WO2025069809A1 - 樹脂組成物、樹脂膜、フィルム、フィルムセット、光導波路、光電気複合基板および電子部品 - Google Patents

樹脂組成物、樹脂膜、フィルム、フィルムセット、光導波路、光電気複合基板および電子部品 Download PDF

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Publication number
WO2025069809A1
WO2025069809A1 PCT/JP2024/029769 JP2024029769W WO2025069809A1 WO 2025069809 A1 WO2025069809 A1 WO 2025069809A1 JP 2024029769 W JP2024029769 W JP 2024029769W WO 2025069809 A1 WO2025069809 A1 WO 2025069809A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
film
resin
mass
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/029769
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English (en)
French (fr)
Japanese (ja)
Inventor
裕馬 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2024575182A priority Critical patent/JP7700974B1/ja
Publication of WO2025069809A1 publication Critical patent/WO2025069809A1/ja
Priority to JP2025089559A priority patent/JP2025122176A/ja
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Definitions

  • the present invention relates to a resin composition, a resin film, a film, a film set, an optical waveguide, an optical/electrical composite substrate, and an electronic component.
  • optical/electrical composite substrate is one in which an optical waveguide is provided on a substrate.
  • Techniques relating to the optical/electrical composite substrate include those described in, for example, Patent Documents 1 and 2.
  • Patent Document 1 describes an opto-electrical hybrid board comprising a flexible circuit board in which electrical wiring having mounting pads is formed on the surface of an insulating layer, an element mounted on the mounting pad, and an optical waveguide laminated on the back surface side of the insulating layer, wherein the flexible circuit board is a flexible double-sided circuit board in which electrical wiring is also formed on the back surface of the insulating layer, and a metallic reinforcing layer is plated on at least the portion of the electrical wiring on the back surface side that corresponds to the mounting pad, and the optical waveguide is in contact with the metallic reinforcing layer.
  • a metallic reinforcing layer is adhered to an insulating layer of a flexible circuit board without an adhesive layer, and it is described that an optical-electrical hybrid board can be provided in which elements are properly mounted while suppressing deformation due to a pressure load when the elements are mounted by the metallic reinforcing layer.
  • Patent Document 1 describes a method of preparing a substrate having an insulating layer 1 made of a resin such as polyimide and copper foil 21 formed on both sides thereof, and forming through holes 1a and via holes 1b for an optical path in the substrate (see paragraph 0023 of Patent Document 1).
  • Patent Document 1 also describes a flexible double-sided circuit board E on which a metallic reinforcing layer M is formed (see paragraph 0028 of Patent Document 1).
  • the flexible double-sided circuit board E includes the substrate.
  • Patent Document 1 describes that an undercladding layer 6 is formed on the back side of a flexible double-sided circuit board E in contact with a metal reinforcing layer M that covers the electrical wiring 2B on the back side, and describes that examples of a molding material for the undercladding layer 6 include a photosensitive resin and a thermosetting resin (see paragraph 0029 of Patent Document 1). According to Figures 4 to 6 of Patent Document 1, it can be seen that the molding material for the undercladding layer 6 is filled into a recess formed in the flexible double-sided circuit board E on which the metal reinforcing layer M is formed.
  • Patent Document 2 describes an optoelectronic wiring board that is formed by integrating a rigid section in which conductor circuits and insulating layers are laminated on both sides of a substrate with one or more bendable flex sections, wherein the rigid section is formed with external connection terminals for mounting optical elements and/or package substrates on which optical elements are mounted, and at least one of the flex sections is formed with optical wiring. It is stated that the optoelectronic wiring board in Patent Document 2 can suitably process large amounts of information and high speed information processing without increasing the size of the wiring board.
  • Patent Document 2 describes that the rigid section has an optical signal transmitting region formed therein, and that the optical signal transmitting region is filled with a resin composition (see claims 4 and 5 of Patent Document 2). It also describes that the optical signal transmitting region is formed so as to penetrate all of the substrates and insulating layers that make up the rigid section (see claim 6 of Patent Document 2).
  • Patent Document 2 describes a substrate 221 consisting of an optical waveguide film 250 and a surrounding resin layer (insulating layer) 221a, and describes that the resin layer 221a constitutes part of the optical signal transmitting regions 242a, 242b (see paragraph 0033 of Patent Document 2).
  • optical/electrical composite substrates are known in which recesses and vias formed in the substrate are filled with a resin composition.
  • the manufacturing process for an optoelectronic composite substrate can include, for example, a process of integrating a substrate on which vias are formed with a film for optical waveguide cladding.
  • the vias formed in the substrate must be embedded with the optical waveguide cladding.
  • a resin composition that can be used for the optical waveguide cladding is required to have the property of being able to sufficiently embed the resin composition in the vias (hereinafter, "embedding ability" refers to the property of the degree to which the resin composition that can be used for the optical waveguide cladding can be embedded in the vias).
  • resin compositions that can be used for optical waveguide cladding are also required to have high light transmittance.
  • the present invention has been made in consideration of the above circumstances, and aims to provide a resin composition that can improve embeddability while suppressing the decrease in light transmittance.
  • the present invention provides the following resin compositions, resin films, films, film sets, optical waveguides, photoelectric composite substrates, and electronic components.
  • a resin composition that can be used for an optical waveguide clad Contains a cyclic olefin resin (A),
  • the cyclic olefin resin (A) contains a structural unit (a) and a structural unit (b),
  • the structural unit (a) is a structural unit represented by the following formula (a-1):
  • the structural unit (b) is one or more selected from the group consisting of a structural unit represented by the following formula (b-1), a structural unit represented by the following formula (b-2), and a structural unit represented by the following formula (b-3):
  • R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom, a hydroxyl group or an organic group having 1 to 30 carbon atoms.
  • R 11 represents a hydrogen atom, a hydroxyl group, or an organic group having 1 to 30 carbon atoms.
  • R 21 and R 22 each independently represent a hydrogen atom or an organic group having 1
  • the resin composition according to the above [5], wherein the compound (B) having a cyclic ether structure includes at least one or more compounds selected from the group consisting of epoxy compounds and oxetane compounds.
  • the device includes a base film, The film according to [21] above, having the resin layer on the base film.
  • the resin constituting the base film contains at least one or more selected from the group consisting of polyimide and polyethylene terephthalate.
  • a film set that can be used for an optical waveguide clad comprising: A first film and a second film, At least one of the first film and the second film is the film according to any one of [21] to [24].
  • An electronic component comprising the optical/electrical composite substrate according to [27] above.
  • the present invention provides a resin composition that can improve embeddability while suppressing the decrease in light transmittance.
  • FIG. 1 is a cross-sectional view showing a schematic example of the structure of an optical/electrical composite substrate according to this embodiment.
  • the optical/electrical composite substrate 200 has an optical waveguide 100 provided on a substrate 110.
  • the optical waveguide 100 has a first clad layer 20, a core layer 30, and a second clad layer 40 laminated in this order.
  • a mirror 50 on the light-emitting element side and a mirror 60 on the light-receiving element side are formed in the optical waveguide 100.
  • Vias 140 140a, 140b
  • a light-emitting element 120 and a light-receiving element 130 are provided on the side of the substrate 110 opposite to the optical waveguide 100 side.
  • the substrate 110 on which the vias 140 are formed and a film for forming the first cladding layer 20 are laminated and integrated by heating and pressurizing.
  • the vias 140 need to be embedded in the first cladding layer 20.
  • the first cladding layer 20 embedded in the via 140 becomes a path for light to propagate. Therefore, a resin composition that can be used for the optical waveguide cladding is required to have a high light transmittance (for example, light transmittance for a wavelength of 850 nm).
  • the present invention has been made in consideration of the above circumstances, and aims to provide a resin composition that can improve embeddability while suppressing the decrease in light transmittance.
  • the present invention can provide an optical/electrical composite substrate capable of suppressing propagation loss.
  • the resin composition of the present embodiment is a resin composition that can be used for an optical waveguide clad, and contains a cyclic olefin resin (A).
  • the cyclic olefin resin (A) contains a structural unit (a) and a structural unit (b).
  • the structural unit (a) is a structural unit represented by formula (a-1).
  • the structural unit (b) is one or more selected from the group consisting of a structural unit represented by formula (b-1), a structural unit represented by formula (b-2), and a structural unit represented by formula (b-3).
  • R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom, a hydroxyl group or an organic group having 1 to 30 carbon atoms.
  • R 11 represents a hydrogen atom, a hydroxyl group, or an organic group having 1 to 30 carbon atoms.
  • the alkyl group, alkenyl group, alkynyl group, alkylidene group, aryl group, aralkyl group, alkaryl group, cycloalkyl group, organic group having a carboxyl group and organic group having a heterocycle may have one or more hydrogen atoms substituted with halogen atoms, such as fluorine, chlorine, bromine and iodine.
  • one or more hydrogen atoms may be substituted with halogen atoms, such as fluorine, chlorine, bromine, and iodine.
  • the cyclic olefin resin (A) may be a single type of cyclic olefin resin, or may contain two or more types of cyclic olefin resins.
  • the compound (B) having a cyclic ether structure preferably contains an alicyclic structure in the molecule.
  • the compound (B) having a cyclic ether structure contains an alicyclic structure in the molecule means that it contains an alicyclic structure in addition to the cyclic ether structure.
  • the alicyclic structure in this embodiment includes a condensed ring structure in which a cyclic ether and an aliphatic ring are condensed, and a spiro ring structure in which a cyclic ether and an aliphatic ring are bonded by a spiro bond atom.
  • the curing agent (C) contains a cationic polymerization initiator, and preferably contains a photocationic polymerization initiator as the cationic polymerization initiator.
  • the photocationic polymerization initiator includes, for example, a sulfonium salt type polymerization initiator, an iodonium salt type polymerization initiator, etc., preferably a sulfonium salt type polymerization initiator, more preferably a triarylsulfonium salt type polymerization initiator, and further preferably a triphenylsulfonium salt type polymerization initiator.
  • the concentration of the total solids (non-volatile components) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, even more preferably 30% by mass or more, and even more preferably 35% by mass or more, from the viewpoint of appropriately controlling the viscosity of the resin composition, and is preferably 60% by mass or less, more preferably 55% by mass or less, and even more preferably 50% by mass or less, from the viewpoint of sufficiently dissolving each component in the resin composition.
  • the total content of the cyclic olefin resin (A) and the compound (B) having a cyclic ether structure in the resin composition of this embodiment is, when the total content of all components in the resin composition is 100 mass%, preferably 10 mass% or more, more preferably 20 mass% or more, even more preferably 30 mass% or more, even more preferably 35 mass% or more, even more preferably 50 mass% or more, even more preferably 70 mass% or more, even more preferably 80 mass% or more, even more preferably 85 mass% or more, even more preferably 90 mass% or more, even more preferably 92 mass% or more, and the upper limit is not particularly limited, but is, for example, less than 100 mass% and 99 mass% or less.
  • the thickness of the resin film in this embodiment is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, even more preferably 5 ⁇ m or more, and even more preferably 8 ⁇ m or more, from the viewpoint of further improving embeddability, and is preferably 150 ⁇ m or less, more preferably 130 ⁇ m or less, even more preferably 100 ⁇ m or less, even more preferably 70 ⁇ m or less, even more preferably 50 ⁇ m or less, and even more preferably 30 ⁇ m or less, from the viewpoint of further improving the light propagation efficiency of the optical waveguide.
  • the thickness of the resin layer in this embodiment is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, even more preferably 5 ⁇ m or more, and even more preferably 8 ⁇ m or more, and from the viewpoint of further improving the light propagation efficiency of the optical waveguide, it is preferably 150 ⁇ m or less, more preferably 130 ⁇ m or less, even more preferably 100 ⁇ m or less, even more preferably 70 ⁇ m or less, even more preferably 50 ⁇ m or less, and even more preferably 30 ⁇ m or less.
  • the film of the present embodiment preferably further includes a base film, and a resin layer is provided on the base film.
  • the base film may be, for example, a resin film.
  • the resin constituting the base film is not particularly limited, but it is preferable that the base film contains at least one or more types selected from the group consisting of polyimide and polyethylene terephthalate.
  • the thickness of the base film in this embodiment is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, even more preferably 20 ⁇ m or more, and is preferably 100 ⁇ m or less, more preferably 80 ⁇ m or less, even more preferably 60 ⁇ m or less, even more preferably 40 ⁇ m or less.
  • the substrate film of this embodiment may be subjected to surface treatment such as antistatic treatment and release treatment.
  • the film of the present embodiment may further include a cover film.
  • the cover film is preferably provided so as to be in direct contact with the resin layer.
  • the cover film is preferably provided on the surface of the resin layer opposite to the base film.
  • the cover film is not particularly limited, but for example, an OPP cover film can be used.
  • the film of this embodiment can be obtained, for example, by applying the varnish-like resin composition of this embodiment onto a substrate film and drying it.
  • application methods include direct application using various coater devices such as a pin coater, die coater, comma coater, curtain coater, etc., and printing methods such as screen printing.
  • the film set of this embodiment includes a first film and a second film, and at least one of the first film and the second film is the film of this embodiment.
  • both the first film and the second film are preferably the film of this embodiment.
  • the optical waveguide of this embodiment will be described with reference to FIG.
  • the optical waveguide 100 of this embodiment is an optical waveguide in which a first clad layer 20, a core layer 30, and a second clad layer 40 are laminated in this order, and at least one of the first clad layer 20 and the second clad layer 40 contains the resin composition of this embodiment.
  • the first cladding layer 20 be on the substrate 110 side.
  • the preferred thicknesses of the first cladding layer 20 and the second cladding layer 40 are as follows.
  • the thickness of the first cladding layer 20 is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, even more preferably 5 ⁇ m or more, even more preferably 8 ⁇ m or more, even more preferably 10 ⁇ m or more, even more preferably 15 ⁇ m or more, and even more preferably 20 ⁇ m or more, and from the viewpoint of further improving the light propagation efficiency of the optical waveguide, the thickness is preferably 150 ⁇ m or less, more preferably 100 ⁇ m or less, even more preferably 70 ⁇ m or less, even more preferably 50 ⁇ m or less, even more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m or less.
  • the thickness of the second cladding layer 40 is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, even more preferably 5 ⁇ m or more, and even more preferably 8 ⁇ m or more, and is preferably 150 ⁇ m or less, more preferably 100 ⁇ m or less, even more preferably 70 ⁇ m or less, even more preferably 50 ⁇ m or less, even more preferably 40 ⁇ m or less, even more preferably 30 ⁇ m or less, and even more preferably 20 ⁇ m or less.
  • the material for forming the core layer 30 is not particularly limited, but may be, for example, a resin composition.
  • the resin for forming the core layer 30 may be, for example, a resin used for the core of a known optical waveguide, but preferably contains a cyclic olefin resin, and more preferably contains a norbornene resin.
  • the resin composition for forming the core layer 30 may contain an antioxidant, a photocationic polymerization initiator, and the like.
  • the thickness of the core layer 30 is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, even more preferably 10 ⁇ m or more, even more preferably 20 ⁇ m or more, even more preferably 30 ⁇ m or more, and is preferably 100 ⁇ m or less, more preferably 80 ⁇ m or less, even more preferably 60 ⁇ m or less, even more preferably 50 ⁇ m or less.
  • the core layer 30 may have a waveguide pattern formed therein.
  • Methods for forming the waveguide pattern include, for example, exposure, etching, and replication.
  • the optical waveguide 100 may have a mirror formed thereon, and a mirror 50 on the light-emitting element side and a mirror 60 on the light-receiving element side may be formed.
  • the mirror may be formed, for example, by forming an inclined surface by laser processing or the like.
  • the optical waveguide 100 may have other layers as long as they do not affect the good performance of the optical waveguide 100.
  • the optical and electrical composite substrate of this embodiment will be described with reference to FIG.
  • the optical/electrical composite substrate 200 includes a substrate 110 and an optical waveguide 100 provided on the substrate 110 .
  • Examples of the substrate 110 include a printed circuit board and a flexible substrate, and a flexible substrate is preferable.
  • the substrate 110 may have vias 140 formed therein.
  • the optical-electrical composite substrate 200 may further include a polyimide substrate (not shown) on the surface of the second cladding layer 40 opposite the core layer 30.
  • the photoelectric composite substrate 200 may include a light emitting element 120, a light receiving element 130, etc.
  • the optical-electrical composite substrate 200 can be obtained, for example, by (i) forming a first clad layer 20 on a substrate 110, (ii) forming a core layer 30 on the first clad layer 20, and (iii) forming a second clad layer 40 on the core layer 30.
  • methods for forming each layer include methods in which films for forming each layer are laminated in order by roll lamination, vacuum roll lamination, flat plate lamination, vacuum flat plate lamination, atmospheric pressing, vacuum pressing, etc.
  • the electronic component of this embodiment includes the optical/electrical composite substrate of this embodiment.
  • Examples of the electronic components of this embodiment include electronic components in electronic devices such as mobile phones, game machines, router devices, WDM devices, personal computers, televisions, and home servers.

