WO2024062951A1 - Flux and solder paste - Google Patents

Flux and solder paste Download PDF

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Publication number
WO2024062951A1
WO2024062951A1 PCT/JP2023/032877 JP2023032877W WO2024062951A1 WO 2024062951 A1 WO2024062951 A1 WO 2024062951A1 JP 2023032877 W JP2023032877 W JP 2023032877W WO 2024062951 A1 WO2024062951 A1 WO 2024062951A1
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WIPO (PCT)
Prior art keywords
acid
flux
mass
group
solder
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PCT/JP2023/032877
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French (fr)
Japanese (ja)
Inventor
一博 行方
遼 神尾
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株式会社弘輝
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Publication of WO2024062951A1 publication Critical patent/WO2024062951A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Definitions

  • the present invention relates to flux and solder paste.
  • solder paste made from a mixture of solder alloy powder and flux is used.
  • the solder paste is applied to the electrode parts on the surface of the board, and is heated (reflowed) while the electrode parts of the joining components are in contact with the electrode parts. This melts the solder alloy powder to form a solder joint, and a joining structure can be obtained in which the board and joining components are joined via the solder joint.
  • Manufacturing defects in such bonded structures are detected by performing various inspections.
  • electrical inspection may be performed by bringing a probe into contact with a solder alloy formed by melting solder alloy powder in order to find defects that cannot be detected by visual inspection or appearance inspection equipment.
  • ICT in-circuit test
  • a checker pin is brought into contact with a solder alloy (pin contact) to apply a measurement signal and measure voltage and current. Measure.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flux and a solder paste that can reduce the coverage of flux residue on a solder alloy.
  • the flux according to the present invention is a flux used for soldering, which contains at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure, and a number of carbon atoms. At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain of 1 to 11 and an imidazole derivative having a phenyl group, a liquid resin, and at least one selected from the group consisting of a liquid polymerized fatty acid. and one liquid polymeric compound.
  • the solder paste according to the present invention includes the flux and solder alloy powder.
  • the flux according to the present embodiment has at least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure, and an alkyl chain having 1 to 11 carbon atoms.
  • the carboxylic acid is at least one selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure. From the viewpoint of improving solder melting property, the carboxylic acid preferably has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
  • dicarboxylic acids examples include 4,4'-dicarboxydiphenyl ether, 4,4-biphenyldicarboxylic acid, 4,4-stilbenedicarboxylic acid, 2,6-naphthalene dicarboxylic acid, bis(2-carboxyethyl)isocyanuric acid, 3,3'-dicarboxydiphenyl ether, 2,2'-dicarboxydiphenyl ether, 3,3-biphenyldicarboxylic acid, 2,2-biphenyldicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, Examples include decahydro-1,4-naphthalene dicarboxylic acid.
  • the dicarboxylic acid is preferably at least one selected from the group consisting of 4,4'-dicarboxydiphenyl ether and 2,6-naphthalene dicarboxylic acid from the viewpoint of improving solder meltability. preferable.
  • the said dicarboxylic acid may be used individually by 1 type, or may use 2 or more types together.
  • tricarboxylic acids examples include tris(2-carboxyethyl)isocyanuric acid, tris(2-carboxypropyl)isocyanuric acid, 1,4,5-naphthalenetricarboxylic acid, and the like.
  • the tricarboxylic acid is at least one selected from the group consisting of tris(2-carboxyethyl)isocyanuric acid and tris(2-carboxypropyl)isocyanuric acid from the viewpoint of improving solder meltability. It is preferable that there be.
  • the said tricarboxylic acid may be used individually by 1 type, or may use 2 or more types together.
  • the content of the carboxylic acid is preferably 0.5% by mass or more, more preferably 1.5% by mass or more, and preferably 4.0% by mass or more, based on the entire flux. Particularly preferred. Further, the content of the carboxylic acid is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, and 6.0% by mass or less based on the entire flux. This is particularly preferred. In addition, when two or more types of carboxylic acids are included, the content is the total content.
  • the imidazole compound is at least one selected from the group consisting of imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms and imidazole derivatives having a phenyl group. Further, the imidazole compound is preferably an imidazole derivative having a phenyl group from the viewpoint of improving solder meltability.
  • imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms examples include 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-isopropylimidazole, 2-butylimidazole, and 2-undecylimidazole.
  • 2,4-diamino-6-(2-(2-methylimidazol-1-yl)ethyl)-1,3,5-triazine 2,4-diamino-6-(2-(2-ethyl 4- Methylimidazol-1-yl)ethyl)-1,3,5-triazine
  • imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms include 2-ethylimidazole, 2-undecylimidazole, 2,4-diamino-6-(2-(2-ethyl 4-methyl imidazol-1-yl)ethyl)-1,3,5-triazine, 2,4-diamino-6-(2'-undecyl-imidazolyl)-ethyl-s-triazine, 2,4-diamino-6-[2 It may be at least one selected from the group consisting of '-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct.
  • the imidazole derivatives having an alkyl chain having 1 or more and 11 or less carbon atoms may be used alone or in combination of two or more.
  • imidazole derivatives having a phenyl group examples include 2-phenylimidazole, 1-benzyl-2-phenyl-1H-imidazole, 4-methyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2 -phenyl-4-methyl-5-hydroxymethylimidazole, 2,4,5-triphenylimidazole and the like.
  • the imidazole derivative having a phenyl group is preferably 2-phenyl-4-methyl-5-hydroxymethylimidazole from the viewpoint of improving solder meltability.
  • the imidazole derivatives having a phenyl group may be used alone or in combination of two or more.
  • the content of the imidazole compound is preferably 0.5% by mass or more, more preferably 1.5% by mass or more, and preferably 4.0% by mass or more, based on the entire flux. Particularly preferred. Further, the content of the imidazole compound is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, and 6.0% by mass or less based on the entire flux. This is particularly preferred. In addition, when two or more types of imidazole compounds are included, the content is the total content.
  • the liquid polymer compound is at least one selected from the group consisting of liquid resin and liquid polymer fatty acid. Further, the liquid polymer compound is preferably a liquid polymer fatty acid from the viewpoint of improving solder meltability.
  • liquid resin examples include dimer diol, hydrogenated polybutadiene having hydroxyl groups at both ends (hydroxyl group-terminated liquid polybutadiene), liquid polybutadiene having hydroxyl groups at both ends (hydroxyl group-terminated liquid polybutadiene), and liquid polybutadiene having hydroxyl groups at both ends.
  • examples include isoprene (hydroxyl group-terminated liquid polyisoprene), polybutene, acrylic resin, polyester polyol resin, and the like.
  • the liquid resin may be at least one selected from the group consisting of polybutadiene hydrogenated with hydroxyl groups at both ends, liquid polyisoprene having hydroxyl groups at both ends, and polybutene.
  • liquid resins include, for example, Pripol 2033 (manufactured by Croda Japan), GI-1000, GI-2000, GI-3000 (manufactured by Nippon Soda), G-1000, G-2000, G-3000 (manufactured by Nippon Soda Co., Ltd.), Poly-bd R-15HT, Poly-bd R-45HT (manufactured by Idemitsu Kosan Co., Ltd.), Poly-ip (manufactured by Idemitsu Kosan Co., Ltd.), EPOL (manufactured by Idemitsu Kosan Co., Ltd.) ), NOF Polybutene O-15N, NOF Polybutene 3N, NOF Polybutene 10N, NOF Polybutene 30N (manufactured by NOF Corporation), Nippon Oil Polybutene Grade LV-7, Grade LV-50, Grade LV-100, Grade HV-15, Grade 35, Grade HV-50, Grade
  • the liquid polymerized fatty acid preferably has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less, and more preferably 250 mgKOH/g or more and 300 mgKOH/g or less.
  • the acid value represents the number of milligrams of potassium hydroxide required to neutralize the acidic components contained in 1 g of sample, and can be measured in accordance with the potentiometric titration method of JIS K 2501:2003.
  • liquid polymerized fatty acid examples include dimer acid, hydrogenated dimer acid, 5 (or 6)-carboxy-4-hexylcyclohex-2-en-1-octanoic acid, trimer acid, and the like.
  • the liquid polymerized fatty acid is preferably 5 (or 6)-carboxy-4-hexylcyclohex-2-en-1-octanoic acid from the viewpoint of improving solder meltability.
  • liquid polymerized fatty acids include, for example, Tsuno Dime 205, Tsuno Dime 216, Tsuno Dime 228, Tsuno Dime 395 (manufactured by Tsuno Shokuhin Kogyo Co., Ltd.), Pripol 1004, Pripol 1009, Pripol 1006, Pripol 1010, Pripol 1013, and Pripol 1017.
  • Pripol 1025 (manufactured by Croda Japan), Tsunodime 346 (manufactured by Tsuno Foods Co., Ltd.), Pripol 1040 (manufactured by Croda Japan), Haridimer 200, Haridimer 250, Haridimer 300 (manufactured by Harima Kasei) ), Diacid 1550 (manufactured by Harima Kasei Co., Ltd.), and the like.
  • the liquid polymerized fatty acids may be used alone or in combination of two or more.
  • the content of the liquid polymer compound is preferably 2.0% by mass or more, more preferably 5.0% by mass or more, based on the entire flux, It is particularly preferable that the content is 8.0% by mass or more. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the liquid polymer compound is preferably 18.0% by mass or less, and 12.0% by mass or less, based on the entire flux. is more preferable, and particularly preferably 10.0% by mass or less. In addition, when the said liquid polymer compound is contained 2 or more types, the said content is a total content.
  • the flux according to this embodiment may contain other resins than the liquid resin.
  • the other resins include rosin resins, terpene phenol resins, phenol resins, polyvinyl acetate resins, ethylene-vinyl acetate copolymers, polylactic acid, and polystyrene.
  • the other resin includes a rosin resin from the viewpoint of improving solder meltability.
  • the rosin resin is not particularly limited, and may be selected from the group consisting of rosin and rosin derivatives (for example, hydrogenated rosin, polymerized rosin, disproportionated rosin, acrylic acid-modified rosin, etc.).
  • One or more rosin resins can be used. Note that the other resins may be used alone or in combination of two or more.
  • the content of the other resin is preferably 25.0% by mass or more, and more preferably 30.0% by mass or more, based on the entire flux. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the other resin is preferably 45.0% by mass or less, and 40.0% by mass or less, based on the entire flux. is more preferable. In addition, when two or more types of other resins are contained, the said content is a total content.
  • the flux according to this embodiment may contain a solvent.
  • the solvent include diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono-2-ethylhexyl ether (2-ethylhexyl diglycol), diethylene glycol monobutyl ether (butyl diglycol), and triethylene.
  • Glycol ethers such as glycol monobutyl ether (butyl triglycol), polyethylene glycol dimethyl ether, tripropylene glycol n-butyl ether; aliphatic compounds such as n-hexane, isohexane, n-heptane; isopropyl acetate, methyl propionate, propionic acid
  • Known solvents such as esters such as ethyl; ketones such as methyl ethyl ketone, methyl-n-propyl ketone and diethyl ketone; and alcohols such as ethanol, n-propanol, isopropanol and isobutanol can be used.
  • the said solvent may be used individually by 1 type, or may use 2 or more types together.
  • the content of the solvent is preferably 30.0% by mass or more, more preferably 40.0% by mass or more, based on the entire flux. Further, the content of the solvent is preferably 60.0% by mass or less, more preferably 50.0% by mass or less, based on the entire flux. In addition, when two or more kinds of the above-mentioned solvents are contained, the above-mentioned content is the total content.
