WO2024255329A1 - 扬声器模组和电子设备 - Google Patents

扬声器模组和电子设备 Download PDF

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Publication number
WO2024255329A1
WO2024255329A1 PCT/CN2024/079728 CN2024079728W WO2024255329A1 WO 2024255329 A1 WO2024255329 A1 WO 2024255329A1 CN 2024079728 W CN2024079728 W CN 2024079728W WO 2024255329 A1 WO2024255329 A1 WO 2024255329A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover body
speaker module
cavity
partition net
connecting segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/079728
Other languages
English (en)
French (fr)
Inventor
王琳琛
胡橙
张学宇
刘金华
刘卫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Publication of WO2024255329A1 publication Critical patent/WO2024255329A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the embodiments of the present application relate to the technical field of electronic devices, and in particular to a speaker module and an electronic device.
  • Speaker modules are used to convert audio electrical signals such as music and voice into sound for playback, and therefore are increasingly used in electronic devices such as mobile phones, tablets, and laptops.
  • the assembly process of the speaker module is relatively complicated, resulting in a low assembly efficiency of the speaker module.
  • the embodiments of the present application provide a speaker module and an electronic device, which are used to solve the problem of low assembly efficiency of the speaker module.
  • the present application provides a speaker module.
  • the speaker module includes a shell, a core and a partition net.
  • the shell encloses a storage space with an opening.
  • the storage space includes a first cavity and a second cavity.
  • the second cavity is arranged at the periphery of the first cavity. At least a portion of the first cavity is arranged opposite to the opening.
  • the core includes a magnetic bowl.
  • the magnetic bowl is arranged in the first cavity, and the magnetic bowl is opposite to the opening.
  • the partition net is arranged between the first cavity and the second cavity. Air holes are formed on the partition net.
  • the air holes connect the first cavity and the second cavity.
  • the shell includes a first cover body with an opening, and a second cover body arranged opposite to the first cover body.
  • the partition net is integrally formed with the first cover body; and/or, the partition net is integrally formed with the second cover body.
  • the speaker module of the embodiment of the present application sets the magnetic bowl of the core in the first cavity, and makes the magnetic bowl face the opening on the shell so that the magnetic bowl can be exposed, so that the shell does not need to completely cover the core, thereby reducing the thickness of the speaker module, which is conducive to the thinning of the speaker module, and further to reducing the thickness of the electronic device.
  • the partition net set between the first cavity and the second cavity is integrally formed with the first cover body, and/or the partition net is integrally formed with the second cover body, which can improve the connection strength and simplify the assembly steps of the speaker module, thereby helping to improve the assembly efficiency of the speaker module. It can also avoid the extra components in the related art occupying the space of the second cavity, which is conducive to improving the low-frequency performance of the speaker module.
  • the first cover body when the partition net is integrally formed with the first cover body, the first cover body includes a first connecting segment, a second connecting segment extending from the edge of the first connecting segment toward and away from the second cover body, and a third connecting segment connected to the end of the second connecting segment, the third connecting segment is parallel to the first connecting segment, and the third connecting segment is connected to the partition net.
  • the volume of the space defined between the third connecting section and the first connecting section can be increased, and the height of the partition net can also be increased, which is beneficial to improving the low-frequency performance and sound loudness of the speaker module, and further beneficial to improving the user experience.
  • the speaker module further includes: a first connecting member, the first connecting member simultaneously connects the partition net and the second cover body, and a portion of the first connecting member extends into a side of the inner core away from the opening and abuts against the inner core.
  • the partition net and the second cover body can be connected by the first connecting member while supporting the inner core, which can avoid the need to provide additional components to support the inner core, thereby facilitating cost reduction.
  • the thickness of the third connecting section is greater than or equal to 0.03 mm.
  • the height of the partition net can be increased while ensuring the structural strength of the third connecting section, so that the air permeability area between the first cavity and the second cavity can be larger.
  • an orthographic projection of an outer contour of the vent hole on a plane perpendicular to the first connecting section at least partially overlaps with an orthographic projection of the second connecting section on a plane perpendicular to the first connecting section.
  • the overlapping part of the orthographic projection of the partition net on the plane perpendicular to the first connecting section and the orthographic projection of the second connecting section on the plane perpendicular to the first connecting section can be additionally provided with air holes, so that the total opening area of the air holes on the partition net can be increased, which is beneficial to improve the air flow between the first cavity and the second cavity, thereby helping to improve the low-frequency performance of the speaker module.
  • the second cover body when the partition net and the second cover body are integrally formed, the second cover body includes a fourth connecting segment, a fifth connecting segment extending from the edge of the fourth connecting segment in a direction away from the first cover body, and a sixth connecting segment connected to the end of the fifth connecting segment, wherein the fourth connecting segment is connected to the partition net and is arranged opposite to the first cover body, and the sixth connecting segment extends to the side of the inner core away from the opening and abuts against the inner core.
  • the volume of the second cavity can be increased, and the height of the partition net can be increased, which is beneficial to improving the low-frequency performance and sound loudness of the speaker module, thereby improving the user experience.
  • a distance between an edge of the fourth connecting segment close to the first cover body and an edge of the sixth connecting segment away from the first cover body is greater than or equal to 0.12 mm.
  • the height of the partition net can be increased while ensuring the structural strength of the second cover body, so that the air permeability area between the first cavity and the second cavity can be larger.
  • the partition net can make full use of the area covered in the relevant technology, so that the total opening area of the air holes set on the partition net can be increased, which is beneficial to improve the flow of air between the first cavity and the second cavity, and further beneficial to improve the low-frequency performance and sound loudness of the speaker module.
  • the partition net can make full use of the area covered in the relevant technology, so that the total opening area of the air holes set on the partition net can be increased, which is beneficial to improve the flow of air between the first cavity and the second cavity, and further beneficial to improve the low-frequency performance and sound loudness of the speaker module.
  • first spacing between the center of some of the air holes and the edge of the first cover body there is a first spacing between the center of some of the air holes and the edge of the first cover body, the first spacing is greater than or equal to 0 and less than or equal to 0.25 mm.
  • second spacing between the center of some of the air holes and the edge of the second cover body the second spacing is greater than or equal to 0 and less than or equal to 0.25 mm.
  • the total number of openings of the air holes provided on the partition net can be reduced.
  • the area can be increased, which is beneficial to improving the flow of air between the first cavity and the second cavity, and further beneficial to improving the low-frequency performance and sound loudness of the speaker module.
  • the ratio of the total opening area of the air holes to the area of the partition mesh is greater than or equal to 50%.
  • the area for airflow between the first cavity and the second cavity can be guaranteed, thereby ensuring the low-frequency performance and sound loudness of the speaker module, which is conducive to improving the user experience.
  • At least one of the first cover, the partition net, and the second cover is made of steel.
  • the present application provides an electronic device, comprising a screen, a back shell, a circuit board, and a speaker module according to any of the above technical solutions.
  • the screen comprises a light-transmitting cover plate and a display screen arranged in a stacked manner.
  • the back shell comprises a frame and a back cover. The light-transmitting cover plate, the frame and the back cover together enclose a storage space for the electronic device.
  • the display screen, the circuit board, and the speaker module are located in the storage space.
  • the core of the speaker module is electrically connected to the circuit board.
  • a sound outlet hole is provided on the frame. The sound outlet channel of the speaker module is connected to the sound outlet hole.
  • the technical effects brought about by any design method in the second aspect can refer to the technical effects brought about by different design methods in the first aspect, and will not be repeated here.
  • FIG1 is a perspective view of an electronic device provided in an embodiment of the present application.
  • FIG2 is an exploded view of an electronic device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of a cross-sectional structure of the electronic device described in FIG1 along the A-A direction;
  • FIG4 is an exploded view of a speaker module provided in an embodiment of the present application.
  • FIG5 is a schematic diagram of the structure of a speaker module in the related art
  • FIG6 is a cross-sectional view of a speaker module provided in an embodiment of the present application.
  • FIG7 is a partial stereoscopic view of a first speaker module provided in an embodiment of the present application.
  • FIG8 is a partial stereoscopic view of a second speaker module provided in an embodiment of the present application.
  • FIG9 is a partial stereoscopic view of a third speaker module provided in an embodiment of the present application.
  • FIG10 is a schematic diagram of a cross-sectional structure of the speaker module shown in FIG7 along the B-B direction;
  • FIG11 is a schematic diagram of a cross-sectional structure of the speaker module shown in FIG8 along the C-C direction;
  • FIG12 is a schematic diagram of a cross-sectional structure of the speaker module shown in FIG9 along the D-D direction;
  • FIG13 is a performance comparison diagram of solution A and solution B provided in an embodiment of the present application in a cavity state
  • FIG14 is a performance comparison diagram of Solution A and Solution B provided in the embodiment of the present application after filling 0.15cc of powder;
  • FIG. 15 is a performance comparison chart of Solution A and Solution B provided in the embodiment of the present application after filling with 0.2cc of powder.
  • the terms "exemplary” or “for example” are used to indicate examples, illustrations or descriptions. Any embodiment or design described as “exemplary” or “for example” in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as “exemplary” or “for example” is intended to present related concepts in a specific way.
