WO2024251083A1 - 麦克风的防水密封机构和电子设备 - Google Patents

麦克风的防水密封机构和电子设备 Download PDF

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Publication number
WO2024251083A1
WO2024251083A1 PCT/CN2024/097052 CN2024097052W WO2024251083A1 WO 2024251083 A1 WO2024251083 A1 WO 2024251083A1 CN 2024097052 W CN2024097052 W CN 2024097052W WO 2024251083 A1 WO2024251083 A1 WO 2024251083A1
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WO
WIPO (PCT)
Prior art keywords
sound
hole
waterproof
device housing
transmitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/097052
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English (en)
French (fr)
Inventor
李俊楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Hikvision Digital Technology Co Ltd
Original Assignee
Hangzhou Hikvision Digital Technology Co Ltd
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Filing date
Publication date
Application filed by Hangzhou Hikvision Digital Technology Co Ltd filed Critical Hangzhou Hikvision Digital Technology Co Ltd
Publication of WO2024251083A1 publication Critical patent/WO2024251083A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/44—Special adaptations for subaqueous use, e.g. for hydrophone

Definitions

  • the present application relates to waterproof sealing technology, and in particular to a waterproof sealing mechanism of a microphone, and an electronic device using the waterproof sealing mechanism of the microphone.
  • An electronic device that needs to collect sound waves usually has a microphone installed inside, and the electronic device also has a sound-transmitting hole in the device casing so that sound waves in the environment where the electronic device is located can be transmitted from the sound-transmitting hole to the microphone inside the device casing.
  • Embodiments of the present application provide a waterproof sealing mechanism for a microphone and an electronic device.
  • a waterproof sealing mechanism of a microphone may include: a device housing, the device housing being provided with a sound-transmitting through hole; a module substrate, the module substrate being fixedly mounted on the inner surface of the device housing, and the module substrate being provided with a sound pickup hole corresponding to the position of the sound-transmitting through hole, wherein the microphone is fixedly mounted on the surface of the module substrate facing away from the device housing, and the microphone covers the sound pickup hole to form a sound transmission channel penetrating the sound pickup hole between the microphone and the sound-transmitting through hole; a waterproof sound-transmitting membrane, the waterproof sound-transmitting membrane being horizontally placed in the sound transmission channel; and a sealing film, the sealing film being sealed and stacked together with the waterproof sound-transmitting membrane between the module substrate and the device housing, the sealing film being provided with a sound transmission hole penetrated by the sound transmission channel, the sound transmission channel penetrating the waterproof sound-transmitting membrane being sealed and surrounded by the
  • the first opening end of the sound-transmitting hole is sealed and docked with the sound-transmitting through hole on the inner surface of the device housing facing the module substrate
  • the second opening end of the sound-transmitting hole is sealed and docked with the sound pickup hole on the surface of the module substrate facing the device housing
  • the waterproof sound-transmitting membrane is stacked between the first opening end of the sound-transmitting hole and the sound-transmitting through hole, or between the second opening end of the sound-transmitting hole and the sound pickup hole.
  • the sealing film is in sealing contact with at least one of the device housing and the module substrate at the periphery of the sound-transmitting hole to form a sealed partition between the device housing and the module substrate that surrounds the periphery of the sound-transmitting hole.
  • the size of the waterproof sound-permeable membrane is adapted to the radial size of the sound transmission channel
  • the size of the sealing film is adapted to the radial size of the module substrate
  • the size of the sealing film is larger than the size of the waterproof sound-permeable membrane
  • the inner surface of the device housing has a positioning groove, and the sound-transmitting through hole is opened at the bottom of the positioning groove; the sealing film is positioned and matched with the positioning groove so that the sound-transmitting hole is coaxially aligned with the sound-transmitting through hole; the sealing partition formed by the sealing film between the device housing and the module substrate is located outside the positioning groove.
  • the sealing film has a boss, the sound-permeable hole passes through the boss, the boss protrudes from the surface of the sealing film toward the device housing, and the boss extends into the positioning groove to be positioned and matched with the positioning groove.
  • the waterproof sound-permeable membrane is positioned in the positioning groove, and the waterproof sound-permeable membrane seals and covers the sound-permeable through hole; the sealing film limits the position of the waterproof sound-permeable membrane and presses it onto the bottom surface of the positioning groove.
  • the waterproof sound-permeable membrane is adhered to the bottom surface of the positioning groove, and the positioning groove The bottom surface of the groove is a polished surface.
  • a hole wall of the sound-transmitting through hole at an open end of the bottom of the positioning groove is an arc-shaped wall.
  • the surface of the sealing film facing the module substrate has a recessed groove coaxially arranged with the boss; the waterproof sound-permeable membrane is positioned in the recessed groove, and the recessed groove limits and presses the waterproof sound-permeable membrane on the surface of the module substrate facing the device housing, and the waterproof sound-permeable membrane seals and covers the pickup hole on the surface of the module substrate facing the device housing.
  • the waterproof sound-permeable membrane is adhered to a surface of the module substrate facing the device housing, and the surface of the module substrate facing the device housing is a polished surface.
  • the sealing film has a convex rib that is closed around the periphery of the sound-transmitting hole, wherein: the convex rib is distributed on the surface of the sealing film facing the device housing, and the convex rib is in sealing contact with the device housing outside the positioning groove to form the sealed partition that is closed around the periphery of the sound-transmitting hole; and/or the convex rib is distributed on the surface of the sealing film facing the module substrate, and the convex rib is in sealing contact with the module substrate outside the positioning groove to form the sealed partition that is closed around the periphery of the sound-transmitting hole.
  • a hole wall of the sound-transmitting through hole at an opening end facing the microphone is an arc-shaped wall.
  • the waterproof sealing mechanism also includes a mesh protective membrane, which is stacked on at least one side surface of the waterproof sound-permeable membrane, the size of the mesh protective membrane is the same as the size of the waterproof sound-permeable membrane, and the strength of the mesh protective membrane is greater than the strength of the waterproof sound-permeable membrane.
  • the radial dimension of the sound-transmitting through hole is larger than the radial dimension of the sound pickup hole, and the radial dimension of the sound-transmitting hole is not smaller than the radial dimension of the sound-transmitting through hole; the opening end of the sound-transmitting through hole away from the waterproof sound-transmitting membrane is recessed relative to the outer surface of the device housing, and is connected to the outer surface of the device housing through a conical opening, and the radial dimension of the conical opening increases monotonically in the direction from the sound-transmitting through hole to the outer surface of the device housing.
  • the plurality of microphones and the plurality of sound pickup holes are coplanarly distributed in a multi-circle ring shape on the module substrate; the number of the plurality of sound-transmitting through holes and their coplanar distribution on the device housing are the same as those of the plurality of microphones and the plurality of sound pickup holes; the number of the plurality of sound-transmitting holes and their coplanar distribution on the sealing film are the same as those of the plurality of microphones and the plurality of sound pickup holes; the size of the sealing film is adapted to the size of the module substrate, the waterproof sound-transmitting membrane that seals and covers each of the sound-transmitting through holes is limited and crimped by the sealing film, and the sealing contact position between the sealing film and the device housing is distributed on the periphery of each of the sound-transmitting through holes that are sealed and covered by the waterproof sound-transmitting membrane.
  • the area of the device housing where the sound-transmitting through holes are deployed is flat; the module substrate is flat; the area is stacked parallel to the module substrate, and the module substrate is fixed to the device housing by multiple screws deployed in a ring.
  • an electronic device may include a microphone and the waterproof sealing mechanism of the microphone described in the first aspect.
  • a sound transmission channel can be formed between the sound-transmitting through hole opened in the device housing and the microphone installed on the module substrate, and a waterproof sound-transmitting membrane and a sealing film are also sealed and stacked between the module substrate and the device housing, wherein the waterproof sound-transmitting membrane is horizontally placed in the sound transmission channel, and the sound-transmitting hole of the sealing film seals and surrounds the sound transmission channel that passes through the waterproof sound-transmitting membrane between the sound pickup hole and the sound-transmitting through hole of the module substrate, so as to achieve waterproof sealing of the sound transmission channel without affecting the propagation of sound waves along the sound transmission channel.
  • the sealing film also forms a sealed partition that is closed around the outer periphery of the waterproof sound-transmitting membrane between the device housing and the module substrate, so as to achieve secondary waterproof sealing of the sound transmission channel.
  • the effect of the sound-permeable through hole on the sealing of the device housing can be improved.
  • the sealing consistency of the multiple sound-permeable through holes can also be ensured.
  • FIG. 1 is a schematic diagram of the exploded structure of a waterproof sealing mechanism of a microphone in one embodiment of the present application.
  • FIG. 2 is a schematic diagram showing the distribution of microphones of the waterproof sealing mechanism of the microphone shown in FIG. 1 .
  • FIG. 3 is a schematic structural diagram of a device housing adapted to the waterproof sealing mechanism of the microphone shown in FIG. 1 .
  • FIG. 4 is a cross-sectional view of a first assembly structure example of the waterproof sealing mechanism of the microphone shown in FIG. 1 .
  • FIG. 5 is a cross-sectional view of a second assembly structure example of the waterproof sealing mechanism of the microphone shown in FIG. 1 .
  • FIG. 6 is a cross-sectional view of a third assembly structure example of the waterproof sealing mechanism of the microphone shown in FIG. 1 .
  • FIG. 7 is a schematic diagram of an exploded structure of an electronic device in another embodiment of the present application.
  • FIG. 8 is a schematic diagram of a semi-assembled structure of the electronic device shown in FIG. 7 .
  • FIG. 9 is a cross-sectional view of the assembly structure of the electronic device shown in FIG. 7 .
  • FIG. 10 is a schematic diagram of the exploded structure of the optical imaging module of the electronic device shown in FIG. 7 .
  • FIG. 11 is a schematic diagram of the exploded structure of the light-emitting lamp assembly of the electronic device shown in FIG. 7 .
  • FIG. 12 is a cross-sectional view of the assembly structure of the light-emitting lamp assembly shown in FIG. 11 .
  • the sound-transmitting through hole will affect the sealing of the device housing of the electronic device. Even if the opening size of the sound-transmitting through hole is reduced to reduce the impact of the sound-transmitting through hole on the sealing, the sound-transmitting through hole still cannot have a sealing effect, and it will also cause the intensity of the sound waves transmitted to the microphone to be too small, thereby limiting the effect of sound wave collection.
  • embodiments of the present application provide a waterproof sealing mechanism for a microphone and an electronic device.
  • Fig. 1 is a schematic diagram of the exploded structure of a waterproof sealing mechanism of a microphone in an embodiment of the present application.
  • the waterproof sealing mechanism of the microphone may include a device housing 10 and a sound wave collection module 50 .
  • the device housing 10 may be a hard component with any shape and any material.
  • the device housing 10 shown in FIG1 is only a part thereof, and it should not be understood that the actual shape of the device housing 10 is limited to the partial shape shown in FIG1.
  • the device housing 10 is provided with a sound-permeable through hole 115.
  • the sound wave collection module 50 may include a module substrate 510 and a microphone 500.
  • the module substrate 510 is fixedly mounted on the inner surface of the device housing 10, and the module substrate 510 is provided with a sound pickup hole 515 corresponding to the position of the sound-transmitting through hole 115.
  • the microphone 500 may be fixedly mounted on the surface of the module substrate 510 facing away from the device housing 10, and the microphone 500 covers the sound pickup hole 515 to form a sound transmission channel between the microphone 500 and the sound-transmitting through hole 115 that passes through the sound pickup hole 515.
  • FIG2 is a schematic diagram of the distribution of microphones of the waterproof sealing mechanism of the microphone shown in FIG1.
  • the sound wave collection module 50 may include a plurality of microphones 500, and a plurality of pickup holes 515 corresponding to the plurality of microphones 500 are correspondingly provided. That is, the module substrate 510 of the sound wave collection module 50 may be deployed with a microphone array including a plurality of microphones 500.
  • 64 microphones 500 are distributed in the form of 8 microphones per circle and a total of 8 circles (as shown by the circle auxiliary lines represented by dotted lines in FIG2).
  • the inner surface of the device housing 10 may also have at least two module positioning columns 117.
  • the module substrate 510 may also have at least two substrate positioning holes 517 corresponding to the positions of the at least two module positioning columns 117.
  • the module substrate 510 is constrained to an assembly posture that makes the sound pickup hole 515 coaxially aligned with the sound transmission hole 525 (described later) and the sound transmission through hole 115.
  • the "coaxial alignment" described herein may mean that the single-side gap does not exceed 0.5 mm.
  • the sound wave collection module 50 may further include a waterproof sound-permeable membrane 550 and a sealing film 520 .
  • the waterproof sound-permeable membrane 550 is placed between the module substrate 510 and the device housing 10, and is horizontally placed in the sound transmission channel of the microphone 500. As shown in FIG1, the sound wave collection module 50 can be provided with a plurality of waterproof sound-permeable membranes 550 corresponding to a plurality of microphones 500.
  • the installation position of the waterproof sound-permeable membrane 550 placed horizontally in the sound transmission channel of the microphone 500 can be any position between the module substrate 510 and the device housing 10.
  • each waterproof sound-permeable membrane 550 can be placed horizontally in the sound transmission channel between the corresponding microphone 500 and the sound-permeable through hole 115 by means such as bonding to the inner surface of the device housing 10 facing the module substrate 510, and sealingly covering the corresponding sound-permeable through hole 115 on the inner surface of the device housing 10, and forming a waterproof barrier.
  • each waterproof sound-permeable membrane 550 can be placed horizontally in the sound transmission channel between the corresponding microphone 500 and the sound-permeable through hole 115 by means such as bonding to the surface of the module substrate 510 facing the device housing 10, and sealingly covering the corresponding sound pickup hole 515 on the surface of the module substrate 510, and can also be placed horizontally in the sound transmission channel between the corresponding microphone 500 and the sound-permeable through hole 115, and forming a waterproof barrier.
