
  • the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223 are both magnetized along the vibration direction of the first vibration component 131 and the magnetization directions are opposite, the first magnet 1232 and the second magnet 1233 are both magnetized along the vibration direction of the first vibration component 131 and the magnetization directions are opposite, and the first magnet 1232 and the central magnetic circuit portion 1222 have the same magnetization direction.
  • the magnetizing directions of the magnets in the first common magnetic circuit 12222 and the second common magnetic circuit 12232 are opposite, the magnetizing directions of the first magnet 1232 and the magnet in the first common magnetic circuit 12222 are the same, and the magnetizing directions of the second magnet 1233 and the magnet in the second common magnetic circuit 12232 are the same.
  • Such an arrangement can optimize the nonlinear performance of BL.
  • the first voice coil 1312 is an annular voice coil, and the first voice coil 1312 is arranged around the central magnetic circuit part 1222.
  • the second voice coil 1322 is a flat voice coil, and the second voice coil 1322 includes two long axis sides and two short axis sides connected end to end, each short axis side is arranged between the two long axis sides, one of the long axis sides is arranged in the third sub-gap, and the other long axis side is arranged in the fourth sub-gap. In this way, the two long axis sides of the second voice coil 1322 both move in the magnetic gap to cut the magnetic flux lines, driving the second diaphragm 1321 to vibrate and produce sound.
  • the second magnetic circuit portion 123 is opposite to a part of the side magnetic circuit portion 1223 and a second magnetic gap 1231 is formed therebetween.
  • the central magnetic circuit portion 1222 includes a central magnetic circuit 12221
  • the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232
  • the side magnetic circuit 12231 is located outside the central magnetic circuit 12221 and is spaced to form a first sub-gap
  • the second common magnetic circuit 12232 is located outside the central magnetic circuit 12221 and is spaced to form a second sub-gap
  • the first sub-gap is connected to the second sub-gap to form a first magnetic gap 1221
  • the second magnetic circuit portion 123 is opposite to the second common magnetic circuit 12232 and a second magnetic gap 1231 is formed therebetween.
  • the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232, that is, part of the side magnetic circuit portion 1223 is the second common magnetic circuit 12232, and another part of the side magnetic circuit portion 1223 is the side magnetic circuit 12231.
  • the side magnetic circuit 12231 and the second common magnetic circuit 12232 of the side magnetic circuit portion 1223 can be an integrally connected structure or can be separately arranged.
  • the side magnetic circuit parts 1223 include a plurality of side magnetic circuit parts 1223, and the plurality of side magnetic circuit parts 1223 include a side magnetic circuit 12231 and a second common magnetic circuit 12232.
  • the side magnetic circuit parts 1223 include four, one of which is the second common magnetic circuit 12232, and three of which are side magnetic circuits 12231. It can be understood that the three side magnetic circuits 12231 are arranged at intervals outside the central magnetic circuit 12221, and are spaced apart from the central magnetic circuit 12221 to form a first sub-magnetic circuit.
  • the second common magnetic circuit 12232 is spaced outside the central magnetic circuit 12221 and is spaced from the central magnetic circuit 12221 to form a second sub-gap, and the first sub-gap is connected to the second sub-gap to form the first magnetic gap 1221.
  • the thickness of the second common magnetic circuit 12232 is less than or equal to the thickness of the side magnetic circuit 12231.
  • the center magnetic circuit 12221 includes a stacked center magnet and a center magnetic conductive plate, the center magnet is arranged between the center magnetic conductive plate and the magnetic conductive yoke 121, the side magnetic circuit 12231 includes a stacked first side magnet and a first side magnetic conductive plate, the first side magnet is arranged between the first side magnetic conductive plate and the magnetic conductive yoke 121, the second common magnetic circuit 12232 includes a second common magnetic conductive plate, the first side magnetic conductive plate and the second common magnetic conductive plate are both arranged opposite to the center magnetic conductive plate.
  • the second magnetic circuit portion 123 includes a third magnet 1234 , which is opposite to the second common magnetic circuit 12232 and forms a second magnetic gap 1231 therebetween.
  • the first voice coil 1312 is an annular voice coil, and the first voice coil 1312 is arranged around the central magnetic circuit portion 1222.
  • the second voice coil 1322 is a flat voice coil, and the second voice coil 1322 includes two long axis sides and two short axis sides connected end to end, each short axis side is arranged between the two long axis sides, one of the long axis sides is connected to the second diaphragm 1321, and the other long axis side is arranged in the second magnetic gap 1231. In this way, the distance between the second voice coil 1322 and the second diaphragm 1321 is small, which can effectively avoid the phenomenon of swinging of the second voice coil 1322 during vibration.
  • the magnetic yoke 121 is provided with an air leakage hole, and in order to prevent impurities or sound-absorbing particles from entering the sound module 100 through the air leakage hole and affecting the performance of the sound module 100, the sound module 100 also includes a breathable isolation piece arranged corresponding to the air leakage hole.
  • the air leakage holes are arranged at the four corners of the first section 1211 , and the air leakage holes correspond to the first magnetic gap 1221 and/or the gap formed between the two side magnetic circuit parts 1223 .
  • the present invention also provides an electronic device 200, which includes a device housing and the above-mentioned sound module 100, the sound module 100 is arranged in the device housing, and the specific structure of the sound module 100 refers to the above-mentioned embodiment.
  • the device housing includes a display surface 210, a back surface 230 opposite to the display surface 210, and a side surface 220 connecting the display surface 210 and the back surface 230.
  • the sound module 100 is disposed on the top of the electronic device 200.
  • the top of the electronic device 200 has a first sound outlet 201 and a second sound outlet 202.
  • the first sound outlet 201 and the second sound outlet 202 are both connected to the sound outlet 211.
  • the first sound outlet 201 is provided on the display surface 210 or on the connection area between the display surface 210 and the side surface 220, and the second sound outlet 202 is provided on the side surface 220.
  • the first sound outlet 201 and the second sound outlet 202 can be a through hole or a plurality of micro holes, which is not limited here.
  • the sound module 100 is disposed at the bottom of the electronic device 200, and the bottom of the electronic device 200 has a bottom sound hole 203, and the bottom sound hole 203 is opposite to and connected to the sound outlet 211.
  • the bottom sound hole 203 is disposed on the side 220. It can be understood that the bottom sound hole 203 can be a through hole or a plurality of micro holes, which is not limited here.
  • the sound module 100 may include multiple sound modules 100, and the sound modules 100 are arranged both at the top and at the bottom of the electronic device 200.
  • the sound module 100 at the top works, and when the electronic device 200 is in the speaker mode, the sound module 100 at the bottom works, or the sound modules 100 at the bottom and top work at the same time to improve the speaker effect.
  • the present application does not limit this, and it can be flexibly selected according to actual needs in actual applications.
  • the electronic device Since the electronic device adopts all the technical solutions of all the aforementioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the aforementioned embodiments, which will not be described one by one here.

