WO2024108855A1 - 一种弹性fpc板及其制作方法和应用弹性fpc板的产品 - Google Patents

一种弹性fpc板及其制作方法和应用弹性fpc板的产品 Download PDF

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Publication number
WO2024108855A1
WO2024108855A1 PCT/CN2023/086153 CN2023086153W WO2024108855A1 WO 2024108855 A1 WO2024108855 A1 WO 2024108855A1 CN 2023086153 W CN2023086153 W CN 2023086153W WO 2024108855 A1 WO2024108855 A1 WO 2024108855A1
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WO
WIPO (PCT)
Prior art keywords
elastic
fpc board
fpc
conductor
substrate
Prior art date
Application number
PCT/CN2023/086153
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English (en)
French (fr)
Inventor
张仕华
郭健涛
Original Assignee
张仕华
郭健涛
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 张仕华, 郭健涛 filed Critical 张仕华
Publication of WO2024108855A1 publication Critical patent/WO2024108855A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the invention relates to an FPC board, in particular to an elastic FPC board and a manufacturing method thereof and a product using the elastic FPC board.
  • Flexible printed circuit also known as soft circuit board, flexible circuit board, etc.
  • FPC Flexible printed circuit
  • soft circuit board also known as soft circuit board, flexible circuit board, etc.
  • the use of elastic FPC boards instead of conductive wires in the above-mentioned electronic products and wearable products does not affect the telescopic function, and can solve the problem of the large diameter of the elastic conductive wire.
  • the elastic insulator of the elastic FPC board in the prior art is used as the base material of the FPC board, it must have insulation ability and a certain elasticity, which limits the selection of materials for the elastic insulator. Generally, only plastic, silicone and other materials can be selected, which also makes the fixing method and application scope of this elastic FPC have great limitations.
  • the present invention aims at the technical problems existing in the prior art and provides an elastic FPC board and a manufacturing method thereof and a product using the elastic FPC board.
  • an elastic FPC board including an FPC board and at least one elastic substrate, the FPC board includes one or more conductors, the conductor includes a non-elastic insulating layer and at least one conductive core located in the insulating layer, and the conductor is at least partially curved; at least the conductor in the FPC board is connected to the elastic substrate.
  • the spacing between the two side edges of the conductive core in the conductor width direction and the outer edge of the insulating layer in the conductor width direction is respectively greater than or equal to 0.1 mm.
  • the conductor is wavy, sawtooth, square or triangular; the FPC board is punched to form the conductor, and the FPC board also includes at least one conductive portion exposed outside the insulating layer, the conductive portion is conductive to the conductive core, and the at least one conductive portion is located at the end of the conductor and/or between the two ends of the conductor.
  • a shielding layer is provided on the upper surface and/or the lower surface of the insulating layer.
  • electronic components are connected to at least one conductor by SMT patch method, and the electronic components include one or more of LED lamps, sensors, IC chips, capacitors, resistors and connectors.
  • the number of the elastic substrates is one, and the elastic substrate is stacked and connected with the FPC board to form a stacked structure, or the number of the elastic substrates is two, and two elastic substrates are stacked and connected with the FPC board to form a stacked structure, and at least the conductor of the FPC board is located between the two elastic substrates.
  • the adhesive layer also includes an adhesive layer, and the adhesive layer, the FPC board, and the elastic substrate are stacked and connected together to form a stacked structure; the number of the adhesive layer and the elastic substrate are respectively one, and at least the conductor of the FPC board is located between the adhesive layer and the elastic substrate; or the number of the adhesive layer is at least one, the number of the elastic substrate is two, at least the conductor of the FPC board is located between the two elastic substrates, and the adhesive layer is located on the side of the elastic substrate facing away from the FPC board; the adhesive layer is any one of an adhesive, an elastic film, a hot melt adhesive, and a hot melt adhesive film.
  • a protective film is provided on the upper surface and/or the lower surface of the stacked structure, and the protective film includes Any one of pattern paper, silicone oil paper, and release paper.
  • the FPC board is bonded and fixed to the elastic substrate, or the FPC board is composited with the elastic substrate by heat pressing.
  • the elastic substrate includes any one of an elastic film, an elastic rubber product, an elastic cloth, an elastic webbing, and an elastic film.
  • the number of the conductors is one, or the number of the conductors is multiple and the multiple conductors are connected in parallel, or one ends of the multiple conductors are conductive and the other ends are independent of each other, or the multiple conductors are distributed in a tree shape; the number of conductive cores in the conductor is one or more and the multiple conductive cores are arranged in parallel.
  • the number of the elastic FPC boards is at least two, the at least two elastic FPC boards are stacked to form a multi-layer structure, and at least one end of the at least two elastic FPC boards is conductively connected up and down.
  • the present invention further provides a method for manufacturing an elastic FPC board, comprising the following steps:
  • Discharging removing the excess part of the FPC board punched out, so that the punched FPC board includes one or more conductors, and the conductor includes an insulating layer and at least one conductive core located in the insulating layer, and the conductor is at least partially curved;
  • At least the conductor of the FPC board is laminated and connected with at least one elastic substrate.
  • the FPC board is pre-attached to an auxiliary substrate, wherein the auxiliary substrate is a release paper with adhesive; the FPC board is bonded and fixed to the elastic substrate, or the FPC board is hot-pressed and laminated to the elastic substrate.
  • the auxiliary substrate is a release paper with adhesive
  • the present invention further provides a product using an elastic FPC board, comprising at least one elastic FPC board as described in the present invention.
  • the product is a wearable product, which includes a wearable body, the elastic FPC board is arranged on the wearable body, and the wearable body includes clothing, shoes, hairbands, bracelets, hats, scarves, gloves, Any one of socks, smart glasses, headphones, and smart glasses;
  • the conductor is conductively connected to the power component arranged on the wearable body, and the power component includes one or more of a non-elastic FPC board, an elastic FPC board, a wire, an electronic component, a PCB board, and a power supply battery, and the electronic component includes any one or more of a sensor, an LED lamp, an IC chip, a capacitor, a resistor, an electrode sheet, a heating sheet, a luminous wire, a connector, a control switch, and a piercing terminal;
  • the conductive connection method includes any one or more of a dielectric connection, a non-media connection, and a piercing connection, and the conductive connection part is encapsulated to obtain
  • the present invention has the following beneficial effects:
  • the FPC board of the present invention includes one or more conductors, and the conductors are at least partially curved, and at least the conductors of the FPC board are connected to an elastic substrate, so that the present invention satisfies the function of elastic expansion and contraction, and the FPC board can be manufactured according to the traditional manufacturing method of the FPC board, and then punched, and the manufacturing process is simple.
  • the insulating layer of the conductor only needs to meet the insulation function without having elasticity.
  • the elastic substrate to which it is connected can position and protect the conductor so that it can be better reset after stretching.
  • the material selection of the elastic substrate can have more choices compared with the elastic insulator of the elastic FPC board in the prior art, so that its application and fixing method can have more choices and the application range is also wider.
  • the requirements of good wearing comfort and not easy to fall off after washing can be achieved.
  • FIG1 is a top view of an FPC board of the present invention according to Embodiment 1;
  • FIG. 2 is a cross-sectional schematic diagram of an FPC board of the present invention before punching and an auxiliary substrate in a combined state according to Embodiment 1;
  • FIG. 3 is a schematic cross-sectional view of a conductor of an FPC board of the present invention in accordance with Embodiment 1;
  • Example 4 is a top view of the elastic FPC board of the present invention in Example 1;
  • FIG5 is an enlarged schematic diagram of part A in FIG4 of Example 1;
  • Example 6 is a partial cross-sectional schematic diagram of an elastic FPC board of the present invention in Example 1;
  • Example 7 is another schematic structural diagram of the conductor of the FPC board of the present invention in Example 1;
  • Example 8 is another structural schematic diagram of the conductor of the FPC board of the present invention in Example 1;
  • Example 9 is another schematic structural diagram of the conductor of the FPC board of the present invention in Example 1;
  • Example 10 is another schematic structural diagram of the conductor of the FPC board of the present invention in Example 1;
  • FIG. 11 is a schematic diagram of the structure of the FPC board of the second embodiment of the present invention.
