WO2024071719A1 - Filtre en mode commun multicouche - Google Patents

Filtre en mode commun multicouche Download PDF

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Publication number
WO2024071719A1
WO2024071719A1 PCT/KR2023/013343 KR2023013343W WO2024071719A1 WO 2024071719 A1 WO2024071719 A1 WO 2024071719A1 KR 2023013343 W KR2023013343 W KR 2023013343W WO 2024071719 A1 WO2024071719 A1 WO 2024071719A1
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WO
WIPO (PCT)
Prior art keywords
pattern
sheet
disposed
coil
filter
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PCT/KR2023/013343
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English (en)
Korean (ko)
Inventor
임병국
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주식회사 아모텍
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Publication of WO2024071719A1 publication Critical patent/WO2024071719A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
    • H03H7/425—Balance-balance networks
    • H03H7/427—Common-mode filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/09—Filters comprising mutual inductance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0078—Constructional details comprising spiral inductor on a substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Definitions

  • the present invention relates to a stacked common mode filter that passes differential mode signal current and removes common mode noise current in electronic devices using high-speed signal lines.
  • portable terminals adopt the MIPI (Mobile Industry Processor Interface) D-PHY standard as a digital data transmission standard.
  • the MIPI D-PHY standard is a digital data transmission standard that connects the main circuit of a portable terminal and a display or camera. It transmits data as a differential signal using multiple transmission lines.
  • portable terminals require a transmission method that can transmit and receive data at higher speeds than MIPI D-PHY.
  • the MIPI C-PHY standard uses multiple transmission lines to send different voltages to each transmission line from the transmitting side, and outputs differentially by taking the difference between each line at the receiving side.
  • the present invention was proposed in consideration of the above circumstances, and is a stacked common mode filter that realizes broadband characteristics by stacking capacitance layers on the top and bottom of the electrode layer, while uniformly forming the resistance and inductance of the coil patterns that make up each channel.
  • the purpose is to provide.
  • the stacked common mode filter is a laminate in which an electrode layer, a first capacitance layer, and a second capacitance layer are stacked, and the upper surface, the lower surface, the first side, and the first side are opposite to each other. It includes a filter laminate having a second side, a third side, and a fourth side opposite the third side, the electrode layer is composed of a laminate having a plurality of coil patterns, and the first capacitance layer includes a capacitor pattern and a ground pattern.
  • the second capacitance layer is composed of a laminate with a capacitor pattern and a ground pattern and is disposed on the lower part of the electrode layer, and the first capacitance layer and the second capacitance layer are a capacitor pattern. It may be configured to overlap one or more of the plurality of coil patterns to form additional capacitance.
  • the electrode layer includes a first sheet, a first coil pattern disposed on the first side of the first sheet, a second sheet disposed below the first sheet, a second coil pattern disposed on the first side of the second sheet, and a first coil pattern disposed on the first side of the second sheet.
  • the first end of the first coil pattern is connected to the first end of the second coil through the first via hole, the second end of the first coil pattern is exposed to the second side of the filter laminate, and the second end of the first coil pattern is exposed to the second side of the filter laminate.
  • the first end of the coil pattern is connected to the first end of the first coil through the first via hole, and the second end of the second coil pattern is connected to the first side of the filter stack opposite to one side of the filter stack.
  • the first end of the third coil pattern is connected to the first end of the fourth coil through the second via hole, the second end of the third coil pattern is exposed to the first side of the filter stack, and The first end of the four coil pattern is connected to the first end of the first coil through the first via hole, and the second end of the second coil pattern is connected to the second end of the filter stack opposite the first side of the filter stack. It can be exposed to the side.
  • the first end of the first coil pattern is connected to the first end of the second coil pattern through a first via hole penetrating the first sheet, third sheet, and fourth sheet, and the first coil pattern and the second coil pattern may be connected through the first via hole to form a first coil constituting the first channel.
  • the first end of the third coil pattern is connected to the first end of the fourth coil pattern through the second via hole penetrating the third sheet, and the third and fourth coil patterns are connected through the second via hole. It can be connected through to form a second coil constituting a second channel.
