WO2024106246A1 - Composition d'organopolysiloxane durcissable et produit stratifié - Google Patents
Composition d'organopolysiloxane durcissable et produit stratifié Download PDFInfo
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- WO2024106246A1 WO2024106246A1 PCT/JP2023/039869 JP2023039869W WO2024106246A1 WO 2024106246 A1 WO2024106246 A1 WO 2024106246A1 JP 2023039869 W JP2023039869 W JP 2023039869W WO 2024106246 A1 WO2024106246 A1 WO 2024106246A1
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- 239000000203 mixture Substances 0.000 title claims abstract description 102
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 53
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 24
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 11
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 7
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 5
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 125000006038 hexenyl group Chemical group 0.000 claims description 14
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 125000005389 trialkylsiloxy group Chemical group 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 45
- 239000000853 adhesive Substances 0.000 abstract description 42
- 239000000126 substance Substances 0.000 abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract 1
- -1 trimethylsiloxy groups Chemical group 0.000 description 60
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 34
- 238000001723 curing Methods 0.000 description 26
- 229920001577 copolymer Polymers 0.000 description 18
- 229910052697 platinum Inorganic materials 0.000 description 16
- 239000000123 paper Substances 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000004205 dimethyl polysiloxane Substances 0.000 description 11
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 2
- GNKZMNRKLCTJAY-UHFFFAOYSA-N 4'-Methylacetophenone Chemical compound CC(=O)C1=CC=C(C)C=C1 GNKZMNRKLCTJAY-UHFFFAOYSA-N 0.000 description 2
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 241000519695 Ilex integra Species 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229910052909 inorganic silicate Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 125000004665 trialkylsilyl group Chemical group 0.000 description 2
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- VMFJVWPCRCAWBS-UHFFFAOYSA-N (3-methoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 VMFJVWPCRCAWBS-UHFFFAOYSA-N 0.000 description 1
- OZDCBKYPNBVRSA-UHFFFAOYSA-N (4,4-dimethoxycyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound C1=CC(OC)(OC)CC=C1C(=O)C1=CC=CC=C1 OZDCBKYPNBVRSA-UHFFFAOYSA-N 0.000 description 1
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-SOFGYWHQSA-N (e)-3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)\C=C(/C)C#C HMVBQEAJQVQOTI-SOFGYWHQSA-N 0.000 description 1
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- XLYMOEINVGRTEX-ONEGZZNKSA-N (e)-4-ethoxy-4-oxobut-2-enoic acid Chemical compound CCOC(=O)\C=C\C(O)=O XLYMOEINVGRTEX-ONEGZZNKSA-N 0.000 description 1
- KNIBYEXSDVPWDA-ARJAWSKDSA-N (z)-4-(1-methoxypropan-2-yloxy)-4-oxobut-2-enoic acid Chemical compound COCC(C)OC(=O)\C=C/C(O)=O KNIBYEXSDVPWDA-ARJAWSKDSA-N 0.000 description 1
- IQBLWPLYPNOTJC-FPLPWBNLSA-N (z)-4-(2-ethylhexoxy)-4-oxobut-2-enoic acid Chemical compound CCCCC(CC)COC(=O)\C=C/C(O)=O IQBLWPLYPNOTJC-FPLPWBNLSA-N 0.000 description 1
- FDNBQVCBHKEDOJ-FPLPWBNLSA-N (z)-4-(6-methylheptoxy)-4-oxobut-2-enoic acid Chemical compound CC(C)CCCCCOC(=O)\C=C/C(O)=O FDNBQVCBHKEDOJ-FPLPWBNLSA-N 0.000 description 1
- PCTZLSCYMRXUGW-UHFFFAOYSA-N 1,1,1,2,2-pentafluorobutane Chemical group [CH2]CC(F)(F)C(F)(F)F PCTZLSCYMRXUGW-UHFFFAOYSA-N 0.000 description 1
- SXPRVMIZFRCAGC-UHFFFAOYSA-N 1,2,3,4,5-pentafluoro-6-methylbenzene Chemical compound CC1=C(F)C(F)=C(F)C(F)=C1F SXPRVMIZFRCAGC-UHFFFAOYSA-N 0.000 description 1
- SJBBXFLOLUTGCW-UHFFFAOYSA-N 1,3-bis(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC(C(F)(F)F)=C1 SJBBXFLOLUTGCW-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JYAQYXOVOHJRCS-UHFFFAOYSA-N 1-(3-bromophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(Br)=C1 JYAQYXOVOHJRCS-UHFFFAOYSA-N 0.000 description 1
- SKBBQSLSGRSQAJ-UHFFFAOYSA-N 1-(4-acetylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(C(C)=O)C=C1 SKBBQSLSGRSQAJ-UHFFFAOYSA-N 0.000 description 1
- HDMHXSCNTJQYOS-UHFFFAOYSA-N 1-(4-prop-2-enylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(CC=C)C=C1 HDMHXSCNTJQYOS-UHFFFAOYSA-N 0.000 description 1
- DKFHWNGVMWFBJE-UHFFFAOYSA-N 1-ethynylcyclohexene Chemical compound C#CC1=CCCCC1 DKFHWNGVMWFBJE-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KLAMVBJBHNQYSB-UHFFFAOYSA-N 2-ethyl-1-phenylbutan-1-one Chemical compound CCC(CC)C(=O)C1=CC=CC=C1 KLAMVBJBHNQYSB-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 1
