WO2025047576A1 - 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 - Google Patents

導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Download PDF

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WO2025047576A1
WO2025047576A1 PCT/JP2024/029863 JP2024029863W WO2025047576A1 WO 2025047576 A1 WO2025047576 A1 WO 2025047576A1 JP 2024029863 W JP2024029863 W JP 2024029863W WO 2025047576 A1 WO2025047576 A1 WO 2025047576A1
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meth
conductive paste
conductive
weight
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English (en)
French (fr)
Japanese (ja)
Inventor
滉生 大倉
雄太 山中
康晴 永井
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2024571933A priority Critical patent/JPWO2025047576A1/ja
Priority to CN202480052078.XA priority patent/CN121713258A/zh
Publication of WO2025047576A1 publication Critical patent/WO2025047576A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Definitions

  • the present invention relates to a conductive paste containing a conductive filler.
  • the present invention also relates to an RFID inlay using the conductive paste and a method for manufacturing an RFID inlay.
  • UHF Ultra High Frequency
  • RFID inlays which allow contactless data transmission and reception, are widely used in contactless RFID tags and contactless RFID cards.
  • UHF Ultra High Frequency
  • RFID inlays have attracted attention due to their long communication distances, and UHF band RFID inlays are used for a variety of items and purposes, such as commuter passes, inventory management, distribution management, and history management.
  • a conductive paste containing a conductive filler and binder resin may be used to bond and connect a chip with electrodes on its surface to a substrate with wiring (antenna pattern) on its surface.
  • Patent Document 1 discloses an adhesive that can be used for electronic components.
  • the adhesive is an acrylic adhesive composition that contains a radical initiator with a 10-hour half-life temperature of 80°C or less, a vinylene-containing oligomer, and at least one diluent.
  • the adhesive can snap cure at low temperatures, and the pot life of the adhesive at room temperature is 24 hours or more.
  • the object of the present invention is to provide a conductive paste that can 1) improve adhesion, 2) improve the tack of the cured product, and 3) improve electrical conductivity reliability, even when mounted in a relatively short time.
  • Another object of the present invention is to provide an RFID inlay using the conductive paste, and a method for manufacturing an RFID inlay.
  • This specification discloses the following conductive paste, RFID inlay, and method for manufacturing an RFID inlay.
  • Item 2 The conductive paste according to Item 1, in which the curable compound has one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group, and the reactive functional group other than the (meth)acryloyl group is an epoxy group, an oxetanyl group, an amino group, a hydroxyl group, or a carboxyl group.
  • Item 3 The conductive paste according to item 1 or 2, wherein the first curable compound includes a first epoxy (meth)acrylate compound having one (meth)acryloyl group and one or more epoxy groups.
  • Item 5 The conductive paste according to any one of items 1 to 4, wherein the first curable compound includes a first urethane (meth)acrylate compound having one (meth)acryloyl group.
  • Item 6 The conductive paste according to item 5, wherein the content of the first urethane (meth)acrylate compound is 1% by weight or more and 20% by weight or less in 100% by weight of the conductive paste.
  • Item 8 The conductive paste according to item 7, wherein the total content of the second urethane (meth)acrylate compound and the second epoxy (meth)acrylate compound is 5% by weight or more and 30% by weight or less in 100% by weight of the curable compound.
  • Item 9 The conductive paste according to any one of items 1 to 8, wherein the storage modulus at 30°C of the cured product obtained by heating the conductive paste at 150°C for 10 minutes is 0.7 GPa or more and 5.0 GPa or less.
  • Item 10 The conductive paste according to any one of items 1 to 9, wherein the conductive filler is a conductive particle, and the particle diameter of the conductive particle is 10 ⁇ m or less.
  • Item 11 The conductive paste according to any one of items 1 to 10, wherein the conductive paste contains a non-conductive filler, and the total content of the conductive filler and the non-conductive filler in 100% by weight of the conductive paste is 10% by weight or more and 40% by weight or less.
  • Item 12 The conductive paste according to any one of items 1 to 11, wherein the viscosity of the conductive paste at 25°C is 8.0 Pa ⁇ s or more and 100 Pa ⁇ s or less.
  • An RFID inlay comprising a substrate having wiring on its surface, a chip having electrodes on its surface, and an adhesive portion bonding the substrate and the chip, the adhesive portion being made of the conductive paste described in any one of items 1 to 13, and the wiring and the electrodes being electrically connected by the conductive filler in the adhesive portion.
  • a method for manufacturing an RFID inlay comprising: a first arrangement step of arranging the conductive paste according to any one of items 1 to 13 on a surface of a substrate having wiring on its surface; a second arrangement step of arranging a chip having an electrode on its surface on the surface of the conductive paste opposite the substrate; and a bonding step of forming an adhesive part that bonds the substrate and the chip with the conductive paste by heating and pressurizing the conductive paste, and electrically connecting the wiring and the electrode with the conductive filler in the adhesive part.
  • Item 16 The method for manufacturing an RFID inlay according to Item 15, in which the substrate is long and the RFID inlay is manufactured by transporting the long substrate in the first placement process, the second placement process, and the bonding process using a roll-to-roll method.
  • the conductive paste according to the present invention includes a curable compound, a curing agent, and a conductive filler.
  • the curable compound includes a first curable compound having one (meth)acryloyl group and a second curable compound having two or more (meth)acryloyl groups
  • the first curable compound includes a curable compound having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group. Since the conductive paste according to the present invention has the above configuration, even when mounted in a relatively short time, 1) adhesiveness can be improved, 2) tackiness of the cured product can be improved, and 3) electrical conductivity reliability can be improved.
  • the conductive paste according to the present invention includes a curable compound, a curing agent, and a conductive filler.
  • the curable compound includes a first curable compound having one (meth)acryloyl group and a second curable compound having two or more (meth)acryloyl groups, and the first curable compound includes a curable compound having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group.
  • the inventors have found that the above problems can be solved by using a combination of a curable compound having two or more (meth)acryloyl groups and a curable compound having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group.
  • the conductive paste according to the present invention since the conductive paste according to the present invention has the above-mentioned configuration, it can be sufficiently cured even when mounted (heated) in a relatively short time (for example, within 15 seconds). Furthermore, since the conductive paste according to the present invention has the above-mentioned configuration, it can increase adhesion, improve the tackiness of the cured product, and increase the conductivity reliability, even when mounted in a relatively short time.
  • the storage modulus at 30°C of the cured product obtained by heating the conductive paste at 150°C for 10 minutes is preferably 0.7 GPa or more, more preferably 1.0 GPa or more, even more preferably 2.0 GPa or more, and is preferably 5.0 GPa or less, more preferably 4.0 GPa or less, even more preferably 3.5 GPa or less.
  • the adhesiveness and electrical conductivity reliability can be further improved.
  • the storage modulus of the cured product at 30°C is measured, for example, as follows.
  • the conductive paste is heated at 150°C for 10 minutes to obtain a cured product.
  • the cured product is cut into a size of 10 mm width, 1 mm thickness, and 50 mm length to prepare a measurement sample.
  • the storage modulus of the obtained measurement sample (cured product) at 30°C is measured using a dynamic viscoelasticity measuring device (for example, RSA3 manufactured by TA Instruments) under conditions of a frequency of 10 Hz, strain of 0.1%, temperature of 25°C to 150°C, and a heating rate of 10°C/min.
  • a dynamic viscoelasticity measuring device for example, RSA3 manufactured by TA Instruments
  • the conductive paste according to the present invention is in a paste form at 25°C.
  • the conductive paste is used by discharging it at, for example, 20°C to 50°C. It is preferable that the conductive paste according to the present invention is used by discharging it using a jet dispenser.
  • the viscosity ( ⁇ 25) of the conductive paste at 25°C is preferably 8.0 Pa ⁇ s or more, more preferably 9.0 Pa ⁇ s or more, even more preferably 9.5 Pa ⁇ s or more, and particularly preferably 10.0 Pa ⁇ s or more.
  • the viscosity ( ⁇ 25) of the conductive paste at 25°C is preferably 120 Pa ⁇ s or less, more preferably 100 Pa ⁇ s or less, even more preferably 40.0 Pa ⁇ s or less, particularly preferably 30.0 Pa ⁇ s or less, and most preferably 20.0 Pa ⁇ s or less. If the viscosity ( ⁇ 25) is equal to or greater than the lower limit, the conductive paste can be prevented from flowing out from around the chip and from the wiring. If the viscosity ( ⁇ 25) is equal to or less than the upper limit, the conductive paste can be placed on the fine wiring with high precision, and the adhesiveness can be further improved.
  • the viscosity ( ⁇ 25) can be measured, for example, using an E-type viscometer with a No. 7 rotor at 25°C and 5 rpm.
  • E-type viscometer examples include the TV22 viscometer manufactured by Toki Sangyo Co., Ltd.
  • the conductive paste has good adhesive properties.
  • the conductive paste is suitable for use as an adhesive.
  • the conductive paste is particularly suitable for use in bonding a substrate and a chip.
  • the conductive paste is preferably thermosetting.
  • the conductive paste is preferably a thermosetting conductive paste, and more preferably a thermosetting anisotropic conductive paste.
  • the heat generation start temperature is preferably 70°C or higher
  • the heat generation peak top temperature is preferably 85°C or higher and 105°C or lower
  • the heat generation end temperature is preferably 110°C or lower.
  • the heat generation start temperature refers to the temperature at which the heat generation amount starts to increase from the baseline.
  • the heat generation end temperature refers to the temperature at which, after reaching the heat generation peak top, the heat generation amount has decreased to 1% of the heat generation amount at the heat generation peak top.
  • the above differential scanning calorimetry can be performed in the following manner.
  • a differential scanning calorimetry device is prepared. 5 mg of the above conductive paste is placed in a special aluminum pan and the lid is placed using a special tool. This special aluminum pan and an empty aluminum pan (reference) are placed in a heating unit and heated in air from 30°C to 200°C at a heating rate of 10°C/min, and reverse heat flow and non-reverse heat flow are observed. The heat generation peak observed in the non-reverse heat flow is regarded as the heat generation peak of the conductive paste.
  • An example of the above differential scanning calorimetry device is the "TA7000" manufactured by Hitachi High-Tech Science Corporation.
  • the heat generation onset temperature can be measured. From the viewpoint of improving the storage stability and discharge stability of the conductive paste and further increasing the electrical reliability even when mounting is performed in a relatively short time, the heat generation onset temperature is preferably 70°C or higher, more preferably 80°C or higher, and is preferably 110°C or lower, more preferably 100°C or lower.
  • the heat generation peak top temperature can be measured. From the viewpoint of further improving the electrical conductivity reliability even when mounted in a relatively short time, the heat generation peak top temperature is preferably 85°C or higher, more preferably 90°C or higher, and is preferably 105°C or lower, more preferably 100°C or lower.
  • the heat generation end temperature can be measured. From the viewpoint of further improving the electrical conductivity reliability even when mounted in a relatively short time, the heat generation end temperature is preferably 110°C or less, and more preferably 105°C or less. There is no particular limit to the lower limit of the heat generation end temperature.
  • the heat generation end temperature may be 90°C or more, or 95°C or more.
  • the range of the heat generation end temperature can be set by appropriately selecting the lower limit value and the upper limit value.
  • the absolute value of the difference between the heat generation start temperature and the heat generation end temperature is preferably 1°C or more, more preferably 3°C or more, even more preferably 5°C or more, and is preferably 25°C or less, more preferably 20°C or less, even more preferably 15°C or less, and particularly preferably 13°C or less. If the absolute value of the difference between the heat generation start temperature and the heat generation end temperature is equal to or more than the above lower limit and equal to or less than the above upper limit, the storage stability of the conductive paste can be improved, and the conductivity reliability can be further improved even when mounted in a relatively short time.
  • (meth)acrylate refers to acrylate and methacrylate.
  • (meth)acrylic refers to acrylic and methacrylic.
  • (meth)acryloyl refers to acryloyl and methacryloyl.
  • the curable compound includes a thermosetting compound and a photocurable compound.
  • the curable compound is preferably a thermosetting compound.
  • the thermosetting compound is a compound that can be cured by heating.
  • the thermosetting compound includes a (meth)acrylic compound, an oxetane compound, an epoxy compound, an oxetanyl compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound, a silicone compound, and a polyimide compound.
  • the curable compound may be used alone or in combination of two or more kinds.
  • the curable compound includes a first curable compound having one (meth)acryloyl group and a second curable compound having two or more (meth)acryloyl groups.
  • the first curable compound is a curable compound having one (meth)acryloyl group.
  • the first curable compound is a monofunctional (meth)acrylate.
  • the first curable compound may be used alone or in combination of two or more.
  • the first curable compound includes a curable compound (1A) having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group.
  • the curable compound (1A) has one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group. Only one type of the curable compound (1A) may be used, or two or more types may be used in combination.
  • the reactive functional groups other than the (meth)acryloyl group in the curable compound (1A) include an epoxy group, an oxetanyl group, an amino group, a hydroxy group, a carboxy group, an amide group, an isocyanate group, and an episulfide group.
