WO2025009059A1 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
WO2025009059A1
WO2025009059A1 PCT/JP2023/024770 JP2023024770W WO2025009059A1 WO 2025009059 A1 WO2025009059 A1 WO 2025009059A1 JP 2023024770 W JP2023024770 W JP 2023024770W WO 2025009059 A1 WO2025009059 A1 WO 2025009059A1
Authority
WO
WIPO (PCT)
Prior art keywords
air
opening
laser processing
protective window
dust collection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/024770
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
雅也 大橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2023/024770 priority Critical patent/WO2025009059A1/ja
Priority to JP2023570066A priority patent/JP7455289B1/ja
Priority to TW112143004A priority patent/TW202502477A/zh
Publication of WO2025009059A1 publication Critical patent/WO2025009059A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece

Definitions

  • This disclosure relates to a laser processing device.
  • Laser processing equipment that performs high-speed drilling or cutting on workpieces such as printed wiring boards is equipped with a lens and a protective window that protects the lens on the processing head.
  • Such laser processing equipment focuses the laser light output from a laser oscillator with a focusing lens to perform laser processing on the workpiece.
  • the protective window blocks spatter, interfering gas, and dust generated during laser processing, preventing damage to the lens. If the protective window is exposed to spatter, interfering gas, or dust, the surface of the protective window will deteriorate or be damaged, requiring cleaning, replacement, or processing defects.
  • Patent Document 1 describes a cover glass that protects the focusing lens from debris that scatters when the workpiece is laser-processed, an air injection nozzle that injects air toward the cover glass to remove the debris, a downflow generating unit that generates a downflow that prevents debris from entering the cover glass, an outside air introduction path, and a suction flow path.
  • the air injection nozzle and downflow generating unit guide debris that has scattered upwards downward without it reaching the cover glass, and collect it in the suction flow path.
  • Patent Document 1 uses an air curtain that introduces outside air using a configuration that includes an outside air introduction path and a suction flow path, but the air does not flow in a straight line and the air volume is small, which causes variation in the protective ability of the air curtain and reduces the protective performance of the protective window.
  • the present disclosure has been made in consideration of the above, and aims to obtain a laser processing device that improves the protective performance of the protective window and achieves stable laser processing.
  • the laser processing device of the present disclosure performs laser processing by focusing laser light with a focusing lens and irradiating the workpiece with the focused light.
  • the laser processing device includes a protective window provided downstream of the optical path of the focusing lens, a holder for holding the focusing lens and the protective window, a first air nozzle for spraying first air toward the protective window, a dust collection duct having a first opening and a second opening downstream of the first opening in the optical path through which the laser light passes, a second air nozzle for spraying second air, a duct exhaust port which is a recovery port for the second air, and a suction device for sucking the second air from the duct exhaust port.
  • the first opening and the second opening have an opening shape large enough to surround the protective window.
  • the second air nozzle sprays the second air over an area wider than the diameter of the protective window.
  • the laser processing device disclosed herein has the effect of improving the protective performance of the protective window and achieving stable laser processing.
  • FIG. 1 is a diagram showing a schematic configuration of a laser processing apparatus according to an embodiment
  • FIG. 1 is a bottom view showing a configuration of a dust collection duct of a laser processing apparatus according to an embodiment
  • FIG. 1 is a diagram showing a schematic configuration of a laser processing apparatus 100 according to an embodiment.
  • FIG. 2 is a bottom view showing a configuration of a dust collection duct 12 of the laser processing apparatus 100 according to an embodiment.
  • the laser processing apparatus 100 includes a laser oscillator 1, a reflecting mirror 2, an f ⁇ lens 4 as a condensing lens, a protective window 5, a holder 6 as a first holder, a dust sensor 13, a Z-axis box 16 as a second holder, a dust collection device 40, a first high-pressure air supply source 21 as a first air supply source, a second high-pressure air supply source 22 as a second air supply source, a control device 24, and an XY table 26.
  • the dust collection device 40 has a dust collection duct 12 and a suction device 20.
  • the laser processing apparatus 100 performs laser processing by condensing a laser beam 3 with an f ⁇ lens 4 and irradiating the workpiece 25.
  • FIG. 1 shows an X, Y, and Z coordinate system. The Z direction is described as the up-down direction, but other implementations are possible.
  • the laser oscillator 1 emits laser light 3 as a pulse wave.
  • the laser light 3 emitted from the laser oscillator 1 is guided to the f ⁇ lens 4 via the reflecting mirror 2.
  • the reflecting mirror 2 reflects the laser light 3 and guides it downstream in the optical path.
  • the reflecting mirrors 2 are arranged at various positions on the optical path within the laser processing device 100.
  • the f ⁇ lens 4 focuses the laser light 3 on the workpiece 25.
  • the workpiece 25 to be processed is placed on an XY table 26.
  • the workpiece 25 is, for example, a printed wiring board.
  • the XY table 26 can be moved two-dimensionally in the X and Y directions by a drive mechanism (not shown).
  • the workpiece 25 is irradiated with the laser light 3, thereby drilling or cutting the workpiece 25.
  • the holder 6 is stored and fixed in the Z-axis box 16.
  • the holder 6 is, for example, cylindrical in shape.
  • the f ⁇ lens 4 and protective window 5 are attached to the inside of the holder 6, and the holder 6 holds the f ⁇ lens 4 and the protective window 5.
  • the protective window 5 is provided below the f ⁇ lens 4, downstream in the optical path.
  • the protective window 5 is provided between the f ⁇ lens 4 and the workpiece 25.
  • the protective window 5 shields sputters B1, interfering gas B2, or dust B3 generated during processing of the workpiece 25, protecting the f ⁇ lens 4.
  • a dust collection duct 12 is provided below the holder 6 to prevent spatter B1, interference gas B2, or dust B3 from being released to the outside.
  • the dust collection duct 12 is attached to the underside of the Z-axis box 16 by a first bolt joint 14 and a second bolt joint 15, and is not in contact with the holder 6.
  • a gap 8 is provided between the holder 6 and the dust collection duct 12.
  • Preventing direct contact between the dust collection duct 12 and the holder 6 prevents negative pressure vibrations of the suction device 20, which will be described later, from being transmitted to the f ⁇ lens 4.
  • the distance between the dust collection duct 12 and the Z-axis box 16 can be adjusted by adjusting the vertical nut positions of the first bolt joint 14 and the second bolt joint 15.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Prevention Of Fouling (AREA)
PCT/JP2023/024770 2023-07-04 2023-07-04 レーザ加工装置 Ceased WO2025009059A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2023/024770 WO2025009059A1 (ja) 2023-07-04 2023-07-04 レーザ加工装置
JP2023570066A JP7455289B1 (ja) 2023-07-04 2023-07-04 レーザ加工装置
TW112143004A TW202502477A (zh) 2023-07-04 2023-11-08 雷射加工裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/024770 WO2025009059A1 (ja) 2023-07-04 2023-07-04 レーザ加工装置