- LEUJIOLEGDAICX-UHFFFAOYSA-N 3-chloroxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=C(Cl)C=C3OC2=C1 LEUJIOLEGDAICX-UHFFFAOYSA-N 0.000 description 1
- KMSYDDGPKBBSNA-UHFFFAOYSA-N 3-ethyl-1-phenylpentan-1-one Chemical compound CCC(CC)CC(=O)C1=CC=CC=C1 KMSYDDGPKBBSNA-UHFFFAOYSA-N 0.000 description 1
- LAKYCCVWZNCNIO-UHFFFAOYSA-N 3-methylidenepent-1-yne Chemical compound CCC(=C)C#C LAKYCCVWZNCNIO-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- XJBGJIHHXFXOFJ-UHFFFAOYSA-N 5-methyl-3-methylidenehex-1-yne Chemical compound CC(C)CC(=C)C#C XJBGJIHHXFXOFJ-UHFFFAOYSA-N 0.000 description 1
- DLGLWFGFEQRRCP-UHFFFAOYSA-N 6-chloro-1-nonylxanthen-9-one Chemical compound O1C2=CC(Cl)=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCC DLGLWFGFEQRRCP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- 229910000576 Laminated steel Inorganic materials 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- JSAYQGVHWNBMNG-UHFFFAOYSA-N bis(2-methylbut-3-yn-2-yloxy)-prop-1-enylsilane Chemical compound CC=C[SiH](OC(C#C)(C)C)OC(C#C)(C)C JSAYQGVHWNBMNG-UHFFFAOYSA-N 0.000 description 1
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 1
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- RSLWZZXJRRZAOD-UHFFFAOYSA-N but-1-en-3-yn-2-ylbenzene Chemical compound C#CC(=C)C1=CC=CC=C1 RSLWZZXJRRZAOD-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- RWGWWFFEIPJXAN-UHFFFAOYSA-N dimethyl-bis(3-methylbut-1-ynoxy)silane Chemical compound CC(C)C#CO[Si](C)(C)OC#CC(C)C RWGWWFFEIPJXAN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-L fumarate(2-) Chemical compound [O-]C(=O)\C=C\C([O-])=O VZCYOOQTPOCHFL-OWOJBTEDSA-L 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CLFYLNSQRWCJAY-UHFFFAOYSA-N hex-3-en-1-yne Chemical compound CCC=CC#C CLFYLNSQRWCJAY-UHFFFAOYSA-N 0.000 description 1
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LWIGVRDDANOFTD-UHFFFAOYSA-N hydroxy(dimethyl)silane Chemical group C[SiH](C)O LWIGVRDDANOFTD-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002649 leather substitute Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 229940074369 monoethyl fumarate Drugs 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000010450 olivine Substances 0.000 description 1
- 229910052609 olivine Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- PIZSEPSUZMIOQF-UHFFFAOYSA-N platinum;2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound [Pt].C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 PIZSEPSUZMIOQF-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 208000008918 voyeurism Diseases 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
Definitions
- the present invention relates to a curable organopolysiloxane composition and a laminate produced using the composition.
- Curable organopolysiloxane compositions are capable of forming cured films that exhibit adequate release performance against adhesive substances, and are therefore used as materials for forming peelable cured films. It is known that this composition can be blended with an organopolysiloxane that is not involved in the curing reaction to reduce the peel resistance against adhesive substances. However, even with such compositions, it is difficult to sufficiently reduce the peel resistance, and there is instead an issue of reducing the residual adhesive strength of adhesive substances.
- Patent Document 1 describes such a composition, which has a viscosity of 50 to 5,000 mPa ⁇ s at 25°C, both ends of the molecular chain are blocked with trimethylsiloxy groups, and the side chains contain at least two alkenyl groups each having 4 or more carbon atoms (the content of alkenyl groups in the siloxane is 0.2 to 10.0 mol% of the total organic groups).
- Patent Document 2 proposes a composition containing a dihydrogenpolysiloxane, a platinum-based catalyst, and 99 to 90 parts by weight of a linear diorganopolysiloxane having a viscosity of 5 to 1,000 mPa ⁇ s at 25° C., both molecular chain terminals being blocked with dimethylalkenylsiloxy groups and the alkenyl group content being 0.2 to 10.0 mol % of the total organic groups, and
- the proposed composition includes a mixture of 1 to 10 parts by weight of a linear diorganopolysiloxane having a viscosity of 50 to 5,000 mPa ⁇ s at 25°C, containing at least two alkenyl groups in the molecule, and both molecular chain ends capped with dimethylalkenylsiloxy groups (the content of alkenyl groups in the siloxane is 0.2 to 10.0 mol % of the total organic groups);
- Patent Document 2 proposes a composition containing a dihydr
- the object of the present invention is to provide a curable organopolysiloxane composition that can form a cured film with stable release properties on adhesive substances without impairing their adhesive properties.
- Another object of the present invention is to provide a laminate having a cured film with stable release properties.