  • the reactive functional groups other than the (meth)acryloyl group in the curable compound (1A) may be of only one type, or of two or more types.
  • the curable compound (1A) may have one reactive functional group other than the (meth)acryloyl group, two or more reactive functional groups, three or more reactive functional groups, ten or less reactive functional groups, or five or less reactive functional groups.
  • the first curable compound preferably contains a curable compound having one (meth)acryloyl group and an epoxy group, an oxetanyl group, an amino group, a hydroxy group, or a carboxy group, and more preferably contains a curable compound having one (meth)acryloyl group and an epoxy group, a hydroxy group, or a carboxy group.
  • the conductive paste can be cured even better even when mounted in a relatively short time.
  • the first curable compound (curable compound (1A)) contains a first epoxy (meth)acrylate compound having one (meth)acryloyl group and one or more epoxy groups.
  • Examples of the first epoxy (meth)acrylate compound include glycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, EBECRYL3605 (manufactured by Daicel Allnex), BFEA-50 (manufactured by KSM), BAEM-50, BEEM-50 (manufactured by KSM), and PNEM-50 (manufactured by KSM).
  • the first oxetanyl (meth)acrylate compound may be, for example, (3-ethyloxetan-3-yl)methyl (meth)acrylate.
  • Examples of the first amino(meth)acrylate compound include 2-aminoethyl(meth)acrylate and 2-(tert-butylamino)ethyl(meth)acrylate.
  • Examples of the first hydroxy(meth)acrylate compound include 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, 2-hydroxy-3-phenoxypropyl(meth)acrylate, and 2-(meth)acryloyloxyethyl-2-hydroxyethyl-phthalic acid.
  • Examples of the first carboxy (meth)acrylate compound include monohydroxyethyl (meth)acrylate phthalate, 2-(meth)acryloyloxyethyl hexahydrophthalate, and 2-acryloyloxyethyl succinic acid.
  • the first curable compound may include a curable compound (1A) having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group, and a curable compound (1B) having one (meth)acryloyl group and no reactive functional groups other than the (meth)acryloyl group. Only one type of the curable compound (1B) may be used, or two or more types may be used in combination.
  • the curable compound (1B) may include a curable compound having a urethane bond or an imide bond.
  • the curable compound (1B) may include a (meth)acrylate compound having a urethane bond, or may include a (meth)acrylate compound having an imide bond.
  • the curable compound (1B) may have one urethane bond or imide bond, two or more urethane bonds or imide bonds, three or more urethane bonds or imide bonds, ten or less urethane bonds or imide bonds, or five or less urethane bonds or imide bonds.
  • curable compound (1B) examples include urethane (meth)acrylate compounds and imide (meth)acrylate compounds.
  • the first curable compound (curable compound (1B)) preferably contains a first urethane (meth)acrylate compound having one (meth)acryloyl group, or a first imide (meth)acrylate compound having one (meth)acryloyl group.
  • the first curable compound (curable compound (1B)) preferably contains a first urethane (meth)acrylate compound having one (meth)acryloyl group, and more preferably contains a first urethane (meth)acrylate compound and a first imide (meth)acrylate compound. In these cases, the conductive paste can be cured even better even when mounted in a relatively short time.
  • the first urethane (meth)acrylate compound may be KRM9276 (manufactured by Daicel Allnex Corporation).
  • the first urethane (meth)acrylate compound may be synthesized by reacting an isocyanate compound having a (meth)acryloyl group with a polyol compound.
  • the isocyanate compound having a (meth)acryloyl group and the polyol compound are not particularly limited.
  • Examples of the first imide (meth)acrylate compound include N-acryloyloxyethyl hexahydrophthalimide, N-acryloyloxyethyl phthalimide, N-acryloyloxyethyl tetrahydrophthalimide, and N-acryloyloxyethyl succinimide.
  • the content of the curable compound in the conductive paste (100% by weight) is preferably 15% by weight or more, more preferably 20% by weight or more, and preferably 95% by weight or less, more preferably 90% by weight or less, and even more preferably 85% by weight or less.
  • the content of the curable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effect of the present invention can be more effectively exhibited.
  • the content of the first curable compound in the conductive paste (100% by weight) is preferably 10% by weight or more, more preferably 15% by weight or more, and preferably 80% by weight or less, more preferably 75% by weight or less, and even more preferably 70% by weight or less.
  • the content of the first curable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effect of the present invention can be more effectively exhibited.
  • the first curable compound includes a curable compound (1A) and a curable compound (1B)
  • the content of the first curable compound indicates the total content of the curable compound (1A) and the curable compound (1B).
  • the content of the first curable compound in 100% by weight of the curable compound is preferably 20% by weight or more, more preferably 30% by weight or more, and preferably 90% by weight or less, more preferably 80% by weight or less, and even more preferably 70% by weight or less.
  • the content of the first curable compound is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.
  • the content of the curable compound (1A) having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group is preferably 3% by weight or more, more preferably 5% by weight or more, and even more preferably 20% by weight or more.
  • the content of the curable compound (1A) having one (meth)acryloyl group and one or more reactive functional groups other than the (meth)acryloyl group is preferably 60% by weight or less, more preferably 50% by weight or less, and even more preferably 40% by weight or less.
  • the content of the first epoxy (meth)acrylate compound is preferably 3% by weight or more, more preferably 5% by weight or more, and preferably 60% by weight or less, more preferably 50% by weight or less, and even more preferably 40% by weight or less.
  • the content of the first epoxy (meth)acrylate compound is equal to or more than the lower limit and equal to or less than the upper limit, the conductive paste can be cured more satisfactorily even when mounted in a relatively short time.
  • the content of the curable compound (1B) having one (meth)acryloyl group and no reactive functional groups other than the (meth)acryloyl group is preferably 5% by weight or more, more preferably 10% by weight or more, and preferably 70% by weight or less, more preferably 60% by weight or less, and even more preferably 50% by weight or less.
  • the content of the curable compound (1B) is equal to or more than the lower limit and equal to or less than the upper limit, the reliability of conductivity can be further improved even when mounting is performed in a relatively short time.
  • the content of the first urethane (meth)acrylate compound is preferably 1% by weight or more, more preferably 3% by weight or more, even more preferably 5% by weight or more, and preferably 30% by weight or less, more preferably 25% by weight or less, even more preferably 20% by weight or less. If the content of the first urethane (meth)acrylate compound is equal to or more than the lower limit and equal to or less than the upper limit, the reliability of conductivity can be further improved even when mounting is performed in a relatively short time.
  • the reactive functional groups other than the (meth)acryloyl group in the curable compound (2A) having two or more (meth)acryloyl groups and one or more reactive functional groups other than the (meth)acryloyl group include an epoxy group, an oxetanyl group, an amino group, a hydroxy group, a carboxy group, an amide group, and an isocyanate group.
  • the reactive functional groups other than the (meth)acryloyl group in the curable compound (2A) may be of only one type, or of two or more types.
  • the curable compound (2A) may have one reactive functional group other than the (meth)acryloyl group, two or more reactive functional groups, three or more reactive functional groups, ten or less reactive functional groups, or five or less reactive functional groups.
  • the second curable compound contains a second urethane (meth)acrylate compound having two or more (meth)acryloyl groups, or a second epoxy (meth)acrylate compound having two or more (meth)acryloyl groups and one or more epoxy groups.
  • Examples of the second urethane (meth)acrylate compound include KRM9465 (manufactured by Daicel-Allnex Corporation), EBECRYL4666 (manufactured by Daicel-Allnex Corporation), EBECRYL8209 (manufactured by Daicel-Allnex Corporation), EBECRYL8210 (manufactured by Daicel-Allnex Corporation), EBECRYL8804 (manufactured by Daicel-Allnex Corporation), EBECRYL4858 (manufactured by Daicel-Allnex Corporation), UN-2601 (manufactured by Negami Chemical Industries Co., Ltd.), UN-2301 (manufactured by Negami Chemical Industries Co., Ltd.), and UN-9000PEP (manufactured by Negami Chemical Industries Co., Ltd.).
  • the content of the second curable compound in 100% by weight of the conductive paste is preferably 4% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and is preferably 50% by weight or less, more preferably 40% by weight or less, even more preferably 30% by weight or less. If the content of the second curable compound is equal to or more than the lower limit and equal to or less than the upper limit, the reliability of conductivity can be further improved even when mounting is performed in a relatively short time.
  • the content of the second epoxy (meth)acrylate compound is preferably 1% by weight or more, more preferably 5% by weight or more, and preferably 25% by weight or less, more preferably 20% by weight or less, and even more preferably 15% by weight or less.
  • the content of the second epoxy (meth)acrylate compound is equal to or more than the lower limit and equal to or less than the upper limit, the reliability of conductivity can be further improved even when mounting is performed in a relatively short time.
  • the curing agent is preferably a polymerization initiator.
  • the polymerization initiator include a photopolymerization initiator and a thermal polymerization initiator. Only one type of the polymerization initiator may be used, or two or more types may be used in combination.
  • the polymerization initiator contains a thermal polymerization initiator.
  • the thermal polymerization initiator preferably contains a thermal radical polymerization initiator, and is preferably a thermal radical polymerization initiator.
  • Examples of the thermal radical polymerization initiator include a peroxide radical polymerization initiator, an azo radical polymerization initiator, and a redox radical polymerization initiator.
  • the above-mentioned peroxide-based radical polymerization initiators include diacyl-based radical polymerization initiators, peroxyester-based radical polymerization initiators, dialkyl-based radical polymerization initiators, percarbonate-based radical polymerization initiators, and ketone peroxide-based radical polymerization initiators.
  • the above-mentioned diacyl-based radical polymerization initiators include lauroyl peroxide and benzoyl peroxide.
  • the above-mentioned peroxyester-based radical polymerization initiators include t-butyl peroxybenzoate, t-butyl peroxyacetate, t-butyl peroxypivalate, and t-butyl peroxy-2-ethylhexanoate.
  • the above-mentioned dialkyl-based radical polymerization initiators include dicumyl peroxide and di-t-butyl peroxide.
  • the above-mentioned percarbonate-based radical polymerization initiators include diisopropyl peroxydicarbonate.
  • the above-mentioned ketone peroxide-based radical polymerization initiators include methyl ethyl ketone peroxide.
  • the redox radical polymerization initiator includes, for example, a peroxide and a reducing agent or a metal-containing compound.
  • Specific examples of the redox radical polymerization initiator include a mixture of benzoyl peroxide and organic amines, a mixture of the peroxyester radical polymerization initiator and a reducing agent such as mercaptans, and a mixture of methyl ethyl ketone peroxide and an organic cobalt salt.
  • the above polymerization initiator contains a peroxide-based radical polymerization initiator.
  • the content of the curing agent (polymerization initiator) in the conductive paste (100% by weight) is preferably 0.1% by weight or more, more preferably 0.3% by weight or more, even more preferably 0.5% by weight or more, and is preferably 5% by weight or less, more preferably 4% by weight or less, even more preferably 3% by weight or less.
  • the content of the curing agent (polymerization initiator) is preferably 0.3 parts by weight or more, more preferably 0.5 parts by weight or more, even more preferably 0.7 parts by weight or more, and is preferably 6 parts by weight or less, more preferably 5 parts by weight or less, and even more preferably 4 parts by weight or less, relative to 100 parts by weight of the curable compound.
  • content of the curing agent (polymerization initiator) is equal to or more than the lower limit and equal to or less than the upper limit, reactivity and storage stability can be improved.
  • the conductive filler is not particularly limited, and may be conductive particles or carbon fibers.
  • the conductive filler in the conductive paste is a conductive particle having a resin particle and a conductive layer disposed on the surface of the resin particle, or a metal particle having a melting point exceeding 450°C. From the viewpoint of further improving the reliability of conduction, it is preferable that the conductive filler in the conductive paste is a metal particle having a melting point exceeding 450°C.
  • the conductive filler described here is different from solder particles. When the conductive particles described here are used, the discharge stability of the conductive paste can be improved.
  • metal particles e.g., solder particles
  • a melting point of 450°C or less it is difficult to sufficiently improve the discharge stability of the conductive paste compared to when metal particles having a melting point exceeding 450°C are used.
  • the shape of the conductive filler is not particularly limited.
  • the shape of the conductive filler may be spherical, may be a shape other than spherical, or may be flat, etc.
  • the conductive filler is preferably a conductive particle.
  • the conductive particle may be a solder particle or a metal particle.
  • the metal particle may be a metal powder.
  • the conductive particle may include a base particle and a conductive portion disposed on the surface of the base particle. From the viewpoint of further increasing the reliability of conduction, the conductive particle preferably includes a base particle and a conductive portion disposed on the surface of the base particle.
  • the particle diameter of the conductive particle is preferably 0.1 ⁇ m or more, more preferably 1 ⁇ m or more, even more preferably 2 ⁇ m or more, and preferably 100 ⁇ m or less, more preferably 30 ⁇ m or less, even more preferably 10 ⁇ m or less.
