WO2024113397A1

WO2024113397A1 - Detection apparatus, detection method, machining device, and machining method

Info

Publication number: WO2024113397A1
Application number: PCT/CN2022/136839
Authority: WO
Inventors: 罗先刚; 张逸云; 赵承伟; 龚天诚; 张文豪; 王彦钦; 王长涛
Original assignee: 中国科学院光电技术研究所
Priority date: 2022-12-01
Filing date: 2022-12-06
Publication date: 2024-06-06
Also published as: CN116045857A

Abstract

A detection apparatus, a detection method, a machining device, and a machining method. The detection apparatus comprises: a laser interferometer, configured to emit a laser beam to form an interference fringe with the surface of an element to be processed, drive phase shift of the interference fringe, collect phase information of the interference fringe, and obtain continuous profile data according to the phase information of the interference fringe; and a white light interference measurement head, configured to perform vertical scanning on the surface of said element to obtain morphology data of a discrete microstructure. The machining device comprises: the detection apparatus, configured to measure the continuous profile data of the surface of said element and the morphology data of the discrete microstructure, and match the continuous profile data with the morphology data of the discrete microstructure to generate full-view data of the surface of said element; and a machining apparatus, configured to generate machining parameters according to the full-view data, and perform single-point non-coupling machining on the surface of said element according to the machining parameters. The apparatus, device and methods can realize high-precision detection and machining of the surface of a discrete microstructure.

Description

Detection device, detection method, processing equipment and processing method

This disclosure claims priority to Chinese patent application No. 202211533112.4 filed on December 1, 2022, the entire contents of which are incorporated by reference into this disclosure.

Technical Field

The present disclosure relates to the field of detection and processing technology, and in particular to a detection device, a detection method, a processing device and a processing method.

Background technique

The flatness of the substrate is determined by the substrate holder that supports the substrate. The main feature of the holder is the presence of a large number of periodically arranged discrete microstructures on the surface. When in use, the back of the substrate is supported by these raised surface microstructures. In order to reduce the impact of contaminants such as particles on the flatness of the substrate, the duty cycle of the microstructure pattern on the holder surface is usually very small (less than 5%).

Traditional optical inspection and processing methods are mainly carried out for continuous surfaces. Due to the presence of a large number of discrete microstructures on the surface of the retainer, traditional optical inspection methods cannot perform high-precision surface flatness inspection on such retainers, which limits the further improvement of the retainer's accuracy. In addition, existing optical processing methods cannot process non-continuous discrete surfaces or there is a coupling effect during processing, and cannot achieve high-precision single-point non-coupled processing, thus failing to meet the substrate flatness requirements of advanced processes.

Summary of the invention

In view of the above technical problems, the present disclosure provides a detection device, a detection method, a processing equipment and a processing method, which are used to at least partially solve the above technical problems.

Based on this, the first aspect of the present disclosure provides a detection device, including: a laser interferometer, used to emit a laser beam to form interference fringes with the surface of the component to be processed, drive the interference fringes to shift the phase, collect the phase information of the interference fringes, and obtain continuous surface data based on the phase information of the interference fringes; a white light interference detection head, used to vertically scan the surface of the component to be processed to obtain the morphology data of discrete microstructures.

According to an embodiment of the present disclosure, the detection device also includes: a first mounting bracket for mounting a laser interferometer; a second mounting bracket for mounting a white light interference detection head; a workbench mounted on one side of the laser interferometer and the white light interference detection head where light exits; a detection sample table mounted on the workbench for placing the component to be processed, wherein the workbench is used to drive the detection sample table to switch between the measurement position of the laser interferometer and the measurement position of the white light interference detection head, and to move the component to be processed to different positions for measuring continuous surface data or discrete microstructure morphology data; and a detection packaging cover for sealing the laser interferometer, the white light interference detection head, the first mounting bracket, the second mounting bracket, the workbench and the detection sample table.

The second aspect of the present disclosure provides a detection method based on the above-mentioned detection device, including: emitting a laser beam through a laser interferometer to form interference fringes with the surface of the component to be processed, driving the interference fringes to shift phase, collecting the phase information of the interference fringes, and obtaining continuous surface data based on the phase information of the interference fringes; vertically scanning the surface of the component to be processed by a white light interference detection head to obtain the morphology data of discrete microstructures; matching the continuous surface data and the morphology data of the discrete microstructures to generate full-view data of the surface of the component to be processed.

According to an embodiment of the present disclosure, continuous surface data and topographic data of discrete microstructures are matched to generate full-view data of the surface of the component to be processed, which specifically includes: interpolating the continuous surface data; calculating the height of a single microstructure based on the topographic data of the discrete microstructure using a step height method; and superimposing the interpolated continuous surface data with the height of a single microstructure to obtain full-view data.

The third aspect of the present disclosure provides a processing device, including: a detection device as described above, used to measure the continuous surface data of the surface of the component to be processed and the morphology data of the discrete microstructure, and match the continuous surface data and the morphology data of the discrete microstructure to generate the overall data of the surface of the component to be processed; a processing device, used to generate processing parameters according to the overall data, and perform single-point non-coupled processing on the surface of the component to be processed according to the processing parameters.

According to an embodiment of the present disclosure, the processing device includes: a vertical polishing machine, which is a single-spindle combined with a three-dimensional translation table structure, and is used to perform single-point non-coupled processing on the surface of the component to be processed; a processing sample table, which is used to carry the component to be processed; and a processing packaging cover, which is used to seal the vertical polishing machine and the processing sample table.

According to an embodiment of the present disclosure, the vertical polishing machine includes a machining spindle, an X-axis translation table, a Y-axis translation table, a Z-axis translation table, a transmission box, and a polishing disc, wherein: the torque output by the machining spindle drives the polishing disc to rotate through the transmission box to grind and polish the component to be processed, and the X-axis translation table, the Y-axis translation table, and the Z-axis translation table work together to drive the polishing disc to move to different positions on the surface of the component to be processed for grinding and polishing.

According to an embodiment of the present disclosure, the diameter of the polishing disk is smaller than the arrangement period of the discrete microstructures on the surface of the component to be processed.

The fourth aspect of the present disclosure provides a processing method based on the above-mentioned processing equipment, including: emitting a laser beam through a laser interferometer to form interference fringes with the surface of a component to be processed, driving the interference fringes to shift phase, collecting the phase information of the interference fringes, and obtaining continuous surface data based on the phase information of the interference fringes; vertically scanning the surface of the component to be processed through a white light interference detection head to obtain the morphology data of discrete microstructures; matching the continuous surface data with the morphology data of discrete microstructures to generate full-view data of the surface of the component to be processed; generating processing parameters based on the full-view data, and performing single-point non-coupled processing on the surface of the component to be processed based on the processing parameters.

According to an embodiment of the present disclosure, processing parameters are generated based on the overall data, specifically including: generating the position and processing removal amount of each microstructure on the surface of the component to be processed based on the overall data; converting the position and processing removal amount into processing parameters, wherein the processing parameters include spindle speed, feed rate and processing time.

According to an embodiment of the present disclosure, the processing method also includes: after the processing is completed, determining whether the flatness of the surface of the component to be processed is greater than or equal to a preset accuracy threshold; if the flatness of the surface of the component to be processed is less than the preset accuracy threshold, repeatedly executing the processing method until the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold.

The detection device, detection method, processing equipment and processing method provided by the embodiments of the present disclosure have at least the following beneficial effects:

The detection device and detection method provided by the present invention are as follows: a laser interferometer measures continuous surface shape data of the surface of the component to be processed based on the principle of laser interference, and a white light interference detection head measures the morphology data of discrete microstructures on the surface of the component to be processed based on the principle of white light interference. The two complement each other and simultaneously realize the measurement of continuous surface shape data and morphology data of discrete microstructures, thereby realizing high-precision detection of the surface flatness of the component to be processed.

The processing equipment and processing method provided by the present invention realize high-precision detection of the surface flatness of the component to be processed based on the detection device, and can obtain accurate processing parameters. On this basis, considering the differences in the processing removal amounts of various microstructures, a single spindle combined with a three-dimensional translation stage structure is set, thereby achieving a non-coupled single-point processing effect covering the entire surface of the component to be processed, which solves the technical problem that the existing optical processing methods cannot process non-continuous discrete surfaces or there is a coupling effect during processing.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

FIG1 schematically shows a structural diagram of a detection device provided in an embodiment of the present disclosure.

FIG2 schematically shows a structural diagram of a laser interferometer provided in an embodiment of the present disclosure.

FIG3 schematically shows a structural diagram of a white light interferometric detection head provided in an embodiment of the present disclosure.

FIG4 schematically shows a cross-sectional view of the structure of a detection device provided in an embodiment of the present disclosure.

FIG5 schematically shows a flow chart of a detection method provided by an embodiment of the present disclosure.

FIG. 6 schematically shows a surface structure diagram of a retainer provided by an embodiment of the present disclosure.

FIG. 7 schematically shows a schematic diagram of the principle of solving the bottom surface shape data of the retainer microstructure position provided by an embodiment of the present disclosure.

FIG8 schematically shows a schematic diagram of a solution principle of the holder microstructure height data provided by an embodiment of the present disclosure.

FIG9 schematically shows a principle diagram of superposition of surface shape data and three-dimensional shape data provided by an embodiment of the present disclosure.

FIG10 schematically shows an overall structural diagram of the processing equipment provided by an embodiment of the present disclosure.

FIG. 11 schematically shows a structural diagram of a processing device provided in an embodiment of the present disclosure.

FIG. 12 schematically shows a dimensional diagram of a polishing disk provided in an embodiment of the present disclosure.

FIG. 13 schematically shows a flow chart of a processing method provided in an embodiment of the present disclosure.

FIG. 14 schematically shows a flow chart of a processing method provided by another embodiment of the present disclosure.

FIG. 15 schematically shows a structural diagram of a holder to be inspected and processed provided in an embodiment of the present disclosure.

FIG. 16 schematically shows an interference fringe pattern obtained by detection provided by an embodiment of the present disclosure.

FIG. 17 schematically shows a three-dimensional topography of a single microstructure on the surface of a retainer obtained by detection according to an embodiment of the present disclosure.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present disclosure.

The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "include", "comprising", etc. used herein indicate the existence of the features, steps, operations and/or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

In the description of the present disclosure, it is necessary to understand that the terms "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the subsystem or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or configurations will be omitted when they may cause confusion in the understanding of the present disclosure. The shapes, sizes, and positional relationships of the components in the drawings do not reflect the actual size, proportion, and actual positional relationship. In addition, in the claims, any reference symbol between brackets shall not be constructed as a limitation to the claims.

Similarly, in order to simplify the present disclosure and help understand one or more of the various disclosed aspects, in the above description of the exemplary embodiments of the present disclosure, the various features of the present disclosure are sometimes grouped together into a single embodiment, figure, or description thereof. The description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the feature. In the description of the present disclosure, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

As shown in FIG. 1 , the detection device may include, for example, a laser interferometer 12 and a white light interference detection head 14 .

The laser interferometer 12 is used to emit a laser beam to form interference fringes with the surface of the component to be processed, drive the interference fringes to shift phase, collect phase information of the interference fringes, and obtain continuous surface data based on the phase information of the interference fringes.

The white light interference detection head 14 is used to vertically scan the surface of the component to be processed to obtain the morphological data of the discrete microstructure.

As shown in FIG2 , the laser interferometer 12 may be, for example, a Fizeau interferometer, including a laser light source, a collimator, a beam splitter, a phase shifter, a standard mirror, and a CCD (Charge Coupled Device) camera.

The laser beam emitted by the laser light source is collimated by a collimator, and then passes through a beam splitter and a standard mirror in sequence before irradiating the surface of the component to be processed. The laser beam transmitted through the standard mirror forms interference fringes with the surface to be measured, and the phase shifter on the standard mirror is controlled by an actuator to generate a small displacement to drive the interference fringes to shift phase. The interference fringes are photographed by a CCD camera, and the surface shape data of the surface to be measured can be calculated by analyzing the phase information of the interference fringes. The component to be measured can be, for example, a substrate holder, and the specific component type is not limited in this disclosure.

The measurement principle of the Fizeau interferometer determines that the laser interferometer 12 is suitable for measuring the surface data of continuous surfaces, but is not suitable for measuring discrete microstructures on the surface of the component to be processed.

As shown in FIG. 3 , the white light interferometric detection head may include, for example, an illumination system, an imaging system, a vertical scanning mechanism, an interferometric objective lens, and a CCD camera.

The illumination system emits a light beam, and the imaging system, the vertical scanning mechanism and the interference objective lens use the light beam to vertically scan and image the surface of the component to be processed, obtain the morphological data of the discrete microstructure on the surface of the component to be processed, and use a CCD camera to record the morphological data of the discrete microstructure.

The vertical scanning mechanism usually adopts a high-precision piezoelectric ceramic driver, which can achieve nanometer-level precise measurement of the three-dimensional morphology of the surface of the component to be processed. The white light interference detection head 14 is used in the detection device to detect the discrete microstructure of the surface of the holder, and forms a functional complement with the laser interferometer 12.

1 and 4 , the detection device, for example, further includes a detection packaging housing 11 (not shown in FIG. 1 and FIG. 4 ), a first mounting bracket 13 , a second mounting bracket 15 , a workbench 16 and a detection sample table 17 . Among them:

The first mounting bracket 13 is used to mount the laser interferometer 12 .

The second mounting bracket 15 is used to mount the white light interference detection head 14. Furthermore, the main optical path structure of the white light interference detection head 14 can be encapsulated in the metal cover 141, with only the electric tower 142 exposed outside. The electric tower 142 is equipped with interference objective lenses of different magnifications, and the detection of different sizes of fields of view can be achieved by switching the interference objective lenses. The detection field size of the white light interference detection head 14 is usually 0.1mm×0.1mm～10mm×10mm.

The workbench 16 is installed on the side (the lower side as shown in FIG. 1 and FIG. 4 ) where the laser interferometer 12 and the white light interference detection head 14 emit light.

The detection sample stage 17 is installed on the workbench 16 and is used to place the component to be processed, wherein the workbench 16 is used to drive the detection sample stage 17 to switch between the measurement position of the laser interferometer 12 and the measurement position of the white light interference detection head 14, and move the component to be processed to different positions to measure continuous surface data or discrete microstructure morphology data.

The detection package housing 11 is used to seal the laser interferometer 12, the white light interference detection head 14, the first mounting bracket 13, the second mounting bracket 15, the workbench 16 and the detection sample table 17. The detection package housing 11 mainly serves to isolate external pollution and protect the internal precision optical instruments. The housing is assembled together by riveting, threading, welding, etc., and is made of metal material. It can be a whole plate or a combination of multiple plates. Holes can be punched at required positions to facilitate disassembly and wiring.

Based on the above detection device, the embodiment of the present disclosure also provides a detection method.

As shown in FIG. 5 , the detection method may include, for example, operations S501 to S503 .

In operation S501, a laser interferometer is used to emit a laser beam to form interference fringes with the surface of the component to be processed, so as to shift the phase of the interference fringes, collect the phase information of the interference fringes, and obtain continuous surface data according to the phase information of the interference fringes.

In operation S502, a white light interferometric detection head is used to vertically scan the surface of the component to be processed to obtain topographic data of discrete microstructures.

In operation S503, the continuous surface shape data and the shape data of the discrete microstructures are matched to generate full shape data of the surface of the component to be processed.

In the disclosed embodiment, the process of generating the full-view data may be: interpolating the continuous surface data, calculating the height of a single microstructure according to the morphological data of the discrete microstructures using the method of calculating the step height, and superimposing the interpolated continuous surface data with the height of the single microstructure to obtain the full-view data.

The following detailed description is given by taking the example that the component to be processed is a retainer.

Exemplarily, first, the sliding door of the detection package cover 11 is opened, the holder is mounted on the detection sample stage 17 of the detection device, the sliding door is closed, and the detection is started.

Secondly, detect the surface shape data of the retainer: the workpiece table 16 drives the retainer to move to the bottom of the laser interferometer 12, and performs the bottom surface shape detection of the retainer as shown in Figure 6. Since the area of the microstructure on the surface of the retainer is very small, effective interference fringes cannot be formed. Therefore, the surface shape data at this position (i.e., the microstructure) is missing.

As shown in Figure 7, the black circles in the figure represent the pixel point surface data of the retainer surface obtained by measurement, and the white circles represent the pixel point surface data of the retainer surface obtained by interpolation. Since the surface microstructure has a small occupancy rate, the number of missing data points is usually small. Therefore, the surface data _h1 of the bottom surface of the retainer microstructure position obtained by interpolation has higher accuracy.

Next, the three-dimensional morphology data of the discrete microstructure is detected: the workpiece table 16 drives the holder to move to the bottom of the white light detection head 14, and the three-dimensional morphology detection of the microstructure on the surface of the holder is performed as shown in Figure 6. Before the detection, the electric turret 142 switches to an interference objective lens with a suitable magnification according to the area size of the microstructure to ensure that the detection field of view is larger than the area size of the microstructure.

As shown in FIG8 , after obtaining the morphological data of the scattered microstructures, the height h ₂ of a single microstructure is obtained by using the step height method; the workpiece stage 16 drives the holder to move to different positions for microstructure height detection until the three-dimensional morphology of all microstructures on the holder surface is completely detected.

Finally, the detected surface data and the three-dimensional shape data are superimposed to obtain the overall shape data of the retainer surface, which includes all shape data information of the entire retainer surface.

As shown in FIG. 9 , the overall data h of the microstructure on the retainer surface is the sum of the surface data h ₁ at that position and the height h ₂ of a single microstructure. The flatness of the retainer surface can be calculated using the overall data h.

It should be noted that the three-dimensional morphological data of the discrete microstructure may be detected first, and then the surface shape data of the retainer may be detected. The specific order may be determined according to actual application requirements, and the present disclosure does not impose any limitation thereto.

According to the detection device and detection method provided by the embodiments of the present disclosure, the laser interferometer measures the continuous surface data of the surface of the component to be processed, and the white light interferometer detection head measures the morphology data of the discrete microstructures on the surface of the component to be processed. The two complement each other and simultaneously realize the measurement of the continuous surface data and the morphology data of the discrete microstructures, thereby realizing high-precision detection of the surface flatness of the component to be processed.

Based on the above detection device, the embodiment of the present disclosure also provides a processing equipment.

As shown in FIG10 , the processing equipment may include:

The detection device 1 is used to measure the continuous surface shape data and the morphology data of the discrete microstructure on the surface of the component to be processed, and match the continuous surface shape data and the morphology data of the discrete microstructure to generate the overall shape data of the surface of the component to be processed.

The processing device 2 is used to generate processing parameters according to the overall data, and perform single-point non-coupled processing on the surface of the component to be processed according to the processing parameters.

The structure of the detection device 1 is the same as that shown in Figures 1 to 4. For details, please refer to the above description of the detection device, which will not be repeated here. The processing device 2 is described in detail below.

As shown in FIG. 11 , the processing device 2 may include, for example, a processing packaging housing 21 , a vertical polishing machine 22 and a processing sample stage 23 , wherein:

The processing packaging housing 21 is used to seal the vertical polishing machine and the processing sample stage. The purpose of the seal is to prevent the slurry, polishing powder, polishing liquid and other pollutants used in the processing process from leaking out and causing pollution.

The vertical polishing machine 22 is a single-spindle combined with a three-dimensional translation stage structure, which is used to use the full-view data transmitted by the detection device 1 as input data, generate processing parameters, and perform single-point non-coupled processing on the surface of the component to be processed to achieve the desired surface accuracy.

The processing sample stage 23 is used to carry the component to be processed.

Traditional small grinding head polishing equipment often uses a planetary gear train structure of a revolving motor + a self-rotating motor. However, since the processing equipment of the embodiment of the present disclosure processes a continuous structure on the surface of the component, but a series of discrete microstructures, the processing removal amount of each microstructure is different, and the processing removal function is relatively complex, which is not suitable for the traditional planetary gear train structure. In addition, in order to cover a larger processing area, the diameter of the polishing disc of the revolving motor + the self-rotating motor is usually large (on the order of tens of millimeters to hundreds of millimeters), and the processing removal amount within the diameter of the polishing disc does not show differences, there is a coupling effect, and the single-point processing effect for the local microstructure on the surface of the retainer cannot be achieved.

Based on this, the vertical polishing machine 22 provided in the embodiment of the present disclosure adopts a single spindle + XYZ translation table structure.

Specifically, the vertical polishing machine 22 may include, for example, a processing spindle 221, an X-axis translation table 222, a Y-axis translation table 223, a Z-axis translation table 224, a transmission box 225, and a polishing disc 226. The torque output by the processing spindle 221 drives the polishing disc 226 to rotate at a high speed through the transmission box 225, so as to grind and polish the surface of the holder to be processed; the X-axis translation table 222, the Y-axis translation table 223, and the Z-axis translation table 224 drive the polishing disc 226 to move to different positions for processing, so that the processing area covers the entire surface of the sample to be processed.

Furthermore, in order to better reflect the differences in machining removal amounts and avoid coupling effects, the embodiment of the present disclosure also designs the size of the polishing disk 226 .

As shown in FIG. 12 , the diameter of the polishing disk is smaller than the arrangement period of the discrete microstructures on the surface of the component to be processed, so as to achieve a non-coupled single-point processing effect covering the entire retainer surface.

Furthermore, the processing equipment may also include a platform 3 and a base 4, for example.

The platform 3 is used to install the detection device 1 and the processing device 2. The platform 3 can be made of thicker marble granite material to improve the stability of the equipment.

The base 4 is used to contact the ground and bear the weight. The base 4 is a hollow frame structure, which is convenient for placing control cabinets, chassis, waste liquid barrels and other components of the detection device 1 and the processing device 2, thereby ensuring the compactness of the structure.

Based on the above processing equipment, the embodiment of the present disclosure also provides a processing method.

As shown in FIG. 13 , the processing method may include, for example, operations S1301 to S1304 .

In operation S1301, a laser beam is emitted through a laser interferometer to form interference fringes with the surface of the component to be processed, the interference fringes are driven to shift phase, the phase information of the interference fringes is collected, and continuous surface data is obtained based on the phase information of the interference fringes.

In operation S1302, a white light interferometric detection head is used to vertically scan the surface of the component to be processed to obtain topographic data of discrete microstructures.

In operation S1303, the continuous surface shape data and the shape data of the discrete microstructures are matched to generate full shape data of the surface of the component to be processed.

In operation S1304, processing parameters are generated according to the overall data, and single-point non-coupled processing is performed on the surface of the component to be processed according to the processing parameters.

Operations S1301 to S1303 are identical to operations S501 to S503 and are not described in detail here. Operation S1304 is described in detail below.

First, the processing device generates processing parameters according to the overall data, which may include: generating the position and processing removal amount of each microstructure on the surface of the component to be processed according to the overall data. The position and processing removal amount are converted into processing parameters, wherein the processing parameters include spindle speed, feed rate and processing time, etc.

Secondly, the processing is performed according to the processing parameters: during the processing, the X-axis displacement stage 222 and the Y-axis displacement stage 223 drive the polishing disc 226 to move to different positions according to the position information, the Z-axis displacement stage 224 performs the corresponding feed amount according to the processing removal amount, and the processing spindle 221 drives the polishing disc 226 to polish the microstructure on the surface of the component to be processed. Since the diameter of the polishing disc 226 is smaller than the microstructure arrangement period, the processing process can realize non-coupled single-point processing. The above processing process continues until all the microstructures on the surface of the component to be processed are processed.

As shown in FIG. 14 , the processing method may further include, for example, operation S1305 based on operations S1301 to S1304 .

In operation S1305, it is determined whether the flatness of the surface of the component to be processed after processing is greater than or equal to a preset accuracy threshold.

If the flatness of the surface of the component to be processed after processing is greater than or equal to the preset accuracy threshold, the processing of the component to be processed is completed. If the flatness of the surface of the component to be processed is less than the preset accuracy threshold, operations S1301 to S1304 are repeatedly performed until the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold. The criterion for whether the accuracy meets the requirements can be the actual use effect of the retainer, or the overall data of the retainer measured by the detection device 1.

According to the processing equipment and processing method provided by the present invention, high-precision detection of the surface flatness of the component to be processed is achieved based on the detection device, and accurate processing parameters can be obtained. On this basis, considering the differences in the processing removal amounts of various microstructures, a single spindle combined with a three-dimensional translation stage structure is set, thereby achieving a non-coupled single-point processing effect covering the entire surface of the component to be processed, which solves the problem that existing optical processing methods cannot process non-continuous discrete surfaces or there is a coupling effect during processing.

In order to more clearly illustrate the detection device, detection method, processing equipment and processing method provided by the embodiments of the present disclosure, specific examples of detecting and processing the retainer are listed below.

As shown in FIG15 , the holder is a typical substrate holder structure, made of silicon carbide, with a large number of regularly arranged cylindrical lattice structures on the surface, with a cylindrical diameter of 0.5 mm, a cylindrical height of 0.1 mm, a period of 5 mm, and an arrangement area within the range of φ298 mm, for adsorbing 12-inch substrates; the characteristic of the holder is that it needs to ensure a very high surface flatness, and is very suitable for detection and processing using the detection device, detection method, processing equipment and processing method provided by the present disclosure. The specific detection and processing process can be as follows:

First, install the sample: install the holder sample to be processed on the test sample table 17 of the test turn 1, close the sliding door, and prepare to start the test.

Then, the workpiece stage 16 drives the holder to move to the position directly below the laser interferometer 12 , and the laser interferometer 12 is used to measure an aperture of φ300 mm and a standard mirror shape accuracy of 1/20λ.

As shown in FIG16 , due to the small diameter of the cylinder and the discontinuous structure, effective interference fringes cannot be formed, and the surface data of the bottom surface is measured, and the data at each cylinder is temporarily missing.

Next, the three-dimensional shape of the cylinder is detected: the workpiece stage 16 drives the holder to move to the bottom of the white light detection head 14 to detect the three-dimensional shape of the cylindrical dot matrix. Before the detection, the electric tower 142 switches to the 10x interference objective lens, and the detection field size is 1mm×1mm, which can cover a cylinder with a diameter of 0.5mm. During the detection process, the workpiece stage 16 drives the holder to move to different positions for detection until all the three-dimensional shapes of the cylindrical structures on the surface of the holder are fully detected.

As shown in FIG. 17 , the three-dimensional morphology of a single microstructure on the surface of the retainer detected is a cylinder.

Next, data superposition: the bottom surface data obtained is superimposed with the cylindrical lattice three-dimensional morphology data obtained to obtain the overall data of the retainer surface. The superposition uses the least squares method to match the data of the edge of the cylindrical bottom surface with the surface data of the corresponding position to generate the overall data of the retainer, which contains the XYZ point cloud data information of all structures on the retainer surface.

Next, processing preparation: the inspected holder is taken out and mounted on the processing sample stage 23 of the processing device 2 to prepare for processing.

Next, data is transferred: the generated overall data of the retainer is transferred to the processing device 2, and the processing device 2 generates processing data such as the position of each cylinder on the retainer surface and the processing removal amount based on the data, wherein the calculation of the processing removal amount is based on the minimum value of all cylinder heights.

Next, single-point processing: the vertical polishing machine 22 receives the generated processing data and converts the processing removal amount into specific processing parameters such as spindle speed, feed rate, and processing time. In this embodiment, the spindle speed is 200r/min, the feed rate is 0.01um, and the processing time is linearly related to the specific material removal amount, ranging from 60s to 280s; the polishing disc 26 has a diameter of 4mm, which is slightly smaller than the period of the cylindrical arrangement, and the abrasive is W20 corundum micro powder. Processing is performed according to the above processing parameters until all the cylinders on the surface are processed.

Finally, accuracy judgment: judge whether the surface accuracy of the processed retainer meets the requirements. If it does, the sample is processed. If it does not, repeat the above process to re-test and iterate the processing until the accuracy meets the requirements.

The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only a specific embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

A detection device, characterized in that it comprises:

A laser interferometer, used for emitting a laser beam to form interference fringes with the surface of the component to be processed, driving the interference fringes to shift phase, collecting phase information of the interference fringes, and obtaining continuous surface shape data according to the phase information of the interference fringes;

The white light interference detection head is used to vertically scan the surface of the component to be processed to obtain the morphological data of the discrete microstructure.
The detection device according to claim 1, characterized in that the detection device further comprises:

A first mounting bracket, used for mounting the laser interferometer;

A second mounting bracket, used for mounting the white light interference detection head;

A workbench, installed on one side of the laser interferometer and the white light interference detection head emitting light;

A detection sample stage, mounted on the workbench, for placing the component to be processed, wherein the workbench is used to drive the detection sample stage to switch between the measurement position of the laser interferometer and the measurement position of the white light interferometric detection head, and to move the component to be processed to different positions to measure continuous surface data or discrete microstructure morphology data;

The detection packaging cover is used to seal the laser interferometer, the white light interference detection head, the first mounting bracket, the second mounting bracket, the workbench and the detection sample table.
A detection method based on the detection device according to claim 1 or 2, characterized in that it comprises:

The laser interferometer is used to emit a laser beam to form interference fringes with the surface of the component to be processed, so as to shift the phase of the interference fringes, collect the phase information of the interference fringes, and obtain the continuous surface shape data according to the phase information of the interference fringes;

Scanning the surface of the component to be processed vertically by a white light interferometric detection head to obtain the topographic data of the discrete microstructure;

The continuous surface shape data and the shape data of the discrete microstructure are matched to generate the overall shape data of the surface of the component to be processed.
The detection method according to claim 3 is characterized in that matching the continuous surface data with the morphology data of the discrete microstructure to generate the overall data of the surface of the component to be processed specifically includes:

interpolating the continuous surface data;

Calculating the height of a single microstructure based on the topographic data of the discrete microstructures using a step height calculation method;

The interpolated continuous surface data are superimposed with the height of a single microstructure to obtain the overall data.
A processing equipment, characterized in that it comprises:

The detection device according to claim 1 or 2, used to measure the continuous surface shape data and the topography data of the discrete microstructure of the surface of the component to be processed, and match the continuous surface shape data and the topography data of the discrete microstructure to generate the overall shape data of the surface of the component to be processed;

A processing device is used to generate processing parameters according to the overall data, and perform single-point non-coupled processing on the surface of the component to be processed according to the processing parameters.
The processing equipment according to claim 5, characterized in that the processing device comprises:

A vertical polishing machine, which is a single-spindle combined with a three-dimensional translation stage structure, and is used for performing single-point non-coupled processing on the surface of the component to be processed;

A processing sample stage, used for carrying the component to be processed;

A processing packaging cover is used to seal the vertical polishing machine and the processing sample stage.
The processing equipment according to claim 6 is characterized in that the vertical polishing machine includes a processing spindle, an X-axis translation table, a Y-axis translation table, a Z-axis translation table, a transmission box, and a polishing disc, wherein:

The torque output by the machining spindle drives the polishing disc to rotate through the transmission box to grind and polish the component to be processed. The X-axis translation table, the Y-axis translation table and the Z-axis translation table work together to drive the polishing disc to move to different positions on the surface of the component to be processed for grinding and polishing.
The processing equipment according to claim 7 is characterized in that the diameter of the polishing disk is smaller than the arrangement period of the discrete microstructures on the surface of the component to be processed.
A processing method based on the processing equipment according to any one of claims 5 to 8, characterized in that it comprises:

The laser interferometer is used to emit a laser beam to form interference fringes with the surface of the component to be processed, so as to shift the phase of the interference fringes, collect the phase information of the interference fringes, and obtain the continuous surface shape data according to the phase information of the interference fringes;

Scanning the surface of the component to be processed vertically by a white light interferometric detection head to obtain the topographic data of the discrete microstructure;

Matching the continuous surface shape data with the shape data of the discrete microstructure to generate full shape data of the surface of the component to be processed;

Processing parameters are generated according to the overall data, and single-point non-coupled processing is performed on the surface of the component to be processed according to the processing parameters.
The processing method according to claim 9 is characterized in that the step of generating processing parameters according to the overall data specifically comprises:

Generate the position and machining removal amount of each microstructure on the surface of the component to be processed according to the overall data;

The position and the machining removal amount are converted into machining parameters, wherein the machining parameters include spindle speed, feed rate and machining time.
The processing method according to claim 9 or 10, characterized in that the processing method further comprises:

After the processing is completed, determining whether the flatness of the surface of the component to be processed is greater than or equal to a preset accuracy threshold;

When the flatness of the surface of the component to be processed is less than a preset accuracy threshold, the processing method is repeatedly executed until the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold.