WO2024088208A1 - 电子设备及电子设备组件 - Google Patents

电子设备及电子设备组件 Download PDF

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Publication number
WO2024088208A1
WO2024088208A1 PCT/CN2023/125901 CN2023125901W WO2024088208A1 WO 2024088208 A1 WO2024088208 A1 WO 2024088208A1 CN 2023125901 W CN2023125901 W CN 2023125901W WO 2024088208 A1 WO2024088208 A1 WO 2024088208A1
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WO
WIPO (PCT)
Prior art keywords
microphone
circuit board
electronic device
signal
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/125901
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English (en)
French (fr)
Inventor
林汉众
刘凯
周伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2024088208A1 publication Critical patent/WO2024088208A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2430/00—Signal processing covered by H04R, not provided for in its groups

Definitions

  • the present application belongs to the field of electronic technology, and specifically relates to an electronic device and an electronic device component.
  • the microphone signal when transmitted through the microphone wiring inside the electronic device, it is susceptible to interference such as antenna radiation interference inside the electronic device and printed circuit board wiring coupling interference.
  • the embodiments of the present application provide an electronic device and an electronic device component, which solve the technical problem that the microphone wiring of the electronic device is easily disturbed when an external headset is connected to the electronic device.
  • an embodiment of the present application proposes an electronic device, comprising: a first circuit board, a second circuit board and a flexible circuit board; an audio codec is provided on the first circuit board, and an external interface is provided on the second circuit board; the audio codec comprises a first microphone terminal and a second microphone terminal; wherein the first microphone terminal is connected to the external interface via a first wiring, and part of the first wiring is located on the flexible circuit board; the second microphone terminal is connected to the second wiring, and part of the second wiring is located on the flexible circuit board; the first microphone terminal is used to receive a first signal transmitted by the first wiring, and the second microphone terminal is used to receive a first signal transmitted by the first wiring, and the second microphone terminal is used to receive a first signal transmitted by the first wiring.
  • the microphone end is used for receiving the second signal transmitted by the second line, and the audio codec is used for performing differential processing on the first signal and the second signal.
  • an embodiment of the present application proposes an electronic device component, comprising: headphones and the electronic device according to the first aspect; the headphones include a microphone; wherein, when the headphones are connected to an external interface of the electronic device, a signal from the microphone is transmitted to the first microphone end of the audio codec via the first wiring.
  • an electronic device includes a first circuit board, a second circuit board and a flexible circuit board; an audio codec is provided on the first circuit board, and an external interface is provided on the second circuit board; the audio codec includes a first microphone terminal and a second microphone terminal; wherein the first microphone terminal is connected to the external interface through a first line, and part of the first line is located on the flexible circuit board; the second microphone terminal is connected to the second line, and part of the second line is located on the flexible circuit board; the first microphone terminal is used to receive a first signal transmitted by the first line, and the second microphone terminal is used to receive a second signal transmitted by the second line, and the audio codec is used to perform differential processing on the first signal and the second signal.
  • the first signal transmitted by the first line and the second signal transmitted by the second line are both interfered in the area where the flexible circuit board is located, and then when the audio codec performs differential processing on the first signal and the second signal, it can partially or completely offset the interference of the first signal and the second signal in the area where the flexible circuit board is located, thereby improving the anti-interference ability of the microphone line of the electronic device to a certain extent.
  • FIG1 is a schematic diagram of an electronic device assembly of the prior art
  • FIG2 is a schematic diagram of an electronic device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of another electronic device provided in an embodiment of the present application.
  • FIG4 is a schematic diagram of an electronic device assembly provided in an embodiment of the present application.
  • FIG5 is a schematic diagram of another electronic device assembly provided in an embodiment of the present application.
  • FIG6 is a schematic diagram of another electronic device assembly provided in an embodiment of the present application.
  • FIG7-1 is a schematic diagram of another electronic device assembly provided in an embodiment of the present application.
  • FIG7-2 is a schematic diagram of an earphone provided in an embodiment of the present application.
  • FIG7-3 is a schematic diagram of an electronic device provided in an embodiment of the present application.
  • first and second in the specification and claims of this application may explicitly or implicitly include one or more of the features.
  • plural means two or more.
  • and/or in the specification and claims may include one or more of the features.
  • Or means at least one of the connected objects, and the character “/” generally means that the previously and subsequently associated objects are in an “or” relationship.
  • connection should be understood in a broad sense, for example, it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components.
  • connection should be understood in a broad sense, for example, it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two components.
  • the microphone path in the mobile phone is relatively sensitive and easily interfered.
  • the connection between the headphone mic and the mobile phone Take the connection between the headphone mic and the mobile phone as an example.
  • the headphone mic transmits the microphone signal to the mobile phone through a single line.
  • the single line of the headphone mic is in a radiation state and is prone to generate interference signals such as induced voltage, which leads to frequent electromagnetic interference problems in the headphone mic.
  • the microphone differential input port can be designed in the audio codec 202 on the first circuit board 230 of the mobile phone 200: the microphone positive terminal (i.e., MIC_P port) and the microphone negative terminal (i.e., MIC_N port).
  • the microphone positive terminal (i.e., MIC_P port) of the audio codec 202 is connected to the positive electrode (i.e., VP port) of the microphone 101 through the microphone positive input differential wiring 203, and the microphone bias voltage port (i.e., MIC_BIAS port) is connected to the microphone positive input differential wiring 203 through the first impedance R1; the microphone negative terminal (i.e., MIC_N port) of the audio codec 202 is connected to the microphone bias voltage port (i.e., MIC_BIAS port) through the microphone negative input differential wiring 204; the negative electrode (i.e., VN port) of the microphone 101 is grounded.
  • the signal transmitted by the microphone positive input differential routing 203 can be used as the input of the microphone positive terminal (i.e., MIC_P port), and the signal transmitted by the microphone negative input differential routing 204 can be used as the input of the microphone negative terminal (i.e., MIC_N port), forming a differential feedback design, and then by subtracting the microphone positive input signal from the microphone negative input signal to obtain the microphone signal, the noise generated on the microphone bias voltage terminal (MIC_BIAS) can be offset.
  • the microphone positive input differential routing 203 can be used as the input of the microphone positive terminal (i.e., MIC_P port)
  • the signal transmitted by the microphone negative input differential routing 204 can be used as the input of the microphone negative terminal (i.e., MIC_N port)
  • MIC_BIAS microphone bias voltage terminal
  • the applicant has noticed that, as shown in FIG. 1 , since the microphone negative input differential trace 204 is disposed in the area where the first circuit board 230 is located, only the first circuit board 230 can be offset during differential processing. Noise on the microphone bias voltage port (i.e., MIC_BIAS port) in the area.
  • the earphone interface 201 is located in the area where the second circuit board 210 at the bottom of the mobile phone is located, and the audio codec 230 is located in the area where the first circuit board 230 is located.
  • the microphone positive input differential routing 203 passes through the second circuit board 210, the flexible circuit board 220, and the first circuit board 230 of the mobile phone in turn, resulting in the microphone positive input differential routing 203 being relatively long and susceptible to interference such as radiation antenna interference and printed circuit board routing coupling interference inside the mobile phone.
  • the microphone positive signal in the microphone positive input differential routing 203 is affected by the low-frequency interference signal (e.g., noise signal N) generated in the area where the second circuit board and the flexible circuit board are located, the microphone positive signal will carry the interference signal N into the microphone positive end (i.e., MIC_P port).
  • the microphone negative input differential routing does not pass through the area where the second circuit board and the flexible circuit board of the mobile phone are located, the noise N coupled into the microphone positive signal during the microphone positive input differential routing cannot be offset, resulting in the subsequent noise signal being demodulated and amplified, affecting the call quality of the microphone.
  • the present application provides an electronic device.
  • the overall concept of the present application is that compared with the related art of arranging the microphone negative input differential trace in the first circuit board area, the microphone negative input differential trace is extended and stretched to the area where the second circuit board is located (refer to Figure 4), or the microphone negative input differential trace is extended and stretched to the area where the external interface is located (refer to Figure 6), which greatly lengthens the coupling length of the microphone positive input differential trace and the microphone negative input differential trace, so that the microphone positive input differential trace and the microphone negative input differential trace can be interfered in the coupling length part, and the interference signal can be partially or completely offset in the subsequent differential processing of the audio codec, thereby improving the anti-interference ability of the microphone trace of the electronic device.
  • a typical application scenario of the electronic device provided by the present application may be: when the electronic device is connected to the headphone microphone, the anti-interference capability of the microphone routing is improved by designing a differential routing for the microphone path between the electronic device and the headphone microphone.
  • the application scenario of the electronic device provided by the present application may also be to improve the anti-interference capability between the electronic device and other types of microphones of the peripheral device, etc., and the present application does not make any specific restrictions here.
  • the electronic device 300 provided in the embodiment of the present application may include:
  • the flexible circuit board 330 can be arranged between the first circuit board 310 and the second circuit board 320, or can be arranged in the direction of the first circuit board 310 away from the second circuit board 320, or can be arranged in the direction of the second circuit board 320 away from the first circuit board 310.
  • the present application does not limit the specific setting position of the flexible circuit board 330.
  • the electronic device 300 may include a differential line 302, and the differential line 302 includes a first line 3021 and a second line 3022.
  • the first signal transmitted by the first line 3021 is used as the input of the first microphone terminal a
  • the second signal transmitted by the second line 3022 is used as the input of the second microphone terminal b.
  • the first line 3021 and the second line 3022 can both be understood as microphone lines.
  • the first line 3021 extends through the flexible circuit board 330 and is connected to the first microphone terminal a
  • the second line 3022 extends through the flexible circuit board 330 and is connected to the second microphone terminal b. Since the first line 3021 and the second line 3022 extend through the flexible circuit board 330, the first signal transmitted by the first line and the second signal transmitted by the second line are both interfered in the area where the flexible circuit board is located.
  • the first routing line 3021 and the second routing line 3022 can be straight and arranged in parallel and close to each other, so that the distance between the first routing line 3021 and the second routing line 3022 is less than a threshold value, so that the first signal transmitted by the first routing line and the second signal transmitted by the second routing line are subject to the same interference in the area where the flexible circuit board is located.
  • the microphone path between the first and second circuit boards 3021 and 3022 may include a first line 3021 and a second line 3022, and the first line 3021 may pass through the area where the second circuit board 320, the flexible circuit board 330 and the first circuit board 310 are located.
  • the first line 3021 may also pass through the area where the second circuit board 320, the flexible circuit board 330 and the first circuit board 310 are located.
  • the first line 3021/the second line 3022 may be coupled in the area where the second circuit board 320 is located, and may also be coupled in the area where the first circuit board 310 is located.
  • the first line/the second line may be interfered in the coupling part.
  • the first microphone terminal a can be the positive terminal of the microphone or the negative terminal of the microphone.
  • the second microphone terminal b is the negative terminal of the microphone.
  • the audio codec 301 is used to perform differential processing on the first signal transmitted by the first microphone terminal and the second signal transmitted by the second microphone terminal to obtain a processed microphone signal: 1/2*(first signal-second signal).
  • the first microphone terminal a is the negative terminal of the microphone
  • the second microphone terminal b is the positive terminal of the microphone.
  • the audio codec 301 is used to perform differential processing on the second signal transmitted by the second microphone terminal and the first signal transmitted by the first microphone terminal to obtain a processed microphone signal: 1/2*(second signal-first signal).
  • the following is an example in which the first microphone terminal a is the positive terminal of the microphone.
  • the first line 3021 can be a microphone positive input differential line
  • the second line 3022 can be a microphone negative input differential line.
  • the first line and the second line in the differential line 302 are coupled in the area where the flexible circuit board 330 is located, and the first line and the second line may be subject to the same (same direction, same amplitude) interference in the coupled part, so that the first signal transmitted by the first line and the first signal transmitted by the second line carry the same interference signal when passing through the flexible circuit board 330.
  • the interference N on the microphone path will be loaded onto the first line 3021 and the second line 3022 at the same time, so that the first signal transmitted on the first line 3021 will carry the interference signal N1, and the second signal transmitted on the second line 3022 will carry the interference signal N2, and then the audio codec 301 will react to the first signal input by the first microphone terminal a and the second signal input by the second microphone terminal b.
  • the noise Nin in the microphone signal collected by the audio codec 301 is N1-N2 ⁇ 0, which can completely offset the interference of the first signal and the second signal in the area where the flexible circuit board is located, thereby improving the anti-interference capability of the microphone trace of the electronic device.
  • the electronic device includes a first circuit board, a second circuit board and a flexible circuit board; an audio codec is arranged on the first circuit board, and an external interface is arranged on the second circuit board; the audio codec includes a first microphone terminal and a second microphone terminal; wherein the first microphone terminal is connected to the external interface through a first line, and part of the first line is located on the flexible circuit board; the second microphone terminal is connected to the second line, and part of the second line is located on the flexible circuit board; the first microphone terminal is used to receive a first signal transmitted by the first line, and the second microphone terminal is used to receive a second signal transmitted by the second line, and the audio codec is used to perform differential processing on the first signal and the second signal.
  • the first signal transmitted by the first line and the second signal transmitted by the second line are both interfered in the area where the flexible circuit board is located, and then when the audio codec performs differential processing on the first signal and the second signal, it can partially or completely offset the interference of the first signal and the second signal in the area where the flexible circuit board is located, thereby improving the anti-interference ability of the microphone line of the electronic device to a certain extent.
  • the present application can be understood as lengthening the length of the second line 3022, which can not only offset the interference received by the microphone line on the first circuit board, but also further offset the interference received by the microphone line on the flexible circuit board.
  • the interference received by the microphone line of the electronic device is further improved.
  • the present application can further offset the interference received by the microphone line on the second circuit board; when the second line 3022 is also connected to the external interface and the microphone, the present application can further offset the interference received by the microphone line on the external interface and the microphone. For details, see below.
  • the electronic device considering the application scenarios of some microphones (such as microphones built into 3.5 mm (millimeter, mm) headphones), it is not allowed to make design changes to the external interface of the electronic device (such as the 3.5 mm headphone jack).
  • the electronic device provided in the embodiment of the present application can improve the second wiring alone without changing the external interface of the electronic device and the headphones at the same time.
  • Figures 2, 4 and 5 are examples.
  • the electronic device 300 provided in the embodiment of the present application may include:
  • One end of the first trace 3021 is connected to the external interface 303, and the other end of the first trace 3021 is connected to the first microphone terminal a; one end of the second trace 3022 is connected to the second microphone terminal b, and the other end of the second trace 302 is grounded through the second circuit board 320.
  • the first microphone terminal is connected to the external interface 303 through the first wiring 3021; wherein the first signal transmitted by the first wiring 3021 is used as the input of the first microphone terminal a, and the second signal transmitted by the second wiring 3022 is used as the input of the second microphone terminal b; wherein the first wiring 3021 extends through the flexible circuit board 330 and is connected to the first microphone terminal a, and the second wiring 3022 extends through the flexible circuit board 330 and is connected to the second microphone terminal b.
  • one end of the second wiring 3022 is connected to the second microphone terminal (MIC_N port), and the other end of the second wiring 3022 is connected to the second microphone terminal (MIC_N port). Grounding; wherein the location where the second trace 3022 is grounded is located in the area where the second circuit board 320 is located.
  • the other end of the second wiring 3022 can be directly grounded or grounded through the fourth impedance R4 (refer to FIG. 5 ), and this application does not make specific restrictions.
  • the specific impedance of the fourth impedance R4 can be adjusted and determined according to the actual impedance of the microphone 401, and this application does not make specific restrictions.
  • the interference N on the microphone path when the interference N on the microphone path is simultaneously loaded onto the first wiring 3021 and the second wiring 3022, the first signal transmitted on the first wiring 3021 will carry the interference signal N1, and the second signal transmitted on the second wiring 3022 will carry the interference signal N2.
  • the audio codec 301 performs subtraction processing on the first signal input by the first microphone terminal a and the second signal input by the second microphone terminal b, the noise Nin in the microphone signal collected by the audio codec 301 is N1-N2, so that the interference received by the first signal and the second signal in the area where the second circuit board 320 and the flexible circuit board 330 are located can be partially offset or completely offset.
  • the solution provided in the embodiment of the present application does not require any changes to the external interface 303, the adapter interface 402 and the microphone 401 in terms of the hardware connection relationship, and has a wider scope of application and operability, and is applicable to scenarios where the external interface of the electronic device is a 3.5mm headphone jack, a Type-C type interface, or other interface.
  • the electronic device further includes a power supply terminal 3101, which is arranged on the first circuit board 310 and is used to power the microphone 401.
  • the power supply terminal 3101 can be specifically a microphone bias voltage port MIC_BIAS.
  • the power supply terminal 3101 can be arranged on the first circuit board
  • the audio codec 301 on the first circuit board may also be set at other locations on the first circuit board, and the present application does not impose any specific limitation on this.
  • a power supply terminal 3101 is disposed on the first circuit board 310 .
  • the power supply terminal 3101 is connected to the first trace 3021 through a first impedance R1 , and is connected to the second trace 3022 through a second impedance R3 .
  • the power supply end 3101 can be directly connected to the second line 3022, or the power supply end 3101 can be connected to the second line 3022 through an impedance, and the present application does not make any specific restrictions here.
  • the power supply end can be a microphone bias voltage port (MIC_BIAS), and the power supply end is also connected to the second line 3022 through a second impedance R3.
  • MIC_BIAS microphone bias voltage port
  • the first microphone input terminal (MIC_P port) of the audio codec 301 collects the first signal input by the first wire 3021, and the path where the first wire 3021 is located is recorded as the microphone positive input path, and the microphone positive input path includes the power supply terminal (MIC_BIAS port), the first impedance R1, the first wire 3021 and the microphone 401, and the ground terminal.
  • the second microphone input terminal (MIC_N port) of the audio codec 301 collects the second signal transmitted by the second wire 3022.
  • the path where the second wire 3021 is located is recorded as the microphone negative input path, and the microphone negative input path includes the power supply terminal (MIC_BIAS port), the second impedance R3, the second wire 3021 and the fourth impedance R4, and the ground terminal.
  • the impedance in the embodiments of the present application may include resistance, resistance and capacitance, resistance and inductance, etc., and the present application does not impose any specific limitations.
  • the impedance value of the first impedance R1 may be equal to the impedance value of the second impedance R3, and both the first impedance R1 and the second impedance R3 may be disposed on the first circuit board 310.
  • the impedance value of the first impedance R1 is equal to the impedance value of the second impedance R3
  • the voltage value of the first signal input to the audio codec by the first wiring 3021 is as close as possible to the voltage value of the second signal input to the audio codec by the second wiring 3022.
  • the audio codec 301 When the audio codec 301 receives the voltage value of the first signal input to the first wiring 3021 and the voltage value of the second signal input to the audio codec by the second wiring 3022, the first signal input to the first wiring 3021 is equal to the voltage value of the second signal input to the audio codec by the second wiring 3022.
  • the accuracy of the microphone signal can be improved when the voltage value of the signal is processed differentially.
  • the first signal can be expressed as V1+N1
  • V1 represents the voltage value of the first signal under ideal (no interference) conditions
  • N1 represents the interference suffered by the first signal
  • the second signal can be expressed as -V2+N2
  • -V2 represents the voltage value of the second signal under ideal (no interference) conditions
  • N2 represents the interference suffered by the second signal.
  • the impedance value of the first impedance R1 is equal to the impedance value of the second impedance R3
  • the magnitude of V1 is approximately equal to the magnitude of V2
  • the microphone signal obtained after differential processing by the audio codec 301 can be V1+1/2*Nin.
  • Nin is approximately equal to 0, and the microphone signal obtained after processing may be V1, thereby improving the accuracy of the microphone signal.
  • the impedance value of the fourth impedance R4 can be equal to the impedance value of the microphone 401, so that the voltage value of the first signal transmitted from the first line 3021 to the audio codec is as close as possible to the voltage value of the second signal transmitted from the second line 3022 to the audio codec, and when the audio codec 301 performs differential processing on the voltage value of the signal input from the first line 3021 and the voltage value of the signal input from the first line 3021, the accuracy of the microphone signal can be improved.
  • the magnitude of V1 is approximately equal to the magnitude of V2
  • the microphone signal obtained after differential processing by the audio codec 301 can be V1+1/2*Nin.
  • Nin is approximately equal to 0, and the microphone signal obtained after processing can be V1, which improves the accuracy of the microphone signal.
  • the electronic device provided in the embodiment of the present application can improve the second wiring 3022 and the external interface 303 at the same time, and improve the hardware connection relationship between the second wiring 3022 and the external interface 303.
  • 303 is connected to connect the second line 3022 to an external device (e.g., a built-in microphone 401 of a headset).
  • an external device e.g., a built-in microphone 401 of a headset.
  • it is equivalent to extending the differential line 302 to the microphone 401 of the external device, which can further offset the interference signal in the area where the microphone 401 is located and the area where the external interface 303 is located, and further improve the anti-interference ability of the path where the microphone line of the electronic device is located.
  • FIG. 3, FIG. 6 and FIG. 7-1 The following is an example of FIG. 3, FIG. 6 and FIG. 7-1.
  • the electronic device 200 provided in the embodiment of the present application may include:
  • the first microphone terminal a is used to receive a first signal transmitted by the first wire 3021
  • the second microphone terminal b is used to receive a second signal transmitted by the second wire 3022
  • the audio codec 301 is used to perform differential processing on the first signal and the second signal.
  • the first signal transmitted by the first wiring 3021 is used as the input of the first microphone terminal a
  • the second signal transmitted by the second wiring 3022 is used as the input of the second microphone terminal b
  • the first wiring 3021 extends through the flexible circuit board 330 and is connected to the first microphone terminal a
  • the second wiring 3022 extends through the flexible circuit board 330 and is connected to the second microphone terminal b.
  • the first line 3021 can be a microphone positive input differential line
  • the second line 3022 can be a microphone negative input differential line. Since the first line 3021 and the second line 3022 both extend through the flexible circuit board 330, and the distance between the first line 3021 and the second line 3022 is less than the threshold, the first line and the second line in the differential line 302 are coupled in the area where the flexible circuit board 330 is located. The coupling part may be interfered with, so that the signal transmitted by the first line and the signal transmitted by the second line receive interference signals.
  • the interference N on the microphone path will be loaded onto the first wiring 3021 and the second wiring 3022 at the same time, so that the first signal transmitted on the first wiring 3021 will carry the interference signal N1, and the second signal transmitted on the second wiring 3022 will carry the interference signal N2.
  • the audio codec 301 performs differential processing on the first signal input by the first microphone end a and the second signal input by the second microphone end b
  • the noise Nin in the microphone signal collected by the audio codec 301 is N1-N2, so that the interference received by the first signal and the second signal in the area where the second circuit board 320 and the flexible circuit board 330 are located can be partially or completely offset, thereby improving the anti-interference capability of the microphone wiring of the electronic device.
  • the differential trace 302 is coupled on the entire microphone path from the external interface 303 to the audio codec 301. Even as shown in FIG6 , when the electronic device 300 is connected to the microphone 401, the first trace in the differential trace is connected to the positive electrode of the microphone 401, and the second trace in the differential trace is connected to the negative electrode of the microphone 401.
  • the differential trace design includes the entire microphone path from the microphone 401 to the audio codec 301, and thus can offset the interference of the first signal and the second signal on the microphone 401, the second circuit board 320, the flexible circuit board 330 and the first circuit board 310 (i.e., the entire microphone path), further improving the anti-interference ability of the path where the microphone trace of the electronic device is located.
  • the third impedance R2 is equal to the first impedance R1 , and both the first impedance R1 and the third impedance R2 are disposed on the first circuit board 310 .
  • the impedance value of the first impedance R1 is equal to the impedance value of the third impedance R2
  • the voltage value of the first signal input to the audio codec by the first wiring 3021 is as close as possible to the voltage value of the second signal input to the audio codec by the second wiring 3022.
  • the audio codec 301 performs differential processing on the voltage value of the first signal input to the first wiring 3021 and the voltage value of the second signal input to the second wiring 3022, the accuracy of the microphone signal can be improved.
  • the first signal can be expressed as V1+N1
  • V1 represents the voltage value of the first signal under ideal (no interference) conditions
  • N1 represents the interference suffered by the first signal
  • the second signal can be expressed as -V2+N2
  • -V2 represents the voltage value of the second signal under ideal (no interference) conditions
  • N2 represents the interference suffered by the second signal.
  • the impedance value of the first impedance R1 is equal to the impedance value of the third impedance R2
  • the magnitude of V1 is approximately equal to the magnitude of V2
  • the microphone signal obtained after differential processing by the audio codec 301 can be V1+1/2*Nin.
  • the size of N1 is approximately equal to the size of N2
  • Nin is approximately equal to 0
  • the microphone signal obtained after processing can be V1, thereby improving the accuracy of the microphone signal.
  • the external interface 303 may be a Type-C interface.
  • the Type-C interface has 24 pins, wherein any one of the idle pins such as 4 ground pins (A1 pin/B pin 1/B12 pin/A12 pin) and 4 data pins (B2 pin/B3 pin/A2 pin/A3 pin) may be used as the second pin b1.
  • the external interface 303 generally includes an idle ground pin, and the second pin b1 may be a ground pin.
  • the first pin may be an SBU1/2 (Side Band Use) pin
  • the second pin may be a B1 pin
  • the second trace 3022 of the electronic device 300 is connected to the B1 pin of the Type-C interface, thereby realizing a differential design of the entire microphone path.
  • the second pin may not only be a ground pin, but also other idle pins on the external interface, and this application does not make any specific restrictions here.
  • an embodiment of the present application further provides an electronic device component.
  • the electronic device component provided by the embodiment of the present application may include: headphones 400 and the electronic device 300 provided by any of the above embodiments; the headphones 400 include a microphone 401; wherein, when the headphones 400 are connected to the external interface 303 of the electronic device 300, the signal from the microphone 401 is transmitted to the first microphone terminal a of the audio codec 301 via the first wiring 3021.
  • the electronic device assembly provided according to the embodiment of the present application includes earphones and the electronic device provided by any of the above embodiments; the earphones include a microphone; wherein, when the earphones are connected to the external interface of the electronic device, the signal from the microphone is transmitted to the first microphone end of the audio codec via the first wiring.
  • the interference of the first signal and the second signal in the area where the flexible circuit board is located can be partially or completely offset, thereby improving the anti-interference ability of the microphone wiring of the electronic device to a certain extent.
  • the earphone 400 in the electronic device assembly shown in FIG. 4 or FIG. 5, the earphone 400 may be a 3.5mm earphone, the external interface 303 may be a 3.5mm earphone jack, and the adapter interface 402 may be a 3.5mm earphone plug.
  • the earphone 400 may be a Type-C earphone, and both the external interface 303 and the adapter interface 402 may be Type-C interfaces.
  • the second routing of the electronic device is improved, and there is no need to change the external interface 303, the adapter interface 402, and the microphone 401 in terms of the hardware connection relationship.
  • the scope of application and operability are wider, and it is applicable in scenarios where the external interface of the electronic device is a 3.5mm earphone jack, a Type-C type interface, or the like.
  • the electronic device assembly provided by the embodiment shown in FIG. 5 does not need to change the hardware connection relationship between the external interface of the electronic device and the headset.
  • the second wiring 3022 is extended to the area where the second circuit board is located, so that the first wiring and the second wiring are both connected to the second circuit board and the flexible electrical
  • the area where the circuit board and the first circuit board are located is coupled and interfered.
  • the interference signals received by the first and second routing lines in the coupling length portion can be offset, thereby improving the anti-interference capability of the microphone routing of the electronic device.
  • the earphone 400 may be a Type-C earphone.
  • Both the external interface 303 and the adapter interface 402 may be Type-C interfaces, and the Type-C interface includes a plurality of ground pins; the second pin b1 may be any one of the plurality of ground pins, and the second matching pin b2 may be any one of the plurality of ground pins.
  • the differential design of the electronic device assembly includes the entire microphone path from the microphone 401 to the audio codec 301, thereby offsetting interference on the entire microphone path, further enhancing the anti-interference capability of the path where the microphone wiring of the electronic device is located.
  • the earphone 400 further includes an adapter interface 402 that matches the external interface 303, the adapter interface 402 has a first matching pin a2 and a second matching pin b2, the first matching pin a2 corresponds to the first pin a1, and the second matching pin b2 corresponds to the second pin b1.
  • b1 corresponds to; when the earphone 400 is connected to the external interface 303 of the electronic device 300, one end of the microphone 401 is connected to the first microphone end a of the audio codec 301 through the first matching pin a2 of the adapter interface 402, the first pin a1 of the external interface 303, and the first wiring 3021 in sequence; when the earphone 400 is connected to the external interface 303 of the electronic device 300, the other end of the microphone 401 is connected to the second microphone end b of the audio codec 301 through the second matching pin b2 of the adapter interface 402, the second pin b1 of the external interface 303, and the second wiring 3022 in sequence.
  • the differential routing design of the electronic device assembly includes the entire microphone path from the microphone 401 to the audio codec 301, thereby canceling the first signal and the second signal on the microphone 401, the second circuit board 320, the flexible circuit board 330 and the first circuit board 310.
  • the interference received on the entire microphone path further enhances the anti-interference capability of the path where the microphone of the electronic device is located.
  • the electronic device component provided by the embodiment shown in Figure 7-1 changes the hardware connection relationship between the external interface of the electronic device and the earphone, and designs the entire microphone path between the electronic device 300 and the microphone 401 as a differential routing.
  • the interference received by the entire microphone path can be offset, further improving the anti-interference ability of the path where the microphone routing of the electronic device is located.
  • the earphone 400 may also include a first speaker SPK2 and a second speaker SPK3, the positive pole of the first speaker SPK2 is connected to the left channel port (HPL_L) of the audio codec 301 through the Type-C interface, the positive pole of the second speaker SPK3 is connected to the right channel port (HPL_R) of the audio codec 301 through the Type-C interface, and the negative pole of the first speaker SPK2 and the negative pole of the second speaker SPK3 are grounded through the Type-C interface.
  • HPL_L left channel port
  • HPL_R right channel port
  • Figure 7-2 can be a specific Type-C headset in the electronic device assembly shown in Figure 7-1
  • Figure 7-3 can be a specific electronic device with a Type-C interface in the electronic device assembly shown in Figure 7-1.
  • the positive electrode of the microphone 401 is connected to the MIC_P port of the audio codec 301 through the SBU1/2 pin of the Type-C interface 402, the SBU1/2 pin of the Type-C interface 303, and the first wiring 3021; the negative electrode of the microphone 401 is connected to the MIC_N port of the audio codec 301 through the B1 pin of the Type-C interface 402, the B1 pin of the Type-C interface 303, and the second wiring 3022.
  • the entire microphone path between the electronic device 300 and the microphone 401 is designed as a differential wiring, and the interference of the entire microphone path can be offset, further improving the anti-interference ability of the path where the microphone wiring of the electronic device is located.

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Abstract

一种电子设备(300)及电子设备组件，涉及电子技术领域。电子设备(300)包括：第一电路板(310)、第二电路板(320)和柔性电路板(330)；第一电路板(310)上设置有音频编解码器(301)，第二电路板(320)上设置有外接接口(303)；音频编解码器(301)包括第一麦克风端(a)和第二麦克风端(b)；其中，第一麦克风端(a)通过第一走线(3021)与外接接口(303)连接，第一走线(3021)的部分走线位于柔性电路板(330)；第二麦克风端(b)与第二走线(3022)连接，第二走线(3022)的部分走线位于柔性电路板(330)；第一麦克风端(a)用于接收第一走线(3021)传输的第一信号，第二麦克风端(b)用于接收第二走线(3022)传输的第二信号，音频编解码器(301)用于对第一信号和第二信号进行差分处理。

Description

电子设备及电子设备组件
交叉引用
本发明要求在2022年10月27日提交中国专利局、申请号为202211323829.6、发明名称为“电子设备及电子设备组件”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请属于电子技术领域，具体涉及一种电子设备及电子设备组件。
背景技术
在人们日常使用电子设备(例如手机、平板电脑等)的过程中，经常会使用耳机连接上电子设备，并使用耳机内置的麦克风进行语音通话。
然而，在麦克风信号通过电子设备内部的麦克风走线传输的过程中，容易受到诸如电子设备内部的天线辐射干扰、印制电路板走线耦合干扰等干扰。
发明内容
本申请实施例提供一种电子设备及电子设备组件，解决电子设备外接耳机时的麦克风走线容易受到干扰的技术问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提出了一种电子设备，包括：第一电路板、第二电路板和柔性电路板；第一电路板上设置有音频编解码器，第二电路板上设置有外接接口；音频编解码器包括第一麦克风端和第二麦克风端；其中，第一麦克风端通过第一走线与外接接口连接，第一走线的部分走线位于柔性电路板；第二麦克风端与第二走线连接，第二走线的部分走线位于柔性电路板；第一麦克风端用于接收第一走线传输的第一信号，第二麦 克风端用于接收第二走线传输的第二信号，音频编解码器用于对第一信号和第二信号进行差分处理。
第二方面，本申请实施例提出了一种电子设备组件，包括：耳机和根据第一方面所述的电子设备；所述耳机包括麦克风；其中，在所述耳机与所述电子设备的外接接口连接的情况下，来自所述麦克风的信号经由所述第一走线传输至所述音频编解码器的第一麦克风端。
在本申请实施例中，电子设备包括第一电路板、第二电路板和柔性电路板；第一电路板上设置有音频编解码器，第二电路板上设置有外接接口；音频编解码器包括第一麦克风端和第二麦克风端；其中，第一麦克风端通过第一走线与外接接口连接，第一走线的部分走线位于柔性电路板；第二麦克风端与第二走线连接，第二走线的部分走线位于柔性电路板；第一麦克风端用于接收第一走线传输的第一信号，第二麦克风端用于接收第二走线传输的第二信号，音频编解码器用于对第一信号和第二信号进行差分处理。如此，由于第一走线的部分走线和第二走线的部分走线均位于柔性电路板，使第一走线传输的第一信号和第二走线传输的第二信号在柔性电路板所在的区域均受到干扰，进而音频编解码器对第一信号和第二信号进行差分处理时，可以部分抵消或者全部抵消第一信号和第二信号在柔性电路板所在的区域受到的干扰，一定程度上提高了电子设备的麦克风走线的抗干扰能力。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是现有技术的一种电子设备组件的示意图；
图2是本申请实施例提供的一种电子设备的示意图；
图3是本申请实施例提供的另一种电子设备的示意图；
图4是本申请实施例提供的一种电子设备组件的示意图；
图5是本申请实施例提供的另一种电子设备组件的示意图；
图6是本申请实施例提供的另一种电子设备组件的示意图；
图7-1是本申请实施例提供的另一种电子设备组件的示意图；
图7-2是本申请实施例提供的一种耳机的示意图；
图7-3是本申请实施例提供的一种电子设备的示意图。
附图标记说明：
100-耳机；101-麦克风；102-耳机匹配接口；200-手机；201-耳机接口；
202-音频编解码器；203-麦克风正输入差分走线；204-麦克风负输入差分走线；210-第二电路板；220-柔性电路板；230-第一电路板；300-电子设备；301-音频编解码器；a-第一麦克风端、b-第二麦克风端；MIC_P-麦克风正端；MIC_N-麦克风负端；302-差分走线；3021-第一走线；3022-第二走线；303-外接接口；a1-第一引脚；b1-第二引脚；310-第一电路板；3101-供电端；MIC_BIAS-麦克风偏置电压端口；320-第二电路板；330-柔性电路板；400-耳机；401-麦克风；VP-麦克风正极；VN-麦克风负极；402-适配接口；a2-第一匹配引脚；b2-第二匹配引脚；R1-第一阻抗；R2-第三阻抗；R3-第二阻抗。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/ 或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“相连”、“连接”应做广义理解，例如，可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
随着手机支持数据连接类型的增多，各类干扰问题层出不穷，其中，手机中的麦克风通路比较敏感，容易受到干扰。以耳机麦连接到手机为例，在手机与耳机麦之间的连接通路中，由于布局限制，耳机麦通过单根走线向手机传输麦克风信号，这样耳机麦的单根走线处于辐射状态下容易产生感应电压等干扰信号，从而导致耳机麦经常出现电磁干扰的问题。
为了提升电子设备中麦克风走线的抗干扰能力，如图1所示，以耳机内置的麦克风101连接到手机200为例，相关技术中可以在手机200的第一电路板230上的音频编解码器202中设计麦克风差分输入端口：麦克风正端(即MIC_P端口)和麦克风负端(即MIC_N端口)。音频编解码器202的麦克风正端(即MIC_P端口)通过麦克风正输入差分走线203与麦克风101的正极(即VP端口)连接，麦克风偏置电压端口(即MIC_BIAS端口)通过第一阻抗R1连接到麦克风正输入差分走线203；音频编解码器202的麦克风负端(即MIC_N端口)通过麦克风负输入差分走线204与麦克风偏置电压端口(即MIC_BIAS端口)连接；麦克风101的负极(即VN端口)接地。其中，麦克风正输入差分走线203传输的信号可以作为麦克风正端(即MIC_P端口)的输入，麦克风负输入差分走线204传输的信号可以作为麦克风负端(即MIC_N端口)的输入，形成差分反馈设计，进而通过将麦克风正输入信号与麦克风负输入信号进行相减处理得到麦克风信号，可以抵消麦克风偏置电压端(MIC_BIAS)上产生的噪声。
然而，申请人注意到，如图1所示，由于麦克风负输入差分走线204设置在第一电路板230所在的区域，差分处理时仅可抵消第一电路板230所 在的区域中麦克风偏置电压端口(即MIC_BIAS端口)上的噪声。而在手机200的布局中，耳机接口201处于手机底部的第二电路板210所在的区域，而音频编解码器230位于第一电路板230所在的区域，麦克风正输入差分走线203依次通过手机的第二电路板210，柔性电路板220和第一电路板230所在的区域，导致麦克风正输入差分走线203比较长，容易受到手机内部诸如辐射的天线干扰和印刷电路板走线耦合干扰等干扰。当麦克风正输入差分走线203中的麦克风正极信号被第二电路板、柔性电路板所在区域产生的低频干扰信号(例如噪声信号N)影响时，麦克风正极信号会携带干扰信号N进入麦克风正端(即MIC_P端口)。而由于麦克风负输入差分走线未经过手机的第二电路板、柔性电路板所在的区域，麦克风正极信号经过麦克风正输入差分走线过程中耦合进去的噪声N不能被抵消，导致后续噪声信号被解调放大，影响麦克风的通话质量。
基于此，本申请提供一种电子设备，本申请总体构思在于：与相关技术将麦克风负输入差分走线布置在第一电路板区域相比，将麦克风负输入差分走线延长拉伸到第二电路板所在的区域(可参考图4)，或者将麦克风负输入差分走线延长拉伸到外接接口所在的区域(可参考图6)，大大加长了麦克风正输入差分走线和麦克风负输入差分走线的耦合长度，从而麦克风正输入差分走线和麦克风负输入差分走线在耦合长度部分可以受到干扰，并且干扰信号可以在后续音频编解码器的差分处理中部分抵消或者全部抵消，提高了电子设备的麦克风走线的抗干扰能力。
需要指出的是，本申请提供的电子设备的典型应用场景可以是：在电子设备与耳机麦连接时，通过将电子设备与耳机麦之间的麦克风通路进行差分走线设计，提升麦克风走线的抗干扰能力。当然，本申请提供的电子设备的应用场景还可以是提升电子设备与外设的其他类型麦克风之间的抗干扰能力，等等，本申请在此不作具体限制。
下面将参照附图更详细地描述本申请的示例性实施例。
如图2或者图3所示，本申请实施例提供的电子设备300可以包括：
第一电路板310、第二电路板320和柔性电路板330；第一电路板310上设置有音频编解码器301，第二电路板320上设置有外接接口303；音频编解码器301包括第一麦克风端a、第二麦克风端b；其中，第一麦克风端a通过第一走线3021与外接接口303连接，第一走线的部分走线位于柔性电路板330；第二麦克风端b与第二走线3022连接，第二走线的部分走线位于柔性电路板330；第一麦克风端a用于接收第一走线3021传输的第一信号，第二麦克风端b用于接收第二走线3022传输的第二信号，音频编解码器301用于对第一信号和第二信号进行差分处理。
在本申请实施例中，柔性电路板330可以设置在第一电路板310和第二电路板320之间，也可以设置在第一电路板310的远离第二电路板320的方向上，也可以设置在第二电路板320的远离第一电路板310的方向上，本申请对柔性电路板330的具体设置位置不作限制。
在本申请实施例中，电子设备300可以包括差分走线302，差分走线302包括第一走线3021和第二走线3022。其中，第一走线3021传输的第一信号作为第一麦克风端a的输入，第二走线3022传输的第二信号作为第二麦克风端b的输入。第一走线3021和第二走线3022均可以理解为麦克风走线。
其中，第一走线3021延伸经过柔性电路板330而与第一麦克风端a相连接，第二走线3022延伸经过柔性电路板330而与第二麦克风端b相连接。由于第一走线3021和第二走线3022延伸经过柔性电路板330，使第一走线传输的第一信号和第二走线传输的第二信号在柔性电路板所在的区域均受到干扰。
举例而言，在一个可选的例子中，在柔性电路板330上，第一走线3021和第二走线3022可以为直线且平行靠近设置，使第一走线3021和第二走线3022之间的距离小于阈值，以使第一走线传输的第一信号和第二走线传输的第二信号在柔性电路板所在的区域受到同样的干扰。
在本申请实施例中，参考图4和图6，音频编解码器301与麦克风401 之间的麦克风通路可以包括第一走线3021和第二走线3022，第一走线3021可以经过第二电路板320，柔性电路板330和第一电路板310所在的区域。第一走线3021也可以经过第二电路板320，柔性电路板330和第一电路板310所在的区域。能够理解的是，第一走线3021/第二走线3022在第二电路板320所在的区域可耦合，在第一电路板310所在的区域也可耦合。而第一走线/第二走线在耦合部分可以受到干扰。
在本申请实施例中，第一麦克风端a可以为麦克风正端，也可以为麦克风负端。在第一麦克风端a为麦克风正端时，第二麦克风端b为麦克风负端，此时音频编解码器301用于对第一麦克风端传输的第一信号和对第二麦克风端传输的第二信号进行差分处理，得到处理后的麦克风信号：1/2*(第一信号-第二信号)。在第一麦克风端a为麦克风负端时，第二麦克风端b为麦克风正端，此时音频编解码器301用于对第二麦克风端传输的第二信号和对第一麦克风端传输的第一信号进行差分处理后，得到处理后的麦克风信号：1/2*(第二信号-第一信号)。
下面以第一麦克风端a为麦克风正端为例进行举例说明。
在第一麦克风端a为麦克风正端的情况下，第一走线3021可以是麦克风正输入差分走线，第二走线3022可以是麦克风负输入差分走线。在一个具体的例子中，由于第一走线3021和第二走线3022均延伸经过柔性电路板330，且第一走线3021和第二走线3022之间的距离小于阈值，差分走线302中第一走线和第二走线在柔性电路板330所在的区域耦合，第一走线和第二走线在耦合部分可能受到同样(同向、等幅度)的干扰，使第一走线传输的第一信号和第二走线传输的第一信号在经过柔性电路板330时携带同样的干扰信号。
基于此，麦克风通路上的干扰N会同时加载到第一走线3021和第二走线3022上，使第一走线3021上传输的第一信号会携带干扰信号N1，第二走线3022上传输的第二信号会携带干扰信号N2，进而音频编解码器301对第一麦克风端a输入的第一信号和第二麦克风端b输入的第二信号 进行相减处理后，音频编解码器301采集到的麦克风信号中噪声Nin＝N1-N2，使第一信号和第二信号在柔性电路板所在的区域均受到的干扰可以被部分抵消或者全部抵消。
举例而言，在一个具体的例子中，在柔性电路板330上第一走线3021和第二走线3022比较靠近(两者之间的距离小于阈值)的情况下，N1≈N2，进而音频编解码器301对第一麦克风端a输入的第一信号和第二麦克风端b输入的第二信号进行相减处理后，音频编解码器301采集到的麦克风信号中噪声Nin＝N1-N2≈0，可以全部抵消第一信号和第二信号在柔性电路板所在的区域均受到的干扰，提升了电子设备的麦克风走线的抗干扰能力。
根据本申请实施例提供的电子设备，包括第一电路板、第二电路板和柔性电路板；第一电路板上设置有音频编解码器，第二电路板上设置有外接接口；音频编解码器包括第一麦克风端和第二麦克风端；其中，第一麦克风端通过第一走线与外接接口连接，第一走线的部分走线位于柔性电路板；第二麦克风端与第二走线连接，第二走线的部分走线位于柔性电路板；第一麦克风端用于接收第一走线传输的第一信号，第二麦克风端用于接收第二走线传输的第二信号，音频编解码器用于对第一信号和第二信号进行差分处理。如此，由于第一走线的部分走线和第二走线的部分走线均位于柔性电路板，使第一走线传输的第一信号和第二走线传输的第二信号在柔性电路板所在的区域均受到干扰，进而音频编解码器对第一信号和第二信号进行差分处理时，可以部分抵消或者全部抵消第一信号和第二信号在柔性电路板所在的区域受到的干扰，一定程度上提高了电子设备的麦克风走线的抗干扰能力。
能够理解的是，与相关技术(参考图1)中仅能抵消麦克风走线在第一电路板上麦克风偏置电压端(MIC_BIAS)上受到的干扰相比，本申请可以理解为拉长了第二走线3022的长度，不仅可以抵消麦克风走线在第一电路板上受到的干扰，还能够进一步抵消麦克风走线在柔性电路板上受 到的干扰，进一步提高了电子设备的麦克风走线的抗干扰能力。并且，在第二走线3022的部分走线还位于第二电路板上的情况下，本申请还可以更进一步抵消麦克风走线在第二电路板上受到的干扰；在第二走线3022还连接到外接接口和麦克风的情况下，本申请还可以更进一步抵消麦克风走线在外接接口和麦克风上受到的干扰，具体描述参见下文。
在一个具体的实施例中，考虑到一些麦克风(例如3.5毫米(millimeter，mm)耳机内置的麦克风)的应用场景，不允许对电子设备的外接接口(例如3.5mm耳机孔)进行设计变更，本申请实施例提供的电子设备可以单独对第二走线进行改进，而无需同时改变电子设备的外接接口和耳机。下面以图2、图4和图5为例进行举例说明。
如图4所示，本申请实施例提供的电子设备300可以包括：
第一电路板310、第二电路板320、柔性电路板330、音频编解码器301、差分走线302和外接接口303；音频编解码器301设置在第一电路板310上，外接接口303设置在第二电路板320上；音频编解码器301包括第一麦克风端a、第二麦克风端b；电子设备300可以包括差分走线302，差分走线302包括第一走线3021和第二走线3022。第一走线3021的一端与外接接口303相连接，第一走线3021的另一端与第一麦克风端a相连接；第二走线3022的一端与第二麦克风端b相连接，第二走线302的另一端通过第二电路板320接地。
在图5中，以第一麦克风端为麦克风正端(MIC_P端口)、第二麦克风端为麦克风负端(MIC_N端口)为例，第一麦克风端通过第一走线3021与外接接口303连接；其中，第一走线3021传输的第一信号作为第一麦克风端a的输入，第二走线3022传输的第二信号作为第二麦克风端b的输入；其中，第一走线3021延伸经过柔性电路板330而与第一麦克风端a相连接，第二走线3022延伸经过柔性电路板330而与第二麦克风端b相连接。
如图5所示，在本申请实施例提供的电子设备300中，第二走线3022的一端与第二麦克风端(MIC_N端口)相连接，第二走线3022的另一端 接地；其中，第二走线3022接地的位置位于第二电路板320所在的区域。
其中，在第二电路板320所在的区域上，第二走线3022的另一端可以直接接地，也可以通过第四阻抗R4接地(参考图5)，本申请不作具体限制。在第二走线3022的另一端通过第四阻抗R4接地的情况下，第四阻抗R4的具体阻抗可以根据麦克风401的实际阻抗进行调节确定，本申请不作具体限制。
这样，在麦克风通路上的干扰N会同时加载到第一走线3021和第二走线3022上的情况下，第一走线3021上传输的第一信号会携带干扰信号N1，第二走线3022上传输的第二信号会携带干扰信号N2，进而音频编解码器301对第一麦克风端a输入的第一信号和第二麦克风端b输入的第二信号进行相减处理后，音频编解码器301采集到的麦克风信号中噪声Nin＝N1-N2，使第一信号和第二信号在第二电路板320和柔性电路板330所在的区域受到的干扰可以被部分抵消或者全部抵消。
举例而言，在第一走线3021和第二走线3022延伸经过第二电路板320、柔性电路板330和第一电路板310所在区域的情况下，若在第二电路板320、柔性电路板330和第一电路板310上，第一走线3021和第二走线3022比较靠近(第一走线3021和第二走线3022之间的距离小于阈值)，N1≈N2，进而音频编解码器对第一麦克风端输入的第一信号和第二麦克风端输入的第二信号进行差分处理后，采集到的噪声Nin＝N1-N2≈0，从而达到抵消绝大部分噪声的效果。
并且，在抵消噪声的基础上，本申请实施例提供的方案无需在硬件连接关系方面上对外接接口303、适配接口402和麦克风401进行改变，应用范围和可操作性更广泛，在电子设备的外接接口是3.5mm耳机孔、Type-C类型接口等接口的场景下均适用。
本申请实施例中，电子设备还包括供电端3101，供电端3101设置在第一电路板310上，用于对麦克风401进行供电，供电端3101具体可以是麦克风偏置电压端口MIC_BIAS，供电端3101可以设置在第一电路板 上的音频编解码器301上，也可以设置在第一电路板上的其他位置，本申请对此不作具体限制。
如图2所示，第一电路板310上设置有供电端3101，供电端3101通过第一阻抗R1连接到第一走线3021，并通过第二阻抗R3连接到第二走线3022。
供电端3101可以直接连接到第二走线3022，供电端3101也可以通过阻抗连接到第二走线3022，本申请在此不作具体限制。举例而言，如图5所示，供电端具体可以是麦克风偏置电压端口(MIC_BIAS)，供电端还通过第二阻抗R3连接到第二走线3022。
在本申请实施例中，如图5所示，音频编解码器301的第一麦克风输入端(MIC_P端口)采集的是第一走线3021输入的第一信号，将第一走线3021所在的通路记为麦克风正输入通路，麦克风正输入通路包括供电端(MIC_BIAS端口)、第一阻抗R1、第一走线3021和麦克风401、接地端。音频编解码器301的第二麦克风输入端(MIC_N端口)采集的是第二走线3022传输的第二信号。将第二走线3021所在的通路记为麦克风负输入通路，麦克风负输入通路包括供电端(MIC_BIAS端口)、第二阻抗R3、第二走线3021和第四阻抗R4、接地端。
需要指出的是，本申请实施例中的阻抗(例如第一阻抗、第二阻抗、第三阻抗、第四阻抗)可以包括电阻，还可以包括电阻和电容，还可以包括电阻和电感，等等，本申请不作具体限制。
基于此，在一个具体的实施例中，如图5所示，对比麦克风正输入通路和麦克风负输入通路，第一阻抗R1的阻抗值可以等于第二阻抗R3的阻抗值，第一阻抗R1和第二阻抗R3均可以设置在第一电路板310上。这样，由于第一阻抗R1的阻抗值等于第二阻抗R3的阻抗值，使得第一走线3021输入至音频编解码器的第一信号的电压数值尽可能靠近第二走线3022输入至音频编解码器的第二信号的电压数值，在音频编解码器301对第一走线3021输入的第一信号的电压数值和第一走线3021输入的第二 信号的电压数值进行差分处理时，可以提高麦克风信号的精确度。
举例而言，在图5所示的电子设备中，第一信号可以表示为V1+N1，V1表示理想(无干扰)情况下第一信号的电压值，N1表示第一信号受到的干扰，第二信号可以表示为-V2+N2，-V2表示理想(无干扰)情况下第二信号的电压值，N2表示第二信号受到的干扰。音频编解码器301对第一信号和第二信号进行差分处理，可以得到处理后的麦克风信号：(1/2)*(第一信号-第二信号)＝(1/2)*[(V1+N1)-(-V2+N2)]＝(1/2)*(V1+V2)+(1/2)*(N1-N2)＝(1/2)*(V1+V2)+(1/2)*Nin。而在第一阻抗R1的阻抗值等于第二阻抗R3的阻抗值的情况下，V1的大小约等于V2的大小，通过音频编解码器301进行差分处理后得到的麦克风信号可以是V1+1/2*Nin。在第一信号和第二信号受到的干扰被全部抵消的情况下，Nin约等于0，处理后得到的麦克风信号可以是V1，提高了麦克风信号的精确度。
同理，在图5中，对比麦克风正输入通路和麦克风负输入通路，第四阻抗R4的阻抗值可以等于麦克风401的阻抗值，使得第一走线3021传输至音频编解码器的第一信号的电压数值尽可能靠近第二走线3022传输至音频编解码器的第二信号的电压数值，在音频编解码器301对第一走线3021输入的信号的电压数值和第一走线3021输入的信号的电压数值进行差分处理时，可以提高麦克风信号的精确度。举例而言，在第四阻抗R4的阻抗值等于麦克风401的阻抗值的情况下，V1的大小约等于V2的大小，通过音频编解码器301进行差分处理后得到的麦克风信号可以是V1+1/2*Nin。在第一信号和第二信号受到的干扰被全部抵消的情况下，Nin约等于0，处理后得到的麦克风信号可以是V1，提高了麦克风信号的精确度。
在另一个具体的实施例中，为了尽可能全面地抵消麦克风通路上的干扰信号，本申请实施例提供的电子设备可以同时对第二走线3022和外接接口303进行改进，在硬件连接关系方面上将第二走线3022和外接接口 303进行连接，使第二走线3022连接到外部设备(例如耳机内置的麦克风401)。这样，可以等效为将差分走线302延伸至外设的麦克风401，可以进一步抵消麦克风401所在的区域、外接接口303所在区域的干扰信号，进一步提升电子设备的麦克风走线所在通路的抗干扰能力。下面以图3、图6和图7-1为例进行举例说明。
如图3所示，本申请实施例提供的电子设备200可以包括：
第一电路板310、第二电路板320和柔性电路板330；第一电路板上设置有音频编解码器301，第二电路板320上设置有外接接口303；音频编解码器301包括第一麦克风端a和第二麦克风端b；外接接口303包括第一引脚a1和第二引脚b1；第一走线3021的一端与第一引脚a1相连接，第一走线3021的另一端与第一麦克风端a相连接；第二走线3022的一端与第二引脚b1相连接，且第二走线3022的另一端与第二麦克风端b相连接；其中，第一麦克风端a通过第一走线3021与外接接口303连接，第一走线的部分走线位于柔性电路板330；第二麦克风端b与第二走线3022连接，第二走线的部分走线位于柔性电路板330；
第一麦克风端a用于接收第一走线3021传输的第一信号，第二麦克风端b用于接收第二走线3022传输的第二信号，音频编解码器301用于对第一信号和第二信号进行差分处理。
在本申请实施例中，第一走线3021传输的第一信号作为第一麦克风端a的输入，第二走线3022传输的第二信号作为第二麦克风端b的输入；其中，第一走线3021延伸经过柔性电路板330而与第一麦克风端a相连接，第二走线3022延伸经过柔性电路板330而与第二麦克风端b相连接。
在第一麦克风端a为麦克风正端的情况下，第一走线3021可以是麦克风正输入差分走线，第二走线3022可以是麦克风负输入差分走线。由于第一走线3021和第二走线3022均延伸经过柔性电路板330，且第一走线3021和第二走线3022之间的距离小于阈值，使差分走线302中第一走线和第二走线在柔性电路板330所在的区域耦合。而第一走线和第二走线在 耦合部分可以受到干扰，使第一走线传输的信号和第二走线传输的信号收到干扰信号。
基于此，麦克风通路上的干扰N会同时加载到第一走线3021和第二走线3022上，使第一走线3021上传输的第一信号会携带干扰信号N1，第二走线3022上传输的第二信号会携带干扰信号N2，进而音频编解码器301对第一麦克风端a输入的第一信号和第二麦克风端b输入的第二信号进行差分处理后，音频编解码器301采集到的麦克风信号中噪声Nin＝N1-N2，使第一信号和第二信号在第二电路板320和柔性电路板330所在的区域受到的干扰可以被部分抵消或者全部抵消，提高了电子设备的麦克风走线的抗干扰能力。
举例而言，在第一走线3021和第二走线3022延伸经过第二电路板320、柔性电路板330和第一电路板310所在区域的情况下，若在第二电路板320、柔性电路板330和第一电路板310上第一走线3021和第二走线3022比较靠近(第一走线3021和第二走线3022之间的距离小于阈值)，N1≈N2，进而音频编解码器301对第一麦克风端输入的第一信号和第二麦克风端输入的第二信号进行差分处理后，采集到的噪声Nin＝N1-N2≈0，从而达到抵消绝大部分噪声的作用。
并且，在如图3所示，差分走线302从外接接口303至音频编解码器301之间的整个麦克风通路上均耦合。甚至如图6所示，在电子设备300与麦克风401连接的情况下，差分走线中的第一走线连接到麦克风401的正极，差分走线中的第二走线连接到麦克风401的负极，可以理解为差分走线设计包含了从麦克风401至音频编解码器301之间的整个麦克风通路，进而可以抵消第一信号和第二信号在麦克风401、第二电路板320、柔性电路板330和第一电路板310上(即整个麦克风通路上)受到的干扰，进一步提升了电子设备的麦克风走线所在通路的抗干扰能力。
在一个可选的实施例中，如图6或者图7-1所示，第三阻抗R2与第一阻抗R1相等，第一阻抗R1和第三阻抗R2均设置在第一电路板310上。 这样，由于第一阻抗R1的阻抗值等于第三阻抗R2的阻抗值，使得第一走线3021输入至音频编解码器的第一信号的电压数值尽可能靠近第二走线3022输入至音频编解码器的第二信号的电压数值，在音频编解码器301对第一走线3021输入的第一信号的电压数值和第二走线3022输入的第二信号的电压数值进行差分处理时，可以提高麦克风信号的精确度。
举例而言，在图6所示的电子设备中，第一信号可以表示为V1+N1，V1表示理想(无干扰)情况下第一信号的电压值，N1表示第一信号受到的干扰，第二信号可以表示为-V2+N2，-V2表示理想(无干扰)情况下第二信号的电压值，N2表示第二信号受到的干扰。音频编解码器301对第一信号和第二信号进行差分处理，可以得到处理后的麦克风信号：(1/2)*(第一信号-第二信号)＝(1/2)*[(V1+N1)-(-V2+N2)]＝(1/2)*(V1+V2)+(1/2)*(N1-N2)＝(1/2)*(V1+V2)+(1/2)Nin。而在第一阻抗R1的阻抗值等于第三阻抗R2的阻抗值的情况下，V1的大小约等于V2的大小，通过音频编解码器301进行差分处理后得到的麦克风信号可以是V1+1/2*Nin。在第一信号和第二信号受到的干扰被全部抵消的情况下，N1的大小约等于N2的大小，Nin约等于0，处理后得到的麦克风信号可以是V1，提高了麦克风信号的精确度。
在一个可选的实施例中，如图7-3所示，外接接口303可以为Type-C接口。Type-C接口有24个引脚，其中，诸如4个地脚(A1引脚/B引脚1/B12引脚/A12引脚)、4个数据引脚(B2引脚/B3引脚/A2引脚/A3引脚)等空闲引脚中的任意一个引脚均可以用来作为第二引脚b1。例如，外接接口303中一般包括空闲的接地引脚，第二引脚b1可以为接地引脚。
举例而言，如图7-3所示，第一引脚可以是SBU1/2(Side Band Use，旁带使用)引脚，第二引脚可以是B1引脚，电子设备300的第二走线3022连接到Type-C接口的B1引脚，实现整个麦克风通路的差分设计。当然，第二引脚不仅可以是接地引脚，还可以是外接接口上的其他空闲引脚，本申请在此不作具体限制。
基于与上述任一实施例提供的电子设备相同的构思，本申请实施例还提供一种电子设备组件。
举例而言，如图4或图6所示，本申请实施例提供的电子设备组件可以包括：耳机400和上述任一实施例提供的电子设备300；耳机400包括麦克风401；其中，在耳机400与电子设备300的外接接口303连接的情况下，来自麦克风401的信号经由第一走线3021传输至音频编解码器301的第一麦克风端a。
根据本申请实施例提供的电子设备组件包括耳机和上述任一实施例提供的电子设备；耳机包括麦克风；其中，在耳机与电子设备的外接接口连接的情况下，来自麦克风的信号经由第一走线传输至音频编解码器的第一麦克风端。如此，由于第一走线的部分走线和第二走线的部分走线均位于柔性电路板，使第一走线传输的第一信号和第二走线传输的第二信号在柔性电路板所在的区域均受到干扰，进而音频编解码器对第一信号和第二信号进行差分处理时，可以部分抵消或者全部抵消第一信号和第二信号在柔性电路板所在的区域受到的干扰，一定程度上提高了电子设备的麦克风走线的抗干扰能力。
在一个具体的实施例中，在图4或者图5所示的电子设备组件中，耳机400可以是3.5mm耳机，外接接口303可以为3.5mm耳机孔，适配接口402可以为3.5mm耳机插头。或者，耳机400可以是Type-C耳机，外接接口303和适配接口402均可以为Type-C接口。这种情况下，在提升麦克风走线的抗干扰能力的前提下，仅对电子设备的第二走线进行改进，无需在硬件连接关系方面上对外接接口303、适配接口402和麦克风401进行改变，应用范围和可操作性更广泛，在电子设备的外接接口是3.5mm耳机孔、Type-C类型接口等接口的场景下均适用。
在实际应用中，图5所示的实施例提供的电子设备组件，无需改变电子设备的外接接口和耳机的硬件连接关系，将第二走线3022延伸至第二电路板所在的区域，即可使第一走线和第二走线均在第二电路板、柔性电 路板和第一电路板所在的区域耦合而受到干扰。进而，第一走线和第二走线在耦合长度部分受到的干扰信号可抵消，提升了电子设备的麦克风走线的抗干扰能力。
在另一个具体的实施例中，在图6或者图7-1所示的电子设备组件中，耳机400可以是Type-C耳机。外接接口303和适配接口402均可以为Type-C接口，Type-C接口包括多个接地引脚；第二引脚b1可以为多个接地引脚中的任意一个接地引脚，第二匹配引脚b2可以为多个接地引脚中的任意一个接地引脚。这种情况下，电子设备组件的差分设计包含了从麦克风401至音频编解码器301之间的整个麦克风通路，进而可以抵消整个麦克风通路上的干扰，进一步提升了电子设备的麦克风走线所在通路的抗干扰能力。
举例而言，如图6所示，在外接接口303包括第一引脚a1和第二引脚b1，第一走线3021的一端与第一引脚a1相连接，第一走线3021的另一端与第一麦克风端a相连接，第二走线3022的一端与第二引脚b1相连接，第二走线3022通过第三阻抗R2接地的情况下，耳机400还包括与外接接口303匹配的适配接口402，适配接口402具有第一匹配引脚a2和第二匹配引脚b2，第一匹配引脚a2与第一引脚a1对应，第二匹配引脚b2与第二引脚b1对应；在耳机400与电子设备300的外接接口303连接的情况下，麦克风401的一端依次通过适配接口402的第一匹配引脚a2、外接接口303的第一引脚a1、第一走线3021与音频编解码器301的第一麦克风端a连接；在耳机400与电子设备300的外接接口303连接的情况下，麦克风401的另一端依次通过适配接口402的第二匹配引脚b2、外接接口303的第二引脚b1、第二走线3022与音频编解码器301的第二麦克风端b连接。
这种情况下，电子设备组件的差分走线设计包含了从麦克风401至音频编解码器301之间的整个麦克风通路，进而可以抵消第一信号和第二信号在麦克风401、第二电路板320、柔性电路板330和第一电路板310上 (即整个麦克风通路)上受到的干扰，进一步提升了电子设备的麦克风走线所在通路的抗干扰能力。
在实际应用中，图7-1所示的实施例提供的电子设备组件，改变了电子设备的外接接口和耳机的硬件连接关系，将电子设备300与麦克风401之间的整个麦克风通路设计成差分走线，整个麦克风通路受到的干扰均可抵消，进一步提高了电子设备的麦克风走线所在通路的抗干扰能力。
在图7-1中，耳机400还可以包括第一扬声器SPK2和第二扬声器SPK3，第一扬声器SPK2的正极通过Type-C接口连接到音频编解码器301的左声道端口(HPL_L)，第二扬声器SPK3的正极通过Type-C接口连接到音频编解码器301的右声道端口(HPL_R)，第一扬声器SPK2的负极和第二扬声器SPK3的负极通过Type-C接口接地。
其中，图7-2可以是图7-1所示电子设备组件中一种具体的Type-C耳机，图7-3可以是图7-1所示电子设备组件中一种具体具有Type-C接口的电子设备。
在图7-2所示的Type-C耳机与图7-3所示的电子设备连接的情况下，麦克风401的正极依次通过Type-C接口402的SBU1/2引脚、Type-C接口303的SBU1/2引脚、第一走线3021与音频编解码器301的MIC_P端口连接；麦克风401的负极依次通过Type-C接口402的B1引脚、Type-C接口303的B1引脚、第二走线3022与音频编解码器301的MIC_N端口连接。进而将电子设备300与麦克风401之间的整个麦克风通路设计成差分走线，整个麦克风通路受到的干扰均可抵消，进一步提高了电子设备的麦克风走线所在通路的抗干扰能力。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一 个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (10)

  1. 一种电子设备，包括：第一电路板、第二电路板和柔性电路板；
    所述第一电路板上设置有音频编解码器，所述第二电路板上设置有外接接口；所述音频编解码器包括第一麦克风端和第二麦克风端；
    其中，所述第一麦克风端通过第一走线与所述外接接口连接，所述第一走线的部分走线位于所述柔性电路板；所述第二麦克风端与第二走线连接，所述第二走线的部分走线位于所述柔性电路板；
    所述第一麦克风端用于接收所述第一走线传输的第一信号，所述第二麦克风端用于接收所述第二走线传输的第二信号，所述音频编解码器用于对所述第一信号和所述第二信号进行差分处理。
  2. 根据权利要求1所述的电子设备，其中，所述第二走线的一端与所述第二麦克风端相连接，所述第二走线的另一端通过所述第二电路板接地。
  3. 根据权利要求2所述的电子设备，其中，所述第一电路板上设置有供电端，所述供电端通过第一阻抗连接到所述第一走线，并通过第二阻抗连接到所述第二走线。
  4. 根据权利要求3所述的电子设备，其中，所述第一阻抗的阻抗值等于所述第二阻抗的阻抗值，所述第一阻抗和所述第二阻抗均设置在所述第一电路板上。
  5. 根据权利要求1所述的电子设备，其中，所述外接接口包括第一引脚和第二引脚；
    所述第一走线的一端与所述第一引脚相连接，所述第一走线的另一端与所述第一麦克风端相连接；
    所述第二走线的一端与所述第二引脚相连接，且所述第二走线的另一端与所述第二麦克风端相连接。
  6. 根据权利要求5所述的电子设备，其中，所述第二引脚为接地引脚。
  7. 根据权利要求5所述的电子设备，其中，所述第一电路板上设置有 供电端，所述供电端通过第一阻抗连接到所述第一走线，所述第二走线通过第三阻抗接地；所述第三阻抗的阻抗值与所述第一阻抗的阻抗值相等，所述第一阻抗和所述第三阻抗均设置在所述第一电路板上。
  8. 一种电子设备组件，包括：耳机和根据权利要求1-7任一项所述的电子设备；所述耳机包括麦克风；
    其中，在所述耳机与所述电子设备的外接接口连接的情况下，来自所述麦克风的信号经由所述第一走线传输至所述音频编解码器的第一麦克风端。
  9. 根据权利要求8所述的电子设备组件，其中，在所述外接接口包括第一引脚和第二引脚，所述第一走线的一端与所述第一引脚相连接，所述第一走线的另一端与所述第一麦克风端相连接，所述第二走线的一端与所述第二引脚相连接，所述第二走线通过第三阻抗接地的情况下，所述耳机还包括与所述外接接口匹配的适配接口，所述适配接口具有第一匹配引脚和第二匹配引脚，所述第一匹配引脚与所述第一引脚对应，所述第二匹配引脚与所述第二引脚对应；
    在所述耳机与所述电子设备的外接接口连接的情况下，所述麦克风的一端依次通过所述适配接口的第一匹配引脚、所述外接接口的第一引脚、所述第一走线与所述音频编解码器的第一麦克风端连接；
    在所述耳机与所述电子设备的外接接口连接的情况下，所述麦克风的另一端依次通过所述适配接口的第二匹配引脚、所述外接接口的第二引脚、所述第二走线与所述音频编解码器的第二麦克风端连接。
  10. 根据权利要求9所述的电子设备组件，其中，所述外接接口和所述适配接口均为Type-C接口，所述Type-C接口包括多个接地引脚；所述第二匹配引脚为所述多个接地引脚中的任意一个接地引脚。
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105050001A (zh) * 2015-08-06 2015-11-11 宁波萨瑞通讯有限公司 一种耳机兼容电路及其工作方法
CN105872904A (zh) * 2016-04-20 2016-08-17 乐视控股（北京）有限公司 麦克风电路、系统以及耳机
US20200288241A1 (en) * 2017-09-29 2020-09-10 Samsung Electronics Co., Ltd. Electronic device having circuit structure having electric connection between designated pin included in connector electrically connectable to ground terminal of external microphone and designated ground of circuit board
CN112153182A (zh) * 2019-06-28 2020-12-29 西安中兴新软件有限责任公司 一种音频电路及具有其的移动终端
CN114827831A (zh) * 2021-01-28 2022-07-29 昆腾微电子股份有限公司 伪差分音频输入电路和装置
CN217470265U (zh) * 2022-05-23 2022-09-20 安克创新科技股份有限公司 无线耳机
CN115567839A (zh) * 2022-10-27 2023-01-03 维沃移动通信有限公司 电子设备及电子设备组件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201479352U (zh) * 2009-07-29 2010-05-19 比亚迪股份有限公司 耳机发送端音频调整电路
US8750537B2 (en) * 2010-12-06 2014-06-10 Blackberry Limited Differential microphone circuit
CN102780938B (zh) * 2012-06-06 2015-04-15 歌尔声学股份有限公司 蓝牙耳机电路板
CN103096216B (zh) * 2013-02-07 2015-05-27 青岛歌尔声学科技有限公司 一种音频处理电路和耳机
CN107820160B (zh) * 2017-09-30 2020-11-06 深圳市艾特智能科技有限公司 信号输入电路
CN114640336B (zh) * 2022-05-09 2023-04-11 荣耀终端有限公司 接口电路及电子设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105050001A (zh) * 2015-08-06 2015-11-11 宁波萨瑞通讯有限公司 一种耳机兼容电路及其工作方法
CN105872904A (zh) * 2016-04-20 2016-08-17 乐视控股（北京）有限公司 麦克风电路、系统以及耳机
US20200288241A1 (en) * 2017-09-29 2020-09-10 Samsung Electronics Co., Ltd. Electronic device having circuit structure having electric connection between designated pin included in connector electrically connectable to ground terminal of external microphone and designated ground of circuit board
CN112153182A (zh) * 2019-06-28 2020-12-29 西安中兴新软件有限责任公司 一种音频电路及具有其的移动终端
CN114827831A (zh) * 2021-01-28 2022-07-29 昆腾微电子股份有限公司 伪差分音频输入电路和装置
CN217470265U (zh) * 2022-05-23 2022-09-20 安克创新科技股份有限公司 无线耳机
CN115567839A (zh) * 2022-10-27 2023-01-03 维沃移动通信有限公司 电子设备及电子设备组件

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