WO2024262150A1 - 積層セラミックコンデンサ - Google Patents

積層セラミックコンデンサ Download PDF

Info

Publication number
WO2024262150A1
WO2024262150A1 PCT/JP2024/015286 JP2024015286W WO2024262150A1 WO 2024262150 A1 WO2024262150 A1 WO 2024262150A1 JP 2024015286 W JP2024015286 W JP 2024015286W WO 2024262150 A1 WO2024262150 A1 WO 2024262150A1
Authority
WO
WIPO (PCT)
Prior art keywords
external electrode
layer
glass
electrode
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2024/015286
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
敏彦 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202480033721.4A priority Critical patent/CN121175771A/zh
Priority to JP2025527512A priority patent/JPWO2024262150A1/ja
Publication of WO2024262150A1 publication Critical patent/WO2024262150A1/ja
Priority to US19/260,781 priority patent/US20250336605A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • the present invention relates to a multilayer ceramic capacitor.
  • a plating film may be placed on the surface of the external electrode of a multilayer ceramic capacitor to improve the wettability of the solder when mounting the multilayer ceramic capacitor.
  • a plating solution is usually used to form the plating film.
  • Cited Document 1 describes the placement of a layer containing sulfur in the external electrode to suppress a decrease in reliability caused by the plating solution.
  • conventional technology does not sufficiently prevent the deterioration of the reliability of multilayer ceramic capacitors.
  • the glass material contained in the external electrodes can melt during the process of forming the plating film.
  • hydrogen can diffuse into the external electrodes. The melting of the glass material and the diffusion of hydrogen into the external electrodes can lead to a decrease in the reliability of the multilayer ceramic capacitor.
  • the present invention aims to provide a multilayer ceramic capacitor with improved reliability.
  • the multilayer ceramic capacitor of the present invention is a multilayer ceramic capacitor comprising a ceramic body including a plurality of laminated dielectric layers and a plurality of laminated internal electrode layers, the ceramic body having six surfaces including a first main surface and a second main surface facing each other in a height direction, a first side surface and a second side surface facing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface facing each other in a length direction perpendicular to the height direction and the width direction, and an external electrode provided on the ceramic body and connected to a part of the internal electrode layers, the external electrode containing at least one of barium-boron-silicon glass, strontium-boron-silicon glass, or barium-strontium-boron-silicon glass as glass, and copper, the glass and the copper are exposed on the surface of the external electrode, a layer containing sulfur is formed on at least a part of the surface of the glass exposed on the surface of the external electrode, and a t
  • the present invention makes it possible to provide a multilayer ceramic capacitor with improved reliability.
  • FIG. 1 is a perspective view of a multilayer ceramic capacitor according to an embodiment of the present invention
  • 2 is a cross-sectional view taken along line II in FIG. 1.
  • 2 is a cross-sectional view taken along line II-II of FIG. 1.
  • FIG. 3 is an enlarged view of the boxed portion of FIG. 2 .
  • FIG. 1 is a diagram showing the results of an example and a comparative example.
  • Fig. 1 is a perspective view of a multilayer ceramic capacitor 1 according to an embodiment of the present invention.
  • Fig. 1 shows a two-terminal multilayer ceramic capacitor.
  • the multilayer ceramic capacitor 1 of the present invention is not limited to a two-terminal multilayer ceramic capacitor.
  • the multilayer ceramic capacitor 1 of the present invention may be a multi-terminal multilayer ceramic capacitor, such as a three-terminal multilayer ceramic capacitor.
  • the multilayer ceramic capacitor 1 includes a ceramic body 2 and a terminal electrode 20.
  • the terminal electrode 20 includes a first terminal electrode 21 and a second terminal electrode 22.
  • the ceramic body 2 includes a plurality of laminated dielectric layers 40 and a plurality of internal electrode layers 30.
  • the dielectric layers 40 and the internal electrode layers 30 are illustrated in Fig. 2.
  • the ceramic body 2 has a roughly rectangular parallelepiped shape.
  • the direction in which the dielectric layers 40 and the internal electrode layers 30 are stacked is defined as the height direction T.