  • the particle diameter of the conductive particle is equal to or more than the lower limit and equal to or less than the upper limit, the conductivity reliability can be further improved even when mounting is performed in a relatively short time.
  • the particle diameter of the conductive particles is preferably an average particle diameter, and more preferably a number average particle diameter.
  • the average particle diameter of the conductive particles can be determined, for example, by observing 50 random conductive particles with an electron microscope or optical microscope and calculating the average particle diameter of each conductive particle, or by performing laser diffraction particle size distribution measurement.
  • the particle diameter of the conductive particles is measured by observing 50 arbitrary conductive particles with an electron microscope or optical microscope, the measurement can be performed, for example, as follows.
  • the conductive particles are added to "Technovit 4000" manufactured by Kulzer so that the content of the conductive particles is 30% by weight, and dispersed to prepare an embedding resin body for conductive particle inspection.
  • a cross section of the conductive particle is cut out using an ion milling device ("IM4000" manufactured by Hitachi High-Technologies Corporation) so as to pass through the vicinity of the center of the conductive particles dispersed in the embedding resin body for conductive particle inspection.
  • the image magnification is set to 25,000 times, 50 conductive particles are randomly selected, and each conductive particle is observed.
  • the circle equivalent diameter of each conductive particle is measured, and the arithmetic average of the measured diameters is determined as the particle diameter of the conductive particle.
  • the coefficient of variation (CV value) of the particle diameter of the conductive particles is preferably 10% or less, more preferably 5% or less.
  • the coefficient of variation of the particle diameter of the conductive particles is equal to or less than the upper limit, the reliability of electrical conductivity can be further improved.
  • the coefficient of variation (CV value) of the particle diameter of the conductive particles may be 0% or more, or 1% or more.
  • CV value The above coefficient of variation (CV value) can be measured as follows.
  • CV value (%) ( ⁇ /Dn) ⁇ 100 ⁇ : Standard deviation of the particle diameter of the conductive particles Dn: Average particle diameter of the conductive particles
  • the conductive paste contains 100% by weight of the conductive filler, and the conductive filler content is preferably 0.1% by weight or more, more preferably 1% by weight or more, and even more preferably 5% by weight or more, and is preferably 80% by weight or less, more preferably 60% by weight or less, and even more preferably 40% by weight or less. If the conductive filler content is equal to or more than the lower limit and equal to or less than the upper limit, the adhesiveness and electrical conductivity reliability can be further improved even when mounting is performed in a relatively short time.
  • the conductive filler preferably contains a metal.
  • the metal include gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, ruthenium, nickel, chromium, titanium, antimony, bismuth, germanium, and cadmium, as well as alloys thereof.
  • Tin-doped indium oxide (ITO) may also be used as the metal. Only one of the above metals may be used, or two or more of them may be used in combination.
  • the conductive filler preferably contains a tin-containing alloy, nickel, palladium, ruthenium, silver, copper or gold, and more preferably contains nickel or palladium. From the viewpoint of increasing the corrosion resistance of the conductive filler and maintaining high electrical conductivity reliability, the conductive filler preferably contains nickel or gold, and more preferably contains nickel. From the viewpoint of increasing the corrosion resistance of the conductive filler and maintaining high electrical conductivity reliability, it is particularly preferable that the conductive filler contains nickel on the outer surface.
  • the conductive particles are metal particles
  • examples of the metal particles include silver, copper, nickel, silicon, gold, titanium, and alloys such as solder. From the viewpoint of more effectively increasing the reliability of electrical conduction, it is preferable that the material of the metal particles contains nickel or a nickel alloy, and it is more preferable that the material of the metal particles is nickel or a nickel alloy. From the viewpoint of more effectively increasing the reliability of electrical conduction, it is preferable that the outer surface portion of the metal particles contains nickel or a nickel alloy.
  • the conductive particle which includes a base particle and a conductive portion disposed on the surface of the base particle.
  • the material for the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; acrylic resins such as polymethyl methacrylate and polymethyl acrylate; polyalkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polysulfone, polyphenylene oxide, polyacetal, polyimide, polyamideimide, polyether ether ketone, polyether sulfone, divinylbenzene polymer, and polymers obtained by polymerizing one or more of various polymeriz
  • non-crosslinkable monomers include styrene-based monomers such as styrene and ⁇ -methylstyrene; carboxyl group-containing monomers such as (meth)acrylic acid, maleic acid, and maleic anhydride; alkyl (meth)acrylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; 2-hydroxyethyl Examples of such monomers include oxygen-containing (meth)acrylate compounds such as (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)acrylate, and
  • the base particles are inorganic particles other than metal particles or organic-inorganic hybrid particles
  • examples of the inorganic material of the base particles include silica, alumina, barium titanate, zirconia, and carbon black. It is preferable that the inorganic material is not a metal.
  • the particles formed from silica are not particularly limited, but examples include particles obtained by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups to form crosslinked polymer particles, and then baking the particles as necessary.
  • the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed from a crosslinked alkoxysilyl polymer and an acrylic resin.
  • the organic-inorganic hybrid particles are preferably core-shell type organic-inorganic hybrid particles having a core and a shell disposed on the surface of the core.
  • the core is preferably an organic core.
  • the shell is preferably an inorganic shell.
  • the base particle is preferably an organic-inorganic hybrid particle having an organic core and an inorganic shell disposed on the surface of the organic core.
  • Examples of the organic core material include the resin particle materials mentioned above.
  • the base particles are metal particles
  • examples of the metal particles include silver, copper, nickel, silicon, gold, titanium, and alloys such as solder.
  • the melting point of the metal particles is preferably greater than 450°C, more preferably 500°C or higher, even more preferably 600°C or higher, even more preferably 700°C or higher, even more preferably 800°C or higher, and particularly preferably 900°C or higher. If the melting point of the metal particles is equal to or higher than the lower limit, the discharge stability of the conductive paste can be further improved.
  • the melting point of the metal particles may be equal to or lower than 3000°C, or may be equal to or lower than 2500°C.
  • the range of the melting point of the metal particles can be set by appropriately selecting the lower limit and the upper limit.
  • the particle diameter of the base particles is preferably 0.01 ⁇ m or more, more preferably 0.05 ⁇ m or more, even more preferably 0.5 ⁇ m or more, even more preferably 1 ⁇ m or more, and particularly preferably 3 ⁇ m or more, and is preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less, even more preferably 20 ⁇ m or less, and particularly preferably 10 ⁇ m or less.