  • FIG. 12 is another structural schematic diagram of the FPC board of the second embodiment of the present invention.
  • FIG. 13 is another structural schematic diagram of an FPC board of the present invention in Embodiment 3.
  • FIG. 14 is a schematic diagram of the structure of the fourth embodiment of the present invention in a multi-layer state
  • 15 is a schematic structural diagram of the conductive portion of the fourth embodiment of the present invention in a multi-layer state
  • FIG. 16 is a schematic diagram of the structure of the FPC board of the fifth embodiment of the present invention.
  • FIG. 17 is a schematic diagram of another structure of the FPC board of the fifth embodiment of the present invention.
  • FIG. 18 is a schematic diagram of another structure of the FPC board of the fifth embodiment of the present invention.
  • FIG20 is an enlarged schematic diagram of part B in FIG19 of the fifth embodiment.
  • 21 is a cross-sectional schematic diagram of an elastic FPC board of Example 6 of the present invention.
  • FIG. 22 is a cross-sectional schematic diagram of an elastic FPC board of the present invention according to Embodiment 7;
  • FIG. 23 is a schematic cross-sectional view of an elastic FPC board of Embodiment 8 of the present invention.
  • FIG24 is a schematic diagram of the structure of a wearable product according to Embodiment 9 of the present invention.
  • FIG. 25 is a schematic structural diagram of a product using an elastic FPC board according to the tenth embodiment of the present invention.
  • 26 is a schematic structural diagram of a product using an elastic FPC board according to the eleventh embodiment of the present invention.
  • FIG. 27 is a schematic structural diagram of a product using an elastic FPC board according to the twelfth embodiment of the present invention.
  • 29 is a schematic structural diagram of a product using an elastic FPC board according to a fourteenth embodiment of the present invention.
  • FIG. 30 is a schematic structural diagram of a product using an elastic FPC board according to the fifteenth embodiment of the present invention.
  • FIG. 31 is a schematic diagram of the connection between the elastic FPC boards of the present invention.
  • 35 is a schematic diagram of the connection between the elastic FPC board and two PCB boards of the present invention.
  • 36 is a schematic diagram of the connection between the elastic FPC board and three PCB boards of the present invention.
  • 39 is another schematic diagram of a package of the connection portion between the elastic FPC boards of the present invention.
  • FIG40 is another schematic diagram of a package of the connection portion between the elastic FPC boards of the present invention.
  • 41 is a schematic diagram of the packaging of the connection portion of the elastic FPC board and electronic components of the present invention.
  • 43 is another packaging schematic diagram of the connection portion of the elastic FPC board and electronic components of the present invention.
  • FPC board 11. conductor, 111. insulating layer, 112. conductive core, 12. conducting part, 2. auxiliary substrate, 3. elastic substrate, 4. adhesive, 5. sensor, 6. connector, 7. LED lamp, 8. protective film, 9. adhesive layer, 10.
  • elastic FPC board 20. piercing terminal, 30. clothing, 40. heating plate, 50. control switch, 60. luminous wire, 70. PCB board, 80. electrode sheet, 90. socks, 100. wire, 110. thermoplastic material, 120. glue, 130. hot melt adhesive sheet.
  • first, second, etc. are only used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, nor can they be understood as indicating or implying relative importance.
  • plural means two or more.
  • and/or describes related objects.
  • An association relationship indicates that there can be three types of relationships. For example, A and/or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone.
  • an elastic FPC board of the present invention includes an FPC board 1 and at least one sheet-like elastic substrate 3, the FPC board 1 includes a conductor 11, the conductor 11 includes an insulating layer 111 and a conductive core 112 located in the insulating layer 111; the conductor 11 is at least partially curved so that the conductor 11 can be stretched and retracted along the length direction; the FPC board 1 at least includes the conductor 11 and the elastic substrate 3 stacked and connected together.
  • the FPC board 1 includes the conductor 11 and the conducting parts 12 located at both ends of the conductor 11, the conducting parts 12 are in conduction with the conductive core 112, and are used to conduct and connect with external power components (also referred to as electrical connection or electrical connection).
  • the conductor 11 is in a regular wavy shape, but it is not limited to this.
  • the conductor 11 can also be in an irregular wavy shape, as shown in FIG7 .
  • the conductor 11 can also be in a triangular wave shape (as shown in FIG8 ) or a sawtooth shape or a square wave shape, or in other special-shaped structures, as shown in FIG9 and FIG10 .
  • the conductor is partially curved, and the rest is straight.
  • the FPC board 1 is punched to form the conductor 11.
  • the spacing L between the two side edges of the conductive core 112 in the width direction of the conductor 11 and the outer edge of the insulating layer 111 in the width direction of the conductor 11 is greater than or equal to 0.1 mm, so that the waterproof performance of the conductor 11 after punching can be ensured.
  • the conductive core 112 may be made of copper foil, and the number of the conductive core 112 may be one or more. When the number of the conductive core 112 is more than one, the multiple conductive cores 112 may be arranged in parallel and insulated from each other.
  • the FPC board 1 is punched by a punching and cutting process, and before punching, the FPC board needs to be pre-pasted on an auxiliary substrate 2, as shown in FIG. 2, and the auxiliary substrate 2 can be a release paper with adhesive, etc. It is to ensure that the conductor 11 after punching is not deformed, misaligned, overlapped, etc., so as to facilitate the processing of the subsequent process; when punching, laser cutting, die cutting, ultrasonic punching and other processes can be used to punch out the required shape according to the design requirements.
  • the distance between the conductive core 112 in the conductor 11 and the punching edge must be greater than or equal to 0.1mm, that is, the distance L between the two side edges of the conductive core 112 in the width direction of the conductor 1 and the outer edge of the insulating layer 111 in the width direction of the conductor 1 is greater than or equal to 0.1mm, as shown in Figure 3.
  • the conductor 11 only includes the insulating layer 111 and the conductive core 112, but is not limited thereto.
  • the conductor also includes at least one shielding layer, which is arranged on the outer surface of the insulating layer, that is, the shielding layer is arranged on the upper surface and/or the lower surface of the insulating layer, and the shielding layer completely covers the area where the conductive core is located.
  • the number of the elastic substrates 3 is two, and the FPC board 1 has at least the conductor 11 connected between the two elastic substrates 3.
  • the two elastic substrates 3 are respectively in the shape of long strips, and the width of the lower elastic substrate 3 is greater than the width of the FPC board 1, and the width of the upper elastic substrate 3 is less than the width of the FPC board 1, but not limited to this.
  • the FPC board 1 is bonded or hot-pressed with the upper and lower elastic substrates 3 by an adhesive 4.
  • the adhesive 4 includes any one of an adhesive, an elastic film, a hot melt adhesive, a hot melt adhesive film, etc. The provision of the two elastic substrates 3 can better position the conductor 11.
  • the two elastic substrates 3 are elastic cloths respectively, but not limited thereto.
  • the elastic substrate 3 includes any one of an elastic film, an elastic rubber product, an elastic webbing, an elastic film, and the like.
  • the present invention provides an elastic FPC board, and the manufacturing method thereof comprises the following steps:
  • Discharging removing the excess part of the FPC board punched out, so that the punched FPC board includes one or more conductors, and the conductor includes an insulating layer and at least one conductive core located in the insulating layer, and the conductor is at least partially curved;
  • At least the conductor of the FPC board is laminated and connected with at least one elastic substrate.
