WO2024062542A1 - Appareil de traitement laser et procédé de traitement laser - Google Patents

Appareil de traitement laser et procédé de traitement laser Download PDF

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Publication number
WO2024062542A1
WO2024062542A1 PCT/JP2022/035041 JP2022035041W WO2024062542A1 WO 2024062542 A1 WO2024062542 A1 WO 2024062542A1 JP 2022035041 W JP2022035041 W JP 2022035041W WO 2024062542 A1 WO2024062542 A1 WO 2024062542A1
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Prior art keywords
laser
laser beam
workpiece
laser processing
processing
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PCT/JP2022/035041
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English (en)
Japanese (ja)
Inventor
謙吾 清田
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ファナック株式会社
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Priority to PCT/JP2022/035041 priority Critical patent/WO2024062542A1/fr
Publication of WO2024062542A1 publication Critical patent/WO2024062542A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms

Definitions

  • the present invention relates to a laser processing device and a laser processing method, and particularly to a laser processing device and a laser processing method that perform processing while changing the beam profile of a laser beam irradiated onto a workpiece.
  • Laser processing equipment such as laser cutting machines and laser welding machines transmits a laser beam output from a laser oscillator, irradiates the workpiece, and performs specified processing by moving the laser beam and the workpiece relative to each other. Can be done.
  • the energy density (beam profile) per unit processing length on the processing path must be uniform (within a specified range). It is desirable that
  • the processing path for the workpiece consists of a simple straight line, it is possible to make the energy density per unit processing length uniform if processing is performed at a constant processing speed and constant laser output. can.
  • laser processing is performed in situations where the heat capacity of the workpiece is unbalanced, such as when the machining path includes corners or curved parts, or when machining is performed near the edge of the workpiece. In some cases, the balance of heat input to the workpiece may not be uniform, which may affect machining quality.
  • Patent Document 1 discloses a laser beam including a second beam portion having a second power density inside a first beam portion having a first power density.
  • a processing method is disclosed in which the power density of the laser beam is arbitrarily controlled by swinging the second beam part inside the first beam part when processing the workpiece by irradiating the laser beam with the laser beam. .
  • the spot of the laser beam can be adjusted according to the change in heat capacity, so it is said that the occurrence of defects can be suppressed.
  • the first beam portion and the second beam portion are placed on the same optical path from separate laser light sources.
  • the controller includes at least a wedge prism that rotates the focal point of the laser beam around a predetermined rotation axis, and the control device includes a rotation angle control unit that controls the rotation angle of the focal point, and a rotation angle control unit that controls the rotation angle of the focal point.
  • the apparatus further includes an output control section that controls the output of the laser beam according to the angle.
  • a laser processing method in which processing is performed while changing the beam profile of a laser beam irradiated onto a workpiece, the focal point of the laser beam on the workpiece is rotated around a predetermined rotation axis.
  • the method includes at least a beam moving step of relatively moving the workpiece and a predetermined rotational axis while the laser beam is moving, and in the beam moving step, the output of the laser beam is controlled in accordance with the rotational angle of the focal point.
  • FIG. 1 is a schematic diagram showing the configuration of a laser processing apparatus according to a first embodiment.
  • FIG. 2 is a partial cross-sectional view showing an example of a specific configuration of the processing head shown in FIG. 1.
  • FIG. FIG. 2 is a block diagram showing an example of a specific configuration of the control device shown in FIG. 1 and the relationship between the control device and each component of the laser processing device.
  • FIG. 3 is a schematic diagram showing a typical example of a processing path and a beam profile in the laser processing method according to the first embodiment.
  • FIG. 3 is a schematic diagram showing a typical example of a processing path and a beam profile in the laser processing method according to the first embodiment.
  • FIG. 1 It is a schematic diagram which shows an example of the processing path and beam profile in the laser processing method by the 1st modification of 1st Embodiment. It is a schematic diagram which shows an example of the processing path and beam profile in the laser processing method by the 1st modification of 1st Embodiment. It is a schematic diagram which shows an example of the processing path and beam profile in the laser processing method by the 2nd modification of 1st Embodiment. It is a schematic diagram which shows an example of the processing path and beam profile in the laser processing method by the 2nd modification of 1st Embodiment. It is a schematic diagram which shows an example of the processing path and beam profile in the laser processing method by the 2nd modification of 1st Embodiment. FIG.
  • FIG. 7 is a partial cross-sectional view showing an example of a specific configuration of a processing head included in a laser processing apparatus according to a second embodiment.
  • FIG. 7 is a schematic diagram showing a typical example of a processing path and a beam profile in the laser processing method according to the second embodiment.
  • FIG. 3 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a third embodiment.
  • FIG. 7 is a schematic diagram showing a typical example of a processing path and a beam profile in a laser processing method according to a third embodiment.
