CN118033829A - Optical module - Google Patents

Abstract

The application provides an optical module, comprising: a circuit board; the optical transceiver component is electrically connected with the circuit board and comprises a light emitting device, and the light emitting device is used for receiving an optical signal; the light emitting device comprises a tube seat, a laser component and an adapter plate, wherein the laser component and the adapter plate are arranged at the top of the tube seat, and the adapter plate is arranged at one side of the laser component; the adapter plate comprises an adapter plate body, wherein a high-frequency metal layer, a first grounding metal layer and a second grounding metal layer are arranged on the front surface of the adapter plate body, the first grounding metal layer is positioned on one side of the high-frequency metal layer, and the second grounding metal layer is positioned on the other side of the high-frequency metal layer; the laser component is correspondingly connected with one ends of the high-frequency metal layer, the first grounding metal layer and the second grounding metal layer through wire bonding. The optical module provided by the embodiment of the application is used for ensuring the high-frequency performance of the light emitting device.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

The semiconductor laser chip is a key device of the optical module, and uses a semiconductor material as a working substance to generate laser, and with the continuous improvement of the transmission rate of the optical module required by the development of optical communication technology, the requirement of the high-frequency performance of the semiconductor laser chip is higher and higher. The high frequency modulation performance of the semiconductor laser chip is determined by the high frequency response of the active region and the high speed transmission structure, so that the high speed transmission structure is critical to the performance of high bandwidth and ultra-high bandwidth, and any impedance mismatch or resonance effect seriously deteriorates the performance of the whole product, so that the semiconductor laser chip cannot realize high speed application.

The TO package is a common package use form of the semiconductor laser chip and has the characteristics of simple manufacturing process, low cost, flexible and convenient use and the like. In the current optical module, the TO is generally electrically connected TO a circuit board inside the optical module through a flexible circuit board, and because of a high-speed signal routing line structure inside the TO and a high-speed signal routing microstrip line structure on the flexible circuit board, high-signal transmission at a connection position between the TO and the flexible circuit board can cause impedance mismatch, and when a backflow path is improperly processed, resonance effect can be caused, and quality of a high-speed signal of the semiconductor laser chip can be further lost, so that the 3dB bandwidth of the semiconductor laser chip is reduced.

Disclosure of Invention

The embodiment of the application provides an optical module which is used for ensuring the high-frequency performance of a light emitting device.

The application provides an optical module, comprising:

a circuit board;

the optical transceiver component is electrically connected with the circuit board and comprises a light emitting device, and the light emitting device is used for receiving an optical signal;

The light emitting device comprises a tube seat, a laser component and an adapter plate, wherein the laser component and the adapter plate are arranged at the top of the tube seat, and the adapter plate is arranged at one side of the laser component;

The adapter plate comprises an adapter plate body, wherein a high-frequency metal layer, a first grounding metal layer and a second grounding metal layer are arranged on the front surface of the adapter plate body, the first grounding metal layer is positioned on one side of the high-frequency metal layer, and the second grounding metal layer is positioned on the other side of the high-frequency metal layer; the laser component is correspondingly connected with one ends of the high-frequency metal layer, the first grounding metal layer and the second grounding metal layer through wire bonding.

In the optical module provided by the application, the adapter plate is arranged at the top of the tube seat and is arranged at one side of the laser component, and the laser component is connected with the adapter plate so as to realize the electric connection between the laser component and the corresponding pin on the tube seat through the adapter plate, thereby facilitating the electric connection between the laser component and the corresponding pin on the tube seat. The adapter plate comprises a high-frequency metal layer, and a first grounding metal layer and a second grounding metal layer which are positioned on two sides of the high-frequency metal layer, so that the impedance control on a high-frequency signal transmission path of the laser component is realized through the adapter plate, the high-frequency signal transmitted to the laser component is reduced, the interference is reduced, and the high-frequency performance of the light emitting device is guaranteed conveniently.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a diagram of the connection relationship of an optical communication system;

fig. 2 is a block diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module provided according to some embodiments;

FIG. 4 is an exploded view illustration of an optical module provided in accordance with some embodiments;

Fig. 5 is an outline configuration diagram of a light emitting device provided according to some embodiments;

Fig. 6 is a schematic diagram of a partial structure of a light emitting device provided in accordance with some embodiments;

FIG. 7 is a schematic diagram of a partial structure of a light emitting device according to some embodiments;

FIG. 8 is an exploded illustration of FIG. 6;

FIG. 9 is a schematic diagram of a laser assembly provided according to some embodiments;

FIG. 10 is an exploded view of a laser assembly provided according to some embodiments;

FIG. 11 is a schematic structural view of a substrate provided according to some embodiments;

FIG. 12 is an exploded schematic view of a substrate provided according to some embodiments;

FIG. 13 is a diagram of electrical connections for a laser assembly provided according to some embodiments;

FIG. 14 is a schematic diagram of simulation results of an S11 curve provided in accordance with some embodiments;

FIG. 15 is a schematic diagram of simulation results of an S21 curve provided in accordance with some embodiments;

FIG. 16 is a schematic illustration of a header provided in accordance with some embodiments;

FIG. 17 is a second schematic illustration of a header provided in accordance with some embodiments;

FIG. 18 is a cross-sectional view I of a header provided in accordance with some embodiments;

FIG. 19 is an exploded view of an adapter plate and header body provided in accordance with some embodiments;

FIG. 20 is a second cross-sectional view of a header provided in accordance with some embodiments;

FIG. 21 is a schematic diagram of a flexible circuit board provided according to some embodiments;

FIG. 22 is a schematic diagram illustrating an assembly of a light emitting device and a flexible circuit board according to some embodiments;

fig. 23 is a second schematic diagram of an assembly of a light emitting device and a flexible circuit board according to some embodiments;

fig. 24 is a third schematic diagram of an assembly of a light emitting device and a flexible circuit board provided in accordance with some embodiments;

Fig. 25 is a schematic diagram of an assembly of a light emitting device and a flexible circuit board according to some embodiments;

fig. 26 is a schematic structural diagram of an interposer according to some embodiments;

Fig. 27 is a second schematic structural diagram of an interposer according to some embodiments;

Fig. 28 is a third schematic structural view of an interposer provided according to some embodiments;

Fig. 29 is a front view of a partial structure of a light emitting device provided in accordance with some embodiments;

Fig. 30 is a schematic diagram of a partial structure of a light emitting device according to some embodiments.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and the electric connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-range signal transmission, such as several kilometers (6 kilometers to 8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to achieve unlimited distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. Illustratively, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the mutual conversion between the optical signal and the electrical signal, it has no function of processing data, and the information is not changed during the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Illustratively, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits an electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100, as a host computer of the optical module 200, can monitor the operation of the optical module 200. The upper computer of the Optical module 200 may include an Optical line terminal (Optical LINE TERMINAL, OLT) or the like in addition to the Optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal, and fig. 2 shows only the configuration of the optical network terminal 100 related to the optical module 200 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 propose a bi-directional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module provided in accordance with some embodiments, and fig. 4 is an exploded view of an optical module provided in accordance with some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 206 disposed in the housing, and an optical transceiver 207.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being covered on the lower housing 202 to form the above-mentioned housing having two openings; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed at both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction in which the two openings 204 and 205 are connected may be the same as the longitudinal direction of the optical module 200 or may be different from the longitudinal direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 206 extends out from the electrical port 204 and is inserted into a host computer (e.g., the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 such that the external optical fiber 101 is connected to an optical transceiver component 207 inside the optical module 200.

The circuit board 206, the optical transceiver 207 and other devices are conveniently installed in the shell by adopting an assembly mode that the upper shell 201 and the lower shell 202 are combined, and the upper shell 201 and the lower shell 202 form packaging protection for the devices. In addition, when devices such as the circuit board 206 and the optical transceiver 207 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently deployed, and the automatic production implementation is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located outside the housing thereof, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates 2022 of the lower housing 202, with a snap-in member that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 206 includes circuit traces, electronic components and chips, which are connected together by circuit traces according to a circuit design to perform functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a limiting amplifier (LIMITING AMPLIFIER), a clock data recovery (Clock and Data Recovery, CDR) chip, a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 206 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; when the optical transceiver component is positioned on the circuit board, the hard circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 206 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 206 is inserted into the cage 106 and conductively connected to the electrical connectors within the cage 106 by the gold fingers. The gold finger may be disposed on only one surface (e.g., the upper surface shown in fig. 4) of the circuit board 206, or may be disposed on both upper and lower surfaces of the circuit board 206, so as to adapt to the situation with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, a flexible circuit board may be used to connect the hard circuit board and the optical transceiver.

The optical transceiver 207 includes a light emitting device 300 configured to enable emission of an optical signal and a light receiving device configured to enable reception of the optical signal. Illustratively, the light emitting device 300 and the light receiving device are combined together to form an integrally formed light receiving and transmitting assembly, although the light emitting device 300 and the light receiving device may be separated in embodiments of the present application, i.e., the light emitting device 300 and the light receiving device do not share a housing.

Fig. 5 provides an outline structure of a light emitting device according to some embodiments. As shown in fig. 5, the light emitting device 300 provided in this embodiment includes a stem 310 and a cap 320, the cap 320 being connected to the stem 310 and forming a relatively sealed space with the stem 310, in which a device for generating an optical signal and transmitting the optical signal, such as a laser assembly, a lens, a TEC (Thermo Electric Cooler, a semiconductor refrigerator), etc., is disposed.

The socket 310 includes a socket body 311 and a plurality of pins, the top of the socket body 311 is connected to the socket body 311, the plurality of pins are connected to the socket body 311, and one end of a portion of the pins is extended into a space formed between the socket 310 and the socket 320, and the plurality of pins include, but are not limited to, a high frequency pin for transmitting a high frequency signal, a ground pin for grounding, and first and second pins for supplying power to the TEC, etc. Pins are used to facilitate electrical connection of the light emitting device 300 to the circuit board 206. Illustratively, the pins connect to the flexible circuit board to electrically connect to the circuit board 206 through the flexible circuit board. Thus, the light emitting device 300 is electrically connected to the circuit board 206, and further, other electrical devices in the light emitting device 300 are electrically connected to the circuit board 206, which is not limited to the flexible circuit board 206. A light window is typically provided on the cap 320 for transmitting light generated in the light emitting device 300.

Fig. 6 is a schematic diagram of a partial structure of a light emitting device according to some embodiments, fig. 7 is a schematic diagram of a partial structure of a light emitting device according to some embodiments, fig. 8 is an exploded schematic diagram of fig. 6, and fig. 6-8 show a structure of a light emitting device 300 after removing a cap 320. As shown in fig. 6-8, in some embodiments, the light emitting device 300 includes a laser assembly 400, the laser assembly 400 being configured to emit light. Of course, in some embodiments of the present application, the use form of the light emitting device 300 is not limited to the structure shown in fig. 6, i.e., the internal structure of the light emitting device 300 may be other forms.

In some embodiments of the present application, the top of the header body 311 is provided with a TEC330, and the laser assembly 400 is provided on the TEC 330. The laser assembly 400 generally includes a sheet-like substrate and a device mounted on the substrate in a package, and is not conveniently mounted directly on the TEC330, so that the top of the TEC330 is provided with a base 340 to facilitate the mounting of the laser assembly 400; the bottom surface of the base 340 is connected with the TEC330, and the first side surface of the base 340 is used for arranging the laser assembly 400, so that the laser assembly 400 is arranged on the TEC330 conveniently and the light emitted by the laser assembly 400 can transmit through the light window of the pipe cap 320. The base 340 is made of a thermally good conductive material, such as copper, ceramic, etc., and the TEC330 is able to adjust the temperature of the laser assembly 400 through the base 340.

In some embodiments of the present application, an interposer 350 is further provided on top of the header body 311, and a metal layer is provided on the interposer 350 to form circuit traces for circuit switching of the pins on the header 310 or the header body 311 to the laser assembly 400. In an embodiment of the present application, in order to ensure that the laser chip 420 can work normally, the laser assembly 400 is disposed above the TEC330, so as to raise the height of the laser assembly 400 on the header 310, and the interposer 350 is used to implement electrical connection between different heights on the header 310. The interposer 350 may employ a ceramic substrate, such as an AlN ceramic substrate, formed with a circuit pattern, but is not limited to a ceramic substrate. Illustratively, the laser assembly 400 is wire-bonded to the interposer 350.

In some embodiments of the present application, a pillar is disposed on the top surface of the socket body 311, and a side surface of the pillar supports the adapter plate 350, so as to facilitate fixing of the adapter plate 350 on the socket body 311 and ensure fixing firmness of the adapter plate 350 on the socket body 311.

Fig. 9 is a schematic structural view of a laser assembly provided according to some embodiments, and fig. 10 is an exploded schematic view of a laser assembly provided according to some embodiments. As shown in fig. 9 and 10, the laser assembly 400 includes a substrate 410 and a laser chip 420 disposed on the substrate 410. The substrate 410 includes a non-metallized region and a metallized region, the metallized region being used to carry or connect electrical devices such as chips; such as a metalized area, is used to carry the laser chip 420, facilitate powering and inputting high frequency signals to the laser chip 420, and facilitate impedance matching on the high frequency signal lines of the laser chip 420. Illustratively, the laser chip 420 is an Electro-absorption modulated laser (Electro-absorption Modulated Maser, EML) including an Electro-absorption modulator (Electro Absorption Modulator, EAM) and a distributed feedback laser diode (Distributed Feed Back, DFB), and the top of the laser chip 420 includes an EA anode and a DFB anode.

In some embodiments of the present application, the laser assembly 400 further includes a capacitor 430, a matching resistor 440, and a thermistor 450, the capacitor 430, the matching resistor 440, and the thermistor 450 being disposed on the substrate 410. The capacitor 430 is connected in parallel with the DFB in the laser chip 420 for filtering in the DFB power supply circuit; the matching resistor 440 is connected in parallel with the EA in the laser chip 420 for EA termination matching; the thermistor 450 is used for temperature acquisition of the laser assembly 400.

Fig. 11 is a schematic structural view of a substrate according to some embodiments, and fig. 12 is an exploded schematic view of a substrate according to some embodiments. As shown in fig. 11 and 12, in some embodiments of the present application, the substrate 410 includes a substrate body 411, and a first metal layer 412, a second metal layer 413, a third metal layer 414, a fourth metal layer 415, a fifth metal layer 416, and a sixth metal layer 417 disposed on a top surface of the substrate body 411. The first metal layer 412, the second metal layer 413 and the third metal layer 414 are arranged on the top surface of the substrate body 411 in parallel, and the second metal layer 413 is located between the first metal layer 412 and the third metal layer 414 and insulated from the first metal layer 412 and the third metal layer 414; the first metal layer 412, the second metal layer 413, and the third metal layer 414 are located at one side of the fourth metal layer 415, the sixth metal layer 417 is located at the other side of the fourth metal layer 415, and the first metal layer 412, the third metal layer 414, and the sixth metal layer 417 connect the fourth metal layer 415; the fifth metal layer 416 is located below the fourth metal layer 415, and the fifth metal layer 416 is insulated from the fourth metal layer 415.

Fig. 13 is a diagram of electrical connections for a laser assembly provided in accordance with some embodiments. As shown in fig. 13, in the embodiment of the present application, the laser chip 420 is mounted on the fourth metal layer 415, that is, the negative electrode of the laser chip 420 is electrically connected to the fourth metal layer 415, the EA positive electrode wire of the laser chip 420 is connected to one end of the second metal layer 413, and the DFB positive electrode wire of the laser chip 420 is connected to the fifth metal layer 416; the capacitor 430 and the thermistor 450 are mounted on the sixth metal layer 417, that is, the first end of the capacitor 430 and the first end of the thermistor 450 are electrically connected to the sixth metal layer 417, respectively, and the second end of the capacitor 430 is wire-bonded to the fifth metal layer 416.

In some embodiments of the present application, a first pad 418 and a second pad 419 are further disposed on the top surface of the substrate body 411, and the first pad 418 and the second pad 419 are disposed over the connection region of the fourth metal layer 415 and the sixth metal layer 417. First pad 418 and second pad 419 are insulated therebetween, and first pad 418 and second pad 419 are insulated from fourth metal layer 415 and sixth metal layer 417, respectively. The first end of the matching resistor 440 is electrically connected to the first bonding pad 418, the second end of the matching resistor 440 is electrically connected to the second bonding pad 419, the first bonding pad 418 is wire-bonded to the EA positive electrode of the laser chip 420, the second bonding pad 419 is wire-bonded to the fourth metal layer 415 and the sixth metal layer 417 connecting region, and the matching resistor 440, the first bonding pad 418, the second bonding pad 419 and the wire bond are used for forming a matching circuit of the laser chip 420 so as to facilitate adjustment of the matching circuit based on actual performance parameters of the laser chip 420. The second pad 419 is connected to the fourth metal layer 415 or the sixth metal layer 417 by gold wires 441, for example.

As shown in fig. 9-13, the fourth metal layer 415 is disposed on the top surface of the substrate body 411 near the center, and the second metal layer 413 extends obliquely from the side edge of the substrate body 411 to the fourth metal layer 415, so as to adjust the length of the second metal layer 413 and control the height of the other end of the second metal layer 413 above the substrate body 411, so that the other end of the second metal layer 413 is connected with the bonding wire of the interposer 350. Of course, in the embodiment of the present application, the inclination angle of the second metal layer 413 is not limited to the one shown in the drawings, and may be specifically selected according to the position of the bonding wire with the interposer 350 and the position of the fourth metal layer 415.

