WO2024109889A1 - Optical sensor, electronic device, and optical sensor packaging method - Google Patents

Abstract

The present application provides an optical sensor, an electronic device, and an optical sensor packaging method. The optical sensor comprises a substrate and a housing mounted on the substrate, the substrate and the housing acting in concert to form a first accommodation cavity and a second accommodation cavity which are isolated from one another. The first accommodation cavity has a light source disposed therein, and the second accommodation cavity has a chip disposed therein. An upper surface of the housing has formed thereon a first groove and a second groove, and a position of the housing facing the second accommodation cavity has a mounting groove formed thereon. The housing further comprises a first light hole and a second light hole, the first light hole communicating the first groove and the first accommodation cavity, and the second light hole communicating the second groove and the mounting groove. The first groove has disposed therein a light diffuser which covers the first light hole and is directly opposite to the light source, the second groove has disposed therein a light filter which covers the second light hole, and the mounting groove has disposed therein a metasurface lens facing the chip.

Description

Optical sensor, electronic device and packaging method of optical sensor

This application claims priority to Chinese patent application No. 202211486385.8 filed on November 24, 2022, the entire contents of which are incorporated by reference into this application.

Technical Field

The present application relates to the technical field of optical sensors, and in particular to an optical sensor, an electronic device, and a packaging method for an optical sensor.

Background technique

TOF is the abbreviation of Time of Flight technology, that is, the optical sensor emits modulated near-infrared light, which is reflected after encountering an object. The optical sensor converts the distance of the photographed scene by calculating the time difference or phase difference between the emission and reflection of the light to generate depth information. 3D (depth) TOF sensor is a non-scanning device. Its imaging is not like the point-by-point scanning method of traditional laser radar, but adopts a camera-like working mode to achieve global imaging at one time to complete detection and imaging. Each pixel can record the flight time of the photon. Since the object has three-dimensional spatial properties, the light irradiated to different parts of the object has different flight times, so a three-dimensional image with depth information is output. Existing optical sensors are mostly packaged in camera modules. The camera module includes a lens. The lens itself is large in size, and the light path transmission still requires a large space, resulting in high packaging costs and large volume. It has gradually failed to meet the needs of wearable consumer electronics such as VR/AR.

In view of this, it is necessary to provide a new optical sensor, electronic device and packaging method of the optical sensor to solve or at least alleviate the above technical defects.

technical problem

The main purpose of the present application is to provide an optical sensor, an electronic device and a packaging method for an optical sensor, aiming to solve the technical problems of large packaging volume and high manufacturing cost of optical sensors in the prior art.

Technical Solutions

To achieve the above-mentioned purpose, according to one aspect of the present application, the present application provides an optical sensor, including a substrate and a shell installed on the substrate, the substrate and the shell cooperate to form a first accommodating cavity and a second accommodating cavity isolated from each other, a light source is arranged in the first accommodating cavity, a chip is arranged in the second accommodating cavity, a first groove and a second groove are formed on the upper surface of the shell, a mounting groove is formed at a position of the shell facing the second accommodating cavity, the shell also includes a first light hole and a second light hole, the first light hole connects the first groove and the first accommodating cavity, the second light hole connects the second groove and the mounting groove, a light homogenizer covering the first light hole and facing the light source is arranged in the first groove, a filter covering the second light hole is arranged in the second groove, and a metasurface lens facing the chip is arranged in the mounting groove.

In one embodiment, a support member is provided at least between the first groove and the light homogenizer, between the second groove and the filter, and between the mounting groove and the metasurface lens.

In one embodiment, the support member includes a support ring and an air leakage channel formed on the support ring.

In one embodiment, the support member includes a first support member arranged in the first groove and a third support member arranged in the mounting groove, the first support member includes a square ring and a first notch arranged on opposite sides of the square ring, the square ring connects the light homogenizing sheet and the bottom surface of the first groove, the square ring is arranged along the inner edge of the light homogenizing sheet, the first notch forms the air leakage channel, and the structure of the third support member is the same as that of the first support member.

