WO2024069970A1 - Appareil de pompe à chaleur - Google Patents

Appareil de pompe à chaleur Download PDF

Info

Publication number
WO2024069970A1
WO2024069970A1 PCT/JP2022/036812 JP2022036812W WO2024069970A1 WO 2024069970 A1 WO2024069970 A1 WO 2024069970A1 JP 2022036812 W JP2022036812 W JP 2022036812W WO 2024069970 A1 WO2024069970 A1 WO 2024069970A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat medium
refrigerant
heat exchanger
water
Prior art date
Application number
PCT/JP2022/036812
Other languages
English (en)
Japanese (ja)
Inventor
直史 竹中
傑 鳩村
勇輝 水野
広有 柴
多佳志 岡崎
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2022/036812 priority Critical patent/WO2024069970A1/fr
Publication of WO2024069970A1 publication Critical patent/WO2024069970A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously

Definitions

  • This disclosure relates to a heat pump device.
  • Patent Document 1 discloses a hot and cold water multi-air conditioner equipped with two hot and cold water machines and multiple indoor units installed on each floor of a building.
  • each outdoor unit is connected to the multiple indoor units by hot and cold water piping, and one outdoor unit is used for cooling operation and the other outdoor unit is used for heating operation, allowing each indoor unit to perform cooling operation and heating operation simultaneously.
  • Patent Document 1 requires two hot and cold water pipes connected to one outdoor unit for the return of cold water, and two hot and cold water pipes connected to the other outdoor unit for the return of hot water. This means that two hot and cold water pipes must be installed for each outdoor unit installed outdoors, and the large number of hot and cold water pipes required results in a heavy burden of piping work.
  • This disclosure has been made to solve the problems described above, and aims to provide a heat pump device that can reduce the number of pipes connected to the heat source unit.
  • the heat pump device is a heat pump device including a heat source unit, a relay unit connected to the heat source unit, and a plurality of load devices connected to the relay unit, the heat source unit having a first refrigerant circuit through which a refrigerant circulates and a first water heat exchanger that exchanges heat with the first refrigerant circuit, the relay unit having a second refrigerant circuit through which a refrigerant circulates and a second water heat exchanger that exchanges heat with the second refrigerant circuit, the first water heat exchanger, the second water heat exchanger, and the load devices are connected by a first heat medium pipe to form a first heat medium circuit through which a heat medium circulates.
  • cooling and heating can be performed using a first refrigerant circuit provided in the heat source unit and a second refrigerant circuit provided in the relay unit, respectively, so the number of pipes connected to the heat source unit can be reduced.
  • FIG. 1 is a schematic diagram showing a heat pump device according to a first embodiment of the present invention
  • 1 is a refrigerant circuit diagram of a heat pump device according to a first embodiment.
  • 1 is a refrigerant circuit diagram illustrating a heat pump device according to a first embodiment of the present invention in which a first pump is disposed in a relay unit.
  • 1 is a refrigerant circuit diagram illustrating a heat pump device according to a first embodiment of the present invention in which a first pump is disposed in a heat source unit and a relay unit.
  • FIG. 2 is a refrigerant circuit diagram showing the flow of the refrigerant and the heat medium in the heat pump device according to the first embodiment when cooling is performed by all the load devices.
  • FIG. 1 is a schematic diagram showing a heat pump device according to a first embodiment of the present invention
  • 1 is a refrigerant circuit diagram of a heat pump device according to a first embodiment of the present invention in which a first pump is disposed in
  • FIG. 2 is a refrigerant circuit diagram showing the flows of the refrigerant and the heat medium in the heat pump device according to the first embodiment when heating is performed by all the load devices.
  • 1 is a refrigerant circuit diagram showing the flow of a refrigerant and a heat medium in a heat pump device according to a first embodiment of the present invention when the device is in a cooling-dominated operation mode.
  • 1 is a refrigerant circuit diagram showing the flows of a refrigerant and a heat medium in a heat pump device according to a first embodiment of the present invention in a heating-dominated operation mode.
  • FIG. 4 is a refrigerant circuit diagram showing a first modified example of the heat pump device according to the first embodiment.
  • FIG. 4 is a schematic configuration diagram showing a second modified example of the heat pump device according to the first embodiment.
  • FIG. 6 is a refrigerant circuit diagram of a heat pump device according to a second embodiment.
  • 13 is a graph showing a relationship between a cooling ratio of a load device and a ratio of a flow rate V1 of the heat medium flowing through a bypass flow path to a total flow rate V of the heat medium flowing through a first heat medium circuit in a heat pump device according to a second embodiment.
  • FIG. 11 is a refrigerant circuit diagram of a heat pump device according to a third embodiment.
  • FIG. 11 is a refrigerant circuit diagram of a heat pump device according to a third embodiment, in which hot water is produced in a first heat medium circuit.
  • FIG. 11 is a refrigerant circuit diagram of a heat pump device according to a third embodiment, in which cold water is produced in a first heat medium circuit.
  • FIG. 1 is a schematic diagram of a heat pump device 100 according to the first embodiment.
  • FIG. 2 is a refrigerant circuit diagram of the heat pump device 100 according to the first embodiment.
  • the white arrows in FIG. 2 indicate the flow of the heat medium.
  • the heat pump device 100 according to the first embodiment includes a heat source device 1, a relay device 2 connected to the heat source device 1, and two load devices 3A and 3B connected to the relay device 2.
  • the heat source device 1 is an outdoor unit as an example.
  • the load devices 3A and 3B are indoor units as an example.
  • the heat source device 1 is installed, for example, on the roof of a building 200.
  • the relay device 2 and the load devices 3A and 3B are installed, for example, inside the building 200.
  • the components constituting the heat source device 1, the relay device 2, and the load devices 3A and 3B are controlled by a control device 6.
  • the heat source unit 1 has a first refrigerant circuit 10 through which the refrigerant circulates, and a first water heat exchanger 11 that exchanges heat with the first refrigerant circuit 10.
  • the relay unit 2 has a second refrigerant circuit 20 through which the refrigerant circulates, a second water heat exchanger 21 that exchanges heat with the second refrigerant circuit 20, and a third water heat exchanger 22 that exchanges heat with the second refrigerant circuit 20.
  • the load devices 3A and 3B each have a load-side heat exchanger 30.
  • the first refrigerant circuit 10 is filled with a flammable refrigerant such as R290, NH 3 , or olefin (R1234yf, R1234ze(E), R1123, R1132(E), etc.). This is because the heat source unit 1 is mainly installed outdoors, and a refrigerant that is flammable but has a small global warming effect is used.
  • the second refrigerant circuit 20 is filled with a non-flammable or slightly flammable refrigerant such as R410A, R32, olefin, or a mixture of these refrigerants. This is because the relay unit 2 is mainly installed indoors.
  • the refrigerant filled in the first refrigerant circuit 10 and the second refrigerant circuit 20 are not limited to the above-mentioned refrigerants, and refrigerants commonly used in air conditioning today, such as R410A or R32, R290, CO 2 NH 3 , olefin, or a mixture of these refrigerants, or other types of refrigerants may be used.
  • the refrigerant filled in the second refrigerant circuit 20 may be a flammable refrigerant such as R290, NH 3 , or olefin, taking safety into consideration.
  • the amount of refrigerant circulating through the first refrigerant circuit 10 is greater than the amount of refrigerant circulating through the second refrigerant circuit 20.
  • the amount of refrigerant circulating through the first refrigerant circuit 10 is, for example, 5 kg or less.
  • the amount of refrigerant circulating through the second refrigerant circuit 20 is, for example, less than 1 kg, which is the standard for indoor use of a flammable refrigerant.
