WO2024071256A1 - Puce à microcanal et son procédé de fabrication - Google Patents

Puce à microcanal et son procédé de fabrication Download PDF

Info

Publication number
WO2024071256A1
WO2024071256A1 PCT/JP2023/035289 JP2023035289W WO2024071256A1 WO 2024071256 A1 WO2024071256 A1 WO 2024071256A1 JP 2023035289 W JP2023035289 W JP 2023035289W WO 2024071256 A1 WO2024071256 A1 WO 2024071256A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
microchannel chip
recess
channel
chip
Prior art date
Application number
PCT/JP2023/035289
Other languages
English (en)
Japanese (ja)
Inventor
崇志 安田
修一 高師
修平 大島
亮丞 石井
Original Assignee
株式会社精工技研
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社精工技研 filed Critical 株式会社精工技研
Publication of WO2024071256A1 publication Critical patent/WO2024071256A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/08—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a stream of discrete samples flowing along a tube system, e.g. flow injection analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N37/00—Details not covered by any other group of this subclass

Definitions

  • the present invention relates to a microchannel chip in which the bonding surfaces of opposing substrates are bonded together to form a microchannel therebetween, and a method for manufacturing the same.
  • a microchannel chip is a molded product that has two or more substrates adhesively bonded together, with minute microchannel grooves between them, measuring between a few hundred nanometers and 1 mm wide. Reagents and specimens are injected through holes that connect to the channel, and the chip is used for separating, analyzing, detecting, and other applications of samples.
  • microfluidic chips Typical applications include analysis in the medical and pharmaceutical fields, compound synthesis, and environmental measurement. When microfluidic chips are used for these applications, it is possible to obtain benefits such as shorter analysis times compared to the use of conventional analytical devices suitable for similar applications.
  • Patent Document 1 is known as a bonding method that can bond resin to resin at a lower temperature than bonding by heat fusion.
  • the object of the present invention is to provide a microchannel chip that reduces the inclusion of air bubbles when bonding without using adhesives, and that makes it possible to collect liquid outside the channel when it leaks from the inlet and outlet, and a method for manufacturing the same.
  • the microchannel chip according to one aspect of the present invention that solves the above problems is a microchannel chip formed in a light-transmitting plate shape, and having a channel groove with all parts sealed inside except for an inlet and an outlet
  • the microchannel chip comprises a first substrate and a second substrate, the first substrate has a channel groove formed therein, a first bonding surface for bonding the first substrate to the second substrate, and a recess not communicating with the channel groove formed therein, the second substrate has a second bonding surface for bonding the first substrate to the first substrate, and at least one of an inlet communicating with the channel groove or a discharge port communicating with the channel groove formed therein, and at least one of the first substrate and the second substrate has an opening formed therein that connects to the recess.
  • the opening is formed in the second substrate in the same direction as the recess.
  • the opening is formed on at least one of the side surfaces of the first substrate and the second substrate.
  • the area of the recess is larger than the area of the opening.
  • the depth of the recess from the first joining surface is deeper than the depth of the flow channel.
  • the edge of the opening is formed lower than the height of the edge of either the inlet or the outlet, the difference in edge height is 0.1 ⁇ m or more, and a mouth recess is formed that is thinner than the thickness of the second substrate.
  • first and second bonding surfaces do not have an adhesive or pressure-sensitive adhesive layer.
  • a plurality of flow grooves are arranged independently and that recesses are arranged between the flow grooves.
  • an optical measurement observation surface is formed on a second substrate located above a flow channel formed on the first substrate.
  • a method for manufacturing a microchannel chip for a microchannel chip formed in a light-transmitting plate shape, with a channel groove sealed internally except for an inlet and an outlet, the microchannel chip comprising a first substrate and a second substrate, the first substrate having a channel groove formed therein, a first bonding surface for bonding the first substrate to the second substrate by stacking the first substrate together, and a recess not communicating with the channel groove formed therein, the second substrate having a second bonding surface for bonding the first substrate to the first substrate by stacking the first substrate together, at least one of an inlet communicating with the channel groove or a discharge port communicating with the channel groove formed therein, and at least one of the first substrate and the second substrate having an opening formed therein that connects to the recess.
  • the present invention provides a microchannel chip and a method for manufacturing the same, which can remove residual air bubbles at the bonding surfaces by using the openings as degassing holes, even if air bubbles remain between the two substrates to be bonded during the process of bonding the bonding surfaces, and in addition, when liquid leaks from the inlet and outlet, it flows into the grooves of the recessed portion and can be stored therein.
  • the opening becomes a burr part for liquid that accumulates in the groove of the recess, making it less likely for the liquid to spill out.
  • the scattered light from the sample is refracted or totally reflected by the gradient section, thereby suppressing the light returning to the flow path, and also reducing noise light to other flow path sections.
  • FIG. 2 is an explanatory diagram showing an example of a configuration of a microchannel chip as viewed from the second substrate side.
  • FIG. 2 is a cross-sectional view showing an outline of the functions of the microchannel chip.
  • FIG. 2 is a schematic diagram showing an example of an opening of the micro-channel chip.
  • FIG. 2 is a schematic diagram showing an example of an opening of the microchannel chip.
  • FIG. 2 is a schematic diagram showing an example of an opening of the microchannel chip.
  • FIG. 2 is a schematic diagram showing the function of an opening of the microchannel chip.
  • FIG. 2 is an explanatory diagram showing that a plurality of flow channel grooves and recesses are formed in a micro-flow channel chip.
  • FIG. 2 is a cross-sectional view showing an outline of a sloped side surface of a recess of a micro-channel chip.
  • 11A and 11B are diagrams showing examples of height differences on the surfaces of the edges of an opening portion.
  • 11A and 11B are cross-sectional views showing the function of the openings in the bonding process.
  • 5A to 5C are cross-sectional views showing examples of the arrangement and height difference of flow channel grooves and recesses according to the embodiment.
  • FIG. 1 is a diagram showing an outline of a micro-channel chip (hereinafter simply referred to as a "micro-channel chip") 3 according to this embodiment.
  • FIG. 2 is a diagram showing a schematic cross-sectional view of the micro-channel chip 3. More specifically, the micro-channel chip 3 is formed by stacking a first substrate 1 and a second substrate 2 and bonding them together.
  • the joining surface 11 of the first substrate 1 is formed with a flow channel 12 that is sealed except for the inlet 22 and outlet 22, and a recess 13 that is not connected to the flow channel 12.
  • the joining surface 21 of the second substrate 2 is formed with an opening 23 that opens upward like the inlet 22 and outlet 22.
  • the substrate 1 on which the flow channel 12 and the recess 13 are formed is referred to as the "first substrate", and the other substrate that is overlaid on the first substrate is referred to as the "second substrate”.
  • first and second are counters used to easily distinguish between the two substrates when describing the micro-channel chip according to this embodiment, and have no other technical meaning.
  • a recess may be provided not only in the first substrate but also in the second substrate. That is, the flow channel 12 and the recess 13 may be formed on the bonding interface 31 between the bonding surface 11 of the first substrate 1 and the bonding surface 21 of the second substrate 2.
  • a plurality of recesses 13 may be formed on the first substrate 1.
  • an inlet 22 and an outlet 22 are formed in the second substrate 2.
  • the inlet 22 and the outlet 22 are connected to the channel 12, and it is possible to inject liquid from the inlet 22 and discharge the liquid from the outlet 22 via the channel 12. It is preferable that both the inlet 22 and the outlet 22 are provided on the bonding surface 21 of the second substrate, but this is not limiting, and it is sufficient that at least one of these is formed in the second substrate 2.
  • the microchannel chip 3 is optically transparent. If there are no particular problems with the required heat resistance and durability, a resin that is suitable for mass production by a manufacturing method is selected as the material, but glass, which has excellent transparency, is also a preferred example.
  • the resin which is the main component, is preferably a polymeric material that can be processed and molded into the desired shape.
  • the resin that can be used in the first substrate 1 is not limited as long as it can obtain the desired refractive index, but examples include thermoplastic resins such as polycarbonate, polyethylene, polypropylene, polyvinyl chloride, polyester, acrylic, cycloolefin polymer (COP), and cyclic olefin copolymer (COC), thermosetting resins such as phenolic resin, polyurethane, and thermosetting polyimide, and photocurable resins.
  • the resin is not limited as long as it has optical transparency, but may be colorless transparent, colorless translucent, colored transparent, or colored translucent.
  • each substrate before bonding can be produced by various molding methods such as injection molding using a mold in which fine flow paths and protrusions are formed.
  • the thickness of the substrate does not matter, and it can be a film.
  • the size of the channel 12 is not limited and various widths and shapes can be adopted as long as the function of the microchannel chip can be exhibited, but a typical preferred range is assumed to be a width of 0.1 ⁇ m to 1 mm and a depth of 0.1 ⁇ m to 1 mm.
  • Generally known methods for producing fine irregularities in grooves such as flow paths include metal cutting dies, a combination of electron beam lithography and plasma etching, and photolithography.
  • the microstructures formed can also be formed as electroformed dies.
  • the fine irregularities in the formed flow path grooves can be transferred to resin or the like as a die, making mass production possible.
  • injection port 22, the discharge port 22, and the opening 23 that penetrate the second substrate 2 can be formed by any method, such as molding using a mold structure, additional machining by cutting, pressing, laser processing, etc.
  • a cover is provided on the flow channel 12, and the substrates are joined together in the bonding process.
  • this embodiment shows an example in which the recess 13 and the opening 23 connected thereto are in the same direction.
  • This configuration has the advantage that even if liquid leaks from the inlet and outlet 22 formed in the second substrate 2, the liquid can be stored in the recess 13 from the opening 23. However, they do not necessarily have to be in the same direction, as long as the opening 23 connected to the recess 13 is formed in the first substrate 1 and the second substrate 2.
  • the same direction here means that they are formed on the same surface side when looking at the microchannel chip 3 according to this embodiment.
  • Figures 3, 4 and 5 show an example of another embodiment of the present invention in which the openings 23 are formed in a perpendicular direction instead of in the same direction.
  • the openings 23 are formed on the side of the micro-channel chip 3. Doing it this way has the advantage that molding is easier, and the area required for bonding can be reduced, resulting in increased bonding strength.
  • the pretreatment process is a process for facilitating bonding of the substrates, and a specific example thereof is preferably surface modification of the first bonding surface 11 and the second bonding surface 21 of each substrate to make them hydrophilic.
  • the modification method may be either vacuum plasma treatment or atmospheric pressure plasma treatment, and the surface modification process of the bonding surfaces of both substrates may be, in addition to plasma treatment, vacuum ultraviolet (VUV) treatment in which vacuum ultraviolet (VUV) rays are irradiated from an excimer lamp to the bonding surfaces, corona discharge treatment, etc. Since the fine flow path portion may be distorted due to heat generation, it is preferable to select vacuum plasma treatment or vacuum ultraviolet (VUV) rays, which suppress heat generation, but vacuum ultraviolet (VUV) treatment is more preferable in terms of production process under atmospheric pressure.
  • VUV vacuum ultraviolet
  • the bonding surfaces of each pretreated substrate are bonded together by a thermal pressurizing process.
  • bonding can be efficiently performed by applying pressure from both sides.
  • the heating time is preferably adjusted appropriately between a few seconds and a few minutes, depending on the heat resistance of the resin and the thicker the substrate, since it takes longer for heat to be transmitted to the bonding surfaces.
  • bonding can also be performed at room temperature. Bonding can also be performed with a pressure of about several kgf, but the pressure must be increased depending on the size of the microchannel chip 3 to be bonded and air bubbles present on the bonding surfaces.
  • the thermal pressurizing process should be performed promptly within a few minutes, but thermal pressurizing bonding can also be performed over several days.
  • the above bonding method does not use any adhesive or glue, so bonding is possible without blocking or blocking the cross section of the micro flow channel. In this case, there is no adhesive or sticky layer between the first bonding surface 11 and the second bonding surface 21. It goes without saying that bonding is also possible with a micro flow chip 3 having three or more stacked substrates. In addition, by having the recess 13 and the opening 23, the area of the bonding surface to be pressed can be reduced, and as a result, bonding can be performed with less pressure, and deformation of the flow channel 12, etc. can be reduced.
  • the outer surface of the microchannel chip 3 according to this embodiment may be covered with a coating, deposition, or sputtering protective layer, or a seal, film, paint such as ink, etc., as long as the characteristics of the liquid injection and discharge sections, optical observation section, and openings are maintained. This allows for freedom in product design.
  • the liquid in the unlikely event that liquid leaks from the inlet 22 and outlet 22 during use, the liquid can be stored in the recess 13 from the opening 23.
  • the recess 13 can act as a receiver to store liquid that leaks from the bonding interface 31 due to unintended liquid pressure, preventing it from leaking out of the micro-channel chip 3.
  • the presence of the opening 23 prevents the pressure in the recess 13 from increasing due to the leaked liquid, preventing further peeling of the bonding interface 31 and preventing unnecessary liquid from leaking out again onto the surface of the micro-channel chip 3.
  • the recess 13 is disposed between the multiple independent flow channels 12.
  • the area of the opening 23 as viewed from the Z direction (top and bottom sides) of the chip surface is smaller than the area of the recess 13.
  • the area of the recess 13 as viewed from the Z direction of the micro-channel chip 3 surface is larger than the area of the opening 23.
  • the bonding surface of the second substrate 2 covers the recess 13, forming a burr surface 15, making it difficult for the accumulated liquid to return to the surface.
  • the shape may also be designed as long as it can perform its function. In the case of multiple openings 23, it is similarly preferable that the bonding surface covers the recess 13.
  • the cross-sectional shape of the recess 13 may also have a step.
  • the bottom of the recess 13 is the same as or lower than the depth of the flow channel 12. In this way, the volume of the recess 13 can be made larger than the total volume of the flow channel 12, making it possible to provide some leeway for the liquid that can be stored.
  • these recesses 13 may be connected to each other via grooves that are not connected to the flow channel 12, or may be arranged to surround the flow channel 12. Since liquid may similarly flow in directions other than those of the arrows in Figure 6, it is preferable to form openings 23 and recesses 13 as appropriate depending on the design of the flow channel 12.
  • the substrate is optically transparent.
  • optically transparent refers to the property of transmitting at least a portion of incident light.
  • the transmittance of light (633 nm) in the flat portion and the finely uneven portion of the substrate is preferably more than 10% and not more than 60%, and more preferably 20% or more and not more than 50%. A transmittance of less than 10% is not preferred because the light for detection will not be transmitted.
  • the recess side surface 14 of the recess 13 in the first substrate 1 may be appropriately sloped. In the production process, if the molded product is made of resin, this not only makes it easier to release it from the mold, but also reduces the amount of unwanted light 4 that is generated in the flow channel 12 and returns to the flow channel side due to refraction and total reflection of the light on the recess side surface 14, thereby reducing optical noise.
  • the recess side surface 14 of the recess 13 is sloped, there is a drawback in that the light transmittance decreases if the substrate is colored and transparent, but it has the effect of absorbing scattered light and reducing noise light, and the optical path length and thickness of the molded part can be designed appropriately.
  • the material of the plate-shaped portions of the first substrate 1 and the second substrate 2 may be made of a resin that transmits only specific wavelength ranges, such as ultraviolet and infrared light. This makes it possible to eliminate the need for components such as filters on the detection device side.
  • the leaked liquid can be easily guided to the recess 13 by the height difference 33 between the edge 24 of the opening and the edges of the inlet 22 and the outlet 22.
  • the mouth recess 25 of the opening 23 can be shaped to have a flow path shape when viewed from the Z direction, or a shape that surrounds the inlet 22 and outlet 22, and can be shaped to guide the leaking liquid 32 to the opening 23, thereby improving its function.
  • a "mouth recess” refers to a recess formed on at least one of the first substrate and the second substrate, which connects multiple openings.
  • the heat pressurizing mold 5 does not come into contact with the optical measurement observation surface 26 during the heat pressurizing process, scratches on the observation surface can be prevented.
  • the configuration can be designed to prevent scratches when the microchannel chips are stacked or placed on top of each other during processing, transportation, and use.
  • the microchannel chip according to this embodiment can be given a unique design to prevent leakage of liquid during use, and can be used not only as a medical microchannel chip, but also as a molded product that reduces optical noise, such as a chip for chemical analysis equipment.
  • a resist pattern for the uneven parts of the flow path was formed using photolithography.
  • a fine uneven pattern was transferred from the resist pattern using electroforming to create a nickel mold, which was then attached to a mold for production using injection molding.
  • the nickel mold was then attached to the mold, and the pattern was transferred to the resin using injection molding.
  • the specifications of the molded product were multiple 1 mm thick flow channels with a pair of flat surfaces and a depth of 400 ⁇ m.
  • thermocompression bonding can be achieved without using adhesives for the resin materials acrylic, polystyrene, polycarbonate, cycloolefin polymer, and COC.
  • the present invention has industrial applicability as a microchannel chip and a manufacturing method thereof. Specifically, it is suitable for a microchannel chip and a manufacturing method thereof in which substrates are stacked and bonded together to form a microchannel between the bonded surfaces.
  • Second substrate 3 Microchannel chip 4: Unwanted light 5: Heat pressurization mold 11: Bonding surface of first substrate 12: Flow channel 13: Recess 14: Recess side 15: Curved surface 21: Bonding surface of second substrate 22: Inlet/outlet 23: Opening 24: Edge of opening 25: Mouth recess 26: Optical measurement observation surface 31: Bonding boundary surface 32: Leaking liquid 33: Edge height difference 51: Degassing flow 53: Through hole

Abstract

L'invention concerne : une puce à microcanal qui supprime le bruit optique de l'intérieur du canal, est apte à stocker une fuite de fluide provenant d'un orifice d'injection et d'un orifice d'évacuation et est obtenue par chevauchement et assemblage d'un seul tenant de substrats les uns avec les autres sans utiliser d'adhésif ; et son procédé de fabrication. Une puce à microcanal 3 selon la présente invention qui est formée en tant que plaque optiquement transparente et qui possède une rainure de canal 12, dont l'intérieur autre qu'un orifice d'injection 22 et un orifice d'évacuation 22 est rendue hermétique, ladite puce à microcanal 3 étant caractérisée en ce qu'elle est équipée d'un premier substrat 1 et d'un second substrat 2 et en ce que : le premier substrat a une rainure de canal formée en son sein, a une première surface de jonction 11 pour chevaucher et étant jointe d'un seul tenant au second substrat et a un évidement 13 formé en son sein qui n'est pas relié à la rainure de canal ; le second substrat a une seconde surface de jonction 21 de chevauchement et étant jointe d'un seul tenant au premier substrat et a un orifice d'injection qui est relié à la rainure de canal et/ou à un orifice d'évacuation qui est relié à la rainure de canal qui sont formées à l'intérieur de celui-ci ; et une ouverture 23 qui est reliée à l'évidement est formée dans le premier substrat et/ou le second substrat.
PCT/JP2023/035289 2022-09-29 2023-09-27 Puce à microcanal et son procédé de fabrication WO2024071256A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022155946 2022-09-29
JP2022-155946 2022-09-29

Publications (1)

Publication Number Publication Date
WO2024071256A1 true WO2024071256A1 (fr) 2024-04-04

Family

ID=90478050

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/035289 WO2024071256A1 (fr) 2022-09-29 2023-09-27 Puce à microcanal et son procédé de fabrication

Country Status (1)

Country Link
WO (1) WO2024071256A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004106508A (ja) * 2002-07-26 2004-04-08 Enplas Corp プレートの接着部構造
JP2007289818A (ja) * 2006-04-21 2007-11-08 Konica Minolta Medical & Graphic Inc マイクロリアクタおよびマイクロリアクタを用いたマイクロ総合分析システム
JP2009236555A (ja) * 2008-03-26 2009-10-15 Shimadzu Corp 流体デバイス及びその製造方法
WO2020021992A1 (fr) * 2018-07-24 2020-01-30 フコク物産株式会社 Dispositif à microcanaux et son procédé de fabrication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004106508A (ja) * 2002-07-26 2004-04-08 Enplas Corp プレートの接着部構造
JP2007289818A (ja) * 2006-04-21 2007-11-08 Konica Minolta Medical & Graphic Inc マイクロリアクタおよびマイクロリアクタを用いたマイクロ総合分析システム
JP2009236555A (ja) * 2008-03-26 2009-10-15 Shimadzu Corp 流体デバイス及びその製造方法
WO2020021992A1 (fr) * 2018-07-24 2020-01-30 フコク物産株式会社 Dispositif à microcanaux et son procédé de fabrication

Similar Documents

Publication Publication Date Title
US6555067B1 (en) Polymeric structures incorporating microscale fluidic elements
WO2019151150A1 (fr) Dispositif de canaux d'écoulement d'inspection et appareil d'inspection
US8377389B2 (en) Microfluidic circuit
US20110243813A1 (en) Diagnostic card with micro-fluidic channels and method of construction thereof
KR101434707B1 (ko) 수지제 부재의 접합 방법
JPWO2008117651A1 (ja) マイクロチップ
WO2024071256A1 (fr) Puce à microcanal et son procédé de fabrication
KR20100047977A (ko) 친수성 필름을 이용한 무동력 미세 유체 칩
JP2008216121A (ja) マイクロチップの製造方法
US9079359B2 (en) Microchip and method of manufacturing the same
JP2018083294A (ja) 基板の貼り合わせ方法、並びに、マイクロチップおよびその製造方法
US9162225B2 (en) Microchip
KR101151221B1 (ko) 마이크로 채널을 가진 구조물의 제조 방법 및 그 구조물
JP2011053091A (ja) 接合部材及びその製造方法
JP2005031064A (ja) 液体検査用チップ及びその作製方法
JP2013224896A (ja) マイクロ流体チップ及びその製造方法並びに化学装置
JP2010145083A (ja) 樹脂製接合品およびその製造方法
JP7458098B2 (ja) 流体分析用チップ
JP3132162U (ja) 樹脂製マイクロチャネルアレイ
US20230294979A1 (en) Method of manufacturing laminate
WO2023248963A1 (fr) Procédé de production de dispositif fluidique et dispositif fluidique
JP7443995B2 (ja) 微小流路形成部材
WO2022201469A1 (fr) Dispositif, système et procédé de gestion de liquide
JPWO2009101850A1 (ja) マイクロチップの製造方法、及びマイクロチップ
CN109415199B (zh) 具有歧管的微流体装置