  • the direction perpendicular to the height direction T is defined as the width direction W.
  • the direction perpendicular to the height direction T and the width direction W is defined as the length direction L.
  • one face is designated as the first main surface 3.
  • the remaining face is designated as the second main surface 4.
  • one face is designated as the first side surface 5.
  • the remaining face is designated as the second side surface 6.
  • one face is designated as the first end surface 7.
  • the remaining face is designated as the second end surface 8.
  • the cross section taken along line I-I in FIG. 1 is referred to as the LT cross section.
  • the cross section taken along line II-II in FIG. 1 is referred to as the WT cross section.
  • the main material of the dielectric layer 40 is a ceramic material.
  • the ceramic material are dielectric ceramics whose main components are barium titanate, calcium titanate, strontium titanate, calcium zirconate, etc.
  • the ceramic material may be a dielectric ceramic in which a secondary component such as a manganese compound, an iron compound, a chromium compound, a cobalt compound, or a nickel compound is added to these main components.
  • Figure 2 is a cross-sectional view of line I-I in Figure 1.
  • the ceramic body 2 can be divided in the height direction T into a first main surface side outer layer portion 10, an effective portion 11, and a second main surface side outer layer portion 12.
  • the first main surface side outer layer portion 10 is the portion between the internal electrode layer 30 closest to the first main surface 3 and the first main surface 3.
  • the effective portion 11 is the portion where the internal electrode layer 30 faces the internal electrode layer 30.
  • the second main surface side outer layer portion 12 is the portion between the internal electrode layer 30 closest to the second main surface 4 and the second main surface 4.
  • the dielectric layers 40 arranged on the first main surface side outer layer portion 10 and the second main surface side outer layer portion 12 are referred to as outer dielectric layers 41.
  • the dielectric layers 40 arranged on the effective portion 11 are referred to as inner dielectric layers 42.
  • the longitudinal opposing portion 14 is the portion where the internal electrode layers 30 face each other in the height direction T.
  • the first end face side outer layer portion 13 is the portion between the longitudinal opposing portion 14 and the first end face 7.
  • the second end face side outer layer portion 15 is the portion between the longitudinal opposing portion 14 and the second end face 8.
  • the longitudinal opposing portion 14 is a portion that corresponds to the opposing electrode portion in the internal electrode layer 30.
  • the first end face side outer layer portion 13 and the second end face side outer layer portion 15 are portions that correspond to the lead-out electrode portion in the internal electrode layer 30.
  • the first end face side outer layer portion 13 and the second end face side outer layer portion 15 are also called L gaps.
  • the first side surface outer layer portion 16 and the second side surface outer layer portion 18 are portions in which the internal electrode layer 30 does not exist in the height direction T.
  • the first side surface outer layer portion 16 and the second side surface outer layer portion 18 are also called W gaps.
  • the internal electrode layer 30 includes a plurality of first internal electrode layers 31 and a plurality of second internal electrode layers 32.
  • the first internal electrode layer 31 is the internal electrode layer 30 exposed at the first end face 7.
  • the second internal electrode layer 32 is the internal electrode layer 30 exposed at the second end face 8.
  • the first internal electrode layer 31 can be divided into a first opposing electrode portion 34 and a first extraction electrode portion 36.
  • the first opposing electrode portion 34 is a portion that faces the second internal electrode layer 32.
  • the first extraction electrode portion 36 is a portion that is extracted from the first opposing electrode portion 34 to the first end face 7.
  • the second internal electrode layer 32 can be divided into a second opposing electrode portion 35 and a second extraction electrode portion 37.
  • the second opposing electrode portion 35 is a portion that faces the first internal electrode layer 31.
