WO2024108553A1 - 显示面板以及显示装置 - Google Patents
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- WO2024108553A1 WO2024108553A1 PCT/CN2022/134374 CN2022134374W WO2024108553A1 WO 2024108553 A1 WO2024108553 A1 WO 2024108553A1 CN 2022134374 W CN2022134374 W CN 2022134374W WO 2024108553 A1 WO2024108553 A1 WO 2024108553A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
Definitions
- the present disclosure relates to the field of display technology, and in particular to a display panel and a display device.
- display quality In the field of display products, the display quality of display products needs to be tested before they leave the factory, and qualified display products are allowed to flow into the user end. Among them, display quality includes the color uniformity and brightness consistency of the display screen.
- Binning refers to the sorting of light-emitting elements used before packaging, also known as light-emitting chips, such as LED (Light-Emitting Diode) chips, so that chips of the same quality grade are classified into one grade, that is, the same Bin level.
- LED Light-Emitting Diode
- the present disclosure provides a display panel, comprising:
- a substrate a light-emitting layer located on one side of the substrate, and an encapsulation layer located on a side of the light-emitting layer away from the substrate;
- the light-emitting layer includes a plurality of light-emitting elements, and the encapsulation layer includes a cut-off filter film layer; wherein the plurality of light-emitting elements generate emitted light of at least one color;
- the cut-off filter film layer includes a plurality of filter regions, and one filter region is configured to filter emission light of one color so that the wavelength range of the emission light passing through the filter region is smaller than the wavelength range of the emission light.
- the wavelength range of the outgoing light of each color passing through the cut-off filter layer is a range in which the difference between the wavelength and the central wavelength of the emitted light of the color is less than or equal to 15 nm.
- the orthographic projection of the cut-off filter film layer on the substrate covers the entire surface of the substrate.
- the cut-off filter film layer includes a plurality of filter regions, and orthographic projections of the plurality of filter regions on the substrate do not overlap with each other.
- the orthographic projection of one of the filter areas on the substrate covers the orthographic projection of at least one of the light-emitting elements that produces emitted light of the same color on the substrate, so that the filter area filters the emitted light emitted by the light-emitting element covered by it.
- the cut-off filter film layer includes a plurality of sub-film layers stacked in layers, and every two adjacent sub-film layers have refractive indices of different magnitudes.
- the refractive index of one sub-layer is greater than 2, and the refractive index of the other sub-layer is less than 2.
- the film material of one sub-layer includes at least one of Ta2O5 , TiO3 , TiO2 , and ZrO2 ; the film material of the other sub-layer includes at least one of SiO2 , MgF2 , CeF3 , Al2O3 , and Y2O3 .
- the cut-off filter film layer includes a first film layer material and a second film layer material with different refractive indices, wherein one sub-film layer of each two adjacent sub-film layers is made of the first film layer material, and the other sub-film layer is made of the second film layer material.
- the first film layer material includes Ta 2 O 5
- the second film layer material includes SiO 2 .
- the number of the plurality of sub-membrane layers is greater than or equal to 9 and less than or equal to 16.
- the number of sub-film layers in the filter area corresponding to the emitted light of the color with a longer wavelength is greater than the number of sub-film layers in the filter area corresponding to the emitted light of the color with a shorter wavelength.
- different sub-membrane layers have different thicknesses.
- the thickness of the filter area corresponding to the emitted light of the color with a longer wavelength is greater than the thickness of the filter area corresponding to the emitted light of the color with a shorter wavelength.
- the encapsulation layer further includes a composite adhesive layer located on the side of the light-emitting layer facing away from the substrate, and the cutoff filter layer is located between the composite adhesive layer and the light-emitting layer, or located on the side of the composite adhesive layer facing away from the light-emitting layer.
- the composite adhesive layer includes at least one of a diffusion adhesive layer, a transparent adhesive layer and a black adhesive layer; wherein, in the case of including the diffusion adhesive layer, the diffusion adhesive layer is disposed close to the light-emitting layer.
- the plurality of light emitting elements include light emitting elements that emit blue light, light emitting elements that emit green light, and light emitting elements that emit red light.
- the light emitting element is a sub-millimeter light emitting diode.
- the present disclosure also provides a display device, comprising the display panel described in any one or more of the above embodiments.
- the display panel disclosed in the present invention includes a substrate, a light-emitting layer and an encapsulation layer, wherein the encapsulation layer can encapsulate the light-emitting layer, and the encapsulation layer includes a cutoff filter film layer, which is configured to allow the emission light emitted by the light-emitting layer to be filtered so that the wavelength range of the output light passing through the cutoff filter film layer is smaller than the wavelength range of the emission light.
- the cut-off filter film layer allows the light of the light emitting element to pass through, and the wavelength range of the light emitted after passing through the film layer is compressed, the difference between the wavelengths of the light emitted by the light emitting element after passing through is smaller, that is, the wavelength range is compressed. Since the wavelength range is compressed, the color purity of the light emitted from the display panel is improved, and the color uniformity is improved.
- the requirements for the wavelength range of the light emitted by the light-emitting element are reduced, and the wavelength range of the light emitted by the light-emitting element can be allowed to be wider.
- the wavelength range can be limited to a smaller range through the cut-off filter film layer in the encapsulation layer during the later encapsulation, thereby improving the color purity and uniformity of the display panel, thereby ensuring that the display quality of the display panel can still be guaranteed when the light-emitting element is binned with coarse granularity.
- the use of the encapsulation layer disclosed in the present invention can reversely allow coarse-grained binning, reduce the fineness of binning, and thus avoid the problem of increased difficulty in binning.
- FIG1 schematically shows a schematic structural diagram of a display panel of the present disclosure
- FIG2 schematically shows a cross-sectional structure diagram of a display panel in some embodiments
- FIG3 schematically shows a cross-sectional structure diagram of a display panel in some other embodiments
- FIG4 schematically shows a top view of the display panel shown in FIG2 ;
- FIG5a schematically shows a top view of a display panel
- FIG5 b schematically shows a top view of yet another display panel
- FIG6 schematically shows a top view of the display panel shown in FIG3 ;
- FIG7 schematically shows a schematic diagram of the filtering process of the cut-off filter film layer
- FIG8 schematically shows the thickness and material arrangement of each sub-layer in the entire cut-off filter layer
- FIG9 schematically shows a bar chart of the thickness and material arrangement of each sub-layer in the entire cut-off filter layer
- FIG10 schematically shows a schematic diagram of light transmittance after passing through a full-surface cutoff filter film layer
- FIG11 schematically shows the thickness and material arrangement of each sub-layer in the filter area for filtering blue light in the cut-off filter layer
- FIG12 schematically shows a schematic diagram of light transmittance after passing through a filter area for blue light filtering
- FIG13 schematically shows the thickness and material arrangement of each sub-layer in the filter area for filtering green light in the cut-off filter layer
- FIG14 schematically shows a schematic diagram of light transmittance after filtering the green light in the filter area
- FIG15 schematically shows the arrangement of the thickness and materials of each sub-layer in the filter area for filtering red light in the cut-off filter layer
- FIG16 schematically shows a schematic diagram of light transmittance after filtering the red light in the filter area
- chips with wavelength distribution within 2nm and brightness change control band within 15% may be classified into one level, that is, the same bin level.
- chips will be tested and sorted according to wavelength, luminous intensity, voltage, etc., and divided into more bins and categories.
- Binning equipment will automatically pack chips into different bin boxes according to the set test standards. Due to the increasing requirements for LED binning, the number of bin levels has increased. The binning equipment has increased from 32bin to 64bin, but it still cannot meet the needs of production and market.
- the difficulty of binning is related not only to the refinement requirements of binning (Bin level), but also to the size of the chip.
- the refinement requirements are more stringent, and probes are often required to complete the test.
- the sorting process requires precise machinery and image recognition systems, which places extremely high demands on the detection equipment and detection accuracy.
- the present disclosure proposes a solution to fully or partially solve the above-mentioned technical problems.
- the core of the solution is: through the packaging layer of the display panel, the wavelength range of the light emitted by the light-emitting element is compressed, that is, the wavelength band of the emitted light is limited, so that the wavelength range of the light emitted by the light-emitting element is narrower after passing through the packaging layer, thereby achieving a higher color uniformity effect and improving the display quality.
- the cut-off filter film layer allows the light of the light-emitting element to pass through, and is configured to filter the emitted light emitted by the light-emitting layer, so that the wavelength range of the emitted light passing through the cut-off filter film layer is smaller than the wavelength range of the emitted light.
- the cut-off filter film layer allows the light of the light-emitting element to pass through, and is configured to filter the emitted light emitted by the light-emitting layer, so that the wavelength range of the emitted light passing through the cut-off filter film layer is smaller than the wavelength range of the emitted light.
- the display panel may specifically include the following structure:
- multiple light-emitting elements 1021 generate emission light of at least two colors; that is, at least two colors of emission light can be generated in the light-emitting layer, wherein one light-emitting element 1021 generates emission light of one color, and among multiple light-emitting elements, some light-emitting elements 1021 can generate emission light of one color, and some light-emitting elements can generate emission light of another color.
- the cut-off filter layer 103 is configured to filter the emitted light from the light-emitting layer 102 so that the wavelength range of the emitted light passing through the cut-off filter layer 103 is smaller than the wavelength range of the emitted light.
- R, G, and B represent the colors of the emitted light emitted by the corresponding light-emitting elements.
- the substrate 101 can be made of glass and the thickness can be set to 0.5 mm (millimeter). It can serve as a supporting component for the light-emitting element 1021.
- the front side of the substrate 101 (the side close to the light-emitting element 1021) is the metal wiring of the LED driving circuit, and the side and back sides are bound COF (Chip On Flex, or Chip On Film).
- the base material can also be other materials, such as PCB material.
- a plurality of light-emitting elements 1021 are arranged in an array in the light-emitting layer 102, and a barrier layer may or may not be provided in the gaps between the light-emitting elements 1021.
- an encapsulation layer may be provided on the light-emitting layer 102, which, on the one hand, protects the light-emitting layer 102 so that the light-emitting elements 1021 in the light-emitting layer 102 are not damaged or exposed; on the other hand, it may also support the light-emitting layer 102.
- the encapsulation layer can allow the emission light emitted by the light-emitting layer 102 to pass through to realize the display function of the display panel. Specifically, as mentioned above, in order to reversely reduce the binning fineness of the light-emitting element 1021, the encapsulation layer can be improved so that the emission light emitted by the light-emitting layer 102 can pass through the encapsulation layer, and the wavelength range of the emitted light becomes narrower.
- a cutoff filter film layer 103 can be configured in the encapsulation layer.
- the cutoff filter film layer 103 has a filtering function, which can allow light within a wavelength range to pass through, but not allow light outside the wavelength range to pass through, so that the wavelength range of the output light after passing through the cutoff filter film layer 103 is narrowed compared to the wavelength range of the emitted light, thereby making the output light purer and the color display quality better.
- the light-emitting layer 102 can emit light of multiple colors, wherein each color corresponds to a wavelength range.
- the wavelength range of red light is generally 625nm to 740nm
- the wavelength range of blue light is generally 400nm to 480nm
- the wavelength range of green light is generally 492nm to 577nm (nanometers).
- the cut-off filter layer 103 can filter the light of each color in a targeted manner, thereby narrowing the wavelength range of the emitted light of each color.
- the cut-off filter layer includes multiple filter areas, and one filter area is configured to filter the emitted light of one color, as shown in FIG3 , including a red light filter area 1031, a red light filter area 1032, and a red light filter area 1033.
- the wavelength range of the emitted light passing through each filter area is smaller than the wavelength range of the emitted light of one color targeted by the filter area.
- multiple filters can be set so that each filter area covers a light-emitting element of one color.
- the light emitting layer 102 emits green light and red light.
- the light emitting element 1021 includes a chip emitting red light and a chip emitting green light.
- the wavelength range of the emitted red light is between 650nm and 700nm
- the wavelength range of the emitted green light is between 525nm and 570nm.
- the filter area corresponding to the red light in the cut-off filter film layer 103 can be configured to allow red light between 660nm and 690nm to pass through, but not allow red light of other wavelengths to pass through; the filter area corresponding to the green light allows green light between 540nm and 570nm to pass through, but not allow green light of other wavelengths to pass through.
- the wavelength of the transmitted red light is distributed within a range of 15nm from the central wavelength of 675nm
- the wavelength of the transmitted green light is distributed within a range of 15nm from the central wavelength of 555nm; thus, even if the wavelength range of the red and green light-emitting elements 1021 is relatively wide, the purity of the red and green light can still be improved after passing through the encapsulation layer to ensure the display quality. Furthermore, it can be reversely allowed to reduce the fineness requirements for the wavelength range of the light-emitting element 1021 of each luminous color in the binning, thereby reducing the difficulty of binning.
- the configurations of the filter areas for filtering different colors may be different or the same, wherein the configuration may include the material, thickness, and size of the filter areas in the plane direction of the substrate.
- the cut-off filter film layer used in the present disclosure is used when the light-emitting layer emits light of one color.
- the cut-off filter film layer 103 can filter the light of the color, thereby narrowing the wavelength range of the emitted light.
- the light-emitting layer 102 emits red light, that is, the light-emitting element 1021 emits red light
- the wavelength range of the emitted red light is between 650nm and 700nm.
- the cut-off filter film layer 103 can be configured to allow red light between 660nm and 690nm to pass through, but not allow red light of other wavelengths to pass through.
- the wavelength of the transmitted red light is distributed within the 15nm range of the central wavelength 675. Therefore, even if the wavelength range of the red light emitted by the light-emitting element 1021 is wide, the purity of the red light can still be improved after passing through the encapsulation layer to ensure the display quality. In other words, it can be reversely allowed to reduce the fineness requirements for the wavelength range of the light-emitting element 1021 in the binning, thereby reducing the difficulty of binning.
- multiple filter areas can be set according to the distribution area of the light-emitting element 1021.
- every n adjacent light-emitting elements 1021 correspond to a filter area.
- each display area can be filtered in a targeted manner.
- a large-sized rectangular display panel can be designed with four display areas to display data from different sources.
- the arrangement of the light-emitting elements 1021 in the light-emitting layer 102 can be adaptively arranged into four areas. Accordingly, the cut-off filter film layer 103 can be divided into four filter areas.
- the above is only an exemplary description, wherein the light-emitting element 1021 may also include chips that produce other colors, such as purple, yellow, white, etc.
- the encapsulation layer disclosed in the present invention is still applicable, that is, the purity of other colors can still be improved through the encapsulation layer.
- the working principle of the cut-off filter layer 103 is as follows:
- the light reflected on the two surfaces of the film layer has an optical path exactly equal to half a wavelength, thus canceling each other out, which greatly reduces the reflection loss of light and enhances the intensity of the transmitted light.