  • the first refrigerant circuit 10 is primarily used for the load devices 3A and 3B, which have a large operating load. In other words, in order to increase operating efficiency, the amount of refrigerant circulating through the first refrigerant circuit 10 is greater than the amount of refrigerant circulating through the second refrigerant circuit 20.
  • the first water heat exchanger 11, the second water heat exchanger 21, and the load side heat exchanger 30 are connected by a first heat medium pipe 40 to form a first heat medium circuit 4 through which the heat medium circulates.
  • the third water heat exchanger 22 and the load side heat exchanger 30 are connected by a second heat medium pipe 50 to form a second heat medium circuit 5 through which the heat medium circulates.
  • the first heat medium circuit 4 and the second heat medium circuit 5 are provided with first flow path switching devices 4a and 5a that switch the flow path of the heat medium flowing into the load devices 3A and 3B to the first heat medium circuit 4 or the second heat medium circuit 5.
  • the heat medium is, for example, water, brine, or a mixture of brine and water.
  • the heat source unit 1 has a first refrigerant circuit 10 through which a refrigerant circulates.
  • the first refrigerant circuit 10 is configured such that a first compressor 12, a first flow switching valve 13, a heat source side heat exchanger 14, a first expansion mechanism 15, and a first water heat exchanger 11 are connected in sequence by refrigerant piping.
  • the first refrigerant circuit 10 may include other components in addition to the above components, or some components may be omitted.
  • the first compressor 12 is, for example, an inverter compressor.
  • the operating frequency may be changed arbitrarily by an inverter circuit or the like to change the refrigerant discharge capacity per unit time.
  • the operation of the inverter circuit is controlled by the control device 6.
  • the refrigerant discharged from the first compressor 12 flows into the heat source side heat exchanger 14 or the first water heat exchanger 11 via the first flow path switching valve 13.
  • the first flow path switching valve 13 is, for example, a four-way valve, and has a function of switching the flow path of the refrigerant. During cooling operation, the first flow path switching valve 13 switches the refrigerant flow path to connect the refrigerant discharge side of the first compressor 12 to the heat source side heat exchanger 14, and to connect the refrigerant suction side of the first compressor 12 to the first water heat exchanger 11. On the other hand, during heating operation, the first flow path switching valve 13 switches the refrigerant flow path to connect the refrigerant discharge side of the first compressor 12 to the first water heat exchanger 11, and to connect the refrigerant suction side of the first compressor 12 to the heat source side heat exchanger 14.
  • the first flow path switching valve 13 may be configured by combining two-way valves or three-way valves.
  • the heat source side heat exchanger 14 functions as a condenser during cooling operation.
  • the heat source side heat exchanger 14 also functions as an evaporator during heating operation.
  • the heat source side heat exchanger 14 draws in outdoor air using the heat source side blower 16, and expels the air that has exchanged heat with the refrigerant flowing inside to the outside.
  • the first expansion mechanism 15 reduces the pressure of the refrigerant flowing through the first refrigerant circuit 10 and expands it, and is, for example, composed of an electronic expansion valve whose opening is variably controlled.
  • the first water heat exchanger 11 exchanges heat between the heat medium and the refrigerant.
  • the first water heat exchanger 11 is a flow path of the first refrigerant circuit 10 and a flow path of the first heat medium circuit 4.
  • the first water heat exchanger 11 is a device that constitutes the first refrigerant circuit 10 and a device that constitutes the first heat medium circuit 4.
  • the first water heat exchanger 11 functions as an evaporator during cooling operation, and exchanges heat between the refrigerant flowing out of the first expansion mechanism 15 and the heat medium, evaporating the refrigerant and vaporizing it, and cooling the heat medium.
  • the first water heat exchanger 11 functions as a condenser during heating operation, and exchanges heat between the refrigerant flowing in from the first compressor 12 and the heat medium, condensing the refrigerant to liquefy it or to convert it into a gas-liquid two-phase state, and heating the heat medium.
  • the relay unit 2 has a second refrigerant circuit 20 in which the refrigerant circulates, a second water heat exchanger 21 that exchanges heat with the second refrigerant circuit 20, a third water heat exchanger 22 that exchanges heat with the second refrigerant circuit 20, and first flow path switching devices 4a and 5a that switch the flow path of the heat medium flowing into the load devices 3A and 3B to the first heat medium circuit 4 or the second heat medium circuit 5.
  • the second refrigerant circuit 20 is configured such that a second compressor 23, a second flow path switching valve 24, a second water heat exchanger 21, a second expansion mechanism 25, and a third water heat exchanger 22 are connected in sequence by refrigerant piping.
  • the second refrigerant circuit 20 may include other components in addition to the above components, or some components may be omitted.
  • the second compressor 23 is, for example, an inverter compressor, and has basically the same configuration as the first compressor 12.
  • the refrigerant discharged from the second compressor 23 flows into the second water heat exchanger 21 or the third water heat exchanger 22 via the second flow path switching valve 24.
  • the second flow path switching valve 24 is, for example, a four-way valve, and is basically configured the same as the first flow path switching valve 13. During cooling operation, the second flow path switching valve 24 switches the refrigerant flow path to connect the refrigerant discharge side of the second compressor 23 to the second water heat exchanger 21 and to connect the refrigerant suction side of the second compressor 23 to the third water heat exchanger 22. On the other hand, during heating operation, the second flow path switching valve 24 switches the refrigerant flow path to connect the refrigerant discharge side of the second compressor 23 to the third water heat exchanger 22 and to connect the refrigerant suction side of the second compressor 23 to the second water heat exchanger 21.
  • the second flow path switching valve 24 may be configured by combining two-way valves or three-way valves.
  • the second expansion mechanism 25 reduces the pressure of the refrigerant circulating in the second refrigerant circuit 20 and expands it, and is, for example, composed of an electronic expansion valve whose opening is variably controlled.
  • the second water heat exchanger 21 exchanges heat between the heat medium and the refrigerant.
  • the second water heat exchanger 21 is a flow path of the second refrigerant circuit 20 and a flow path of the first heat medium circuit 4.
  • the second water heat exchanger 21 is a component of the second refrigerant circuit 20 and a component of the first heat medium circuit 4.
  • the second water heat exchanger 21 When the second water heat exchanger 21 functions as a condenser, it exchanges heat between the refrigerant flowing in from the second compressor 23 and the heat medium circulating through the first heat medium piping 40, condensing the refrigerant to liquefy or to form a two-phase gas-liquid mixture, and heating the heat medium.
  • the second water heat exchanger 21 When the second water heat exchanger 21 functions as an evaporator, it exchanges heat between the refrigerant flowing out from the second expansion mechanism 25 and the heat medium circulating through the first heat medium piping 40, evaporating the refrigerant to vaporize it, and cooling the heat medium.
  • the third water heat exchanger 22 exchanges heat between the heat medium and the refrigerant.
  • the third water heat exchanger 22 is a flow path of the second refrigerant circuit 20 and a flow path of the second heat medium circuit 5.
  • the third water heat exchanger 22 is a component of the second refrigerant circuit 20 and a component of the second heat medium circuit 5.
  • the third water heat exchanger 22 When the third water heat exchanger 22 functions as an evaporator, it exchanges heat between the refrigerant flowing out from the second expansion mechanism 25 and the heat medium circulating through the second heat medium piping 50, evaporating the refrigerant and cooling the heat medium.
  • the third water heat exchanger 22 When the third water heat exchanger 22 functions as a condenser, it exchanges heat between the refrigerant flowing in from the second compressor 23 and the heat medium circulating through the second heat medium piping 50, condensing the refrigerant and liquefying it or turning it into a gas-liquid two-phase state, and heating the heat medium.
  • the first flow path switching devices 4a are provided on the inlet and outlet sides of the refrigerant of the load side heat exchanger 30 in the first heat medium circuit 4.
  • the first flow path switching devices 5a are provided on the inlet and outlet sides of the refrigerant of the load side heat exchanger 30 in the second heat medium circuit 5.
  • the first flow path switching devices 4a and 5a are configured, for example, as two-way valves, and opening and closing is controlled by the control device 6.
  • the first flow path switching devices 4a and 5a may be configured, for example, as two-way valves that can control the valve opening degree (opening area).
  • the first flow path switching devices 4a and 5a control the heat medium flowing in and out of the load side heat exchanger 30 by controlling the opening and closing.
  • the first heat medium circuit 4 is provided with a first pump 41 that circulates the heat medium.
  • the first pump 41 is one of the devices that make up the first heat medium circuit 4, and is provided in the heat source unit 1 as an example.
  • the first pump 41 draws water in the first heat medium circuit 4, applies pressure, and sends it out to circulate.
  • the capacity of the first pump 41 is changed by a pump inverter drive device (not shown).
  • the pump inverter drive device changes the capacity of the first pump 41 by arbitrarily changing the drive frequency based on instructions from the control device 6.
  • FIG. 3 is a refrigerant circuit diagram of the heat pump device 100 according to the first embodiment, showing a configuration in which the first pump 41 is arranged in the relay unit 2.
  • FIG. 4 is a refrigerant circuit diagram of the heat pump device 100 according to the first embodiment, showing a configuration in which the first pump 41 is arranged in the heat source unit 1 and the relay unit 2.
  • the first pump 41 may be provided in the relay unit 2 as shown in FIG. 3. Also, the first pump 41 may be provided in each of the heat source unit 1 and the relay unit 2 as shown in FIG. 4.
  • the heat pump device 100 shown in FIG. 4 has two first pumps 41 connected in series, taking into account the pressure loss of the heat medium flowing between the heat source unit 1 and the relay unit 2, and the pressure loss of the heat medium flowing between the relay unit 2 and the load devices 3A and 3B.
  • the second heat medium circuit 5 is also provided with a second pump 51 for circulating the heat medium.
  • the second pump 51 is one of the devices constituting the second heat medium circuit 5.
  • the second pump 51 draws water in the second heat medium circuit 5, applies pressure and sends it out to circulate.
  • the capacity of the second pump 51 is changed by a pump inverter drive device (not shown).
  • the pump inverter drive device changes the capacity of the second pump 51 by arbitrarily changing the drive frequency based on instructions from the control device 6.
  • the second pump 51 has a smaller flow rate or head than the first pump 41. This is because the second heat medium circuit 5 connects the relay unit 2 to the load devices 3A and 3B, and has shorter heat medium piping than the first heat medium circuit 4, so the pressure loss is not as large. By making the second pump 51 smaller than the first pump 41, costs can be reduced and the burden of installation work can also be reduced.
  • the second pump 51 may have the same flow rate or head as the first pump 41.
  • the load devices 3A and 3B have a load-side heat exchanger 30 and a load-side blower 31.
  • the load devices 3A and 3B pass air in the indoor space through the load-side heat exchanger 30, generating an air flow that returns the air to the indoor space.
  • the load-side heat exchanger 30 is, as an example, a fin-tube type heat exchanger that exchanges heat between the indoor air in the indoor space supplied from the load-side blower 31 and the heat medium.
  • the load-side heat exchanger 30 passes a heat medium that is colder than the air through the heat transfer tube of the load-side heat exchanger 30, thereby cooling the indoor space.
  • the load-side heat exchanger 30 passes a heat medium that is warmer than the air through the heat transfer tube of the load-side heat exchanger 30, thereby heating the indoor space.
  • the load devices 3A and 3B may have a flow rate adjustment device that adjusts the flow rate of the heat medium flowing into the load-side heat exchanger 30.
  • the control device 6 controls the operation of the entire heat pump device 100. Specifically, the control device 6 controls the compressor drive frequency, the fan rotation speed, the switching of the flow path switching device, the opening of the expansion mechanism, the pump drive frequency, etc.
  • the control device 6 is composed of a computer equipped with a memory for storing data and programs required for control and a CPU for executing programs, dedicated hardware such as an ASIC or FPGA, or both.
  • the operation of the heat pump device 100 has four modes: cooling operation, heating operation, cooling-dominated operation, and heating-dominated operation.
  • Cooling operation is an operation mode in which only cooling is possible for the load devices 3A and 3B, and the load devices 3A and 3B are either cooling or stopped.
  • Heating operation is an operation mode in which only heating is possible for the load devices 3A and 3B, and the load devices 3A and 3B are either heating or stopped.
  • Cooling-dominated operation is an operation mode in which cooling and heating can be selected for each load device 3A and 3B, and in simultaneous cooling and heating operation in which the load device 3A or 3B performing cooling and the load device 3A or 3B performing heating exist simultaneously, the cooling load is larger than the heating load.
  • Heating-dominated operation is an operation mode in which cooling and heating can be selected for each load device 3A and 3B, and in simultaneous cooling and heating operation in which the load device 3A or 3B performing cooling and the load device 3A or 3B performing heating exist simultaneously, the heating load is larger than the cooling load.
  • Fig. 5 is a refrigerant circuit diagram showing the flow of the refrigerant and the heat medium in the heat pump device 100 according to the first embodiment when cooling is performed by all the load devices 3A and 3B.
  • the white color shown by the reference symbol 4a indicates a state in which the valve is open.
  • the black color shown by the reference symbol 5a indicates a state in which the valve is closed.
  • the first flow switching device 4a when cooling is performed by all the load devices 3A and 3B, the first flow switching device 4a is opened, the first flow switching device 5a is closed, the second refrigerant circuit 20 is stopped, and only the first refrigerant circuit 10 and the first heat medium circuit 4 are operated.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows to the heat source side heat exchanger 14, where it exchanges heat with the air and condenses and liquefies.
  • the condensed and liquefied refrigerant is depressurized in the first expansion mechanism 15 to become a low-pressure gas-liquid two-phase refrigerant, flows to the first water heat exchanger 11, and exchanges heat with the heat medium flowing in the first heat medium circuit 4 to evaporate and gasify.
  • the gasified refrigerant passes through the first flow switching valve 13 and is sucked into the first compressor 12 via the accumulator.
  • the heat medium flowing through the first heat medium circuit 4 is cooled by the refrigerant flowing through the first water heat exchanger 11 to become cold water, and then flows through the relay unit 2 to the load side heat exchanger 30, where it is heated through heat exchange with the indoor air in the indoor space.
  • the heated heat medium flows through the relay unit 2 again into the first water heat exchanger 11.
  • FIG. 6 is a refrigerant circuit diagram showing the flow of the refrigerant and the heat medium in the heat pump device 100 according to the first embodiment when heating is performed by all the load devices 3A and 3B.
  • the white color shown by the reference symbol 4a indicates a state in which the valve is open.
  • the black color shown by the reference symbol 5a indicates a state in which the valve is closed.