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Abstract

本发明公开一种发声模组和电子设备，所述发声模组包括发声单体和模组壳体，所述发声单体设有第一振动组件和第二振动组件，所述第一振动组件的振动方向与所述第二振动组件的振动方向呈夹角设置，所述模组壳体具有收容空间，所述发声单体设于所述收容空间内，所述发声单体与所述模组壳体之间形成后声腔，所述模组壳体具有供第一振动组件和第二振动组件的声波传递至外界的出声部。本发明旨在提供一种能够有效拓宽频带的发声模组，该发声模组发声效果好。

Description

发声模组和电子设备 技术领域
本发明涉及电声转换技术领域，特别涉及一种发声模组和应用该发声模组的电子设备。
背景技术
微型扬声器由于其尺寸小，被广泛应用于现代化便携、通讯、智能设备中，而用户对高音质的需求也日益增加，尤其对于一些便携式智能化设备，用户已经不再满足于声音的有与没有，而是更多的追求好的音质。
目前智能移动终端中微型扬声器的有效频带较窄，音色比较单调，音质较差。
发明内容
本发明的主要目的是提供一种发声模组和电子设备，旨在提供一种发声模组，该发声模组的发声单体包括呈夹角设置的第一振动组件和第二振动组件，可以拓展发声模组的频宽，提高发声效果。
为实现上述目的，本发明提出一种发声模组，所述发声模组包括：
发声单体，所述发声单体设有第一振动组件和第二振动组件，所述第一振动组件的振动方向与所述第二振动组件的振动方向呈夹角设置，所述发声单体沿第一振动组件的振动方向的尺寸小于所述发声单体沿第二振动组件的振动方向的尺寸；和
模组壳体，所述模组壳体具有收容空间，所述发声单体设于所述收容空间内并和所述模组壳体之间形成后声腔；
所述模组壳体具有支撑壁以及与所述支撑壁连接的出声部，所述发声单体设有所述第一振动组件的一侧连接于所述支撑壁，所述发声单体设有第二振动组件的一侧连接于所述出声部，所述出声部将所述第一振动组件的声波和所述第二振动组件的声波传递至外界。
在一实施例中，所述出声部位于所述模组壳体的周侧，所述出声部与所述第二振动组件相对且连通，所述第二振动组件的声波经所述出声部向外辐射；
所述第一振动组件和所述模组壳体之间形成第一前腔，所述支撑壁设有第一断口，所述第一前腔经所述第一断口与所述出声部连通，所述第一振动组件的声波经所述第一前腔、所述第一断口、所述出声部向外辐射。
在一实施例中，所述出声部具有第一出声通道，所述第一断口和所述第一出声通道连通，所述第一振动组件的声波和所述第二振动组件的声波均经由所述第一出声通道向外辐射。
在一实施例中，所述出声部和所述第二振动组件之间设有导声管道，所述导声管道连接于所述第二振动组件的周缘且与所述第一出声通道对应连通，所述导声管道设有第一避让通道，所述第一避让通道和所述第一断口相对且连通。
在一实施例中，所述出声部具有第二出声通道和第三出声通道，所述第二出声通道和所述第三出声通道相互隔离，所述第二出声通道与所述第二振动组件相对且连通，所述第二振动组件的声波经所述第二出声通道向外辐射；
所述第一断口和所述第三出声通道相连通，所述第一振动组件的声波经所述第一前腔、所述第一断口、所述第三出声通道向外辐射。
在一实施例中，所述第三出声通道包括两个，两个所述第三出声通道分别设于所述第二出声通道的相对两侧。
在一实施例中，所述出声部和所述第二振动组件之间设有导声管道，所述导声管道连接于所述第二振动组件的周缘且与所述第二出声通道对应连通，所述第二振动组件的声波经所述导声管道和所述第二出声通道向外辐射；
所述出声部和所述导声管道之间设有第二避让通道，所述第二避让通道与所述第一断口相对且连通，所述第一振动组件的声波经所述第一前腔、所述第一断口、所述第二避让通道和所述第三出声通道向外辐射。
在一实施例中，所述模组壳体包括
模组下壳，所述模组下壳设有所述支撑壁以及所述出声部；
模组上壳，所述模组上壳和所述模组下壳连接并围合成所述收容空间，所述发声单体、所述模组上壳、所述模组下壳之间形成所述后声腔。
在一实施例中，所述发声单体背向所述第一振动组件和所述第二振动组件的一侧设有台阶结构，所述发声单体内形成有振动空间，所述台阶结构设有连通所述振动空间和所述后声腔的泄气孔；所述发声模组还包括设于所述台阶结构的透气隔离件，所述透气隔离件遮盖所述泄气孔，所述后声腔灌装有吸音颗粒，所述透气隔离件用于阻挡所述吸音颗粒进入所述振动空间。
在一实施例中，所述第一振动组件用于低音发声，所述第二振动组件用于高音发声。
在一实施例中，所述发声单体包括：
外壳，所述外壳包括呈夹角设置的第一壳体和第二壳体；
磁路系统，所述磁路系统连接于所述第一壳体和所述第二壳体；及
振动系统，所述振动系统包括所述第一振动组件和所述第二振动组件，所述第一振动组件与所述第一壳体连接，并与所述磁路系统相对，所述第二振动组件与所述第二壳体连接，并与所述磁路系统相对，所述第一振动组件的振动方向与所述第二振动组件的振动方向呈夹角设置。
在一实施例中，所述磁路系统具有第一磁间隙和第二磁间隙；
所述第一振动组件包括第一振膜和第一音圈，所述第一振膜连接于所述第一壳体，所述第一音圈的一端连接于所述第一振膜，所述第一音圈的另一端悬设于所述第一磁间隙内；
所述第二振动组件包括第二振膜和第二音圈，所述第二振膜连接于所述第二壳体，所述第二音圈与所述第二振膜连接，所述第二音圈设于所述第二磁间隙。
在一实施例中，所述磁路系统包括：
导磁轭；
第一磁路部分，所述第一磁路部分与所述第一振动组件相对且间隔，所述第一磁路部分包括设于所述导磁轭面向所述外壳一侧的中心磁路部分和边磁路部分，所述边磁路部分设于所述中心磁路部分的外侧，并与所述中心磁路部分间隔以形成所述第一磁间隙；及
第二磁路部分，所述第二磁路部分设于所述导磁轭，与所述第二振动组件相对且间隔，所述第二磁路部分位于部分所述第一磁路部分背向所述第一振动组件的一侧，并与所述第一磁路部分配合形成所述第二磁间隙。
在一实施例中，所述中心磁路部分包括相连接的中心磁路和第一共用磁路，所述边磁路部分包括边磁路和第二共用磁路，所述边磁路位于所述中心磁路的外侧，并间隔形成第一子间隙，所述第二共用磁路位于所述第一共用磁路背向所述中心磁路的一侧，并间隔形成第二子间隙，所述第一子间隙与所述第二子间隙连通，以形成所述第一磁间隙；
所述第二磁路部分包括间隔设置的第一磁铁和第二磁铁，所述第一磁铁与所述第一共用磁路相对且间隔，以形成第三子间隙，所述第二磁铁与所述第二共用磁路相对且间隔，以形成第四子间隙，所述第三子间隙和所述第四子间隙连通，并形成所述第二磁间隙。
在一实施例中，所述第二音圈为扁平音圈，所述第二音圈包括首尾连接的两个长轴边及两个短轴边，每一所述短轴边设于两个所述长轴边之间，其中一所述长轴边设于所述第三子间隙内，另一所述长轴边设于所述第四子间隙内。
在一实施例中，所述边磁路部分包括边磁路和第二共用磁路，所述边磁路和所述中心磁路之间形成第一子间隙，所述第二共用磁路和所述中心磁路之间形成第二子间隙，所述第一子间隙与所述第二子间隙连通，以形成所述第一磁间隙；
所述第二磁路部分包括第三磁铁，所述第三磁铁与所述第二共用磁路相对且之间形成所述第二磁间隙。