- light reflection will occur at the interface between the two media. If the medium does not absorb light, the interface is an optical surface, and the light is incident vertically, then the reflectivity R satisfies the following relationship (I):
- the refractive index of the cut-off filter layer 103 satisfies the following relation (II):
- n is the refractive index of the film
- d is the thickness of the film
- ⁇ is the wavelength
- the required refractive index of the film can be achieved by designing the film thickness and the film material, and then the reflectivity of light of a certain wavelength can be controlled through the relationship (1) so that the light is completely reflected or allowed to pass, thereby realizing the above-mentioned filtering function.
- the wavelength range of the red light emitted by the display panel needs to be limited to between 670nm and 680nm (including the wavelength at the end points). Assume that 6,000 of the 10,000 light emitting elements 1021 meet this condition.
- the binning method of the related art 10,000 light-emitting elements 1021 will be binned at a granularity of 10nm, 5nm or even smaller, and one or more bin-level chips will be selected for packaging. Since the wavelength range of the required red light after emission is 670nm to 680nm, the light-emitting elements 1021 belonging to each bin level in the range of 670nm to 680nm will be used for subsequent packaging. In other words, according to the binning method of the related art, at least 4,000 light-emitting elements 1021 will be discarded (more may be discarded due to binning errors, etc.).
- the present disclosure will set a cut-off filter film layer 103 in the packaging layer in the subsequent packaging stage
- the packaging solution of the present disclosure when adopted, the binning can be performed according to a granularity of 20nm or even higher in the pre-binning stage. Assuming that according to this granularity, the chips with a wavelength range of 650nm to 700nm can be divided into one bin level, and assuming that there are 8,000 chips with a wavelength range of 650nm to 700nm, then 8,000 chips can be used for subsequent packaging. In this way, the fineness of binning is reduced, and fewer chips will be discarded.
- the light-emitting layer 102 includes 8000 red-light emitting elements 1021, whose wavelength range is 650nm to 700nm, and the selected central wavelength is 675nm. Assuming that the wavelength range of the red light that needs to pass through the cut-off filter layer 103 is within the range of 5nm or less from 675nm, the wavelength range of the red light after passing through the cut-off filter layer 103 is 670nm to 680nm, and among the 8000 red-light emitting elements 1021, 6000 light-emitting elements 1021 emit red light with a wavelength range of 670nm to 680nm, so that 2000 light-emitting elements 1021 that reflect red light of other wavelength bands can be packaged into the display panel. That is to say, in the pre-order binning stage, even if the light-emitting elements 1021 of 650nm to 700nm are divided into one Bin level, it does not affect the subsequent display quality of the display panel.
- the wavelength range of the light emitted by the light-emitting element 1021 can be made wider.
- the wavelength range can be limited to a smaller range through the cut-off filter film layer 103 in the packaging layer during the later packaging, thereby improving the color purity and uniformity of the display panel, thereby ensuring that the display quality of the display panel can still be guaranteed when the light-emitting element 1021 is binned with coarse granularity.
- the cut-off filter layer 103 may include a filter area designed for each color of the light emitting element 1021, that is, the cut-off filter layer 103 may be designed separately for each color, so that each color of light may be filtered by the corresponding cut-off filter layer 103. In this way, the pertinence and accuracy of filtering each color of light may be improved, so that the wavelength of each color of light transmitted is within the preset wavelength band corresponding to the color of light.
- the light emitting element 1021 may be an LED (light emitting diode) chip 1021. Further, in some other embodiments, the light emitting element 1021 may be a sub-millimeter light emitting diode, specifically, a Mini light emitting element 1021, or a Micro light emitting element 1021. Among them, the Mini light emitting element 1021 is between the traditional LED and the Micro LED, and its size is generally between 100 ⁇ m and 300 ⁇ m; while the size of the Micro light emitting element 1021 can be as small as 50 ⁇ m, with a diameter of about 0.002 inches, and is a chip of the micron order.
- the Mini light emitting element 1021 is between the traditional LED and the Micro LED, and its size is generally between 100 ⁇ m and 300 ⁇ m; while the size of the Micro light emitting element 1021 can be as small as 50 ⁇ m, with a diameter of about 0.002 inches, and is a chip of the micron order.
- the display panel may be a mini LED display panel or a Micro LED display panel.
- the Mini light emitting element or the Micro light emitting element due to its small size, the difficulty of binning is very large. Therefore, it is particularly necessary to reduce the difficulty of binning these light emitting elements 1021.
- the encapsulation layer proposed in the present disclosure is used in the mini LED display panel or the Micro LED display panel, the light filtering function of the encapsulation layer can be used to achieve a wider binning band for the light emission band of the sub-millimeter light emitting diode, thereby greatly reducing the difficulty of binning of the micro Micro LED display technology.
- the light emitting layer 102 can emit light of at least one color. For example, green light and blue light, or red light and blue light, or green light and red light, or all three colors of light. In other embodiments, the light emitting layer 102 can emit light of a single color, for example, red light, blue light, or green light.
- the light-emitting elements 1021 emitting blue light, the light-emitting elements 1021 emitting green light, and the light-emitting elements 1021 emitting red light can be arranged in an array in the light-emitting layer 102.
- the light-emitting elements 1021 emitting the same color light can be arranged in a row.
- the light-emitting elements in each adjacent row emit light of different colors.
- the light-emitting elements in one row all emit blue light
- the light-emitting elements in another row all emit green light, as shown in FIG. 5b.
- the light-emitting elements 1021 emitting the same color light can be arranged in a column.
- the light-emitting elements in each adjacent column emit light of different colors.
- the light-emitting elements in one column all emit blue light
- the light-emitting elements in another column all emit green light. This case can be shown in FIG. 5a.
- a light emitting element 1021 emitting blue light, a light emitting element 1021 emitting green light, and a light emitting element 1021 emitting red light may constitute a pixel unit, and each light emitting element 1021 in the pixel unit may be referred to as a sub-pixel, for example, the light emitting element 1021 emitting blue light may be a sub-pixel.
- the wavelength range of the outgoing light of each color passing through the cut-off filter layer 103 satisfies the following condition: the difference between the wavelength of the outgoing light of each color and the central wavelength of the emitted light of the color is less than or equal to 15 nm.
- the central wavelength of the emitted light may refer to the median of the wavelength range of the emitted light, or may also be a wavelength of the emitted light selected according to the requirements. For example, taking red light as an example, the selected central wavelength may be 625nm, or may be other wavelengths such as 620nm, 640nm.
- the refractive index of the cut-off filter film layer 103 for each color may be set according to the above-mentioned relational expressions (I) and (II), so as to achieve the function of filtering the light of each color, so that the wavelength range of the emitted light of each color passing through the cut-off filter film layer 103 is a range in which the difference from the central wavelength of the emitted light is less than or equal to 15nm.
- the light-emitting layer 102 can emit red light, green light and blue light.
- the central wavelength of the wavelength range of the emitted red light is 625nm
- the central wavelength of the green light is 520nm
- the central wavelength of the blue light is 475nm.
- the wavelength range of the blue light passing through the cut-off filter layer 103 is controlled at 475 ⁇ 15nm
- the wavelength range of the green light is controlled at 520 ⁇ 15nm
- the wavelength range of the red light is controlled at 625 ⁇ 15nm.
- the light emitted by the light-emitting layer 102 may also be other light, such as purple light, yellow light, etc.
- each color of light transmitted can be controlled within a range where the difference from the central wavelength of the emitted light is less than or equal to 15nm.
- the wavelength range of the emitted light of each color passing through the cut-off filter layer 103 may also be set to be a range where the difference from the central wavelength of the emitted light is less than or equal to other nanometers, such as 10 nm, or a smaller wavelength range.
- the cut-off filter layer 103 filters the emitted light, the narrower the wavelength range of the emitted light passing through the cut-off filter layer 103, thereby making the emitted light purer.
- the wavelength range of each color of the emitted light passing through the cut-off filter layer 103 can be set to meet the following condition: the difference between the wavelength and the central wavelength of the emitted light of the color is less than or equal to 5nm. In this way, the human eye cannot observe the color change, further improving the display quality.
- the encapsulation layer may include a composite adhesive layer 201.
- the composite adhesive layer 201 may be composed of multiple layers of adhesive layers stacked on top of each other.
- the composite adhesive layer 201 may achieve the following functions:
- the display panel includes a substrate 101, a light-emitting layer 102, and an encapsulation layer, wherein in these embodiments, the encapsulation layer includes: a composite adhesive layer 201 located on the side of the light-emitting layer 102 away from the substrate 101, wherein the cut-off filter film layer 103 is located between the composite adhesive layer 201 and the light-emitting layer 102, or, located on the side of the composite adhesive layer 201 away from the light-emitting layer 102.
- the encapsulation layers include a composite adhesive layer 201 and a cutoff filter film layer 103; as shown in FIG. 2 , the cutoff filter film layer 103 is located on the side of the composite adhesive layer 201 away from the light-emitting layer 102, that is, the display panel is stacked in sequence from close to the substrate 101 to far away from the substrate 101, with the light-emitting layer 102, the composite adhesive layer 201 and the cutoff filter film layer 103 being stacked in sequence.
- the cutoff filter layer 103 is located between the light-emitting layer 102 and the composite adhesive layer 201 . That is, the display panel is stacked in sequence from close to the substrate 101 to far away from the substrate 101 , including the light-emitting layer 102 , the cutoff filter layer 103 and the composite adhesive layer 201 .
- the cut-off filter layer 103 can achieve the screening effect on the light emitted by the light-emitting element 1021 , so that the wavelength range of the outgoing light passing through the cut-off filter layer 103 is smaller than the wavelength range of the emitted light.
- the composite adhesive layer 201 includes at least one of a stacked diffusion adhesive layer 105 , a transparent adhesive layer 106 , and a black adhesive layer 107 .
- the diffusion adhesive layer 105 is included, the diffusion adhesive layer 105 is disposed close to the light emitting layer 102 .
- the composite adhesive layer 201 may include a stacked diffusion adhesive layer 105 and a black adhesive layer 107 , or may include a stacked diffusion adhesive layer 105 , a transparent adhesive layer 106 and a black adhesive layer 107 .
- the composite adhesive layer 201 may include a stacked diffusion adhesive layer 105, a transparent adhesive layer 106, and a black adhesive layer 107.
- the diffusion adhesive layer 105 is located on the side of the light-emitting layer 102 away from the substrate 101
- the transparent adhesive layer 106 is located on the side of the diffusion adhesive layer 105 away from the substrate 101
- the black adhesive layer 107 is located on the side of the transparent adhesive layer 106 away from the substrate 101.
- the composite adhesive layer 201 may include a stacked diffusion adhesive layer 105 and a black adhesive layer 107.
- a first substrate layer 108 is disposed between the cut-off filter film layer 103 and the diffusion adhesive layer 105, and the first substrate layer 108 can support the cut-off filter film layer, and the black adhesive layer 107 is disposed on the side of the diffusion adhesive layer 105 away from the substrate 101.
- the composite adhesive layer 201 may also include a diffusion adhesive layer 105 and a transparent adhesive layer 106. It should be noted that the diffusion adhesive layer 105 may be disposed close to the light emitting layer 102.
- the encapsulation layer may also include a second substrate layer 104 arranged in the outermost layer.
- the second substrate layer 104 may be located on the side of the cut-off filter membrane layer facing away from the substrate 101, or, as shown in Figure 3, may be located on the side of the black glue layer 107 in the composite glue layer 201 facing away from the substrate 101.
- the second substrate layer 104 is made of glass or PMMA, and the cut-off filter film layer is evaporated on the lower surface of the second substrate layer 104.
- a sol-gel coating device can be used to evaporate the cut-off filter film layer on the lower surface of the second substrate layer 104.
- the sol-gel coating device can be operated at room temperature and pressure, has high film uniformity, and controllable microstructure, and is suitable for substrates of different shapes and sizes.
- the cut-off filter film layer with a high laser damage threshold can be obtained by controlling the formula and preparation process.
- the function of the diffusion adhesive layer 105 is to make the emitted light generated by the light-emitting layer 102 more uniform at the front and side viewing angles.
- the diffusion adhesive layer 105 can avoid the color difference caused by the viewing angle, so that the size and light type of the RGB three-color light-emitting element 1021 at a large viewing angle are close to the same. This is to avoid the color shift on the surface of the direct display screen as the viewing angle changes, that is, the color shift phenomenon of the display picture changing from white to light red and then to light cyan from the front viewing angle to the side viewing angle.
- the coordinate inflection point of the color deviation of the visual color appears at a wide viewing angle of 50° to 60°.
- this color deviation phenomenon is related to the light pattern mismatch and asymmetry between LED bare chips (due to the difference in the internal structure of the R chip and the GB chip, the light pattern is different). Therefore, the color deviation problem in the front and side views can be improved by the diffusion glue layer 105, ensuring the color uniformity of the light emitted by the display device at various viewing angles.
- the material of the diffusion glue layer includes TiO 2 , and can actually be TiO 2 powder.
- the particle size of TiO 2 is greater than or equal to 10 nm and less than or equal to 300 nm.
- the diffusion glue layer 105 can select transparent silica gel as a matrix, add diffusive particles, such as TiO 2 powder, the particle size of the TiO 2 powder can be 10 nm to 300 nm, and the thickness can be 50 ⁇ m.
- the transparent adhesive layer 106 is used as a film thickness supplement layer, and its thickness can be 100 ⁇ m. That is, the transparent adhesive layer 106 is used as a thickness compensation to increase the thickness of the composite adhesive layer 201. After the thickness of the composite adhesive layer 201 is increased, the light emitting element 1021 below can be protected from being exposed.
- the black glue layer 107 can reduce the reflectivity of the metal wiring on the substrate 101, and at the same time, shield the uneven wiring surface of the substrate 101, so that the display screen has better uniformity.
- the black glue layer 107 uses black carbon black particles mixed in a transparent silica gel matrix, and the particle size ranges from 10nm to 500nm.
- the black glue layer 107 may be supported by black carbon black particles mixed in a transparent silica gel matrix, and the particle size of the black carbon black particles ranges from 10 nm to 500 nm.
- the thickness of the composite adhesive layer 201 is greater than the thickness of the light-emitting element 1021.
- the total thickness of the composite adhesive layer 201 can be set to 150 ⁇ m to 175 ⁇ m; the firmness and wear resistance of the film layer can be enhanced. In this way, the light-emitting element 1021 is not exposed to the outside due to the protection of the composite adhesive layer 201, thereby avoiding the problem of erosion and wear.
- the cut-off filter layer 103 is described in detail below:
- the cut-off filter film layer 103 can be a structure of a whole-layer design, that is, it is a complete film layer.
- the configurations of different filter areas can be the same.
- the materials of different filter areas can be the same, or the materials and thicknesses can be the same, wherein adjacent filter areas can be adjacent to each other.