  • the second extraction electrode portion 37 is a portion that is extracted from the second opposing electrode portion 35 to the second end face 8.
  • the material of the internal electrode layer 30 is at least one of metals such as nickel, copper, silver, palladium, and gold, and an alloy containing at least one of the aforementioned metals, such as a silver-palladium alloy.
  • capacitance is formed by the first opposing electrode portion 34 and the second opposing electrode portion 35 facing each other via the inner dielectric layer 42. This allows the multilayer ceramic capacitor 1 to exhibit capacitor characteristics.
  • the thickness of the internal electrode layer 30 is preferably 0.2 ⁇ m or more and 2.0 ⁇ m or less.
  • the total number of first internal electrode layers 31 and second internal electrode layers 32 is preferably 15 or more and 2000 or less.
  • the terminal electrodes 20 will be described.
  • the terminal electrodes 20 include a first terminal electrode 21 and a second terminal electrode 22.
  • the first terminal electrode 21 is the terminal electrode 20 connected to the first internal electrode layer 31.
  • the second terminal electrode 22 is the terminal electrode 20 connected to the second internal electrode layer 32.
  • the first terminal electrode 21 is disposed on the first end face 7, part of the first main surface 3, part of the second main surface 4, part of the first side surface 5, and part of the second side surface 6.
  • the second terminal electrode 22 is disposed on the second end face 8, part of the first main surface 3, part of the second main surface 4, part of the first side surface 5, and part of the second side surface 6.
  • the external electrodes 25 are disposed on and cover the end faces of the ceramic body 2.
  • the external electrodes 25 extend from the end faces to parts of the main surfaces and parts of the side surfaces.
  • the external electrode 25 includes glass and metal.
  • the external electrode 25 is formed by applying an electrode paste including glass and metal to the ceramic body 2 and firing it.
  • the metal includes copper.
  • the metal is included in the electrode paste as metal powder.
  • the glass includes barium-boron-silicon glass.
  • the glass is included in the electrode paste as glass powder.
  • the glass improves the adhesion between the ceramic body 2 and the external electrode 25.
  • the thickness of the external electrode 25 is preferably 3 ⁇ m or more and 20 ⁇ m or less.
  • the glass is not limited to barium-boron-silicon glass.
  • the glass can be at least one of barium-boron-silicon glass, strontium-boron-silicon glass, or barium-strontium-boron-silicon glass.
  • An electrode paste may be created by mixing a barium-boron-silicon glass powder with a strontium-boron-silicon glass powder. This allows both barium and strontium components to be added to the external electrode 25.
  • the thickness of the thickest part of the external electrode 25 formed on the first end face 7 or the second end face 8 is preferably 15 ⁇ m or less. Also, the thickness of the thickest part of the external electrode 25 formed on the first side face 5 or the second side face 6 is preferably 5 ⁇ m or less.
  • the nickel plating film 27 is disposed so as to cover the external electrodes 25.
  • the tin plating film 28 is disposed so as to cover the nickel plating film 27.
  • the thickness of the nickel plating film 27 is preferably 2 ⁇ m or more and 5 ⁇ m or less.
  • the thickness of the tin plating film 28 is preferably 3 ⁇ m or more and 5 ⁇ m or less.
  • the nickel plating film 27 prevents the external electrodes 25 from being eroded by the solder when mounting the multilayer ceramic capacitor 1.
  • the tin plating film 28 improves the wettability of the solder when mounting the multilayer ceramic capacitor 1, making mounting easier.
  • the terminal electrode 20 may include only one of the nickel plating film 27 and the tin plating film 28.
  • Length 70 is preferably 10 mm or less, more preferably 0.6 mm or less.
  • Lengths 71 and 72 are preferably 5 mm or less, more preferably 0.3 mm or less.
  • Fig. 4 is an enlarged view of the framed area 68 in Fig. 2.
  • Fig. 4 is an enlarged LT cross section of a portion of the external electrode 25.
  • the external electrode 25 contains copper 50 and barium-boron-silicon-based glass 52.
  • the barium-boron-silicon-based glass 52 is in the form of particles.
  • the barium-boron-silicon-based glass 52 is dispersed as particles in the copper 50.
  • the copper 50 and the barium-boron-silicon-based glass 52 are exposed on a surface 58 of the external electrode 25.