- the curable organopolysiloxane composition of the present invention comprises: (A) a linear organopolysiloxane having a viscosity at 25°C of 20 to 1,500 mPa ⁇ s and having higher alkenyl groups having 4 to 12 carbon atoms at the molecular chain terminals and in the side chains; (B) a linear organopolysiloxane having a viscosity at 25°C of 3,000 to 50,000 mPa ⁇ s, having at least two alkenyl groups having 2 to 12 carbon atoms per molecule only at side chains of the molecular chain, and the content of said alkenyl groups in component (B) calculated as vinyl groups (CH 2 ⁇ CH-) is 0.1 to 0.3 mass %; (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, and (D) a catalytic amount of a hydrosilylation reaction catalyst, a mass ratio of the component (A)
- the higher alkenyl group in component (A) is a hexenyl group, and the content of said hexenyl groups in component (A) calculated as vinyl groups (CH 2 ⁇ CH—) is 0.5 to 3.0 mass %.
- both molecular chain terminals of component (B) are preferably blocked with trialkylsiloxy groups.
- This composition is suitable for forming peelable cured coatings.
- the laminate of the present invention is characterized by having a cured layer formed by curing the above-mentioned curable organopolysiloxane composition on at least one surface of the sheet-like substrate.
- the laminate of the present invention is characterized in that it has a release layer formed by curing the above-mentioned curable organopolysiloxane composition on at least one surface of the sheet-like substrate, and has an adhesive layer on the release layer.
- the curable organopolysiloxane composition of the present invention is characterized by its ability to form a cured film with stable release properties on adhesive substances without impairing their adhesive properties.
- the laminate of the present invention is characterized by its stable release properties.
- viscosity means a value (unit: mPa s or Pa s) at 25°C measured using a B-type rotational viscometer in accordance with JIS K 7117-1:1999 "Plastics - Liquid, emulsion or dispersion resins - Measurement method of apparent viscosity using a Brookfield rotational viscometer”.
- side chain of a molecular chain refers to a bonding position other than the terminal of the molecular chain
- having an alkenyl group at the side chain of a molecular chain means that an alkenyl group is bonded to a silicon atom other than the terminal of the molecular chain of a linear organopolysiloxane.
- content calculated as vinyl group (CH 2 ⁇ CH-) used in this specification means the content as vinyl group when the alkenyl group is calculated as the equimolar amount of vinyl group.
- Component (A) is a linear organopolysiloxane having higher alkenyl groups having 4 to 12 carbon atoms at the molecular chain terminals and in the side chains.
- Examples of the higher alkenyl groups in component (A) include butenyl, pentenyl, hexenyl, heptenyl, and octenyl groups, with hexenyl groups being preferred.
- Examples of groups bonded to silicon atoms other than higher alkenyl groups in component (A) include alkyl groups having 1 to 12 carbon atoms, such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and heptyl groups; aryl groups having 6 to 12 carbon atoms, such as phenyl, tolyl, and xylyl groups; aralkyl groups having 7 to 12 carbon atoms, such as benzyl and phenethyl groups; and fluoroalkyl groups having 3 to 12 carbon atoms, such as 3,3,3-trifluoropropyl, 4,4,4,3,3-pentafluorobutyl, 5,5,5,4,4,3,3-heptafluoropentyl, 6,6,6,5,5,4,4,3,3-nonafluorohexyl, and 7,7,7,6,6,5,5,4,4,3,3-undecafluoroheptyl groups, with methyl groups
- component (A) a small amount of hydroxyl groups or alkoxy groups having 1 to 3 carbon atoms, such as methoxy groups and ethoxy groups, may be bonded to silicon atoms, provided this does not impair the object of the present invention.
- component (A) when they are hexenyl groups, it is preferable that the content of said hexenyl groups in component (A), calculated as vinyl groups (CH 2 ⁇ CH-), is in the range of 0.5 to 3.0 mass%, or in the range of 0.5 to 2.0 mass%.
- component (A) when the content of hexenyl groups in component (A) is at or above the lower limit of the above range, the composition cures sufficiently, preventing migration of the silicone component to the adhesive substance of the resulting cured release coating and preventing a decrease in the residual adhesion rate of the adhesive substance, whereas when it is at or below the upper limit of the above range, the resulting cured release coating has an appropriately light peel resistance.
- the viscosity of component (A) at 25°C is within the range of 20 to 1,500 mPa ⁇ s, and preferably within the range of 50 to 1,500 mPa ⁇ s, 50 to 1,000 mPa ⁇ s, or 100 to 500 mPa ⁇ s. This is because when the viscosity of component (A) is equal to or greater than the lower limit of the above range, the curability of the composition can be improved, whereas when the viscosity is equal to or less than the upper limit of the above range, the resulting peelable cured coating has relatively low peel resistance and changes over time are small.
- component (A) examples include a dimethylsiloxane-methylhexenylsiloxane copolymer in which both molecular chain terminals are blocked with dimethylhexenylsiloxy groups, and a methylhexenylpolysiloxane in which both molecular chain terminals are blocked with dimethylhexenylsiloxy groups.
- Component (B) is a linear organopolysiloxane having at least two alkenyl groups having 2 to 12 carbon atoms in the molecule only on the side chains of the molecular chain.
- alkenyl groups in component (B) include vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, and octenyl groups, with vinyl being preferred.
- Examples of groups bonded to silicon atoms other than the alkenyl groups in component (B) include the alkyl groups having 1 to 12 carbon atoms, aryl groups having 6 to 12 carbon atoms, aralkyl groups having 7 to 12 carbon atoms, and fluoroalkyl groups having 3 to 12 carbon atoms, all of which are listed as examples of component (A), with methyl being preferred.
