Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/0225—Out-coupling of light
  • H01S5/02255—Out-coupling of light using beam deflecting elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/02208—Mountings; Housings characterised by the shape of the housings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/0225—Out-coupling of light
  • H01S5/02253—Out-coupling of light using lenses
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/0225—Out-coupling of light
  • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/02—Structural details or components not essential to laser action
  • H01S5/022—Mountings; Housings
  • H01S5/023—Mount members, e.g. sub-mount members
  • H01S5/02315—Support members, e.g. bases or carriers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
  • H01S5/00—Semiconductor lasers
  • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

Definitions

• This disclosure relates to a light emitting device and a light emitting module.
• Patent Document 1 discloses an example of a laser system that realizes such high-output laser light.
• the light emitting device of the present disclosure includes a base having a mounting surface, a plurality of semiconductor laser elements each having an emission surface for emitting laser light in a first direction and arranged on the mounting surface along a second direction intersecting the first direction, a plurality of first mirror members each having a first reflection surface for reflecting the laser light emitted from a corresponding semiconductor laser element among the plurality of semiconductor laser elements and changing the traveling direction of the laser light in a direction away from the mounting surface, an opposing surface facing the mounting surface, and an upper surface located on the opposite side of the opposing surface, and the plurality of semiconductor laser elements
• the laser element and the plurality of first mirror members are positioned above the cover, and the cover transmits the laser light reflected by the first reflecting surface.
• One or more second mirror members are disposed on the upper surface of the cover, and have a second reflecting surface that reflects the laser light that has passed through the cover, and further change the traveling direction of the laser light.
• the plurality of first mirror members are disposed on the mounting surface such that the positions of the first reflecting surfaces in the first direction are different from each other, and the mounting surface is used as a reference surface, and the heights of the optical axes of the laser light reflected by the second reflecting device from the reference surface are different from each other.
• the light emitting module of the present disclosure comprises the light emitting device, a plurality of fifth mirror members each having a fifth reflecting surface that reflects the laser light emitted from the corresponding semiconductor laser element and reflected in this order by the first reflecting surface and the second reflecting surface in a third direction, and a focusing lens that couples the plurality of laser lights obtained by the laser light emitted from each of the plurality of semiconductor laser elements being reflected in this order by the first reflecting surface, the second reflecting surface, and the fifth reflecting surface into an optical fiber.
• Another light emitting device of the present disclosure includes a base having a mounting surface, a plurality of first semiconductor laser elements each having a first emission surface that emits a first laser light in a first direction and arranged on the mounting surface along a second direction intersecting the first direction, a plurality of second semiconductor laser elements each having a second emission surface that emits a second laser light in the first direction and arranged on the mounting surface along the second direction, and a first reflector that reflects the first laser light emitted from a corresponding first semiconductor laser element among the plurality of first semiconductor laser elements.
• the laser diode includes a semiconductor laser element, a lid member located above the plurality of third mirror members and transmitting the first laser light reflected on the first reflecting surface and the second laser light reflected on the third reflecting surface, a second mirror member located on the upper surface of the lid member and having a second reflecting surface that reflects the first laser light transmitted through the lid member and further changing the traveling direction of the first laser light, and a fourth mirror member located on the upper surface of the lid member in a direction opposite to the first direction from the second mirror member and having a fourth reflecting surface that reflects the second laser light transmitted through the lid member and further changing the traveling direction of the second laser light
• Another light emitting module of the present disclosure comprises the other light emitting device, a plurality of fifth mirror members each having a fifth reflecting surface that reflects the first laser light emitted from the corresponding first semiconductor laser element and reflected by the first reflecting surface and the second reflecting surface in this order in a third direction, a plurality of sixth mirror members each having a sixth reflecting surface that reflects the second laser light emitted from the corresponding second semiconductor laser element and reflected by the third reflecting surface and the fourth reflecting surface in this order in the third direction, and a focusing lens that couples the plurality of first laser lights obtained by the first laser light emitted from each of the plurality of first semiconductor laser elements being reflected by the first reflecting surface, the second reflecting surface, and the fifth reflecting surface in this order, and the plurality of second laser lights obtained by the second laser light emitted from each of the plurality of second semiconductor laser elements being reflected by the third reflecting surface, the fourth reflecting surface, and the sixth reflecting surface in this order, into an optical fiber.
• heat generated from the multiple semiconductor laser elements during operation can be effectively dissipated to the outside of the light emitting device.
• FIG. 1A is a perspective view illustrating a schematic configuration of a light emitting device according to a first exemplary embodiment of the present disclosure.
• FIG. 1B is an exploded perspective view of the light emitting device shown in FIG. 1A.
• FIG. 1C is a top view of a configuration in which the lid, the second mirror member, and the slow-axis collimating lens array are omitted from the light-emitting device shown in FIG. 1A.
• FIG. 1D is a cross-sectional view of the light-emitting device shown in FIG. 1A, taken parallel to the YZ plane.
• FIG. 2A is a perspective view that illustrates a schematic configuration of a first modified example of the light emitting device according to the first embodiment of the present disclosure.
• FIG. 1A is a perspective view that illustrates a schematic configuration of a first modified example of the light emitting device according to the first embodiment of the present disclosure.
• FIG. 2B is an exploded perspective view that illustrates a schematic configuration of Modification 2 of the light emitting device according to the first embodiment of the present disclosure.
• FIG. 3A is a top view diagrammatically illustrating a configuration of a light emitting module according to the first exemplary embodiment of the present disclosure.
• FIG. 3B is a side view diagrammatically illustrating the configuration of the light emitting module according to the first exemplary embodiment of the present disclosure.
• FIG. 3C is another side view diagrammatically illustrating the configuration of the light emitting module according to the first exemplary embodiment of the present disclosure.
• FIG. 4A is a perspective view illustrating a schematic configuration of a light emitting device according to a second exemplary embodiment of the present disclosure.
• 4B is an exploded perspective view of the light emitting device shown in FIG.
• FIG. 4C is a top view of the light-emitting device shown in FIG. 4B omitting the lid and the components on the lid.
• FIG. 4D is a cross-sectional view parallel to the YZ plane of the light emitting device shown in FIG. 4A.
• FIG. 5A is a top view diagrammatically illustrating a configuration of a light emitting module according to a second exemplary embodiment of the present disclosure.
• FIG. 5B is a side view diagrammatically illustrating a configuration of a light emitting module according to the second exemplary embodiment of the present disclosure.
• FIG. 5C is another side view diagrammatically illustrating the configuration of the light emitting module according to the second exemplary embodiment of the present disclosure.
• FIG. 6A is an exploded perspective view of a laser light source.
• FIG. 6B is a cross-sectional view of the laser light source parallel to the YZ plane.
• the light emitting module includes multiple light emitting devices. Parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts.
• polygon when referring to polygons such as triangles or quadrangles, the term "polygon” includes shapes in which the corners of the polygon have been processed, such as by rounding, chamfering, removing the corners, or rounding off the edges. Shapes in which processing has been applied to the middle parts of the sides, not just the corners (edges), are also called polygons. In other words, shapes that have been partially processed while retaining the polygon as the base are included in the interpretation of "polygon" as described in this specification and claims.
• Fig. 1A is a perspective view that shows a schematic configuration of a light emitting device according to exemplary embodiment 1 of the present disclosure.
• the light emitting device 100A shown in Fig. 1A can be placed on, for example, a mounting surface of a support base. Details of the support base will be described later in the description of the light emitting module according to embodiment 1.
• Fig. 1B is an exploded perspective view of the light emitting device shown in Fig. 1A.
• the first mirror members 30a includes a base 10A, a plurality of laser light sources 20, a plurality of first mirror members 30a, a second mirror member 30b, a cover 40A, and a slow axis collimating lens array 50.
• the slow axis collimating lens array 50 is integrally formed and includes a plurality of slow axis collimating lenses 50s that each function as a lens.
• the base 10A has a mounting surface 10s.
• Each of the first mirror members 30a has a first reflecting surface 30as, and each of the second mirror members 30b has a second reflecting surface 30bs.
• the cover 40A has an upper surface 42 and a lower surface 44.
• the laser light source 20 is a chip-on-submount type semiconductor laser light source having a semiconductor laser element.
• the number of the laser light sources 20 is three, but this number is not limited to three.
• the number of the laser light sources 20 may be two, or four or more. It is preferable that the number of the first mirror members 30a and the slow-axis collimating lenses 50s is the same as the number of the laser light sources 20.
• the light-emitting device 100A may further include a protection element such as a Zener diode and/or a temperature measurement element for measuring the internal temperature such as a thermistor.
• the mutually orthogonal X-axis, Y-axis, and Z-axis are shown diagrammatically.
• the direction of the X-axis arrow is referred to as the +X direction, and the opposite direction is referred to as the -X direction.
• the ⁇ X directions they are simply referred to as the X direction.
• the Y and Z directions are simply referred to as "upward” and the -Y direction is referred to as "downward.” This does not limit the orientation of the light-emitting device when in use, and the orientation of the light-emitting device is arbitrary.
• FIG. 1C is a top view of the light-emitting device 100A shown in FIG. 1A with the lid 40A, second mirror member 30b, and slow-axis collimating lens array 50 omitted.
• FIG. 1D is a cross-sectional view parallel to the YZ plane of the light-emitting device 100A shown in FIG. 1A.
• the multiple laser light sources 20 and the multiple first mirror members 30a are arranged on the mounting surface 10s, and the laser light L emitted from each of the multiple laser light sources 20 is reflected in this order by the first reflecting surface 30as and the second reflecting surface 30bs and travels in the +Z direction.
• the multiple first mirror members 30a are arranged on the mounting surface 10s so that the positions of the first reflecting surfaces 30as in the Z direction are different from each other.
• the heights of the optical axes of the multiple laser lights L can be made different from each other by using the mounting surface 10s as a reference plane for height. This is because the distance between the location where the optical axis of the laser light L hits on the first reflecting surface 30as and the location where the optical axis of the laser light L hits on the second reflecting surface 30bs depends on the position of the first reflecting surface 30as in the Z direction.
• the laser light L emitted from the laser light source 20 is a collimated beam in the YZ plane, and its optical axis passes through the center of the beam cross section.
• the mounting surface 10s can be made the same plane. Since multiple collimated lights with different heights can be obtained without providing a step on the mounting surface 10s, the variation in the distance between the mounting surface 10s and the lower surface 14 described later can be reduced. This reduces the variation in the amount of heat generated from the multiple laser light sources 20 during operation and transmitted to the mounting surface of the support base. Therefore, the heat generated from the multiple laser light sources 20 during operation can be effectively released to the outside of the light emitting device 100A.
• the variation in the degree of cooling of the multiple laser light sources 20 in the light emitting device 100A can be reduced by flowing a liquid through the flow path.
• the support base is provided with a heat sink below the mounting surface, the variation in the degree of heat dissipation of the multiple laser light sources 20 in the light emitting device 100A can be reduced. If the distance between the mounting surface 10s and the lower surface 14 directly below the multiple laser light sources 20 is constant, the variation in heat dissipation can be further reduced, and heat can be dissipated effectively.
• the components of the light emitting device 100A are described below.
• the base 10A includes a flat plate portion having a mounting surface 10s on which the laser light sources 20 and the first mirror members 30a are mounted, and a side wall portion located around the mounting surface 10s and surrounding the laser light sources 20 and the first mirror members 30a.
• the base 10A accommodates the laser light sources 20 and the first mirror members 30a.
• the mounting surface 10s is parallel to the XZ plane.
• the flat plate portion and the side wall portion may be integrally formed or may be formed separately and then joined.
• the flat plate portion has a rectangular flat plate shape, but is not limited to this shape.
• the flat plate portion may have, for example, a polygonal, circular or elliptical flat plate shape.
• the base 10A generally has a box shape with an open top.
• the base 10A has a first top surface 12a and a second top surface 12b that correspond to the top surfaces of the sidewall portions.
• the first top surface 12a and the second top surface 12b surround the multiple laser light sources 20 and the multiple first mirror members 30a in a top view seen from the normal direction of the mounting surface 10s.
• the second top surface 12b is located above the first top surface 12a and surrounds the first top surface 12a in a top view.
• the base 10A further has a bottom surface 14 that corresponds to the bottom surface of the flat plate portion.
• the normal direction of the mounting surface 10s is the +Y direction. In this specification, the normal direction of a surface means the perpendicular direction of the surface, that is, the direction away from the object having that surface.
• the first upper surface 12a of the base 10A is bonded to the peripheral region of the lower surface 44 of the lid 40A.
• a metal film 16 is provided on the first upper surface 12a, and the base 10A and the lid 40A are bonded by, for example, an inorganic bonding material provided on the metal film 16.
• the metal film 16 may be formed from at least one metal material selected from the group consisting of, for example, Ag, Cu, W, Au, Ni, Pt, Sn, Ti, and Pd.
• the base 10A has internal wiring for supplying power to each laser light source 20.
• Each laser light source 20 is electrically connected to an external circuit via the internal wiring, and the external circuit supplies power to the multiple laser light sources 20 simultaneously or at different times.
• the base 10A includes an area formed from a material having high thermal conductivity.
• the thermal conductivity of the material may be, for example, 10 W/m ⁇ K or more and 2000 W/m ⁇ K or less.
• the base 10A having such high thermal conductivity allows the heat generated from the laser light source 20 during operation to be effectively transferred to the support substrate via the base 10A.
• the base 10A may be formed from a ceramic selected from the group consisting of AlN, SiN, SiC, and alumina.
• the dimension of the base 10A in the X direction may be, for example, 7 mm or more and 45 mm or less
• the dimension in the Y direction may be, for example, 2 mm or more and 3 mm or less
• the dimension in the Z direction may be, for example, 15 mm or more and 25 mm or less.
• the multiple laser light sources 20 are arranged on the mounting surface 10s as shown in Fig. 1B.
• the multiple laser light sources 20 are arranged along the X direction such that the positions of the multiple laser light sources 20 in the Z direction are different from each other as shown in Fig. 1C.
• the multiple laser light sources 20 are arranged so as to be shifted stepwise in the -Z direction along the X direction.
• the shift direction may not be the -Z direction, but the opposite direction, that is, the +Z direction.
• the positions of the multiple laser light sources 20 in the Z direction may be irregular along the X direction.
• the mounting surface 10s is the same plane, it is possible to reduce the variation in the amount of heat emitted from the multiple laser light sources 20 during operation and transmitted to the mounting surface of the support base. Therefore, the heat emitted from the multiple laser light sources 20 during operation can be effectively transmitted to the outside of the light emitting device 100A.
• each laser light source 20 includes a submount 21, an end-emitting semiconductor laser element 22 supported by the submount 21, a lens support member 23, and a fast-axis collimating lens 24.
• the semiconductor laser element 22 is supported by the mounting surface 10s via the submount 21.
• the semiconductor laser element 22 is positioned so as to emit laser light toward the first reflecting surface 30as.
• the lens support member 23 has a shape that straddles the semiconductor laser element 22.
• the lens support member 23 supports the fast-axis collimating lens 24 by its end surface.
• the components of the laser light source 20 may be treated as components of the light-emitting device 100A. That is, the light-emitting device 100A includes a plurality of submounts 21, a plurality of semiconductor laser elements 22, a plurality of lens support members 23, and a plurality of fast-axis collimating lenses 24. These components are located between the mounting surface 10s of the base 10A and the lower surface 44 of the lid 40A.
• the plurality of semiconductor laser elements 22 are indirectly disposed on the mounting surface 10s along the X direction. More specifically, each semiconductor laser element 22 is disposed on the mounting surface 10s via a corresponding submount 21. The plurality of semiconductor laser elements 22 may be disposed directly on the mounting surface 10s along the X direction.
• the semiconductor laser element 22 has an emission surface from which laser light L is emitted in the +Z direction. If the end face extends in the X direction and is a plane parallel to the XY plane, the laser light L emitted from the semiconductor laser element 22 in the +Z direction spreads relatively fast in the YZ plane and spreads relatively slow in the XZ plane.
• the fast axis direction of the laser light L is parallel to the Y direction, and the slow axis direction is parallel to the X direction.
• the laser light source 20 emits laser light L that is emitted from the semiconductor laser element 22 and passes through the fast-axis collimating lens 24.
• the fast-axis collimating lens 24 collimates the laser light L emitted from the semiconductor laser element 22 in the YZ plane, more specifically in the fast-axis direction in the YZ plane. Therefore, the laser light L emitted from the laser light source 20 is collimated in the YZ plane, but is not collimated in the XZ plane.
• “collimate” means not only making the laser light L parallel, but also reducing the spread angle of the laser light L.
• the wavelengths of the laser light L emitted from the multiple laser light sources 20 may be equal to each other or different from each other. Alternatively, the wavelengths of the laser light L emitted from some of the laser light sources 20 may be different from the wavelengths of the laser light L emitted from the remaining laser light sources 20. The specific configuration of the laser light source 20 will be described later.
• the laser light source 20 is sealed by the base 10A and the lid 40A.
• This sealing is preferably airtight. Airtight sealing reduces dust collection on the emission surface of the semiconductor laser element 22, making the semiconductor laser element 22 less likely to break down.
• the effect of airtight sealing is greater as the wavelength of the laser light emitted from the semiconductor laser element 22 becomes shorter. This is because in a configuration where the emission surface of the semiconductor laser element 22 is exposed to the outside air without airtight sealing, the shorter the wavelength of the laser light, the greater the possibility that the emission surface will deteriorate during operation due to dust collection.
• a surface-emitting semiconductor laser element such as a VCSEL (Vertical-Cavity Surface-Emitting Laser) element may be used.
• the surface-emitting semiconductor laser element is positioned so that the laser light emitted from the semiconductor laser element travels in the +Z direction.
• the first mirror members 30a are arranged on the mounting surface 10s of the base 10A as shown in FIG. 1B.
• the first mirror members 30a are arranged along the X direction such that the positions of the first reflecting surfaces 30as in the Z direction are different from each other as shown in FIG. 1C.
• the first mirror members 30a are arranged to be shifted stepwise in the ⁇ Z direction along the X direction, similar to the laser light sources 20.
• the shift direction may not be the ⁇ Z direction, but the opposite direction, the +Z direction.
• the positions of the first mirror members 30a in the Z direction may be irregular along the X direction.
• the distances defined by the distance between each of the multiple first mirror members 30a and a corresponding one of the multiple laser light sources 20 are substantially the same.
• the distance is the distance between the point on the first reflecting surface 30as of each first mirror member 30a where the optical axis of the laser light L strikes and the center of the emission surface of the semiconductor laser element 22 included in the corresponding laser light source 20.
• the first mirror member 30a has a uniform cross-sectional shape in the X direction.
• the cross-sectional shape is roughly triangular.
• the first mirror member 30a has a bottom surface, a back surface, and a slope connecting the bottom surface and the back surface.
• the bottom surface is parallel to the XZ plane, and the back surface is parallel to the XY plane.
• the normal direction of the slope is a direction parallel to the YZ plane, and forms an acute angle with the +Y direction and an acute angle with the -Z direction.
• the angle between the two directions has a positive value and does not have a negative value.
• the angle between the bottom surface of the first mirror member 30a and the slope is 45°, but is not limited to this angle and may be, for example, 30° to 60°.
• the first mirror member 30a has a first reflecting surface 30as.
• the first reflecting surface 30as is inclined with respect to the mounting surface 10s of the base 10A and faces diagonally upward.
• diagonally upward means a direction that forms an angle of 30° to 60° with the +Y direction.
• each first mirror member 30a reflects the laser light L emitted from the corresponding laser light source 20 and changes the traveling direction of the laser light L to a direction away from the mounting surface 10s of the base 10A.