  • a sulfur-containing layer 56 is formed on the surface of the barium-boron-silicon glass 52 exposed on the surface 58 of the external electrode 25.
  • a tin layer 54 is formed on the surface of the copper 50 exposed on the surface 58 of the external electrode 25.
  • the nickel plating film 27 is formed on the surface of the surface 58 of the external electrode 25 on which the sulfur-containing layer 56 or the tin layer 54 is not formed, on the surface of the sulfur-containing layer 56 formed on the surface 58 of the external electrode 25, and on the surface of the tin layer 54 formed on the surface 58 of the external electrode 25.
  • the sulfur-containing layer 56 may be formed on at least a portion of the surface of the barium-boron-silicon glass 52 exposed on the surface 58 of the external electrode 25.
  • the tin layer 54 may be formed on at least a portion of the surface of the copper 50 exposed on the surface 58 of the external electrode 25.
  • a layer 56 containing sulfur is present on the surface of the barium-boron-silicon glass 52 exposed at the surface 58. Therefore, when forming a plating film, it is possible to prevent moisture from penetrating from the surface 58 of the external electrode 25 through the barium-boron-silicon glass 52 into the interior of the external electrode 25.
  • a tin layer 54 is present on the surface of the copper 50 exposed at the surface 58. Therefore, when forming a plating film, it is possible to suppress the diffusion of hydrogen atoms from the surface 58 of the external electrode 25 through the copper 50 into the interior of the external electrode 25.
  • the reliability of the multilayer ceramic capacitor 1 is improved by suppressing the intrusion of moisture and the diffusion of hydrogen atoms. In particular, sufficient moisture resistance reliability can be ensured even when the thickness of the external electrodes 25 is reduced.
  • the thickness of the sulfur-containing layer 56 and the thickness of the tin layer 54 will now be described.
  • the thickness of the sulfur-containing layer 56 is indicated by thickness 76.
  • the thickness of the nickel plating film 27 in the portion in contact with the sulfur-containing layer 56 is indicated by thickness 77.
  • the thickness of the tin layer 54 is indicated by thickness 78.
  • the thickness of the nickel plating film 27 in the portion in contact with the tin layer 54 is indicated by thickness 79.
  • the thickness ratio of the sulfur-containing layer 56 to the nickel plating film 27 in the portion in contact with the sulfur-containing layer 56 is preferably 0.07 or more and 0.56 or less. Also, the thickness ratio of the tin layer 54 to the nickel plating film 27 in the portion in contact with the tin layer 54 is preferably 0.07 or more and 0.56 or less.
  • the thickness ratio of the sulfur-containing layer 56 to the nickel plating film 27 is set to 0.07 or more and 0.56 or less, when the plating film is formed, the intrusion of moisture from the surface 58 of the external electrode 25 through the barium-boron-silicon glass 52 into the interior of the external electrode 25 is more reliably prevented.
  • the diffusion of hydrogen atoms from the surface 58 of the external electrode 25 through the copper 50 into the interior of the external electrode 25 is more reliably suppressed when the plating film is formed.
  • the thickness 76 of the sulfur-containing layer 56 is preferably 0.14 ⁇ m or more and 2.80 ⁇ m or less.
  • the thickness 78 of the tin layer 54 is preferably 0.14 ⁇ m or more and 2.80 ⁇ m or less.
  • the thickness 77 and thickness 79 of the nickel plating film 27 are preferably 2 ⁇ m or more and 5 ⁇ m or less.
  • each of thicknesses 76 to 79 is measured by observing the cross section of the relevant area.
  • the length 70 in the length direction L of the multilayer ceramic capacitor 1 is preferably 0.6 mm or less.
  • the length 71 in the height direction T and the length 72 in the width direction W of the multilayer ceramic capacitor 1 are preferably both 0.3 mm or less.
  • the thickness of the thickest part of the external electrode 25 is preferably 20 ⁇ m or less.
  • the thickness of the thickest part of the external electrode 25 formed on the first end face 7 or the second end face 8 is preferably 15 ⁇ m or less.
  • the thickness of the thickest part of the external electrode 25 formed on the first side face 5 or the second side face 6 is preferably 5 ⁇ m or less.
  • the multilayer ceramic capacitor 1 of this embodiment can ensure reliability by forming the tin layer 54 and the layer 56 containing sulfur.
