WO2024093058A1

WO2024093058A1 - Optical module

Info

Publication number: WO2024093058A1
Application number: PCT/CN2023/078211
Authority: WO
Inventors: 张晓磊; 李静思; 王扩
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2022-11-02
Filing date: 2023-02-24
Publication date: 2024-05-10

Abstract

An optical module (200), comprising a circuit board (206) and an optical transceiving component (207) electrically connected to the circuit board (206). The optical transceiving component (207) comprises an optical transmitting component (300), wherein the optical transmitting component (300) comprises a header (310), a laser assembly (400), and a flexible circuit board (370). The header (310) comprises: a header body (311) provided with the laser assembly (400) on the top; a high-frequency pin (312) embedded to the header body (311) and insulated from the header body (311), one end of the high-frequency pin protruding from the top surface of the header body (311) and being electrically connected to the laser assembly (400); and a first grounding pin (3131) and a second grounding pin (3132) which are provided on two sides of the high-frequency pin (312), a first boss (3133) being provided at the joint of the first grounding pin (3131) and the header body (311), and a second boss (3134) being provided at the joint of the second grounding pin (3132) and the header body (311). A high-frequency connection hole (371), a first grounding connection hole (372), and a second grounding connection hole (373) are formed in the flexible circuit board (370), the first boss (3133) is embedded in the first grounding connection hole (372), and the second boss (3134) is embedded in the second grounding connection hole (373).

Description

Optical Module

This application claims the priority of application number 202211367153.0 filed with the China Patent Office on November 2, 2022; the priority of application number 202211364257.6 filed with the China Patent Office on November 2, 2022; the priority of application number 202211363790.0 filed with the China Patent Office on November 2, 2022, the entire contents of which are incorporated by reference in this application.

Technical Field

The present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module.

Background technique

With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. In addition, with the development of optical communication technology, the transmission rate of optical modules is constantly increasing.

Summary of the invention

According to some embodiments of the present disclosure, an optical module is provided, comprising: a circuit board; an optical transceiver component, electrically connected to the circuit board, the optical transceiver component including an optical emitting component, and the optical emitting component is used to emit an optical signal. Wherein, the optical emitting component includes a tube seat, a laser component and a flexible circuit board, and the tube seat includes: a tube seat body, a laser component is arranged on the top, and a first boss and a second boss are arranged on the bottom; a high-frequency pin is embedded in the tube seat body, insulated from the tube seat body, and one end protrudes from the top surface of the tube seat body and is electrically connected to the laser component; a first grounding pin, one end of which is connected to the first boss and is arranged on one side of the high-frequency pin; a second grounding pin, one end of which is connected to the second boss and is arranged on the other side of the high-frequency pin; a high-frequency connection hole, a first grounding connection hole and a second grounding connection hole are arranged on the flexible circuit board, the other end of the high-frequency pin is connected to the high-frequency connection hole, the other end of the first grounding pin is connected to the first grounding connection hole, the other end of the second grounding pin is connected to the second grounding connection hole, and the first boss is embedded in the first grounding connection hole, and the second boss is embedded in the second grounding connection hole.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

FIG1 is a connection diagram of an optical communication system provided according to some embodiments of the present disclosure;

FIG2 is a structural diagram of an optical network terminal provided according to some embodiments of the present disclosure;

FIG3 is a schematic diagram of the structure of an optical module provided according to some embodiments of the present disclosure;

FIG4 is an exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure;

FIG5 is a structural diagram of an optical emission component according to some embodiments of the present disclosure;

FIG6 is a schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

FIG7 is a second schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

FIG8 is an exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure;

FIG9 is a schematic structural diagram of a laser assembly provided according to some embodiments of the present disclosure;

FIG10 is an exploded schematic diagram of a laser assembly provided according to some embodiments of the present disclosure;

FIG11 is a schematic structural diagram of a substrate provided according to some embodiments of the present disclosure;

FIG12 is an exploded schematic diagram of a substrate provided according to some embodiments of the present disclosure;

FIG13 is an electrical connection diagram of a laser assembly according to some embodiments of the present disclosure;

FIG14 is a schematic diagram of a return loss curve provided according to some embodiments of the present disclosure;

FIG15 is a schematic diagram of an insertion loss curve provided according to some embodiments of the present disclosure;

FIG16 is a first structural diagram of a tube socket provided according to some embodiments of the present disclosure;

FIG17 is a second structural schematic diagram of a tube socket provided according to some embodiments of the present disclosure;

FIG18 is a cross-sectional view 1 of a tube socket provided according to some embodiments of the present disclosure;

FIG19 is an exploded schematic diagram of an adapter plate and a tube socket body provided according to some embodiments of the present disclosure;

FIG20 is a second cross-sectional view of a tube socket provided according to some embodiments of the present disclosure;

FIG21 is a schematic diagram of the structure of a flexible circuit board provided according to some embodiments of the present disclosure;

FIG22 is a schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure;

FIG23 is a second schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure;

FIG24 is a third schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure;

FIG25 is a fourth schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure;

FIG26 is a first structural diagram of an adapter plate provided according to some embodiments of the present disclosure;

FIG27 is a second structural schematic diagram of an adapter plate provided according to some embodiments of the present disclosure;

FIG28 is a third structural schematic diagram of an adapter plate provided according to some embodiments of the present disclosure;

FIG29 is a front view of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

FIG. 30 is a three-dimensional diagram of the partial structure of a light emitting component provided according to some embodiments of the present disclosure.

Detailed ways

The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct or indirect physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct or indirect physical or electrical contact with each other. However, the term "coupled" or "communicatively coupled" may also mean that two or more components are not in direct contact with each other. But still cooperate or interact with each other. The embodiments disclosed here are not necessarily limited to the contents of this article.

“At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

“A and/or B” includes the following three combinations: A only, B only, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "substantially," or "approximately" includes the stated value and an average that is within an acceptable range of variation from that value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

In an optical communication system, light signals are used to carry information to be transmitted, and the light signals carrying information are transmitted to information processing equipment such as computers through information transmission media such as optical fibers or optical waveguides to complete the transmission of information. Since light has passive transmission characteristics when transmitted through optical fibers or optical waveguides, long distances can be achieved. In addition, the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion between electrical signals and optical signals.

Optical modules realize the above-mentioned mutual conversion function between optical signals and electrical signals in the field of optical communication technology. Optical modules include optical ports and electrical ports. Optical modules realize optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical ports, and realize electrical connection with optical network terminals (for example, optical modems) through the electrical ports. The electrical connection is mainly used for power supply, I2C signal transmission, data information transmission, and grounding. The optical network terminal transmits electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).

FIG1 is a connection diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in FIG1 , the optical communication system mainly includes a remote server 1000 , a local information processing device 2000 , an optical network terminal 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: a router, a switch, a computer, a tablet computer, a television, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to be connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be connected to the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 realizes the mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. Exemplarily, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101. Since the optical module 200 is a tool for realizing the mutual conversion between optical signals and electrical signals.

The optical network terminal 100 includes a housing that is roughly rectangular, and an optical module interface 102 and a network cable interface 104 that are arranged on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 establish a bidirectional electrical signal connection. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. Exemplarily, the optical network terminal 100 receives the signals from the optical module 200. The electrical signal is transmitted to the network cable 103, and the electrical signal from the network cable 103 is transmitted to the optical module 200. Therefore, the optical network terminal 100, as the host computer of the optical module 200, can monitor the operation of the optical module 200. In addition to the optical network terminal 100, the host computer of the optical module 200 can also include an optical line terminal (Optical Line Terminal, OLT) and the like.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .

FIG2 is a structural diagram of an optical network terminal provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100, FIG2 only shows the structure related to the optical network terminal 100 and the optical module 200. As shown in FIG2, the optical network terminal 100 includes a circuit board 105 disposed in a housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins that increase the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

Fig. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Fig. 4 is an exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure. As shown in Fig. 3 and Fig. 4, the optical module 200 includes a shell, a circuit board 206 and an optical transceiver component 207 disposed in the shell.

Exemplarily, the shell may include an upper shell 201 and a lower shell 202 , wherein the upper shell 201 covers the lower shell 202 to form the above-mentioned shell with two openings; the outer contour of the shell generally presents a square body.

In some embodiments of the present disclosure, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

The upper housing 201 and the lower housing 202 are combined to facilitate installation of components such as the circuit board 206 and the optical transceiver component 207 into the housing, and these components are packaged and protected by the upper housing 201 and the lower housing 202. In addition, when assembling components such as the circuit board 206 and the optical transceiver component 207, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.

In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation.

The direction of the connection line of the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger of the circuit board 206 extends from the electrical port and is inserted into the upper computer (for example, the optical network terminal 100); the opening 205 is an optical port, which is configured to access the external optical fiber 101 so that the external optical fiber 101 is connected to the optical transceiver component 207 inside the optical module 200.

In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing, and the unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Exemplarily, the unlocking component 203 is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a snap-fit component that matches the cage of the host computer (for example, the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the host computer, the snap-fit component of the unlocking component fixes the optical module 200 in the cage of the host computer; When the unlocking component 203 is unlocked, the engaging component of the unlocking component 203 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the engaging relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage of the host computer.

The circuit board 206 includes circuit traces, electronic components and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. Electronic components include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET). Chips include microcontroller units (MCU), laser driver chips, limiting amplifiers (LA), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

The circuit board 206 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; when the optical transceiver component is located on the circuit board, the rigid circuit board can also provide stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

The circuit board 206 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 206 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 206 (such as the upper surface shown in FIG. 4), or can be set on the upper and lower surfaces of the circuit board 206 to adapt to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards. For example, a flexible circuit board can be used to connect a rigid circuit board to an optical transceiver component.

FIG. 4 shows an optical module structure of a coaxial package (TO-CAN, referred to as TO). Among them, the optical transceiver component 207 includes an optical emitting component (also referred to as an optical emitting assembly) 300 and an optical receiving component (also referred to as an optical receiving assembly), and both the optical emitting component 300 and the optical receiving component adopt a TO structure; the optical emitting component 300 is configured to realize the emission of optical signals, and the optical receiving component is configured to realize the reception of optical signals. Exemplarily, the optical emitting component 300 and the optical receiving component are combined together to form an integrated optical transceiver component. Of course, in the embodiment of the present application, the optical emitting component 300 and the optical receiving component can also be separated, that is, the optical emitting component 300 and the optical receiving component do not share a housing. Of course, in some embodiments, the optical receiving component can adopt other packaging structures such as chip on board (COB) packaging and micro-optical packaging.

In some optical modules, the TO-packaged optical emitting component is electrically connected to the circuit board inside the optical module through a flexible circuit board. Since the high-speed signal line inside the TO-packaged optical emitting component is connected to the high-speed signal line on the flexible circuit board through the pins on the socket, the high signal transmission at the connection between the TO-packaged optical emitting component and the flexible circuit board will cause impedance mismatch, and when the return path is improperly handled, it will also cause a resonance effect, which will further degrade the quality of the high-speed signal of the semiconductor laser chip, resulting in a reduction in the bandwidth of the semiconductor laser chip. Therefore, in some embodiments of the present disclosure, the TO-packaged optical emitting component can ensure the high-frequency performance of the TO-packaged optical emitting component.

FIG5 is a structural diagram of an optical emitting component provided according to some embodiments of the present disclosure. As shown in FIG5, in some embodiments, the optical emitting component 300 includes a tube seat 310 and a tube cap 320, and the tube cap 320 is connected to the tube seat 310 and forms a relatively sealed space with the tube seat 310, and the device for generating and transmitting optical signals, such as a laser component, a lens, a semiconductor cooler (TEC), etc., is arranged in the space.

The tube socket 310 includes a tube socket body 311 and a plurality of tube pins. The top of the tube socket body 311 is connected to the tube cap 320 . The plurality of tube pins are respectively connected to the tube socket body 311 . An insulating layer is provided between some of the tube pins and the tube socket body 311 to insulate the pins from the tube socket body 311 .

Among them, one end of some pins extends into the space formed by the tube seat 310 and the tube cap 320, and the part of the pins includes but is not limited to a high-frequency pin configured to transmit a high-frequency signal, a grounding pin configured to be grounded, and a first pin and a second pin configured to supply power to the TEC, etc. The pins are used to facilitate the electrical connection between the light emitting component 300 and the circuit board 206.

Exemplarily, the pin is connected to one end of the flexible circuit board, and the other end of the flexible circuit board is electrically connected to the circuit board 206. In this way, the light emitting component 300 is electrically connected to the circuit board 206 through the flexible circuit board, and then other electrical devices in the light emitting component 300 are electrically connected to the circuit board 206. Of course, in the embodiment of the present application, the light emitting component 300 includes but is not limited to being electrically connected to the circuit board 206 through the flexible circuit board.

In some examples, a light window may be generally disposed on the tube cap 320 , and the light window is configured to transmit light generated in the light emitting component 300 .

FIG6 is a schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure, FIG7 is a schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure, and FIG8 is a schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure. FIG6-FIG8 show the structure of a light emitting component 300 after the cap 320 is removed. As shown in FIG6-FIG8, in some embodiments, the light emitting component 300 may include a laser assembly 400, and the laser assembly 400 is configured to emit an optical signal. Of course, in some embodiments, the use form of the light emitting component 300 is not limited to the structure shown in FIG6, that is, the internal structure of the light emitting component 300 can also be in other forms.

In some embodiments, a TEC330 is disposed on the top of the tube base body 311, and the laser assembly 400 is disposed on the TEC330. The laser assembly 400 generally includes a substrate and an electrical device packaged and disposed on the substrate. The substrate can be used to facilitate the laser assembly 400 to be disposed on the TEC330. A support seat 340 is disposed on the top of the TEC330. The bottom surface of the support seat 340 is connected to the TEC330, and the first side surface of the support seat 340 is used to dispose the laser assembly 400, so as to facilitate the disposition of the laser assembly 400 on the TEC330 and enable the light emitted by the laser assembly 400 to pass through the light window of the tube cap 320. In some embodiments, the support seat 340 is made of a good thermal conductor material, such as copper, ceramic, etc., so that the TEC330 can adjust the temperature of the laser assembly 400 through the support seat 340.

In some embodiments, an adapter board 350 is further disposed on the top of the tube socket body 311, and a metal layer is disposed on the adapter board 350 to form circuit traces on the surface of the adapter board 350, and the circuit is transferred from the pins on the tube socket 310 or the tube socket body 311 to the laser assembly 400.

In some embodiments, in order to ensure that the laser chip 420 can work properly, the laser assembly 400 is arranged above the TEC 330, thereby raising the height of the laser assembly 400 on the tube seat 310, and the adapter plate 350 is used to realize the electrical connection between the tube seat 310 pin and the laser assembly 400. In some embodiments, the adapter plate 350 is a ceramic substrate with a circuit pattern formed on the surface, such as an AlN ceramic substrate, but is not limited to a ceramic substrate. Exemplarily, the laser assembly 400 is wired to the adapter plate 350.

In some embodiments, a column 318 is set on the top surface of the tube seat body 311, and the side support of the column 318 is connected to the adapter plate 350 to facilitate the fixation of the adapter plate 350 on the tube seat body 311 and ensure the fixation firmness of the adapter plate 350 on the tube seat body 311.

FIG. 9 is a schematic diagram of the structure of a laser assembly provided according to some embodiments of the present disclosure, and FIG. 10 is a schematic diagram of the decomposition of a laser assembly provided according to some embodiments of the present disclosure. As shown in FIG. 9 and FIG. 10, the laser assembly 400 may include a substrate 410 and a laser chip 420 disposed on the substrate 410. The substrate 410 includes a non-metallized area and a metallized area, and the metallized area is configured to carry or connect electrical devices such as chips. The metallized area is configured to carry and set the laser chip 420 to facilitate power supply to the laser chip 420 and input of high-frequency signals; at the same time, it is convenient to achieve impedance matching on the high-frequency signal line of the laser chip 420. In some embodiments, the laser chip 420 is an electro-absorption modulated laser (EML), including an electro-absorption modulator (EAM) and a distributed feedback laser diode (DFB), and the top of the laser chip 420 includes an EAM positive electrode and a DFB positive electrode.

In some embodiments, the laser assembly 400 may further include a capacitor 430, a matching resistor 440, and a thermistor 450, which are arranged on the substrate 410. The capacitor 430 is connected in parallel with the DFB in the laser chip 420 for filtering in the DFB power supply circuit; the matching resistor 440 is connected in parallel with the EAM in the laser chip 420 for EAM terminal matching; and the thermistor 450 is used for temperature collection of the laser assembly 400.

FIG. 11 is a schematic diagram of the structure of a substrate provided according to some embodiments of the present disclosure, and FIG. 12 is a schematic diagram of the decomposition of a substrate provided according to some embodiments of the present disclosure. As shown in FIG. 11 and FIG. 12, in some embodiments, a substrate 410 includes a substrate body 411 and a first metal layer 412, a second metal layer 413, and a second metal layer 414 disposed on the top surface of the substrate body 411. The metal layer 413 , the third metal layer 414 , the fourth metal layer 415 , the fifth metal layer 416 and the sixth metal layer 417 .

The first metal layer 412, the second metal layer 413, and the third metal layer 414 are arranged in parallel on the top surface of the substrate body 411, and the second metal layer 413 is located between the first metal layer 412 and the third metal layer 414, and is insulated from the first metal layer 412 and the third metal layer 414; the first metal layer 412, the second metal layer 413, and the third metal layer 414 are located on one side of the fourth metal layer 415, and the sixth metal layer 417 is located on the other side of the fourth metal layer 415, and the first metal layer 412, the third metal layer 414, and the sixth metal layer 417 are connected to the fourth metal layer 415; the fifth metal layer 416 is located below the fourth metal layer 415, and the fifth metal layer 416 is insulated from the fourth metal layer 415.

FIG13 is an electrical connection diagram of a laser assembly provided according to some embodiments of the present disclosure. As shown in FIG13, in some embodiments, the laser chip 420 is mounted on the fourth metal layer 415, that is, the cathode of the laser chip 420 is electrically connected to the fourth metal layer 415, the EAM anode of the laser chip 420 is wired to one end of the second metal layer 413, and the DFB anode of the laser chip 420 is wired to the fifth metal layer 416; the capacitor 430 and the thermistor 450 are mounted on the sixth metal layer 417, that is, the first end of the capacitor 430 and the first end of the thermistor 450 are electrically connected to the sixth metal layer 417, respectively, and the second end of the capacitor 430 is wired to the fifth metal layer 416.

In some embodiments, a first pad 418 and a second pad 419 are further provided on the top surface of the substrate body 411. As shown in FIG. 13 , the first pad 418 and the second pad 419 are provided above the connection area between the fourth metal layer 415 and the sixth metal layer 417. The first pad 418 and the second pad 419 are insulated from each other, and the first pad 418 and the second pad 419 are insulated from the fourth metal layer 415 and the sixth metal layer 417, respectively. The first end of the matching resistor 440 is electrically connected to the first pad 418, and the second end of the matching resistor 440 is electrically connected to the second pad 419. The first pad 418 is wired to connect the positive electrode of the EAM of the laser chip 420, and the second pad 419 is wired to connect the connection area between the fourth metal layer 415 and the sixth metal layer 417. The matching resistor 440, the first pad 418, the second pad 419 and the wires are used to form a matching circuit of the laser chip 420, so as to adjust the matching circuit based on the actual performance parameters of the laser chip 420.

By way of example, the second pad 419 may be connected to the fourth metal layer 415 or the sixth metal layer 417 via a gold wire 441 .

In some embodiments, as shown in FIGS. 9-13 , the fourth metal layer 415 is disposed near the center of the top surface of the substrate body 411, and the second metal layer 413 extends obliquely from the side of the substrate body 411 toward the fourth metal layer 415, so as to facilitate the adjustment of the length of the second metal layer 413 and control the height of the other end of the second metal layer 413 above the substrate body 411, so as to facilitate the wire bonding connection between the other end of the second metal layer 413 and the adapter board 350. Of course, in some embodiments, the inclination angle of the second metal layer 413 is not limited to that shown in FIGS. 9-13 , and can be specifically selected according to the wire bonding position with the adapter board 350 and the setting position of the fourth metal layer 415.

