WO2024245166A1 - 导电泡棉及其制作方法、电子设备 - Google Patents

导电泡棉及其制作方法、电子设备 Download PDF

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Publication number
WO2024245166A1
WO2024245166A1 PCT/CN2024/095356 CN2024095356W WO2024245166A1 WO 2024245166 A1 WO2024245166 A1 WO 2024245166A1 CN 2024095356 W CN2024095356 W CN 2024095356W WO 2024245166 A1 WO2024245166 A1 WO 2024245166A1
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WIPO (PCT)
Prior art keywords
conductive
layer
foam
conductive paste
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/095356
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English (en)
French (fr)
Inventor
孟胤
毕凌宇
江成
樊勇
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Honor Device Co Ltd
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Honor Device Co Ltd
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Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Publication of WO2024245166A1 publication Critical patent/WO2024245166A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Definitions

  • the present application relates to the field of electronic communication technology, and in particular to a conductive foam and a manufacturing method thereof, and an electronic device.
  • foam is often used in electronic devices to reduce radiation stray, conduct electricity, and prevent static electricity.
  • current foam cannot achieve low working height and low passive intermodulation (PIM), which results in the electronic devices being unable to achieve ultra-thinness and unable to have better performance when used in electronic devices.
  • PIM passive intermodulation
  • the embodiments of the present application provide a conductive foam and a method for making the same, as well as an electronic device.
  • the conductive foam can be both conductive and well compressed or stretched, thereby achieving a lower working height in a first direction, having a smaller PIM, and a smaller stress.
  • the contact area with the structure in the electronic device can be larger.
  • a conductive foam for use in electronic equipment, wherein the conductive foam comprises:
  • a conductive layer covers at least a first surface of the foam substrate, wherein the first surface is used to be electrically connected to a first structure in the electronic device through the conductive layer; the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.
  • the embodiment of the present application provides a conductive foam, which is provided with a conductive paste layer covering at least the first surface of the foam substrate, so that the conductive paste in the conductive paste layer has certain ductility, good conductivity, large resistivity and other properties, and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure.
  • the conductive foam can have a lower working height in the first direction; at the same time, the conductive paste is sintered into layers, The volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; and when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.
  • multiple connected conductive particles in the conductive paste layer can generate multiple current paths, thereby making the conductive paste layer conductive; at the same time, the paste body in the conductive paste layer is soft, so that the conductive paste layer can be deformed under external pressure.
  • the conductive layer is a first conductive paste layer, and the first conductive paste layer is used to deform under external pressure.
  • a first conductive paste layer is provided to cover at least the first surface of the foam matrix. Since the first conductive paste has certain ductility, good conductivity, large resistivity and other properties, and the first conductive paste is in liquid before film formation, its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure.
  • the conductive foam can work at a lower height in the first direction; at the same time, the first conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the first conductive paste is very small; and when the first conductive paste is cured into a conductive paste layer, the first conductive particles in the first conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.
  • the conductive layer is a second conductive paste layer, and the second conductive paste layer is used to deform under external pressure.
  • a second conductive paste layer is provided to cover at least the first surface of the foam matrix. Since the second conductive paste has certain ductility, good conductivity, large resistivity and other properties, and the second conductive paste is in liquid before film formation, its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure.
  • the conductive layer further includes a first substrate layer, and the first substrate layer is configured to deform under the external pressure;
  • the orthographic projection of the conductive paste layer on the foam substrate at least partially overlaps with the orthographic projection of the first substrate layer on the foam substrate.
  • the first substrate layer has elasticity and can be well compressed or stretched; on the other hand, the conductive paste in the conductive paste layer has a certain degree of ductility.
  • the conductive paste has good electrical conductivity, high resistivity and other properties, and the volume will shrink during the curing process of the conductive paste, so that the conductive foam exhibits good conductivity and can also deform under pressure.
  • the conductive foam can have a lower working height in the first direction; at the same time, the conductive paste is sintered into layers and the volume is reduced, which can make the PIM inside the conductive paste very small; and the conductive paste is spread out when it is cured into a conductive paste layer, which can make the contact area between the conductive foam and the structure in the electronic device larger.
  • the conductive paste layer is a first conductive paste layer, and the first conductive paste layer is disposed on a side of the first substrate layer away from the foam matrix;
  • the conductive layer further includes a first adhesive layer, which is disposed between the first substrate layer and the foam matrix.
  • the first adhesive layer is used to bond the first substrate layer and the foam matrix, and is deformed under the external pressure.
  • the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced.
  • the conductive foam can be used to achieve electrical connection of the structures in the electronic devices, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic devices.
  • the conductive paste layer is a first conductive paste layer, and the first conductive paste layer at least wraps a surface of the first substrate layer close to the foam substrate and a surface of the first substrate layer away from the foam substrate;
  • the conductive layer further includes a first bonding layer, which is disposed between the first conductive paste layer and the foam matrix.
  • the first bonding layer is used to bond the first conductive paste layer and the foam matrix, and deforms under the external pressure.
  • the first adhesive layer can achieve better bonding between the first conductive paste layer and the foam matrix; at the same time, the first adhesive layer can be compressed or stretched, and the thickness of the first adhesive layer in the direction perpendicular to the foam matrix is relatively small, so that the thickness of the conductive layer in the direction perpendicular to the foam matrix is relatively small, and thus the working height of the conductive foam in the first direction can be relatively low; moreover, the first adhesive layer will not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, thereby obtaining a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the thickness of the electronic devices can be reduced while the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced.
  • the conductive foam can be used to achieve directional electrical connection of the structures in the electronic devices and reduce or eliminate radiation stray interference, thereby effectively improving the performance of the electronic devices.
  • the first bonding layer is a glue layer.
  • the first substrate layer/first conductive paste layer and the foam substrate can be well bonded by the adhesive layer; at the same time, the adhesive layer can be compressed or stretched, and the thickness of the adhesive layer in the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer in the direction perpendicular to the foam substrate is small, thereby enabling the conductive foam to be in the first direction.
  • the upper working height is low, thereby a conductive foam with a low working height in the first direction, small PIM and low stress can be obtained; and the adhesive layer is simple and easy to realize, and the cost is low.
  • the first bonding layer is a second conductive paste layer.
  • the second conductive paste layer can achieve better bonding between the first substrate layer/first conductive paste layer and the foam matrix; at the same time, the second conductive paste layer can be compressed or stretched, and the thickness of the second conductive paste layer in a direction perpendicular to the foam matrix can be smaller, so that the thickness of the conductive layer in a direction perpendicular to the foam matrix can be smaller, and thus the working height of the conductive foam in the first direction can be lower.
  • a conductive foam with a lower working height in the first direction, small PIM and low stress can be obtained.
  • the first surface of the foam matrix is divided into at least a first area and a second area, and along a direction perpendicular to the foam matrix, a height of a portion of the conductive layer located in the first area is less than a height of a portion of the conductive layer located in the second area.
  • the conductive foam when used in electronic devices, can be electrically connected to at least two structures of different heights, thereby enriching the application of conductive foam in electronic devices.
  • a structure of a portion of the conductive layer located in the first region is the same as a structure of a portion of the conductive layer located in the second region;
  • a height of a portion of at least one of the conductive layers located in the first region is smaller than a height of a portion of the at least one conductive layer located in the second region.
  • the height of the conductive layer in the first area can be made smaller than the height in the second area, and the height difference is as small as possible, which is simple and easy to implement.
  • the conductive layer further includes a second substrate layer, and the second substrate layer is disposed in the second region and located on a side of the conductive paste layer away from the foam matrix.
  • the height of the conductive layer in the first area can be smaller than that in the second area along the direction perpendicular to the foam matrix, and the height difference can be large, which is simple and easy to implement.
  • the foam matrix is in the shape of a polyhedron, and the polyhedron includes at least the first surface, the second surface, and the third surface connected to each other;
  • the conductive layer covers at least the first surface, the second surface and the third surface.
  • the foam matrix includes at least a first surface, a second surface and a third surface that are connected, and the conductive layer covers at least the first surface, the second surface and the third surface of the foam matrix, thereby providing a variety of conductive foams with low working height, small PIM and low stress in the first direction, thereby enriching the application of conductive foams in electronic devices.
  • the polyhedron when the polyhedron includes the first surface, the second surface and the third surface, the first surface is arranged opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the polyhedron.
  • the first surface and the second surface of the foam substrate are arranged opposite to each other, and the first surface is connected to the second surface through the third surface, and a conductive layer is arranged to cover at least part of the first surface, all of the third surface and at least part of the second surface of the polyhedron, so that a "C"-shaped conductive layer can be formed.
  • the conductive foam is applied to When used in electronic devices, the directionality of the conductive foam can be guaranteed, thereby performing identification and preventing mistakes.
  • the polyhedron when the polyhedron includes the first surface, the second surface, the third surface and the fourth surface, the first surface is arranged opposite to the second surface, and the third surface is arranged opposite to the fourth surface, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface and the entire fourth surface.
  • the first surface is arranged opposite to the second surface
  • the third surface is arranged opposite to the fourth surface
  • the first surface is connected to the second surface through the third surface and the fourth surface respectively
  • the conductive layer is arranged to cover the entire first surface, at least part of the second surface, the entire third surface and the entire fourth surface of the foam substrate, so as to form a similar
  • the conductive layer of the conductive foam can ensure the directionality of the conductive foam when used in electronic equipment, thereby performing identification and anti-mistake.
  • the polyhedron when the polyhedron includes a first surface, a second surface and a third surface, the first surface is arranged opposite to the second surface, and the first surface is connected to the second surface through the third surface; the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the polyhedron;
  • the conductive foam further includes a second adhesive layer, and the second adhesive layer is arranged on a portion of the second surface.
  • the conductive foam can be well electrically connected to the structure in the electronic device, thereby realizing the application of the conductive foam.
  • the polyhedron when the polyhedron includes a first surface, a second surface, a third surface and a fourth surface, the first surface is arranged opposite to the second surface, and the third surface is arranged opposite to the fourth surface, the first surface is connected to the second surface through the third surface and the fourth surface respectively, and the conductive layer covers the entire first surface, at least a portion of the second surface, the entire third surface and the entire fourth surface;
  • the conductive foam further includes a second adhesive layer, and the second adhesive layer is arranged on a portion of the second surface.
  • the conductive foam can be well electrically connected to the structure in the electronic device, thereby realizing the application of the conductive foam.
  • the second surface of the polyhedron is used to be electrically connected to a second structure in the electronic device through the conductive layer.
  • the first surface of the conductive foam can be electrically connected to the first structure in the electronic device through the conductive layer
  • the second surface can be electrically connected to the second structure in the electronic device through the conductive layer, thereby at least achieving electrical connection between the first structure and the second structure in the electronic device.
  • the first structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative component.
  • the conductive foam can achieve electrical connection with at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc. in the electronic device through the conductive layer.
  • the second structure in the electronic device is any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, and a decorative component.
  • the conductive foam can achieve electrical connection with at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc. in the electronic device through the conductive layer.
  • an electronic device comprising the conductive foam as in the first aspect or any possible implementation of the first aspect.
  • the electronic device provided in the embodiment of the present application uses the conductive foam as in the first aspect or any possible implementation of the first aspect, so that the thickness of the electronic device can be reduced while the PIM between the structure in the electronic device and the contact interface of the conductive foam can be smaller; and the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.
  • the first structure in the electronic device is a display screen
  • the second structure in the electronic device is a metal middle frame.
  • the first surface of the conductive foam can be electrically connected to the display screen through the conductive layer, and the second surface of the conductive foam can be electrically connected to the metal middle frame through the conductive layer; at the same time, because the conductive foam can be well compressed or stretched, it can not only meet the requirements of achieving a lower working height in the first direction, but also avoid damaging the display screen, thereby ensuring the excellent performance of the electronic device.
  • the first structure includes at least a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam during rotation.
  • a camera assembly such as a camera is electrically connected to a conductive foam. Since the working height of the conductive foam in the first direction is relatively low, it can be placed between the camera and other structures. When the camera rotates in any direction, since the conductive foam can be well compressed or stretched, the camera can always maintain an electrical connection with the conductive foam, thereby ensuring the performance of the electronic device. At the same time, since the conductive foam is an independent structure and can be separated, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic device, causing the entire electronic device to be scrapped. Moreover, the conductive foam can effectively absorb the tolerance existing when electrically connecting to the structure of the electronic device, thereby avoiding poor contact.
  • the conductive foam can make the grounding (GND) path shorter.
  • the conductive foam can also be improved by strain. As a result, the performance of the electronic device in the embodiment of the present application is greatly improved.
  • a method for making a conductive foam comprising:
  • a conductive layer is formed on at least the first surface of the foam substrate; wherein the first surface is used to electrically connect to a first structure in the electronic device through the conductive layer, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.
  • the method for making the conductive foam forms a conductive paste by spraying, printing, spraying, vacuum plating, dipping, etc., and bakes/heats to solidify to form a conductive paste layer, which is simple and easy to implement; at the same time, the conductive paste in the conductive paste layer has certain ductility, good conductivity, large resistivity and other properties, and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure.
  • the working height of the conductive foam in the first direction can be relatively low; and the conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; in addition, when the conductive paste is solidified into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.
  • the present application provides a conductive foam and a method for manufacturing the same, and an electronic device. Since the conductive paste layer in the conductive layer covering at least the first surface of the foam substrate has certain ductility, good conductivity, and a large resistivity, and since the foam substrate has elasticity, the conductive foam has a low working height in the first direction, and the PIM The conductive foam is smaller and the stress is also smaller; the conductive foam is applied to electronic devices, can have a larger contact surface with the structure in the electronic devices, and the PIM of the contact surface is smaller. At the same time, it can also make the thickness of the electronic devices thinner and reduce or eliminate radiation stray interference, etc., thereby effectively improving the performance of the electronic devices and providing a good user experience.
  • FIG1 is a schematic diagram of the structure of a first electronic device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of a three-dimensional structure with a cross section of the first conductive foam provided in an embodiment of the present application;
  • FIG6 is a schematic cross-sectional view of the conductive foam shown in FIG5 ;
  • FIG7 is a schematic diagram of the structure of the conductive paste layer of the conductive foam provided in an embodiment of the present application before curing;
  • FIG8 is a schematic diagram of the structure of the conductive paste layer of the conductive foam provided in an embodiment of the present application after curing;
  • FIG9 is a schematic diagram of a three-dimensional structure with a cross section of a third conductive foam provided in an embodiment of the present application.
  • FIG10 is a schematic cross-sectional view of the conductive foam shown in FIG9 ;
  • FIG11 is a schematic diagram of the structure of a fourth conductive foam provided in an embodiment of the present application.
  • FIG12 is a schematic diagram of the microstructure of the nonwoven fabric provided in an embodiment of the present application.
  • FIG13 is a schematic diagram of the structure of a fifth conductive foam provided in an embodiment of the present application.
  • FIG14 is a schematic diagram of the structure of a sixth conductive foam provided in an embodiment of the present application.
  • FIG15 is a schematic diagram of the structure of a seventh conductive foam provided in an embodiment of the present application.
  • FIG16 is a schematic diagram of the structure of an eighth conductive foam provided in an embodiment of the present application.
  • FIG17 is a schematic diagram of the structure of a ninth conductive foam provided in an embodiment of the present application.
  • FIG18 is a schematic diagram of the structure of the tenth conductive foam provided in an embodiment of the present application.
  • FIG19 is a schematic diagram of the structure of an eleventh conductive foam provided in an embodiment of the present application.
  • FIG20 is a schematic diagram of the structure of a second electronic device provided in an embodiment of the present application.
  • FIG21 is a schematic diagram of the structure of a third electronic device provided in an embodiment of the present application.
  • FIG22 is a schematic structural diagram of a first electronic device in the related art
  • FIG23 is a schematic structural diagram of a second electronic device in the related art.
  • FIG24 is a schematic structural diagram of a fourth electronic device provided in an embodiment of the present application.
  • FIG25 is a schematic diagram of the structure of a fifth electronic device provided in an embodiment of the present application.
  • FIG26 is a schematic structural diagram of a sixth electronic device provided in an embodiment of the present application.
  • FIG27 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.
  • FIG28 is a schematic structural diagram of a seventh electronic device provided in an embodiment of the present application.
  • FIG29 is a schematic structural diagram of an eighth electronic device provided in an embodiment of the present application.
  • FIG30 is a flow chart of a first method for making conductive foam provided in an embodiment of the present application.
  • FIG31 is a flow chart of a second method for making conductive foam provided in an embodiment of the present application.
  • FIG32 is a flow chart of a third method for making conductive foam provided in an embodiment of the present application.
  • FIG33 is a flow chart of a first method for making conductive foam for practical application provided in an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of technical features indicated.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of the features.
  • “multiple” means two or more.
  • “At least one” means one or more.
  • Foam refers to foamed materials such as polyurethane and plastic particles, referred to as foam. Foam has the characteristics of light weight, elasticity, fast pressure-sensitive fixation, easy use, easy bending, ultra-thin volume, and reliable performance.
  • Conductive foam refers to wrapping conductive cloth on the foam core. After processing, it has good surface conductivity and can be easily fixed to the structure that needs to be shielded with adhesive tape.
  • Passive intermodulation occurs when two or more frequencies mix together in a nonlinear device, thereby generating spurious signals.
  • Radiated spurious signals refer to the radiation at discrete frequencies other than the carrier frequency and the sidebands and adjacent channels caused by normal modulation and switching transients when modulated with a standard signal; radiated spurious signals may be harmonic components, intermodulation signals, etc. generated by some nonlinear structures.
  • the conductive network is mainly formed by direct overlapping of the conductive particles.
  • the conductive particles When the content of conductive particles in the conductive paste is low, the conductive particles are insufficient for direct contact. At this time, an external electric field is imposed from the outside, and electrons penetrate the organic matter through the tunnel effect and jump to the nearby conductive particles, so that the conductive network is unobstructed. When the tunnel effect theory or field emission theory is dominant in the conductive paste, the PIM performance of the conductive paste is poor.
  • Non-woven fabrics are also called non-woven fabrics, needle-punched cotton, needle-punched non-woven fabrics, etc. They are made of polyester fibers, polyester fibers and other materials, and are made through a needle-punching process. Non-woven fabrics have no warp and weft. They are a kind of fabric that does not require spinning and weaving. They are made by directional or random arrangement of textile short fibers or filaments to form a fiber mesh structure, and then reinforced by mechanical, thermal bonding or chemical methods. Non-woven fabrics are moisture-proof, breathable, flexible, thin, flame-retardant, non-toxic and tasteless, low-priced, and recyclable.
  • FIG1 shows an electronic device 01 to which an embodiment of the present application is applicable.
  • the mobile phone may include a display module 101, a middle frame 102, a rear shell 103, etc.
  • the middle frame 102 is arranged between the display module 101 and the rear shell 103, and the middle frame 102 includes a frame 1021 and a carrier plate 1022 surrounded by the frame, and an internal structure, such as components, is installed on one side of the carrier plate 1022.
  • the internal structure of the mobile phone can realize its function through electrical connection, which is usually a weak force contact, resulting in the contact interface of the internal structure to easily generate nonlinear products such as harmonics and passive intermodulation. Nonlinear products are the main source of mobile phone radiation spurious, and radiation spurious interference is an important indicator for mobile phone acceptance.
  • the internal structure of the mobile phone can be electrically connected through foam.
  • foam There are many types of foam provided by the relevant technology, such as omnidirectional drawing foam, etc. These foams are widely used due to their low PIM and other characteristics.
  • FIG2 shows an all-round brushed foam 03 in a related art.
  • the all-round brushed foam 03 includes a backing glue 121 and a metal wire 122.
  • the backing glue 121 may include any one of a conductive glue, an insulating glue, etc.
  • the metal wire 122 may include a copper wire, etc.
  • the metal wire 122 may break, or the metal wire 122 may not rebound and may be permanently deformed, which makes it difficult to compress its working height in the first direction.
  • the first direction is the OZ direction shown in FIG2 , and the OZ direction corresponds to the thickness direction of the mobile phone.
  • the present application provides a conductive foam, which is provided with a conductive layer covering at least the first surface of the foam substrate, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer has the advantages of good ductility, good conductivity, and very small internal PIM; at the same time, the conductive paste is in liquid state before film formation, and the volume is reduced during the curing process.
  • the conductive foam will shrink, so that it not only exhibits good conductivity, but also can be deformed under pressure and rebound after the pressure disappears, thereby effectively reducing the working height of the conductive foam in the first direction and achieving a very small PIM, and the conductive foam itself will not have problems such as breakage and permanent deformation.
  • the contact area between the conductive foam and the structure in the electronic device is large, and the thickness of the electronic device can be effectively reduced to achieve ultra-thinness; at the same time, the interface PIM between the structure in the electronic device and the contact surface of the conductive foam can also be reduced, thereby reducing or eliminating radiation stray interference, etc.
  • the electronic devices of the present application may include mobile phones, wearable devices (such as smart bracelets, smart watches, headphones, etc.), tablet computers, laptop computers, handheld computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computers, UMPCs), cellular phones, personal digital assistants (personal digital assistants, PDAs), augmented reality (AR) and virtual reality (VR) devices, Internet of Things (IOT) devices, vehicle-mounted electronic devices, and may also be televisions, large screens, printers, projectors and other devices.
  • wearable devices such as smart bracelets, smart watches, headphones, etc.
  • tablet computers laptop computers, handheld computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computers, UMPCs), cellular phones, personal digital assistants (personal digital assistants, PDAs), augmented reality (AR) and virtual reality (VR) devices, Internet of Things (IOT) devices, vehicle-mounted electronic devices, and may also be televisions, large screens, printers, projectors and other devices.
  • laptop computers such as smart bracelets, smart
  • the mobile phone may include a display module 101, a middle frame 102, and a rear shell 103, etc.
  • the display module 101 includes a display screen 1011, and a touch panel 1012 arranged on the light-emitting side of the display screen 1011; the display module 101 is installed on one side of the carrier board 1022, and the internal structures such as the camera assembly, antenna, circuit board, and battery are installed on the other side.
  • the frame 1021 and the carrier board 1022 used to form the middle frame 102 can be an integrated structure; the rear shell 103 is installed on the middle frame 102, and the rear shell 103 is used to protect the above internal structures.
  • the mobile phone may also include a metal frame 1013 installed on the non-light-emitting side of the display screen 1011, and the side of the metal frame 1013 away from the display screen 1011 can be adhered to the side of the middle frame 102 through an adhesive layer, so as to achieve the purpose of installing the display module 101 on one side of the middle frame 102.
  • the first structure may be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.
  • the second structure may be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.
  • the first structure and the second structure may be the same, or of course different, depending on the actual application.
  • the camera assembly may include a camera
  • the circuit board may include a printed circuit board (PCB), a flexible printed circuit (FPC), etc.
  • display screens may include liquid crystal display (LCD), organic light emitting diode (OLED) display screens, etc.
  • LCD liquid crystal display
  • OLED organic light emitting diode
  • the touch panel may include a cover plate made of glass or transparent resin material, and a touch electrode pattern located on a side of the cover plate close to the display screen.
  • the conductive foam provided by the present application when applied to an electronic device, it can be electrically connected to any first structure and/or other structures except the first structure in the electronic device, so that the electrical connection of the structure in the electronic device can be achieved through the conductive foam, while the thickness of the electronic device can be reduced, and the contact surface PIM between the structure in the electronic device and the conductive foam can be reduced. In addition, it can also reduce or eliminate radiation stray interference, etc., and the user experience is good.
  • At least one surface of the conductive foam provided in the embodiment of the present application is used to be electrically connected to at least one structure in an electronic device through a conductive paste layer.
  • the structure in the electronic device may include at least one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc.
  • the first surface may be used to electrically connect to one first structure through the conductive paste layer, or the first surface may be used to electrically connect to multiple first structures through the conductive paste layer, which is not specifically limited here.
  • the conductive foam when the conductive foam includes a first surface and other surfaces, for example, the conductive foam includes a first surface and a second surface, the first surface may be electrically connected to the first structure through a conductive paste layer, and the second surface may be electrically connected to the second structure through a conductive paste layer.
  • the second structure may refer to the first structure, which will not be described in detail here. The number of the first structure and the second structure may also be determined according to actual needs.
  • the conductive foam 05 provided in the embodiment of the present application is introduced in detail below in conjunction with Figures 3 to 19.
  • the conductive foam 05 provided in the present application includes:
  • the conductive layer 2 covers at least the first surface 11 of the foam substrate 1, and the first surface 11 is used to be electrically connected to the first structure in the electronic device through the conductive layer 2; the conductive layer 2 at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.
  • the conductive paste layer includes a paste body and a plurality of connected conductive particles, and the conductive particles are doped into the paste body.
  • the present application does not specifically limit the material and manufacturing process of the foam matrix.
  • the material of the foam matrix may include polyurethane, silicon dioxide-based resin, etc.
  • the foam matrix may be formed by a foaming process to serve as the foam core of the conductive foam.
  • the foamed foam matrix has a plurality of micropores on its surface, and the foam matrix is elastic and can be well deformed by compression, stretching, etc.
  • the shape of the foam matrix may include a polyhedron, a sphere, a cylinder, etc.
  • the polyhedron may include a regular polyhedron or an irregular polyhedron.
  • the regular polyhedron may include a cube, a hexahedron, an octahedron, etc.
  • the shape of the foam matrix 1 is a hexahedron.
  • the polyhedron has multiple surfaces, and the multiple surfaces include at least a first surface, which is a surface that needs to be electrically connected to a first structure in an electronic device; of course, at least one other surface of the polyhedron except the first surface can also be electrically connected to other structures in the electronic device except the first structure.
  • the polyhedron can also be provided with a second surface electrically connected to the second structure in the electronic device.
  • the number of surfaces that need to be electrically connected to the structure of the electronic device can be determined according to the actual application of the conductive foam.
  • the electrical connection can be an indirect electrical connection, that is, the surface of the polyhedron is electrically connected to the structure in the electronic device through a conductive layer; of course, the surface of the polyhedron can also be electrically connected to the structure in the electronic device through a first adhesive layer, a conductive layer, etc., which is not specifically limited here.
  • the volume of the foam matrix mentioned above in the present application can be determined according to actual needs.
  • the above-mentioned conductive layer covers at least the first surface of the foam substrate, which means that the conductive layer can only cover the first surface of the foam substrate; or, in addition to covering the first surface of the foam substrate, the conductive layer can also cover the foam substrate.
  • Other surfaces of the substrate wherein the other surfaces refer to any surface other than the first surface, which is not specifically limited here.
  • the conductive layer can cover one surface (the first surface) of the foam substrate; or, the conductive layer can cover two surfaces (the first surface and the second surface) of the foam substrate; or, the conductive layer can cover more than three surfaces of the foam substrate, which is subject to actual application.
  • the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface) of the foam substrate 1.
  • the conductive layer covers a portion of the first surface 11 (upper surface), a portion of the second surface 12 (lower surface), and the entire third surface 13 (left surface) of the foam substrate 1 .
  • the conductive layer covers the entire first surface 11 (upper surface), a portion of the second surface 12 (lower surface), and the entire third surface 13 (left surface) of the foam substrate 1 .
  • the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface), the entire third surface 13 (left surface), and the entire fourth surface 14 (right surface) of the foam substrate 1 .
  • the first surface, the second surface, the third surface and the fourth surface is used for electrical connection with the structure in the electronic device based on the conductive layer.
  • the first surface, the second surface, the third surface and the fourth surface can all be electrically connected with the structure in the electronic device based on the conductive layer, specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, the second surface is used for electrical connection with the second structure in the electronic device based on the conductive layer, the third surface is used for electrical connection with the third structure in the electronic device based on the conductive layer, and the fourth surface is used for electrical connection with the fourth structure in the electronic device based on the conductive layer; or, only one surface can be used for electrical connection with the structure in the electronic device based on the conductive layer, specifically, the first surface is used for electrical connection with the first structure in the electronic device based on the conductive layer, and the second surface, the third surface and the fourth surface are not used for electrical connection with the structure in the electronic device based on the
  • the first structure, the second structure, the third structure and the fourth structure can all be any one of a display screen, a camera assembly, an antenna, a metal middle frame, a circuit board, a reed, a shielding cover, a battery cover, a decorative part, etc., which is determined according to actual needs.