在一实施例中，所述第二音圈为扁平音圈，所述第二音圈包括首尾连接的两个长轴边及两个短轴边，每一所述短轴边设于两个所述长轴边之间，其中一所述长轴边连接于所述第二振膜，另一所述长轴边设于所述第二磁间隙内。
在一实施例中，所述导磁轭包括依次连接的第一段、第二段及第三段，所述第一段和所述第三段分别与所述第二段呈夹角设置，并位于所述第二段的相对两侧，部分所述第一磁路部分设于所述第一段，所述第二磁路部分设于所述第三段。
本发明还提出一种电子设备，包括设备壳体和上述所述的发声模组，所述设备壳体包括显示面、与所述显示面相对的背面以及与连接所述显示面和所述背面的侧面，所述发声模组设于所述设备壳体内。
在一实施例中，所述发声模组位于所述电子设备的顶部，所述设备壳体的顶部设有第一出声孔和第二出声孔，所述第一出声孔和所述第二出声孔均和所述出声部相连通，且所述第二出声孔和所述出声部相对设置，所述第一出声孔设于所述显示面或者设于所述显示面和所述侧面的连接区域，所述第二出声孔设于所述侧面。
在一实施例中，所述发声模组设于所述电子设备的底部，所述设备壳体的底部具有底部出声孔，所述底部出声孔与所述出声部相对且连通，所述底部出声孔设于所述侧面。
本发明技术方案的发声模组通过在发声单体上设置第一振动组件和第二振动组件，使得第一振动组件的振动方向与第二振动组件的振动方向呈夹角设置，通过出声部将第一振动组件和第二振动组件的声波辐射至外界，拓宽了发声模组的频带，使得发声模组的声音更丰富、更饱满。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明一实施例中发声模组的平面示意图；
图2为沿图1中A-A线的剖面示意图；
图3为本发明一实施例中发声模组的去掉部分模组壳体的立体示意图；
图4为本发明一实施例中发声模组的模组下壳的结构示意图；
图5为本发明一实施例中发声模组的分解示意图；
图6为本发明一实施例中发声模组的平面示意图；
图7为沿图1中B-B线的剖面示意图；
图8为沿图1中C-C线的剖面示意图；
图9为本发明一实施例中发声模组的去掉部分模组壳体的立体示意图；
图10为本发明一实施例中发声模组的模组下壳的结构示意图；
图11为本发明一实施例中发声模组的分解示意图；
图12为本发明一实施例中发声单体的剖面示意图；
图13为本发明一实施例中电子设备的剖面示意图；
图14为本发明一实施例中电子设备的剖面示意图。
附图标号说明：
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
同时，全文中出现的“和/或”或“且/或”的含义为，包括三个方案，以“A和/或B”为例，包括A方案，或B方案，或A和B同时满足的方案。
另外，在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
微型扬声器由于其尺寸小，被广泛应用于现代化便携、通讯、智能设备中，而用户对高音质的需求也日益增加，尤其对于一些便携式智能化设备，用户已经不再满足于声音的有与没有，而是更多的追求好的音质。
目前智能移动终端中微型扬声器的有效频带较窄，音色比较单调，音质较差。
基于上述构思和问题，本发明提出一种发声模组100。可以理解的，发声模组100应用于电子设备200，电子设备200可以是手机、平板、电脑、耳机、手表或电视等，在此不做限定。
请结合参照图1至图12所示，在本发明实施例中，该发声模组100包括发声单体1和模组壳体2，其中，模组壳体2具有收容空间，发声单体1收容于收容空间内，发声单体1设有第一振动组件131和第二振动组件132，第一振动组件131的振动方向与第二振动组件132的振动方向呈夹角设置，模组壳体2具有支撑壁212以及与支撑壁212连接的出声部211，发声单体1设有 第一振动组件131的一侧连接于支撑壁212，发声单体1设有第二振动组件132的一侧连接于出声部211，出声部211将第一振动组件131的声波和第二振动组件132的声波传递至外界。
在本实施例中，如图2、图7至图8所示，发声单体1设于收容空间内并与模组壳体2之间形成后声腔3，可进一步利用后声腔3灌装吸音颗粒，从而有效提高发声模组100的低频性能和声学性能。
在本实施例中，通过在发声单体1上设置第一振动组件131和第二振动组件132，使得第一振动组件131的振动方向与第二振动组件132的振动方向呈夹角设置，通过出声部211将第一振动组件131和第二振动组件132的声波辐射至外界，拓宽了发声模组100的频带，使得发声模组100的声音更丰富、更饱满。
如图2、图7至图8所示，发声单体1沿第一振动组件131的振动方向的尺寸小于发声单体1沿第二振动组件132的振动方向的尺寸。如此，发声单体1呈扁平状结构，在适配于应用端时，便于应用端的薄型化设计，提升用户使用体验。
如图1至图11所示，出声部211位于模组壳体2的周侧，出声部211与第二振动组件132相对且连通，第二振动组件132的声波经由出声部211向外辐射，第一振动组件131和模组壳体2之间形成第一前腔1310，支撑壁212设有第一断口2121，第一前腔1310经第一断口2121与出声部211连通，第一振动组件131的声波经第一前腔1310、第一断口2121、出声部211向外辐射。如此，第一振动组件131和第二振动组件132的声波均由出声部211向外界辐射，拓宽发声模组100的频带，提升其发声效果。可选地，出声部211上进一步设置防尘网26，防止外界灰尘或杂质进入出声部211的内部，影响其发声效果。
作为其中一具体的实施方式，出声部211具有第一出声通道2111，第一断口2121和第一出声通道2111连通，第一振动组件131的声波和第二振动组件132的声波均经由第一出声通道2111向外辐射。可以理解地，第一出声通道2111呈中空结构，如此可通过第一出声通道2111将第一振动组件131和第二振动组件132发出的声音顺利传出，提升发声模组100的发声效果。
本实施方式中，第二振动组件132和第一振动组件131的声波的辐射路 径相连通，且第二振动组件132的声波和第一振动组件131的声波共混后经由第一出声通道2111向外界辐射，如此，可以进一步拓宽发声模组100的频带，提升发声效果。
可选地，出声部211和第二振动组件132之间设有导声管道23，导声管道23连接于第二振动组件132的周缘且与第一出声通道2111对应连通，导声管道23设有第一避让通道231，第一避让通道231和第一断口2121相对且连通。可以理解的，导声管道23呈中空结构，如此可通过导声管道23将第一振动组件131和第二振动组件132发出的声音顺利传出，提升发声模组100的发声效果。
本实施方式中，出声部211与第二振动组件132之间设有导声管道23，即发声单体1和模组壳体2之间设有导声管道23，便于在发声单体1的装配及使用过程中，仅通过更换导声管道23使得发声单体1适配于不同的装配环境，匹配不同的模组外壳11，如此，可以解放发声单体1的外形设计。
可选地，导声管道23远离第二振动组件132的表面设有密封泡棉25，如此，提升导声管道23和外部器件之间的密封性，提升发声模组100的音质效果。可以理解地，密封泡棉25为环形，密封泡棉25具有与第一避让通道231连通的第一避让槽251。
可选地，导声管道23远离第二振动组件132的一侧为倾斜面，即倾斜面与第二振动组件132的安装面之间具有夹角。如此，便于发声模组100和外部器件装配，在对发声单体1沿第一振动组件131的振动方向施力装配的同时，导声管道23的倾斜面也能受力紧固，提高了发声单体1在装配时的可操作性。进一步地，倾斜面靠近第一振动组件131的一端与第二振动组件132的距离小于倾斜面远离第一振动组件131的一端与第二振动组件132之间的距离。
作为又一具体的实施方式，出声部211具有第二出声通道2112和第三出声通道2113，第二出声通道2112和第三出声通道2113相互隔离，第二出声通道2112与第二振动组件132相对且连通，第二振动组件132的声波经第二出声通道2112向外辐射；第一断口2121和第三出声通道2113相连通，第一振动组件131的声波经第一前腔1310、第一断口2121、第三出声通道2113向外辐射。可以理解地，第二出声通道2112和第三出声通道2113呈中空结 构，如此可通过第二出声通道2112将第二振动组件132发出的声音顺利传出，通过第三出声通道2113将第一振动组件131发出的声音顺利传出，提升发声模组100的发声效果。
在本实施方式中，第二出声通道2112和第三出声通道2113相互隔离，即第一振动组件131的声波和第二振动组件132的声波经不同的辐射路径向外辐射，如此，第一振动组件131和第二振动组件132与模组壳体2之间的空间被分隔为不同的辐射路径，可提升发声模组100的高频性能。
可选地，第三出声通道2113包括两个，两个第三出声通道2113分别设于第二出声通道2112的相对两侧，如此，可使得第二出声通道2112正对第二振动组件132，便于第二振动组件132的声波直接向外界辐射，提升发声模组100的高频性能。可以理解地，第一断口2121和第二出声通道2112相互隔离，第一断口2121被分为位于第二出声通道2112两侧的两部分，分别与一个第三出声通道2113对应连通。可选地，第三出声通道2113和第二出声通道2112呈扩口状，其远离发声单体1的一侧的口径大于其靠近发声单体1的一侧的口径。当然，在其他实施方式中，第三出声通道2113也可以是一个，在此不作限制。
可选地，出声部211和第二振动组件132之间设有导声管道23，导声管道23连接于第二振动组件132的周缘且与第二出声通道2112对应连通，第二振动组件132的声波经导声管道23和第二出声通道2112向外辐射；出声部211和导声管道23之间设有第二避让通道24，第二避让通道24与第一断口2121相对且连通，第一振动组件131的声波经第一前腔1310、第一断口2121、第二避让通道24和第三出声通道2113向外辐射。可以理解的，导声管道23呈中空结构，如此可通过导声管道23将第二振动组件132发出的声音顺利传出，提升发声模组100的发声效果。可以理解的，出声部211的内壁和导声管道23的外壁相连接，第二避让通道24形成于导声管道23和出声部211之间，具体形成于出声部211的内壁和导声管道23的外壁之间。如图10所示，第二避让通道24由形成第三出声通道2113的内壁相对于形成第二出声通道2112的内壁向远离第二振动组件132的方向凹陷形成。当然，在其他实施例中，也可以将导声管道23的外壁对应第三出声通道2113的部分向靠近第二振动组件132的方向凹陷形成，以在二者之间形成与第一断口2121 连通的第二避让通道24。
本实施方式中，出声部211与第二振动组件132之间设有导声管道23，即发声单体1和模组壳体2之间设有导声管道23，便于在发声单体1的装配及使用过程中，仅通过更换导声管道23使得发声单体1适配于不同的装配环境，匹配不同的模组外壳11，如此，可以解放发声单体1的外形设计。
可选地，导声管道23远离第二振动组件132的表面设有密封泡棉25，如此提升导声管道23和外部器件之间的密封性，提升发声模组100的音质效果。可以理解地，密封泡棉25为环形，密封泡棉25具有与第三出声通道2113连通的第二避让槽252。
可选地，导声管道23远离第二振动组件132的一侧为倾斜面，即倾斜面与第二振动组件132的安装面之间具有夹角。如此，便于发声单体1和模组壳体2之间进行装配，在对发声单体1沿第一振动组件131的振动方向施力装配的同时，导声管道23的倾斜面也能受力紧固，提高了发声单体1在装配时的可操作性。进一步地，倾斜面靠近第一振动组件131的一端与第二振动组件132的距离小于倾斜面远离第一振动组件131的一端与第二振动组件132之间的距离。
在本发明一实施例中，模组壳体2包括模组上壳22和模组下壳21，模组下壳21和模组上壳22连接并围合成收容空间，模组下壳21设有支撑壁212以及出声部211，模组下壳21，发声单体1、模组上壳22、模组下壳21之间形成后声腔3。在本实施例中，如图5和图11所示，通过将模组壳体2设置为模组下壳21和模组上壳22两部分结构，从而方便发声单体1的安装固定，模组上壳22和模组下壳21可以通过粘接、焊接等方式固定，在此不做限定。
在一实施例中，如图5、图11和图12所示，发声单体1内形成有振动空间14，发声单体1背向第一振动组件131和第二振动组件132的一侧设有台阶结构，台阶结构设有连通振动空间14和后声腔3的泄气孔；发声模组100还包括设于后声腔3内的透气隔离件，在后声腔3灌装吸音颗粒时，用于阻挡吸音颗粒进入发声单体1的振动空间14。
可选地，台阶结构的第一台阶面设置有泄气孔，透气隔离件贴合第一台阶面设置，并遮盖泄气孔；或者，台阶结构的第二台阶面设置有泄气孔，透气隔离件贴合第二台阶面设置，并遮盖泄气孔；或者，台阶结构的第一台阶 面和第二台阶面均设置有泄气孔，透气隔离件贴合第一台阶面和第二台阶面设置，并遮盖泄气孔。
可选地，第一台阶面对应第一振动组件设置，第二台阶面对应第二振动组件设置，第一台阶面设置有多个泄气孔，第二台阶面设置有多个泄气孔，透气隔离件包括多个，每一透气隔离件遮盖一泄气孔设置，在此不做限定。
在本实施例中，通过在台阶结构上设置泄气孔，从而利用泄气孔连通振动空间14和后声腔3，以平衡振动空间14和后声腔3的气压。同时，通过在后声腔3内设置透气隔离件，如此可利用透气隔离件阻挡吸音颗粒通过泄气孔进入发声单体1内部，从而影响发声单体1的声学性能。
可以理解的，透气隔离件可以贴合发声单体1的台阶结构设置并遮盖泄气孔，如此可以增大灌装腔的体积，实现发声模组100的全灌装。当然，在其他实施例中，透气隔离件也可设于后声腔3并将后声腔3分隔出灌装腔，也即透气隔离件与模组壳体2配合形成灌装腔，透气隔离件与发声单体1的台阶结构间隔，在此不做限定。
在一实施例中，如图5和图11所示，模组壳体2设有连通后声腔3的阻尼孔，发声模组100还包括阻尼件5，阻尼件5设于阻尼孔处。可以理解的，通过设置阻尼孔和阻尼件5，一方面利用阻尼孔和阻尼件5平衡后声腔3与外部的气压，另一方面，可通过阻尼孔向后声腔3内灌装腔内灌装吸音颗粒。
可选地，阻尼件5为透气性膜片或薄膜等透气隔离件，在此不做限定。
在一实施例中，如图4至图5、图10至图11所示，发声模组100还包括柔性电路板6，柔性电路板6用于与外部电路连接，柔性电路板6的一端伸入后声腔3内，并与发声单体1电连接，柔性电路板6具有与发声单体1连接的内焊盘61以及与外部电路连接的外焊盘62。