  • the capacitor pattern and ground pattern of the first capacitance layer may be configured to be symmetrical to the capacitor pattern and ground pattern of the second capacitance layer with the electrode layer interposed therebetween.
  • the first capacitance layer and the second capacitance layer are composed of a laminate in which N fifth sheets and N sixth sheets are alternately stacked, a plurality of capacitor patterns are disposed on the fifth sheet, and a ground pattern is placed on the sixth sheet. can be placed.
  • the first capacitance layer has a sixth sheet stacked on top of the fifth sheet, the sixth sheet is disposed at the top of the first capacitance layer, the fifth sheet is disposed at the bottom of the first capacitance layer, and the second The capacitance layers may be stacked so that the fifth sheet is disposed on top of the sixth sheet, so that the fifth sheet is disposed on the top of the second capacitance layer, and the sixth sheet is disposed on the bottom of the second capacitance layer.
  • the first capacitance layer and the second capacitance layer are composed of a laminate in which N fifth sheets and N + 1 sixth sheets are alternately stacked, a plurality of capacitor patterns are disposed on the fifth sheet, and a ground layer is provided on the sixth sheet. Patterns may also be placed.
  • the first capacitance layer and the second capacitance layer are stacked so that one fifth sheet is sandwiched between two adjacent sixth sheets, and the first capacitance layer and the second capacitance layer have a sixth sheet disposed at the top and bottom. It can be.
  • the capacitor pattern includes a first capacitor pattern disposed on the first side of the fifth sheet, a second capacitor pattern disposed on the first side of the fifth sheet and spaced apart from the first capacitor pattern, and a first side of the fifth sheet. a third capacitor pattern disposed on the first capacitor pattern and the second capacitor pattern, and a fourth capacitor pattern disposed on the first side of the fifth sheet and spaced apart from the first to third capacitor patterns. and a capacitor pattern, wherein the first end of the first capacitor pattern is disposed to face the first end of the third capacitor pattern, and the first end of the second capacitor pattern is disposed to face the first end of the fourth capacitor pattern. It can be.
  • the second end of the first capacitor pattern and the second end of the second capacitor pattern are exposed to the first side of the filter stack, and the second end of the third capacitor pattern and the second end of the fourth capacitor pattern are exposed to the filter layer. It may be exposed to the second side of the laminate.
  • the ground pattern includes a plate-shaped first pattern disposed on the first side of the sixth sheet, a second pattern disposed on the first side of the sixth sheet, and a third pattern disposed on the first side of the sixth sheet,
  • the first end of the second pattern is connected to one side of the first pattern
  • the second end of the second pattern is exposed to the third side of the filter laminate
  • the first end of the third pattern is connected to one side of the first pattern. It is connected to the other side of the opposing first pattern, and the second end of the third pattern may be exposed to the fourth side of the filter laminate.
  • the stacked common mode filter according to an embodiment of the present invention is disposed on the second side of the filter stack opposite to the first side of the filter stack, and is connected to the first coil pattern exposed to the second side of the filter stack.
  • 1 external electrode disposed on the second side of the filter laminate, connected to the fourth coil pattern exposed to the second side of the filter laminate, second external electrode disposed on the first side of the filter laminate, filter laminate a third external electrode connected to the second coil pattern exposed to the first side of the filter stack, and a fourth external electrode disposed on the first side of the filter stack and connected to the third coil pattern exposed to the first side of the filter stack. More may be included.
  • the first external electrode is further connected to the third capacitor pattern exposed to the second side of the filter laminate, and the second external electrode is further connected to the fourth capacitor pattern exposed to the second side of the filter laminate,
  • the third external electrode may be further connected to the first capacitor pattern exposed to the first side of the filter stack, and the fourth external electrode may be further connected to the second capacitor pattern exposed to the first side of the filter stack.
  • the stacked common mode filter according to an embodiment of the present invention is disposed on the third side of the filter stack and includes a fifth external electrode connected to the second pattern of the ground pattern exposed to the third side of the filter stack and a filter stack. It may further include a sixth external electrode disposed on the fourth side of the filter stack opposite the third side and connected to the third pattern of the ground pattern exposed to the fourth side of the filter stack.