  • the particle diameter of the base particles is equal to or greater than the lower limit, the electrical conductivity reliability is further increased.
  • aggregation is less likely to occur, and aggregated conductive particles are less likely to be formed.
  • the conductive particles are easily compressed sufficiently, and the connection resistance between the electrodes connected via the conductive particles can be further effectively reduced.
  • the particle diameter of the base particles is preferably an average particle diameter, and more preferably a number average particle diameter.
  • the number average particle diameter of the base particles can be measured, for example, as follows.
  • the conductive particles are added to "Technovit 4000" manufactured by Kulzer so that the content of the conductive particles is 30% by weight, and dispersed to prepare an embedded resin body for inspecting base particles.
  • a cross section of the conductive particles dispersed in the embedded resin body for inspecting base particles is cut out using an ion milling device ("IM4000" manufactured by Hitachi High-Technologies Corporation) so as to pass through the vicinity of the center of the base particle in the conductive particles dispersed in the embedded resin body for inspecting base particles.
  • IM4000 manufactured by Hitachi High-Technologies Corporation
  • the conductive portion preferably contains a metal.
  • the metal constituting the conductive portion is not particularly limited. Examples of the metal include gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, ruthenium, nickel, chromium, titanium, antimony, bismuth, germanium, and cadmium, as well as alloys thereof.
  • tin-doped indium oxide (ITO) may be used as the metal. Only one of the metals may be used, or two or more of them may be used in combination. From the viewpoint of further reducing the connection resistance between the electrodes, an alloy containing tin, nickel, palladium, ruthenium, silver, copper, or gold is preferred, and nickel or palladium is more preferred.
  • the conductive portion contains nickel, and it is even more preferable that the outer surface portion of the conductive portion contains nickel.
  • the nickel content in 100% by weight of the nickel-containing conductive part is preferably 10% by weight or more, more preferably 50% by weight or more, even more preferably 60% by weight or more, even more preferably 70% by weight or more, and particularly preferably 90% by weight or more.
  • the nickel content in 100% by weight of the nickel-containing conductive part may be 100% by weight or less, 99% by weight or less, 90% by weight or less, or 70% by weight or less.
  • the range of the nickel content in 100% by weight of the nickel-containing conductive part can be set by appropriately selecting the lower limit value and the upper limit value.
  • the conductive portion may be formed of one layer.
  • the conductive portion may be formed of multiple layers. That is, the conductive portion may have a laminated structure of two or more layers.
  • the metal constituting the outermost layer is preferably an alloy containing gold, silver, nickel, palladium, ruthenium, copper or tin, and is more preferably nickel.
  • the connection resistance between the electrodes is further reduced.
  • the method for forming the conductive portion on the surface of the base particle is not particularly limited.
  • Examples of the method for forming the conductive portion include electroless plating, electroplating, physical collision, mechanochemical reaction, physical vapor deposition or physical adsorption, and coating the surface of the base particle with a metal powder or a paste containing a metal powder and a binder.
  • the method for forming the conductive portion is preferably electroless plating, electroplating, or physical collision.
  • Examples of the physical vapor deposition method include vacuum vapor deposition, ion plating, and ion sputtering.
  • the physical collision method uses, for example, a sheeter composer (manufactured by Tokuju Kosakusho Co., Ltd.).
  • the thickness of the conductive portion is preferably 0.005 ⁇ m or more, more preferably 0.01 ⁇ m or more, and is preferably 10 ⁇ m or less, more preferably 1 ⁇ m or less, and even more preferably 0.3 ⁇ m or less.
  • the thickness of the conductive portion is equal to or greater than the lower limit and equal to or less than the upper limit, sufficient conductivity is obtained, and the conductive particles do not become too hard, allowing the conductive particles to be sufficiently deformed when connected.
  • the thickness of the conductive portion of the outermost layer is preferably 0.001 ⁇ m or more, more preferably 0.01 ⁇ m or more, and preferably 0.5 ⁇ m or less, more preferably 0.1 ⁇ m or less.
  • the thickness of the conductive portion of the outermost layer is equal to or greater than the lower limit and equal to or less than the upper limit, the conductive portion of the outermost layer becomes uniform, the corrosion resistance becomes sufficiently high, and the connection resistance between the electrodes can be sufficiently low.
  • the thickness of the conductive portion can be measured, for example, by observing the cross-section of the conductive particle using a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • the conductive particles preferably have a plurality of protrusions on the outer surface of the conductive part.
  • An oxide film is often formed on the surface of the electrodes connected by the conductive particles.
  • the oxide film can be effectively removed by the protrusions by arranging the conductive particles between the electrodes and pressing them together. This allows the electrodes and the conductive part to be in more reliable contact, and the connection resistance between the electrodes is further reduced.
  • the protrusions of the conductive particles can effectively remove the filler between the conductive particles and the electrodes. This further increases the reliability of the conduction between the electrodes.
  • Methods for forming the above-mentioned protrusions include a method in which a core material is attached to the surface of a base particle and then a conductive portion is formed by electroless plating, and a method in which a conductive portion is formed on the surface of a base particle by electroless plating, then a core material is attached, and then a conductive portion is formed by electroless plating.
  • a method may be used in which, without using the above-mentioned core material, a conductive portion is formed on the base particle by electroless plating, plating is deposited in the form of protrusions on the surface of the conductive portion, and then a conductive portion is formed by electroless plating.
  • Methods for attaching a core substance to the surface of a base particle include, for example, a method in which a core substance is added to a dispersion liquid of the base particle, and the core substance is accumulated and attached to the surface of the base particle by van der Waals forces, and a method in which a core substance is added to a container containing the base particle, and the core substance is attached to the surface of the base particle by mechanical action such as rotating the container.
  • the method for attaching a core substance to the surface of a base particle is preferably a method in which the core substance is accumulated and attached to the surface of the base particle in the dispersion liquid.
  • the materials constituting the core material include conductive materials and non-conductive materials.
  • the conductive materials include, for example, conductive non-metals such as metals, metal oxides, and graphite, and conductive polymers.
  • the conductive polymers include polyacetylene.
  • the non-conductive materials include silica, alumina, titanium oxide, tungsten carbide, and zirconia. From the viewpoint of further increasing the reliability of electrical conduction between the electrodes, it is preferable that the core material is a metal.
  • the metal is not particularly limited.
  • the metal include gold, silver, copper, platinum, zinc, iron, lead, tin, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, and cadmium, as well as alloys composed of two or more metals, such as tin-lead alloys, tin-copper alloys, tin-silver alloys, tin-lead-silver alloys, and tungsten carbide.
