WO2021197114A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2021197114A1
WO2021197114A1 PCT/CN2021/082216 CN2021082216W WO2021197114A1 WO 2021197114 A1 WO2021197114 A1 WO 2021197114A1 CN 2021082216 W CN2021082216 W CN 2021082216W WO 2021197114 A1 WO2021197114 A1 WO 2021197114A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
electronic device
speaker
hole
housing
Prior art date
Application number
PCT/CN2021/082216
Other languages
English (en)
French (fr)
Inventor
王波
闫涛
徐阳
麦楷
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021197114A1 publication Critical patent/WO2021197114A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/725—Cordless telephones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to an electronic equipment.
  • Electronic equipment is gradually becoming smaller, lighter and thinner. Therefore, the layout of the components of the electronic equipment is more compact.
  • electronic equipment includes audio devices such as speakers.
  • the volume of the back cavity affects the low-frequency sound quality of the speakers.
  • the speaker is located in the housing of the electronic device. Due to the small space inside the housing, the layout space of the speaker is small. It is impossible to improve the sound quality of the speaker by increasing the volume of the rear cavity, resulting in poor sound quality of the electronic device. user experience.
  • the present application provides an electronic device, which can improve the sound quality of a speaker in the electronic device.
  • An embodiment of the present application provides an electronic device, the electronic device includes: a housing; a speaker installed in the housing, and the speaker includes a first cavity; a screen assembly installed in the housing, and The screen assembly includes a display module and a cover plate, the cover plate and the housing enclose a third cavity for accommodating the display module; wherein, the first cavity and the third cavity The body is connected.
  • the third cavity can be used as a part of the rear cavity of the speaker in addition to installing the display module, that is, the rear cavity of the speaker can be enlarged.
  • the volume thereby improving the sound quality of the speaker.
  • the method of increasing the rear cavity of the speaker in the embodiments of the present application does not need to be achieved by increasing the volume of the speaker itself, so the overall volume and weight of the electronic device will not be increased, which is conducive to miniaturization and thinning of the electronic device. .
  • the method in the embodiment of the present application only needs to connect the two cavities without other complicated operations, thereby saving costs.
  • the speaker includes a housing, the housing encloses the first cavity, and the housing is provided with a first through hole communicating with the first cavity;
  • the housing includes A front case, along the thickness direction of the electronic device, the speaker and the screen assembly are installed at both ends of the front case;
  • the front case is provided with a second through hole communicating with the third cavity, So that the first cavity and the third cavity are communicated through the first through hole and the second through hole.
  • the first cavity and the third cavity are directly connected through the first through hole and the second through hole, and the communication does not need to be realized through other components, thereby simplifying the structure of the electronic device.
  • the projection of the first through hole and the projection of the second through hole at least partially overlap.
  • the first cavity and the third cavity can be connected through the first through hole and the second through hole, and the first through hole and the second through hole can be connected to each other.
  • the front case is further provided with a protrusion, the protrusion extends in a direction perpendicular to the surface of the front case, and the protrusion surrounds the second through hole;
  • the loudspeaker, the front case, and the protruding part enclose a buffer space, and the second through hole is located in the buffer space.
  • the buffer space can improve the uniformity of the air flow between the first cavity and the third cavity, thereby further improving the sound quality of the speaker.
  • each of the protrusions surrounds the second through hole.
  • a plurality of the protrusions are connected to form a ring structure, and the ring structure surrounds the second through hole.
  • processing can be facilitated, and the strength of the casing can be improved, thereby increasing the service life of the electronic device.
  • the front shell is provided with a convex rib, and the convex rib protrudes in a direction perpendicular to the surface of the front shell; the convex portion is connected with the convex rib, and the speaker ,
  • the front shell, the ribs and the protrusions enclose the buffer space.
  • the protruding edge of the front shell participates in enclosing the second through hole, so that the volume and weight of the protruding portion can be reduced, and the weight of the electronic device can be reduced.
  • the protrusion includes a tangent circular arc structure and a linear structure, and the linear structure is connected to the rib.
  • the arc-shaped structure can reduce the stress concentration of the front shell, thereby improving its strength.
  • the electronic device further includes a first sealing member, and along the thickness direction of the electronic device, the first sealing member is located between the front case and the speaker;
  • the sealing member surrounds the first through hole and the second through hole.
  • the first sealing member is used to seal the connected first through hole and the second through hole, so that the connected first cavity and the third cavity are closed cavities, which can improve the sound quality of the speaker and protect the display module. Group.
  • the first sealing member is foam, and along the thickness direction of the electronic device, the speaker and the front shell compress the foam between them, and the foam
  • the compression of cotton is 50% to 70%.
  • the first sealing element is installed in the buffer space and abuts against the protrusion.
  • the installation stability of the first sealing element can be improved, thereby improving the airtightness between the first cavity and the third cavity.
  • the height of the first sealing member in the uncompressed state is higher than the height of the protrusion, and the height of the first sealing member in the compressed state is equal to that of the protrusion.
  • the height is the same.
  • the compression amount of the first sealing element can be adjusted by changing the height of the protrusion, thereby adjusting the sealing performance of the first sealing element.
  • the electronic device further includes a communication tube, one end of the communication tube is connected to the first cavity, and the other end is connected to the third cavity.
  • a connecting pipe by providing a connecting pipe, the communication between the first cavity and the third cavity can be achieved even when the distance between the first cavity and the third cavity is far, thereby increasing the volume of the rear cavity of the speaker and improving the sound quality of the speaker and the electronic device.
  • connection between the communication pipe and the first cavity is sealed, and the connection between the communication pipe and the third cavity is sealed.
  • the connecting pipe is made of flexible material.
  • the communication tube can be deformed, so that it is convenient to be arranged inside the electronic device and can avoid other parts of the electronic device.
  • the third cavity includes a first sub-cavity and a second sub-cavity that are separated from each other, and the cross-sectional area of the first sub-cavity along the thickness direction of the electronic device is larger than that of the second sub-cavity.
  • the cross-sectional area of the sub-cavity along the thickness direction of the electronic device; the first cavity is in communication with the first sub-cavity.
  • the first sub-cavity with a larger cross-sectional area is separated from the second sub-cavity with a smaller cross-sectional area, and the first cavity of the loudspeaker is connected to the first sub-cavity with the larger cross-sectional area.
  • the second sub-cavity with a smaller area is separated, so that while increasing the back cavity of the speaker to improve the sound quality of the speaker, it can also prevent the second sub-cavity with a smaller cross-sectional area from causing the speaker to generate standing waves, which improves the speaker and electronic equipment. Sound quality.
  • the electronic device further includes a second sealing member.
  • the second sealing member is located between the housing and the display module and is used for Separate the first sub-cavity and the second sub-cavity.
  • the second sealing element can facilitate the separation of the above-mentioned first sub-cavity and the second sub-cavity, and can improve the sealing performance of the first cavity and the first sub-cavity that are connected.
  • the housing includes a front shell and a frame, the frame is connected to the outer periphery of the front shell; the second sealing member extends along the width direction of the electronic device, and The two ends of the direction abut against the frame respectively, and the cover plate, the front shell, the frame and the second sealing member enclose the first sub-cavity.
  • the front shell includes a first mounting portion for mounting the speaker; the first mounting portion, the cover plate, the frame, and the second sealing member enclose a place The first sub-cavity.
  • the distance between the first sub-cavity and the speaker is small, so that the first cavity and the first sub-cavity can be easily communicated.
  • the cross-sectional area of the first sub-cavity is relatively large, thereby reducing the risk of standing wave formation.