  • FIG. 7 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a first modification of the third embodiment.
  • FIG. 7 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a second modification of the third embodiment.
  • 13 is a front view showing an example of the blocking plate shown in FIG. 12.
  • FIG. 7 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a third modification of the third embodiment.
  • 15 is a front view showing an example of the blocking plate shown in FIG. 14.
  • FIG. 1 is a schematic diagram showing the configuration of a laser processing apparatus according to a first embodiment, which is a typical example of the present invention.
  • FIG. 2 is a partial sectional view showing an example of a specific configuration of the processing head shown in FIG.
  • FIG. 3 is a block diagram showing an example of a specific configuration of the control device shown in FIG. 1 and the relationship between the control device and each component of the laser processing device.
  • the laser processing apparatus 100 includes, for example, a laser oscillator 110 that emits a laser beam LB, a processing head 120 that guides the laser beam LB to irradiate the workpiece W, and a workpiece W.
  • the laser processing apparatus 100 includes a work holding mechanism 130 that moves the processing head 120 relative to the processing head 120, a head transport mechanism 140 that moves the processing head 120, and a control device 150 that controls the operation of each component of the laser processing apparatus 100.
  • the laser processing apparatus in this specification executes a predetermined process by irradiating a workpiece W with a laser beam, such as laser welding, laser cutting, laser drilling (trepanning), laser marking, laser dicing, or laser annealing. It can be applied to any processing equipment that In addition, in the following embodiment, the case of laser cutting among the above-mentioned laser processing will be explained as an example.
  • the laser oscillator 110 is a laser oscillation source having a wavelength with high absorption efficiency according to the material of the workpiece W to be processed.
  • Examples of such a laser oscillator 110 include a gas laser oscillator using a laser gas such as CO2 gas as a laser medium, a solid-state laser oscillator using a solid medium such as a YAG rod, a fiber laser oscillator, or a laser diode (LD).
  • the laser beam LB emitted from the laser oscillator 110 is transmitted to the processing head 120 via an arbitrary transmission path 112.
  • the laser beam LB is introduced from one end (upper end) side and is emitted toward the workpiece W from the nozzle 122 at the other end (lower end) side. At this time, the laser beam LB is condensed to a predetermined beam diameter at a condensing point FP on the workpiece W by a condensing lens CL disposed inside the processing head 120.
  • a supply pipe (not shown) for introducing an assist gas or a shielding gas may be connected to the nozzle 122 to inject these gases coaxially with the laser beam LB.
  • the processing head 120 is provided with a lens moving mechanism 124 that moves the condenser lens CL in a direction along the optical axis of the laser beam LB.
  • the focal length of the laser beam LB can be changed without changing the distance of the processing head 120 from the workpiece W.
  • the processing head 120 includes a wedge prism WP that shifts the optical axis of the laser beam LB in a predetermined direction between the nozzle 122 and the condenser lens CL, and a wedge prism WP that rotates the wedge prism WP around the optical axis of the laser beam LB.
  • a prism rotation mechanism 126 that rotates the prism rotation mechanism 126 and a motor 128 that applies rotational force to the prism rotation mechanism 126 are provided.
  • the wedge prism WP rotates, and the focal point FP of the laser beam LB on the work W rotates around a predetermined rotation axis (that is, the optical axis of the laser beam LB introduced into the processing head 120). do.
  • a molten pool MP is formed in the workpiece W by the laser beam LB absorbed by the rotating focal point FP.
  • the work holding mechanism 130 includes a chuck mechanism (not shown) for attaching the work W, and is configured to grip and fix the work W.
  • the work holding mechanism 130 may include not only a mechanism for moving the work W in the three axial directions of XYZ, but also a rotation mechanism.
  • the head transport mechanism 140 is configured as a linear drive body that moves relative to each other in three axes directions of XYZ orthogonal to each other, and the processing head 120 is attached to one end of the linear drive body.
  • the head transport mechanism 140 may be configured as a 6-axis or 7-axis type industrial robot including a robot arm with the processing head 120 attached to one end.
  • the control device 150 receives detection data from various sensors provided in the laser processing device 100, and also includes a main control section 151 that controls the operation of each section described below, and a database.
  • a program analysis unit 152 reads a machining program stored in a computer, etc., and analyzes the machining program, and an irradiation position command signal that instructs the irradiation position of the laser beam LB onto the work W based on the analysis result of the machining program.
  • the irradiation position control unit 153 outputs to the workpiece holding mechanism 130 and the head transport mechanism 140, and the rotational position of the focal point FP of the laser beam LB on the workpiece W (i.e., the wedge prism WP
  • a rotation angle control unit 154 outputs driving power to the motor 128 to the processing head 120 to set the rotation angle (rotation angle of An output control section 155 that outputs a command signal to the laser oscillator 110, a display section 156 that displays operation information of the laser processing apparatus 100 such as the above-mentioned detection data, and an interface 157 that allows an operator to input various information.