  • the above-mentioned conductive layer at least includes a conductive paste layer, which means that the conductive layer may only include a conductive paste layer, for example, the conductive layer is a first conductive paste layer/a second conductive paste layer; or, in addition to the conductive paste layer, the conductive layer may also include other film layers, for example, it may also include a first bonding layer, a first substrate layer, etc., which is not specifically limited here.
  • the present application does not specifically limit the conductive paste of the conductive paste layer.
  • the conductive paste may include a polymer conductive paste (baked or heated to form a film, with an organic polymer as a bonding phase), a sintered conductive paste (sintered to form a film, with a sintering temperature of >500°C, and glass powder or oxide as a bonding phase), etc.
  • the following embodiments of the present application are all described by taking the conductive paste as a polymer conductive paste as an example.
  • the conductive paste may include a paste body and a plurality of conductive particles, wherein the plurality of conductive particles are doped into the paste body, wherein the plurality of conductive particles are not connected before curing but are connected after curing, thereby generating a plurality of current paths in the conductive paste layer formed after curing, thereby conducting electricity, and after curing, the conductive particles reduce their volume to ensure contact between adjacent particles, thereby effectively reducing the PIM inside the conductive paste; at the same time, after curing, the conductive particles spread out, thereby increasing the contact area between the conductive paste layer and the structure in the electronic device.
  • the slurry body may include a resin
  • the resin may be any one of a silicone resin, a silane-modified resin, an epoxy resin, a silicon dioxide resin, etc.
  • silicone resin and silane-modified resin have the characteristics of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing (for example, less than 10%), high temperature resistance, and no internal stress.
  • Epoxy resin and silicon dioxide resin have the characteristics of low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation.
  • the elastic modulus of the above-mentioned conductive particles is different.
  • the main body of the slurry is the same resin
  • the conductive particles with a smaller elastic modulus are selected and doped into the resin, the conductive slurry can be slightly deformed under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.
  • Table 1 below shows the elastic modulus, Poisson's ratio, pressure and intensity corresponding to silver particles, copper particles, gold particles, aluminum particles, nickel particles, iron particles and platinum particles of the same size.
  • the required conductive particles can also be selected according to other conditions:
  • conductive particles can be selected according to the pressure. For example, when the pressure is high, nickel particles can be selected. The properties of nickel particles are more stable than those of silver particles. For another example, when the pressure is moderate, copper particles can be selected. The cost of copper particles is lower than that of silver particles.
  • conductive particles can be selected according to the current of the conductive path in the conductive foam. For example, when the current is low or in the low current area, copper particles can be selected to reduce costs. For another example, when the current is high or in the high current area, silver particles, gold particles, or other low PIM particles can be selected to ensure the performance of the conductive foam.
  • the present application does not specifically limit the doping concentration of the conductive particles in the conductive paste in the main body of the paste.
  • the mass fraction of the conductive particles in the main body of the paste may range from 75% to 85%.
  • the mass fraction of the conductive particles in the main body of the paste may be 75%, 78%, 80%, 81%, 83% or 85%, etc.
  • the mass fraction of the conductive particles in the main body of the paste may be set to be higher to meet the compression or stretching of the conductive paste layer.
  • the conductive paste is a conductive silver paste
  • the conductive silver paste includes resin and silver particles, and the silver particles are doped in the resin.
  • the mass fraction of the silver particles can be 80%, the mass fraction of the resin can be 20%, and the resin can be compressed or stretched; the density of the silver particles can be 10, and the density of the resin can be 1; when the mass fraction is converted into a volume fraction, the ratio of the volume fraction of the silver particles to the volume fraction of the resin can be 2:5.
  • the volume can shrink by about 50%, effectively reducing the PIM between the silver particles, which can even be ignored.
  • the ratio of the volume fraction of the silver particles in the conductive silver paste layer to the volume fraction of the resin can be 1:1.25.
  • the contact area When in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after being activated at low pressure, further increasing the contact area; the tensile adhesion value range of the conductive silver paste can include 8-9Mpa, specifically, the tensile adhesion of the conductive silver paste can be 8Mpa or 9Mpa, etc.
  • the silver particles can be micron-sized spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-sized silver wires, silver rods, etc., depending on the actual application.
  • the thickness of the conductive paste layer in the direction perpendicular to the foam substrate is in the range of 10-13 ⁇ m, the resistivity of the conductive paste layer can reach 200 m ⁇ . Therefore, if you want the resistivity of the conductive paste layer to be lower, you can set the thickness of the conductive paste layer in the direction perpendicular to the foam substrate to be smaller.
  • the present application does not specifically limit the thickness of the above-mentioned conductive paste layer in the direction perpendicular to the foam substrate.
  • the thickness of the conductive paste layer in the direction perpendicular to the foam substrate can range from 5 to 10 ⁇ m.
  • the thickness of the conductive paste layer in the direction perpendicular to the foam substrate can be 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m or 10 ⁇ m, etc.
  • a conductive paste can be first formed on the surface of the foam substrate by spraying, printing, etc., and then the conductive paste is cured by baking/heating, etc. to form the conductive paste layer; or, when the conductive layer includes a conductive paste layer and a first substrate layer, a conductive paste can be first formed on the surface of the first substrate layer by spraying, printing, etc., and then the conductive paste is cured by baking/heating, etc. to form the conductive paste layer; or, when the conductive layer includes a conductive paste layer and a first substrate layer, the first substrate can be first immersed in the conductive paste, and then the first substrate layer, the conductive paste and the foam substrate are combined.
  • the silicone resin or silane modified resin can be first coated by spraying, and then the conductive paste is baked/heated to cure; or, the first substrate can be immersed in the silicone resin or silane modified resin, and then the conductive paste is baked/heated to cure.
  • other manufacturing processes can also be used, which are not specifically limited here.
  • the epoxy resin or silicon dioxide resin can be printed first, and then the conductive paste is baked/heated to cure; or the first substrate can be immersed in the epoxy resin or silicon dioxide resin, and then the conductive paste is baked/heated to cure.
  • other manufacturing processes can also be used, which are not specifically limited here.
  • the slurry body can also be selected according to the material of the foam matrix.
  • a substrate with a material similar to that of the foam matrix can be selected as the slurry body.
  • a silicone rubber conductive foam can use a resin with a silica matrix, thereby improving the bonding between the foam matrix and the conductive slurry.
  • Figures 8 and 9 both illustrate the conductive mechanism by taking the conductive layer including the first conductive paste layer 21, and the first conductive paste in the first conductive paste layer 21 being the first polymer conductive paste as an example.
  • Figure 8 shows a schematic diagram of the first polymer conductive paste before film formation;
  • Figure 9 shows a schematic diagram of the first polymer conductive paste after film formation.
  • the first conductive paste layer is not conductive at this time, and no conductive path is generated.
  • FIG9 during the curing process, as the solvent continues to evaporate, the spacing between the first conductive particles 212 becomes smaller and smaller until they are in direct contact with each other to form a conductive path D1. This is the percolation theory of the first conductive paste.
  • FIG9 is illustrated by taking the first conductive paste layer generating two conductive paths D1 as an example.
  • the mass fraction of the first conductive particles in the first conductive paste should satisfy the requirement that the conductive mechanism of the first conductive paste is at least based on the percolation theory, which includes: the conductive mechanism of the first conductive paste is only based on the percolation theory; or the conductive mechanism of the first conductive paste is based on the percolation theory, and can also be supplemented by the tunnel effect theory or the field emission theory.
  • the mass fraction of the first conductive particles in the first conductive paste is in the range of 75-85%, the conductive mechanism of the first conductive paste can be at least based on the percolation theory.
  • the present application does not specifically limit the source of the above-mentioned external pressure.
  • it can be the pressure directly applied to the conductive foam by the outside world; or it can be the pressure applied to the conductive foam by the outside world from other structures in the electronic device, which in turn apply the pressure to the conductive foam; or it can be the pressure generated by other structures in the electronic device itself and applied to the conductive foam.
  • any two conductive foams of the present application namely conductive foam 1 and conductive foam 2, and make the first surface of conductive foam 1 electrically connected to the laser engraved surface in the electronic device, and the second surface electrically connected to the copper foil in the electronic device, and the first surface of conductive foam 2 electrically connected to the laser engraved surface in the electronic device, and the second surface electrically connected to the copper foil in the electronic device, and then test the PIM values and the worst knocking values of conductive foam 1 and conductive foam 2 respectively, as shown in Table 2 below.
  • a conductive foam 3 of the related technology wherein the conductive foam 3 is a surface of a foam substrate coated with a gold-plated layer, so that the first surface of the conductive foam 3 is electrically connected to the laser-engraved surface in the electronic device to form a first contact surface, and the second surface is electrically connected to the copper foil in the electronic device.
  • the PIM value, the worst value of tapping the workbench, and the worst value of tapping the first contact surface of the conductive foam 3 are then tested and obtained, as shown in Table 3 below.
  • the conductive foam may also include a second adhesive layer, a release layer, and other structures.
  • the present application does not specifically limit the type and position of the second adhesive layer.
  • the second adhesive layer may include any one of conductive glue and insulating glue.
  • the second adhesive layer may be any one of full conductive glue and partial insulating glue.
  • the second adhesive layer may be provided on any surface of the foam substrate.
  • the release layer may include release paper; the release layer may be disposed on a side of the second adhesive layer away from the conductive layer to protect the second adhesive layer.
  • the release layer may be removed to electrically connect the conductive layer to the structure in the electronic device through the second adhesive layer.
  • the conductive foam provided in the embodiment of the present application is provided with a conductive paste layer covering at least the first surface of the foam substrate.
  • the conductive paste in the conductive paste layer has certain ductility, good conductivity, and a large resistivity (10 -5 -10 -4 ⁇ cm), and the conductive paste is in liquid state before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity and can also be deformed under pressure.
  • the working height of the conductive foam in the first direction can be relatively low.
  • the working height of the conductive foam in the first direction can range from 0.1 to 0.15 mm.
  • the working height of the conductive foam in the first direction can be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm or 0.15 mm, etc.
  • the conductive paste is sintered into layers, and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; on the other hand, when the conductive paste is cured into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger, for example, the contact area can reach more than 43.46%.
  • the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the conductive foam When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.
  • the conductive layer is the first conductive paste layer 21 is described in detail below with reference to FIG. 3 and FIG. 4 .
  • the conductive layer is a first conductive paste layer 21.
  • a plurality of first conductive particles 212 in the first conductive paste layer 21 are doped in the first paste body 211.
  • the plurality of first conductive particles 212 are not connected before curing, but are connected after curing, so that a plurality of current paths are generated in the first conductive paste layer 21 formed after curing, thereby conducting electricity.
  • the first conductive particles 212 are reduced in volume to ensure contact between adjacent particles, so that the first conductive particles 212 are The PIM inside the paste is effectively reduced; at the same time, after curing, the first conductive particles 212 are spread out, which can increase the contact area between the first conductive paste layer 21 and the structure in the electronic device.
  • the present application does not specifically limit the conductive paste in the first conductive paste layer.
  • the conductive paste may include polymer conductive paste, sintered conductive paste, etc.
  • the following embodiments of the present application are described by taking the conductive paste in the first conductive paste layer as polymer conductive paste.
  • the first slurry body may include a first resin.
  • the first resin may be an epoxy resin, a silicon dioxide resin, etc.
  • epoxy resin and silicon dioxide resin both have the characteristics of low viscosity, easy leveling, large volume change rate after curing (for example, greater than 50%), easy curing, large internal stress, and good heat dissipation.
  • the first conductive particles may include first metal conductive particles.
  • the first metal conductive particles may be any one or more combinations of silver particles, copper particles, gold particles, aluminum particles, nickel particles, etc.
  • the shape of the first metal conductive particles may include any one of spherical, thorny, flake, rod, wire, etc.
  • the size of the first metal conductive particles may be micron-level, nanometer-level, etc., specifically, the particle size range of the first metal conductive particles may include 5-20 ⁇ m, that is, the particle size of the first metal conductive particles may be 5 ⁇ m, 8 ⁇ m, 10 ⁇ m, 13 ⁇ m, 17 ⁇ m or 20 ⁇ m, etc.
  • the elastic modulus of the above-mentioned first conductive particles is different.
  • the first slurry body is the same first resin
  • the first conductive particles with a smaller elastic modulus are selected and doped into the first resin
  • the first conductive slurry can be slightly deformed under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.
  • the present application does not specifically limit the doping concentration of the first conductive particles in the first conductive paste in the first paste body.
  • the mass fraction of the first conductive particles in the first paste body may range from 75% to 85%.
  • the mass fraction of the first conductive particles in the first paste body may be 75%, 78%, 80%, 81%, 83% or 85%, etc.
  • the first conductive paste is a first conductive silver paste
  • the first conductive silver paste includes a first resin and first silver particles
  • the first silver particles are doped in the first resin.
  • the mass fraction of the first silver particles can be 80%, the mass fraction of the first resin can be 20%, and the first resin can be compressed or stretched;
  • the density of the first silver particles can be 10, and the density of the first resin can be 1;
  • the ratio of the volume fraction of the first silver particles to the volume fraction of the first resin can be 2:5, and after the first conductive silver paste is cured, the volume can shrink by about 50%, effectively reducing the PIM between the first silver particles, which can even be negligible, and the ratio of the volume fraction of the first silver particles in the first conductive silver paste layer to the volume fraction of the first resin can be 1:1.25, and when in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft
  • the silver particles can be micron-sized spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-sized silver wires, silver rods, etc., depending on the actual application.
  • the present application does not specifically limit the thickness of the first conductive paste layer in the direction perpendicular to the foam substrate.
  • the thickness of the first conductive paste layer in the direction perpendicular to the foam substrate may range from 5 to 10 ⁇ m.
  • the thickness of the first conductive paste layer along a direction perpendicular to the foam substrate can be 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m or 10 ⁇ m, etc.
  • the present application does not specifically limit the manufacturing process of the above-mentioned first conductive paste layer.
  • the first conductive paste can be formed on the surface of the foam substrate by printing or other methods, and then the first conductive paste is cured by baking/heating or other curing methods to form the first conductive paste layer.
  • the conductive foam provided in the embodiment of the present application is provided with a first conductive paste layer covering at least the first surface of the foam substrate.
  • the first conductive paste in the first conductive paste layer has the properties of low viscosity, easy leveling, large volume change rate after curing, easy curing, large internal stress, good heat dissipation, etc., and the first conductive paste is in liquid state before film formation, and its volume will shrink during curing, so that the conductive foam exhibits good conductivity and can also be deformed under pressure.
  • the conductive foam can have a lower working height in the first direction; on the other hand, the first conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple first conductive particles, so that the PIM inside the first conductive paste is very small; on the other hand, when the first conductive paste is cured into the first conductive paste layer, the conductive particles in the first conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.
  • the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the conductive foam When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.
  • the conductive layer is the second conductive paste layer 22 .
  • the conductive layer is a second conductive paste layer 22.
  • a plurality of second conductive particles 222 in the second conductive paste layer 22 are doped in a second paste body 221.
  • the plurality of second conductive particles 222 are not connected before curing, but are connected after curing, thereby generating a plurality of current paths in the second conductive paste layer 22 formed after curing, thereby conducting electricity.
  • the second conductive particles 222 are reduced in volume to ensure contact between adjacent particles, thereby effectively reducing the PIM inside the second conductive paste.
  • the second conductive particles 222 are spread out, which can increase the contact area between the second conductive paste layer 22 and the structure in the electronic device.
  • the present application does not specifically limit the conductive paste in the second conductive paste layer.
  • the conductive paste may include polymer conductive paste, sintered conductive paste, etc.
  • the following embodiments of the present application are described by taking the conductive paste in the second conductive paste layer as polymer conductive paste.
  • the second slurry body may include a second resin.
  • the second resin may be any one of a silicone resin, a silane-modified resin, etc.
  • silicone resins and silane-modified resins have the characteristics of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing (for example, less than 10%), high temperature resistance, and no internal stress.
  • the second conductive particles may include second metal conductive particles.
  • the second metal conductive particles may be any one or more combinations of silver particles, copper particles, gold particles, aluminum particles, nickel particles, etc.; the shape of the second metal conductive particles may include any one of spherical, thorny, sheet-like, rod-like, linear, etc.; the size of the second metal conductive particles may be The particle size of the second metal conductive particles may be in the micrometer level, nanometer level, etc.
  • the particle size range of the second metal conductive particles may include 5-20 ⁇ m, that is, the particle size of the second metal conductive particles may be 5 ⁇ m, 8 ⁇ m, 10 ⁇ m, 13 ⁇ m, 17 ⁇ m or 20 ⁇ m, etc.
  • the elastic modulus of the above-mentioned second conductive particles is different.
  • the second paste body is the same second resin
  • the second conductive particles with a smaller elastic modulus are selected and doped into the second resin
  • the second conductive paste can be slightly deformed under low pressure, thereby increasing the contact area between the conductive foam and the structure in the electronic device.
  • the present application does not specifically limit the doping concentration of the second conductive particles in the second conductive paste in the second paste body.
  • the mass fraction of the second conductive particles in the second paste body may range from 75% to 85%.
  • the mass fraction of the second conductive particles in the second paste body may be 75%, 78%, 80%, 81%, 83% or 85%, etc.
  • the second conductive paste is a second conductive silver paste
  • the second conductive silver paste includes a second resin and second silver particles
  • the second silver particles are doped in the second resin.
  • the mass fraction of the second silver particles can be 80%, the mass fraction of the second resin can be 20%, and the second resin can be compressed or stretched;
  • the density of the second silver particles can be 10, and the density of the second resin can be 1; when the mass fraction is converted into volume fraction, the ratio of the volume fraction of the second silver particles to the volume fraction of the second resin can be 2:5, and the volume of the second conductive silver paste can shrink by about 50% after curing, which effectively reduces the PIM between the second silver particles and can even be ignored.
  • the ratio of the volume fraction of the second silver particles in the second conductive silver paste layer to the volume fraction of the second resin can be 1:1.25, and when in contact with the structure in the electronic device, the contact area can reach 45% of the total area; at the same time, because the silver particles themselves are good conductors and soft, they will deform after being activated at low pressure, further increasing the contact area;
  • the tensile adhesion value range of the second conductive silver paste can include 8-9Mpa, specifically, the tensile adhesion of the second conductive silver paste can be 8Mpa or 9Mpa, etc.
  • the silver particles can be micron-sized spherical, thorn-shaped, flake-shaped, rod-shaped silver, or nano-sized silver wires, silver rods, etc., depending on the actual application.
  • the present application does not specifically limit the thickness of the second conductive paste layer along the direction perpendicular to the foam substrate.
  • the thickness range of the second conductive paste layer along the direction perpendicular to the foam substrate may include 5-10 ⁇ m.
  • the thickness of the second conductive paste layer along the direction perpendicular to the foam substrate may be 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m or 10 ⁇ m, etc.
  • the present application does not specifically limit the manufacturing process of the second conductive paste layer.
  • the second conductive paste can be first formed on the surface of the foam substrate by spraying or other methods, and then the second conductive paste is cured by baking/heating or other curing methods to form the second conductive paste layer.
  • the conductive foam provided in the embodiment of the present application is provided with a second conductive paste layer covering at least the first surface of the foam substrate.
  • the second conductive paste in the second conductive paste layer has the properties of good elasticity, high viscosity, high viscosity, low volume shrinkage after curing, high temperature resistance, and no internal stress.
  • the second conductive paste is in liquid state before film formation, and its volume will shrink during curing, so that the conductive foam exhibits good conductivity while being able to deform under pressure.
  • the conductive foam can have a lower working height in the first direction; on the other hand, the second conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple second conductive particles, so that the PIM inside the second conductive paste is very small; on the other hand, when the second conductive paste is cured into the second conductive paste layer, the conductive particles in the second conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.
  • the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the conductive foam When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.
  • the conductive layer also includes a first substrate layer 6, which is used to deform under external pressure; the orthographic projection of the conductive slurry layer on the foam substrate 1 at least partially overlaps with the orthographic projection of the first substrate layer 6 on the foam substrate.
  • the present application does not specifically limit the type of the first substrate layer.
  • the first substrate layer may include a polyimide (PI) layer, a non-woven fabric, and the like.
  • the first substrate layer should be able to be well compressed or stretched, have a moderate surface roughness, have no scratches or only very few scratches on the surface, and be suitable for spraying and printing of conductive paste.
  • the present application does not specifically limit the thickness of the above-mentioned first substrate layer along the direction perpendicular to the foam substrate.
  • the thickness range of the first substrate layer along the direction perpendicular to the foam substrate may include 1-2 ⁇ m.
  • the thickness of the first substrate layer along the direction perpendicular to the foam substrate may be 1 ⁇ m, 1.2 ⁇ m, 1.5 ⁇ m, 1.7 ⁇ m, 1.8 ⁇ m or 2 ⁇ m, etc.
  • the at least partial overlap between the orthographic projection of the conductive paste layer on the foam substrate and the orthographic projection of the first substrate layer on the foam substrate means that: the orthographic projection of the conductive paste layer on the foam substrate and the orthographic projection of the first substrate layer on the foam substrate partially overlap; or, the orthographic projection of the conductive paste layer on the foam substrate and the orthographic projection of the first substrate layer on the foam substrate completely overlap, which is not specifically limited here.
  • the orthographic projection of the conductive paste layer on the foam substrate may be located within the orthographic projection of the first substrate layer on the foam substrate; or, the orthographic projection of the first substrate layer on the foam substrate may be located within the orthographic projection of the conductive paste layer on the foam substrate.
  • the conductive paste layer may be a single layer, for example, the conductive paste layer may be a first conductive paste layer/a second conductive paste layer; or, the conductive paste layer may be a multilayer, for example, the conductive paste layer may include a first conductive paste layer and a second conductive paste layer.
  • the present application does not specifically limit the thickness of a single-layer conductive paste layer along a direction perpendicular to the foam substrate.
  • the thickness of a single-layer conductive paste layer along a direction perpendicular to the foam substrate may range from 5 to 10 ⁇ m.
  • the thickness of a single-layer conductive paste layer along a direction perpendicular to the foam substrate may be 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m or 10 ⁇ m, etc.
  • the present application does not specifically limit the relationship between the conductive paste layer and the first substrate layer.
  • the conductive paste layer and the first substrate layer can be independent film layers.
  • the conductive paste layer can be disposed on any side of the first substrate layer; as another example, the conductive paste layer can at least wrap the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate.
  • the conductive paste layer and the first substrate layer are not independent film layers.
  • the conductive paste layer can penetrate into the first substrate layer in addition to at least wrapping the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate.
  • the first substrate layer is When one substrate layer is a non-woven fabric, since the non-woven fabric has no warp and weft, but only directs or randomly arranges textile staple fibers or filaments to form a fiber mesh structure, the non-woven fabric is immersed in a conductive slurry.
  • the conductive slurry can at least wrap the two surfaces of the non-woven fabric and penetrate into the pores of the non-woven fabric to form a conductive layer.
  • the conductive foam provided in the embodiment of the present application is provided with a first substrate layer and a conductive paste layer.
  • the first substrate layer is elastic and can be well compressed or stretched; on the other hand, the conductive paste has certain ductility, good conductivity, large resistivity and other properties, and the volume of the conductive paste will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure.
  • the working height of the conductive foam in the first direction can be relatively low; at the same time, the conductive paste is sintered into layers and the volume is reduced, which can make the PIM inside the conductive paste very small; and when the conductive paste is cured into a conductive paste layer, it is spread out, which can make the contact area between the conductive foam and the structure in the electronic device larger.
  • the present application provides a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the conductive foam When the conductive foam is applied to electronic devices, the thickness of the electronic devices can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic devices can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structures in the electronic devices, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic devices.
  • the conductive paste layer is a first conductive paste layer 21, and the first conductive paste layer 21 is arranged on the side of the first substrate layer 6 away from the foam matrix 1; the conductive layer also includes a first bonding layer, and the first bonding layer is arranged between the first substrate layer 6 and the foam matrix 1, and the first bonding layer is used to bond the first substrate layer 6 to the foam matrix 1, and deforms under the action of external pressure.
  • the present application does not specifically limit the type of the first bonding layer.
  • the first bonding layer may be a glue layer, a conductive paste layer, or the like.
  • the material of the glue layer 5 may be a thermosetting glue.
  • the conductive paste layer may be the second conductive paste layer 22 .
  • the present application does not specifically limit the thickness of the first adhesive layer along the direction perpendicular to the foam substrate.
  • the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may range from 1 to 2 ⁇ m.
  • the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may be 1 ⁇ m, 1.2 ⁇ m, 1.5 ⁇ m, 1.7 ⁇ m, 1.8 ⁇ m or 2 ⁇ m, etc.
  • the present application does not specifically limit the thickness range of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer.
  • the thickness range may include 10-20 ⁇ m.
  • the thickness of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer may be 10 ⁇ m, 13 ⁇ m, 15 ⁇ m, 16 ⁇ m, 18 ⁇ m or 20 ⁇ m, etc.
  • the thickness of the conductive layer covering different surfaces of the foam substrate may be partially the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be all the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be different, and no specific limitation is made here.
  • the conductive foam provided in the embodiment of the present application can be bonded to the first conductive paste layer and the foam base through the first bonding layer.
  • the first adhesive layer can be well compressed or stretched, and the thickness of the first adhesive layer along the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer along the direction perpendicular to the foam substrate can be small, so that the working height of the conductive foam in the first direction can be low; and the first adhesive layer will not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, so that a conductive foam with low working height, small PIM and low stress in the first direction can be obtained.
  • the thickness of the electronic equipment can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic equipment can be reduced; in addition, the conductive foam can be used to realize the electrical connection of the structure in the electronic equipment, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic equipment.
  • the conductive paste layer is a first conductive paste layer 21, and the first conductive paste layer 21 at least wraps the surface of the first substrate layer 6 close to the foam matrix 1, and wraps the surface of the first substrate layer 6 away from the foam matrix 1; the conductive layer also includes a first bonding layer, the first bonding layer is arranged between the first conductive paste layer 21 and the foam matrix 1, the first bonding layer is used to bond the first conductive paste layer 21 and the foam matrix 1, and deforms under the action of external pressure.
  • the above-mentioned first conductive paste layer at least wraps the surface of the first substrate layer close to the foam substrate side and wraps the surface of the first substrate layer away from the foam substrate side, which means: the first conductive paste layer can only wrap the surface of the first substrate layer close to the foam substrate side and wrap the surface of the first substrate layer away from the foam substrate side; or, in addition to wrapping the surface of the first substrate layer close to the foam substrate side and wrapping the surface of the first substrate layer away from the foam substrate, the first conductive paste layer can also include other surfaces of the first substrate layer; or, in addition to wrapping the surface of the first substrate layer close to the foam substrate side and wrapping the surface of the first substrate layer away from the foam substrate side, the first conductive paste layer can also penetrate into the interior of the first substrate layer, which is not specifically limited here.
  • the first conductive paste layer may wrap a surface of the PI layer close to the foam substrate, and a surface of the first substrate layer away from the foam substrate.
  • the first conductive paste layer may wrap the entire surface of the PI layer.
  • the first conductive paste layer may wrap a surface of the non-woven fabric close to the foam matrix and a surface of the first substrate layer away from the foam matrix.
  • the first conductive paste layer may wrap the entire surface of the non-woven fabric.
  • the first conductive paste layer can wrap all surfaces of the non-woven fabric and penetrate into the pores inside the non-woven fabric. At this time, since the non-woven fabric is filled with the first conductive paste, the non-woven fabric is not easily torn when compressed or stretched.
  • the orthographic projection of the above-mentioned first substrate layer on the foam substrate may partially overlap with the orthographic projection of the first conductive paste layer on the foam substrate; or, the orthographic projection of the first substrate layer on the foam substrate may completely overlap with the orthographic projection of the first conductive paste layer on the foam substrate, which is not specifically limited here.
  • the present application does not specifically limit the type of the first bonding layer.
  • the first bonding layer may be a glue layer, a conductive paste layer, or the like.
  • the material of the glue layer 5 may be thermosetting glue.
  • the conductive paste layer may be the second conductive paste layer 22 .
  • the present application does not specifically limit the thickness of the first adhesive layer along the direction perpendicular to the foam substrate.
  • the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may range from 1 to 2 ⁇ m.
  • the thickness of the first adhesive layer along the direction perpendicular to the foam substrate may be 1 ⁇ m, 1.2 ⁇ m, 1.5 ⁇ m, 1.7 ⁇ m, 1.8 ⁇ m or 2 ⁇ m, etc.
  • the present application does not specifically limit the thickness range of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer.
  • the thickness range may include 10-20 ⁇ m.
  • the thickness of the conductive layer composed of the second conductive paste layer, the first substrate layer and the first conductive paste layer may be 10 ⁇ m, 13 ⁇ m, 15 ⁇ m, 16 ⁇ m, 18 ⁇ m or 20 ⁇ m, etc.
  • the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and forms a conductive layer with the adhesive layer 5.
  • the conductive layer is arranged on part of the first surface 11, part of the second surface 12 and the entire third surface 13 of the foam matrix 1.
  • the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and forms a conductive layer with the second conductive paste layer 22.
  • the conductive layer is arranged on the entire first surface 11, part of the second surface 12 and the entire third surface 13 of the foam matrix 1.
  • the first conductive paste layer 21 wraps all surfaces of the first substrate layer 6 and is arranged on the entire first surface 11, part of the second surface 12 and the entire third surface 13 of the foam matrix 1.
  • the second conductive paste layer 22 is arranged on the entire first surface 11 and part of the second surface 12 of the foam matrix 1 to form a conductive layer.
  • the conductive paste layer can also include a first conductive paste layer and a second conductive paste layer, wherein the first conductive paste layer at least wraps the surface of the first substrate layer close to the foam matrix side, and wraps the surface of the first substrate layer away from the foam matrix side, and the second conductive paste layer at least wraps the surface of the first conductive paste layer close to the foam matrix side, and wraps the surface of the first conductive paste layer away from the foam matrix side, and is used to bond the first conductive paste layer and the foam matrix.
  • the first conductive paste layer wraps the surface of the first substrate layer close to the foam matrix and the surface of the first substrate layer away from the foam matrix
  • the second conductive paste layer wraps the surface of the first conductive paste layer close to the foam matrix and the surface of the first conductive paste layer away from the foam matrix
  • the first conductive paste layer wraps the surface of the first substrate layer close to the foam matrix and the surface of the first substrate layer away from the foam matrix, and the second conductive paste layer wraps all surfaces of the first conductive paste layer.
  • the first conductive paste layer wraps all surfaces of the first base material layer
  • the second conductive paste layer wraps the surface of the first conductive paste layer close to the foam matrix and the surface of the first conductive paste layer away from the foam matrix.
  • the first conductive paste layer covers all surfaces of the first substrate layer
  • the second conductive paste layer covers all surfaces of the first conductive paste layer, which is not specifically limited here.
  • the conductive paste layer may also be a second conductive paste layer, wherein the second conductive paste layer at least wraps the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate. And the second conductive paste layer is used to bond with the foam base.
  • the second conductive paste layer wraps the surface of the first substrate layer close to the foam matrix, and wraps the surface of the first substrate layer away from the foam matrix.
  • the second conductive paste layer covers all surfaces of the first substrate layer, which is not specifically limited here.
  • the thickness of the conductive layer covering different surfaces of the foam substrate may be partially the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be all the same; or, the thickness of the conductive layer covering different surfaces of the foam substrate may be different, and no specific limitation is made here.
  • the conductive foam provided in the embodiment of the present application wraps at least the surface of the first substrate layer close to the foam substrate and the surface of the first substrate layer away from the foam substrate with the first conductive paste layer, and the first conductive paste layer can be well bonded to the foam substrate through the first adhesive layer; at the same time, the first adhesive layer can be well compressed or stretched, and the thickness of the first adhesive layer along the direction perpendicular to the foam substrate is small, so that the thickness of the conductive layer along the direction perpendicular to the foam substrate can be small, so that the working height of the conductive foam in the first direction can be low; and the first adhesive layer will not affect the PIM and other properties of the first conductive paste in the first conductive paste layer, so that a conductive foam with a low working height, small PIM and low stress in the first direction can be obtained.
  • the thickness of the electronic equipment can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic equipment can be small; in addition, the conductive foam can be used to realize the electrical connection of the structure in the electronic equipment, and reduce or eliminate the radiation stray interference, etc., effectively improving the performance of the electronic equipment.
  • the first surface 11 of the foam matrix 1 is divided into at least a first area Q1 and a second area Q2, and along the direction perpendicular to the foam matrix 1, the height of the portion of the conductive layer located in the first area Q1 is less than the height of the portion of the conductive layer located in the second area Q2.
  • the first surface of the above-mentioned foam matrix is divided into at least a first area and a second area, which means that: the first surface of the foam matrix can be divided into only the first area and the second area; or, in addition to being divided into the first area and the second area, the first surface of the foam matrix can also be divided into other areas, for example, a third area, a fourth area, etc., which is not specifically limited here.
  • the present application does not make any specific limitation on the position, area relationship, etc. of the first area and the second area.
  • the first area and the second area can be located at any position, wherein the area of the first area can be larger than the area of the second area; or, the area of the first area can be smaller than the area of the second area; or, the area of the first area can be equal to the area of the second area.
  • the following specifically describes how to achieve that the height of the portion of the conductive layer located in the first region is smaller than the height of the portion of the conductive layer located in the second region.
  • the first one may be that the structure of the portion of the conductive layer located in the first region is the same as that of the portion located in the second region, but the heights are different.
  • the conductive layer is a single layer
  • the conductive layer is a conductive paste layer
  • the height of the portion of the first conductive paste layer located in the first region is less than the height of the portion of the first conductive paste layer located in the second region; for another example, when the conductive layer is a second conductive paste layer, along the direction perpendicular to the foam substrate, the second conductive paste layer is located in the first region.
  • the height of the portion is smaller than the height of the portion of the second conductive paste layer located in the second region.
  • the conductive layer when the conductive layer is multi-layered, along the direction perpendicular to the foam matrix, at least one layer of the conductive layer may have different heights in the first area and in the second area.
  • the conductive layer includes a first bonding layer, a first substrate layer and a first conductive paste layer, along a direction perpendicular to the foam substrate, at least one of the first bonding layer, the first substrate layer and the first conductive paste layer may have different heights in the first region and in the second region.
  • the first bonding layer may have different heights in the first region and in the second region, and the first substrate layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first conductive paste layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; or, the first bonding layer and the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; or The height of the first region may be different from that of the second region, and the height of the first conductive paste layer may be the same as that of the second region
  • the conductive layer may also include other film layers, so there may be other various configurations, which are not specifically limited here.
  • the second type may be that the structure of the portion of the conductive layer located in the first region is different from the structure of the portion of the conductive layer located in the second region, and the heights are different.
  • the same layer structure in the conductive layer may have different heights in the first area and in the second area.
  • the conductive layer in the first region includes a first bonding layer, a first substrate layer and a first conductive paste layer
  • the conductive layer in the second region includes a first bonding layer, a first substrate layer, a first conductive paste layer and a second substrate layer, along a direction perpendicular to the foam substrate
  • at least one of the first bonding layer, the first substrate layer and the first conductive paste layer may have different heights in the first region and in the second region.
  • the first bonding layer may have different heights in the first region and in the second region, and the first substrate layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first substrate layer may have different heights in the first region and in the second region, and the first bonding layer and the first conductive paste layer may have the same heights in the first region and in the second region; or, the first conductive paste layer may have different heights in the first region and in the second region, and the first bonding layer and the first substrate layer may have the same heights in the first region and in the second region; Alternatively, the first bonding layer and the first substrate layer may have different heights in the first region and in the second region, and the first conductive paste layer may have the same height in the first region and in the second region; alternatively, the first bonding layer and the first conductive paste layer may have different heights in the first region and in the second region, and the first substrate layer may have the same height in the first region and in the second region; alternatively, the first bond
  • the same layer structure in the conductive layer may have the same height in the first area and in the second area.
  • the conductive layer in the first region includes a first bonding layer, a first substrate layer and a first conductive paste layer
  • the conductive layer in the second region includes a first bonding layer, a first substrate layer, a first conductive paste layer and a second substrate layer, along a direction perpendicular to the foam matrix
  • the height of the first bonding layer, the first substrate layer and the first conductive paste layer in the first region may be the same as that in the second region.
  • the conductive layer may also include other film layers, so there may be other various configurations, which are not specifically limited here.
  • the portion of the conductive layer located in the first region Q1 includes the adhesive layer 5, the first substrate layer 6 and the first conductive paste layer 21, and the portion of the conductive layer located in the second region Q2 includes the adhesive layer 5, the first substrate layer 6, the first conductive paste layer 21 and the second substrate layer 9.
  • the second substrate layer 9 makes the height of the portion of the conductive layer located in the first region Q1 smaller than the height of the portion of the conductive layer located in the second region Q2.
  • the present application does not specifically limit the type of the second substrate layer.
  • the second substrate layer may include a polyimide layer, a non-woven fabric, and the like.
  • the second substrate layer should be able to be well compressed or stretched, the surface roughness of the second substrate layer should be moderate, and there should be no scratches or only very few scratches on the surface.
  • the conductive foam provided in the embodiment of the present application is arranged in a direction perpendicular to the foam substrate, by setting the height of the conductive layer in the first area to be different from the height of the conductive layer in the second area.
  • the conductive foam can be electrically connected to at least two structures with different heights, thereby enriching the application of the conductive foam in electronic devices.
  • At least one surface is used to be electrically connected to a structure in an electronic device through a conductive layer.
  • the first surface of the polyhedron may be used to electrically connect to a first structure in the electronic device through a conductive layer, while other surfaces are not used to electrically connect to the structure in the electronic device through the conductive layer; or, the first surface of the polyhedron may be used to electrically connect to the first structure in the electronic device through a conductive layer, and the second surface may be used to electrically connect to the second structure in the electronic device through a conductive layer, while other surfaces are not used to electrically connect to the structure in the electronic device through a conductive layer.
  • other methods are also possible and are not specifically limited here.
  • the polyhedron may include a regular polyhedron or an irregular polyhedron.
  • the regular polyhedron may include a cube, a hexahedron, an octahedron, and the like.
  • the above-mentioned polyhedron includes at least a connected first surface, a second surface and a third surface, which means that the polyhedron may only include a connected first surface, a second surface and a third surface; or, in addition to the connected first surface, the second surface and the third surface, the polyhedron may also include a fourth surface, a fifth surface, a sixth surface, etc., which is not specifically limited here.
  • the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not labeled in the figure, front surface) and a sixth surface (not labeled in the figure, rear surface).
  • the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface).
  • the hexahedron includes a first surface 11 (upper surface), a second surface 12 (lower surface), a third surface 13 (left surface), a fourth surface 14 (right surface), a fifth surface (not labeled in the figure, front surface) and a sixth surface (not labeled in the figure, rear surface).
  • the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface).
  • the conductive foam 05 further includes a second adhesive layer 7 , which can be disposed on at least a portion of the second surface 12 of the foam matrix 1 and connected to both the adhesive layer 5 and the first conductive paste layer 21 .
  • the second adhesive layer can also be arranged on at least part of the second surface of the foam substrate, and spaced apart from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.
  • the foam is bonded to the structure in the electronic device.
  • the type of the second bonding layer is not specifically limited here.
  • the second bonding layer may include a backing adhesive, and the backing adhesive may include any one of a conductive adhesive, an insulating adhesive, and the like.
  • the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 covers part of the first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-type conductive layer.
  • the different-color PET layer 8 is disposed on a portion of the first surface 11 (upper surface) of the foam substrate 1, and is connected to the adhesive layer 5 and the first conductive paste layer 21.
  • the different-color PET layer can also be disposed on at least a portion of the first surface of the foam substrate, and is spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.
  • the above-mentioned different-color PET layer can have color.
  • the side of the conductive foam with the different-color PET layer is electrically connected to the structure in the electronic device, which is more conducive to fool-proofing; on the other hand, if there is a step difference between the structure in the electronic device and the conductive foam, the step difference can also be filled by the different-color PET layer.
  • the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the second conductive paste layer 22 covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-type conductive layer.
  • the conductive layer composed of the first conductive paste layer, the first base material layer and the second conductive paste layer can also only cover part of the first surface of the foam matrix.
  • the part of the first surface of the foam matrix not provided with the conductive layer may not be provided with any structure, or may be provided with structures such as a different-color PET layer, etc., which is not specifically limited here.
  • the first conductive paste layer 21 and the first substrate layer 6 cover the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, and the second conductive paste layer 22 only covers the entire first surface 11 (upper surface) and part of the second surface 12 (lower surface) of the hexahedron, thereby forming a "C"-type conductive layer.
  • the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least part of the second surface 12 of the foam substrate 1 and is connected to both the second conductive paste layer 22 and the first conductive paste layer 21.
  • the second adhesive layer can also be disposed on at least part of the second surface of the foam substrate and spaced from both the second conductive paste layer and the first conductive paste layer, which is not specifically limited here.
  • the conductive layer composed of the first conductive paste layer, the first base material layer and the second conductive paste layer can also only cover part of the first surface of the foam matrix.
  • the part of the first surface of the foam matrix not provided with the conductive layer may not be provided with any structure, or may be provided with structures such as a different-color PET layer, etc., which is not specifically limited here.
  • the conductive layer composed of the first conductive paste layer 21, the first base material layer 6 and the adhesive layer 5 covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, thereby forming a "C"-shaped conductive layer; at the same time, along the direction perpendicular to the foam matrix 1, the height of the first conductive paste layer 21 in the first area Q1 is less than the height of the first conductive paste layer 21 in the second area Q2.
  • the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least a portion of the second surface 12 of the foam substrate 1 and is connected to both the adhesive layer 5 and the first conductive paste layer 21.
  • the second adhesive layer can also be disposed on at least a portion of the second surface of the foam substrate and spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.
  • the conductive layer composed of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface) and the entire third surface 13 (left surface) of the hexahedron, and the second substrate layer 9 is located on part of the first surface 11 (upper surface) of the hexahedron, thereby forming a "C"-shaped conductive layer; at the same time, along the direction perpendicular to the foam matrix 1, the height of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 in the first area Q1 is equal to the height of the first conductive paste layer 21, the first substrate layer 6 and the adhesive layer 5 in the second area Q2.
  • the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least a portion of the second surface 12 of the foam substrate 1 and is connected to the adhesive layer 5 and the first conductive paste layer 21.
  • the second adhesive layer can also be disposed on at least a portion of the second surface of the foam substrate and spaced from the first adhesive layer and the first conductive paste layer, which is not specifically limited here.
  • first surface, second surface, third surface, fourth surface, fifth surface and sixth surface of the above-mentioned hexahedron can also be located at other positions of the hexahedron.
  • first surface can be the upper surface
  • second surface can be the left surface
  • third surface can be the right surface
  • fourth surface can be the lower surface
  • fifth surface can be the front surface
  • sixth surface can be the rear surface.
  • the conductive layer covers at least part of the first surface, at least part of the second surface and all of the third surface of the hexahedron, the conductive layer constitutes an inverted "U"-shaped conductive layer.
  • the first surface may be the lower surface
  • the second surface may be the left surface
  • the third surface may be the right surface
  • the fourth surface may be the upper surface
  • the fifth surface may be the front surface
  • the sixth surface may be the rear surface.
  • the conductive layer covers at least part of the first surface, at least part of the second surface, and all of the third surface of the hexahedron, the conductive layer constitutes a "U"-shaped conductive layer.
  • the first surface may be the upper surface
  • the second surface may be the lower surface
  • the third surface may be the right surface
  • the fourth surface may be the left surface
  • the fifth surface may be the front surface
  • the sixth surface may be the rear surface.
  • the conductive layer covers at least part of the first surface, at least part of the second surface, and all of the third surface of the hexahedron, the conductive layer constitutes a Type of conductive layer.
  • the conductive layer can also form other structures, which are not specifically limited here.
  • the conductive foam provided in the embodiment of the present application is arranged with the first surface and the second surface of the foam substrate being opposite to each other, and the first surface being connected to the second surface through the third surface, and a conductive layer is arranged to cover at least part of the first surface, all of the third surface and at least part of the second surface of the polyhedron, so that a "C"-shaped conductive layer can be formed; on the other hand, when the conductive foam is used in an electronic device, the directionality of the conductive foam can be ensured, so that the thickness of the electronic device can be reduced while identification and fool-proofing are performed, and the conductive foam and the electronic device can be closely connected.
  • the PIM between the contact interfaces of the structures in the device is small; in addition, the conductive foam can be used to achieve directional electrical connection of the structures in the electronic device, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.
  • the polyhedron includes a first surface 11, a second surface 12, a third surface 13 and a fourth surface 14, the first surface 11 is arranged opposite to the second surface 12, and the third surface 13 is arranged opposite to the fourth surface 14, the first surface 11 is connected to the second surface 12 through the third surface 13 and the fourth surface 14 respectively, and the conductive layer covers the entire first surface 11, at least part of the second surface 12, the entire third surface 13 and the entire fourth surface 14.
  • the above-mentioned conductive layer covers the entire first surface, the entire third surface, the entire fourth surface and at least a portion of the second surface, which means: the conductive layer covers the entire first surface, the entire third surface, the entire fourth surface and a portion of the second surface; or, the conductive layer covers the entire first surface, the entire third surface, the entire fourth surface and the entire second surface, and no specific limitation is made here.
  • the conductive layer 2 covers the entire first surface 11 (upper surface), the entire second surface 12 (lower surface), the entire third surface 13 (left surface) and the entire fourth surface 14 (right surface) of the hexahedron.
  • the conductive layer covers the entire first surface 11 (upper surface), part of the second surface 12 (lower surface), the entire third surface 13 (left surface), and the entire fourth surface 14 (right surface) of the hexahedron, thereby forming a similar Type of conductive layer.
  • the conductive foam 05 further includes a second adhesive layer 7, which is disposed on at least a portion of the second surface 12 of the foam substrate 1 and is spaced apart from the second conductive paste layer 22.
  • the second adhesive layer can also be disposed on at least a portion of the second surface of the foam substrate and connected to the second conductive paste layer, which is not specifically limited here.
  • the conductive layer of the embodiment of the present application is not limited to the second conductive layer, but can also be any other structure.
  • the conductive layer can be a first bonding layer, a first substrate layer, a first conductive paste layer, etc.
  • the specific setting method can refer to the above embodiment, and the setting of the second bonding layer can also refer to the above and the second conductive paste layer, which will not be repeated here.
  • first surface, second surface, third surface, fourth surface, fifth surface and sixth surface of the above-mentioned hexahedron can also be located at other positions of the hexahedron.
  • first surface can be the lower surface
  • second surface can be the left surface
  • third surface can be the upper surface
  • fourth surface can be the right surface
  • fifth surface can be the front surface
  • sixth surface can be the back surface.
  • the conductive layer covers the entire first surface, at least part of the second surface, all the third surfaces and all the fourth surfaces of the hexahedron, the conductive layer constitutes a "D"-type conductive layer.
  • the first surface may be the left surface
  • the second surface may be the upper surface
  • the third surface may be the right surface
  • the fourth surface may be the lower surface
  • the fifth surface may be the front surface
  • the sixth surface may be the rear surface.
  • the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface of the hexahedron, the conductive layer constitutes a Type of conductive layer.
  • the first surface may be the upper surface
  • the second surface may be the right surface
  • the third surface may be the lower surface
  • the fourth surface may be the left surface
  • the fifth surface may be the front surface
  • the sixth surface may be the rear surface.
  • the conductive layer covers the entire first surface, at least part of the second surface, the entire third surface, and the entire fourth surface of the hexahedron, the conductive layer constitutes a Type of conductive layer.
  • the first surface and the second surface of the foam substrate are arranged opposite to each other, and the first surface is connected to the second surface through the third surface, and a conductive layer is arranged to cover at least part of the first surface, the entire third surface and at least part of the second surface of the polyhedron, so that a similar type of conductive layer;
  • the conductive foam when used in electronic equipment, the directionality of the conductive foam can be ensured, so that while identification and anti-mistake are performed, the thickness of the electronic equipment can be reduced, and the PIM between the contact interface of the conductive foam and the structure in the electronic equipment can be smaller; in addition, the conductive foam can be used to achieve directional electrical connection of the structure in the electronic equipment, and reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic equipment.
  • An embodiment of the present application further provides an electronic device, which includes the above-mentioned conductive foam.
  • the electronic device provided in the embodiment of the present application includes a conductive foam with a low working height, a small PIM, and a low stress in the first direction, so the thickness of the electronic device can be effectively reduced.
  • the PIM between the structure in the electronic device and the contact interface of the conductive foam can be small; and the electronic device can reduce or eliminate radiation stray interference, etc., effectively improving the performance of the electronic device.
  • the following uses the conductive foam as a hexahedron to specifically explain various applications of conductive foam in electronic devices.
  • the first structure in the electronic device includes at least a camera assembly, and the camera assembly is used to maintain electrical connection with the conductive foam when rotating.
  • the camera component may include a camera, etc.
  • the camera may include a front camera and a rear camera.
  • the front camera may be arranged on a side of the display module away from the middle frame; the rear camera may be arranged on a side of the rear housing away from the middle frame, which is determined by actual application.
  • the first structure in the above-mentioned electronic device at least includes a camera component, which means that the first structure in the electronic device may only include a camera component; or, in addition to the camera component, the first structure in the electronic device may also include other structures, which is not specifically limited here.
  • 22 and 23 respectively show schematic structural diagrams of electrical connection between a front camera 501 and a shielding cover 502 in the related art.
  • the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503, and the shielding cover 502 is electrically connected to the PCB 504, resulting in a longer ground (GND) path back to the PCB 504, which cannot effectively improve the electromagnetic shielding of the electronic device and other problems.
  • GND ground
  • the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 through the conductive cloth 503 and the bracket steel sheet 505, which may result in that there is no space on the substrate 507 of the front camera 501 to place the screws 506 to ensure the distance between the bracket steel sheet 505 and the substrate 507.
  • bracket steel sheet 505 is an insert injection-molded bracket steel sheet, although there are screws 506 near the bracket steel sheet 505, the insert injection molding of the bracket steel sheet may cause glue overflow at the edge of the sealing glue. If an insulating layer is formed between the bracket steel sheet 505 and the conductive glue, it may cause problems such as insufficient contact or no contact.
  • the conductive foam in the related art often cannot be placed near the camera due to problems such as high working height.
  • the conductive foam with a low working height in the first direction and small stress and PIM provided in the embodiment of the present application can well realize the electrical connection between the camera and other structures, and can improve the electromagnetic shielding and other problems in electronic equipment.
  • Fig. 20 shows a schematic diagram of the conductive foam 05 of the embodiment of the present application being used to electrically connect the front camera 501 with the shielding cover 502.
  • Fig. 22 shows a schematic diagram of the conductive foam 05 of the embodiment of the present application being used to electrically connect the rear camera 508 with the shielding cover 502.
  • the substrate 507 of the front camera 501 is electrically connected to the shielding cover 502 via the conductive foam 05 , and the shielding cover 502 is fixedly connected to the PCB 504 via screws 506 .
  • the middle frame 102 and the substrate 509 of the rear camera 508 are electrically connected through the conductive foam 05, the shielding cover 502 and the bracket steel sheet 505 are electrically connected through the conductive foam 05, and the substrate 509 of the rear camera 508 is also fixedly connected to the PCB504 through screws 506.
  • the electronic device electrically connects the camera assembly such as the camera to the conductive foam. Since the working height of the conductive foam in the first direction is relatively low, it can be placed between the camera and other structures; when the camera rotates in any direction, since the conductive foam can be well compressed or stretched, the camera can always maintain electrical connection with the conductive foam, thereby ensuring the performance of the electronic device; on the other hand, since the conductive foam is an independent structure and can be separated, for example, when the conductive foam needs to be replaced, there is no need to disassemble the electronic device, causing the entire electronic device to be scrapped; on the other hand, the conductive foam can effectively absorb the tolerance existing when electrically connecting to the structure of the electronic device, thereby avoiding poor contact; on the other hand, the conductive foam can make the grounding (GND) path shorter; at the same time, if problems such as overflowing glue occur, the conductive foam can also be improved by strain. As a result, the performance of the electronic device of
  • the first surface 11 of the foam substrate 1 is electrically connected to the display screen 111 through a conductive layer, and the second surface 12 of the foam substrate 1 is connected to the middle frame 102 through a conductive layer.
  • the first surface and the second surface in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can be conducted along the second direction and the third direction respectively, wherein the second direction can be set perpendicular to the third direction.
  • the electronic device provided in the embodiment of the present application realizes electrical connection with the display screen and the middle frame respectively through conductive foam, which can effectively reduce the stress between the contact interface of the conductive foam and the antenna, and the stress between the contact interface of the conductive foam and the middle frame, thereby effectively improving the performance of the electronic device.
  • the first surface 11 of the foam matrix 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam matrix 1 is electrically connected to the PCB 504 through the conductive layer.
  • the two surfaces in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can be conducted along the second direction and the third direction respectively, wherein the second direction can be set perpendicular to the third direction.
  • PCB504 in FIG. 25 can be replaced by a display screen, a battery cover, a decorative component, or the like.
  • the middle frame 102 in FIG. 25 may be a metal middle frame, and an anti-oxidation layer 110 is wrapped around the outer periphery of the metal middle frame.
  • the surface of the middle frame 102 in contact with the reed 108 may be laser engraved to form a laser engraved surface 109 .
  • the electronic device provided in the embodiment of the present application realizes the electrical connection between the reed and the PCB through the conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the reed, and the PIM between the contact interface between the conductive foam and the PCB, and effectively improves the performance of the electronic device; on the other hand, when one side of the conductive foam is a display screen, the conductive foam will not rebound and cause interface damage, such as screen film printing, etc., further improving the performance of the electronic device.
  • the first surface 11 of the foam matrix 1 is electrically connected to the reed 108 through the conductive layer, and the second surface 12 of the foam matrix 1 is electrically connected to the PCB 504 through the conductive layer.
  • the two surfaces in the foam matrix are electrically connected to the structure in the electronic device, so that the conductive foam can be conducted along the second direction and the third direction respectively.
  • the electronic device may further include an antenna 105 , a middle frame 102 and plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .
  • the surface of the antenna 105 on one side close to the reed 108 may be laser engraved to form a laser engraved surface 109 .
  • the antenna 105 may be wrapped with an anti-oxidation layer 110 .
  • the electronic device provided in the embodiment of the present application realizes the electrical connection between the reed and the PCB through the conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the reed, and the PIM between the contact interface between the conductive foam and the PCB, and effectively improve the performance of the electronic device.
  • the first surface 11 and the second surface 12 of the foam matrix 1 are electrically connected to the antenna 105 through a conductive layer, the first surface 11 of the foam matrix 1 is also electrically connected to the middle frame 102 through a conductive layer, and one surface of the foam matrix is connected to the insulating material layer 106.
  • the first surface and the second surface of the foam matrix are electrically connected to multiple structures in the electronic device respectively, so that the conductive foam can be conductive in multiple directions.
  • the electronic device may further include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .
  • the surface of the foam substrate connected to the insulating material layer may or may not be provided with the first sub-conductive layer, which is not specifically limited here.
  • the electronic device provided in the embodiment of the present application realizes electrical connection between the antenna and the middle frame through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, and the PIM between the contact interface between the conductive foam and the middle frame, thereby effectively improving the performance of the electronic device.
  • the first surface 11 and the third surface 13 of the foam substrate 1 are electrically connected to the antenna 105 through the conductive layer, and the first surface 11 and the fourth surface 14 of the foam substrate 1 are electrically connected to the antenna 105 through the conductive layer. They are electrically connected to the middle frame 102 through the conductive layer, and the second surface 12 of the foam matrix 1 is electrically connected to the PCB 504 through the conductive layer.
  • the first surface, the second surface, the third surface and the fourth surface of the foam substrate are electrically connected to multiple structures in the electronic device respectively, so that the conductive foam can be conductive in multiple directions.
  • the electronic device may further include plastic 107 , and the antenna 105 and the middle frame 102 are carried on one side of the plastic 107 .
  • the electronic device provided in the embodiment of the present application realizes electrical connection between the antenna, the middle frame, and the PCB through conductive foam, which can effectively reduce the PIM between the contact interface between the conductive foam and the antenna, the PIM between the contact interface between the conductive foam and the middle frame, and the PIM between the contact interface between the conductive foam and the PCB, thereby effectively improving the performance of the electronic device.
  • the first surface 11 of the foam matrix 1 is electrically connected to the antenna 105 and the middle frame 102 respectively through the conductive layer, and one surface of the foam matrix 1 is also connected to the insulating material layer 106 .
  • the conductive foam can be conductive along the second direction.
  • the antenna 105 in the electronic device shown in FIG. 29 is different from the middle frame 102 in height along a direction perpendicular to the foam matrix.
  • the electronic device may further include plastic 107 , and the antenna 105 and the middle frame 102 are supported on one side of the plastic 107 .
  • the surface of the foam substrate connected to the insulating material layer may or may not be provided with the first sub-conductive layer, which is not specifically limited here.
  • the electronic device provided in the embodiment of the present application realizes the electrical connection between the antenna and the middle frame through the conductive foam, which can effectively reduce the PIM between the contact interface of the conductive foam and the antenna, and the PIM between the contact interface of the conductive foam and the middle frame, and effectively improves the performance of the electronic device; on the other hand, since the heights of the antenna and the middle frame along the direction perpendicular to the foam matrix are different, a conductive foam can realize electrical connection with structures of different heights in the electronic device, enriching the application of the conductive foam.
  • the embodiment of the present application provides a method for manufacturing a conductive foam.
  • the manufacturing method includes:
  • the first surface is used to be electrically connected to a first structure in the electronic device through a conductive layer, and the conductive layer at least includes a conductive paste layer, and the conductive paste layer is used to deform under external pressure.
  • a conductive paste can be first formed on the surface of the foam substrate by spraying, printing, spraying, vacuum plating, etc., and then the conductive paste is baked/heated to form a conductive paste layer.
  • a conductive paste can be first formed on at least one surface of the first substrate layer by spraying, printing, or the like, and then the conductive paste is baked/heated to cure to form the first substrate layer and the conductive paste layer.
  • the first substrate when the conductive layer includes a conductive paste layer and a first substrate layer, the first substrate may be immersed in the conductive paste, and then the conductive paste may be baked/heated to cure to form the first substrate layer and the conductive paste layer.
  • the method for making the conductive foam on the one hand, forms a conductive paste by spraying, printing, spraying, vacuum plating, dipping, etc., and bakes/heats to solidify to form a conductive paste layer, which is simple and easy to implement; on the other hand, the conductive paste in the conductive paste layer has certain ductility, good conductivity, large resistivity ( 10-5-10-4 ⁇ ⁇ cm) and other properties, and the conductive paste is in liquid before film formation, and its volume will shrink during the curing process, so that the conductive foam exhibits good conductivity while being able to deform under pressure.
  • the working height of the conductive foam in the first direction can be relatively low; on the other hand, the conductive paste is sintered into layers and its volume is reduced to ensure the contact force between multiple conductive particles, so that the PIM inside the conductive paste is very small; on the other hand, when the conductive paste is solidified into a conductive paste layer, the conductive particles in the conductive paste are spread out, so that the contact area between the conductive foam and the structure in the electronic device can be larger.
  • the method for making the conductive foam shown in FIG. 3 and FIG. 4 includes:
  • the method for making the conductive foam shown in FIG. 5 and FIG. 6 includes:
  • the method for making the conductive foam provided in the embodiment of the present application involves spraying a second conductive paste and baking/heating to cure the second conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.
  • the method for making the conductive foam shown in FIG. 9 and FIG. 10 includes:
  • the first substrate layer is directly formed on the entire first surface, the entire second surface, the entire third surface and the entire fourth surface of the foam substrate; and then the first conductive paste is printed on the surface of the first substrate layer close to the first surface, the second surface, the third surface and the fourth surface; and the layer is baked and cured to form a first conductive paste layer.
  • the method for making the conductive foam provided in the embodiment of the present application, on the one hand, prints the first conductive paste and bakes/heats to cure it to form a first conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.
  • the method for making the conductive foam shown in FIG. 11 includes:
  • the method for making the conductive foam comprises spraying the second conductive paste, printing the first conductive paste, and baking/heating to cure to form the first conductive paste layer and the second conductive paste layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.
  • the method for making the conductive foam shown in FIG. 13 includes:
  • the second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .
  • step S51 may be performed first, and then step S52; or, step S52 may be performed first, and then step S51; or, step S51 and step S52 may be performed at the same time.
  • preparation method may also include:
  • the second bonding layer is connected to the second conductive paste layer.
  • the method for making the conductive foam provided in the embodiment of the present application, on the one hand, immerses the first substrate layer in a conductive paste, and bakes/heats to cure it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.
  • the method for making the conductive foam shown in FIG. 14 includes:
  • the second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .
  • the different-color PET layer 8 is connected to both the adhesive layer 5 and the first conductive paste layer 21 .
  • step S61 may be performed first, and then step S62; or, step S62 may be performed first, and then step S61; or, step S61 and step S62 may be performed at the same time.
  • preparation method may also include:
  • the second bonding layer is connected to the second conductive paste layer.
  • the method for making the conductive foam provided in the embodiment of the present application, on the one hand, immerses the first substrate layer in a conductive paste, and bakes/heats to cure it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.
  • the method for making the conductive foam shown in FIG. 15 includes:
  • the second adhesive layer 7 is connected to both the second conductive paste layer 22 and the first conductive paste layer 21 .
  • step S71 may be performed first, and then step S72; or, step S72 may be performed first, and then step S71; or, step S71 and step S72 may be performed at the same time.
  • preparation method may also include:
  • the second bonding layer is connected to the second conductive paste layer.
  • the method for making the conductive foam provided in the embodiment of the present application, on the one hand, immerses the first substrate layer in a conductive paste, and bakes/heats to cure it to form a conductive paste layer covering all surfaces of the first substrate layer, which is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and low stress.
  • the method for making the conductive foam shown in FIG. 16 includes:
  • the second adhesive layer 7 is connected to both the second conductive paste layer 22 and the first conductive paste layer 21 .
  • step S81 may be performed first, and then step S82; or, step S82 may be performed first, and then step S81; or, step S81 and step S82 may be performed at the same time.
  • the method for making the conductive foam comprises coating the second conductive paste, immersing the first substrate layer in the first conductive paste, and baking/heating and curing to form the second conductive paste layer and the first conductive paste layer wrapping all surfaces of the first substrate layer.
  • This method is simple and easy to implement; on the other hand, it can form a conductive foam with a low working height in the first direction, a small PIM, and a low stress.
  • the method for making the conductive foam shown in FIG. 17 includes:
  • the second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .
  • step S91 may be performed first, and then step S92; or, step S92 may be performed first, and then step S91; or, step S91 and step S92 may be performed at the same time.
  • preparation method may also include:
  • the second bonding layer is connected to the second conductive paste layer.
  • the height of the conductive paste printed/sprayed in the first area can be smaller than the height of the conductive paste printed/sprayed in the second area along the direction perpendicular to the foam substrate.
  • the method for making a conductive foam on the one hand, forms an additional conductive paste layer in the second area than in the first area, so that the structure of the conductive layer in the first area is the same as that in the second area, and at the same time, along the direction perpendicular to the foam matrix, the height of the conductive layer in the first area is smaller than the height of the conductive layer in the second area; on the other hand, it can form a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the method for making the conductive foam shown in FIG. 18 includes:
  • the second bonding layer 7 is connected to both the glue layer 5 and the first conductive paste layer 21 .
  • step S101 may be performed first, and then step S102; or, step S102 may be performed first, and then step S101; or, step S101 and step S102 may be performed simultaneously.
  • preparation method may also include:
  • the second bonding layer is connected to the second conductive paste layer.
  • the method for making a conductive foam provided in an embodiment of the present application, on the one hand, by additionally forming a second substrate layer in the second area, so that the structure of the conductive layer in the first area is different from that in the second area, and along the direction perpendicular to the foam substrate, the height of the conductive layer in the first area is smaller than the height of the conductive layer in the second area; on the other hand, it is possible to form a conductive foam with a low working height, small PIM and low stress in the first direction.
  • the method for making the conductive foam shown in FIG. 19 includes:
  • the second bonding layer 7 and the second conductive paste layer 22 are spaced apart from each other.
  • preparation method may also include:
  • the second bonding layer, the glue layer and the first conductive paste layer are all arranged at intervals.
  • step S0111 may be performed first, and then step S0112; or, step S0112 may be performed first, and then step S0111; or, step S0111 and step S0112 may be performed at the same time.
  • the method for making a conductive foam comprises, on one hand, forming a conductive foam substrate On the other hand, it can form a conductive foam with low working height, small PIM and low stress in the first direction.
  • a first foam substrate with a larger volume is generally selected, and a conductive layer, an adhesive layer, etc. are formed, and then punched into multiple smaller conductive foams, and a release layer is compounded for standby use.
  • the release layer is torn off, and the conductive foam is electrically connected to at least one structure in the electronic device.
  • the manufacturing method includes:
  • the manufacturing method may further include: S019, adding a diluent. At this time, the selected first conductive silver paste may be diluted to obtain the required first conductive silver paste.
  • the resistivity of the conductive foam needs to meet 10-5-10-4 ⁇ cm, specifically, the resistivity of the conductive foam can be 10-5 ⁇ cm, 10-4 ⁇ cm, etc.; the working height of the conductive foam in the first direction needs to meet 0.1-0.15mm, specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.
  • the present application does not specifically limit the process of the above-mentioned first foam matrix mold forming.
  • the first foam matrix can be manufactured by an extrusion molding method. Specifically, the mechanically foamed first foam matrix is selected for cleaning, and the cleaned first foam matrix is placed at the discharge port of the mold, and the first foam matrix is squeezed to force the foamed foam matrix to produce directional plastic deformation and extrude from the mold hole in a specific shape, for example, the hexahedral first foam matrix 10 shown in Figure 33.
  • the reason for using mechanical foaming is that after spraying/printing the conductive slurry and curing, the conductive foam will not undergo a large size change.
  • the first foam substrate mold can also be directly formed into a foam substrate, and then the conductive layer and the like can be manufactured without punching.
  • the manufacturing method includes:
  • the manufacturing method may further include: S031, adding a diluent. At this time, the selected first conductive silver paste may be diluted to obtain the required first conductive silver paste.
  • the pad printing head dips the first conductive silver paste and shapes the first conductive silver paste.
  • a pad printing head pad prints a first conductive silver paste on a first surface, a second surface, a third surface, and a fourth surface of the first foam substrate.
  • the pad printing head of the present application can print the first conductive silver paste multiple times on the first surface, second surface, third surface and fourth surface of the first foam substrate at the same time, and dry the surface, and solidify after repeated multiple times; or, the pad printing head can print the first conductive silver paste multiple times on the surface of a first foam substrate in sequence, and dry the surface, and solidify after repeated multiple times, which is not specifically limited here.
  • the resistivity of the conductive foam needs to meet 10-5-10-4 ⁇ cm, specifically, the resistivity of the conductive foam can be 10-5 ⁇ cm, 10-4 ⁇ cm, etc.; the working height of the conductive foam in the first direction needs to meet 0.1-0.15mm, specifically, the working height of the conductive foam in the first direction can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, etc.
  • steps S021 to S032 and steps S022 to S024 are not specifically limited. For example, steps S021 to S032 may be performed first, and then steps S022 to S024 may be performed; or, steps S022 to S024 may be performed first, and then steps S021 to S032 may be performed; or, steps S021 to S032 and steps S022 to S024 may be performed simultaneously.
  • the manufacturing method may further include: S032, forming a first foam substrate mold.
  • the present application does not specifically limit the process of the above-mentioned first foam matrix mold forming.
  • the first foam matrix can be manufactured by an extrusion molding method. Specifically, the mechanically foamed first foam matrix is selected for cleaning, and the cleaned first foam matrix is placed at the discharge port of the mold, and the first foam matrix is squeezed to force the foamed foam matrix to produce directional plastic deformation and extrude from the mold hole in a specific shape, for example, the hexahedral first foam matrix 10 shown in Figure 33.
  • the reason for using mechanical foaming is that after spraying/printing the conductive slurry and curing, the conductive foam will not undergo a large size change.
  • the first foam substrate mold can also be directly formed into a foam substrate, and then the conductive layer and the like can be manufactured without punching.
  • Figure 33 is a process flow chart of Figure 32 combined with a conductive foam structure.
  • a first foam substrate 10 is provided; as shown in (b) of Figure 33, a first conductive silver paste is printed on the first surface and the second surface of the first foam substrate 10; as shown in (c) of Figure 33, a first conductive silver paste is printed on the third surface and the fourth surface of the first foam substrate 10, and solidified to form a first conductive paste layer 21; as shown in (d) of Figure 33, a plurality of conductive foams are obtained by punching, wherein each conductive foam includes a foam substrate 1, and a first conductive paste layer 21 formed on the first surface, the second surface, the third surface and the fourth surface of the foam substrate 1, and the first conductive paste in the first conductive paste layer 21 is conductive.
  • pre-setting and “pre-definition” can be achieved by pre-saving corresponding codes, tables or other methods that can be used to indicate relevant information in a device (for example, including an electronic device), and the present application does not limit its specific implementation method.

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Abstract

提供了一种导电泡棉（05）及其制作方法、电子设备（01），涉及电子通信技术领域，导电泡棉（05）应用于电子设备（01），导电泡棉（05）包括：泡棉基体（1）；导电层（2），包覆泡棉基体（1）的至少第一表面（11），第一表面（11）用于通过导电层（2）与电子设备（01）中的第一结构电连接；导电层（2）至少包括导电浆料层，导电浆料层用于在外界压力作用下发生变形。由此，可以提供一种具备导电性、在第一方向（OZ）上的工作高度较低、PIM较低、且应力较小的导电泡棉（05），该导电泡棉（05）应用于电子设备（01）时，可以减薄电子设备（01）的厚度，并减小导电泡棉（05）与电子设备（01）中的结构的接触界面的PIM，此外还能够减小或消除辐射杂散干扰。

Description

导电泡棉及其制作方法、电子设备
本申请要求于2023年05月26日提交国家知识产权局、申请号为202310613241.2、申请名称为“导电泡棉及其制作方法、电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子通信技术领域，尤其涉及一种导电泡棉及其制作方法、电子设备。
背景技术
随着移动通信技术的不断发展，电子设备的内部结构越来越复杂，集成度越来越高，例如，以电子设备为手机为例，所包括的元器件的高集成度，使得手机的厚度越来越薄；这样，将使得沿手机的厚度方向上，相邻元器件之间的间距越来越小。在此情况下，如何降低辐射杂散(radiated spurious emission，RSE)、以及如何避免相邻元器件之间产生信号干扰等尤为重要。
相关技术中，电子设备中常通过设置泡棉来起到减少辐射杂散、导电、防静电等目的。然而，目前的泡棉无法实现低工作高度和低无源互调(passive intermodulation，PIM)，进而导致应用于电子设备中时，电子设备无法实现超薄化，也无法具备较佳的性能。
因此，亟待一种新的解决方案，以解决上述问题。
发明内容
本申请实施例提供一种导电泡棉及其制作方法、电子设备，通过设置在泡棉基体的至少第一表面的导电层，能够使得导电泡棉既具备导电性，又能很好的压缩或拉伸，从而在第一方向上能够实现较低的工作高度、并具有较小的PIM、较小的应力，此外还能够与电子设备中的结构的接触面积较大。
为达到上述目的，本申请采用如下技术方案：
第一方面，提供一种导电泡棉，应用于电子设备，所述导电泡棉包括：
泡棉基体；
导电层，包覆所述泡棉基体的至少第一表面，所述第一表面用于通过所述导电层与所述电子设备中的第一结构电连接；所述导电层至少包括导电浆料层，所述导电浆料层用于在外界压力作用下发生变形。
本申请实施例提供了一种导电泡棉，通过设置包覆泡棉基体的至少第一表面的导电浆料层，从而使得该导电浆料层中的导电浆料具备一定的延展性、良好的导电性、较大的电阻率等性能，且导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；同时，导电浆料烧结成层， 体积缩小以保证多个导电粒子之间的接触力，从而使得导电浆料内部的PIM非常小；并且，导电浆料固化成导电浆料层时，导电浆料中的导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
由此，本申请提供了一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
在第一方面一种可能的实现方式中，所述导电浆料层包括浆料主体和多个相连的导电粒子，所述导电粒子掺杂于所述浆料主体中。
在该实现方式中，导电浆料层中多个相连的导电粒子能够产生多条电流通路，从而使得导电浆料层导电；同时，导电浆料层中的浆料主体质软，从而使得导电浆料层能够在外界压力作用下发生变形。
可选地，导电层为第一导电浆料层，第一导电浆料层用于在外界压力作用下发生变形。
在该实现方式中，通过设置包覆泡棉基体的至少第一表面的第一导电浆料层，由于第一导电浆料具备一定的延展性、良好的导电性、较大的电阻率等性能，且第一导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；同时，第一导电浆料料烧结成层，体积缩小以保证多个导电粒子之间的接触力，从而使得第一导电浆料内部PIM非常小；并且，第一导电浆料固化成导电浆料层时，第一导电浆料中的第一导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
可选地，导电层为第二导电浆料层，第二导电浆料层用于在外界压力作用下发生变形。
在该实现方式中，通过设置包覆泡棉基体的至少第一表面的第二导电浆料层，由于第二导电浆料具备一定的延展性、良好的导电性、较大的电阻率等性能，且第二导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；同时，第二导电浆料料烧结成层，体积缩小以保证多个导电粒子之间的接触力，从而使得第二导电浆料内部PIM非常小；并且，第二导电浆料固化成导电浆料层时，第二导电浆料中的第二导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
在第一方面一种可能的实现方式中，所述导电层还包括第一基材层，所述第一基材层用于在所述外界压力作用下发生变形；
所述导电浆料层在所述泡棉基体上的正投影与所述第一基材层在所述泡棉基体上的正投影至少部分重合。
在该实现方式中，通过设置第一基材层和导电浆料层，一方面，第一基材层具有弹性，可以很好的压缩或拉伸；另一方面，导电浆料层中的导电浆料具备一定的延展 性、良好的导电性、较大的电阻率等性能，且导电浆料固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；同时，导电浆料烧结成层，体积缩小，能够使得导电浆料内部的PIM非常小；并且，导电浆料固化成导电浆料层时摊开，能够使得导电泡棉与电子设备中的结构的接触面积可以较大。
在第一方面一种可能的实现方式中，所述导电浆料层为第一导电浆料层，所述第一导电浆料层设置在所述第一基材层远离所述泡棉基体的一侧；
所述导电层还包括第一粘结层，所述第一粘结层设置在所述第一基材层和所述泡棉基体之间，所述第一粘结层用于粘结所述第一基材层与所述泡棉基体、并在所述外界压力作用下发生变形。
在该实现方式中，通过第一粘结层能够实现第一基材层和泡棉基体较好的粘结；同时，第一粘结层能够压缩或拉伸，且第一粘结层沿垂直于泡棉基体方向的厚度较小，从而能够使得导电层沿垂直于泡棉基体方向的厚度较小，进而能够使得导电泡棉在第一方向上工作高度较低，由此，能够得到一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
在第一方面一种可能的实现方式中，所述导电浆料层为第一导电浆料层，所述第一导电浆料层至少包裹所述第一基材层靠近所述泡棉基体一侧的表面、以及包裹所述第一基材层远离所述泡棉基体一侧的表面；
所述导电层还包括第一粘结层，所述第一粘结层设置在所述第一导电浆料层和所述泡棉基体之间，所述第一粘结层用于粘结所述第一导电浆料层和所述泡棉基体、并在所述外界压力作用下发生变形。
在该实现方式中，通过第一粘结层能够实现第一导电浆料层和泡棉基体较好的粘结；同时，第一粘结层能够压缩或拉伸，且第一粘结层沿垂直于泡棉基体方向的厚度较小，从而使得导电层沿垂直于泡棉基体方向的厚度较小，进而能够使得导电泡棉在第一方向上工作高度较低；而且，第一粘结层不会影响第一导电浆料层中第一导电浆料的PIM等性能，由此，能够得到一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
该导电泡棉应用于电子设备时，能够使得电子设备的厚度减薄的同时，还使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的定向电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
在第一方面一种可能的实现方式中，所述第一粘结层为胶层。
在该实现方式中，通过胶层能够实现第一基材层/第一导电浆料层和泡棉基体较好的粘结；同时，胶层能够压缩或拉伸，且胶层沿垂直于泡棉基体方向的厚度较小，从而使得导电层沿垂直于泡棉基体方向的厚度较小，进而能够使得导电泡棉在第一方向 上工作高度较低，由此，能够得到一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉；并且，胶层简单易实现，成本较低。
在第一方面一种可能的实现方式中，所述第一粘结层为第二导电浆料层。
在该实现方式中，通过第二导电浆料层能够实现第一基材层/第一导电浆料层和泡棉基体较好的粘结；同时，第二导电浆料层能够压缩或拉伸，且第二导电浆料层沿垂直于泡棉基体方向的厚度可以较小，从而能够使得导电层沿垂直于泡棉基体方向的厚度较小，进而能够使得导电泡棉在第一方向上工作高度较低，由此，能够得到一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
在第一方面一种可能的实现方式中，所述泡棉基体的所述第一表面至少分为第一区域和第二区域，沿垂直于所述泡棉基体的方向，所述导电层位于所述第一区域的部分的高度小于所述导电层位于所述第二区域的部分的高度。
在该实现方式中，通过设置沿垂直于泡棉基体的方向，导电泡棉在第一区域与在第二区域的部分的高度不同，这样应用于电子设备中时，导电泡棉至少可以与高度不同的两个结构进行电连接，丰富了导电泡棉在电子设备中的应用。
在第一方面一种可能的实现方式中，所述导电层位于所述第一区域的部分的结构与所述导电层位于所述第二区域的部分的结构相同；
沿垂直于所述泡棉基体的方向，所述导电层中的至少一层位于所述第一区域的部分的高度小于位于所述第二区域的部分的高度。
在该实现方式中，能够使得导电层在第一区域的高度小于在第二区域的高度、且该高度差尽量不要太大，简单易实现。
在第一方面一种可能的实现方式中，所述导电层还包括第二基材层，所述第二基材层设置在所述第二区域、且位于所述导电浆料层远离所述泡棉基体的一侧。
在该实现方式中，通过设置在第二区域的第二基材层，能够使得沿垂直于泡棉基体的方向，导电层在第一区域的高度小于在第二区域的高度、且该高度差可以较大，简单易实现。
在第一方面一种可能的实现方式中，所述泡棉基体的形状为多面体，所述多面体至少包括相连的所述第一表面、第二表面和第三表面；
所述导电层至少包覆所述第一表面、所述第二表面和所述第三表面。
在该实现方式中，泡棉基体至少包括相连的第一表面、第二表面和第三表面，导电层至少包覆泡棉基体的第一表面、第二表面和第三表面，从而可以提供多种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉，丰富了导电泡棉在电子设备中的应用。
在第一方面一种可能的实现方式中，当所述多面体包括所述第一表面、所述第二表面和所述第三表面时，所述第一表面与所述第二表面相对设置、且所述第一表面通过所述第三表面与所述第二表面相连；所述导电层包覆所述多面体的至少部分所述第一表面、至少部分所述第二表面和全部所述第三表面。
在该实现方式中，通过泡棉基体的第一表面与第二表面相对设置、且第一表面通过第三表面与第二表面相连，又设置导电层包覆多面体的至少部分第一表面、全部第三表面和至少部分第二表面，从而可以构成类“C”型的导电层，该导电泡棉应用于 电子设备中时，可以保证导电泡棉的方向性，从而进行识别防呆。
在第一方面一种可能的实现方式中，当所述多面体包括所述第一表面、所述第二表面、所述第三表面和第四表面时，所述第一表面与所述第二表面相对设置、且所述第三表面与所述第四表面相对设置，所述第一表面分别通过所述第三表面和所述第四表面与所述第二表面相连，所述导电层包覆全部所述第一表面、至少部分所述第二表面、全部所述第三表面和全部所述第四表面。
在该实现方式中，通过第一表面与第二表面相对设置、第三表面与第四表面相对设置，第一表面分别通过第三表面和第四表面与第二表面相连，且设置导电层包覆泡棉基体的全部第一表面、至少部分第二表面、全部第三表面和全部第四表面，从而能够构成类型的导电层，该导电泡棉应用于电子设备中时，可以保证导电泡棉的方向性，从而进行识别防呆。
可选地，当多面体包括第一表面、第二表面和第三表面时，第一表面与第二表面相对设置、且第一表面通过第三表面与第二表面相连；导电层包覆多面体的至少部分第一表面、至少部分第二表面和全部第三表面；
导电泡棉还包括第二粘结层，第二粘结层设置在部分第二表面。
在该实现方式中，通过在部分第二表面设置有第二粘结层，能够使得导电泡棉与电子设备中的结构很好的电连接，实现了导电泡棉的应用。
可选地，当多面体包括第一表面、第二表面、第三表面和第四表面时，第一表面与第二表面相对设置、且第三表面与第四表面相对设置，第一表面分别通过第三表面和第四表面与第二表面相连，导电层包覆全部第一表面、至少部分第二表面、全部第三表面和全部第四表面；
导电泡棉还包括第二粘结层，第二粘结层设置在部分第二表面。
在该实现方式中，通过在部分第二表面设置有第二粘结层，能够使得导电泡棉与电子设备中的结构很好的电连接，实现了导电泡棉的应用。
在第一方面一种可能的实现方式中，所述多面体的所述第二表面用于通过所述导电层与所述电子设备中的第二结构电连接。
在该实现方式中，导电泡棉的第一表面能够通过导电层与电子设备中的第一结构电连接，且第二表面能够通过导电层与电子设备中的第二结构电连接，从而至少可以实现电子设备中的第一结构与第二结构的电连接。
在第一方面一种可能的实现方式中，所述电子设备中的所述第一结构为显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件中的任一种。
在该实现方式中，导电泡棉通过导电层能够实现与电子设备中的显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件等中的至少一种的电连接。
在第一方面一种可能的实现方式中，所述电子设备中的所述第二结构为显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件中的任一种。
在该实现方式中，导电泡棉通过导电层能够实现与电子设备中的显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件等中的至少一种的电连接。
第二方面，提供了一种电子设备，包括如第一方面或第一方面的任意可能的实现方式中的导电泡棉。
本申请实施例提供的电子设备，由于使用了如第一方面或第一方面的任意可能的实现方式中的导电泡棉，能够使得电子设备的厚度减薄的同时，该电子设备中的结构与导电泡棉的接触界面之间的PIM可以较小；并且，该电子设备能够减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
在第二方面一种可能的实现方式中，所述电子设备中的所述第一结构为显示屏，所述电子设备中的第二结构为金属中框。
在该实现方式中，能够使得导电泡棉的第一表面通过导电层与显示屏电连接、且导电泡棉的第二表面通过导电层与金属中框电连接；同时，由于导电泡棉可以很好的压缩或拉伸，既满足在第一方向上实现较低的工作高度，又能够避免损伤显示屏，确保了电子设备优异的性能。
在第二方面一种可能的实现方式中，第一结构至少包括摄像组件，摄像组件用于在转动时与导电泡棉保持电连接。
在该实现方式中，将摄像组件例如摄像头与导电泡棉电连接，由于导电泡棉在第一方向上的工作高度较低，因此能够置于摄像头与其它结构之间；当摄像头向任意方向转动的过程中，由于导电泡棉可以很好的压缩或拉伸，因此摄像头始终能够与导电泡棉保持电连接，保证了电子设备的性能；同时，由于导电泡棉是独立的结构，可分离，那么例如在需要更换导电泡棉时，无需拆卸电子设备，造成电子设备整体报废；并且，导电泡棉能够有效吸收与电子设备的结构电连接时存在的公差，从而避免出现接触不良；还有，导电泡棉可以使得接地(GND)路径较短；同时，若出现溢胶等问题，导电泡棉也可以通过应变来改善。由此，本申请实施例的电子设备的性能得到了大幅的提升。
第三方面，提供了一种导电泡棉的制作方法，制作方法包括：
在泡棉基体的至少第一表面形成导电层；其中，第一表面用于通过导电层与电子设备中的第一结构电连接，导电层至少包括导电浆料层，导电浆料层用于在外界压力作用下发生变形。
本申请实施例提供的导电泡棉的制作方法，通过喷涂、印刷、喷镀、真空镀、浸渍等方式形成导电浆料，并烘烤/加热固化形成导电浆料层，简单易实现；同时，导电浆料层中的导电浆料具备一定的延展性、良好的导电性、较大的电阻率等性能，且导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；并且，导电浆料烧结成层，体积缩小以保证多个导电粒子之间的接触力，从而使得导电浆料内部的PIM非常小；此外，导电浆料固化成导电浆料层时，导电浆料中的导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
本申请实施例提供一种导电泡棉及其制作方法、电子设备，由于包覆泡棉基体至少第一表面的导电层中的导电浆料层具备一定的延展性、良好的导电性、较大的电阻率等，且由于泡棉基体具有弹性，从而使得导电泡棉在第一方向上工作高度较低、PIM 较小、应力也较小；该导电泡棉应用于电子设备，能够与电子设备中的结构具有较大的接触面，且该接触面的PIM较小，同时还能够使得电子设备的厚度较薄，并减小或消除辐射杂散干扰等，从而有效的提升了电子设备的性能，用户体验佳。
附图说明
图1为本申请实施例提供的第一种电子设备的结构示意图；
图2为相关技术中的一种全方位拉丝泡棉的结构示意图；
图3为本申请实施例提供的第一种导电泡棉的具有剖面的立体结构示意图；
图4为图3所示的导电泡棉的剖面示意图；
图5为本申请实施例提供的第二种导电泡棉的具有剖面的立体结构示意图；
图6为图5所示的导电泡棉的剖面示意图；
图7为本申请实施例提供的导电泡棉的导电浆料层未固化前的结构示意图；
图8为本申请实施例提供的导电泡棉的导电浆料层固化后的结构示意图；
图9为本申请实施例提供的第三种导电泡棉的具有剖面的立体结构示意图；
图10为图9所示的导电泡棉的剖面示意图；
图11为本申请实施例提供的第四种导电泡棉的结构示意图；
图12为本申请实施例提供的无纺布的微观结构示意图；
图13为本申请实施例提供的第五种导电泡棉的结构示意图；
图14为本申请实施例提供的第六种导电泡棉的结构示意图；
图15为本申请实施例提供的第七种导电泡棉的结构示意图；
图16为本申请实施例提供的第八种导电泡棉的结构示意图；
图17为本申请实施例提供的第九种导电泡棉的结构示意图；
图18为本申请实施例提供的第十种导电泡棉的结构示意图；
图19为本申请实施例提供的第十一种导电泡棉的结构示意图；
图20为本申请实施例提供的第二种电子设备的结构示意图；
图21为本申请实施例提供的第三种电子设备的结构示意图；
图22为相关技术中的第一种电子设备的结构示意图；
图23为相关技术中的第二种电子设备的结构示意图；
图24为本申请实施例提供的第四种电子设备的结构示意图；
图25为本申请实施例提供的第五种电子设备的结构示意图；
图26为本申请实施例提供的第六种电子设备的结构示意图；
图27为本申请实施例提供的电子设备的结构示意图；
图28为本申请实施例提供的第七种电子设备的结构示意图；
图29为本申请实施例提供的第八种电子设备的结构示意图；
图30为本申请实施例提供的导电泡棉的第一种制作方法流程图；
图31为本申请实施例提供的导电泡棉的第二种制作方法流程图；
图32为本申请实施例提供的导电泡棉的第三种制作方法流程图；
图33为本申请实施例提供的实际应用的导电泡棉的第一种制作方法流程图。
附图标记：
01-电子设备；101-显示模组；1011-显示屏；1012-触控面板；1013-金属框；102-
中框；1021-边框；1022-承载板；103-后壳；501-前置摄像头；502-屏蔽盖；503-导电布；504-PCB；505-支架钢片；506-螺钉；507-前置摄像头的基板；508-后置摄像头；509-后置摄像头的基板；102-中框；105-天线；106-绝缘材料层；107-塑胶；108-簧片；109-镭雕面；110-防氧化层；OZ-第一方向(手机的厚度方向)；OX-第二方向(手机的宽度方向)；OY-第三方向(手机的长度方向)；111-显示屏；
03-全方位拉丝泡棉；121-全方位拉丝泡棉的背胶；122-金属丝；
05-导电泡棉；1-泡棉基体；10-第一泡棉基体；11-泡棉基体的第一表面；12-泡棉
基体的第二表面；13-泡棉基体的第三表面；14-泡棉基体的第四表面；2-导电层；21-第一导电浆料层；211-第一浆料主体；212-第一导电粒子；22-第二导电浆料层；221-第二浆料主体；222-第二导电粒子；D1-导电通路；Q1-第一区域；Q12-第二区域；5-胶层；6-第一基材层；7-第二粘结层；8-异色PET层；9-第二基材层。
具体实施方式
下面将结合附图对本申请实施例中的技术方案进行清楚、详尽地描述。其中，在本申请实施例的描述中，除非另有说明，“/”表示或的意思，例如，A/B可以表示A或B；文本中的“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为暗示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征，在本申请实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。“至少一个”的含义是一个或一个以上。
首先，对本申请实施例中的部分用语进行解释说明，以便于本领域技术人员理解。
1、泡棉
泡棉是指聚氨酯、塑料粒子等发泡过的材料，简称泡棉。泡棉具有重量轻、有弹性、快速压敏固定、使用方便、弯曲自如、体积超薄、性能可靠等特点。
2、导电泡棉
导电泡棉是指在泡芯上包裹导电布等，经过处理后，使其具有良好的表面导电性等，可以很容易的用胶粘带等固定在需要屏蔽的结构上。
3、无源互调
无源互调是指两个或更多的频率在非线性器件中混合在一起，由此产生了杂散信号。
4、辐射杂散
辐射杂散是指用标准信号调制时，在除了载频和由于正常调制和切换瞬态引起的边带以及邻道以外离散频率上的辐射；辐射杂散可能是一些非线性结构产生的谐波分量、交调信号等。
5、导电浆料的渗流理论
当导电浆料中导电粒子的含量较高时，导电网络主要由导电粒子直接搭接形成。
6、导电浆料的隧道效应理论或场致发射理论
当导电浆料中导电粒子的含量较低时，导电粒子不足以直接接触，此时由外界强加外电场，电子通过隧道效应穿透有机物，跳迁到附近的导电粒子上，以使得导电网络畅通。导电浆料中以隧道效应理论或场致发射理论为主时，导电浆料的PIM性能较差。
7、无纺布
无纺布又称不织布、针刺棉、针刺无纺布等，采用聚酯纤维，涤纶纤维等材质生产，经过针刺工艺制作而成。无纺布没有经纬线，是一种不需要纺纱织布而形成的织物，只是将纺织短纤维或者长丝进行定向或随机排列，形成纤网结构，然后采用机械、热粘或化学等方法加固而成。无纺布具有防潮、透气、柔韧、轻薄、阻燃、无毒无味、价格低廉、可循环再用等特点。
以上是对本申请实施例所涉及名词的简单介绍，以下不再赘述。
示例性的，图1示出了一种本申请实施例适用的电子设备01。
如图1所示，以电子设备01为手机为例，该手机可以包括显示模组101、中框102和后壳103等，中框102设置在显示模组101和后壳103之间，中框102包括边框1021和被边框包围的承载板1022，承载板1022的一侧安装有内部结构，例如元器件等。手机的内部结构可以通过电连接实现功能，该电连接通常为弱力接触，导致内部结构的接触界面易产生谐波、无源互调等非线性产物，非线性产物是手机辐射杂散的主要来源，而辐射杂散干扰是手机验收的一项重要指标。
为了减小或消除辐射杂散干扰，手机的内部结构可以通过泡棉进行电连接。相关技术提供的泡棉种类较多，例如，全方位拉丝泡棉等等，这些泡棉由于低PIM等特性受到了广泛的应用。
示例性的，图2示出了一种相关技术中的全方位拉丝泡棉03。如图2所示，全方位拉丝泡棉03包括背胶121和金属丝122。其中，背胶121可以包括导电胶、绝缘胶等中的任一种，金属丝122可以包括铜丝等。然而，全方位拉丝泡棉03被压缩时，可能会出现金属丝122断裂的问题，或者，可能会出现不会回弹，金属丝122产生永久形变的问题，进而导致其在第一方向上的工作高度很难压缩。需要说明的是，第一方向为图2中所示的OZ方向，OZ方向对应手机的厚度方向。
那么，基于上述几种示例可见，相关技术中提供的泡棉均无法在第一方向上实现较低的工作高度，也无法进一步减小PIM。
有鉴于此，本申请提供了一种导电泡棉，该导电泡棉设置了包覆泡棉基体至少第一表面的导电层，该导电层至少包括导电浆料层，导电浆料层具有延展性较好、导电性良好、内部PIM非常小等优点；同时，导电浆料在成膜前呈液态，固化过程中体积 会缩小，使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，并在该压力作用消失后回弹，从而能够有效降低导电泡棉在第一方向上的工作高度，并实现非常小的PIM，且该导电泡棉自身不会产生断裂、永久变形等问题。
当本申请的导电泡棉应用于电子设备时，导电泡棉与电子设备中的结构的接触面积较大，并能够有效降低电子设备的厚度，实现超薄化；同时，还能够降低电子设备中的结构与导电泡棉接触面之间的界面PIM，减小或消除辐射杂散干扰等。
本申请实施例对电子设备的具体类型不做任何限制，在一些实施例中，本申请的电子设备可以包括手机、可穿戴设备(例如智能手环、智能手表、耳机等)、平板电脑、膝上型计算机(laptop)、手持计算机、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、蜂窝电话、个人数字助理(personal digital assistant，PDA)、增强现实(Augmented reality，AR)\虚拟现实(virtual reality，VR)设备等物联网(internet of things，IOT)设备、车载电子设备，还可以是电视、大屏、打印机、投影仪等设备。
应用中，以电子设备为手机为例，如图1所示，该手机可以包括显示模组101、中框102和后壳103等。其中，显示模组101包括显示屏1011、以及设置于显示屏1011出光侧的触控面板1012；承载板1022的一侧安装有显示模组101，另一侧安装有摄像组件、天线、电路板、电池等内部结构，用于构成中框102的边框1021与承载板1022可以为一体结构；后壳103安装于中框102上，后壳103用于对上述内部结构进行保护。如图1所示，该手机还可以包括安装于显示屏1011非出光侧的金属框1013，金属框1013背离显示屏1011的一侧可以通过胶层粘贴于中框102的一侧，从而达到将显示模组101安装于中框102一侧的目的。
在一些实施例中，本申请的电子设备中，第一结构可以是显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件等中的任一种；第二结构可以是显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件等中的任一种。第一结构与第二结构可以相同，当然也可以不同，具体以实际应用为准。示例性的，摄像组件可以包括摄像头(camera)；电路板可以包括印刷电路板(printed circuit boards，PCB)、柔性电路板(flexible printed circuit，FPC)等。
需要说明的是，上述显示屏可以包括液晶显示屏(Liquid Crystal Display，LCD)、有机发光二极管(Organic Light Emitting Diode，OLED)显示屏等。
上述触控面板可以包括由玻璃或者透明树脂材料制成的盖板、以及位于该盖板靠近显示屏一侧的触控电极图案。
这里仅介绍与发明点相关的内容，其余结构可以参考相关技术获取，这里不再详细说明。
基于上述结构，本申请提供的导电泡棉应用于电子设备时，可以与电子设备中的任意一种第一结构和/或除第一结构以外的其它结构电连接，从而通过导电泡棉实现电子设备中结构的电连接的同时，还能够减薄电子设备的厚度，并减小电子设备中的结构与导电泡棉的接触面PIM，此外，还能够减小或消除辐射杂散干扰等，用户体验佳。
应用中，本申请实施例提供的导电泡棉的至少一个表面，用于通过导电浆料层与电子设备中的至少一个结构电连接，此时电子设备中的结构可以包括显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件等中的至少一个。
作为一个示例，当导电泡棉包括第一表面时，可以是第一表面用于通过导电浆料层与一个第一结构电连接，还可以是第一表面用于通过导电浆料层与多个第一结构电连接，这里不做具体限定。
作为一个示例，当导电泡棉包括第一表面和其它表面，例如导电泡棉包括第一表面和第二表面时，可以是第一表面通过导电浆料层与第一结构电连接、且第二表面通过导电浆料层与第二结构电连接。第二结构可以参考第一结构，这里不再赘述。第一结构、第二结构的数量等也可以根据实际需要确定。
下面结合图3至图19，对本申请实施例提供的导电泡棉05进行详细介绍。
如图3至图6、图9至图11、图13至图19所示，本申请提供的导电泡棉05包括：
泡棉基体1。
导电层2，包覆泡棉基体1的至少第一表面11，第一表面11用于通过导电层2与电子设备中的第一结构电连接；导电层2至少包括导电浆料层，导电浆料层用于在外界压力作用下发生变形。
其中，导电浆料层包括浆料主体和多个相连的导电粒子，导电粒子掺杂于浆料主体中。
本申请对于上述泡棉基体的材料、制作工艺等均不做具体限定，示例性的，泡棉基体的材料可以包括聚氨酯、二氧化硅基材的树脂等。例如，可以采用发泡工艺形成上述泡棉基体，以作为导电泡棉的泡芯，经过发泡的泡棉基体表面具有多个微孔，且泡棉基体具有弹性，可以很好的进行压缩、拉伸等变形。
本申请对于上述泡棉基体的形状不做具体限定，示例性的，泡棉基体的形状可以包括多面体、圆球、圆柱等。在泡棉基体的形状为多面体的情况下，多面体可以包括规则多面体或者非规则多面体。在泡棉基体的形状为规则多面体的情况下，规则多面体可以包括立方体、六面体、八面体等。在图3至图6、图9至图11、图12至图19中，泡棉基体1的形状为六面体。
多面体具有多个表面，多个表面至少包括第一表面，该第一表面是需要与电子设备中的第一结构电连接的表面；当然，多面体中除了第一表面以外的其它至少一个表面也可以与电子设备中除了第一结构以外的其它结构电连接，示例性的，多面体还可以设置第二表面与电子设备中的第二结构电连接。在多面体的所有表面中，需要与电子设备的结构电连接的表面的数量可以根据导电泡棉的实际应用进行确定。此时，该电连接可以是间接电连接，即多面体的表面通过导电层与电子设备中的结构电连接；当然，还可以是多面体的表面依次通过第一粘结层、导电层等与电子设备中的结构电连接，这里不做具体限定。
本申请上述泡棉基体的体积等可以根据实际需要确定。
应理解，上述导电层包覆泡棉基体的至少第一表面是指：导电层可以仅包覆泡棉基体的第一表面；或者，导电层除了包覆泡棉基体的第一表面以外，还可以包覆泡棉 基体的其它表面，其中，该其它表面是指除了第一表面以外的任意一个表面，这里不做具体限定。以泡棉基体的形状为六面体为例，导电层可以包覆泡棉基体的一个表面(第一表面)；或者，导电层可以包覆泡棉基体的两个表面(第一表面和第二表面)；或者，导电层可以包覆泡棉基体的三个以上表面，具体以实际应用为准。
下面以泡棉基体的形状为六面体，对导电层包覆泡棉基体的情况进行具体示例：
作为一个示例，图3至图6、图9-图11中，导电层2包覆泡棉基体1的全部第一表面11(上表面)、全部第二表面12(下表面)、全部第三表面13(左表面)和全部第四表面14(右表面)。
作为另一个示例，图13至图14中，导电层包覆泡棉基体1的部分第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)。
作为又一个示例，图15至图18中，导电层包覆泡棉基体1的全部第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)。
作为再一个示例，图19中，导电层包覆泡棉基体1的全部第一表面11(上表面)、部分第二表面12(下表面)、全部第三表面13(左表面)和全部第四表面14(右表面)。
需要说明的是，第一表面、第二表面、第三表面和第四表面中的至少一个表面用于基于导电层与电子设备中的结构电连接，示例性的，可以是第一表面、第二表面、第三表面和第四表面全部基于导电层与电子设备中的结构电连接，具体为，第一表面用于基于导电层与电子设备中的第一结构电连接、第二表面用于基于导电层与电子设备中的第二结构电连接、第三表面用于基于导电层与电子设备中的第三结构电连接、第四表面用于基于导电层与电子设备中的第四结构电连接；或者，可以是仅一个表面用于基于导电层与电子设备中的结构电连接，具体为，第一表面用于基于导电层与电子设备中的第一结构电连接，而第二表面、第三表面、第四表面均未用于基于导电层与电子设备中的结构电连接；当然，还可以是其它情况，这里不做具体限定。其中，第一结构、第二结构、第三结构和第四结构均可以是显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件等中的任一种，具体以实际需要确定。
应理解，上述导电层至少包括导电浆料层是指：导电层可以仅包括导电浆料层，例如，导电层为第一导电浆料层/第二导电浆料层；或者，导电层除了包括导电浆料层以外，还可以包括其它膜层，例如，还可以包括第一粘结层、第一基材层等，这里不做具体限定。
本申请对于上述导电浆料层的导电浆料不做具体限定，示例性的，导电浆料可以包括聚合物导电浆料(烘烤或加热固化成膜，以有机聚合物作为粘接相)、烧结型导电浆料(烧结成膜，烧结温度>500℃，玻璃粉或氧化物作为粘接相)等。本申请下述实施例均以导电浆料为聚合物导电浆料为例进行说明。
应用中，导电浆料可以包括浆料主体和多个导电粒子，多个导电粒子掺杂于浆料主体中，多个导电粒子在固化前不相连，固化后相连，从而使得固化后形成的导电浆料层中产生多条电流通路，从而导电，且在固化后导电粒子缩小体积以保证相邻粒子间的接触，使得导电浆料内部的PIM有效的减小；同时，在固化后导电粒子摊开，能够增加导电浆料层与电子设备中的结构的接触面积。
本申请对于浆料主体不做具体限定，示例性的，浆料主体可以包括树脂，具体为，树脂可以是硅胶树脂、硅烷改性树脂、环氧树脂、二氧化硅树脂等中的任一种。其中，硅胶树脂和硅烷改性树脂具有弹性好、粘稠度较大、粘性较大、固化后体积收缩率较低(例如小于10％)、耐高温、内部无应力等特性。环氧树脂和二氧化硅树脂具有粘稠度较小、易流平、固化后体积变化率较大(例如大于50％)、易固化、内应力较大、散热性较好等特性。
本申请对于导电粒子的类型、形状、粒径等均不做具体限定，示例性的，导电粒子可以包括金属导电粒子，具体为，该金属导电粒子可以是银(Ag)粒子、铜(Gu)粒子、金(Au)粒子、铝(Al)粒子、镍(Ni)粒子等中的任一种或多种组合；金属导电粒子的形状可以包括球状、刺状，片状、棒状、线状等中的任一种；金属导电粒子的粒径可以为微米级、纳米级等，具体为，金属导电粒子的粒径取值范围可以包括5-20μm，即金属导电粒子的粒径可以是5μm、8μm、10μm、13μm、17μm或者20μm等等。
需要说明的是，上述导电粒子的弹性模量不同，在浆料主体为同一树脂的情况下，选取弹性模量较小的导电粒子掺杂于树脂中时，可以使得导电浆料在低压强下发生微小变形，从而可以增加导电泡棉与电子设备中的结构的接触面积。
下表一示出了相同尺寸的银粒子、铜粒子、金粒子、铝粒子、镍粒子、铁粒子、铂粒子对应的弹性模量、泊松比、压力和压强。
表一
由表一可以看出，银、金、铝的弹性模量均较小，掺杂于树脂中形成浆料层时，由于银、金、铝本身是良导体，且质软，可以很好的压缩或拉伸。并且，导电浆料层 中的银粒子、金粒子、铝粒子可以在压缩后摊开，从而使得实现导电浆料层与电子设备中的结构的接触面积较大。
此外，还可以根据其它条件选择所需要的导电粒子：
作为一个示例，可以根据压强选择导电粒子，例如，压强较大时，可以选择镍粒子，镍粒子的性质比银粒子等的性质更稳定；又例如，压强适中时，可以选择铜粒子，铜粒子的成本比银粒子等的成本更低。
作为另一个示例，可以根据导电泡棉中导电通路的电流选择导电粒子，例如，电流较低或在低电流区时，可以选择铜粒子，以降低成本；又例如，电流较高或在高电流区时，可以选择银粒子、金粒子等低PIM的粒子，以保证导电泡棉的性能。
本申请对于上述导电浆料中的导电粒子在浆料主体中的掺杂浓度不做具体限定，示例性的，导电粒子在浆料主体中的质量分数取值范围可以包括75-85％，具体为，导电粒子在浆料主体中的质量分数可以是75％、78％、80％、81％、83％或者85％等等。其中，导电粒子在浆料主体中的质量分数越高，电阻率越小，断裂延伸率越差，从而可以设置导电粒子在浆料主体中的质量分数较高，以满足导电浆料层的压缩或拉伸。
作为一个示例，以导电浆料为导电银浆，导电银浆包括树脂和银粒子，银粒子掺杂于树脂中为例进行说明。其中，银粒子的质量分数可以为80％、树脂的质量分数可以为20％，树脂可以压缩或拉伸；银粒子的密度可以为10、树脂的密度可以为1；当质量分数换算成体积分数后，银粒子的体积分数与树脂的体积分数的比值可以为2:5，导电银浆固化后，体积可以收缩约50％，有效降低了银粒子之间的PIM，甚至可以忽略不计，并且，还能够使得导电银浆层中的银粒子的体积分数与树脂的体积分数的比值可以为1:1.25，与电子设备中的结构接触时，接触面积可以达到总面积的45％；同时，由于银粒子本身是良导体、质软，在低压强激活后会变形，进一步增大接触面积；导电银浆的拉伸附着力取值范围可以包括8-9Mpa，具体为，导电银浆的拉伸附着力可以是8Mpa或者9Mpa等等。
需要说明的是，银粒子可以是微米级的球状、刺状，片状、棒状的银，还可以是纳米级的银线、银棒等，具体以实际应用为准。
导电浆料层沿垂直于泡棉基体方向的厚度取值范围在10-13μm时，可以使得导电浆料层的电阻率达到200mΩ。那么，若希望导电浆料层的电阻率更低，则可以设置导电浆料层沿垂直于泡棉基体方向的厚度更小。本申请对于上述导电浆料层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，导电浆料层沿垂直于泡棉基体方向的厚度取值范围可以包括5-10μm，具体为，导电浆料层沿垂直于泡棉基体方向的厚度可以是5μm、6μm、7μm、8μm、9μm或者10μm等等。
本申请对于上述导电浆料层的制作工艺不做具体限定，示例性的，当导电层仅包括导电浆料层时，可以先在泡棉基体表面采用喷涂、印刷等方法形成导电浆料，再通过对导电浆料进行烘烤/加热等固化方式形成导电浆料层；或者，当导电层包括导电浆料层和第一基材层时，可以先在第一基材层表面采用喷涂、印刷等方法形成导电浆料，再通过对导电浆料进行烘烤/加热等固化方式形成导电浆料层；或者，当导电层包括导电浆料层和第一基材层时，可以先将第一基材置于导电浆料中浸泡，再将第一基材层、导电浆料与泡棉基体结合。
作为一个示例，当导电浆料中的浆料主体为硅胶树脂、硅烷改性树脂时，可以先采用喷涂方式涂覆硅胶树脂、硅烷改性树脂，再对导电浆料进行烘烤/加热固化处理；或者，可以将第一基材置于硅胶树脂、硅烷改性树脂中浸泡，再对导电浆料进行烘烤/加热固化处理。当然还可以采用其它制作工艺，这里不做具体限定。
作为另一个示例，当导电浆料中的浆料主体为环氧树脂、二氧化硅树脂时，可以先采用印刷方式印刷环氧树脂、二氧化硅树脂，再对导电浆料进行烘烤/加热固化处理；或者，可以将第一基材置于环氧树脂、二氧化硅树脂中浸泡，再对导电浆料进行烘烤/加热固化处理。当然还可以采用其它制作工艺，这里不做具体限定。
需要说明的是，还可以根据泡棉基体的材质选择浆料主体，示例性的，可以选择和泡棉基体近似材质的基材作为浆料主体，例如，硅橡胶导电泡棉可以选用二氧化硅基材的树脂，从而可以提高泡棉基体和导电浆料的结合性。
示例性的，图8和图9均以导电层包括第一导电浆料层21，第一导电浆料层21中的第一导电浆料为第一聚合物导电浆料为例说明导电机理。其中，图8示出了第一聚合物导电浆料在成膜前的示意图；图9示出了第一聚合物导电浆料在成膜后的示意图。
如图8所示，第一聚合物导电浆料在成膜前，即未固化时，由于第一导电粒子212没有直接接触，此时第一导电浆料层不具有导电性，也就不会产生导电通路。如图9所示，在固化过程中，随着溶剂的不断挥发，第一导电粒子212之间的间距越来越小，直至相互直接接触形成导电通路D1，此为第一导电浆料的渗流理论。图9以第一导电浆料层产生两条导电通路D1为例进行绘示。
需要说明的是，第一导电浆料中的第一导电粒子的质量分数应当满足使得第一导电浆料的导电机理至少以渗流理论为主，此时包括：第一导电浆料的导电机理仅为渗流理论；或者，第一导电浆料的导电机理以渗流理论为主，还可以辅以隧道效应理论或场致发射理论。当第一导电浆料中的第一导电粒子的质量分数范围包括75-85％时，第一导电浆料的导电机理能够至少以渗流理论为主。
本申请对于上述外界压力作用的来源不做具体限定，示例性的，可以是外界直接施加于导电泡棉的压力作用；或者，还可以是外界施加于电子设备中的其它结构、该结构再施加于导电泡棉的压力作用；或者，还可以是电子设备中的其它结构自身产生的、施加于导电泡棉的压力作用。
下面任意选取两个本申请的导电泡棉，即导电泡棉1和导电泡棉2，分别使得导电泡棉1的第一表面与电子设备中的镭雕面电连接、且第二表面与电子设备中的铜箔电连接，导电泡棉2的第一表面与电子设备中的镭雕面电连接、且第二表面与电子设备中的铜箔电连接，再分别测试得到导电泡棉1和导电泡棉2的PIM值和敲击最差值，如下表二所示。
表二
下面提供相关技术的导电泡棉3，该导电泡棉3是镀金层包覆泡棉基体的表面，使得导电泡棉3的第一表面与电子设备中的镭雕面电连接构成第一接触面、且第二表面与电子设备中的铜箔电连接，再测试得到导电泡棉3的PIM值、敲击工作台最差值和敲击第一接触面最差值，如下表三所示。
表三
由表二和表三可以看出，本申请的导电泡棉1和导电泡棉2随着外界作用力的增大，各处的敲击最差值都很稳定，且PIM值也变化不大，效果较好。而相关技术中的导电泡棉3当外界作用力较小时，敲击第一接触面最差值不稳定；并且，随着外界作用力的增大，PIM值会趋于稳定。但是，若压力过大，则可能导致导电泡棉与电子设备中的结构的多个接触界面中，不耐压一侧的接触界面产生问题，例如，屏幕膜印、电池盖膜印等，因此不宜压力过大。
需要说明的是，实际应用时，该导电泡棉还可以包括第二粘结层、离型层等结构。本申请对于第二粘结层的类型、位置等均不做具体限定，示例性的，第二粘结层可以包括导电胶、绝缘胶等中的任一种，具体为，第二粘结层可以是全面导电胶、局部绝缘胶等中的任一种；第二粘结层可以设置在泡棉基体的任一表面。
本申请对于离型层的类型、位置等均不做具体限定，示例性的，离型层可以包括离型纸；离型层可以设置在第二粘结层远离导电层的一侧，以对第二粘结层进行保护。当使用导电泡棉时，可以将离型层去除，以通过第二粘结层将导电层与电子设备中的结构电连接。
这里仅介绍与发明点相关的内容，其余结构可以参考相关技术获取，这里不再详细说明。
本申请实施例提供的导电泡棉，通过设置包覆泡棉基体的至少第一表面的导电浆料层，一方面，该导电浆料层中的导电浆料具备一定的延展性、良好的导电性、较大的电阻率(10-5-10-4Ω×cm)等性能，且导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低，例如，使得导电泡棉在第一方向上的工作高度取值范围包括0.1-0.15mm，具体为，导电泡棉在第一方向上的工作高度可以是0.1mm、0.11mm、0.12mm、0.13mm、0.14mm或者0.15mm等；另一方面，导电浆料烧结成层，体积缩小以保证多个导电粒子之间的接触力，从而使得导电浆料内部的PIM非常小；又一方面，导电浆料固化成导电浆料层时，导电浆料中的导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大，例如，接触面积可以达到43.46％以上。
由此，本申请提供了一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
下面结合图3和图4，具体说明导电层为第一导电浆料层21的情况。
在图3和图4中，导电层为第一导电浆料层21，第一导电浆料层21中的多个第一导电粒子212掺杂于第一浆料主体211中，多个第一导电粒子212在固化前不相连，固化后相连，从而使得固化后形成的第一导电浆料层21中产生多条电流通路，从而导电，且在固化后第一导电粒子212缩小体积以保证相邻粒子间的接触，使得第一导电 浆料内部的PIM有效的减小；同时，在固化后第一导电粒子212摊开，能够增加第一导电浆料层21与电子设备中的结构的接触面积。
本申请对于上述第一导电浆料层中的导电浆料不做具体限定，示例性的，导电浆料可以包括聚合物导电浆料、烧结型导电浆料等。本申请下述实施例均以第一导电浆料层中的导电浆料为聚合物导电浆料为例进行说明。
本申请对于第一浆料主体不做具体限定，示例性的，第一浆料主体可以包括第一树脂。具体为，该第一树脂可以是环氧树脂、二氧化硅树脂等。其中，环氧树脂、二氧化硅树脂均具有粘稠度较小、易流平、固化后体积变化率较大(例如大于50％)、易固化、内应力较大、散热性较好等特性。
本申请对于第一导电粒子的类型、形状、尺寸等均不做具体限定，示例性的，第一导电粒子可以包括第一金属导电粒子，具体为，该第一金属导电粒子可以是银粒子、铜粒子、金粒子、铝粒子、镍粒子等中的任一种或多种组合；第一金属导电粒子的形状可以包括球状、刺状，片状、棒状、线状等中的任一种；第一金属导电粒子的尺寸可以为微米级、纳米级等，具体为，第一金属导电粒子的粒径取值范围可以包括5-20μm，即第一金属导电粒子的粒径可以是5μm、8μm、10μm、13μm、17μm或者20μm等等。
需要说明的是，上述第一导电粒子的弹性模量不同，在第一浆料主体为同一第一树脂的情况下，选取弹性模量较小的第一导电粒子掺杂于第一树脂中时，可以使得第一导电浆料在低压强下发生微小变形，从而可以增加导电泡棉与电子设备中的结构的接触面积。
本申请对于上述第一导电浆料中的第一导电粒子在第一浆料主体中的掺杂浓度不做具体限定，示例性的，第一导电粒子在第一浆料主体中的质量分数取值范围可以包括75-85％，具体为，第一导电粒子在第一浆料主体中的质量分数可以是75％、78％、80％、81％、83％或者85％等等。
作为一个示例，以第一导电浆料为第一导电银浆，第一导电银浆包括第一树脂和第一银粒子，第一银粒子掺杂于第一树脂中为例进行说明。其中，第一银粒子的质量分数可以为80％、第一树脂的质量分数可以为20％，第一树脂可以压缩或拉伸；第一银粒子的密度可以为10、第一树脂的密度可以为1；当质量分数换算成体积分数后，第一银粒子的体积分数与第一树脂的体积分数的比值可以为2:5，第一导电银浆固化后，体积可以收缩约50％，有效降低了第一银粒子之间的PIM，甚至可以忽略不计，并且，还能够使得第一导电银浆层中的第一银粒子的体积分数与第一树脂的体积分数的比值可以为1:1.25，与电子设备中的结构接触时，接触面积可以达到总面积的45％；同时，由于银粒子本身是良导体、质软，在低压强激活后会变形，进一步增大接触面积；第一导电银浆的拉伸附着力取值范围可以包括8-9Mpa，具体为，第一导电银浆的拉伸附着力可以是8Mpa或者9Mpa等等。
需要说明的是，银粒子可以是微米级的球状、刺状，片状、棒状的银，还可以是纳米级的银线、银棒等，具体以实际应用为准。
本申请对于上述第一导电浆料层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，第一导电浆料层沿垂直于泡棉基体方向的厚度取值范围可以包括5-10μm，具 体为，第一导电浆料层沿垂直于泡棉基体方向的厚度可以是5μm、6μm、7μm、8μm、9μm或者10μm等等。
本申请对于上述第一导电浆料层的制作工艺不做具体限定，示例性的，可以先在泡棉基体表面采用印刷等方法形成第一导电浆料，再通过对第一导电浆料进行烘烤/加热等固化方式形成第一导电浆料层。
本申请实施例提供的导电泡棉，通过设置包覆泡棉基体的至少第一表面的第一导电浆料层，一方面，该第一导电浆料层中的第一导电浆料具备粘稠度较小、易流平、固化后体积变化率较大、易固化、内应力较大、散热性较好等性能，且第一导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；另一方面，第一导电浆料烧结成层，体积缩小以保证多个第一导电粒子之间的接触力，从而使得第一导电浆料内部的PIM非常小；又一方面，第一导电浆料固化成第一导电浆料层时，第一导电浆料中的导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
由此，本申请提供了一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
下面结合图5和图6，具体说明导电层为第二导电浆料层22的情况。
在图5至图6、图19中，导电层为第二导电浆料层22，第二导电浆料层22中的多个第二导电粒子222掺杂于第二浆料主体221中，多个第二导电粒子222在固化前不相连，固化后相连，从而使得固化后形成的第二导电浆料层22中产生多条电流通路，从而导电，且在固化后第二导电粒子222缩小体积以保证相邻粒子间的接触，使得第二导电浆料内部的PIM有效的减小；同时，在固化后第二导电粒子222摊开，能够增加第二导电浆料层22与电子设备中的结构的接触面积。
本申请对于上述第二导电浆料层中的导电浆料不做具体限定，示例性的，导电浆料可以包括聚合物导电浆料、烧结型导电浆料等。本申请下述实施例均以第二导电浆料层中的导电浆料为聚合物导电浆料为例进行说明。
本申请对于第二浆料主体不做具体限定，示例性的，第二浆料主体可以包括第二树脂。具体为，该第二树脂可以是硅胶树脂、硅烷改性树脂等中的任一种。其中，硅胶树脂、硅烷改性树脂均具有弹性好、粘稠度较大、粘性较大、固化后体积收缩率较低(例如小于10％)、耐高温、内部无应力等特性。
本申请对于第二导电粒子的类型、形状、尺寸等均不做具体限定，示例性的，第二导电粒子可以包括第二金属导电粒子，具体为，该第二金属导电粒子可以是银粒子、铜粒子、金粒子、铝粒子镍粒子等中的任一种或多种组合；第二金属导电粒子的形状可以包括球状、刺状，片状、棒状、线状等中的任一种；第二金属导电粒子的尺寸可 以为微米级、纳米级等，具体为，第二金属导电粒子的粒径取值范围可以包括5-20μm，即第二金属导电粒子的粒径可以是5μm、8μm、10μm、13μm、17μm或者20μm等等。
需要说明的是，上述第二导电粒子的弹性模量不同，在第二浆料主体为同一第二树脂的情况下，选取弹性模量较小的第二导电粒子掺杂于第二树脂中时，可以使得第二导电浆料在低压强下发生微小变形，从而可以增加导电泡棉与电子设备中的结构的接触面积。
本申请对于上述第二导电浆料中的第二导电粒子在第二浆料主体中的掺杂浓度不做具体限定，示例性的，第二导电粒子在第二浆料主体中的质量分数取值范围可以包括75-85％，具体为，第二导电粒子在第二浆料主体中的质量分数可以是75％、78％、80％、81％、83％或者85％等等。
作为一个示例，以第二导电浆料为第二导电银浆，第二导电银浆包括第二树脂和第二银粒子，第二银粒子掺杂于第二树脂中为例进行说明。其中，第二银粒子的质量分数可以为80％、第二树脂的质量分数可以为20％，第二树脂可以压缩或拉伸；第二银粒子的密度可以为10、第二树脂的密度可以为1；当质量分数换算成体积分数后，第二银粒子的体积分数与第二树脂的体积分数的比值可以为2:5，第二导电银浆固化后，体积可以收缩约50％，有效降低了第二银粒子之间的PIM，甚至可以忽略不计，并且，还能够使得第二导电银浆层中的第二银粒子的体积分数与第二树脂的体积分数的比值可以为1:1.25，与电子设备中的结构接触时，接触面积可以达到总面积的45％；同时，由于银粒子本身是良导体、质软，在低压强激活后会变形，进一步增大接触面积；第二导电银浆的拉伸附着力取值范围可以包括8-9Mpa，具体为，第二导电银浆的拉伸附着力可以是8Mpa或者9Mpa等等。
需要说明的是，银粒子可以是微米级的球状、刺状，片状、棒状的银，还可以是纳米级的银线、银棒等，具体以实际应用为准。
本申请对于上述第二导电浆料层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，第二导电浆料层沿垂直于泡棉基体方向的厚度取值范围可以包括5-10μm，具体为，第二导电浆料层沿垂直于泡棉基体方向的厚度可以是5μm、6μm、7μm、8μm、9μm或者10μm等等。
本申请对于上述第二导电浆料层的制作工艺不做具体限定，示例性的，可以先在泡棉基体表面采用喷涂等方法形成第二导电浆料，再通过对第二导电浆料进行烘烤/加热等固化方式形成第二导电浆料层。
本申请实施例提供的导电泡棉，通过设置包覆泡棉基体的至少第一表面的第二导电浆料层，一方面，该第二导电浆料层中的第二导电浆料具备弹性好、粘稠度较大、粘性较大、固化后体积收缩率较低、耐高温、内部无应力等性能，且第二导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；另一方面，第二导电浆料烧结成层，体积缩小以保证多个第二导电粒子之间的接触力，从而使得第二导电浆料内部的PIM非常小；又一方面，第二导电浆料固化成第二导电浆料层时，第二导电浆料中的导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
由此，本申请提供了一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
可选地，作为一种可实现的方式，参考图9至图11、图13至图18所示，导电层还包括第一基材层6，第一基材层6用于在外界压力作用下发生变形；导电浆料层在泡棉基体1上的正投影与第一基材层6在泡棉基体上的正投影至少部分重合。
本申请对于上述第一基材层的类型不做具体限定，示例性的，上述第一基材层可以包括聚酰亚胺(polyimide，PI)层、无纺布等。
需要说明的是，第一基材层应当能够很好的压缩或拉伸，第一基材层的表面粗糙度适中、表面不能有划痕或者仅有非常少的划痕、适于导电浆料的喷涂、印刷等。
本申请对于上述第一基材层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，第一基材层沿垂直于泡棉基体方向的厚度取值范围可以包括1-2μm，具体为，第一基材层沿垂直于泡棉基体方向的厚度可以是1μm、1.2μm、1.5μm、1.7μm、1.8μm或者2μm等等。
应理解，上述导电浆料层在泡棉基体上的正投影与第一基材层在泡棉基体上的正投影至少部分重合是指：导电浆料层在泡棉基体上的正投影与第一基材层在泡棉基体上的正投影部分重合；或者，导电浆料层在泡棉基体上的正投影与第一基材层在泡棉基体上的正投影全部重合，这里不做具体限定。
在导电浆料层在泡棉基体上的正投影与第一基材层在泡棉基体上的正投影部分重合的情况下，可以是导电浆料层在泡棉基体上的正投影位于第一基材层在泡棉基体上的正投影以内；或者，可以是第一基材层在泡棉基体上的正投影位于导电浆料层在泡棉基体上的正投影以内。
这里对于上述导电浆料层的结构不做具体限定，示例性的，导电浆料层可以为单层，例如，导电浆料层可以为第一导电浆料层/第二导电浆料层；或者，导电浆料层可以为多层，例如，导电浆料层可以包括第一导电浆料层和第二导电浆料层。
本申请对于单层导电浆料层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，单层导电浆料层沿垂直于泡棉基体方向的厚度取值范围可以包括5-10μm，具体为，单层导电浆料层沿垂直于泡棉基体方向的厚度可以是5μm、6μm、7μm、8μm、9μm或者10μm等等。
本申请对于导电浆料层与第一基材层的关系不做具体限定，示例性的，导电浆料层与第一基材层可以分别为独立的膜层。作为一个示例，导电浆料层可以设置在第一基材层的任一侧；作为另一个示例，导电浆料层可以至少包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面。
或者，示例性的，导电浆料层与第一基材层不为独立的膜层。作为一个示例，导电浆料层除了至少包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面的表面以外，还可以渗入第一基材层内部。如图13所示，当第 一基材层是无纺布时，由于无纺布没有经纬线，只是将纺织短纤维或者长丝进行定向或随机排列形成纤网结构，那么将无纺布浸泡在导电浆料中，导电浆料可以至少包裹无纺布的两个表面、并渗入无纺布的孔隙中，以形成导电层。
本申请实施例提供的导电泡棉，通过设置第一基材层和导电浆料层，一方面，第一基材层具有弹性，可以很好的压缩或拉伸；另一方面，导电浆料具备一定的延展性、良好的导电性、较大的电阻率等性能，且导电浆料固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；同时，导电浆料烧结成层，体积缩小，能够使得导电浆料内部的PIM非常小；并且，导电浆料固化成导电浆料层时摊开，能够使得导电泡棉与电子设备中的结构的接触面积可以较大。
由此，本申请提供了一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
可选地，作为一种可实现的方式，如图9至图11所示，导电浆料层为第一导电浆料层21，第一导电浆料层21设置在第一基材层6远离泡棉基体1的一侧；导电层还包括第一粘结层，第一粘结层设置在第一基材层6和泡棉基体1之间，第一粘结层用于粘结第一基材层6与泡棉基体1、并在外界压力作用下发生变形。
本申请对于第一粘结层的类型不做具体限定，示例性的，第一粘结层可以为胶层、导电浆料层等。
如图9和图10所示，当第一粘结层为胶层5时，该胶层5的材料可以为热固胶。
如图11所示，当第一粘结层为导电浆料层时，该导电浆料层可以为第二导电浆料层22。
本申请对于第一粘结层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，第一粘结层沿垂直于泡棉基体方向的厚度取值范围可以包括1-2μm，具体为，第一粘结层沿垂直于泡棉基体方向的厚度可以是1μm、1.2μm、1.5μm、1.7μm、1.8μm或者2μm等等。
需要说明的是，当第一粘结层为第二导电浆料层时，沿垂直于泡棉基体的方向，本申请对于第二导电浆料层、第一基材层和第一导电浆料层构成的导电层的厚度取值范围不做具体限定，示例性的，该厚度取值范围可以包括10-20μm，具体为，第二导电浆料层、第一基材层和第一导电浆料层构成的导电层的厚度可以是10μm、13μm、15μm、16μm、18μm或者20μm等等。
需要说明的是，当导电层包覆泡棉基体的多个表面时，对于图9至图11中任一种导电泡棉而言，包覆泡棉基体不同表面的导电层的厚度可以部分相同；或者，包覆泡棉基体不同表面的导电层的厚度可以全部相同；或者，包覆泡棉基体不同表面的导电层的厚度可以都不同，这里不做具体限定。
本申请实施例提供的导电泡棉，通过第一粘结层可以将第一导电浆料层与泡棉基 体较好的粘结；同时，第一粘结层能够很好的压缩或拉伸，且第一粘结层沿垂直于泡棉基体方向的厚度较小，从而可以使得导电层沿垂直于泡棉基体方向的厚度较小，这样，能够使得导电泡棉在第一方向上工作高度较低；而且，第一粘结层不会影响第一导电浆料层中第一导电浆料的PIM等性能，从而可以得到一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
可选地，作为一种可实现的方式，如图13至图18所示，导电浆料层为第一导电浆料层21，第一导电浆料层21至少包裹第一基材层6靠近泡棉基体1一侧的表面、以及包裹第一基材层6远离泡棉基体1一侧的表面；导电层还包括第一粘结层，第一粘结层设置在第一导电浆料层21和泡棉基体1之间，第一粘结层用于粘结第一导电浆料层21和泡棉基体1、并在外界压力作用下发生变形。
应理解，上述第一导电浆料层至少包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面是指：第一导电浆料层可以仅包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面；或者，第一导电浆料层除了包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面以外，还可以包括第一基材层的其它表面；或者，第一导电浆料层除了包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面以外，还可以渗入第一基材层的内部，这里不做具体限定。
作为一个示例，当第一基材层为PI层时，第一导电浆料层可以包裹PI层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面。
作为另一个示例，当第一基材层为PI层时，第一导电浆料层可以包裹PI层的所有表面。
作为又一个示例，当第一基材层为无纺布时，第一导电浆料层可以包裹无纺布靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面。
作为再一个示例，当第一基材层为无纺布时，第一导电浆料层可以包裹无纺布的所有表面。
作为还一个示例，当第一基材层为无纺布时，第一导电浆料层可以包裹无纺布的所有表面、以及渗入无纺布的内部的孔隙中。此时，由于无纺布内部填充有第一导电浆料，使得无纺布在压缩或拉伸时不易撕裂。
需要说明的是，上述第一基材层在泡棉基体上的正投影与第一导电浆料层在泡棉基体上的正投影可以部分重合；或者，第一基材层在泡棉基体上的正投影与第一导电浆料层在泡棉基体上的正投影可以全部重合，这里不做具体限定。
本申请对于第一粘结层的类型不做具体限定，示例性的，第一粘结层可以为胶层、导电浆料层等。
如图13和图14、图17和图18所示，当第一粘结层为胶层5时，该胶层5的材料可以为热固胶。
如图15和图16所示，当第一粘结层为导电浆料层时，该导电浆料层可以为第二导电浆料层22。
本申请对于第一粘结层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，第一粘结层沿垂直于泡棉基体方向的厚度取值范围可以包括1-2μm，具体为，第一粘结层沿垂直于泡棉基体方向的厚度可以是1μm、1.2μm、1.5μm、1.7μm、1.8μm或者2μm等等。
需要说明的是，当第一粘结层为第二导电浆料层时，沿垂直于泡棉基体的方向，本申请对于第二导电浆料层、第一基材层和第一导电浆料层构成的导电层的厚度取值范围不做具体限定，示例性的，该厚度取值范围可以包括10-20μm，具体为，第二导电浆料层、第一基材层和第一导电浆料层构成的导电层的厚度可以是10μm、13μm、15μm、16μm、18μm或者20μm等等。
作为一个示例，图13和图14中，第一导电浆料层21包裹第一基材层6的所有表面、且与胶层5构成导电层，该导电层设置在泡棉基体1的部分第一表面11、部分第二表面12和全部第三表面13。
作为另一个示例，如图15所示，第一导电浆料层21包裹第一基材层6的所有表面、且与第二导电浆料层22构成导电层，该导电层设置在泡棉基体1的全部第一表面11、部分第二表面12和全部第三表面13。
作为又一个示例，如图16所示，第一导电浆料层21包裹第一基材层6的所有表面、且设置在泡棉基体1的全部第一表面11、部分第二表面12和全部第三表面13，同时，第二导电浆料层22设置在泡棉基体1的全部第一表面11和部分第二表面12，以构成导电层。
需要说明的是，第一，导电浆料层还可以包括第一导电浆料层和第二导电浆料层，其中，第一导电浆料层至少包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面，第二导电浆料层至少包裹第一导电浆料层靠近泡棉基体一侧的表面、以及包裹第一导电浆料层远离泡棉基体一侧的表面、且用于粘结第一导电浆料层和泡棉基体。
作为一个示例，第一导电浆料层包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面，第二导电浆料层包裹第一导电浆料层靠近泡棉基体一侧的表面、以及包裹第一导电浆料层远离泡棉基体一侧的表面。
作为另一个示例，第一导电浆料层包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面，第二导电浆料层包裹第一导电浆料层的所有表面。
作为又一个示例，第一导电浆料层包裹第一基材层的所有表面，第二导电浆料层包裹第一导电浆料层靠近泡棉基体一侧的表面、以及包裹第一导电浆料层远离泡棉基体一侧的表面。
作为再一个示例，第一导电浆料层包裹第一基材层的所有表面，第二导电浆料层包裹第一导电浆料层的所有表面，这里不做具体限定。
第二，导电浆料层还可以为第二导电浆料层，其中，第二导电浆料层至少包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面， 且第二导电浆料层用于与泡棉基粘结体。
作为一个示例，第二导电浆料层包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面。
作为另一个示例，第二导电浆料层包裹第一基材层的所有表面，这里不做具体限定。
第三，当导电层包覆泡棉基体的多个表面时，对于图13至图18中任一种导电泡棉而言，包覆泡棉基体不同表面的导电层的厚度可以部分相同；或者，包覆泡棉基体不同表面的导电层的厚度可以全部相同；或者，包覆泡棉基体不同表面的导电层的厚度可以都不同，这里不做具体限定。
本申请实施例提供的导电泡棉，通过第一导电浆料层至少包裹第一基材层靠近泡棉基体一侧的表面、以及包裹第一基材层远离泡棉基体一侧的表面，并通过第一粘结层可以将第一导电浆料层与泡棉基体较好的粘结；同时，第一粘结层能够很好的压缩或拉伸，且第一粘结层沿垂直于泡棉基体方向的厚度较小，从而可以使得导电层沿垂直于泡棉基体方向的厚度较小，这样，能够使得导电泡棉在第一方向上工作高度较低；而且，第一粘结层不会影响第一导电浆料层中第一导电浆料的PIM等性能，从而可以得到一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。该导电泡棉应用于电子设备时，可以使得电子设备的厚度减薄的同时，还可以使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
可选地，作为一种可实现的方式，如图17和图18所示，泡棉基体1的第一表面11至少分为第一区域Q1和第二区域Q2，沿垂直于泡棉基体1的方向，导电层位于第一区域Q1的部分的高度小于导电层位于第二区域Q2的部分的高度。
应理解，上述泡棉基体的第一表面至少分为第一区域和第二区域是指：泡棉基体的第一表面可以仅分为第一区域和第二区域；或者，泡棉基体的第一表面除了可以分为第一区域和第二区域以为，还可以划分有其它区域，例如，第三区域、第四区域等，这里不做具体限定。
本申请对于上述第一区域与第二区域的位置、面积关系等均不做具体限定，示例性的，第一区域与第二区域可以位于任一位置，其中，第一区域的面积可以大于第二区域的面积；或者，第一区域的面积可以小于第二区域的面积；或者，第一区域的面积可以等于第二区域的面积。
下面具体说明如何实现导电层位于第一区域的部分的高度小于导电层位于第二区域的部分的高度。
第一种，可以是，导电层位于第一区域的部分的结构与位于第二区域的部分的结构相同、但高度不同。
应理解，在导电层为单层的情况下，示例性的，在导电层为导电浆料层的情况下，例如，导电层为第一导电浆料层时，沿垂直于泡棉基体的方向，第一导电浆料层位于第一区域的部分的高度小于第一导电浆料层位于第二区域的部分的高度；又例如，导电层为第二导电浆料层时，沿垂直于泡棉基体的方向，第二导电浆料层位于第一区域 的部分的高度小于第二导电浆料层位于第二区域的部分的高度。
应理解，在导电层为多层的情况下，沿垂直于泡棉基体的方向，可以是导电层中的至少一层在第一区域的部分与在第二区域的部分的高度不同。
示例性的，在导电层包括第一粘结层、第一基材层和第一导电浆料层的情况下，沿垂直于泡棉基体的方向，可以是第一粘结层、第一基材层和第一导电浆料层中的至少一层在第一区域的部分与在第二区域的部分的高度不同。具体为，沿垂直于泡棉基体的方向，可以是第一粘结层在第一区域的部分与在第二区域的部分的高度不同、且第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一基材层在第一区域的部分与在第二区域的部分的高度不同、且第一粘结层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一导电浆料层在第一区域的部分与在第二区域的部分的高度不同、且第一粘结层和第一基材层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一粘结层和第一基材层在第一区域的部分与在第二区域的部分的高度不同、且第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一粘结层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度不同、且第一基材层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度不同、且第一粘结层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一粘结层、第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度均不同。
当然，导电层还可以包括其它的膜层，从而还可以有其它的多种设置方式，这里不做具体限定。
作为一个示例，在图17中，导电层位于第一区域Q1和第二区域Q2的部分均包括胶层5、第一基材层6和第一导电浆料层21。如图17所示，沿垂直于泡棉基体1的方向，胶层5和第一基材层6在第一区域Q1的高度与在第二区域Q2的高度相同、且第一导电浆料层21在第一区域Q1的高度小于在第二区域Q2的高度。
第二种，可以是，导电层位于第一区域的部分的结构与导电层位于第二区域的部分的结构不同、且高度不同。
应理解，在导电层为多层的情况下，沿垂直于泡棉基体的方向，可以是导电层中相同的层结构在第一区域的部分与在第二区域的部分的高度不同。
示例性的，当在第一区域的导电层包括第一粘结层、第一基材层和第一导电浆料层，且在第二区域的导电层包括第一粘结层、第一基材层、第一导电浆料层和第二基材层的情况下，沿垂直于泡棉基体的方向，可以是第一粘结层、第一基材层和第一导电浆料层中的至少一层在第一区域的部分与在第二区域的部分的高度不同。具体为，沿垂直于泡棉基体的方向，可以是第一粘结层在第一区域的部分与在第二区域的部分的高度不同、且第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一基材层在第一区域的部分与在第二区域的部分的高度不同、且第一粘结层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一导电浆料层在第一区域的部分与在第二区域的部分的高度不同、且第一粘结层和第一基材层在第一区域的部分与在第二区域的部分的高度相同； 或者，可以是第一粘结层和第一基材层在第一区域的部分与在第二区域的部分的高度不同、且第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一粘结层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度不同、且第一基材层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度不同、且第一粘结层在第一区域的部分与在第二区域的部分的高度相同；或者，可以是第一粘结层、第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度均不同。
当然，导电层还可以包括其它的膜层，从而还可以有其它的多种设置方式，这里不做具体限定。
应理解，在导电层为多层的情况下，沿垂直于泡棉基体的方向，可以是导电层中相同的层结构在第一区域的部分与在第二区域的部分的高度相同。
示例性的，当在第一区域的导电层包括第一粘结层、第一基材层和第一导电浆料层，且在第二区域的导电层包括第一粘结层、第一基材层、第一导电浆料层和第二基材层的情况下，沿垂直于泡棉基体的方向，可以是第一粘结层、第一基材层和第一导电浆料层在第一区域的部分与在第二区域的部分的高度相同。
当然，导电层还可以包括其它的膜层，从而还可以有其它的多种设置方式，这里不做具体限定。
作为一个示例，在图18中，导电层位于第一区域Q1的部分包括胶层5、第一基材层6和第一导电浆料层21，导电层位于第二区域Q2的部分包括胶层5、第一基材层6、第一导电浆料层21和第二基材层9。如图18所示，沿垂直于泡棉基体1的方向，位于第一区域Q1和第二区域Q2的胶层5、第一基材层6、第一导电浆料层21的高度相同，由此，第二基材层9使得导电层位于第一区域Q1的部分的高度小于导电层位于第二区域Q2的部分的高度。
本申请对于上述第二基材层的类型不做具体限定，示例性的，上述第二基材层可以包括聚酰亚胺层、无纺布等。
需要说明的是，第二基材层应当能够很好的压缩或拉伸，第二基材层的表面粗糙度适中、表面不能有划痕或者仅有非常少的划痕等。
本申请对于上述第二基材层沿垂直于泡棉基体方向的厚度不做具体限定，示例性的，第二基材层沿垂直于泡棉基体方向的厚度取值范围可以包括1-2μm，具体为，第二基材层沿垂直于泡棉基体方向的厚度可以是1μm、1.2μm、1.5μm、1.7μm、1.8μm或者2μm等等。
需要说明的是，第一，上述第二基材层还可以替换为其它任意的结构，例如，第二基材层和至少包裹第二基材层靠近泡棉基体一侧的表面、以及包裹第二基材层远离泡棉基体一侧的表面的第一导电浆料层等，这里不做具体限定。
第二，沿垂直于泡棉基体的方向，若通过设置导电浆料层在第一区域的高度小于导电浆料层在第二区域的高度，以实现导电层在第一区域的高度小于导电层在第二区域的高度时，由于导电浆料层仅能喷涂/印刷较薄的高度，由此，适用于实现导电层在第一区域的高度与导电层在第二区域的高度的段差较小的情形，示例性的，导电层在 第一区域的高度与导电层在第二区域的高度的段差的取值范围可以包括28-32μm，具体为，导电层在第一区域的高度与导电层在第二区域的高度的段差可以是28μm、29μm、30μm、31μm或者32μm等等。
若要实现导电层在第一区域的高度与导电层在第二区域的高度的段差较大，可以通过设置导电层中任意一层在第一区域的高度与在第二区域的高度不同；或者，可以通过在第二区域设置其它膜层结构等，这里不做具体限定。
本申请实施例提供的导电泡棉，沿垂直于泡棉基体的方向，通过设置导电层在第一区域的高度与导电层在第二区域的部分的高度不同，这样应用于电子设备中时，导电泡棉至少可以与高度不同的两个结构进行电连接，丰富了导电泡棉在电子设备中的应用。
可选地，作为一种可实现的方式，如图3至图6、如图9至图11、图12至图19所示，泡棉基体1的形状为多面体，多面体至少包括相连的第一表面11、第二表面12和第三表面13；导电层至少包覆第一表面11、第二表面12和第三表面13。
应理解，上述多面体的所有表面中，至少一个表面用于通过导电层与电子设备中的结构电连接。
示例性的，可以是多面体的第一表面用于通过导电层与电子设备中的第一结构电连接，而其它表面不用于通过导电层与电子设备中的结构电连接；或者，可以是多面体的第一表面用于通过导电层与电子设备中的第一结构电连接、且第二表面用于通过导电层与电子设备中的第二结构电连接，而其它表面均不用于通过导电层与电子设备中的结构电连接，当然，还可以是其它方式，这里不做具体限定。
本申请对于上述多面体不做具体限定，示例性的，多面体可以包括规则多面体或者非规则多面体。在泡棉基体的形状为规则多面体的情况下，规则多面体可以包括立方体、六面体、八面体等。
应理解，上述多面体至少包括相连的第一表面、第二表面和第三表面是指：多面体可以仅包括相连的第一表面、第二表面和第三表面；或者，多面体除了包括相连的第一表面、第二表面和第三表面，还可以包括第四表面、第五表面、第六表面等，这里不做具体限定。
应理解，上述导电层至少包覆第一表面、第二表面和第三表面是指：导电层可以仅包覆第一表面、第二表面和第三表面；或者，导电层除了包覆第一表面、第二表面和第三表面以外，还可以包覆第四表面、第五表面、第六表面等，这里不做具体限定。
下面以泡棉基体的形状为六面体，对导电层包覆泡棉基体的情况进行具体示例：
作为一个示例，在图3至图6、如图9至图11中，六面体包括第一表面11(上表面)、第二表面12(下表面)、第三表面13(左表面)、第四表面14(右表面)、第五表面(图中未标注，前表面)和第六表面(图中未标注，后表面)。如图3至图6、如图9至图11所示，导电层2包覆全部第一表面11(上表面)、全部第二表面12(下表面)、全部第三表面13(左表面)和全部第四表面14(右表面)。
作为另一个示例，在图13至图18中，六面体包括第一表面11(上表面)、第二表面12(下表面)、第三表面13(左表面)、第四表面14(右表面)、第五表面(图 中未标注，前表面)和第六表面(图中未标注，后表面)。如图13至图18所示，导电层包覆至少部分第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)。
作为又一个示例，在图19中，六面体包括第一表面11(上表面)、第二表面12(下表面)、第三表面13(左表面)、第四表面14(右表面)、第五表面(图中未标注，前表面)和第六表面(图中未标注，后表面)。如图19所示，导电层包覆全部第一表面11(上表面)、部分第二表面12(下表面)、全部第三表面13(左表面)和全部第四表面14(右表面)。
需要说明的是，在泡棉基体的形状为六面体的情况下，对于上述第一表面、第二表面、第三表面、第四表面、第五表面和第六表面的位置不做具体限定，示例性的，可以如图3至图6、如图9至图11、图13至图19所示，第一表面11为上表面、第二表面12为下表面、第三表面13为左表面、第四表面14为右表面、第五表面为前表面和第六表面为后表面；或者，可以是第一表面为上表面、第二表面为左表面、第三表面为右表面、第四表面为下表面、第五表面为前表面和第六表面为后表面，当然，还可以是其它情形，具体以实际应用为准。
本申请实施例提供的导电泡棉，泡棉基体至少包括相连的第一表面、第二表面和第三表面，导电层至少包覆泡棉基体的第一表面、第二表面和第三表面，这样在实际应用时，能够确保导电泡棉与电子设备中的结构电连接时，导电泡棉中的导电层是导通的，并可以提供多种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉，丰富了导电泡棉在电子设备中的应用。
可选地，作为一种可实现的方式，如图13至图18所示，多面体包括第一表面11、第二表面12和第三表面13，第一表面11与第二表面12相对设置、且第一表面11通过第三表面13与第二表面12相连；导电层包覆多面体的至少部分第一表面11、至少部分第二表面12和全部第三表面13。
应理解，上述导电层包覆多面体的至少第一表面、至少部分第二表面和全部第三表面是指：导电层可以包覆多面体的部分第一表面、部分第二表面和全部第三表面；或者，导电层可以包覆多面体的部分第一表面、全部第二表面和全部第三表面；或者，导电层可以包覆多面体的全部第一表面、部分第二表面全和部第三表面；或者，导电层可以包覆多面体的全部第一表面、全部第二表面和全部第三表面，这里不做具体限定。
作为一个示例，如图13所示，第一导电浆料层21、第一基材层6和胶层5构成的导电层包覆六面体的部分第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)，从而可以构成类“C”型的导电层。
需要说明的是，在图13中，导电泡棉05还包括第二粘结层7，第二粘结层7可以设置在泡棉基体1的至少部分第二表面12、且与胶层5和第一导电浆料层21均相连。
当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第一粘结层和第一导电浆料层均间隔设置，这里不做具体限定。其中，第二粘结层可以使得导电 泡棉与电子设备中的结构粘结，这里对于第二粘结层的类型不做具体限定，示例性的，第二粘结层可以包括背胶，该背胶可以包括导电胶、绝缘胶等中的任一种。
作为另一个示例，如图14所示，第一导电浆料层21、第一基材层6和胶层5构成的导电层包覆六面体的部分第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)，从而可以构成类“C”型的导电层。
需要说明的是，在图14中，导电泡棉05还可以包括第二粘结层7和异色聚对苯二甲酸乙二酯(polyethylene terephthalate，PET)层8。
如图14所示，第二粘结层7可以设置在泡棉基体1的至少部分第二表面12、且与胶层5和第一导电浆料层21相连。当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第一粘结层和第一导电浆料层均间隔设置，这里不做具体限定。
如图14所示，异色PET层8设置在泡棉基体1的部分第一表面11(上表面)、且与胶层5和第一导电浆料层21相连。当然，异色PET层还可以设置在泡棉基体的至少部分第一表面、且与第一粘结层和第一导电浆料层间隔均设置，这里不做具体限定。
需要说明的是，上述异色PET层可以具有颜色，这样，一方面能够清晰的标识出导电泡棉具有异色PET层的一侧与电子设备中的结构电连接，更有利于防呆；另一方面，若电子设备中的结构与导电泡棉之间具有段差，还可以通过异色PET层填补该段差。
作为又一个示例，如图15所示，第一导电浆料层21、第一基材层6和第二导电浆料层22构成的导电层包覆六面体的全部第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)，从而构成类“C”型的导电层。
需要说明的是，第一，在图15中，导电泡棉05还可以包括第二粘结层7，第二粘结层7设置在泡棉基体1的至少部分第二表面12、且与第二导电浆料层22和第一导电浆料层21均相连。当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第二导电浆料层和第一导电浆料层均间隔设置，这里不做具体限定。
第二，第一导电浆料层、第一基材层和第二导电浆料层构成的导电层还可以仅包覆泡棉基体的部分第一表面，此时泡棉基体的第一表面未设置有导电层的部分可以不设置任何结构，也可以设置例如异色PET层等结构，这里不做具体限定。
作为再一个示例，如图16所示，第一导电浆料层21和第一基材层6包覆六面体的全部第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)，第二导电浆料层22仅包覆六面体的全部第一表面11(上表面)和部分第二表面12(下表面)，从而构成类“C”型的导电层。
需要说明的是，第一，在图16中，导电泡棉05还包括第二粘结层7，第二粘结层7设置在泡棉基体1的至少部分第二表面12、且与第二导电浆料层22和第一导电浆料层21均相连。当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第二导电浆料层和第一导电浆料层均间隔设置，这里不做具体限定。
第二，第一导电浆料层、第一基材层和第二导电浆料层构成的导电层还可以仅包覆泡棉基体的部分第一表面，此时泡棉基体的第一表面未设置有导电层的部分可以不设置任何结构，也可以设置例如异色PET层等结构，这里不做具体限定。
作为还一个示例，如图17所示，第一导电浆料层21、第一基材层6和胶层5构成的导电层包覆六面体的全部第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)，从而构成类“C”型的导电层；同时，沿垂直于泡棉基体1的方向，第一导电浆料层21在第一区域Q1的高度小于第一导电浆料层21在第二区域Q2的高度。
需要说明的是，在图17中，导电泡棉05还包括第二粘结层7，第二粘结层7设置在泡棉基体1的至少部分第二表面12、且与胶层5和第一导电浆料层21均相连。当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第一粘结层和第一导电浆料层间隔设置，这里不做具体限定。
作为还一个示例，如图18所示，第一导电浆料层21、第一基材层6和胶层5构成的导电层包覆六面体的全部第一表面11(上表面)、部分第二表面12(下表面)和全部第三表面13(左表面)，且第二基材层9位于六面体的部分第一表面11(上表面)，从而构成类“C”型的导电层；同时，沿垂直于泡棉基体1的方向，第一导电浆料层21、第一基材层6和胶层5在第一区域Q1的高度等于第一导电浆料层21、第一基材层6和胶层5在第二区域Q2的高度。
需要说明的是，在图18中，导电泡棉05还包括第二粘结层7，第二粘结层7设置在泡棉基体1的至少部分第二表面12、且与胶层5和第一导电浆料层21均相连。当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第一粘结层和第一导电浆料层间隔设置，这里不做具体限定。
应理解，上述六面体的第一表面、第二表面、第三表面、第四表面、第五表面和第六表面还可以位于六面体的其它位置，例如，还可以是第一表面为上表面、第二表面为左表面、第三表面为右表面、第四表面为下表面、第五表面为前表面和第六表面为后表面，此时当导电层包覆六面体的至少部分第一表面、至少部分第二表面和全部第三表面时，导电层构成类倒“U”型的导电层。
又例如，还可以是第一表面为下表面、第二表面为左表面、第三表面为右表面、第四表面为上表面、第五表面为前表面和第六表面为后表面，此时当导电层包覆六面体的至少部分第一表面、至少部分第二表面和全部第三表面时，导电层构成类“U”型的导电层。
再例如，还可以是第一表面为上表面、第二表面为下表面、第三表面为右表面、第四表面为左表面、第五表面为前表面和第六表面为后表面，此时当导电层包覆六面体的至少部分第一表面、至少部分第二表面和全部第三表面时，导电层构成类型的导电层。
当然对应其它的第一表面、第二表面、第三表面、第四表面、第五表面和第六表面的位置，导电层还可以构成其它的结构，这里不做具体限定。
本申请实施例提供的导电泡棉，一方面，通过泡棉基体的第一表面与第二表面相对设置、且第一表面通过第三表面与第二表面相连，又设置导电层包覆多面体的至少部分第一表面、全部第三表面和至少部分第二表面，从而可以构成类“C”型的导电层；另一方面，该导电泡棉应用于电子设备中时，可以保证导电泡棉的方向性，从而进行识别防呆的同时，还能够使得电子设备的厚度减薄，并使得导电泡棉与电子设备 中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的定向电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
可选地，作为一种可实现的方式，如图3至图6、图9至图11、图19所示，多面体包括第一表面11、第二表面12、第三表面13和第四表面14，第一表面11与第二表面12相对设置、且第三表面13与第四表面14相对设置，第一表面11分别通过第三表面13和第四表面14与第二表面12相连，导电层包覆全部第一表面11、至少部分第二表面12、全部第三表面13和全部第四表面14。
应理解，上述导电层包覆全部第一表面、全部第三表面、全部第四表面和至少部分第二表面是指：导电层包覆全部第一表面、全部第三表面、全部第四表面和部分第二表面；或者，导电层包覆全部第一表面、全部第三表面、全部第四表面和全部第二表面，这里不做具体限定。
作为一个示例，如图3至图6、图9至图11所示，导电层2包覆六面体的全部第一表面11(上表面)、全部第二表面12(下表面)、全部第三表面13(左表面)和全部第四表面14(右表面)。
作为另一个示例，如图19所示，导电层包覆六面体的全部第一表面11(上表面)、部分第二表面12(下表面)、全部第三表面13(左表面)、和全部第四表面14(右表面)，从而可以构成类型的导电层。
需要说明的是，第一，在图19中，导电泡棉05还包括第二粘结层7，第二粘结层7设置在泡棉基体1的至少部分第二表面12、且与第二导电浆料层22间隔设置。当然，第二粘结层还可以设置在泡棉基体的至少部分第二表面、且与第二导电浆料层相连，这里不做具体限定。
第二，本申请实施例的导电层不限定为第二导电层，还可以为其它任一种结构，例如，导电层可以为第一粘结层、第一基材层和第一导电浆料层等，具体的设置方式可以参考上述实施例，以及第二粘结层的设置也可以参考上述与第二导电浆料层，这里不再赘述。
应理解，上述六面体的第一表面、第二表面、第三表面、第四表面、第五表面和第六表面还可以位于六面体的其它位置，例如，还可以是第一表面为下表面、第二表面为左表面、第三表面为上表面、第四表面为右表面、第五表面为前表面和第六表面为后表面，此时当导电层包覆六面体的包覆全部第一表面、至少部分第二表面、全部第三表面和全部第四表面时，导电层构成类“D”型的导电层。
又例如，还可以是第一表面为左表面、第二表面为上表面、第三表面为右表面、第四表面为下表面、第五表面为前表面和第六表面为后表面，此时当导电层包覆六面体的包覆全部第一表面、至少部分第二表面、全部第三表面和全部第四表面时，导电层构成类型的导电层。
再例如，还可以是第一表面为上表面、第二表面为右表面、第三表面为下表面、第四表面为左表面、第五表面为前表面和第六表面为后表面，此时当导电层包覆六面体的包覆全部第一表面、至少部分第二表面、全部第三表面和全部第四表面时，导电层构成类型的导电层。
当然对应其它的第一表面、第二表面、第三表面、第四表面、第五表面和第六表面的位置，导电层还可以构成其它的结构，这里不做具体限定。
一方面，通过泡棉基体的第一表面与第二表面相对设置、且第一表面通过第三表面与第二表面相连，又设置导电层包覆多面体的至少部分第一表面、全部第三表面和至少部分第二表面，从而可以构成类型的导电层；另一方面，该导电泡棉应用于电子设备中时，可以保证导电泡棉的方向性，从而进行识别防呆的同时，还能够使得电子设备的厚度减薄，并使得导电泡棉与电子设备中的结构的接触界面之间的PIM较小；此外，能够通过导电泡棉实现电子设备中的结构的定向电连接，并减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
以上仅介绍与发明点相关的内容，其余结构可以参考相关技术获取，这里不再详细说明。
本申请实施例还提供一种电子设备，该电子设备包括上述的导电泡棉。
本申请实施例提供的电子设备，由于包括在第一方向上工作高度较低、PIM较小、应力较低的导电泡棉，该电子设备的厚度能够有效的减薄，同时，该电子设备中的结构与导电泡棉的接触界面之间的PIM可以较小；并且，该电子设备能够减小或消除辐射杂散干扰等，有效提升了电子设备的性能。
下面以导电泡棉的形状为六面体，具体说明导电泡棉在电子设备中的多种应用。
可选地，如图20和图21所示，电子设备中的第一结构至少包括摄像组件，摄像组件用于在转动时与导电泡棉保持电连接。
本申请对于上述摄像组件不做具体限定，示例性的，摄像组件可以包括摄像头等。
在摄像组件为摄像头的情况下，该摄像头可以包括前置摄像头、后置摄像头。其中，前置摄像头可以设置在显示模组远离中框的一侧；后置摄像头可以设置在后壳远离中框的一侧，具体以实际应用为准。
应理解，上述电子设备中的第一结构至少包括摄像组件是指：电子设备中的第一结构可以仅包括摄像组件；或者，电子设备中的第一结构除包括摄像组件以外，还可以包括其它结构，这里不做具体限定。
图22和图23分别示出了相关技术中的前置摄像头501与屏蔽盖502电连接的结构示意图。
如图22所示，前置摄像头501的基板507通过导电布503与屏蔽盖502电连接，屏蔽盖502与PCB504电连接，导致回流到PCB504的接地(GND)路径较长，无法有效改善电子设备的电磁屏蔽等问题。
如图23所示，前置摄像头501的基板507通过导电布503、支架钢片505与屏蔽盖502电连接，可能导致前置摄像头501的基板507没有空间放置螺钉506来保证支架钢片505和基板507的间距。
此时，若使用单面导电胶来保证支架钢片505和基板507的间距，可能存在无法接触的问题；若使用双面导电胶来保证支架钢片505和基板507的间距，拆卸支架钢片505的同时可能损坏前置摄像头501。并且，若支架钢片505为嵌件注塑支架钢片， 虽然在支架钢片505附近有螺钉506，但嵌件注塑支架钢片可能导致封胶边缘溢胶，若再在支架钢片505和导电胶之间形成绝缘层，可能导致接触不充分或无法接触等问题。
为了解决上述问题，可以考虑通过设置导电泡棉实现摄像组件例如摄像头与屏蔽盖等结构电连接。
然而，相关技术中的导电泡棉常常由于工作高度较高等问题，导致无法放置在摄像头附近。
因此，本申请实施例提供的在第一方向上工作高度较低、且应力和PIM均较小的导电泡棉能够很好的实现摄像头与其它结构的电连接，且能够改善电子设备中的电磁屏蔽等问题。
图20示出了本申请实施例的导电泡棉05用于将前置摄像头501与屏蔽盖502电连接的示意图。图22示出了本申请实施例的导电泡棉05用于将后置摄像头508与屏蔽盖502电连接的示意图。
如图20所示，前置摄像头501的基板507通过导电泡棉05与屏蔽盖502电连接，屏蔽盖502与PCB504通过螺钉506固定连接。
如图21所示，中框102和后置摄像头508的基板509通过导电泡棉05电连接，屏蔽盖502和支架钢片505通过导电泡棉05电连接，后置摄像头508的基板509还与PCB504通过螺钉506固定连接。
本申请实施例提供的电子设备，一方面，将摄像组件例如摄像头与导电泡棉电连接，由于导电泡棉在第一方向上的工作高度较低，因此能够置于摄像头与其它结构之间；当摄像头向任意方向转动的过程中，由于导电泡棉可以很好的压缩或拉伸，因此摄像头始终能够与导电泡棉保持电连接，保证了电子设备的性能；另一方面，由于导电泡棉是独立的结构，可分离，那么例如在需要更换导电泡棉时，无需拆卸电子设备，造成电子设备整体报废；又一方面，导电泡棉能够有效吸收与电子设备的结构电连接时存在的公差，从而避免出现接触不良；再一方面，导电泡棉可以使得接地(GND)路径较短；同时，若出现溢胶等问题，导电泡棉也可以通过应变来改善。由此，本申请实施例的电子设备的性能得到了大幅的提升。
可选地，在图24的电子设备中，如图24所示，泡棉基体1的第一表面11通过导电层与显示屏111电连接，泡棉基体1的第二表面12通过导电层与中框102连接。
由此，泡棉基体中的第一表面、第二表面与电子设备中的结构电连接，从而使得导电泡棉能够沿第二方向和第三方向分别导通，其中，可以设置第二方向与第三方向垂直。
本申请实施例提供的电子设备，通过导电泡棉分别实现与显示屏和中框的电连接，能够有效的减小导电泡棉与天线的接触界面之间的应力、以及导电泡棉与中框的接触界面之间的应力，有效的提升了电子设备的性能。
可选地，在图25的电子设备中，如图25所示，泡棉基体1的第一表面11通过导电层与簧片108电连接、且泡棉基体1的第二表面12通过导电层与PCB504电连接。
由此，泡棉基体中的两个表面与电子设备中的结构电连接，从而使得导电泡棉能够沿第二方向和第三方向分别导通，其中，可以设置第二方向与第三方向垂直。
需要说明的是，图25中的PCB504可以替换为显示屏、电池盖、装饰件等结构。
图25中的中框102可以为金属中框，金属中框外围包裹一圈防氧化层110。
如图25所示，中框102与簧片108接触的表面可以进行镭雕处理，形成镭雕面109。
本申请实施例提供的电子设备，一方面，通过导电泡棉实现了簧片与PCB的电连接，能够有效的减小导电泡棉与簧片的接触界面之间的PIM、以及导电泡棉与PCB的接触界面之间的PIM，有效的提升了电子设备的性能；另一方面，当导电泡棉的一侧为显示屏时，导电泡棉不会回弹造成界面损伤，例如，屏幕膜印等，进一步提升了电子设备的性能。
可选地，在图26的电子设备中，如图26所示，泡棉基体1的第一表面11通过导电层与簧片108电连接，泡棉基体1的第二表面12通过导电层与PCB504电连接。
由此，泡棉基体中的两个表面与电子设备中的结构电连接，从而使得导电泡棉能够沿第二方向和第三方向分别导通。
需要说明的是，如图26所示，电子设备还可以包括天线105、中框102和塑胶107，天线105和中框102承载于塑胶107的一侧。
天线105靠近簧片108的一侧表面可以进行镭雕处理，形成镭雕面109。
天线105外围可以包裹一圈防氧化层110。
本申请实施例提供的电子设备，通过导电泡棉实现了簧片与PCB的电连接，能够有效的减小导电泡棉与簧片的接触界面之间的PIM、以及导电泡棉与PCB的接触界面之间的PIM，有效的提升了电子设备的性能。
可选地，在图27的电子设备中，如图27所示，泡棉基体1的第一表面11和第二表面12通过导电层与天线105电连接，泡棉基体1的第一表面11还通过导电层与中框102电连接，泡棉基体的一个表面与绝缘材料层106连接。
由此，泡棉基体中的第一表面、第二表面分别与电子设备中的多个结构电连接，从而使得导电泡棉能够沿多个方向导通。
需要说明的是，如图27所示，电子设备还可以包括塑胶107，天线105和中框102承载于塑胶107的一侧。
与绝缘材料层连接的泡棉基体的表面可以设置第一子导电层，也可以不设置第一子导电层，这里不做具体限定。
本申请实施例提供的电子设备，通过导电泡棉实现了天线与中框的电连接，能够有效的减小导电泡棉与天线的接触界面之间的PIM、以及导电泡棉与中框的接触界面之间的PIM，有效的提升了电子设备的性能。
可选地，在图28的电子设备中，如图28所示，泡棉基体1的第一表面11和第三表面13分别通过导电层与天线105电连接，泡棉基体1的第一表面11和第四表面14 分别通过导电层与中框102电连接，泡棉基体1的第二表面12通过导电层与PCB504电连接。
由此，泡棉基体的第一表面、第二表面、第三表面和第四表面分别与电子设备中的多个结构电连接，从而使得导电泡棉能够沿多个方向导通。
需要说明的是，如图28所示，电子设备还可以包括塑胶107，天线105和中框102承载于塑胶107的一侧。
本申请实施例提供的电子设备，通过导电泡棉实现了天线、中框、PCB的电连接，能够有效的减小导电泡棉与天线的接触界面之间的PIM、导电泡棉与中框的接触界面之间的PIM、以及导电泡棉与PCB的接触界面之间的PIM，有效的提升了电子设备的性能。
可选地，在图29的电子设备中，如图29所示，泡棉基体1的第一表面11通过导电层与天线105、中框102分别电连接，泡棉基体1的一个表面还与绝缘材料层106连接。
由此，泡棉基体中仅第一表面与电子设备中的结构电连接，从而使得导电泡棉能够沿第二方向导通。
图29所示的电子设备中的天线105与中框102沿垂直于泡棉基体方向的高度不同。
如图29所示，电子设备还可以包括塑胶107，天线105和中框102承载于塑胶107的一侧。
与绝缘材料层连接的泡棉基体的表面可以设置第一子导电层，也可以不设置第一子导电层，这里不做具体限定。
本申请实施例提供的电子设备，一方面，通过导电泡棉实现了天线与中框的电连接，能够有效的减小导电泡棉与天线的接触界面之间的PIM、以及导电泡棉与中框的接触界面之间的PIM，有效的提升了电子设备的性能；另一方面，由于天线与中框沿垂直于泡棉基体方向的高度不同，从而使得一个导电泡棉就实现了与电子设备中的不同高度的结构的电连接，丰富了导电泡棉的应用。
本申请实施例提供一种导电泡棉的制作方法。
如图30所示，该制作方法包括：
S1、提供泡棉基体。
S2、在泡棉基体的至少第一表面形成导电层。
其中，第一表面用于通过导电层与电子设备中的第一结构电连接，导电层至少包括导电浆料层，导电浆料层用于在外界压力作用下发生变形。
本申请对于上述导电层的制作工艺不做具体限定，作为一个示例，当导电层仅包括导电浆料层时，可以先在泡棉基体表面采用喷涂、印刷、喷镀、真空镀等方法形成导电浆料，再对导电浆料进行烘烤/加热固化，以形成导电浆料层。
作为另一个示例，当导电层包括导电浆料层和第一基材层时，可以先在第一基材层的至少一个表面采用喷涂、印刷等方法形成导电浆料，再对导电浆料进行烘烤/加热固化，以形成第一基材层和导电浆料层。
作为又一个示例，当导电层包括导电浆料层和第一基材层时，可以先将第一基材置于导电浆料中浸泡，再对导电浆料进行烘烤/加热固化，以形成第一基材层和导电浆料层。
本申请实施例提供的导电泡棉的制作方法，一方面，通过喷涂、印刷、喷镀、真空镀、浸渍等方式形成导电浆料，并烘烤/加热固化形成导电浆料层，简单易实现；另一方面，导电浆料层中的导电浆料具备一定的延展性、良好的导电性、较大的电阻率(10-5-10-4Ω×cm)等性能，且导电浆料在成膜前呈液态，固化过程中体积会缩小，从而使得导电泡棉表现出良好导电性的同时，还能够在压力作用下发生变形，结合泡棉基体的弹性，能够使得导电泡棉在第一方向上工作高度较低；又一方面，导电浆料烧结成层，体积缩小以保证多个导电粒子之间的接触力，从而使得导电浆料内部的PIM非常小；再一方面，导电浆料固化成导电浆料层时，导电浆料中的导电粒子摊开，从而使得导电泡棉与电子设备中的结构的接触面积可以较大。
下面具体说明本申请中多种结构的导电泡棉的制作方法。
作为示例，图3和图4所示的导电泡棉的制作方法包括：
S11、在泡棉基体1的全部第一表面11、全部第二表面12、全部第三表面13和全部第四表面14印刷第一导电浆料。
S12、烘烤固化，形成第一导电浆料层21。
本申请实施例提供的导电泡棉的制作方法，一方面，印刷第一导电浆料，并烘烤/加热固化形成第一导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图5和图6所示的导电泡棉的制作方法包括：
S21、在泡棉基体1的全部第一表面11、全部第二表面12、全部第三表面13和全部第四表面14喷涂第二导电浆料。
S22、烘烤固化，形成第二导电浆料层22。
本申请实施例提供的导电泡棉的制作方法，一方面，喷涂第二导电浆料，并烘烤/加热固化形成第二导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图9和图10所示的导电泡棉的制作方法包括：
S31、在泡棉基体1的全部第一表面11、全部第二表面12、全部第三表面13和全部第四表面14形成胶层5。
S32、在胶层5靠近第一表面11、第二表面12、第三表面13和第四表面14的表面形成第一基材层6。
S33、在第一基材层6靠近第一表面11、第二表面12、第三表面13和第四表面14的表面印刷第一导电浆料。
S34、烘烤固化，形成第一导电浆料层21。
需要说明的是，还可以不在泡棉基体的全部第一表面、全部第二表面、全部第三表面和全部第四表面形成胶层，而是直接在泡棉基体的全部第一表面、全部第二表面、全部第三表面和全部第四表面形成第一基材层；再在第一基材层靠近第一表面、第二表面、第三表面和第四表面的表面印刷第一导电浆料；烘烤固化，形成第一导电浆料层。
本申请实施例提供的导电泡棉的制作方法，一方面，印刷第一导电浆料，并烘烤/加热固化形成第一导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图11所示的导电泡棉的制作方法包括：
S41、在泡棉基体1的全部第一表面11、全部第二表面12、全部第三表面13和全部第四表面14喷涂第二导电浆料。
S42、在第二导电浆料的表面形成第一基材层6。
S43、在第一基材层6的表面印刷第一导电浆料。
S44、烘烤固化，形成第二导电浆料层22和第一导电浆料层21。
本申请实施例提供的导电泡棉的制作方法，一方面，喷涂第二导电浆料、印刷第一导电浆料，并烘烤/加热固化形成第一导电浆料层和第二导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图13所示的导电泡棉的制作方法包括：
S51、在泡棉基体1的部分第一表面11、部分第二表面12和全部第三表面13形成胶层5。
S52、将第一基材层6浸泡于第一导电浆料中，形成具有包裹第一基材层6所有表面的第一导电浆料的第一中间层。
S53、在胶层5靠近第一表面11、第二表面12和第三表面13的表面形成第一中间层。
S54、烘烤固化，形成包裹第一基材层6所有表面的第一导电浆料层21。
S55、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与胶层5和第一导电浆料层21均相连。
本申请对于上述步骤S51与步骤S52的顺序不做具体限定，示例性的，可以先进行步骤S51、再进行步骤S52；或者，可以先进行步骤S52、再进行步骤S51；或者，可以同时进行步骤S51和步骤S52。
需要说明的是，制作方法还可以包括：
S051、将第一基材层置于第二导电浆料中浸泡，形成具有包裹第一基材层所有表面的第二导电浆料的第二中间层。
S052、在泡棉基体的部分第一表面、部分第二表面和全部第三表面形成第二中间层。
S053、烘烤固化，形成包裹第一基材层所有表面的第二导电浆料层。
S054、在泡棉基体的部分第二表面形成第二粘结层。
其中，第二粘结层与第二导电浆料层相连。
本申请实施例提供的导电泡棉的制作方法，一方面，将第一基材层浸渍于导电浆料中，并烘烤/加热固化形成包裹第一基材层所有表面的导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图14所示的导电泡棉的制作方法包括：
S61、在泡棉基体1的部分第一表面11、部分第二表面12和全部第三表面13形成胶层5。
S62、将第一基材层6浸泡于第一导电浆料中，形成具有包裹第一基材层6所有表面的第一导电浆料的第一中间层。
S63、在胶层5靠近第一表面11、第二表面12和第三表面13的表面形成第一中间层。
S64、烘烤固化，形成包裹第一基材层6所有表面的第一导电浆料层21。
S65、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与胶层5和第一导电浆料层21均相连。
S66、在泡棉基体1的部分第一表面11形成异色PET层8。
其中，异色PET层8与胶层5和第一导电浆料层21均相连。
本申请对于上述步骤S61与步骤S62的顺序不做具体限定，示例性的，可以先进行步骤S61、再进行步骤S62；或者，可以先进行步骤S62、再进行步骤S61；或者，可以同时进行步骤S61和步骤S62。
需要说明的是，制作方法还可以包括：
S061、将第一基材层置于第二导电浆料中浸泡，形成具有包裹第一基材层所有表面的第二导电浆料的第二中间层。
S062、在泡棉基体的部分第一表面、部分第二表面和全部第三表面形成第二中间层。
S063、烘烤固化，形成包裹第一基材层所有表面的第二导电浆料层。
S064、在泡棉基体的部分第二表面形成第二粘结层。
其中，第二粘结层与第二导电浆料层相连。
S065、在泡棉基体的部分第一表面形成异色PET层。
其中，异色PET层与第二导电浆料层相连。
本申请实施例提供的导电泡棉的制作方法，一方面，将第一基材层浸渍于导电浆料中，并烘烤/加热固化形成包裹第一基材层所有表面的导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图15所示的导电泡棉的制作方法包括：
S71、在泡棉基体1的全部第一表面11、部分第二表面12和全部第三表面13喷涂第二导电浆料。
S72、将第一基材层6置于第一导电浆料中浸泡，形成具有包裹第一基材层6所有表面的第一导电浆料的第一中间层。
S73、在第二导电浆料靠近第一表面11、第二表面12和第三表面13的表面形成第一中间层。
S74、烘烤固化，形成第二导电浆料层22和包裹第一基材层6所有表面的第一导电浆料层21。
S75、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与第二导电浆料层22和第一导电浆料层21均相连。
本申请对于上述步骤S71与步骤S72的顺序不做具体限定，示例性的，可以先进行步骤S71、再进行步骤S72；或者，可以先进行步骤S72、再进行步骤S71；或者，可以同时进行步骤S71和步骤S72。
需要说明的是，制作方法还可以包括：
S071、将第一基材层置于第二导电浆料中浸泡，形成具有包裹第一基材层所有表面的第二导电浆料的第二中间层。
S072、在泡棉基体的全部第一表面、部分第二表面和全部第三表面形成第二中间层。
S073、烘烤固化，形成包裹第一基材层所有表面的第二导电浆料层。
S074、在泡棉基体的部分第二表面形成第二粘结层。
其中，第二粘结层与第二导电浆料层相连。
本申请实施例提供的导电泡棉的制作方法，一方面，将第一基材层浸渍于导电浆料中，并烘烤/加热固化形成包裹第一基材层所有表面的导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图16所示的导电泡棉的制作方法包括：
S81、在泡棉基体1的全部第一表面11和部分第二表面12喷涂第二导电浆料。
S82、将第一基材层6置于第一导电浆料中浸泡，形成具有包裹第一基材层6所有表面的第一导电浆料的第一中间层。
S83、在第二导电浆料靠近第一表面11和第二表面12的表面、以及泡棉基体的第三表面13形成第一中间层。
S84、烘烤固化，形成第二导电浆料层22和包裹第一基材层6所有表面的第一导电浆料层21。
S85、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与第二导电浆料层22和第一导电浆料层21均相连。
本申请对于上述步骤S81与步骤S82的顺序不做具体限定，示例性的，可以先进行步骤S81、再进行步骤S82；或者，可以先进行步骤S82、再进行步骤S81；或者，可以同时进行步骤S81和步骤S82。
本申请实施例提供的导电泡棉的制作方法，一方面，涂覆第二导电浆料，以及将第一基材层浸渍于第一导电浆料中，并烘烤/加热固化形成第二导电浆料层和包裹第一基材层所有表面的第一导电浆料层，简单易实现；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图17所示的导电泡棉的制作方法包括：
S91、在泡棉基体1的全部第一表面11、部分第二表面12和全部第三表面13形成胶层5。
S92、将第一基材层6浸泡于第一导电浆料中，形成具有包裹第一基材层6所有表面的第一导电浆料的第一中间层。
S93、在胶层5靠近第一表面11、第二表面12和第三表面13的表面形成第一中间层。
S94、烘烤固化，形成包裹第一基材层6所有表面的第一导电浆料层21。
S95、在第二区域Q2的第一导电浆料层21上印刷第一导电浆料。
S96、烘烤固化，形成第一导电浆料层21。
S97、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与胶层5和第一导电浆料层21均相连。
本申请对于上述步骤S91与步骤S92的顺序不做具体限定，示例性的，可以先进行步骤S91、再进行步骤S92；或者，可以先进行步骤S92、再进行步骤S91；或者，可以同时进行步骤S91和步骤S92。
需要说明的是，制作方法还可以包括：
S091、将第一基材层置于第二导电浆料中浸泡，形成具有包裹第一基材层所有表面的第二导电浆料的第二中间层。
S092、在泡棉基体的全部第一表面、部分第二表面和全部第三表面形成第二中间层。
S093、烘烤固化，形成包裹第一基材层所有表面的第二导电浆料层。
S094、在第二区域的第二导电浆料层上喷涂第二导电浆料。
S095、烘烤固化，形成第二导电浆料层。
S096、在泡棉基体的部分第二表面形成第二粘结层。
其中，第二粘结层与第二导电浆料层相连。
当然，还可以在第一基材层与导电浆料层为分别独立的结构的情况下，形成导电浆料层时，沿垂直于泡棉基体的方向，可以在第一区域印刷/喷涂的导电浆料的高度小于在第二区域印刷/喷涂的导电浆料的高度。
本申请实施例提供的导电泡棉的制作方法，一方面，通过在第二区域比在第一区域额外形成导电浆料层，使得导电层在第一区域的部分的结构与在第二区域的部分的结构相同的同时，沿垂直于泡棉基体的方向，导电层在第一区域的部分的高度小于导电层在第二区域的部分的高度；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图18所示的导电泡棉的制作方法包括：
S101、在泡棉基体1的全部第一表面11、部分第二表面12和全部第三表面13形成胶层5。
S102、将第一基材层6浸泡于第一导电浆料中，形成具有包裹第一基材层6所有表面的第一导电浆料的第一中间层。
S103、在胶层5靠近第一表面11、第二表面12和第三表面13的表面形成第一中间层。
S104、烘烤固化，形成包裹第一基材层6所有表面的第一导电浆料层21。
S105、在第二区域Q2的第一导电浆料层21上形成第二基材层9。
S106、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与胶层5和第一导电浆料层21均相连。
本申请对于上述步骤S101与步骤S102的顺序不做具体限定，示例性的，可以先进行步骤S101、再进行步骤S102；或者，可以先进行步骤S102、再进行步骤S101；或者，可以同时进行步骤S101和步骤S102。
需要说明的是，制作方法还可以包括：
S0101、将第一基材层置于第二导电浆料中浸泡，形成具有包裹第一基材层所有表面的第二导电浆料的第二中间层。
S0102、在泡棉基体的全部第一表面、部分第二表面和全部第三表面形成第二中间层。
S0103、烘烤固化，形成包裹第一基材层所有表面的第二导电浆料层。
S0104、在第二区域的第二导电浆料层上形成第二基材层。
S0105、在泡棉基体的部分第二表面形成第二粘结层。
其中，第二粘结层与第二导电浆料层相连。
本申请实施例提供的导电泡棉的制作方法，一方面，通过在第二区域额外形成第二基材层，使得导电层在第一区域的部分的结构与在第二区域的部分的结构不同，且沿垂直于泡棉基体的方向，导电层在第一区域的部分的高度小于导电层在第二区域的部分的高度；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
作为示例，图19所示的导电泡棉的制作方法包括：
S111、在泡棉基体1的全部第一表面11、部分第二表面12、全部第三表面13和全部第四表面14喷涂第二导电浆料。
S112、烘烤固化，形成第二导电浆料层22。
S113、在泡棉基体1的部分第二表面12形成第二粘结层7。
其中，第二粘结层7与第二导电浆料层22间隔设置。
需要说明的是，制作方法还可以包括：
S0111、在泡棉基体的全部第一表面、部分第二表面、全部第三表面和全部第四表面形成胶层。
S0112、将第一基材层浸泡于第一导电浆料中，形成具有包裹第一基材层所有表面的第一导电浆料的第一中间层。
S0113、在胶层靠近第一表面、第二表面、第三表面和第四表面的表面形成第一中间层。
S0114、烘烤固化，形成包裹第一基材层所有表面的第一导电浆料层。
S0115、在泡棉基体的部分第二表面形成第二粘结层。
其中，第二粘结层与胶层和第一导电浆料层均间隔设置。
本申请对于上述步骤S0111与步骤S0112的顺序不做具体限定，示例性的，可以先进行步骤S0111、再进行步骤S0112；或者，可以先进行步骤S0112、再进行步骤S0111；或者，可以同时进行步骤S0111和步骤S0112。
当然，还可以是其它结构的导电层的制作方法，这里不再赘述。
本申请实施例提供的导电泡棉的制作方法，一方面，在泡棉基体上形成类型的导电层；另一方面，能够形成一种在第一方向上的工作高度较低、PIM小、应力低的导电泡棉。
应用中，一般选取体积较大的第一泡棉基体，且形成导电层、粘结层等，冲切成多个体积较小的导电泡棉，并复合离型层后，备以待用。使用时，撕除离型层，将导电泡棉与电子设备中的至少一个结构电连接。
下面介绍多种具体的制作方法：
作为一个示例，如图31所示，制作方法包括：
S011、清洗第一泡棉基体表面。
S012、选择第一导电银浆。
在步骤S012、选择第一导电银浆之后，且在步骤S013、在第一泡棉基体的第一表面、第二表面、第三表面和第四表面喷涂第一导电银浆之前，制作方法还可以包括：S019、添加稀释剂。此时可以通过对选择出的第一导电银浆进行稀释处理，以得到需要的第一导电银浆。
S013、在第一泡棉基体的第一表面、第二表面、第三表面和第四表面喷涂第一导电银浆。
S014、烘烤固化。
S015、检测电阻率和高度。
若检测电阻率和高度符合要求，则进行后续步骤；若检测电阻率和高度不符合要求，则废料。此时导电泡棉的电阻率需要满足10-5-10-4Ω×cm，具体为，导电泡棉的电阻率可以是10-5Ω×cm、10-4Ω×cm等；导电泡棉在第一方向上的工作高度需要满足0.1-0.15mm，具体为，导电泡棉在第一方向上的工作高度可以是0.1mm、0.11mm、0.12mm、0.13mm、0.14mm或者0.15mm等。
S016、覆全面导电胶。
S017、冲切。
S018、覆合离型纸。
需要说明的是，第一，上述步骤S011、与步骤S012和步骤S019的顺序不做具体 限定，示例性的，可以先进行步骤S011，再进行步骤S012和步骤S019；或者，可以先进行步骤S012和步骤S019，再进行步骤S011；或者，可以同时进行步骤S011、与步骤S012和步骤S019。
第二，在步骤S011、清洗第一泡棉基体表面之后，且在步骤S013、在第一泡棉基体的第一表面、第二表面、第三表面和第四表面喷涂第一导电银浆之前，制作方法还可以包括：S020、第一泡棉基体模具成型。
本申请对于上述第一泡棉基体模具成型的工艺不做具体限定，示例性的，可以对第一泡棉基体采用挤压成型的方法进行制作。具体为，选取机械发泡的第一泡棉基体进行清洗，将清洗后的第一泡棉基体放置在模具的出料口，挤压第一泡棉基体，迫使发泡好的泡棉基体产生定向塑性变形，以特定形状从模孔挤出，例如，图33所示的六面体的第一泡棉基体10。之所以使用机械发泡是因为喷涂/印刷导电浆料且固化后，导电泡棉不会发生较大尺寸的变化。
当然，还可以直接将第一泡棉基体模具成型成泡棉基体后，制作导电层等，无需冲切。
作为另一个示例，如图32所示，制作方法包括：
S021、清洗第一泡棉基体表面。
S022、选择第一导电银浆。
S023、将第一导电银浆置于钢板的槽内。
在步骤S022、选择第一导电银浆之后，且在步骤S023、将第一导电银浆置于钢板的槽内之前，制作方法还可以包括：S031、添加稀释剂。此时可以通过对选择出的第一导电银浆进行稀释处理，以得到需要的第一导电银浆。
S024、移印头蘸取第一导电银浆，并使得第一导电银浆成型。
S025、移印头在第一泡棉基体的第一表面、第二表面、第三表面和第四表面移印第一导电银浆。
本申请的移印头可以同时对第一泡棉基体的第一表面、第二表面、第三表面和第四表面多次印刷第一导电银浆，并表干，重复多次后固化；或者，移印头可以依次对一个第一泡棉基体的表面多次印刷第一导电银浆，并表干，重复多次后固化，这里不做具体限定。
S026、烘烤固化。
S027、检测电阻率和高度。
若检测电阻率和高度符合要求，则进行后续步骤；若检测电阻率和高度不符合要求，则废料。此时导电泡棉的电阻率需要满足10-5-10-4Ω×cm，具体为，导电泡棉的电阻率可以是10-5Ω×cm、10-4Ω×cm等；导电泡棉在第一方向上的工作高度需要满足0.1-0.15mm，具体为，导电泡棉在第一方向上的工作高度可以是0.1mm、0.11mm、0.12mm、0.13mm、0.14mm或者0.15mm等。
S028、覆全面导电胶。
S029、冲切。
S030、覆合离型纸。
需要说明的是，上述步骤S021至步骤S032、与步骤S022至步骤S024的顺序不做具体限定，示例性的，可以先进行步骤S021至步骤S032，再进行步骤S022至步骤S024；或者，可以先进行步骤S022至步骤S024，再进行S021至步骤S032；或者，可以同时进行S021至步骤S032、与步骤S022至步骤S024。
在步骤S021、清洗第一泡棉基体表面之后，且在步骤S025、移印头在第一泡棉基体的第一表面、第二表面、第三表面和第四表面移印第一导电银浆之前，制作方法还可以包括：S032、第一泡棉基体模具成型。
本申请对于上述第一泡棉基体模具成型的工艺不做具体限定，示例性的，可以对第一泡棉基体采用挤压成型的方法进行制作。具体为，选取机械发泡的第一泡棉基体进行清洗，将清洗后的第一泡棉基体放置在模具的出料口，挤压第一泡棉基体，迫使发泡好的泡棉基体产生定向塑性变形，以特定形状从模孔挤出，例如，图33所示的六面体的第一泡棉基体10。之所以使用机械发泡是因为喷涂/印刷导电浆料且固化后，导电泡棉不会发生较大尺寸的变化。
当然，还可以直接将第一泡棉基体模具成型成泡棉基体后，制作导电层等，无需冲切。
图33为图32结合导电泡棉结构的工艺流程图。如图33中的(a)所示，提供第一泡棉基体10；如图33中的(b)所示，在第一泡棉基体10的第一表面、第二表面移印第一导电银浆；如图33中的(c)所示，在第一泡棉基体10的第三表面、第四表面移印第一导电银浆，固化形成第一导电浆料层21；如图33中的(d)所示，冲切，得到多个导电泡棉，此时每个导电泡棉包括泡棉基体1，以及在泡棉基体1的第一表面、第二表面、第三表面和第四表面形成的第一导电浆料层21，该第一导电浆料层21中的第一导电浆料导通。
本申请实施例中关于导电泡棉的结构说明可以参考上述实施例，这里不再赘述。
这里仅介绍与发明点相关的内容，其余制作方法可以参考相关技术获取，这里不再详细说明。
应理解，上述只是为了帮助本领域技术人员更好地理解本申请实施例，而非要限制本申请实施例的范围。本领域技术人员根据所给出的上述示例，显然可以进行各种等价的修改或变化，例如，上述检测方法的各个实施例中某些步骤可以是不必须的，或者可以新加入某些步骤等。或者上述任意两种或者任意多种实施例的组合。这样的修改、变化或者组合后的方案也落入本申请实施例的范围内。
还应理解，上文对本申请实施例的描述着重于强调各个实施例之间的不同之处，未提到的相同或相似之处可以互相参考，为了简洁，这里不再赘述。
还应理解，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请实施例的实施过程构成任何限定。
还应理解，本申请实施例中，“预先设定”、“预先定义”可以通过在设备(例如，包括电子设备)中预先保存相应的代码、表格或其他可用于指示相关信息的方式来实现，本申请对于其具体的实现方式不做限定。
还应理解，本申请实施例中的方式、情况、类别以及实施例的划分仅是为了描述的方便，不应构成特别的限定，各种方式、类别、情况以及实施例中的特征在不矛盾 的情况下可以相结合。
还应理解，在本申请的各个实施例中，如果没有特殊说明以及逻辑冲突，不同的实施例之间的术语和/或描述具有一致性、且可以相互引用，不同的实施例中的技术特征根据其内在的逻辑关系可以组合形成新的实施例。
最后应说明的是：以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何在本申请揭露的技术范围内的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种导电泡棉，其特征在于，应用于电子设备，所述导电泡棉包括：
    泡棉基体；
    导电层，包覆所述泡棉基体的至少第一表面，所述第一表面用于通过所述导电层与所述电子设备中的第一结构电连接；所述导电层至少包括导电浆料层，所述导电浆料层用于在外界压力作用下发生变形。
  2. 根据权利要求1所述的导电泡棉，其特征在于，所述导电浆料层包括浆料主体和多个相连的导电粒子，所述导电粒子掺杂于所述浆料主体中。
  3. 根据权利要求1或2所述的导电泡棉，其特征在于，所述导电层还包括第一基材层，所述第一基材层用于在所述外界压力作用下发生变形；
    所述导电浆料层在所述泡棉基体上的正投影与所述第一基材层在所述泡棉基体上的正投影至少部分重合。
  4. 根据权利要求3所述的导电泡棉，其特征在于，所述导电浆料层为第一导电浆料层，所述第一导电浆料层设置在所述第一基材层远离所述泡棉基体的一侧；
    所述导电层还包括第一粘结层，所述第一粘结层设置在所述第一基材层和所述泡棉基体之间，所述第一粘结层用于粘结所述第一基材层与所述泡棉基体、并在所述外界压力作用下发生变形。
  5. 根据权利要求3所述的导电泡棉，其特征在于，所述导电浆料层为第一导电浆料层，所述第一导电浆料层至少包裹所述第一基材层靠近所述泡棉基体一侧的表面、以及包裹所述第一基材层远离所述泡棉基体一侧的表面；
    所述导电层还包括第一粘结层，所述第一粘结层设置在所述第一导电浆料层和所述泡棉基体之间，所述第一粘结层用于粘结所述第一导电浆料层和所述泡棉基体、并在所述外界压力作用下发生变形。
  6. 根据权利要求4或5所述的导电泡棉，其特征在于，所述第一粘结层为第二导电浆料层或者胶层。
  7. 根据权利要求1至6中任一项所述的导电泡棉，其特征在于，所述泡棉基体的所述第一表面至少分为第一区域和第二区域，沿垂直于所述泡棉基体的方向，所述导电层位于所述第一区域的部分的高度小于所述导电层位于所述第二区域的部分的高度。
  8. 根据权利要求7所述的导电泡棉，其特征在于，所述导电层位于所述第一区域的部分的结构与所述导电层位于所述第二区域的部分的结构相同；
    沿垂直于所述泡棉基体的方向，所述导电层中的至少一层位于所述第一区域的部分的高度小于位于所述第二区域的部分的高度。
  9. 根据权利要求7所述的导电泡棉，其特征在于，所述导电层还包括第二基材层，所述第二基材层设置在所述第二区域、且位于所述导电浆料层远离所述泡棉基体的一侧。
  10. 根据权利要求1至9中任一项所述的导电泡棉，其特征在于，所述泡棉基体的形状为多面体，所述多面体至少包括相连的所述第一表面、第二表面和第三表面；
    所述导电层至少包覆所述第一表面、所述第二表面和所述第三表面。
  11. 根据权利要求10所述的导电泡棉，其特征在于，当所述多面体包括所述第一 表面、所述第二表面和所述第三表面时，所述第一表面与所述第二表面相对设置、且所述第一表面通过所述第三表面与所述第二表面相连；所述导电层包覆所述多面体的至少部分所述第一表面、至少部分所述第二表面和全部所述第三表面。
  12. 根据权利要求10所述的导电泡棉，其特征在于，当所述多面体包括所述第一表面、所述第二表面、所述第三表面和第四表面时，所述第一表面与所述第二表面相对设置、且所述第三表面与所述第四表面相对设置，所述第一表面分别通过所述第三表面和所述第四表面与所述第二表面相连，所述导电层包覆全部所述第一表面、至少部分所述第二表面、全部所述第三表面和全部所述第四表面。
  13. 根据权利要求10至12中任一项所述的导电泡棉，其特征在于，所述多面体的所述第二表面用于通过所述导电层与所述电子设备中的第二结构电连接。
  14. 根据权利要求1至13中任一项所述的导电泡棉，其特征在于，所述电子设备中的所述第一结构为显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件中的任一种。
  15. 根据权利要求13所述的导电泡棉，其特征在于，所述电子设备中的所述第二结构为显示屏、摄像组件、天线、金属中框、电路板、簧片、屏蔽盖、电池盖、装饰件中的任一种。
  16. 一种电子设备，其特征在于，包括如权利要求1至15中任一项所述的导电泡棉。
  17. 根据权利要求16所述的电子设备，其特征在于，所述电子设备中的所述第一结构为显示屏，所述电子设备中的第二结构为金属中框。
  18. 根据权利要求16所述的电子设备，其特征在于，所述第一结构至少包括摄像组件，所述摄像组件用于在转动时与所述导电泡棉保持电连接。
  19. 一种导电泡棉的制作方法，其特征在于，所述制作方法包括：
    在泡棉基体的至少第一表面形成导电层；其中，所述第一表面用于通过所述导电层与电子设备中的第一结构电连接，所述导电层至少包括导电浆料层，所述导电浆料层用于在外界压力作用下发生变形。
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