  • the FPC board before punching the FPC board, the FPC board is pre-attached to an auxiliary substrate, wherein the auxiliary substrate is a release paper with adhesive; the FPC board is bonded and fixed to the elastic substrate, or the FPC board and the elastic substrate are heat-pressed and laminated together.
  • the auxiliary substrate is a release paper with adhesive
  • Adhesive 4 is used to bond or heat-press the side of the punched FPC board 1 facing away from the auxiliary substrate 2 to one of the elastic substrates 3;
  • the auxiliary substrate 2 is removed, and the other side of the FPC board 1 is bonded or hot-pressed to another elastic substrate 3 using an adhesive 4 to obtain the product shown in FIGS. 4 to 6 .
  • the elastic FPC board and its manufacturing method of the present invention wherein the FPC board 1 is directly manufactured by adopting the manufacturing process of the traditional FPC board and is punched, and the manufacturing process is simple, and the insulating layer 111 of the conductor 11 only needs to satisfy the insulation function, and does not need to have elasticity, and does not need to be used for subsequent application fixation.
  • the elastic substrate 3 connected thereto can not only position and protect the conductor 11, so that it can be better reset after stretching, prevent deformation, dislocation, displacement and overlap, etc., but also can be used for application fixation, and since the elastic substrate 3 only needs to have elasticity, and does not need to insulate the conductive core 112, the material selection of the elastic substrate 3 is wider.
  • the elastic substrate 3 can also be selected from any one of elastic film, elastic rubber product, elastic webbing, elastic film, etc., so that there are more choices for its application fixation method, and its application range is also wider. In particular, it meets the requirements of good wearing comfort and not easy to fall off after washing.
  • its elastic substrate 3 is preferably elastic cloth, which meets the requirements of good wearing comfort and not easy to fall off after washing.
  • the elastic cloth can be a part of the wearable body, and can also be fixed to the wearable body by sewing or other methods.
  • the elastic FPC board of the present invention is different from the above-mentioned embodiment 1.
  • the number of the conductors 11 is multiple, the multiple conductors 11 are arranged together, and the multiple conductors 11 can be distributed in parallel and in parallel, as shown in FIG11 ; the multiple conductors 11 can also be connected together at one end and independent of each other at the other end, as shown in FIG12 .
  • the elastic FPC board of the present invention is different from the above-mentioned second embodiment in that the plurality of conductors 11 are distributed in a tree-like manner, specifically in a multi-level tree-like manner, but not limited thereto.
  • the number of conductive cores in the conductor as the main branch is the sum of the number of conductive cores of each branch conductor at its end.
  • the difference between the elastic FPC board of the present invention and the above-mentioned embodiments is that the number of the elastic FPC boards 10 is at least two, the at least two elastic FPC boards 10 are stacked to form a multi-layer structure, and the conductive parts 12 at both ends of the at least two elastic FPC boards 10 are respectively connected to each other up and down.
  • the multi-layer structure can distribute the conductive cores in multiple layers through layered arrangement when the number of conductive cores is large, ensuring that the width of each layer of the elastic FPC board is small.
  • the difference between the elastic FPC board of the present invention and the above-mentioned embodiment 1 is that the electronic components are connected to the conductor 11 by SMT patch method, and the assembly part is provided with a packaging sealing layer.
  • the electronic components include one or more of LED lights, sensors, IC chips, capacitors, resistors and connectors.
  • the two ends of the conductor 11 are respectively connected with sensors 5 by SMT patch method, or, as shown in Figure 17, the two ends of the conductor 11 and the part between the two ends are respectively connected with sensors 5 by SMT patch method, or, as shown in Figure 18, the two ends of the two conductors 11 are respectively connected with sensors 5 by SMT patch method, and a connector 7 is connected between the two conductors 11 by SMT patch method, or, as shown in Figures 19 and 20, a plurality of LED lights 7 are connected between the two ends of the wavy conductor 11 by SMT patch method, so that the elastic FPC board of the present invention forms an LED light strip.
  • an elastic FPC board of the present invention is different from the above-mentioned embodiment 1 in that: the number of the elastic substrate 3 is one.
  • the FPC board 1 is also bonded or hot-pressed with the elastic substrate 3 by an adhesive 4, and the adhesive 4 includes any one of an adhesive, an elastic adhesive film, a hot melt adhesive, and a hot melt adhesive mold, and the adhesive 4 can be located between the FPC board 1 and the elastic substrate 3, and can also be located on the side of the FPC board 1 facing away from the elastic substrate 3.
  • the elastic substrate 3 is also an elastic cloth, but it is not limited thereto.
  • the elastic substrate includes any one of an elastic film, an elastic rubber product, an elastic webbing, an elastic film, etc.
  • FIG. 22 shows an elastic FPC board of the present invention.
  • the difference between the elastic substrate 3 and the above embodiments is that the number of the elastic substrate 3 is one, and the present invention further includes an adhesive layer 9.
  • the adhesive layer 9, the FPC board 1, and the elastic substrate 3 are stacked and connected together to form a stacked structure, and the FPC board 1 is located between the adhesive layer 9 and the elastic substrate 3.
  • a protective film 8 is provided on the upper surface of the stacked structure (i.e., the upper surface of the adhesive layer 9), and the protective film 8 includes any one of release paper, silicone oil paper, and anti-sticking paper.
  • the adhesive layer 9 is any one of an adhesive, an elastic film, a hot melt adhesive, and a hot melt adhesive film. Therefore, when the present invention is used, it only needs to remove the protective film 8, and it can be bonded to the application product through the adhesive layer 9.
  • FIG. 23 shows an elastic FPC board of the present invention.
  • the difference between the elastic FPC board of the seventh embodiment is that the number of the adhesive layers 9 and the number of the elastic substrates 3 are two respectively, the FPC board 1 is located between the two elastic substrates 3, and the two elastic substrates 3 are provided with adhesive layers 9 on the side facing away from the FPC board 1.
  • the upper surface and the lower surface of the stacked structure i.e., the outer surfaces of the two adhesive layers 9) are provided with protective films 8 respectively.
  • a product of the present invention using an elastic FPC board specifically a wearable product, includes a wearable body, and also includes the elastic FPC board as described in the present invention above, and the elastic FPC board is arranged on the wearable body.
  • the wearable body is clothing 30, specifically a pullover long-sleeved top, but not limited to this.
  • the wearable body can be a T-shirt, pants, vest, vest, etc.
  • the wearable body can also be any one of shoes, hairbands, bracelets, hats, scarves, gloves, socks, smart glasses, headphones, smart glasses, etc.
  • the conductive parts 12 at both ends of the conductor 11 are respectively connected to the power components provided on the wearable body (in this embodiment, the wearable body is clothing 30), and the power components include one or more of a non-elastic FPC board, an elastic FPC board, a wire, an electronic component, a PCB board, a power supply battery, etc., and the electronic component includes any one or more of a sensor, an LED lamp, an IC chip, a capacitor, a resistor, an electrode sheet, a heating sheet, a light-emitting wire, a connector, a control switch, a piercing terminal, etc.
  • the power components include one or more of a non-elastic FPC board, an elastic FPC board, a wire, an electronic component, a PCB board, a power supply battery, etc.
  • the electronic component includes any one or more of a sensor, an LED lamp, an IC chip, a capacitor, a resistor, an electrode sheet, a heating sheet, a light-emit
  • the power component includes a heating plate 40 and a control switch 50.
  • the conductive portion 12 at one end of the FPC board 1 is conductively connected to the heating plate 40, and the conductive portion 12 at the other end of the FPC board 1 is conductively connected to the control switch 50.
  • the FPC board 1 plays a conductive role.