  • first and second are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the term “and/or” refers to and covers any and all possible combinations of one or more of the associated listed items.
  • the term “and/or” is a description of the association relationship of associated objects, indicating that three relationships may exist.
  • a and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone.
  • the character "/" in the present application generally indicates that the associated objects before and after are in an "or" relationship.
  • connection can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.
  • fixed connection means that the two are connected to each other and the relative position relationship after the connection remains unchanged.
  • directional terms mentioned in the embodiments of the present application such as “inside”, “outside”, etc., are only references to the directions of the accompanying drawings.
  • the embodiment of the present application provides an electronic device, which is a type of electronic device with a speaker module.
  • the electronic device includes but is not limited to mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, notebook computers, vehicle-mounted devices, wearable devices, walkmans, radios and other electronic devices.
  • PDAs personal digital assistants
  • wearable devices include but are not limited to smart bracelets, smart watches, smart head-mounted displays, smart glasses, etc.
  • Figure 1 is a three-dimensional diagram of an electronic device provided in an embodiment of the present application.
  • the embodiment of the present application and the embodiments below are exemplified by taking the electronic device as a mobile phone.
  • the electronic device is approximately in the shape of a rectangular plate.
  • an XYZ coordinate system is established, and the width direction of the electronic device is defined as the X-axis direction, the length direction of the electronic device is defined as the Y-axis direction, and the thickness direction of the electronic device is defined as the Z-axis direction.
  • the coordinate system direction of the electronic device can be flexibly set according to actual needs, and no specific limitation is made here.
  • the shape of the electronic device can be a square flat plate, a circular flat plate, an elliptical flat plate, etc., which are not specifically limited here.
  • FIG. 2 is an exploded view of an electronic device provided by the present application.
  • the electronic device 100 includes a screen 10 , a back cover 20 , a circuit board 30 , and a speaker module 40 .
  • Figures 1 and 2 only schematically illustrate that the electronic device 100 includes some components, and the actual shape, size, position and structure of these components are not limited by Figures 1 and 2 and the following figures. In some other embodiments, the electronic device 100 may not include the screen 10.
  • the screen 10 is used to display images, videos, etc.
  • the screen 10 includes a light-transmitting cover plate 11 and a display screen 12.
  • the light-transmitting cover plate 11 and the display screen 12 are stacked and fixedly connected.
  • the light-transmitting cover plate 11 is mainly used to protect the display screen 12 and prevent dust.
  • the material of the light-transmitting cover plate 11 includes but is not limited to glass.
  • the display screen 12 can be a flexible display screen or a rigid display screen.
  • the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (mini) display screen, a micro organic light-emitting diode (micro) display screen, a micro organic light-emitting diode (micro) display screen, a quantum dot light emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.
  • OLED organic light-emitting diode
  • AMOLED active-matrix organic light-emitting diode
  • mini mini organic light-emitting diode
  • micro organic light-emitting diode micro organic light-emitting diode
  • micro micro organic light-emitting diode
  • QLED quantum dot light emitting diode
  • LCD liquid crystal display
  • the back shell 20 forms a shell of the electronic device, and is used to protect the internal electronic components of the electronic device 100.
  • the back shell 20 may include a back cover 21 and a frame 22.
  • the back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11, and is stacked and spaced with the light-transmitting cover plate 11 and the display screen 12.
  • the frame 22 is located between the back cover 21 and the light-transmitting cover plate 11.
  • the frame 22 can be fixed on the back cover 21.
  • the frame 22 can be fixedly connected to the back cover 21 by adhesive, and the frame 22 can also be an integrally formed structure with the back cover 21, that is, the frame 22 and the back cover 21 are a structural component as a whole.
  • the light-transmitting cover plate 11 can be fixed on the frame 22 by gluing.
  • the light-transmitting cover plate 11, the back cover 21 and the frame 22 together enclose the storage space of the electronic device 100.
  • the storage space accommodates the display screen 12, the circuit board 30 and the speaker module 40.
  • the back shell 20 may further include a middle plate 23.
  • the middle plate 23 is arranged in the above-mentioned storage space, and the middle plate 23 is located on the side of the display screen 12 away from the light-transmitting cover plate 11.
  • the edge of the middle plate 23 is fixed to the frame 22.
  • the edge of the middle plate 23 can be fixed to the frame 22 by gluing, and the middle plate 23 can also be an integrally formed structure with the frame 22, that is, the middle plate 23 and the frame 22 are a structural component as a whole.
  • the display screen 12 can be located on the side of the middle plate 23 close to the light-transmitting cover plate 11, and the circuit board 30 and the speaker module 40 can be located on the side of the middle plate 23 close to the back cover 21. It should be noted that the whole formed by connecting the middle plate 23 and the frame 22 is also called the middle frame. In some other embodiments, the back shell 20 may also not include the middle plate 23.
  • the circuit board 30 is used to set electronic components and realize electrical connection between various electronic components.
  • the circuit board 30 may include a main circuit board 31 and a sub-circuit board 32.
  • the main circuit board 31 and the sub-circuit board 32 are arranged in a partial space between the middle plate 23 and the back cover 21, and are stacked with the back cover 21.
  • the main circuit board 31 and the sub-circuit board 32 are fixed on the middle plate 23.
  • the main circuit board 31 is used to integrate a control chip.
  • the control chip may be, for example, an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal flash storage (UFS).
  • AP application processor
  • DDR double data rate synchronous dynamic random access memory
  • UFS universal flash storage
  • the main circuit board 31 is electrically connected to the display screen 12, and the main circuit board 31 is used to control the display screen 12 to display images or videos.
  • the main circuit board 31 can be a hard circuit board, a flexible circuit board, or a combination of hard and soft circuit boards.
  • the main circuit board 31 can be a FR-4 dielectric board, a Rogers dielectric board, or a mixed dielectric board of FR-4 and Rogers, etc.
  • FR-4 is a code for a flame retardant material grade
  • Rogers dielectric The board is a high frequency board.
  • the auxiliary circuit board 32 is used to integrate electronic components such as the antenna (such as a 5G antenna) radio frequency front end, universal serial bus (USB) devices, and vibrators.
  • the antenna such as a 5G antenna
  • USB universal serial bus
  • the auxiliary circuit board 32 may be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board.
  • the auxiliary circuit board 32 can be made of a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on.
  • the auxiliary circuit board 32 is electrically connected to the main circuit board 31 through the connection structure 50 to achieve data and signal transmission between the auxiliary circuit board 32 and the main circuit board 31.
  • the connection structure 50 includes but is not limited to a flexible printed circuit (FPC), a wire, an enameled wire, or a structure formed by weaving a wire and a flexible material.
  • the speaker module 40 is located on the inner side of the back shell 20.
  • the inner side of the back shell 20 refers to the side of the back shell 20 facing the aforementioned storage space.
  • the speaker module 40 is electrically connected to the circuit board 30.
  • the speaker module 40 can be electrically connected to the main circuit board 31, and can also be electrically connected to the auxiliary circuit board 32.
  • audio electrical signals such as music and voice can be obtained from the circuit board 30, and the speaker module 40 is used to restore the audio electrical signals into sound for playback.
  • FIG. 3 is a schematic diagram of the cross-sectional structure of the electronic device 100 shown in FIG. 1 along the A-A direction.
  • the speaker module 40 has a sound outlet channel 46.
  • the sound signal output by the speaker module 40 is output by the sound outlet channel 46.
  • the frame 22 is provided with a sound outlet hole 221.
  • the sound outlet channel 46 is connected to the sound outlet hole 221.
  • the sound output by the sound outlet channel 46 is further output to the outside of the electronic device 100 by the sound outlet hole 221.
  • the speaker module 40 includes a housing 41, a core 42 and a partition 43.
  • the housing 41 includes a first cover 411 and a second cover 412 disposed opposite to each other.
  • FIG5 is a schematic diagram of the structure of the speaker module in the related art.
  • the partition net and the shell of the speaker module are separate molded parts, and it is necessary to set additional parts to connect the partition net and the shell.
  • the use of additional parts to connect increases the difficulty of assembling the speaker module, making the assembly efficiency of the speaker module slower.
  • the parts will also cover part of the surface of the partition net, so that the area where the air holes can be set on the partition net becomes smaller. For example, when the partition net is connected to the first cover body and the second cover body by plastic, it is first necessary to locate the installation position of the partition net, the first cover body and the second cover body, and then connect them by plastic, so that the assembly efficiency of the speaker module is slower.
  • the plastic When the plastic is connected to the partition net and the first cover body, it will cover the area of the partition net surface size W1, so that the surface of the partition net is reduced by the area of size W1.
  • the plastic When the plastic is connected to the partition net and the second cover body, it will cover the area of the partition net surface size W2, so that the surface of the partition net is reduced by the area of size W2, thereby reducing the height of the partition net, so that the area where the air holes can be set on the partition net is reduced.
  • the relevant technology may not be a public document.
  • FIG. 6 is a cross-sectional view of a speaker module 40 provided in an embodiment of the present application.
  • the present application provides a speaker module 40.
  • a housing 41 is surrounded by a receiving space 44 having an opening 443.