In one embodiment, the support member includes a second support member arranged in the second groove, the second support member includes a circular ring and second notches arranged on opposite sides of the circular ring, the circular ring connects the filter and the bottom surface of the second groove, the circular ring is arranged along the outer edge of the second light hole, and the second notch forms the air leakage channel.

In one embodiment, a blocking groove is provided at least between the first groove and the light homogenizer, between the second groove and the filter, and between the mounting groove and the metasurface lens.

In one embodiment, the shell includes an outer cover and a reinforcement structure disposed in the outer cover, and the reinforcement structure is disposed on the top of the first accommodating cavity and the second accommodating cavity.

In one embodiment, the reinforcement structure includes a connecting portion and reinforcing ribs respectively arranged around the connecting portion, the connecting portion is penetrated by the first light hole and the second light hole, and one end of the reinforcing rib away from the connecting portion is connected to the side wall of the outer cover.

In one embodiment, the size of the second light hole is gradually expanded from the second groove to the second accommodation cavity.

In one embodiment, the metasurface lens is formed by fabricating a microstructure on the surface of a glass wafer.

In one embodiment, a protective film is attached to both the light homogenizer and the filter.

In one embodiment, the shell is an injection-molded shell, and a partition is disposed inside the shell, and the partition divides the shell into the first accommodating chamber and the second accommodating chamber that are isolated from each other.

In one embodiment, the shell includes a first shell and a second shell, the first shell cooperates with the substrate to form the first accommodating cavity, the second shell cooperates with the substrate to form the second accommodating cavity, the first shell and the second shell are both metal shells, and the metal shells are welded to the substrate.

According to another aspect of the present application, the present application also provides an electronic device, which includes the optical sensor described above.

According to another aspect of the present application, the present application further provides a packaging method for an optical sensor, the packaging method for the optical sensor comprising:

A housing is provided, a first groove and a second groove are formed on the upper surface of the housing, a mounting groove is formed on the inner surface of the housing, and a first light hole penetrating the bottom surface of the first groove and a second light hole penetrating the second groove and the mounting groove are provided;

A light homogenizer is arranged in the first groove, a filter is arranged in the second groove, and a metasurface lens is arranged in the mounting groove, so that the light homogenizer covers the first light hole and the filter covers the second light hole;

Providing a substrate, on which a light source and a chip are respectively arranged;

The assembled shell is installed on the substrate so that the shell and the substrate cooperate to form a first accommodating cavity and a second accommodating cavity, the light source is located in the first accommodating cavity, the chip and the metasurface lens are located in the second accommodating cavity, the light source is arranged opposite to the first light hole, and the metasurface lens is arranged facing the chip.

Beneficial Effects

In the above scheme, the optical sensor includes a substrate and a shell mounted on the substrate, the substrate and the shell cooperate to form a first accommodating cavity and a second accommodating cavity isolated from each other, a light source is arranged in the first accommodating cavity, a chip is arranged in the second accommodating cavity, a first groove and a second groove are formed on the upper surface of the shell, a mounting groove is formed at the position of the shell facing the second accommodating cavity, the shell also includes a first light hole and a second light hole, the first light hole connects the first groove and the first accommodating cavity, the second light hole connects the second groove and the mounting groove, a light homogenizer covering the first light hole and facing the light source is arranged in the first groove, a filter covering the second light hole is arranged in the second groove, and a super surface lens facing the chip is arranged in the mounting groove. The light source can be a VCSEL laser emitter, which can emit vertical and relatively concentrated light, and the light homogenizer is used to convert the light spot with relatively concentrated energy emitted by the laser generator into light with uniform energy on the entire surface; the filter is used to filter out irrelevant ambient light to reduce environmental noise. The chip can be an ASIC chip, and the function of the super surface lens is to change the light path, make the light path more concentrated, and allow all the photosensitive areas on the ASIC chip to receive. The traditional camera module packaging uses lenses, which has high packaging costs, is large in size, and still requires a large space for the optical path. The invention provides a mounting groove on the side of the shell facing the second accommodating cavity, and installs the metasurface lens in the mounting groove to support or fix the metasurface lens. The light entering from the filter passes through the second light hole and changes and focuses the light path under the action of the metasurface lens. The metasurface lens is a planar lens, which reduces the packaging cost and has a smaller optical path. It can reduce the volume of the packaged optical sensor and is more suitable for small-volume packaging. It has the advantages of low packaging cost and small packaged product volume. In addition, by providing a first groove and a second groove on the upper surface of the shell for placing a light diffuser and a filter, the first groove and the second groove can play a positioning role, thereby improving mounting accuracy and mounting efficiency. This design can further reduce the difficulty of mounting, because in actual optical sensors, the shell is large in size and deep. If the light diffuser and filter are to be mounted on the inside of the shell, the existing equipment will interfere with the shell. Therefore, it is necessary to design additional smaller mounting tools to prevent interference when the light diffuser and filter are inserted deep into the shell. This undoubtedly increases the difficulty of mounting and increases the production cost. The invention has the advantages of reducing packaging costs and packaging volume, while improving the mounting efficiency and mounting accuracy of the light diffuser and filter.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