- FIG. 4 a top view schematic diagram of a display panel in some embodiments is shown. As shown in FIG. 4 , the orthographic projection of the cut-off filter film layer 103 on the substrate 101 covers the entire surface of the substrate 101, wherein the cut-off filter film layer 103 can allow the emission light emitted by multiple light-emitting elements 1021 to pass through.
- the cut-off filter film layer 103 may cover the entire surface of the light-emitting layer 102, that is, the cut-off filter film layer 103 may be a whole-layer regular film system.
- the cut-off filter film layer 103 may be composed of multiple stacked sub-film layers (described in detail in subsequent embodiments).
- each prepared sub-film layer is a whole-layer film system, which can facilitate the evaporation of the cut-off filter film layer 103 and reduce the process difficulty.
- the entire cut-off filter layer 103 can cover all the light emitting elements 1021, thereby filtering the emitted light emitted by the entire light emitting layer 102, that is, the cut-off filter layer 103 can allow all or part of the emitted light emitted by the light emitting element 1021 to pass through. As described above, if there are 10,000 light emitting elements 1021 packaged in the light emitting layer 102, the red light emitted by 8,000 chips is allowed to pass through the cut-off filter layer 103, that is, the light of part of the light emitting element 1021 is allowed to pass through.
- the configurations of the filter areas corresponding to emission lights of different colors may be different, that is, the materials and/or thicknesses of the filter areas corresponding to emission lights of different colors are different.
- the materials of the filter areas corresponding to emission lights of different colors are different, or the thicknesses are different, or both the materials and the thicknesses are different.
- one filter area can cover one light emitting element, or cover multiple light emitting elements 1021 of the same light emitting color.
- the orthographic projection of one filter area on the substrate covers the orthographic projection of at least one light emitting element that generates light emitting of the same color on the substrate, so that the filter area filters the light emitting light emitted by the light emitting element covered by it.
- the orthographic projection of the filter area on the substrate 101 may cover the orthographic projection of at least one light emitting element 1021 on the substrate 101, so that the filter area allows the emission light emitted by the light emitting element 1021 covered by it to pass through, but does not allow the emission light emitted by the light emitting element 1021 not covered by it to pass through.
- the cut-off filter film layer 103 may only filter the emission light of the light emitting element 1021 covered by the filter area, and may not filter the emission light of the light emitting element 1021 not covered by it.
- the orthographic projection of a filter area on the substrate may cover one light-emitting element, or may cover multiple light-emitting elements that generate light of the same color, or may cover all light-emitting elements that generate light of the same color.
- the light-emitting element 1021 includes an R chip (emitting red light), a G chip (emitting green light) and a B chip (emitting blue light).
- the cut-off filter film layer 103 includes a plurality of filter regions, and the orthographic projections of the plurality of filter regions on the substrate 101 do not overlap with each other; wherein the orthographic projection of one filter region on the substrate 101 covers the orthographic projection of at least one light-emitting element 1021 of the same color on the substrate 101, so that one filter region filters the emitted light of one color.
- the orthographic projection of a filter area on the substrate 101 can cover the orthographic projection of a light emitting element 1021 of the same color on the substrate 101, so that each light emitting element 1021 has its own independent cut-off filter film to achieve independent light screening for each light emitting element 1021.
- a filter area can filter the emission light emitted by the light emitting element 1021 covered by it, and not filter the emission light emitted by the light emitting element 1021 not covered by it.
- the orthographic projection of a filter area on the substrate 101 can cover the orthographic projection of all or part of the light-emitting elements 1021 of the same color on the substrate 101.
- all or part of the light-emitting elements 1021 emitting the same color can filter light through the same cut-off filter film.
- a filter area covers all light-emitting elements 1021 of the same color.
- multiple light-emitting elements 1021 of each color can be arranged in an array on the substrate 101, so that the light-emitting elements 1021 emitting the same color are located in a row or a column, and all the light-emitting elements 1021 in a row or a column pass through their own independent cutoff filter films to perform targeted light screening on the light emitted by the light-emitting elements 1021 in the row or the column.
- a filter area covers a light-emitting element 1021.
- each light-emitting element 1021 has its own separate cutoff filter film.
- multiple light-emitting elements 1021 of each color can be arranged in an array on the substrate 101, so that the light-emitting elements 1021 emitting the same color are located in a row or a column; alternatively, there is no need for an array arrangement.
- the cut-off filter film layer 103 includes a plurality of filter areas, and the orthographic projections of the plurality of filter areas on the substrate 101 do not overlap each other.
- the non-overlapping may mean that there is no overlapping portion between adjacent filter areas.
- the adjacent filter areas may be adjacent, that is, two adjacent filter areas may be in contact without a gap. Alternatively, there is a gap between adjacent filter areas.
- a barrier material may be provided between the adjacent filter areas, and the barrier material may prohibit the emission light from passing through, or allow part of the emission light to pass through.
- the orthographic projection of a filter area on the substrate 101 can cover the orthographic projection of a light emitting element 1021 on the substrate 101, that is, when a filter area covers a light emitting element 1021, there is a gap between the filter areas, and the gap can leave sufficient tolerance when preparing a separate filter area for each light emitting element 1021, thereby reducing the difficulty of preparing a separate filter area for each light emitting element 1021 and improving the accuracy of screening light of different colors in this case.
- Figure 6 refer to Figure 6.
- the orthographic projection of a filter area on the substrate 101 covers the orthographic projections of multiple light-emitting elements 1021 of the same luminous color on the substrate 101, there may be a gap between the filter areas, and sufficient manufacturing tolerance may also be left to reduce the difficulty of manufacturing.
- the relationship between the size of the filter area and the size of the light emitting element 1021 can satisfy the following relationship (III):
- L is the side length of the chip
- x is the size of the filter area. Specifically, as shown in FIG. 6 , x may be the side length of the filter area.
- the above-mentioned relationship (three) can also be used to limit the size of the filter area, where, as shown in Figure 5, in this case, x can represent the size in the direction from R light-emitting element 1021 to G light-emitting element 1021.
- each filter area can filter the reflected light of one color. Since the wavelength range of the emitted light of each color is different, the wavelength range of the light passing through the cut-off filter film layer 103 can also be different.
- the filter areas can be set to prepare the corresponding cut-off filter film layer 103 for each color separately, so as to achieve targeted filtering. Compared with the method of preparing the entire film system, it is less difficult to design the cut-off filter film layer 103 for each color of emitted light separately. Therefore, more precise filtering can be achieved, making the emitted light purer.
- the cutoff filter film layer 103 needs to filter the emission light emitted by the light-emitting layer 102 so that the wavelength range of the output light passing through the cutoff filter film layer 103 is smaller than the wavelength range of the emission light.
- the cutoff filter film layer 103 may include a plurality of stacked sub-film layers, and each two adjacent sub-film layers have different refractive indices.
- the cut-off filter film layer 103 can be composed of multiple sub-film layers that are stacked. Moreover, each two adjacent sub-film layers have refractive indices of different sizes, that is, the multiple sub-film layers can be arranged alternately with high and low refractive indices for each two adjacent sub-film layers.
- the refractive index of each sub-film layer can be designed, so that the emitted light of the light-emitting layer 102 can be filtered layer by layer by multiple sub-film layers, and finally the emitted light of the required wavelength band can be transmitted (the light that passes through the last sub-film layer of the cut-off filter layer is called the output light).
- the light-emitting layer 102 generates emission lights of multiple colors
- a whole layer of cut-off filter film layer 103 an embodiment in which multiple filter areas are configured the same
- the orthographic projection of the cut-off filter film layer 103 on the substrate 101 covers the entire surface of the substrate 101, then the cut-off filter film layer 103 will filter the emission lights of multiple colors at the same time.
- the filter area includes multiple sub-film layers, wherein the sides of the filter area are aligned, that is, the sides of the sub-film layers are flush.
- the side of the filter area is covered by one of the sub-film layers, such as the uppermost sub-film layer.
- FIG. 7 a schematic diagram of the filtering process of the cut-off filter film layer 103 is shown.
- the emission light of green, blue and red generated by the light-emitting layer 102 as an example, multiple sub-film layers are stacked from close to the light-emitting element 1021 to away from the light-emitting element 1021, and a total of K layers are designed, K is greater than or equal to 9 and less than or equal to 16.
- the light-emitting layer 102 generates green light, blue light and red light that enter the first layer, filters out light of one wavelength, for example, allows light of a band of green light to pass through, that is, reflects the light of this wavelength back, and allows light of other wavelengths to pass through, for example, allows red light and blue light to pass through, and then these lights allowed to pass through the first layer enter the second layer. Since the refractive index of the second layer is different from that of the first layer, light of another wavelength will be filtered out, and so on.
- the red light, blue light and green light are filtered on the corresponding sub-film layers, so that the wavelength range of the transmitted light is gradually narrowed, that is to say, each color of light passing through the cut-off filter film layer 103 becomes purer.
- the refractive index of one sub-layer is greater than 2, and the refractive index of the other sub-layer is less than 2.
- multiple sub-film layers are alternately arranged with high and low refractive indices.
- a better filtering effect can be achieved, that is, when the high and low refractive indices are alternately arranged, the color of the emitted light can be made purer.
- the refractive index of one sub-layer is greater than 2, and the refractive index of the other sub-layer is less than 2.
- the difference in refractive index between the sub-layer with a refractive index greater than 2 and the sub-layer with a refractive index less than 2 can be relatively large, for example, the difference can be set to 0.5 or 0.8 which is higher than 0.5, and specifically, 0.5, 0.6, 0.7 and 0.8 can be selected. Each difference is described in detail in the subsequent specific embodiments.
- the setting of the refractive index can set different sub-film layers to correspond to different refractive indices.
- the difference in the refractive index of each two adjacent sub-film layers can be selected as: 0.5, 0.6, 0.7 and 0.8.
- the number of the plurality of sub-membrane layers may be greater than or equal to 9 and less than or equal to 16.
- the number of its multiple sub-film layers can be greater than or equal to 10 and less than or equal to 15, and preferably, can be composed of 13 sub-film layers.
- the filter areas corresponding to emission lights of different colors may be composed of different numbers of sub-film layers.
- the number of sub-film layers in the filter area corresponding to emission lights of colors with longer wavelengths is greater than the number of sub-film layers in the filter area corresponding to emission lights of colors with shorter wavelengths.
- the lower the wavelength range of the emission light the fewer the number of sub-film layers in the filter area.
- the filter area corresponding to the blue light may be composed of 9 sub-film layers
- the filter area corresponding to the green light may be composed of 14 sub-film layers
- the filter area corresponding to the red light may be composed of 16 sub-film layers.
- different sub-membrane layers may have different thicknesses.
- the refractive index is related to the wavelength and thickness. Therefore, when the wavelength is known, the refractive index can be set by changing the thickness to achieve the desired degree of refraction of the emitted light of a certain wavelength.
- the thickness of each sub-film layer can be simulated by software based on equations (1) and (2) according to the actual filtering requirements.
- each sub-film layer can have its own thickness, so that even if the material of the sub-film layer is the same, the refractive index can be fine-tuned by changing the thickness, so that fine filtering of light within the same wavelength range can be achieved.
- the refractive index can be fine-tuned by changing the thickness, so that fine filtering of light within the same wavelength range can be achieved.
- the thickness of the filter area corresponding to the emission light of the longer wavelength is greater than the thickness of the filter area corresponding to the emission light of the shorter wavelength.
- the thickness of the filter area corresponding to the emission light of the color with a longer wavelength can be greater than the thickness of the filter area corresponding to the emission light of the color with a shorter wavelength.
- the thickness of the filter area for filtering blue light can be smaller than the filter area for filtering green light
- the thickness of the filter area for filtering green light can be smaller than the filter area for filtering red light.
- the thickness of the filter area can also be achieved by setting the number of sub-film layers in the filter area, where the number of sub-film layers in the filter area corresponding to the emission light of the color with a longer wavelength is greater than the number of sub-film layers in the filter area corresponding to the emission light of the color with a shorter wavelength in every two colors of emission light.
- the thickness of the corresponding filter area is increased by increasing the number of sub-film layers.
- the filter area corresponding to blue light can be composed of 9 sub-film layers
- the filter area corresponding to green light can be composed of 14 sub-film layers
- the filter area corresponding to red light can be composed of 16 sub-film layers.
- the surface of the cut-off filter layer is not flush.
- the cut-off filter layer is arranged close to the light emitting element, that is, arranged on the side of the light emitting element away from the substrate 101, when preparing the composite adhesive layer on the side of the cut-off filter layer away from the substrate, the first substrate layer 108 may be first covered on the side of the cut-off filter layer away from the substrate, as shown in FIG3, and the upper surface of the cut-off filter layer is flattened by the first substrate layer 108.
- a transparent adhesive layer may be covered on the side of the cut-off filter layer away from the substrate, and the upper surface of the transparent adhesive layer is flush, and then a composite adhesive layer is prepared on the side of the transparent adhesive layer away from the substrate, thereby compensating for the step difference caused by the different thicknesses of the filter areas, avoiding the generation of bubbles at the step difference, and improving the display quality of the display panel.
- the refractive index of a substance depends mainly on the material, and the thickness can fine-tune the refractive index (for nano-scale materials, the thickness can affect the refractive index).
- the refractive index of one sub-layer is greater than 2, and the refractive index of the other sub-layer is less than 2.
- a material with a refractive index greater than 2 can be selected as a high-refractive-index film material, and a material with a refractive index less than 2 can be selected as a low-refractive-index film material.
- the film layer material of one of the sub-film layers includes at least one of Ta 2 O 5 , TiO 3 , TiO 2 , and ZrO 2
- the film layer material of the other sub-film layer includes at least one of SiO 2 , MgF 2 , CeF 3 , Al 2 O 3 , and Y 2 O 3 .
- the Chinese name of Ta2O5 is tantalum pentoxide
- the Chinese name of TiO3 is titanium trioxide
- the Chinese name of TiO2 is titanium dioxide
- the Chinese name of ZrO2 is zirconium dioxide
- the Chinese name of SiO2 is silicon dioxide
- the Chinese name of MgF2 is magnesium difluoride
- the Chinese name of CeF3 is cerium difluoride
- the Chinese name of Al2O3 is aluminum trioxide
- the Chinese name of Y2O3 is yttrium trioxide.
- one sub-layer uses a high refractive index film material, wherein the high refractive index film material includes Ta2O5 , TiO3 , TiO2 and ZrO2 .
- the high refractive index film material includes Ta2O5 , TiO3 , TiO2 and ZrO2 .
- one material among Ta2O5 , TiO3 , TiO2 and ZrO2 can be selected, or multiple materials thereof can be selected.
- the other sub-layer uses low refractive index film materials including SiO2 , MgF2 , CeF3 , Al2O3 and Y2O3 .
- low refractive index film materials including SiO2 , MgF2 , CeF3 , Al2O3 and Y2O3 .
- one material among SiO2 , MgF2 , CeF3 , Al2O3 and Y2O3 can be selected , or multiple materials thereof can be selected .
- the refractive index of each material is as follows:
- the above-mentioned film layer materials can be used for production.
- the film layer materials used in different sub-film layers can be different, as long as the high and low refractive indexes are alternately stacked. For example, there are 9 sub-film layers.
- the film layer material of the first sub-film layer can be Ta 2 O 5
- the film layer material of the second sub-film layer can be SiO 2
- the film layer material of the third sub-film layer can be TiO 3
- the film layer material of the fourth sub-film layer can be MgF 2
- the film layer material of the fifth sub-film layer can be TiO 2.
- the cut-off filter film layer 103 can be composed of two film layer materials with different refractive indices and good adhesion, so that the adhesion between adjacent sub-film layers is improved and warping is not easy, thereby optimizing the yield of the display panel.
- every two adjacent sub-membrane layers can be stacked by overlapping the two film layer materials, thereby forming a plurality of sub-membrane layers.
- the cut-off filter film layer 103 includes a first film layer material and a second film layer material with different refractive indices, wherein one of every two adjacent sub-film layers is made of the first film layer material, and the other sub-film layer is made of the second film layer material.
- the first film layer material can be any one of the above-mentioned Ta 2 O 5 , TiO 3 , TiO 2 , and ZrO 2 , or can be a film layer material with good adhesion.
- the second film layer material can be any one of SiO 2 , MgF 2 , CeF 3 , Al 2 O 3 , and Y 2 O 3 , or can be a film layer material with good adhesion.
- the first film layer material includes Ta 2 O 5 and the second film layer material includes SiO 2.
- the first film layer material includes Ta 2 O 5 and the second film layer material includes SiO 2 , and the number of sub-film layers in the multiple filter regions can be the same.
- the thickness of the filter regions corresponding to the emission lights of different colors may be different, but the materials may be the same.
- the material of the first film layer may include TiO 2
- the material of the second film layer may include SiO 2 .
- SiO2 silicon dioxide
- SiO2 silicon dioxide
- it can enhance its adhesion with other sub-film layers and improve the evaporation effect.
- Ta 2 O 5 tantalum pentoxide
- SiO 4 silicon dioxide
- the two film layer materials contained in the filter areas corresponding to the emission lights of different colors may also be different.
- the light-emitting layer 102 emits red light, blue light and green light.
- the two film layer materials used in the filter area for filtering red light may be TiO2 and SiO2
- the two film layer materials used in the filter area for filtering green light may be Ta2O5 and SiO2
- the two film layer materials used in the filter area for filtering blue light may be Ta2O5 and SiO2 .
- each sub-film layer in each filtering area can be selected according to the filtering requirements, and no special limitation is made here.
- the orthographic projection of the cut-off filter film layer on the substrate covers the entire substrate, and different colors of emitted light correspond to different filter areas.
- the materials and thicknesses of these filter areas can be the same, so they can be completed in one composition process.
- the light-emitting layer generates blue light, green light and red light; accordingly, it includes a light-emitting element that emits blue light, a light-emitting element that emits green light and a light-emitting element that emits red light.
- the display panel includes a substrate, a light-emitting layer located on one side of the substrate, a diffusion adhesive layer located on the side of the light-emitting layer facing away from the substrate, a transparent adhesive layer located on the side of the diffusion adhesive layer facing away from the substrate, a black adhesive layer located on the side of the transparent adhesive layer facing away from the substrate, a cut-off filter film layer located on the side of the black adhesive layer facing away from the substrate, and a second base material layer located on the side of the cut-off filter film layer facing away from the substrate.
- the film layer materials are selected from high refractive index Ta 2 O 5 and low refractive index SiO 2 .
- the second substrate layer is glass
- the sub-film layer attached to the second substrate layer is SiO 2
- the thickness is 98.78nm
- the adjacent sub-film layer is Ta 2 O 5
- the thickness is 72.98nm
- the high and low refractive index film layers are arranged alternately, a total of 13 layers
- the top layer is SiO 2 layer
- the thickness is 133.65nm.
- Refractive index represents the refractive index
- extinction coefficient represents the attenuation coefficient of light
- Optical Thickness represents the optical thickness
- Physical Thickness represents the physical thickness, with the unit of nm (nanometer).
- the first sub-film layer is SiO 2 with a thickness of 133.6 nm
- the second sub-film layer is Ta 2 O 5 with a thickness of 65.64 nm
- the third sub-film layer is SiO 2 with a thickness of 91.44 nm
- the fourth sub-film layer is Ta 2 O 5 with a thickness of 109.35 nm
- the fifth sub-film layer is SiO 2 with a thickness of 261.88 nm
- the sixth sub-film layer is Ta 2 O 5 with a thickness of 45.28 nm
- the seventh sub-film layer is SiO 2 with a thickness of 206.87 nm
- the eighth sub-film layer is Ta 2 O 5 with a thickness of 54.45 nm
- the ninth sub-film layer is SiO 2 with a thickness of 202.53
- the central wavelength of blue light allowed to pass through the cut-off filter film layer is (475 ⁇ 15) nm
- the central wavelength of green light is (520 ⁇ 15) nm
- the central wavelength of red light is (625 ⁇ 15) nm.
- the total thickness of the film layer is 1532 nm.
- the transmittance curve of the film layer is shown in Figure 10.
- the horizontal axis represents the wavelength
- the vertical axis represents the transmittance. It can be seen that the transmittance of the blue light band in the range of 475 ⁇ 15nm is the highest, and the transmittance of other blue light bands is very low. Therefore, the purity of blue light can be improved. Similarly, the purity of green and red light is also improved.
- the light-emitting layer generates blue light, green light and red light; accordingly, it includes a light-emitting element that emits blue light, a light-emitting element that emits green light and a light-emitting element that emits red light.
- each filter area filters emission light of one color, and there may be intervals between adjacent filter areas.
- the display panel includes a substrate, a light-emitting layer located on one side of the substrate, a cut-off filter film layer located on the side of the light-emitting layer facing away from the substrate, a first base material layer located on the side of the cut-off filter film layer facing away from the substrate, a diffusion glue layer located on the side of the first base material layer facing away from the substrate, a black glue layer located on the side of the diffusion glue layer facing away from the substrate, and a second base material layer located on the side of the black glue layer facing away from the substrate.