  • the number of waterproof sound-permeable membranes 550 can be the same as the number of sound-permeable through holes 115, and the size of the waterproof sound-permeable membrane 550 can be adapted to the radial size of the sound transmission channel (for example, larger than or slightly larger than the radial size of the sound-permeable through hole 115).
  • the size of the waterproof sound-permeable membrane 550 is adapted to the radial size of the sound transmission channel, and at least includes the following size constraints: the size of the waterproof sound-permeable membrane 550 is not less than the radial size of the sound-permeable through hole 115, and has an edge margin that facilitates the installation of the waterproof sound-permeable membrane 550.
  • the sealing film 520 and the waterproof sound-permeable membrane 550 are sealed and stacked between the module substrate 510 and the device housing 10, and the sealing film 520 is provided with sound-permeable holes 525 corresponding to the positions of the sound-permeable through holes 115 and the sound pickup holes 515 (i.e., one-to-one correspondence) and penetrated by the corresponding sound transmission channels. That is, a sound transmission channel penetrating the sound pickup holes 515 and the sound-permeable holes 525 is formed between each microphone 500 and the corresponding sound-permeable through holes 115.
  • the size of the waterproof sound-permeable membrane 550 is adapted to the radial size of the sound transmission channel, and at least includes the following size constraints: the size of the waterproof sound-permeable membrane 550 is not less than the radial size of the sound transmission hole 525.
  • the sealing film 520 that is sealed and stacked between the module substrate 510 and the device housing 10 together with the waterproof sound-permeable membrane 550 can form a limited pressure connection for the waterproof sound-permeable membrane 550.
  • the sealing film 520 can limit the pressure connection of the waterproof sound-permeable membrane 550 on the inner surface of the device housing 10 facing the module substrate 510.
  • the sealing film 520 can limit the pressure connection of the waterproof sound-permeable membrane 550 on the surface of the module substrate 510 facing the device housing 10.
  • the sound-permeable hole 525 of the sealing film 520 seals and surrounds the sound transmission channel passing through the waterproof sound-permeable membrane 550 between the corresponding sound pickup hole 515 and the sound-permeable through hole 115, so as to achieve waterproof sealing of the sound transmission channel without affecting the propagation of sound waves along the sound transmission channel.
  • sealed enclosure may mean that the sound transmission channel penetrating the waterproof sound-permeable membrane 550 is sealed and surrounded by the hole wall of the sound-permeable hole 525 between the sound pickup hole 515 and the sound-permeable through hole 115.
  • the first opening end of the sound-permeable hole 525 facing the device housing 10 may be sealed and docked (e.g., seamlessly docked) with the sound-permeable through hole 115 on the inner surface of the device housing 10 facing the module substrate 510
  • the second opening end of the sound-permeable hole 525 facing the module substrate 510 may be sealed and docked (e.g., seamlessly docked) with the sound pickup hole 515 on the surface of the module substrate 510 facing the device housing 10.
  • the waterproof sound-permeable membrane 550 is sealed and docked with the sound pickup hole 515 on the inner surface of the device housing 10 facing the module substrate 510.
  • the sound-permeable membrane 550 is stacked between the first opening end of the sound-permeable hole 525 and the sound-permeable through hole 115, and seals and covers the sound-permeable through hole 115 on the inner surface of the device housing 10 facing the module substrate 510, or the waterproof sound-permeable membrane 550 is stacked between the second opening end of the sound-permeable hole 525 and the sound pickup hole 515, and seals and covers the sound pickup hole 515 on the surface of the module substrate 510 facing the device housing 10.
  • the size of the sealing film 520 can be larger than the size of the waterproof sound-permeable membrane 550.
  • the size of the sealing film 520 can be adapted to the size of the module substrate 510, that is, in the case where the sound wave collection module 50 includes multiple microphones 500, the size of the sealing film 520 can cover the area of all sound-permeable through holes 115 opened in the device housing 10 like the module substrate 510, and each waterproof sound-permeable membrane 550 that seals and covers each sound-permeable through hole 115 or sound pickup hole 515 is limited and crimped by the same piece of sealing film 520.
  • the sealing film 520 can also form a sealed partition between the device housing 10 and the module substrate 510 that is closed around the outer periphery of the sound-transmitting hole 525, so as to achieve a secondary waterproof seal of the sound transmission channel that is sealed and surrounded by the sound-transmitting hole 525.
  • the sealed partition formed by the sealing film 520 between the device housing 10 and the module substrate 510 can include the sealing film 520 being in sealed contact with at least one of the device housing 10 and the module substrate 510 on the outer periphery of the waterproof sound-permeable membrane 550.
  • the sealing contact position of the sealing film 520 with at least one of the device housing 10 and the module substrate 510 is distributed on the periphery of the corresponding sound-transmitting through hole 115 or the sound pickup hole 515 sealed and covered by each waterproof sound-transmitting membrane 550.
  • the influence of the sound-permeable through hole 115 on the sealing of the device housing can be improved.
  • the sealing consistency of the plurality of sound-permeable through holes can also be ensured.
  • FIG. 1 shows that the area (e.g., the housing panel) of the device housing 10 where the sound-transmitting through hole 115 is deployed is in the shape of a flat plate.
  • the module substrate 510 is also in the shape of a flat plate.
  • the module substrate 510 may be a PCB (Printed Circuit Board).
  • the module substrate 510 may be stacked in parallel with the area of the device housing 10 where the sound-transmitting through hole 115 is deployed, so that the sound transmission channels connecting each microphone 500 and the corresponding sound-transmitting through hole 115 are of equal length, thereby ensuring that the pickup consistency between the microphones 500 in the microphone array is achieved.
  • the number of the multiple sound-transmitting through holes 115 and the coplanar distribution method in the device housing 10 are the same as the multiple microphones 500 and the multiple sound pickup holes 515
  • the number of the multiple waterproof sound-transmitting membranes 550 and the coplanar distribution method in the device housing 10 and/or the module substrate 510 are the same as the multiple microphones 500 and the multiple sound pickup holes 515.
  • the sealing film 520 stacked between the module substrate 510 and the inner surface of the device housing 10 is also flat, and the number of the multiple sound-transmitting holes 525 of the sealing film 520 and the coplanar distribution method in the sealing film 520 are also the same as the multiple microphones 500 and the multiple sound pickup holes 515.
  • the module substrate 510 can be fixed to the device housing 10 by multiple screws 590 arranged in a ring (for example, at least two circles of ring arrangement) to avoid uneven lengths of the sound transmission channels between each microphone 500 and the corresponding sound-permeable through hole 115 due to uneven force on the module substrate 510.
  • 16 screws 590 are divided into 3 circles, and the number of single-circle screws 590 in the 3 circles is distributed in the form of 4, 4, and 8 from the inside to the outside.
  • the distance between adjacent screws 590 should be set to The arrangement is to help make the overall stress-strain uniformity of the module substrate 510 greater than 90%.
  • the sealing film 520 is an integrally formed part adapted to the size of the module substrate 510, the sealing film 520 can have a uniform compression amount sufficient to produce a sealing effect in the thickness direction. For example, when the Shore hardness of the sealing film 520 is in the range of 28 to 32 degrees, the sealing film 520 can have a compression amount of 12% to 18% (preferably 15%).
  • the embodiments of the present application only take a microphone array including multiple microphones 500 as an example, but for a single microphone deployment scheme including only one microphone 500, the two-stage sealing scheme using a waterproof sound-permeable membrane 550 and a sealing film 520 is still applicable.
  • the sealing film 520 may also have at least two film positioning holes 527 corresponding to the positions of the at least two module positioning posts 117. Moreover, based on the one-to-one corresponding positioning cooperation between the at least two module positioning posts 117 and the at least two film positioning holes 527, the sealing film 520 is constrained to an assembly posture in which the sound-transmitting hole 525 is coaxially aligned with the sound-transmitting through hole 115 and the sound pickup hole 515.
  • a structure for positioning and matching may be provided for the sealing film 520 and the device housing 10 .
  • Fig. 3 is a schematic diagram of the structure of a device housing adapted to the waterproof sealing mechanism of the microphone shown in Fig. 1.
  • the inner surface of the device housing 10 has a corresponding positioning groove 114, and the sound-transmitting through hole 115 of the sound transmission channel is opened at the bottom of the corresponding positioning groove 114.
  • FIG4 is a cross-sectional view of a first assembly structure example of the waterproof sealing mechanism of the microphone shown in FIG1.
  • FIG5 is a cross-sectional view of a second assembly structure example of the waterproof sealing mechanism of the microphone shown in FIG1.
  • FIG6 is a cross-sectional view of a third assembly structure example of the waterproof sealing mechanism of the microphone shown in FIG1. Please refer to FIG3 and further combine FIG4 to FIG6. If the inner surface of the device housing 10 has a corresponding positioning groove 114, the sealing film 520 can be positioned and matched with the positioning groove 114, and the positioning and matching aligns the sound-transmitting hole 525 with the sound-transmitting through hole 115.
  • the sealing partition formed by the sealing film 520 between the device housing 10 and the module substrate 510 is located outside the positioning groove 114, that is, the sealing contact position of the sealing film 520 with at least one of the device housing 10 and the module substrate 510 is located outside the positioning groove 114.
  • the sealing film 520 may have a boss 526 that closes around each sound-transmitting hole 525, that is, the sound-transmitting hole 525 passes through the boss 526.
  • the boss 526 that closes around each sound-transmitting hole 525 protrudes from the surface of the sealing film 520 toward the device housing 10, and extends into the positioning groove 114 where the corresponding sound-transmitting through hole 115 is located, and is positioned and matched with the positioning groove 114.
  • the waterproof sound-permeable membrane 550 placed horizontally in each sound transmission channel is positioned in the positioning groove 114 and seals and covers the corresponding sound-permeable through hole 115 arranged at the bottom of the positioning groove 114.
  • the radial dimensions of the positioning groove 114 and the boss 526 can be the same as or compatible with the radial dimensions of the waterproof sound-permeable membrane 550, and the waterproof sound-permeable membrane 550 can be adhered to the bottom surface of the positioning groove 114.
  • the sealing film 520 limits the waterproof sound-permeable membrane 550 and presses it onto the inner surface of the device housing 10 (such as the bottom surface of the positioning groove 114), thereby reducing the waterproof
  • the bonding gap between the water-permeable sound-permeable membrane 550 and the inner surface of the device housing 10 (such as the bottom surface of the positioning groove 114 ) can further improve the sealing performance of the water-permeable sound-permeable membrane 550 to the sound-permeable through hole 115 .
  • the waterproof sound-permeable membrane 550 can be pasted on the inner surface of the device housing 10, the limited pressing of the sealing film 520 (e.g., the boss 526) on the waterproof sound-permeable membrane 550 can also help improve the adhesion tightness between the waterproof sound-permeable membrane 550 and the inner surface of the device housing 10.
  • the inner surface of the device housing 10 e.g., the bottom surface of the positioning groove 114 can be a polished surface to improve the sealing by reducing the bonding gap between the waterproof sound-permeable membrane 550 and the inner surface of the device housing 10.
  • the polishing degree of the polished surface can be not less than 400 mesh.
  • the waterproof sound-permeable membrane 550 disposed horizontally in each sound transmission channel is indirectly positioned by the positioning groove 114 through the sealing film 520, and the corresponding sound pickup hole 515 is sealed and covered on the surface of the module substrate 510 facing the device housing 10.
  • the surface of the sealing film 520 facing the module substrate 510 has a recessed groove 529 coaxially arranged with the boss 526, and the waterproof sound-permeable membrane 550 is positioned in the recessed groove 529, and the waterproof sound-permeable membrane 550 seals and covers the sound pickup hole 515 on the surface of the module substrate 510 facing the device housing 10.
  • the radial dimensions of the positioning groove 114 and the boss 526 can be greater than the radial dimensions of the waterproof sound-permeable membrane 550, and the radial dimensions of the recessed groove 529 can be the same as or compatible with the radial dimensions of the waterproof sound-permeable membrane 550.
  • the waterproof sound-permeable membrane 550 can be attached to the surface of the module substrate 510 facing the device housing 10.
  • the sealing film 520 limits and presses the waterproof sound-permeable membrane 550 onto the surface of the module substrate 510 facing the device housing 10, thereby reducing the bonding gap between the waterproof sound-permeable membrane 550 and the surface of the module substrate 510 facing the device housing 10, thereby improving the sealing performance of the waterproof sound-permeable membrane 550 to the sound pickup hole 515.
  • the surface of the module substrate 510 facing the device housing 10 is a polished surface, for example, the polishing degree of the polished surface can be not less than 400 mesh.
  • the waterproof sound-permeable membrane 550 is sealed to cover the sound-permeable through hole 115 on the inner surface of the device housing 10 facing the module substrate 510, or is sealed to cover the pickup hole 515 on the surface of the module substrate 510 facing the device housing 10, the sealing partition formed by the sealing film 520 between the device housing 10 and the module substrate 510 (i.e., the sealing contact between the sealing film 520 and at least one of the device housing 10 and the module substrate 510) can be located outside the positioning groove 114.
  • the sealing film 520 may have a rib 522 that is closed around the outer periphery of the sound-transmitting hole 525, that is, the rib 522 may be annular, and the radial dimension of the rib 522 may be greater than the radial dimension of the boss 526, so that the rib 522 is located outside the positioning groove 114.
  • the convex ribs 522 may be distributed on the surface of the sealing film 520 facing the device housing 10 as shown in Fig. 4 and Fig. 5. In this case, the convex ribs 522 may be in sealing contact with the device housing 10 outside the positioning groove 114 to form a sealed partition between the device housing 10 and the module substrate 510 that is closed around the outer periphery of the waterproof sound-permeable membrane 550.
  • the convex ribs 522 may also be distributed on the surface of the sealing film 520 facing the device housing 10 and the surface of the sealing film 520 facing the module substrate 510 as shown in FIG6 .