  • FIG. 1 is a schematic diagram of a partial structure of an electronic device provided by this application in a first specific embodiment
  • Figure 2 is an exploded view of Figure 1;
  • FIG. 3 is a schematic diagram of the structure of the loudspeaker in FIG. 1;
  • Fig. 4 is a top view of Fig. 3 with the dust-proof net and the blocking member removed;
  • Figure 5 is a cross-sectional view taken along the line A-A of Figure 4.
  • FIG. 6 is a schematic diagram of the structure of the second housing in FIG. 3;
  • FIG. 7 is a schematic diagram of cooperation between the housing and the screen assembly in FIG. 1 in a specific embodiment
  • Figure 8 is a top view of Figure 7;
  • Figure 9 is a cross-sectional view taken along the line B-B of Figure 8.
  • Fig. 10 is a partial enlarged view of part II in Fig. 9;
  • Fig. 11 is a partial enlarged view of part I in Fig. 7 in the first specific embodiment
  • Figure 12 is a top view of Figure 1;
  • Figure 13 is a cross-sectional view taken along the line C-C in Figure 12;
  • Figure 14 is a partial enlarged view of part III in Figure 13;
  • Fig. 15 is a partial enlarged view of part I in Fig. 7 in a second specific embodiment
  • 16 is a schematic structural diagram of an electronic device provided in an embodiment of this application in a second specific embodiment
  • Fig. 17 is a schematic diagram of the matching structure of the loudspeaker and the communicating pipe in Fig. 16.
  • the sound quality of the speakers of electronic devices is mainly improved in the following two ways.
  • the side wall of the rear cavity of the speaker can be a steel sheet structure, thereby increasing the volume of the rear cavity by reducing the thickness of the side wall of the rear cavity, thereby improving the sound quality of the speaker (for example, the thickness of the side wall of the steel sheet can be 0.15 -0.2mm, the thickness of the original plastic sidewall is 0.45mm, so that the plastic sidewall can be replaced with a steel sheet sidewall to increase the rear cavity space).
  • the second is to add sound-absorbing powders such as BASS powder to the speakers to improve the sound quality, especially to improve the bass of the speakers.
  • BASS powder due to the limitation of the internal space of the electronic device, the installation space of the speaker is limited, and the solution of adding BASS powder increases the higher cost. The above two methods cannot effectively improve the sound quality of the speaker.
  • an embodiment of the present application provides an electronic device.
  • the electronic device may be a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, or an ultra-mobile personal computer.
  • UMPC personal digital assistants
  • PDAs personal digital assistants
  • AR augmented reality
  • VR virtual reality
  • AI artificial intelligence
  • Wearable devices wearable devices, in-vehicle devices, smart home devices, and/or smart city devices.
  • the embodiments of the present application do not impose special restrictions on the specific types of electronic devices.
  • the electronic device may include components such as a screen assembly 3, a circuit board, a battery, an audio module, a speaker 1, a receiver, and a microphone.
  • the screen component 3 is used to display images, videos, and so on.
  • the electronic device may include 1 or N screen components 3, and N is a positive integer greater than 1.
  • Electronic equipment can realize audio functions, such as music playback, recording, etc., through audio modules, speakers 1, receivers and other components.
  • the audio module is used to convert digital audio information into an analog audio signal for output, and also used to convert an analog audio input into a digital audio signal.
  • the audio module can also be used to encode and decode audio signals.
  • the audio module may be provided in the processor, or part of the functional modules of the audio module may be provided in the processor.
  • the speaker 1 is also called a "speaker” and is used to convert audio electrical signals into sound signals.
  • the electronic device can listen to music through the speaker 1, or listen to a hands-free call.
  • the receiver is also called a "handset”, which is used to convert audio electrical signals into sound signals. When an electronic device answers a call or a voice message, it can listen to the voice by placing the receiver close to the human ear.
  • the screen assembly 3 and the speaker 1 are mounted on the housing assembly 2, and the screen assembly 3 and the speaker 1 are mounted on the two ends of the housing assembly 2 in the thickness direction Z.
  • the speaker 1 is installed in the housing assembly 2, and after installation, the speaker 1 is located in the inner cavity of the electronic device.
  • the speaker 1 may specifically include a housing 11 and an inner core 12, wherein the inner core 12 is installed in the outer housing 11, and the vibration of the inner core 12 enables the speaker 1 to emit sound.
  • the housing 11 is provided with one or more first mounting holes 115 for mounting the speaker 1 to the housing assembly 2 of the electronic device.
  • the housing 11 may include a first housing 111 and a second housing 112, which enclose the inner cavity of the speaker 1.
  • the first housing 111 of the housing 11 is also provided with a first through hole 111a and a vent hole 111b. Both the first through hole 111a and the vent hole 111b are in communication with the inner cavity of the speaker 1, and the vent hole 111b is used for exhausting the inner cavity of the speaker 1, so that the speaker 1 can work normally.
  • the speaker 1 may also include a dust-proof net 14 and a blocking member 15. Wherein, the dust-proof net 14 is used to cover the first through hole 111a to reduce the vibration of the display module and improve the low-frequency resonance point.
  • the pore size of the dust-proof net 14 may be 5-30 ⁇ m, for example, the pore size may be 20 ⁇ m, 30 ⁇ m, or the like.
  • the blocking member 15 is used to cover the vent hole 111b, so as to reduce the risk of foreign dust and other impurities entering the first cavity 113 through the vent hole 111b.
  • the blocking member 15 may specifically be made of plastic material such as PET.
  • the first through hole 111a may be a circular hole, a square hole or a hole of other shapes, and the first through hole 111a may be provided in one or more.
  • the first through hole 111a is a circular hole, its diameter is greater than 3 mm.
  • the distance between the first through hole 111a and the vent hole 111b may be 5 mm to 10 mm.
  • the inner cavity of the speaker 1 may include a first cavity 113 and a second cavity 114, wherein the first cavity 113 and the second cavity 114 are divided by the inner core 12. The size of the cavity 113 can change the sound quality of the speaker 1.
  • the first mounting hole 115 may be provided in the second housing 112, and the second housing 112 has a partition inside.
  • the second housing 112 is used to connect with the second housing 112
  • a housing see the first housing 111 shown in FIG. 3
  • the two can enclose the first cavity 113 and the second cavity 114 described above.
  • the first cavity 113 is the rear cavity of the speaker 1. Therefore, the sound quality of the speaker 1 is related to the volume of the first cavity 113, and when the volume of the first cavity 113 increases, it can be improved. The sound quality of the speaker 1, especially the sound quality of the bass of the speaker 1 can be improved.
  • the volume of the first cavity 113 is increased, the volume of the speaker 1 will increase, occupying a relatively large internal space of the electronic device, resulting in a relatively large volume and weight of the electronic device, which is not conducive to the realization of the miniaturization of the electronic device. And thinner.
  • the embodiment of the present application improves the sound quality of the speaker 1 by improving the structure of the speaker 1 and the housing assembly 2 without increasing the volume of the speaker 1 itself.
  • the housing assembly 2 may specifically include a front shell 21 and a frame 22, and the frame 22 is located on the outer periphery of the front shell 21.
  • the front shell 21 and the frame 22 may be an integral structure, and the two may be formed by stamping, casting or 3D printing.
  • the front shell 21 and the frame 22 may also have a split structure, and the two may be fixedly connected by a buckle and a slot.
  • the front case 21 may specifically include a first mounting portion 211 and a second mounting portion 212, the first mounting portion 211 and the second mounting portion 212 are arranged along the length direction X of the electronic device and pass between them. The ribs 213 are separated.
  • the first mounting portion 211 is close to the frame 22 of the housing assembly 2 along the length direction X.
  • the first mounting portion 211 is used for mounting the aforementioned speaker 1, and the second mounting portion 212 is used for mounting components such as the circuit board 33 of the electronic device.
  • the second mounting portion 212 can be used to mount components such as the circuit board 33 of the control display module (see the display module 32 shown in FIG. 10), and the circuit board 33 can be mounted on the front housing 21 away from the display module. 32 on the side.
  • the circuit board 33 is the circuit board 33 of the display module 32.
  • the front shell 21 has a through hole for realizing the connection between the circuit board 33 and the display module 32. At the same time, the through hole can be sealed by foam or glue.
  • the housing assembly 2 of the electronic device can be used to support the circuit board 33 and realize the connection between the circuit board 33 and the display module (see the display module 32 shown in FIG. 10).
  • the housing assembly 2 is also used to install the screen assembly 3 of the electronic device.
  • the screen assembly 3 includes a cover plate 31 and a display module 32 along the thickness direction Z of the electronic device.
  • the display module 32 may specifically include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) for displaying text and/or images.
  • the cover plate 31 may be a glass plate for protecting the display module 32.
  • the cover plate 31 can be installed on the housing assembly 2, and along the thickness direction Z, the cover plate 32 and the front case 21 are located on both sides of the display module 32.
  • the cover plate 31 and the housing assembly 2 enclose a third cavity 4, and the third cavity 4 is used for accommodating the display module 32.
  • the third cavity 4 is usually a closed cavity.
  • the first mounting portion 211 (for installing the speaker 1) and the third cavity 4 (for accommodating the display module 32) of the front case 21 correspond to the thickness direction Z of the electronic device, and The two are separated by the wall surface of the front shell 21.
  • the front housing 21 in the embodiment of the present application is provided with a second through hole 211 a, and the second through hole 211 a is in communication with the third cavity 4.
  • the housing 11 of the speaker 1 in the embodiment of the present application is provided with a first through hole 111a, which communicates with the first cavity 113 (the rear cavity of the speaker) of the speaker 1.
  • the housing assembly 2 is used to install the speaker 1. As shown in FIG. 13, the housing assembly 2 is also used to install the screen assembly 3. Therefore, as shown in FIG. 14, when the speaker 1 is installed in the housing assembly 2, the above-mentioned first through hole 111a communicates with the second through hole (see the second through hole 211a shown in FIGS. 10 and 11), thereby making The first cavity 113 and the third cavity 4 of the speaker 1 are communicated through a first through hole 111a and a second through hole (see the second through hole 211a shown in FIGS. 10 and 11).
  • the third cavity 4 can be used as a part of the rear cavity of the speaker 1, in addition to being used for installing the display module 32.
  • the volume of the rear cavity of the loudspeaker 1 is large, thereby improving the sound quality of the loudspeaker 1.
  • the sound pressure level of the speaker 1 at low frequencies can be increased Nearly 10dB.
  • the method of increasing the back cavity of the speaker 1 in the embodiment of the present application does not need to be realized by increasing the volume of the speaker 1 itself, so the overall volume and weight of the electronic device will not be increased, which is conducive to the miniaturization and miniaturization of the electronic device. Thin and light.
  • the method in the embodiment of the present application only needs to connect the two cavities without other complicated operations, thereby saving costs.
  • the third cavity 4 of the electronic device for installing the display module 32 is always in a sealed state, when the third cavity 4 is in communication with the first cavity 113 of the speaker 1, the speaker 1 can work normally. , And can effectively improve the sound quality of the speaker 1. And for waterproof electronic equipment and non-waterproof electronic equipment, the third cavity 4 is in a sealed state. Therefore, in the embodiment of the present application, the first cavity 113 of the speaker 1 and the third cavity of the display module 32 are combined.
  • the 4-connectivity method can be used for waterproof electronic devices and non-waterproof electronic devices.
  • the electronic device may further include a first sealing member 5, which is located between the speaker 1 and the front housing 21 along the thickness direction Z of the electronic device, and is used to seal the connected second A through hole 111a and a second through hole (see the second through hole 211a shown in FIG. 10 and FIG. 11), so that the connected first cavity 113 and the third cavity 4 are closed cavities, which can improve the speaker 1, and protect the display module 32.
  • the first sealing member 5 may specifically be foam or a rubber sleeve, and the foam is compressed between the speaker 1 and the front shell 21.
  • the compression amount of the foam may be 50% to 70%, for example, the compression amount of the foam may be 70%, so that the foam has a better sealing performance.
  • the front shell 21 may also be provided with a sealing rib, which surrounds the second through hole (see the second through hole 211a shown in FIG. 10 and FIG. 11) and is used for bonding with glue Set of teamwork.
  • the amount of interference between the rubber sleeve and the sealing rib is more than 0.25 mm, so as to satisfy the sealing reliability of the first through hole 111a and the second through hole (see the second through hole 211a shown in FIGS. 10 and 11).
  • first through hole 111a and the second through hole may be through holes with the same size and shape, for example, both may be round. The diameter of both can be 3mm.
  • first through hole 111a and the second through hole may also be through holes with different sizes and shapes.
  • the first through hole 111a may be The round hole and the second through hole (see the second through hole 211a shown in FIG. 10 and FIG. 11) may be a triangular hole.
  • the embodiment of the present application does not limit the shape and size of the first through hole 111a and the second through hole (see the second through hole 211a shown in FIG. 10 and FIG. 11).
  • the center lines of the two may or may not overlap, as long as It is sufficient that at least part of the projections of the two overlap, at this time, the first through hole 111a and the second through hole (see the second through hole 211a shown in FIG. 10 and FIG. 11) can be connected.
  • the cover plate 31 and the housing 1 enclose the above-mentioned third cavity 4, and the third cavity 4 is used for accommodating the screen.
  • the housing 2 includes a front housing 21 and a frame 22.
  • the frame 22 surrounds the outer periphery of the front housing 21, and when the screen assembly 3 is installed in the housing 1, the cover 31 can be connected to the frame 22 .
  • a second sealing member 6 is provided between the front case 21 and the display module 32, and the second sealing member 6 divides the third cavity 4 into a first sub-cavity 41 and a second sub-cavity 42 .
  • the first sub-cavity 41 is close to the speaker 1, and the cross-sectional area of the first sub-cavity 41 along the thickness direction Z of the electronic device is larger than the cross-sectional area of the second sub-cavity 42 along the thickness direction Z of the electronic device. Therefore, when the first cavity 113 of the speaker 1 communicates with the third cavity 4, due to the arrangement of the second sealing member 6, the first cavity 113 communicates with the first sub-cavity 41 with a larger cross-sectional area.
  • the second sealing member 6 separates the first sub-cavity 41 with a larger cross-sectional area from the second sub-cavity 42 with a smaller cross-sectional area, and makes the first cavity 113 of the speaker 1 and the cross-sectional area larger.
  • the first sub-cavity 41 is connected to and separated from the second sub-cavity 42 with a smaller cross-sectional area, so that while increasing the rear cavity of the speaker 1 to improve the sound quality of the speaker 1, it can also prevent the second sub-cavity with a smaller cross-sectional area.
  • the sub-cavity 42 causes the speaker 1 to generate standing waves. The wave formed when two rows of waves with the same amplitude and the same frequency propagating in opposite directions are superimposed is called a standing wave.
  • the first sub-cavity 41 and the second sub-cavity 42 are separated by the second sealing member 6 to prevent the formation of standing waves, thereby improving the sound quality of the speaker 1 and the electronic device.
  • the first sub-cavity 41 and the second sub-cavity 42 are arranged along the length direction X of the electronic device, and the first sub-cavity 41 is close to the speaker 1, that is, the first sub-cavity 41 is located Below the first mounting portion 211 (the portion of the front case 21 for mounting the speaker 1).