  • the thickness of the external electrode 25 is thin.
  • the thickness of the external electrode 25 may be 20 ⁇ m or less at the thickest part of the external electrode 25.
  • the formation of the tin layer 54 and the layer 56 containing sulfur allows the multilayer ceramic capacitor 1 to be miniaturized, and deterioration in reliability can be suppressed even when the thickness of the external electrode 25 is thin.
  • the thickness of the thickest part of the external electrode 25 formed on the first end face 7 or the second end face 8 is 15 ⁇ m or less, and the thickness of the thickest part of the external electrode 25 formed on the first side face 5 or the second side face 6 is 15 ⁇ m or less, a decrease in reliability can be suppressed.
  • the formation of the sulfur-containing layer 56 will be described.
  • An example of the sulfur-containing layer 56 is a layer containing barium sulfate.
  • the source of barium in the barium sulfate is the barium-boron-silicon glass 52 contained as glass in the external electrode 25.
  • the ceramic body 2, on which the external electrodes 25 are formed but no plating film is formed, is immersed in an aqueous solution containing added sulfuric acid.
  • an aqueous solution containing added sulfuric acid By immersing the ceramic body 2 in the aqueous sulfuric acid solution, the barium oxide contained in the barium-boron-silicon glass 52 reacts with the sulfuric acid. As a result, barium sulfate is formed on the surface of the barium-boron-silicon glass 52. This barium sulfate is a poorly soluble salt.
  • the sulfur-containing layer 56 is formed on the surface of the barium-boron-silicon glass 52 that is exposed to the surface 58 of the external electrode 25. This is because sulfuric acid comes into contact with the surface of the barium-boron-silicon glass 52 that is exposed to the surface 58 of the external electrode 25.
  • the formation of the tin layer 54 will be described.
  • the tin layer 54 is formed by a substitution reaction between the nickel plating and the tin media, and the dissolved tin ions are reprecipitated on the copper.
  • the formation of the tin layer 54 can be performed using a barrel plating device or the like.
  • the ceramic body 2, on which the external electrode 25 is formed but no plating film is formed, and media containing tin are placed in the barrel plating device.
  • the tin layer 54 can then be formed by stirring without applying current.
  • FIG. 5 shows the evaluation results of the example and the comparative example.
  • the ceramic body 2 is the same in the example and the comparative example.
  • the ceramic body 2 has nickel internal electrodes exposed alternately on both end faces.
  • the length of the ceramic body 2 in the length direction L is 0.4 mm
  • the length in the height direction T is 0.2 mm
  • the length in the width direction W is 0.2 mm.
  • the electrode paste for the external electrodes 25 was prepared by kneading the following materials in a roll mill.
  • the glass powder was of three types: barium-boron-silicon glass, strontium-boron-silicon glass, and barium-strontium-boron-silicon glass.
  • 4 ⁇ m diameter flat copper powder 67.8wt% Glass (powder): 8.3 wt% Acrylic resin: 6.6 wt% Terpineol: 17.3 wt%
  • the glass in Example 1, Comparative Example 1A, and Comparative Example 1B is a barium-boron-silicon glass.
  • the glass in Example 2, Comparative Example 2A, and Comparative Example 2B is a strontium-boron-silicon glass.
  • the glass in Example 3, Comparative Example 3A, and Comparative Example 3B is a barium-strontium-boron-silicon glass.
  • the electrode paste was applied to the ceramic body 2, and the applied electrode paste was fired. First, one end face of the ceramic body 2 was immersed in the electrode paste. It was then dried at 100 degrees for 10 minutes. Next, the other end face was similarly immersed in the electrode paste and dried. Next, the electrode paste was fired at 800 degrees in nitrogen gas. This resulted in a chip on which an external electrode 25 was formed.
  • the obtained chips were placed in an electrolytic plating barrel together with tin media.
  • the electrolytic plating barrel was immersed in a nickel plating bath containing sulfate ions and stirred without applying current.
  • the plating bath was a Watts bath. This process formed barium sulfate on the surface of the glass.
  • the barium sulfate is layer 56 containing sulfur.