  • the stacked common mode filter can maintain a constant distance (spacing) between the coil patterns constituting each channel, which has the effect of maintaining uniform resistance and inductance of the coil patterns constituting each channel. there is.
  • the stacked common mode filter has the effect of expanding the attenuation band by forming an additional notch in the common mode attenuation characteristics by placing capacitance layers on the top and bottom of the electrode stack. There is.
  • the stacked common mode filter has the effect of realizing broadband characteristics by forming additional poles (i.e., additional capacitance) by the capacitance layer and coil pattern along with the pole formed by the coil patterns of the electrode stack. there is.
  • the stacked common mode filter has the effect of minimizing changes in inductance characteristics of coil patterns by maintaining a constant distance (spacing) between each channel.
  • the stacked common mode filter has the effect of improving magnetic coupling (i.e., electromagnetic coupling) between the first coil and the second coil and minimizing deterioration of the differential signal.
  • FIG. 1 is a perspective view of a stacked common mode filter according to an embodiment of the present invention.
  • Figure 2 is a perspective view for explaining the filter laminate of Figure 1.
  • Figures 3 to 7 are exploded perspective views for explaining an example of the electrode layer of Figure 2.
  • 8 to 12 are diagrams for explaining the first capacitance layer and the second capacitance layer of FIG. 2.
  • FIG. 13 is a diagram illustrating a change in frequency characteristics according to a change in the stacked structure of the capacitance layer of a stacked common mode filter according to an embodiment of the present invention.
  • Figure 14 is a diagram showing the equivalent circuit of a stacked common mode filter according to an embodiment of the present invention.
  • Figure 15 is a diagram for explaining the frequency characteristics of a stacked common mode filter according to an embodiment of the present invention.
  • each layer (film), region, pattern or structure is said to be formed “on” or “under” the substrate, each layer (film), region, pad or pattern.
  • “on” and “under” include both being formed “directly” or “indirectly” through another layer.
  • the standards for the top or bottom of each floor are based on the drawing.
  • the stacked common mode filter includes a filter stack 110, a first external electrode 120, a second external electrode 130, a third external electrode 140, and a third external electrode 140. It is comprised of four external electrodes 150, a fifth external electrode 160, and a sixth external electrode 170.
  • the stacked common mode filter operates as a 2-channel C-PHY common mode filter.
  • the filter stack 110 is a stack of an electrode layer 200, a first capacitance layer 300a, and a second capacitance layer 300b.
  • the electrode layer 200 is composed of a laminate in which a plurality of coil patterns are formed. At this time, a magnetic layer formed of ferrite or the like may be further laminated on the electrode layer 200.
  • the electrode layer 200 is formed by stacking a plurality of sheets on which a coil pattern is formed. Coil patterns formed on a plurality of sheets constitute different channels.
  • the electrode layer 200 is composed of a plurality of sheets on which a coil pattern is formed, and includes a first sheet 210, a second sheet 220 disposed below the first sheet 210, and a first sheet 210. Configuration including a third sheet 230 interposed between the first sheet 210 and the second sheet 220 and a fourth sheet 240 interposed between the second sheet 22 and the third sheet 230. do.
  • the first sheet 210 is disposed on the top of the electrode layer 200.
  • a first coil pattern 211 constituting a first channel is disposed on the first sheet 210.
  • the first coil pattern 211 is disposed on the upper surface of the first sheet 210.
  • the first coil pattern 211 forms a loop wound around the center of the first sheet 210 a plurality of times.
  • the first end 211a of the first coil pattern 211 is disposed adjacent to the center of the first sheet 210.
  • the first end 211a of the first coil pattern 211 is connected to the coil pattern formed on the second sheet 220 through the first via hole V1.
  • the first via hole V1 is adjacent to the center of the first sheet 210 and is disposed at the first end 211a of the first coil pattern 211.
  • the first via hole V1 is formed to penetrate the first sheet 210, the third sheet 230, and the fourth sheet 240, and is formed in the first coil pattern 211 and the second sheet 220. Connect the coil pattern.
  • the second end 211b of the first coil pattern 211 is disposed on the same line as the second side of the first sheet 210, which is opposite to the first side of the first sheet 210. Accordingly, the second end 211b of the first coil pattern 211 is exposed to the second side S2 of the filter stack 110.
  • the second side S2 of the filter stack 110 is the side opposite to the first side S1 of the filter stack 110.
  • the second sheet 220 is disposed below the first sheet 210.
  • a second coil pattern 221 constituting a first channel together with the first coil pattern 211 of the first sheet 210 is disposed on the second sheet 220.
  • the second coil pattern 221 is disposed on the upper surface of the second sheet 220.
  • the second coil pattern 221 forms a loop wound around the center of the second sheet 220 a plurality of times.
  • the first end 221a of the second coil pattern 221 is disposed adjacent to the center of the second sheet 220.
  • the first end 221a of the second coil pattern 221 is connected to the first end 211a of the first coil pattern 211 formed on the first sheet 210 through the first via hole V1. Accordingly, the first coil pattern 211 and the second coil pattern 221 constitute a first channel.
  • the second end 221b of the second coil pattern 221 is disposed on the same line as the first side of the second sheet 220. Accordingly, the second end 221b of the second coil pattern 221 is exposed to the first side S1 of the filter stack 110.
  • the third sheet 230 is interposed between the first sheet 210 and the second sheet 220.
  • a third coil pattern 231 constituting the second channel is disposed on the third sheet 230.
  • the third coil pattern 231 is disposed on the upper surface of the third sheet 230.
  • the third coil pattern 231 forms a loop wound around the center of the third sheet 230 a plurality of times.
  • the first end 231a of the third coil pattern 231 is disposed adjacent to the center of the third sheet 230.
  • the first end 231a of the third coil pattern 231 is connected to the coil pattern formed on the fourth sheet 240 through the second via hole V2.
  • the second via hole V2 is adjacent to the center of the third sheet 230 and is disposed at the first end 231a of the third coil pattern 231.
  • the second via hole V2 is formed to penetrate the third sheet 230 and connects the third coil pattern 231 and the coil pattern formed on the fourth sheet 240.
  • the second end 231b of the third coil pattern 231 is disposed on the same line as the first side of the third sheet 230. Accordingly, the second end 231b of the third coil pattern 231 is exposed to the first side of the filter stack 110.
  • a first via hole V1 is formed in the third sheet 230 and spaced apart from the first end 231a of the third coil pattern 231.
  • the first via hole V1 of the third sheet 230 connects the first via hole V1 of the fourth sheet 240 and the first end 211a of the first coil pattern 211.
  • the fourth sheet 240 is disposed below the third sheet 230 and is interposed between the second sheet 220 and the third sheet 230.
  • a fourth coil pattern 241 constituting a second channel together with a third coil pattern 231 is disposed on the fourth sheet 240.
  • the fourth coil pattern 241 is disposed on the upper surface of the fourth sheet 240.
  • the fourth coil pattern 241 forms a loop that winds around the center of the fourth sheet 240 a plurality of times.
  • the first end 241a of the fourth coil pattern 241 is disposed adjacent to the center of the fourth sheet 240.
  • the first end 241a of the fourth coil pattern 241 is connected to the first end 231a of the third coil pattern 231 through the second via hole V2.
  • the second end 241b of the fourth coil pattern 241 is disposed on the same line as the second side of the fourth sheet 240, which is opposite to the first side of the fourth sheet 240. Accordingly, the second end 241b of the fourth coil pattern 241 is exposed to the second side S2 of the filter stack 110.
  • a first via hole V1 is formed in the fourth sheet 240 and spaced apart from the first end 241a of the fourth coil pattern 241.
  • the first via hole V1 of the fourth sheet 240 connects the first via hole V1 of the third sheet 230 and the first end 241a of the fourth coil pattern 241.
  • the coil pattern and terminal pattern formed on the sheets constituting the electrode layer 200 may be modified into various shapes.
  • the electrode layer 200 can be modified into various forms, such as the shape of the loop formed by the coil pattern and the position where the end is exposed.
  • the order in which the first coil pattern 211, the second coil pattern 221, the third coil pattern 231, and the fourth coil pattern 241 are stacked maintains the order shown in the drawing.
  • the electrode layer 200 includes a first coil pattern 211, a second coil pattern 221, a third coil pattern 231, and a fourth coil pattern 241. At this time, the first coil pattern 211 and the second coil pattern 221 form the first coil constituting the first channel, and the third coil pattern 231 and the fourth coil pattern 241 form the second channel. A second coil is formed.
  • the stacked common mode filter according to an embodiment of the present invention can make the distance (spacing) between the coil patterns constituting each channel constant, so that the resistance and inductance of the coil patterns constituting each channel are uniform. It can be maintained.
  • the first capacitance layer 300a is composed of a laminate in which a ground pattern and a plurality of capacitor patterns are formed.
  • the first capacitance layer 300a is disposed on top of the electrode layer 200.
  • the first capacitance layer 300a may be laminated on top of the electrode layer 200 with a magnetic layer formed of ferrite or the like interposed between the first capacitance layer 300a and the electrode layer 200.
  • a magnetic layer formed of ferrite or the like may be further stacked on the first capacitance layer 300a.
  • the second capacitance layer 300b is composed of a laminate in which a ground pattern and a plurality of capacitor patterns are formed.
  • the second capacitance layer 300b is disposed below the electrode layer 200.
  • the second capacitance layer 300b may be laminated on the lower part of the electrode layer 200 with a magnetic layer formed of ferrite or the like interposed between the second capacitance layer 300b and the electrode layer 200.
  • a magnetic layer formed of ferrite, etc. may be further stacked on the lower part of the second capacitance layer 300b.
  • the first capacitance layer 300a and the second capacitance layer 300b are composed of two fifth sheets 310 on which a plurality of capacitor patterns 311 are formed and two fifth sheets 310 on which a ground pattern is formed. It may be composed of an SGSG stacked structure in which six sheets 320 are alternately stacked.
  • the first capacitance layer 300a and the second capacitance layer 300b are arranged to be symmetrical with the electrode layer 200 interposed therebetween.
  • the first capacitance layer 300a is formed by stacking a fifth sheet 310 on the lower part of the sixth sheet 320, and another sixth sheet (310) on the lower part of the fifth sheet 310. 320) are stacked, and another fifth sheet 310 is stacked on the lower part of the other sixth sheet 320. Accordingly, the sixth sheet 320 is disposed at the uppermost part of the first capacitance layer 300a, and the fifth sheet 310 is disposed at the lowermost part of the first capacitance layer 300a.
  • the second capacitance layer 300b is formed by stacking a sixth sheet 320 on the lower part of the fifth sheet 310, and another fifth sheet 310 on the lower part of the sixth sheet 320. They are stacked, and another sixth sheet 320 is stacked on the lower part of the other fifth sheet 310. Accordingly, the fifth sheet 310 is disposed at the uppermost part of the second capacitance layer 300b, and the sixth sheet 320 is disposed at the lowermost part of the second capacitance layer 300b.
  • a plurality of capacitor patterns 311 are disposed on the upper surface of the fifth sheet 310.
  • the plurality of capacitor patterns 311 are arranged to overlap the coil pattern included in the electrode layer 200. Additional capacitance is formed between the plurality of capacitor patterns 311 and the coil pattern.
  • the plurality of capacitor patterns 311 form additional notches in the common mode attenuation characteristics to expand the attenuation band, so that the stacked common mode filter has an attenuation band between approximately 1 GHz and 10 GHz. It should have broadband characteristics.
  • the capacitor pattern 311 consists of a plurality of patterns disposed at the input and output terminals of the stacked common mode filter.
  • a first capacitor pattern 312, a second capacitor pattern 313, a third capacitor pattern 314, and a fourth capacitor pattern 315 are formed on the fifth sheet 310. .
