WO2024084786A1 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
WO2024084786A1
WO2024084786A1 PCT/JP2023/029138 JP2023029138W WO2024084786A1 WO 2024084786 A1 WO2024084786 A1 WO 2024084786A1 JP 2023029138 W JP2023029138 W JP 2023029138W WO 2024084786 A1 WO2024084786 A1 WO 2024084786A1
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WO
WIPO (PCT)
Prior art keywords
conductor layer
axis
viewed
signal
ground
Prior art date
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Ceased
Application number
PCT/JP2023/029138
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English (en)
French (fr)
Japanese (ja)
Inventor
恒亮 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202380069014.6A priority Critical patent/CN119948695A/zh
Priority to JP2024551246A priority patent/JP7794328B2/ja
Publication of WO2024084786A1 publication Critical patent/WO2024084786A1/ja
Priority to US19/172,708 priority patent/US20250239772A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Definitions

  • the present invention relates to a multilayer substrate.
  • a microstrip antenna is one example of a conventional invention related to a multilayer board.
  • the microstrip antenna includes a ground conductor, a central conductor, and a radiating conductor.
  • the central conductor is located below the ground conductor.
  • the radiating conductor is located above the ground conductor.
  • a slot is provided in the ground conductor. When viewed from below, the slot overlaps with the radiating conductor and central conductor. This allows the radiating conductor to be electromagnetically coupled to the ground conductor.
  • the object of the present invention is to provide a multilayer substrate that can easily adjust the input impedance to the radiating conductor layer and suppress a decrease in the symmetry of the radiation characteristics and reception characteristics of the radiating conductor layer.
  • a multilayer substrate comprises:
  • the antenna includes a laminate, a radiation conductor layer, one or more first ground conductor layers, a signal conductor layer, a first branch conductor layer, and a second branch conductor layer,
  • the laminate has a structure in which a plurality of insulating layers are laminated along the Z axis, the radiating conductor layer is provided on the laminate, the one or more first ground conductor layers are provided in the laminate, overlap with the radiation conductor layer when viewed in the negative direction of the Z axis, and are located on the negative side of the Z axis with respect to the radiation conductor layer;
  • the signal conductor layer is provided on the laminate, overlaps with the radiation conductor layer and the one or more first ground conductor layers when viewed in the negative direction of the Z axis, is located on the negative side of the Z axis with respect to the radiation conductor layer and the one or more first ground conductor layers, and is not electrically connected to the radiation conductor layer; when viewed in the negative direction of the Z
  • the multilayer board according to the present invention makes it easy to adjust the input impedance to the radiating conductor layer in the band of high-frequency signals transmitted and received by the radiating conductor layer, and also suppresses a decrease in the symmetry of the radiation characteristics and reception characteristics of the radiating conductor layer.
  • FIG. 1 is an exploded perspective view of a multilayer substrate 10.
  • FIG. FIG. 2 is a top view of the multilayer substrate 10.
  • FIG. 3 is a cross-sectional view of the multilayer substrate 10.
  • FIG. 4 is an exploded perspective view of the multilayer substrate 10a.
  • FIG. 5 is an exploded perspective view of the multilayer substrate 10b.
  • FIG. 6 is a cross-sectional view of the multilayer substrate 10c.
  • FIG. 7 is an exploded perspective view of the multilayer board 10d.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • Fig. 2 is a top view of the multilayer substrate 10.
  • Fig. 3 is a cross-sectional view of the multilayer substrate 10.
  • Fig. 3 is a cross-sectional view taken along line A-A in Fig. 2.
  • directions are defined as follows.
  • the direction in which the insulating layers 16a to 16f are arranged in this order is defined as the downward direction.
  • the downward direction coincides with the negative direction of the Z axis.
  • two sides of the laminate 15 extend along the front-rear axis.
  • the front-rear axis coincides with the Y axis.
  • the remaining two sides of the laminate 15 extend along the left-right axis.
  • the left-right axis coincides with the X axis.
  • the up-down axis (Z axis), front-rear axis (Y axis), and left-right axis (X axis) are mutually perpendicular.
  • up-down axis, front-rear axis, and left-right axis in this embodiment do not have to coincide with the up-down axis, front-rear axis, and left-right axis when the multilayer substrate 10 is in use.
  • the multilayer board 10 is an antenna module that is built into an electronic device such as a wireless communication terminal. As shown in Figure 1, the multilayer board 10 includes a laminate 15, a radiation conductor layer 17, a signal conductor layer 18, a first ground conductor layer 20, a second ground conductor layer 22, an external electrode 28, an annular ground conductor layer 30, and interlayer connection conductors v1 to v3.
  • the laminate 15 has a plate shape. When viewed from below, the laminate 15 has a rectangular shape.
  • the laminate 15 has a structure in which the insulator layers 16a to 16f are stacked along the vertical axis (Z-axis).
  • the insulator layers 16a to 16f are lined up in this order from the bottom up.
  • the insulator layers 16a to 16f are fused together with adjacent layers.
  • the material of the insulator layers 16a to 16f is a thermoplastic resin.
  • the thermoplastic resin is, for example, a liquid crystal polymer.
  • the radiating conductor layer 17 is provided on the laminate 15. In this embodiment, the radiating conductor layer 17 is located on the upper main surface of the laminate 15. Therefore, the radiating conductor layer 17 is located on the upper main surface of the insulator layer 16a.
  • the radiating conductor layer 17 has a rectangular shape when viewed from below.
  • the radiating conductor layer 17 may have a square shape when viewed from below. When viewed from below, two sides of the radiating conductor layer 17 extend along the front-to-back axis. The remaining two sides of the radiating conductor layer 17 extend along the left-to-right axis.
  • the first ground conductor layer 20 is provided in the laminate 15.
  • the first ground conductor layer 20 is located on the upper main surface of the insulator layer 16d.
  • the first ground conductor layer 20 is located below the radiating conductor layer 17 (on the negative side of the Z axis).
  • the first ground conductor layer 20 covers most of the upper main surface of the insulator layer 16d.
  • the first ground conductor layer 20 overlaps with the radiating conductor layer 17 when viewed in the downward direction.
  • the first ground conductor layer 20 as described above is connected to the ground potential.
  • the signal conductor layer 18 is provided in the laminate 15.
  • the signal conductor layer 18 is located on the upper main surface of the insulator layer 16e. Therefore, the signal conductor layer 18 is located below (on the negative side of the Z axis) the radiation conductor layer 17 and the first ground conductor layer 20. Also, when viewed in the downward direction (negative direction of the Z axis), the signal conductor layer 18 overlaps with the radiation conductor layer 17 and the first ground conductor layer 20. However, the signal conductor layer 18 is not electrically connected to the radiation conductor layer 17 and the first ground conductor layer 20.
  • the signal conductor layer 18 has a linear shape extending along the left-right axis (X axis). As a result, the signal conductor layer 18 has a left end (first end) and a right end. A high-frequency signal is transmitted to the signal conductor layer 18 as described above.
  • the second ground conductor layer 22 is provided in the laminate 15.
  • the second ground conductor layer 22 is located on the lower main surface of the insulator layer 16f.
  • the second ground conductor layer 22 is located below the signal conductor layer 18 (on the negative side of the Z axis).
  • the second ground conductor layer 22 covers most of the lower main surface of the insulator layer 16f.
  • the second ground conductor layer 22 overlaps with the radiation conductor layer 17 and the signal conductor layer 18 when viewed in the downward direction.
  • the second ground conductor layer 22 as described above is connected to the ground potential.
  • the signal conductor layer 18, the first ground conductor layer 20, and the second ground conductor layer 22 as described above have a stripline structure.
  • the external electrode 28 is provided on the laminate 15. In this embodiment, the external electrode 28 is located on the lower main surface of the insulator layer 16f. However, the external electrode 28 is not in contact with the second ground conductor layer 22.
  • the external electrode 28 has a rectangular shape when viewed from below. When viewed from below, the external electrode 28 overlaps with the right end of the signal conductor layer 18.
  • the external electrode 28 is connected to an electrode of the circuit board by soldering.
  • the annular ground conductor layer 30 is provided in the laminate 15.
  • the annular ground conductor layer 30 is located on the upper main surface of the insulator layer 16e.
  • the annular ground conductor layer 30 has a rectangular ring shape when viewed from below.
  • the signal conductor layer 18 is located within the area surrounded by the annular ground conductor layer 30 when viewed from below.
  • the annular ground conductor layer 30 is connected to the ground potential.
  • the interlayer connection conductor v1 electrically connects the signal conductor layer 18 and the external electrode 28.
  • the interlayer connection conductor v1 penetrates the insulator layers 16e and 16f along the up-down axis.
  • the upper end of the interlayer connection conductor v1 contacts the right end of the signal conductor layer 18.
  • the lower end of the interlayer connection conductor v1 contacts the external electrode 28.
  • the interlayer connection conductors v2 and v3 electrically connect the first ground conductor layer 20, the second ground conductor layer 22, and the annular ground conductor layer 30.
  • the interlayer connection conductors v2 and v3 penetrate the insulator layers 16d to 16f along the up-down axis.
  • the upper ends of the interlayer connection conductors v2 and v3 are in contact with the first ground conductor layer 20.
  • the lower ends of the interlayer connection conductors v2 and v3 are in contact with the second ground conductor layer 22.
  • the middle parts of the interlayer connection conductors v2 and v3 are in contact with the annular ground conductor layer 30.
  • the area in which the radiation conductor layer 17 is provided is defined as the radiation conductor layer area A1 when viewed downward (negative direction of the Z axis).
  • the radiation conductor layer area A1 When viewed downward (negative direction of the Z axis), the radiation conductor layer area A1 includes a ground conductor layer non-forming area A0 in which the first ground conductor layer 20 is not provided.
  • the ground conductor layer non-forming area A0 When viewed downward (negative direction of the Z axis), the ground conductor layer non-forming area A0 is surrounded by the first ground conductor layer 20.
  • the ground conductor layer non-forming area A0 has a rectangular shape. The two long sides of the ground conductor layer non-forming area A0 extend in the front-rear direction.
  • the two short sides of the ground conductor layer non-forming area A0 extend in the left-right direction.
  • the length of the ground conductor layer non-forming area A0 in the direction along the front-rear axis (Y axis) is equal to or less than 1 ⁇ 4 of the wavelength of the high-frequency signal transmitted through the signal conductor layer 18. This suppresses the occurrence of unnecessary resonance in the ground conductor layer non-forming area A0, thereby suppressing the occurrence of noise.
  • the ground conductor layer non-forming area A0 intersects with the signal conductor layer 18 when viewed in the downward direction.
  • the ground conductor layer non-forming area A0 is perpendicular to the signal conductor layer 18 when viewed in the downward direction.
  • the signal conductor layer 18 overlaps with the ground conductor layer non-forming area A0 when viewed in the downward direction (negative direction of the Z axis). That is, when viewed in the downward direction (negative direction of the Z axis), the signal conductor layer 18 has an overlapping portion P that overlaps with the ground conductor layer non-forming area A0.
  • the length L1 of the signal conductor layer 18 between the left end (first end) of the signal conductor layer 18 and the overlapping portion P is 1 ⁇ 4 or less of the wavelength of the high-frequency signal transmitted through the signal conductor layer 18.
  • the signal conductor layer 18 overlaps with the radiation conductor layer 17 in the ground conductor layer non-forming area A0. That is, when viewed in the downward direction, the overlapping portion P overlaps with the radiation conductor layer 17.
  • the signal conductor layer 18 and the radiation conductor layer 17 are electromagnetically coupled.
  • the signal conductor layer 18 and the radiation conductor layer 17 are mainly magnetically coupled.
  • the high-frequency signal transmitted through the signal conductor layer 18 is transmitted to the radiation conductor layer 17 by the electromagnetic field through the ground conductor layer non-forming area A0. Then, a standing wave of the high-frequency signal is generated in the radiation conductor layer 17.
  • the radiation conductor layer 17 radiates the electromagnetic wave of the high-frequency signal upward. Note that, by the same principle, the radiation conductor layer 17 receives the electromagnetic wave of the high-frequency signal.
  • the multilayer substrate 10 further includes a first branched conductor layer 24 and a second branched conductor layer 26.
  • the first branched conductor layer 24 and the second branched conductor layer 26 are provided in the laminate 15.
  • the first branched conductor layer 24 and the second branched conductor layer 26 are located on the upper main surface of the insulator layer 16e.
  • the first branched conductor layer 24 and the second branched conductor layer 26 have an L-shape when viewed downward.
  • the first branched conductor layer 24 includes a first portion 24a and a second portion 24b.
  • the first portion 24a extends in the front-rear direction.
  • the rear end of the first portion 24a is connected to the connection point P0 of the signal conductor layer 18.
  • the connection point P0 is located between the left end and the right end of the signal conductor layer 18.
  • the length L2 of the transmission path of the high-frequency signal from the overlapping portion P to the connection point P0 is shorter than half the wavelength of the high-frequency signal. That is, the length L2 of the transmission path of the high-frequency signal from the overlapping portion P to the first branched conductor layer 24 is shorter than half the wavelength of the high-frequency signal.
  • the second portion 24b extends in the left-right direction. The right end of the second portion 24b is connected to the front end of the first portion 24a.
  • the first branched conductor layer 24 is electrically connected to the signal conductor layer 18.
  • the length of the first branched conductor layer 24 is less than half the wavelength of the high-frequency signal transmitted through the signal conductor layer 18.
  • the first branched conductor layer 24 as described above functions as an open stub.
  • the second branch conductor layer 26 includes a first portion 26a and a second portion 26b.
  • the first portion 26a extends in the front-rear direction.
  • the front end of the first portion 26a is connected to the connection point P0 of the signal conductor layer 18.
  • the length L2 of the transmission path of the high-frequency signal from the overlapping portion P to the connection point P0 is shorter than half the wavelength of the high-frequency signal.
  • the length L2 of the transmission path of the high-frequency signal from the overlapping portion P to the second branch conductor layer 26 is shorter than half the wavelength of the high-frequency signal.
  • the second portion 26b extends in the left-right direction. The right end of the second portion 26b is connected to the rear end of the first portion 26a.
  • the second branch conductor layer 26 is electrically connected to the signal conductor layer 18.
  • the length of the second branch conductor layer 26 is equal to or shorter than half the wavelength of the high-frequency signal transmitted through the signal conductor layer 18.
  • the second branch conductor layer 26 as described above functions as an open stub.
  • the length of the first portion 24a is equal to the length of the first portion 26a.
  • the length of the second portion 24b is equal to the length of the second portion 26b.
  • the radiation conductor layer 17 has a shape that is line-symmetrical with respect to the imaginary line L. Furthermore, when viewed in the downward direction (negative direction of the Z axis), the ground conductor layer non-forming area A0 extends along the front-to-rear axis. As a result, when viewed in the downward direction (negative direction of the Z axis), the ground conductor layer non-forming area A0 extends along an axis that is perpendicular to the imaginary line L. And the ground conductor layer non-forming area A0 has a structure that is line-symmetrical with respect to the imaginary line L.
  • the radiation conductor layer 17, the signal conductor layer 18, the first ground conductor layer 20, the second ground conductor layer 22, the first branch conductor layer 24, the second branch conductor layer 26, the external electrode 28, and the annular ground conductor layer 30 are formed by patterning metal foil attached to the upper or lower principal surfaces of the insulator layers 16a, 16d to 16f.
  • the metal foil is, for example, copper foil.
  • the interlayer connection conductors v1 to v3 are formed by filling the through holes that penetrate the insulator layers 16d to 16f along the vertical axis with a conductive paste, and then solidifying the conductive paste by heating and pressurizing.
  • the input impedance to the radiation conductor layer 17 can be easily adjusted. More specifically, in the multilayer substrate 10, the first branch conductor layer 24 and the second branch conductor layer 26 are electrically connected to the signal conductor layer 18. This allows the first branch conductor layer 24 and the second branch conductor layer 26 to function as a matching circuit by adjusting the shapes of the first branch conductor layer 24 and the second branch conductor layer 26. As a result, the input impedance to the radiation conductor layer 17 can be easily adjusted.
  • the multilayer board 10 can suppress the decrease in the symmetry of the radiation characteristics of the radiation conductor layer 17. More specifically, when the first branch conductor layer 24 and the second branch conductor layer 26 are provided on the multilayer board 10, the radiation characteristics of the radiation conductor layer 17 are affected by the first branch conductor layer 24 and the second branch conductor layer 26. Therefore, when viewed in the downward direction, there is a virtual line L that passes through the overlapping portion P and on which the first branch conductor layer 24 and the second branch conductor layer 26 are line-symmetric. That is, the first branch conductor layer 24 and the second branch conductor layer 26 are in a line-symmetric relationship.
  • the multilayer board 10 can suppress the decrease in the symmetry of the radiation characteristics of the radiation conductor layer 17. For the same reason, the multilayer board 10 can suppress the decrease in the symmetry of the reception characteristics of the radiation conductor layer 17.
  • FIG. 4 is an exploded perspective view of the multilayer substrate 10a.
  • the multilayer board 10a differs from the multilayer board 10 in that the signal conductor layer 18 and the first and second branch conductor layers 24 and 26 are located on different insulator layers. More specifically, the signal conductor layer 18 is located on the upper main surface of the insulator layer 16e. The first and second branch conductor layers 24 and 26 are located on the upper main surface of the insulator layer 16g. The insulator layer 16g is located between the insulator layers 16e and 16f. As a result, the first and second branch conductor layers 24 and 26 are located below the signal conductor layer 18 (on the negative side of the Z axis).
  • the interlayer connection conductor v1 electrically connects the signal conductor layer 18, the first branch conductor layer 24, the second branch conductor layer 26, and the external electrode 28.
  • the interlayer connection conductor v1 penetrates the insulator layers 16e, 16g, and 16f along the up-down axis.
  • the upper end of the interlayer connection conductor v1 contacts the right end of the signal conductor layer 18.
  • the lower end of the interlayer connection conductor v1 contacts the external electrode 28.
  • the middle part of the interlayer connection conductor v1 contacts the first branch conductor layer 24 and the second branch conductor layer 26.
  • the rest of the structure of the multilayer board 10a is the same as that of the multilayer board 10, so a description will be omitted.
  • the multilayer board 10a can achieve the same effects as the multilayer board 10.
  • the first branch conductor layer 24 and the second branch conductor layer 26 are located below the signal conductor layer 18 (on the negative side of the Z axis). This places the first branch conductor layer 24 and the second branch conductor layer 26 away from the radiation conductor layer 17. As a result, the radiation characteristics of the radiation conductor layer 17 are less susceptible to the influence of the first branch conductor layer 24 and the second branch conductor layer 26.
  • Fig. 5 is an exploded perspective view of the multilayer substrate 10b.
  • the multilayer substrate 10b differs from the multilayer substrate 10 in that it further includes annular ground conductor layers 32, 34, and 36.
  • the annular ground conductor layers 32, 34, and 36 are provided in the laminate 15.
  • the annular ground conductor layer 32 is located on the upper main surface of the insulator layer 16a.
  • the annular ground conductor layer 34 is located on the upper main surface of the insulator layer 16b.
  • the annular ground conductor layer 36 is located on the upper main surface of the insulator layer 16c.
  • the annular ground conductor layers 32, 34, and 36 have a rectangular ring shape when viewed from below.
  • the radiation conductor layer 17, the signal conductor layer 18, the first branch conductor layer 24, and the second branch conductor layer 26 are located within the area surrounded by the annular ground conductor layers 32, 34, and 36 when viewed from below.
  • the interlayer connection conductors v2 and v3 electrically connect the first ground conductor layer 20, the second ground conductor layer 22, and the annular ground conductor layers 30, 32, 34, and 36. As a result, the annular ground conductor layers 32, 34, and 36 are connected to the ground potential.
  • the rest of the structure of the multilayer board 10b is the same as that of the multilayer board 10, so a description thereof will be omitted.
  • the multilayer board 10b can achieve the same effects as the multilayer board 10.
  • the radiation conductor layer 17, the signal conductor layer 18, the first branch conductor layer 24, and the second branch conductor layer 26 are located in an area surrounded by the annular ground conductor layers 32, 34, and 36 when viewed from below. This prevents noise from entering the multilayer board 10b, and also prevents noise from radiating forward, backward, left, and right from the multilayer board 10b.
  • the radiation conductor layer 17, the signal conductor layer 18, the first branch conductor layer 24, and the second branch conductor layer 26 are prevented from forming capacitance with the conductors surrounding the multilayer board 10b.
  • the electromagnetic field radiating from the ground conductor layer non-forming area A0 is prevented from spreading in the left-right direction, so that power is efficiently input to the radiation conductor layer 17.
  • Fig. 6 is a cross-sectional view of the multilayer substrate 10c.
  • the multilayer board 10c differs from the multilayer board 10 in that the laminate 15 is curved. More specifically, the laminate 15 has a first section A11 in which the radiating conductor layer 17 is provided when viewed downward (negative direction of the Z axis), and second sections A12a, A12b in which the radiating conductor layer 17 is not provided when viewed downward (negative direction of the Z axis). The vertical thickness of a portion of the second section A12b is smaller than the vertical thickness of the first section A11. The second section A12b of the laminate 15 has a curved portion when viewed forward (orthogonal to the Z axis). The other structure of the multilayer board 10c is the same as that of the multilayer board 10, so a description will be omitted. The multilayer board 10c can achieve the same effects as the multilayer board 10.
  • the vertical thickness of a portion of the second section A12b is smaller than the vertical thickness of the first section A11. This makes it easier to bend the second section A12b of the laminate 15 when viewed in the forward direction (direction perpendicular to the Z axis).
  • the first section A11 and the second section A12b include the insulator layers 16d to 16f. This means that no connection is made in the signal conductor layer 18 between the first section A11 and the second section A12b. As a result, loss is suppressed from occurring in the signal conductor layer 18.
  • FIG. 7 is an exploded perspective view of the multilayer substrate 10d.
  • Multilayer substrate 10d differs from multilayer substrate 10 in that the materials of insulator layers 16a-16c are different from the materials of insulator layers 16d-16f.
  • the dielectric constant of insulator layers 16a-16c is higher than the dielectric constant of insulator layers 16d-16f.
  • the rest of the structure of multilayer substrate 10d is the same as that of multilayer substrate 10, so a description is omitted.
  • Multilayer substrate 10d can achieve the same effects as multilayer substrate 10.
  • the dielectric constant of the insulator layers 16a to 16c is higher than the dielectric constant of the insulator layers 16d to 16f. This creates a wavelength shortening effect in the radiating conductor layer 17. As a result, the radiating conductor layer 17 can be made smaller.
  • the multilayer board according to the present invention is not limited to the multilayer boards 10, 10a to 10d, and may be modified within the scope of the invention.
  • the structures of the multilayer boards 10, 10a to 10d may be combined in any desired manner.
  • the number of first ground conductor layers is not limited to one.
  • the number of first ground conductor layers may be one or more.
  • a ground conductor layer-free area A0 is formed between the two first ground conductor layers.
  • the ground conductor layer-free area A0 is not surrounded by the first ground conductor layers. For example, when viewed from below, no first ground conductor layers are present in front of or behind the ground conductor layer-free area A0.
  • the dielectric constant of the insulator layers 16a to 16c may be equal to or less than the dielectric constant of the insulator layers 16d to 16f. In this case, the capacitance between the radiation conductor layer 17 and the first ground conductor layer 20 is reduced. As a result, the gain of the multilayer board is improved.
  • the second ground conductor layer 22, the external electrode 28, and the annular ground conductor layers 30, 32, 34, and 36 are not essential components.
  • the dielectric constant of the insulator layers 16a to 16c may be lower than the dielectric constant of the insulator layers 16d to 16f. In this case, the distance between the radiation conductor layer 17 and the first ground conductor layer 20 is shortened, and the thickness of the multilayer substrate 10 in the vertical direction is reduced.
  • the first branched conductor layer 24 and the second branched conductor layer 26 may be located above the signal conductor layer 18.
  • the first branch conductor layer 24 and the second branch conductor layer 26 may be located to the left of the area A0 where the ground conductor layer is not formed.
  • the connection point P0 may be located between the left end of the signal conductor layer 18 and the overlapping portion P.
  • the first branch conductor layer 24 and the second branch conductor layer 26 may be short stubs instead of open stubs.
  • the first branch conductor layer 24 and the second branch conductor layer 26 are connected to, for example, the annular ground conductor layer 32.
  • the length L2 of the transmission path of the high-frequency signal from the overlapping portion P to the first branched conductor layer 24 and the second branched conductor layer 26 may be longer than half the wavelength of the high-frequency signal.
  • the radiating conductor layer 17 does not have to have a shape that is linearly symmetrical with respect to the imaginary line L.
  • the signal conductor layer 18 When viewed from below, the signal conductor layer 18 does not have to have a shape that is linearly symmetrical with respect to the imaginary line L.
  • the area A0 without the ground conductor layer does not have to extend along an axis perpendicular to the imaginary line L.
  • the length L1 of the signal conductor layer 18 between the left end of the signal conductor layer 18 and the overlapping portion P may be longer than half the wavelength of the high-frequency signal transmitted through the signal conductor layer 18.
  • the length of the ground conductor layer non-forming area A0 along the front-rear axis may be longer than half the wavelength of the high-frequency signal transmitted through the signal conductor layer 18.
  • the multilayer substrate 10, 10a to 10d may further include one or more branch conductor layers.
  • the one or more branch conductor layers may not have a shape that is linearly symmetrical with respect to the imaginary line L when viewed in the downward direction. However, the length of the transmission path from the first branch conductor layer 24 to the overlapping portion P and the length of the transmission path from the second branch conductor layer 26 to the overlapping portion P are shorter than the length of the transmission path from the one or more branch conductor layers to the overlapping portion P.
  • each of the first branched conductor layer 24 and the second branched conductor layer 26 may have a straight line shape when viewed downward, or may have a curved shape.
  • the multilayer substrate 10, 10a to 10d may further include a third branch conductor layer and a fourth branch conductor layer that are linearly symmetrical with respect to the imaginary line L.
  • the first branch conductor layer 24 and the second branch conductor layer 26 do not have to overlap with the radiating conductor layer 17 when viewed from below. Therefore, the entire first branch conductor layer 24 and the entire second branch conductor layer 26 may overlap with the radiating conductor layer 17 when viewed from below, or a portion of the first branch conductor layer 24 and a portion of the second branch conductor layer 26 may overlap with the radiating conductor layer 17 when viewed from below.
  • the present invention has the following structure:
  • the multilayer substrate includes a laminate, a radiation conductor layer, one or more first ground conductor layers, a signal conductor layer, a first branch conductor layer, and a second branch conductor layer
  • the laminate has a structure in which a plurality of insulating layers are laminated along the Z axis, the radiating conductor layer is provided on the laminate, the one or more first ground conductor layers are provided in the laminate, overlap with the radiation conductor layer when viewed in the negative direction of the Z axis, and are located on the negative side of the Z axis with respect to the radiation conductor layer;
  • the signal conductor layer is provided on the laminate, overlaps with the radiation conductor layer and the one or more first ground conductor layers when viewed in the negative direction of the Z axis, is located on the negative side of the Z axis with respect to the radiation conductor layer and the one or more first ground conductor layers, and is not electrically connected to the radiation conductor layer; when viewed in the negative direction of the Z axis, a radiating
  • a length of a transmission path of a high frequency signal from the overlapping portion to the first branch conductor layer and the second branch conductor layer is shorter than half the wavelength of the high frequency signal;
  • the radiation conductor layer When viewed in the negative direction of the Z axis, the radiation conductor layer has a shape that is line-symmetric with respect to the imaginary line.
  • a multilayer substrate according to any one of (1) to (3).
  • the ground conductor layer non-forming area extends along an axis perpendicular to the imaginary line.
  • the signal conductor layer has a first end, a length of the signal conductor layer between the first end and the overlapping portion when viewed in the negative direction of the Z axis is equal to or less than half the wavelength of a high-frequency signal transmitted through the signal conductor layer;
  • a multilayer substrate according to any one of (1) to (5).
  • the multilayer substrate further includes a second ground conductor layer, the second ground conductor layer is provided in the laminate, overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis, and is located on the negative side of the Z axis with respect to the signal conductor layer;
  • the laminate has a first section in which the radiating conductor layer is provided, as viewed in the negative direction of the Z axis, and a second section in which the radiating conductor layer is not provided, as viewed in the negative direction of the Z axis,
  • the second section of the laminate has a curved portion when viewed in a direction perpendicular to the Z axis.
  • the signal conductor layer extends along the X-axis, The Y-axis is perpendicular to the X-axis and the Z-axis. a length of the ground conductor layer non-forming area in the direction along the Y-axis is equal to or less than half the wavelength of a high-frequency signal transmitted through the signal conductor layer;
  • a multilayer substrate according to any one of (1) to (8).
  • the signal conductor layer extends along the X-axis, The Y-axis is perpendicular to the X-axis and the Z-axis. the ground conductor layer-free region is surrounded by the first ground conductor layer when viewed in the negative direction of the Z axis.
  • a multilayer substrate according to any one of (1) to (9).

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PCT/JP2023/029138 2022-10-18 2023-08-09 多層基板 Ceased WO2024084786A1 (ja)

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CN202380069014.6A CN119948695A (zh) 2022-10-18 2023-08-09 多层基板
JP2024551246A JP7794328B2 (ja) 2022-10-18 2023-08-09 多層基板
US19/172,708 US20250239772A1 (en) 2022-10-18 2025-04-08 Multilayer substrate

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JP2022-166830 2022-10-18
JP2022166830 2022-10-18

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US19/172,708 Continuation US20250239772A1 (en) 2022-10-18 2025-04-08 Multilayer substrate

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0700117A1 (en) * 1994-08-30 1996-03-06 Pilkington Plc Patch antenna assembly
US6069587A (en) * 1998-05-15 2000-05-30 Hughes Electronics Corporation Multiband millimeterwave reconfigurable antenna using RF mem switches
JP2002290144A (ja) * 2001-03-28 2002-10-04 Hitachi Chem Co Ltd 平面アレーアンテナ
US20020163468A1 (en) * 2001-05-01 2002-11-07 Anderson Joseph M. Stripline fed aperture coupled microstrip antenna
JP2016127481A (ja) * 2015-01-06 2016-07-11 株式会社東芝 偏波共用アンテナ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064310A (ja) * 2000-08-21 2002-02-28 Sharp Corp マイクロ波・ミリ波装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0700117A1 (en) * 1994-08-30 1996-03-06 Pilkington Plc Patch antenna assembly
US6069587A (en) * 1998-05-15 2000-05-30 Hughes Electronics Corporation Multiband millimeterwave reconfigurable antenna using RF mem switches
JP2002290144A (ja) * 2001-03-28 2002-10-04 Hitachi Chem Co Ltd 平面アレーアンテナ
US20020163468A1 (en) * 2001-05-01 2002-11-07 Anderson Joseph M. Stripline fed aperture coupled microstrip antenna
JP2016127481A (ja) * 2015-01-06 2016-07-11 株式会社東芝 偏波共用アンテナ

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JP7794328B2 (ja) 2026-01-06
JPWO2024084786A1 (https=) 2024-04-25

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