  • the opening 443 allows the receiving space 44 to communicate with the space outside the housing 41.
  • the housing 41 includes a first cover 411 having an opening 443 and a second cover 412 disposed opposite to the first cover 411. Specifically, in the thickness direction of the speaker module 40 (Z-axis direction as shown in FIG6 ), the first cover 411 and the second cover 412 are disposed opposite to each other.
  • the thickness direction of the speaker module 40 refers to the direction that is consistent with the thickness direction of the electronic device 100 when the speaker module 40 is installed in the electronic device 100.
  • the thickness direction of the speaker module 40 is also the Z-axis direction mentioned above.
  • the accommodating space 44 includes a first cavity 441 and a second cavity 442.
  • the second cavity 442 is arranged at the periphery of the first cavity 441.
  • the second cavity 442 can be arranged around the periphery of the first cavity 441.
  • the second cavity 442 can be filled with sound-absorbing particles.
  • the sound-absorbing particles can improve the low-frequency performance and sound loudness of the speaker module 40 without increasing the physical volume of the second cavity 442 of the speaker module 40.
  • the material of the sound-absorbing particles includes but is not limited to one or more of melamine, zeolite particles, glass fiber, and activated carbon.
  • At least part of the first cavity 441 is disposed opposite to the opening 443. Specifically, part of the first cavity 441 may be disposed opposite to the opening 443. Alternatively, the entire first cavity 441 may be disposed opposite to the opening 443.
  • “at least part of the first cavity 441 is disposed opposite to the opening 443” means that the orthographic projection of the outer contour of at least part of the first cavity 441 on the plane where the opening 443 is located is located within the outer contour of the opening 443.
  • the inner core 42 includes a magnetic bowl 421.
  • the magnetic bowl 421 is disposed in the first cavity 441, and the magnetic bowl 421 is opposite to the opening 443.
  • the inner core 42 may be disposed as a whole in the first cavity 441. Since the thickness of the inner core 42 itself is relatively large, in order to avoid increasing the thickness of the speaker module 40 by adding the shell 41 on both sides of the inner core 42 along the Z-axis direction, the magnetic bowl 421 is exposed by placing the magnetic bowl 421 opposite to the opening 443, so that the shell 41 does not need to completely cover the inner core 42, thereby reducing the thickness of the speaker module 40, which is beneficial to the thinning of the speaker module 40, and further beneficial to reducing the thickness of the electronic device 100.
  • the core 42 can be used to block the opening 443. That is, the inner edge of the opening 443 is sealed with the core 42.
  • the sealed connection between the inner edge of the opening 443 and the core 42 can be sealed by filling a sealant.
  • the sealing method using the sealant is easy to operate and is suitable for sealing gaps of different shapes and has a wide range of applications.
  • the sealant includes but is not limited to one or more of a shadowless glue, polyurethane, silicone rubber, polysulfide rubber, chloroprene rubber and epoxy resin sealant.
  • FIG. 7 is a partial stereoscopic view of the first speaker module 40 provided in the embodiment of the present application.
  • the partition net 43 is arranged between the first cavity 441 and the second cavity 442.
  • An air hole 431 is formed on the partition net 43.
  • the air hole 431 connects the first cavity 441 and the second cavity 442. In other words, the air flow in the first cavity 441 can flow into the second cavity 442 through the air hole 431.
  • the size of the air holes 431 needs to be smaller than the size of the sound-absorbing particles. Therefore, since the sound-absorbing particles are located on the side of the partition 43 away from the core 42, and the size of the air holes 431 is smaller than the size of the sound-absorbing particles, the partition 43 can be used to prevent the sound-absorbing particles from entering the core 42 while connecting the first cavity 441 and the second cavity 442, thereby avoiding the partition 43 from interfering with the movement of the core 42, which is beneficial to improving the reliability of the operation of the speaker module 40.
  • the partition net 43 can be integrally formed with the first cover 411. This arrangement can improve the connection strength between the partition net 43 and the first cover 411, and can simplify the assembly steps of the speaker module 40, thereby facilitating the improvement of the assembly efficiency of the speaker module 40. At the same time, the connection between the partition net 43 and the first cover 411 will not be covered, so that the area of the air holes 431 on the partition net 43 can be increased compared with the related art.
  • a guide slope may be provided at the connection between the partition net 43 and the first cover body 411, so that the filling of the sealant is facilitated.
  • FIG. 8 is a partial stereoscopic view of the second speaker module 40 provided in an embodiment of the present application.
  • the partition net 43 can be integrally formed with the second cover body 412.
  • Such a configuration can improve the connection strength between the partition net 43 and the second cover body 412, and can simplify the assembly steps of the speaker module 40, thereby helping to improve the assembly efficiency of the speaker module 40.
  • the connection between the partition net 43 and the second cover body 412 will not be covered, so that the area where the air vent 431 can be set on the partition net 43 can be increased compared to that in the related art.
  • FIG. 9 is a partial stereogram of the third speaker module 40 provided in an embodiment of the present application.
  • the partition net 43 can be integrally formed with the first cover body 411 and the second cover body 412. Such a setting can improve the connection strength between the partition net 43 and the first cover body 411 and the second cover body 412, and can further simplify the assembly steps of the speaker module 40, thereby facilitating the improvement of the assembly efficiency of the speaker module 40.
  • the area of the air vent 431 that can be set on the partition net 43 can be increased compared with that in the related art.
  • the magnetic bowl 421 of the core 42 in the first cavity 441, and making the magnetic bowl 421 opposite to the opening 443 on the shell 41, the magnetic bowl 421 can be exposed, so that the shell 41 does not need to completely cover the core 42, thereby reducing the thickness of the speaker module 40, which is conducive to the thinning of the speaker module 40, and further conducive to reducing the thickness of the electronic device 100.
  • the partition net 43 set between the first cavity 441 and the second cavity 442 is integrally formed with the first cover 411, and/or the partition net 43 is integrally formed with the second cover 412, which can improve the connection strength, and can simplify the assembly steps of the speaker module 40, thereby facilitating the improvement of the assembly efficiency of the speaker module 40. It can also avoid the additional components occupying the space of the second cavity 442 in the related art, thereby facilitating the improvement of the low-frequency performance of the speaker module 40.
  • FIG. 10 is a schematic diagram of the cross-sectional structure of the speaker module 40 described in FIG. 7 along the B-B direction.
  • the first cover body 411 when the partition net 43 is integrally formed with the first cover body 411, the first cover body 411 includes a first connecting segment 4111, a second connecting segment 4112 extending from the edge of the first connecting segment 4111 in a direction away from the second cover body 412, and a third connecting segment 4113 connected to the end of the second connecting segment 4112.
  • the third connecting segment 4113 is parallel to the first connecting segment 4111.
  • the third connecting segment 4113 is connected to the partition net 43.
  • first connecting segment 4111, the second connecting segment 4112 and the third connecting segment 4113 are connected in sequence, wherein one end of the second connecting segment 4112 is connected to the first connecting segment 4111, and the other end of the second connecting segment 4112 extends in a direction away from the second cover body 412 and is connected to the third connecting segment 4113.
  • the partition net 43 and the first cover body 411 are integrally formed, and the second connecting section 4112 is inclined, and the third connecting section 4113 is parallel to the first connecting section 4111, compared with the original second cavity 442, the volume of the space defined between the third connecting section 4113 and the first connecting section 4111 can be increased, and the height of the partition net 43 can also be increased, which is beneficial to improve the low-frequency performance and sound loudness of the speaker module 40, and further helps to improve the user experience.
  • parallel means approximately parallel within a certain error range
  • the error range may be a range where the deviation angle relative to absolute parallelism is less than or equal to 5°.
  • the thickness H1 of the third connecting section 4113 is greater than or equal to 0.03 mm along the thickness direction of the speaker module 40.
  • the height of the partition net 43 can be increased while ensuring the structural strength of the third connecting section 4113, so that the air permeability area between the first cavity 441 and the second cavity 442 can be larger.
  • the thickness H1 of the third connecting section 4113 may be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm or 0.08 mm, etc.
  • the orthographic projection of the outer contour of the air hole 431 on the plane perpendicular to the first connecting section 4111 at least partially overlaps with the orthographic projection of the second connecting section 4112 on the plane perpendicular to the first connecting section 4111.
  • the orthographic projection of the partition net 43 on the plane perpendicular to the first connecting section 4111 and the orthographic projection of the second connecting section 4112 on the plane perpendicular to the first connecting section 4111 overlap each other and can be additionally provided with air holes 431, so that the total opening area of the air holes 431 on the partition net 43 can be increased, which is beneficial to improve the air flow between the first cavity 441 and the second cavity 442, thereby improving the low-frequency performance of the speaker module 40.
  • the speaker module 40 further includes a first connecting member 45.
  • the first connecting member The first connecting member 45 connects the partition net 43 and the second cover body 412 at the same time.
  • Part of the first connecting member 45 extends into the side of the inner core 42 away from the opening 443 and abuts against the inner core 42.
  • part of the partition net 43 extends into the first connecting member 45, so that the partition net 43 is connected to the first connecting member 45
  • part of the second cover body 412 extends into the first connecting member 45, so that the second cover body 412 is connected to the first connecting member 45.
