JPWO2025047576A1 - - Google Patents
Info
- Publication number
- JPWO2025047576A1 JPWO2025047576A1 JP2024571933A JP2024571933A JPWO2025047576A1 JP WO2025047576 A1 JPWO2025047576 A1 JP WO2025047576A1 JP 2024571933 A JP2024571933 A JP 2024571933A JP 2024571933 A JP2024571933 A JP 2024571933A JP WO2025047576 A1 JPWO2025047576 A1 JP WO2025047576A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023137307 | 2023-08-25 | ||
| PCT/JP2024/029863 WO2025047576A1 (ja) | 2023-08-25 | 2024-08-22 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025047576A1 true JPWO2025047576A1 (https=) | 2025-03-06 |
| JPWO2025047576A5 JPWO2025047576A5 (https=) | 2025-08-06 |
Family
ID=94819127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024571933A Pending JPWO2025047576A1 (https=) | 2023-08-25 | 2024-08-22 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025047576A1 (https=) |
| CN (1) | CN121713258A (https=) |
| TW (1) | TW202513746A (https=) |
| WO (1) | WO2025047576A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242397A (ja) * | 2006-03-08 | 2007-09-20 | Toyobo Co Ltd | 導電性ペースト及びこれを用いた印刷回路、面状発熱体 |
| JP2015005502A (ja) * | 2013-05-23 | 2015-01-08 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| WO2020137615A1 (ja) * | 2018-12-25 | 2020-07-02 | 東レ株式会社 | 無線通信装置の製造方法、無線通信装置および無線通信装置の集合体 |
| WO2020171053A1 (ja) * | 2019-02-18 | 2020-08-27 | 積水化学工業株式会社 | 硬化性樹脂組成物、液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
| JP2020139011A (ja) * | 2019-02-27 | 2020-09-03 | ナミックス株式会社 | 導電性組成物および導電性接着剤 |
-
2024
- 2024-08-22 CN CN202480052078.XA patent/CN121713258A/zh active Pending
- 2024-08-22 WO PCT/JP2024/029863 patent/WO2025047576A1/ja active Pending
- 2024-08-22 JP JP2024571933A patent/JPWO2025047576A1/ja active Pending
- 2024-08-23 TW TW113131785A patent/TW202513746A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242397A (ja) * | 2006-03-08 | 2007-09-20 | Toyobo Co Ltd | 導電性ペースト及びこれを用いた印刷回路、面状発熱体 |
| JP2015005502A (ja) * | 2013-05-23 | 2015-01-08 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| WO2020137615A1 (ja) * | 2018-12-25 | 2020-07-02 | 東レ株式会社 | 無線通信装置の製造方法、無線通信装置および無線通信装置の集合体 |
| WO2020171053A1 (ja) * | 2019-02-18 | 2020-08-27 | 積水化学工業株式会社 | 硬化性樹脂組成物、液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
| JP2020139011A (ja) * | 2019-02-27 | 2020-09-03 | ナミックス株式会社 | 導電性組成物および導電性接着剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN121713258A (zh) | 2026-03-20 |
| WO2025047576A1 (ja) | 2025-03-06 |
| TW202513746A (zh) | 2025-04-01 |
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