  • This treatment also causes a substitution reaction between the nickel plating and the tin media, causing the dissolved tin to be redeposited on the copper surface.
  • This tin originates from the media.
  • the precipitated tin is tin layer 54.
  • the tin plating film 28 was formed under the following conditions.
  • Type of plating bath Neutral plating bath pH of plating bath: 6.0 Plating bath temperature: 25 degrees Current value: 3A Plating time: 66 minutes
  • the samples of the examples and comparative examples were subjected to a moisture resistance reliability evaluation and a film structure analysis.
  • the moisture resistance reliability evaluation will be explained.
  • the moisture resistance reliability evaluation was performed by a PCBT test.
  • the conditions of the PCBT (Pressure Cooker Bias Test) test were as follows. Temperature: 125 degrees Relative humidity: 95% Applied voltage: 3.2 V Load time: 72 hours Number of samples: 15 After the PCBT test, the insulation resistance (IR) of each sample was measured. When the LogIR value at the end of the PCBT test was reduced by 0.5 or more from the start of the test, it was considered that the IR had deteriorated.
  • the film structure analysis will be described.
  • the sample was embedded in resin, polished, and cross-sectioned. After that, the polished surface was processed five times using a high-performance focused ion beam (FIB) device (Hitachi High-Tech SMI-3050R).
  • FIB high-performance focused ion beam
  • the cross section was taken at the position of the frame 68 in FIG. 2.
  • a layer containing sulfur was formed on the glass on the surface 58 of the external electrode 25 with a thickness of 0.4 ⁇ m or more and 1.0 ⁇ m or less.
  • a tin layer 54 was formed on the copper on the surface 58 of the external electrode 25 with a thickness of 0.6 ⁇ m or more and 1.0 ⁇ m or less.
  • a layer 56 containing sulfur was formed on the glass on the surface 58 of the external electrode 25 to a thickness of 0.4 ⁇ m or more and 1.0 ⁇ m or less.
  • No tin layer 54 was formed on the copper on the surface 58 of the external electrode 25.
  • the tin layer 54 was not formed, and the sulfur-containing layer 56 was only sparsely formed.
  • the nickel plating film was formed, a small amount of the sulfur-containing layer was formed on the glass, but this was insufficient to prevent moisture from penetrating the external electrode 25.
  • the tin layer 54 was not formed on the copper, the moisture resistance reliability was extremely low.
  • one end of the surface of the barium-boron-silicon glass 52 exposed to the surface 58 of the external electrode 25 is indicated by point 91, and the other end is indicated by point 92.
  • the length from point 91 to point 92 on the surface of the barium-boron-silicon glass 52 exposed to the surface 58 of the external electrode 25 is indicated by length 93.
  • the percentage of the length 93 where the sulfur-containing layer 56 is in contact with the barium-boron-silicon glass 52 is the sulfur coverage. It is preferable that the sulfur coverage is 67.0% or more.
  • the method for measuring the length and thickness of each part will be described below when the measurement method is not otherwise specified.
  • the multilayer ceramic capacitor 1 is polished to the center position in the width direction W.
  • the LT cross section exposed by polishing is then observed with an optical microscope.
  • the length or thickness is measured from the observed LT cross section.
  • a method for manufacturing the multilayer ceramic capacitor 1 will be described. First, a dielectric sheet that will become the dielectric layer 40 and a conductive paste that will become the internal electrode layer 30 are prepared.
  • the dielectric sheet and the conductive paste contain a binder and a solvent.
  • the binder and the solvent may be a known organic binder and organic solvent, etc.
  • a conductive paste is printed on the dielectric sheet in a specified pattern.
  • the pattern of the internal electrode layer 30 is formed by printing the conductive paste.
  • the printing is performed by screen printing, gravure printing, or the like.
  • a predetermined number of dielectric sheets that will become the outer layers are stacked. No conductive paste is printed on the dielectric sheets that will become the outer layers. A predetermined number of dielectric sheets on which the pattern of the internal electrode layer 30 is printed are stacked on top of the stacked dielectric sheets. A predetermined number of dielectric sheets that will become the outer layers are stacked on top of these. A laminated sheet is produced by stacking these layers.