- Component (B) has alkenyl groups only on the side chains of the molecular chain, but the groups at the terminals of the molecular chain are not limited, and it is preferred that the component (B) has a trialkylsilyl group, for example. Examples of the trialkylsilyl group include trimethylsilyl and triethylsilyl groups.
- component (B) a small amount of hydroxyl groups or alkoxy groups having 1 to 3 carbon atoms, such as methoxy groups and ethoxy groups, may be bonded to silicon atoms, provided this does not impair the object of the present invention.
- the alkenyl group content of component (B), calculated as the content of vinyl groups (CH 2 ⁇ CH-), is in the range of 0.1 to 0.3 mass%, preferably 0.1 to 0.25 mass%, or 0.1 to 0.2 mass%. This is because when the alkenyl group content in component (B) is at or above the lower limit of the above range, the composition cures sufficiently, preventing migration of the silicone component into the adhesive substance of the resulting cured release coating and preventing a decrease in the residual adhesion rate of the adhesive substance, whereas when it is at or below the upper limit of the above range, the resulting cured release coating has an appropriately light peel resistance and there is little change in peel resistance due to the presence or absence of press treatment.
- the viscosity of component (B) at 25°C is in the range of 3,000 to 50,000 mPa ⁇ s, preferably in the range of 4,000 to 45,000 mPa ⁇ s. This is because when the viscosity of component (B) is equal to or higher than the lower limit of the above range, the curability of the composition can be improved, while when the viscosity is equal to or lower than the upper limit of the above range, the resulting peelable cured coating has a relatively light peel resistance, and the change in peel resistance due to the presence or absence of press processing is small.
- component (B) when the viscosity of component (B) is low, the molecular weight is low, so that even with the same alkenyl group content, the number of alkenyl groups in one molecule is small. As a result, the reactivity of component (B) is low, and the silicone component is more likely to migrate to the adhesive substance of the peelable cured coating. In order to prevent this, a relatively high alkenyl content is preferable. On the other hand, when the viscosity is high, the molecular weight is high, so that even with the same alkenyl group content, the number of alkenyl groups in one molecule is large.
- component (B) As a result, the reactivity of component (B) is high, and the silicone component is more likely to remain inside the peelable cured coating. In order to promote localization of component (B) on the surface, it is effective to differentiate its relative reactivity with component (A), and a relatively low alkenyl group content is preferable for this.
- component (B) examples include dimethylsiloxane-methylvinylsiloxane copolymers with both molecular chain terminals blocked by trimethylsiloxy groups, methylvinylpolysiloxanes with both molecular chain terminals blocked by trimethylsiloxy groups, and dimethylsiloxane-methylvinylsiloxane copolymers with both molecular chain terminals blocked by dimethylhydroxysiloxy groups.
- the mass ratio of component (A) to component (B) ⁇ component (A)/component (B) ⁇ is within the range of 90/10 to 75/25, and preferably within the range of 90/10 to 77/23. This is because, when this mass ratio is equal to or greater than the lower limit of the above range, the curability of this composition, particularly at a low temperature of about 100°C, can be improved, and the strength of the resulting peelable cured coating can be increased, while, when it is equal to or less than the upper limit of the above range, the resulting peelable cured coating has a relatively low peel resistance.
- component (B) is blended in a specific ratio relative to component (A), so that a peelable cured coating can be formed that has a relatively low peel resistance, that has a small change in peel resistance depending on whether or not a press treatment is performed, and that inhibits a decrease in the residual adhesion rate of the adhesive substance.
- Component (C) is an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule.
- groups bonded to silicon atoms other than hydrogen atoms in component (C) include the alkyl groups having 1 to 12 carbon atoms, aryl groups having 6 to 12 carbon atoms, aralkyl groups having 7 to 12 carbon atoms, and fluoroalkyl groups having 3 to 12 carbon atoms exemplified in component (A) above, and preferably methyl groups.
- component (C) may have a small amount of hydroxyl groups or alkoxy groups having 1 to 3 carbon atoms, such as methoxy groups and ethoxy groups, bonded to silicon atoms, as long as the object of the present invention is not impaired.
- the viscosity of component (C) at 25°C is not limited, but is preferably within the range of 1 to 1,000 mPa ⁇ s, or within the range of 5 to 500 mPa ⁇ s. This is because when the viscosity of component (C) is equal to or greater than the lower limit of the above range, the evaporation of component (C) from the composition is suppressed, making the composition stable, whereas when the viscosity is equal to or less than the upper limit of the above range, the curing of the composition is promoted.
- the molecular structure of such component (C) is not limited, and examples thereof include linear, partially branched linear, branched, cyclic, and resinous.
- Examples of such component (C) include a dimethylsiloxane-methylhydrogensiloxane copolymer capped at both molecular chain terminals with trimethylsiloxy groups, a dimethylsiloxane-methylhydrogensiloxane copolymer capped at both molecular chain terminals with dimethylhydrogensiloxy groups, a dimethylpolysiloxane capped at both molecular chain terminals with dimethylhydrogensiloxy groups, a methylhydrogenpolysiloxane capped at both molecular chain terminals with trimethylsiloxy groups, a cyclic methylhydrogenpolysiloxane, a cyclic methylhydrogensiloxane-dimethylsiloxane copolymer, a copolymer consisting of siloxane units represented by
- the content of component (C) is an amount such that the ratio of the number of moles of silicon-bonded hydrogen atoms in component (C) to the total number of moles of higher alkenyl groups in component (A) and alkenyl groups in component (B) is in the range of 0.5 to 5.0, and preferably in the range of 0.5 to 3.0, or in the range of 1.0 to 3.0. This is because when the content of component (C) is at or above the lower limit of the above range, the curability of this composition is improved, whereas when it is at or below the upper limit of the above range, the obtained release-hardened coating exhibits light release properties against adhesive substances.
- Component (D) is a hydrosilylation catalyst for promoting the curing reaction of the composition.
- Component (D) can be exemplified by platinum catalyst, palladium catalyst, and rhodium catalyst, and is preferably platinum catalyst.
- This platinum catalyst is a catalyst containing platinum metal, and specifically, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complex of chloroplatinic acid, complex of chloroplatinic acid and ketones, complex of chloroplatinic acid and vinylsiloxane, platinum tetrachloride, platinum fine powder, solid platinum supported on alumina or silica carrier, platinum black, olefin complex of platinum, alkenylsiloxane complex of platinum, carbonyl complex of platinum, platinum catalyst of thermoplastic organic resin powder such as methyl methacrylate resin, polycarbonate resin, polystyrene resin, silicone resin, etc., containing these platinum catalysts.
- platinum alkenylsiloxane complexes such as a complex of chloroplatinic acid and divinyltetramethyldisiloxane, a complex of chloroplatinic acid and tetramethyltetravinylcyclotetrasiloxane, platinum divinyltetramethyldisiloxane complex, and platinum tetramethyltetravinylcyclotetrasiloxane complex are preferred.
- the content of component (D) is a catalytic amount that accelerates the hydrosilylation reaction of the composition, specifically an amount in which the catalytic metal in this component is within the range of 1 to 1,000 ppm by mass, or within the range of 5 to 500 ppm, relative to the total amount of components (A) to (C). This is because when the content of component (D) is at or above the lower limit of the above range, the curing of the composition is accelerated, whereas when it is at or below the upper limit of the above range, the resulting peelable cured coating is less likely to cause problems such as discoloration.
- the composition may contain (E) a hydrosilylation reaction inhibitor to adjust the curing rate.
- component (E) include alkyne alcohols such as 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-pentyn-3-ol, 2-phenyl-3-butyn-2-ol, 1-ethynyl-1-cyclohexanol, 2-ethynylisopropanol, and 2-ethynylbutan-2-ol; silylated acetylene alcohols such as trimethyl(3,5-dimethyl-1-hexyn-3-oxy)silane, dimethylbis(3-methyl-1-butynoxy)silane, methylvinylbis(3-methyl-1-butyn-3-oxy)silane, and [(1,1-dimethyl-2-propynyl)oxy]trimethylsilane; 2-isobutyl-1-buten-3-yn
- component (E) is not limited, but is preferably at least 0.001 parts by mass, at least 0.01 parts by mass, or at least 0.1 parts by mass, and at most 5 parts by mass, or at most 3 parts by mass, per 100 parts by mass of the total of components (A) and (B).
- This composition can be used substantially solvent-free, but may be diluted with a known organic solvent.
- organic solvents include aromatic hydrocarbon solvents such as toluene and xylene, aliphatic hydrocarbon solvents such as hexane, octane, and isoparaffin, ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, ester solvents such as ethyl acetate and isobutyl acetate, ether solvents such as diisopropyl ether and 1,4-dioxane, cyclic polysiloxanes with a polymerization degree of 3 to 6 such as hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, and decamethylcyclopentasiloxane, and halogenated hydrocarbons such as trichloroethylene, perchloroethylene, trifluoromethylbenzen
- the composition may contain, as optional components, adhesion promoters consisting of alkoxysilane compounds such as 3-glycidoxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane; antioxidants such as phenols, quinones, amines, phosphorus, phosphites, sulfur, and thioethers; light stabilizers such as triazoles and benzophenones; flame retardants such as phosphate esters, halogens, phosphorus, and antimony; one or more antistatic agents consisting of cationic surfactants, anionic surfactants, nonionic surfactants, and the like; and other known additives such as heat stabilizers, dyes, and pigments.
- adhesion promoters consisting of alkoxysilane compounds such as 3-glycidoxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane
- antioxidants such as phenols, quinones, amines
- the composition may be cured by irradiation with energy rays (also called actinic rays), such as ultraviolet rays or electron beams, particularly ultraviolet rays.
- energy rays also called actinic rays
- curing by ultraviolet rays includes curing by ultraviolet rays alone, or curing by ultraviolet rays and heat.
- the composition may further contain (F) a photopolymerization initiator.
- Component (F) is a component that imparts ultraviolet curing properties to the composition, and by combining heat curing by addition reaction and ultraviolet curing, there is an advantage that damage caused by heat to a plastic film substrate with low heat resistance is reduced, and the adhesion of the cured product obtained by curing the composition to the plastic film is improved. Furthermore, there is an advantage that the silicone component is prevented from migrating from the surface of the cured film obtained by curing the composition onto the sheet, and the sheet is contaminated by the silicone component (this is called silicone migration), and the migration of the silicone can be further reduced.
- This component (F) can be appropriately selected from known compounds that generate radicals when irradiated with ultraviolet light, such as organic peroxides, carbonyl compounds, organic sulfur compounds, and azo compounds.
- Specific examples include acetophenone, propiophenone, benzophenone, xanthol, fluorene, benzaldehyde, anthraquinone, triphenylamine, 4-methylacetophenone, 3-pentylacetophenone, 4-methoxyacetophenone, 3-bromoacetophenone, 4-allylacetophenone, p-diacetylbenzene, 3-methoxybenzophenone, 4-methylbenzophenone, 4-chlorobenzophenone, 4,4-dimethoxybenzophenone, 4-chloro-4-benzyl Examples include benzophenone, 3-chloroxanthone, 3,9-dichloroxanthone, 3-chloro-8-nonylxanthone, benzoin, benzoin methyl
- the amount of component (F) is not limited, but is preferably within the range of 0.01 to 10 parts by mass, or 0.01 to 2.5 parts by mass, per 100 parts by mass of component (A). If the amount of component (F) is within the above range, the silicone migration of the release cured coating obtained by curing the composition can be improved, and the physical properties such as the mechanical strength can be improved.
- This composition can be produced by simply uniformly mixing the above components (A) to (D), further component (E) and other optional components.
- the order of addition of each component is not particularly limited, but when the composition is not to be used immediately after mixing, it is preferable to store the mixture of components (A), (B) and (C) separately from component (D) and mix both immediately before use.
- component (E) by adjusting the content of component (E) in the composition consisting of components (A) to (D) and component (E), it is possible to obtain a composition that does not crosslink at room temperature but crosslinks and hardens when heated.
- a sheet-like substrate When the composition is uniformly applied to a sheet-like substrate and heated under conditions sufficient to crosslink component (A) and component (C) through a hydrosilylation reaction, a sheet-like substrate can be produced having a cured layer on the surface of the substrate that has excellent slip properties, transparency, and adhesion to the substrate.
- the cured layer obtained by curing the composition also has the advantage of being flexible and breathable, with minimal air bubble entrapment even when applied to a non-flat object. For this reason, the composition can be used extremely well in applications where both the release properties of the cured layer and the adhesion properties of the cured layer to the object to be protected are important, such as protective films for optical displays and glass surfaces.
- the laminate is characterized by having a cured layer formed by curing the composition on at least one surface of the sheet-like substrate.
- the sheet-like substrate is not limited, but examples thereof include polyesters such as polyethylene terephthalate and polyethylene naphthalate; polyolefins such as polypropylene and polymethylpentene; polycarbonate; polyimide; and films made of plastics such as polyvinyl acetate; furthermore, papers such as Japanese paper, paperboard, corrugated paper, glassine paper, clay-coated paper, polyolefin-laminated paper, polyethylene-laminated paper, and synthetic paper; fabrics such as natural fiber fabric, synthetic fiber fabric, and artificial leather fabric; and other materials such as glass wool and metal foil.
- the film may be a single layer, or may be composed of two or more layers made of the same or different plastics.
- plastic films particularly polyester films
- polyethylene terephthalate films are particularly preferred, with biaxially oriented polyethylene terephthalate films being particularly preferred.
- Polyethylene terephthalate films are less likely to generate dust during processing, use, and the like. Therefore, poor coating of adhesive substances on the release sheet caused by dust and the like can be effectively prevented.
- by applying an antistatic treatment to a polyethylene terephthalate film and using it as a substrate problems such as poor coating of adhesive substances can be prevented.
- the thickness of the sheet-like substrate is not particularly limited, but is generally 10 to 300 ⁇ m, preferably 15 to 200 ⁇ m, and particularly preferably 20 to 125 ⁇ m.
- primer compositions that can be used include a condensation type silicone primer composition that contains a polydiorganosiloxane having a SiOH group at the end, a polysiloxane having a SiH group, and/or a polysiloxane having an alkoxy group, and a condensation reaction catalyst; and an addition type silicone primer composition that contains a polydiorganopolysiloxane having an alkenyl group such as a vinyl group, a polysiloxane having a SiH group, and an addition reaction catalyst.
- the surface of the sheet-like substrate opposite the cured layer may be subjected to a surface treatment such as scratch prevention, stain prevention, fingerprint prevention, anti-glare, anti-reflection, anti-static, etc.
- the above-mentioned surface treatment may be performed after the composition is applied to the sheet-like substrate, or the composition may be applied after the surface treatment.
- scratch prevention treatment hard coat treatment
- hard coat agents such as acrylate-based, silicone-based, oxetane-based, inorganic-based, and organic-inorganic hybrid-based.
- anti-soiling treatment include treatment with anti-soiling agents such as fluorine-based, silicone-based, ceramic-based, and photocatalyst-based.
- anti-reflection treatment examples include wet treatment by coating with fluorine-based, silicone-based, and other anti-reflection agents, and dry treatment by vapor deposition or sputtering.
- anti-static treatment examples include treatment with anti-static agents such as surfactant-based, silicone-based, organic boron-based, conductive polymer-based, metal oxide-based, and vapor-deposited metal-based.
- the temperature for curing the composition on the sheet-like substrate is generally 50 to 200°C, but may be 200°C or higher if the heat resistance of the sheet-like substrate is good.
- the heating method includes heating in a hot air circulating oven, passing through a long heating furnace, and radiating heat rays from an infrared lamp or halogen lamp. Curing may also be achieved by combining heating and ultraviolet irradiation.
- component (D) is a platinum alkenylsiloxane complex catalyst
- component (D) is a platinum alkenylsiloxane complex catalyst
- the composition on the sheet-like substrate such as polyolefins and then heat it at a low temperature of 50°C to 100°C, more preferably 50°C to 80°C.
- the composition can be stably cured within a curing time of 30 seconds to several minutes (e.g., 1 to 10 minutes).
- the composition can be applied to the surface of a sheet-like substrate by any method known in the art, including dipping, spraying, gravure coating, offset coating, offset gravure, roll coating using an offset transfer roll coater, reverse roll coating, air knife coating, curtain coating using a curtain flow coater, comma coating, Mayer bar coating, and other methods known in the art that are used for forming a cured layer.
- a thickness of the release cured coating on the substrate is preferably within the range of 0.01 to 3 ⁇ m, or 0.03 to 2 ⁇ m.
- the thickness of the release cured coating is equal to or greater than the lower limit of the above range, the adhesive substance is easily peeled off, whereas if the thickness is equal to or less than the upper limit of the above range, blocking is suppressed when the resulting release sheet is wound into a roll.
- This composition is useful for forming a hardened layer that has excellent surface slipperiness and release properties against adhesive substances, and can be used particularly effectively as a release-resistant hardened coating agent for process paper, asphalt wrapping paper, and various plastic films.
- the laminate has a release layer formed by curing the composition on at least one surface of the sheet-like substrate, and is characterized by having an adhesive layer on the release layer.
- the release layer obtained by curing this composition has excellent release properties against other adhesive layers, and can therefore be used as a release layer for laminates including adhesive layers, such as process paper, adhesive packaging paper, adhesive tape, and adhesive labels.
- a laminate can be obtained in which an adhesive sheet having an adhesive layer (or adhesive layer) on at least one side of a sheet-like substrate having a cured layer (release layer or release layer) formed by heat-curing this composition on at least one side of the sheet-like substrate is attached to the sheet-like substrate so that the adhesive layer is in contact with the cured layer.
- the adhesive substance to be applied to this laminate includes various adhesives and various types of glue, and examples thereof include acrylic resin adhesives, rubber adhesives, silicone adhesives; acrylic resin adhesives, synthetic rubber adhesives, silicone adhesives, epoxy resin adhesives, and polyurethane adhesives. Other examples include asphalt, sticky foods such as mochi, glue, and chicken mochi.
- the cured layer made of this composition can be used as a slightly adhesive adhesive layer while retaining the same excellent peeling properties as when applied thinly, and is extremely useful in that it can be used as an adhesive layer for protective sheets, removable adhesive sheets, etc.
- Such an adhesive layer has the advantage of maintaining stable adhesion for a long period of time after application to an object, preventing misalignment or peeling, but also excellent removability even after application for a long period of time. It also has the advantage of being easy to reapply, and is less likely to cause deformation, whitening, or adhesive residue in the cured layer when the protective sheet is used for a long period of time.
- a protective sheet or removable adhesive sheet having a cured layer made of this composition is used for applications such as attaching to the surfaces of components such as metal sheets, painted metal sheets, aluminum sashes, resin sheets, decorative steel sheets, polyvinyl chloride laminated steel sheets, glass sheets, etc. to protect them when transporting, processing, or curing them. It can also be suitably used as a protective sheet in the manufacturing process of various liquid crystal display panels (also called monitors or displays), the distribution process of polarizing plates, the manufacturing process and distribution process of resin components for various machines such as automobiles, food packaging, etc.
- a protective sheet having an adhesive layer made of a cured layer of the present composition is easy to reposition, and is therefore suitable as a protective sheet for various displays, such as the following.
- the protective sheet of the present invention is used for purposes such as preventing the surface from being scratched, being stained, preventing fingerprints, being antistatic, being antireflective, and preventing peeping, during the manufacture, distribution, and use of these displays.
- the laminate that is the surface protection sheet can be obtained by using the present composition, and is constructed by attaching a release sheet having a release layer on at least one surface of the sheet-like substrate to the sheet-like substrate, the release layer being in contact with the cured layer, the release sheet being in contact with the cured layer, the release layer being in contact with the cured layer.
- the curable organopolysiloxane composition and laminate of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
- the viscosity in the examples is the value at 25°C measured using a Brookfield DV1 rotational viscometer in accordance with JIS K 7117-1:1999 "Plastics - Liquid, emulsion or dispersion resins - Method for measuring apparent viscosity using a Brookfield rotational viscometer.”
- the release sheets were prepared and evaluated as follows:
- Heavy peeling ratio was calculated by the following formula, by measuring the peeling resistance of the press-treated sample and the untreated sample after the above aging process.
- Heavy release rate (peel resistance of press-treated release sheet/peel resistance of untreated release sheet)
- the heavy peeling ratio is required to be 1.10 or less.
- Examples 1 to 6 and Comparative Examples 1 to 19 The following components were mixed uniformly to prepare curable organopolysiloxane compositions as shown in Tables 1 to 4.
- the content of component (D) in the tables is the amount of platinum in component (D) that is 100 ppm by mass relative to the total amount of components (A) to (C).