- the high and low refractive index layers are arranged alternately.
- the filter area for filtering blue light has a total of 9 sub-film layers with a total thickness of 720nm. Referring to FIG. 11 , a thickness design distribution diagram of each sub-film layer in the filter area for filtering blue light is shown.
- the first sub-film layer is TiO 2 with a thickness of 93.78 nm
- the second sub-film layer is SiO 2 with a thickness of 93.03 nm
- the third sub-film layer is TiO 2 with a thickness of 53.51 nm
- the fourth sub-film layer is SiO 2 with a thickness of 91.49 nm
- the fifth sub-film layer is TiO 2 with a thickness of 57.29 nm
- the sixth sub-film layer is SiO 2 with a thickness of 138.23 nm
- the seventh sub-film layer is TiO 2 with a thickness of 58.24 nm
- the eighth sub-film layer is SiO 2 with a thickness of 89.57 nm
- the ninth sub-film layer is TiO 2 with a thickness of 48.48
- the green light filtering area has 14 sub-film layers with a total thickness of 1107 nm.
- a thickness design distribution diagram of each sub-film layer in the green light filtering area is shown.
- a schematic diagram of light transmittance of green light after passing through the cut-off filter film layer is shown.
- the first sub-film layer is TiO 2 with a thickness of 11.10 nm
- the second sub-film layer is SiO 2 with a thickness of 66.70 nm
- the third sub-film layer is TiO 2 with a thickness of 71.76 nm
- the fourth sub-film layer is SiO 2 with a thickness of 113.76 nm
- the fifth sub-film layer is TiO 2 with a thickness of 57.64 nm
- the sixth sub-film layer is SiO 2 with a thickness of 90.35 nm
- the seventh sub-film layer is TiO 2 with a thickness of 51.71 nm
- the eighth sub-film layer is SiO 2 with a thickness of 185.08 nm
- the ninth sub-film layer is TiO 2 with a thickness of 51.85 nm
- the red light filtering area has 16 sub-film layers with a total thickness of 1350nm.
- a thickness design distribution diagram of each sub-film layer in the red light filtering area is shown.
- a schematic diagram of light transmittance of red light after passing through the cut-off filter film layer is shown.
- the first sub-film layer is TiO 2 with a thickness of 67.05 nm
- the second sub-film layer is SiO 2 with a thickness of 96.14 nm
- the third sub-film layer is TiO 2 with a thickness of 156.75 nm
- the fourth sub-film layer is SiO 2 with a thickness of 78.34 nm
- the fifth sub-film layer is TiO 2 with a thickness of 69.09 nm
- the sixth sub-film layer is SiO 2 with a thickness of 92.54 nm
- the seventh sub-film layer is TiO 2 with a thickness of 57.88 nm
- the eighth sub-film layer is SiO 2 with a thickness of 91.67 nm
- the ninth sub-film layer is TiO 2 with a thickness of 117.92
- the binning requirements for the light-emitting elements are reduced in reverse. Since the cutoff filter layer filters the emitted light, the difference between the wavelengths of the light emitted by the light-emitting elements is smaller after being transmitted. Therefore, the color purity of the light emitted from the display panel is improved, and the color uniformity is improved, so that the light-emitting elements on the light-emitting layer can have a wider light-emitting band, thereby reducing the binning requirements for the light-emitting elements.
- the yield of light-emitting components is improved. Since the requirements for the fineness of binning can be reduced, coarser binning can be allowed, and the number of light-emitting components discarded and recycled in the same batch of light-emitting components is greatly reduced, thereby reducing production costs.
- the present invention discloses a display device, which may include the display panel in any of the above embodiments.
- references herein to "one embodiment,” “embodiment,” or “one or more embodiments” mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present disclosure.
- examples of the term “in one embodiment” herein do not necessarily all refer to the same embodiment.
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Abstract
一种显示面板以及显示装置,显示面板包括基板(101),位于基板(101)一侧的发光层(102),以及位于发光层(102)背离基板(101)一侧的封装层;发光层(102)包括多个发光元件(1021),封装层包括截止滤光膜层(103);其中,多个发光元件(1021)产生至少一种颜色的发射光,截止滤光膜层(103)包括多个滤光区,一个滤光区被配置为对一种颜色的发射光进行滤光,以使透过滤光区的出射光的波长范围小于发射光的波长范围。
Description
本公开涉及显示技术领域,特别是涉及一种显示面板以及显示装置。
在显示产品领域,在显示产品出厂前,需要对显示产品的显示质量进行检测,检测合格的显示产品再被允许流入用户端。其中,显示质量包括显示画面的颜色均一性、亮度的一致性等质量。
相关技术中,为使显示产品的显示质量合格,会对显示产品进行封装前的分Bin,该分Bin是指对封装前所用到的发光元件,又称发光芯片进行拣选,如LED(Light-Emitting Diode,发光二极管)芯片,以将同一质量等级的芯片归为一档,即同一Bin级。
然而,随着显示产品的不断升级换代,其自身的功能及特性不断提升,对显示质量的要求也越来越高,在此种背景下,便需要提高分Bin的精细度,这样,分Bin时需要划分更多个Bin级,例如,以往归为一档的多个芯片可能要再次分Bin,将其归到更多个更精细的Bin级,如此一来,导致分Bin难度大大增加。
概述
本公开提供了一种显示面板,包括:
基板,位于所述基板一侧的发光层,以及位于所述发光层背离所述基板一侧的封装层;所述发光层包括多个发光元件,所述封装层包括截止滤光膜层;其中,多个所述发光元件产生至少一种颜色的发射光;
其中,所述截止滤光膜层包括多个滤光区,一个滤光区被配置为对一种颜色的发射光进行滤光,以使透过所述滤光区的出射光的波长范围小于所述发射光的波长范围。
在一些可选实施例中,透过所述截止滤光膜层的每种颜色的出射光的波长范围为:与该种颜色的发射光的中心波长之间的差异小于或等于15nm的 范围。
在一些可选实施例中,所述截止滤光膜层在所述基板上的正投影整面覆盖所述基板。
在一些可选实施例中,所述截止滤光膜层包括多个滤光区,多个所述滤光区在所述基板上的正投影互不交叠。
在一些可选实施例中,一个所述滤光区在所述基板上的正投影,覆盖产生同一种颜色的发射光的至少一个所述发光元件在所述基板上的正投影,以使所述滤光区对被其覆盖的发光元件所发出的发射光进行滤光。
在一些可选实施例中,相邻两个所述滤光区在所述基板上的正投影之间具有间隔。
在一些可选实施例中,所述截止滤光膜层包括层叠设置的多个子膜层,每相邻的两个子膜层具有不同大小的折射率。
在一些可选实施例中,相邻的两个子膜层中,其中一个子膜层的折射率大于2,另一个子层的折射率小于2。
在一些可选实施例中,相邻的两个子膜层中:其中一个子膜层的膜层材料包括Ta
2O
5、TiO
3、TiO
2、ZrO
2中的至少一种,另一个子膜层的膜层材料包括SiO
2、MgF
2、CeF
3、Al
2O
3和Y
2O
3中的至少一种。
在一些可选实施例中,所述截止滤光膜层包括折射率不同的第一膜层材料和第二膜层材料,其中,每相邻的两个子膜层中的一个子模层为所述第一膜层材料,另一子膜层为所述第二膜层材料。
在一些可选实施例中,所述第一膜层材料包括Ta
2O
5,所述第二膜层材料包括SiO
2。
在一些可选实施例中,所述多个子膜层的数量大于等于9且小于等于16。
在一些可选实施例中,每两种颜色的发射光中,波长较长的颜色的发射光所对应的滤光区中子膜层的数量,大于波长较短的颜色的发射光所对应的滤光区中子膜层的数量。
在一些可选实施例中,不同的所述子膜层具有不同的厚度。
在一些可选实施例中,每两种颜色的发射光中,波长较长的颜色的发射光所对应的滤光区的厚度,大于波长较短的颜色的发射光所对应的滤光区的厚度。
在一些可选实施例中,所述封装层还包括位于所述发光层背离基板一侧的复合胶层,所述截止滤光膜层位于所述复合胶层与所述发光层之间,或,位于所述复合胶层背离所述发光层的一侧。
在一些可选实施例中,所述复合胶层包括扩散胶层、透明胶层和黑胶层中的至少一者;其中,在包括所述扩散胶层的情况下,所述扩散胶层靠近所述发光层设置。
在一些可选实施例中,多个所述发光元件包括发蓝色光的发光元件、发绿色光的发光元件以及发红色光的发光元件。
在一些可选实施例中,所述发光元件为次毫米发光二极管。
本公开还提供一种显示设备,包括上述任一或多个实施例中所述的显示面板。
采用本公开的显示面板,包括基板、发光层和封装层,其中,封装层可以封装发光层,在该封装层中包括截止滤光膜层,截止滤光膜层被配置为允许为对发光层发出的发射光进行滤光,以使透过截止滤光膜层的出射光的波长范围小于发射光的波长范围。
由于截止滤光膜层允许发光元件的光透过,且透过该膜层后的出射光的波长范围被压缩,这样,使得发光元件所发出的光被透过后,其波长之间的差异更小,即压缩了波长范围,由于波长范围被压缩,因此从显示面板出射的光的颜色的纯净度得到提高,颜色均一性得到提高。如此,带来以下优势:
一方面,对发光元件发光的波长范围要求降低,可以允许发光元件发出的光的波长范围更宽,这样,即使发光元件被执行较粗粒度的分Bin,具有较宽的波长范围,也可以经由后期封装时封装层中的截止滤光膜层将波长范围限制在较小的范围内,提高显示面板的颜色纯净度和均一性,从而保证在发光元件被较粗粒度分Bin时,仍然能保证显示面板的显示质量。也就是说,采用本公开的封装层,可以反向允许较粗粒度的分Bin,降低分Bin的精细度,从而避免分Bin难度增加的问题。
另一方面,由于可以降低对分Bin的精细度的要求,如此,可以允许较粗粒度的分Bin,从而提高生产出的发光元件的利用率,利用率提高了,则同一批次生产出的发光元件中被弃用回收的发光元件大大减少,从而降低了生产成本。
上述说明仅是本公开技术方案的概述,为了能够更清楚了解本公开的技术手段,而可依照说明书的内容予以实施,并且为了让本公开的上述和其它目的、特征和优点能够更明显易懂,以下特举本公开的具体实施方式。
附图简述
为了更清楚地说明本公开实施例或相关技术中的技术方案,下面将对实施例或相关技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。需要说明的是,附图中的比例仅作为示意并不代表实际比例。
图1示意性地示出了本公开的一种显示面板的结构示意图;
图2示意性地示出了一些实施例中显示面板的截面结构示意图;
图3示意性地示出了又一些实施例中显示面板的截面结构示意图;
图4示意性地示出了图2中所示的的显示面板的俯视示意图;
图5a示意性地示出了一种显示面板的俯视示意图;
图5b示意性地示出了又一种显示面板的俯视示意图;
图6示意性示出了图3中所示的的显示面板的俯视示意图;
图7示意性示出了截止滤光膜层的滤光过程示意图;
图8示意性示出了整面的截止滤光膜层中各个子膜层的厚度和材料的排列图;
图9示意性示出了整面的截止滤光膜层中各个子膜层的厚度和材料的排列柱状图;
图10示意性示出了经整面的截止滤光膜层后光透过率示意图;
图11示意性示出了截止滤光膜层中对蓝光滤光的滤光区的各子膜层的厚度和材料的排列图;
图12示意性示出了经蓝光滤光的滤光区后光透过率的示意图;
图13示意性示出了截止滤光膜层中对绿光滤光的滤光区的各子膜层的厚度和材料的排列图;
图14示意性示出了经绿光滤光的滤光区后光透过率的示意图;
图15示意性示出了截止滤光膜层中对红光滤光的滤光区的各子膜层的 厚度和材料的排列图;
图16示意性示出了经红光滤光的滤光区后光透过率的示意图;
101-基板,102-发光层,1021-发光元件,103-截止滤光膜层,104-第二基材层,105-扩散胶层,106-透明胶层,107-黑胶层,108-第一基材层,201-复合胶层,1031-红光滤光区,1032-绿光滤光区,1033-蓝光滤光区,R-红色,G-绿色,B-蓝色。
详细描述
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。