  • the number of dielectric sheets to be stacked is preferably 15 or more and 2000 or less.
  • the thickness of each dielectric sheet is preferably 0.3 ⁇ m or more and 10 ⁇ m or less.
  • the laminated block is cut to a specified size. This cutting process cuts out laminated chips. When cutting, the corners and edges of the laminated chips may be rounded. The rounding process is done by barrel polishing.
  • the laminated chip is fired. This firing produces a ceramic body.
  • the preferred firing temperature is 900 degrees or higher and 1110 degrees or lower. The firing temperature can be changed depending on the material of the dielectric layer 40 and the material of the internal electrode layer 30.
  • the terminal electrodes 20 are formed.
  • an electrode paste that will become the external electrodes 25 is applied to the two end faces of the ceramic body 2.
  • the electrode paste contains glass, metal, etc.
  • the electrode paste is applied by a method such as dipping.
  • firing is performed to form the external electrodes 25.
  • the firing temperature is preferably 500 degrees or higher and 900 degrees or lower.
  • the firing time is preferably 30 minutes or higher and 2 hours or lower.
  • a nickel plating film 27 is formed on the surface of the external electrode 25. Furthermore, a tin plating film 28 is formed on the surface of the nickel plating film 27.
  • the nickel plating film 27 and the tin plating film 28 are formed by a barrel plating method.
  • tin media is added. It is then stirred in the barrel plating bath without applying current. This forms the tin layer 54.
  • the sulfur-containing layer 56 is formed during stirring without current in the barrel plating bath as described above, and during stirring with current.
  • a ceramic body including a plurality of laminated dielectric layers and a plurality of laminated internal electrode layers, the ceramic body having six surfaces including a first main surface and a second main surface opposed to each other in a height direction, a first side surface and a second side surface opposed to each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposed to each other in a length direction perpendicular to the height direction and the width direction; an external electrode provided on the ceramic body and connected to a part of the internal electrode layers, the external electrodes contain, as glass, at least one of barium-boron-silicon glass, strontium-boron-silicon glass, or barium-strontium-boron-silicon glass, and copper; the glass and the copper are exposed on a surface of the external electrode; a layer containing sulfur is formed on at least a portion of the surface of the glass exposed on a surface of the external electrode, A tin layer is formed on at least a portion of
  • ⁇ 2> a surface of the external electrode on which the sulfur-containing layer or the tin layer is not formed; a surface of the sulfur-containing layer formed on the surface of the external electrode; a nickel plating film is formed on the surface of the tin layer formed on the surface of the external electrode; a thickness ratio of the sulfur-containing layer to the nickel plating film at a portion in contact with the sulfur-containing layer; and The thickness ratio of the tin layer to the nickel plating film at the portion in contact with the tin layer is 0.07 or more and 0.56 or less.
  • the length in the longitudinal direction is 0.6 mm or less, The length in the height direction and the length in the width direction are both 0.3 mm or less, The thickness of the thickest part of the external electrode is 20 ⁇ m or less.
  • the thickness of the thickest portion of the external electrode formed on the first end face or the second end face is 15 ⁇ m or less;
  • the thickness of the thickest portion of the external electrode formed on the first side surface or the second side surface is 5 ⁇ m or less.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2024/015286 2023-06-21 2024-04-17 積層セラミックコンデンサ Ceased WO2024262150A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202480033721.4A CN121175771A (zh) 2023-06-21 2024-04-17 层叠陶瓷电容器
JP2025527512A JPWO2024262150A1 (https=) 2023-06-21 2024-04-17
US19/260,781 US20250336605A1 (en) 2023-06-21 2025-07-07 Multilayer ceramic capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023101656 2023-06-21
JP2023-101656 2023-06-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US19/260,781 Continuation US20250336605A1 (en) 2023-06-21 2025-07-07 Multilayer ceramic capacitor