- component (A)/component (B) in the tables indicates the ratio of the content of component (A) to the content of component (B)
- SiH/CH 2 ⁇ CH indicates the ratio of the number of moles of silicon-bonded hydrogen atoms in component (C) to the total number of moles of alkenyl groups in components (A) and (B).
- the properties of release sheets produced using the curable organopolysiloxane compositions thus prepared were measured, and the results are shown in Tables 1 to 4.
- (b-5) Dimethylpolysiloxane having a viscosity of 350 mPa ⁇ s and both molecular chain terminals blocked with trimethylsiloxy groups;
- component (E) the following component was used: (e-1): 1-ethynyl-cyclohexan-1-ol
- component (B) Even when a dimethylsiloxane-methylvinylsiloxane copolymer with a vinyl group content of 0.3% by mass or less and both molecular chain terminals blocked with trimethylsiloxy groups was used as component (B), it was found that it was difficult to achieve a sufficiently light peeling when the component (A)/component (B) ratio was outside the range of 90/10 to 75/25 (Comparative Examples 14 and 17), and the residual adhesion rate was also found to decrease significantly (Comparative Examples 15, 16, 18, and 19).
- component (B) a dimethylsiloxane-methylvinylsiloxane copolymer with a vinyl group content of 0.3 mass% or less and both molecular chain ends blocked with dimethylvinyl groups was used as component (B) (Comparative Examples 9 and 10), the heavy peeling rate and residual adhesion rate were good, but the peel resistance became heavy. Furthermore, when a dimethylsiloxane-methylhexenylsiloxane copolymer with hexenyl groups only on the side chains of the molecular chain was used as component (A) (Comparative Example 13), the tendency to heavy peeling was strong and the residual adhesion rate was also low.
- the present invention (Examples 1 to 6) showed low peel resistance, low heavy peel rate when the release sheet after hardening was pressed, and no decrease in residual adhesion rate.
- the curable organopolysiloxane composition of the present invention is suitable as a composition for forming a peelable cured film, since it can form a cured film with stable release performance on adhesive substances without impairing their adhesive performance. That is, even when the composition is coated on a sheet-like substrate, such as polyethylene laminated paper, and the release sheet obtained by curing the composition is laminated and pressed, the release layer made of the composition has a small release difference from that of the unpressed composition, has stable release performance, and is capable of suppressing a decrease in the adhesiveness of the adhesive substance, so that a laminate having a release layer and an adhesive layer using the above composition, such as a peelable adhesive tape/sheet, can be provided.
- a sheet-like substrate such as polyethylene laminated paper
- the release sheet obtained by curing the composition is laminated and pressed
- the release layer made of the composition has a small release difference from that of the unpressed composition, has stable release performance, and is capable of suppressing a decrease in the adhesiveness of the adhesive
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Abstract
Le but de la présente invention est de fournir une composition d'organopolysiloxane durcissable qui peut former un film de revêtement durci ayant des propriétés de libération stables à partir d'une substance adhésive sans affecter les propriétés adhésives de la substance adhésive. La présente invention concerne une composition qui contient : (A) un organopolysiloxane linéaire qui a une viscosité à 25 °C de 20 à 1500 mPa·s et a un groupe alcényle supérieur ayant de 4 à 12 atomes de carbone au niveau d'une borne et dans une chaîne latérale d'une chaîne moléculaire ; (B) un organopolysiloxane linéaire qui a une viscosité à 25 °C de 3 000 à 50 000 mPa·s et a, dans une molécule, au moins deux groupes alcényle ayant de 2 à 12 atomes de carbone uniquement dans des chaînes latérales d'une chaîne moléculaire, la teneur en groupes vinyle (CH2=CH-) dans les groupes alcényle dans le composant (B) étant de 0,1 à 0,3 % en masse ; (C) un organohydrogénopolysiloxane ayant au moins deux atomes d'hydrogène liés à un atome de silicium par molécule ; et (D) un catalyseur de réaction d'hydrosilylation.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000160102A (ja) * | 1998-11-25 | 2000-06-13 | Dow Corning Toray Silicone Co Ltd | 剥離性硬化皮膜形成用シリコーン組成物 |
JP2010150537A (ja) * | 2008-11-26 | 2010-07-08 | Dow Corning Toray Co Ltd | 無溶剤型剥離性硬化皮膜形成性オルガノポリシロキサン組成物および剥離性硬化皮膜を有するシート状基材 |
WO2021132515A1 (fr) * | 2019-12-25 | 2021-07-01 | ダウ・東レ株式会社 | Composition durcissable d'organopolysiloxane, agent de revêtement antiadhésif le comprenant, et stratifié |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000160102A (ja) * | 1998-11-25 | 2000-06-13 | Dow Corning Toray Silicone Co Ltd | 剥離性硬化皮膜形成用シリコーン組成物 |
JP2010150537A (ja) * | 2008-11-26 | 2010-07-08 | Dow Corning Toray Co Ltd | 無溶剤型剥離性硬化皮膜形成性オルガノポリシロキサン組成物および剥離性硬化皮膜を有するシート状基材 |
WO2021132515A1 (fr) * | 2019-12-25 | 2021-07-01 | ダウ・東レ株式会社 | Composition durcissable d'organopolysiloxane, agent de revêtement antiadhésif le comprenant, et stratifié |
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