  • the metal is preferably nickel, copper, silver, or gold.
  • the metal may be the same as the metal constituting the conductive portion, or may be different.
  • the shape of the core material is not particularly limited.
  • the core material is preferably in the form of a lump.
  • Examples of the core material include particulate lumps, agglomerates of multiple microparticles, and amorphous lumps.
  • the particle diameter of the core material is preferably 0.001 ⁇ m or more, more preferably 0.05 ⁇ m or more, and preferably 0.9 ⁇ m or less, more preferably 0.2 ⁇ m or less.
  • the particle diameter of the core material is equal to or greater than the lower limit and equal to or less than the upper limit, the connection resistance between the electrodes can be effectively reduced.
  • the particle diameter of the core substance is preferably an average particle diameter, and more preferably a number average particle diameter.
  • the particle diameter of the core substance can be determined, for example, by observing 50 random core substances with an electron microscope or optical microscope and calculating the average particle diameter of each core substance, or by performing laser diffraction particle size distribution measurement.
  • the conductive paste preferably contains a non-conductive filler.
  • the non-conductive filler may be silica, alumina, titanium oxide, calcium oxide, zinc oxide, boron nitride, etc. Only one type of the non-conductive filler may be used, or two or more types may be used in combination.
  • the non-conductive filler preferably contains silica or titanium oxide, and more preferably contains silica.
  • the content of the non-conductive filler in the conductive paste (100% by weight) is preferably 1% by weight or more, more preferably 3% by weight or more, and preferably 20% by weight or less, more preferably 10% by weight or less. If the content of the non-conductive filler is equal to or more than the lower limit and equal to or less than the upper limit, the application properties of the conductive paste can be improved, and the adhesiveness and conductivity reliability can be further improved even when mounting is performed in a relatively short time.
  • the total content of the conductive filler and the non-conductive filler in the conductive paste (100% by weight) is preferably 10% by weight or more, more preferably 15% by weight or more, and preferably 40% by weight or less, more preferably 30% by weight or less.
  • the application properties of the conductive paste can be improved, and the adhesiveness and conductivity reliability can be further improved even when mounting is performed in a relatively short time.
  • the conductive paste may contain components other than the curable compound, the curing agent, the conductive filler, and the non-conductive filler.
  • the conductive paste may contain, as other components, a solvent, an inorganic filler, an organic filler, a colorant, a polymerization inhibitor, a chain transfer agent, an antioxidant, an ultraviolet absorber, an antifoaming agent, a leveling agent, a surfactant, a slip agent, an antiblocking agent, a wax, a masking agent, a deodorant, a fragrance, a preservative, an antibacterial agent, an antistatic agent, and an adhesion imparting agent.
  • the RFID inlay according to the present invention comprises a substrate having wiring on its surface, a chip having electrodes on its surface, and an adhesive portion bonding the substrate and the chip.
  • the material of the adhesive portion is the conductive paste described above.
  • the wiring and the electrodes are electrically connected by the conductive filler in the adhesive portion.
  • FIG. 1 is a cross-sectional view showing a schematic diagram of an RFID inlay using a conductive paste according to a first embodiment of the present invention.
  • the RFID inlay 81 shown in FIG. 1 comprises a substrate 82 having wiring on its surface, a chip 83 having electrodes on its surface, and an adhesive portion 84 that bonds the substrate 82 and the chip 83.
  • the material of the adhesive portion 84 is a conductive paste containing conductive filler 1.
  • the adhesive portion 84 is formed from a conductive paste containing conductive filler 1. It is preferable that the adhesive portion 84 is formed by hardening the conductive paste containing conductive filler 1.
  • the substrate 82 has wiring 82a on its surface (upper surface).
  • the chip 83 has an electrode 83a on its surface (lower surface).
  • the wiring 82a and the electrode 83a are electrically connected by the conductive filler 1 in the adhesive portion 84.
  • the manufacturing method of the RFID inlay according to the present invention comprises the following steps (1) to (3): (1) A first arrangement step of arranging the above-mentioned conductive paste on the surface of a substrate having wiring on its surface. (2) A second arrangement step of arranging a chip having an electrode on its surface on the surface of the conductive paste opposite the substrate. (3) A bonding step of forming an adhesive part that bonds the substrate and the chip with the conductive paste by heating and pressurizing the conductive paste, and electrically connecting the wiring and the electrodes with the conductive filler in the adhesive part.
  • the RFID inlay and manufacturing method for the RFID inlay according to the present invention use a specific conductive paste, which improves adhesion between the substrate and the chip and increases the reliability of electrical continuity.
  • the substrate is long and that the RFID inlay is manufactured by transporting the long substrate using a roll-to-roll method in the first arrangement step, the second arrangement step, and the bonding step.
  • multiple RFID inlays can be manufactured continuously, and the manufacturing efficiency of the RFID inlay can be further improved.
  • the conductive paste can be applied by, for example, applying it with a dispenser, screen printing, or ejecting it with an inkjet device.
  • the heating temperature in the bonding process is preferably 100°C or higher, more preferably 150°C or higher, and is preferably 400°C or lower, more preferably 300°C or lower, and even more preferably 250°C or lower. If the heating temperature in the bonding process is equal to or higher than the lower limit and equal to or lower than the upper limit, thermal damage to the substrate can be reduced and good electrical connection can be achieved between the chip and the substrate.
  • the applied pressure in the bonding process is preferably 0.5 N or more, more preferably 1 N or more, and is preferably 3.5 N or less, more preferably 3 N or less, and even more preferably 2.5 N or less.
  • the applied pressure in the bonding process is equal to or more than the lower limit and equal to or less than the upper limit, the adhesion between the substrate and the chip can be improved, and the electrical conductivity reliability can be improved.
  • the heating and pressurizing time in the bonding process is not particularly limited.
  • the heating and pressurizing time in the bonding process may be 2 seconds or more, 15 seconds or less, 10 seconds or less, 9 seconds or less, 7 seconds or less, or 5 seconds or less.
  • the RFID inlay may be cut to a predetermined size as necessary, or may be cut before use. It is preferable that a plurality of the chips are adhered to a long substrate by a plurality of the adhesive parts. A plurality of laminates of the chips and the adhesive parts may be arranged on the long substrate. In the first arrangement step, it is preferable that the conductive paste is arranged at a plurality of locations on the surface of the long substrate. In the second arrangement step, it is preferable that a plurality of chips are used to arrange the chips on the surface opposite the substrate side of each of the conductive pastes arranged at a plurality of locations. After the chips are adhered to the long substrate by the adhesive parts, the long substrate may be cut.
  • the substrate is not particularly limited.
  • the substrate is preferably a circuit board.
  • the circuit board include a resin film, a flexible printed circuit board, a rigid-flexible board, a glass board, and a paper board.
  • the substrate may be a resin board, a glass board, or a paper board.
  • the substrate has wiring (antenna pattern) on its surface.
  • Wiring (antenna pattern) is formed on the surface of the base material. It is preferable that the substrate has a base material and wiring (antenna pattern) disposed on the surface of the base material.
  • the substrate may be made of resin, glass, paper, or the like.
  • the resin may be made of PET (polyethylene terephthalate), PP (polypropylene), PVC (polyvinyl chloride), or the like.
  • the paper may be impregnated with epoxy resin or phenolic resin.
  • the substrate is preferably made of resin or paper, and more preferably made of PET (polyethylene terephthalate) or paper.
  • the substrate may be made of resin, glass, or paper.
  • the above wiring may be gold wiring, nickel wiring, tin wiring, aluminum wiring, silver wiring, SUS wiring, copper wiring, molybdenum wiring, tungsten wiring, etc. From the viewpoint of improving the operating sensitivity in the UHF band (860 MHz to 960 MHz), the above wiring is preferably aluminum wiring.
  • the thickness of the substrate is preferably 20 ⁇ m or more, more preferably 30 ⁇ m or more, and is preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less.
  • the shapes of the substrate and the base material are not particularly limited. From the viewpoint of manufacturing RFID inlays by a roll-to-roll method, it is preferable that the substrate and the base material are long.
  • the length of the substrate and the base material is not particularly limited. The length of the substrate and the base material may be 1 m or more, 10 m or more, 5000 m or less, or 1000 m or less.
  • the above chips include semiconductor chips (IC chips), etc.
  • the chip has an electrode on its surface.
  • the electrode include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, silver electrodes, SUS electrodes, copper electrodes, molybdenum electrodes, and tungsten electrodes. From the viewpoint of further improving the reliability of electrical conduction, the electrode is preferably a copper electrode or a gold electrode, and more preferably a copper electrode.
  • the number of electrodes per chip is not particularly limited.
  • the number of electrodes per chip may be 1 or more, 4 or more, 20 or less, or 10 or less.
  • the shape of the tip is not particularly limited.
  • the tip may be rectangular, triangular, or circular.
  • Curable Compounds (First Curable Compound) "EBECRYL3605" manufactured by Daicel Allnex Co., Ltd. (first epoxy (meth)acrylate compound, one (meth)acryloyl group, one epoxy group) "M-5700” manufactured by Toagosei Co., Ltd. (2-hydroxy-3-phenoxypropyl acrylate, first hydroxy (meth)acrylate compound, one (meth)acryloyl group, one hydroxy group) "M-5400” manufactured by Toagosei Co., Ltd.
  • Non-conductive filler "RX200” (silicic acid silica) manufactured by Nippon Aerosil Co., Ltd. Tokuyama “PM-20L” (dry silica)
  • Tips IC chip (copper electrode, NXP "UCODE9", surface area: 0.22 mm 2 )
  • PET film long, resin film with aluminum wiring and operating frequency in the UHF band (860MHz to 920MHz)
  • Example 1 Preparation of Conductive Paste The materials shown in Table 1 below were mixed in the amounts (parts by weight) shown in Table 1 below and stirred using a planetary mixer (Thinky Mixer), to obtain a conductive paste (anisotropic conductive paste).
  • a planetary mixer Thinky Mixer
  • connection step the wiring on the surface of the PET film and the electrodes on the surface of the chip were electrically connected by the conductive filler (conductive particles) in the adhesive to obtain a connection structure (adhesion step).
  • the first arrangement step, the second arrangement step, and the adhesion step were performed using a "DDA40000" (roll-to-roll method) manufactured by Muhlbauer.
  • the resulting connection structure was cut to a size of 5 cm x 1.5 cm using a "DCL30000” manufactured by Muhlbauer to obtain 50 RFID inlays A.
  • RFID inlay B was obtained in the same manner as RFID inlay A, except that the thermocompression bonding conditions were changed to upper heat tool 160°C, lower heat tool 155°C, pressure 2N, and compression time 7 seconds.
  • Examples 2 to 17 and Comparative Examples 1 and 2 Conductive pastes and RFID inlays were obtained in the same manner as in Example 1, except that the ingredients and amounts of the conductive paste were changed as shown in Tables 1, 3, 5, 7, and 9.
  • Viscosity of Conductive Paste at 25° C. The viscosity of the conductive paste at 25° C. was measured by the method described above.
  • Die shear strength is 7.0 N or more.
  • Die shear strength is 5.0 N or more and less than 7.0 N.
  • Die shear strength is 3.0 N or more and less than 5.0 N.
  • Die shear strength is less than 3.0 N.
  • the conductive paste was filled into two PTFE molds and heated in an oven under the following conditions: (1) 180°C for 300 seconds and (2) 160°C for 300 seconds to obtain a rectangular cured product of 5 mm x 40 mm x 2 mm. The obtained cured product was left at room temperature for 12 hours or more, and then cooled. When one end of the cured product was touched with the tip of a needle with a handle at 25°C, it was observed whether the cured product lifted up. When heated under the following conditions: (1) 180°C for 300 seconds and (2) 160°C for 300 seconds, the curability of the conductive paste (tackiness of the cured product) was evaluated according to the following criteria.

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PCT/JP2024/029863 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Pending WO2025047576A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242397A (ja) * 2006-03-08 2007-09-20 Toyobo Co Ltd 導電性ペースト及びこれを用いた印刷回路、面状発熱体
WO2020137615A1 (ja) * 2018-12-25 2020-07-02 東レ株式会社 無線通信装置の製造方法、無線通信装置および無線通信装置の集合体
JP2020139011A (ja) * 2019-02-27 2020-09-03 ナミックス株式会社 導電性組成物および導電性接着剤

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JP6328996B2 (ja) * 2013-05-23 2018-05-23 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
JP7160907B2 (ja) * 2019-02-18 2022-10-25 積水化学工業株式会社 ポリイミド配向膜付基板用の液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242397A (ja) * 2006-03-08 2007-09-20 Toyobo Co Ltd 導電性ペースト及びこれを用いた印刷回路、面状発熱体
WO2020137615A1 (ja) * 2018-12-25 2020-07-02 東レ株式会社 無線通信装置の製造方法、無線通信装置および無線通信装置の集合体
JP2020139011A (ja) * 2019-02-27 2020-09-03 ナミックス株式会社 導電性組成物および導電性接着剤

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