  • the first flow switching device 4a when heating is performed by all the load devices 3A and 3B, the first flow switching device 4a is opened, the first flow switching device 5a is closed, the second refrigerant circuit 20 is stopped, and only the first refrigerant circuit 10 and the first heat medium circuit 4 are operated.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows to the first water heat exchanger 11.
  • the refrigerant that flows into the first water heat exchanger 11 exchanges heat with the heat medium flowing through the first heat medium circuit 4, condenses and liquefies, is depressurized in the first expansion mechanism 15, and becomes a low-pressure gas-liquid two-phase refrigerant, which flows into the heat source side heat exchanger 14.
  • the gas-liquid two-phase refrigerant that flows into the heat source side heat exchanger 14 exchanges heat with the air and evaporates into gas, passes through the first flow switching valve 13, and is sucked into the first compressor 12 via the accumulator.
  • the heat medium flowing through the first heat medium circuit 4 is heated by the refrigerant flowing through the first water heat exchanger 11 to become hot water, and then flows through the relay unit 2 to the load side heat exchanger 30, where it is cooled by heat exchange with the indoor air in the indoor space.
  • the cooled heat medium flows through the relay unit 2 again into the first water heat exchanger 11.
  • Fig. 7 is a refrigerant circuit diagram showing the flow of the refrigerant and the heat medium in the heat pump device 100 according to the first embodiment in a case where cooling is the dominant operation.
  • the first refrigerant circuit 10 when one load device 3A performs cooling and the other load device 3B performs heating, the first refrigerant circuit 10, the first heat medium circuit 4, the second refrigerant circuit 20, and the second heat medium circuit 5 are operated. Then, in order to connect the load side heat exchanger 30 of the load device 3A performing cooling to the first heat medium circuit 4, the first flow switching device 4a is opened and the first flow switching device 5a is closed. Also, in order to connect the load side heat exchanger 30 of the load device 3B performing heating to the second heat medium circuit 5, the first flow switching device 4a is closed and the first flow switching device 5a is opened.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows to the heat source side heat exchanger 14, where it exchanges heat with the air and condenses and liquefies.
  • the condensed and liquefied refrigerant is decompressed in the first expansion mechanism 15 to become a low-pressure gas-liquid two-phase refrigerant, and flows to the second water heat exchanger 21, where it exchanges heat with the heat medium flowing in the first heat medium circuit 4 and evaporates into gas.
  • the gasified refrigerant passes through the first flow switching valve 13 and is sucked into the first compressor 12 via the accumulator.
  • the heat medium flowing through the first heat medium circuit 4 is cooled by the refrigerant flowing through the first water heat exchanger 11 to become cold water, and then flows through the relay unit 2 to the load side heat exchanger 30 of the load device 3A, where it is heated through heat exchange with the indoor air in the indoor space.
  • the heated heat medium flows to the second water heat exchanger 21, where it is cooled through heat exchange with the refrigerant circulating through the second refrigerant circuit 20, and then flows back into the first water heat exchanger 11.
  • the high-temperature, high-pressure gas refrigerant discharged from the second compressor 23 passes through the second flow path switching valve 24 and flows to the third water heat exchanger 22, where it exchanges heat with the heat medium flowing in the second heat medium circuit 5 and is condensed and liquefied.
  • the condensed and liquefied refrigerant is decompressed in the second expansion mechanism 25 to become a low-pressure gas-liquid two-phase refrigerant, flows to the second water heat exchanger 21, and exchanges heat with the heat medium flowing in the first heat medium circuit 4 to evaporate and gasify.
  • the gasified refrigerant passes through the second flow path switching valve 24 and is sucked into the second compressor 23 via the accumulator.
  • the heat medium flowing through the second heat medium circuit 5 is heated by the refrigerant flowing through the third water heat exchanger 22 to become hot water, and then flows into the load-side heat exchanger 30 of the load device 3B, where it is cooled by heat exchange with the indoor air in the indoor space.
  • the cooled heat medium flows back into the third water heat exchanger 22.
  • Fig. 8 is a refrigerant circuit diagram showing the flow of the refrigerant and the heat medium in the heat pump device according to the first embodiment in the case of heating-dominated operation.
  • the first refrigerant circuit 10 the first heat medium circuit 4, the second refrigerant circuit 20, and the second heat medium circuit 5 are operated. Then, in order to connect the load side heat exchanger 30 of the load device 3A performing cooling to the second heat medium circuit 5, the first flow path switching device 4a is closed and the first flow path switching device 5a is opened. Also, in order to connect the load side heat exchanger 30 of the load device 3B performing heating to the first heat medium circuit 4, the first flow path switching device 4a is opened and the first flow path switching device 5a is closed.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows to the first water heat exchanger 11.
  • the refrigerant that flows into the first water heat exchanger 11 exchanges heat with the heat medium flowing through the first heat medium circuit 4, condenses and liquefies, is depressurized in the first expansion mechanism 15, and becomes a low-pressure gas-liquid two-phase refrigerant, which flows into the heat source side heat exchanger 14.
  • the gas-liquid two-phase refrigerant that flows into the heat source side heat exchanger 14 exchanges heat with the air and evaporates into gas, passes through the first flow switching valve 13, and is sucked into the first compressor 12 via the accumulator.
  • the heat medium flowing through the first heat medium circuit 4 is heated by the refrigerant flowing through the first water heat exchanger 11 to become hot water, and then flows through the relay unit 2 to the load side heat exchanger 30 of the load device 3A, where it is cooled by heat exchange with the indoor air in the indoor space.
  • the cooled heat medium flows to the second water heat exchanger 21, where it is heated by heat exchange with the refrigerant circulating through the second refrigerant circuit 20, and then flows back into the first water heat exchanger 11.
  • the high-temperature, high-pressure gas refrigerant discharged from the second compressor 23 passes through the second flow path switching valve 24 and flows to the second water heat exchanger 21, where it exchanges heat with the heat medium flowing in the first heat medium circuit 4 and is condensed and liquefied.
  • the condensed and liquefied refrigerant is decompressed in the second expansion mechanism 25 to become a low-pressure gas-liquid two-phase refrigerant, flows to the third water heat exchanger 22, and exchanges heat with the heat medium flowing in the second heat medium circuit 5 to evaporate and gasify.
  • the gasified refrigerant passes through the second flow path switching valve 24 and is sucked into the second compressor 23 via the accumulator.
  • the heat medium flowing through the second heat medium circuit 5 is cooled by the refrigerant flowing through the third water heat exchanger 22 to become cold water, and then flows into the load-side heat exchanger 30 of the load device 3B, where it is heated through heat exchange with the indoor air in the indoor space.
  • the heated heat medium flows back into the third water heat exchanger 22.
  • Fig. 9 is a refrigerant circuit diagram showing a first modified example of the heat pump device 100 according to the first embodiment.
  • the heat pump device 100 shown in Fig. 9 has a hot water tank that supplies hot water as a load device 3C.
  • one load device 3B is an indoor unit, and the other load device 3C is a hot water tank.
  • a case where heating is performed by the load device 3B is described as an example, but cooling may also be performed by the load device 3B.
  • the heating load is assumed to be larger than the hot water supply load.
  • the heat medium circulating through the second heat medium circuit 5 is water supplied to the hot water tank, which is the load device 3C.
  • the hot water tank stores water supplied via a water supply pipe (not shown) and hot water heated by the third water heat exchanger 22.
  • the first refrigerant circuit 10 when one load device 3B performs heating and the other load device 3C performs hot water supply, the first refrigerant circuit 10, the first heat medium circuit 4, the second refrigerant circuit 20, and the second heat medium circuit 5 are operated. Then, in order to connect the load side heat exchanger 30 of the load device 3B performing heating to the first heat medium circuit 4, the first flow path switching device 4a is opened and the first flow path switching device 5a is closed. Also, in order to connect the load side heat exchanger 30 of the load device 3C performing hot water supply to the second heat medium circuit 5, the first flow path switching device 4a is closed and the first flow path switching device 5a is opened.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows to the first water heat exchanger 11.
  • the refrigerant that flows into the first water heat exchanger 11 exchanges heat with the heat medium flowing through the first heat medium circuit 4, condenses and liquefies, is depressurized in the first expansion mechanism 15, and becomes a low-pressure gas-liquid two-phase refrigerant, which flows into the heat source side heat exchanger 14.
  • the gas-liquid two-phase refrigerant that flows into the heat source side heat exchanger 14 exchanges heat with the air and evaporates into gas, passes through the first flow switching valve 13, and is sucked into the first compressor 12 via the accumulator.
  • the heat medium flowing through the first heat medium circuit 4 is heated by the refrigerant flowing through the first water heat exchanger 11 to become hot water, and then flows through the relay unit 2 to the load side heat exchanger 30 of the load device 3B, where it is cooled by heat exchange with the indoor air in the indoor space.
  • the cooled heat medium flows to the second water heat exchanger 21, where it is cooled by heat exchange with the refrigerant circulating through the second refrigerant circuit 20, and then flows back into the first water heat exchanger 11.
  • the high-temperature, high-pressure gas refrigerant discharged from the second compressor 23 passes through the second flow path switching valve 24 and flows to the third water heat exchanger 22, where it exchanges heat with the heat medium flowing in the second heat medium circuit 5 and is condensed and liquefied.
  • the condensed and liquefied refrigerant is decompressed in the second expansion mechanism 25 to become a low-pressure gas-liquid two-phase refrigerant, flows to the second water heat exchanger 21, and exchanges heat with the heat medium flowing in the first heat medium circuit 4 to evaporate and gasify.
  • the gasified refrigerant passes through the second flow path switching valve 24 and is sucked into the second compressor 23 via the accumulator.
  • the heat medium flowing through the second heat medium circuit 5 is heated by the refrigerant flowing through the third water heat exchanger 22 to become hot water, which is then stored in the storage tank.
  • the load devices 3B and 3C may all be hot water storage tanks that supply hot water.
  • the second refrigerant circuit 20 may omit the second flow path switching valve 24.
  • FIG. 10 is a schematic diagram showing a second modified example of the heat pump device 100 according to the first embodiment.
  • the number of the heat source device 1, the relay device 2, and the load devices 3A and 3B is not limited to the above.
  • two or more heat source devices 1 may be installed. When a plurality of heat source devices 1 are installed, the heat source devices 1 are connected to each other via the first heat medium pipes.
  • two or more relay devices 2 may be installed. When a plurality of relay devices 2 are installed, the relay devices 2 are connected to each other via the first heat medium pipes.
  • three or more load devices 3A and 3B connected to each relay device 2 may be installed.
  • all the load devices 3A and 3B may be indoor units, or some or all of the load devices 3A and 3B may be hot water storage tanks for supplying hot water.
  • some of the load devices 3A and 3B may include a configuration in which they are directly connected to the heat source device 1 without going through the relay device 2.
  • the heat pump device 100 includes a heat source unit 1, a relay unit 2 connected to the heat source unit 1, and a plurality of load devices 3A and 3B connected to the relay unit 2.
  • the heat source unit 1 includes a first refrigerant circuit 10 through which a refrigerant circulates, and a first water heat exchanger 11 that exchanges heat with the first refrigerant circuit 10.
  • the relay unit 2 includes a second refrigerant circuit 20 through which a refrigerant circulates, and a second water heat exchanger 21 that exchanges heat with the second refrigerant circuit 20.
  • the first water heat exchanger 11, the second water heat exchanger 21, and the load devices 3A and 3B are connected by a first heat medium pipe 40 to form a first heat medium circuit 4 through which a heat medium circulates.
  • the heat pump device 100 when cooling and heating are performed simultaneously by a plurality of load devices 3A and 3B, cooling and heating can be performed by the first refrigerant circuit 10 provided in the heat source unit 1 and the second refrigerant circuit 20 provided in the relay unit 2, respectively. Therefore, the heat pump device 100 can reduce the number of pipes connecting the heat source unit 1 and the relay unit 2 to two, so that the number of pipes can be reduced and the burden of piping work can be reduced.
  • a heat pump device 101 according to the second embodiment will be described with reference to Fig. 11 and Fig. 12.
  • Fig. 11 is a refrigerant circuit diagram of the heat pump device 101 according to the second embodiment. Note that the same components as those in the heat pump device 100 described in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.
  • the second refrigerant circuit 20 and the second heat medium circuit 5 are operated, so the load for generating hot and cold water in the heat source unit 1 is reduced. Therefore, it is no longer necessary to cause all of the heat medium flowing through the first heat medium circuit 4 to flow into the first water heat exchanger 11.
  • a bypass flow path 7 and a flow rate control device 8 are provided in the first heat medium circuit 4.
  • the bypass flow path 7 connects the first heat medium pipe 40 between the first water heat exchanger 11 and the second water heat exchanger 21, and the first heat medium pipe 40 between the first water heat exchanger 11 and the load side heat exchanger 30.
  • the flow rate control device 8 controls the flow rate of the heat medium flowing into the first water heat exchanger 11 and the flow rate of the heat medium flowing into the outlet side of the first water heat exchanger 11 via the bypass flow path 7.
  • the flow rate control device 8 has a first flow rate control valve 8a provided between the inlet end of the bypass flow path 7 and the first water heat exchanger 11, and a second flow rate control valve 8b provided in the bypass flow path 7.
  • first flow rate control valve 8a provided between the inlet end of the bypass flow path 7 and the first water heat exchanger 11
  • second flow rate control valve 8b provided in the bypass flow path 7.
  • the flow rate of the heat medium flowing through the first water heat exchanger 11 and the bypass flow path 7 can be adjusted by controlling the first flow control valve 8a and the second flow control valve 8b.
  • the first flow control valve 8a and the second flow control valve 8b are, for example, configured as two-way valves capable of controlling the valve opening (opening area).
  • the first flow control valve 8a adjusts its opening to control the flow rate of the heat medium flowing into the first water heat exchanger 11.
  • the second flow control valve 8b adjusts its opening to control the flow rate of the heat medium flowing into the bypass flow path 7.
  • the first flow control valve 8a and the second flow control valve 8b are controlled by the control device 6.
  • FIG. 12 is a graph showing the relationship between the cooling ratio of the load devices 3A and 3B and the ratio of the flow rate V1 of the heat medium flowing in the bypass flow path 7 to the total flow rate V of the heat medium flowing in the first heat medium circuit 4 in the heat pump device 101 according to the second embodiment.
  • the horizontal axis shows the cooling ratio of the load devices 3A and 3B.
  • the vertical axis shows the ratio of the flow rate V1 of the heat medium flowing in the bypass flow path 7 to the total flow rate V of the heat medium flowing in the first heat medium circuit 4. 100% on the horizontal axis indicates a state in which only cooling is being performed by the load devices 3A and 3B. Meanwhile, 0% on the horizontal axis indicates a state in which only heating is being performed by the load devices 3A and 3B.
  • the first flow control valve 8a is fully opened and the second flow control valve 8b is fully closed, and the ratio of the flow rate V1 flowing through the bypass flow path 7 to the total flow rate V of the heat medium flowing through the first heat medium circuit 4 is set to 0%.
  • the opening degree of the first flow control valve 8a and the second flow control valve 8b is controlled according to the cooling ratio of the load devices 3A and 3B, and the ratio of the flow rate V1 flowing through the bypass flow path 7 to the total flow rate V of the heat medium flowing through the first heat medium circuit 4 is adjusted.
  • This makes it possible to reduce the flow rate V2 of the heat medium flowing into the heat source unit 1, thereby improving the heat exchange efficiency.
  • the first flow control valve 8a When the cooling and heating loads of the load devices 3A and 3B do not change (point A in FIG. 12), the first flow control valve 8a is fully closed and the second flow control valve 8b is fully opened, and the flow rate V1 flowing through the bypass flow path 7 is set to 100%. This allows the operation of the heat source unit 1 to be stopped, thereby improving the energy saving performance of the heat pump device 100.
  • the bypass flow path 7 is provided in the relay unit 2, but it may be provided in the heat source unit 1.
  • the heat pump device 101 according to the second embodiment may be configured as a storage tank for supplying hot water as a load device, as shown in FIG. 9.
  • a heat pump device 102 according to the third embodiment will be described with reference to Fig. 13 to Fig. 15.
  • Fig. 13 is a refrigerant circuit diagram of the heat pump device 102 according to the third embodiment. Note that the same components as those in the heat pump device 100 described in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.
  • the piping is configured so that the refrigerant circulating in the first refrigerant circuit 10 and the heat medium circulating in the first heat medium circuit 4 flow in countercurrent in the first water heat exchanger 11, thereby increasing the heat exchange rate in the first water heat exchanger 11 and improving energy efficiency.
  • the heat pump device 102 according to the third embodiment is particularly effective when using a non-azeotropic refrigerant mixture with different boiling points and dew points, and can reduce the temperature difference between the refrigerant and water in the refrigerant condensation process (heating water) and the refrigerant evaporation process (cooling water), thereby increasing system efficiency.
  • the first heat medium circuit 4 of the heat pump unit 102 is provided with a second flow path switching device 9 that reverses the flow of the heat medium flowing into the first water heat exchanger 11.
  • the second flow path switching device 9 has a first bypass piping 90, a second bypass piping 91, a first opening/closing valve 92, a second opening/closing valve 93, a third opening/closing valve 94, and a fourth opening/closing valve 95.
  • the first bypass pipe 90 has a first inlet end 90a connected to the first heat medium pipe 40 between the first water heat exchanger 11 and the second water heat exchanger 21, and a first outlet end 90b connected to the first heat medium pipe 40 between the first water heat exchanger 11 and the load devices 3A and 3B.
  • the second bypass pipe 91 has a second inlet end 91a connected to the first heat medium pipe 40 between the first water heat exchanger 11 and the first inlet end 90a of the first bypass pipe 90, and a second outlet end 91b connected to the first heat medium pipe 40 between the first outlet end 90b of the first bypass pipe 90 and the load devices 3A and 3B.
  • the first on-off valve 92 is provided in the first heat medium pipe 40 between the first inlet end 90a of the first bypass pipe 90 and the second inlet end 91a of the second bypass pipe 91.
  • the second on-off valve 93 is provided in the first bypass pipe 90.
  • the third on-off valve 94 is provided in the second bypass pipe 91.
  • the fourth on-off valve 95 is provided in the first heat medium pipe 40 between the first outlet end 90b of the first bypass pipe 90 and the second outlet end 91b of the second bypass pipe 91.
  • the first on-off valve 92, the second on-off valve 93, the third on-off valve 94 and the fourth on-off valve 95 are, for example, two-way valves, and their opening and closing is controlled by the control device 6.
  • FIG. 14 is a refrigerant circuit diagram of the heat pump device 102 according to the third embodiment, in which hot water is produced in the first heat medium circuit 4.
  • the white colors indicated by the reference numerals 92 and 95 indicate that the valves are open.
  • the black colors indicated by the reference numerals 93 and 94 indicate that the valves are closed.
  • the first on-off valve 92 and the fourth on-off valve 95 are opened, and the second on-off valve 93 and the third on-off valve 94 are closed.
  • the heat medium flowing through the first heat medium circuit 4 flows from the second water heat exchanger 21 to the first water heat exchanger 11, where it is heated by the refrigerant flowing through the first water heat exchanger 11 to become hot water, and then flows to the load side heat exchanger 30, where it is cooled by heat exchange with the indoor air in the indoor space.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows into the first water heat exchanger 11. That is, in the first water heat exchanger 11, the refrigerant circulating in the first refrigerant circuit 10 and the heat medium circulating in the first heat medium circuit 4 flow in opposite directions.
  • FIG. 15 is a refrigerant circuit diagram of the heat pump device 100 according to the third embodiment, in which cold water is produced in the first heat medium circuit 4.
  • the white colors shown in the reference numerals 93 and 94 indicate that the valves are open.
  • the black colors shown in the reference numerals 92 and 95 indicate that the valves are closed.
  • the heat pump device 102 as shown in FIG. 15, when cold water is produced in the first heat medium circuit 4, the first on-off valve 92 and the fourth on-off valve 95 are closed, and the second on-off valve 93 and the third on-off valve 94 are opened. In this case, the heat medium flowing through the first heat medium circuit 4 flows from the second water heat exchanger 21 to the first bypass piping 90 and then to the first water heat exchanger 11.
  • the heat medium flowing through the first water heat exchanger 11 is cooled by the refrigerant flowing through the first water heat exchanger 11 to become cold water, and then flows through the second bypass piping 91 and flows to the load side heat exchanger 30, where it is heated by heat exchange with the indoor air in the indoor space.
  • the high-temperature, high-pressure gas refrigerant discharged from the first compressor 12 passes through the first flow switching valve 13 and flows to the heat source side heat exchanger 14, where it exchanges heat with the air and condenses and liquefies.
  • the condensed and liquefied refrigerant is decompressed in the first expansion mechanism 15 to become a low-pressure gas-liquid two-phase refrigerant, and flows to the first water heat exchanger 11.
  • the refrigerant circulating in the first refrigerant circuit 10 and the heat medium circulating in the first heat medium circuit 4 flow in counterflow.
  • the refrigerant circulating through the first refrigerant circuit 10 and the heat medium circulating through the first heat medium circuit 4 flow in opposite directions in the first water heat exchanger 11, thereby increasing the heat exchange rate and improving energy efficiency.
  • the heat pump devices (100-102) have been described above based on the embodiments, but the heat pump devices (100-102) are not limited to the configurations of the above-mentioned embodiments.
  • the configurations of the heat pump devices (100-102) described above are merely examples, and other components may be included, or some components may be omitted.
  • the heat pump devices (100-102) include the range of design modifications and application variations that would normally be made by a person skilled in the art, provided that they do not deviate from the technical concept.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

L'invention concerne un appareil de pompe à chaleur qui comprend : un dispositif de source de chaleur ; un dispositif de relais connecté au dispositif de source de chaleur ; et une pluralité de dispositifs de charge connectés au dispositif de relais. Le dispositif de source de chaleur présente un premier circuit de fluide frigorigène à travers lequel circule un fluide frigorigène, et un premier échangeur de chaleur à eau qui échange de la chaleur avec le premier circuit de fluide frigorigène. Le dispositif de relais comporte un second circuit de fluide frigorigène à travers lequel circule le fluide frigorigène, et un second échangeur de chaleur à eau qui échange de la chaleur avec le second circuit de fluide frigorigène. Le premier échangeur de chaleur à eau, le second échangeur de chaleur à eau et les dispositifs de charge sont reliés par une première tuyauterie de milieu thermique, et forment un premier circuit de milieu thermique à travers lequel circule un milieu thermique.
PCT/JP2022/036812 2022-09-30 2022-09-30 Appareil de pompe à chaleur WO2024069970A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/036812 WO2024069970A1 (fr) 2022-09-30 2022-09-30 Appareil de pompe à chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/036812 WO2024069970A1 (fr) 2022-09-30 2022-09-30 Appareil de pompe à chaleur

Publications (1)

Publication Number Publication Date
WO2024069970A1 true WO2024069970A1 (fr) 2024-04-04