FIG1 is a schematic cross-sectional view of an optical sensor according to an embodiment of the present application;

FIG2 is a schematic diagram of a partial structure of an optical sensor according to an embodiment of the present application as viewed from the bottom;

FIG3 is a schematic diagram of a partial structure of an optical sensor according to an embodiment of the present application as viewed from the top surface;

FIG4 is a schematic diagram of another part of the structure of the optical sensor according to the embodiment of the present application as viewed from the top surface;

FIG. 5 is a schematic flow chart of a first embodiment of a packaging method for an optical sensor of the present application.

Description of labels:

1. Substrate; 2. Shell; 21. First light hole; 22. Second light hole; 23. First accommodating cavity; 24. Second accommodating cavity; 25. First groove; 26. Second groove; 29. Partition; 3. Light source; 4. Chip; 41. Photosensitive area; 5. Light homogenizer; 6. Filter; 7. Metasurface lens; 8. First support member; 81. Square ring; 9. Second support member; 91. Circular ring; 10. Air discharge channel; 11. Mounting groove; 12. Reinforcement structure; 121. Connecting part; 122. Reinforcement rib; 13. Electronic device; 14. Concave area; 15. Third support member.

The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings.

Embodiments of the present invention

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

It should be noted that all directional indications (such as up, down, etc.) in the implementation manner of the present application are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

In addition, in this application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

Furthermore, the technical solutions between the various implementation modes of the present application may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

Referring to Figures 1 to 4, according to one aspect of the present application, the present application provides an optical sensor, including a substrate 1 and a shell 2 installed on the substrate 1, the substrate 1 and the shell 2 cooperate to form a first accommodating cavity 23 and a second accommodating cavity 24 isolated from each other, a light source 3 is arranged in the first accommodating cavity 23, and a chip 4 is arranged in the second accommodating cavity 24. A first groove 25 and a second groove 26 are formed on the upper surface of the shell 2, and a mounting groove 11 is formed at a position of the shell 2 facing the second accommodating cavity 24. The shell 2 also includes a first light hole 21 and a second light hole 22, the first light hole 21 connects the first groove 25 and the first accommodating cavity 23, the second light hole 22 connects the second groove 26 and the mounting groove 11, a light homogenizer 5 covering the first light hole 21 and facing the light source 3 is arranged in the first groove 25, a filter 6 covering the second light hole 22 is arranged in the second groove 26, and a metasurface lens 7 facing the chip 4 is arranged in the mounting groove 11.

In the above embodiment, the light source 3 can be a VCSEL laser emitter, which can emit vertical light with relatively concentrated energy. The light homogenizer 5 is used to convert the light spot with relatively concentrated energy emitted by the laser generator into light with uniform energy on the entire surface; the filter 6 is used to filter out irrelevant ambient light to reduce environmental noise. The chip 4 can be an ASIC chip, and the role of the metasurface lens 7 is to change the light path, make the light path more concentrated, and allow the photosensitive area 41 on the ASIC chip to receive all. The traditional camera module packaging uses lenses, which has high packaging costs, large size itself, and the light path still requires a large space. This embodiment provides a mounting groove 11 on the side of the housing 2 facing the second accommodating cavity 24, and the metasurface lens 7 is installed in the mounting groove 11 to support or fix the metasurface lens 7. The light entering from the filter 6 passes through the second light hole 22 and achieves the effect of changing the light path and concentrating the light path under the action of the metasurface lens 7. The metasurface lens 7 is a plane lens that replaces the camera lens in the prior art, which reduces the packaging cost, and the optical path is smaller, which can reduce the volume of the packaged optical sensor, and is more suitable for small-volume packaging, and has the advantages of low packaging cost and small package product volume. In addition, by setting the first groove 25 and the second groove 26 on the upper surface of the housing 2, for placing the light homogenizer 5 and the filter 6, the first groove 25 and the second groove 26 can play a positioning role, thereby improving the mounting accuracy and mounting efficiency. This design can further reduce the mounting difficulty, because in the actual optical sensor, the housing 2 is large in size and depth. If the light homogenizer 5 and the filter 6 are to be mounted on the inner side of the housing 2, the existing equipment will interfere with the housing 2, so it is necessary to design additional smaller mounting tooling to prevent the light homogenizer 5 and the filter 6 from interfering with the housing 2 when they are deeply inserted into the housing 2, which undoubtedly increases the difficulty of mounting and increases the manufacturing cost. This embodiment has the advantages of being able to reduce the packaging cost and reduce the packaging volume, while improving the mounting efficiency and mounting accuracy of the light homogenizer 5 and the filter 6. The optical sensor can be a 3D TOF sensor.

Referring to Figures 2 and 3, in one embodiment, at least one of the three, between the first groove 25 and the light homogenizer 5, between the second groove 26 and the filter 6, and between the mounting groove 11 and the metasurface lens 7, is provided with a support member. The support member is a protruding protrusion structure that can play a supporting role. In addition, the support member includes a support ring and an air release channel 10 formed on the support ring. The support ring is designed in the shape of a moat, which can reduce the glue flowing to the photosensitive area of the lens (the lens here includes the light homogenizer 5, the filter 6 and the metasurface lens 7) during the bonding process. At the same time, a notch can also be set on the support ring to form an air release channel 10, so that the expanded gas can be discharged during the baking and reflux of the product during packaging or use.

Referring to Fig. 2 and Fig. 3, in a specific embodiment, the support member includes a first support member 8 disposed in the first groove 25 and a third support member 15 disposed in the mounting groove 11, the first support member 8 includes a square ring 81 and first notches disposed on opposite sides of the square ring 81, the square ring 81 connects the light homogenizer 5 and the bottom surface of the first groove 25, the square ring 81 is disposed along the inner edge of the light homogenizer 5, the first notch forms an air leakage channel 10, and the structure of the third support member 15 is the same as that of the first support member 8. Referring to Fig. 2, in another specific embodiment, the support member includes a second support member 9 disposed in the second groove 26, the second support member 9 includes a circular ring 91 and second notches disposed on opposite sides of the circular ring 91, the circular ring 91 connects the filter 6 and the bottom surface of the second groove 26, the circular ring 91 is disposed along the outer edge of the second light hole 22, and the second notch forms an air leakage channel 10.

In one embodiment, at least one of the three is provided with a blocking groove, between the first groove 25 and the light homogenizer 5, between the second groove 26 and the filter 6, and between the mounting groove 11 and the metasurface lens 7. The blocking groove is a corresponding inwardly recessed groove provided on the housing 2. When excess glue or silver paste flows toward the center of each lens during the bonding process, it will flow into the recessed groove to reduce the glue from flowing to the light-transmitting area of each lens during the bonding process, thereby affecting light propagation.

Referring to FIG. 1 and FIG. 3 , in one embodiment, the housing 2 includes an outer cover and a reinforcing structure 12 disposed in the outer cover, and the reinforcing structure 12 is disposed at the top of the first accommodating cavity 23 and the second accommodating cavity 24. Since the housing 2 is relatively large in size, it is easy to deform during use, especially when a plastic housing 2 is used. Therefore, a reinforcing structure 12 can be disposed in the housing 2 to play a supporting role and prevent the housing 2 from deforming. The reinforcing structure 12 is used to support the top of the housing 2 and the surroundings of the housing 2.

Referring to FIG. 3 , in one embodiment, the reinforcement structure 12 includes a connection portion 121 and reinforcement ribs 122 respectively arranged around the connection portion 121. The connection portion 121 is penetrated by the first light hole 21 and the second light hole 22. The end of the reinforcement rib 122 away from the connection portion 121 is connected to the side wall of the outer cover. The connection portion 121 is penetrated by the first light hole 21 and the second light hole 22, so that the reinforcement structure 12 does not affect the normal propagation of light. At the same time, the strength of the housing 2 is improved by the distribution of the cross-shaped reinforcement ribs 122. At the same time, the distribution of the cross-shaped reinforcement ribs 122 can be a groove formed in the housing 2 to form a sunken area 14, which plays a role in reducing weight while ensuring the strength of the housing 2.

Referring to FIG. 1 , in one embodiment, the size of the second light hole 22 is gradually expanded from the second groove 26 to the second accommodating cavity 24. Since the light from the filter 6 is not necessarily completely vertically incident, the second light hole 22 is set to be gradually expanded to ensure that more light is incident on the metasurface lens 7 and finally received by the chip 4, thereby improving the measurement accuracy. As for the shapes of the first light hole 21 and the second light hole 22, they can be round holes or square holes, and the size can be adaptively adjusted according to the optical design.

In one embodiment, the metasurface lens 7 is formed by a microstructure manufactured on the surface of a glass wafer. The manufactured metasurface lens 7 is a plane lens with lower manufacturing cost and smaller size. It can also achieve the function of changing the light path and focusing the light path, thereby ensuring the normal use function of the optical sensor.

In one embodiment, protective films are attached to both the light homogenizer 5 and the light filter 6. Protective films can be attached to both the light homogenizer 5 and the light filter 6 to prevent dust from falling off. The protective films need to be made of high-temperature resistant materials, such as polyimide films.

Referring to Fig. 1, in one embodiment, the housing 2 is an injection molded housing, and a partition 29 is provided inside the housing 2. The partition 29 divides the housing 2 into a mutually isolated first accommodating chamber 23 and a second accommodating chamber 24. This embodiment adopts an injection molded housing, and the housing 2 and the partition 29 are integrally formed by injection molding, which has a simple manufacturing process and a lower manufacturing cost.

In one embodiment, the shell 2 includes a first shell and a second shell. The first shell cooperates with the substrate 1 to form a first accommodating cavity 23. The second shell cooperates with the substrate 1 to form a second accommodating cavity 24. Both the first shell and the second shell are metal shells, and the metal shells are welded to the substrate 1. The shell 2 is a metal shell, and the metal shell is welded to the substrate 1. Since the shell 2 is large in size, it can be designed as two independent first shells and second shells, and in order to improve the strength of the shell 2, a metal shell can be used. The metal shell and the substrate 1 are welded by silver paste or solder paste, and it is not easy to deform during use. The inner surface of the metal shell can be coated with a black light-absorbing paint, or the inner surface of the metal shell can be designed to be matte black, which can reduce the light reflection in the accommodating cavity.

According to another aspect of the present application, the present application also provides an electronic device, which includes the above-mentioned optical sensor. The above-mentioned electronic device may be a portable intelligent wearable device, such as VR or AR glasses. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned optical sensor, it has at least all the beneficial effects brought by all the above-mentioned technical solutions, which are not described one by one here.