在本实施例中，通过设置柔性电路板6，从而利用柔性电路板6将外部电路与发声单体1导通，以确保发声单体1的正常工作。可选地，柔性电路板6采用FPCB制成。
在一实施例中，第一振动组件131用于低音发声，第二振动组件132用于高音发声，如此，可以拓展发声模组100的频宽，使得发声模组100的音色更饱满、圆润。
具体地，发声模组100具有分频点F1，发声模组100用于电子设备200 时，第一振动组件131对应的Fh(前腔谐振频率)大于等于4kHz小于等于7kHz，F1＞Fh。如此，可以避免在分频点F1处第一振动组件131和第二振动组件132的声波的相位突变，保证分频点F1处第一振动组件131和第二振动组件132的振动方向一致，发声模组100的声压稳定。
可选地，F1大于等于6kHz，如此第一振动组件13131和第二振动组件132组合后的发声模组100的声压级曲线比较平滑，不会产生较大的波谷，听感自然。
进一步地，分频点F1大于等于6kHz小于等于10kHz，分频点F1可以是6kHz、6.5KHz、7kHz、7.5kHz、8kHz、8.5kHz、9kHz、9.5kHz、10kHz等。如此，第一振动组件13131和第二振动组件13232的声压级在分频点处可以更好地衔接，音质更丰富、自然。本实施例中的发声模组100的低音深沉有力，高音清晰丰富。
在本发明的发声模组100中，发声单体1包括外壳11、磁路系统12及振动系统13，其中，外壳11包括呈夹角设置的第一壳体和第二壳体，磁路系统12连接于第一壳体和第二壳体，振动系统13包括第一振动组件131和第二振动组件132，第一振动组件131与第一壳体连接，并与磁路系统12相对，第二振动组件132与第二壳体连接，并与磁路系统12相对，第一振动组件131的振动方向与第二振动组件132的振动方向呈夹角设置。可选地，第一振动组件131的振动方向与第二振动组件132的振动方向呈垂直设置。
在本实施例中，外壳11用于安装、固定、支撑和保护振动系统13、磁路系统12等部件，也即外壳11为振动系统13、磁路系统12等部件提供安装基础。可以理解的，外壳11可以是具有安装腔的安装壳、壳体或盒体等结构，也即外壳11限定出收容空间，在此不做限定。
可选地，第一壳体和第二壳体为一体成型结构，如此提高外壳11的结构强度和稳定性。可以理解的，第一壳体和第二壳体围合形成安装腔，安装腔可以是通腔或通槽结构。可选地，第一壳体和第二壳体呈垂直设置。
在本实施例中，第一壳体呈长方形结构，第一壳体具有相对的两个长边和两个短边，短边的两端分别与两个长边连接，长边的两端分别与两个短边连接。可以理解的，第二壳体连接于第一壳体的长边或短边，使得第二壳体与第一壳体呈垂直设置。
可以理解的，第二壳体可选为长方形结构，第二壳体具有相对的两个长边和两个短边，短边的两端分别与两个长边连接，长边的两端分别与两个短边连接。在本实施例中，第一壳体和第二壳体共用一个长边或短边。第一壳体的两个长边和两个短边限定出第一开口，第二壳体的两个长边和两个短边限定出第二开口，第一开口和第二开口分别连通安装腔。可选地，第一开口和第二开口位于外壳11的相邻两个表面。
需要说明的是，外壳11是金属件时，磁路系统12与外壳11采用粘接或焊接固定。在另外的实施例中，外壳11为塑料注塑成型时，磁路系统12的边导磁板先作为嵌件注塑在外壳11中，或者磁路系统12与外壳11采用粘接固定，然后其他部分再粘接固定，在此不做限定。
在本实施例中，如图2、图7至图8、图12所示，磁路系统12设于外壳11的安装腔内，并与外壳11的第一壳体和第二壳体连接。振动系统13连接于外壳11的第一壳体和第二壳体，并与磁路系统12相对。可以理解的，振动系统13的第一振动组件131与第一壳体连接，并盖合第一开口，第二振动组件132与第二壳体连接，并盖合第二开口，如此外壳11的第一壳体和第二壳体、第一振动组件131和第二振动组件132及磁路系统12共同围合形成振动空间14。
可以理解的，第一振动组件131与磁路系统12相对，第二振动组件132与磁路系统12相对，使得第一振动组件131和第二振动组件132共用磁路系统12，即磁路系统12为第一振动组件131和第二振动组件132提供磁场和驱动力，以驱动第一振动组件131和第二振动组件132分别振动发声，从而提高磁场利用率的同时，减小发声单体1的尺寸、降低发声单体1的成本。
本发明中发声模组100的发声单体1通过将外壳11设置为夹角设置的第一壳体和第二壳体，使得第一壳体和第二壳体为一体成型结构，并围合形成安装腔，从而利用安装腔安装固定磁路系统12的同时，提高外壳11的结构强度，同时将振动系统13设置有第一振动组件131和第二振动组件132，使得第一振动组件131与第一壳体连接，并与磁路系统12相对，第二振动组件132与第二壳体连接，并与磁路系统12相对，如此利用磁路系统12同时为第一振动组件131和第二振动组件132提供磁场和驱动力，以提高磁场利用率的同时，降低成本，进一步将第一振动组件131的振动方向与第二振动组件 132的振动方向设置为呈夹角设置，如此可使得振动系统13形成两个相互独立且呈夹角设置的振动辐射面，不仅拓宽了发声模组100的频带，还可以减小发声单体1的尺寸。
在一实施例中，磁路系统12具有第一磁间隙1221和第二磁间隙1231，第一振动组件131包括第一振膜1311和第一音圈1312，第一振膜1311连接于第一壳体，第一音圈1312的一端与第一振膜1311连接，另一端设于第一磁间隙1221，第二振动组件132包括第二振膜1321和第二音圈1322，第二振膜1321连接于第二壳体，第二音圈1322设于第二磁间隙1231。可以理解地，磁路系统12提供第一磁间隙1221和第二磁间隙1231，第一音圈1312通电时在第一磁间隙1221中切割磁感线产生振动，带动第一振膜1311振动发声，第二音圈1322通电时在第二磁间隙1231中切割磁感线产生振动，带动第二振膜1321振动发声。
在一实施例中，磁路系统12包括导磁轭121、第一磁路部分122及第二磁路部分123，其中，第一磁路部分122设于导磁轭121，并与第一振动组件131相对且间隔，第一磁路部分122设有第一磁间隙1221，第二磁路部分123设于导磁轭121，与第二振动组件132相对且间隔，第二磁路部分123位于部分第一磁路部分122背向第一振动组件131的一侧，并与第一磁路部分122配合形成第二磁间隙1231。
在本实施例中，如图2、图7至图8所示，磁路系统12的导磁轭121为第一磁路部分122和第二磁路部分123提供安装固定基础，第一磁路部分122和第二磁路部分123设置于导磁轭121面向外壳11的一侧，磁路系统12通过第一磁路部分122和第二磁路部分123与外壳11的第一壳体和第二壳体连接。
可以理解的，第一磁路部分122和第二磁路部分123可采用粘结方式连接固定于导磁轭121上。导磁轭121可选为导磁板等结构，在此不做限定。第一磁路部分122和第二磁路部分123可采用粘结、焊接等方式与外壳11的第一壳体和第二壳体连接，在此不做限定。
在本实施例中，通过在第一磁路部分122设置第一磁间隙1221，从而利用第一磁间隙1221为第一振动组件131提供避让和振动空间。通过将第二磁路部分123设置在部分第一磁路部分122背向第一振动组件131的一侧，并 与第二振动组件132相对且间隔，使得第二磁路部分123与部分第一磁路部分122配合形成第二磁间隙1231，从而利用第二磁间隙1231为第二振动组件132提供避让和振动空间的同时，使得第一振动组件131和第二振动组件132共用部分第一磁路部分122，以提高磁路系统12的磁场利用率的同时，有效降低成本。
为了方便安装固定第一磁路部分122和第二磁路部分123，并使得第一磁路部分122和第二磁路部分123分别与第一振动组件131和第二振动组件132相对，在一实施例中，导磁轭121包括依次连接的第一段1211、第二段1212及第三段1213，第一段1211和第三段1213分别与第二段1212呈夹角设置，并位于第二段1212的相对两侧；部分第一磁路部分122设于第一段1211，第二磁路部分123设于第三段1213。可以理解地，导磁轭121的第一段1211和第二段1212背离第一壳体和第二壳体的一侧形成台阶结构。
在本实施例中，导磁轭121的第一段1211、第二段1212及第三段1213为一体成型结构。可选地，第一段1211、第二段1212及第三段1213形成Z形结构，如此利用第二段1212使得第一段1211和第三段1213之间形成高度差，从而方便利用导磁轭121的第一段1211安装固定第一磁路部分122，利用导磁轭121的第二段1212和第三段1213安装固定第二磁路部分123，且使得第二磁路部分123位于第一磁路部分122对应第三段1213的部分下方，如此提高结构紧凑性的同时，使得第二振动组件132共用部分第一磁路部分122。
可选地，第一段1211和第三段1213与第一壳体平行，或者第二段1212与第二壳体平行，使得发声模组100的外观更为规整，便于装配于外部环境。第二磁路部分123进一步可以与第二段1212连接，增加第二部分磁路的连接可靠性。
在一实施例中，第一磁路部分122包括中心磁路部分1222和边磁路部分1223，边磁路部分1223设于中心磁路部分1222的外侧，并与中心磁路部分1222间隔以形成第一磁间隙1221。
如图2、图7至图8、图12所示，第一磁路部分122的部分中心磁路部分1222和部分边磁路部分1223安装固定于导磁轭121的第一段1211，第一磁路部分122通过边磁路部分1223与外壳11的第一壳体连接固定。可选地，导磁轭121与中心磁路部分1222和边磁路部分1223粘结连接，边磁路部分 1223与外壳11的第一壳体粘结连接。
可以理解的，中心磁路部分1222包括层叠设置的中心磁铁和中心导磁板，中心磁铁设置于中心导磁板和导磁轭121之间，边磁路部分1223包括层叠设置的边磁铁和边导磁板，边磁铁设置于边导磁板和导磁轭121之间。可以理解的，边磁路部分1223的边导磁板可以是与外壳11采用粘结连接，或者，边导磁板与外壳11为一体成型结构。
可以理解的，边磁路部分1223可以是环形结构，环形的边磁路部分1223环绕中心磁路部分1222，并与中心磁路部分1222间隔以形成环形的第一磁间隙1221。可选地，边磁路部分1223可以呈圆环形，或者呈四边形、五边形、六边形等等多边形状。
当然，也可以的，边磁路部分1223包括多个，多个边磁路部分1223间隔且环绕中心磁路部分1222设置，并与中心磁路部分1222间隔以形成第一磁间隙1221，相邻两个边磁路部分1223间隔以形成连通第一磁间隙1221的缺口。
在一实施例中，第一磁路部分122的中心磁路部分1222和边磁路部分1223均沿第一振动组件131的振动方向充磁，中心磁路部分1222和边磁路部分1223的充磁方向相反。可以理解的，中心磁路部分1222的中心磁铁和边磁路部分1223的边磁铁均沿第一振动组件131的振动方向充磁，中心磁铁和边磁铁的充磁方向相反。可以理解的，如此设置可实现优化BL的非线性性能。
在一具体的实施方式中，如图12所示，第二磁路部分123与部分中心磁路部分1222和部分边磁路部分1223相对且间隔，以配合形成第二磁间隙1231。可以理解地，第二磁路部分123与部分中心磁路部分1222相对且间隔，以形成第三子间隙，第二磁路部分123与部分边磁路部分1223相对且间隔，以形成第四子间隙，第三子间隙和第四子间隙连通，并形成第二磁间隙1231。
具体地，中心磁路部分1222包括相连接的中心磁路12221和第一共用磁路12222，边磁路部分1223包括边磁路12231和第二共用磁路12232，边磁路12231位于中心磁路12221的外侧，并间隔形成第一子间隙，第二共用磁路12232位于第一共用磁路12222背向中心磁路12221的一侧，并间隔形成第二子间隙，第一子间隙与第二子间隙连通，以形成第一磁间隙1221，第二磁路部分123与第一共用磁路12222相对且间隔，以形成第三子间隙，第二 磁路部分123与第二共用磁路12232相对且间隔，以形成第四子间隙，第三子间隙和第四子间隙连通，并形成第二磁间隙1231。
可选地，第二磁路部分123可以是一个整体结构，也可以是分体结构。作为其中一种实施方式，第二磁路部分123包括间隔设置的第一磁铁1232和第二磁铁1233，其中，第一磁铁1232位于第一共用磁路12222的下方，并与第一共用磁路12222相对且间隔，以形成第三子间隙，第二磁铁1233位于第二共用磁路12232的下方，并与第二共用磁路12232相对且间隔，以形成第四子间隙，且第三子间隙和第四子间隙连通，并形成第二磁间隙1231。
还可以地，第二磁路部分123是一个整体结构，第一磁铁1232为第二磁路部分123的一个充磁区域，第二磁铁1233为第二磁路部分123的一个充磁区域。
在本实施方式中，中心磁路部分1222的中心磁路12221和第一共用磁路12222可以是一体成型结构，也可以是分体结构通过粘结等方式连接为一体。可以理解的，中心磁路12221和第一共用磁路12222均包括中心磁铁和中心导磁板，中心磁路12221和第一共用磁路12222的中心导磁板可以是一个整体结构，也即中心磁路12221和第一共用磁路12222共用一个中心导磁板，在此不做限定。
可以理解的，边磁路部分1223包括边磁路12231和第二共用磁路12232，也即部分边磁路部分1223为第二共用磁路12232，另外部分边磁路部分1223为边磁路12231。可选地，边磁路部分1223的边磁路12231和第二共用磁路12232可以是一体连接结构，也可以是分体设置。
在本实施方式中，边磁路部分1223包括多个，多个边磁路部分1223包括边磁路12231和第二共用磁路12232。可选地，边磁路部分1223包括四个，一个为第二共用磁路12232，三个为边磁路12231。可以理解的，三个边磁路12231间隔设于中心磁路12221的外侧，并与中心磁路12221间隔形成第一子间隙，第二共用磁路12232位于第一共用磁路12222背向中心磁路12221的一侧，并间隔形成第二子间隙，且第一子间隙与第二子间隙连通，以形成第一磁间隙1221。
需要说明的是，边磁路12231和第二共用磁路12232均包括层叠设置的边磁铁和边导磁板，边磁铁设置于边导磁板和导磁轭121之间。