  • the above-mentioned second sealing member 6 can extend along the width direction Y of the electronic device, and both ends of the second sealing member 6 in the width direction Y abut against the frame 22, so that the second sealing member 6 separates the first sub-cavity 41 and The second sub-cavity 42 is separated.
  • the second sealing member 6 is compressed between the front case 21 and the display module 32, and the second sealing member 6 is in a compressed state, and the compression amount can be 50% to 80%.
  • the distance between the first sub-cavity 41 and the speaker 1 is small, so that the first through hole 111a and the second through hole (see the second through hole 211a shown in FIGS. 10 and 11) can be conveniently ⁇ Connected.
  • the first sub-cavity 41 is surrounded by the cover plate 31, the front shell 21 and the frame 22, and at a position close to the frame 22, the first sub-cavity 41 has a larger cross-sectional area, thereby reducing the risk of standing waves. .
  • the two can easily pass through the first channel.
  • the hole 111a and the second through hole are communicated without other components.
  • the first mounting portion 211 of the front case 21 may also be provided with a raised portion 211b along a bottom wall perpendicular to the first mounting portion 211 The direction is raised.
  • the protruding portion 211b is arranged outside the second through hole 211a and surrounds the second through hole 211a.
  • the speaker when the speaker (refer to the speaker 1 shown in FIGS. 3 and 4) is mounted on the first mounting portion 211, since the first mounting portion 211 of the front case 21 is provided with a raised portion 211b, the raised portion 211b is away from the surface of the first mounting portion 211 and is attached to the housing of the speaker (see the housing 11 of the speaker 1 shown in FIGS. 3 and 4), that is, the first through hole of the speaker (see FIG. 3 and FIG. 4) The first through hole 111a of the speaker 1 is spaced from the second through hole 211a of the front case 21 in the thickness direction Z so as to pass through the raised portion 211b and the housing (see the housing of the speaker 1 shown in FIGS. 3 and 4).
  • the first mounting part 211 enclose a buffer space, which can improve the air flow between the first cavity and the third cavity (see the first cavity 113 and the third cavity 4 shown in FIG. 14) Uniformity, thereby further improving the sound quality of the speaker.
  • the size, shape, and number of the protrusions 211b in the embodiment of the present application may not be limited, that is, the first mounting portion 211 may be provided with one protrusion 211b, or may be provided with multiple protrusions 211b.
  • the shape and size of the protrusions 211b may be the same or different, and the protrusions 211b may be evenly distributed or randomly distributed.
  • the shape of the protrusions 211b may be the same or different, and may be a regular shape or an irregular shape.
  • the first mounting portion 211 may be provided with a plurality of protrusions 211b, and the protrusions 211b are distributed at intervals, that is, there is a gap between adjacent protrusions 211b, wherein each protrusion 211b
  • the gap between the raised portions 211b may be the same or different.
  • the plurality of protrusions 211b may be enclosed in a circular structure, may also be enclosed in a square structure, or may be enclosed in other shapes.
  • the specific shape of the protrusions 211b is not limited in the present application.
  • the plurality of protrusions 211b are connected to form a ring structure, and the ring structure surrounds the second through hole 211a.
  • the raised portion 211b includes a tangent arc-shaped structure and a linear structure, and the raised portion 211b is connected to the rib 213 of the front shell 21, and two After being connected, it surrounds the second through hole 211a.
  • the rib 213 of the front case 21 participates in surrounding the second through hole 211a, so that the volume and weight of the protrusion 211b can be reduced, and the weight of the electronic device can be reduced.
  • a first sealing member is provided between the front case 21 and the speaker 1 (see FIG. 14, along the thickness direction Z, between the front case 21 and the speaker 1
  • the first sealing element (see the first sealing element 5 shown in FIG. 14) can be located in the above-mentioned buffer space, thereby improving the installation stability of the first sealing element 5, thereby improving the first sealing element 5).
  • the airtightness between a cavity and a third cavity (see the first cavity 113 and the third cavity 4 shown in FIG. 14).
  • the shape of the protrusion 211b may be a regular shape such as a circle, a square, a cone, or the like, or an irregular shape.
  • the specific shape of the protrusion 211b is not limited in the present application.
  • the distance between the center of the protrusion 211b and the first through hole 211b may be 1 mm to 2 mm, for example, it may be 1.45 mm. The setting of this distance can accommodate and limit the first sealing element, thereby improving its installation reliability.
  • the first mounting portion 211 of the front case 21 is provided with one or more mounting posts 211c, and the mounting posts 211c are provided with second mounting holes 211d.
  • the first installation hole of the speaker see the first installation hole 115 shown in FIG. 3
  • the second installation hole 211d of the front case 21 are correspondingly communicated, and fasteners (such as screws, etc.) can be Through the first mounting hole 115 and the second mounting hole 211d, the speaker 1 and the front case 21 are connected.
  • the electronic device may also include a connecting pipe 13.
  • One end of the communicating tube 13 is connected to the first cavity of the speaker 1, and the other end is connected to the third cavity 4. Therefore, in this embodiment, the communication between the first cavity and the third cavity 4 can also be achieved through the communication pipe 13, thereby increasing the volume of the rear cavity of the speaker 1 and improving the sound quality of the speaker 1 and the electronic device.
  • the communication tube 13 and the first cavity of the speaker 1 are sealed, and the communication tube 13 and the third cavity 4 are sealed, for example, the sealing can be achieved by dispensing glue or other means.
  • the electronic device is a notebook computer.
  • the third cavity 4 for accommodating the display module is located in the display screen part, and the speaker 1 is installed in the keyboard part.
  • the distance between the third cavity 4 and the first cavity of the speaker 1 is relatively long, and the communication between the two needs to be achieved through the communication pipe 13.
  • the third cavity 4 and the first cavity of the speaker 1 can also be communicated with each other through the communication pipe 13.
  • the cross section of the communication tube 13 may be round, square or other shapes, and the communication tube 13 may be a flexible material that can be deformed, so as to facilitate the arrangement inside the electronic device and avoid Other parts of electronic equipment.

Abstract

本申请实施例提供一种电子设备，所述电子设备包括：壳体；扬声器，安装于所述壳体，且所述扬声器包括第一腔体；屏幕组件，安装于所述壳体，且所述屏幕组件包括显示模组和盖板，所述盖板与所述壳体围成用于容纳所述显示模组的第三腔体；其中，所述第一腔体与所述第三腔体连通。通过将第一腔体和第三腔体连通，使得第三腔体除了用于安装显示模组外，还能够作为扬声器的一部分后腔，即能够增大扬声器的后腔的体积，从而提高扬声器的音质。同时，增大扬声器的后腔的方式无需通过增大扬声器自身的体积实现，因此不会增大电子设备的整机体积和重量，有利于实现电子设备的小型化和轻薄化。

Description

一种电子设备
本申请要求于2020年04月02日提交中国专利局、申请号为202010253694.5、发明名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电子设备。
背景技术
电子设备逐渐趋向小型化、轻薄化发展，因此，电子设备各部件的布置更加紧凑。通常情况下，电子设备包括扬声器等音频器件，对于扬声器而言，其后腔的体积影响扬声器的低频音质。而该扬声器位于电子设备的壳体内，由于壳体内部的空间较小，使得扬声器的布置空间较小，无法通过增大后腔体积来改善扬声器的音质，从而导致电子设备的音质较差，影响用户体验。
申请内容
本申请提供了一种电子设备，能够提高电子设备中扬声器的音质。
本申请实施例提供一种电子设备，所述电子设备包括：壳体；扬声器，安装于所述壳体，且所述扬声器包括第一腔体；屏幕组件，安装于所述壳体，且所述屏幕组件包括显示模组和盖板，所述盖板与所述壳体围成用于容纳所述显示模组的第三腔体；其中，所述第一腔体与所述第三腔体连通。
本申请实施例中，通过将第一腔体和第三腔体连通，使得第三腔体除了用于安装显示模组外，还能够作为扬声器的一部分后腔，即能够增大扬声器的后腔的体积，从而提高扬声器的音质。同时，本申请实施例中增大扬声器的后腔的方式无需通过增大扬声器自身的体积实现，因此不会增大电子设备的整机体积和重量，有利于实现电子设备的小型化和轻薄化。另外，本申请实施例中的方式仅需将两个腔体连通即可，无需其他复杂操作，从而能够节省成本。
在一种可能的设计中，所述扬声器包括外壳，所述外壳围成所述第一腔体，所述外壳设置有与所述第一腔体连通的第一通孔；所述壳体包括前壳，沿所述电子设备的厚度方向，所述扬声器和所述屏幕组件安装于所述前壳的两端；所述前壳设置有与所述第三腔体连通的第二通孔，以使所述第一腔体与所述第三腔体通过所述第一通孔和所述第二通孔连通。本实施例中，该第一腔体和第三腔体通过第一通孔和第二通孔直接连通，无需通过其他部件实现连通，从而简化电子设备的结构。
在一种可能的设计中，沿所述电子设备的厚度方向，所述第一通孔的投影与所述第二通孔的投影至少部分重合。本实施例中，两个通孔的投影至少部分重合时，能够 实现第一腔体和第三腔体通过第一通孔和第二通孔连通，且对第一通孔和第二通孔的精度要求较低，从而简化加工，降低成本。
在一种可能的设计中，所述前壳还设置有凸起部，所述凸起部沿垂直于所述前壳的表面的方向延伸，所述凸起部包围所述第二通孔；所述扬声器、所述前壳和所述凸起部围成缓冲空间，所述第二通孔位于所述缓冲空间内。本实施例中，该缓冲空间能够提高第一腔体与第三腔体之间气流的均匀性，从而进一步提高扬声器的音质。
在一种可能的设计中，所述凸起部为多个，且间隔分布，各所述凸起部包围所述第二通孔。
在一种可能的设计中，多个所述凸起部连接形成环形结构，且所述环形结构包围所述第二通孔。本实施例中，多个凸起部连接形成环形结构时，能够便于加工，且能够提高该壳体的强度，从而提高电子设备的使用寿命。
在一种可能的设计中，所述前壳设置有凸棱，所述凸棱沿垂直于所述前壳的表面的方向凸起；所述凸起部与所述凸棱连接，所述扬声器、所述前壳、所述凸棱和所述凸起部围成所述缓冲空间。本实施例中，前壳的凸棱参与包围第二通孔，从而能够减小凸起部的体积和重量，降低电子设备的重量。
在一种可能的设计中，所述凸起部包括相切的圆弧形结构和直线结构，且所述直线型结构与所述凸棱连接。本实施例中，该圆弧形结构能够降低前壳的应力集中，从而提高其强度。
在一种可能的设计中，所述电子设备还包括第一密封件，沿所述电子设备的厚度方向，所述第一密封件位于所述前壳和所述扬声器之间；所述第一密封件包围所述第一通孔和所述第二通孔。该第一密封件用于密封连通后的第一通孔和第二通孔，从而使得连通后的第一腔体和第三腔体为封闭腔体，能够提高扬声器的音质，并保护显示模组。
在一种可能的设计中，所述第一密封件为泡棉，沿电子设备的厚度方向，所述扬声器与所述前壳将所述泡棉压紧于二者之间，且所述泡棉的压缩量为50％～70％。
在一种可能的设计中，所述第一密封件安装于所述缓冲空间内，并与所述凸起部抵接。本实施例中，第一密封件安装于缓冲空间内时，能够提高第一密封件的安装稳定性，从而提高第一腔体与第三腔体之间的气密性。
在一种可能的设计中，所述第一密封件在未压缩状态时的高度高于所述凸起部的高度，所述第一密封件在压缩状态时的高度与所述凸起部的高度相同。本实施例中，能够通过改变凸起部的高度来调整第一密封件的压缩量，从而调整第一密封件的密封性能。
在一种可能的设计中，所述电子设备还包括连通管，所述连通管一端连通所述第一腔体，另一端连通所述第三腔体。本实施例中，通过设置连通管，使得第一腔体与第三腔体距离较远时仍然能够实现连通，从而增大扬声器的后腔体积，提升扬声器和电子设备的音质。
在一种可能的设计中，所述连通管与所述第一腔体的连接处密封，所述连通管与所述第三腔体的连接处密封。
在一种可能的设计中，所述连通管为柔性材质。该连通管能够变形，从而便于在 电子设备内部布置，并能够避让电子设备的其他部件。
在一种可能的设计中，所述第三腔体包括相互隔开的第一分腔和第二分腔，所述第一分腔沿所述电子设备厚度方向的截面积大于所述第二分腔沿所述电子设备厚度方向的截面积；所述第一腔体与所述第一分腔连通。本实施例中，将截面积较大的第一分腔与截面积较小的第二分腔隔开，并使得扬声器的第一腔体与截面积较大的第一分腔连通，与截面积较小的第二分腔隔开，从而在增大扬声器的后腔以提高扬声器的音质的同时，还能够防止截面积较小的第二分腔导致扬声器产生驻波，提高扬声器和电子设备的音质。
在一种可能的设计中，所述电子设备还包括第二密封件，沿所述电子设备的厚度方向，所述第二密封件位于所述壳体与所述显示模组之间，并用于隔开所述第一分腔和所述第二分腔。本实施例中，通过该第二密封件能够便于实现上述第一分腔和第二分腔的隔开，且能够提高相连通的第一腔体和第一分腔的密封性。
在一种可能的设计中，所述壳体包括前壳和边框，所述边框连接于所述前壳的外周；所述第二密封件沿所述电子设备的宽度方向延伸，且其沿宽度方向的两端分别与所述边框抵接，所述盖板、所述前壳、所述边框和所述第二密封件围成所述第一分腔。
在一种可能的设计中，所述前壳包括用于安装所述扬声器的第一安装部；所述第一安装部、所述盖板、所述边框和所述第二密封件围成所述第一分腔。本实施例中，该第一分腔与扬声器之间的距离较小，使得第一腔体和第一分腔能够方便地连通。另外，在靠近边框的位置，该第一分腔的截面积较大，从而能够降低驻波形成的风险。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为本申请所提供电子设备在第一种具体实施例中的局部结构示意图；
图2为图1的爆炸图；
图3为图1中扬声器的结构示意图；
图4为图3中去掉防尘网和封堵件的俯视图；
图5为图4的A-A向剖视图；
图6为图3中第二外壳的结构示意图；
图7为图1中壳体和屏幕组件在一种具体实施例中的配合示意图；
图8为图7的俯视图；
图9为图8的B-B向剖视图；
图10为图9中II部分的局部放大图；
图11为图7中I部分在第一种具体实施例中的局部放大图；
图12为图1的俯视图；
图13为图12的C-C向剖视图；
图14为图13中III部分的局部放大图；
图15为图7中I部分在第二种具体实施例中的局部放大图；
图16为本申请实施例所提供电子设备在第二种具体实施例中的结构示意图；
图17为图16中扬声器与连通管的配合结构示意图。
附图标记：
1-扬声器；
11-外壳；
111-第一外壳；
111a-第一通孔；
111b-泄气孔；
112-第二外壳；
113-第一腔体；
114-第二腔体；
115-第一安装孔；
12-内核；
13-连通管；
14-防尘网；
15-封堵件；
2-壳体组件；
21-前壳；
211-第一安装部；
211a-第二通孔；
211b-凸起部；
211c-安装柱；
211d-第二安装孔；
212-第二安装部；
213-凸棱；
22-边框；
3-屏幕组件；
31-盖板；
32-显示模组；
33-电路板；
4-第三腔体；
41-第一分腔；
42-第二分腔；
5-第一密封件；
6-第二密封件。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施 例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
应当明确，所描述的实施例仅仅是本申请一部分实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在一种具体实施例中，下面通过具体的实施例并结合附图对本申请做进一步的详细描述。
目前，电子设备扬声器的音质主要通过下述两种方式改进。第一种，扬声器的后腔的侧壁可以为钢片结构，从而通过减少后腔侧壁的厚度来提升后腔体积大小，进而改善扬声器的音质(例如，钢片侧壁的厚度可以为0.15-0.2mm，原有的塑胶侧壁的厚度为0.45mm，从而能够将塑胶侧壁替换为钢片侧壁来增大后腔空间)。第二种，在扬声器中增加BASS粉等吸声粉料来改善音质，尤其是改善扬声器的低音。但是，由于电子设备内部空间的限制，使得扬声器的安装空间有限，并且增加BASS粉的方案增加了较高成本，上述两种方式无法有效提高扬声器的音质。
为了解决该技术问题，本申请实施例提供一种电子设备，电子设备可以是手机、平板电脑、桌面型计算机、膝上型计算机、手持计算机、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本，以及蜂窝电话、个人数字助理(personal digital assistant，PDA)、增强现实(augmented reality，AR)设备、虚拟现实(virtual reality，VR)设备、人工智能(artificial intelligence,AI)设备、可穿戴式设备、车载设备、智能家居设备和/或智慧城市设备，本申请实施例对该电子设备的具体类型不作特殊限制。
其中，如图1和图2所示，电子设备可以包括屏幕组件3、电路板、电池、音频模块、扬声器1、受话器、麦克风等部件。其中，屏幕组件3用于显示图像，视频等。在一些实施例中，电子设备可以包括1个或N个屏幕组件3，N为大于1的正整数。电子设备可以通过音频模块，扬声器1，受话器等部件实现音频功能，例如音乐播放，录音等。其中，音频模块用于将数字音频信息转换成模拟音频信号输出，也用于将模拟音频输入转换为数字音频信号。音频模块还可以用于对音频信号编码和解码。在一些实施例中，音频模块可以设置于处理器中，或将音频模块的部分功能模块设置于处理器中。
扬声器1也称“喇叭”，用于将音频电信号转换为声音信号。电子设备可以通过扬声器1收听音乐，或收听免提通话。受话器也称“听筒”，用于将音频电信号转换成声音信号。当电子设备接听电话或语音信息时，可以通过将受话器靠近人耳接听语音。
如图1和图2所示，该电子设备中，屏幕组件3和扬声器1安装于壳体组件2，且该屏幕组件3和扬声器1安装于壳体组件2沿厚度方向Z的两端。具体地，如图1所示，扬声器1安装于该壳体组件2，且安装后，该扬声器1位于电子设备的内腔中。
如图3所示，该扬声器1具体可以包括外壳11和内核12，其中，内核12安装于外壳11，通过内核12的振动，使得扬声器1能够发出声音。具体地，外壳11设置有一个或多个第一安装孔115，该第一安装孔115用于将扬声器1安装于电子设备的壳体组件2。其中，外壳11可以包括第一外壳111和第二外壳112，二者围成扬声器1的内腔。
同时，如图3所示，该外壳11的第一外壳111还设置有第一通孔111a和泄气孔111b。该第一通孔111a和泄气孔111b均与扬声器1的内腔连通，该泄气孔111b用于扬声器1的内腔的排气，使得扬声器1能够正常工作。如图3所示，该扬声器1还可以包括防尘网14和封堵件15。其中，该防尘网14用于覆盖第一通孔111a，减少显示模组的振动，提高低频谐振点。其中，该防尘网14的孔径可以为5～30μm，例如，孔径可以为20μm、30μm等。该封堵件15用于覆盖泄气孔111b，从而减小外界灰尘等杂质经该泄气孔111b进入第一腔体113的风险。其中，该封堵件15具体可以为PET等塑料材质。
如图4所示，该扬声器1中，该第一通孔111a可以为圆形孔、方形孔或其他形状的孔，且该第一通孔111a可以设置为一个或多个。当第一通孔111a为圆形孔时，其直径大于3mm。另外，该第一通孔111a与泄气孔111b之间的距离可以为5mm～10mm。如图5和图6所示，该扬声器1的内腔可以包括第一腔体113和第二腔体114，其中，第一腔体113和第二腔体114通过内核12进行分割，第一腔体113的大小能够改变扬声器1的音质。
具体地，如图6所示，该扬声器1中，第一安装孔115可以设置于第二外壳112，且该第二外壳112内部具有分区，当该第二外壳112用于与扬声器1的第一外壳(参见图3所示的第一外壳111)连接时，二者能够围成上述第一腔体113和第二腔体114。
该扬声器1中，第一腔体113为扬声器1的后腔，因此，该扬声器1的音质与第一腔体113的体积有关，且当该第一腔体113的体积增大时，能够改善扬声器1的音质，尤其是能够提升扬声器1的低音的音质。但是，当增大第一腔体113的体积时，会导致扬声器1的体积增大，占据较大的电子设备的内部空间，导致电子设备体积和重量均较大，不利于实现电子设备的小型化和轻薄化。
为了解决该技术问题，本申请实施例在不增大扬声器1本身的体积的前提下，通过改进扬声器1和壳体组件2的结构来改善扬声器1的音质。
具体地，如图7所示，该壳体组件2具体可以包括前壳21和边框22，边框22位于前壳21的外周。其中，该前壳21与边框22可以为一体式结构，二者具体可以通过冲压、铸造或3D打印加工成型。或者，该前壳21与边框22也可以为分体式结构，二者具体可以通过卡扣和卡槽固定连接。更具体地，该前壳21具体可以包括第一安装部211和第二安装部212，该第一安装部211与第二安装部212沿电子设备的长度方向X布置，且二者之间通过凸棱213隔开。同时，该第一安装部211沿长度方向X靠近壳体组件2的边框22。该第一安装部211用于安装上述扬声器1，第二安装部212用于安装电子设备的电路板33等部件。
另外，该第二安装部212可以用于安装控制显示模组(参见图10所示的显示模组32)的电路板33等部件，且电路板33可以安装于前壳21的远离显示模组32的一 侧。其中，该电路板33为显示模组32的电路板33。该前壳21开设通孔用于实现电路板33与显示模组32之间的连接，同时，该通孔可以通过泡棉或点胶等方式密封。
如图8所示，该电子设备的壳体组件2可以用于支撑电路板33，并实现电路板33与显示模组(参见图10所示的显示模组32)的连接。
如图9所示，该壳体组件2还用于安装电子设备的屏幕组件3。如图10所示，该屏幕组件3沿电子设备的厚度方向Z包括盖板31和显示模组32。其中，显示模组32具体可以包括液晶显示器(Liquid Crystal Display，LCD)或有机发光二极管(Organic Light-Emitting Diode，OLED)，用于显示文字和/或图像等。盖板31可以为玻璃板，用于保护显示模组32。其中，该盖板31可以安装于壳体组件2，且沿厚度方向Z，该盖板32和前壳21位于显示模组32的两侧。同时，盖板31与壳体组件2围成第三腔体4，该第三腔体4用于容纳显示模组32。另外，为了保证显示模组32能够正常工作，该第三腔体4通常为封闭腔体。
另外，如图10所示，该前壳21的第一安装部211(用于安装扬声器1)与第三腔体4(用于容纳显示模组32)沿电子设备的厚度方向Z对应，且二者通过前壳21的壁面隔开。
基于此，如图10和图11所示，本申请实施例中的前壳21设置有第二通孔211a，该第二通孔211a与第三腔体4连通。同时，如图3所示，本申请实施例中的扬声器1的外壳11设置有第一通孔111a，该第一通孔111a连通扬声器1的第一腔体113(扬声器的后腔)。
如图12所示，该壳体组件2用于安装扬声器1。如图13所示，该壳体组件2还用于安装屏幕组件3。因此，如图14所示，当扬声器1安装于壳体组件2时，上述第一通孔111a与第二通孔(参见图10和图11所示的第二通孔211a)连通，从而使得该扬声器1的第一腔体113和第三腔体4通过第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)连通。
本申请实施例中，通过将第一腔体113和第三腔体4连通，使得第三腔体4除了用于安装显示模组32外，还能够作为扬声器1的一部分后腔，即能够增大扬声器1的后腔的体积，从而提高扬声器1的音质。例如，当将第一腔体113和第三腔体4均作为扬声器1的后腔，与仅第一腔体113为扬声器1的后腔相比，扬声器1在低频处的声压级能提升将近10dB。同时，本申请实施例中增大扬声器1的后腔的方式无需通过增大扬声器1自身的体积实现，因此不会增大电子设备的整机体积和重量，有利于实现电子设备的小型化和轻薄化。另外，本申请实施例中的方式仅需将两个腔体连通即可，无需其他复杂操作，从而能够节省成本。
另外，由于该电子设备的用于安装显示模组32的第三腔体4始终为密封状态，当该第三腔体4与扬声器1的第一腔体113连通时，使得扬声器1能够正常工作，且能够有效改善扬声器1的音质。且对于防水式电子设备和非防水式电子设备，该第三腔体4均为密封状态，因此，本申请实施例中将扬声器1的第一腔体113与显示模组32的第三腔体4连通的方式能够用于防水式电子设备和非防水式电子设备。
同时，如图14所示，该电子设备还可以包括第一密封件5，该第一密封件5沿电子设备的厚度方向Z位于扬声器1与前壳21之间，用于密封相连通的第一通孔111a 和第二通孔(参见图10和图11所示的第二通孔211a)，从而使得连通后的第一腔体113和第三腔体4为封闭腔体，能够提高扬声器1的音质，并保护显示模组32。其中，该第一密封件5具体可以为泡棉或者胶套，且通过扬声器1与前壳21将泡棉压紧于二者之间。泡棉的压缩量可以为50％～70％，例如，泡棉的压缩量可以为70％，从而使得泡棉具有更好的密封性。当第一密封件5为胶套时，该前壳21还可以设置密封筋，该密封筋包围第二通孔(参见图10和图11所示的第二通孔211a)，并用于与胶套配合。此时，胶套与密封筋的干涉量为0.25mm以上，从而满足第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)的密封可靠性。
需要说明的是，上述第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)可以为大小和形状均相同的通孔，例如二者均可以为圆孔，且二者的直径均可以为3mm。当然，上述第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)也可以为大小和形状不相同的通孔，例如，第一通孔111a可以为圆孔，第二通孔(参见图10和图11所示的第二通孔211a)可以为三角形孔。因此，本申请实施例对第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)的形状和大小不作限定。另外，以第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)均为圆孔为例，二者的中心线可以重合，也可以不重合，只要二者的投影的至少部分重合即可，此时，能够实现第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)连通。
以上各实施例中，如图14所示，该屏幕组件3安装于壳体1后，其盖板31与壳体1围成上述第三腔体4，该第三腔体4用于容纳屏幕组件3的显示模组32。具体地，结合图7所示，该壳体2包括前壳21和边框22，该边框22包围前壳21的外周，且屏幕组件3安装于壳体1时，盖板31可以与边框22连接。
如图14所示，前壳21与显示模组32之间设置有第二密封件6，该第二密封件6将上述第三腔体4分割为第一分腔41和第二分腔42。其中，第一分腔41靠近扬声器1，且该第一分腔41沿电子设备厚度方向Z的截面积大于第二分腔42沿电子设备厚度方向Z的截面积。因此，当扬声器1的第一腔体113与第三腔体4连通时，由于第二密封件6的设置，使得第一腔体113与截面积较大的第一分腔41连通。
本实施例中，第二密封件6将截面积较大的第一分腔41与截面积较小的第二分腔42隔开，并使得扬声器1的第一腔体113与截面积较大的第一分腔41连通，与截面积较小的第二分腔42隔开，从而在增大扬声器1的后腔以提高扬声器1的音质的同时，还能够防止截面积较小的第二分腔42导致扬声器1产生驻波。两列沿相反方向传播的振幅相同、频率相同的波叠加时形成的波叫做驻波，扬声器1产生驻波时，会影响扬声器1的音质。因此，本实施例中将第一分腔41和第二分腔42通过第二密封件6隔开的方式能够防止驻波的形成，从而提高扬声器1和电子设备的音质。
具体地，上述第三腔体4中，第一分腔41和第二分腔42沿电子设备的长度方向X布置，且该第一分腔41靠近扬声器1，即该第一分腔41位于第一安装部211(前壳21的用于安装扬声器1的部分)的下方。基于此，上述第二密封件6可以沿电子设备的宽度方向Y延伸，且其沿宽度方向Y的两端均与边框22抵接，从而通过该第二密封件6将第一分腔41和第二分腔42隔开。另外，沿厚度方向Z，该第二密封件 6压紧于前壳21和显示模组32之间，且该第二密封件6处于压缩状态，其压缩量可以为50％～80％。
本实施例中，该第一分腔41与扬声器1之间的距离较小，使得第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)能够方便地连通。另外，该第一分腔41由盖板31、前壳21和边框22围成，且在靠近边框22的位置，该第一分腔41的截面积较大，从而能够降低驻波形成的风险。
以上各实施例的电子设备中，由于其扬声器1的第一腔体113与用于安装显示模组32的第三腔体4之间的距离较小，使得二者能够方便地通过第一通孔111a和第二通孔(参见图10和图11所示的第二通孔211a)实现连通，无需通过其他部件实现连通。
在另一种具体实施例中，如图15所示，该前壳21的第一安装部211还可以设置有凸起部211b，该凸起部211b沿垂直于第一安装部211的底壁的方向凸起。同时，该凸起部211b设置于第二通孔211a的外侧，并包围第二通孔211a。
本实施例中，当扬声器(参见图3和图4所示的扬声器1)安装于该第一安装部211时，由于前壳21的第一安装部211设置凸起部211b，该凸起部211b远离第一安装部211的表面，与扬声器的外壳(参见图3和图4所示的扬声器1的外壳11)贴合，即使得扬声器的第一通孔(参见图3和图4所示的扬声器1的第一通孔111a)与前壳21的第二通孔211a沿厚度方向Z具有间隔，从而通过该凸起部211b、外壳(参见图3和图4所示的扬声器1的外壳11)和第一安装部211围成缓冲空间，该缓冲空间能够提高第一腔体与第三腔体(参见图14所示的第一腔体113和第三腔体4)之间气流的均匀性，从而进一步提高扬声器的音质。
其中，本申请实施例中的凸起部211b的大小、形状、个数可以不做限定，即该第一安装部211可以设置一个凸起部211b，也可以设置多个凸起部211b。当设置多个凸起部211b时，各凸起部211b的形状和大小可以相同，也可以不同，各凸起部211b可以均匀分布，也可以随机分布。另外，各凸起部211b的形状可以相同，也可以不同，可以为规则形状，也可以为不规则形状。
在一种具体实施例中，该第一安装部211可以设置有多个凸起部211b，且各凸起部211b呈间隔分布，即相邻凸起部211b之间具有间隙，其中，各凸起部211b之间的间隙可以相同，也可以不同。当各凸起部211b之间的间隙相同时，各凸起部211b均匀分布于第一安装部211。
具体地，多个凸起部211b可以围成圆形结构，也可以围成方形结构，或者围成其他形状，本申请对凸起部211b的具体形状不做限定。
在另一种具体实施例中，多个凸起部211b连接形成环形结构，且该环形结构包围第二通孔211a。
本实施例中，多个凸起部211b连接形成环形结构时，能够便于加工，且能够提高该前壳21的强度，从而提高电子设备的使用寿命。
在另一种具体实施中，如图15所示，该凸起部211b包括相切的圆弧形结构和直线型结构，且该凸起部211b与前壳21的凸棱213连接，且二者连接后包围第二通孔211a。本实施例中，前壳21的凸棱213参与包围第二通孔211a，从而能够减小凸起 部211b的体积和重量，降低电子设备的重量。
另一方面，本实施例中的前壳21设置凸起部211b后，当前壳21与扬声器1之间设置第一密封件(参见图14，沿厚度方向Z，前壳21与扬声器1之间设置有第一密封件5)时，该第一密封件(参见图14所示的第一密封件5)能够位于上述缓冲空间内，从而提高第一密封件5的安装稳定性，进而提高第一腔体与第三腔体(参见图14所示的第一腔体113与第三腔体4)之间的气密性。第一密封件在未压缩状态时，该第一密封件的高度高于凸起部211b的高度。第一密封件在压缩状态(通过前壳与扬声器压缩)时，该第一密封件的高度与凸起部211b的高度相同，此时，第一密封件的压缩量可以为50％～70％。
以上各实施例中，凸起部211b的形状可以为圆形、方形、锥形等规则形状，也可以为不规则形状，本申请对凸起部211b的具体形状不做限定。具体地，凸起部211b的中心与第一通孔211b之间的距离可以为1mm～2mm，例如，可以为1.45mm。该距离的设置能够容纳并限位第一密封件，从而提高其安装可靠性。
更具体地，如图15所示，该前壳21的第一安装部211设置有一个或多个安装柱211c，该安装柱211c设置有第二安装孔211d。当扬声器安装于前壳21时，扬声器的第一安装孔(参见图3所示的第一安装孔115)与前壳21的第二安装孔211d对应连通，紧固件(例如螺钉等)能够穿过该第一安装孔115和第二安装孔211d，从而实现扬声器1与前壳21的连接。
在另一种具体实施例中，如图16所示，当上述第一腔体113与第三腔体4之间的距离较远使得二者无法直接连通时，该电子设备还可以包括连通管13，该连通管13的一端与扬声器1的第一腔体连通，另一端与第三腔体4连通。因此，本实施例中，通过连通管13也能够实现第一腔体和第三腔体4之间的连通，从而增大扬声器1的后腔体积，提升扬声器1和电子设备的音质。
具体地，该连通管13与扬声器1的第一腔体之间密封，连通管13与第三腔体4之间密封，例如可以通过点胶或其他方式实现密封。
如图16所示的实施例中，该电子设备为笔记本电脑，此时，其用于容纳显示模组的第三腔体4位于显示屏部分，扬声器1安装于键盘部分。本实施例中，第三腔体4与扬声器1的第一腔体之间的距离较远，二者之间需要通过该连通管13实现连通。
当然，当电子设备为手机时，第三腔体4与扬声器1的第一腔体之间也可以通过连通管13连通。
更具体地，如图17所示，该连通管13的截面可以为圆形、方形或其他形状，且该连通管13可以为能够变形的柔性材质，从而便于在电子设备内部布置，并能够避让电子设备的其他部件。
需要指出的是，本专利申请文件的一部分包含受著作权保护的内容。除了对专利局的专利文件或记录的专利文档内容制作副本以外，著作权人保留著作权。

Claims (15)

  1. 一种电子设备，其特征在于，所述电子设备包括：
    壳体；
    扬声器，安装于所述壳体，且所述扬声器包括第一腔体；
    屏幕组件，安装于所述壳体，且所述屏幕组件包括显示模组和盖板，所述盖板与所述壳体围成用于容纳所述显示模组的第三腔体；
    其中，所述第一腔体与所述第三腔体连通。
  2. 根据权利要求1所述的电子设备，其特征在于，所述扬声器包括外壳，所述外壳围成所述第一腔体，所述外壳设置有与所述第一腔体连通的第一通孔；
    所述壳体包括前壳，沿所述电子设备的厚度方向，所述扬声器和所述屏幕组件安装于所述前壳的两端；
    所述前壳设置有与所述第三腔体连通的第二通孔，以使所述第一腔体与所述第三腔体通过所述第一通孔和所述第二通孔连通。
  3. 根据权利要求2所述的电子设备，其特征在于，所述前壳还设置有凸起部，所述凸起部沿垂直于所述前壳的表面的方向延伸，所述凸起部包围所述第二通孔；
    所述扬声器、所述前壳和所述凸起部围成缓冲空间，所述第二通孔位于所述缓冲空间内。
  4. 根据权利要求3所述的电子设备，其特征在于，所述凸起部为多个，且间隔分布，各所述凸起部包围所述第二通孔。
  5. 根据权利要求3所述的电子设备，其特征在于，多个所述凸起部连接形成环形结构，且所述环形结构包围所述第二通孔。
  6. 根据权利要求3所述的电子设备，其特征在于，所述前壳设置有凸棱，所述凸棱沿垂直于所述前壳的表面的方向凸起；
    所述凸起部与所述凸棱连接，所述扬声器、所述前壳、所述凸棱和所述凸起部围成所述缓冲空间。
  7. 根据权利要求3所述的电子设备，其特征在于，所述电子设备还包括第一密封件，沿所述电子设备的厚度方向，所述第一密封件位于所述前壳和所述扬声器之间；
    所述第一密封件包围所述第一通孔和所述第二通孔。
  8. 根据权利要求7所述的电子设备，其特征在于，所述第一密封件安装于所述缓冲空间内，并与所述凸起部抵接。
  9. 根据权利要求1所述的电子设备，其特征在于，所述电子设备还包括连通管，所述连通管一端连通所述第一腔体，另一端连通所述第三腔体。
  10. 根据权利要求9所述的电子设备，其特征在于，所述连通管与所述第一腔体的连接处密封，所述连通管与所述第三腔体的连接处密封。
  11. 根据权利要求9所述的电子设备，其特征在于，所述连通管为柔性材质。
  12. 根据权利要求1～11中任一项所述的电子设备，其特征在于，所述第三腔体 包括相互隔开的第一分腔和第二分腔，所述第一分腔沿所述电子设备厚度方向的截面积大于所述第二分腔沿所述电子设备厚度方向的截面积；
    所述第一腔体与所述第一分腔连通。
  13. 根据权利要求12所述的电子设备，其特征在于，所述电子设备还包括第二密封件，沿所述电子设备的厚度方向，所述第二密封件位于所述壳体与所述显示模组之间，并用于隔开所述第一分腔和所述第二分腔。
  14. 根据权利要求13所述的电子设备，其特征在于，所述壳体包括前壳和边框，所述边框连接于所述前壳的外周；
    所述第二密封件沿所述电子设备的宽度方向延伸，且其沿宽度方向的两端分别与所述边框抵接，所述盖板、所述前壳、所述边框和所述第二密封件围成所述第一分腔。
  15. 根据权利要求14所述的电子设备，其特征在于，所述前壳包括用于安装所述扬声器的第一安装部；
    所述第一安装部、所述盖板、所述边框和所述第二密封件围成所述第一分腔。
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