  • the inner core 42 can be supported while the partition net 43 and the second cover body 412 are connected by the first connecting member 45, and it can be avoided to set up additional components to support the inner core 42, which is conducive to reducing costs.
  • the first connecting member 45 can be plastic, and the plastic includes but is not limited to polycarbonate (PC), PC+glass fiber and ABS plastic (acrylonitrile butadiene styrene plastic).
  • PC polycarbonate
  • PC+glass fiber PC+glass fiber
  • ABS plastic acrylonitrile butadiene styrene plastic
  • the first connecting member 45 is formed in a horizontal "L" shape, and the first connecting member 45 includes a first section 451 and a second section 452 connected in sequence.
  • the first section 451 connects the partition net 43 and the second cover 412 at the same time, and the second section 452 extends in a direction away from the second cavity 442 and extends into a side of the inner core 42 away from the opening 443 to abut against the inner core 42.
  • FIG. 11 is a schematic diagram of the cross-sectional structure of the speaker module 40 described in FIG. 8 along the C-C direction.
  • the second cover body 412 when the partition net 43 is integrally formed with the second cover body 412, the second cover body 412 includes a fourth connecting segment 4121, a fifth connecting segment 4122 extending from the edge of the fourth connecting segment 4121 in a direction away from the first cover body 411, and a sixth connecting segment 4123 connected to the end of the fifth connecting segment 4122.
  • the fourth connecting segment 4121 is connected to the partition net 43 and is arranged opposite to the first cover body 411, and the sixth connecting segment 4123 extends to the side of the inner core 42 away from the opening 443 and abuts against the inner core 42.
  • the fourth connecting segment 4121, the fifth connecting segment 4122 and the sixth connecting segment 4123 can define a positioning step for positioning the inner core 42. Since the partition net 43 and the second cover body 412 are integrally formed, the volume of the second cavity 442 can be increased compared to the related art, and the height of the partition net 43 can also be increased, which is beneficial to improving the low-frequency performance and sound loudness of the speaker module 40, thereby improving the user experience. At the same time, it is also convenient to install the core 42.
  • the fifth connecting segment 4122 and the sixth connecting segment 4123 may be perpendicular to each other. This arrangement can increase the contact area between the sixth connecting segment 4123 and the core 42, thereby ensuring support for the core 42 and improving the reliability of the speaker module 40.
  • the distance H2 between the edge of the fourth connecting segment 4121 close to the first cover body 411 and the edge of the sixth connecting segment 4123 away from the first cover body 411 is greater than or equal to 0.12 mm.
  • the height of the partition net 43 can be increased while ensuring the structural strength of the second cover body 412, so that the air permeability area between the first cavity 441 and the second cavity 442 can be larger.
  • the value of the interval H2 may be 0.12 mm, 0.13 mm, 0.14 mm or 0.15 mm, etc.
  • the speaker module 100 further includes a second connecting member 47, and the second connecting member 47 is connected to both the first cover 411 and the partition net 43.
  • the second connecting member 47 is similar to the first connecting member 45, and will not be described in detail herein.
  • Fig. 12 is a schematic diagram of the cross-sectional structure of the speaker module 40 along the D-D direction described in Fig. 9.
  • the partition net 43 is integrally formed with the first cover body 411 and the second cover body 412, it is the same as the above description and will not be repeated here.
  • the speaker module 40 there are multiple air holes 431.
  • the first spacing L1 is greater than or equal to 0 and less than or equal to 0.25 mm.
  • the center of the air hole 431 can be located at the edge of the first cover body 411, and the air hole 431 can be formed in a semicircular shape.
  • the partition net 43 can make full use of the covered area in the related art, so that the total opening area of the air holes 431 set on the partition net 43 can be increased, which is beneficial to improve the first cavity 441 and The flow of air between the second cavities 442 is beneficial to improving the low-frequency performance and sound loudness of the speaker module 40.
  • "multiple" means two or more.
  • the first spacing L1 is also applicable to the embodiment shown in FIG. 10 .
  • the value of the first spacing L1 can be 0mm, 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0mm or 0.25mm, etc.
  • the center of the air hole 431 can be located at the edge of the second cover body 412, and the air hole 431 can be formed into a semicircular shape.
  • the partition net 43 can make full use of the area covered in the relevant technology, so that the total opening area of the air hole 431 on the partition net 43 can be increased, which is conducive to improving the flow of air between the first cavity 441 and the second cavity 442, and then It is beneficial to improve the low-frequency performance and sound loudness of the speaker module 40.
  • the second spacing L2 is also applicable to the embodiment shown in Figure 11.
  • the value of the second spacing L2 can be 0mm, 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0mm or 0.25mm, etc.
  • first spacing L1 between the center of some of the air holes 431 and the edge of the first cover body 411.
  • the first spacing L1 is greater than or equal to 0 and less than or equal to 0.25 mm.
  • second spacing L2 between the center of some of the air holes 431 and the edge of the second cover body 412, and the second spacing L2 is greater than or equal to 0 and less than or equal to 0.25 mm. This arrangement can increase the total air permeability area of the partition net 43.
  • the total opening area of the air holes 431 set on the partition net 43 can be increased, which is beneficial to improve the flow of air between the first cavity 441 and the second cavity 442, and further beneficial to improve the low-frequency performance and sound loudness of the speaker module 40.
  • Figure 13 is a performance comparison diagram of the scheme A and scheme B provided in the embodiment of the present application in the cavity state
  • Figure 14 is a performance comparison diagram of the scheme A and scheme B provided in the embodiment of the present application after filling 0.15cc of powder
  • Figure 15 is a performance comparison diagram of the scheme A and scheme B provided in the embodiment of the present application after filling 0.2cc of powder.
  • the solid line in Figures 13 to 15 represents scheme A
  • the dotted line represents scheme B
  • the horizontal axis represents the frequency of the speaker module 40
  • the vertical axis represents the sensitivity of the speaker module 40.
  • Table 1 By arranging the data of Figures 13, 14 and 15, Table 1 can be obtained.
  • the number of air holes 431 can be increased, thereby improving the air flow between the first cavity 441 and the second cavity 442, so that the sensitivity of the speaker module 40 can be improved, which is beneficial to improving the low-frequency performance and sound loudness of the speaker module 40.
  • the ratio of the total opening area of the vent holes 431 to the area of the partition net 43 is greater than or equal to 50%.
  • the ratio of the total opening area of the vent holes 431 to the area of the partition net 43 the area of air flow between the first cavity 441 and the second cavity 442 can be guaranteed, so that the low-frequency performance and sound loudness of the speaker module 40 can be guaranteed, which is conducive to improving the user experience.
  • the ratio of the total opening area of the air pores 431 to the area of the partition net 43 can be 50%, 52%, 55%, 58%, 60%, 62%, 65%, 68%, 70%, 72%, 75%, 78%, 80%, 82%, 85% or 90%, etc.
  • At least one of the first cover 411, the partition 43, and the second cover 412 is made of steel. Since steel has high structural strength, it can be lightweight while ensuring structural strength. It is also easy to process and helps reduce costs.
  • the materials of the first cover 411 , the partition 43 , and the second cover 412 may all include steel.
  • a filling port (not shown) may be provided on the second cover 412.
  • the shape of the filling port includes but is not limited to circular, square, polygonal, etc.
  • the filling port is connected to a portion of the rear cavity. Sound-absorbing particles may be poured into the second cavity 442 through the filling port.
  • a cover may be provided on the filling port, and the cover is used to close the filling port. Specifically, the cover may be covered on the edge of the first shell 41 at the filling port by bonding or the like.