  • the first capacitor pattern 312 and the second capacitor pattern 313 are disposed at the input terminal of the stacked common mode filter (i.e., the first side (S1) of the filter stack 110), and the third capacitor pattern ( 314) and the fourth capacitor pattern 315 are disposed at the output terminal of the stacked common mode filter (that is, the second side S2 of the filter stack 110).
  • the first capacitor pattern 312 is disposed on the upper surface of the fifth sheet 310.
  • the first end 312a of the first capacitor pattern 312 is disposed adjacent to the center of the fifth sheet 310.
  • the second end 312b of the first capacitor pattern 312 is disposed on the same line as the first side of the fifth sheet 310. Accordingly, the first capacitor pattern 312 is exposed to the first side S1 of the filter stack 110.
  • the second capacitor pattern 313 is disposed on the upper surface of the fifth sheet 310 to be spaced apart from the first capacitor pattern 312.
  • the first end 313a of the second capacitor pattern 313 is disposed adjacent to the center of the fifth sheet 310.
  • the second end 313b of the second capacitor pattern 313 is disposed on the same line as the first side of the fifth sheet 310. Accordingly, the second capacitor pattern 313 is exposed to the first side S1 of the filter stack 110.
  • the third capacitor pattern 314 is disposed on the upper surface of the fifth sheet 310.
  • the first end 314a of the third capacitor pattern 314 is disposed adjacent to the center of the fifth sheet 310 and is disposed to face the first end 312a of the first capacitor pattern 312.
  • the second end 314b of the third capacitor pattern 314 is disposed on the same line as the second side of the fifth sheet 310. Accordingly, the third capacitor pattern 314 is exposed to the second side S2 of the filter stack 110.
  • the fourth capacitor pattern 315 is disposed on the upper surface of the fifth sheet 310 to be spaced apart from the third capacitor pattern 314.
  • the first end 315a of the fourth capacitor pattern 315 is disposed adjacent to the center of the fifth sheet 310 and is disposed to face the first end 313a of the second capacitor pattern 313.
  • the second end 315b of the fourth capacitor pattern 315 is disposed on the same line as the second side of the fifth sheet 310. Accordingly, the fourth capacitor pattern 315 is exposed to the second side S2 of the filter stack 110.
  • the capacitor pattern 311 is exposed to the input terminal of the stacked common mode filter (i.e., the first side (S1) of the filter stack 110), and the third capacitor pattern 314 and the fourth capacitor pattern 315 are exposed.
  • the first capacitor pattern 312 and the second capacitor pattern 313 may be exposed to the output terminal of the stacked common mode filter (i.e., the second side of the filter stack 110).
  • a ground pattern 321 is disposed on the sixth sheet 320.
  • the ground pattern 321 is disposed on the upper surface of the sixth sheet 320.
  • the ground pattern 321 may include a first pattern 321a, a second pattern 321b, and a third pattern 321c.
  • the first pattern 321a is formed in a plate shape and disposed at the center of the upper surface of the sixth sheet 320, and may be formed as an island pattern spaced apart from the four sides of the sixth sheet 320.
  • the second pattern 321b extends from the third side of the first pattern 321a and is disposed on the same line as the third side of the sixth sheet 320. That is, the first end of the second pattern 321b is connected to the third side of the first pattern 321a, and the second end of the second pattern 321b is the same as the third side of the sixth sheet 320. It is arranged to be located on a line.
  • the third pattern 321c extends from the fourth side of the first pattern 321a and is disposed on the same line as the fourth side of the sixth sheet 320. That is, the first end of the third pattern 321c is connected to the fourth side of the first pattern 321a, and the second end of the third pattern 321c is the same as the fourth side of the sixth sheet 320. It is arranged to be located on a line.
  • the second pattern 321b and the third pattern 321c have a symmetrical shape with the first pattern 321a interposed therebetween, and the ground pattern 321 is formed on the third side (S3) of the filter stack 110. ) and is exposed to the fourth side (S4).
  • the first capacitance layer 300a and the second capacitance layer 300b are composed of two fifth sheets 310 on which a plurality of capacitor patterns 311 are formed and three sheets on which a ground pattern 321 is formed. It may be configured in a GSGSG stacked structure in which 6 sheets 320 are alternately stacked. That is, the capacitance layer 300 may be formed by stacking three sixth sheets 320 in sequence and stacking the fifth sheet 310 between two adjacent sixth sheets 320. At this time, the first capacitance layer 300a and the second capacitance layer 300b are configured to be symmetrical with the filter stack 110 interposed therebetween.
  • the positions of the additional poles of the stacked common mode filter are controlled by the capacitance. Accordingly, the number, shape, and arrangement position of the ground pattern 321 and the capacitor pattern 311 included in the first capacitance layer 300a and the second capacitance layer 300b may vary depending on the location of the additional pole.
  • the stacked common mode filter includes a stacked common mode filter (SGSG structure) including a capacitance layer in which two ground sheets and two capacitance sheets are stacked, and a capacitor in which three ground sheets and two capacitance sheets are stacked. It can be composed of a stacked common mode filter (GSGSG structure) including a layer.
  • GGSG structure stacked common mode filter
  • the ground sheet corresponds to the sixth sheet 320
  • the capacitance sheet corresponds to the fifth sheet 310.
  • the secondary resonance point (RP1) of the stacked common mode filter of the SGSG structure is formed at a first frequency higher than 1Gh
  • the secondary resonance point (RP2) of the stacked common mode filter of the GSGSG structure is formed at a second frequency higher than 1Gh and lower than the first frequency. formed at a frequency.
  • the secondary resonance point of the stacked common mode filter moves to a relatively low frequency when the capacitor pattern and/or ground pattern are added to the capacitance layers 300a and 300b, and when the capacitor pattern and/or ground pattern are reduced, it moves to a relatively low frequency. It can be seen that it moves to a high frequency.
  • the first external electrode 120 is disposed on the second side of the filter stack 110.
  • the first external electrode 120 is disposed adjacent to the third side of the filter stack 110.
  • the first external electrode 120 is formed at the second end 211b of the first coil pattern 211 and the second end 314b of the third capacitor patterns 314 exposed to the second side of the filter laminate 110. connected to the fields Both ends of the first external electrode 120 may be formed to extend to the upper and lower surfaces of the filter stack 110.
  • the second external electrode 130 is disposed on the second side of the filter stack 110.
  • the second external electrode 130 is disposed adjacent to the fourth side of the filter stack 110.
  • the second external electrode 130 is formed at the second end 241b of the fourth coil pattern 241 and the second end 315b of the fourth capacitor pattern 315 exposed to the second side of the filter laminate 110. is connected to Both ends of the second external electrode 130 may be formed to extend to the upper and lower surfaces of the filter stack 110.
  • the third external electrode 140 is disposed on the first side of the filter stack 110.
  • the third external electrode 140 is disposed adjacent to the third side of the filter stack 110.
  • the third external electrode 140 is formed at the second end 221b of the second coil pattern 221 and the second end 312b of the first capacitor pattern 312 exposed to the first side of the filter laminate 110. is connected to Both ends of the third external electrode 140 may be formed to extend to the upper and lower surfaces of the filter stack 110.
  • the fourth external electrode 150 is disposed on the first side of the filter stack 110.
  • the fourth external electrode 150 is disposed adjacent to the fourth side of the filter stack 110.
  • the fourth external electrode 150 is formed at the second end 231b of the third coil pattern 231 and the second end 313b of the second capacitor pattern 313 exposed to the first side of the filter laminate 110. is connected to Both ends of the fourth external electrode 150 may be formed to extend to the upper and lower surfaces of the filter stack 110.
  • the fifth external electrode 160 is disposed on the third side of the filter stack 110.
  • the fifth external electrode 160 is connected to the second pattern 321b of the ground pattern 321 exposed to the third side of the filter stack 110. Both ends of the fifth external electrode 160 may be formed to extend to the upper and lower surfaces of the filter stack 110.
  • the sixth external electrode 170 is disposed on the fourth side of the filter stack 110.
  • the sixth external electrode 170 is connected to the third pattern 321c of the ground pattern 321 exposed to the third side of the filter stack 110. Both ends of the sixth external electrode 170 may be formed to extend to the upper and lower surfaces of the filter stack 110.
  • the first external electrode 120 and the third external electrode 140 operate as inputs and outputs of the first channel formed by the first coil pattern 211 and the second coil pattern 221.
  • the second external electrode 130 and the fourth external electrode 150 operate as inputs and outputs of the second channel formed by the third coil pattern 231 and the fourth coil pattern 241.
  • the stacked common mode filter includes a first coil (i.e., first coil pattern 211 and second coil pattern 221) and a second coil (i.e., third coil). Capacitance C1 is formed between the pattern 231 and the fourth coil pattern 241.
  • the first capacitance layer 300a and the second capacitance layer 300b are respectively disposed on the top and bottom of the electrode layer 200, so that the first coil 211 and Additional capacitances C2 and C3 are formed by the coupling effect between the second coils 231 and 241 and the capacitor pattern 521, and by the coupling effect between the second coils 231 and 241 and the capacitor pattern 521. Additional capacitances C4 and C5 are formed by .
  • the capacitance can be increased without adding an electrode layer composed of a sheet layer on which a coil pattern is formed. You can.
  • the stacked common mode filter according to an embodiment of the present invention has an additional notch in the common mode attenuation characteristics as additional capacitance is formed between the coil and the capacitor pattern 521.
  • additional capacitance is formed between the coil and the capacitor pattern 521.
  • the stacked common mode filter according to an embodiment of the present invention can prevent the differential mode insertion loss from decreasing in the attenuation band as additional capacitance is formed between the coil and the capacitor pattern 521. there is.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)

Abstract

L'invention concerne un filtre en mode commun multicouche ayant des première et deuxième couches de capacité disposées sur les surfaces supérieure et inférieure, respectivement, d'une couche d'électrode pourvue d'une pluralité de motifs de bobine qui forment deux canaux. Le filtre en mode commun multicouche selon l'invention comprend des première et deuxième couches de capacité, symétriques avec une couche d'électrode interposée entre celles-ci, les première et deuxième couches de capacité étant sous la forme de motifs de masse et de motifs de condensateur empilés en alternance, et, conjointement avec un pôle formé par les motifs de bobine, un pôle supplémentaire est formé par les couches de capacité et les motifs de bobine pour présenter des caractéristiques à large bande.
PCT/KR2023/013343 2022-09-27 2023-09-06 Filtre en mode commun multicouche WO2024071719A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220122183A KR20240043294A (ko) 2022-09-27 2022-09-27 적층형 공통 모드 필터
KR10-2022-0122183 2022-09-27

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WO2024071719A1 true WO2024071719A1 (fr) 2024-04-04

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950035560A (ko) * 1994-05-19 1995-12-30 우덕창 칩형의 lc복합 필터의 제조방법
JP2000114048A (ja) * 1998-10-05 2000-04-21 Kankyo Denji Gijutsu Kenkyusho:Kk コモンモードフィルタ
JP2016225394A (ja) * 2015-05-28 2016-12-28 Tdk株式会社 積層コモンモードフィルタ
US20170294257A1 (en) * 2014-11-05 2017-10-12 Panasonic Intellectual Property Management Co., Ltd. Common mode noise filter
KR20210043382A (ko) * 2019-10-11 2021-04-21 주식회사 아모텍 적층형 공통 모드 필터

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6740854B2 (ja) 2016-10-24 2020-08-19 Tdk株式会社 積層コモンモードフィルタ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950035560A (ko) * 1994-05-19 1995-12-30 우덕창 칩형의 lc복합 필터의 제조방법
JP2000114048A (ja) * 1998-10-05 2000-04-21 Kankyo Denji Gijutsu Kenkyusho:Kk コモンモードフィルタ
US20170294257A1 (en) * 2014-11-05 2017-10-12 Panasonic Intellectual Property Management Co., Ltd. Common mode noise filter
JP2016225394A (ja) * 2015-05-28 2016-12-28 Tdk株式会社 積層コモンモードフィルタ
KR20210043382A (ko) * 2019-10-11 2021-04-21 주식회사 아모텍 적층형 공통 모드 필터

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