  • the present invention has a heating function and plays a warming role. When the elastic FPC board is applied and fixed, its elastic substrate 3 (elastic cloth) can be directly sewn and fixed on the clothing 30, or the elastic substrate 3 can also constitute a part of the clothing 30.
  • the product using the elastic FPC board of the present invention combines electronics with traditional clothing, so that the product has certain functionality (such as heating and warmth preservation, EMS electrical stimulation, heart rate monitoring, blood pressure monitoring, motion capture, sports monitoring, etc.).
  • the elastic FPC board of the present invention is used to provide electrical conduction, data transmission, etc., so that the product is more comfortable to wear.
  • a product using an elastic FPC board of the present invention is different from the above-mentioned ninth embodiment in that: the power component includes a light-emitting wire 60 and a PCB board 70, the conductive part at one end of the FPC board 1 is conductively connected to the light-emitting wire 60, and the conductive part at the other end of the FPC board 1 is conductively connected to the PCB board 70. Therefore, the present invention has a luminous function and can play a warning role at night.
  • a product using an elastic FPC board of the present invention is different from the above-mentioned embodiments 9 and 10 in that: the power component includes two electrode sheets 80, and the conductive parts at both ends of the FPC board 1 are electrically connected to the electrode sheets 80 respectively; the clothing 30 is a cardigan-style long-sleeved top, but is not limited to this.
  • a product using an elastic FPC board of the present invention is different from the above-mentioned embodiments nine, ten, and eleven in that: the power component includes a plurality of sensors 5, and the conductor 11 of the FPC board 1 is connected with the plurality of sensors 5 by SMT patch method, which can be used for motion capture, heart rate monitoring, exercise monitoring, etc.
  • a product of the present invention using an elastic FPC board is different from the above-mentioned embodiments 9 to 12 in that: there are multiple FPC boards 1, and multiple LED lamps 7 are connected to the conductor 11 of each FPC using SMT patch method, and the multiple FPC boards 1 and the LED lamps 7 thereon are arranged and combined in an array.
  • a product using an elastic FPC board of the present invention is different from the above-mentioned embodiment thirteen in that a plurality of FPC boards 1 and a plurality of LED lamps 7 connected thereto form a “Z” shape, but it is not limited thereto.
  • a product using an elastic FPC board of the present invention is different from the above-mentioned embodiments 9 to 14 in that: the wearable body is a sock 90, the power component includes a heater 40 and a PCB board 70, the conductive portion at one end of the FPC board 1 is conductively connected to the heater 40, the conductive portion at the other end of the FPC board 1 is conductively connected to the PCB board 70, the heater 40 is located at the bottom of the sock, and the PCB The plate 70 is located on top of the side wall of the sock.
  • the present invention has a heating function.
  • An elastic FPC board of the present invention when applied to the above-mentioned products, has conductive connections between its conductive parts and various power components including dielectric connection (connection using solder paste, tin wire, conductive glue, etc.), non-dielectric connection (laser welding, ultrasonic welding or spot welding, etc.), piercing connection, SMT patch connection, etc., and the connections include the following: two FPC boards 1 are connected to each other, as shown in FIG31; the FPC board 1 is connected to the wire 100, as shown in FIG32; the FPC board 1 is connected to electronic components (such as sensors 5, etc.) using SMT patch method, as shown in FIG33; the FPC board 1 is connected to the connector 6, as shown in FIG34, etc.; the FPC board 1 is connected between two rigid PCB boards 70, as shown in FIG35; among multiple PCB boards 70, adjacent PCB boards 70 are respectively connected to the FPC board 1, as shown in FIG36; the FPC board 1 is pierced with the piercing terminal 20, as shown
  • the parts where the FPC board 1 is connected to the power components are secondary packaged to form a packaging sealing layer.
  • the secondary packaging methods include the following three:
  • thermoplastic material 110 PVC, TPE, PP, PE, ABS, PC, etc.
  • Glue potting and packaging Glue 120 (including one or more of polyurethane potting glue, silicone potting glue, epoxy resin potting glue, etc.) is poured into the conductive connection part between the FPC board 1 and the power component by equipment or manual method, and solidified at room temperature or heating conditions to become a thermosetting polymer insulating material with excellent performance, thereby achieving the purpose of bonding, sealing, potting and coating protection, as shown in Figures 40 and 41;
  • Hot melt adhesive hot pressing packaging process using a hot melt adhesive sheet 130 with release paper or cloth to perform hot pressing packaging on the conductive connection parts between the FPC board 1 and the power components, as shown in Figures 42 and 43.
  • the present invention provides an elastic FPC board, a manufacturing method thereof and a product using the elastic FPC board, and the unrelated parts are the same as the prior art or can be implemented by using the prior art.
  • the present invention discloses an elastic FPC board and a manufacturing method thereof and a product using the elastic FPC board.
  • the elastic FPC board includes an FPC board and at least one elastic substrate.
  • the FPC board includes one or more conductors.
  • the conductors include a non-elastic insulating layer and a conductive core located in the insulating layer.
  • the conductors are at least partially curved.
  • At least the conductors of the FPC board are connected to the elastic substrate.
  • the elastic substrate only needs to have elasticity without insulating the conductive core. Therefore, compared with the elastic insulator of the elastic FPC board in the prior art, the material selection of the elastic substrate can have more choices, so that the selection of its application fixing method is more, the application range is also wider, and it has industrial practicality.

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Abstract

本发明公开了一种弹性FPC板及其制作方法和应用弹性FPC板的产品，所述弹性FPC板包括FPC板和至少一弹性基材，所述FPC板包括一条或多条导电体，所述导电体包括非弹性的绝缘层和位于该绝缘层中的导电芯；所述导电体至少部分呈弯曲状；所述FPC板至少导电体连接在弹性基材上。所述弹性基材只需具备弹性能力，而无需对导电芯进行绝缘，因而，弹性基材的材质选择与现有技术的弹性FPC板的弹性绝缘体相比，可以有更多的选择，从而使其应用固定方式的选择更多，应用范围也更广。

Description

一种弹性FPC板及其制作方法和应用弹性FPC板的产品
本申请要求2022年11月23日向中国国家知识产权局，申请号为：20221147264.1，发明创造名称是：“一种弹性FPC板及其制作方法和应用弹性FPC板的产品”的中国专利申请为基础，并主张其优先权，该中国专利申请的公开内容在此作为整体引入本申请文本中。
技术领域
本发明涉及一种FPC板，特别是涉及一种弹性FPC板及其制作方法和应用弹性FPC板的产品。
背景技术
随着科技的快速进步，以及人民生活水平的提高，人们的运动意识、健康意识也日益增强，技术进步的同时也促进了一些穿戴产品(例如智能手表、智能眼镜、智能服装等)的发展。这类穿戴产品为了穿戴的舒适性，往往会采用弹性材料，相应的，通常会采用弹性导电线为穿戴产品上的功能器件进行电力或数据传输。然而，弹性导电线为实现弹性伸缩功能，通常是将导电线材在弹性轴芯外编织或缠绕而成，这会导致弹性导电线的直径较大，应用于穿戴产品时容易显得突兀，影响穿戴的舒适性。
柔性电路板(Flexible Printed Circuit，简称FPC)，又称软性电路板、挠性电路板等，其以质量轻、厚度薄、可自由弯曲折叠等优良特性而备受青睐。因此，采用弹性FPC板代替导电线应用于上述电子产品、穿戴产品，既不影响伸缩功能，又能够解决弹性导电线直径较大的问题。然而，由于现有技术的弹性FPC板的弹性绝缘体作为FPC板的基材，要具备绝缘能力，又要具备一定的弹性能力，使得弹性绝缘体的选材受限，一般只能选择塑胶、硅胶等材质，也使得这种弹性FPC的固定方式及应用范围存在较大的局限性。
发明内容
本发明针对现有技术存在的技术问题，提供了一种弹性FPC板及其制作方法和应用弹性FPC板的产品。
本发明解决其技术问题所采用的技术方案是：一种弹性FPC板，包括FPC板和至少一弹性基材，所述FPC板包括一条或多条导电体，所述导电体包括非弹性的绝缘层和位于该绝缘层中的至少一根导电芯，所述导电体至少部分呈弯曲状；所述FPC板中至少导电体连接在弹性基材上。
进一步的，所述导电芯在导电体宽度方向上的两侧边缘与所述绝缘层在导电体宽度方向上的外边缘之间的间距分别大于或等于0.1mm。
进一步的，所述导电体呈波浪状或锯齿状或方波状或三角波状；所述FPC板经冲切形成所述导电体，所述FPC板还包括露在所述绝缘层外的至少一导通部位，所述导通部位与所述导电芯相导通，所述至少一导通部位位于所述导电体的端部和/或所述导电体的两端之间。
进一步的，所述绝缘层的上表面和/或下表面设置屏蔽层。
进一步的，至少一导电体上采用SMT贴片方式连接有电子元器件，所述电子元器件包括LED灯、传感器、IC芯片、电容、电阻和连接器中的一种或几种。
进一步的，所述弹性基材的数量为一个，该弹性基材与所述FPC板层叠连接在一起形成层叠结构，或者，所述弹性基材的数量为两个，两个弹性基材与所述FPC板层叠连接在一起形成层叠结构，且所述FPC板至少导电体位于两个弹性基材之间。
进一步的，还包括粘合层，粘合层、所述FPC板、弹性基材层叠连接在一起形成层叠结构；所述粘合层、弹性基材的数量分别一个，所述FPC板至少导电体位于粘合层和弹性基材之间；或者，所述粘合层的数量为至少一个，所述弹性基材的数量为两个，所述FPC板至少导电体位于两个弹性基材之间，粘合层位于弹性基材背对FPC板的一面；所述粘合层为粘着剂、弹性胶膜、热熔胶、热熔胶膜中的任一种。
进一步的，所述层叠结构的上表面和/或下表面设有保护膜，所述保护膜包括离 型纸、硅油纸、防粘纸中的任一种。
进一步的，所述FPC板与所述弹性基材粘接固定，或者，所述FPC板与弹性基材热压复合在一起。
进一步的，所述弹性基材包括弹性膜、弹性橡胶制品、弹性布、弹性织带、弹性胶片中的任一种。
进一步的，所述导电体的数量为一个，或者，所述导电体的数量为多个，且多个导电体并联连接，或者，多个导电体的一端相导通，另一端相互独立，或者，多个导电体呈树状分布；所述导电体中的导电芯的数量为一个或多个，多个导电芯并列排布。
进一步的，所述弹性FPC板的数量为至少两个，该至少两个弹性FPC板叠加设置，形成多层结构，且该至少两个弹性FPC板的至少一端上下相导通连接。
本发明另提供一种弹性FPC板的制作方法，包括以下步骤：
对FPC板按预设形状进行冲切处理；
排料：去除FPC板冲切下来的多余部分，使冲切后的FPC板包括一条或多条导电体，且所述导电体包括绝缘层和位于该绝缘层中的至少一根导电芯，所述导电体至少部分呈弯曲状；
至少将所述FPC板的导电体与至少一弹性基材层叠连接在一起。
进一步的，对FPC板冲切前，预先将FPC板贴在辅助基材上，所述辅助基材为带胶的离型纸；所述FPC板与所述弹性基材粘接固定，或者，所述FPC板与弹性基材热压复合在一起。
本发明另提供一种应用弹性FPC板的产品，包括至少一如上述本发明所述的弹性FPC板。
进一步的，所述产品为穿戴产品，其包括可穿戴本体，所述弹性FPC板设置在可穿戴本体上，所述可穿戴本体包括服装、鞋子、发带、手环、帽子、围巾、手套、 袜子、智能眼镜、头戴式耳机、智能眼镜中的任一种；所述导电体与所述可穿戴本体上设置的电力部件导通连接，所述电力部件包括非弹性FPC板、弹性FPC板、导线、电子元器件、PCB板、供电电池中的一种或几种，所述电子元器件包括传感器、LED灯、IC芯片、电容、电阻、电极片、加热片、发光线、连接器、控制开关、刺破式端子中的任一种或几种；所述导通连接的方式包括有介质连接、无介质连接、刺破式连接中的任一种或几种，所述导通连接的部位通过封装得到封装密封层，所述封装方式包括注塑包胶封装、灌胶封装、热熔胶热压封装中的任一种或几种。
相较于现有技术，本发明具有以下有益效果：
本发明的FPC板包括一条或多条导电体，所述导电体至少部分呈弯曲状，且所述FPC板至少导电体连接在弹性基材上，使得本发明满足了弹性伸缩的功能，并且，所述FPC板可按照传统的FPC板的制作方式进行制作，再经冲切而成，制作工艺简单，其导电体的绝缘层只需满足绝缘功能即可，而无需具备弹性能力，其所连接的弹性基材，能够对导电体进行定位、防护，使其拉伸后更好的复位，并且，由于弹性基材只需具备弹性能力，而无需对导电芯进行绝缘，因而，弹性基材的材质选择与现有技术的弹性FPC板的弹性绝缘体相比，可以有更多的选择，从而使其应用固定方式可以有更多选择，应用范围也更广，特别是应用于穿戴产品时，可以通过选择合适的弹性基材，达到穿戴舒适性好、水洗不易脱落等要求。
以下结合附图及实施例对本发明作进一步详细说明；但本发明的一种弹性FPC板及其制作方法和应用弹性FPC板的产品不局限于实施例。
附图说明
图1是实施例一本发明的FPC板的俯视图；
图2是实施例一本发明的FPC板冲切前与辅助基材在组合状态的截面示意图；
图3是实施例一本发明的FPC板的导电体的截面示意图；
图4是实施例一本发明的弹性FPC板的俯视图；
图5是实施例一图4中A部分的放大示意图；
图6是实施例一本发明的弹性FPC板的局部截面示意图；
图7是实施例一本发明的FPC板的导电体的又一种结构示意图；
图8是实施例一本发明的FPC板的导电体的又一种结构示意图；
图9是实施例一本发明的FPC板的导电体的又一种结构示意图；
图10是实施例一本发明的FPC板的导电体的又一种结构示意图；
图11是实施例二本发明的FPC板的结构示意图；
图12是实施例二本发明的FPC板的又一种结构示意图；
图13是实施例三本发明的FPC板的又一种结构示意图；
图14是实施例四本发明在多层状态的结构示意图；
图15是实施例四本发明在多层状态的导通部位的结构示意图；
图16是实施例五本发明的FPC板的结构示意图；
图17是实施例五本发明的FPC板的又一种结构示意图；
图18是实施例五本发明FPC板的又一种结构示意图；
图19是实施例五本发明的弹性FPC板的俯视图；
图20是实施例五图19中B部分的放大示意图；
图21是实施例六本发明的弹性FPC板的截面示意图；
图22是实施例七本发明的弹性FPC板的截面示意图；
图23是实施例八本发明的弹性FPC板的截面示意图；
图24是实施例九本发明的穿戴产品的结构示意图；
图25本实施例十本发明的应用弹性FPC板的产品的结构示意图；
图26是实施例十一本发明的应用弹性FPC板的产品的结构示意图；
图27是实施例十二本发明的应用弹性FPC板的产品的结构示意图；
图28是实施例十三本发明的应用弹性FPC板的产品的结构示意图；
图29是实施例十四本发明的应用弹性FPC板的产品的结构示意图；
图30是实施例十五本发明的应用弹性FPC板的产品的结构示意图；
图31是本发明的弹性FPC板之间的连接示意图；
图32是本发明的弹性FPC板与导线的连接示意图；
图33是本发明的弹性FPC板与传感器的连接示意图；
图34是本发明的弹性FPC板与连接器的连接示意图；
图35是本发明的弹性FPC板与两块PCB板的连接示意图；
图36是本发明的弹性FPC板与三块PCB板的连接示意图；
图37是本发明的弹性FPC板与刺破式端子的连接示意图；
图38是本发明的弹性FPC板之间的连接部位的封装示意图；
图39是本发明的弹性FPC板之间的连接部位的又一种封装示意图；
图40是本发明的弹性FPC板之间的连接部位的又一种封装示意图；
图41是本发明的弹性FPC板与电子元器件等的连接部位的封装示意图；
图42是本发明的弹性FPC板与电子元器件等的连接部位的又一种封装示意图；
图43是本发明的弹性FPC板与电子元器件等的连接部位的又一种封装示意图；
其中，1、FPC板，11、导电体，111、绝缘层，112、导电芯，12、导通部位，2、辅助基材，3、弹性基材，4、粘合剂，5、传感器，6、连接器，7、LED灯，8、保护膜，9、粘合层，10、弹性FPC板，20、刺破式端子，30、服装，40、加热片，50、控制开关，60、发光线，70、PCB板，80、电极片，90、袜子，100、导线，110、热塑性材料，120、胶液，130、热熔胶片。
具体实施方式
本发明中，对于术语“第一”、“第二”等仅用于区别类似的对象，而不必用于描述特定的顺序或先后次序，也不能理解为指示或暗示相对重要性。在本申请的描述中，除非另有说明，“多个”是指两个或两个以上。“和/或”，描述关联对象的 关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
实施例一
请参见图1-图10所示，本发明的一种弹性FPC板，包括FPC板1和至少一个片状的弹性基材3，所述FPC板1包括一条导电体11，所述导电体11包括绝缘层111和位于该绝缘层111中的导电芯112；所述导电体11至少部分呈弯曲状，以使所述导电体11能沿长度方向伸缩；所述FPC板1至少导电体11与弹性基材3层叠连接在一起。
本实施例中，如图1所示，所述FPC板1包括所述导电体11和位于该导电体11的两端处的导通部位12，所述导电部位12与所述导电芯112相导通，并用于与外部的电力部件进行导通连接(又可称为电性连接或电连接)。所述导电体11整条呈规则的波浪状，但不局限于此，所述导电体11也可以呈不规则的波浪状，如图7所示。所述导电体11除了可以呈波浪状，还可以呈三角波状(如图8所示)或锯齿状或方波状，或者呈其它异型结构，如图9、图10所示。在其它实施例中，所述导电体局部呈弯曲状，其余部分则呈直线型等。
本实施例中，所述FPC板1经冲切形成所述导电体11。如图2所示，所述导电芯112在导电体11宽度方向上的两侧边缘与所述绝缘层111在导电体11宽度方向上的外边缘之间的间距L分别大于或等于0.1mm，如此，能够确保冲切后的导电体11的防水性能。