Family

ID=90476682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/036812 WO2024069970A1 (fr) 2022-09-30 2022-09-30 Appareil de pompe à chaleur

Country Status (1)

Country Link
WO (1) WO2024069970A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006258343A (ja) * 2005-03-16 2006-09-28 Mitsubishi Electric Corp 空気調和装置
WO2012032580A1 (fr) * 2010-09-10 2012-03-15 三菱電機株式会社 Dispositif de climatisation
WO2018066089A1 (fr) * 2016-10-05 2018-04-12 三菱電機株式会社 Machine de réfrigération et système de climatisation
JP2018080865A (ja) * 2016-11-15 2018-05-24 株式会社デンソー 冷凍サイクル装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006258343A (ja) * 2005-03-16 2006-09-28 Mitsubishi Electric Corp 空気調和装置
WO2012032580A1 (fr) * 2010-09-10 2012-03-15 三菱電機株式会社 Dispositif de climatisation
WO2018066089A1 (fr) * 2016-10-05 2018-04-12 三菱電機株式会社 Machine de réfrigération et système de climatisation
JP2018080865A (ja) * 2016-11-15 2018-05-24 株式会社デンソー 冷凍サイクル装置

Similar Documents

Publication Publication Date Title
JP5197576B2 (ja) ヒートポンプ装置
WO2011048695A1 (fr) Dispositif de conditionnement d'air
JP2009228979A (ja) 空気調和装置
US9890976B2 (en) Air-conditioning apparatus
WO2015140994A1 (fr) Unité côté source de chaleur et climatiseur
JP2019109044A (ja) 室内機
JP2017101855A (ja) 空気調和装置
EP2584285B1 (fr) Dispositif de climatisation à réfrigération
EP2541170A1 (fr) Système d'alimentation en eau chaude pour conditionneur d'air
WO2004005811A1 (fr) Materiel de refrigeration
JP2000274879A (ja) 空気調和機
KR100667517B1 (ko) 용량 가변형 압축기를 구비한 공기조화기
JP6576603B1 (ja) 空気調和装置
JP5312681B2 (ja) 空気調和装置
WO2024069970A1 (fr) Appareil de pompe à chaleur
JP6238935B2 (ja) 冷凍サイクル装置
JP2005283058A (ja) 再熱除湿型空気調和機
JP2001066006A (ja) 空気調和装置の冷媒回路
WO2021106084A1 (fr) Dispositif à cycle de réfrigération
WO2024166275A1 (fr) Dispositif de pompe à chaleur
JP2004293889A (ja) 氷蓄熱ユニット、氷蓄熱式空調装置及びその運転方法
JP7573733B2 (ja) 冷凍サイクル装置
KR100215038B1 (ko) 멀티에어컨용 실내기의 연결구조
WO2023139702A1 (fr) Dispositif à cycle frigorifique
WO2022003754A1 (fr) Dispositif à cycle de réfrigération

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22961029

Country of ref document: EP

Kind code of ref document: A1