WO2024143134A1 - 光回路基板、光学部品実装構造体および光回路基板の製造方法 - Google Patents

光回路基板、光学部品実装構造体および光回路基板の製造方法 Download PDF

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Publication number
WO2024143134A1
WO2024143134A1 PCT/JP2023/045840 JP2023045840W WO2024143134A1 WO 2024143134 A1 WO2024143134 A1 WO 2024143134A1 JP 2023045840 W JP2023045840 W JP 2023045840W WO 2024143134 A1 WO2024143134 A1 WO 2024143134A1
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WO
WIPO (PCT)
Prior art keywords
groove
optical
circuit board
recess
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/045840
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English (en)
French (fr)
Japanese (ja)
Inventor
巧也 北乾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2024567698A priority Critical patent/JPWO2024143134A1/ja
Publication of WO2024143134A1 publication Critical patent/WO2024143134A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means

Definitions

  • optical fibers capable of transmitting large volumes of data at high speeds have come to be used in information communications.
  • Optical signals are transmitted and received between these optical fibers and optical components.
  • Such optical components are mounted on, for example, optical circuit boards.
  • Optical circuit boards are equipped with optical waveguides. Optical signals are transmitted and received via these optical waveguides.
  • the optical circuit board includes a wiring board having a first top surface, and an optical waveguide located on the first top surface and extending from the periphery of the wiring board toward the center.
  • the optical waveguide includes a lower clad, a core, and an upper clad from the first top surface side.
  • the core extends to a second top surface of the lower clad, and the upper clad covers the second top surface and the core.
  • the optical waveguide includes a recess having the lower clad as a bottom surface and a recess opening that opens to a third top surface and a side surface of the optical waveguide.
  • the end face of the core is exposed to a first wall surface of the recess that is located away from the periphery of the wiring board.
  • a first groove is located on the bottom surface of the recess, below the end face of the core.
  • the end surface of the core is exposed on a first wall surface of the recess that is located away from the periphery of the wiring board, and a first groove that is continuous with the first wall surface is formed on the bottom surface of the recess below the end surface of the core.
  • FIG. 1 is a plan view showing an optical component mounting structure in which optical components and electronic components are mounted on an optical circuit board according to an embodiment of the present disclosure.
  • 2 is an enlarged explanatory view for illustrating a cross section of a region X shown in FIG. 1 .
  • FIG. 3 is a planar perspective view of region Y shown in FIG. 2 as viewed from the direction of arrow A shown in FIG. 2 (however, the optical connector and adhesive are omitted).
  • FIG. 4 is an enlarged explanatory view showing a cross section taken along line XX shown in FIG. 3.
  • 4 is an enlarged explanatory view showing a state in which an adhesive is filled in the recess shown in FIG. 3 and an optical connector is connected.
  • FIG. 4 is a perspective view seen from the direction of the arrow B shown in FIG. 3 . 4 is an enlarged explanatory view showing another cross section taken along line XX shown in FIG. 3.
  • 1A to 1C are explanatory views for explaining a process for manufacturing an optical circuit board according to an embodiment of the present disclosure.
  • 1A to 1C are explanatory views for explaining a process for manufacturing an optical circuit board according to an embodiment of the present disclosure.
  • the insulating layers may be made of the same or different resins.
  • the insulating layers and the core substrate included in the build-up layer may be made of the same or different resins.
  • the build-up layer usually has via-hole conductors to electrically connect the layers.
  • the first groove 36 is located on the bottom surface of the recess 35.
  • the first groove 36 is located below the end face of the core 32.
  • the first groove 36 does not need to be located continuously (flush) with the end face of the core 32, and may be slightly shifted toward the peripheral edge of the wiring board 2.
  • the adhesive 34 that connects the optical waveguide 3 and the optical connector 5a is filled in the first groove 36. That is, an anchor effect is generated by the adhesive 34 in the first groove 36.
  • FIG. 5 is an enlarged explanatory diagram showing the state in which the recess 35 shown in FIG. 3 has been filled with adhesive 34 and the optical connector 5a has been connected.
  • the width W of the first groove 36 shown in FIG. 4 is not limited and may be, for example, 1 ⁇ m or more and 100 ⁇ m or less at the opening of the first groove 36.
  • the width W of the first groove 36 may increase from the bottom surface of the first groove 36 toward the opening of the first groove 36, for example, as shown in FIG. 4. If the first groove 36 has a structure that increases in width from the bottom surface toward the opening, it is easier to fill the adhesive 34 deep into the first groove 36 when connecting the optical connector 5a, as shown in FIG. 5.
  • the bottom of the recess 35 may be flat or curved. It is preferable that the bottom of the recess 35 has a curved surface. By having the bottom of the recess 35 have a curved surface, the contact area between the bottom of the recess 35 and the adhesive 34 becomes larger, which makes it easier to increase the adhesive strength between the optical waveguide 3 and the optical connector 5a.
  • the end surface of the core is exposed on a first wall surface that is located away from the periphery of the wiring board among the walls of the recess, and a first groove that is continuous with the first wall surface is formed on the bottom surface of the recess below the end surface of the core.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2023/045840 2022-12-28 2023-12-21 光回路基板、光学部品実装構造体および光回路基板の製造方法 Ceased WO2024143134A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024567698A JPWO2024143134A1 (https=) 2022-12-28 2023-12-21

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022211173 2022-12-28
JP2022-211173 2022-12-28

Publications (1)

Publication Number Publication Date
WO2024143134A1 true WO2024143134A1 (ja) 2024-07-04

Family

ID=91717435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/045840 Ceased WO2024143134A1 (ja) 2022-12-28 2023-12-21 光回路基板、光学部品実装構造体および光回路基板の製造方法

Country Status (3)

Country Link
JP (1) JPWO2024143134A1 (https=)
TW (1) TWI891186B (https=)
WO (1) WO2024143134A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001281479A (ja) * 2000-03-29 2001-10-10 Oki Electric Ind Co Ltd 高分子光導波路素子およびその製造方法
JP2012155036A (ja) * 2011-01-24 2012-08-16 Hitachi Chem Co Ltd ミラー付き光導波路及びその製造方法、ミラー付きフレキシブル導波路及びその製造方法、ミラー付き光ファイバコネクタ及びその製造方法
WO2016151670A1 (ja) * 2015-03-20 2016-09-29 オリンパス株式会社 光伝送モジュール、内視鏡、および前記光伝送モジュールの製造方法
US10018781B1 (en) * 2017-01-06 2018-07-10 International Business Machines Corporation Fluid control structure
US20190094460A1 (en) * 2017-03-16 2019-03-28 Corning Research & Development Corporation Detachable optical connectors for optical chips comprising a connector support and methods of fabricating the same
US20200003950A1 (en) * 2018-06-27 2020-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Photonic semiconductor device and method
JP2020166233A (ja) * 2019-03-26 2020-10-08 株式会社フジクラ 導波路基板、光コネクタ、及び導波路基板の製造方法
WO2021261232A1 (ja) * 2020-06-26 2021-12-30 京セラ株式会社 光導波路パッケージ、発光装置および投影システム
WO2022210230A1 (ja) * 2021-03-30 2022-10-06 京セラ株式会社 光回路基板およびそれを用いた光学部品実装構造体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006171173A (ja) * 2004-12-14 2006-06-29 Omron Corp 光モジュール及びその製造方法
JP5156502B2 (ja) * 2007-06-26 2013-03-06 パナソニック株式会社 光モジュール
JP2020016756A (ja) * 2018-07-25 2020-01-30 日東電工株式会社 光導波路部材コネクタおよびその製造方法
CN114660721B (zh) * 2020-12-23 2024-04-12 联合微电子中心有限责任公司 硅基光电子芯片端面耦合封装结构及其形成方法
CN113281840B (zh) * 2021-04-01 2023-06-16 日月光半导体制造股份有限公司 半导体封装结构及其形成方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001281479A (ja) * 2000-03-29 2001-10-10 Oki Electric Ind Co Ltd 高分子光導波路素子およびその製造方法
JP2012155036A (ja) * 2011-01-24 2012-08-16 Hitachi Chem Co Ltd ミラー付き光導波路及びその製造方法、ミラー付きフレキシブル導波路及びその製造方法、ミラー付き光ファイバコネクタ及びその製造方法
WO2016151670A1 (ja) * 2015-03-20 2016-09-29 オリンパス株式会社 光伝送モジュール、内視鏡、および前記光伝送モジュールの製造方法
US10018781B1 (en) * 2017-01-06 2018-07-10 International Business Machines Corporation Fluid control structure
US20190094460A1 (en) * 2017-03-16 2019-03-28 Corning Research & Development Corporation Detachable optical connectors for optical chips comprising a connector support and methods of fabricating the same
US20200003950A1 (en) * 2018-06-27 2020-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Photonic semiconductor device and method
JP2020166233A (ja) * 2019-03-26 2020-10-08 株式会社フジクラ 導波路基板、光コネクタ、及び導波路基板の製造方法
WO2021261232A1 (ja) * 2020-06-26 2021-12-30 京セラ株式会社 光導波路パッケージ、発光装置および投影システム
WO2022210230A1 (ja) * 2021-03-30 2022-10-06 京セラ株式会社 光回路基板およびそれを用いた光学部品実装構造体

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TWI891186B (zh) 2025-07-21
TW202430947A (zh) 2024-08-01
JPWO2024143134A1 (https=) 2024-07-04

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