本实施例中，所述导电芯112可以采用铜箔材质，且所述导电芯112的数量可以为一根，也可以为多根，当导电芯112的数量为多根时，该多根导电芯112可以并列排布，并彼此绝缘。
本实施例中，所述FPC板1采用冲切排料工艺冲切而成，且冲切前需要将FPC板预先贴于辅助基材2上，如图2所示，所述辅助基材2可以是带胶离型纸等，目的 是确保冲切后的导电体11不变形、错位、跑位重叠等，方便进行后道工序的加工；冲切时，可以采用激光切割、刀模冲切、超声波冲切等工艺，按设计要求冲切出需要的形状。为了保证冲切后的防水性能，导电体11中的导电芯112距离冲切边缘的距离要大于或等于0.1mm，亦即，所述导电芯112在导电体1宽度方向上的两侧边缘与所述绝缘层111在导电体1宽度方向上的外边缘之间的间距L大于或等于0.1mm，如图3所示。
本实施例中，所述导电体11仅包括所述绝缘层111和导电芯112，但不局限于此，在其它实施例中，所述导电体还包括至少一屏蔽层，其设置在所述绝缘层外表面，亦即，所述绝缘层的上表面和/或下表面设置屏蔽层，且所述屏蔽层完全覆盖导电芯所在的区域。
本实施例中，如图4-图6所示，所述弹性基材3的数量为两个，所述FPC板1至少导电体11连接在两弹性基材3之间。两弹性基材3分别呈长条状，且在下的弹性基材3的宽度大于所述FPC板1的宽度，在上的弹性基材3的宽度小于FPC板1的宽度，但不局限于此。所述FPC板1采用粘合剂4与上、下两弹性基材3粘接或热压复合在一起。所述粘合剂4包括粘着剂、弹性胶膜、热熔胶、热熔胶膜等中的任一种。两弹性基材3的设置，能够更好地定位导电体11。
本实施例中，所述两弹性基材3分别为弹性布，但不局限于此，在其它实施例中，所述弹性基材3包括弹性膜、弹性橡胶制品、弹性织带、弹性胶片等中的任一种。
本发明的一种弹性FPC板，其制作方法包括以下步骤：
对FPC板按预设形状进行冲切处理；
排料：去除FPC板冲切下来的多余部分，使冲切后的FPC板包括一条或多条导电体，且所述导电体包括绝缘层和位于该绝缘层中的至少一根导电芯，所述导电体至少部分呈弯曲状；
至少将所述FPC板的导电体与至少一弹性基材层叠连接在一起。
本实施例中，对FPC板冲切前，预先将FPC板贴在辅助基材上，所述辅助基材为带胶的离型纸；所述FPC板与所述弹性基材粘接固定，或者，所述FPC板与弹性基材热压复合在一起。
具体，本发明的一种弹性FPC板，其详细的制作方法包括以下步骤：
将待冲切的FPC板贴在辅助基材2上；
采用激光、模具或超声波冲切等工艺，按设计要求冲切出需要的形状，并去除FPC板冲切下来的多余部分，使FPC板形成一条或多条所述导电体11；
采用粘合剂4将冲切后的FPC板1背对辅助基材2的一面与其中一弹性基材3粘接或热压复合在一起；
去除辅助基材2，采用粘合剂4将FPC板1的另一面与另一弹性基材3粘接或热压复合在一起上，得到如图4-图6所示的产品。
本发明的一种弹性FPC板及其制作方法，其FPC板1直接采用传统的FPC板的制作工艺制作，并经冲切而成，其制作工艺简单，且其导电体11的绝缘层111只需满足绝缘功能即可，而无需具备弹性能力，也无需用于后续应用固定。其所连接的弹性基材3，不仅能够对导电体11进行定位、防护，使其拉伸后更好的复位，防变形、错位、跑位重叠等，还能够用于应用固定，并且，由于弹性基材3只需具备弹性能力，而无需对导电芯112进行绝缘，因而，弹性基材3的材质选择更广泛，如上所述，所述弹性基材3除了可以选用弹性布，还可以选用弹性膜、弹性橡胶制品、弹性织带、弹性胶片等中的任一种，从而使其应用固定方式可以有更多选择，其应用范围也更广。特别的满足穿戴舒适性好、水洗不易脱落等要求，当本发明的弹性FPC板应用于穿戴产品时，其弹性基材3优选弹性布，达到穿戴舒适性好、水洗不易脱落等要求，此时，弹性布可以是可穿戴本体的一部分，也可以采用车缝等方式固定在可穿戴本体上。
实施例二
请参见图11、图12所示，本发明的一种弹性FPC板，其与上述实施例一的区别 在于：所述导电体11的数量为多条，多条导电体11设置在一起，且多条导电体11可以并列分布，并呈并联形式，如图11所示，所述多条导电体11也可以一端导通连接在一起，另一端则彼此独立，如图12所示。
实施例三
请参见图13所示，本发明的一种弹性FPC板，其与上述实施例二的区别在于：所述多条导电体11呈树状分布，具体呈多级树状分布，但不局限于此。此时，作为主支的导电体中的导电芯数量为其所在末端的各分支导电体的导电芯数量的总和。
实施例四
请参见图14、图15所示，本发明的一种弹性FPC板，其与上述各实施例的区别在于：所述弹性FPC板10的数量为至少两个，该至少两个弹性FPC板10叠加设置，形成多层结构，且该至少两个弹性FPC板10的两端的导通部位12分别上下相导通连接。所述多层结构的设置，可以在导电芯的数量较多的情况下，通过分层设置对导电芯进行多层分配，确保每层弹性FPC板的宽度较小。
实施例五
请参见图16-图20所示，本发明的一种弹性FPC板，其与上述实施例一的区别在于：所述导电体11上采用SMT贴片方式连接有电子元器件，且组装部位设有封装密封层。所述电子元器件包括LED灯、传感器、IC芯片、电容、电阻和连接器等中的一种或几种。具体，如图16所示，所述导电体11的两端分别采用SMT贴片方式连接有传感器5，或者，如图17所示，所述导电体11的两端及两端之间的部位分别采用SMT贴片方式连接有传感器5，或者，如图18所示，两条导电体11的两端分别采用SMT贴片方式连接有传感器5，且两条导电体11之间采用SMT贴片方式连接有一连接器7，或者，如图19、图20所示，呈波浪状的导电体11的两端之间采用SMT贴片方式连接有多个LED灯7，使本发明的弹性FPC板形成一条LED灯带。
实施例六
请参见图21所示，本发明的一种弹性FPC板，其与上述实施例一的区别在于：所述弹性基材3的数量为一个。
本实施例中，所述FPC板1同样采用粘合剂4与所述弹性基材3粘接或热压复合在一起，所述粘合剂4包括粘着剂、弹性胶膜、热熔胶、热熔胶模中的任一种，且所述粘合剂4除了可以位于FPC板1和弹性基材3之间，还可以位于FPC板1背对弹性基材3的一面上。本实施例中，所述弹性基材3同样为弹性布，但不局限于此，在其它实施例中，所述弹性基材包括弹性膜、弹性橡胶制品、弹性织带、弹性胶片等中的任一种。
实施例七
请参见图22所示，本发明的一种弹性FPC板，其与上述各实施例的区别在于：所述弹性基材3的数量为一个，本发明还包括一粘合层9，粘合层9、所述FPC板1、弹性基材3层叠连接在一起形成层叠结构，且FPC板1位于粘合层9和弹性基材3之间。所述层叠结构的上表面(即所述粘合层9的上表面)设有保护膜8，所述保护膜8包括离型纸、硅油纸、防粘纸中的任一种，所述粘合层9为粘着剂、弹性胶膜、热熔胶、热熔胶膜中的任一种。因此，本发明在应用时，只需去除保护膜8，即可通过粘合层9将其粘接于应用产品上。
实施例八
请参加图23所示，本发明的一种弹性FPC板，其与上述实施例七的区别在于：所述粘合层9的数量和弹性基材3的数量分别为两个，所述FPC板1位于两个弹性基材3之间，两个弹性基材3背对FPC板1的一面分别设有粘合层9。所述层叠结构的上表面和下表面(即两粘合层9的外表面)分别设有保护膜8。
因此，本发明在应用时，只需去除所述保护膜8，即可通过两粘合层9将其粘接于应用产品相对的两面之间。
实施例九
请参见图24所示，本发明的一种应用弹性FPC板的产品，具体为穿戴产品，包括可穿戴本体，还包括如上述本发明所述的弹性FPC板，所述弹性FPC板设置在所述可穿戴本体上。
本实施例中，所述可穿戴本体为服装30，具体为套头式的长袖上衣，但不局限于此，在其它实施例中，所述可穿戴本体可以是T恤、裤子、马甲、背心等。所述可穿戴本体除了可以是服装30，还可以是鞋子、发带、手环、帽子、围巾、手套、袜子、智能眼镜、头戴式耳机、智能眼镜等中的任一种。所述导电体11两端的导通部位12分别与可穿戴本体(本实施例中可穿戴本体为服装30)上设置的电力部件导通连接，所述电力部件包括非弹性FPC板、弹性FPC板、导线、电子元器件、PCB板、供电电池等中的一种或几种，所述电子元器件包括传感器、LED灯、IC芯片、电容、电阻、电极片、加热片、发光线、连接器、控制开关、刺破式端子等中的任一种或几种。
本实施例中，所述电力部件包括加热片40和控制开关50，所述FPC板1的其中一端的导通部位12与加热片40导通连接，所述FPC板1的另一端的导通部位12与控制开关50导通连接。所述FPC板1起导电作用，本发明具有加热功能，起到保暖作用。所述弹性FPC板进行应用固定时，可直接将其弹性基材3(为弹性布)车缝固定在服装30上，或者，也可以使弹性基材3构成服装30的一部分。
本发明的一种应用弹性FPC板的产品，其通过电子与传统服装相结合，使得该产品具有一定的功能性(如：加热保暖、EMS电刺激、心率监测、血压监测、动作捕捉、运动监测等)。其采用本发明的弹性FPC板提供导电、数据传输等，使得产品穿戴舒适性更好。
实施例十