为了使得磁路系统12能够同时为第一振动组件131和第二振动组件132提供磁场及驱动力，中心磁路部分1222和边磁路部分1223均沿第一振动组件131的振动方向充磁且充磁方向相反，第一磁铁1232和第二磁铁1233均沿第一振动组件131的振动方向充磁且充磁方向相反，第一磁铁1232和中心磁路部分1222的充磁方向相同。
可以理解地，第一共用磁路12222和第二共用磁路12232的磁铁的充磁方向相反，第一磁铁1232和第一共用磁路12222的磁铁的充磁方向相同，第二磁铁1233和第二共用磁路12232的磁铁的充磁方向相同，如此设置可实现优化BL的非线性性能。
在本实施方式中，第一音圈1312为环形音圈，第一音圈1312环绕中心磁路部分1222设置，第二音圈1322为扁平音圈，第二音圈1322包括首尾连接的两个长轴边及两个短轴边，每一短轴边设于两个长轴边之间，其中一长轴边设于第三子间隙内，另一长轴边设于第四子间隙内。如此，第二音圈1322的两个长轴边均在磁间隙中做切割磁感线的运动，带动第二振膜1321振动发声。
在又一具体的实施方式中，第二磁路部分123与部分边磁路部分1223相对且之间形成第二磁间隙1231。如图2、图7至图8所示，中心磁路部分1222包括中心磁路12221，边磁路部分1223包括边磁路12231和第二共用磁路12232，边磁路12231位于中心磁路12221的外侧，并间隔形成第一子间隙，第二共用磁路12232位于中心磁路12221的外侧，并间隔形成第二子间隙，第一子间隙与第二子间隙连通，以形成第一磁间隙1221；第二磁路部分123与第二共用磁路12232相对且之间形成第二磁间隙1231。
本实施方式中，边磁路部分1223包括边磁路12231和第二共用磁路12232，也即部分边磁路部分1223为第二共用磁路12232，另外部分边磁路部分1223为边磁路12231。可选地，边磁路部分1223的边磁路12231和第二共用磁路12232可以是一体连接结构，也可以是分体设置。
在本实施方式中，边磁路部分1223包括多个，多个边磁路部分1223包括边磁路12231和第二共用磁路12232。可选地，边磁路部分1223包括四个，一个为第二共用磁路12232，三个为边磁路12231。可以理解的，三个边磁路12231间隔设于中心磁路12221的外侧，并与中心磁路12221间隔形成第一子 间隙，第二共用磁路12232间隔设于中心磁路12221的外侧，并与中心磁路12221间隔形成第二子间隙，且第一子间隙与第二子间隙连通，以形成第一磁间隙1221。可选地，第二共用磁路12232的厚度小于等于边磁路12231的厚度。
需要说明的是，中心磁路12221包括层叠设置的中心磁铁和中心导磁板，中心磁铁设置于中心导磁板和导磁轭121之间，边磁路12231包括层叠设置的第一边磁铁和第一边导磁板，第一边磁铁设置于第一边导磁板和导磁轭121之间，第二共用磁路12232包括第二共用导磁板，第一边导磁板、第二共用导磁板均与中心导磁板相对设置。
具体地，第二磁路部分123包括第三磁铁1234，第三磁铁1234与第二共用磁路12232相对且之间形成第二磁间隙1231。
在本实施方式中，第一音圈1312为环形音圈，第一音圈1312环绕中心磁路部分1222设置，第二音圈1322为扁平音圈，第二音圈1322包括首尾连接的两个长轴边及两个短轴边，每一短轴边设于两个长轴边之间，其中一长轴边与第二振膜1321连接，另一长轴边设于第二磁间隙1231内。如此，第二音圈1322和第二振膜1321之间的间距较小，可以有效避免第二音圈1322在振动过程中的摆动等现象。
为了确保发声模组100内振动空间14的气压平衡，以保证第一振动组件131和第二振动组件132的振动平衡性。在一实施例中，导磁轭121设有泄气孔，为了避免杂质或吸音颗粒从泄气孔进入发声模组100内，影响发声模组100的性能，发声模组100还包括对应泄气孔设置的透气隔离件。
可选地，泄气孔设于第一段1211的四角位置，泄气孔对应第一磁间隙1221和/或两个边磁路部分1223之间形成的缺口。
本发明还提出一种电子设备200，该电子设备200包括设备壳体和上述的发声模组100，发声模组100设于设备壳体内，该发声模组100的具体结构参照前述实施例。可以理解地，设备壳体包括显示面210、与显示面210相对的背面230以及与连接显示面210和背面230的侧面220。
在一实施例中，如图13所示，发声模组100设于电子设备200的顶部，电子设备200的顶部具有第一出声孔201和第二出声孔202，第一出声孔201和第二出声孔202均和出声部211相连通，且第二出声孔202和出声部211 相对设置。可选地，第一出声孔201设于显示面210或者设于显示面210和侧面220的连接区域，第二出声孔202设于侧面220。可以理解地，第一出声孔201和第二出声孔202可以是一个通孔，也可以是多个微孔，在此不作限制。
在一实施例中，如图14所示，发声模组100设于电子设备200的底部，电子设备200的底部具有底部出声孔203，底部出声孔203与出声部211相对且连通。可选地，底部出声孔203设于侧面220。可以理解地，底部出声孔203可以是一个通孔，也可以是多个微孔，在此不作限制。
在本申请的电子设备200中，发声模组100可以包括多个，发声模组100既设置在电子设备200的顶部，又设置在电子设备200的底部。在电子设备200处于听筒模式时，顶部的发声模组100工作，在电子设备200处于外放模式时，底部的发声模组100工作，或者，底部和顶部的发声模组100同时工作，以提升外放效果。本申请在此不作限制，实际应用中根据实际需要灵活选择。
由于本电子设备采用了前述所有实施例的全部技术方案，因此至少具有前述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
以上所述仅为本发明的可选实施例，并非因此限制本发明的专利范围，凡是在本发明的构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (17)

  1. 一种发声模组，其特征在于，所述发声模组包括：
    发声单体，所述发声单体设有第一振动组件和第二振动组件，所述第一振动组件的振动方向与所述第二振动组件的振动方向呈夹角设置，所述发声单体沿第一振动组件的振动方向的尺寸小于所述发声单体沿第二振动组件的振动方向的尺寸；和
    模组壳体，所述模组壳体具有收容空间，所述发声单体设于所述收容空间内并和所述模组壳体之间形成后声腔；
    所述模组壳体具有支撑壁以及与所述支撑壁连接的出声部，所述发声单体设有所述第一振动组件的一侧连接于所述支撑壁，所述发声单体设有第二振动组件的一侧连接于所述出声部，所述出声部将所述第一振动组件的声波和所述第二振动组件的声波传递至外界。
  2. 根据权利要求1所述的发声模组，其特征在于，所述出声部位于所述模组壳体的周侧，所述出声部与所述第二振动组件相对且连通，所述第二振动组件的声波经所述出声部向外辐射；
    所述第一振动组件和所述模组壳体之间形成第一前腔，所述支撑壁设有第一断口，所述第一前腔经所述第一断口与所述出声部连通，所述第一振动组件的声波经所述第一前腔、所述第一断口、所述出声部向外辐射。