  • the convex ribs 522 may be in sealing contact with the device housing 10 and the module substrate 510 outside the positioning groove 114 to form a sealed partition between the device housing 10 and the module substrate 510 that is closed around the outer periphery of the waterproof sound-permeable membrane 550.
  • the ribs 522 may be distributed on the surface of the sealing film 520 facing the device housing 10 and/or the surface of the sealing film 520 facing the module substrate 510, and the ribs 522 may be disposed outside the positioning groove 114 and contact the device housing 10. At least one of the device housing 10 and the module substrate 510 is in sealing contact, so that a sealing partition is formed between the device housing 10 and the module substrate 510 by using the sealing film 520 to enclose the outer periphery of the waterproof sound-permeable membrane 550 .
  • the thickness of the waterproof sound-permeable membrane 550 can be 0.1 mm, which is easily damaged by external forces (such as wind and rain in an outdoor environment).
  • external forces such as wind and rain in an outdoor environment.
  • the risk of damage to the waterproof sound-permeable membrane 550 will be higher.
  • an optimization scheme in the embodiment of the present application may include: the hole wall of the opening end of the sound-transmitting through hole 115 corresponding to each microphone 500 adjacent to the waterproof sound-transmitting membrane 550 is an arc-shaped wall, that is, the hole wall of the opening end of each sound-transmitting through hole 115 at the bottom of the positioning groove 114 where it is located is an arc-shaped wall.
  • the nominal radius r0 of the arc-shaped wall can be 0.5 mm.
  • the sound wave collection module 50 may also include a mesh protective film 530, and the mesh protective film 530 is stacked on at least one side surface of the waterproof sound-permeable membrane 550 to play a supporting role for the waterproof sound-permeable membrane 550, that is, the mesh protective film 530 may also be called a supporting film.
  • the size of the mesh protective film 530 is the same as the size of the waterproof sound-permeable membrane 550, and the strength of the mesh protective film 530 is greater than the strength of the waterproof sound-permeable membrane 550.
  • the material of the mesh protective film 530 may include PET (Polyethylene terephthalate) with a mesh number of not less than about 1000 meshes, and the thickness of the mesh protective film 530 may be 0.3 mm.
  • the mesh protective film 530 is stacked between the waterproof and sound-permeable membrane 550 and the sealing film 520 (such as the boss 526) in the positioning groove 114, that is, the mesh protective film 530 is stacked on the side surface of the waterproof and sound-permeable membrane 550 facing the module substrate 510.
  • the mesh protective film 530 is stacked in the positioning groove 114 between the waterproof sound-permeable membrane 550 and the sealing film 520 (such as the boss 526), and between the waterproof sound-permeable membrane 550 and the bottom of the positioning groove 114, that is, the mesh protective film 530 is stacked on the two side surfaces of the waterproof sound-permeable membrane 550 facing the module substrate 510 and the device housing 10 respectively.
  • the mesh protective film 530 is stacked between the waterproof sound-permeable membrane 550 and the sealing film 520 in the recessed groove 529 , that is, the mesh protective film 530 is stacked on a side surface of the waterproof sound-permeable membrane 550 facing the device housing 10 .
  • the multiple microphones 500 and the multiple sound pickup holes 515 are coplanarly distributed in a multi-circle annular pattern on the module substrate 510, there are also multiple mesh protective films 530, and the number of the multiple mesh protective films 530 can be the same as the number of the multiple waterproof sound-permeable films 550, or twice the number of the multiple waterproof sound-permeable films 550.
  • the coplanar distribution of the multiple mesh protective films 530 on the device housing 10 is the same as that of the multiple microphones 500, the multiple sound pickup holes 515, and the multiple waterproof sound-permeable films 550.
  • the radial dimension of the sound-transmitting through hole 115 (for example, 4 mm) is larger than the radial dimension of the sound pickup hole 515, and the radial dimension of the sound-transmitting hole 525 (for example, 5 mm) is not smaller than the radial dimension of the sound-transmitting through hole 115.
  • the caliber of each sound transmission channel on the sound input side can be expanded to enhance the signal strength of the sound wave signal transmitted to the microphone 500 through the sound transmission channel.
  • the opening end of the sound-transmitting through hole 115 away from the waterproof sound-transmitting membrane 550 is concave relative to the outer surface of the device housing 10 facing away from the device housing cover 20 (shown in FIG. 7 ), and the opening end of the sound-transmitting through hole 115 away from the waterproof sound-transmitting membrane 550 is connected to the outer surface of the device housing 10 through a conical opening 116.
  • the radial dimension of the conical opening 116 is 1.1 mm from the sound-transmitting through hole 115 to the outer surface of the device housing 10.
  • the tapered opening 116 increases monotonically in the direction to the outer surface of the device housing 10.
  • the tapered opening 116 can form a bell mouth for expanding sound waves outside the sound-transmitting through hole 115.
  • the nominal axial dimension of the tapered opening 116 is 1.5 mm, and the inclination angle of the tapered wall of the tapered opening 116 relative to the axial direction is in the range of 30° to 35°.
  • the horn mouth formed by the conical opening 116 can be regarded as an area connected to the external environment, so the concave of the sound-transmitting through hole 115 actually shortens the channel length of the sound transmission channel, which helps to improve the signal-to-noise ratio of the sound wave signal collected by the microphone 500.
  • the horn mouth formed by the conical opening 116 can prevent rainwater in the outdoor environment from remaining and accumulating in the sound-transmitting through hole 115, thereby reducing the probability of corrosion of the waterproof sound-transmitting membrane 550, and reducing the probability of sealing failure of the sound-transmitting through hole 115 caused by corrosion and damage of the waterproof sound-transmitting membrane 550.
  • the sound wave collection module 50 in the waterproof sealing mechanism of the microphone may also coexist with modules with other functions.
  • an area for deploying modules with other functions may be reserved at the annular center position of the above-mentioned annular coplanar distribution.
  • the module substrate 510 may also have a substrate avoidance hole 513, and the sealing film 520 may have a film avoidance hole 523.
  • the device housing 10 may be provided with a through hole 113 at the annular center position of the above-mentioned annular coplanar distribution, wherein if the module with other functions is a speaker, the through hole 113 may be a mesh for covering the sound-emitting surface of the speaker, or, if the module with other functions is an optical imaging module, the through hole 113 may be an imaging through hole for avoiding the imaging field of view of the lens assembly of the optical imaging module.
  • the substrate avoidance hole 513 and the film avoidance hole 523 both correspond to the position of the through hole 113.
  • FIG7 is a schematic diagram of the exploded structure of an electronic device in another embodiment of the present application.
  • FIG8 is a schematic diagram of the semi-assembled structure of the electronic device as shown in FIG7.
  • FIG9 is a cross-sectional view of the assembled structure of the electronic device as shown in FIG7.
  • the electronic device can be used to implement combined video and audio detection on the target object.
  • the electronic device may include a device housing 10, a device housing cover 20, an optical imaging module 30, the sound wave acquisition module 50 in the aforementioned embodiment, and a main control module 60.
  • the device housing 10 and the device housing cover 20 can be assembled with each other to provide a housing cavity for accommodating components of the electronic device.
  • the device housing 10 may include a housing panel 110.
  • the area of the device housing 10 mentioned in the above embodiment where the sound-transmitting through hole 115 is disposed may be located at the housing panel 110. That is, the local structure of the device housing 10 shown in FIG. 1 may be considered as a part of the housing panel 110. Accordingly, the imaging through hole 113 and the sound-transmitting through hole 115 may both be located at the housing panel 110.
  • the device housing 10 may further include a panel periphery 120 that is closed around the edge of the housing panel 110.
  • the device housing cover 20 may include a housing back plate 210, and a back plate periphery 220 that is closed around the edge of the housing back plate 210.
  • the device housing 10 and the device housing cover 20 may be assembled to each other in a posture in which the housing panel 110 and the housing back plate 210 are arranged at intervals (preferably, the housing panel 110 and the housing back plate 210 are arranged in parallel and at intervals), and the panel periphery 120 and the back plate periphery 220 are adapted and spliced.
  • the device housing 10 may have a first hole seat 130 disposed at the corner of the housing panel 110, and the device housing cover 20 may have a second hole seat 230 disposed at the corner of the housing back plate 210, and the device housing 10 and the device housing cover 20 may be assembled to each other by screws, which are penetrated through the second hole seat 230 and screwed with the threaded blind hole of the first hole seat 130.
  • the device housing 10 and the device cover 20 can be made of metals with rust-proof and corrosion-resistant properties such as stainless steel, so as to help improve the service life of the electronic equipment in outdoor environments.
  • the device housing 10 can be used as a mounting carrier for most components.
  • the device housing cover 20 can be used to install a heat dissipation module, and the device housing cover 20 can also be used as an electronic device.
  • the outer surface of the device housing cover 20 e.g., housing back plate 210) facing away from the device housing 10 (e.g., housing panel 110) may have a back plate boss 211, and the back plate boss 211 may be used to cooperate with an external desktop bracket or wall-mounted bracket.
  • the back plate boss 211 may have a back plate blind hole 212, so as to realize a fixed connection with an external desktop bracket or wall-mounted bracket by using the back plate blind hole 212.
  • the optical imaging module 30 may include a lens assembly 300 , and the lens field of view of the lens assembly 300 faces the imaging through hole 113 .
  • the lens assembly 300 may include any optical lens that transmits visible light.
  • the optical imaging module 30 may also include visible light photosensitive components such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor).
  • CCD Charge Coupled Device
  • CMOS Complementary Metal Oxide Semiconductor
  • the optical imaging module 30 can use the visible light photosensitive components to image the target object and generate a visible light image, so that the optical imaging module 30 can be used to collect monitoring images of the target object.
  • the optical imaging module 30 can be used to collect monitoring images of the target object.
  • the main control module 60 can be electrically connected to the optical imaging module 30 and the acoustic wave collection module 50 (eg, the module substrate 510).
  • the optical imaging module 30, the acoustic wave collection module 50, and the main control module 60 are all contained in a shell cavity formed by assembling the device shell cover 20 and the device housing 10.
  • the main control module 60 may include a main control circuit board 610, which may be a PCB, and the main control circuit board 610 may be integrated with at least one processing device such as a CPU (central processing unit), an MCU (Microcontroller Unit), an FPGA (Field-Programmable Gate Array), or a GPU (Graphics Processing Unit).
  • a CPU central processing unit
  • MCU Microcontroller Unit
  • FPGA Field-Programmable Gate Array
  • GPU Graphics Processing Unit
  • the main control circuit board 610 of the main control module 60 can be electrically connected to the optical imaging module 30 through a flat cable.
  • the main control circuit board 610 can be stacked on the surface of the module substrate 510 facing away from the device housing 10 (e.g., the housing panel 110).
  • the main control circuit board 610 has an avoidance hole 630 for avoiding the module housing 40.
  • the main control module 60 can also include a sound pickup docking socket 660 integrated in the main control circuit board 610, and the module substrate 510 can also be integrated with a substrate plugging interface 516 on the surface facing away from the device housing 10 (e.g., the housing panel 110).
  • the main control module 60 can be electrically connected to the sound wave collection module 50 through the plugging of the sound pickup docking socket 660 and the substrate plugging interface 516.
  • the plugging of the sound pickup docking socket 660 and the substrate plugging interface 516 can leave a gap between the main control circuit board 610 and the module substrate 510, and the gap can prevent the main control circuit board 610 from interfering with the microphone 500 arranged on the surface of the module substrate 510 facing away from the device housing 10 (e.g., the housing panel 110).
  • the main control module 60 can be electrically connected to the optical imaging module 30 and the acoustic wave collection module 50 (for example, the module substrate 510), during the use of the electronic device for detecting a target object, the main control module 60 electrically connected to the optical imaging module 30 and the acoustic wave collection module 50 can obtain the monitoring image of the target object collected by the optical imaging module 30, and the surface acoustic wave of the target object collected by the acoustic wave collection module 50.
  • the main control module 60 can also use the communication component of the electronic device to send the monitoring image and surface acoustic wave of the target object to the client or server, or the main control module 60 can also store the monitoring image and surface acoustic wave of the target object locally in the electronic device.
  • the communication component of the electronic device may include an antenna component 71, and the antenna component 71 may be installed on the device housing 10 (for example, the panel periphery 120).
  • the antenna component 71 is electrically connected to the main control module 60 to support the main control module 60 to send the monitoring image and surface acoustic wave of the target object to the client or server through wireless transmission.
  • the device housing 10 for example, the panel periphery 120
  • the antenna assembly 71 can be installed in the antenna installation through hole 121.
  • the antenna assembly 71 can be electrically connected to the main control module 60 through a flexible cable.
  • the communication component of the electronic device may include a cable connector 72, and the cable connector 72 may be installed on the device shell cover 20 (for example, the shell back plate 210).
  • the cable connector 72 is electrically connected to the main control module 60 to support the main control module 60 to send the monitoring image and surface acoustic wave of the target object to the client or server through wired transmission.
  • the device shell cover 20 (for example, the shell back plate 210) may have a connector mounting through hole 217, and the cable connector 72 may be installed in the connector mounting through hole 217.
  • the cable connector 72 may be electrically connected to the main control module 60 through a flexible cable.
  • the device housing 10 may also have a memory card receiving slot 122, which may be used to receive a non-volatile memory card such as an SD (Secure Digital Memory) card.
  • the memory card receiving slot 122 may be provided with a memory card bus interface adapted to the non-volatile memory card, and the memory card bus interface is electrically connected to the main control module 60 to support the main control module 60 to store the monitoring image and surface acoustic wave of the target object in the non-volatile memory card placed in the memory card receiving slot 122 of the electronic device.
  • the electronic device in the embodiment of the present application can also implement real-time online detection of the target object, thereby, compared with the manual inspection method, it can also improve the real-time detection, and it is conducive to the client or server to trigger an alarm in time according to the abnormality of the monitoring image and/or the abnormality of the surface acoustic wave.