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Abstract

本申请提供一种扬声器模组和电子设备，涉及电子设备技术领域，用于解决扬声器模组装配效率较慢的问题。扬声器模组包括壳体、内核和隔网。壳体围成具有开口的容纳空间。容纳空间包括第一腔体和第二腔体。第二腔体设置在第一腔体的外周。至少部分第一腔体与开口相对设置。内核包括磁碗。磁碗设置于第一腔体内，且磁碗与开口相对。隔网设置于第一腔体和第二腔体之间。隔网上形成有透气孔。透气孔连通第一腔体和第二腔体。其中，壳体包括具有开口的第一盖体、以及与第一盖体相对设置的第二盖体。隔网与第一盖体一体成型；和/或，隔网与第二盖体一体成型。

Description

扬声器模组和电子设备
本申请要求于2023年06月12日提交国家知识产权局、申请号为202321499087.2、发明名称为“扬声器模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及电子设备技术领域，尤其涉及一种扬声器模组和电子设备。
背景技术
扬声器模组用于将音乐、语音等音频电信号还原成声音进行播放，因此在手机、平板电脑、笔记本电脑等电子设备中得到了越来越广泛的应用。
相关技术中，扬声器模组的装配过程较为复杂，使得扬声器模组的装配效率较慢。
发明内容
本申请实施例提供一种扬声器模组和电子设备，用于解决扬声器模组的装配效率较慢的问题。
为达到上述的目的，本申请的实施例采用如下技术方案：
第一方面，本申请提供一种扬声器模组。扬声器模组包括壳体、内核和隔网。壳体围成具有开口的容纳空间。容纳空间包括第一腔体和第二腔体。第二腔体设置在第一腔体的外周。至少部分第一腔体与开口相对设置。内核包括磁碗。磁碗设置于第一腔体内，且磁碗与开口相对。隔网设置于第一腔体和第二腔体之间。隔网上形成有透气孔。透气孔连通第一腔体和第二腔体。其中，壳体包括具有开口的第一盖体、以及与第一盖体相对设置的第二盖体。隔网与第一盖体一体成型；和/或，隔网与第二盖体一体成型。
本申请实施例的扬声器模组，通过将内核的磁碗设置于第一腔体内，并使磁碗与壳体上的开口相对，使磁碗可以外露，使得壳体无需完全包覆内核，从而可以减小扬声器模组的厚度，有利于扬声器模组的薄型化，进而有利于减小电子设备的厚度。同时将设置在第一腔体和第二腔体之间的隔网与第一盖体一体成型，和/或，隔网与第二盖体一体成型，可以提高其连接强度，并且可以简化扬声器模组的装配步骤，从而有利于提高扬声器模组的装配效率。并且可以避免相关技术中额外零部件占用第二腔体的空间，从而有利于提高扬声器模组的低频性能。
在一种可能实现的方式中，当隔网与第一盖体一体成型时，第一盖体包括第一连接段、自第一连接段的边缘向远离第二盖体方向延伸的第二连接段、以及连接于第二连接段末端的第三连接段，第三连接段与第一连接段平行，第三连接段与隔网连接。
由此，可以增加第三连接段到第一连接段之间的所限定的空间的体积，也可以增加隔网的高度，从而有利于提高扬声器模组的低频性能和声音响度，进而有利于提高用户的使用体验。
在一种可能实现的方式中，扬声器模组还包括：第一连接件，第一连接件同时连接隔网和第二盖体，部分第一连接件伸入内核远离开口的一侧，并与内核抵接。
由此，可以通过第一连接件连接隔网与第二盖体的同时对内核进行支撑，可以避免设置额外的部件对内核进行支撑，从而有利于降低成本。
在一种可能实现的方式中，沿扬声器模组的厚度方向，第三连接段的厚度大于或者等于0.03mm。
通过限制第三连接段的厚度，可以在保证第三连接段的结构强度的同时，增加隔网的高度，使第一腔体与第二腔体之间的透气面积可以更大。
在一种可能实现的方式中，透气孔的外轮廓在垂直于第一连接段的平面上的正投影，与第二连接段在垂直于第一连接段的平面上的正投影至少部分重合。
由此，隔网在垂直于第一连接段的平面上的正投影，与第二连接段垂直于第一连接段的平面上的正投影的重合部分可以额外设置透气孔，使隔网上透气孔的开孔总面积可以得到增加，有利于提高第一腔体和第二腔体之间的气流流动，从而有利于提高扬声器模组的低频性能。
在一种可能实现的方式中，当隔网与第二盖体一体成型时，第二盖体包括第四连接段、自第四连接段的边缘向远离第一盖体方向延伸的第五连接段、以及连接于第五连接段末端的第六连接段，其中，第四连接段与隔网连接且与第一盖体相对设置，第六连接段延伸至内核远离开口的一侧，并与内核抵接。
由此，可以增加第二腔体的体积，也可以增加隔网的高度，从而有利于提高扬声器模组的低频性能和声音响度，进而有利于提高用户的使用体验。同时也便于对内核进行安装。
在一种可能实现的方式中，在扬声器模组的厚度方向上，第四连接段的靠近第一盖体的边缘与第六连接段的远离第一盖体的边缘之间的间距大于或者等于0.12mm。
通过限制四连接段的靠近第一盖体的边缘与第六连接段的远离第一盖体的边缘之间的间距，可以在保证第二盖体的结构强度的同时增加隔网的高度，使第一腔体与第二腔体之间的透气面积可以更大。
在一种可能实现的方式中，在扬声器模组的厚度方向上，透气孔的数量为多个，部分透气孔的中心与第一盖体的边缘之间具有第一间距，第一间距大于或等于0且小于或者等于0.25mm。
由此，通过限定第一间距的取值范围，使隔网可以充分利用相关技术中被覆盖的面积，使隔网上设置透气孔的开孔总面积可以得到增加，从而有利于提高第一腔体和第二腔体之间的气流的流动，进而有利于提高扬声器模组的低频性能和声音响度。
在一种可能实现的方式中，部分透气孔的中心与第二盖体的边缘之间具有第二间距，第二间距大于或等于0且小于或者等于0.25mm。
由此，通过限定第二间距的取值范围，使隔网可以充分利用相关技术中被覆盖的面积，使隔网上设置透气孔的开孔总面积可以得到增加，从而有利于提高第一腔体和第二腔体之间的气流的流动，进而有利于提高扬声器模组的低频性能和声音响度。
在一种可能实现的方式中，部分透气孔的中心与第一盖体的边缘之间具有第一间距，第一间距大于或等于0且小于或者等于0.25mm。部分透气孔的中心与第二盖体的边缘之间具有第二间距，第二间距大于或等于0且小于或者等于0.25mm。
由此，通过限定第一间距和第二间距的取值范围，使隔网上设置透气孔的开孔总 面积可以得到增加，从而有利于提高第一腔体和第二腔体之间的气流的流动，进而有利于提高扬声器模组的低频性能和声音响度。
在一种可能实现的方式中，透气孔的开孔总面积与隔网面积的比值大于或者等于50％。
通过限定透气孔开孔总面积与隔网面积的比值，可以保证第一腔体和第二腔体之间气流流动的面积，从而使扬声器模组的低频性能和声音响度可以得到保障，有利于提高用户的使用体验。
在一种可能实现的方式中，第一盖体、隔网、以及第二盖体中的至少一个的材料包括钢。
由于钢的结构强度高，可以在保证结构强度的同时实现轻薄化的。同时加工便利，有利于降低成本。
第二方面，本申请提供一种电子设备，包括屏幕、背壳、电路板、以及如上任一技术方案的扬声器模组。屏幕包括层叠设置的透光盖板和显示屏。背壳包括边框和背盖。透光盖板、边框和背盖共同围成电子设备的收纳空间。显示屏、电路板、以及扬声器模组位于收纳空间内。扬声器模组的内核与电路板电连接。边框上设有出声孔。扬声器模组的出声通道与出声孔连通。
其中，第二方面中任一种设计方式所带来的技术效果可参见第一方面中不同设计方式所带来的技术效果，此处不再赘述。
附图说明
图1为本申请实施例提供的电子设备的立体图；
图2为本申请实施例提供的电子设备的爆炸图；
图3为图1所述的电子设备沿A-A向的截面结构示意图；
图4为本申请实施例提供的扬声器模组的分解图；
图5为相关技术中扬声器模组的结构示意图；
图6为本申请实施例提供的扬声器模组的剖视图；
图7为本申请实施例提供的第一种扬声器模组的局部立体图；
图8为本申请实施例提供的第二种扬声器模组的局部立体图；
图9为本申请实施例提供的第三种扬声器模组的局部立体图；
图10为图7所述的扬声器模组沿B-B向的截面结构的示意图；
图11为图8所述的扬声器模组沿C-C向的截面结构的示意图；
图12为图9所述的扬声器模组沿D-D向的截面结构的示意图；
图13为本申请实施例提供的方案A与方案B在空腔状态下的性能对比图；
图14为本申请实施例提供的方案A与方案B在灌粉0.15cc后的性能对比图；
图15为本申请实施例提供的方案A与方案B在灌粉0.2cc后的性能对比图。
附图标记:
100、电子设备；
10、屏幕；11、透光盖板；12、显示屏；
20、背壳；21、背盖；22、边框；221、出声孔；23、中板；
30、电路板；31、主电路板；32、副电路板；
40、扬声器模组；41、壳体；411、第一盖体；4111、第一连接段；4112、第二连
接段；4113、第三连接段；412、第二盖体；4121、第四连接段；4122、第五连接段；4123、第六连接段；42、内核；421、磁碗；43、隔网；431、透气孔；44、容纳空间；441、第一腔体；442、第二腔体；443、开口；45、第一连接件；451、第一段；452、第二段；46、出声通道；47、第二连接件；
50、连接结构。
具体实施方式
在本申请实施例中，术语“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。
在本申请实施例中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
在本申请实施例的描述中，术语“和/或”是指并且涵盖相关联的所列出的项目中的一个或多个项目的任何和全部可能的组合。术语“和/或”，是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本申请中的字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，“连接”可以是可拆卸地连接，也可以是不可拆卸地连接；可以是直接连接，也可以通过中间媒介间接连接。其中，“固定连接”是指彼此连接且连接后的相对位置关系不变。另外，本申请实施例中所提到的方位用语，例如，“内”、“外”等，仅是参考附图的方向，因此，使用的方位用语是为了更好、更清楚地说明及理解本申请实施例，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。
本申请实施例提供一种电子设备，该电子设备为具有扬声器模组的一类电子设备。具体地，该电子设备包括但不限于手机、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、个人数码助理(personal digital assistant，PDA)、个人计算机、笔记本电脑、车载设备、可穿戴设备、随身听、收音机等电子设备。其中，可穿戴设备包括但不限于智能手环、智能手表、智能头戴显示器、智能眼镜等。
请参阅图1，图1为本申请实施例提供的电子设备的立体图。本申请实施例以及下文各实施例是以电子设备为手机进行示例性说明。电子设备近似呈矩形板状。在此基础上，为了方便后文各实施例的描述，建立XYZ坐标系，定义电子设备的宽度方向为X轴方向，电子设备的长度方向为Y轴方向，电子设备的厚度方向为Z轴方向。可以理解的是，电子设备的坐标系方向可以根据实际需要进行灵活设置，在此不做具体限定。在其他一些实施例中，电子设备的形状可以为方形平板状、圆形平板状、椭圆形平板状等，在此不做具体限定。
请一并参阅图1和图2，图2为本申请实施提供的电子设备的爆炸图。在本实施例中， 电子设备100包括屏幕10、背壳20、电路板30、以及扬声器模组40。
可以理解的是，图1和图2仅示意性的示出了电子设备100包括一些部件，这些部件的实际形状、实际大小、实际位置和实际构造不受图1和图2以及下文各附图限定。在其他一些实施例中，电子设备100也可以不包括屏幕10。
屏幕10用于显示图像、视频等。屏幕10包括透光盖板11和显示屏12。透光盖板11与显示屏12层叠设置并固定连接。透光盖板11主要用于对显示屏12起到保护以及防尘作用。透光盖板11的材质包括但不限于玻璃。显示屏12可以采用柔性显示屏，也可以采用刚性显示屏。例如，显示屏12可以为有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，迷你发光二极管(mini organic light-emitting diode)显示屏，微型发光二极管(micro organic light-emitting diode)显示屏，微型有机发光二极管(micro organic light-emitting diode)显示屏，量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏，液晶显示屏(liquid crystal display，LCD)。
背壳20形成电子设备的壳体，用于保护电子设备100的内部电子器件。背壳20可以包括背盖21和边框22。背盖21位于显示屏12远离透光盖板11的一侧，并与透光盖板11、显示屏12层叠且间隔设置。边框22位于背盖21与透光盖板11之间。边框22可以固定于背盖21上，示例性的，边框22可以通过粘胶固定连接于背盖21上，边框22也可以与背盖21为一体成型结构，即边框22与背盖21为一个结构件整体。透光盖板11可以通过胶粘固定于边框22上。透光盖板11、背盖21与边框22共同围成电子设备100的收纳空间。该收纳空间将显示屏12、电路板30和扬声器模组40容纳在内。
请继续参阅图2，在一些实施例中，背壳20还可以包括中板23。中板23设置于上述收纳空间内，且中板23位于显示屏12远离透光盖板11的一侧。中板23的边缘与边框22固定。一些实施例中，中板23的边缘可以通过胶粘固定于边框22上，中板23也可以与边框22为一体成型结构，即中板23与边框22为一个结构件整体。显示屏12可以位于中板23靠近透光盖板11的一侧，电路板30和扬声器模组40可以位于中板23靠近背盖21的一侧。需要说明的是，中板23与边框22连接成的整体也称之为中框。在其他一些实施例中，背壳20也可以不包括中板23。
电路板30用于设置电子元器件并实现各个电子元器件之间的电连接。在一些实施例中，请继续参阅图2，电路板30可以包括主电路板31和副电路板32。主电路板31和副电路板32设置于中板23与背盖21之间的部分空间内，并与背盖21层叠设置。一些实施例中，请参阅图2，主电路板31、副电路板32均固定于中板23上。
主电路板31用于集成控制芯片。控制芯片例如可以为应用处理器(application processor，AP)、双倍数据率同步动态随机存取存储器(double data rate，DDR)以及通用存储器(universal flash storage，UFS)等。一些实施例中，主电路板31与显示屏12电连接，主电路板31用于控制显示屏12显示图像或视频。
主电路板31可以为硬质电路板，也可以为柔性电路板，还可以为软硬结合电路板。主电路板31可以采用FR-4介质板，也可以采用罗杰斯(Rogers)介质板，还可以采用FR-4和Rogers的混合介质板，等等。这里，FR-4是一种耐燃材料等级的代号，Rogers介质 板为一种高频板。
副电路板32用于集成天线(比如5G天线)射频前端、通用串行总线(universal serial bus，USB)器件、振子等电子元器件。
副电路板32可以为硬质电路板，也可以为柔性电路板，还可以为软硬结合电路板。
副电路板32可以采用FR-4介质板，也可以采用罗杰斯(Rogers)介质板，还可以采用FR-4和Rogers的混合介质板，等等。
副电路板32通过连接结构50与主电路板31电连接，以实现副电路板32与主电路板31之间的数据、信号传输。其中，连接结构50包括但不限于柔性电路板(flexible printed circuit，FPC)、导线、漆包线或者由导线及柔性材料编织形成的结构。
扬声器模组40位于背壳20的内侧。背壳20的内侧是指背壳20朝向前述收纳空间的一侧。扬声器模组40与电路板30电连接。具体地，扬声器模组40可以与主电路板31电连接，也可以与副电路板32电连接。由此，可以从电路板30获取音乐、语音等音频电信号，扬声器模组40用于将该音频电信号还原成声音进行播放。
请参阅图3，图3为图1所述的电子设备100沿A-A向的截面结构示意图。扬声器模组40具有出声通道46。扬声器模组40输出的声音信号由该出声通道46输出。边框22上设有出声孔221。出声通道46与出声孔221连通。出声通道46输出的声音进一步由该出声孔221输出至电子设备100外。
请参阅图4，图4为本申请实施例提供的扬声器模组40的分解图。在一些实施例中，扬声器模组40包括壳体41、内核42和隔网43。壳体41包括相对设置的第一盖体411和第二盖体412。
请参阅图5，图5为相关技术中扬声器模组的结构示意图。相关技术中，扬声器模组的隔网与壳体为分体成型件，则需要通过设置额外的零部件以将隔网与壳体进行连接。采用额外零部件连接的方式增加了扬声器模组的装配难度，使得扬声器模组的装配效率较慢。并且该零部件也会覆盖隔网的部分表面，使得隔网上可以设置透气孔的面积变小。例如，通过塑胶将隔网与第一盖体连接和第二盖体连接时，首先需要对隔网、第一盖体和第二盖体的安装位置进行定位，再通过塑胶进行连接，使得扬声器模组的装配效率较慢。当塑胶在连接隔网与第一盖体时，会覆盖隔网表面尺寸为W1的面积，使得隔网的表面减小尺寸为W1的面积。塑胶在连接隔网与第二盖体时，会覆盖隔网表面尺寸为W2的面积，使得隔网的表面减小尺寸为W2的面积，从而减小了隔网的高度，使得隔网上可以设置透气孔的面积变小。需要说明的是，相关技术可以不是公开的文件。
请参阅图6，图6为本申请实施例提供的扬声器模组40剖视图。为了解决上述的技术问题，本申请提供一种扬声器模组40。壳体41围成具有开口443的容纳空间44。其中，开口443使容纳空间44可以与壳体41外的空间连通。
壳体41包括具有开口443的第一盖体411、以及与第一盖体411相对设置的第二盖体412。具体地，在扬声器模组40的厚度方向上(如图6所示的Z轴方向)，第一盖体411与第二盖体412相对设置。
在上述的实施例中，扬声器模组40的厚度方向是指当扬声器模组40安装于电子设备100内时，与电子设备100的厚度方向一致的方向。该扬声器模组40的厚度方向也即是前文所述的Z轴方向。
容纳空间44包括第一腔体441和第二腔体442。第二腔体442设置在第一腔体441的外周。示例性的，第二腔体442可以环绕设置在第一腔体441的外周。示例性的，第二腔体442内可以灌装吸音颗粒。吸音颗粒可以在不增加扬声器模组40的第二腔体442物理体积的同时，提升扬声器模组40的低频性能和声音响度。其中，吸音颗粒的材料包括但不限于三聚氰胺类、沸石颗粒、玻璃纤维、活性炭中的一种或者多种。
至少部分第一腔体441与开口443相对设置。具体地，可以是部分第一腔体441与开口443相对设置。也可以是第一腔体441整体与开口443相对设置。其中，“至少部分第一腔体441与开口443相对设置”是指，至少部分第一腔体441的外轮廓在开口443所在平面的正投影位于开口443的外轮廓内。
内核42包括磁碗421。磁碗421设置于第一腔体441内，且磁碗421与开口443相对。具体地，可以是内核42整体设置在第一腔体441内。由于内核42自身的厚度较大，为了避免在内核42沿Z轴方向的两侧增加壳体41使得扬声器模组40的厚度增加，通过将磁碗421与开口443相对，使磁碗421可以外露，使得壳体41无需完全包覆内核42，从而可以减小扬声器模组40的厚度，有利于扬声器模组40的薄型化，进而有利于减小电子设备100的厚度。
需要说明的是，内核42可以用于封堵开口443。即开口443的内边缘与内核42之间为密封连接。开口443的内边缘与内核42之间的密封连接可以通过填充密封胶的方式进行密封。采用密封胶的密封的方式，操作方便，且适于密封不同形状的间隙，适用范围广。其中，密封胶包括但不限于无影胶、聚氨酯、硅橡胶、聚硫橡胶、氯丁橡胶和环氧树脂密封胶中的一种或多种。
请参阅图7，图7为本申请实施例提供的第一种扬声器模组40的局部立体图。隔网43设置于第一腔体441和第二腔体442之间。隔网43上形成有透气孔431。透气孔431连通第一腔体441和第二腔体442。也就是说，位于第一腔体441内的气流可以通过透气孔431流入第二腔体442内。
其中，透气孔431的尺寸需小于吸音颗粒的尺寸。由此，由于吸音颗粒位于隔网43远离内核42的一侧，且透气孔431的尺寸小于吸音颗粒的尺寸，则隔网43可以在连通第一腔体441和第二腔体442的同时用于阻止吸音颗粒进入内核42内，从而避免隔网43对内核42的运动产生干涉，有利于提高扬声器模组40运行的可靠性。
在一些实施例中，隔网43可以与第一盖体411一体成型。这样设置可以提高隔网43与第一盖体411之间的连接强度，并且可以简化扬声器模组40的装配步骤，从而有利于提高扬声器模组40的装配效率。同时隔网43与第一盖体411的连接处不会被覆盖，使得隔网43上可以设置透气孔431的面积相比于相关技术中的可以得到增加。
其中，当隔网43与第一盖体411一体成型时，隔网43与第一盖体411的连接处可以设有导斜面，这样设置便于密封胶的填充。
请参阅图8，图8为本申请实施例提供的第二种扬声器模组40的局部立体图。在另一些实施例中，隔网43可以与第二盖体412一体成型。这样设置可以提高隔网43与第二盖体412之间的连接强度，并且可以简化扬声器模组40的装配步骤，从而有利于提高扬声器模组40的装配效率。同时隔网43与第二盖体412的连接处不会被覆盖，使得隔网43上可以设置透气孔431的面积相比于相关技术中的可以得到增加。
请参阅图9，图9为本申请实施例提供的第三种扬声器模组40的局部立体图。在又一些实施例中，隔网43可以与第一盖体411和第二盖体412一体成型。这样设置可以提高隔网43与第一盖体411和第二盖体412之间的连接强度，并且可以进一步简化扬声器模组40的装配步骤，从而有利于提高扬声器模组40的装配效率。同时使得隔网43上可以设置透气孔431的面积相比于相关技术中的可以得到增加。
根据本申请实施例的扬声器模组40，通过将内核42的磁碗421设置于第一腔体441内，并使磁碗421与壳体41上的开口443相对，使磁碗421可以外露，使得壳体41无需完全包覆内核42，从而可以减小扬声器模组40的厚度，有利于扬声器模组40的薄型化，进而有利于减小电子设备100的厚度。同时将设置在第一腔体441和第二腔体442之间的隔网43与第一盖体411一体成型，和/或，隔网43与第二盖体412一体成型，可以提高其连接强度，并且可以简化扬声器模组40的装配步骤，从而有利于提高扬声器模组40的装配效率。并且可以避免相关技术中额外零部件占用第二腔体442的空间，从而有利于提高扬声器模组40的低频性能。
请参阅图10，图10为图7所述的扬声器模组40沿B-B向的截面结构的示意图。在一些实施例中，当隔网43与第一盖体411一体成型时，第一盖体411包括第一连接段4111、自第一连接段4111的边缘向远离第二盖体412方向延伸的第二连接段4112、以及连接于第二连接段4112末端的第三连接段4113。第三连接段4113与第一连接段4111平行。第三连接段4113与隔网43连接。具体地，第一连接段4111、第二连接段4112和第三连接段4113依次连接，其中，第二连接段4112的一端与第一连接段4111连接，第二连接段4112的另一端向远离第二盖体412的方向延伸，并与第三连接段4113连接。由于隔网43与第一盖体411一体成型，且第二连接段4112倾斜设置，第三连接段4113与第一连接段4111平行，则相比于原先的第二腔体442，可以增加第三连接段4113到第一连接段4111之间的所限定的空间的体积，也可以增加隔网43的高度，从而有利于提高扬声器模组40的低频性能和声音响度，进而有利于提高用户的使用体验。
其中，“平行”表示允许一定误差范围内的大致平行，该误差范围可以为相对于绝对平行偏差角度小于或者等于5°的范围。
请继续参阅图10，在一些实施例中，沿扬声器模组40的厚度方向，第三连接段4113的厚度H1大于或者等于0.03mm。通过限制第三连接段4113的厚度H1，可以在保证第三连接段4113的结构强度的同时，增加隔网43的高度，使第一腔体441与第二腔体442之间的透气面积可以更大。
示例性的，沿扬声器模组40的厚度方向，第三连接段4113的厚度H1的取值可以为0.03mm、0.04mm、0.05mm、0.06mm、0.07mm或0.08mm等。
请继续参阅图10，在一些实施例中，透气孔431的外轮廓在垂直于第一连接段4111的平面上的正投影，与第二连接段4112在垂直于第一连接段4111的平面上的正投影至少部分重合。由此，隔网43在垂直于第一连接段4111的平面上的正投影，与第二连接段4112垂直于第一连接段4111的平面上的正投影的重合部分可以额外设置透气孔431，使隔网43上透气孔431的开孔总面积可以得到增加，有利于提高第一腔体441和第二腔体442之间的气流流动，从而有利于提高扬声器模组40的低频性能。
请继续参阅图10，在一些实施例中，扬声器模组40还包括第一连接件45。第一连接 件45同时连接隔网43和第二盖体412。部分第一连接件45伸入内核42远离开口443的一侧，并与内核42抵接。具体地，隔网43的部分伸入第一连接件45内，使隔网43与第一连接件45连接，第二盖体412的部分伸入第一连接件45内，使第二盖体412与第一连接件45连接。由此，可以通过第一连接件45连接隔网43与第二盖体412的同时对内核42进行支撑，可以避免设置额外的部件对内核42进行支撑，从而有利于降低成本。
其中，第一连接件45可以为塑胶，塑胶包括但不限于聚碳酸酯(polycarbonate，PC)、PC+玻璃纤维和ABS塑料(acrylonitrile butadiene styrene plastic)。
示例性的，第一连接件45形成为横置的“L”形，第一连接件45包括依次连接的第一段451和第二段452。第一段451同时连接隔网43与第二盖体412，第二段452向远离第二腔体442的方向延伸，并伸入内核42远离开口443的一侧与内核42抵接。
请参阅图11，图11为图8所述的扬声器模组40沿C-C向的截面结构的示意图。在一些实施例中，当隔网43与第二盖体412一体成型时，第二盖体412包括第四连接段4121、自第四连接段4121的边缘向远离第一盖体411方向延伸的第五连接段4122、以及连接于第五连接段4122末端的第六连接段4123。其中，第四连接段4121与隔网43连接且与第一盖体411相对设置，第六连接段4123延伸至内核42远离开口443的一侧，并与内核42抵接。具体地，第四连接段4121、第五连接段4122和第六连接段4123可以限定出定位台阶，用于内核42的定位。由于隔网43与第二盖体412一体成型，则相比于相关技术可以增加第二腔体442的体积，也可以增加隔网43的高度，从而有利于提高扬声器模组40的低频性能和声音响度，进而有利于提高用户的使用体验。同时也便于对内核42进行安装。
示例性的，第五连接段4122与第六连接段4123可以相互垂直。这样设置可以使第六连接段4123与内核42的接触面积可以更多，从而可以保证对内核42的支撑，有利于提高扬声器模组40的可靠性。
请继续参阅图11，在一些实施例中，在扬声器模组40的厚度方向上，第四连接段4121的靠近第一盖体411的边缘与第六连接段4123的远离第一盖体411的边缘之间的间距H2大于或者等于0.12mm。通过限制第四连接段4121的靠近第一盖体411的边缘与第六连接段4123的远离第一盖体411的边缘之间的间距H2，可以在保证第二盖体412的结构强度的同时增加隔网43的高度，使第一腔体441与第二腔体442之间的透气面积可以更大。
示例性的，间距H2的取值可以为0.12mm、0.13mm、0.14mm或0.15mm等。
在一些实施例中，扬声器模组100还包括第二连接件47，第二连接件47同时与第一盖体411和隔网43连接。第二连接件47与第一连接件45类似，此处不再赘述。
请参阅图12，图12为图9所述的扬声器模组40沿D-D向的截面结构的示意图。在一些实施中，当隔网43与第一盖体411和第二盖体412一体成型时，与上述的描述相同，此处不再赘述。
请继续参阅图12，在一些实施例中，在扬声器模组40的厚度方向上，透气孔431的数量为多个。部分透气孔431的中心与第一盖体411的边缘之间具有第一间距L1。第一间距L1大于或等于0且小于或者等于0.25mm。具体地，当第一间距L1等于0时，透气孔431的中心可以位于第一盖体411的边缘处，此时透气孔431可以形成为半圆形。由此，通过限定第一间距L1的取值范围，使隔网43可以充分利用相关技术中被覆盖的面积，使隔网43上设置透气孔431的开孔总面积可以得到增加，从而有利于提高第一腔体441和 第二腔体442之间的气流的流动，进而有利于提高扬声器模组40的低频性能和声音响度。其中，“多个”是指两个或两个以上。第一间距L1同样适用于图10所示的实施例。
示例性的，第一间距L1的取值可以为0mm、0.1mm、0.11mm、0.12mm、0.13mm、0.14mm、0.15mm、0.16mm、0.17mm、0.18mm、0.19mm、0.2mm、0.21mm、0.22mm、0.23mm、0.24mm、0mm或0.25mm等。
请继续参阅图12，在另一些实施例中，透气孔431的中心与第二盖体412的边缘之间具有第二间距L2，第二间距L2大于或等于0且小于或者等于0.25mm。具体地，当第二间距L2等于0时，透气孔431的中心可以位于第二盖体412的边缘处，此时透气孔431可以形成为半圆形。由此，通过限定第二间距L2的取值范围，使隔网43可以充分利用相关技术中被覆盖的面积，使隔网43上设置透气孔431的开孔总面积可以得到增加，从而有利于提高第一腔体441和第二腔体442之间的气流的流动，进而有利于提高扬声器模组40的低频性能和声音响度。其中，第二间距L2同样适用于图11所示的实施例。
示例性的，第二间距L2的取值可以为0mm、0.1mm、0.11mm、0.12mm、0.13mm、0.14mm、0.15mm、0.16mm、0.17mm、0.18mm、0.19mm、0.2mm、0.21mm、0.22mm、0.23mm、0.24mm、0mm或0.25mm等。
请继续参阅图12，在又一些实施例中，部分透气孔431的中心与第一盖体411的边缘之间具有第一间距L1。第一间距L1大于或等于0且小于或者等于0.25mm。部分透气孔431的中心与第二盖体412的边缘之间具有第二间距L2，第二间距L2大于或等于0且小于或者等于0.25mm。这样设置可以提高隔网43的透气总面积。由此，通过限定第一间距L1和第二间距L2的取值范围，使隔网43上设置透气孔431的开孔总面积可以得到增加，从而有利于提高第一腔体441和第二腔体442之间的气流的流动，进而有利于提高扬声器模组40的低频性能和声音响度。
下面对高度不同的两个隔网43在扬声器模组40中的表现进行比较。其中，方案A中隔网43的高度等于2mm，方案B中隔网43的高度等于1.6mm。
请参阅图13、图14和图15，图13为本申请实施例提供的方案A与方案B在空腔状态下的性能对比图，图14为本申请实施例提供的方案A与方案B在灌粉0.15cc后的性能对比图，图15为本申请实施例提供的方案A与方案B在灌粉0.2cc后的性能对比图。其中，图13至图15中的实线表示方案A，虚线表示方案B，横坐标表示扬声器模组40的频率，纵坐标表示扬声器模组40的灵敏度。
通过对图13、图14和图15的数据进行整理，可以得到表1。
表1

通过参阅表1，可以得出，在方案A和方案B都灌粉0.15cc的情况下，方案A的灵敏度相较于方案B的灵敏度在频率点为200时，提升0.3分贝；在频率点为300时，提升0.4分贝。由此可以得出在相同的灌粉量下，方案A的低频性能的提升更为显著，方案A的灵敏度的均值约0.35分贝以上。
在方案A和方案B都灌粉0.2cc的情况下，方案A的灵敏度相较于方案B的灵敏度在频率点为200时，提升0.3分贝；在频率点为300时，提升0.5分贝；在频率点为500时，提升1分贝。由此可以得出在相同的灌粉量下，方案A的低频性能的提升更为显著，方案A的灵敏度的均值约0.4分贝以上。
综上，当隔网43的高度在得到增加后，可以增加透气孔431的数量，从而可以提高第一腔体441和第二腔体442之间的空气流动，使扬声器模组40的灵敏度可以得到提升，有利于提高扬声器模组40的低频性能和声音响度。
在一些实施例中，透气孔431的开孔总面积与隔网43面积的比值大于或者等于50％。通过限定透气孔431开孔总面积与隔网43面积的比值，可以保证第一腔体441和第二腔体442之间气流流动的面积，从而使扬声器模组40的低频性能和声音响度可以得到保障，有利于提高用户的使用体验。
示例性的，透气孔431的开孔总面积与隔网43面积的比值可以为50％、52％、55％、58％、60％、62％、65％、68％、70％、72％、75％、78％、80％、82％、85％或90％等。
在一些实施例中，第一盖体411、隔网43、以及第二盖体412中的至少一个的材料包括钢。由于钢的结构强度高，可以在保证结构强度的同时实现轻薄化的。同时加工便利，有利于降低成本。
示例性的，第一盖体411、隔网43、以及第二盖体412的材料可以均包括钢。
在一些实施例中，第二盖体412上可以设有灌装口(图未示出)。灌装口的形状包括但不限于圆形、方形、多边形等等。灌装口与部分后腔连通。吸音颗粒可以由该灌装口灌入第二腔体442内。灌装口上可以设有盖体，盖体用于封闭该灌装口、具体地，盖体可以通过粘接等方式盖合于灌装口处的第一壳体41部分边缘。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (11)

  1. 一种扬声器模组，其特征在于，包括：
    壳体，所述壳体围成具有开口的容纳空间，所述容纳空间包括第一腔体和第二腔体，所述第二腔体设置在所述第一腔体的外周，至少部分所述第一腔体与所述开口相对设置；
    内核，所述内核包括磁碗，所述磁碗设置于所述第一腔体内，且所述磁碗与所述开口相对；
    隔网，所述隔网设置于所述第一腔体和所述第二腔体之间，所述隔网上形成有透气孔，所述透气孔连通所述第一腔体和所述第二腔体；
    其中，所述壳体包括具有所述开口的第一盖体、以及与所述第一盖体相对设置的第二盖体；所述隔网与所述第一盖体一体成型；和/或，所述隔网与所述第二盖体一体成型。
  2. 根据权利要求1所述的扬声器模组，其特征在于，当所述隔网与所述第一盖体一体成型时，所述第一盖体包括第一连接段、自所述第一连接段的边缘向远离所述第二盖体方向延伸的第二连接段、以及连接于所述第二连接段末端的第三连接段，所述第三连接段与所述第一连接段平行，所述第三连接段与所述隔网连接。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述扬声器模组还包括：第一连接件，所述第一连接件同时连接所述隔网和所述第二盖体，部分所述第一连接件伸入所述内核远离所述开口的一侧，并与所述内核抵接。
  4. 根据权利要求2或3所述的扬声器模组，其特征在于，沿所述扬声器模组的厚度方向，所述第三连接段的厚度大于或者等于0.03mm。
  5. 根据权利要求2-4中任一项所述的扬声器模组，其特征在于，所述透气孔的外轮廓在垂直于所述第一连接段的平面上的正投影，与所述第二连接段在垂直于所述第一连接段的平面上的正投影至少部分重合。
  6. 根据权利要求1-5中任一项所述的扬声器模组，其特征在于，当所述隔网与所述第二盖体一体成型时，所述第二盖体包括第四连接段、自所述第四连接段的边缘向远离所述第一盖体方向延伸的第五连接段、以及连接于所述第五连接段末端的第六连接段，其中，所述第四连接段与所述隔网连接且与所述第一盖体相对设置，所述第六连接段延伸至所述内核远离所述开口的一侧，并与所述内核抵接。
  7. 根据权利要求6所述的扬声器模组，其特征在于，在所述扬声器模组的厚度方向上，所述第四连接段的靠近所述第一盖体的边缘与所述第六连接段的远离所述第一盖体的边缘之间的间距大于或者等于0.12mm。
  8. 根据权利要求1-7中任一项所述的扬声器模组，其特征在于，在所述扬声器模组的厚度方向上，所述透气孔的数量为多个，部分所述透气孔的中心与所述第一盖体的边缘之间具有第一间距，所述第一间距大于或等于0且小于或者等于0.25mm；和/或，部分所述透气孔的中心与所述第二盖体的边缘之间具有第二间距，所述第二间距大于或等于0且小于或者等于0.25mm。
  9. 根据权利要求1-8中任一项所述的扬声器模组，其特征在于，所述透气孔的开孔总面积与所述隔网面积的比值大于或者等于50％。
  10. 根据权利要求1-9中任一项所述的扬声器模组，其特征在于，所述第一盖体、所述隔网、以及所述第二盖体中的至少一个的材料包括钢。
  11. 一种电子设备，其特征在于，包括：屏幕、背壳、电路板、以及如权利要求1-10中任一项所述的扬声器模组；
    所述屏幕包括层叠设置的透光盖板和显示屏，所述背壳包括边框和背盖，所述透光盖板、所述边框和所述背盖共同围成所述电子设备的收纳空间；
    所述显示屏、所述电路板、以及所述扬声器模组位于所述收纳空间内，所述扬声器模组的内核与所述电路板电连接，所述边框上设有出声孔，所述扬声器模组的出声通道与所述出声孔连通。
PCT/CN2024/079728 2023-06-12 2024-03-01 扬声器模组和电子设备 Ceased WO2024255329A1 (zh)

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