请参见图25所示，本发明的一种应用弹性FPC板的产品，其与上述实施例九的区别在于：所述电力部件包括发光线60和PCB板70，所述FPC板1的其中一端的导通部位与发光线60导通连接，所述FPC板1的另一端的导通部位与PCB板70导通连 接。因此，本发明具有发光功能，在夜间能够起到警示作用。
实施例十一
请参见图26所示，本发明的一种应用弹性FPC板的产品，其与上述实施例九、十的区别在于：所述电力部件包括两电极片80，所述FPC板1两端的导通部位分别与电极片80电连接；所述服装30为开衫式的长袖上衣，但不局限于此。
实施例十二
请参见图27所示，本发明的一种应用弹性FPC板的产品，其与上述实施例九、十、十一的区别在于：所述电力部件包括多个传感器5，所述FPC板1的导电体11上采用SMT贴片方式连接有所述多个传感器5，可用于动作捕捉、心率监测、运动监测等。
实施例十三
请参见图28所示，本发明的一种应用弹性FPC板的产品，其与上述实施例九-实施例十二的区别在于：所述FPC板1的数量为多个，且各FPC的导电体11上采用SMT贴片方式连接有多个LED灯7，多个FPC板1及其上的LED灯7按阵列进行排列组合。
实施例十四
请参见图29所示，本发明的一种应用弹性FPC板的产品，其与上述实施例十三的区别在于：多个FPC板1及其上连接的多个LED灯7组成“Z”字形，但不局限于此。
实施例十五
请参见图30所示，本发明的一种应用弹性FPC板的产品，其与上述实施例九-实施例十四的区别在于：所述可穿戴本体为袜子90，所述电力部件包括加热40和PCB板70,所述FPC板1的其中一端的导通部位与加热片40导通连接，所述FPC板1的另一端的导通部位与PCB板70导通连接，所述加热片40位于袜子底部，所述PCB 板70位于袜子的侧壁顶部。因此，本发明具有加热功能。
本发明的一种弹性FPC板，其应用于上述产品时，其导通部位与各电力部件的导通连接包括有介质连接(采用锡膏、锡丝、导电胶等进行连接)、无介质连接(激光焊接、超声波焊接或点焊等)、刺破式连接、SMT贴片连接等，且连接包括以下几种：两FPC板1相互连接，如图31所示；FPC板1与导线100连接，如图32所示；FPC板1与电子元器件(如传感器5等)采用SMT贴片方式进行连接，如图33所示；FPC板1与连接器6相连接，如图34等；FPC板1连接在两硬性的PCB板70之间，如图35所示；多个PCB板70中，相邻的PCB板70分别与FPC板1相连接，如图36所示；FPC板1与刺破式端子20进行刺破式连接，如图37所示。
为达到防水、耐腐蚀、可水洗、耐老化等保护作用，对FPC板1与电力部件导通连接的部位进行二次封装，形成封装密封层。所述二次封装方式包括以下三种：
1、注塑包胶：使用热塑性材料110(PVC、TPE、PP、PE、ABS、PC等)在FPC板1与电力部件的导通连接部位直接注塑成型，如图38、39所示；
2、灌胶封装：将胶液120(包括聚氨酯灌封胶、有机硅灌封胶、环氧树脂灌封胶等中的一种或几种)用设备或手工方式灌至FPC板1与电力部件的导通连接部位处，在常温或加热条件下固化成为性能优异的热固性高分子绝缘材料，从而达到粘接、密封、灌封和涂敷保护的目的，如图40、图41所示；
3、热熔胶热压封装工艺，使用带离型纸或者带布料的热熔胶片130对FPC板1与电力部件的导通连接部位进行热压封装，如图42、图43所示。
本发明的一种弹性FPC板及其制作方法和应用弹性FPC板的产品，未涉及部分均与现有技术相同或可采用现有技术加以实现。
上述实施例仅用来进一步说明本发明的一种弹性FPC板及其制作方法和应用弹性FPC板的产品，但本发明并不局限于实施例，凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均落入本发明技术方案的保护范围内。
工业实用性
本发明公开了一种弹性FPC板及其制作方法和应用弹性FPC板的产品，所述弹性FPC板包括FPC板和至少一弹性基材，所述FPC板包括一条或多条导电体，所述导电体包括非弹性的绝缘层和位于该绝缘层中的导电芯；所述导电体至少部分呈弯曲状；所述FPC板至少导电体连接在弹性基材上。所述弹性基材只需具备弹性能力，而无需对导电芯进行绝缘，因而，弹性基材的材质选择与现有技术的弹性FPC板的弹性绝缘体相比，可以有更多的选择，从而使其应用固定方式的选择更多，应用范围也更广,具有工业实用性。

Claims (16)

  1. 一种弹性FPC板，其特征在于：包括FPC板和至少一弹性基材，所述FPC板包括一条或多条导电体，所述导电体包括非弹性的绝缘层和位于该绝缘层中的至少一根导电芯，所述导电体至少部分呈弯曲状；所述FPC板中至少导电体连接在弹性基材上。
  2. 根据权利要求1所述的弹性FPC板，其特征在于：所述导电芯在导电体宽度方向上的两侧边缘与所述绝缘层在导电体宽度方向上的外边缘之间的间距分别大于或等于0.1mm。
  3. 根据权利要求1所述的弹性FPC板，其特征在于：所述导电体呈波浪状或锯齿状或方波状或三角波状；所述FPC板经冲切形成所述导电体，所述FPC板还包括露在所述绝缘层外的至少一导通部位，所述导通部位与所述导电芯相导通，所述至少一导通部位位于所述导电体的端部和/或所述导电体的两端之间。
  4. 根据权利要求1所述的弹性FPC板，其特征在于：所述绝缘层的上表面和/或下表面设置屏蔽层。
  5. 根据权利要求1所述的弹性FPC板，其特征在于：至少一导电体上采用SMT贴片方式连接有电子元器件，所述电子元器件包括LED灯、传感器、IC芯片、电容、电阻和连接器中的一种或几种。
  6. 根据权利要求1所述的弹性FPC板，其特征在于：所述弹性基材的数量为一个，该弹性基材与所述FPC板层叠连接在一起形成层叠结构，或者，所述弹性基材的数量为两个，两个弹性基材与所述FPC板层叠连接在一起形成层叠结构，且所述FPC板至少导电体位于两个弹性基材之间。
  7. 根据权利要求1所述的弹性FPC板，其特征在于：还包括粘合层，粘合层、所述FPC板、弹性基材层叠连接在一起形成层叠结构；所述粘合层、弹性基材的数量分别一个，所述FPC板至少导电体位于粘合层和弹性基材之间；或者，所述粘合层的 数量为至少一个，所述弹性基材的数量为两个，所述FPC板至少导电体位于两个弹性基材之间，粘合层位于弹性基材背对FPC板的一面；所述粘合层为粘着剂、弹性胶膜、热熔胶、热熔胶膜中的任一种。
  8. 根据权利要求6或7所述的弹性FPC板，其特征在于：所述层叠结构的上表面和/或下表面设有保护膜，所述保护膜包括离型纸、硅油纸、防粘纸中的任一种。
  9. 根据权利要求6或7所述的弹性FPC板，其特征在于：所述FPC板与所述弹性基材粘接固定，或者，所述FPC板与弹性基材热压复合在一起。
  10. 根据权利要求1或6或7所述的弹性FPC板，其特征在于：所述弹性基材包括弹性膜、弹性橡胶制品、弹性布、弹性织带、弹性胶片中的任一种。
  11. 根据权利要求1所述的弹性FPC板，其特征在于：所述导电体的数量为一个，或者，所述导电体的数量为多个，且多个导电体并联连接，或者，多个导电体的一端相导通，另一端相互独立，或者，多个导电体呈树状分布；所述导电体中的导电芯的数量为一个或多个，多个导电芯并列排布。
  12. 根据权利要求1的弹性FPC板，其特征在于：所述弹性FPC板的数量为至少两个，该至少两个弹性FPC板叠加设置，形成多层结构，且该至少两个弹性FPC板的至少一端上下相导通连接。
  13. 一种弹性FPC板的制作方法，其特征在于：包括以下步骤：
    对FPC板按预设形状进行冲切处理；
    排料：去除FPC板冲切下来的多余部分，使冲切后的FPC板包括一条或多条导电体，且所述导电体包括绝缘层和位于该绝缘层中的至少一根导电芯，所述导电体至少部分呈弯曲状；
    至少将所述FPC板的导电体与至少一弹性基材层叠连接在一起。
  14. 根据权利要求13所述的弹性FPC板的制作方法，其特征在于：对FPC板冲切前，预先将FPC板贴在辅助基材上，所述辅助基材为带胶的离型纸；所述FPC板与 所述弹性基材粘接固定，或者，所述FPC板与弹性基材热压复合在一起。
  15. 一种应用弹性FPC板的产品，其特征在于：包括至少一如权利要求1-12中任一项所述的弹性FPC板。
  16. 根据权利要求15所述的应用弹性FPC板的产品，其特征在于：所述产品为穿戴产品，其包括可穿戴本体，所述弹性FPC板设置在可穿戴本体上，所述可穿戴本体包括服装、鞋子、发带、手环、帽子、围巾、手套、袜子、智能眼镜、头戴式耳机、智能眼镜中的任一种；所述FPC板与所述可穿戴本体上设置的电力部件导通连接，所述电力部件包括非弹性FPC板、弹性FPC板、导线、电子元器件、PCB板、供电电池中的一种或几种，所述电子元器件包括传感器、LED灯、IC芯片、电容、电阻、电极片、加热片、发光线、连接器、控制开关、刺破式端子中的任一种或几种；所述导通连接的方式包括有介质连接、无介质连接、刺破式连接中的任一种或几种，所述导通连接的部位通过封装得到封装密封层，所述封装方式包括注塑包胶封装、灌胶封装、热熔胶热压封装中的任一种或几种。
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