  • the flux according to this embodiment may contain a thixotropic agent.
  • a thixotropic agent examples include hydrogenated castor oil, fatty acid amide, fatty acid bisamide, polyamide compound, kaolin, colloidal silica, organic bentonite, glass frit, and the like.
  • the thixotropic agent is preferably a fatty acid bisamide or a polyamide compound from the viewpoint of improving heat resistance.
  • fatty acid bisamides include methylene bisstearamide, ethylene biscapric acid amide, ethylene bislauric acid amide, ethylene bisstearic acid amide, ethylene bishydroxystearic acid amide, ethylene bisbehenic acid amide, and hexamethylene bis stearic acid amide. , hexamethylenebisbehenic acid amide, hexamethylenebis-12-hydroxystearic acid amide, N,N'-distearyladipic acid amide, N,N'-xylylenebis-12-hydroxystearylamide, and the like.
  • polyamide compounds examples include aliphatic polyamide compounds such as Talen VA-79, AMX-6096A, WH-215, and WH-255 (all manufactured by Kyoeisha Chemical Co., Ltd.), SP-10, and SP-500 (all manufactured by Toray Industries, Inc.).
  • Aromatic polyamide compounds (semi-aromatic polyamide compounds or fully aromatic polyamide compounds) containing a cyclic compound such as a benzene ring or a naphthalene ring in the main chain, such as Grilamid L20G, Grilamid TR55 (manufactured by M Chemie Japan), etc. ), such as JH-180 (manufactured by Ito Oil Co., Ltd.).
  • the thixotropic agents may be used alone or in combination of two or more.
  • the content of the thixotropic agent is preferably 1.0% by mass or more, more preferably 3.0% by mass or more, based on the entire flux. Further, the content of the thixotropic agent is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, based on the entire flux. In addition, when 2 or more types of thixotropic agents are contained, the said content is a total content.
  • the flux according to this embodiment may contain other activators other than the imidazole compound and the dicarboxylic acid.
  • the other activators are not particularly limited, and include, for example, organic acid activators, amine compounds, amino acids, halogen activators such as amine halogen salts, and halogen compounds.
  • the above-mentioned other activators may be used alone or in combination of two or more.
  • the organic acid activator is not particularly limited, and includes, for example, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, and palmitic acid.
  • monocarboxylic acids such as margaric acid, stearic acid, tuberculostearic acid, arachidic acid, behenic acid, lignoceric acid, glycolic acid; oxalic acid, malonic acid, succinic acid, methylsuccinic acid, glutaric acid, adipic acid, pimelic acid , dicarboxylic acids such as suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, diglycolic acid; others such as levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, picolinic acid, etc. Examples include organic acids.
  • the amine compound is not particularly limited, and examples thereof include triazole compounds.
  • examples of the triazole compound include benzotriazole, 1H-benzotriazole-1-methanol, 1-methyl-1H-benzotriazole, and the like.
  • Other amine compounds include, for example, cetylamine, erucic acid amide, 3-(dimethylamino)-1,2-propanediol, 3,5-dimethylpyrazole, dimethylurea, hexahydro-1,3,5-triphenyl -1,3,5-triazine, pyrazinamide, N-phenylglycine, 3-methyl-5-pyrazolone, N-lauroylsarcosine, 1,3-diphenylguanidine and the like.
  • the amino acids are not particularly limited, and include, for example, N-acetylphenylalanine (N-acetyl-L-phenylalanine, N-acetyl-DL-phenylalanine, N-acetyl-D-phenylalanine), N-acetylglutamic acid ( N-acetyl-L-glutamic acid), N-acetylglycine, N-acetylleucine (N-acetyl-L-leucine, N-acetyl-DL-leucine, N-acetyl-D-leucine), or N-acetylphenyl Examples include glycine (N-acetyl-N-phenylglycine, N-acetyl-L-phenylglycine, N-acetyl-DL-phenylglycine) and the like.
  • the halogen-based activator is not particularly limited, and examples thereof include amine halogen salts, halogen compounds, and the like.
  • examples of the amine of the amine halogen salt include diethylamine, dibutylamine, tributylamine, diphenylguanidine, and cyclohexylamine.
  • examples of the halogen in the amine halogen salt include fluorine, chlorine, bromine, and iodine.
  • Examples of halogen compounds include tris(2,3-dibromopropyl) isocyanurate, 2,3-dibromo-2-butene-1,4-diol, and 2-bromo-3-iodo-2-butene-1,4-diol. , TBA-bis(2,3-dibromopropyl ether), 4,4'-diiodobiphenyl, and the like.
  • the content of the other activator is preferably 0.5% by mass or more, and more preferably 3.0% by mass or more, based on the entire flux, from the viewpoint of improving solder meltability. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the other activator is preferably 20.0% by mass or less, and 10.0% by mass or less, based on the entire flux. is more preferable. In addition, when two or more kinds of the above-mentioned other activators are contained, the above-mentioned content is the total content.
  • the flux according to the present embodiment may contain, as other additives, at least one selected from the group consisting of stabilizers, surfactants, antifoaming agents, and antioxidants.
  • the total content of other additives is not particularly limited, and can be, for example, 5.0% by mass or less based on the entire flux.
  • the flux according to the present embodiment is useful for visual inspection using a camera such as ICT inspection and automatic optical inspection (AOI), and can be suitably used.
  • a camera such as ICT inspection and automatic optical inspection (AOI)
  • the flux according to the present embodiment includes at least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure, and an imidazole having an alkyl chain having 1 to 11 carbon atoms. At least one imidazole compound selected from the group consisting of derivatives and imidazole derivatives having a phenyl group, and at least one liquid polymer compound selected from the group consisting of liquid resins and liquid polymerized fatty acids. Accordingly, the coverage of flux residue on the solder alloy can be reduced.
  • the flux according to the present embodiment can suppress adhesion of flux residue to checker pins by reducing the coverage of flux residue on the solder alloy. As a result, the period during which one checker pin can be inspected becomes longer, and the working time per man-hour can be shortened.
  • the carboxylic acid has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
  • the coverage rate of flux residue can be further reduced.
  • the content of the carboxylic acid is 0.5% by mass or more and 10.0% by mass or less based on the entire flux, thereby further reducing the coverage of flux residue on the solder alloy. can be done.
  • the content of the imidazole compound is 0.5% by mass or more and 10.0% by mass or less based on the entire flux, thereby further reducing the coverage of flux residue on the solder alloy. can be done.
  • the acid value of the liquid polymerized fatty acid is 150 mgKOH/g or more and 320 mgKOH/g or less, it is possible to further reduce the coverage of flux residue on the solder alloy.
  • the flux according to the present embodiment has a content of the liquid polymer compound of 2.0% by mass or more and 18.0% by mass or less based on the entire flux, thereby increasing the coverage rate of flux residue on the solder alloy. can be lowered.
  • the solder paste according to this embodiment contains the above-mentioned flux and solder alloy powder.
  • the solder paste is obtained by mixing the flux and the solder alloy powder.
  • the content of the flux is preferably 5.0% by mass or more and 20.0% by mass or less based on the entire solder paste. Further, the content of the solder alloy powder is preferably 80.0% by mass or more and 95.0% by mass or less based on the entire solder paste.
  • Examples of the alloy of the solder alloy powder include lead-free solder alloys and eutectic solder alloys containing lead, but from the viewpoint of reducing environmental impact, lead-free solder alloys are preferable.
  • Examples of lead-free solder alloys include alloys containing tin, silver, copper, indium, zinc, bismuth, antimony, and the like.
  • Sn/Ag, Sn/Ag/Cu, Sn/Cu, Sn/Ag/Bi, Sn/Bi, Sn/Ag/Cu/Bi, Sn/Sb, Sn/Zn/Bi, Sn/ Examples include alloys such as Zn, Sn/Zn/Al, Sn/Ag/Bi/In, Sn/Ag/Cu/Bi/In/Sb, and In/Ag.
  • the alloy of the solder alloy powder is preferably a Sn/Ag/Cu alloy.
  • the Sn/Ag/Cu alloy further contains at least one selected from the group consisting of In, Bi, Sb, and Ni. Further, the alloy contains inevitable impurities.
  • Unavoidable impurities refer to components that are unavoidably mixed in during the manufacturing process and are allowed within a range that does not affect the effects of the present invention.
  • the particle size of the solder alloy powder is preferably 5 ⁇ m or more and 45 ⁇ m or less, more preferably 15 ⁇ m or more and 39 ⁇ m or less.
  • the solder paste according to this embodiment contains the above-mentioned flux and solder alloy powder. Thereby, the coverage of flux residue on the solder alloy can be reduced.
  • the present invention includes the following aspects.
  • Flux used for soldering At least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure;
  • At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 or more and 11 or less carbon atoms, and an imidazole derivative having a phenyl group;
  • a flux comprising a liquid resin and at least one liquid polymerized compound selected from the group consisting of liquid polymerized fatty acids.
  • [5] The flux according to any one of [1] to [4], wherein the liquid polymerized fatty acid has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less.
  • [6] The flux according to any one of [1] to [5], wherein the content of the liquid polymerizable compound is 2.0% by mass or more and 18.0% by mass or less based on the entire flux.
  • [7] A solder paste containing the flux according to any one of [1] to [6] and a solder alloy powder.
  • the flux and solder paste according to the present invention are not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention. Furthermore, the flux and solder paste according to the present invention are not limited to the effects of the above-described embodiments. That is, the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the invention is indicated by the claims rather than by the foregoing description. Further, the scope of the present invention is intended to include all changes within the meaning and scope equivalent to the scope of the claims.
  • Table 5 shows details of each material contained in the fluxes shown in Tables 1 to 4. Further, details of the solder alloys shown in Tables 1 to 4 are shown in Table 6.
  • solder paste place 300 g of solder paste on a metal mask set on a printing machine (YSP YAMAHA Motor, manufactured by YAMAHA Motor), roll it 4 times to spread the solder paste onto the metal mask, and then press the metal mask. After dry cleaning the back of the plate, printing was carried out once under the following printing conditions. Further, the substrate was preheated under the following temperature condition (i), and then heated under the following temperature condition (ii).
  • Printing conditions Printing environment: temperature 24-26°C, humidity 50-60%RH Printing squeegee: Metal squeegee Squeegee angle: 60° Metal mask thickness: 150 ⁇ m Printing speed: 40mm/sec Pad shape and size: circular, diameter 1.5mm Pad material: OSP treated copper
  • Solder coverage rate [%] (number of pixels in white areas after flux residue removal - number of pixels in white areas) / number of pixels in white areas after flux residue removal) x 100 (1)
  • solder coverage is “Excellent” if the solder coverage is 0% or more and less than 35%, “Good” if the solder coverage is 35% or more and less than 55%, and “Good” if the solder coverage is 55% or more. “Excellent” and “Good” were evaluated as “pass”, and “unsatisfactory” were determined as “fail”. The solder coverage and evaluation results are shown in Tables 1 to 4.
  • the fluxes of the examples that meet all the requirements of the present invention can reduce the coverage of flux residue on the solder alloy.

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Abstract

The flux according to the present invention is intended to be used for soldering, and comprises at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure, at least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 to 11 carbon atoms inclusive and an imidazole derivative having a phenyl group, and at least one liquid polymerizable compound selected from the group consisting of a liquid resin and a liquid polymerizable fatty acid.

Description

フラックス、及び、ソルダペーストFlux and solder paste 関連出願の相互参照Cross-reference of related applications
　本願は、日本国特願２０２２－１５１５０７号の優先権を主張し、引用によって本願明細書の記載に組み込まれる。 This application claims priority to Japanese Patent Application No. 2022-151507, which is incorporated into the specification of this application by reference.
　本発明は、フラックス、及び、ソルダペーストに関する。 The present invention relates to flux and solder paste.
　プリント配線板等の電子回路基板と接合部品との接合には、はんだ合金粉末とフラックスとを混合したソルダペーストが用いられる。ソルダペーストは、基板表面の電極部に塗布されると共に、該電極部に接合部品の電極部を接触させた状態で加熱（リフロー）される。これにより、はんだ合金粉末が溶融してはんだ接合部が形成され、該はんだ接合部を介して基板と接合部品とが接合された接合構造体を得ることができる。 To join electronic circuit boards such as printed wiring boards to joining components, a solder paste made from a mixture of solder alloy powder and flux is used. The solder paste is applied to the electrode parts on the surface of the board, and is heated (reflowed) while the electrode parts of the joining components are in contact with the electrode parts. This melts the solder alloy powder to form a solder joint, and a joining structure can be obtained in which the board and joining components are joined via the solder joint.
　斯かる接合構造体は、種々の検査を行うことにより製造不良が検出される。前記検査の一つとして、目視検査及び外観検査装置では発見できないような不良を見つけるために、はんだ合金粉末が溶融してなるはんだ合金にプローブを接触させて電気的に検査を行うことがある。例えば、部品の定数違い等の製造不良を検出することができるＩＣＴ（インサーキットテスト）という検査においては、はんだ合金にチェッカーピンを接触（ピンコンタクト）させて測定信号を印加し、電圧及び電流を測定する。 Manufacturing defects in such bonded structures are detected by performing various inspections. As one of the above-mentioned inspections, electrical inspection may be performed by bringing a probe into contact with a solder alloy formed by melting solder alloy powder in order to find defects that cannot be detected by visual inspection or appearance inspection equipment. For example, in an inspection called ICT (in-circuit test) that can detect manufacturing defects such as differences in component constants, a checker pin is brought into contact with a solder alloy (pin contact) to apply a measurement signal and measure voltage and current. Measure.
　斯かるＩＣＴ検査においては、測定精度を高める観点から、チェッカーピンを確実にはんだ合金に接触させることが求められる。ところが、該はんだ合金にフラックス残渣が大量に付着していると、フラックス残渣がチェッカーピンに付着し堆積することから、チェッカーピンがはんだ合金に接触できずに導通不良が起こり、正確に検査できない場合が生じる。 In such ICT inspection, from the viewpoint of increasing measurement accuracy, it is required that the checker pin be brought into reliable contact with the solder alloy. However, if a large amount of flux residue adheres to the solder alloy, the flux residue will adhere to and accumulate on the checker pin, which will prevent the checker pin from coming into contact with the solder alloy, resulting in poor conductivity, which may prevent accurate inspection. occurs.
　このような問題を解決するために、従来、チェッカーピンを一定期間ごとに交換して検査を行っている。しかし、フラックス残渣がチェッカーピンに付着しやすいと、一つのチェッカーピンにおいて検査できる期間が短くなる。ＩＣＴ検査を行う部分は数万点に及ぶことから、検査できる期間が短ければそれだけチェッカーピンの交換が必要となり、１工数当たりの作業時間が長くなるという問題がある。また、チェッカーピンのコストが増加するという問題もある。そのため、近年では、フラックス残渣を低減させたソルダペースト、又は、フラックス残渣が残らないソルダペーストを使用する方法が提案されている（例えば、特許文献１参照）。 In order to solve such problems, conventionally, checker pins have been replaced and inspected at regular intervals. However, if flux residue tends to adhere to the checker pins, the period during which one checker pin can be inspected becomes shorter. Since there are tens of thousands of parts to be inspected for ICT, there is a problem that the shorter the inspection period, the more the checker pins will need to be replaced, and the work time per man-hour will increase. Another problem is that the cost of the checkered pin increases. Therefore, in recent years, methods have been proposed that use solder pastes with reduced flux residues or solder pastes that do not leave flux residues (for example, see Patent Document 1).
　しかしながら、特許文献１のようにフラックス残渣を低減させたソルダペーストであっても、はんだ合金に対するフラックス残渣の被覆率が高いとチェッカーピンがフラックス残渣に接触しやすくなるため、フラックス残渣がチェッカーピンに付着し堆積する虞がある。その結果、チェッカーピンがはんだ合金に接触できず、導通不良が起こることがある。 However, even with a solder paste with reduced flux residue as in Patent Document 1, if the coverage of the flux residue on the solder alloy is high, the checker pins will easily come into contact with the flux residues, so the flux residues may come into contact with the checker pins. There is a risk of adhesion and accumulation. As a result, the checker pin may not be able to contact the solder alloy, resulting in poor conduction.
日本国特開２００４－２５３０５号公報Japanese Patent Application Publication No. 2004-25305
　本発明は、上記事情に鑑みてなされたものであり、はんだ合金に対するフラックス残渣の被覆率を低下させることができるフラックス、及び、ソルダペーストを提供することを課題とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a flux and a solder paste that can reduce the coverage of flux residue on a solder alloy.
　本発明に係るフラックスは、はんだ付けに用いられるフラックスであって、環状構造を有するジカルボン酸、及び、環状構造を有するトリカルボン酸からなる群から選択される少なくとも１つのカルボン酸と、炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体、及び、フェニル基を有するイミダゾール誘導体からなる群から選択される少なくとも１つのイミダゾール化合物と、液状樹脂、及び、液状重合脂肪酸からなる群から選択される少なくとも１つの液状重合化合物と、を含む。 The flux according to the present invention is a flux used for soldering, which contains at least one carboxylic acid selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure, and a number of carbon atoms. At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain of 1 to 11 and an imidazole derivative having a phenyl group, a liquid resin, and at least one selected from the group consisting of a liquid polymerized fatty acid. and one liquid polymeric compound.
　本発明に係るソルダペーストは、前記フラックスと、はんだ合金粉末とを含む。 The solder paste according to the present invention includes the flux and solder alloy powder.
　以下、本発明の実施形態に係るフラックス、及び、ソルダペーストについて説明する。 Hereinafter, flux and solder paste according to embodiments of the present invention will be explained.
　＜フラックス＞
　本実施形態に係るフラックスは、環状構造を有するジカルボン酸、及び、環状構造を有するトリカルボン酸からなる群から選択される少なくとも１つのカルボン酸と、炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体、及び、フェニル基を有するイミダゾール誘導体からなる群から選択される少なくとも１つのイミダゾール化合物と、液状樹脂、及び、液状重合脂肪酸からなる群から選択される少なくとも１つの液状重合化合物と、を含む。 <Flux>
The flux according to the present embodiment has at least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure, and an alkyl chain having 1 to 11 carbon atoms. At least one imidazole compound selected from the group consisting of imidazole derivatives and imidazole derivatives having a phenyl group, and at least one liquid polymer compound selected from the group consisting of liquid resins and liquid polymerized fatty acids. .
　（カルボン酸）
　カルボン酸は、環状構造を有するジカルボン酸、及び、環状構造を有するトリカルボン酸からなる群から選択される少なくとも１つである。また、前記カルボン酸は、はんだ溶融性を向上させる観点から、ナフタレン構造、ビフェニル構造、スチルベン構造、ビフェニルエーテル構造、及び、イソシアヌル酸構造からなる群から選択される少なくとも１つの環状構造を有することが好ましい。 (carboxylic acid)
The carboxylic acid is at least one selected from the group consisting of a dicarboxylic acid having a cyclic structure and a tricarboxylic acid having a cyclic structure. From the viewpoint of improving solder melting property, the carboxylic acid preferably has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
　ジカルボン酸としては、例えば、４，４’－ジカルボキシジフェニルエーテル、４，４－ビフェニルジカルボン酸、４，４－スチルベンジカルボン酸、２，６－ナフタレンジカルボン酸、ビス（２－カルボキシエチル）イソシアヌル酸、３，３’－ジカルボキシジフェニルエーテル、２，２’－ジカルボキシジフェニルエーテル、３，３－ビフェニルジカルボン酸、２，２－ビフェニルジカルボン酸、１，４－ナフタレンジカルボン酸、２，３－ナフタレンジカルボン酸、デカヒドロ－１，４－ナフタレンジカルボン酸等が挙げられる。これらの中でも、前記ジカルボン酸は、はんだ溶融性を向上させる観点から、４，４’－ジカルボキシジフェニルエーテル、及び、２，６－ナフタレンジカルボン酸からなる群から選択される少なくとも１つであることが好ましい。なお、前記ジカルボン酸は、１種を単独で用いても、２種以上を併用してもよい。 Examples of dicarboxylic acids include 4,4'-dicarboxydiphenyl ether, 4,4-biphenyldicarboxylic acid, 4,4-stilbenedicarboxylic acid, 2,6-naphthalene dicarboxylic acid, bis(2-carboxyethyl)isocyanuric acid, 3,3'-dicarboxydiphenyl ether, 2,2'-dicarboxydiphenyl ether, 3,3-biphenyldicarboxylic acid, 2,2-biphenyldicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, Examples include decahydro-1,4-naphthalene dicarboxylic acid. Among these, the dicarboxylic acid is preferably at least one selected from the group consisting of 4,4'-dicarboxydiphenyl ether and 2,6-naphthalene dicarboxylic acid from the viewpoint of improving solder meltability. preferable. In addition, the said dicarboxylic acid may be used individually by 1 type, or may use 2 or more types together.
　トリカルボン酸としては、例えば、トリス（２－カルボキシエチル）イソシアヌル酸、トリス（２－カルボキシプロピル）イソシアヌル酸、１，４，５－ナフタレントリカルボン酸等が挙げられる。これらの中でも、前記トリカルボン酸は、はんだ溶融性を向上させる観点から、トリス（２－カルボキシエチル）イソシアヌル酸、及び、トリス（２－カルボキシプロピル）イソシアヌル酸からなる群から選択される少なくとも１つであることが好ましい。なお、前記トリカルボン酸は、１種を単独で用いても、２種以上を併用してもよい。 Examples of tricarboxylic acids include tris(2-carboxyethyl)isocyanuric acid, tris(2-carboxypropyl)isocyanuric acid, 1,4,5-naphthalenetricarboxylic acid, and the like. Among these, the tricarboxylic acid is at least one selected from the group consisting of tris(2-carboxyethyl)isocyanuric acid and tris(2-carboxypropyl)isocyanuric acid from the viewpoint of improving solder meltability. It is preferable that there be. In addition, the said tricarboxylic acid may be used individually by 1 type, or may use 2 or more types together.
　前記カルボン酸の含有量は、前記フラックス全体に対して、０．５質量％以上であることが好ましく、１．５質量％以上であることがより好ましく、４．０質量％以上であることが特に好ましい。また、前記カルボン酸の含有量は、前記フラックス全体に対して、１０．０質量％以下であることが好ましく、８．０質量％以下であることがより好ましく、６．０質量％以下であることが特に好ましい。なお、前記カルボン酸が２種以上含まれる場合、前記含有量は合計含有量である。 The content of the carboxylic acid is preferably 0.5% by mass or more, more preferably 1.5% by mass or more, and preferably 4.0% by mass or more, based on the entire flux. Particularly preferred. Further, the content of the carboxylic acid is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, and 6.0% by mass or less based on the entire flux. This is particularly preferred. In addition, when two or more types of carboxylic acids are included, the content is the total content.
　（イミダゾール化合物）
　イミダゾール化合物は、炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体、及び、フェニル基を有するイミダゾール誘導体からなる群から選択される少なくとも１つである。また、前記イミダゾール化合物は、はんだ溶融性を向上させる観点から、フェニル基を有するイミダゾール誘導体であることが好ましい。 (imidazole compound)
The imidazole compound is at least one selected from the group consisting of imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms and imidazole derivatives having a phenyl group. Further, the imidazole compound is preferably an imidazole derivative having a phenyl group from the viewpoint of improving solder meltability.
　炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体としては、例えば、２－メチルイミダゾール、２－エチルイミダゾール、２－プロピルイミダゾール、２－イソプロピルイミダゾール、２－ブチルイミダゾール、２－ウンデシルイミダゾール、２，４－ジアミノ－６－（２－（２－メチルイミダゾール－１－イル）エチル）－１，３，５－トリアジン、２，４－ジアミノ－６－（２－（２－エチル４－メチルイミダゾール－１－イル）エチル）－１，３，５－トリアジン、２，４－ジアミノ－６－（２’－ウンデシル－イミダゾリル）－エチル－ｓ－トリアジン、２，４－ジアミノ－６－［２’－メチルイミダゾリル－（１’）］－エチル－ｓ－トリアジン　イソシアヌル酸付加物等が挙げられる。これらの中でも、炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体は、２－エチルイミダゾール、２－ウンデシルイミダゾール、２，４－ジアミノ－６－（２－（２－エチル４－メチルイミダゾール－１－イル）エチル）－１，３，５－トリアジン、２，４－ジアミノ－６－（２’－ウンデシル－イミダゾリル）－エチル－ｓ－トリアジン、２，４－ジアミノ－６－［２’－メチルイミダゾリル－（１’）］－エチル－ｓ－トリアジン　イソシアヌル酸付加物からなる群から選択される少なくとも１つであってもよい。なお、炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体は、１種を単独で用いても、２種以上を併用してもよい。 Examples of imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms include 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-isopropylimidazole, 2-butylimidazole, and 2-undecylimidazole. , 2,4-diamino-6-(2-(2-methylimidazol-1-yl)ethyl)-1,3,5-triazine, 2,4-diamino-6-(2-(2-ethyl 4- Methylimidazol-1-yl)ethyl)-1,3,5-triazine, 2,4-diamino-6-(2'-undecyl-imidazolyl)-ethyl-s-triazine, 2,4-diamino-6-[ Examples include 2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct. Among these, imidazole derivatives having an alkyl chain having 1 to 11 carbon atoms include 2-ethylimidazole, 2-undecylimidazole, 2,4-diamino-6-(2-(2-ethyl 4-methyl imidazol-1-yl)ethyl)-1,3,5-triazine, 2,4-diamino-6-(2'-undecyl-imidazolyl)-ethyl-s-triazine, 2,4-diamino-6-[2 It may be at least one selected from the group consisting of '-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct. In addition, the imidazole derivatives having an alkyl chain having 1 or more and 11 or less carbon atoms may be used alone or in combination of two or more.
　フェニル基を有するイミダゾール誘導体としては、例えば、２－フェニルイミダゾール、１－ベンジル－２－フェニル－１Ｈ－イミダゾール、４－メチル－２－フェニルイミダゾール、２－フェニル－４，５－ジヒドロキシメチルイミダゾール、２－フェニル－４－メチル－５－ヒドロキシメチルイミダゾール、２，４，５－トリフェニルイミダゾール等が挙げられる。これらの中でも、フェニル基を有するイミダゾール誘導体は、はんだ溶融性を向上させる観点から、２－フェニル－４－メチル－５－ヒドロキシメチルイミダゾールであることが好ましい。なお、フェニル基を有するイミダゾール誘導体は、１種を単独で用いても、２種以上を併用してもよい。 Examples of imidazole derivatives having a phenyl group include 2-phenylimidazole, 1-benzyl-2-phenyl-1H-imidazole, 4-methyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2 -phenyl-4-methyl-5-hydroxymethylimidazole, 2,4,5-triphenylimidazole and the like. Among these, the imidazole derivative having a phenyl group is preferably 2-phenyl-4-methyl-5-hydroxymethylimidazole from the viewpoint of improving solder meltability. In addition, the imidazole derivatives having a phenyl group may be used alone or in combination of two or more.
　前記イミダゾール化合物の含有量は、前記フラックス全体に対して、０．５質量％以上であることが好ましく、１．５質量％以上であることがより好ましく、４．０質量％以上であることが特に好ましい。また、前記イミダゾール化合物の含有量は、前記フラックス全体に対して、１０．０質量％以下であることが好ましく、８．０質量％以下であることがより好ましく、６．０質量％以下であることが特に好ましい。なお、前記イミダゾール化合物が２種以上含まれる場合、前記含有量は合計含有量である。 The content of the imidazole compound is preferably 0.5% by mass or more, more preferably 1.5% by mass or more, and preferably 4.0% by mass or more, based on the entire flux. Particularly preferred. Further, the content of the imidazole compound is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, and 6.0% by mass or less based on the entire flux. This is particularly preferred. In addition, when two or more types of imidazole compounds are included, the content is the total content.
　（液状重合化合物）
　液状重合化合物は、液状樹脂、及び、液状重合脂肪酸からなる群から選択される少なくとも１つである。また、前記液状重合化合物は、はんだ溶融性を向上させる観点から、液状重合脂肪酸であることが好ましい。 (Liquid polymer compound)
The liquid polymer compound is at least one selected from the group consisting of liquid resin and liquid polymer fatty acid. Further, the liquid polymer compound is preferably a liquid polymer fatty acid from the viewpoint of improving solder meltability.
　前記液状樹脂としては、例えば、ダイマージオール、両末端に水酸基を有する水素添加ポリブタジエン（水酸基末端液状ポリブタジエン）、両末端に水酸基を有する液状ポリブタジエン（水酸基末端液状ポリブタジエン）、両末端に水酸基を有する液状ポリイソプレン（水酸基末端液状ポリイソプレン）、ポリブテン、アクリル樹脂、ポリエステルポリオール樹脂等が挙げられる。これらの中でも、液状樹脂は、両末端水酸基水素化ポリブタジエン、両末端に水酸基を有する液状ポリイソプレン、ポリブテンからなる群から選択される少なくとも１つであってもよい。前記液状樹脂の市販品としては、例えば、プリポール２０３３（以上、クローダジャパン社製）、ＧＩ－１０００、ＧＩ－２０００、ＧＩ－３０００（以上、日本曹達社製）、Ｇ－１０００、Ｇ－２０００、Ｇ－３０００（以上、日本曹達社製）、Ｐｏｌｙ－ｂｄ　Ｒ－１５ＨＴ、Ｐｏｌｙ－ｂｄ　Ｒ－４５ＨＴ（以上、出光興産社製）、Ｐｏｌｙ－ｉｐ（出光興産社製）、ＥＰＯＬ（出光興産社製）、日油ポリブテンＯ－１５Ｎ、日油ポリブテン３Ｎ、日油ポリブテン１０Ｎ、日油ポリブテン３０Ｎ（以上、日油社製）、日石ポリブテングレードＬＶ－７、グレードＬＶ－５０、グレードＬＶ－１００、グレードＨＶ－１５、グレード３５、グレードＨＶ－５０、グレードＨＶ－１００、グレードＨＶ－３００（以上、ＥＮＥＯＳ社製）、アクリルＯ（荒川化学工業社製）、アウトフローＵＭＭ－１００１、ＵＴ－１００１、ＣＢ－３０６０、ＣＢＢ－３０９８（以上、総研化学社製）、プリプラスト１９００、プリプラスト１９０１、プリプラスト１８３８、プリプラスト３１８６、プリプラスト３１９６、プリプラスト３１９７、プリプラスト３１９９（以上、クローダジャパン社製）、クラレポリオールＰ－５１０、Ｐ－１０１０、Ｐ－２０１０、Ｐ－３０１０、Ｐ－４０１０、Ｐ－５０１０、Ｐ－６０１０、Ｆ－５１０、Ｆ－１０１０、Ｆ－２０１０、Ｆ－３０１０、Ｐ－２０１１、Ｐ－５２０、Ｐ－１０２０、Ｐ－２０２０、Ｐ－１０１２、Ｐ－２０１２、Ｐ－５３０、Ｐ－２０３０、Ｐ－２０５０（以上、クラレ社製）等が挙げられる。なお、前記液状樹脂は、１種を単独で用いても、２種以上を併用してもよい。 Examples of the liquid resin include dimer diol, hydrogenated polybutadiene having hydroxyl groups at both ends (hydroxyl group-terminated liquid polybutadiene), liquid polybutadiene having hydroxyl groups at both ends (hydroxyl group-terminated liquid polybutadiene), and liquid polybutadiene having hydroxyl groups at both ends. Examples include isoprene (hydroxyl group-terminated liquid polyisoprene), polybutene, acrylic resin, polyester polyol resin, and the like. Among these, the liquid resin may be at least one selected from the group consisting of polybutadiene hydrogenated with hydroxyl groups at both ends, liquid polyisoprene having hydroxyl groups at both ends, and polybutene. Commercially available liquid resins include, for example, Pripol 2033 (manufactured by Croda Japan), GI-1000, GI-2000, GI-3000 (manufactured by Nippon Soda), G-1000, G-2000, G-3000 (manufactured by Nippon Soda Co., Ltd.), Poly-bd R-15HT, Poly-bd R-45HT (manufactured by Idemitsu Kosan Co., Ltd.), Poly-ip (manufactured by Idemitsu Kosan Co., Ltd.), EPOL (manufactured by Idemitsu Kosan Co., Ltd.) ), NOF Polybutene O-15N, NOF Polybutene 3N, NOF Polybutene 10N, NOF Polybutene 30N (manufactured by NOF Corporation), Nippon Oil Polybutene Grade LV-7, Grade LV-50, Grade LV-100, Grade HV-15, Grade 35, Grade HV-50, Grade HV-100, Grade HV-300 (manufactured by ENEOS), Acrylic O (manufactured by Arakawa Chemical Industries), Outflow UMM-1001, UT-1001, CB-3060, CBB-3098 (manufactured by Soken Kagaku Co., Ltd.), Puri-Plast 1900, Puri-Plast 1901, Puri-Plast 1838, Puri-Plast 3186, Puri-Plast 3196, Puri-Plast 3197, Puri-Plast 3199 (manufactured by Croda Japan Co., Ltd.), Kuraray Polyol P-510 , P-1010, P-2010, P-3010, P-4010, P-5010, P-6010, F-510, F-1010, F-2010, F-3010, P-2011, P-520, P -1020, P-2020, P-1012, P-2012, P-530, P-2030, P-2050 (all manufactured by Kuraray), etc. In addition, the said liquid resin may be used individually by 1 type, or may use 2 or more types together.
　前記液状重合脂肪酸は、はんだ溶融性を向上させる観点から、酸価が１５０ｍｇＫＯＨ／ｇ以上３２０ｍｇＫＯＨ／ｇ以下であることが好ましく、２５０ｍｇＫＯＨ／ｇ以上３００ｍｇＫＯＨ／ｇ以下であることがより好ましい。ここで、酸価とは、試料１ｇ中に含まれる酸性成分を中和するのに必要な水酸化カリウムのｍｇ数を表し、ＪＩＳ　Ｋ　２５０１：２００３の電位差滴定法に準拠して測定することができる。 From the viewpoint of improving solder melting properties, the liquid polymerized fatty acid preferably has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less, and more preferably 250 mgKOH/g or more and 300 mgKOH/g or less. Here, the acid value represents the number of milligrams of potassium hydroxide required to neutralize the acidic components contained in 1 g of sample, and can be measured in accordance with the potentiometric titration method of JIS K 2501:2003.
　前記液状重合脂肪酸としては、例えば、ダイマー酸、水素添加ダイマー酸、５（または６）－カルボキシ－４－ヘキシルシクロヘキサ－２－エン－１－オクタン酸、トリマー酸等が挙げられる。これらの中でも、液状重合脂肪酸は、はんだ溶融性を向上させる観点から、５（または６）－カルボキシ－４－ヘキシルシクロヘキサ－２－エン－１－オクタン酸であることが好ましい。前記液状重合脂肪酸の市販品としては、例えば、ツノダイム２０５、ツノダイム２１６、ツノダイム２２８、ツノダイム３９５（以上、津野食品工業社製）、プリポール１００４、プリポール１００９、プリポール１００６、プリポール１０１０、プリポール１０１３、プリポール１０１７、プリポール１０２５（以上、クローダジャパン社製）、ツノダイム３４６（以上、津野食品工業社製）、プリポール１０４０（以上、クローダジャパン社製）、ハリダイマー２００、ハリダイマー２５０、ハリダイマー３００（以上、ハリマ化成社製）、ダイアシッド１５５０（ハリマ化成社製）等が挙げられる。なお、前記液状重合脂肪酸は、１種を単独で用いても、２種以上を併用してもよい。 Examples of the liquid polymerized fatty acid include dimer acid, hydrogenated dimer acid, 5 (or 6)-carboxy-4-hexylcyclohex-2-en-1-octanoic acid, trimer acid, and the like. Among these, the liquid polymerized fatty acid is preferably 5 (or 6)-carboxy-4-hexylcyclohex-2-en-1-octanoic acid from the viewpoint of improving solder meltability. Commercially available liquid polymerized fatty acids include, for example, Tsuno Dime 205, Tsuno Dime 216, Tsuno Dime 228, Tsuno Dime 395 (manufactured by Tsuno Shokuhin Kogyo Co., Ltd.), Pripol 1004, Pripol 1009, Pripol 1006, Pripol 1010, Pripol 1013, and Pripol 1017. , Pripol 1025 (manufactured by Croda Japan), Tsunodime 346 (manufactured by Tsuno Foods Co., Ltd.), Pripol 1040 (manufactured by Croda Japan), Haridimer 200, Haridimer 250, Haridimer 300 (manufactured by Harima Kasei) ), Diacid 1550 (manufactured by Harima Kasei Co., Ltd.), and the like. The liquid polymerized fatty acids may be used alone or in combination of two or more.
　前記液状重合化合物の含有量は、はんだ溶融性を向上させる観点から、前記フラックス全体に対して、２．０質量％以上であることが好ましく、５．０質量％以上であることがより好ましく、８．０質量％以上であることが特に好ましい。また、前記液状重合化合物の含有量は、ソルダペーストの粘度安定性を高める観点から、前記フラックス全体に対して、１８．０質量％以下であることが好ましく、１２．０質量％以下であることがより好ましく、１０．０質量％以下であることが特に好ましい。なお、前記液状重合化合物が２種以上含まれる場合、前記含有量は合計含有量である。 From the viewpoint of improving solder meltability, the content of the liquid polymer compound is preferably 2.0% by mass or more, more preferably 5.0% by mass or more, based on the entire flux, It is particularly preferable that the content is 8.0% by mass or more. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the liquid polymer compound is preferably 18.0% by mass or less, and 12.0% by mass or less, based on the entire flux. is more preferable, and particularly preferably 10.0% by mass or less. In addition, when the said liquid polymer compound is contained 2 or more types, the said content is a total content.
　（その他の樹脂）
　本実施形態に係るフラックスは、前記液状樹脂以外のその他の樹脂を含んでいてもよい。前記その他の樹脂としては、例えば、ロジン系樹脂、テルペンフェノール樹脂、フェノール樹脂、ポリ酢酸ビニル樹脂、エチレン－酢酸ビニル共重合体、ポリ乳酸、ポリスチレン等が挙げられる。これらの中でも、前記その他の樹脂は、はんだ溶融性を向上させる観点から、ロジン系樹脂を含むことが好ましい。前記ロジン系樹脂としては、特に限定されるものではなく、例えば、ロジン、及び、ロジン誘導体（例えば、水素添加ロジン、重合ロジン、不均化ロジン、アクリル酸変性ロジン等）からなる群から選択される１種以上のロジン系樹脂を用いることができる。なお、前記その他の樹脂は、１種を単独で用いても、２種以上を併用してもよい。 (Other resins)
The flux according to this embodiment may contain other resins than the liquid resin. Examples of the other resins include rosin resins, terpene phenol resins, phenol resins, polyvinyl acetate resins, ethylene-vinyl acetate copolymers, polylactic acid, and polystyrene. Among these, it is preferable that the other resin includes a rosin resin from the viewpoint of improving solder meltability. The rosin resin is not particularly limited, and may be selected from the group consisting of rosin and rosin derivatives (for example, hydrogenated rosin, polymerized rosin, disproportionated rosin, acrylic acid-modified rosin, etc.). One or more rosin resins can be used. Note that the other resins may be used alone or in combination of two or more.
　前記その他の樹脂の含有量は、はんだ溶融性を向上させる観点から、前記フラックス全体に対して、２５．０質量％以上であることが好ましく、３０．０質量％以上であることがより好ましい。また、前記その他の樹脂の含有量は、ソルダペーストの粘度安定性を高める観点から、前記フラックス全体に対して、４５．０質量％以下であることが好ましく、４０．０質量％以下であることがより好ましい。なお、その他の樹脂が２種以上含まれる場合、前記含有量は合計含有量である。 From the viewpoint of improving solder meltability, the content of the other resin is preferably 25.0% by mass or more, and more preferably 30.0% by mass or more, based on the entire flux. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the other resin is preferably 45.0% by mass or less, and 40.0% by mass or less, based on the entire flux. is more preferable. In addition, when two or more types of other resins are contained, the said content is a total content.
　（溶剤）
　本実施形態に係るフラックスは、溶剤を含んでいてもよい。前記溶剤としては、例えば、ジエチレングリコールモノヘキシルエーテル（ヘキシルジグリコール）、ジエチレングリコールジブチルエーテル（ジブチルジグリコール）、ジエチレングリコールモノ２－エチルヘキシルエーテル（２エチルヘキシルジグリコール）、ジエチレングリコールモノブチルエーテル（ブチルジグリコール）、トリエチレングリコールモノブチルエーテル（ブチルトリグリコール）、ポリエチレングリコールジメチルエーテル、トリプロピレングリコールｎ－ブチルエーテル等のグリコールエーテル類；ｎ－ヘキサン、イソヘキサン、ｎ－ヘプタン等の脂肪族系化合物；酢酸イソプロピル、プロピオン酸メチル、プロピオン酸エチル等のエステル類；メチルエチルケトン、メチル－ｎ－プロピルケトン、ジエチルケトン等のケトン類；エタノール、ｎ－プロパノール、イソプロパノール、イソブタノール等のアルコール類等の公知の溶剤を用いることができる。なお、前記溶剤は、１種を単独で用いても、２種以上を併用してもよい。 (solvent)
The flux according to this embodiment may contain a solvent. Examples of the solvent include diethylene glycol monohexyl ether (hexyl diglycol), diethylene glycol dibutyl ether (dibutyl diglycol), diethylene glycol mono-2-ethylhexyl ether (2-ethylhexyl diglycol), diethylene glycol monobutyl ether (butyl diglycol), and triethylene. Glycol ethers such as glycol monobutyl ether (butyl triglycol), polyethylene glycol dimethyl ether, tripropylene glycol n-butyl ether; aliphatic compounds such as n-hexane, isohexane, n-heptane; isopropyl acetate, methyl propionate, propionic acid Known solvents such as esters such as ethyl; ketones such as methyl ethyl ketone, methyl-n-propyl ketone and diethyl ketone; and alcohols such as ethanol, n-propanol, isopropanol and isobutanol can be used. In addition, the said solvent may be used individually by 1 type, or may use 2 or more types together.
　前記溶剤の含有量は、前記フラックス全体に対して、３０．０質量％以上であることが好ましく、４０．０質量％以上であることがより好ましい。また、前記溶剤の含有量は、前記フラックス全体に対して、６０．０質量％以下であることが好ましく、５０．０質量％以下であることがより好ましい。なお、前記溶剤が２種以上含まれる場合、前記含有量は合計含有量である。 The content of the solvent is preferably 30.0% by mass or more, more preferably 40.0% by mass or more, based on the entire flux. Further, the content of the solvent is preferably 60.0% by mass or less, more preferably 50.0% by mass or less, based on the entire flux. In addition, when two or more kinds of the above-mentioned solvents are contained, the above-mentioned content is the total content.
　（チキソ剤）
　本実施形態に係るフラックスは、チキソ剤を含んでいてもよい。チキソ剤としては、例えば、ヒマシ硬化油、脂肪酸アミド、脂肪酸ビスアマイド、ポリアミド化合物、カオリン、コロイダルシリカ、有機ベントナイト、ガラスフリット等が挙げられる。これらの中でも、チキソ剤は、耐熱性を向上させる観点から、脂肪酸ビスアマイド（脂肪酸ビスアミド）又はポリアミド化合物であることが好ましい。脂肪酸ビスアマイドとしては、例えば、メチレンビスステアリン酸アミド、エチレンビスカプリン酸アミド、エチレンビスラウリン酸アミド、エチレンビスステアリン酸アミド、エチレンビスヒドロキシステアリン酸アミド、エチレンビスベヘン酸アミド、ヘキサメチレンビスステアリン酸アミド、ヘキサメチレンビスベヘン酸アミド、ヘキサメチレンビス－１２－ヒドロキシステアリン酸アミド、Ｎ，Ｎ’－ジステアリルアジピン酸アミド、Ｎ，Ｎ’－キシリレンビス－１２－ヒドロキシステアリルアミド等が挙げられる。ポリアミド化合物としては、例えば、脂肪族ポリアミド化合物であるターレンＶＡ－７９、ＡＭＸ－６０９６Ａ、ＷＨ－２１５、ＷＨ－２５５（以上、共栄社化学社製）、ＳＰ－１０、ＳＰ－５００（以上、東レ社製）、グリルアミドＬ２０Ｇ、グリルアミドＴＲ５５（以上、エムスケミ－・ジャパン社製）等、主鎖にベンゼン環、ナフタレン環等の環式化合物含む芳香族ポリアミド化合物（半芳香族ポリアミド化合物又は全芳香族ポリアミド化合物）であるＪＨ－１８０（伊藤製油社製）等が挙げられる。なお、チキソ剤は、１種を単独で用いても、２種以上を併用してもよい。 (thixotropic agent)
The flux according to this embodiment may contain a thixotropic agent. Examples of the thixotropic agent include hydrogenated castor oil, fatty acid amide, fatty acid bisamide, polyamide compound, kaolin, colloidal silica, organic bentonite, glass frit, and the like. Among these, the thixotropic agent is preferably a fatty acid bisamide or a polyamide compound from the viewpoint of improving heat resistance. Examples of fatty acid bisamides include methylene bisstearamide, ethylene biscapric acid amide, ethylene bislauric acid amide, ethylene bisstearic acid amide, ethylene bishydroxystearic acid amide, ethylene bisbehenic acid amide, and hexamethylene bis stearic acid amide. , hexamethylenebisbehenic acid amide, hexamethylenebis-12-hydroxystearic acid amide, N,N'-distearyladipic acid amide, N,N'-xylylenebis-12-hydroxystearylamide, and the like. Examples of polyamide compounds include aliphatic polyamide compounds such as Talen VA-79, AMX-6096A, WH-215, and WH-255 (all manufactured by Kyoeisha Chemical Co., Ltd.), SP-10, and SP-500 (all manufactured by Toray Industries, Inc.). Aromatic polyamide compounds (semi-aromatic polyamide compounds or fully aromatic polyamide compounds) containing a cyclic compound such as a benzene ring or a naphthalene ring in the main chain, such as Grilamid L20G, Grilamid TR55 (manufactured by M Chemie Japan), etc. ), such as JH-180 (manufactured by Ito Oil Co., Ltd.). In addition, the thixotropic agents may be used alone or in combination of two or more.
　前記チキソ剤の含有量は、前記フラックス全体に対して、１．０質量％以上であることが好ましく、３．０質量％以上であることがより好ましい。また、前記チキソ剤の含有量は、前記フラックス全体に対して、１０．０質量％以下であることが好ましく、８．０質量％以下であることがより好ましい。なお、チキソ剤が２種以上含まれる場合、前記含有量は合計含有量である。 The content of the thixotropic agent is preferably 1.0% by mass or more, more preferably 3.0% by mass or more, based on the entire flux. Further, the content of the thixotropic agent is preferably 10.0% by mass or less, more preferably 8.0% by mass or less, based on the entire flux. In addition, when 2 or more types of thixotropic agents are contained, the said content is a total content.
　（その他の活性剤）
　本実施形態に係るフラックスは、前記イミダゾール化合物、及び、前記ジカルボン酸以外のその他の活性剤を含んでいてもよい。前記その他の活性剤としては、特に限定されるものではなく、例えば、有機酸系活性剤、アミン系化合物、アミノ酸、アミンハロゲン塩やハロゲン化合物等のハロゲン系活性剤等が挙げられる。なお、前記その他の活性剤は、１種を単独で用いても、２種以上を併用してもよい。 (Other activators)
The flux according to this embodiment may contain other activators other than the imidazole compound and the dicarboxylic acid. The other activators are not particularly limited, and include, for example, organic acid activators, amine compounds, amino acids, halogen activators such as amine halogen salts, and halogen compounds. In addition, the above-mentioned other activators may be used alone or in combination of two or more.
　前記有機酸系活性剤としては、特に限定されるものではなく、例えば、ギ酸、酢酸、プロピオン酸、酪酸、吉草酸、カプロン酸、エナント酸、カプリン酸、ラウリル酸、ミリスチン酸、ペンタデシル酸、パルミチン酸、マルガリン酸、ステアリン酸、ツベルクロステアリン酸、アラキジン酸、ベヘニン酸、リグノセリン酸、グリコール酸等のモノカルボン酸；シュウ酸、マロン酸、コハク酸、メチルコハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、フマル酸、マレイン酸、酒石酸、ジグリコール酸等のジカルボン酸；レブリン酸、乳酸、アクリル酸、安息香酸、サリチル酸、アニス酸、クエン酸、ピコリン酸等のその他の有機酸が挙げられる。 The organic acid activator is not particularly limited, and includes, for example, formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecylic acid, and palmitic acid. monocarboxylic acids such as margaric acid, stearic acid, tuberculostearic acid, arachidic acid, behenic acid, lignoceric acid, glycolic acid; oxalic acid, malonic acid, succinic acid, methylsuccinic acid, glutaric acid, adipic acid, pimelic acid , dicarboxylic acids such as suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, diglycolic acid; others such as levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, picolinic acid, etc. Examples include organic acids.
　前記アミン系化合物としては、特に限定されるものではなく、例えば、トリアゾール系化合物等が挙げられる。前記トリアゾール系化合物としては、例えば、ベンゾトリアゾール、１Ｈ－ベンゾトリアゾール－１－メタノール、１－メチル－１Ｈ－ベンゾトリアゾール等が挙げられる。その他のアミン系化合物としては、例えば、セチルアミン、エルカ酸アミド、３－（ジメチルアミノ）－１，２－プロパンジオール、３，５－ジメチルピラゾール、ジメチルウレア、ヘキサヒドロ－１，３，５－トリフェニル－１，３，５－トリアジン、ピラジンアミド、Ｎ－フェニルグリシン、３－メチル－５－ピラゾロン、Ｎ－ラウロイルサルコシン、１，３－ジフェニルグアニジン等が挙げられる。 The amine compound is not particularly limited, and examples thereof include triazole compounds. Examples of the triazole compound include benzotriazole, 1H-benzotriazole-1-methanol, 1-methyl-1H-benzotriazole, and the like. Other amine compounds include, for example, cetylamine, erucic acid amide, 3-(dimethylamino)-1,2-propanediol, 3,5-dimethylpyrazole, dimethylurea, hexahydro-1,3,5-triphenyl -1,3,5-triazine, pyrazinamide, N-phenylglycine, 3-methyl-5-pyrazolone, N-lauroylsarcosine, 1,3-diphenylguanidine and the like.
　前記アミノ酸としては、特に限定されるものではなく、例えば、Ｎ－アセチルフェニルアラニン（Ｎ－アセチル－Ｌ－フェニルアラニン、Ｎ－アセチル－ＤＬ－フェニルアラニン、Ｎ－アセチル－Ｄ－フェニルアラニン）、Ｎ－アセチルグルタミン酸（Ｎ－アセチル－Ｌ－グルタミン酸）、Ｎ－アセチルグリシン、Ｎ－アセチルロイシン（Ｎ－アセチル－Ｌ－ロイシン、Ｎ－アセチル－ＤＬ－ロイシン、Ｎ－アセチル－Ｄ－ロイシン）、又は、Ｎ－アセチルフェニルグリシン（Ｎ－アセチル－Ｎ－フェニルグリシン、Ｎ－アセチル－Ｌ－フェニルグリシン、Ｎ－アセチル－ＤＬ－フェニルグリシン）等が挙げられる。 The amino acids are not particularly limited, and include, for example, N-acetylphenylalanine (N-acetyl-L-phenylalanine, N-acetyl-DL-phenylalanine, N-acetyl-D-phenylalanine), N-acetylglutamic acid ( N-acetyl-L-glutamic acid), N-acetylglycine, N-acetylleucine (N-acetyl-L-leucine, N-acetyl-DL-leucine, N-acetyl-D-leucine), or N-acetylphenyl Examples include glycine (N-acetyl-N-phenylglycine, N-acetyl-L-phenylglycine, N-acetyl-DL-phenylglycine) and the like.
　前記ハロゲン系活性剤としては、特に限定されるものではなく、アミンハロゲン塩、ハロゲン化合物等が挙げられる。アミンハロゲン塩のアミンとしては、例えば、ジエチルアミン、ジブチルアミン、トリブチルアミン、ジフェニルグアニジン、シクロヘキシルアミン等が挙げられる。アミンハロゲン塩のハロゲンとしては、フッ素、塩素、臭素、ヨウ素が挙げられる。ハロゲン化合物としては、イソシアヌル酸トリス（２，３－ジブロモプロピル）、２，３－ジブロモ－２－ブテン－１，４－ジオール、２－ブロモ－３－ヨード－２－ブテン－１，４－ジオール、ＴＢＡ－ビス（２，３－ジブロモプロピルエーテル）、４，４’－ジヨードビフェニル等が挙げられる。 The halogen-based activator is not particularly limited, and examples thereof include amine halogen salts, halogen compounds, and the like. Examples of the amine of the amine halogen salt include diethylamine, dibutylamine, tributylamine, diphenylguanidine, and cyclohexylamine. Examples of the halogen in the amine halogen salt include fluorine, chlorine, bromine, and iodine. Examples of halogen compounds include tris(2,3-dibromopropyl) isocyanurate, 2,3-dibromo-2-butene-1,4-diol, and 2-bromo-3-iodo-2-butene-1,4-diol. , TBA-bis(2,3-dibromopropyl ether), 4,4'-diiodobiphenyl, and the like.
　前記その他の活性剤の含有量は、はんだ溶融性を向上させる観点から、フラックス全体に対して、０．５質量％以上であることが好ましく、３．０質量％以上であることがより好ましい。また、前記その他の活性剤の含有量は、ソルダペーストの粘度安定性を高める観点から、フラックス全体に対して、２０．０質量％以下であることが好ましく、１０．０質量％以下であることがより好ましい。なお、前記その他の活性剤が２種以上含まれる場合、前記含有量は合計含有量である。 The content of the other activator is preferably 0.5% by mass or more, and more preferably 3.0% by mass or more, based on the entire flux, from the viewpoint of improving solder meltability. Further, from the viewpoint of increasing the viscosity stability of the solder paste, the content of the other activator is preferably 20.0% by mass or less, and 10.0% by mass or less, based on the entire flux. is more preferable. In addition, when two or more kinds of the above-mentioned other activators are contained, the above-mentioned content is the total content.
　本実施形態に係るフラックスは、その他の添加剤として、例えば、安定剤、界面活性剤、消泡剤、及び、酸化防止剤からなる群から選択される少なくとも１種を含んでいてもよい。その他の添加剤の合計含有量は、特に限定されるものではなく、例えば、前記フラックス全体に対して、５．０質量％以下とすることができる。 The flux according to the present embodiment may contain, as other additives, at least one selected from the group consisting of stabilizers, surfactants, antifoaming agents, and antioxidants. The total content of other additives is not particularly limited, and can be, for example, 5.0% by mass or less based on the entire flux.
　本実施形態に係るフラックスは、ＩＣＴ検査、自動光学検査（ＡＯＩ）等のカメラを使用した外観検査等に対して有用であり、好適に用いることができる。 The flux according to the present embodiment is useful for visual inspection using a camera such as ICT inspection and automatic optical inspection (AOI), and can be suitably used.
　本実施形態に係るフラックスは、環状構造を有するジカルボン酸、及び、環状構造を有するトリカルボン酸からなる群から選択される少なくとも１つのカルボン酸、炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体、及び、フェニル基を有するイミダゾール誘導体からなる群から選択される少なくとも１つのイミダゾール化合物と、液状樹脂、及び、液状重合脂肪酸からなる群から選択される少なくとも１つの液状重合化合物と、を含むことにより、はんだ合金に対するフラックス残渣の被覆率を低下させることができる。 The flux according to the present embodiment includes at least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure, and an imidazole having an alkyl chain having 1 to 11 carbon atoms. At least one imidazole compound selected from the group consisting of derivatives and imidazole derivatives having a phenyl group, and at least one liquid polymer compound selected from the group consisting of liquid resins and liquid polymerized fatty acids. Accordingly, the coverage of flux residue on the solder alloy can be reduced.
　また、本実施形態に係るフラックスは、はんだ合金に対するフラックス残渣の被覆率を低下させることにより、フラックス残渣がチェッカーピンに付着することを抑制することができる。その結果、一つのチェッカーピンにおいて検査できる期間が長くなり、１工数当たりの作業時間を短縮することができる。 Furthermore, the flux according to the present embodiment can suppress adhesion of flux residue to checker pins by reducing the coverage of flux residue on the solder alloy. As a result, the period during which one checker pin can be inspected becomes longer, and the working time per man-hour can be shortened.
　本実施形態に係るフラックスは、前記カルボン酸が、ナフタレン構造、ビフェニル構造、スチルベン構造、ビフェニルエーテル構造、及び、イソシアヌル酸構造からなる群から選択される少なくとも１つの環状構造を有することにより、はんだ合金に対するフラックス残渣の被覆率をより低下させることができる。 In the flux according to the present embodiment, the carboxylic acid has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure. The coverage rate of flux residue can be further reduced.
　本実施形態に係るフラックスは、前記カルボン酸の含有量が、フラックス全体に対して、０．５質量％以上１０．０質量％以下であることにより、はんだ合金に対するフラックス残渣の被覆率をより低下させることができる。 In the flux according to the present embodiment, the content of the carboxylic acid is 0.5% by mass or more and 10.0% by mass or less based on the entire flux, thereby further reducing the coverage of flux residue on the solder alloy. can be done.
　本実施形態に係るフラックスは、前記イミダゾール化合物の含有量が、フラックス全体に対して、０．５質量％以上１０．０質量％以下であることにより、はんだ合金に対するフラックス残渣の被覆率をより低下させることができる。 In the flux according to the present embodiment, the content of the imidazole compound is 0.5% by mass or more and 10.0% by mass or less based on the entire flux, thereby further reducing the coverage of flux residue on the solder alloy. can be done.
　本実施形態に係るフラックスは、前記液状重合脂肪酸の酸価が、１５０ｍｇＫＯＨ／ｇ以上３２０ｍｇＫＯＨ／ｇ以下であることにより、はんだ合金に対するフラックス残渣の被覆率をより低下させることができる。 In the flux according to the present embodiment, since the acid value of the liquid polymerized fatty acid is 150 mgKOH/g or more and 320 mgKOH/g or less, it is possible to further reduce the coverage of flux residue on the solder alloy.
　本実施形態に係るフラックスは、前記液状重合化合物の含有量が、フラックス全体に対して、２．０質量％以上１８．０質量％以下であることにより、はんだ合金に対するフラックス残渣の被覆率をより低下させることができる。 The flux according to the present embodiment has a content of the liquid polymer compound of 2.0% by mass or more and 18.0% by mass or less based on the entire flux, thereby increasing the coverage rate of flux residue on the solder alloy. can be lowered.
　＜ソルダペースト＞
　本実施形態に係るソルダペーストは、上述のフラックスと、はんだ合金粉末と、を含有する。前記ソルダペーストは、前記フラックスと前記はんだ合金粉末とを混合することにより得られる。前記フラックスの含有量は、前記ソルダペースト全体に対して、５．０質量％以上２０．０質量％以下であることが好ましい。また、前記はんだ合金粉末の含有量は、前記ソルダペースト全体に対して、８０．０質量％以上９５．０質量％以下であることが好ましい。 <Solder paste>
The solder paste according to this embodiment contains the above-mentioned flux and solder alloy powder. The solder paste is obtained by mixing the flux and the solder alloy powder. The content of the flux is preferably 5.0% by mass or more and 20.0% by mass or less based on the entire solder paste. Further, the content of the solder alloy powder is preferably 80.0% by mass or more and 95.0% by mass or less based on the entire solder paste.
　前記はんだ合金粉末の合金としては、鉛フリーはんだ合金、鉛を含む共晶はんだ合金が挙げられるが、環境負荷低減の観点から、鉛フリーはんだ合金であることが好ましい。鉛フリーはんだ合金としては、例えば、スズ、銀、銅、インジウム、亜鉛、ビスマス、アンチモン等を含む合金が挙げられる。より具体的には、Ｓｎ／Ａｇ、Ｓｎ／Ａｇ／Ｃｕ、Ｓｎ／Ｃｕ、Ｓｎ／Ａｇ／Ｂｉ、Ｓｎ／Ｂｉ、Ｓｎ／Ａｇ／Ｃｕ／Ｂｉ、Ｓｎ／Ｓｂ、Ｓｎ／Ｚｎ／Ｂｉ、Ｓｎ／Ｚｎ、Ｓｎ／Ｚｎ／Ａｌ、Ｓｎ／Ａｇ／Ｂｉ／Ｉｎ、Ｓｎ／Ａｇ／Ｃｕ／Ｂｉ／Ｉｎ／Ｓｂ、Ｉｎ／Ａｇ等の合金が挙げられる。これらの中でも、前記はんだ合金粉末の合金は、Ｓｎ／Ａｇ／Ｃｕ合金であることが好ましい。また、Ｓｎ／Ａｇ／Ｃｕ合金は、さらに、Ｉｎ、Ｂｉ、Ｓｂ及びＮｉからなる群から選択される少なくとも１種を含有することがより好ましい。また、前記合金には、不可避的不純物が含まれる。不可避的不純物とは、製造過程において不可避的に混入する成分であって、本発明の効果に影響を与えない範囲で許容されるものを意味する。 Examples of the alloy of the solder alloy powder include lead-free solder alloys and eutectic solder alloys containing lead, but from the viewpoint of reducing environmental impact, lead-free solder alloys are preferable. Examples of lead-free solder alloys include alloys containing tin, silver, copper, indium, zinc, bismuth, antimony, and the like. More specifically, Sn/Ag, Sn/Ag/Cu, Sn/Cu, Sn/Ag/Bi, Sn/Bi, Sn/Ag/Cu/Bi, Sn/Sb, Sn/Zn/Bi, Sn/ Examples include alloys such as Zn, Sn/Zn/Al, Sn/Ag/Bi/In, Sn/Ag/Cu/Bi/In/Sb, and In/Ag. Among these, the alloy of the solder alloy powder is preferably a Sn/Ag/Cu alloy. Moreover, it is more preferable that the Sn/Ag/Cu alloy further contains at least one selected from the group consisting of In, Bi, Sb, and Ni. Further, the alloy contains inevitable impurities. Unavoidable impurities refer to components that are unavoidably mixed in during the manufacturing process and are allowed within a range that does not affect the effects of the present invention.
　前記はんだ合金粉末の粒子径は、５μｍ以上４５μｍ以下であることが好ましく、１５μｍ以上３９μｍ以下であることがより好ましい。 The particle size of the solder alloy powder is preferably 5 μm or more and 45 μm or less, more preferably 15 μm or more and 39 μm or less.
　本実施形態に係るソルダペーストは、上述のフラックスと、はんだ合金粉末と、を含有する。これにより、はんだ合金に対するフラックス残渣の被覆率を低下させることができる。 The solder paste according to this embodiment contains the above-mentioned flux and solder alloy powder. Thereby, the coverage of flux residue on the solder alloy can be reduced.
　本発明は、以下の態様を含む。
［１］はんだ付けに用いられるフラックスであって、
　環状構造を有するジカルボン酸、及び、環状構造を有するトリカルボン酸からなる群から選択される少なくとも１つのカルボン酸と、
　炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体、及び、フェニル基を有するイミダゾール誘導体からなる群から選択される少なくとも１つのイミダゾール化合物と、
　液状樹脂、及び、液状重合脂肪酸からなる群から選択される少なくとも１つの液状重合化合物と、を含むフラックス。
［２］前記カルボン酸が、ナフタレン構造、ビフェニル構造、スチルベン構造、ビフェニルエーテル構造、及び、イソシアヌル酸構造からなる群から選択される少なくとも１つの環状構造を有する、［１］に記載のフラックス。
［３］前記カルボン酸の含有量が、フラックス全体に対して、０．５質量％以上１０．０質量％以下である、［１］又は［２］に記載のフラックス。
［４］前記イミダゾール化合物の含有量が、フラックス全体に対して、０．５質量％以上１０．０質量％以下である、［１］～［３］のいずれか一つに記載のフラックス。
［５］前記液状重合脂肪酸の酸価が、１５０ｍｇＫＯＨ／ｇ以上３２０ｍｇＫＯＨ／ｇ以下である、［１］～［４］のいずれか一つに記載のフラックス。
［６］前記液状重合化合物の含有量が、フラックス全体に対して、２．０質量％以上１８．０質量％以下である、［１］～［５］のいずれか一つに記載のフラックス。
［７］［１］～［６］のいずれか一つに記載のフラックスと、はんだ合金粉末と、を含む、ソルダペースト。 The present invention includes the following aspects.
[1] Flux used for soldering,
At least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure;
At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 or more and 11 or less carbon atoms, and an imidazole derivative having a phenyl group;
A flux comprising a liquid resin and at least one liquid polymerized compound selected from the group consisting of liquid polymerized fatty acids.
[2] The flux according to [1], wherein the carboxylic acid has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
[3] The flux according to [1] or [2], wherein the content of the carboxylic acid is 0.5% by mass or more and 10.0% by mass or less based on the entire flux.
[4] The flux according to any one of [1] to [3], wherein the content of the imidazole compound is 0.5% by mass or more and 10.0% by mass or less based on the entire flux.
[5] The flux according to any one of [1] to [4], wherein the liquid polymerized fatty acid has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less.
[6] The flux according to any one of [1] to [5], wherein the content of the liquid polymerizable compound is 2.0% by mass or more and 18.0% by mass or less based on the entire flux.
[7] A solder paste containing the flux according to any one of [1] to [6] and a solder alloy powder.
　なお、本発明に係るフラックス、及び、ソルダペーストは、上記実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更が可能である。また、本発明に係るフラックス、及び、ソルダペーストは、上記した実施形態の作用効果によって限定されるものでもない。即ち、今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記の説明ではなく、請求の範囲によって示される。また、本発明の範囲には、請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。 Note that the flux and solder paste according to the present invention are not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention. Furthermore, the flux and solder paste according to the present invention are not limited to the effects of the above-described embodiments. That is, the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the invention is indicated by the claims rather than by the foregoing description. Further, the scope of the present invention is intended to include all changes within the meaning and scope equivalent to the scope of the claims.
　以下、本発明の実施例について説明するが、本発明は、以下の実施例に限定されるものではない。 Examples of the present invention will be described below, but the present invention is not limited to the following examples.
　＜フラックスの作製＞
　表１～表４に示す配合量の各材料を加熱容器に投入し、１８０℃まで加熱することにより、全材料を溶解させた。その後、室温まで冷却することにより、均一に分散された各実施例及び各比較例のフラックスを得た。なお、表１～表４に示す各配合量は、フラックスに含まれる各成分の含有量と等しい。 <Preparation of flux>
Each of the materials in the amounts shown in Tables 1 to 4 was placed in a heating container and heated to 180° C. to dissolve all the materials. Thereafter, by cooling to room temperature, uniformly dispersed fluxes of each Example and each Comparative Example were obtained. Note that each blending amount shown in Tables 1 to 4 is equal to the content of each component contained in the flux.
　＜ソルダペーストの作製＞
　各実施例及び各比較例のフラックスを１１．０質量％、表１～表４に示すはんだ合金粉末を８９.０質量％となるように混合して、各実施例及び各比較例のソルダペーストを得た。 <Preparation of solder paste>
The flux of each Example and Comparative Example was mixed at 11.0 mass % with the solder alloy powder shown in Tables 1 to 4 at 89.0 mass % to obtain a solder paste of each Example and Comparative Example.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000004
　表１～表４に示すフラックスに含まれる各材料の詳細を表５に示す。また、表１～表４に示すはんだ合金の詳細を表６に示す。 Table 5 shows details of each material contained in the fluxes shown in Tables 1 to 4. Further, details of the solder alloys shown in Tables 1 to 4 are shown in Table 6.
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000006
Figure JPOXMLDOC01-appb-T000006
　＜試験基板の作製＞
　サイズ１００ｍｍ×１００ｍｍ、厚み１．６ｍｍの基板表面上に銅パッド（直径１．５ｍｍの円形状）を有する弘輝試験用の標準基板（材質：ＦＲ－４）に各実施例及び各比較例のソルダペーストを、下記印刷条件で印刷し、その後、基板を下記温度条件で加熱することにより、はんだ合金粉末を溶融させて各実施例及び各比較例の試験基板を作製した。ソルダペーストの印刷は、印刷機（ＹＳＰ　ＹＡＭＡＨＡ　Ｍｏｔｏｒ、ＹＡＭＡＨＡ　Ｍｏｔｏｒ社製）にセッティングしたメタルマスクの上にソルダペーストを３００ｇ載せ、メタルマスクにソルダペーストをなじませるため、ローリングを４回行い、メタルマスクの版裏を乾式クリーニングした後、下記印刷条件で１回行った。また、基板は、下記温度条件（ｉ）で予熱した後、下記温度条件（ｉｉ）で加熱した。 <Preparation of test board>
The solders of each example and each comparative example were placed on a standard board (material: FR-4) for the Hiroki test, which had a copper pad (circular shape with a diameter of 1.5 mm) on the surface of the board with a size of 100 mm x 100 mm and a thickness of 1.6 mm. The paste was printed under the following printing conditions, and then the board was heated under the following temperature conditions to melt the solder alloy powder and produce test boards for each example and each comparative example. To print the solder paste, place 300 g of solder paste on a metal mask set on a printing machine (YSP YAMAHA Motor, manufactured by YAMAHA Motor), roll it 4 times to spread the solder paste onto the metal mask, and then press the metal mask. After dry cleaning the back of the plate, printing was carried out once under the following printing conditions. Further, the substrate was preheated under the following temperature condition (i), and then heated under the following temperature condition (ii).
　（印刷条件）
　印刷環境：温度が２４～２６℃、湿度が５０～６０％ＲＨ
　印刷スキージ：メタルスキージ
　スキージ角度：６０°
　メタルマスク厚：１５０μｍ
　印刷速度：４０ｍｍ／ｓｅｃ
　パッドの形状及び大きさ：円形状、直径１．５ｍｍ
　パッドの材質：ＯＳＰ処理銅 (Printing conditions)
Printing environment: temperature 24-26℃, humidity 50-60%RH
Printing squeegee: Metal squeegee Squeegee angle: 60°
Metal mask thickness: 150μm
Printing speed: 40mm/sec
Pad shape and size: circular, diameter 1.5mm
Pad material: OSP treated copper
　（温度条件）
　（ｉ）プリヒート時
　昇温速度：１．０～３．０℃／秒
　プリヒート温度：１５０～１９０℃／６０～１００秒
　加熱環境：大気雰囲気
　（ｉｉ）はんだ溶融時
　昇温速度：１．０～２．０℃／秒
　溶融温度：２１９℃以上３０秒以上
　ピーク温度：２３０～２５０℃ (Temperature conditions)
(i) During preheating Temperature rising rate: 1.0 to 3.0°C/sec Preheating temperature: 150 to 190°C/60 to 100 seconds Heating environment: Air atmosphere (ii) During solder melting Temperature rising rate: 1.0 to 2.0℃/sec Melting temperature: 219℃ or more for 30 seconds or more Peak temperature: 230-250℃
　＜酸価の測定＞
　液状重合脂肪酸の酸価を、ＪＩＳ　Ｋ　２５０１：２００３の電位差滴定法により測定した。測定結果を表５に示す。 <Measurement of acid value>
The acid value of the liquid polymerized fatty acid was measured by potentiometric titration method according to JIS K 2501:2003. The measurement results are shown in Table 5.
　＜はんだ被覆率の評価＞
　走査型電子顕微鏡（ＪＳＭ－ＩＴ３００ＬＶ、日本電子社製）を用いて、加速電圧が１５．０ｋＶ、照射電流が６０．０μＡ、及び、真空度が３０Ｐａの条件により、作製した各実施例及び各比較例の試験基板におけるはんだ付け部（すなわち、はんだ合金粉末が溶融して一体化した部分）の画像を取得した。取得した画像について２階色調化を行い、はんだ合金が表れている箇所を白色に表示し、その他の箇所（すなわち、フラックス残渣が表れている箇所）を黒色に表示して、白色箇所の画素数を求めた。その後、各試験基板のフラックス残渣を洗浄により除去して、フラックス残渣除去後の白色箇所の画素数を求め、下記式（１）により、はんだ被覆率を算出した。 <Evaluation of solder coverage>
Examples and comparisons were prepared using a scanning electron microscope (JSM-IT300LV, manufactured by JEOL Ltd.) under conditions of an accelerating voltage of 15.0 kV, an irradiation current of 60.0 μA, and a degree of vacuum of 30 Pa. An image of the soldered portion (ie, the portion where the solder alloy powder was melted and integrated) on the example test board was acquired. The acquired image is converted into two-tone tones, and the areas where solder alloy appears are displayed in white, other areas (i.e., areas where flux residue appears) are displayed in black, and the number of pixels in the white area is calculated. I asked for Thereafter, the flux residue on each test board was removed by cleaning, the number of pixels in the white area after the flux residue was removed was determined, and the solder coverage was calculated using the following formula (1).
　はんだ被覆率［％］＝（フラックス残渣除去後の白色箇所の画素数－白色箇所の画素数）／フラックス残渣除去後の白色箇所の画素数）×１００　　　　（１） Solder coverage rate [%] = (number of pixels in white areas after flux residue removal - number of pixels in white areas) / number of pixels in white areas after flux residue removal) x 100 (1)
　はんだ被覆率の評価は、はんだ被覆率が０％以上３５％未満の場合に「優」、はんだ被覆率が３５％以上５５％未満の場合に「良」、はんだ被覆率が５５％以上の場合に「不可」と評価し、「優」及び「良」を「合格」と判定し、「不可」を「不合格」と判定した。はんだ被覆率及び評価結果を表１～表４に示す。 The evaluation of solder coverage is "Excellent" if the solder coverage is 0% or more and less than 35%, "Good" if the solder coverage is 35% or more and less than 55%, and "Good" if the solder coverage is 55% or more. "Excellent" and "Good" were evaluated as "pass", and "unsatisfactory" were determined as "fail". The solder coverage and evaluation results are shown in Tables 1 to 4.
　表１～表４の結果から分かるように、本発明の要件をすべて満たす各実施例のフラックスは、はんだ合金に対するフラックス残渣の被覆率を低下させることができる。
 
  As can be seen from the results in Tables 1 to 4, the fluxes of the examples that meet all the requirements of the present invention can reduce the coverage of flux residue on the solder alloy.

Claims (7)

  1. 　はんだ付けに用いられるフラックスであって、
    　環状構造を有するジカルボン酸、及び、環状構造を有するトリカルボン酸からなる群から選択される少なくとも１つのカルボン酸と、
    　炭素原子数が１以上１１以下のアルキル鎖を有するイミダゾール誘導体、及び、フェニル基を有するイミダゾール誘導体からなる群から選択される少なくとも１つのイミダゾール化合物と、
    　液状樹脂、及び、液状重合脂肪酸からなる群から選択される少なくとも１つの液状重合化合物と、を含むフラックス。     A flux used for soldering,
    At least one carboxylic acid selected from the group consisting of dicarboxylic acids having a cyclic structure and tricarboxylic acids having a cyclic structure;
    At least one imidazole compound selected from the group consisting of an imidazole derivative having an alkyl chain having 1 or more and 11 or less carbon atoms, and an imidazole derivative having a phenyl group;
    A flux comprising a liquid resin and at least one liquid polymerized compound selected from the group consisting of liquid polymerized fatty acids.
  2. 　前記カルボン酸が、ナフタレン構造、ビフェニル構造、スチルベン構造、ビフェニルエーテル構造、及び、イソシアヌル酸構造からなる群から選択される少なくとも１つの環状構造を有する、請求項１に記載のフラックス。 The flux according to claim 1, wherein the carboxylic acid has at least one cyclic structure selected from the group consisting of a naphthalene structure, a biphenyl structure, a stilbene structure, a biphenyl ether structure, and an isocyanuric acid structure.
  3. 　前記カルボン酸の含有量が、フラックス全体に対して、０．５質量％以上１０．０質量％以下である、請求項１に記載のフラックス。 The flux according to claim 1, wherein the content of the carboxylic acid is 0.5% by mass or more and 10.0% by mass or less based on the entire flux.
  4. 　前記イミダゾール化合物の含有量が、フラックス全体に対して、０．５質量％以上１０．０質量％以下である、請求項１に記載のフラックス。 The flux according to claim 1, wherein the content of the imidazole compound is 0.5% by mass or more and 10.0% by mass or less based on the entire flux.
  5. 　前記液状重合脂肪酸の酸価が、１５０ｍｇＫＯＨ／ｇ以上３２０ｍｇＫＯＨ／ｇ以下である、請求項１に記載のフラックス。 The flux according to claim 1, wherein the liquid polymerized fatty acid has an acid value of 150 mgKOH/g or more and 320 mgKOH/g or less.
  6. 　前記液状重合化合物の含有量が、フラックス全体に対して、２．０質量％以上１８．０質量％以下である、請求項１に記載のフラックス。 The flux according to claim 1, wherein the content of the liquid polymerization compound is 2.0% by mass or more and 18.0% by mass or less based on the entire flux.
  7. 　請求項１に記載のフラックスと、はんだ合金粉末と、を含む、ソルダペースト。
     
          A solder paste comprising the flux according to claim 1 and a solder alloy powder.
PCT/JP2023/032877 2022-09-22 2023-09-08 Flux and solder paste WO2024062951A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004347A (en) * 2010-06-17 2012-01-05 Harima Chem Inc Solder bump formation method
WO2019142826A1 (en) * 2018-01-16 2019-07-25 千住金属工業株式会社 Flux and solder paste
JP2020189337A (en) * 2019-05-15 2020-11-26 株式会社弘輝 Flux and solder paste
WO2021166967A1 (en) * 2020-02-18 2021-08-26 千住金属工業株式会社 Flux and solder paste
WO2021261502A1 (en) * 2020-06-24 2021-12-30 株式会社タムラ製作所 Flux, solder paste, electronic circuit mounting board, and electronic control device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012004347A (en) * 2010-06-17 2012-01-05 Harima Chem Inc Solder bump formation method
WO2019142826A1 (en) * 2018-01-16 2019-07-25 千住金属工業株式会社 Flux and solder paste
JP2020189337A (en) * 2019-05-15 2020-11-26 株式会社弘輝 Flux and solder paste
WO2021166967A1 (en) * 2020-02-18 2021-08-26 千住金属工業株式会社 Flux and solder paste
WO2021261502A1 (en) * 2020-06-24 2021-12-30 株式会社タムラ製作所 Flux, solder paste, electronic circuit mounting board, and electronic control device

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