Publications (1)

Publication Number Publication Date
WO2024262150A1 true WO2024262150A1 (ja) 2024-12-26

Family

ID=93935074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/015286 Ceased WO2024262150A1 (ja) 2023-06-21 2024-04-17 積層セラミックコンデンサ

Country Status (4)

Country Link
US (1) US20250336605A1 (https=)
JP (1) JPWO2024262150A1 (https=)
CN (1) CN121175771A (https=)
WO (1) WO2024262150A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003082492A (ja) * 2001-09-13 2003-03-19 Murata Mfg Co Ltd チップ型セラミックス電子部品の電極形成法
JP2007016290A (ja) * 2005-07-08 2007-01-25 Murata Mfg Co Ltd めっき装置、及びめっき方法、並びに積層セラミック電子部品の製造方法
WO2007119281A1 (ja) * 2006-03-15 2007-10-25 Murata Manufacturing Co., Ltd. 積層型電子部品およびその製造方法
JP2012199353A (ja) * 2011-03-22 2012-10-18 Murata Mfg Co Ltd 積層セラミック電子部品およびその製造方法
JP2013110363A (ja) * 2011-11-24 2013-06-06 Tdk Corp セラミック電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003082492A (ja) * 2001-09-13 2003-03-19 Murata Mfg Co Ltd チップ型セラミックス電子部品の電極形成法
JP2007016290A (ja) * 2005-07-08 2007-01-25 Murata Mfg Co Ltd めっき装置、及びめっき方法、並びに積層セラミック電子部品の製造方法
WO2007119281A1 (ja) * 2006-03-15 2007-10-25 Murata Manufacturing Co., Ltd. 積層型電子部品およびその製造方法
JP2012199353A (ja) * 2011-03-22 2012-10-18 Murata Mfg Co Ltd 積層セラミック電子部品およびその製造方法
JP2013110363A (ja) * 2011-11-24 2013-06-06 Tdk Corp セラミック電子部品

Also Published As

Publication number Publication date
US20250336605A1 (en) 2025-10-30
JPWO2024262150A1 (https=) 2024-12-26
CN121175771A (zh) 2025-12-19

Similar Documents

Publication Publication Date Title
KR101670980B1 (ko) 적층 세라믹 전자부품
KR101670974B1 (ko) 적층 세라믹 전자부품
JP7516709B2 (ja) 積層セラミック電子部品
JP4311124B2 (ja) チップ型電子部品
US20210175016A1 (en) Multilayer ceramic electronic component
US12148573B2 (en) Multilayer ceramic electronic component with a stress applied Ni plated layer
CN111755247B (zh) 层叠陶瓷电容器以及层叠陶瓷电容器的制造方法
KR102946062B1 (ko) 적층형 전자 부품
JP2023075920A (ja) 積層セラミック電子部品
CN114551098A (zh) 多层电子组件
KR20230100425A (ko) 적층 세라믹 커패시터 및 이의 제조방법
WO2024262150A1 (ja) 積層セラミックコンデンサ
CN112420388B (zh) 层叠陶瓷电容器、电路板和层叠陶瓷电容器的制造方法
US20250336604A1 (en) Multilayer ceramic capacitor
JP4470463B2 (ja) セラミック電子部品の製造方法
US20260128231A1 (en) Multilayer ceramic capacitor
US20260088228A1 (en) Multilayer ceramic component
US20260058061A1 (en) Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
US20250372311A1 (en) Multilayer ceramic capacitor
CN121729750A (zh) 层叠陶瓷电容器
CN116612984A (zh) 层叠陶瓷电容器以及层叠陶瓷电容器的制造方法
CN121905708A (zh) 多层陶瓷电容器
CN121748170A (zh) 层叠陶瓷电容器
JP2023107723A (ja) 積層型電子部品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24825560

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2025527512

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE