WO2024240201A1 - 显示模组和显示装置 - Google Patents

显示模组和显示装置 Download PDF

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Publication number
WO2024240201A1
WO2024240201A1 PCT/CN2024/094837 CN2024094837W WO2024240201A1 WO 2024240201 A1 WO2024240201 A1 WO 2024240201A1 CN 2024094837 W CN2024094837 W CN 2024094837W WO 2024240201 A1 WO2024240201 A1 WO 2024240201A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
area
binding
printed circuit
binding area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/094837
Other languages
English (en)
French (fr)
Inventor
李少鹏
邓豪
李汶泽
张卫本
范荣坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/996,285 priority Critical patent/US20260025936A1/en
Publication of WO2024240201A1 publication Critical patent/WO2024240201A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]

Definitions

  • the present disclosure relates to the technical field of OLED product manufacturing, and in particular to a display module and a display device.
  • the Y-dimension of FPC or PCB is reduced, and the multi-layer board structure has uneven temperature distribution and poor uniformity, resulting in defects such as Bonding miss/weak pressure, and the multi-layer board structure has a higher cost;
  • the Y-dimension of FPC or PCB is reduced, and a multi-layer board design is required. This will increase the thickness of FPC or PCB, which will cause PNL (panel) warping after bonding.
  • FPC/PCB The components arranged on the surface of FPC/PCB require a certain amount of arrangement space, so there is a limit to the Y-direction size of FPC or PCB.
  • the present disclosure provides a display module and a display device to solve the problems of small Y-axis size and limited assembly space.
  • a technical solution adopted in an embodiment of the present disclosure is: a display module, comprising a display panel, a flexible circuit board and a printed circuit board, wherein along a first direction, the flexible circuit board is connected to one end of the display panel, and the flexible circuit board is bent to the backlight side of the display panel to be bound and connected with the printed circuit board,
  • the flexible circuit board comprises a first binding area for binding and connecting with the printed circuit board, and A first area adjacent to the first binding area in the first direction, the orthographic projection of the first area in the second direction is located on the printed circuit board, and the second direction is a direction perpendicular to the light emitting surface of the display panel.
  • the first binding area is located at an end of the flexible circuit board away from the display panel, and the first region is located at a side of the first binding area close to the display panel.
  • a second binding area for binding and connecting with the first binding area is provided on the printed circuit board, and in the first direction, the second binding area is located in the middle of the printed circuit board.
  • a second binding area for binding and connecting with the first binding area is provided on the printed circuit board.
  • the second binding area is located at an end of the printed circuit board away from one end of the flexible circuit board.
  • the first binding area is located in the middle of the flexible circuit board, and the first region is located on a side of the first binding area close to the display panel.
  • a second binding area for binding and connecting with the first binding area is provided on the printed circuit board, and the second binding area is located at an end of the printed circuit board away from one end of the flexible circuit board.
  • the first binding area in the first direction, is located in the middle of the flexible circuit board, and in the first direction, the first area includes a first sub-area located on a side of the first binding area close to the display panel, and a second sub-area located on a side of the first binding area away from the display panel.
  • a second binding area for binding and connecting with the first binding area is provided on the printed circuit board, and in the first direction, the second binding area is located in the middle of the printed circuit board.
  • a gap between the printed wiring board and the display panel is less than or equal to 1 mm.
  • At least one of the flexible circuit board and the printed circuit board is a multi-layer board structure.
  • the printed circuit board is a multilayer board structure, and the printed circuit board includes a main body area and a second binding area located on one side of the main body area; or, the printed circuit board includes a main body area, Along the first direction, a hole is dug in the middle of the main body area to expose the corresponding metal conductive layer to form a second binding area, and the second binding area is used for binding and connecting with the first binding area.
  • the second binding region includes a conductive pin and a green oil layer located on a side of the conductive pin close to the main region.
  • the printed circuit board includes a component setting area, a lead setting area, and a second binding area, wherein the second binding area is used for binding and connecting with the first binding area, and the lead setting area is provided with leads for signal connection between the components in the component setting area and the second binding area;
  • the component setting area adopts a multi-layer board structure, and the lead setting area and the second binding area are single-layer board structures.
  • the embodiment of the present disclosure further provides a display device, comprising the above-mentioned display module.
  • the beneficial effect of the present disclosure is that: by setting the first area, the overlapping area of the flexible circuit board and the printed circuit board is increased, thereby shortening the total length of the flexible circuit board and the printed circuit board after binding connection in the first direction, which can further achieve a narrow frame and increase the assembly space of the power supply.
  • FIG1 is a schematic diagram showing the structure of a display module in the related art
  • FIG2 is a first structural diagram of a display module in an embodiment of the present disclosure
  • FIG3 shows a second structural schematic diagram of a display module in an embodiment of the present disclosure
  • FIG4 is a third structural diagram of a display module in an embodiment of the present disclosure.
  • FIG5 is a fourth structural diagram of a display module in an embodiment of the present disclosure.
  • FIG6 is a fifth structural diagram of a display module in an embodiment of the present disclosure.
  • FIG7 is a sixth structural diagram of a display module in an embodiment of the present disclosure.
  • FIG8 is a first structural diagram of a printed circuit board in an embodiment of the present disclosure.
  • FIG9 is a second schematic diagram showing the structure of a printed circuit board in an embodiment of the present disclosure.
  • FIG10 is a third structural diagram of a printed circuit board in an embodiment of the present disclosure.
  • FIG11 is a fourth structural diagram of a printed circuit board in an embodiment of the present disclosure.
  • FIG12 is a fifth structural diagram of a printed circuit board in an embodiment of the present disclosure.
  • FIG. 13 shows a sixth structural diagram of a printed circuit board in an embodiment of the present disclosure.
  • this embodiment provides a display module, including a display panel 1, a flexible circuit board 2, and a printed circuit board 3.
  • a display module including a display panel 1, a flexible circuit board 2, and a printed circuit board 3.
  • the flexible circuit board 2 is connected to one end of the display panel 1, and the flexible circuit board 2 is bent to the backlight side of the display panel 1 to be bound and connected to the printed circuit board 3.
  • the flexible circuit board 2 includes a first binding area 21 for binding and connecting with the printed circuit board 3, and a first area 22 adjacent to the first binding area 21 in the first direction, and the orthographic projection of the first area 22 in the second direction is located on the printed circuit board 3, and the second direction is a direction perpendicular to the light emitting surface of the display panel 1.
  • the first binding area 21 of the flexible circuit board 2 is arranged at the edge (i.e., the far end) of the side of the flexible circuit board 2 away from the display panel 1, and the second binding area 31 of the printed circuit board 3 is located at the edge of the side of the printed circuit board 3 close to the flexible circuit board 2.
  • the distal end (i.e., the proximal end) of the flexible circuit board 2 and the proximal end of the printed circuit board 3 are bound and connected.
  • the total length of the flexible circuit board 2 and the printed circuit board 3 after being bound and connected is: (the length of the flexible circuit board 2 - the length of the first binding area 21) + the length of the printed circuit board 3. Therefore, the size of the display module in the first direction is limited by the size of the flexible circuit board 2 and the size of the printed circuit board 3, and the length L of the gap between the printed circuit board 3 and the display panel 1 in the first direction is limited and cannot be further reduced.
  • the flexible circuit board 2 and the printed circuit board 3 are bound in a conventional manner, and the overlapping area of the flexible circuit board 2 and the printed circuit board 3 only includes a binding area for binding the flexible circuit board 2 and the printed circuit board 3.
  • the position of the binding area of the flexible circuit board 2 and/or the printed circuit board 3 is changed, so that the overlapping area of the flexible circuit board 2 and the printed circuit board 3 includes an area outside the first binding area 21 and the second binding area 31, that is, the overlapping area of the flexible circuit board 2 and the printed circuit board 3 is increased, thereby shortening the total length of the flexible circuit board 2 and the printed circuit board 3 after binding in the first direction, thereby breaking the limitation of the size of the flexible circuit board 2 and the printed circuit board 3 on the size of the display module in the first direction, and further realizing a narrow frame.
  • L in FIG2-FIG5 is compared with L in FIG1 .
  • the length L of the printed circuit board 3 and the display panel 1 in the first direction is reduced, so that the assembly space of the power supply 4 in the first direction can also be increased.
  • the flexible circuit board 2 and the printed circuit board 3 There are many specific structural forms of the flexible circuit board 2 and the printed circuit board 3, as long as the first area 22 can be realized to shorten the total length of the flexible circuit board 2 and the printed circuit board 3 after being bound and connected in the first direction. Several binding connection methods adopted by the circuit board 2 and the printed circuit board 3.
  • the first binding area 21 is located at an end of the flexible circuit board 2 away from the display panel 1 , and the first area 22 is located on a side of the first binding area 21 close to the display panel 1 .
  • the position of the first binding area 21 remains unchanged, but the second binding area 31 moves in the direction away from the display panel 1, so that the first area 22 is formed on the side of the first binding area 21 close to the display panel 1.
  • the formation of the first area 22 increases the overlapping area between the flexible circuit board 2 and the printed circuit board 3, shortens the total length of the flexible circuit board 2 and the printed circuit board after binding and connection in the first direction, and increases the assembly space of the power supply.
  • FIG. 2 is a schematic diagram showing a flexible circuit board in a bent state
  • FIG. 6 is a schematic diagram showing a flexible circuit board in an unfolded state.
  • the printed circuit board 3 is provided with a second binding area 31 for binding and connecting with the first binding area 21 , and in the first direction, the second binding area 31 is located in the middle of the printed circuit board 3 .
  • FIG. 3 is a schematic diagram showing a flexible circuit board in a bent state
  • FIG. 7 is a schematic diagram showing a flexible circuit board in an unfolded state.
  • the printed circuit board 3 is provided with a second binding area 31 for binding and connecting with the first binding area 21 , and in the first direction, the second binding area 31 is located at an end of the printed circuit board 3 away from one end of the flexible circuit board 2 .
  • the position of the second binding area 31 is not limited to that described above. As long as the second binding area 31 is located at the edge of the printed circuit board 3 close to the display panel 1 relative to that shown in Figure 1, the second binding area 31 is moved a certain distance away from the display panel 1, so that the first area 22 is formed on the side of the second binding area 31 close to the display panel 1, the overall length of the flexible circuit board 2 and the printed circuit board 3 after the binding connection can be shortened in the first direction.
  • the first binding area 21 is located in the middle of the flexible circuit board 2 , and the first area 22 is located on a side of the first binding area 21 away from the display panel 1 .
  • the first binding area 21 is moved toward the side close to the display panel 1 in the first direction, and/or the second binding area 31 is moved away from the display panel 1, so as to increase the overlapping area of the flexible circuit board 2 and the printed circuit board 3 in the first direction.
  • the printed circuit board 3 is provided with a second binding area 31 for binding and connecting with the first binding area 21 , and the second binding area 31 is located at an end of the printed circuit board 3 close to one end of the display panel 1 .
  • the first binding area 21 is located in the middle of the flexible circuit board 2, and in the first direction, the first area 22 includes a first sub-area 201 located on a side of the first binding area 21 close to the display panel 1, and a second sub-area 202 located on a side of the first binding area 21 away from the display panel 1.
  • the first binding area 21 is located in the middle of the flexible circuit board 2, and a first sub-area 201 and a second sub-area 202 are formed on opposite sides of the first binding area 21, respectively.
  • at least part of the orthographic projection of the first sub-area 201 on the printed circuit board 3 is located outside the second binding area 31, and at least part of the orthographic projection of the second sub-area 202 on the printed circuit board 3 is located outside the second binding area 31.
  • the overlapping area of the flexible circuit board 2 and the printed circuit board 3 is increased, and the total length of the bound and connected flexible circuit board 2 and the printed circuit board 3 is shortened.
  • the position of the second binding area 31 can be kept unchanged relative to the position of the second binding area 31 shown in Figure 1, or the second binding area 31 can be moved a certain distance in the direction away from the display panel 1 relative to the position shown in Figure 1 (not limited to setting the second binding area 31 in the middle of the printed circuit board 3) to further reduce the total length of the flexible circuit board 2 and the printed circuit board 3 after the binding connection.
  • a second binding area 31 for binding and connecting with the first binding area 21 is provided on the printed circuit board 3 , and the second binding area 31 is located in the middle of the printed circuit board 3 in the first direction.
  • a gap between the printed circuit board 3 and the display panel 1 is less than or equal to 1 mm.
  • the flexible circuit board 2 and the printed circuit board 3 adopt the binding connection method shown in Figure 1, that is, the first binding area 21 is located at the edge of the flexible circuit board 2 on the side away from the display panel 1, and the second binding area 31 is located at the edge of the printed circuit board 3 on the side close to the display panel 1.
  • the gap between the printed circuit board 3 and the display panel 1 in the first direction is greater than or equal to 6.15mm.
  • the gap between the printed circuit board 3 and the display panel 1 is significantly reduced.
  • the gap between the printed circuit board 3 and the display panel 1 can be 0.8mm, but it is not limited to this.
  • the flexible circuit board 2 may be a single-layer board structure or a multi-layer board structure.
  • the printed circuit board 3 may be a single-layer board structure or a multi-layer board structure.
  • the flexible circuit board 2 is a multi-layer board structure
  • the printed circuit board 3 is a multi-layer board structure.
  • the flexible circuit board 2 is a multi-layer board structure, which can reduce the size of the flexible circuit board 2
  • the printed circuit board 3 is a multi-layer board structure, which can reduce the size of the printed circuit board 3. Therefore, the flexible circuit board 2 is a multi-layer board structure, and/or the printed circuit board 3 is a multi-layer board structure, which cooperates with the formation of the first area 22. In the first direction, the total length of the flexible circuit board 2 and the printed circuit board 3 after the binding connection can be further shortened, and the wiring space of the flexible circuit board 2 and the printed circuit board 3 can be met.
  • the printed circuit board 3 is a multi-layer board structure, including a substrate layer 311 and a multi-layer metal conductive layer 312 stacked on the substrate layer 311, and an insulating layer is provided between two adjacent metal conductive layers 312.
  • the printed circuit board 3 includes a main body area and the second binding area 31 located on one side of the main body area.
  • the printed circuit board 3 includes a main body area, and along the first direction, a hole is dug in the middle of the main body area to expose the corresponding metal conductive layer to form the second binding area 31.
  • the main body area is also provided with components 313, and one of the multi-layer metal conductive layers 312 extends outward to form the second binding area 31.
  • the second binding area 31 includes a conductive pin and a green oil layer 32 located on a side of the conductive pin close to the main area.
  • the green oil layer 32 can block water and oxygen and protect the conductive pin. The function of the electrical pins.
  • the green oil layer 32 is disposed on both opposite sides of the second binding area 31 in the first direction.
  • the printed circuit board 3 includes a first side facing the flexible circuit board 2 and a second side away from the flexible circuit board 2, the second binding area 31 includes a gold finger, and the gold finger is located on the first side.
  • a plurality of components 313 are arranged on the printed circuit board 3, and at least some of the components 313 are arranged on the second side, so as to ensure the accuracy of the binding connection between the printed circuit board 3 and the flexible circuit board 2 and increase the setting space of the components 313.
  • all the components 313 are arranged on the second side to avoid damage to the components caused by the binding connection between the printed circuit board 3 and the flexible circuit board 2.
  • the component 313 is located in an area outside the second binding area 31 on the printed circuit board 3.
  • the printed circuit board 3 includes a second area corresponding to the first area (the orthographic projection of the first area on the printed circuit board 3 coincides with the second area), and the printed circuit board 3 includes a third area other than the second binding area 31 and the second area, and the component 313 is located on the third area, so that after the printed circuit board 3 and the flexible circuit board 2 are bound and connected, the component 313 is arranged on the printed circuit board 3 and the flexible circuit board 2, so that while ensuring the binding accuracy of the printed circuit board 3 and the flexible circuit board 2, the thickness of the display module in the light emitting direction of the display panel can be reduced (because if the component 313 is arranged in the overlapping area between the printed circuit board 3 and the flexible circuit board 2, when the printed circuit board 3 and the flexible circuit board 2 are bound and connected, the corresponding component 313 must be avoided, and the component 313 has a certain height, therefore, the distance between the printed circuit board 3
  • the printed circuit board 3 when it adopts a multi-layer board structure, it includes a component setting area 34, a lead setting area 33 and the second binding area 31, which are divided by dotted lines in Figure 8.
  • the component setting area 34 adopts a multi-layer board structure
  • the lead setting area 33 and the second binding area 31 are single-layer board structures
  • the lead setting area 33 is provided with leads for connecting signals between the components of the component setting area 34 and the second binding area 31, which can reduce costs.
  • the printed circuit board is a hard board with a certain rigidity
  • the flexible circuit board is a flexible and foldable flexible board.
  • the embodiment of the present disclosure further provides a display device, comprising the above-mentioned display module.
  • the display module includes a display panel, a flexible circuit board and a printed circuit board, and the printed circuit board can provide a signal to the display panel through the flexible circuit board.
  • the display panel also includes a driver IC, and under the control of the printed circuit board, the driver IC is used to drive the display panel to display.
  • the display panel includes a non-bending area, a bendable area and a binding area, the binding area is used to connect with the flexible circuit board, the bendable area is bent so that the binding area is bent to the backlight side of the display panel, and when the bendable area is in a bent state, a first back film layer 5, a PI layer 6, a supporting layer 7, a spacer layer 8 and a second back film layer 9 are stacked in sequence from the non-bending area to the binding area.
  • the support layer 7 can play a supporting role to maintain the flatness of the non-bending area of the display panel 1 .
  • the spacer layer 8 can control the bending radius of the bendable area and enhance the reliability of the bending deformation of the bendable area.
  • the printed circuit board 3 is connected to a side of the support layer 7 away from the non-bending area of the display panel 1 through an adhesive layer.
  • the spacer layer 8 can extend away from the bendable area to form a first connecting portion, so that the printed circuit board 3 is connected to the first connecting portion, reducing the step difference between the binding area of the printed circuit board 3 and the display panel 1, and facilitating the binding connection between the flexible circuit board 2 and the printed circuit board 3.
  • a buffer protection layer 10 is disposed on the outer side of the bendable area.
  • the display device may be any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device further includes a flexible circuit board, a printed circuit board and a backplane.
  • a display function such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet computer, etc.
  • the display device further includes a flexible circuit board, a printed circuit board and a backplane.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开涉及一种显示模组，包括显示面板、柔性线路板和印刷线路板，沿第一方向，所述柔性线路板连接于所述显示面板的一端，且所述柔性线路板弯折至所述显示面板的背光侧以与所述印刷线路板绑定连接，所述柔性线路板包括用于与所述印刷线路板绑定连接的第一绑定区，以及在所述第一方向上与所述第一绑定区相邻的第一区域，所述第一区域在第二方向上的正投影位于所述印刷线路板上，所述第二方向为垂直于所述显示面板的出光面的方向。本公开还涉及一种显示装置。

Description

显示模组和显示装置
相关申请的交叉引用
本申请主张在2023年05月25日在中国提交的中国专利申请号No.202310603509.4的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及OLED产品制作技术领域，尤其涉及一种显示模组和显示装置。
背景技术
目前大尺寸车载/PAD/NB产品，客户明确提出需求更多组装空间，支持大容量电池提高续航，或者满足其它特殊设计要求对组装空间的需求。
现有解决方案之一是通过压缩FPC(柔性线路板)或PCB(印刷线路板)的Y向尺寸以减小边框，实现高续航。但是会带来其他的问题：
FPC或PCB的Y向尺寸减小，多层板结构存在温度分布不均，均一性差，导致Bonding miss/弱压等不良，且多层板结构成本更高；
FPC或PCB的Y向尺寸减小，需要进行多层板设计，这样FPC或PCB的厚度上升，会导致Bonding后PNL(面板)翘曲；
FPC/PCB表面排布的元器件需求一定的排布空间，因此，FPC或PCB的Y向尺寸存在极限。
发明内容
为了解决上述技术问题，本公开提供一种显示模组和显示装置，解决Y向尺寸小，组装空间有限的问题。
为了达到上述目的，本公开的一个实施例采用的技术方案是：一种显示模组，包括显示面板、柔性线路板和印刷线路板，沿第一方向，所述柔性线路板连接于所述显示面板的一端，且所述柔性线路板弯折至所述显示面板的背光侧以与所述印刷线路板绑定连接，
所述柔性线路板包括用于与所述印刷线路板绑定连接的第一绑定区，以及 在所述第一方向上与所述第一绑定区相邻的第一区域，所述第一区域在第二方向上的正投影位于所述印刷线路板上，所述第二方向为垂直于所述显示面板的出光面的方向。
在一个示例中，所述第一绑定区位于所述柔性线路板远离所述显示面板的一端的端部，所述第一区域位于所述第一绑定区靠近所述显示面板的一侧。
在一个示例中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，在所述第一方向上，所述第二绑定区位于所述印刷线路板的中部。
在一个示例中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，在所述第一方向上，所述第二绑定区位于所述印刷线路板的远离所述柔性线路板的一端的端部。
在一个示例中，所述第一绑定区位于所述柔性线路板的中部，所述第一区域位于所述第一绑定区靠近所述显示面板的一侧。
在一个示例中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，所述第二绑定区位于所述印刷线路板的远离所述柔性线路板的一端的端部。
在一个示例中，在所述第一方向上，所述第一绑定区位于所述柔性线路板的中部，在所述第一方向上，所述第一区域包括位于所述第一绑定区靠近所述显示面板的一侧的第一子区域，和位于所述第一绑定区远离所述显示面板的一侧的第二子区域。
在一个示例中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，在所述第一方向上，所述第二绑定区位于所述印刷线路板的中部。
在一个示例中，在所述第一方向上，所述印刷线路板和所述显示面板之间的间隙小于或等于1mm。
在一个示例中，所述柔性线路板和所述印刷线路板中的至少一个为多层板结构。
在一个示例中，所述印刷线路板为多层板结构，所述印刷线路板包括主体区和位于所述主体区的一侧的第二绑定区；或者，所述印刷线路板包括主体区， 沿所述第一方向，在所述主体区的中部挖孔以露出相应的金属导电层形成第二绑定区，所述第二绑定区用于与所述第一绑定区绑定连接。
在一个示例中，所述第二绑定区包括导电引脚，以及位于所述导电引脚靠近所述主体区的一侧的绿油层。
在一个示例中，所述印刷线路板包括元器件设置区、引线设置区和第二绑定区，所述第二绑定区用于与所述第一绑定区绑定连接，所述引线设置区设置有用于将所述元器件设置区的元器件和所述第二绑定区之间进行信号连接的引线；
所述元器件设置区采用多层板结构，所述引线设置区和所述第二绑定区为单层板结构。
本公开实施例还提供一种显示装置，包括上述的显示模组。
本公开的有益效果是：通过所述第一区域的设置，增大了所述柔性线路板和所述印刷线路板的重叠面积，进而在所述第一方向上缩短了绑定连接后的所述柔性线路板和所述印刷线路板的总长度，这样可以进一步的实现窄边框，并增大电源的组装空间。
附图说明
图1表示相关技术中显示模组的结构示意图；
图2表示本公开实施例中的显示模组的结构示意图一；
图3表示本公开实施例中的显示模组的结构示意图二；
图4表示本公开实施例中的显示模组的结构示意图三；
图5表示本公开实施例中的显示模组的结构示意图四；
图6表示本公开实施例中的显示模组的结构示意图五；
图7表示本公开实施例中的显示模组的结构示意图六；
图8表示本公开实施例中的印刷线路板的结构示意图一；
图9表示本公开实施例中的印刷线路板的结构示意图二；
图10表示本公开实施例中的印刷线路板的结构示意图三；
图11表示本公开实施例中的印刷线路板的结构示意图四；
图12表示本公开实施例中的印刷线路板的结构示意图五；
图13表示本公开实施例中的印刷线路板的结构示意图六。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
参考图2-图12，本实施例提供一种显示模组，包括显示面板1、柔性线路板2和印刷线路板3，沿第一方向(参考图2中的X方向)，所述柔性线路板2连接于所述显示面板1的一端，且所述柔性线路板2弯折至所述显示面板1的背光侧以与所述印刷线路板3绑定连接，
所述柔性线路板2包括用于与所述印刷线路板3绑定连接的第一绑定区21，以及在所述第一方向上与所述第一绑定区21相邻的第一区域22，所述第一区域22在第二方向上的正投影位于所述印刷线路板3上，所述第二方向为垂直于所述显示面板1的出光面的方向。
参考图1，传统技术中，所述柔性线路板2的第一绑定区21设置于所述柔性线路板2远离所述显示面板1的一侧的边缘(即远端)，所述印刷线路板3的第二绑定区31位于所述印刷线路板3靠近所述柔性线路板2的一侧的边 缘(即近端)，即所述柔性线路板2的远端和所述印刷线路板3的近端相绑定连接，这样，在所述第一方向上，所述柔性线路板2和所述印刷线路板3绑定连接后的总长度为：(所述柔性线路板2的长度-所述第一绑定区21的长度)+所述印刷线路板3的长度，因此，所述显示模组在所述第一方向上的尺寸，被所述柔性线路板2的尺寸和所述印刷线路板3的尺寸的限制，所述印刷线路板3和所述显示面板1在所述第一方向上的间隙的长度L受到限制，无法进一步的减小。
参考图1，所述柔性线路板2和所述印刷线路板3采用传统的绑定方式，所述柔性线路板2和所述印刷线路板3的重叠区域仅仅包括用于将所述柔性线路板2和所述印刷线路板3绑定连接的绑定区。参考图2-图7，本实施例中，改变了所述柔性线路板2和/或所述印刷线路板3的绑定区的位置，使得所述柔性线路板2和所述印刷线路板3的重叠区域包括所述第一绑定区21和所述第二绑定区31之外的区域，即增加了所述柔性线路板2和所述印刷线路板3的重叠面积，从而在所述第一方向上，缩短了所述柔性线路板2和所述印刷线路板3绑定连接后的总的长度，从而打破所述柔性线路板2和所述印刷线路板3的尺寸对所述显示模组在所述第一方向上的尺寸的限制，可以进一步的实现窄边框，图2-图5中的L与图1中的L进行对比，明显的，图2-图5的结构中，减小所述印刷线路板3与所述显示面板1在所述第一方向上的长度L的大小，这样也可以增大电源4在所述第一方向上的组装空间。
需要说明的是，在所述第一方向上，所述第一绑定区21的长度和所述第二绑定区31的长度存在公差设置，即存在部分所述第一绑定区21在所述印刷线路板3上的正投影位于所述第二绑定区31之外，或者存在部分所述第二绑定区31在所述柔性线路板2上的正投影位于所述第一绑定区21之外的情况，因此为了有效的减小所述柔性线路板2和所述印刷线路板3在绑定连接后的总的长度，至少部分所述第一区域22在所述印刷线路板3上的正投影位于所述第二绑定区31之外的区域。
所述柔性线路板2和所述印刷线路板3的具体结构形式有多种，只要可以实现所述第一区域22的存在，以在所述第一方向上缩短所述柔性线路板2和所述印刷线路板3在绑定连接后的总的长度即可，以下介绍本实施例中所述柔 性线路板2和所述印刷线路板3所采用的几种绑定连接方式。
参考图2、图3、图6和图7，示例性的实施方式中，所述第一绑定区21位于所述柔性线路板2远离所述显示面板1的一端的端部，所述第一区域22位于所述第一绑定区21靠近所述显示面板1的一侧。
相对于图1，所述第一绑定区21的位置不变，但是所述第二绑定区31向远离所述显示面板1的方向移动，从而使得在所述第一绑定区21靠近所述显示面板1的一侧，形成所述第一区域22，对比图1，所述第一区域22的形成，增大了所述柔性线路板2和所述印刷线路板3之间的重叠面积，在所述第一方向上缩短了所述柔性线路板2和所述印刷电路板绑定连接后的总的长度，增加了电源的组装空间。
图2表示的是柔性线路板处于弯折状态的示意图，图6表示的是柔性线路板处于展开状态的示意图。
参考图2和图6，示例性的，所述印刷线路板3上设置有用于与所述第一绑定区21绑定连接的第二绑定区31，在所述第一方向上，所述第二绑定区31位于所述印刷线路板3的中部。
图3表示的是柔性线路板处于弯折状态的示意图，图7表示的是柔性线路板处于展开状态的示意图。
参考图3和图7，示例性的，所述印刷线路板3上设置有用于与所述第一绑定区21绑定连接的第二绑定区31，在所述第一方向上，所述第二绑定区31位于所述印刷线路板3的远离所述柔性线路板2的一端的端部。
需要说明的是，所述第二绑定区31的位置并不限于上述所述，只要相对于图1中所示的，所述第二绑定区31位于所述印刷线路板3靠近所述显示面板1的边缘，所述第二绑定区31向远离所述显示面板1的方向移动一定的距离，使得在所述第二绑定区31靠近所述显示面板1的一侧形成所述第一区域22，即可在所述第一方向上缩短绑定连接后的所述柔性线路板2和所述印刷线路板3的整体的长度。
参考图4，示例性的实施方式中，所述第一绑定区21位于所述柔性线路板2的中部，所述第一区域22位于所述第一绑定区21远离所述显示面板1的一侧。
对照图1，为了在所述第一方向上，缩短绑定连接后的所述柔性线路板2和所述印刷线路板3的总的长度，只要在所述第一方向上，所述第一绑定区21向靠近所述显示面板1的一侧移动，和/或所述第二绑定区31向远离所述显示面板1的方向移动，以在所述第一方向上增加所述柔性线路板2和所述印刷线路板3的重叠面积即可。
参考图4，示例性的，所述印刷线路板3上设置有用于与所述第一绑定区21绑定连接的第二绑定区31，所述第二绑定区31位于所述印刷线路板3的靠近所述显示面板1的一端的端部。
参考图5，示例性的实施方式中，在所述第一方向上，所述第一绑定区21位于所述柔性线路板2的中部，在所述第一方向上，所述第一区域22包括位于所述第一绑定区21靠近所述显示面板1的一侧的第一子区域201，和位于所述第一绑定区21远离所述显示面板1的一侧的第二子区域202。
对比图1，在所述第一方向上，所述第一绑定区21位于所述柔性线路板2的中部，并在所述第一绑定区21的相对的两侧分别形成第一子区域201和第二子区域202，此时，至少部分所述第一子区域201在所述印刷线路板3上的正投影位于所述第二绑定区31之外，且至少部分所述第二子区域202在所述印刷线路板3上的正投影位于所述第二绑定区31之外。从而在所述第一方向上，增加了所述柔性线路板2和所述印刷线路板3的重叠面积，缩短了绑定连接的所述柔性线路板2和所述印刷线路板3的总的长度。
需要说明的是，在所述第一绑定区21位于所述柔性线路板2的中部，所述第一区域22位于所述第一绑定区21靠近所述显示面板1的一侧的实施方式中，可以相对于图1中所示的所述第二绑定区31的位置，使得所述第二绑定区31的位置不变，也可以相对于图1中所述第二绑定区31所示的位置，使得所述第二绑定区31向远离所述显示面板1所述的方向移动一定的距离(并不限于将所述第二绑定区31设置于所述印刷线路板3的中部)，以进一步的减小绑定连接后的所述柔性线路板2和所述印刷线路板3的总的长度。
参考图5，示例性的实施方式中，所述印刷线路板3上设置有用于与所述第一绑定区21绑定连接的第二绑定区31，在所述第一方向上，所述第二绑定区31位于所述印刷线路板3的中部。
示例性的，在所述第一方向上，所述印刷线路板3和所述显示面板1之间的间隙小于或等于1mm。
所述柔性线路板2和所述印刷线路板3采用图1中所示的绑定连接方式，即所述第一绑定区21位于所述柔性线路板2远离所述显示面板1的一侧的边缘，所述第二绑定区31位于所述印刷线路板3靠近所述显示面板1的一侧的边缘，所述印刷线路板3之间和所述显示面板1在所述第一方向上的间隙大于或等于6.15mm，而本实施例中，在所述第一方向上，所述印刷线路板3和所述显示面板1之间的间隙明显减小，例如在所述第一方向上，所述印刷线路板3和所述显示面板1之间的间隙可以为0.8mm，但并不以此为限。
示例性的，所述柔性线路板2可以为单层板结构，也可以为多层板结构。
示例性的，所述印刷线路板3可以为单层板结构，也可以为多层板结构。
本实施例中可选的，所述柔性线路板2为多层板结构，和/或所述印刷线路板3为多层板结构。
相对于单层板结构，所述柔性线路板2为多层板结构，可以减小所述柔性线路板2的尺寸，所述印刷线路板3为多层板结构，可以减小所述印刷线路板3的尺寸，因此，所述柔性线路板2为多层板结构，和/或所述印刷线路板3为多层板结构，与所述第一区域22的形成相配合，可以在所述第一方向上，进一步的缩短绑定连接后的所述柔性线路板2和所述印刷线路板3的总的长度，并且满足所述柔性线路板2和所述印刷线路板3的布线空间。
参考图8-图13，以印刷线路板3为例，所述印刷线路板3为多层板结构，包括基材层311以及叠置于所述基材层311上的多层金属导电层312，相邻两层金属导电层312之间设置有绝缘层，在图8、图10、图11和图13中，所述印刷线路板3包括主体区和位于所述主体区的一侧的所述第二绑定区31，在图9和图12中，所述印刷线路板3包括主体区，沿所述第一方向，在所述主体区的中部挖孔以露出相应的金属导电层形成所述第二绑定区31。所述主体区还设置有元器件313，多层金属导电层312中的一层所述金属导电层312向外延伸形成所述第二绑定区31。
所述第二绑定区31包括导电引脚，以及位于所述导电引脚靠近所述主体区的一侧的绿油层32。所述绿油层32可以起到阻隔水氧的作用，起到保护导 电引脚的作用。
需要说明的是，在所述第二绑定区31在所述第一方向上位于所述印刷线路板的中部时，在所述第一方向上，所述第二绑定区31的相对的两侧均设置有所述绿油层32。
示例性的，所述印刷线路板3包括朝向所述柔性线路板2的第一侧和背离所述柔性线路板2的第二侧，所述第二绑定区31包括金手指，所述金手指位于所述第一侧，所述印刷线路板3上设置有多个元器件313，至少部分元器件313设置于所述第二侧，保证所述印刷线路板3和所述柔性线路板2之间的绑定连接的精度，且增大了所述元器件313的设置空间。且在一些实施方式中，所有所述元器件313设置在所述第二侧，避免所述印刷线路板3和所述柔性线路板2之间的绑定连接对所述元器件的损伤。
示例性的，所述元器件313位于所述印刷线路板3上的所述第二绑定区31之外的区域，在一些实施方式中，所述印刷线路板3包括与所述第一区域对应的第二区域(所述第一区域在所述印刷线路板3上的正投影与所述第二区域重合)，所述印刷线路板3包括除所述第二绑定区31和所述第二区域之外的第三区域，所述元器件313位于所述第三区域上，这样在所述印刷线路板3和所述柔性线路板2绑定连接后，所述元器件313设置于所述印刷线路板3和所述柔性线路板2之间的叠置区域之外，从而在保证所述印刷线路板3和所述柔性线路板2的绑定精度的同时，可以减小显示模组在所述显示面板的出光方向上的厚度(因为若所述元器件313设置在所述印刷线路板3和所述柔性线路板2之间的叠置区域内时，所述印刷线路板3和所述柔性线路板2绑定连接时，要对相应的元器件313进行避让，而元器件313是具有一定的高度的，因此，限制了所述印刷线路板3和所述柔性线路板2之间的距离)。
参考图8-图10，示例性的，所述印刷线路板3采用多层板结构时，包括元器件设置区34、引线设置区33和所述第二绑定区31，图8中采用虚线进行划分，所述元器件设置区34采用多层板结构，所述引线设置区33和所述第二绑定区31为单层板结构，所述引线设置区33设置有用于将所述元器件设置区34的元器件和所述第二绑定区31之间进行信号连接的引线，这样可以降低成本。
示例性的，所述印刷线路板为具有一定刚性的硬质板，所述柔性线路板是柔性可折叠的柔性板。
本公开实施例还提供一种显示装置，包括上述的显示模组。
所述显示模组包括显示面板、柔性线路板和印刷线路板，所述印刷线路板可以通过所述柔性线路板向所述显示面板提供信号。所述显示面板还包括驱动IC，在所述印刷线路板的控制下，所述驱动IC用于驱动所述显示面板进行显示。
所述显示面板包括非弯折区、可弯折区和绑定区，所述绑定区用于与所述柔性线路板连接，所述可弯折区弯折使得所述绑定区弯折至所述显示面板的背光侧，在所述可弯折区处于弯折状态时，从所述非弯折区到所述绑定区，还依次叠置有第一背膜层5、PI层6、支撑层7、隔垫层8和第二背膜层9。
所述支撑层7可以起到支撑作用，保持所述显示面板1的非弯折区的平坦性。
所述隔垫层8可以控制所述可弯折区的弯折半径，增强所述可弯折区的弯折形变的可靠性。
示例性的，所述印刷线路板3通过胶层连接至所述支撑层7远离所述显示面板1的非弯折区的一侧。
示例性的，沿所述第一方向，所述隔垫层8可以向远离所述可弯折区的方向延伸，形成第一连接部，使得所述印刷线路板3连接于所述第一连接部上，减小所述印刷线路板3和所述显示面板1的所述绑定区之间的段差，利于所述柔性线路板2和所述印刷线路板3之间的绑定连接。
示例性的，所述可弯折区的外侧设置有缓冲保护层10。
所述显示装置可以为：液晶电视、液晶显示器、数码相框、手机、平板电脑等任何具有显示功能的产品或部件，其中，所述显示装置还包括柔性电路板、印刷电路板和背板。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (14)

  1. 一种显示模组，包括显示面板、柔性线路板和印刷线路板，沿第一方向，所述柔性线路板连接于所述显示面板的一端，且所述柔性线路板弯折至所述显示面板的背光侧以与所述印刷线路板绑定连接，其中，
    所述柔性线路板包括用于与所述印刷线路板绑定连接的第一绑定区，以及在所述第一方向上与所述第一绑定区相邻的第一区域，所述第一区域在第二方向上的正投影位于所述印刷线路板上，所述第二方向为垂直于所述显示面板的出光面的方向。
  2. 根据权利要求1所述的显示模组，其中，所述第一绑定区位于所述柔性线路板远离所述显示面板的一端的端部，所述第一区域位于所述第一绑定区靠近所述显示面板的一侧。
  3. 根据权利要求2所述的显示模组，其中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，在所述第一方向上，所述第二绑定区位于所述印刷线路板的中部。
  4. 根据权利要求2所述的显示模组，其中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，在所述第一方向上，所述第二绑定区位于所述印刷线路板的远离所述柔性线路板的一端的端部。
  5. 根据权利要求1所述的显示模组，其中，所述第一绑定区位于所述柔性线路板的中部，所述第一区域位于所述第一绑定区靠近所述显示面板的一侧。
  6. 根据权利要求5所述的显示模组，其中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，所述第二绑定区位于所述印刷线路板的远离所述柔性线路板的一端的端部。
  7. 根据权利要求1所述的显示模组，其中，在所述第一方向上，所述第一绑定区位于所述柔性线路板的中部，在所述第一方向上，所述第一区域包括位于所述第一绑定区靠近所述显示面板的一侧的第一子区域，和位于所述第一绑定区远离所述显示面板的一侧的第二子区域。
  8. 根据权利要求7所述的显示模组，其中，所述印刷线路板上设置有用于与所述第一绑定区绑定连接的第二绑定区，在所述第一方向上，所述第二绑 定区位于所述印刷线路板的中部。
  9. 根据权利要求1所述的显示模组，其中，在所述第一方向上，所述印刷线路板和所述显示面板之间的间隙小于或等于1mm。
  10. 根据权利要求1所述的显示模组，其中，所述柔性线路板和所述印刷线路板中的至少一个为多层板结构。
  11. 根据权利要求10所述的显示模组，其中，所述印刷线路板为多层板结构，所述印刷线路板包括主体区和位于所述主体区的一侧的第二绑定区；或者，所述印刷线路板包括主体区，沿所述第一方向，在所述主体区的中部挖孔以露出相应的金属导电层形成第二绑定区，所述第二绑定区用于与所述第一绑定区绑定连接。
  12. 根据权利要求11所述的显示模组，其中，所述第二绑定区包括导电引脚，以及位于所述导电引脚靠近所述主体区的一侧的绿油层。
  13. 根据权利要求1所述的显示模组，其中，所述印刷线路板包括元器件设置区、引线设置区和第二绑定区，所述第二绑定区用于与所述第一绑定区绑定连接，所述引线设置区设置有用于将所述元器件设置区的元器件和所述第二绑定区之间进行信号连接的引线；
    所述元器件设置区采用多层板结构，所述引线设置区和所述第二绑定区为单层板结构。
  14. 一种显示装置，其中，包括权利要求1-13任一项所述的显示模组。
PCT/CN2024/094837 2023-05-25 2024-05-23 显示模组和显示装置 Ceased WO2024240201A1 (zh)

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