显示领域中,为保证显示质量,在分Bin中,可能将波长分布在2nm以内,且亮度的变化控制带15%以内的芯片归为一档,即同一bin级。实际中,会按照波长、发光强度、电压等进行测试分选,把芯片分成更多bin和类别,分Bin设备会自动的根据设定的测试标准把芯片分装在不同的bin盒内。由于对LED的分bin要求越来越高,划分的bin级也越来越多,分Bin设备已由32bin增加到64bin,但仍然无法满足生产和市场的需求。
一般而言,分Bin难度除与分Bin的精细化要求(Bin级)有关外,还与芯片的尺寸有关,表现在芯片尺寸越小,分Bin难度越大,例如,对于micro LED这样微型尺寸的显示产品而言,精细化要求更为严格,往往需要用探针才能够完成测试,分选过程需要精确的机械和图像识别系统,这对检测设备及检测精度产生了极高要求。
相关技术中,为满足越来越精细化的分Bin需求,应对越来越高的分Bin难度,一般多集中于研发精细化分Bin的设备,更精细化的管控Bin级以满足要求。但分Bin设备昂贵,需要支出较高的成本,特别是对于micro LED这样微型尺寸的显示产品,需要更精细化的分Bin设备,成本更加高昂。
再者,由于对分Bin的精细化要求越来越高,导致分Bin难度越来越高, 不仅导致同一批次的产品分Bin效率低,且会由于其高的精细化要求,大量芯片被弃用,这样,大大降低了生产良率,厂家不得不重新生产芯片,从而增加了生产成本。
有鉴于此,本公开为全部或部分地解决上述技术问题,提出了一种解决思路,该解决思路的核心在于:通过显示面板的封装层,对发光元件发光的波长范围进行压缩,也就是说限制出射光的波段,使得发光元件发出的光通过封装层后其出射光的波长范围较窄,从而能达到较高的颜色均一性的效果,提高显示质量。
具体地,可以通过在封装层中配置截止滤光膜层实现,该截止滤光膜层允许发光元件的光透过,且被配置为对发光层发出的发射光进行滤光,以使透过截止滤光膜层的出射光的波长范围小于发射光的波长范围。也就是说,多个发光元件发出的波长范围较大的光经过截止滤光膜层后,其波长范围被缩小,从而允许拣选出的发光元件其发光的波长范围更宽。
下面,对本公开提出的显示面板进行介绍。
参照图1所示,示出了本公开的一种显示面板的结构示意图,如图1所示,显示面板具体可以包括以下结构:
基板101,位于基板101一侧的发光层102,以及位于发光层102背离基板101一侧的封装层;其中:发光层102包括多个发光元件1021,所述封装层包括截止滤光膜层103;
其中,多个发光元件1021产生至少两种颜色的发射光;也即,发光层中可以产生至少两种颜色的发射光,其中,一个发光元件1021产生一种颜色的发射光,在多个发光元件中,部分发光元件1021可以产生一种颜色的发射光,部分发光元件可以产生另一种颜色的发射光。
其中,截止滤光膜层103被配置为对发光层102发出的发射光进行滤光,以使透过截止滤光膜层103的出射光的波长范围小于发射光的波长范围。
图1中,R、G、B表征对应的发光元件所发出的发射光的颜色。
本公开中,基板101可以为玻璃材质,厚度可以设置为0.5mm(毫米),其可以作为发光元件1021的承载部件,基板101的正面(靠近发光元件1021的一面)为LED的驱动线路的金属走线,侧边和背面为绑定COF(Chip On Flex,or,Chip On Film,覆晶薄膜);实际中,基材也可以为其它材质, 如PCB材料。
其中,发光层102中阵列排布有多个发光元件1021,在发光元件1021之间的间隙可以设置阻隔层或不设置阻隔层。具体地,在发光层102之上可以设置封装层,该封装层一方面保护发光层102,使得发光层102中的发光元件1021不被损坏、暴露;另一方面也可以对发光层102起到支撑作用。
需要说明的是,封整层可以允许发光层102发射的发射光通过,以实现显示面板的显示功能。具体地,如上所述,为了反向降低对发光元件1021的分Bin精细度,可以对封装层进行改进,以使得发光层102发射的发射光可以经由封装层的透过后,出射光的波长范围变窄。
实际中,封装层中可以配置截止滤光膜层103,该截止滤光膜层103具有滤光功能,可以允许一个波长范围内的光通过,而不允许该波长范围之外的光通过,使得透过截止滤光膜层103后的出射光的波长范围,相比于发射光的波长范围有缩小,从而使得出射光更为纯净,这样颜色显示质量更好。
一些实施例中,发光层102可以发射多种颜色的发射光,其中,每种颜色都对应一个波长范围,例如,红光的波长范围一般是625nm~740nm,蓝光的波长范围一般400nm~480nm;绿光的波长范围一般是492nm~577nm(纳米)。
其中,发光层102在发出多种颜色的发射光时,截止滤光膜层103可以对每种颜色的发射光进行针对性滤光,从而缩小每种颜色的出射光的波长范围。具体地,截止滤光膜层包括多个滤光区,一个滤光区被配置为对一种颜色的发射光进行滤光,如图3所示,包括红光滤光区1031,滤光滤光区1032以及红光滤光区1033。这样,透过每个滤光区的出射光的波长范围小于该滤光区所针对的一种颜色的发射光的波长范围。其中,可以按照发光元件1021的位置,设置多个滤光,使得每种滤光区覆盖一种颜色的发光元件。
示例地,发光层102发绿光和红光,此种情况下,发光元件1021包括发射红光的芯片和发射绿光的芯片;具体地,假设发射的红光的波长范围650nm到700nm之间,发射的绿光的波长范围为525nm~570nm。则,截止滤光膜层103中与红光对应的滤光区,可以配置为允许660nm~690nm之间的红光透过,而不允许其他波长的红光透过;与绿光对应的滤光区允许540nm~570nm之间的绿光透过,而不允许其他波长的绿光透过。
如此,经由封装层后,透过的红光的波长均分布在距离中心波长675nm为15nm的范围内,透过的绿光的波长均分布在距离中心波长555nm为15nm的范围内;由此,即使发红光和发绿光的发光元件1021的波长范围较宽,经过封装层后仍然可以提高红光和绿光的纯净度,保证显示质量。进一步地,可以反向允许在分Bin中,降低对每种发光颜色的发光元件1021的波段范围的精细度要求,从而降低分Bin难度。
其中,针对不同颜色进行滤光的滤光区的配置可以不同,也可以相同,其中,配置可以包括滤光区的材料、厚度以及在基板的平面方向上的尺寸。
当然,在其他一些实施例中,不排除发光层发射一种颜色的发射光的情况下,采用本公开所使用的截止滤光膜层。此种情况下,发光层102在发出一种颜色的发射光的情况下,截止滤光膜层103可以对该种颜色的发射光进行滤光,从而缩小出射光的波长范围,示例地,发光层102发红光,也就是说发光元件1021发射红光,发射的红光的波长范围650nm到700nm之间,截止滤光膜层103可以配置为允许660nm~690nm之间的红光透过,而不允许其他波长的红光透过,则经由封装层后,透过的红光的波长均分布在中心波长675的15nm范围内,由此,即使发光元件1021发射的红光的波长范围较宽,经过封装层后仍然可以提高红光的纯净度,保证显示质量。也就是说,可以反向允许在分Bin中,降低对发光元件1021的波段范围的精细度要求,从而降低分Bin难度。
当然,在发光层102发出一种颜色光的情况下,可以按照发光元件1021的分布区域,设置多个滤光区,例如,每n个相邻的发光元件1021对应一个滤光区。此种情况下,可以针对性地对每个显示区域进行滤光。例如,在一些尺寸较大的显示面板中,往往可能需要设计多个可以显示画面的区域,如大尺寸的矩形显示面板,可以设计四个显示区域,可以显示不同来源的数据,此种情况下,发光元件1021在发光层102的排布便可以适应性排布为四个区域。相应地,便可以将截止滤光膜层103划分为四个滤光区。
当然,以上仅是示例性说明,其中,发光元件1021还可以包括产生其他颜色的芯片,如紫色、黄色、白色等,对于其他发光颜色的发光元件1021,本公开的封装层照样适用,也就是说,通过该封装层仍然可以提高其他颜色的纯净度。
其中,截止滤光膜层103的工作原理如下所述:
当截止滤光膜层103的厚度适当时,在膜层的两个面上反射的光,光程恰好等于半个波长,因而相互抵消,这就大大减少了光的反射损失,增强了透射光的强度。当光线从折射率为n0的介质入射到折射率为n1的两一种介质时,在两种介质的分界面上就会产生光的反射。如果介质对光没有吸收,界面是光学表面,光线垂直入射,则反射率R满足以下关系式(一):
其中,截止滤光膜层103对光的透射率T=1-R;
而截止滤光膜层103的折射率为满足以下关系式(二):
其中,n为膜层折射率,d为膜层厚度,λ为波长。
由此可见,在发射光的波长范围已知的情况下,可以通过设计膜层厚度、膜层材料,来达到所需的膜层折射率,进而通过该关系式(一),控制某一波长的光的反射率,使得光被全部反射,或使得光被通过,由此,实现上述的滤光功能。
列举一个示例,对本公开的优势进行说明:
假设一个批次的发红光的发光元件1021有1万个,经显示面板出射后的红光的波长范围需要被限制在670nm~680nm之间(包括端点处的波长)。假设,1万个发光元件1021中有6000个满足此条件。
采用相关技术的分Bin,会按照每10nm或5nm甚至更小的粒度,对1万个发光元件1021进行分Bin,从中选出一个Bin级或多个Bin级的芯片用于封装,由于所需的出射后的红光的波长范围为670nm~680nm,因此,会将属于670nm~680nm中的各个Bin级的发光元件1021用于后续封装。也就是说,按照相关技术的分Bin,会舍弃掉至少4000个发光元件1021(因分Bin误差等,可能会多舍弃)。
但是,由于本公开在后续封装阶段,会在封装层中设置截止滤光膜层103,因此,采用本公开的封装方案时,在前序分Bin阶段,可以按照20nm甚至高大的粒度进行分Bin,假设按照这个粒度,可以将波长范围为650nm到700nm的芯片分为一个bin级,假设650nm到700nm的芯片有8000个, 则可以将8000个芯片用于后续封装。如此,便降低了分Bin的精细度,舍弃的芯片会更少。
接着,在封装阶段,发光层102包括8000个发红光的发光元件1021,其波长范围为650nm到700nm,选取的中心波长为675nm,假设需要透过截止滤光膜层103的红光的波长范围为与675nm之间的差异小于或等于5nm的范围内,则透过截止滤光膜层103后的红光的波长范围为670nm~680nm,而8000个发红光的发光元件1021中,有6000个发光元件1021发出的红光的波长范围是670nm~680nm,这样,便可以允许反射其他波段的红光的2000个发光元件1021被封装到显示面板。也就是说,在前序分Bin的阶段,即使将650nm到700nm的发光元件1021划分为一个Bin级,也不影响后续对显示面板的显示质量。
采用本公开实施例的技术方案,一方面,可以允许发光元件1021发出的光的波长范围更宽,这样,即使发光元件1021被执行较粗粒度的分Bin,具有较宽的波长范围,也可以经由后期封装时封装层中的截止滤光膜层103将波长范围限制在较小的范围内,提高显示面板的颜色纯净度和均一性,从而保证在发光元件1021被较粗粒度分Bin时,仍然能保证显示面板的显示质量。这样,由于降低了分Bin的精细度,避免了分Bin难度的增加,从而同一批次生产出的发光元件1021在分Bin中被弃用回收的发光元件1021大大减少,从而降低了生产成本,利用了产品良率。
另一方面,截止滤光膜层103可以包括针对每种颜色的发光元件1021所设计的滤光区,也就是说,可以单独设计针对每种颜色的截止滤光膜层103,使得每种颜色光可以由各自对应的截止滤光膜层103进行波长的筛选。这样,可以提高对每种颜色光的筛选的针对性和准确性,使得透过的每种颜色的光的波长均位于该种颜色光对应的预设波段范围内。
在一些实施例中,发光元件1021可以是LED(发光二极管)芯片1021。进一步地,在又一些实施例中,发光元件1021可以为次毫米发光二极管,具体地,可以是Mini发光元件1021,或Micro发光元件1021。其中,Mini发光元件1021介于传统的LED和Micro LED之间,其尺寸普遍在100μm~300μm;而Micro发光元件1021的尺寸可以小到50μm,直径约0.002英寸,是微米量级的芯片。
在这些实施例中,显示面板可以是mini LED显示面板,或Micro LED显示面板。而对于Mini发光元件,或Micro发光元件来说,由于其尺寸小,分Bin难度非常大,因此,降低这些发光元件1021的分Bin难度显的尤为必要,当在mini LED显示面板,或Micro LED显示面板中采用本公开提出的封装层时,可以通过封装层的滤光功能,达到对次毫米发光二极管的发光波段的较宽分Bin波段,从而大大降低微型Micro LED显示技术的分Bin难度。
在一些实施例中,发光层102可以发射至少一种颜色的发射光。如,发绿色光和蓝色光,或者,发红色光和蓝色光,或者发绿色光和红色光,或者,三种颜色光的都发生。在又一些实施例中,发光层102可以发射单一颜色的发射光,例如,发射红色光或蓝色光或绿色光,
在一些实施例中,多个发光元件1021可以包括发蓝光的发光元件1021、发绿光的发光元件1021以及发红光的发光元件1021,这样,发光层102可以发射红色的发射光、绿色的发射光和蓝色的发射光。
其中,发蓝光的发光元件1021、发绿光的发光元件1021以及发红光的发光元件1021在发光层102中可以阵列排布。具体地,发相同颜色光的发光元件1021可以排列成一行,此种情况下,每相邻行的发光元件发出不同颜色的发射光,例如,其中一行的发光元件均发蓝光,另一行的发光元件均发绿光,可以参照图5b所示。或者,发相同颜色光的发光元件1021可以排列成一列,此种情况下,每相邻列的发光元件发出不同颜色的发射光,例如,其中一列的发光元件均发蓝光,另一列的发光元件均发绿光。此种情况,可以参照图5a所示。
在显示面板中,一个发蓝光的发光元件1021、一个发绿光的发光元件1021以及一个发红光的发光元件1021可以构成一个像素单元,该像素单元中的每个发光元件1021可以称为一个子像素,例如,发蓝光的发光元件1021可以是一个子像素。
在一些实施例中,透过截止滤光膜层103的每种颜色的出射光的波长范围满足以下条件:与该种颜色的发射光的中心波长之间的差异小于或等于15nm的范围。
发射光的中心波长可以是指发射光的波长范围的中值,或者,也可以是根据需求所选取的发射光的一个波长。例如,以红光为例,选取的中心波长 可以是625nm,还可以是其它波长如620nm、640nm。实际中,可以根据上述关系式(一)和关系式(二),设置截止滤光膜层103针对每种颜色的折射率,从而达到对每种颜色的光进行滤光的功能,以使透过截止滤光膜层103的每种颜色的出射光的波长范围,是距离发射光的中心波长之间的差异小于或等于15nm的范围。
示例地,发光层102可以发射红光、绿光和蓝光,所发射的红光的波长范围的中心波长是625nm,绿光的中心波长是520nm,蓝光的中心波长是475nm,则透过截止滤光膜层103的蓝光的波长范围控制在475±15nm,绿光的波长范围控制在520±15nm,红光的波长范围控制在625±15nm。
其中,如上所述,发光层102发出的光也可以是其他光,如紫光、黄光等,采用封装层,均可以将透过的每种颜色的光控制在距离发射光的中心波长之间的差异小于或等于15nm的范围内。
当然,实际中,也可以设置为透过截止滤光膜层103的每种颜色的出射光的波长范围,是距离发射光的中心波长之间的差异小于或等于其他纳米的范围,如10nm,或者更小的波长范围。
需要说明的是,截止滤光膜层103对发射光的滤光越多,透过截止滤光膜层103的出射光的波长范围越窄,从而使得出射光越纯净,也就是说同种颜色的不同发光元件1021所发射的发射光经出射后,其出射光之间的波长差异越小,越小的情况下,则越不容易被人眼识别,从而可以进一步提高显示面板的显示质量。
示例地,一些实施例中,可以设置透过截止滤光膜层103的每种颜色的出射光的波长范围满足以下条件:与该种颜色的发射光的中心波长之间的差异小于或等于5nm的范围。如此,可以使得人眼观察不到颜色变化,进一步提高显示质量。
在一些实施例中,封装层可以包括复合胶层201,该复合胶层201可以有多层相互层叠的胶层构成,复合胶层201可以实现以下功能:
一方面可以保护发光元件1021;另一方面,对发光元件1021发出的光在侧视角和正视角的颜色显示进行纠正,以让R、G、B三色发光元件1021发出的光在正视角和侧视角更均匀;再一方面,降低基板101上的金属走线的反射率,以对基板101的不平整走线表面进行遮蔽,让显示画面具有较好 的均一性。
参照图2和图3所示,示出了一些实施例中显示面板的结构示意图,如图2和图3所示,显示面板包括基板101、发光层102,以及封装层,其中,在这些实施例中,封装层包括:位于发光层102背离基板101一侧的复合胶层201,其中,截止滤光膜层103位于复合胶层201与所述发光层102之间,或,位于复合胶层201背离发光层102的一侧。
其中,如图2和图3所示,封装层均包括复合胶层201和截止滤光膜层103;如图2所示,截止滤光膜层103位于复合胶层201背离发光层102的一侧,也就是说,显示面板按照靠近基板101至远离基板101的顺序,依次层叠发光层102、复合胶层201和截止滤光膜层103。
如图3所示,截止滤光膜层103位于发光层102和复合胶层201之间,也就是说,显示面板按照靠近基板101至远离基板101的顺序,依次层叠发光层102、截止滤光膜层103和复合胶层201。
其中,无论截止滤光膜层103和位于哪一位置,均能实现其对发光元件1021发出的光的筛选效应,使得透过截止滤光膜层103的出射光的波长范围小于发射光的波长范围。
在一些实施例中,复合胶层201包括层叠的扩散胶层105、透明胶层106和黑胶层107中的至少一者,在包括扩散胶层105的情况下,扩散胶层105靠近发光层102设置。
如图2和图3所示,复合胶层201可以包括层叠的扩散胶层105和黑胶层107,也可以包括层叠的扩散胶层105、透明胶层106和黑胶层107。
其中,如图2所示,在截止滤光膜层103位于复合胶层201背离发光层102的一侧的情况下,复合胶层201可以包括层叠的扩散胶层105、透明胶层106和黑胶层107。此种情况下,扩散胶层105位于发光层102背离基板101的一侧,透明胶层106位于扩散胶层105背离基板101的一侧,黑胶层107位于透明胶层106背离基板101的一侧。
如图3所示,在截止滤光膜层103位于发光层102和复合胶层201之间的情况下,复合胶层201可以包括层叠的扩散胶层105和黑胶层107。此种情况下,在截止滤光膜层103与扩散胶层105之间设置第一基材层108,第一基材层108可以支撑截止过滤膜层鞥,在扩散胶层105背离基板101的一 侧设置黑胶层107。
当然,一些实例中,复合胶层201还可以包括扩散胶层105和透明胶层106。需要说明的是,扩散胶层105可以是靠近发光层102设置的。
需要说明的是,如图2和图3所示,封装层还可以包括设置在最外层的第二基材层104,如图2所示,该第二基材层104可以位于截止过滤膜层背离基板101的一侧,或者,如图3所示,可以位于复合胶层201中黑胶层107背离基板101的一侧。
其中,第二基材层104选择玻璃或PMMA,截止过滤膜层蒸镀于第二基材层104的下表面。具体地,可以选用溶胶—凝胶镀膜设备在第二基材层104的下表面蒸镀截止过滤膜层,溶胶—凝胶镀膜设备能在常温常压下操作、膜层均匀性高、微观结构可控,适于不同形状、尺寸的基片、能通过控制配方、制备工艺,由此得到高激光破坏阈值的截止过滤膜层。
本实施例中,扩散胶层105的作用是让发光层102产生的发射光在正视角和侧视角更均匀,在发光层102产生多种颜色的发射光的情况下,如,红绿蓝三个颜色的发射光,扩散胶层105可以避免因视角产生的色差,以使RGB三色发光元件1021在大视角光束角的大小和光型接近一致。以避免在直显屏幕表面随着观看视角的变化出现色偏,即从正视角到侧视角角,显示画面由白色画面变化到淡红色再到淡青色的色偏现象。
通常而言,视角色偏的坐标拐点出现在大视角50°~60°,通过光型分析,此视角色偏现象与LED裸芯片之间的光型不匹配及光型不对称有关(因R芯片与GB芯片内部结构差异导致光型不同)。由此,通过扩散胶层105可以改善正视和侧视情况下的色偏问题,保证显示装置发出的光在各个视角下的颜色均一性。
在一些实施例中,扩散胶层的材料包括TiO
2,实际中可以为TiO
2粉末。
在又一些实施例中,TiO
2的粒径大于或等于10nm,且小于或等于300nm。具体地,在一些示例中,扩散胶层105可以选择透明硅胶为基质,添加扩散性粒子,如TiO
2粉末,TiO
2粉末的粒径可以为10nm~300nm,厚度可为50μm。
本实施例中,透明胶层106用作膜层厚度补充层,其厚度可以为100μm。也就是说利用透明胶层106用作厚度补偿,以增大复合胶层201的厚度,复 合胶层201的厚度增加后可以保护下面的发光元件1021不被暴露。
本公开中,黑胶层107可以降低基板101上的金属走线的反射率,同时实现对基板101的不平整走线表面进行遮蔽,让显示画面具有较好的均一性。在一些实施例中,该黑胶层107采用透明硅胶基质内混合黑色碳黑粒子,粒径范围在10nm~500nm之间。
在一些实施例中,该黑胶层107可以采用透明硅胶基质内混合黑色碳黑粒子支撑,黑色碳黑粒子的粒径范围在10nm~500nm之间。
在一些实施例中,为了更好地保护发光元件1021,复合胶层201的厚度大于发光元件1021的厚度,具体地,可以设置复合胶层201的总厚度在150μm~175μm;可以增强膜层的牢固性和耐磨性,这样,发光元件1021由于复合胶层201的保护,可以不暴露在外,从而避免被侵蚀和磨损的问题。
下面,对截止滤光膜层103进行详细说明如下:
在一些实施例中,截止滤光膜层103可以是整层设计的结构,即其是一个完整的膜层,此种情况下,不同滤光区的配置可以相同,具体而言,可以是不同滤光区的材料相同,或者,材料和厚度均相同,其中,相邻滤光区之间可以紧邻。在制备封装层时,可以在一次制备工艺中实现。参照图4所示,示出了一些实施例中的显示面板的俯视示意图,如图4所示,截止滤光膜层103在基板101上的正投影整面覆盖基板101,其中,截止滤光膜层103可以允许透过多个发光元件1021发射的发射光。
其中,截止滤光膜层103可以整面覆盖发光层102,也就是说截止滤光膜层103可以是一整层的规整膜系。在一些实施例中,截止滤光膜层103可以由多层层叠的子膜层构成(在后续实施例详述),采用规整的整层膜系时,制备的每一层子膜层都是整层的膜系,如此,可以利于截止滤光膜层103的蒸镀,降低工艺难度。
其中,对于整层的截止滤光膜层103而言,其可以覆盖全部的发光元件1021,从而达到对整个发光层102发射的发射光的滤光,也就是说,截止滤光膜层103可以允许透过全部或部分发光元件1021发射的发射光。如上所述,若封装到发光层102的发光元件1021有1万个,8000个芯片发的红光被允许透过截止滤光膜层103,也就是说允许部分发光元件1021的光透过。
在又一些实施例中,不同颜色的发射光对应的滤光区的配置可以不同,也就是说,不同颜色的发射光对应的滤光区的材料和/或厚度不同,例如,不同颜色的发射光对应的滤光区的材料不同,或厚度不同,或,材料和厚度均不同。
其中,一个滤光区可以覆盖一个发光元件,或者覆盖同一种发光颜色的多个发光元件1021。具体地,一个滤光区在基板上的正投影,覆盖产生同一种颜色的发射光的至少一个发光元件在基板上的正投影,以使所述滤光区对被其覆盖的发光元件所发出的发射光进行滤光。
其中,滤光区在基板101上的正投影,可以覆盖至少一个发光元件1021在基板101上的正投影,以使滤光区允许透过被其覆盖的发光元件1021所发出的发射光,而不允许透过未被其覆盖的发光元件1021所发出的发射光。也就是说,截止滤光膜层103可以只对被滤光区所覆盖的发光元件1021的发射光进行滤光,可以不对未被其覆盖的发光元件1021的发射光进行滤光。
在一些实施例中,一个滤光区在基板上的正投影,可以覆盖一个发光元件,也可以覆盖多个产生同一种颜色光的发光元件,或者,可以覆盖全部的产生同一种颜色光的发光元件。
参照图5和图6所示,示出了一些实施例中的显示面板的俯视示意图,如图5和图6所示,以发光层102产生绿光、红光和蓝光为例,其中,发光元件1021包括R芯片(发红光),G芯片(发绿光)和B芯片(发蓝光)。
其中,截止滤光膜层103包括多个滤光区,多个滤光区在基板101上的正投影互不交叠;其中,一个滤光区在基板101上的正投影,覆盖同一种颜色的至少一个发光元件1021在基板101上的正投影,以使一个滤光区对一种颜色的发射光进行滤光。
其中,一个滤光区在基板101上的正投影,可以覆盖同一种颜色的一个发光元件1021在基板101上的正投影,这样使得每个发光元件1021都有各自独立的截止滤光膜,以达到对每个发光元件1021的独立性的光筛选。具体地,一个滤光区可以对被其所覆盖的发光元件1021所发出的发射光进行滤光,对未被其覆盖的发光元件1021所发出的发射光不进行滤光。
或者,一个滤光区在基板101上的正投影,可以覆盖同一种颜色的全部或部分发光元件1021在基板101上的正投影,此种情况下,发出同一种颜色 的全部发光元件1021或部分发光元件1021均可以通过同一个截止滤光膜进行光的筛选。
如图5所示,是一个滤光区覆盖同一种颜色的全部发光元件1021的情况,此种情况下,每种颜色的多个发光元件1021可以在基板101上阵列排布,使得发出同一种颜色的发光元件1021位于一行或一列,一行或一列的全部发光元件1021通过各自独立的截止滤光膜,对该行或该列的发光元件1021发出的光进行针对性的光筛选。
如图6所示,是一个滤光区覆盖一个发光元件1021的情况,此种情况下,每个发光元件1021均有自己单独的截止滤光膜,这样,每种颜色的多个发光元件1021可以在基板101上阵列排布,使得发出同一种颜色的发光元件1021位于一行或一列;或者,也可以无需阵列排布。
其中,截止滤光膜层103包括的多个滤光区,该多个滤光区在基板101上的正投影互不交叠。互不交叠可以是指:相邻滤光区之间无搭接的部分,在滤光区的正投影之间无交叠的情况下,相邻滤光区可以紧邻,也就是相邻两个滤光区可以无缝隙接触。或者,相邻滤光区之间具有间隔。
在一些示例性实施例中,相邻两个滤光区在基板101上的正投影之间可以具有间隔。如图5a、图5b和图6所示,便是相邻滤光区之间有间隔的情况。参照图4所示,便是相邻滤光区之间无间隔的情况。
其中,在相邻滤光区之间有间隔时,相邻滤光区之间可以设置阻隔材料,阻隔材料可以禁止发射光透过,或者允许部分发射光透过。
其中,在一个滤光区在基板101上的正投影,可以覆盖一个发光元件1021在基板101上的正投影的情况下,也就是说,在一个滤光区覆盖一个发光元件1021的情况下,使得滤光区之间具有间隔,该间隔可以为每个发光元件1021制备单独的滤光区时,留足充足的公差,从而降低每个发光元件1021制备单独的滤光区的制备难度,提高此种情况下对发出不同颜色光的筛选的准确度。具体,参照图6所示。
当然,在一个滤光区在基板101上的正投影,覆盖同一发光颜色的多个发光元件1021在基板101上的正投影的情况下,滤光区之间也可以具有间隔,同样也可以留足制作公差,减小制备难度。具体,参照图5所示。
其中,在一个滤光区覆盖一个发光元件1021的情况下,滤光区的尺寸 与发光元件1021的尺寸之间的关系可以满足以下关系式(三):
L≤x≤2L关系式(三);
其中,L为芯片的边长,x为滤光区的尺寸,具体地,如图6所示,x可以是滤光区的边长。
当然,在一个滤光区在基板101上的正投影,覆盖同一发光颜色的多个发光元件1021在基板101上的正投影的情况下,也可以借用上述关系式(三)限制滤光区的尺寸,其中,如图5所示,此种情况下,x可以表示R发光元件1021到G发光元件1021的方向的尺寸。
采用此种实施方式时,由于包括多个滤光区,每个滤光区可以对一种颜色的反射光进行滤光,由于每种颜色的发射光的波长范围不同,则透过截止滤光膜层103的光的波长范围也可以不同,设置滤光区可以单独针对每种颜色制备相应的截止滤光膜层103,从而可以达到针对性的滤光,相比于整层膜系制备的方式,单独针对每种颜色的发射光设计截止滤光膜层103的难度较小,因此,可以达到更加精准的滤光,使得出射光更纯净。
在一些实施例中,截止滤光膜层103由于需要对发光层102发出的发射光进行滤光,以使透过截止滤光膜层103的出射光的波长范围小于发射光的波长范围,在一些实施例中,截止滤光膜层103可以包括层叠设置的多个子膜层,每相邻的两个子膜层具有不同大小的折射率。
其中,截止滤光膜层103无论是上述所述的整层膜系(多个滤光区的配置相同的实施例),还是多个滤光区的配置不同的实施例,其都可以由层叠设置的多个子膜层构成。并且,每相邻的两个子膜层具有不同大小的折射率,也就是说多个子膜层可以每相邻的两个子膜层可以高、低折射率交替排布的。根据上述关系式(一)和关系式(二),可以设计每个子膜层的折射率,由此发光层102的发射光,可以由多个子膜层进行层层滤光,最终透过所需波段的发射光(透过截止滤光层的最后一层子膜层的光称为出射光)。
其中,在发光层102产生多种颜色的发射光的情况下,若是采用整层的截止滤光膜层103(多个滤光区的配置相同的实施例),即截止滤光膜层103在基板101上的正投影整面覆盖基板101,那么截止滤光膜层103会同时对多种颜色的发射光进行滤光。
一些实施例中,滤光区由于包括多个子膜层,其中,滤光区的侧边是是 对齐的,也就是各个子膜层的侧边齐平。或者,滤光区的侧边被其中一个子膜层所包覆,如被最上层的子膜层所包覆。
下面,示例性说明其滤光过程:
参照图7所示,示出了截止滤光膜层103的滤光过程示意图,以发光层102产生绿光、蓝光和红光的发射光为例,多个子膜层由靠近所述发光元件1021到远离发光元件1021的方向层叠,共设计K层,K大于等于9,小于等于16。
其中,发光层102产生绿光、蓝光和红光进入到第1层,滤除一个波长的光,例如,允许绿光的一个波段的光通过,即将该波长的光反射回,允许其他波长的光通过,例如允许红光和蓝光通过,接着这些被允许通过第1层的光进入到第2层,由于第2层与第1层的折射率不同,则会滤除另一个波长的光,依次类推,经过多个子膜层后,红光、蓝光和绿光在对应的子膜层上被过滤,从而被透过的光的波长范围逐渐被缩小,也就是说透过截止滤光膜层103的每种颜色的光都变的更为纯净。
在一些实施例中,每相邻的两个子膜层中,其中一个子膜层的折射率大于2,另一个子层的折射率小于2。
其中,多个子膜层是高、低折射率交替设置,此种情况下,经模拟仿真,可以达到较好的滤光效果,也就是说高低折射率交替设置的情况下,可以让出射光的颜色更为纯净。
具体地,经模拟仿真,每相邻的两个子膜层中,其中一个子膜层的折射率大于2,另一个子层的折射率小于2。具体地,折射率大于2的子膜层与折射率小于2的子膜层之间的折射率差异可以较大,例如,可以将差异设置为0.5或比0.5更高的0.8,具体可以选择:0.5、0.6、0.7和0.8。每种差异在后续具体实施例中有详细说明。
需要说明的是,该折射率的设置,无论是采用覆盖整面基板101的截止滤光膜层103,还是不同滤光区配置不同的实施例,都可以设置不同子膜层对应不同的折射率。且,每相邻两个子膜层的折射率的差异可以选择为:0.5、0.6、0.7和0.8。
一些实施例中,多个子膜层的数量可以大于等于9且小于等于16。
具体地,在整层设计的情况下,即采用覆盖整面基板101的截止滤光膜层103,其多个子膜层的数量可以大于等于10且小于等于15,优选地,可以由13层子膜层构成。
具体地,在不同滤光区配置不同的实施例的情况下,不同颜色的发射光对应的滤光区可以由不同数量的子膜层构成。一种示例中,波长较长的颜色的发射光所对应的滤光区中子膜层的数量,大于波长较短的颜色的发射光所对应的滤光区中子膜层的数量。也就是说波长范围越低的发射光,其滤光区的子膜层的数量越少。
示例地,蓝光所对应的滤光区可以由9层子膜层构成,绿光对应的滤光区可以由14层子膜层构成,红光对应的滤光区可以由16层子膜层构成。
在一些实施例中,不同子膜层可以具有不同的厚度。
如上述关系式(二),折射率与波长和厚度有关,因此,在波长已知下,可以通过改变厚度以设置折射率,从而达到对某一种波长的发射光的所需程度的折射。实际中,可以依据关系式(一)和关系式(二),根据实际滤光需求,利用软件仿真出各个子膜层的厚度。
具体地,每个子膜层可以有自己的厚度,从而在子膜层的材料即使相同的情况下,可以通过改变厚度,对折射率进行微调,如此,可以实现对同一波长范围内的光的精细滤光。具体地,可以参照后续示例1和示例2详述的内容。
在不同颜色的发射光对应的滤光区采用不同配置的实施例中,每两种颜色的发射光中,波长较长的颜色的发射光所对应的滤光区的厚度,大于波长较短的颜色的发射光所对应的滤光区的厚度。
本实施例中,由于波长越长,按照关系式(二),同样折射率下,需要厚度越大,因此,要达到相同的滤光效果,波长越长,厚度可以越大。对此,波长较长的颜色的发射光所对应的滤光区的厚度,可以大于波长较短的颜色的发射光所对应的滤光区的厚度。例如,对于过滤蓝光的滤光区,其厚度可以小于过滤绿光的滤光区,过滤绿光的滤光区的厚度又可以小于过滤红光的滤光区。
当然,一些实施例中,滤光区的厚度也可以通过设置滤光区中的子膜层的数量达到,每两种颜色的发射光中,波长较长的颜色的发射光所对应的滤 光区中子膜层的数量,大于波长较短的颜色的发射光所对应的滤光区中子膜层的数量。
也就是说,通过增加子膜层的数量来达到增加相应滤光区的厚度的目的。具体如上述实施例所述,蓝光所对应的滤光区可以由9层子膜层构成,绿光对应的滤光区可以由14层子膜层构成,红光对应的滤光区可以由16层子膜层构成。
在一些实施例中,由于各个滤光区的厚度可能不一致,则截止滤光膜层的表面是不齐平的,此种情况下,若截止滤光膜层靠近发光元件设置,也就是设置在发光元件背离基板101一侧时,可以在截止滤光膜层背离基板一侧制备复合胶层时,先在截止滤光膜层背离基板一侧覆盖第一基材层108,如图3所示,通过第一基材层108对截止滤光膜层的上表面进行压平处理。或者,可以在截止滤光膜层背离基板一侧覆盖一层透明胶层,该透明胶层的上表面齐平,再在透明胶层背离基板一侧制备复合胶层,由此可以弥补滤光区厚度不同造成的段差,避免在段差处可能产生气泡,提高显示面板的显示质量。
在一些实施例中,物质的折射率主要取决于材料,厚度可以微调折射率(对纳米级材料而言,厚度可以影响折射率)。如上所述,本公开实施例中每相邻的两个子膜层中,其中一个子膜层的折射率大于2,另一个子层的折射率小于2。如此,可以选用折射率大于2的材料作为高折射率的膜层材料,折射率小于2的低材料作为低折射率的膜层材料。
具体地,无论是多个滤光区配置相同,还是不同颜色的发射光对应的滤光区配置不同,在每相邻的两个子膜层中:其中一个子膜层的膜层材料包括Ta
2O
5、TiO
3、TiO
2、ZrO
2中的至少一种,另一个子膜层的膜层材料包括SiO
2、MgF
2、CeF
3、Al
2O
3和Y
2O
3中的至少一种。
其中,Ta
2O
5的中文名称为五氧化二钽,TiO
3的中文名称为三氧化钛,TiO
2的中文名称为二氧化钛,ZrO
2的中文名称为二氧化锆,SiO
2的中文名称为二氧化硅,MgF