Publications (1)

Publication Number Publication Date
WO2025009059A1 true WO2025009059A1 (ja) 2025-01-09

Family

ID=90367106

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/024770 Ceased WO2025009059A1 (ja) 2023-07-04 2023-07-04 レーザ加工装置

Country Status (3)

Country Link
JP (1) JP7455289B1 (https=)
TW (1) TW202502477A (https=)
WO (1) WO2025009059A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113244A1 (ja) * 2009-03-31 2010-10-07 トヨタ自動車株式会社 レーザ加工装置
WO2017203862A1 (ja) * 2016-05-23 2017-11-30 パナソニックＩｐマネジメント株式会社 レーザ溶接装置、およびレーザ溶接方法
JP2019048331A (ja) * 2017-09-12 2019-03-28 株式会社東芝 溶接ヘッド及び溶接方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7503233B2 (ja) * 2020-01-07 2024-06-20 株式会社東京精密 集光レンズユニット及びレーザ加工装置
JP7473429B2 (ja) * 2020-09-10 2024-04-23 株式会社ディスコ レーザー加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113244A1 (ja) * 2009-03-31 2010-10-07 トヨタ自動車株式会社 レーザ加工装置
WO2017203862A1 (ja) * 2016-05-23 2017-11-30 パナソニックＩｐマネジメント株式会社 レーザ溶接装置、およびレーザ溶接方法
JP2019048331A (ja) * 2017-09-12 2019-03-28 株式会社東芝 溶接ヘッド及び溶接方法

Also Published As

Publication number Publication date
TW202502477A (zh) 2025-01-16
JPWO2025009059A1 (https=) 2025-01-09
JP7455289B1 (ja) 2024-03-25

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