  • Figures 7 to 9 show that the electronic device also includes an antenna assembly 71, a cable connector 72 and a memory card receiving slot 122, this does not mean that the embodiment of the present application intends to limit these three to be included in the electronic device at the same time.
  • the electronic device may include at least one of the antenna assembly 71, the cable connector 72 and the memory card receiving slot 122, but it does not necessarily include the antenna assembly 71, the cable connector 72 and the memory card receiving slot 122 at the same time.
  • the optical imaging module 30 in order to make the electronic device have a sealing property suitable for outdoor environment, can be encapsulated in the module housing 40, and the module housing 40 seals and covers the imaging through hole 113.
  • the module housing 40 has a light-transmitting glass 400 that seals and blocks the lens assembly 300 at the imaging through hole 113, that is, the optical imaging module 30 can be sealed and installed in the electronic device.
  • the sound wave collection module 50 can be sealed and installed in the electronic device using a waterproof sound-permeable membrane 550 and a sealing film 520.
  • the device shell cover 20 is sealed and assembled with the device housing 10.
  • a housing sealing ring 91 is extruded and assembled between the panel periphery 120 of the device housing 10 and the back plate periphery 220 of the device shell cover 20.
  • the screws passing through the second hole seat 230 can be sealed to the second hole seat 230 by the washers sleeved on the screws, and/or a sealing washer can be extruded and assembled between the first hole seat 130 and the second hole seat 230.
  • the antenna assembly 71 can be sealed with an antenna sealing ring 97 and a sealant to install the antenna through hole 121 of the device housing 10 (e.g., the panel periphery 120).
  • the electronic device further includes a cable connector 72
  • the cable connector 72 can be sealed to install the connector through hole 217 of the device shell cover 20 (e.g., the shell back plate 210).
  • the cable connector 72 can further include a connector sheath 720, and the connector sheath 720 and the connector through hole 217 can be sealed with a sealant.
  • the device housing 10 e.g., the panel periphery 120
  • the memory card bus interface in the memory card receiving slot 122 can be sealed and installed in the memory card receiving slot 122 by methods such as dispensing glue.
  • the sealing installation of the sound wave collection module 50 in the electronic device using the waterproof sound-permeable membrane 550 and the sealing film 520 can be referred to the above embodiments, and will not be repeated here.
  • the sealing installation of the optical imaging module 30 in the electronic device will be further described below in conjunction with the accompanying drawings.
  • FIG10 is a schematic diagram of the exploded structure of the optical imaging module of the electronic device shown in FIG7.
  • the module housing 40 includes, in addition to the light-transmitting glass 400, a housing body 410 and a housing cover 420.
  • the housing body 410 and the housing cover 420 may be made of the same metal material as the device housing 10, or the housing body 410 and the housing cover 420 may be made of plastic material.
  • the housing body 410 has a hollow structure.
  • the housing cover 420 is omitted in FIG. 7 and FIG. 8, and the reference numeral "30" with a dotted arrow guide line indicates the positional relationship between the optical imaging module 30 and the housing body 410.
  • the housing body 410 also has a first opening end facing the imaging through hole 113 (i.e., facing the housing panel 110), and a second opening end facing away from the imaging through hole 113 (i.e., facing away from the housing panel 110).
  • the optical imaging module 30 can be placed into the housing body 410 from the second open end of the housing body 410 in a posture in which the lens field of the lens assembly 300 faces the first open end of the housing body 410, and can be accommodated inside the housing body 410 in this posture.
  • the optical imaging module 30 can also include a processing assembly 310 and an adapter bracket 350, and the lens assembly 300 is assembled and connected with the processing assembly 310.
  • the lens assembly 300 can include an optical lens 300a and a lens base 300b containing a visible light photosensitive device, and the lens base 300b can be assembled and connected with the processing assembly 310.
  • the processing assembly 310 can be fixedly mounted on the adapter bracket 350, and the adapter bracket 350 is fixedly mounted on the boss 415 inside the housing body 410.
  • the first open end of the housing body 410 is sealed and covered by the light-transmitting glass 400.
  • the housing body 410 can be fixedly installed on the device housing 10 (for example, the housing panel 110) in a posture in which the first open end equipped with the light-transmitting glass 400 faces the device housing 10 (for example, the housing panel 110).
  • the housing body 410 can be fixedly installed on the device housing 10 (for example, the housing panel 110) by screws, so that the first open end of the housing body 410 is in sealing contact with the device housing 10 (for example, the housing panel 110), so that the first open end of the housing body 410 equipped with the light-transmitting glass 400 can seal and cover the imaging through hole 113 opened in the device housing 10 (for example, the housing panel 110).
  • the housing cover 420 can be used to cover the second opening end of the housing body 410.
  • the housing cover 420 can be installed on the housing body 410 by screws.
  • the housing body 410 may have a positioning cylinder 411, and the lens assembly 300 extends into the positioning cylinder 411.
  • the first open end of the housing body 410 sealed and covered by the light-transmitting glass 400 may be located at the end of the positioning cylinder 411.
  • the inner surface of the device housing 10 e.g., the housing panel 110
  • the device housing cover 20 e.g., the housing back plate 210
  • the imaging through hole 113 may be opened at the bottom of the positioning groove 111.
  • the bottom of the positioning groove 111 having the imaging through hole 113 may protrude relative to the outer surface of the device housing 10 (e.g., the housing panel 110) facing away from the device housing cover 20 (e.g., the housing back plate 210).
  • the module shell 40 that encapsulates the optical imaging module 30 can be positioned and adjusted to a posture in which the light-transmitting glass 400 is aligned with the imaging through hole 113 during the assembly process of the module shell 40, and fixedly installed on the device housing 10 (for example, the housing panel 110) in this posture.
  • the end of the positioning cylinder 411 may have an opening flange 412 protruding in the axial direction, and the radial dimension of the opening flange 412 is adapted to the radial dimension of the positioning recess 111.
  • the opening flange 412 may be embedded in the positioning recess 111, and the light-transmitting glass 400 may be embedded in the opening flange 412.
  • the light-transmitting glass 400 can be sealed with the opening flange 412, for example, the light-transmitting glass 400 and the opening flange 412 are sealed with glue.
  • the annular joints sealed between them are covered and blocked by the bottom of the positioning groove 111.
  • the end of the positioning cylinder 411 also has a cylinder shoulder 413 located on the outer periphery of the opening flange 412, and the radial dimension of the cylinder shoulder 413 is greater than the radial dimension of the positioning groove 111.
  • the cylinder shoulder 413 is sealed and matched with the device housing 10 at the outer periphery of the positioning groove 111, so that the end of the positioning cylinder 411 can seal and cover the imaging through hole 113 opened at the bottom of the positioning groove 111.
  • a sealing ring 93 surrounding the outer periphery of the positioning groove 111 can be extruded and assembled between the cylinder shoulder 413 and the device housing 10.
  • the device housing 10 (such as the housing panel 110) can also have a limiting ring groove 112 surrounding the outer periphery of the positioning groove 111, and the sealing ring 93 is limitedly matched with the limiting ring groove 112.
  • the module housing 40 can also ensure the inner sealing of the optical imaging module 30 in the housing cavity by sealing and encapsulating the optical imaging module 30. That is, the second opening end of the housing body 410 facing away from the imaging through hole 113 (i.e., facing away from the housing panel 110) can be sealed and covered by the housing cover 420.
  • the second opening end of the housing body 410 is equipped with a housing sealing ring 94 that is sealed and squeezed by the housing cover 420.
  • the housing body 410 may also be provided with a wire passing cylinder 416 in the shell wall between the first opening end and the second opening end.
  • the wiring of the optical imaging module 30 may pass through the wire passing cylinder 416 to the outside of the module housing 40, and the main control module 60 may be electrically connected to the optical imaging module 30 through the wiring.
  • the wire passing cylinder 416 is sealed and filled, that is, a wire passing sealing plug 460 that allows the wiring to pass through may be inserted in the wire passing cylinder 416.
  • the wire-passing sealing plug 460 may include a sealing plug body 461 that blocks the wire-passing cylinder column 416, a limiting flange 462 that protrudes laterally from the sealing plug body 461, and a wire-passing slit 463 that penetrates the sealing plug body 461.
  • the limiting cooperation between the limiting flange 462 and the inner wall of the wire-passing cylinder column 416 can prevent the sealing plug body 461 from being inserted into the interior of the housing body 410 through the wire-passing cylinder column 416.
  • the wire-passing slit 463 can allow the wiring between the main control module 60 and the optical imaging module 30 to pass through and be tightly compacted by the sealing plug body 461.
  • the wiring may include a flat wiring such as FPC (Flexible Printed Circuit) that is easy to be sealed and clamped in the wire-passing slit 463.
  • the wire-passing sealing plug 460 may include a silicone material.
  • the lens assembly 300 and the processing assembly 310 may also be sealed by glue.
  • the electronic device may further include a light group 80 for generating visual indication light.
  • FIG. 11 is a schematic diagram of the exploded structure of the light-emitting lamp group of the electronic device shown in FIG. 7 .
  • FIG. 12 is a cross-sectional view of the assembly structure of the light-emitting lamp group shown in FIG. 11 .
  • the optical imaging module 30 and the sound wave collection module 50 in the shell cavity formed by the assembly of the device housing 10 and the device housing cover 20 are omitted.
  • the light-emitting lamp group 80 may include a lamp group driving board 810 and a light guide base 820 .
  • the lamp group driving board 810 has at least two light-emitting lamp bodies 800.
  • the light-emitting lamp body 800 may include a light-emitting element such as an LED (Light-Emitting Diode).
  • FIG. 12 takes three light-emitting lamp bodies 800 as an example, but it is understandable that the number of the light-emitting lamp bodies 800 may not be limited thereto.
  • the light guide base 820 may be an integrally formed part including PC (Polycarbonate).
  • the light guide base 820 may include a base plate 821 and a base enclosure 822, wherein the base enclosure 822 may be enclosed and surrounded on one side of the base plate 821 facing the lamp assembly driving board 810 to form a lamp cavity for accommodating the light emitting lamp body 800.
  • the light guide base 820 may further include a light guide column 823 protruding from the other side of the base plate 821 facing away from the lamp group driving plate 810 and corresponding to the light emitting lamp body 800 one by one.
  • the lamp group driving board 810 can cover the lamp cavity formed by the base enclosure 822, and make each light-emitting lamp body 800 contained in the lamp cavity aligned and contact with the corresponding light guide column 823, so that the light generated by any light-emitting lamp body 800 can be transmitted to the corresponding light guide column 823.
  • the device housing 10 may also have light-transmitting through holes 118 corresponding to the light-guiding columns 823, and each light-guiding column 823 may be inserted into the corresponding light-transmitting through hole 118.
  • the light-guiding base 820 seals and covers the light-transmitting through holes 118 where each light-guiding column 823 is located, that is, the base plate 821 may be in sealing contact with the inner surface of the device housing 10 (e.g., housing panel 110) facing the device housing cover 20 (e.g., housing back plate 210).
  • a lamp assembly sealing ring 98 may be extruded and assembled between the base plate 821 and the inner surface of the device housing 10 (e.g., housing panel 110) facing the device housing cover 20 (e.g., housing back plate 210).
  • the light-emitting lamp group 80 may also include a light-shielding medium 830 that forms a light-shielding barrier between every two adjacent light-emitting lamp bodies 800.
  • the light-shielding medium 830 may include light-shielding foam, and the light-shielding medium 830 may be in the shape of a sheath that is sleeved on each light-emitting lamp body 800 and contained in the lamp cavity formed by the base enclosure 822 together with each light-emitting lamp body 800, that is, the light-shielding medium 830 is used to prevent light from leaking in the lamp cavity formed by the base enclosure 822.
  • the connection portion of the base plate body 821 connected between each light guide 823 may be staggered in a stepped manner in the protruding direction of the light guide 823.
  • the step misalignment dimension ⁇ h of the base plate 821 in the protruding direction of the light guide column 823 may be 1 mm, that is, the step-shaped structure of the base plate 821 is used to reduce light crosstalk through the base plate 821 .
  • the PC material light guide base 820 may be doped with 0.3% of light leveling powder, so that the light guide column 823 inserted in each light-transmitting through hole 118 can generate uniform light.
  • the installation position of the light-emitting lamp group 80 in the device housing 10 can avoid the optical imaging module 30 and the sound wave collection module 50.
  • the lamp group driving board 810 can also have a driving plug interface 860 facing away from the light guide base 820, and the main control module 60 can have a lamp group docking socket (not shown in the drawings) for plugging with the driving plug interface 860 to achieve electrical connection between the light-emitting lamp group 80 and the main control module 60.

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Abstract

本申请涉及麦克风的防水密封机构和电子设备。防水密封机构包括：设备壳体(10)，开设有透声通孔(115)；模组基板(510)，开设有与透声通孔位置对应的拾音孔(515)，麦克风(500)在模组基板背向设备壳体的表面覆盖拾音孔，以在麦克风与透声通孔之间形成贯穿拾音孔的传声通道；防水透声膜(550)，横置于传声通道中；以及密封胶片(520)，与防水透声膜一起密封堆叠在模组基板和设备壳体之间，密封胶片开设有透音孔(525)，传声通道在拾音孔与透声通孔之间被透音孔的孔壁密封包围，密封胶片还在设备壳体和模组基板之间形成密封隔断。

Description

麦克风的防水密封机构和电子设备 技术领域
本申请涉及防水密封技术，特别涉及一种麦克风的防水密封机构、以及应用该麦克风的防水密封机构的电子设备。
背景技术
具有声波采集需求的电子设备的内部通常装设有麦克风，并且，该电子设备还会在设备壳体开设有透声通孔，以使电子设备所在环境中的声波能够从透声通孔传导至设备壳体内部的麦克风。
发明内容
本申请的实施例提供了一种麦克风的防水密封机构和电子设备。
在本申请实施例的第一方面，一种麦克风的防水密封机构可以包括：设备壳体，所述设备壳体开设有透声通孔；模组基板，所述模组基板固定装设在所述设备壳体的内表面，并且，所述模组基板开设有与所述透声通孔位置对应的拾音孔，其中，所述麦克风固定装设在所述模组基板背向所述设备壳体的表面，并且，所述麦克风覆盖所述拾音孔，以在所述麦克风与所述透声通孔之间形成贯穿所述拾音孔的传声通道；防水透声膜，所述防水透声膜横置于所述传声通道中；以及密封胶片，所述密封胶片与所述防水透声膜一起密封堆叠在所述模组基板和所述设备壳体之间，所述密封胶片开设有被所述传声通道穿透的透音孔，贯穿所述防水透声膜的所述传声通道在所述拾音孔与所述透声通孔之间被所述透音孔的孔壁密封包围，并且，所述密封胶片还在所述设备壳体和所述模组基板之间形成封闭地环绕在所述透音孔的外周的密封隔断。
在一些示例中，所述透音孔的第一开口端在所述设备壳体朝向所述模组基板的内表面与所述透声通孔密封对接，所述透音孔的第二开口端在所述模组基板朝向所述设备壳体的表面与所述拾音孔密封对接，并且，所述防水透声膜堆叠在所述透音孔的第一开口端与所述透声通孔之间、或堆叠在所述透音孔的第二开口端与所述拾音孔之间。
在一些示例中，所述密封胶片在所述透音孔的外周与所述设备壳体和所述模组基板中的至少之一密封接触，以在所述设备壳体和所述模组基板之间形成封闭地环绕在所述透音孔的外周的密封隔断。
在一些示例中，所述防水透声膜的尺寸与所述传声通道的径向尺寸相适配，并且，所述密封胶片的尺寸与所述模组基板的径向尺寸相适配，所述密封胶片的尺寸大于所述防水透声膜的尺寸。
在一些示例中，所述设备壳体的内表面具有定位凹槽，并且，所述透声通孔开设于所述定位凹槽的底部；所述密封胶片与所述定位凹槽定位配合，使得所述透音孔与所述透声通孔同轴对准；所述密封胶片在所述设备壳体和所述模组基板之间形成的所述密封隔断，位于所述定位凹槽之外。
在一些示例中，所述密封胶片具有凸台，所述透音孔贯穿所述凸台，所述凸台在所述密封胶片朝向所述设备壳体的表面凸起，并且，所述凸台伸入至所述定位凹槽中以与所述定位凹槽定位配合。
在一些示例中，所述防水透声膜被定位在所述定位凹槽中，并且，所述防水透声膜密封覆盖所述透声通孔；所述密封胶片将所述防水透声膜限位压接在所述定位凹槽的底表面。
在一些示例中，所述防水透声膜粘贴在所述定位凹槽的底表面，并且，所述定位凹 槽的底表面为抛光表面。
在一些示例中，所述透声通孔在所述定位凹槽的底部的开口端的孔壁为弧形壁。
在一些示例中，所述密封胶片朝向所述模组基板的表面具有与所述凸台同轴布置的凹陷槽；所述防水透声膜被定位在所述凹陷槽中，所述凹陷槽将所述防水透声膜限位压接在所述模组基板朝向所述设备壳体的表面，并且，所述防水透声膜在所述模组基板朝向所述设备壳体的表面密封覆盖所述拾音孔。
在一些示例中，所述防水透声膜粘贴在所述模组基板朝向所述设备壳体的表面，并且，所述模组基板朝向所述设备壳体的表面为抛光表面。
在一些示例中，所述密封胶片具有封闭地环绕在所述透音孔的外周的凸筋，其中：所述凸筋分布在所述密封胶片朝向所述设备壳体的表面，并且，所述凸筋在所述定位凹槽之外与所述设备壳体密封接触，以形成封闭地环绕在所述透音孔的外周的所述密封隔断；和/或，所述凸筋分布在所述密封胶片朝向所述模组基板的表面，并且，所述凸筋在所述定位凹槽之外与所述模组基板密封接触，以形成封闭地环绕在所述透音孔的外周的所述密封隔断。
在一些示例中，所述透声通孔朝向所述麦克风的开口端的孔壁为弧形壁。
在一些示例中，所述防水密封机构还包括网孔防护膜，所述网孔防护膜堆叠在所述防水透声膜的至少一侧表面，所述网孔防护膜的尺寸与所述防水透声膜的尺寸相同，所述网孔防护膜的强度大于所述防水透声膜的强度。
在一些示例中，所述透声通孔的径向尺寸大于所述拾音孔的径向尺寸，所述透音孔的径向尺寸不小于所述透声通孔的径向尺寸；所述透声通孔远离所述防水透声膜的开口端相对于所述设备壳体的外表面内凹，并与所述设备壳体的外表面之间通过锥形敞口连通，并且，所述锥形敞口的径向尺寸在从所述透声通孔到所述设备壳体的外表面的方向上单调增加。
在一些示例中，多个所述麦克风和多个所述拾音孔在所述模组基板呈多圈环形共面分布；多个所述透声通孔的数量及在所述设备壳体的共面分布方式，与多个所述麦克风和多个所述拾音孔相同；多个所述透音孔的数量及在所述密封胶片的共面分布方式，与多个所述麦克风和多个所述拾音孔相同；所述密封胶片的尺寸与所述模组基板的尺寸相适配，密封覆盖每个所述透声通孔的所述防水透声膜均被所述密封胶片限位压接，并且，所述密封胶片与所述设备壳体的密封接触位置分布在被所述防水透声膜密封覆盖的每个所述透声通孔的外周。
在一些示例中，所述设备壳体部署有所述透声通孔的区域为平板状；所述模组基板为平板状；所述区域与所述模组基板平行堆叠，并且，所述模组基板通过环形部署的多个螺钉固定于所述设备壳体。
在本申请实施例的第二方面，一种电子设备可以包括麦克风以及前述第一方面中所述的麦克风的防水密封机构。
基于上述实施例，开设于设备壳体的透声通孔与装设于模组基板的麦克风之间可以形成传声通道，并且，模组基板和设备壳体之间还密封堆叠有防水透声膜和密封胶片，其中，防水透声膜横置于该传声通道中，并且，密封胶片的透音孔在模组基板的拾音孔与透声通孔之间将贯穿防水透声膜的传声通道密封包围，以在不影响声波沿传声通道传播的前提下实现对该传声通道的防水密封。另外，密封胶片还在设备壳体和模组基板之间形成封闭地环绕在防水透声膜的外周的密封隔断，以实现对该传声通道的二级防水密 封。由此，可以改善透声通孔对设备壳体的密封性的影响。进一步地，若采用包含多个麦克风的麦克风阵列，则还可以确保对多个透声通孔的密封一致性。
附图说明
以下附图仅对本申请做示意性说明和解释，并不限定本申请的范围。
图1为本申请的一个实施例中的麦克风的防水密封机构的分解结构示意图。
图2为如图1所示的麦克风的防水密封机构的麦克风的分布示意图。
图3为与图1所示的麦克风的防水密封机构相适配的设备壳体的结构示意图。
图4为如图1所示的麦克风的防水密封机构的第一装配结构示例的剖视图。
图5为如图1所示的麦克风的防水密封机构的第二装配结构示例的剖视图。
图6为如图1所示的麦克风的防水密封机构的第三装配结构示例的剖视图。
图7为本申请的另一个实施例中的电子设备的分解结构示意图。
图8为如图7所示的电子设备的半装配结构示意图。
图9为如图7所示的电子设备的装配结构剖视图。
图10为如图7所示的电子设备的光学成像模组的分解结构示意图。
图11为如图7所示的电子设备的发光灯组的分解结构示意图。
图12为图11中示出的发光灯组的装配结构剖视图。
具体实施方式
为了使本申请的目的、特点及优点更加清楚明白，以下参照附图并举实施例，对本申请作进一步详细说明。
相关技术中，透声通孔会影响电子设备的设备壳体的密封性。即便是为了减小透声通孔对密封性的影响而缩减其开孔尺寸，仍不能使透声通孔具备密封效果，同时还会导致传导至麦克风的声波强度过小，由此限制声波采集的效果。
有鉴于此，本申请的实施例提供一种麦克风的防水密封机构和电子设备。
图1为本申请的一个实施例中的麦克风的防水密封机构的分解结构示意图。请参见图1，在本申请的实施例中，麦克风的防水密封机构可以包括设备壳体10和声波采集模组50。
设备壳体10可以是具有任意形状、以及任意材料的硬质部件，在图1中示出的设备壳体10仅仅是其局部，而不应当理解为设备壳体10的真实形状仅限于图1中示出的局部形状。并且，在本申请的实施例中，设备壳体10开设有透声通孔115。
声波采集模组50可以包括模组基板510以及麦克风500。其中，模组基板510固定装设在设备壳体10的内表面，模组基板510开设有与透声通孔115位置对应的拾音孔515。麦克风500可以固定装设在模组基板510背向设备壳体10的表面，并且，麦克风500覆盖拾音孔515，以在麦克风500与透声通孔115之间形成贯穿拾音孔515的传声通道。
图2为如图1所示的麦克风的防水密封机构的麦克风的分布示意图。请在参见图1的同时进一步结合图2，在本申请的实施例中，声波采集模组50可以包括多个麦克风500、并相应地开设有与多个麦克风500一一对应的多个拾音孔515。即，声波采集模组50的模组基板510可以部署有包含多个麦克风500的麦克风阵列。在本申请实施例的图示中，64个麦克风500按照每圈8个麦克风、共8圈(如图2中以点划线表示的圆圈辅助线所示)的形式分布。
从图2中还可以看出，设备壳体10的内表面还可以具有至少两个模组定位柱117， 并且，模组基板510还可以具有与至少两个模组定位柱117位置对应的至少两个基板定位孔517。并且，基于至少两个模组定位柱117与至少两个基板定位孔517之间一一对应的定位配合，模组基板510被约束在使拾音孔515与透音孔525(稍后进行描述)和透声通孔115同轴对准的装配位姿。例如，本文所述的“同轴对准”，可以是指单边间隙不超过0.5mm。
在本申请的实施例中，声波采集模组50还可以包括防水透声膜550和密封胶片520。
防水透声膜550在模组基板510和设备壳体10之间，横置于麦克风500的传声通道中。如图1所示，声波采集模组50可以设有与多个麦克风500一一对应的多个防水透声膜550。
横置于麦克风500的传声通道中的防水透声膜550的装设位置，可以是模组基板510和设备壳体10之间的任意位置。例如，每个防水透声膜550可以通过诸如粘接在设备壳体10朝向模组基板510的内表面等方式，而在设备壳体10的内表面密封覆盖对应的透声通孔115，以横置在对应的麦克风500和透声通孔115之间的传声通道中、并形成防水阻隔。再例如，每个防水透声膜550可以通过诸如粘接在模组基板510朝向设备壳体10的表面等方式，而在模组基板510的该表面密封覆盖对应的拾音孔515，同样可以横置在对应的麦克风500和透声通孔115之间的传声通道中、并形成防水阻隔。
对于声波采集模组50包括多个麦克风500的情况，防水透声膜550的数量可以与透声通孔115的数量相同，并且，防水透声膜550的尺寸可以与传声通道的径向尺寸相适配(例如大于或略大于透声通孔115的径向尺寸)。其中，防水透声膜550的尺寸与传声通道的径向尺寸相适配，至少包括以下的尺寸约束条件：防水透声膜550的尺寸不小于透声通孔115的径向尺寸的基础上，还具有便于防水透声膜550装设的边缘余量。
密封胶片520与防水透声膜550一起密封堆叠在模组基板510和设备壳体10之间，并且，密封胶片520开设有与透声通孔115和拾音孔515位置对应(即一一对应)、且被对应的传声通道穿透的透音孔525。即，每个麦克风500与对应的透声通孔115之间形成贯穿拾音孔515和透音孔525的传声通道。并且，防水透声膜550的尺寸与传声通道的径向尺寸相适配，至少还包括以下的尺寸约束条件：防水透声膜550的尺寸不小于透音孔525的径向尺寸。
而且，与防水透声膜550一起密封堆叠在模组基板510和设备壳体10之间的密封胶片520可以形成对防水透声膜550的限位压接。例如，若防水透声膜550在设备壳体10朝向模组基板510的内表面密封覆盖透声通孔115，则，密封胶片520可以将防水透声膜550限位压接在设备壳体10朝向模组基板510的内表面。再例如，若防水透声膜550在模组基板510朝向设备壳体10的表面密封覆盖拾音孔515，则，密封胶片520可以将防水透声膜550限位压接在模组基板510朝向设备壳体10的表面。从而，基于密封胶片520和防水透声膜550在模组基板510和设备壳体10之间的密封堆叠，密封胶片520的透音孔525在对应的拾音孔515与透声通孔115之间将贯穿防水透声膜550的传声通道密封包围，以在不影响声波沿传声通道传播的前提下实现对该传声通道的防水密封。
上述的“密封包围”可以是指：贯穿防水透声膜550的传声通道在拾音孔515与透声通孔115之间被透音孔525的孔壁密封包围。例如，透音孔525朝向设备壳体10的第一开口端可以在设备壳体10朝向模组基板510的内表面与透声通孔115密封对接(例如无缝对接)，并且，透音孔525朝向模组基板510的第二开口端可以在模组基板510朝向设备壳体10的表面与拾音孔515密封对接(例如无缝对接)。在此情况下，防水 透声膜550堆叠在透音孔525的第一开口端与透声通孔115之间、并在设备壳体10朝向模组基板510的内表面密封覆盖透声通孔115，或者，防水透声膜550堆叠在透音孔525的第二开口端与拾音孔515之间、并在模组基板510朝向设备壳体10的表面密封覆盖拾音孔515。
密封胶片520的尺寸可以大于防水透声膜550的尺寸。例如，密封胶片520的尺寸可以与模组基板510的尺寸相适配，即，对于声波采集模组50包括多个麦克风500的情况，密封胶片520的尺寸可以像模组基板510那样覆盖设备壳体10开设的所有透声通孔115的区域，并且，密封覆盖每个透声通孔115或拾音孔515的各防水透声膜550均被同一片密封胶片520限位压接。
在此情况下，密封胶片520还可以在设备壳体10和模组基板510之间形成封闭地环绕在透音孔525的外周的密封隔断，以实现对透音孔525密封包围的该传声通道的二级防水密封。即，无论防水透声膜550是在设备壳体10朝向模组基板510的内表面密封覆盖透声通孔115，还是在模组基板510朝向设备壳体10的表面密封覆盖拾音孔515，密封胶片520在设备壳体10和模组基板510之间形成的密封隔断，都可以包括密封胶片520在防水透声膜550的外周与设备壳体10和模组基板510中的至少之一密封接触。对于声波采集模组50包括多个麦克风500的情况，密封胶片520与设备壳体10和模组基板510中的至少之一的密封接触位置分布在被每个防水透声膜550密封覆盖的相应透声通孔115或拾音孔515的外周。
由此，基于防水透声膜550在传声通道中形成的防水阻隔、密封胶片520的透音孔525对传声通道的密封包围、以及密封胶片520形成的封闭地环绕在透音孔525的外周的密封隔断，可以改善透声通孔115对设备壳体的密封性的影响。
进一步地，若采用包含多个麦克风500的麦克风阵列，则还可以确保对多个透声通孔的密封一致性。
在本申请的实施例中，图1中示出设备壳体10部署有透声通孔115的区域(例如壳体面板)为平板状。并且，模组基板510也为平板状，例如，模组基板510可以为PCB(Printed Circuit Board，印刷电路板)，在此情况下，对于采用包含多个麦克风500的麦克风阵列的部署方式，模组基板510可以与设备壳体10部署有透声通孔115的区域平行堆叠，以使得各麦克风500与对应的透声通孔115之间连通的传声通道等长，进而确保麦克风阵列中的各麦克风500之间具有拾音一致性。
即，若多个麦克风500和多个拾音孔515在模组基板510呈多圈环形共面分布，则：多个透声通孔115的数量及在设备壳体10的共面分布方式与多个麦克风500和多个拾音孔515相同，多个防水透声膜550的数量及在设备壳体10和/或模组基板510的共面分布方式与多个麦克风500和多个拾音孔515相同。另外，堆叠在模组基板510和设备壳体10的内表面之间的密封胶片520也是平坦的，并且，密封胶片520的多个透音孔525的数量及在密封胶片520的共面分布方式也与多个麦克风500和多个拾音孔515相同。
在本申请的实施例中，对于包含多个麦克风500的情况，模组基板510可以通过环形部署(例如至少两圈环形部署)的多个螺钉590固定在设备壳体10，以避免由于模组基板510的受力不均而导致各麦克风500与对应的透声通孔115之间连通的传声通道不等长。在本申请实施例的图示中，以16个螺钉590分为3圈、且3圈的单圈螺钉590数量由内至外依次为4、4、8的形式分布。在此情况下，相邻螺钉590之间的距离应设 置为有助于使模组基板510的整体应力应变均匀度大于90％。例如，假设模组基板510的径向尺寸为170mm、模组基板510的公称厚度为2mm、模组基板510的平面度小于0.1mm，则，用于固定模组基板510和设备壳体10的每两个相邻螺钉590之间的距离不超过45mm。而且，由于密封胶片520是与模组基板510尺寸适配的一体成型件，因此，可以使密封胶片520在厚度方向上具有足以产生密封效果的均匀压缩量，例如，对于密封胶片520的邵氏硬度为28～32度范围内的情况，密封胶片520可以具有12％～18％(优选15％)的压缩量。
可以理解的是，本申请的实施例仅仅是以包括多个麦克风500的麦克风阵列为例，但对于仅包含一个麦克风500的单麦克风部署方案，利用防水透声膜550和密封胶片520的两级密封方案仍然适用。
以上是对本申请实施例中的麦克风的防水密封机构的整体说明，为了更好地理解防水透声膜550和密封胶片520协同产生的密封效果，下文中将结合附图进行细化说明。
若设备壳体10的内表面还具有至少两个模组定位柱117，则，为了确保透音孔525与透声通孔115和拾音孔515的同轴对准，密封胶片520还可以具有与至少两个模组定位柱117位置对应的至少两个胶片定位孔527。并且，基于至少两个模组定位柱117与至少两个胶片定位孔527之间一一对应的定位配合，密封胶片520被约束在使透音孔525与透声通孔115和拾音孔515同轴对准的装配位姿。
在本申请的实施例中，为了进一步提高透音孔525与作为传声通道入口的透声通孔115之间的同轴度，可以为密封胶片520和设备壳体10提供用于定位配合的结构。
图3为与图1所示的麦克风的防水密封机构相适配的设备壳体的结构示意图。请参见图3，在本申请的实施例中，对于每一个麦克风500的传声通道，设备壳体10的内表面具有对应的定位凹槽114，并且，该传声通道的透声通孔115开设于对应的定位凹槽114的底部。
图4为如图1所示的麦克风的防水密封机构的第一装配结构示例的剖视图。图5为如图1所示的麦克风的防水密封机构的第二装配结构示例的剖视图。图6为如图1所示的麦克风的防水密封机构的第三装配结构示例的剖视图。请在参见图3的同时进一步结合图4至图6，若设备壳体10的内表面具有对应的定位凹槽114，则，密封胶片520可以与定位凹槽114定位配合，该定位配合使透音孔525与透声通孔115对齐。并且，密封胶片520在设备壳体10和模组基板510之间形成的密封隔断位于定位凹槽114之外，即，密封胶片520与设备壳体10和模组基板510中的至少之一的密封接触位置位于定位凹槽114之外。
例如，在图4至图6中，密封胶片520可以具有封闭地环绕每个透音孔525的凸台526，即，透音孔525贯穿凸台526。并且，封闭地环绕每个透音孔525的凸台526都在密封胶片520朝向设备壳体10的表面凸起，并且伸入至对应的透声通孔115所在的定位凹槽114中、并与该定位凹槽114定位配合。
在图4和图5中，横置在每个传声通道中的防水透声膜550被定位在定位凹槽114中、并且密封覆盖在该定位凹槽114的底部处对应设置的透声通孔115，例如，定位凹槽114和凸台526的径向尺寸可以与防水透声膜550的径向尺寸相同或相适配，并且，防水透声膜550可以粘贴在定位凹槽114的底表面。
在此情况下，如图4和图5所示，密封胶片520(例如凸台526)将防水透声膜550限位压接在设备壳体10的内表面(例如定位凹槽114的底表面)，从而，可以减小防 水透声膜550与设备壳体10的内表面(例如定位凹槽114的底表面)之间的粘接间隙，进而，可以提升防水透声膜550对透声通孔115的密封性。
若如前文所述，防水透声膜550可以粘贴在设备壳体10的内表面，则，密封胶片520(例如凸台526)对防水透声膜550的限位压接还可以有助于提升防水透声膜550与设备壳体10的内表面之间的粘贴密实性。在此情况下，优选地，设备壳体10的内表面(例如定位凹槽114的底表面)可以为抛光表面，以通过减小防水透声膜550与设备壳体10的内表面之间的粘接间隙来提升密封性。例如，抛光表面的抛光度可以不低于400目。
在图6中，横置在每个传声通道中的防水透声膜550通过密封胶片520被定位凹槽114间接定位、并且在模组基板510朝向设备壳体10的表面密封覆盖对应的拾音孔515。具体地，密封胶片520朝向模组基板510的表面具有与凸台526同轴布置的凹陷槽529，防水透声膜550被定位在该凹陷槽529中，并且，防水透声膜550在模组基板510朝向设备壳体10的表面密封覆盖拾音孔515。例如，定位凹槽114和凸台526的径向尺寸可以大于防水透声膜550的径向尺寸，凹陷槽529的径向尺寸可以与防水透声膜550的径向尺寸相同或相适配。并且，防水透声膜550可以粘贴在模组基板510朝向设备壳体10的表面。
在此情况下，如图6所示，密封胶片520(例如凹陷槽529)将防水透声膜550限位压接在模组基板510朝向设备壳体10的表面，从而，可以减小防水透声膜550与模组基板510朝向设备壳体10的表面之间的粘接间隙，进而，可以提升防水透声膜550对拾音孔515的密封性。
而且，与图4和图5同理，若防水透声膜550粘贴在模组基板510朝向设备壳体10的表面，则，优选地，模组基板510朝向设备壳体10的表面为抛光表面，例如，抛光表面的抛光度可以不低于400目。
仍参见图4至图6，无论防水透声膜550是在设备壳体10朝向模组基板510的内表面密封覆盖透声通孔115，还是在模组基板510朝向设备壳体10的表面密封覆盖拾音孔515，密封胶片520在设备壳体10和模组基板510之间形成的密封隔断(即密封胶片520与设备壳体10和模组基板510中的至少之一的密封接触)都可以位于定位凹槽114之外。
例如，密封胶片520可以具有封闭地环绕在透音孔525的外周的凸筋522，即，该凸筋522可以呈环形，并且，该凸筋522的径向尺寸可以大于凸台526的径向尺寸，因此，凸筋522位于定位凹槽114之外。
而且，凸筋522可以像图4和图5所示的那样分布在密封胶片520朝向设备壳体10的表面。在此情况下，凸筋522可以在定位凹槽114之外与设备壳体10密封接触，以在设备壳体10和模组基板510之间形成封闭地环绕在防水透声膜550的外周的密封隔断。
或者，凸筋522也可以像图6所示的那样分布在密封胶片520朝向设备壳体10的表面、以及密封胶片520朝向模组基板510的表面。在此情况下，凸筋522可以在定位凹槽114之外与设备壳体10和模组基板510密封接触，以在设备壳体10和模组基板510之间形成封闭地环绕在防水透声膜550的外周的密封隔断。
也就是说，凸筋522可以分布在密封胶片520朝向设备壳体10的表面、和/或密封胶片520朝向模组基板510的表面，并且，凸筋522可以在定位凹槽114之外与设备壳 体10和模组基板510中的至少之一密封接触，以利用密封胶片520在设备壳体10和模组基板510之间形成封闭地环绕在防水透声膜550的外周的密封隔断。
在本申请的实施例中，防水透声膜550的厚度可以为0.1mm，其容易在外力作用(例如户外环境中的风雨作用)下破损，尤其是防水透声膜550在设备壳体10朝向模组基板510的内表面密封覆盖透声通孔115的情况下，防水透声膜550的破损风险会更高。
因此，为了降低由于防水透声膜550破损而引发的对透声通孔115的密封失效，如图4和图5所示，在本申请的实施例中的一种优化方案可以包括：每个麦克风500对应的透声通孔115与防水透声膜550相邻的开口端的孔壁为弧形壁，即，每个透声通孔115在其所在的定位凹槽114的底部的开口端的孔壁为弧形壁。优选地，弧形壁的公称半径r0可以为0.5mm。
同样是为了降低由于防水透声膜550破损而引发的对透声通孔115的密封失效，如图4至图6所示，本申请实施例中可以与上述优化方案择一或同时使用的另一种优化方案可以包括：声波采集模组50还可以包括网孔防护膜530，网孔防护膜530堆叠在防水透声膜550的至少一侧表面，以起到对防水透声膜550的支撑作用，即，网孔防护膜530也可以被称作支撑膜。网孔防护膜530的尺寸与防水透声膜550的尺寸相同，网孔防护膜530的强度大于防水透声膜550的强度。例如，网孔防护膜530的材质可以包括网孔目数不低于1000目左右的PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)、网孔防护膜530的厚度可以为0.3mm。
例如，在图4中，网孔防护膜530在定位凹槽114内堆叠在防水透声膜550与密封胶片520(例如凸台526)之间，即，网孔防护膜530堆叠在防水透声膜550朝向模组基板510的一侧表面。
再例如，在图5中，网孔防护膜530在定位凹槽114内堆叠在防水透声膜550与密封胶片520(例如凸台526)之间、以及防水透声膜550与定位凹槽114的底部之间，即，网孔防护膜530堆叠在防水透声膜550分别朝向模组基板510和设备壳体10的两侧表面。
还例如，在图6中，网孔防护膜530在凹陷槽529内堆叠在防水透声膜550与密封胶片520之间，即，网孔防护膜530堆叠在防水透声膜550朝向设备壳体10的一侧表面。
对于多个麦克风500和多个拾音孔515在模组基板510呈多圈环形共面分布的情况，网孔防护膜530也为多个，多个网孔防护膜530的数量可以与多个防水透声膜550的数量相同、或为多个防水透声膜550的数量的两倍。并且，多个网孔防护膜530在设备壳体10的共面分布方式与多个麦克风500和多个拾音孔515以及多个防水透声膜550相同。
请继续关注图3以及图4至图6，在本申请的实施例中，透声通孔115的径向尺寸(例如4mm)大于拾音孔515的径向尺寸，并且，透音孔525的径向尺寸(例如5mm)不小于透声通孔115的径向尺寸，从而，可以扩大各传声通道在入声侧的口径，以增强通过传声通道向麦克风500传递的声波信号的信号强度。
为了进一步增强向麦克风500传递的声波信号的信号强度，在本申请的实施例中，透声通孔115远离防水透声膜550的开口端相对于设备壳体10背向设备壳盖20(在图7中示出)的外表面内凹，透声通孔115远离防水透声膜550的开口端与设备壳体10的外表面之间通过锥形敞口116连通。并且，锥形敞口116的径向尺寸在从透声通孔115 到设备壳体10的外表面的方向上单调增加。从而，锥形敞口116可以在透声通孔115外形成用于扩张声波的喇叭口。例如，锥形敞口116的公称轴向尺寸为1.5mm，并且，锥形敞口116的锥形壁相对于轴向方向的倾斜角度在30°～35°的范围内。
而且，锥形敞口116形成的喇叭口可以看作是与外部环境连通的区域，因此，透声通孔115的内凹实际上缩短了传声通道的通道长度，有助于提升麦克风500采集到的声波信号的信噪比。另外，锥形敞口116形成的喇叭口可以避免户外环境中的雨水在透声通孔115残留堆积，从而可以降低防水透声膜550被腐蚀的概率，以降低由于防水透声膜550的腐蚀破损而引发的对透声通孔115的密封失效的概率。
在本申请的实施例中，麦克风的防水密封机构中的声波采集模组50也可以与具有其他功能的模组共存。例如，上述环形共面分布的环形中心位置处可以预留出用于部署具有其他功能的模组的区域，相应地，为了避免与具有其他功能的模组发生干涉，模组基板510还可以具有基板避让孔513，密封胶片520可以具有胶片避让孔523。在此情况下，设备壳体10可以在上述环形共面分布的环形中心位置处开设有通孔113，其中，若具有其他功能的模组为扬声器，则该通孔113可以为用于覆盖扬声器的扬声面的网孔，或者，若具有其他功能的模组为光学成像模组，则该通孔113可以为用于避让光学成像模组的镜头组件的成像视野的成像通孔。基板避让孔513和胶片避让孔523均与通孔113位置对应。
图7为本申请的另一个实施例中的电子设备的分解结构示意图。图8为如图7所示的电子设备的半装配结构示意图。图9为如图7所示的电子设备的装配结构剖视图。请参见图7至图9，以通孔113被配置为成像通孔为例，在该实施例中，电子设备可以用于对目标对象实施结合视频和音频的检测。并且，电子设备可以包括设备壳体10、设备壳盖20、光学成像模组30、前述实施例中的声波采集模组50、以及主控模组60。
设备壳体10和设备壳盖20可以相互装配，以提供用于容纳电子设备的元器件的壳腔。
请在参见图7至图9的同时回看图1，在该实施例中，设备壳体10可以包括壳体面板110。前述实施例中提及的设备壳体10部署有透声通孔115的区域可以位于壳体面板110。即，图1中示出的设备壳体10的局部结构可以认为是壳体面板110的一部分。相应地，成像通孔113和透声通孔115可以均位于壳体面板110。
在本申请的实施例中，设备壳体10还可以包括封闭地环绕在壳体面板110的边缘处的面板周缘120。设备壳盖20可以包括壳体背板210、以及封闭地环绕在壳体背板210的边缘处的背板周缘220。并且，设备壳体10与设备壳盖20可以以壳体面板110和壳体背板210间隔布置(优选地，壳体面板110和壳体背板210平行间隔布置)、面板周缘120和背板周缘220适配拼接的位姿相互装配。作为一种可选的方式，设备壳体10可以具有部署在壳体面板110的边角处的第一孔座130，设备壳盖20可以具有部署在壳体背板210的边角处的第二孔座230，并且，设备壳体10和设备壳盖20可以通过螺钉相互装配，所述螺钉穿设于第二孔座230、并与第一孔座130的螺纹盲孔螺接。
而且，作为本申请的实施例的优选方案，设备壳体10和设备壳盖20均可以选用诸如不锈钢等具有防锈、防腐蚀特性的金属，以利于提升电子设备在户外环境下的使用寿命。
请特别关注图8，在本申请的实施例中，设备壳体10可以作为大多数元器件的安装载体。设备壳盖20内可以用于装设散热模组，并且，设备壳盖20还可以用作电子设备 的安装座。设备壳盖20(例如壳体背板210)背向设备壳体10(例如壳体面板110)的外表面可以具有背板凸台211，该背板凸台211可以用于与外部的桌面支架或壁挂支架配合。并且，该背板凸台211可以具有背板盲孔212，以利用背板盲孔212实现与外部的桌面支架或壁挂支架的固定连接。
光学成像模组30可以包括镜头组件300，并且，该镜头组件300的镜头视野朝向成像通孔113。
在本申请的实施例中，镜头组件300中可以包括任意一种透射可见光的光学镜头。并且，光学成像模组30还可以包括诸如CCD(Charge Coupled Device，电荷耦合器件)或CMOS(Complementary Metal Oxide Semiconductor，互补金属氧化物半导体)等可见光感光元器件。从而，光学成像模组30可以利用可见光感光元器件对目标对象成像而产生可见光图像，以使得光学成像模组30可用于采集目标对象的监控图像。进而，在电子设备用于检测目标对象的使用过程中，光学成像模组30可用于采集目标对象的监控图像。
主控模组60可以与光学成像模组30和声波采集模组50(例如模组基板510)电连接。并且，光学成像模组30、声波采集模组50以及主控模组60均容纳在设备壳盖20与设备壳体10装配形成的壳腔内。
在本申请的实施例中，主控模组60可以包括主控电路板610，该主控电路板610可以为PCB，并且，该主控电路板610可以集成有诸如CPU(central processing unit，中央处理单元)、MCU(Microcontroller Unit，微控制单元)、FPGA(Field-Programmable Gate Array，现场可编程门阵列)、GPU(Graphics Processing Unit，图形处理单元)中的至少一种处理器件。
例如，主控模组60的主控电路板610可以通过排线与光学成像模组30电连接。
再例如，主控电路板610可以堆叠于模组基板510背向设备壳体10(例如壳体面板110)的表面。主控电路板610具有避让模组仓壳40的避让孔630。主控模组60还可以包括集成于主控电路板610的拾音对接插口660，模组基板510在背向设备壳体10(例如壳体面板110)的表面还可以集成有基板插接接口516，主控模组60可以通过拾音对接插口660与基板插接接口516的插接与声波采集模组50电连接。并且，拾音对接插口660与基板插接接口516的插接可以在主控电路板610与模组基板510之间留有间隙，该间隙可以避免主控电路板610与布置在模组基板510背向设备壳体10(例如壳体面板110)的表面的麦克风500发生干涉。
基于主控模组60可以与光学成像模组30和声波采集模组50(例如模组基板510)电连接，在电子设备用于检测目标对象的使用过程中，与光学成像模组30和声波采集模组50电连接的主控模组60，可以获取到光学成像模组30采集的目标对象的监控图像、以及声波采集模组50采集的目标对象的表面声波。
在本申请的实施例中，主控模组60还可以利用电子设备的通信组件将目标对象的监控图像和表面声波发送至客户端或服务器，或者，主控模组60也可以将目标对象的监控图像和表面声波本地存储在电子设备。
作为本申请实施例的一种可选方案，电子设备的通信组件可以包括天线组件71，天线组件71可以装设于设备壳体10(例如面板周缘120)。并且，天线组件71与主控模组60电连接，以支持主控模组60通过无线传输方式将目标对象的监控图像和表面声波发送至客户端或服务器。例如，设备壳体10(例如面板周缘120)还可以具有天线安 装通孔121，天线组件71可以装设于该天线安装通孔121。并且，天线组件71可以通过柔性线缆与主控模组60电连接。
作为本申请实施例的另一种可选方案，电子设备的通信组件可以包括线缆接头72，线缆接头72可以装设于设备壳盖20(例如壳体背板210)。并且，线缆接头72与主控模组60电连接，以支持主控模组60通过有线传输方式将目标对象的监控图像和表面声波发送至客户端或服务器。例如，设备壳盖20(例如壳体背板210)可以具有接头安装通孔217，线缆接头72可以装设于该接头安装通孔217。并且，线缆接头72可以通过柔性线缆与主控模组60电连接。
作为本申请实施例的又一种可选方案，设备壳体10(例如面板周缘120)还可以具有存储卡容纳槽122，该存储卡容纳槽122可以用于容纳诸如SD(Secure Digital Memory，安全数字存储)卡等非易失性存储卡。该存储卡容纳槽122中可以装设用于与非易失性存储卡适配的存储卡总线接口，并且，该存储卡总线接口与主控模组60电连接，以支持主控模组60将目标对象的监控图像和表面声波存储在放置于电子设备的存储卡容纳槽122中的非易失性存储卡。
由此，本申请实施例中的电子设备还可以对目标对象实施实时的在线检测，从而，相比于人工巡检的方式，还可以提升检测实时性，并有利于客户端或服务器根据监控图像的异常和/或表面声波的异常及时触发警报。而且，可以理解的是，虽然图7至图9中示出了电子设备同时包括天线组件71、线缆接头72以及存储卡容纳槽122，但这并不意味着本申请的实施例意图限定这三者必须是同时包括在电子设备中。即，在本申请的实施例中，电子设备可以包括天线组件71、线缆接头72以及存储卡容纳槽122中的至少一种，而非必须同时包括天线组件71、线缆接头72以及存储卡容纳槽122。
另外，在本申请的实施例中，为了使电子设备具有适用于户外环境的密封特性，光学成像模组30可以被封装在模组仓壳40中，该模组仓壳40密封覆盖成像通孔113。并且，模组仓壳40具有在成像通孔113处密封遮挡镜头组件300的透光玻璃400，即，光学成像模组30可以密封装设在电子设备中。
为了使电子设备具有适用于户外环境的密封特性，声波采集模组50可以利用防水透声膜550和密封胶片520密封装设在电子设备中。
为了使电子设备具有适用于户外环境的密封特性，设备壳盖20与设备壳体10密封装配，例如，设备壳体10的面板周缘120和设备壳盖20的背板周缘220之间挤压装配有壳体密封圈91。并且，穿设于第二孔座230的螺钉可以通过套设于螺钉的垫圈而对第二孔座230密封、和/或第一孔座130和第二孔座230之间可以挤压装配有密封垫圈。
另，考虑到电子设备的密封特性，若电子设备还包括天线组件71，则，天线组件71可以利用天线密封圈97和密封胶密封装设于设备壳体10(例如面板周缘120)的天线安装通孔121。若电子设备还包括线缆接头72，则，线缆接头72可以密封装设于设备壳盖20(例如壳体背板210)的接头安装通孔217。具体地，线缆接头72可以进一步具有接头护套720，并且，接头护套720与接头安装通孔217之间可以利用密封胶密封配合。若设备壳体10(例如面板周缘120)还具有存储卡容纳槽122，则，存储卡容纳槽122中的存储卡总线接口可以通过诸如点胶等方式密封装设在存储卡容纳槽122中。
其中，声波采集模组50利用防水透声膜550和密封胶片520在电子设备中的密封装设可以参见前述的实施例，此处不再赘述。对于光学成像模组30在电子设备中的密封装设，下文将结合附图进行进一步的说明。
图10为如图7所示的电子设备的光学成像模组的分解结构示意图。请参见图10，并同时回看图7至图9，在本申请的实施例中，模组仓壳40除了包括透光玻璃400之外，还包括仓壳主体410和仓壳盖板420。例如，仓壳主体410和仓壳盖板420可以选用与设备壳体10相同的金属材质，或者，仓壳主体410和仓壳盖板420也可以选用塑料材质。
仓壳主体410具有中空结构，图7和图8中为了体现仓壳主体410的中空结构，省去了仓壳盖板420、并以带虚线箭头指引线的附图标记“30”表示光学成像模组30与仓壳主体410之间的位置关系。并且，仓壳主体410还具有朝向成像通孔113(即朝向壳体面板110)的第一开口端、以及背向成像通孔113(即背向壳体面板110)的第二开口端。
光学成像模组30可以以镜头组件300的镜头视野朝向仓壳主体410的第一开口端的位姿，从仓壳主体410的第二开口端放入仓壳主体410、并以该位姿容纳在仓壳主体410的内部。例如，光学成像模组30还可以包括处理组件310和转接支架350，镜头组件300与处理组件310装配连接。即，镜头组件300可以包括光学镜头300a以及容纳有可见光感光器件的镜头基座300b，并且，镜头基座300b可以与处理组件310装配连接。该处理组件310可以固定装设在转接支架350，并且，转接支架350固定装设于仓壳主体410内部的凸台415。
其中，仓壳主体410的第一开口端被透光玻璃400密封覆盖。并且，仓壳主体410可以以装设有透光玻璃400的第一开口端朝向设备壳体10(例如壳体面板110)的位姿，被固定装设于设备壳体10(例如壳体面板110)。例如，仓壳主体410可以通过螺钉固定装设于设备壳体10(例如壳体面板110)，以使得仓壳主体410的第一开口端与设备壳体10(例如壳体面板110)密封接触，从而，仓壳主体410装设有透光玻璃400的第一开口端可以密封覆盖设备壳体10(例如壳体面板110)开设的成像通孔113。
当光学成像模组30以镜头组件300的镜头视野朝向仓壳主体410的第一开口端的位姿容纳在仓壳主体410的内部时，可以利用仓壳盖板420封盖仓壳主体410的第二开口端。例如，仓壳盖板420可以通过螺钉装设于仓壳主体410。
请在参见图10的同时特别关注图9，在本申请的实施例中，仓壳主体410可以具有定位筒柱411，镜头组件300伸入在定位筒柱411中。并且，仓壳主体410被透光玻璃400密封覆盖的第一开口端可以位于定位筒柱411的端部。相应地，设备壳体10(例如壳体面板110)朝向设备壳盖20(例如壳体背板210)的内表面可以具有定位沉槽111。并且，成像通孔113可以开设于定位沉槽111的底部。优选地，在本申请的实施例中，定位沉槽111开设有成像通孔113的底部可以相对于设备壳体10(例如壳体面板110)背向设备壳盖20(例如壳体背板210)的外表面凸出。
从而，基于定位筒柱411与定位沉槽111之间的定位配合，内部封装有光学成像模组30的模组仓壳40，可以在模组仓壳40的装配过程中被定位调节为透光玻璃400对准成像通孔113的位姿、并以该位姿固定装设于设备壳体10(例如壳体面板110)。
具体地，在本申请的实施例中，定位筒柱411的端部可以具有沿轴向突出的开口凸缘412，该开口凸缘412的径向尺寸与定位沉槽111的径向尺寸适配。该开口凸缘412可以嵌入在定位沉槽111中，透光玻璃400可以内嵌于该开口凸缘412中。
并且，考虑到电子设备的密封特性，透光玻璃400可以与开口凸缘412密封配合，例如，透光玻璃400与开口凸缘412之间点胶密封。透光玻璃400与开口凸缘412 之间密封配合的环形拼缝被定位沉槽111的底部覆盖遮挡。定位筒柱411的端部还具有位于开口凸缘412的外周的筒柱台肩413，筒柱台肩413的径向尺寸大于定位沉槽111的径向尺寸。并且，筒柱台肩413在定位沉槽111的外周与设备壳体10密封配合，以使得定位筒柱411的端部可以密封覆盖开设于定位沉槽111的底部的成像通孔113。例如，筒柱台肩413与设备壳体10之间可以挤压装配有环绕在定位沉槽111的外周的密封圈93。在此情况下，进一步地，设备壳体10(例如壳体面板110)还可以具有环绕在定位沉槽111的外周的限位环槽112，并且，密封圈93与限位环槽112限位配合。
除了确保设备壳体10在成像通孔113处的密封特性之外，模组仓壳40还可以通过对光学成像模组30的密封封装而确保光学成像模组30在壳腔内的内层密封。即，仓壳主体410背向成像通孔113(即背向壳体面板110)的第二开口端可以被仓壳盖板420密封覆盖。例如，仓壳主体410的第二开口端装设有被仓壳盖板420密封挤压的仓壳密封圈94。
在此情况下，为了避免光学成像模组30与主控模组60之间的电连接破坏模组仓壳40对光学成像模组30的封装密封性，仓壳主体410还可以在第一开口端和第二开口端之间的壳壁开设有过线筒柱416。光学成像模组30的排线可以从过线筒柱416穿出至模组仓壳40之外，主控模组60可以通过该排线与光学成像模组30电连接。并且，过线筒柱416被密封填充，即，过线筒柱416内可以插装有允许排线穿过的过线密封塞460。
例如，过线密封塞460可以包括封堵过线筒柱416的密封塞主体461、从密封塞主体461侧向突出的限位凸缘462、以及贯穿密封塞主体461的过线夹缝463。其中，通过限位凸缘462与过线筒柱416的内壁之间的限位配合，可以阻止密封塞主体461在过线筒柱416发生探入至仓壳主体410内部的过位插入。并且，过线夹缝463可以允许主控模组60与光学成像模组30之间的排线穿过并被密封塞主体461紧密压实。优选地，排线可以包括诸如FPC(Flexible Printed Circuit，柔性电路板简称)等便于被密封夹持在过线夹缝463中的扁平状排线。并且，过线密封塞460可以包括硅胶材质。
进一步优选地，若镜头组件300与处理组件310装配连接、并通过转接支架350固定装设于仓壳主体410的内部，则，镜头组件300与处理组件310之间也可以采用点胶密封。
请回看图7和图8，在本申请的实施例中，电子设备还可以包括用于产生可视化指示光的发光灯组80。
图11为如图7所示的电子设备的发光灯组的分解结构示意图。图12为图11中示出的发光灯组的装配结构剖视图。其中，图12中为了突出呈现发光灯组80，省去了设备壳体10和设备壳盖20装配形成的壳腔中的光学成像模组30和声波采集模组50。请参见图11和图12，并同时结合图7和图8，发光灯组80可以包括灯组驱动板810和导光基座820。
灯组驱动板810具有至少两个发光灯体800，例如，发光灯体800可以包括诸如LED(Light-Emitting Diode，发光二极管)等通电发光的元件。图12中以三个发光灯体800为例，但可以理解的是，发光灯体800的数量可以不限于此。
导光基座820可以为包括PC(Polycarbonate，聚碳酸酯)的一体成型件。导光基座820可以包括基座板体821和基座围板822，其中，基座围板822可以在基座板体821朝向灯组驱动板810的一侧封闭环绕、并形成用于容纳发光灯体800的灯腔。并且， 导光基座820还可以包括从基座板体821背向灯组驱动板810的另一侧突出、且与发光灯体800一一对应的导光柱823。
在此情况下，灯组驱动板810可以覆盖基座围板822形成的灯腔，并且使得容纳在灯腔中的各发光灯体800与对应的导光柱823对齐接触，以使得任意一个发光灯体800产生的光能够传导至对应的导光柱823。
设备壳体10(例如壳体面板110)还可以具有与导光柱823一一对应的透光通孔118，每个导光柱823可以插入在对应的透光通孔118。并且，导光基座820密封覆盖各个导光柱823所在的透光通孔118，即，基座板体821可以与设备壳体10(例如壳体面板110)朝向设备壳盖20(例如壳体背板210)的内表面密封接触。例如，基座板体821与设备壳体10(例如壳体面板110)朝向设备壳盖20(例如壳体背板210)的内表面之间，可以挤压装配有灯组密封圈98。
在本申请的实施例中，为了避免容纳在灯腔中的发光灯体800产生的光被误传导至其对应的导光柱823以外的其他导光柱，发光灯组80还可以包括在每两个相邻的发光灯体800之间形成遮光阻隔的遮光介质830。该遮光介质830可以包括遮光泡棉，并且，该遮光介质830可以呈套设于各发光灯体800的护套状、并与各发光灯体800一起容纳在基座围板822形成的灯腔内，即，遮光介质830用于阻止在基座围板822形成的灯腔内的窜光。基座板体821连接在各导光柱823之间的连接部分可以在导光柱823的突出方向上呈阶梯状交错。例如，基座板体821在导光柱823的突出方向上的阶梯错位尺寸Δh可以为1mm，即，基座板体821的阶梯状结构用于减小以基座板体821为媒介的窜光。
优选地，PC材质的导光基座820中可以掺杂配比占0.3％的匀光粉，以使得插入在每个透光通孔118的导光柱823都能够产生均匀的光。
另外，发光灯组80在设备壳体10(例如壳体面板110)的装设位置可以避让光学成像模组30和声波采集模组50。从图11和图12中还可以看出，灯组驱动板810还可以具有背向导光基座820的驱动插接接口860，并且，主控模组60可以具有用于与驱动插接接口860插接的灯组对接插口(未在附图中示出)，以实现发光灯组80与主控模组60的电连接。
以上所述仅为本申请的一些实施例而已，并不用以限制本申请。凡在本申请的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本申请保护的范围之内。

Claims (15)

  1. 一种麦克风(500)的防水密封机构，包括：
    设备壳体(10)，开设有透声通孔(115)；
    模组基板(510)，开设有与所述透声通孔(115)位置对应的拾音孔(515)，其中，所述麦克风(500)在所述模组基板(510)背向所述设备壳体(10)的表面覆盖所述拾音孔(515)，以在所述麦克风(500)与所述透声通孔(115)之间形成贯穿所述拾音孔(515)的传声通道；
    防水透声膜(550)，横置于所述传声通道中；以及
    密封胶片(520)，与所述防水透声膜(550)一起密封堆叠在所述模组基板(510)和所述设备壳体(10)之间，
    其中，所述密封胶片(520)开设有被所述传声通道穿透的透音孔(525)，贯穿所述防水透声膜(550)的所述传声通道在所述拾音孔(515)与所述透声通孔(115)之间被所述透音孔(525)的孔壁密封包围，并且，
    所述密封胶片(520)还在所述设备壳体(10)和所述模组基板(510)之间形成封闭地环绕在所述透音孔(525)的外周的密封隔断。
  2. 根据权利要求1所述的麦克风(500)的防水密封机构，其中，
    所述透音孔(525)的第一开口端在所述设备壳体(10)朝向所述模组基板(510)的内表面与所述透声通孔(115)密封对接，
    所述透音孔(525)的第二开口端在所述模组基板(510)朝向所述设备壳体(10)的表面与所述拾音孔(515)密封对接，并且，
    所述防水透声膜(550)堆叠在所述透音孔(525)的第一开口端与所述透声通孔(115)之间、或堆叠在所述透音孔(525)的第二开口端与所述拾音孔(515)之间。
  3. 根据权利要求1所述的麦克风(500)的防水密封机构，其中，
    所述密封胶片(520)在所述防水透声膜(550)的外周与所述设备壳体(10)和所述模组基板(510)中的至少之一密封接触，以在所述设备壳体(10)和所述模组基板(510)之间形成封闭地环绕在所述透音孔(525)的外周的所述密封隔断；
    和/或，
    所述防水透声膜(550)的尺寸与所述传声通道的径向尺寸相适配，并且，所述密封胶片(520)的尺寸与所述模组基板(510)的径向尺寸相适配。
  4. 根据权利要求1所述的麦克风(500)的防水密封机构，其中，
    所述设备壳体(10)朝向所述模组基板(510)的内表面具有定位凹槽(114)，并且，所述透声通孔(115)开设于所述定位凹槽(114)的底部；
    所述密封胶片(520)与所述定位凹槽(114)定位配合，使得所述透音孔(525)与所述透声通孔(115)同轴对准；
    所述密封胶片(520)在所述设备壳体(10)和所述模组基板(510)之间形成的所述密封隔断，位于所述定位凹槽(114)之外。
  5. 根据权利要求4所述的麦克风(500)的防水密封机构，其中，所述密封胶片(520)具有凸台(526)，
    所述透音孔(525)贯穿所述凸台(526)，
    所述凸台(526)在所述密封胶片(520)朝向所述设备壳体(10)的表面凸起，并且，
    所述凸台(526)伸入至所述定位凹槽(114)中以与所述定位凹槽(114)定位配合。
  6. 根据权利要求5所述的麦克风(500)的防水密封机构，其中，
    所述防水透声膜(550)被定位在所述定位凹槽(114)中，并且，所述防水透声膜(550)密封覆盖所述透声通孔(115)；
    所述密封胶片(520)将所述防水透声膜(550)限位压接在所述定位凹槽(114)的底表面。
  7. 根据权利要求5所述的麦克风(500)的防水密封机构，其中，
    所述密封胶片(520)朝向所述模组基板(510)的表面具有与所述凸台(526)同轴布置的凹陷槽(529)；
    所述防水透声膜(550)被定位在所述凹陷槽(529)中，所述凹陷槽(529)将所述防水透声膜(550)限位压接在所述模组基板(510)朝向所述设备壳体(10)的表面，并且，
    所述防水透声膜(550)在所述模组基板(510)朝向所述设备壳体(10)的表面密封覆盖所述拾音孔(515)。
  8. 根据权利要求4所述的麦克风(500)的防水密封机构，其中，
    所述密封胶片(520)具有封闭地环绕在所述透音孔(525)的外周的凸筋(522)，其中：
    所述凸筋(522)分布在所述密封胶片(520)朝向所述设备壳体(10)的表面，并且，所述凸筋(522)在所述定位凹槽(114)之外与所述设备壳体(10)密封接触，以形成封闭地环绕在所述透音孔(525)的外周的所述密封隔断；
    和/或，
    所述凸筋(522)分布在所述密封胶片(520)朝向所述模组基板(510)的表面，并且，所述凸筋(522)在所述定位凹槽(114)之外与所述模组基板(510)密封接触，以形成封闭地环绕在所述透音孔(525)的外周的所述密封隔断。
  9. 根据权利要求1所述的麦克风(500)的防水密封机构，还包括网孔防护膜(530)，
    所述网孔防护膜(530)堆叠在所述防水透声膜(550)的至少一侧表面，
    所述网孔防护膜(530)的尺寸与所述防水透声膜(550)的尺寸相同，
    所述网孔防护膜(530)的强度大于所述防水透声膜(550)的强度。
  10. 根据权利要求1所述的麦克风(500)的防水密封机构，其中，
    所述透声通孔(115)的径向尺寸大于所述拾音孔(515)的径向尺寸，所述透音孔 (525)的径向尺寸不小于所述透声通孔(115)的径向尺寸，
    所述透声通孔(115)远离所述防水透声膜(550)的开口端相对于所述设备壳体(10)的外表面内凹，并与所述设备壳体(10)的所述外表面之间通过锥形敞口(116)连通，并且，
    所述锥形敞口(116)的径向尺寸在从所述透声通孔(115)到所述设备壳体(10)的外表面的方向上单调增加。
  11. 根据权利要求1所述的麦克风(500)的防水密封机构，其中，
    多个所述麦克风(500)和多个所述拾音孔(515)在所述模组基板(510)呈多圈环形共面分布；
    多个所述透声通孔(115)的数量及在所述设备壳体(10)的共面分布方式，与多个所述麦克风(500)和多个所述拾音孔(515)相同；
    多个所述透音孔(525)的数量及在所述密封胶片(520)的共面分布方式，与多个所述麦克风(500)和多个所述拾音孔(515)相同。
  12. 根据权利要求11所述的麦克风(500)的防水密封机构，其中，
    所述密封胶片(520)的尺寸与所述模组基板(510)的尺寸相适配，
    密封覆盖每个所述透声通孔(115)的所述防水透声膜(550)均被所述密封胶片(520)限位压接，并且，
    所述密封胶片(520)与所述设备壳体(10)的密封接触位置分布在被所述防水透声膜(550)密封覆盖的每个所述透声通孔(115)的外周。
  13. 根据权利要求1所述的麦克风(500)的防水密封机构，其中，
    所述设备壳体(10)部署有所述透声通孔(115)的区域为平板状，
    所述模组基板(510)为平板状，所述设备壳体(10)部署有所述透声通孔(115)的区域与所述模组基板(510)平行堆叠，并且，
    所述模组基板(510)通过环形部署的多个螺钉(590)固定于所述设备壳体(10)。
  14. 根据权利要求4所述的麦克风(500)的防水密封机构，其中，所述透声通孔(115)在所述定位凹槽(114)的底部的开口端的孔壁为弧形壁。
  15. 一种电子设备，包括麦克风(500)以及如权利要求1至14中任一项所述的麦克风(500)的防水密封机构。
PCT/CN2024/097052 2023-06-07 2024-06-03 麦克风的防水密封机构和电子设备 Ceased WO2024251083A1 (zh)

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