2的中文名称为二氟化镁,CeF
3的中文名称为二氟化铈,Al
2O
3的中文名称为三氧化二铝,Y
2O
3的中文名称为三氧化二钇。
其中,一个子膜层选用高折射率的膜层材料,其中,高折射率的膜层材 料包括Ta
2O
5、TiO
3、TiO
2和ZrO
2,实际中,可以任选Ta
2O
5、TiO
3、TiO
2和ZrO
2中的一种材料,或任选其中的多种材料。
其中,另一个子膜层选用低折射率的膜层材料包括SiO
2、MgF
2、CeF
3、Al
2O
3和Y
2O
3,实际中,可以任选SiO
2、MgF
2、CeF
3、Al
2O
3和Y
2O
3中的一种材料,或任选其中的多种材料。
其中,各个材料的折射率如下:
Ta
2O
5的折射率n=2.14182,TiO
3的折射率n=2.39,ZrO
2的折射率n=2.05,TiO
2的折射率n=2.39;
SiO
2折射率n=1.46037,MgF
2的折射率n=1.38,CeF
3的折射率n=1.63,Al
2O
3的折射率n=1.65,Y
2O
3的折射率n=1.8。
其中,无论是多个滤光区配置相同,还是不同颜色的发射光对应的滤光区配置不同,都可以采用上述膜层材料制作。其中,在相邻的三个子膜层或多个子膜层中,不同子膜层所用的膜层材料可以均不同,只要保证高低折射率交替叠放即可。示例地,有9个子膜层,按照从发光层102一侧到远离发光层102的顺序,第一个子膜层的膜层材料可以是Ta
2O
5,第二个子膜层的膜层材料可以是SiO
2,第三个子膜层的膜层材料可以是TiO
3,第四个子膜层的膜层材料可以是MgF
2,第五个子膜层的膜层材料可以是TiO
2。以此类推,从而可以根据需要层层蒸镀,进而得到本公开的截止滤光膜层103。
一种优选方式中,为了降低制备难度,截止滤光膜层103包可以由折射率不同的两种粘附力好的膜层材料构成,这样相邻的子膜层之间的粘附力得到提高,不易翘曲,从而优化显示面板的良率。
具体地,每相邻两个子膜层可以由该两种膜层材料交叠层叠,从而形成多个子膜层。
具体实施时,截止滤光膜层103包括折射率不同的第一膜层材料和第二膜层材料,其中,每相邻的两个子膜层中的一个子模层为所述第一膜层材料,另一子膜层为所述第二膜层材料。
具体地,第一膜层材料可以是上述Ta
2O
5、TiO
3、TiO
2、ZrO
2中的任一种膜层材料,或者可以是其中一种粘附力较好的膜层材料。第二膜层材料可以是SiO
2、MgF
2、CeF
3、Al
2O
3和Y
2O
3中的任一种材料,或者可以是一种粘附力较好的膜层材料。
一些示例性实施例中,第一膜层材料包括Ta
2O
5,第二膜层材料包括SiO
2。例如,多个滤光区配置相同的情况下,第一膜层材料包括Ta
2O
5,第二膜层材料包括SiO
2,且多个滤光区的子膜层的数量可以一致。
或者在又一些示例性实施例中,不同颜色的发射光对应的滤光区的厚度可以不同,但是材料可以相同。此种情况下,第一膜层材料可以包括TiO
2,第二膜层材料包括SiO
2。
其中,SiO
2(二氧化硅)的化学性质比较稳定,具有较高的耐火、耐高温、热膨胀系数小、高度绝缘、耐腐蚀、压电效应、谐振效应以及其独特的光学特性,在制备子膜层时,可以增强其与其他子膜层的粘附力,提高蒸镀效果。
其中,Ta
2O
5(五氧化二钽)主要用作制造高折射低色散特种光学玻璃用材质。
在又一些实施例中,不同颜色的发射光对应的滤光区所包含的两种膜层材料也可以不同,例如,发光层102发射红光、蓝光和绿光,针对红光进行滤光的滤光区,其采用的两种膜层材料可以是TiO
2和SiO
2,针对绿光进行滤光的滤光区,其采用的两种膜层材料可以是Ta
2O
5和SiO
2,针对蓝光进行滤光的滤光区,其采用的两种膜层材料可以是Ta
2O
5和SiO
2。
当然,以上仅为示例性说明,不代表对本公开的具体限制,实际中,可以根据滤光需求,选择每个滤光区中每个子膜层的膜层材料即可,在此不做特别限定。
下面,结合几个具体示例,对本公开的显示面板进行示例说明:
示例1:
本示例1中,截止滤光膜层在基板上的正投影整面覆盖基板,不同颜色的发射光对应不同的滤光区,这些滤光区的材料和厚度都可以相同,因此,可以在一次构图工艺中完成。发光层产生蓝光、绿光和红光;相应地,包括发蓝色光的发光元件、发绿色光的发光元件以及发红色光的发光元件。
参照图2所示,显示面板包括基板、位于基板一侧的发光层、位于发光层背离基板一侧的扩散胶层、位于扩散胶层背离基板一侧的透明胶层、位于透明胶层背离基板一侧的黑胶层、位于黑胶层背离基板一侧的截止滤光膜层, 以及位于截止滤光膜层背离基板的一侧第二基材层。
其中,对于截止滤光膜层,膜层材料选择高折射率的Ta
2O
5和低折射率的SiO
2。其中,SiO
2折射率n=1.46037,Ta
2O
5折射率n=2.14182,第二基材层为玻璃,折射率n=1.519,与第二基材层贴合的子膜层为SiO
2,厚度为98.78nm,相邻的一层子膜层为Ta
2O
5,厚度为72.98nm,高、低折射率膜层交替排布,共13层,最上层为SiO
2层,厚度133.65nm。
通过膜层仿真,各层材料的厚度及排列可以参照图8和图9所示,膜层总厚度为1542.17nm。图9中Refractive index表示折射率,extinction coefficient表示光的衰减系数,Opitcal Thickness表示光学厚度,Physical Thickness表示物理厚度,单位为nm(纳米)。
如图9所示,截止滤光膜层中,从最上层至最下层,即从靠近第二基材层104一侧到远离第二基材层104顺序,其第一个子膜层为SiO
2,厚度为133.6nm,第二个子膜层为Ta
2O
5,厚度为65.64nm;第三个子膜层为SiO
2,厚度为91.44nm,第四个子膜层为Ta
2O
5,厚度为109.35nm;第五个子膜层为SiO
2,厚度为261.88nm,第六个子膜层为Ta
2O
5,厚度为45.28nm;第七个子膜层为SiO
2,厚度为206.87nm,第八个子膜层为Ta
2O
5,厚度为54.45nm;第九个子膜层为SiO
2,厚度为202.53nm,第十个子膜层为Ta
2O
5,厚度为70.22nm;第十一个子膜层为SiO
2,厚度为126.10nm,第十二个子膜层为Ta
2O
5,厚度为72.98nm;第十三个子膜层为SiO
2,厚度为98.78nm。
此示例1中,允许透过截止滤光膜层的蓝光的中心波长为(475±15)nm,绿光中心波长(520±15)nm,红光中心波长(625±15)nm。膜层总厚度1532nm。膜层的透光率曲线,参照图10所示。图10中横坐标代表波长,纵坐标代表透光率,可见蓝光波段在475±15nm范围内的波的透光率最高,其他蓝光波段的透过率很低,因此,可以提高蓝光的纯净度。同理,绿光和红光的纯净度也得到提高。
示例2:发光层产生蓝光、绿光和红光;相应地,包括发蓝色光的发光元件、发绿色光的发光元件以及发红色光的发光元件。
其中,如图5和图6所示,每一滤光区对一种颜色的发射光进行滤光,相邻滤光区之间可以具有间隔。
如图3所示,显示面板包括基板、位于基板一侧的发光层、位于发光层 背离基板一侧的截止滤光膜层、位于截止滤光膜层背离基板一侧的第一基材层、位于第一基材层背离基板一侧的扩散胶层、位于扩散胶层背离基板一侧的黑胶层,以及位于黑胶层背离基板的一侧第二基材层。
其中,对于截止滤光膜层,膜层材料采用高折射率的TiO
2,其折射率n=2.39,和低折射率的SiO
2,其折射率n=1.46。高、低折射率层交替排布。其中,过滤蓝光的滤光区共9层子膜层,总厚度720nm,参照图11,示出了过滤蓝光的滤光区的各子膜层的厚度设计分布图。
如图11所示,该滤光区中,从最上层至最下层,即从靠近第二基材层104一侧到远离第二基材层104顺序,其第一个子膜层为TiO
2,厚度为93.78nm,第二个子膜层为SiO
2,厚度为93.03nm;第三个子膜层为TiO
2,厚度为53.51nm,第四个子膜层为SiO
2,厚度为91.49nm;第五个子膜层为TiO
2,厚度为57.29nm,第六个子膜层为SiO
2,厚度为138.23nm;第七个子膜层为TiO
2,厚度为58.24nm,第八个子膜层为SiO
2,厚度为89.57nm;第九个子膜层为TiO
2,厚度为48.48nm。
参照图12,示出了蓝光从截止滤光膜层透过后的光透过率示意图。
其中,过滤绿光的滤光区共14层子膜层,总厚度1107nm,参照图13,示出了过滤绿光的滤光区的各子膜层的厚度设计分布图。参照图14,示出了绿光从截止滤光膜层透过后的光透过率示意图。
如图13所示,该滤光区中,从最上层至最下层,即从靠近第二基材层104一侧到远离第二基材层104顺序,其第一个子膜层为TiO
2,厚度为11.10nm,第二个子膜层为SiO
2,厚度为66.70nm;第三个子膜层为TiO
2,厚度为71.76nm,第四个子膜层为SiO
2,厚度为113.76nm;第五个子膜层为TiO
2,厚度为57.64nm,第六个子膜层为SiO
2,厚度为90.35nm;第七个子膜层为TiO
2,厚度为51.71nm,第八个子膜层为SiO
2,厚度为185.08nm;第九个子膜层为TiO
2,厚度为51.85nm,第十个子膜层为SiO
2,厚度为88.67nm;第十一个子膜层为TiO
2,厚度为52.52nm,第十二个子膜层为SiO
2,厚度为88.82nm;第十三个子膜层为TiO
2,厚度为102.30nm,第十四个子膜层为SiO
2,厚度为83.33nm。
其中,过滤红光的滤光区共16层子膜层,总厚度1350nm,参照图15, 示出了过滤红光的滤光区的各子膜层的厚度设计分布图。参照图16,示出了红光从截止滤光膜层透过后的光透过率示意图。
如图15所示,该滤光区中,从最上层至最下层,即从靠近第二基材层104一侧到远离第二基材层104顺序,其第一个子膜层为TiO
2,厚度为67.05nm,第二个子膜层为SiO
2,厚度为96.14nm;第三个子膜层为TiO
2,厚度为156.75nm,第四个子膜层为SiO
2,厚度为78.34nm;第五个子膜层为TiO
2,厚度为69.09nm,第六个子膜层为SiO
2,厚度为92.54nm;第七个子膜层为TiO
2,厚度为57.88nm,第八个子膜层为SiO
2,厚度为91.67nm;第九个子膜层为TiO
2,厚度为117.92nm,第十个子膜层为SiO
2,厚度为83.85nm;第十一个子膜层为TiO
2,厚度为51.30nm,第十二个子膜层为SiO
2,厚度为80.43nm;第十三个子膜层为TiO
2,厚度为36.81nm,第十四个子膜层为SiO
2,厚度为59.40nm;第十五个子膜层为TiO
2,厚度为52.09nm,第十六个子膜层为SiO
2,厚度为166.61nm。
采用本公开的显示面板,具有以下优点:
第一方面,反向降低对发光元件的分Bin要求,由于截止滤光膜层对发射光进行滤光,这样,使得发光元件所发出的光被透过后,其波长之间的差异更小,因此从显示面板出射的光的颜色的纯净度得到提高,颜色均一性得到提高,使得发光层上的发光元件可以有较宽的发光波段,因此降低了对发光元件的分Bin要求。
第二方面,提高了发光元件的良率。由于可以降低对分Bin的精细度的要求,如此,可以允许较粗粒度的分Bin,则同一批次生产出的发光元件中被弃用回收的发光元件大大减少,从而降低了生产成本。
基于相同的发明构思,本公开了一种显示装置,该显示装置可以包括上述任一实施例中的显示面板。
最后,还需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素,而且还包 括没有明确列出的其他要素,或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上对本公开所提供的一种显示面板以及显示装置进行了详细介绍,本文中应用了具体个例对本公开的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本公开的方法及其核心思想;同时,对于本领域的一般技术人员,依据本公开的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本公开的限制。
本领域技术人员在考虑说明书及实践这里公开的发明后,将容易想到本公开的其它实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本公开的真正范围和精神由下面的权利要求指出。
应当理解的是,本公开并不局限于上面已经描述并在附图中示出的精确结构,并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。
本文中所称的“一个实施例”、“实施例”或者“一个或者多个实施例”意味着,结合实施例描述的特定特征、结构或者特性包括在本公开的至少一个实施例中。此外,请注意,这里“在一个实施例中”的词语例子不一定全指同一个实施例。
在此处所提供的说明书中,说明了大量具体细节。然而,能够理解,本公开的实施例可以在没有这些具体细节的情况下被实践。在一些实例中,并未详细示出公知的方法、结构和技术,以便不模糊对本说明书的理解。
在权利要求中,不应将位于括号之间的任何参考符号构造成对权利要求的限制。单词“包含”不排除存在未列在权利要求中的元件或步骤。位于元件之前的单词“一”或“一个”不排除存在多个这样的元件。本公开可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中,这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些 单词解释为名称。
最后应说明的是:以上实施例仅用以说明本公开的技术方案,而非对其限制;尽管参照前述实施例对本公开进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。
Claims (20)
- 一种显示面板,其特征在于,包括:基板,位于所述基板一侧的发光层,以及位于所述发光层背离所述基板一侧的封装层;所述发光层包括多个发光元件,所述封装层包括截止滤光膜层;其中,多个所述发光元件产生至少两种颜色的发射光;其中,所述截止滤光膜层包括多个滤光区,一个滤光区对一种颜色的发射光进行滤光,以使透过所述滤光区的出射光的波长范围小于所述发射光的波长范围。
- 根据权利要求1所述的显示面板,其特征在于,透过所述截止滤光膜层的每种颜色的出射光的波长范围为:与该种颜色的发射光的中心波长之间的差异小于或等于15nm的范围。
- 根据权利要求1所述的显示面板,其特征在于,所述截止滤光膜层在所述基板上的正投影整面覆盖所述基板。
- 根据权利要求1所述的显示面板,其特征在于,多个所述滤光区在所述基板上的正投影互不交叠。
- 根据权利要求1所述的显示面板,其特征在于,一个所述滤光区在所述基板上的正投影,覆盖产生同一种颜色的发射光的至少一个所述发光元件在所述基板上的正投影,以使所述滤光区对被其覆盖的发光元件所发出的发射光进行滤光。
- 根据权利要求1所述的显示面板,其特征在于,相邻两个所述滤光区在所述基板上的正投影之间具有间隔。
- 根据权利要求1-6任一所述的显示面板,其特征在于,所述截止滤光膜层包括层叠设置的多个子膜层,每相邻的两个子膜层具有不同大小的折射率。
- 根据权利要求7所述的显示面板,其特征在于,相邻的两个子膜层中,其中一个子膜层的折射率大于2,另一个子层的折射率小于2。
- 根据权利要求7所述的显示面板,其特征在于,相邻的两个子膜层中:其中一个子膜层的膜层材料包括Ta 2O 5、TiO 3、TiO 2、ZrO 2中的至少一 种,另一个子膜层的膜层材料包括SiO 2、MgF 2、CeF 3、Al 2O 3和Y 2O 3中的至少一种。
- 根据权利要求7所述的显示面板,其特征在于,所述截止滤光膜层包括折射率不同的第一膜层材料和第二膜层材料,其中,每相邻的两个子膜层中的一个子模层为所述第一膜层材料,另一子膜层为所述第二膜层材料。
- 根据权利要求10所述的显示面板,其特征在于,所述第一膜层材料包括Ta 2O 5,所述第二膜层材料包括SiO 2。
- 根据权利要求7所述的显示面板,其特征在于,所述多个子膜层的数量大于等于9且小于等于16。
- 根据权利要求7所述的显示面板,其特征在于,每两种颜色的发射光中,波长较长的颜色的发射光所对应的滤光区中子膜层的数量,大于波长较短的颜色的发射光所对应的滤光区中子膜层的数量。
- 根据权利要求7所述的显示面板,其特征在于,不同的所述子膜层具有不同的厚度。
- 根据权利要求1-6任一或8-15任一所述的显示面板,其特征在于,每两种颜色的发射光中,波长较长的颜色的发射光所对应的滤光区的厚度,大于波长较短的颜色的发射光所对应的滤光区的厚度。
- 根据权利要求1-6任一或8-15任一所述的显示面板,其特征在于,所述封装层还包括位于所述发光层背离基板一侧的复合胶层,所述截止滤光膜层位于所述复合胶层与所述发光层之间,或,位于所述复合胶层背离所述发光层的一侧。
- 根据权利要求16所述的显示面板,其特征在于,所述复合胶层包括扩散胶层、透明胶层和黑胶层中的至少一者;其中,在包括所述扩散胶层的情况下,所述扩散胶层靠近所述发光层设置。
- 根据权利要求1至6任一或8至15任一所述的显示面板,其特征在于,多个所述发光元件包括发蓝色光的发光元件、发绿色光的发光元件以及发红色光的发光元件。
- 根据权利要求1所述的显示面板,其特征在于,所述发光元件为次毫米发光二极管。
- 一种显示设备,其特征在于,包括权利要求1-19任一所述的显示面板。
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