WO2024062951A1 - Flux et pâte à braser - Google Patents

Flux et pâte à braser Download PDF

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Publication number
WO2024062951A1
WO2024062951A1 PCT/JP2023/032877 JP2023032877W WO2024062951A1 WO 2024062951 A1 WO2024062951 A1 WO 2024062951A1 JP 2023032877 W JP2023032877 W JP 2023032877W WO 2024062951 A1 WO2024062951 A1 WO 2024062951A1
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Prior art keywords
acid
flux
mass
group
solder
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PCT/JP2023/032877
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English (en)
Japanese (ja)
Inventor
一博 行方
遼 神尾
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株式会社弘輝
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Publication of WO2024062951A1 publication Critical patent/WO2024062951A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Definitions

  • the present invention relates to flux and solder paste.
  • solder paste made from a mixture of solder alloy powder and flux is used.
  • the solder paste is applied to the electrode parts on the surface of the board, and is heated (reflowed) while the electrode parts of the joining components are in contact with the electrode parts. This melts the solder alloy powder to form a solder joint, and a joining structure can be obtained in which the board and joining components are joined via the solder joint.
  • Manufacturing defects in such bonded structures are detected by performing various inspections.
  • electrical inspection may be performed by bringing a probe into contact with a solder alloy formed by melting solder alloy powder in order to find defects that cannot be detected by visual inspection or appearance inspection equipment.
  • ICT in-circuit test
  • a checker pin is brought into contact with a solder alloy (pin contact) to apply a measurement signal and measure voltage and current. Measure.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flux and a solder paste that can reduce the coverage of flux residue on a solder alloy.
  • the flux according to the present invention is a flux used for soldering, which contains at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure, and a number of carbon atoms. At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain of 1 to 11 and an imidazole derivative having a phenyl group, a liquid resin, and at least one selected from the group consisting of a liquid polymerized fatty acid. and one liquid polymeric compound.
  • the solder paste according to the present invention includes the flux and solder alloy powder.
  • the flux according to the present embodiment has at least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure, and an alkyl chain having 1 to 11 carbon atoms.
  • the carboxylic acid is at least one selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure. From the viewpoint of improving solder melting property, the carboxylic acid preferably has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
  • dicarboxylic acids examples include 4,4'-dicarboxydiphenyl ether, 4,4-biphenyldicarboxylic acid, 4,4-stilbenedicarboxylic acid, 2,6-naphthalene dicarboxylic acid, bis(2-carboxyethyl)isocyanuric acid, 3,3'-dicarboxydiphenyl ether, 2,2'-dicarboxydiphenyl ether, 3,3-biphenyldicarboxylic acid, 2,2-biphenyldicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, Examples include decahydro-1,4-naphthalene dicarboxylic acid.
  • the dicarboxylic acid is preferably at least one selected from the group consisting of 4,4'-dicarboxydiphenyl ether and 2,6-naphthalene dicarboxylic acid from the viewpoint of improving solder meltability. preferable.
  • the said dicarboxylic acid may be used individually by 1 type, or may use 2 or more types together.
  • tricarboxylic acids examples include tris(2-carboxyethyl)isocyanuric acid, tris(2-carboxypropyl)isocyanuric acid, 1,4,5-naphthalenetricarboxylic acid, and the like.
  • the tricarboxylic acid is at least one selected from the group consisting of tris(2-carboxyethyl)isocyanuric acid and tris(2-carboxypropyl)isocyanuric acid from the viewpoint of improving solder meltability. It is preferable that there be.
  • the said tricarboxylic acid may be used individually by 1 type, or may use 2 or more types together.
  • the content of the carboxylic acid is preferably 0.5% by mass or more, more preferably 1.5% by mass or more, and preferably 4.0% by mass or more, based on the entire flux. Particularly preferred. Further, the content of the carboxylic acid is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, and 6.0% by mass or less based on the entire flux. This is particularly preferred. In addition, when two or more types of carboxylic acids are included, the content is the total content.
  • the imidazole compound is at least one selected from the group consisting of imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms and imidazole derivatives having a phenyl group. Further, the imidazole compound is preferably an imidazole derivative having a phenyl group from the viewpoint of improving solder meltability.
  • imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms examples include 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-isopropylimidazole, 2-butylimidazole, and 2-undecylimidazole.
  • 2,4-diamino-6-(2-(2-methylimidazol-1-yl)ethyl)-1,3,5-triazine 2,4-diamino-6-(2-(2-ethyl 4- Methylimidazol-1-yl)ethyl)-1,3,5-triazine
  • imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms include 2-ethylimidazole, 2-undecylimidazole, 2,4-diamino-6-(2-(2-ethyl 4-methyl imidazol-1-yl)ethyl)-1,3,5-triazine, 2,4-diamino-6-(2'-undecyl-imidazolyl)-ethyl-s-triazine, 2,4-diamino-6-[2 It may be at least one selected from the group consisting of '-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct.
  • the imidazole derivatives having an alkyl chain having 1 or more and 11 or less carbon atoms may be used alone or in combination of two or more.
  • imidazole derivatives having a phenyl group examples include 2-phenylimidazole, 1-benzyl-2-phenyl-1H-imidazole, 4-methyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2 -phenyl-4-methyl-5-hydroxymethylimidazole, 2,4,5-triphenylimidazole and the like.
  • the imidazole derivative having a phenyl group is preferably 2-phenyl-4-methyl-5-hydroxymethylimidazole from the viewpoint of improving solder meltability.
  • the imidazole derivatives having a phenyl group may be used alone or in combination of two or more.
  • the content of the imidazole compound is preferably 0.5% by mass or more, more preferably 1.5% by mass or more, and preferably 4.0% by mass or more, based on the entire flux. Particularly preferred. Further, the content of the imidazole compound is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, and 6.0% by mass or less based on the entire flux. This is particularly preferred. In addition, when two or more types of imidazole compounds are included, the content is the total content.
  • the liquid polymer compound is at least one selected from the group consisting of liquid resin and liquid polymer fatty acid. Further, the liquid polymer compound is preferably a liquid polymer fatty acid from the viewpoint of improving solder meltability.
  • liquid resin examples include dimer diol, hydrogenated polybutadiene having hydroxyl groups at both ends (hydroxyl group-terminated liquid polybutadiene), liquid polybutadiene having hydroxyl groups at both ends (hydroxyl group-terminated liquid polybutadiene), and liquid polybutadiene having hydroxyl groups at both ends.
  • examples include isoprene (hydroxyl group-terminated liquid polyisoprene), polybutene, acrylic resin, polyester polyol resin, and the like.
  • the liquid resin may be at least one selected from the group consisting of polybutadiene hydrogenated with hydroxyl groups at both ends, liquid polyisoprene having hydroxyl groups at both ends, and polybutene.
  • liquid resins include, for example, Pripol 2033 (manufactured by Croda Japan), GI-1000, GI-2000, GI-3000 (manufactured by Nippon Soda), G-1000, G-2000, G-3000 (manufactured by Nippon Soda Co., Ltd.), Poly-bd R-15HT, Poly-bd R-45HT (manufactured by Idemitsu Kosan Co., Ltd.), Poly-ip (manufactured by Idemitsu Kosan Co., Ltd.), EPOL (manufactured by Idemitsu Kosan Co., Ltd.) ), NOF Polybutene O-15N, NOF Polybutene 3N, NOF Polybutene 10N, NOF Polybutene 30N (manufactured by NOF Corporation), Nippon Oil Polybutene Grade LV-7, Grade LV-50, Grade LV-100, Grade HV-15, Grade 35, Grade HV-50, Grade
  • the liquid polymerized fatty acid preferably has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less, and more preferably 250 mgKOH/g or more and 300 mgKOH/g or less.
  • the acid value represents the number of milligrams of potassium hydroxide required to neutralize the acidic components contained in 1 g of sample, and can be measured in accordance with the potentiometric titration method of JIS K 2501:2003.
  • liquid polymerized fatty acid examples include dimer acid, hydrogenated dimer acid, 5 (or 6)-carboxy-4-hexylcyclohex-2-en-1-octanoic acid, trimer acid, and the like.
  • the liquid polymerized fatty acid is preferably 5 (or 6)-carboxy-4-hexylcyclohex-2-en-1-octanoic acid from the viewpoint of improving solder meltability.
  • liquid polymerized fatty acids include, for example, Tsuno Dime 205, Tsuno Dime 216, Tsuno Dime 228, Tsuno Dime 395 (manufactured by Tsuno Shokuhin Kogyo Co., Ltd.), Pripol 1004, Pripol 1009, Pripol 1006, Pripol 1010, Pripol 1013, and Pripol 1017.
  • Pripol 1025 (manufactured by Croda Japan), Tsunodime 346 (manufactured by Tsuno Foods Co., Ltd.), Pripol 1040 (manufactured by Croda Japan), Haridimer 200, Haridimer 250, Haridimer 300 (manufactured by Harima Kasei) ), Diacid 1550 (manufactured by Harima Kasei Co., Ltd.), and the like.
  • the liquid polymerized fatty acids may be used alone or in combination of two or more.
  • the content of the liquid polymer compound is preferably 2.0% by mass or more, more preferably 5.0% by mass or more, based on the entire flux, It is particularly preferable that the content is 8.0% by mass or more. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the liquid polymer compound is preferably 18.0% by mass or less, and 12.0% by mass or less, based on the entire flux. is more preferable, and particularly preferably 10.0% by mass or less. In addition, when the said liquid polymer compound is contained 2 or more types, the said content is a total content.
  • the flux according to this embodiment may contain other resins than the liquid resin.
  • the other resins include rosin resins, terpene phenol resins, phenol resins, polyvinyl acetate resins, ethylene-vinyl acetate copolymers, polylactic acid, and polystyrene.
  • the other resin includes a rosin resin from the viewpoint of improving solder meltability.
  • the rosin resin is not particularly limited, and may be selected from the group consisting of rosin and rosin derivatives (for example, hydrogenated rosin, polymerized rosin, disproportionated rosin, acrylic acid-modified rosin, etc.).
  • One or more rosin resins can be used. Note that the other resins may be used alone or in combination of two or more.
  • the content of the other resin is preferably 25.0% by mass or more, and more preferably 30.0% by mass or more, based on the entire flux. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the other resin is preferably 45.0% by mass or less, and 40.0% by mass or less, based on the entire flux. is more preferable. In addition, when two or more types of other resins are contained, the said content is a total content.
  • the flux according to this embodiment may contain a solvent.
  • the solvent include diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono-2-ethylhexyl ether (2-ethylhexyl diglycol), diethylene glycol monobutyl ether (butyl diglycol), and triethylene.
  • Glycol ethers such as glycol monobutyl ether (butyl triglycol), polyethylene glycol dimethyl ether, tripropylene glycol n-butyl ether; aliphatic compounds such as n-hexane, isohexane, n-heptane; isopropyl acetate, methyl propionate, propionic acid
  • Known solvents such as esters such as ethyl; ketones such as methyl ethyl ketone, methyl-n-propyl ketone and diethyl ketone; and alcohols such as ethanol, n-propanol, isopropanol and isobutanol can be used.
  • the said solvent may be used individually by 1 type, or may use 2 or more types together.
  • the content of the solvent is preferably 30.0% by mass or more, more preferably 40.0% by mass or more, based on the entire flux. Further, the content of the solvent is preferably 60.0% by mass or less, more preferably 50.0% by mass or less, based on the entire flux. In addition, when two or more kinds of the above-mentioned solvents are contained, the above-mentioned content is the total content.
  • the flux according to this embodiment may contain a thixotropic agent.
  • a thixotropic agent examples include hydrogenated castor oil, fatty acid amide, fatty acid bisamide, polyamide compound, kaolin, colloidal silica, organic bentonite, glass frit, and the like.
  • the thixotropic agent is preferably a fatty acid bisamide or a polyamide compound from the viewpoint of improving heat resistance.
  • fatty acid bisamides include methylene bisstearamide, ethylene biscapric acid amide, ethylene bislauric acid amide, ethylene bisstearic acid amide, ethylene bishydroxystearic acid amide, ethylene bisbehenic acid amide, and hexamethylene bis stearic acid amide. , hexamethylenebisbehenic acid amide, hexamethylenebis-12-hydroxystearic acid amide, N,N'-distearyladipic acid amide, N,N'-xylylenebis-12-hydroxystearylamide, and the like.
  • polyamide compounds examples include aliphatic polyamide compounds such as Talen VA-79, AMX-6096A, WH-215, and WH-255 (all manufactured by Kyoeisha Chemical Co., Ltd.), SP-10, and SP-500 (all manufactured by Toray Industries, Inc.).
  • Aromatic polyamide compounds (semi-aromatic polyamide compounds or fully aromatic polyamide compounds) containing a cyclic compound such as a benzene ring or a naphthalene ring in the main chain, such as Grilamid L20G, Grilamid TR55 (manufactured by M Chemie Japan), etc. ), such as JH-180 (manufactured by Ito Oil Co., Ltd.).
  • the thixotropic agents may be used alone or in combination of two or more.
  • the content of the thixotropic agent is preferably 1.0% by mass or more, more preferably 3.0% by mass or more, based on the entire flux. Further, the content of the thixotropic agent is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, based on the entire flux. In addition, when 2 or more types of thixotropic agents are contained, the said content is a total content.
  • the flux according to this embodiment may contain other activators other than the imidazole compound and the dicarboxylic acid.
  • the other activators are not particularly limited, and include, for example, organic acid activators, amine compounds, amino acids, halogen activators such as amine halogen salts, and halogen compounds.
  • the above-mentioned other activators may be used alone or in combination of two or more.
  • the organic acid activator is not particularly limited, and includes, for example, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, and palmitic acid.
  • monocarboxylic acids such as margaric acid, stearic acid, tuberculostearic acid, arachidic acid, behenic acid, lignoceric acid, glycolic acid; oxalic acid, malonic acid, succinic acid, methylsuccinic acid, glutaric acid, adipic acid, pimelic acid , dicarboxylic acids such as suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, diglycolic acid; others such as levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, picolinic acid, etc. Examples include organic acids.
  • the amine compound is not particularly limited, and examples thereof include triazole compounds.
  • examples of the triazole compound include benzotriazole, 1H-benzotriazole-1-methanol, 1-methyl-1H-benzotriazole, and the like.
  • Other amine compounds include, for example, cetylamine, erucic acid amide, 3-(dimethylamino)-1,2-propanediol, 3,5-dimethylpyrazole, dimethylurea, hexahydro-1,3,5-triphenyl -1,3,5-triazine, pyrazinamide, N-phenylglycine, 3-methyl-5-pyrazolone, N-lauroylsarcosine, 1,3-diphenylguanidine and the like.
  • the amino acids are not particularly limited, and include, for example, N-acetylphenylalanine (N-acetyl-L-phenylalanine, N-acetyl-DL-phenylalanine, N-acetyl-D-phenylalanine), N-acetylglutamic acid ( N-acetyl-L-glutamic acid), N-acetylglycine, N-acetylleucine (N-acetyl-L-leucine, N-acetyl-DL-leucine, N-acetyl-D-leucine), or N-acetylphenyl Examples include glycine (N-acetyl-N-phenylglycine, N-acetyl-L-phenylglycine, N-acetyl-DL-phenylglycine) and the like.
  • the halogen-based activator is not particularly limited, and examples thereof include amine halogen salts, halogen compounds, and the like.
  • examples of the amine of the amine halogen salt include diethylamine, dibutylamine, tributylamine, diphenylguanidine, and cyclohexylamine.
  • examples of the halogen in the amine halogen salt include fluorine, chlorine, bromine, and iodine.
  • Examples of halogen compounds include tris(2,3-dibromopropyl) isocyanurate, 2,3-dibromo-2-butene-1,4-diol, and 2-bromo-3-iodo-2-butene-1,4-diol. , TBA-bis(2,3-dibromopropyl ether), 4,4'-diiodobiphenyl, and the like.
  • the content of the other activator is preferably 0.5% by mass or more, and more preferably 3.0% by mass or more, based on the entire flux, from the viewpoint of improving solder meltability. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the other activator is preferably 20.0% by mass or less, and 10.0% by mass or less, based on the entire flux. is more preferable. In addition, when two or more kinds of the above-mentioned other activators are contained, the above-mentioned content is the total content.
  • the flux according to the present embodiment may contain, as other additives, at least one selected from the group consisting of stabilizers, surfactants, antifoaming agents, and antioxidants.
  • the total content of other additives is not particularly limited, and can be, for example, 5.0% by mass or less based on the entire flux.
  • the flux according to the present embodiment is useful for visual inspection using a camera such as ICT inspection and automatic optical inspection (AOI), and can be suitably used.
  • a camera such as ICT inspection and automatic optical inspection (AOI)
  • the flux according to the present embodiment includes at least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure, and an imidazole having an alkyl chain having 1 to 11 carbon atoms. At least one imidazole compound selected from the group consisting of derivatives and imidazole derivatives having a phenyl group, and at least one liquid polymer compound selected from the group consisting of liquid resins and liquid polymerized fatty acids. Accordingly, the coverage of flux residue on the solder alloy can be reduced.
  • the flux according to the present embodiment can suppress adhesion of flux residue to checker pins by reducing the coverage of flux residue on the solder alloy. As a result, the period during which one checker pin can be inspected becomes longer, and the working time per man-hour can be shortened.
  • the carboxylic acid has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
  • the coverage rate of flux residue can be further reduced.
  • the content of the carboxylic acid is 0.5% by mass or more and 10.0% by mass or less based on the entire flux, thereby further reducing the coverage of flux residue on the solder alloy. can be done.
  • the content of the imidazole compound is 0.5% by mass or more and 10.0% by mass or less based on the entire flux, thereby further reducing the coverage of flux residue on the solder alloy. can be done.
  • the acid value of the liquid polymerized fatty acid is 150 mgKOH/g or more and 320 mgKOH/g or less, it is possible to further reduce the coverage of flux residue on the solder alloy.
  • the flux according to the present embodiment has a content of the liquid polymer compound of 2.0% by mass or more and 18.0% by mass or less based on the entire flux, thereby increasing the coverage rate of flux residue on the solder alloy. can be lowered.
  • the solder paste according to this embodiment contains the above-mentioned flux and solder alloy powder.
  • the solder paste is obtained by mixing the flux and the solder alloy powder.
  • the content of the flux is preferably 5.0% by mass or more and 20.0% by mass or less based on the entire solder paste. Further, the content of the solder alloy powder is preferably 80.0% by mass or more and 95.0% by mass or less based on the entire solder paste.
  • Examples of the alloy of the solder alloy powder include lead-free solder alloys and eutectic solder alloys containing lead, but from the viewpoint of reducing environmental impact, lead-free solder alloys are preferable.
  • Examples of lead-free solder alloys include alloys containing tin, silver, copper, indium, zinc, bismuth, antimony, and the like.
  • Sn/Ag, Sn/Ag/Cu, Sn/Cu, Sn/Ag/Bi, Sn/Bi, Sn/Ag/Cu/Bi, Sn/Sb, Sn/Zn/Bi, Sn/ Examples include alloys such as Zn, Sn/Zn/Al, Sn/Ag/Bi/In, Sn/Ag/Cu/Bi/In/Sb, and In/Ag.
  • the alloy of the solder alloy powder is preferably a Sn/Ag/Cu alloy.
  • the Sn/Ag/Cu alloy further contains at least one selected from the group consisting of In, Bi, Sb, and Ni. Further, the alloy contains inevitable impurities.
  • Unavoidable impurities refer to components that are unavoidably mixed in during the manufacturing process and are allowed within a range that does not affect the effects of the present invention.
  • the particle size of the solder alloy powder is preferably 5 ⁇ m or more and 45 ⁇ m or less, more preferably 15 ⁇ m or more and 39 ⁇ m or less.
  • the solder paste according to this embodiment contains the above-mentioned flux and solder alloy powder. Thereby, the coverage of flux residue on the solder alloy can be reduced.
  • the present invention includes the following aspects.
  • Flux used for soldering At least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure;
  • At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 or more and 11 or less carbon atoms, and an imidazole derivative having a phenyl group;
  • a flux comprising a liquid resin and at least one liquid polymerized compound selected from the group consisting of liquid polymerized fatty acids.
  • [5] The flux according to any one of [1] to [4], wherein the liquid polymerized fatty acid has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less.
  • [6] The flux according to any one of [1] to [5], wherein the content of the liquid polymerizable compound is 2.0% by mass or more and 18.0% by mass or less based on the entire flux.
  • [7] A solder paste containing the flux according to any one of [1] to [6] and a solder alloy powder.
  • the flux and solder paste according to the present invention are not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention. Furthermore, the flux and solder paste according to the present invention are not limited to the effects of the above-described embodiments. That is, the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the invention is indicated by the claims rather than by the foregoing description. Further, the scope of the present invention is intended to include all changes within the meaning and scope equivalent to the scope of the claims.
  • Table 5 shows details of each material contained in the fluxes shown in Tables 1 to 4. Further, details of the solder alloys shown in Tables 1 to 4 are shown in Table 6.
  • solder paste place 300 g of solder paste on a metal mask set on a printing machine (YSP YAMAHA Motor, manufactured by YAMAHA Motor), roll it 4 times to spread the solder paste onto the metal mask, and then press the metal mask. After dry cleaning the back of the plate, printing was carried out once under the following printing conditions. Further, the substrate was preheated under the following temperature condition (i), and then heated under the following temperature condition (ii).
  • Printing conditions Printing environment: temperature 24-26°C, humidity 50-60%RH Printing squeegee: Metal squeegee Squeegee angle: 60° Metal mask thickness: 150 ⁇ m Printing speed: 40mm/sec Pad shape and size: circular, diameter 1.5mm Pad material: OSP treated copper
  • Solder coverage rate [%] (number of pixels in white areas after flux residue removal - number of pixels in white areas) / number of pixels in white areas after flux residue removal) x 100 (1)
  • solder coverage is “Excellent” if the solder coverage is 0% or more and less than 35%, “Good” if the solder coverage is 35% or more and less than 55%, and “Good” if the solder coverage is 55% or more. “Excellent” and “Good” were evaluated as “pass”, and “unsatisfactory” were determined as “fail”. The solder coverage and evaluation results are shown in Tables 1 to 4.
  • the fluxes of the examples that meet all the requirements of the present invention can reduce the coverage of flux residue on the solder alloy.

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Abstract

Le flux selon la présente invention est destiné à être utilisé pour le soudage, et comprend au moins un acide carboxylique choisi dans le groupe constitué par un acide dicarboxylique ayant une structure cyclique et un acide tricarboxylique ayant une structure cyclique, au moins un composé imidazole choisi dans le groupe constitué par un dérivé d'imidazole ayant une chaîne alkyle possédant de 1 à 11 atomes de carbone inclus et un dérivé d'imidazole ayant un groupe phényle, ainsi qu'au moins un composé polymérisable liquide choisi dans le groupe constitué par une résine liquide et un acide gras polymérisable liquide.
PCT/JP2023/032877 2022-09-22 2023-09-08 Flux et pâte à braser WO2024062951A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004347A (ja) * 2010-06-17 2012-01-05 Harima Chem Inc はんだバンプ形成方法
WO2019142826A1 (fr) * 2018-01-16 2019-07-25 千住金属工業株式会社 Flux, et pâte à braser
JP2020189337A (ja) * 2019-05-15 2020-11-26 株式会社弘輝 フラックス及びソルダペースト
WO2021166967A1 (fr) * 2020-02-18 2021-08-26 千住金属工業株式会社 Flux, et pâte à braser
WO2021261502A1 (fr) * 2020-06-24 2021-12-30 株式会社タムラ製作所 Flux, pâte à braser, carte de montage de circuit électronique et dispositif de commande électronique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004347A (ja) * 2010-06-17 2012-01-05 Harima Chem Inc はんだバンプ形成方法
WO2019142826A1 (fr) * 2018-01-16 2019-07-25 千住金属工業株式会社 Flux, et pâte à braser
JP2020189337A (ja) * 2019-05-15 2020-11-26 株式会社弘輝 フラックス及びソルダペースト
WO2021166967A1 (fr) * 2020-02-18 2021-08-26 千住金属工業株式会社 Flux, et pâte à braser
WO2021261502A1 (fr) * 2020-06-24 2021-12-30 株式会社タムラ製作所 Flux, pâte à braser, carte de montage de circuit électronique et dispositif de commande électronique

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