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Optical Integrated Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
PCT/JP2024/029769 2023-09-28 2024-08-22 樹脂組成物、樹脂膜、フィルム、フィルムセット、光導波路、光電気複合基板および電子部品 Pending WO2025069809A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024575182A JP7700974B1 (ja) 2023-09-28 2024-08-22 樹脂組成物、樹脂膜、フィルム、フィルムセット、光導波路、光電気複合基板および電子部品
JP2025089559A JP2025122176A (ja) 2023-09-28 2025-05-29 樹脂組成物、樹脂膜、フィルム、フィルムセット、光導波路、光電気複合基板および電子部品

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JP2023166734 2023-09-28
JP2023-166734 2023-09-28

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WO2025069809A1 true WO2025069809A1 (ja) 2025-04-03

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014137426A (ja) * 2013-01-15 2014-07-28 Sumitomo Bakelite Co Ltd 感光性組成物
JP2016139030A (ja) * 2015-01-28 2016-08-04 住友ベークライト株式会社 感光性樹脂組成物
JP2022182542A (ja) * 2021-05-28 2022-12-08 住友ベークライト株式会社 光硬化性樹脂組成物およびその用途

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014137426A (ja) * 2013-01-15 2014-07-28 Sumitomo Bakelite Co Ltd 感光性組成物
JP2016139030A (ja) * 2015-01-28 2016-08-04 住友ベークライト株式会社 感光性樹脂組成物
JP2022182542A (ja) * 2021-05-28 2022-12-08 住友ベークライト株式会社 光硬化性樹脂組成物およびその用途

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JP2025122176A (ja) 2025-08-20
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