Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
  • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

• This disclosure relates to optical waveguide packages and light source modules.
• FIG. 1 is an exploded perspective view showing a light source module including an optical waveguide package according to an embodiment of the present disclosure
• FIG. 2 is a plan view of the light source module shown in FIG. 1
• 3 is a cross-sectional view taken along the line III-III in FIG. 2.
• FIG. 3 is a partially enlarged perspective view of section IV in FIG. 2, showing the mounting structure of the metal film on the clad.
• FIG. 13 is a partially enlarged perspective view showing a configuration of a metal film of an optical waveguide package according to another embodiment of the present disclosure.
• FIG. 11 is a partially enlarged perspective view showing a configuration of a metal film of an optical waveguide package according to another embodiment of the present disclosure.
• FIG. 11 is an enlarged cross-sectional view showing a schematic diagram of a laminated structure of metal films used in an optical waveguide package according to still another embodiment of the present disclosure.
• FIG. 13 is an enlarged perspective view of a portion of an optical waveguide package according to still another embodiment of the present disclosure.
• Patent Document 1 discloses a configuration in which an optical waveguide is formed on a substrate, the optical waveguide being composed of a core and a cladding surrounding the core, a groove is provided in a direction crossing the optical waveguide, and a light-shielding film is provided on the inner wall of the groove, thereby preventing leakage of radiation modes generated within the optical waveguide element into the core facing the light-emitting element in the cladding mode.
• the light source module 1 is located within the element mounting area 3 and further includes a first electrode 20 on which the light emitting element 4 is mounted, and a second electrode 21 connected to the first electrode 20 and extending outward from the element mounting area 3.
• the lens 6 is located on the optical path of the light emitted from the core 5 and may collimate or focus the light emitted from the core 5.
• the lens 6 may be, for example, a plano-convex lens with a flat entrance surface and a convex exit surface.
• the light-emitting elements 4 include a light-emitting element 4R that emits red light, a light-emitting element 4G that emits green light, and a light-emitting element 4B that emits blue light. These light-emitting elements 4R, 4G, and 4B are, for example, light-emitting diodes (LEDs) or laser diodes. Each light-emitting element 4R, 4G, and 4B is arranged so that the emission end of each color of light faces the incident surface 13R, 13G, and 13B exposed facing the element mounting area 3 of the core 5.
• LEDs light-emitting diodes
• Each light-emitting element 4R, 4G, and 4B is arranged so that the emission end of each color of light faces the incident surface 13R, 13G, and 13B exposed facing the element mounting area 3 of the core 5.
• the element mounting area 3 may be a recess or a through hole that opens to the third surface 11 of the clad 12. In another embodiment, the element mounting area 3 may be a through hole that penetrates from the third surface 11 to the second surface 10 of the clad 12. Also, as shown in FIG. 3, the element mounting area 3 does not completely penetrate the clad 12, and the first electrode 21 and/or the second electrode 22 described below may be located on the clad 12.
• a bonding material is located in a ring shape on the third surface 11 of the clad 12 so as to surround the opening of the element mounting area 3, and the lid body 7 is bonded to the third surface 11 of the clad 12 by the bonding material.
• the inside of the element mounting area 3 is hermetically sealed by the lid body 7, and the light emitting element 4 is protected.
• the lid body 7 may be bonded to the metal film 22 by the bonding material.
• the core 5 may contain silicon oxynitride (SiON), also known as silicon oxynitride, and the cladding 12 may contain silicon oxide (SiO 2 ).
• SiON silicon oxynitride
• SiO 2 silicon oxide
• Figure 4 is a partially enlarged perspective view of section IV in Figure 2, showing the mounting structure of the metal film 22 on the clad 12.
• the clad 12 has a recess 12a that opens to the third surface 11 and the side surface 27, and has a fourth surface 14 as the side surface of the recess 12a.
• the first portion 22a and the second portion 22b of the metal film 22 are not electrically connected to each other and are constructed separately.
• the second portion 122b is located closer to the substrate 9 than the first portion 122a, so that the metal film 122 melts due to the heat generated when the light-emitting element 4 is mounted, and shrinks as shown by arrow B.
• the stress caused by the shrinkage of the metal film 122 counteracts the stress that causes the substrate 9 to warp due to heat, as shown by arrow A, and the warping of the substrate 9 can be reduced.
• the optical waveguide package of this embodiment includes a substrate 9, a clad 12, a core 5, and a metal film 222.
• the clad 12 further has a side surface 27 and a fifth surface 16 formed between the fourth surface 14 and the side surface 27 and parallel to the third surface 11.
• the fifth surface 16 is also the bottom surface of the recess.
• the first metal film 222a may be formed of, for example, TiPt, and the second metal film 222b may be formed of, for example, AuSn.
• the thermal expansion coefficients of the first metal film 222a and the second metal film 222b assuming that the thermal expansion coefficient of the clad 12 is ⁇ 1, the thermal expansion coefficient of the first metal film 222a is ⁇ 2, and the thermal expansion coefficient of the second metal film 222b is ⁇ 3, can suppress the occurrence of film peeling of the metal film 222 during contraction by satisfying the relationship ⁇ 1 ⁇ 2 ⁇ 3.
• the metal film 222 includes a first metal film 222a disposed on the clad 12 and a second metal film 222b disposed on the first metal film 222a, the occurrence of film peeling as described above can be suppressed by using a material for the second metal film 222b that has a higher thermal expansion coefficient than the first metal film 222a.
• FIG. 7 is an enlarged cross-sectional view showing a schematic diagram of a laminated structure of a metal film 322 used in an optical waveguide package according to yet another embodiment of the present disclosure.
• the third surface 11 of the clad 12 has a convex portion 12b formed at a position overlapping the second electrode 21, and a portion adjacent to the convex portion 12b is relatively concave 12c, resulting in an uneven shape.
• the convex portion 12b and the concave portion 12c of the clad 12 may be formed, for example, by etching the clad 12.
• the cross-sectional shape perpendicular to the longitudinal direction (Y-axis direction) of the convex portions 12b, 322ab, 322bb is not limited to a rectangle, but may be a trapezoid.
• the corners of the convex portions 12b, 322ab, 322bb are obtuse angles, making it difficult for stress to concentrate, and reducing the occurrence of cracks originating from the corners.
• the mutual contact area can be increased, improving the bonding strength between the clad 12, the first metal film 322a, and the second metal film 322b and reducing film peeling.
• the optical waveguide package disclosed herein can provide an optical waveguide package with improved optical propagation efficiency.
• the light source module disclosed herein can provide a light source module with improved light propagation efficiency.
• optical waveguide package according to the present disclosure can be implemented in the following configurations (1) to (9).
• a substrate having a first surface; a clad located on the first surface, the clad having a second surface facing the first surface, a third surface located on the opposite side of the second surface, and a fourth surface located on the third surface side between the second surface and the third surface, the clad having an element mounting area opening to the third surface; a core located within the cladding, the core having an incident surface exposed to the element mounting area and an exit surface exposed from an end surface of the cladding; a metal film located on the clad so as to surround the element mounting region; the metal film has a first portion located on the third surface and a second portion located on the fourth surface.
• the light source module according to the present disclosure can be implemented in the following configuration (10).

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optical Couplings Of Light Guides (AREA)
• Semiconductor Lasers (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

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ID=91717834

Family Applications (1)

Country Status (3)

Citations (5)

• 2023
  • 2023-12-27 WO PCT/JP2023/046990 patent/WO2024143486A1/ja not_active Ceased
  • 2023-12-27 TW TW112151079A patent/TW202441231A/zh unknown
  • 2023-12-27 JP JP2024567943A patent/JPWO2024143486A1/ja active Pending

Patent Citations (5)

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