Illustratively, as shown in fig. 9-13, the fifth metal layer 416 has one end near the sixth metal layer 417 and the other end near the junction of the third metal layer 414 and the fourth metal layer 415. In combination with the space on the substrate body 411, the fifth metal layer 416 has a special-shaped structure, the width of one end close to the sixth metal layer 417 is relatively small, the width of the other end close to the joint of the third metal layer 414 and the fourth metal layer 415 is relatively large, the second end wire bonding connection of the fifth metal layer 416 and the capacitor 430 can be realized, the area of the other end of the fifth metal layer 416 can be controlled, the fifth metal layer 416 can be close to the DFB anode of the laser chip 420 as much as possible, and the ageing experiment test and the like of the laser chip 420 can be conveniently realized. Of course, in the embodiment of the present application, the layout shape of the fifth metal layer 416 is not limited to the shape shown in fig. 9-11, and the shape of the third metal layer 414 and the fourth metal layer 415 may be modified adaptively, for example, increasing the width of one end of the fifth metal layer and decreasing the width of the other end of the fifth metal layer.

In some embodiments, as shown in fig. 13, the second pad 419 is wire-bonded to the connection between the fourth metal layer 415 and the sixth metal layer 417 by three gold wires 441, where the three gold wires 441 are used to implement inductance modulation at the output of the laser chip 420, i.e., the three gold wires 441 are equivalent to inductance. In the embodiment of the application, the inductance of the output end of the laser chip 420 can be adjusted by adjusting and controlling the number, length and shape of the gold wires 441, and then the inductance matched with the actual laser chip 420 can be obtained by simulating the number, length and shape of the connected metal layers of the gold wires 441.

Fig. 14 is a schematic diagram of S11 curve simulation results provided according to some embodiments, and fig. 15 is a schematic diagram of S21 curve simulation results provided according to some embodiments. In some embodiments of the present application, the inductance modulation at the output end of the laser chip 420 can ensure that the trend of the S21 curve is increased and then decreased on the basis of ensuring the performance of S11, and the 3dB bandwidth is higher than the starting point by about 0.8-2 dB interval, so as to facilitate the improvement of the performance of the laser chip 420.

In some embodiments, the second bond pad 419 is wire-bonded to the fourth metal layer 415 by one, two, three, etc. gold wires 441, the length of the gold wires 441 and the number of gold wires will affect the inductance of the output of the laser chip 420, and thus the bandwidth of the laser chip 420. As shown in fig. 14 and 15, as can be seen from the emission amount of-10 dB or less in fig. 14 and the amount achieved by the 3dB bandwidth in fig. 15, the performance of using 3 gold wires is slightly better than that of using 1 gold wire laser chip 420, but the difference is not great, but both are much better than that of using one gold wire of 2 times length. When 3 gold wires are used, if the wire length is not high in control accuracy or falling off, the overall inductance is not greatly influenced, so that the reliability of using the 3 gold wires is high. The length of gold wire 441 can be found to be the appropriate length by DOE (Design of Experiment, experimental design).

Fig. 16 is a schematic structural view of a first stem provided according to some embodiments, and fig. 17 is a schematic structural view of a second stem provided according to some embodiments. As shown in fig. 16 and 17, the pins on the socket 310 include a high frequency pin 312, a ground pin 313, a first pin 314, a second pin 315, a third pin 316, a fourth pin 317, and the like, the high frequency pin 312, the first pin 314, the second pin 315, the third pin 316, and the fourth pin 317 are connected to the socket body 311 and insulated from the socket body 311, and the ends of the high frequency pin 312, the first pin 314, the second pin 315, the third pin 316, and the fourth pin 317 protrude from the top surface of the socket body 311. Illustratively, the socket body 311 is provided with through holes for embedding the high-frequency pins 312, the first pins 314, the second pins 315, the third pins 316 and the fourth pins 317, and insulating substances such as insulating glass cement, black glass and the like are arranged in the through holes, so that the high-frequency pins 312, the first pins 314, the second pins 315, the third pins 316 and the fourth pins 317 are embedded and fixed in the corresponding through holes on the socket body 311; illustratively, the high-frequency pins 312, the first pins 314, etc. are fixed in the corresponding through holes on the header body 311 by black glass bonding. In some embodiments of the present application, a plurality of ground pins 313 are provided on the header 310, with two or more ground pins 313 being adjacent to the high frequency pins 312.

At present, a TO packaged device is usually provided with only one grounding pin, and in particular use, in order TO ensure sufficient grounding area, a flexible circuit board is connected through a tin-soldering, however, the tin-soldering needs long-time high-temperature welding of the flexible board, optical path deviation and optical power drop are easy TO cause, and further, the design requirement on the flexible circuit board is relatively high. Therefore, in the embodiment of the present application, the difficulty in designing the flexible circuit board can be reduced to some extent by providing a plurality of ground pins 313 to enhance the grounding of the header 310.

In some embodiments of the present application, the ground pins 313 include a first ground pin 3131 and a second ground pin 3132, and the first ground pin 3131 and the second ground pin 3132 are located at two sides of the high frequency pin 312, so as to implement a layout of a plurality of ground pins on the socket 310, and enhance the grounding of the socket 310 to ensure the high frequency performance of the laser chip 420. Illustratively, the first ground pin 3131 and the second ground pin 3132 are axisymmetrically disposed on both sides of the high frequency pin 312, although the first ground pin 3131 and the second ground pin 3132 may also be asymmetrically disposed on both sides of the high frequency pin 312.

In the embodiment of the present application, the first ground pin 3131 and the second ground pin 3132 are disposed at two sides of the high frequency pin 312 to form a GSG pin design, and further form a GSG transmission line when the high frequency pin 312 is used for transmitting a high frequency signal; and the first and second ground pins 3131 and 3132 are provided for connection to a reference ground, such as a ground on a flexible circuit board, so as to achieve sufficient grounding to ensure the grounding performance of the socket 310 and thus the high frequency performance of the laser chip 420.

Fig. 18 is a cross-sectional view of a header provided in accordance with some embodiments. As shown in fig. 18, in some embodiments of the present application, a first boss 3133 is disposed at a connection point of the first ground pin 3131 and the bottom surface of the header body 311, and a second boss 3134 is disposed at a connection point of the second ground pin 3132 and the bottom surface of the header body 311. The first boss 3133 and the second boss 3134 are used for connecting the flexible circuit board, so that the contact area between the first grounding pin 3131 and the flexible circuit board and the contact area between the second grounding pin 3132 and the flexible circuit board are guaranteed, the first grounding pin 3131 and the second grounding pin 3132 are fully grounded, and further, the impedance continuity of the light emitting device 300 and the flexible circuit board during welding connection is guaranteed. Illustratively, the first boss 3133 and the second boss 3134 are circular bosses, respectively, although embodiments of the present application are not limited to circular bosses.

In some embodiments of the present application, when the light emitting device 300 and the flexible circuit board are soldered, the first boss 3133 and the second boss 3134 are respectively penetrated on the flexible circuit board to be sufficiently connected with the ground on the flexible circuit board, thereby minimizing the influence of the impedance discontinuity of the light emitting device 300 on the high frequency performance of the light emitting device 300 when the light emitting device 300 is soldered to the flexible circuit board.

In some embodiments of the present application, the socket body 311 is provided with a first through hole 3111 and a plurality of second through holes 3112, the high-frequency pins 312 are embedded and fixed in the first through hole 3111, and the first pins 314, the second pins 315, the third pins 316 and the fourth pins 317 are respectively embedded and fixed in the corresponding second through holes 3112. In some embodiments, to facilitate adapting the impedance matching requirements of the laser assembly 400 by adjusting the thickness of the high frequency pins 312, the inner diameter of the first through holes 3111 should be relatively large. Illustratively, the inner diameter of the first through-hole 3111 is greater than the inner diameter of the second through-hole 3112.

In the embodiment of the present application, the laser chip 420 is a high-speed laser, and the characteristic impedance of the high-frequency signal path of the laser chip 420 directly affects the high-frequency performance of the laser chip 420. The diameter and length of the high-frequency pin 312 and the thickness of the material used to fix the high-frequency pin 312, such as black glass, in the first through hole 3111 affect the characteristic impedance of the high-frequency signal path of the laser chip 420, so that the inner diameter of the first through hole 3111 is larger than the inner diameter of the second through hole 3112 in the present application, so as to facilitate the adjustment and control of the characteristic impedance of the high-frequency signal path of the laser chip 420.

Characteristic impedance on high frequency signal path of laser chip 420Wherein L represents inductance and C represents capacitance. The inductance is related to the diameter and length of the high frequency pins 312; the smaller the diameter and longer the length of the high frequency pin 312, the greater the inductance; the larger the diameter and shorter the length of the high frequency pin 312, the smaller the inductance. The capacitance is related to the thickness d of the material used for fixing the high-frequency pin 312 (the thickness from the surface of the high-frequency pin 312 to the inner wall of the first through hole 3111) such as black glass, the dielectric constant epsilon, and the contact area a of the high-frequency pin 312. For example, the capacitance c= (epsilon a)/d, when the high-frequency pin 312 is fixed using black glass, the dielectric constant epsilon is relatively fixed, and thus it is the contact area a of the black glass with the high-frequency pin 312 and the thickness of the black glass in the first through hole 3111 that affect the capacitance C. As such, when the diameter of the high-frequency pin 312 is larger and the inner diameter of the first through hole 3111 is smaller, the characteristic impedance on the high-frequency signal path of the laser chip 420 is smaller, i.e., the diameter of the high-frequency pin 312 and the inner diameter of the first through hole 3111 directly affect the characteristic impedance on the high-frequency signal path of the laser chip 420. Further, in the embodiment of the present application, by setting the inner diameter of the first through hole 3111 to be relatively larger, for example, the inner diameter of the first through hole 3111 is larger than the inner diameter of the second through hole 3112, it is convenient to perform adjustment control of the contact area a of the black glass with the high frequency pin 312 and the thickness of the black glass in the first through hole 3111.

Fig. 19 is an exploded view of an adapter plate and a header body according to some embodiments, and fig. 20 is a cross-sectional view of a header according to some embodiments. As shown in fig. 19 and 20, in some embodiments of the present application, a post 318 is provided on the top surface of the header body 311, the post 318 is electrically connected to the header body 311, and the side support of the post 318 is connected to the back surface of the adapter plate 350; the projection of the pillar 318 on the bottom surface of the header body 311 overlaps the connection of the second ground pin 3132 and the header body 311. Illustratively, a projected portion of stud 318 on the bottom surface of header body 311 overlies second boss 3134 such that the cross-sectional area of stud 318 is greater than or equal to the cross-sectional area of second boss 3134 in order to ensure continuity of impedance matching. The posts 318 are used to support and electrically connect the ground of the interposer 350. In some embodiments, stud 318 is integrally formed with header body 311, and first ground pin 3131, second ground pin 3132, and header body 311 are integrally formed.

In the embodiment of the present application, the interposer 350 includes an interposer body 351 and a metal layer disposed on a surface of the interposer body 351 and forming a certain pattern, where the metal layer disposed on the interposer body includes a high-frequency metal layer 352, and the high-frequency metal layer 352 is disposed on a front surface of the interposer body 351, far from the upright post 318. The front surface of the adapter plate 350 is close to one end of the high-frequency pin 312 protruding out of the top surface of the tube seat body 311, and the high-frequency metal layer 352 is welded to the high-frequency pin 312. Illustratively, the lower end of the high frequency metal layer 352 is soldered to the side of the top of the high frequency pin 312. Gold-tin solder may be used for soldering, e.g. gold, tin ratio 7:3, of course, the embodiment of the application is not limited to using gold-tin solder, and other solders can be used. When the high-frequency metal layer 352 and the high-frequency pin 312 are connected by welding, the volume of the solder at the welding connection position can be controlled according to the impedance matching requirement, and compared with the conventional method of connecting the high-frequency metal layer 352 and the high-frequency pin 312 by using wire bonding, the method of connecting the high-frequency metal layer 352 and the high-frequency pin 312 by using solder welding is more convenient for realizing impedance matching.

As shown in fig. 18 to 20, the height of the high-frequency pins 312, the first pins 314, the second pins 315, the third pins 316, and the fourth pins 317 protruding from the top surface of the socket body 311 may be different, and the height of the high-frequency pins 312, the first pins 314, the second pins 315, the third pins 316, and the fourth pins 317 protruding from the top surface of the socket body 311 may be selectively set according to the positions of the devices to be connected.

Fig. 21 is a schematic structural view of a flexible circuit board provided according to some embodiments. As shown in fig. 21, the light emitting device 300 according to the embodiment of the present application further includes a flexible circuit board 370, and the flexible circuit board 370 is provided with a circuit pattern for electrically connecting each pin on the header 310 with the circuit board 206, so that the electrical connection between each pin on the header 310 and the circuit board 206 is achieved through the flexible circuit board 370.

As shown in fig. 21, one end of the flexible circuit board 370 is provided with a plurality of connection holes, and metal plating layers are plated in the connection holes for embedding and connecting the pins on the corresponding sockets 310. Illustratively, the flexible circuit board 370 is provided with a high-frequency connection hole 371, a first ground connection hole 372, a second ground connection hole 373, a first connection hole 374, a second connection hole 375, a third connection hole 376, a fourth connection hole 377, and the like; the high-frequency connection hole 371 is located between the first ground connection hole 372 and the second ground connection hole 373.

In the embodiment of the present application, the high-frequency connection hole 371, the first ground connection hole 372, the second ground connection hole 373, the first connection hole 374, the second connection hole 375, the third connection hole 376 and the fourth connection hole 377 may be circular through holes, but are not limited to circular through holes, and as shown in fig. 21, the first ground connection hole 372 and the second ground connection hole 373 are elliptical holes. In some embodiments, in order to facilitate securing the contact area of the first boss 3133 and the second boss 3134 with the flexible circuit board 370, the sizes of the first ground connection hole 372 and the second ground connection hole 373 are larger than the sizes of the high-frequency connection hole 371 and the like.

Fig. 22 is a schematic diagram of an assembly of a light emitting device and a flexible circuit board according to some embodiments, fig. 23 is a schematic diagram of an assembly of a light emitting device and a flexible circuit board according to some embodiments, fig. 24 is a schematic diagram of an assembly of a light emitting device and a flexible circuit board according to some embodiments, and fig. 22-24 illustrate an assembly process and an assembly form of a header 310 and a flexible circuit board 370.

As shown in fig. 22-24, pins on the header 310 are correspondingly inserted into connection holes on the flexible circuit board 370, such as high frequency pins 312 inserted into the high frequency connection holes 371, first ground pins 3131 inserted into the first ground connection holes 372, second ground pins 3132 inserted into the second ground connection holes 373, etc., so that the pins on the header 310 are in positioning fit with the flexible circuit board 370; the header 310 is assembled with the flexible circuit board 370 in place so that the flexible circuit board 370 is closely attached to the bottom of the header body 311, and each connection hole is connected to the root of the corresponding pin connection header body 311 and is connected by soldering.

Fig. 25 is a schematic diagram of an assembly of a light emitting device and a flexible circuit board according to some embodiments. As shown in fig. 25, when the header 310 is assembled with the flexible circuit board 370 in place, the flexible circuit board 370 is abutted against the bottom of the header 310, the first boss 3133 is positioned in the first ground connection hole 372, and the second boss 3134 is positioned in the second ground connection hole 373. In some embodiments, the top surface of the first boss 3133 protrudes from the first ground connection hole 372, and the top surface of the second boss 3134 protrudes from the second ground connection hole 373, i.e., the first boss 3133 is inserted into the first ground connection hole 372, and the second boss 3134 is inserted into the second ground connection hole 373, so that the first ground pin 3131 and the second ground pin 3132 are in full contact with the ground on the connection flexible circuit board 370.

In some embodiments of the present application, the ground on the flexible circuit board 370 is disposed on a side of the flexible circuit board 370 away from the bottom of the header body 311, and the first boss 3133, the second boss 3134 and the flexible circuit board 370 are soldered to each other, so that the first ground pin 3131 and the second ground pin 3132 can be sufficiently grounded, and the impedance continuity of the ground pin 313 during soldering can be achieved.

Fig. 26 is a schematic structural view of a first interposer provided according to some embodiments, fig. 27 is a schematic structural view of a second interposer provided according to some embodiments, fig. 28 is a schematic structural view of a third interposer provided according to some embodiments, and fig. 26-28 show structural configurations of respective portions of a interposer. As shown in fig. 26 to 28, the interposer 350 includes an interposer body 351, a high-frequency metal layer 352, a first grounding metal layer 353 and a second grounding metal layer 354 are disposed on the front surface of the interposer body 351, a third grounding metal layer 355 is disposed on the first side surface of the interposer body 351, a fourth grounding metal layer 356 is disposed on the second side surface of the interposer body 351, and a fifth grounding metal layer 357 is disposed on the back surface of the interposer body 351. Illustratively, the high frequency metal layer 352, the first ground metal layer 353, the second ground metal layer 354, the third ground metal layer 355, the fourth ground metal layer 356, and the fifth ground metal layer 357 are formed using gold plating on the interposer body 351.

The high-frequency metal layer 352 extends from the bottom of the adapter plate body 351 to a side edge position close to the top so as to realize electrical connection between devices at different heights through the high-frequency metal layer 352; the high frequency metal layer 352 is bent in shape to facilitate electrical connection of the high frequency metal layer 352 to other structures or components. Illustratively, the high frequency metal layer 352 includes a first connection portion 3521, a second connection portion 3522, and a third connection portion 3523 for smoothly connecting the first connection portion 3521 and the second connection portion 3522; the first connection portion 3521 is located near a side edge of the top of the interposer body 351, and an end of the first connection portion 3521 is near a first side surface of the interposer body 351, and is used for electrically connecting the laser chip 420; the second connection portion 3522 is located at the bottom of the interposer body 351 and is used for electrically connecting the high-frequency pins 312; the third connection portion 3523 serves to extend the first and second connection portions 3521 and 3522. In some embodiments, to facilitate the solder connection of the high frequency metal layer 352 to the high frequency pin 312 and to ensure the continuity of the impedance matching, the width of the second connection portion 3522 is greater than the width of the first connection portion 3521.

A first grounding metal layer 353 is disposed on one side of the high-frequency metal layer 352, and a second grounding metal layer 354 is disposed on the other side of the high-frequency metal layer 352, i.e., the high-frequency metal layer 352 is located between the first grounding metal layer 353 and the second grounding metal layer 354, and the high-frequency metal layer 352 is insulated from the first grounding metal layer 353, the high-frequency metal layer 352 and the second grounding metal layer 354, respectively.

The first ground metal layer 353 is electrically connected to the third ground metal layer 355, and is electrically connected to the fifth ground metal layer 357 through the third ground metal layer 355; one side of the second grounding metal layer 354 is electrically connected to the third grounding metal layer 355, the other side of the second grounding metal layer 354 is electrically connected to the fourth grounding metal layer 356, and the fourth grounding metal layer 356 is electrically connected to the fifth grounding metal layer 357, so that the reference ground on the interposer 350 is the same reference ground. The back surface of interposer 350 is used to connect stud 318 and fifth ground metal 357 is electrically connected to stud 318, allowing interposer 350 to be referenced to header 310, helping to enhance the grounding effect of interposer 350.

In some embodiments, a half hole 3511 is formed at the top of the adapter plate body 351, a metal layer 3512 is disposed in the half hole 3511, one end of the metal layer 3512 is connected to the second grounding metal layer 354, and the other end of the metal layer 3512 is connected to the fifth grounding metal layer 357; when interposer 350 is disposed on stud 318, the other end of metal layer 3512 connects to stud 318. In some embodiments, half hole 3511 is disposed in the middle of the top of adapter plate body 351. The height of the upright post 318 is generally smaller than or equal to that of the adapter plate 350, and the edge of the upright post 318 is provided with an arc surface, so that the contact between the fifth grounding metal layer 357 and the upright post 318 is located in the center of the fifth grounding metal layer 357, the distance from the grounding metal layer on the front surface of the adapter plate body 351 to the upright post 318 is relatively large, the half holes 3511 and the metal layers 3512 arranged in the half holes 3511 are convenient for enhancing the grounding of the second grounding metal layer 354 and helping to shorten the electric connection distance between the second grounding metal layer 354 and the upright post 318, the grounding effect of the adapter plate 350 is further enhanced, the reflow distance of the high-frequency reflow ground on the adapter plate 350 is effectively controlled, and the grounding performance of the adapter plate 350 is ensured. Meanwhile, since the interposer body 351 is generally made of a ceramic material, the placement of the half hole 3511 on the top of the interposer body 351 and the placement of the metal layer 3512 in the half hole 3511 are easier to be implemented than the placement of the via hole on the interposer body 351 and the electrical connection of the front and back ground metal layers of the interposer body 351 through the via hole.

In the embodiment of the present application, in order to effectively control the routing distance from the interposer 350 to the laser chip 420, one end of the first connection portion 3521 extends to the junction between the front surface and the first side surface of the interposer body 351; in order to ensure the insulation effect between the first connection portion 3521 and the third grounding metal layer 355, a hollowed-out area 358 is disposed on the first side surface of the adapter plate body 351, the hollowed-out area 358 is located at a side edge of one end of the first connection portion 3521, and the hollowed-out area 358 is used for insulation between the first connection portion 3521 and the third grounding metal layer 355.

Fig. 29 is a front view showing a partial structure of a light emitting device provided according to some embodiments, fig. 30 is a schematic view showing a partial structure of a light emitting device provided according to some embodiments, and fig. 29 and 30 show an electrical connection relationship in the light emitting device. As shown in fig. 29 and 30, the first pin 314 and the second pin 315 are wire-bonded to two poles of the TEC330 for supplying power to the TEC 330; the capacitor 430 is mounted on the sixth metal layer 417, such that a first end of the capacitor 430 is electrically connected to the sixth metal layer 417, and a second end of the capacitor 430 is wire-bonded to the third pin 316; the thermistor 450 is mounted on the sixth metal layer 417, so that the first end of the thermistor 450 is electrically connected to the sixth metal layer 417, and the second end of the thermistor 450 is wire-bonded to the fourth pin 317; the other end of the second metal layer 413 is wire-bonded to the first connection portion 3521 at one end of the high-frequency metal layer 352; the end portion of the first metal layer 412 is connected to the second grounding metal layer 354 by wire bonding, and the end portion of the third metal layer 414 is connected to the first grounding metal layer 353 by wire bonding; the second connection portion 3522 of the high-frequency metal layer 352 is soldered to the high-frequency pin 312 by solder 359.

As shown in fig. 29 and 30, the light emitting device 300 provided by the embodiment of the present application further includes a backlight detector 360, where the backlight detector 360 is disposed on top of the TEC330 and below the laser chip 420, for detecting the reflected light power of the laser chip 420; the pins on header 310 further include fifth pins 319, which fifth pins 319 are disposed on the side of header body 311 where TEC330 is supported for wire bonding to backlight detector 360. Illustratively, the fifth pin 319 is located between the first pin 314 and the second pin 315 in the orientation shown in fig. 29 and 30.

As shown in fig. 30, the backlight detector 360 is obliquely disposed on top of the TEC330, that is, the top surface of the backlight detector 360 is not parallel to the top surface of the TEC330, so that the receiving optical axis of the backlight detector 360 is not parallel to the optical axis of the laser chip 420, which helps to avoid that crosstalk of optical signals emitted by the backlight detector 360 affects optical signals emitted by the laser chip 420. Illustratively, the inclination angle of the backlight detector 360 at the top of the TEC330 may be set to 3-7 °, for example, the inclination angle of the backlight detector 360 at the top of the TEC330 is 4 °, which not only ensures that the backlight detector 360 can fully receive the backlight of the laser chip 420, but also ensures the crosstalk prevention effect.

In some embodiments of the present application, the bonding pads of the backlight detector 360 face the fifth pin 319, facilitating wire bonding of the backlight detector 360 to the fifth pin 319. Illustratively, the sides of the backlight detector 360 are not parallel or perpendicular to the sides of the TEC330, i.e., the front-facing backlight detector 360 is rotated a certain angle and then placed on top of the TEC 330.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. An optical module, comprising:

a circuit board;

the optical transceiver component is electrically connected with the circuit board and comprises a light emitting device, and the light emitting device is used for receiving an optical signal;

The light emitting device comprises a tube seat, a laser component and an adapter plate, wherein the laser component and the adapter plate are arranged at the top of the tube seat, and the adapter plate is arranged at one side of the laser component;

The adapter plate comprises an adapter plate body, wherein a high-frequency metal layer, a first grounding metal layer and a second grounding metal layer are arranged on the front surface of the adapter plate body, the first grounding metal layer is positioned on one side of the high-frequency metal layer, and the second grounding metal layer is positioned on the other side of the high-frequency metal layer; the laser component is correspondingly connected with one ends of the high-frequency metal layer, the first grounding metal layer and the second grounding metal layer through wire bonding.

2. The optical module of claim 1, wherein the stem comprises a stem body and a post disposed on the stem body, the adapter plate having a height greater than or equal to a height of the post; the top of keysets sets up half hole, set up the metal level in the half hole, the one end electricity of metal level is connected the second ground connection metal level, the other end electricity is connected the stand.

3. The optical module of claim 2, wherein a third grounding metal layer is disposed on a first side of the interposer body, a fourth grounding metal layer is disposed on a second side of the interposer body, a fifth grounding metal layer is disposed on a back surface of the interposer body, the first grounding metal layer is electrically connected to the fifth grounding metal layer through the third grounding metal layer, the second grounding metal layer is electrically connected to the fifth grounding metal layer through the fourth grounding metal layer, and the interposer body is connected to the upright through the fifth grounding metal layer.

4. The optical module of claim 1, wherein the laser assembly comprises a substrate and a laser chip, the laser chip mounted on the substrate;

the substrate comprises a substrate body, wherein a first metal layer, a second metal layer, a third metal layer, a fourth metal layer and a fifth metal layer are arranged on the front surface of the substrate body, the second metal layer is positioned between the first metal layer and the third metal layer, and the fourth metal layer is positioned at one end of the second metal layer and is connected with the first metal layer and the third metal layer;

The laser chip is mounted on the fourth metal layer, an EA positive electrode wire of the laser chip is connected with the second metal layer, and a DFB positive electrode wire of the laser chip is connected with the fifth metal layer;

the first metal layer wire bonding is connected with the second grounding metal layer, the second metal layer wire bonding is connected with the high-frequency metal layer, the third metal layer wire bonding is connected with the first grounding metal layer, and the high-frequency metal layer is welded and connected with a high-frequency pin on the tube seat.

5. The optical module of claim 4, wherein the header further comprises a high frequency pin embedded in the header body, the high frequency metal layer comprising a first connection portion, a second connection portion, and a third connection portion; the end part of the first connecting part is close to the first side surface of the adapter plate body, the second connecting part is positioned at the bottom of the adapter plate body, and the third connecting part is connected with the first connecting part and the second connecting part;

the first connecting part is connected with the second metal layer in a wire bonding way, and the second connecting part is connected with the high-frequency pin in a welding way;

the width of the second connecting portion is larger than that of the first connecting portion.

6. The optical module of claim 4, wherein the substrate body further has first and second bonding pads thereon, the laser assembly further comprising a matching resistor;

The first bonding pad wire is connected with the EA positive electrode of the laser chip, the first end of the matching resistor is electrically connected with the first bonding pad, the second end of the matching resistor is connected with the second bonding pad, and the second bonding pad is connected with the fourth metal layer through a plurality of gold wire wires.

7. The optical module of claim 4, wherein the front side of the substrate body is further provided with a sixth metal layer, the sixth metal layer being electrically connected to the fourth metal layer;

The laser assembly further comprises a thermistor and a capacitor, the thermistor and the capacitor are mounted on the sixth metal layer, the first end of the thermistor is electrically connected with the sixth metal layer, the first end of the capacitor is electrically connected with the sixth metal layer, and the second end of the capacitor is connected with the fifth metal layer in a wire bonding mode.

8. The light module of claim 1 wherein the light emitting device further comprises a TEC disposed on top of the header and a base disposed on top of the TEC, the laser assembly being attached to a side of the base.

9. The light module of claim 8, wherein the light emitting device further comprises a backlight detector disposed obliquely on top of the TEC, the backlight detector having pads near sides of the TEC.

10. The optical module of claim 5, wherein a hollowed-out area is disposed on the first side of the interposer body, the hollowed-out area being located at a side edge of one end of the first connection portion.