5 , according to the first embodiment of the present application, the present application further provides a packaging method for an optical sensor, the packaging method for an optical sensor comprising:

S10, providing a housing 2, forming a first groove 25 and a second groove 26 on the upper surface of the housing 2, forming a mounting groove 11 on the inner surface of the housing 2, and providing a first light hole 21 penetrating the bottom surface of the first groove 25 and a second light hole 22 penetrating the second groove 26 and the mounting groove 11;

The first light hole 21 and the second light hole 22 are used for allowing light to pass through. The shapes of the first light hole 21 and the second light hole 22 can be round or square, and the sizes can be adaptively adjusted according to the optical design.

S20, a light homogenizer 5 is arranged in the first groove 25, a filter 6 is arranged in the second groove 26, and a metasurface lens 7 is arranged in the mounting groove 11, so that the light homogenizer 5 covers the first light hole 21, and the filter 6 covers the second light hole 22;

The mounting groove 11 is used to prevent the metasurface lens 7 from being blocked. The first groove 25 and the second groove 26 are provided on the upper surface of the housing 2 to place the light homogenizer 5 and the filter 6. The first groove 25 and the second groove 26 can play a positioning role, thereby improving the accuracy and efficiency of mounting the light homogenizer 5 and the filter 6. Because in an actual optical sensor, the housing 2 is large in size and depth, if the light homogenizer 5 and the filter 6 are to be mounted on the inner side of the housing 2, the existing equipment will interfere with the housing 2. Therefore, it is necessary to design an additional smaller mounting tool to prevent interference when the light homogenizer 5 and the filter 6 are inserted deep into the housing 2, which undoubtedly increases the difficulty of mounting and increases the production cost.

S30, providing a substrate 1, and arranging a light source 3 and a chip 4 on the substrate 1;

The light source 3 may be a VCSEL laser emitter, which can emit vertical light with relatively concentrated energy. The light homogenizer 5 is used to convert the light spot with relatively concentrated energy emitted by the laser generator into light with uniform energy on the entire surface. The filter 6 is used to filter out irrelevant ambient light to reduce environmental noise. The chip 4 may be an ASIC chip, or, of course, other required electronic devices 13 mounted on the substrate 1.

S40, install the assembled shell 2 on the substrate 1, so that the shell 2 cooperates with the substrate 1 to form a first accommodating cavity 23 and a second accommodating cavity 24, the light source 3 is located in the first accommodating cavity 23, the chip 4 and the metasurface lens 7 are located in the second accommodating cavity 24, the light source 3 is arranged opposite to the first light hole 21, and the metasurface lens 7 is arranged facing the chip 4.

In the above-mentioned embodiment of the present application, by setting a mounting groove 11 on the side of the housing 2 facing the second accommodating cavity 24, the metasurface lens 7 is installed in the mounting groove 11 to support or fix the metasurface lens 7, and the light entering from the filter 6 passes through the second light hole 22 and achieves the effect of changing the light path and focusing the light path under the action of the metasurface lens 7. The metasurface lens 7 is a plane lens, which reduces the packaging cost, and the light path is smaller, which can reduce the volume of the packaged optical sensor and is more suitable for small-volume packaging. In addition, by setting a first groove 25 and a second groove 26 on the upper surface of the housing 2 for placing the light homogenizer 5 and the filter 6, the first groove 25 and the second groove 26 can play a positioning role, thereby improving the mounting accuracy and mounting efficiency. This embodiment has the advantages of being able to reduce the packaging cost and reduce the packaging volume, while improving the mounting efficiency and mounting accuracy of the light homogenizer 5 and the filter 6.