  3. 根据权利要求2所述的发声模组，其特征在于，所述出声部具有第一出声通道，所述第一断口和所述第一出声通道连通，所述第一振动组件的声波和所述第二振动组件的声波均经由所述第一出声通道向外辐射。
  4. 根据权利要求3所述的发声模组，其特征在于，所述出声部和所述第二振动组件之间设有导声管道，所述导声管道连接于所述第二振动组件的周缘且与所述第一出声通道对应连通，所述导声管道设有第一避让通道，所述第一避让通道和所述第一断口相对且连通。
  5. 根据权利要求2所述的发声模组，其特征在于，所述出声部具有第二出声通道和第三出声通道，所述第二出声通道和所述第三出声通道相互隔离，所述第二出声通道与所述第二振动组件相对且连通，所述第二振动组件的声波经所述第二出声通道向外辐射；
    所述第一断口和所述第三出声通道相连通，所述第一振动组件的声波经所述第一前腔、所述第一断口、所述第三出声通道向外辐射。
  6. 根据权利要求5所述的发声模组，其特征在于，所述第三出声通道包括两个，两个所述第三出声通道分别设于所述第二出声通道的相对两侧；
    且/或，所述出声部和所述第二振动组件之间设有导声管道，所述导声管道连接于所述第二振动组件的周缘且与所述第二出声通道对应连通，所述第二振动组件的声波经所述导声管道和所述第二出声通道向外辐射；
    所述出声部和所述导声管道之间设有第二避让通道，所述第二避让通道与所述第一断口相对且连通，所述第一振动组件的声波经所述第一前腔、所述第一断口、所述第二避让通道和所述第三出声通道向外辐射。
  7. 根据权利要求1所述的发声模组，其特征在于，所述模组壳体包括
    模组下壳，所述模组下壳设有所述支撑壁以及所述出声部；
    模组上壳，所述模组上壳和所述模组下壳连接并围合成所述收容空间，所述发声单体、所述模组上壳、所述模组下壳之间形成所述后声腔；
    且/或，所述发声单体背向所述第一振动组件和所述第二振动组件的一侧设有台阶结构，所述发声单体内形成有振动空间，所述台阶结构设有连通所述振动空间和所述后声腔的泄气孔；所述发声模组还包括设于所述台阶结构的透气隔离件，所述透气隔离件遮盖所述泄气孔，所述后声腔灌装有吸音颗粒，所述透气隔离件用于阻挡所述吸音颗粒进入所述振动空间；
    且/或，所述第一振动组件用于低音发声，所述第二振动组件用于高音发声。
  8. 根据权利要求1至7中任一项所述的发声模组，其特征在于，所述发声单体包括：
    外壳，所述外壳包括呈夹角设置的第一壳体和第二壳体；
    磁路系统，所述磁路系统连接于所述第一壳体和所述第二壳体；及
    振动系统，所述振动系统包括所述第一振动组件和所述第二振动组件，所述第一振动组件与所述第一壳体连接，并与所述磁路系统相对，所述第二振动组件与所述第二壳体连接，并与所述磁路系统相对，所述第一振动组件的振动方向与所述第二振动组件的振动方向呈夹角设置。
  9. 根据权利要求8所述的发声模组，其特征在于，所述磁路系统具有第一磁间隙和第二磁间隙；
    所述第一振动组件包括第一振膜和第一音圈，所述第一振膜连接于所述第一壳体，所述第一音圈的一端连接于所述第一振膜，所述第一音圈的另一端悬设于所述第一磁间隙内；
    所述第二振动组件包括第二振膜和第二音圈，所述第二振膜连接于所述第二壳体，所述第二音圈与所述第二振膜连接，所述第二音圈设于所述第二磁间隙。
  10. 根据权利要求9所述的发声模组，其特征在于，所述磁路系统包括：
    导磁轭；
    第一磁路部分，所述第一磁路部分与所述第一振动组件相对且间隔，所述第一磁路部分包括设于所述导磁轭面向所述外壳一侧的中心磁路部分和边磁路部分，所述边磁路部分设于所述中心磁路部分的外侧，并与所述中心磁路部分间隔以形成所述第一磁间隙；及
    第二磁路部分，所述第二磁路部分设于所述导磁轭，与所述第二振动组件相对且间隔，所述第二磁路部分位于部分所述第一磁路部分背向所述第一振动组件的一侧，并与所述第一磁路部分配合形成所述第二磁间隙。
  11. 根据权利要求10所述的发声模组，其特征在于，所述中心磁路部分包括相连接的中心磁路和第一共用磁路，所述边磁路部分包括边磁路和第二共用磁路，所述边磁路位于所述中心磁路的外侧，并间隔形成第一子间隙，所述第二共用磁路位于所述第一共用磁路背向所述中心磁路的一侧，并间隔形成第二子间隙，所述第一子间隙与所述第二子间隙连通，以形成所述第一磁间隙；
    所述第二磁路部分包括间隔设置的第一磁铁和第二磁铁，所述第一磁铁与所述第一共用磁路相对且间隔，以形成第三子间隙，所述第二磁铁与所述第二共用磁路相对且间隔，以形成第四子间隙，所述第三子间隙和所述第四子间隙连通，并形成所述第二磁间隙。
  12. 根据权利要求11所述的发声模组，其特征在于，所述第二音圈为扁平音圈，所述第二音圈包括首尾连接的两个长轴边及两个短轴边，每一所述 短轴边设于两个所述长轴边之间，其中一所述长轴边设于所述第三子间隙内，另一所述长轴边设于所述第四子间隙内。
  13. 根据权利要求10所述的发声模组，其特征在于，所述边磁路部分包括边磁路和第二共用磁路，所述边磁路和所述中心磁路之间形成第一子间隙，所述第二共用磁路和所述中心磁路之间形成第二子间隙，所述第一子间隙与所述第二子间隙连通，以形成所述第一磁间隙；
    所述第二磁路部分包括第三磁铁，所述第三磁铁与所述第二共用磁路相对且之间形成所述第二磁间隙。
  14. 根据权利要求13所述的发声模组，其特征在于，所述第二音圈为扁平音圈，所述第二音圈包括首尾连接的两个长轴边及两个短轴边，每一所述短轴边设于两个所述长轴边之间，其中一所述长轴边连接于所述第二振膜，另一所述长轴边设于所述第二磁间隙内。
  15. 根据权利要求10所述的发声模组，其特征在于，所述导磁轭包括依次连接的第一段、第二段及第三段，所述第一段和所述第三段分别与所述第二段呈夹角设置，并位于所述第二段的相对两侧，部分所述第一磁路部分设于所述第一段，所述第二磁路部分设于所述第三段。
  16. 一种电子设备，其特征在于，包括设备壳体和如权利要求1至15中任一项所述的发声模组，所述设备壳体包括显示面、与所述显示面相对的背面以及与连接所述显示面和所述背面的侧面，所述发声模组设于所述设备壳体内。
  17. 根据权利要求16所述的电子设备，其特征在于，所述发声模组位于所述电子设备的顶部，所述设备壳体的顶部设有第一出声孔和第二出声孔，所述第一出声孔和所述第二出声孔均和所述出声部相连通，且所述第二出声孔和所述出声部相对设置，所述第一出声孔设于所述显示面或者设于所述显示面和所述侧面的连接区域，所述第二出声孔设于所述侧面；
    且/或，所述发声模组设于所述电子设备的底部，所述设备壳体的底部具有底部出声孔，所述底部出声孔与所述出声部相对且连通，所述底部出声孔设于所述侧面。
PCT/CN2024/103963 2023-11-13 2024-07-05 发声模组和电子设备 Pending WO2025102769A1 (zh)

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