• the angle between the traveling direction of the laser light L away from the mounting surface 10s of the base 10A and the normal direction of the mounting surface 10s can be, for example, greater than or equal to 0° and less than or equal to 5°.
• the second mirror member 30b is disposed on the upper surface 42 of the cover body 40A as shown in FIG. 1A.
• the second mirror member 30b has a shape extending along the X direction.
• the second mirror member 30b further has a uniform cross-sectional shape in the X direction.
• the cross-sectional shape is roughly trapezoidal.
• the second mirror member 30b has an upper surface, a lower surface, a back surface, and a slope connecting the upper surface and the lower surface.
• Each of the upper surface and the lower surface is parallel to the XZ plane.
• the dimension of the lower surface in the X direction is equal to the dimension of the upper surface in the X direction.
• the dimension of the lower surface in the Z direction is smaller than the dimension of the upper surface in the Z direction.
• the normal direction of the slope is a direction parallel to the YZ plane, and forms an acute angle with the -Y direction and an acute angle with the +Z direction.
• the angle between the upper surface of the second mirror member 30b and the slope is 45°, but is not limited to this angle and may be, for example, 30° to 60°.
• the angle between the upper surface and the inclined surface of the second mirror member 30b may be equal to or different from the angle between the lower surface and the inclined surface of the first mirror member 30a.
• the second mirror member 30b has a second reflecting surface 30bs. A portion of the second reflecting surface 30bs is located above at least a portion of the first reflecting surface 30as of each first mirror member 30a. As shown in FIG. 1D, the second mirror member 30b, more specifically, its second reflecting surface 30bs, reflects the laser light L that is reflected by the first reflecting surface 30as and transmitted through the cover body 40A, thereby further changing the traveling direction of the laser light L in the +Z direction. Unlike the multiple first mirror members 30a, the second mirror member 30b may be a single member. By using the second mirror member 30b as a single member, it is possible to reduce the misalignment of the optical axis caused by the misalignment of the member.
• the heights of the optical axes of the multiple laser beams L reflected by the second reflecting surface 30bs are different from one another, with the mounting surface 10s being used as the reference surface for height. This is because the distance between the point where the optical axis of the laser beam L hits on the first reflecting surface 30as and the point where the optical axis of the laser beam L hits on the second reflecting surface 30bs depends on the position of the first reflecting surface 30as in the Z direction.
• the multiple first mirror members 30a are arranged so as to be shifted stepwise in the -Z direction along the X direction, so that the height of the optical axis of the multiple laser beams L reflected by the second reflecting surface 30bs is lowered stepwise along the +X direction.
• the absolute value of the difference in the height of the optical axis of two adjacent laser beams L among the multiple laser beams L is, for example, 0.3 mm or more and 0.5 mm or less.
• a resin layer 32 is present between the lower surface of the second mirror member 30b and the upper surface 42 of the lid body 40A. With the lower surface of the second mirror member 30b in contact with the upper surface 42 of the lid body 40A via the uncured resin, the resin is cured to form the resin layer 32.
• the resin may be, for example, a thermosetting resin that is cured by heating, or a photocurable resin that is cured by irradiation with ultraviolet light or visible light.
• the following active alignment may be performed before the resin is cured. That is, with the laser light L emitted from each laser light source 20, the position and orientation of the second mirror member 30b are appropriately adjusted so that the second reflecting surface 30bs changes the traveling direction of the multiple laser light beams L in the +Z direction.
• the direction of travel of the laser light L can be adjusted by rotating the second mirror member 30b around the X-axis or Y-axis as the rotation axis to change its orientation.
• By rotating the second mirror member 30b around the X-axis as the rotation axis the direction of travel of the laser light L can be changed up and down.
• By rotating the second mirror member 30b around the Y-axis as the rotation axis the direction of travel of the laser light L can be changed left and right with the direction of travel of the laser light L being the front direction.
• the height of the optical axis of the laser light L can be adjusted.
• the height of the optical axis of the laser light L can be reduced, and by shifting the second mirror member 30b along the -Z direction, the height of the optical axis of the laser light L can be increased.
• the first mirror member 30a and the second mirror member 30b are, for example, bases having an inclined surface and are provided with a reflective surface.
• the bases may be formed, for example, from at least one selected from the group consisting of glass, quartz, synthetic quartz, sapphire, ceramics, silicon, metal, and dielectric materials.
• the reflective surfaces may be formed, for example, from reflective materials such as dielectric multilayer films and metal materials. The reflective surfaces correspond to the first reflective surface 30as and the second reflective surface 30bs.
• the first mirror member 30a and the second mirror member 30b may have, for example, a base having a slope, and the base may be formed from the above-mentioned reflective material.
• the slope of the base corresponds to the first reflecting surface 30as and the second reflecting surface 30bs.
• the lid 40A has an upper surface 42 and a lower surface 44.
• the lower surface 44 of the lid 40A faces the mounting surface 10s of the base 10A, and the upper surface 42 of the lid 40A is located on the opposite side of the lower surface 44 of the lid 40A.
• the lower surface 44 of the lid 40A is also referred to as the "opposing surface”.
• the lid 40A is located above the multiple semiconductor laser elements 22 and the multiple first mirror members 30a.
• the lid 40A transmits the laser light L reflected by the first reflecting surface 30as of each of the first mirror members 30a. More specifically, the lid 40A has multiple light-transmitting portions 46, and each light-transmitting portion 46 transmits the laser light L reflected by the first reflecting surface 30as of the corresponding first mirror member 30a.
• the cover 40A may have a light-shielding film 48 at least around the periphery of each of the undersides of the multiple light-transmitting portions 46 of the underside 44.
• the undersides of the light-transmitting portions 46 have a rectangular shape, but are not limited to this shape.
• the shape of the undersides of the light-transmitting portions 46 may be, for example, circular or elliptical.
• the light-shielding film 48 reduces the possibility that stray light other than the laser light L generated inside the light-emitting device 100A will leak to the outside of the light-emitting device 100A. This effect reduces the possibility that stray light other than the laser light L generated inside the light-emitting device 100A will reach the resin layer 32 shown in FIG. 1D, making it possible to effectively reduce deterioration of the resin layer 32.
• the light-shielding film 48 further reduces the possibility that ultraviolet light or visible light will reach the laser light source 20 when the resin layer 32 is formed by irradiation with ultraviolet light or visible light.
• the light-shielding film 48 further reduces the possibility that return light of the laser light L emitted to the outside of the light-emitting device 100A will reach the laser light source 20. If irradiation by ultraviolet light or visible light or return light can be reduced, the laser light source 20 will be less likely to be damaged.
• the light-shielding film 48 is provided on the entire area of the underside 44 other than the undersides of the multiple light-transmitting portions 46.
• the light-shielding film 48 thus provided further reduces the possibility of the above-mentioned stray light leaking outside the light-emitting device 100A, and the possibility of the above-mentioned ultraviolet or visible light or the above-mentioned return light reaching the laser light source 20.
• the translucent portion 46 of the lid 40A which transmits the laser light L, may have a transmittance of, for example, 60% or more, and preferably 80% or more, to the laser light L.
• the remaining portion of the lid 40A may or may not have such translucency.
• the lid 40A may be formed from at least one light-transmitting material selected from the group consisting of, for example, glass, silicon, quartz, synthetic quartz, sapphire, and transparent ceramics.
• the dimension of the lid 40A in the X direction may be, for example, 6 mm or more and 44 mm or less
• the dimension in the Y direction may be, for example, 0.1 mm or more and 1.5 mm or less
• the dimension in the Z direction may be, for example, 10 mm or more and 20 mm or less.
• the light-shielding film 48 may be formed from a metal material such as Ag, Cu, W, Au, Ni, Pt, Sn, Ti, and Pd.
• the light-shielding film 48 may be formed, for example, by a photolithography method.
• the light-shielding film 48 may also be formed, for example, by providing a metal film on the entire lower surface 44 of the lid 40A and patterning the metal film by etching.
• the peripheral region of the light-shielding film 48 is bonded to the metal film 16 provided on the first upper surface 12a of the base 10A via an inorganic bonding material such as a solder material.
• an inorganic bonding material such as a solder material.
• the base 10A and the lid 40A are bonded by, for example, an inorganic bonding material provided on the light-shielding film 48.
• the metal film 16 may be provided separately from the light-shielding film 48 on the lower surface 44 of the lid 40A.
• the lid 40A has a flat plate shape, but is not limited to this shape.
• the base 10A may have a flat plate shape, and the lid 40A may have a box shape with an open bottom. In such a shape, the base 10A and the lid 40A are joined so that the bottom surface of the lid 40A is supported by the peripheral region of the mounting surface 10s of the base 10A.
• the base 10A may have a box shape with an open top, and the lid 40A may have a box shape with an open bottom. In such a shape, the base 10A and the lid 40A are joined so that the bottom surface of the lid 40A is supported by the top surface of the base 10A.
• the slow axis collimating lens array 50 is disposed on the upper surface 42 of the cover 40A, and includes a plurality of slow axis collimating lenses 50s.
• the slow axis collimating lens array 50 is integrally formed. Since the components are singled by integral formation, the influence of misalignment when arranging the components can be reduced. Note that the plurality of slow axis collimating lenses 50s may be divided into individual pieces.
• each of the multiple slow-axis collimating lenses 50s collimates the laser light L emitted from a corresponding one of the multiple laser light sources 20 and reflected in this order by the first reflecting surface 30as and the second reflecting surface 30bs in the XZ plane, more specifically, in the slow-axis direction within the XZ plane. Since the slow-axis collimating lens array 50 is disposed on the upper surface 42 of the lid body 40A, the laser light L can be collimated before it spreads significantly in the XZ plane. This makes it possible to make the slow-axis collimating lens array 50 compact. Each slow-axis collimating lens 50s can be formed, for example, from the same light-transmitting material as the lid body 40.
• the heights of the optical axes of the multiple laser light beams L can be made different from one another by using the mounting surface 10s as a reference plane for height. Furthermore, when the mounting surface 10s is the same plane, it is possible to reduce the variation in the amount of heat generated from the multiple laser light sources 20 during operation and transmitted to the mounting surface of the support base. As a result, it becomes possible to effectively transmit the heat generated from the multiple laser light sources 20 during operation to the outside of the light emitting device 100A.
• the light emitting device 100A can be manufactured, for example, as follows.
• the base 10A, the multiple laser light sources 20, the multiple first mirror members 30a, the second mirror member 30b, the lid 40A, and the slow-axis collimating lens array 50 are prepared.
• the multiple laser light sources 20 and the multiple first mirror members 30a are provided on the mounting surface 10s of the base 10A.
• the lid 40A is bonded to the base 10A.
• active alignment is performed in a state in which the lower surface of the second mirror member 30b is in contact with the upper surface 42 of the lid 40A via the uncured resin.
• the resin is cured to form a resin layer 32 between the second mirror member 30b and the lid 40A.
• the slow-axis collimating lens array 50 is provided on the upper surface 42 of the lid 40A.
• FIG. 2A is a perspective view showing a schematic configuration of a first modified example of a light emitting device according to the first embodiment of the present disclosure.
• the light emitting device 110A shown in FIG. 2A differs from the light emitting device 100A shown in FIG. 1A in that the light emitting device 110A includes multiple second mirror members 30b instead of a single second mirror member 30b.
• the number of second mirror members 30b is the same as the number of laser light sources 20.
• the inside of the light emitting device 110A is the same as the inside of the light emitting device 100A shown in FIG. 1B. At least a portion of the second reflection surface 30bs of each second mirror member 30b is located above at least a portion of the first reflection surface 30as of the corresponding first mirror member 30a.
• the laser light L emitted from each laser light source 20 is reflected by the first reflection surface 30as of the corresponding first mirror member 30a and the second reflection surface 30bs of the corresponding second mirror member 30b in this order. Since the positions and orientations of the multiple second mirror members 30b can be adjusted individually, the deviation between the traveling direction of each of the multiple laser beams L and the +Z direction can be effectively reduced.
• FIG. 2B is an exploded perspective view showing a schematic configuration of Modification 2 of the light emitting device according to the first embodiment of the present disclosure.
• the light emitting device 120A shown in FIG. 2B differs from the light emitting device 100A shown in FIG. 1A in that the light emitting device 120A includes a plurality of housings 10h arranged on the mounting surface 10s.
• Each of the plurality of housings 10h houses one of the plurality of laser light sources 20 and a first mirror member 30a corresponding to that one laser light source 20 among the plurality of first mirror members 30a.
• the laser light source 20 and the first mirror member 30a are arranged on the mounting surface 10s via the housing 10h.
• the housing 10h housing the laser light source 20 and the first mirror member 30a can be treated as a single unit, so by arranging multiple units on the mounting surface 10s, multiple laser light sources 20 and multiple first mirror members 30a can be easily housed in the base 10A. Furthermore, by sealing, and more preferably hermetically sealing, the laser light source 20 and the first mirror member 30a with the housing 10h, the durability of the laser light source 20 and the first mirror member 30a can be improved.
• the housing 10h transmits the laser light L emitted from the laser light source 20 and reflected by the first reflecting surface 30as of the first mirror member 30a.
• the inside of the housing 10h is shown as being transparent, but as long as the translucent portion of the housing 10h that transmits the laser light L has translucency, the remaining portion may or may not have translucency.
• the light emitting module includes the light emitting device 100A shown in Fig. 1, but the light emitting device 100A may not be used in the light emitting module and may be used for other purposes.
• FIG. 3A is a top view showing a schematic configuration of a light-emitting module according to exemplary embodiment 1 of the present disclosure.
• FIG. 3B is a side view showing a schematic configuration of a light-emitting module according to exemplary embodiment 1 of the present disclosure.
• FIG. 3C is another side view showing a schematic configuration of a light-emitting module according to exemplary embodiment 1 of the present disclosure.
• the light emitting module 200A shown in Figures 3A to 3C includes a support base 60A, a focusing lens 70, an optical fiber 80, a support member 82 that supports the optical fiber 80, a plurality of mirror members 90, and a light emitting device 100A.
• Each mirror member 90 has a reflective surface 90s.
• the support base 60A is disposed on a reference plane Ref parallel to the XZ plane.
• the reference plane Ref is a reference plane for the height of the light emitting module 200A.
• the support base 60A includes a first portion 60A1 that supports the light emitting device 100A.
• the support base 60A further includes a plurality of second portions 60A2 supported by the first portion 60A1.
• Each second portion 60A2 supports a corresponding mirror member 90.
• the support base 60A further includes a third portion 60A3 connected to the first portion 60A1.
• the third portion 60A3 supports the focusing lens 70 and the optical fiber 80.
• the first portion 60A1 has a first mounting surface 60s1, and a plurality of second portions 60A2 are arranged on the first mounting surface 60s1.
• Each second portion 60A2 has a second mounting surface 60s2.
• the third portion 60A3 has a third mounting surface 60s3.
• the first mounting surface 60s1 is a plane parallel to the XZ plane.
• the heights of the multiple second mounting surfaces 60s2 decrease stepwise along the +X direction as shown in FIG. 3B.
• the light emitting device 100A is arranged on the first mounting surface 60s1 in addition to the multiple second parts 60A2.
• the lower surface 14 of the base 10A shown in FIG. 1B included in the light emitting device 100A is joined to the first mounting surface 60s1 of the support base 60A via an inorganic bonding material such as a solder material.
• a metal film may be provided on the lower surface 14 of the base 10A.
• a corresponding mirror member 90 is arranged on each second mounting surface 60s2.
• the mirror member 90 may be arranged on the first mounting surface 60s1 without the second part 60A2.
• a focusing lens 70 is placed on the third mounting surface 60s3, and an optical fiber 80 is placed via a support member 82.
• the height of the third mounting surface 60s3 from the reference plane Ref is greater than the height of the first mounting surface 60s1 from the reference plane Ref and is less than the minimum height of the second mounting surfaces 60s2 from the reference plane Ref.
• the height of the third mounting surface 60s3 may be equal to or less than the height of the first mounting surface 60s1.
• the height of the third mounting surface 60s3 may be equal to or greater than the maximum height of the second mounting surfaces 60s2.
• the support base 60A may be formed of a ceramic selected from the group consisting of AlN, SiN, SiC, and alumina. Alternatively, the support base 60A may be formed of at least one metal material selected from the group consisting of Cu, Al, and W. The support base 60A may be formed of a metal matrix composite material in which diamond particles are dispersed in at least one metal material selected from the group consisting of Cu, Al, and W.
• the support base 60A may be formed integrally or may be an assembly of multiple parts. The multiple parts may be formed of the same material or different materials. For example, the first part 60A1, the multiple second parts 60A2, and the third part 60A3 may be formed integrally or independently of each other. Alternatively, the first portion 60A1 and the third portion 60A3 may be integrally formed, and the second portions 60A2 may be formed independently of the first portion 60A1 and the third portion 60A3.
• the support base 60A is preferably made of a metal material selected from the group consisting of Cu, Al, and W, and is made of a single member. Metal materials have better heat dissipation properties than ceramics, and are soft and therefore easy to process.
• the support base 60A functions as a support base on which the light emitting device 100A is placed.
• the support base 60A can also function as a heat sink that transfers heat generated from the light emitting device 100A to the outside to reduce excessive temperature rise of the light emitting device 100A.
• one or more flow paths for liquid cooling may be provided inside the support base 60A.
• the liquid used for liquid cooling may be, for example, water.
• a fin structure for air cooling may be provided on the surface of the support base 60A.
• the support base 60A can also function as a heat spreader that transfers heat generated from the light emitting device 100A to the heat sink.
• the light emitting device 100A emits multiple laser beams L in the +Z direction.
• each laser beam L is emitted from a corresponding laser light source 20 and reflected by the first reflecting surface 30as and the second reflecting surface 30bs in this order.
• Each laser beam L is collimated in the XZ plane and the YZ plane.
• the reflecting surface 90s of each mirror member 90 reflects the corresponding laser beam L and changes the traveling direction of the laser beam L to the +X direction toward the focusing lens 70.
• Each laser light L is represented by a thick line with three arrows in the example shown in FIG. 3A, and by a thick line with one arrow in the examples shown in FIG. 3B and FIG. 3C.
• the laser light L is represented by a thick line with three arrows in order to emphasize that the laser light L has a spread.
• the traveling direction of some or all of the multiple laser beams L emitted from the light emitting device 100A may actually deviate from the +Z direction. Even in this case, by appropriately adjusting the position and orientation of the mirror member 90 shown in FIG. 3A, it is possible to reduce the deviation between the traveling direction of the laser beams L reflected by the reflecting surface 90s and the +X direction.
• the angle between the traveling direction of the laser beams L reflected by the reflecting surface 90s and the +X direction is preferably, for example, 1° or less, and more preferably 0.1° or less.
• the focusing lens 70 has a fast axis focusing lens 70a and a slow axis focusing lens 70b.
• the fast axis focusing lens 70a may be, for example, a cylindrical lens having a uniform cross-sectional shape in the Z direction
• the slow axis focusing lens 70b may be, for example, a cylindrical lens having a uniform cross-sectional shape in the Y direction.
• the optical axes of the fast axis focusing lens 70a and the slow axis focusing lens 70b are parallel to the X direction.
• the focusing lens 70 may be formed from the above-mentioned translucent material, similar to the cover body 40A shown in Figures 1A and 1B.
• the fast axis focusing lens 70a is positioned so that its focal point approximately coincides with the light incident end 80a of the optical fiber 80.
• the slow axis focusing lens 70b is positioned so that its focal point approximately coincides with the light incident end 80a of the optical fiber 80.
• the focal length of the fast axis focusing lens 70a is longer than the focal length of the slow axis focusing lens 70b.
• the fast axis focusing lens 70a converges multiple laser beams L to the light incident end 80a of the optical fiber 80 in the XY plane.
• the slow axis focusing lens 70b converges each laser beam L to the light incident end 80a in the XZ plane.
• each of the multiple laser beams L emitted from the light-emitting device 100A in the +Z direction is reflected in the +X direction by the corresponding reflecting surface 90s. More specifically, the laser beam L emitted from each of the multiple laser light sources 20 included in the light-emitting device 100A is reflected in the +X direction by the first reflecting surface 30as, the second reflecting surface 30bs, and the reflecting surface 90s, in that order.
• the multiple laser beams L thus obtained can be combined by the focusing lens 70 and made incident on the optical fiber 80.
• the light emitting module 200A emits combined light in which multiple laser lights L are combined from the light emitting end 80b of the optical fiber 80.
• the output of the combined light is roughly equal to the output of each laser light L multiplied by the number of laser lights L. Therefore, by increasing the number of laser lights L, the output of the combined light can be increased.
• the following three specific directions in embodiment 1 may be numbered.
• the direction in which the laser light L is emitted from the laser light source 20 is also referred to as the "first direction”
• the direction in which the multiple laser light sources 20 are arranged is also referred to as the "second direction”.
• the direction in which the laser light L is reflected by the reflecting surface 90s of each mirror member 90 is also referred to as the "third direction”.
• the first direction is the +Z direction
• the second direction is the +X direction
• the third direction is the +X direction, but these directions are not limited to these.
• the second direction does not need to be perpendicular to the first direction as long as it intersects with the first direction.
• the third direction may or may not be parallel to the second direction.
• Fig. 4A is a perspective view that shows a schematic configuration of a light emitting device according to the second exemplary embodiment of the present disclosure.
• the light emitting device 100B shown in Fig. 4A can be placed on, for example, a mounting surface of a support base. Details of the support base will be described later in the description of the light emitting module according to the second embodiment.
• Fig. 4B is an exploded perspective view of the light emitting device shown in Fig. 4A.
• the 4B includes a base 10B, a plurality of first laser light sources 20a, a plurality of second laser light sources 20b, a plurality of first mirror members 30a, a second mirror member 30b, a plurality of third mirror members 30c, a fourth mirror member 30d, a cover body 40B, a first slow axis collimating lens array 50a, a second slow axis collimating lens array 50b, a first support member 34a, and a second support member 34b.
• the first slow-axis collimating lens array 50a is integrally formed and includes a plurality of first slow-axis collimating lenses 50as.
• the second slow-axis collimating lens array 50b is integrally formed and includes a plurality of second slow-axis collimating lenses 50bs.
• the number of the first laser light sources 20a is three, but is not limited to this number.
• the number of the first laser light sources 20a may be two, or may be four or more.
• the first mirror member 30a and the first slow-axis collimating lenses 50as are provided in the same number as the first laser light sources 20a.
• the number of the second laser light sources 20b is three, but is not limited to this number.
• the number of the second laser light sources 20b may be two, or may be four or more. It is preferable that the second mirror member 30b and the second slow-axis collimating lenses 50bs are provided in the same number as the second laser light sources 20b.
• the first laser light source 20a corresponds to the laser light source 20 shown in FIG. 1B.
• the first mirror member 30a corresponds to the first mirror member 30a shown in FIG. 1B.
• the second mirror member 30b corresponds to the second mirror member 30b shown in FIG. 1B.
• the first slow axis collimating lens array 50a corresponds to the slow axis collimating lens array 50 shown in FIG. 1B.
• the light emitting device 100B shown in FIG. 4B differs from the light emitting device 100A shown in FIG. 1B in the following four points.
• the first point is that the light emitting device 100B has a base 10B instead of the base 10A.
• the dimension of the base 10B in the Z direction is greater than the dimension of the base 10A in the Z direction.
• the light emitting device 100B includes, in addition to the multiple first laser light sources 20a and multiple first mirror members 30a, multiple second laser light sources 20b and multiple third mirror members 30c.
• Each of the third mirror members 30c has a third reflecting surface 30cs.
• the light emitting device 100B shown in FIG. 4B includes a fourth mirror member 30d and a second slow axis collimating lens array 50b in addition to the second mirror member 30b and the first slow axis collimating lens array 50a.
• the fourth mirror member 30d has a fourth reflecting surface 30ds.
• the fourth point is that the light emitting device 100B shown in FIG. 4B includes a first support member 34a that supports the fourth mirror member 30d and a second support member 34b that supports the second slow axis collimating lens array 50b.
• FIG. 4C is a top view of the light-emitting device 100B shown in FIG. 4B, omitting the lid 40B and the components on the lid 40B.
• FIG. 4D is a cross-sectional view parallel to the YZ plane of the light-emitting device 100B shown in FIG. 4A.
• the light emitting device 100B can emit not only a plurality of first laser beams La, but also a plurality of second laser beams Lb traveling above the plurality of first laser beams La, as shown in FIG. 4D.
• the number of laser beams that can be combined can be increased, and the output of the combined light can be further increased.
• the components of the light emitting device 100B are described below.
• the first laser light source 20a, the first mirror member 30a, the second mirror member 30b, and the first slow axis collimator lens array 50a are as described in embodiment 1.
• the base 10B differs from the base 10A shown in FIG. 1B in its dimension in the Z direction.
• the base 10B accommodates a plurality of second laser light sources 20b and a plurality of third mirror members 30c in addition to a plurality of first laser light sources 20a and a plurality of first mirror members 30a. Therefore, the dimension of the base 10B in the Z direction is greater than the dimension of the base 10A in the Z direction.
• the base 10B has a mounting surface 10s, a first upper surface 12a, a second upper surface 12b, and a lower surface 14, similar to the base 10A.
• the dimension of the base 10B in the X direction may be, for example, 7 mm or more and 45 mm or less
• the dimension in the Y direction may be, for example, 2 mm or more and 3 mm or less
• the dimension in the Z direction may be, for example, 25 mm or more and 35 mm or less.
• the second laser light source 20b has the same structure as the first laser light source 20a.
• the second laser light source 20b is different from the first laser light source 20a in the position where the second laser light source 20b is arranged.
• the multiple second laser light sources 20b are arranged behind the multiple first laser light sources 20a on the mounting surface 10s of the base 10B.
• Each first laser light source 20a emits the first laser light La in the +Z direction
• each second laser light source 20b emits the second laser light Lb in the +Z direction.
• "Rear" means a direction opposite to the direction in which the first laser light La is emitted from each first laser light source 20a and the direction in which the second laser light Lb is emitted from each second laser light source 20b.
• the multiple second laser light sources 20b are arranged along the X direction such that the positions of the multiple laser light sources 20 in the Z direction differ from one another.
• the multiple second laser light sources 20b are arranged so as to be shifted stepwise in the -Z direction along the X direction.
• the shift direction may not be the -Z direction, but the opposite direction, the +Z direction.
• the positions of the multiple second laser light sources 20b in the Z direction may be irregular along the X direction.
• the mounting surface 10s When the mounting surface 10s is on the same plane, it is possible to reduce the variation in the amount of heat emitted from the multiple first laser light sources 20a and the multiple second laser light sources 20b during operation and transmitted to the mounting surface of the support base. In other words, when the mounting surface 10s is on the same plane, it is possible to make the heat dissipation from each laser light source 20 uniform. As a result, it becomes possible to effectively transmit the heat emitted from the multiple first laser light sources 20a and the multiple second laser light sources 20b during operation to the outside of the light emitting device 100B.
• Each second laser light source 20b has the same structure as each first laser light source 20a.
• the semiconductor laser element 22 included in each first laser light source 20a is referred to as the "first semiconductor laser element”
• the semiconductor laser element 22 included in each second laser light source 20b is referred to as the "second semiconductor laser element.”
• the first semiconductor laser element has a first emission surface, and the first laser light La is emitted from the first emission surface in the +Z direction.
• the second semiconductor laser element has a second emission surface, and the second laser light Lb is emitted from the second emission surface in the +Z direction.
• the third mirror member 30c has the same structure as the first mirror member 30a.
• the third mirror member 30c is different from the first mirror member 30a in the position where the third mirror member 30c is arranged.
• the multiple third mirror members 30c are arranged on the mounting surface 10s of the base 10B behind the multiple first mirror members 30a.
• the multiple third mirror members 30c are arranged along the X direction so that the positions of the third reflection surfaces 30cs in the Z direction are different from each other. In the example shown in FIG.
• the multiple third mirror members 30c are arranged so as to shift in the -Z direction stepwise along the X direction, similar to the multiple second laser light sources 20b.
• the shift direction may not be the -Z direction, but the opposite direction, the +Z direction.
• the positions of the multiple third mirror members 30c in the Z direction may be irregular along the X direction.
• the distances defined by the distance between each of the third mirror members 30c and the corresponding second laser light source 20b among the second laser light sources 20b are substantially the same.
• the distance is the distance between the point on the third reflecting surface 30cs of each third mirror member 30c where the optical axis of the second laser light Lb strikes and the center of the emission surface of the corresponding second laser light source 20b.
• each third mirror member 30c more specifically, its third reflecting surface 30cs, reflects the second laser light Lb emitted from the second laser light source 20b and changes the traveling direction of the second laser light Lb to a direction away from the mounting surface 10s of the base 10B.
• the angle between the traveling direction of the second laser light Lb away from the mounting surface 10s of the base 10B and the normal direction of the mounting surface 10s can be, for example, greater than or equal to 0° and less than or equal to 5°.
• the fourth mirror member 30d has the same structure as the second mirror member 30b.
• the fourth mirror member 30d differs from the second mirror member 30b in the position where the fourth mirror member 30d is disposed. As shown in FIG. 4A, the fourth mirror member 30d is disposed on the top surface 42 of the cover body 40B, behind and above the second mirror member 30b, via the first support member 34a. If the dimension of the fourth mirror member 30d in the Y direction is sufficiently large, there is no need to provide the first support member 34a.
• the fourth mirror member 30d has a fourth reflecting surface 30ds, similar to the second mirror member 30b. A portion of the fourth reflecting surface 30ds is located above at least a portion of the third reflecting surface 30cs of each third mirror member 30c. As shown in FIG. 4D, the fourth mirror member 30d, more specifically, its fourth reflecting surface 30ds, reflects the second laser light Lb reflected by the third reflecting surface 30cs, thereby further changing the traveling direction of the second laser light Lb in the +Z direction.
• the light emitting device 100B can emit multiple first laser lights La and multiple second laser lights Lb traveling above the multiple first laser lights La.
• the fourth mirror member 30d is a single member, which reduces the misalignment of the optical axis caused by component misalignment.
• Multiple individual fourth mirror members 30d may be used instead of the fourth mirror member 30d. Since the positions and orientations of the multiple fourth mirror members 30d can be adjusted individually, the misalignment between the traveling direction of each of the multiple second laser beams Lb and the +Z direction can be effectively reduced.
• the multiple third mirror members 30c are arranged so as to be shifted stepwise in the -Z direction along the X direction, so the heights of the optical axes of the multiple laser beams L reflected by the fourth reflecting surface 30ds are lowered stepwise in the +X direction.
• the absolute value of the difference in the heights of the optical axes of two adjacent second laser beams Lb among the multiple second laser beams Lb is, for example, 0.3 mm or more and 0.5 mm or less.
• a first resin layer 32a exists between the bottom surface of the second mirror member 30b and the top surface 42 of the cover body 40B.
• the first resin layer 32a corresponds to the resin layer 32 shown in FIG. 1D.
• a second resin layer 32b exists between the bottom surface of the fourth mirror member 30d and the top surface of the first support member 34a. Therefore, like the second mirror member 30b, the position and orientation of the fourth mirror member 30d can be appropriately adjusted.
• the lid body 40B has an upper surface 42 and a lower surface 44, similar to the lid body 40A shown in Fig. 1B.
• the lid body 40B differs from the lid body 40A shown in Fig. 1B in the dimension in the Z direction and the shape of the light-shielding film 48.
• the dimension in the Z direction of the lid body 40B is larger than the dimension in the Z direction of the lid body 40A.
• the lid body 40B is located above the multiple first laser light sources 20a, the multiple second laser light sources 20b, the multiple first mirror members 30a, and the multiple third mirror members 30c.
• the lid 40B transmits the first laser light La reflected by the first reflecting surface 30as and the second laser light Lb reflected by the third reflecting surface 30cs. More specifically, the lid 40B has a plurality of first transparent portions 46a and a plurality of second transparent portions 46b, and each first transparent portion 46a transmits the first laser light La reflected by the first reflecting surface 30as of the corresponding first mirror member 30a, and each second transparent portion 46b transmits the second laser light Lb reflected by the corresponding third reflecting surface 30cs of the third mirror member 30c.
• the cover 40B has a light-shielding film 48 at least around the periphery of the underside of each of the first light-transmitting portions 46a and the underside of each of the second light-transmitting portions 46b on the underside 44.
• the light-shielding film 48 is provided on the entire area of the underside 44 other than the underside of each of the first light-transmitting portions 46a and the underside of each of the second light-transmitting portions 46b.
• the dimension of the lid 40B in the X direction may be, for example, 6 mm or more and 44 mm or less
• the dimension in the Y direction may be, for example, 0.1 mm or more and 1.5 mm or less
• the dimension in the Z direction may be, for example, 20 mm or more and 30 mm or less.
• the second slow-axis collimating lens array 50b has the same structure as the first slow-axis collimating lens array 50a.
• the second slow-axis collimating lens array 50b differs from the first slow-axis collimating lens array 50a in the position where the second slow-axis collimating lens array 50b is arranged.
• the second slow-axis collimating lens array 50b is arranged on the upper surface 42 of the cover body 40B, behind and above the first slow-axis collimating lens array 50a, via the second support member 34b. If the dimension of the second slow-axis collimating lens array 50b in the Y direction is sufficiently large, there is no need to provide the second support member 34b.
• each of the multiple second slow-axis collimating lenses 50bs collimates the second laser light Lb emitted from the corresponding second laser light source 20b among the multiple second laser light sources 20b and reflected in this order by the third reflecting surface 30cs and the fourth reflecting surface 30ds in the XZ plane, more specifically, in the slow-axis direction in the XZ plane. Since the second slow-axis collimating lens array 50b is disposed on the upper surface 42 of the lid body 40B via the second support member 34b, the second laser light Lb can be collimated before it spreads significantly in the XZ plane. Therefore, it is possible to make the second slow-axis collimating lens array 50b compact.
• the second slow-axis collimating lens array 50b Since the second slow-axis collimating lens array 50b is located above the first slow-axis collimating lens array 50a, the second slow-axis collimating lens array 50b can receive the second laser light Lb reflected by the fourth reflecting surface 30ds. In addition, since the second slow axis collimator lens array 50b is disposed above the first slow axis collimator lens array 50a, the distance from the third reflection surface 30cs to the fourth reflection surface 30ds is longer than the distance from the first reflection surface 30as to the second reflection surface 30bs.
• the distance from the fourth mirror member 30d to the second slow axis collimator lens array 50b may be disposed shorter than the distance from the second mirror member 30b to the first slow axis collimator lens array 50a.
• the distance traveled by the light emitted from the plurality of first laser light sources 20a to reach the first slow axis collimator lens array 50a and the distance traveled by the light emitted from the plurality of second laser light sources 20b to reach the second slow axis collimator lens array 50b can be made uniform. That is, the shape of the light emitted from the first slow axis collimator lens array 50a and the shape of the light emitted from the second slow axis collimator lens array 50b can be made uniform.
• the lens shape of the first slow axis collimating lens array 50a and the lens shape of the second slow axis collimating lens array 50b may be made different to align the shapes of the light emitted from each slow axis collimating lens array, or these methods may be combined.
• the light emitting device 100B may be virtually divided into two structures by a plane parallel to the XY plane, and the divided structures may be used as sub-light emitting devices. That is, the light emitting device 100B may have two sub-light emitting devices.
• One sub-light emitting device has a plurality of first laser light sources 20a, a plurality of first mirror members 30a, a second mirror member 30b, and a first slow-axis collimating lens array 50a.
• the other sub-light emitting device has a plurality of second laser light sources 20b, a plurality of third mirror members 30c, a fourth mirror member 30d, a second slow-axis collimating lens array 50b, a first support member 34a, and a second support member 34b.
• the two sub-light emitting devices are arranged along the Z direction and share the base 10B and the cover body 40B.
• the number of sub-light emitting devices is not limited to two, and may be three or more.
• the mounting surface 10s on which the multiple first laser light sources 20a and the multiple second laser light sources 20b are mounted is the same plane, the mounting surface 10s can be used as a reference plane for height to make the heights of the optical axes of the multiple first laser lights La different from each other, and the heights of the optical axes of the multiple second laser lights Lb different from each other. Furthermore, when the mounting surface 10s is the same plane, the variation in the amount of heat emitted from the multiple first laser light sources 20a and the multiple second laser light sources 20b during operation and transmitted to the mounting surface of the support base can be reduced.
• the light emitting device 100B can emit not only the multiple first laser lights La, but also the multiple second laser lights Lb traveling above the multiple first laser lights La.
• the number of laser beams that can be combined can be increased, making it possible to further increase the output of the combined light.
• the light emitting device 100B can be manufactured, for example, as follows.
• the base 10B, the multiple first laser light sources 20a, the multiple second laser light sources 20b, the multiple first mirror members 30a, the multiple second mirror members 30b, the multiple third mirror members 30c, the fourth mirror member 30d, the lid 40B, the first slow axis collimator lens array 50a, the second slow axis collimator lens array 50b, the first support member 34a, and the second support member 34b are prepared.
• the multiple first laser light sources 20a, the multiple second laser light sources 20b, the multiple first mirror members 30a, and the multiple third mirror members 30c are provided on the mounting surface 10s of the base 10B.
• the lid 40B is bonded to the base 10B.
• active alignment is performed with the bottom surface of the second mirror member 30b in contact with the top surface 42 of the lid body 40B via the uncured resin.
• the resin is cured to form a first resin layer 32a between the second mirror member 30b and the lid body 40B.
• a first slow axis collimating lens array 50a is provided on the top surface 42 of the lid body 40B.
• the first support member 34a and the second support member 34b are provided on the upper surface 42 of the lid body 40B.
• active alignment is performed with the lower surface of the fourth mirror member 30d in contact with the upper surface of the first support member 34a via uncured resin.
• the resin is cured to form a second resin layer 32b between the fourth mirror member 30d and the upper surface of the first support member 34a.
• a second slow axis collimator lens array 50b is provided on the upper surface of the second support member 34b.
• the light emitting module includes the light emitting device 100B shown in Fig. 4, but the light emitting device 100B may not be used in the light emitting module and may be used for other purposes.
• FIG. 5A is a top view showing a schematic configuration of a light emitting module according to exemplary embodiment 2 of the present disclosure.
• FIG. 5B is a side view showing a schematic configuration of a light emitting module according to exemplary embodiment 2 of the present disclosure.
• FIG. 5C is another side view showing a schematic configuration of a light emitting module according to exemplary embodiment 2 of the present disclosure.
• the light emitting module 200B shown in FIGS. 5A to 5C differs from the light emitting module 200A shown in FIGS. 3A to 3C in the following three points.
• the first point is that the light emitting module 200B includes a support base 60B instead of the support base 60A.
• the shape of the support base 60B is different from the shape of the support base 60A.
• the second point is that the light emitting module 200B includes a light emitting device 100B, multiple mirror members 90a, and multiple mirror members 90b instead of the light emitting device 100A and multiple mirror members 90.
• Each mirror member 90a has a reflective surface 90as
• each mirror member 90b has a reflective surface 90bs.
• the mirror member 90a and the mirror member 90 shown in FIG. 3A are also referred to as the "fifth mirror member", and their reflective surfaces 90as and reflective surfaces 90s are also referred to as the "fifth reflective surface”.
• the mirror member 90b is also referred to as the "sixth mirror member", and its reflective surface 90bs is also referred to as the "sixth reflective surface”.
• the light emitting module 200B further includes a mirror member 90c, a half-wave plate 92, an optical element 94, and a polarizing beam splitter 96.
• the mirror member 90c has a reflective surface 90cs.
• the support base 60B includes a first portion 60B1 that supports the light emitting device 100B.
• the support base 60B further includes a plurality of second portions 60B2 supported by the first portion 60B1.
• the plurality of second portions 60B2 are arranged in two rows. Each row is parallel to the X direction.
• Each second portion 60B2 included in the first row that is closer to the light emitting device 100B supports a corresponding mirror member 90a.
• Each second portion 60B2 included in the second row that is farther from the light emitting device 100B supports a corresponding mirror member 90b.
• the support base 60B further includes a third portion 60B3 that is connected to the first portion 60B1.
• the third portion 60B3 supports the condenser lens 70, the optical fiber 80, the mirror member 90c, the half-wave plate 92, the optical element 94, and the polarizing beam splitter 96.
• the first portion 60B1 has a first mounting surface 60s1.
• a plurality of second portions 60B2 and light emitting devices 100B are arranged on the first mounting surface 60s1.
• Each second portion 60B2 has a second mounting surface 60s2.
• the third portion 60B3 has a third mounting surface 60s3.
• the first mounting surface 60s1 is a plane parallel to the XZ plane.
• the heights of the second mounting surfaces 60s2 in each of the first and second rows decrease stepwise along the +X direction as shown in FIG. 5B.
• a corresponding mirror member 90a is disposed on each second mounting surface 60s2 in the first row, and a corresponding mirror member 90b is disposed on each second mounting surface 60s2 in the second row. If the mirror members 90a and 90b have sufficiently large dimensions in the Y direction, the mirror members 90a and 90b may be disposed on the first mounting surface 60s1 without the second portion 60B2.
• the condenser lens 70, the mirror member 90c, the half-wave plate 92, the optical element 94, and the polarizing beam splitter 96 are disposed, and the optical fiber 80 is disposed via the support member 82.
• the light emitting device 100B emits a plurality of first laser lights La and a plurality of second laser lights Lb in the +Z direction.
• each first laser light La is emitted from a corresponding first laser light source 20a and is reflected in this order by the first reflecting surface 30as and the second reflecting surface 30bs.
• each second laser light Lb is emitted from a corresponding second laser light source 20b and is reflected in this order by the third reflecting surface 30cs and the fourth reflecting surface 30ds.
• Each first laser light La and each second laser light Lb are collimated in the XZ plane and the YZ plane. As shown in FIG.
• the plurality of second laser lights Lb travel above the plurality of first laser lights La.
• the polarization direction of the plurality of first laser lights La and the plurality of second laser lights Lb is the same, and may be, for example, parallel to the X direction.
• the number of first laser lights La is three, but is not limited to three and may be two, or four or more. The same applies to the number of second laser lights Lb.
• the reflecting surface 90as of each mirror member 90a reflects the corresponding first laser light La and changes the traveling direction of the first laser light La to the +X direction.
• the reflecting surface 90bs of each mirror member 90b reflects the corresponding second laser light Lb and changes the traveling direction of the second laser light Lb to the +X direction.
• the reflecting surface 90cs of the mirror member 90c reflects the second laser light Lb traveling in the +X direction, changing the direction of travel of the second laser light Lb to the -Z direction.
• the half-wave plate 92 changes the polarization direction of the second laser light Lb traveling in the -Z direction by 90°.
• the optical element 94 changes the height of the optical axis of the multiple second laser lights Lb to match the height of the optical axis of the multiple first laser lights La.
• the optical element 94 may include, for example, at least one of a wedge, a prism, and two mirror members.
• the optical element 94 may be a translucent flat-plate-shaped wedge having a light entrance surface and a light exit surface that are parallel to each other.
• the wedge has a uniform cross-sectional shape in the X direction and is arranged so as to incline from the +Y direction to the -Z direction.
• the reflecting surface of one mirror member receives the second laser light Lb traveling in the -Z direction and changes the traveling direction of the second laser light Lb to the -Y direction.
• the reflecting surface of the other mirror member receives the second laser light Lb traveling in the -Y direction and changes the traveling direction of the second laser light Lb to the -Z direction.
• the polarizing beam splitter 96 transmits the multiple first laser beams La that travel in the +X direction and have a polarization direction in the Z direction, and reflects the multiple second laser beams Lb that travel in the -Z direction and have a polarization direction in the Y direction. In this way, the polarizing beam splitter 96 directs the multiple second laser beams Lb that have passed through the 1/2 wavelength plate 92 and the multiple first laser beams La that have not passed through the 1/2 wavelength plate 92 to the focusing lens 70.
• the 1/2 wavelength plate 92 is disposed on the optical path of the multiple second laser beams Lb, but may be disposed on the optical path of the multiple first laser beams La. In that case, the polarizing beam splitter 96 directs the multiple first laser beams La that have passed through the 1/2 wavelength plate 92 and the multiple second laser beams Lb that have not passed through the 1/2 wavelength plate 92 to the focusing lens 70.
• the multiple first laser beams La and multiple second laser beams Lb that pass through the polarizing beam splitter 96 are combined by the focusing lens 70 and converged at the light input end 80a of the optical fiber 80.
• each of the multiple first laser lights La emitted in the +Z direction from the light-emitting device 100B is reflected in the +X direction by the corresponding reflecting surface 90as
• each of the multiple second laser lights Lb emitted in the +Z direction from the light-emitting device 100B is reflected in the +X direction by the corresponding reflecting surface 90bs.
• the first laser light La emitted from each of the multiple first laser light sources 20a included in the light-emitting device 100B is reflected in this order by the first reflecting surface 30as, the second reflecting surface 30bs, and the reflecting surface 90as.
• the second laser light Lb emitted from each of the multiple second laser light sources 20b included in the light-emitting device 100B is reflected in this order by the third reflecting surface 30cs, the fourth reflecting surface 30ds, and the reflecting surface 90bs.
• the multiple first laser beams La and multiple second laser beams Lb thus obtained can be combined after passing through the polarizing beam splitter 96 by the focusing lens 70 and can be incident on the optical fiber 80.
• the light emitting module 200B emits a combined light in which a plurality of first laser lights La and a plurality of second laser lights Lb are combined from the light emitting end 80b of the optical fiber 80.
• the total number of first laser lights La and second laser lights Lb is twice the number of laser lights L, compared to the light emitting module 200A shown in Figures 3A to 3C. Therefore, the output of the combined light can be further increased.
• the following three specific directions in embodiment 2 may be numbered.
• the direction in which the first laser light La is emitted from the first laser light source 20a and the direction in which the second laser light Lb is emitted from the second laser light source 20b are also referred to as the "first direction”.
• the direction that intersects with the first direction and in which the multiple first laser light sources 20a and the multiple second laser light sources 20b are arranged is also referred to as the "second direction”.
• the direction in which the first laser light La is reflected by the reflecting surface 90as of each mirror member 90a and the direction in which the second laser light Lb is reflected by the reflecting surface 90bs of each mirror member 90b are also referred to as the "third direction".
• the first direction is the +Z direction
• the second direction is the +X direction
• the third direction is the +X direction, but these directions are not limited to these.
• the second direction does not need to be perpendicular to the first direction as long as it intersects with the first direction.
• the third direction may or may not be parallel to the second direction.
• Fig. 6A is an exploded perspective view of the laser light source 20.
• Fig. 6B is a cross-sectional view of the laser light source 20 parallel to the YZ plane. Each component of the laser light source 20 will be described below.
• the submount 21 has an upper surface 21s1 and a lower surface 21s2 that are parallel to the XZ plane.
• a metal film is provided on the upper surface 21s1, and the semiconductor laser element 22 and the lens support member 23 are bonded to the submount 21 by, for example, an inorganic bonding material provided on the metal film.
• the metal film provided on the upper surface 21s1 may also be used to supply power to the semiconductor laser element 22.
• a metal film is provided on the lower surface 21s2, and the base 10A shown in FIG. 1B is bonded to the laser light source 20 by, for example, an inorganic bonding material provided on the metal film.
• the metal films provided on each of the upper surface 21s1 and the lower surface 21s2 also serve to transfer heat generated by the semiconductor laser element 22 during operation to the base 10A via the submount 21.
• the submount 21 can be formed, for example, from the aforementioned ceramics, metal materials, or metal matrix composite materials, similar to the support base 60A shown in Figures 3A and 3B.
• the semiconductor laser element 22 is supported by the upper surface 21s1 of the submount 21.
• the semiconductor laser element 22 has an emission surface 22e, one of two end surfaces intersecting in the Z direction, and emits laser light in the +Z direction from the emission surface 22e.
• the laser light travels in the +Z direction, it spreads at different speeds in the YZ plane and the XZ plane.
• the laser light spreads relatively quickly in the YZ plane and relatively slowly in the XZ plane.
• the spot of the laser light has an elliptical shape in the far field in the XY plane, with the major axis in the Y direction and the minor axis in the X direction.
• the semiconductor laser element 22 can emit violet, blue, green or red laser light in the visible region, or infrared or ultraviolet laser light in the invisible region.
• the emission peak wavelength of the violet light is preferably in the range of 400 nm to 420 nm, and more preferably in the range of 400 nm to 415 nm.
• the emission peak wavelength of the blue light is preferably in the range of more than 420 nm to 495 nm, and more preferably in the range of 440 nm to 475 nm.
• the emission peak wavelength of the green light is preferably in the range of more than 495 nm to 570 nm, and more preferably in the range of 510 nm to 550 nm.
• the emission peak wavelength of the red light is preferably in the range of 605 nm to 750 nm, and more preferably in the range of 610 nm to 700 nm.
• the semiconductor laser element 22 that emits purple, blue, and green laser light there is a laser diode that includes a nitride semiconductor material.
• a nitride semiconductor material for example, GaN, InGaN, and AlGaN can be used.
• the semiconductor laser element 22 that emits red laser light there is a laser diode that includes, for example, InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductor materials.
• the lens support member 23 is supported by the upper surface 21s1 of the submount 21, as shown in FIG. 6A.
• the lens support member 23 has two columnar portions 23a and a connecting portion 23b located between the two columnar portions 23a and connecting the two columnar portions 23a.
• the two columnar portions 23a are located on both sides of the semiconductor laser element 22, and the connecting portion 23b is located above the emission surface 22e side of the semiconductor laser element 22.
• the lens support member 23 supports the fast axis collimating lens 24 by the end faces 23as of the two columnar portions 23a.
• the lens support member 23 is located so as to straddle the semiconductor laser element 22, and does not prevent the laser light emitted from the semiconductor laser element 22 from entering the fast axis collimating lens 24.
• the lens support member 23 may be formed, for example, from the aforementioned ceramics, similar to the base 10A shown in Figures 1A and 1B, or may be formed from the aforementioned light-transmitting material, similar to the lid 40A shown in Figures 1A and 1B.
• the lens support member 23 may also be formed, for example, from an alloy such as Kovar or CuW, or Si.
• the fast axis collimating lens 24 may be, for example, a cylindrical lens having a uniform cross-sectional shape in the X direction.
• the fast axis collimating lens 24 has a flat surface on the light incident side and a convex curved surface on the light exit side.
• the convex curved surface has a curvature in the YZ plane.
• the focal point of the fast axis collimating lens 24 approximately coincides with the center of the light emitting point of the exit surface 22e of the semiconductor laser element 22.
• the fast axis collimating lens 24 collimates the laser light emitted in the +Z direction from the exit surface 22e of the semiconductor laser element 22 in the YZ plane.
• the region surrounded by the dashed line shown in FIG. 6B represents a region where the intensity of the laser light is 1/ e2 times or more of its peak intensity. e is the base of the natural logarithm.
• the fast axis collimating lens 24 may be formed of the above-mentioned light-transmitting material, for example, similar to the cover body 40A shown in FIG. 1A and FIG. 1B.
• the fast axis collimating lens 24 is located between the mounting surface 10s of the base 10A and the bottom surface 44 of the lid 40A, and is located on the optical path of the laser light L. Since the fast axis collimating lens 24 is disposed inside the sealed space formed by the base 10A and the lid 40A, it is possible to collimate the laser light L before it spreads too far. This makes it possible to make the fast axis collimating lens 24 compact.
• a collimating lens that collimates the laser light L emitted from the semiconductor laser element 22 not only in the YZ plane but also in the XZ plane may be used. In that case, there is no need to provide a slow axis collimating lens array 50 in the light emitting device 100A. The same applies to the first slow axis collimating lens array 50a and the second slow axis collimating lens array 50b in the light emitting device 100B.
• the present disclosure includes the light emitting devices and light emitting modules described in the following items.
• a base having a mounting surface; a plurality of semiconductor laser elements each having an emission surface for emitting laser light in a first direction and arranged on the mounting surface along a second direction intersecting the first direction; a plurality of first mirror members each having a first reflecting surface that reflects the laser light emitted from a corresponding one of the plurality of semiconductor laser elements and changes the traveling direction of the laser light in a direction away from the mounting surface; a lid having an opposing surface facing the mounting surface and an upper surface located on the opposite side of the opposing surface, the lid being located above the plurality of semiconductor laser elements and the plurality of first mirror members, and transmitting the laser light reflected by the first reflecting surface; a second mirror member disposed on the upper surface of the lid body, the second mirror member having a second reflecting surface that reflects the laser light that has passed through the lid body, and further changing the traveling direction of the laser light; Equipped with the first mirror members are arranged
• [Item 2] 2. The light emitting device according to item 1, wherein a plurality of distances defined by the distance between each of the plurality of first mirror members and a corresponding one of the plurality of semiconductor laser elements are substantially the same.
• [Item 3] 3. The light emitting device according to item 1, wherein the mounting surface on which the plurality of semiconductor laser elements are mounted is flush with one another.
• [Item 4] 4. The light emitting device according to any one of items 1 to 3, wherein the plurality of first mirror members are arranged to be shifted stepwise along the second direction in a direction the same as or opposite to the first direction.
• [Item 5] Further comprising a plurality of housings arranged on the mounting surface, 5.
• each of the plurality of housings accommodates one semiconductor laser element among the plurality of semiconductor laser elements and a first mirror member among the plurality of first mirror members that corresponds to the one semiconductor laser element.
• a plurality of fast axis collimating lenses positioned between the mounting surface of the base and the opposing surface of the lid; 6.
• each of the plurality of fast axis collimating lenses collimates, in a fast axis direction, the laser light emitted from a corresponding semiconductor laser element among the plurality of semiconductor laser elements.
• the light emitting device according to any one of items 1 to 8, wherein the base includes a region formed from a material having a thermal conductivity of 10 W/m ⁇ K or more and 2000 W/m ⁇ K or less.
• the base includes a region formed from a material having a thermal conductivity of 10 W/m ⁇ K or more and 2000 W/m ⁇ K or less.
• the plurality of semiconductor laser elements are hermetically sealed by the base and the lid.
• [Item 11] 4 The light emitting device according to item 3, wherein an absolute value of a difference in height of optical axes of two adjacent laser beams from the mounting surface among a plurality of laser beams obtained by reflecting the laser beam emitted from each of the plurality of semiconductor laser elements by the first reflecting surface and the second reflecting surface in this order is 0.3 mm or more and 0.5 mm or less.
• a plurality of sub-light-emitting devices each of which is the light-emitting device according to any one of items 1 to 11, The plurality of sub-light emitting devices are arranged along the first direction, A light emitting device, wherein the plurality of sub-light emitting devices share the base and the lid.
• a base having a mounting surface; a plurality of first semiconductor laser elements each having a first emission surface that emits a first laser light in a first direction and arranged on the mounting surface along a second direction intersecting the first direction; a plurality of second semiconductor laser elements each having a second emission surface that emits a second laser light in the first direction and arranged on the mounting surface along the second direction; a plurality of first mirror members each having a first reflecting surface that reflects the first laser light emitted from a corresponding one of the plurality of first semiconductor laser elements and that changes a traveling direction of the first laser light to a direction away from the mounting surface; a plurality of third mirror members each having a third reflection surface that reflects the second laser light emitted from a corresponding one of the plurality of second semiconductor laser elements and changes a traveling direction of the second laser light to a direction away from the mounting surface; a lid body having an opposing surface facing the mounting surface and an upper surface located on the opposite side to the opposing surface, the lid body
• a light emitting device according to any one of items 1 to 11, a plurality of fifth mirror members each having a fifth reflecting surface, the fifth reflecting surface reflecting the laser light emitted from a corresponding semiconductor laser element and reflected by the first reflecting surface and the second reflecting surface in this order, in a third direction; a condenser lens that couples a plurality of laser beams obtained by the laser beams emitted from the respective semiconductor laser elements being reflected by the first reflecting surface, the second reflecting surface, and the fifth reflecting surface in this order into an optical fiber;
• a light emitting module comprising: [Item 15] Item 14.
• a light emitting device a plurality of fifth mirror members each having a fifth reflecting surface that reflects, in a third direction, the first laser light emitted from a corresponding first semiconductor laser element and reflected by the first reflecting surface and the second reflecting surface in this order; a plurality of sixth mirror members each having a sixth reflecting surface that reflects the second laser light emitted from a corresponding second semiconductor laser element and reflected by the third reflecting surface and the fourth reflecting surface in this order, in the third direction; a focusing lens that couples, into an optical fiber, a plurality of first laser beams obtained by reflecting the first laser beam emitted from each of the plurality of first semiconductor laser elements on the first reflecting surface, the second reflecting surface, and the fifth reflecting surface in this order, and a plurality of second laser beams obtained by reflecting the second laser beam emitted from each of the plurality of second semiconductor laser elements on the third reflecting surface, the fourth reflecting surface, and the sixth reflecting surface in this order;
• a light emitting module comprising: [Item 16] a polarization
• the light emitting device and light emitting module disclosed herein may be used, in particular, to combine multiple laser beams to produce high-power laser beams.
• the light emitting device and light emitting module disclosed herein may also be used, for example, in industrial fields where a high-power laser light source is required, such as cutting, drilling, localized heat treatment, surface treatment, metal welding, and 3D printing of various materials.
• 10A, 10B Base 10h: Housing 10s: Mounting surface 12a: First upper surface 12b: Second upper surface 14: Lower surface 16: Bonding area 20: Laser light source 20a: First laser light source 20b: Second laser light source 21: Submount 21s1: Upper surface 21s2: Lower surface 22: Semiconductor laser element 22e: Emission surface 23: Lens support member 23a: Columnar portion 23as: End surface 23b: Connection portion 24: Fast axis collimating lens 30a: First mirror member 3 0as: first reflecting surface 30b: second mirror member 30bs: second reflecting surface 30c: third mirror member 30cs: third reflecting surface 30d: fourth mirror member 30ds: fourth reflecting surface 32: resin layer 32a: first resin layer 32b: second resin layer 34a: first support member 34b: second support member 40A, 40B: lid 42: upper surface 44: lower surface 46: light-transmitting portion 46a: first light-transmitting portion 46b: second light-transmitting portion 48: light-shielding film 50:

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• 2023
  • 2023-09-20 WO PCT/JP2023/034145 patent/WO2024070857A1/ja not_active Ceased
  • 2023-09-20 JP JP2024549265A patent/JPWO2024070857A1/ja active Pending
  • 2023-09-20 US US19/115,956 patent/US20260106431A1/en active Pending

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