The above are only optional embodiments of the present application, and do not limit the patent scope of the present application. All equivalent structural transformations made using the contents of the present application specification and drawings under the technical concept of the present application, or direct/indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims (15)

1. An optical sensor, wherein the optical sensor includes a substrate and a shell mounted on the substrate, the substrate and the shell cooperate to form a first accommodating cavity and a second accommodating cavity isolated from each other, a light source is arranged in the first accommodating cavity, a chip is arranged in the second accommodating cavity, a first groove and a second groove are formed on the upper surface of the shell, a mounting groove is formed at a position of the shell facing the second accommodating cavity, the shell also includes a first light hole and a second light hole, the first light hole connects the first groove and the first accommodating cavity, the second light hole connects the second groove and the mounting groove, a light homogenizer covering the first light hole and facing the light source is arranged in the first groove, a filter covering the second light hole is arranged in the second groove, and a metasurface lens facing the chip is arranged in the mounting groove.
2. The optical sensor according to claim 1, wherein a support is provided at least between the first groove and the light homogenizer, between the second groove and the filter, and between the mounting groove and the metasurface lens.
3. The optical sensor according to claim 2, wherein the support member comprises a support ring and an air leakage channel formed on the support ring.
4. The optical sensor according to claim 3, wherein the support member includes a first support member arranged in the first groove and a third support member arranged in the mounting groove, the first support member includes a square ring and first notches arranged on opposite sides of the square ring, the square ring connects the light homogenizer and the bottom surface of the first groove, the square ring is arranged along the inner edge of the light homogenizer, the first notch forms the air leakage channel, and the structure of the third support member is the same as that of the first support member.
5. The optical sensor according to claim 3, wherein the support member includes a second support member arranged in the second groove, the second support member includes a ring and second notches arranged on opposite sides of the ring, the ring connects the filter and the bottom surface of the second groove, the ring is arranged along the outer edge of the second light hole, and the second notch forms the air leakage channel.
6. The optical sensor according to claim 1, wherein a blocking groove is provided at least between the first groove and the light homogenizer, between the second groove and the filter, and between the mounting groove and the metasurface lens.
7. The optical sensor according to claim 1, wherein the shell comprises an outer cover and a reinforcement structure arranged in the outer cover, and the reinforcement structure is arranged at the top of the first accommodating cavity and the second accommodating cavity.
8. The optical sensor according to claim 7, wherein the reinforcement structure comprises a connecting portion and reinforcing ribs respectively arranged around the connecting portion, the connecting portion is penetrated by the first light hole and the second light hole, and one end of the reinforcing rib away from the connecting portion is connected to the side wall of the outer cover.
9. The optical sensor according to any one of claims 1 to 8, wherein the size of the second light hole is gradually expanded from the second groove to the second accommodating cavity.
10. An optical sensor according to any one of claims 1 to 8, wherein the metasurface lens is formed by making a microstructure on the surface of a glass wafer.
11. The optical sensor according to any one of claims 1 to 8, wherein a protective film is attached to both the light homogenizer and the filter.
12. The optical sensor according to any one of claims 1 to 8, wherein the shell is an injection-molded shell, and a partition is provided in the shell, and the partition divides the shell into the first accommodating cavity and the second accommodating cavity that are isolated from each other.
13. An optical sensor according to any one of claims 1 to 8, wherein the shell includes a first shell and a second shell, the first shell cooperates with the substrate to form the first accommodating cavity, the second shell cooperates with the substrate to form the second accommodating cavity, the first shell and the second shell are both metal shells, and the metal shells are welded to the substrate.
14. An electronic device, wherein the electronic device comprises the optical sensor according to any one of claims 1 to 13.
15. A packaging method for an optical sensor, wherein the packaging method for the optical sensor comprises:

    A housing is provided, a first groove and a second groove are formed on the upper surface of the housing, a mounting groove is formed on the inner surface of the housing, and a first light hole penetrating the bottom surface of the first groove and a second light hole penetrating the second groove and the mounting groove are provided;

    A light homogenizer is arranged in the first groove, a filter is arranged in the second groove, and a metasurface lens is arranged in the mounting groove, so that the light homogenizer covers the first light hole and the filter covers the second light hole;

    Providing a substrate, on which a light source and a chip are respectively arranged;

    The assembled shell is installed on the substrate so that the shell and the substrate cooperate to form a first accommodating cavity and a second accommodating cavity, the light source is located in the first accommodating cavity, the chip and the metasurface lens are located in the second accommodating cavity, the light source is arranged opposite to the first light hole, and the metasurface lens is arranged facing the chip.