In some embodiments, as shown in FIGS. 9 to 13 , one end of the fifth metal layer 416 is close to the sixth metal layer 417, and the other end is close to the connection between the third metal layer 414 and the fourth metal layer 415. Combined with the space on the substrate body 411, the fifth metal layer 416 is a special-shaped structure, with a relatively small width at one end close to the sixth metal layer 417 and a relatively large width at the other end close to the connection between the third metal layer 414 and the fourth metal layer 415, so that the fifth metal layer 416 can be connected to the second end of the capacitor 430 by wire bonding, and the area of the other end of the fifth metal layer 416 can be controlled so that the fifth metal layer 416 can be as close to the DFB positive electrode of the laser chip 420 as possible, and the aging test of the laser chip 420 can be easily realized.

Of course, in other embodiments, the layout shape of the fifth metal layer 416 is not limited to the shapes shown in Figures 9-11, and can also be adaptively deformed in combination with the shapes of the third metal layer 414 and the fourth metal layer 415, such as increasing the width of one end of the fifth metal layer and reducing the width of another end of the fifth metal layer.

In some embodiments, as shown in FIG. 13 , the second pad 419 is connected to the connection between the fourth metal layer 415 and the sixth metal layer 417 by three gold wires 441 , and the three gold wires 441 are configured to achieve inductance modulation at the output end of the laser chip 420 , that is, the three gold wires 441 are used to be equivalent to inductance.

In some embodiments, the inductance at the output end of the laser chip 420 can be adjusted by adjusting the number and length of the gold wires 441 and the shape of the connected metal layer, and then the inductance matching the actual laser chip 420 can be obtained by simulating the number and length of the gold wires 441 and the shape of the connected metal layer.

FIG. 14 is a schematic diagram of a return loss (S11) curve according to some embodiments of the present disclosure, and FIG. 15 is a schematic diagram of a differential loss (S21) curve according to some embodiments of the present disclosure. In some embodiments, the inductance modulation at the output end of the laser chip 420 can ensure that the trend of the insertion loss curve is first increased and then decreased on the basis of ensuring the return loss performance. The downward trend is about 0.8 to 2 dB higher than the starting point, and the 3 dB bandwidth meets the specification requirements, so as to improve the performance of the laser chip 420.

In some embodiments, the second pad 419 is connected to the fourth metal layer 415 by one, two, three, etc. gold wires 441 . The length and number of the gold wires 441 will affect the inductance of the output end of the laser chip 420 , thereby affecting the bandwidth of the laser chip 420 .

As shown in FIG. 14 and FIG. 15 , according to the emission below -10 dB in FIG. 14 and the amount reached by the 3 dB bandwidth in FIG. 15 , it can be seen that the performance of the laser chip 420 using three gold wires is slightly better than that using one gold wire, but the difference is not large. However, both are much better than using a gold wire with twice the length. When three gold wires are used, if one of them falls off or the line length control accuracy is not high, the overall inductance has little effect, so using three gold wires has high reliability. The length of the gold wire 441 can be found to be suitable through experimental design (Design of Experiment, DOE).

FIG16 is a schematic diagram of a structure of a tube socket provided according to some embodiments of the present disclosure, and FIG17 is a schematic diagram of a structure of a tube socket provided according to some embodiments of the present disclosure. As shown in FIG16 and FIG17, the pins on the tube socket 310 include a high-frequency pin 312, a ground pin 313, a first pin 314, a second pin 315, a third pin 316, and a fourth pin 317, etc. The high-frequency pin 312, the first pin 314, the second pin 315, the third pin 316, and the fourth pin 317 are connected to the tube socket body 311 and insulated from the tube socket body 311, and the ends of the high-frequency pin 312, the first pin 314, the second pin 315, the third pin 316, and the fourth pin 317 protrude from the top surface of the tube socket body 311.

Exemplarily, through holes for embedding high-frequency pin 312, first pin 314, second pin 315, third pin 316 and fourth pin 317 are provided on the tube socket body 311, and insulating material, such as insulating glass glue, black glass, etc., is provided in the through holes, so that the high-frequency pin 312, first pin 314, second pin 315, third pin 316 and fourth pin 317 are embedded and fixed in the corresponding through holes on the tube socket body 311, and an insulating layer is formed between the tube socket body 311.

Exemplarily, the high frequency pin 312, the first pin 314, etc. are fixed in corresponding through holes on the socket body 311 by black glass bonding. In some embodiments, the socket 310 is provided with a plurality of ground pins 313, and two or more ground pins 313 are close to the high frequency pin 312.

At present, in some embodiments, there is usually only one ground pin in the TO packaged device. In specific use, in order to ensure sufficient grounding area, the flexible circuit board is connected by tinning soldering. However, tinning soldering requires long-term high-temperature soldering of the flexible board, and it is easy to cause optical path deviation and optical power drop, which puts high requirements on the design of the flexible circuit board. Therefore, in the embodiment of the present application, by providing multiple grounding pins 313 to enhance the grounding of the socket 310, the difficulty of designing the flexible circuit board can be reduced to a certain extent.

In some embodiments, the ground pin 313 includes a first ground pin 3131 and a second ground pin 3132, and the first ground pin 3131 and the second ground pin 3132 are located on both sides of the high-frequency pin 312, so as to realize the layout of multiple ground pins on the socket 310, enhance the grounding of the socket 310 to ensure the high-frequency performance of the laser chip 420. Exemplarily, the first ground pin 3131 and the second ground pin 3132 are axially symmetrically arranged on both sides of the high-frequency pin 312. Of course, in some examples, the first ground pin 3131 and the second ground pin 3132 can also be asymmetrically arranged on both sides of the high-frequency pin 312.

In some embodiments, the first ground pin 3131 and the second ground pin 3132 are arranged on both sides of the high-frequency pin 312 to form a GSG pin design, and then when the high-frequency pin 312 is used to transmit a high-frequency signal, a GSG transmission line form is formed; and the first ground pin 3131 and the second ground pin 3132 are arranged to connect to a reference ground, such as connecting to a ground on a flexible printed circuit board, so as to achieve sufficient grounding to ensure the grounding performance of the tube holder 310, and then ensure the high-frequency performance of the laser chip 420.

FIG18 is a cross-sectional view of a tube socket provided according to some embodiments of the present disclosure. As shown in FIG18, in some embodiments, a first boss 3133 is provided at the connection between the first grounding pin 3131 and the bottom surface of the tube socket body 311, and a second boss 3134 is provided at the connection between the second grounding pin 3132 and the bottom surface of the tube socket body 311. Exemplarily, the first boss 3133 and the second boss 3134 are provided at the bottom of the socket body 311, one end of the first grounding pin 3131 is connected to the first boss 3133, and the second grounding pin 3132 is connected to the second boss 3134.

The first boss 3133 and the second boss 3134 are configured to connect the flexible circuit board to ensure the contact area between the first ground pin 3131 and the second ground pin 3132 and the flexible circuit board, so that the first ground pin 3131 and the second ground pin 3132 are fully grounded, thereby ensuring the impedance continuity when the light emitting component 300 is welded to the flexible circuit board. Exemplarily, the first boss 3133 and the second boss 3134 are circular bosses, respectively, but in some embodiments, they are not limited to circular bosses.

In some embodiments, when the light emitting component 300 and the flexible circuit board are welded and connected, the first boss 3133 and the second boss 3134 are respectively penetrated on the flexible circuit board to fully connect with the ground on the flexible circuit board, thereby minimizing the influence of the impedance discontinuity when the light emitting component 300 is welded and connected to the flexible circuit board on the high-frequency performance of the light emitting component 300.

In some embodiments, the tube base body 311 is provided with a first through hole 3111 and a plurality of second through holes 3112; the high-frequency pin 312 is embedded and fixed in the first through hole 3111, an insulating material is disposed in the first through hole 3111, and the high-frequency pin 312 is insulated from the tube base body 311 by the insulating material; the first pin 314, the second pin 315, the third pin 316 and the fourth pin 317 are respectively embedded and fixed in the corresponding second through hole 3112, an insulating material is disposed in the second through hole 3112, and the first pin 314, the second pin 315, the third pin 316 and the fourth pin 317 are respectively insulated from the tube base body 311 by the insulating material. In some embodiments, in order to facilitate adjusting the thickness of the high-frequency pin 312 to meet the impedance matching requirements of the laser assembly 400, the inner diameter of the first through hole 3111 should be relatively large. Exemplarily, the inner diameter of the first through hole 3111 is larger than the inner diameter of the second through hole 3112.

In some embodiments, the laser chip 420 is a high-speed laser, and the characteristic impedance of the high-frequency signal path of the laser chip 420 will directly affect the high-frequency performance of the laser chip 420. The diameter and length of the high-frequency pin 312 and the thickness of the material used to fix the high-frequency pin 312, such as black glass in the first through hole 3111, affect the characteristic impedance of the high-frequency signal path of the laser chip 420. Therefore, by making the inner diameter of the first through hole 3111 larger than the inner diameter of the second through hole 3112, the characteristic impedance of the high-frequency signal path of the laser chip 420 can be adjusted and controlled.

Characteristic impedance of the high frequency signal path of the laser chip 420 Wherein, L represents inductance and C represents capacitance. Inductance is related to the diameter and length of the high-frequency pin 312; the smaller the diameter and the longer the length of the high-frequency pin 312, the greater the inductance; the larger the diameter and the shorter the length of the high-frequency pin 312, the smaller the inductance.

The capacitance is related to the thickness d (the thickness from the surface of the high-frequency pin 312 to the inner wall of the first through hole 3111) of the material used to fix the high-frequency pin 312, such as black glass, the dielectric constant ε, and the contact area A with the high-frequency pin 312. Exemplarily, capacitance C=(εA)/d. When black glass is used to fix the high-frequency pin 312, the dielectric constant ε is relatively fixed. Therefore, what affects capacitance C are the contact area A between the black glass and the high-frequency pin 312 and the thickness of the black glass in the first through hole 3111.

In this way, when the diameter of the high-frequency pin 312 is larger and the inner diameter of the first through hole 3111 is smaller, the characteristic impedance on the high-frequency signal path of the laser chip 420 is smaller, that is, the diameter of the high-frequency pin 312 and the inner diameter of the first through hole 3111 directly affect the characteristic impedance on the high-frequency signal path of the laser chip 420.

Furthermore, in some embodiments, by setting the inner diameter of the first through hole 3111 to be relatively larger, such as the inner diameter of the first through hole 3111 being larger than the inner diameter of the second through hole 3112 , it is convenient to adjust and control the contact area A between the black glass and the high-frequency pin 312 and the thickness of the black glass in the first through hole 3111 .

FIG19 is an exploded schematic diagram of an adapter plate and a socket body provided according to some embodiments of the present disclosure, and FIG20 is a second cross-sectional view of a socket provided according to some embodiments of the present disclosure. As shown in FIG19 and FIG20, in some embodiments, a column 318 is provided on the top surface of the socket body 311, the column 318 is electrically connected to the socket body 311, and the side support of the column 318 is connected to the back of the adapter plate 350. The adapter plate 350 is used to electrically connect the laser chip 420 and the high-frequency pin 312, realize the transition connection from the laser chip 420 to the high-frequency pin 312, and adjust the impedance from the laser chip 420 to the high-frequency pin 312.

In some embodiments, the projection of the column 318 on the bottom surface of the tube base body 311 overlaps with the connection between the second ground pin 3132 and the tube base body 311. Exemplarily, the projection of the column 318 on the bottom surface of the tube base body 311 partially covers the second boss 3134, so that the cross-sectional area of the column 318 is greater than or equal to the cross-sectional area of the second boss 3134. The area is small enough to ensure the continuity of impedance matching. The column 318 is used to support and electrically connect the ground of the adapter board 350. In some embodiments, the column 318 and the tube base body 311 are integrally formed, and the first ground pin 3131, the second ground pin 3132 and the tube base body 311 are integrally formed.

In some embodiments, the adapter plate 350 includes an adapter plate body 351 and a metal layer disposed on the surface of the adapter plate body 351 and forming a certain pattern. The metal layer disposed on the surface of the adapter plate body 351 includes a high-frequency metal layer 352, and the high-frequency metal layer 352 is disposed on the front of the adapter plate body 351, away from the column 318. The front of the adapter plate 350 is close to the end of the high-frequency pin 312 protruding from the top surface of the socket body 311, and the high-frequency metal layer 352 is welded to the high-frequency pin 312.

Exemplarily, the lower end of the high-frequency metal layer 352 is welded to the side of the top of the high-frequency pin 312. Gold-tin solder can be used for welding, such as a weight ratio of gold to tin of 7:3. Of course, in some embodiments, it is not limited to the use of gold-tin solder, and other solders can also be used. When the high-frequency metal layer 352 and the high-frequency pin 312 are connected by welding, the volume of the solder at the welding connection can be controlled according to the impedance matching requirements. Compared with the conventional use of wire bonding to connect the high-frequency metal layer 352 and the high-frequency pin 312, the use of solder welding to connect the high-frequency metal layer 352 and the high-frequency pin 312 is more convenient to achieve impedance matching.

As shown in Figures 18 to 20, the heights of the high-frequency pin 312, the first pin 314, the second pin 315, the third pin 316 and the fourth pin 317 protruding from the top surface of the socket body 311 can be different. The heights of the high-frequency pin 312, the first pin 314, the second pin 315, the third pin 316 and the fourth pin 317 protruding from the top surface of the socket body 311 can be selected and set according to the positions of the corresponding connected devices.

FIG21 is a schematic diagram of the structure of a flexible circuit board provided according to some embodiments of the present disclosure. As shown in FIG21 , the light emitting component 300 provided in the embodiment of the present application further includes a flexible circuit board 370, and the flexible circuit board 370 is provided with a circuit pattern for electrically connecting each pin on the tube holder 310 with the circuit board 206, so as to realize the electrical connection between each pin on the tube holder 310 and the circuit board 206 through the flexible circuit board 370.

As shown in FIG21 , a plurality of connection holes are provided at one end of the flexible circuit board 370, each of which is plated with a metal layer, and each of which is configured to be embedded with a pin connected to a corresponding tube holder 310. Exemplarily, the flexible circuit board 370 is provided with a high-frequency connection hole 371, a first ground connection hole 372, a second ground connection hole 373, a first connection hole 374, a second connection hole 375, a third connection hole 376, and a fourth connection hole 377; the high-frequency connection hole 371 is located between the first ground connection hole 372 and the second ground connection hole 373.

In some embodiments, the high-frequency connection hole 371, the first ground connection hole 372, the second ground connection hole 373, the first connection hole 374, the second connection hole 375, the third connection hole 376 and the fourth connection hole 377 can all be circular through holes, but are not limited to circular through holes. In some embodiments, as shown in FIG. 21, the first ground connection hole 372 and the second ground connection hole 373 are elliptical holes. In some embodiments, in order to ensure the contact area between the first boss 3133 and the second boss 3134 and the flexible circuit board 370, the size of the first ground connection hole 372 and the second ground connection hole 373 is larger than the size of the high-frequency connection hole 371.

Figure 22 is a schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure. Figure 23 is a schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure. Figure 24 is a schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure. Figures 22 to 24 show the assembly process and assembly form of the tube holder 310 and the flexible circuit board 370.

As shown in FIGS. 22 to 24 , the pins on the socket 310 are correspondingly inserted into the connection holes on the flexible circuit board 370; for example, the high-frequency pin 312 is inserted into the high-frequency connection hole 371, the first ground pin 3131 is inserted into the first ground connection hole 372, the second ground pin 3132 is inserted into the second ground connection hole 373, etc., so that the pins on the socket 310 are positioned and matched with the flexible circuit board 370. The socket 310 and the flexible circuit board 370 are assembled in place, so that the flexible circuit board 370 is close to the bottom of the socket body 311, and each connection hole is connected to the root of the corresponding pin connected to the socket body 311, and is connected by welding.

FIG25 is a fourth schematic diagram of an assembly of a light emitting component and a flexible circuit board according to some embodiments of the present disclosure. As shown in FIG25 , when the tube holder 310 and the flexible circuit board 370 are assembled in place and the flexible circuit board 370 is close to the bottom of the tube holder 310 , the first boss 3133 is located in the first ground connection hole 372 , and the second boss 3134 is located in the second ground connection hole 373 .

In some embodiments, the top surface of the first boss 3133 protrudes from the first ground connection hole 372, and the top surface of the second boss 3134 protrudes from the second ground connection hole 373. For example, the thickness of the first boss 3133 and the second boss 3134 is The first boss 3133 is inserted into the first grounding hole 372, and the second boss 3134 is inserted into the second grounding hole 373. In this way, the first grounding pin 3131 and the second grounding pin 3132 are conveniently connected to the ground on the flexible circuit board 370.

In some embodiments, the ground on the flexible circuit board 370 is set on a side of the flexible circuit board 370 away from the bottom of the tube seat body 311, and the first boss 3133, the second boss 3134 and the flexible circuit board 370 are welded and connected, so that the first grounding pin 3131 and the second grounding pin 3132 can be fully grounded, and the impedance continuity of the grounding pin 313 can be achieved when welding.

FIG26 is a schematic diagram of the structure of a transfer board provided according to some embodiments of the present disclosure, FIG27 is a schematic diagram of the structure of a transfer board provided according to some embodiments of the present disclosure, and FIG28 is a schematic diagram of the structure of a transfer board provided according to some embodiments of the present disclosure. FIG26-FIG28 shows the structural form of each part on a transfer board. As shown in FIG26-FIG28, in some embodiments, the transfer board 350 includes a transfer board body 351, a high-frequency metal layer 352, a first grounding metal layer 353, and a second grounding metal layer 354 are arranged on the front of the transfer board body 351, a third grounding metal layer 355 is arranged on the first side of the transfer board body 351, a fourth grounding metal layer 356 is arranged on the second side of the transfer board body 351, and a fifth grounding metal layer 357 is arranged on the back of the transfer board body 351. Exemplarily, the high-frequency metal layer 352, the first grounding metal layer 353, the second grounding metal layer 354, the third grounding metal layer 355, the fourth grounding metal layer 356, and the fifth grounding metal layer 357 are formed by gold plating on the transfer board body 351.

The high-frequency metal layer 352 extends from the bottom of the adapter board body 351 to the side position near the top, so as to realize electrical connection between devices located at different heights through the high-frequency metal layer 352; the high-frequency metal layer 352 is bent in shape to facilitate the high-frequency metal layer 352 to realize electrical connection with other structures or components.

Exemplarily, the high-frequency metal layer 352 includes a first connection part 3521, a second connection part 3522 and a third connection part 3523 for smoothly connecting the first connection part 3521 and the second connection part 3522; the first connection part 3521 is located on the side close to the top of the adapter plate body 351, and the end of the first connection part 3521 is close to the first side surface of the adapter plate body 351, and is used to electrically connect the laser chip 420; the second connection part 3522 is located at the bottom of the adapter plate body 351, and is used to electrically connect the high-frequency pin 312; the third connection part 3523 is used for the extension of the first connection part 3521 and the second connection part 3522.

In some embodiments, the width of the second connection portion 3522 is greater than the width of the first connection portion 3521 , so as to facilitate the welding connection between the high-frequency metal layer 352 and the high-frequency pin 312 and ensure the continuity of impedance matching.

A first grounding metal layer 353 is set on one side of the high-frequency metal layer 352, and a second grounding metal layer 354 is set on the other side of the high-frequency metal layer 352, that is, the high-frequency metal layer 352 is located between the first grounding metal layer 353 and the second grounding metal layer 354, and the high-frequency metal layer 352 and the first grounding metal layer 353, and the high-frequency metal layer 352 and the second grounding metal layer 354 are respectively insulated.

The first grounding metal layer 353 is electrically connected to the third grounding metal layer 355, and is electrically connected to the fifth grounding metal layer 357 through the third grounding metal layer 355; one side of the second grounding metal layer 354 is electrically connected to the third grounding metal layer 355, and the other side of the second grounding metal layer 354 is electrically connected to the fourth grounding metal layer 356, and is electrically connected to the fifth grounding metal layer 357 through the fourth grounding metal layer 356, so that the reference ground on the adapter board 350 is the same reference ground. The back of the adapter board 350 is used to connect the pillar 318, and the fifth grounding metal layer 357 is electrically connected to the pillar 318, so that the adapter board 350 and the tube seat 310 have a common reference ground, which helps to enhance the grounding effect of the adapter board 350.

In some embodiments, a half hole 3511 is disposed on the top of the adapter plate body 351, a metal layer 3512 is disposed in the half hole 3511, one end of the metal layer 3512 is connected to the second grounding metal layer 354, and the other end of the metal layer 3512 is connected to the fifth grounding metal layer 357; when the adapter plate 350 is disposed on the column 318, the other end of the metal layer 3512 is connected to the column 318. In some embodiments, the half hole 3511 is disposed in the middle of the top of the adapter plate body 351.

Usually, the height of the column 318 is less than or equal to the height of the adapter plate 350, and the edge of the column 318 has an arc surface, so that the contact between the fifth grounding metal layer 357 and the column 318 is concentrated in the center of the fifth grounding metal layer 357. In this way, the distance from the grounding metal layer on the front of the adapter plate body 351 to the column 318 is relatively large. The half hole 3511 and the metal layer 3512 in the half hole 3511 are convenient for enhancing the grounding of the second grounding metal layer 354 and helping to shorten the electrical connection distance from the second grounding metal layer 354 to the column 318, which will further enhance the grounding effect of the adapter plate 350 and effectively control the return distance of the high-frequency return ground on the adapter plate 350, ensuring the adapter plate 350. grounding performance.

In addition, since the adapter board body 351 is usually made of ceramic material, it is easier to set a half hole 3511 on the top of the adapter board body 351 and set a metal layer 3512 in the half hole 3511 than to set a via on the adapter board body 351 and electrically connect the grounding metal layer on the front and back sides of the adapter board body 351 through the via.

In some embodiments, in order to effectively control the bonding distance from the adapter plate 350 to the laser chip 420, one end of the first connection portion 3521 extends to the junction of the front surface of the adapter plate body 351 and the first side surface; in order to ensure the insulation effect between the first connection portion 3521 and the third grounding metal layer 355, a hollow area 358 is set on the first side surface of the adapter plate body 351, and the hollow area 358 is located on the side of one end of the first connection portion 3521. The hollow area 358 is used for the insulation of the first connection portion 3521 and the third grounding metal layer 355.

Figure 29 is a front view of a local structure of a light emitting component provided according to some embodiments of the present disclosure, and Figure 30 is a stereoscopic view of a local structure of a light emitting component provided according to some embodiments of the present disclosure. Figures 29 and 30 show an electrical connection relationship in the light emitting component. As shown in FIGS. 29 and 30 , in some embodiments, the first pin 314 and the second pin 315 are connected by wires to the two electrodes of the TEC 330 for supplying power to the TEC 330; the capacitor 430 is mounted on the sixth metal layer 417 so that the first end of the capacitor 430 is electrically connected to the sixth metal layer 417, and the second end of the capacitor 430 is connected by wires to the third pin 316; the thermistor 450 is mounted on the sixth metal layer 417 so that the first end of the thermistor 450 is electrically connected to the sixth metal layer 417, and the second end of the thermistor 450 is connected by wires to the fourth pin 317; the other end of the second metal layer 413 is connected by wires to the first connection portion 3521 at one end of the high-frequency metal layer 352; the end of the first metal layer 412 is connected by wires to the second grounding metal layer 354, and the end of the third metal layer 414 is connected by wires to the first grounding metal layer 353; the second connection portion 3522 of the high-frequency metal layer 352 is connected to the high-frequency pin 312 by soldering 359.

As shown in Figures 29 and 30, in some embodiments, the light emitting component 300 also includes a backlight detector 360, which is arranged on the top of the TEC330 and below the laser chip 420, and is used for detecting the reflected light power of the laser chip 420; the pins on the tube socket 310 also include a fifth pin 319, and the fifth pin 319 is arranged on the side of the tube socket body 311 where the TEC330 is supported, and is used for wiring to connect the backlight detector 360.

Exemplarily, in the directions shown in FIGS. 29 and 30 , the fifth pin 319 is located between the first pin 314 and the second pin 315 .

As shown in FIG30 , the backlight detector 360 is tiltedly arranged on the top of TEC330, that is, the top surface of the backlight detector 360 is not parallel to the top surface of TEC330, so that the receiving optical axis of the backlight detector 360 is not parallel to the optical axis of the laser chip 420, which helps to avoid the crosstalk of the optical signal emitted by the backlight detector 360 affecting the optical signal emitted by the laser chip 420.

Exemplarily, the inclination angle of the backlight detector 360 on the top of TEC330 can be set to 3-7°. For example, the inclination angle of the backlight detector 360 on the top of TEC330 is 4°, which can ensure that the backlight detector 360 can fully receive the backlight of the laser chip 420 and ensure the anti-crosstalk effect.

In some embodiments, the pad of the backlight detector 360 faces the fifth pin 319, so that the backlight detector 360 can be easily connected to the fifth pin 319. For example, the side of the backlight detector 360 is not parallel or perpendicular to the side of the TEC 330, that is, the upright backlight detector 360 is rotated at a certain angle and then arranged on the top of the TEC 330.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

An optical module, comprising:

Circuit boards;

An optical transceiver component, electrically connected to the circuit board, the optical transceiver component comprising an optical emitting component, and the optical emitting component is configured to emit an optical signal;

Wherein, the light emitting component comprises a tube holder, a laser assembly and a flexible circuit board, and the tube holder comprises:

A tube base body, with the laser assembly arranged on the top and a first boss and a second boss arranged on the bottom;

A high-frequency pin is embedded in the tube base body and insulated from the tube base body, one end of the high-frequency pin protrudes from the top surface of the tube base body and is electrically connected to the laser component;

A first grounding pin, one end of which is connected to the first boss and is located at one side of the high-frequency pin;

A second grounding pin, one end of which is connected to the second boss and is located at the other side of the high-frequency pin;

A high-frequency connection hole, a first grounding connection hole and a second grounding connection hole are provided on the flexible circuit board, the high-frequency pin is connected to the high-frequency connection hole, the first grounding pin is connected to the first grounding connection hole, the second grounding pin is correspondingly connected to the second grounding connection hole, and the first boss is located in the first grounding connection hole, and the second boss is embedded in the second grounding connection hole.
According to the optical module of claim 1, a first through hole is provided on the stem body, the high-frequency pin is embedded in the first through hole and fixed by an insulating material, and the inner diameter of the first through hole is determined according to the impedance required on the high-frequency signal path of the laser component, and the inner diameter of the first through hole is related to the diameter of the high-frequency pin and the thickness of the insulating material in the first through hole.
The optical module according to claim 1 or 2, wherein the light emitting component further comprises: an adapter plate, arranged on the top of the tube seat body and located on one side of the laser assembly;

The adapter board includes an adapter board body, and a high-frequency metal layer, a first grounding metal layer and a second grounding metal layer are arranged on the front side of the adapter board body; the first grounding metal layer is located on one side of the high-frequency metal layer, and the second grounding metal layer is located on the other side of the high-frequency metal layer; the laser component is respectively connected to the high-frequency metal layer, the first grounding metal layer and one end of the second grounding metal layer through wire bonding.
The optical module according to claim 3, wherein the laser component comprises a substrate and a laser chip, and the laser chip is mounted on the substrate and electrically connected to the adapter board through the substrate.
The optical module according to claim 4, wherein the substrate comprises a substrate body, a first metal layer, a second metal layer, a third metal layer, a fourth metal layer and a fifth metal layer are arranged on the substrate body, the second metal layer is located between the first metal layer and the third metal layer, and the fourth metal layer is located at one end of the second metal layer and connects the first metal layer and the third metal layer;

The laser chip is mounted on the fourth metal layer, the EAM positive electrode of the laser chip is connected to the second metal layer by wire bonding, and the LD positive electrode of the laser chip is connected to the fifth metal layer by wire bonding;

The adapter board is arranged on the side of the substrate, the first metal layer is connected to the second grounding metal layer by wire bonding, the second metal layer is connected to the high-frequency metal layer by wire bonding, the third metal layer is connected to the first grounding metal layer by wire bonding, and the high-frequency metal layer is welded to the high-frequency pin.
The optical module according to any one of claims 3 to 5, wherein a column is further provided on the top of the tube seat body, the column is electrically connected to the tube seat body, and the column supports and is electrically connected to the adapter plate.
The optical module according to claim 6, wherein a third grounding metal layer is provided on the first side of the adapter board body, a fourth grounding metal layer is provided on the second side of the adapter board, a fifth grounding metal layer is provided on the back of the adapter board, the first grounding metal layer is electrically connected to the fifth grounding metal layer through the third grounding metal layer, and the second grounding metal layer is electrically connected to the fifth grounding metal layer through the fourth grounding metal layer;

The adapter plate is connected to the column through the fifth grounding metal layer.
The optical module according to claim 6 or 7, wherein the height of the adapter plate is greater than or equal to the height of the column, a half hole is set on the top of the adapter plate, a metal layer is set in the half hole, one end of the metal layer is electrically connected to the second grounding metal layer, and the other end is electrically connected to the column.
The optical module according to any one of claims 5 to 8, wherein the high-frequency metal layer comprises a first connection portion, a second connection portion and a third connection portion; an end portion of the first connection portion is close to a first side surface of the adapter plate body, the second connection portion is located at the bottom of the adapter plate body, and the third connection portion connects the first connection portion and the second connection portion;

The first connection portion is connected to the second metal layer by wire bonding, and the second connection portion is connected to the high-frequency pin by welding;

The width of the second connection portion is greater than the width of the first connection portion.
The optical module according to any one of claims 5 to 8, wherein a sixth metal layer is further provided on the substrate body, and the sixth metal layer is electrically connected to the fourth metal layer;

The laser assembly also includes a thermistor and a capacitor, which are mounted on the sixth metal layer, and a first end of the thermistor is electrically connected to the sixth metal layer and a first end of the capacitor is electrically connected to the sixth metal layer, and a second end of the capacitor is wired to the fifth metal layer.
The optical module according to claim 10, wherein the socket further comprises a third pin and a fourth pin, wherein the third pin and the fourth pin are respectively embedded and connected to the socket body, and one end of the third pin and the fourth pin respectively protrudes from the top surface of the socket body;

The second end of the thermistor is connected to the fourth pin by wire bonding, and the second end of the capacitor is connected to the third pin by wire bonding.
According to the optical module according to any one of claims 1-11, the light emitting component further comprises a TEC and a support seat, the TEC is arranged on the top of the tube seat body, the support seat is arranged on the top of the TEC, and the laser component is arranged on the side of the support seat.
The optical module according to claim 12, wherein the light emitting component further comprises a backlight detector, the backlight detector is obliquely arranged on the top of the TEC, and the pad of the backlight detector is close to the side of the TEC.
The optical module according to claim 13, wherein the socket further comprises a first pin, a second pin and a fifth pin, the first pin, the second pin and the fifth pin are respectively embedded and connected to the socket body, and one end of the first pin, the second pin and the fifth pin protrudes from the top surface of the socket body;

The fifth pin is located between the first pin and the second pin. The first pin and the second pin are respectively connected to electrodes of the TEC by wire bonding. The fifth pin is connected to a pad of the backlight detector by wire bonding.
The optical module according to any one of claims 1 to 14, wherein the first ground pin and the second ground pin are symmetrically arranged on both sides of the high-frequency pin.
The optical module according to claim 5, wherein a first solder pad and a second solder pad are further provided on the substrate body, and the laser assembly further comprises a matching resistor;

The first pad is wire-bonded to the EAM positive electrode of the laser chip, the first end of the matching resistor is electrically connected to the first pad, the second end of the matching resistor is connected to the second pad, and the second pad is wire-bonded to the fourth metal layer through a plurality of gold wires.
The optical module according to claim 16, wherein the second pad is connected to the connection between the fourth metal layer and the sixth metal layer on the substrate body by a plurality of gold wires.
The optical module according to claim 16, wherein the first pad and the second pad are arranged in the gap between the fourth metal layer and the sixth metal layer on the substrate body, and the second pad is connected to the connection between the fourth metal layer and the sixth metal layer by three gold wires, so as to modulate the inductance modulation of the output end of the laser chip by the three gold wires.
The optical module according to claim 9, wherein a hollow area is provided on the first side surface of the adapter plate body, and the hollow area is located on a side edge of one end of the first connecting portion.
The optical module according to claim 12, wherein the back surface of the substrate body is connected to the side surface of the support seat.
The optical module according to claim 5, wherein one end of the fifth metal layer is close to the substrate The sixth metal layer on the body, the fifth metal layer extends in a direction perpendicular to the emission light path of the laser chip and in a reverse direction, and the other end of the fifth metal layer is close to the third metal layer.
The optical module according to claim 5, wherein the height of the adapter plate is lower than the height of the substrate body, and the second metal layer is obliquely arranged on the substrate body so that one end of the second metal layer is close to the EAM positive electrode of the laser chip and the other end is lower than the top surface of the substrate body.
The optical module according to any one of claims 1 to 22, wherein the thickness of the first boss is greater than the thickness of the flexible circuit board, and the thickness of the second boss is greater than the thickness of the flexible circuit board.