  • FIG. 3 shows an example in which the display unit 156 and the interface 157 are configured separately, a panel display unit capable of touch input may be used as the display unit 156 to integrate the two. It may be configured as follows.
  • the main control unit 151 sends control commands analyzed by a program analysis unit 152 (described later) to an irradiation position control unit 153, a rotation angle control unit 154, an output control unit 155, or a display unit 156 for each content, and It is connected to various sensors, etc. (not shown) of the processing device 100, and receives these detection signals.
  • the main control unit 151 receives position information of the work W and the processing head 120 from position sensors provided in the work holding mechanism 130 and the head transport mechanism 140, or receives position information of the work W and the processing head 120 from an output detector (not shown). It may be configured to receive output values of the beam LB and perform feedback control based on these detected data.
  • the program analysis unit 152 controls the machining path included in the machining program, the output of the laser beam LB, etc. by reading blocks of the machining program from an external storage device (not shown) such as a database and analyzing them. Distinguishes the command and temporarily stores and saves the loaded machining program block. Then, the program analysis section 152 sends a control command for the determined machining program to the main control section 151.
  • the irradiation position control unit 153 receives control commands including the optical axis and focal position of the laser beam LB and the movement position of the work W based on the processing program from the main control unit 151, and controls the work holding mechanism 130 and the head transport.
  • An irradiation position command signal is output to the mechanism 140 individually.
  • the irradiation position control unit 153 determines the irradiation coordinate value of the focal point FP when the laser beam LB is irradiated onto the work W based on the command position for the work holding mechanism 130 and the movement position for the head transport mechanism 140. It may be configured to have a function of calculating (x, y, z) and sending it back to the main control unit 151.
  • the rotation angle control unit 154 receives a control command including the rotation position or rotation speed of the focal point FP of the laser beam LB based on the processing program from the main control unit 151, and adjusts the rotation speed to the rotation angle control unit 154.
  • a corresponding drive power is output to the motor 128 of the processing head 120.
  • the wedge prism WP in order to obtain a uniform intensity distribution (beam profile) at the focal point FP of the laser beam LB, the wedge prism WP must be sufficiently fast relative to the processing speed (moving speed of the optical axis of the laser beam LB). need to rotate.
  • the rotation speed (rotation frequency) of the wedge prism WP is set to about several hundred Hz.
  • the output control unit 155 receives a control command including an output value of the laser beam LB corresponding to the irradiation coordinate values (x, y, z) on the machining path based on the machining program from the main control unit 151, An output command signal is output to the laser oscillator 110.
  • the output control unit 155 also receives a control signal including the rotational position or rotational speed of the focal point FP from the main control unit 151, and associates the rotational position or rotational speed with the machining path. It also has a function of controlling the output of the laser beam LB for each rotation angle of the focal point FP.
  • FIGS. 4A and 4B are schematic diagrams showing typical examples of the processing path and beam profile in the laser processing method according to the first embodiment.
  • FIG. 5A and FIG. 5B are schematic diagrams showing an example of a processing path and a beam profile in a laser processing method according to a first modification of the first embodiment.
  • FIGS. 6A to 6C are schematic diagrams showing examples of processing paths and beam profiles in the laser processing method according to the second modification of the first embodiment.
  • the laser beam LB irradiated onto the workpiece W moves in the processing direction TD while forming a molten pool MP.
  • a cut surface CS is formed on the processing path.
  • FIG. 4B which is an enlarged view of region A in FIG. 4A
  • the wedge prism WP of the processing head 120 rotates, so that the focal point FP of the laser beam LB is aligned in the rotational direction RD along the beam path BP. Rotate.
  • the assist gas is injected coaxially with the laser beam LB from the nozzle 122 of the processing head 120, thereby blowing off the material of the molten pool MP and forming the cut surface CS.
  • the first modification of the first embodiment shows a case where the machining path is set near the end surface of the workpiece W, as shown in FIG. 5A. That is, in the first modification, a case is illustrated in which the distance D1 to one end surface of the machining route is smaller than the distance D2 to the other end surface, and the heat capacity on the distance D1 side is small.
  • the output of the laser beam LB in the left beam path BP1 with respect to the processing progress direction TD is set to be lower than the output in the right beam path BP2.
  • Ru the output control unit 155 outputs an output command signal that reduces the output of the laser beam LB while the rotation angle of the focal point FP is in the region of the beam path BP1. This makes it possible to perform processing with a beam profile in which the intensity distribution is smaller on the side with smaller heat capacity.
  • the second modification of the first embodiment shows a case where the processing path has a bending region including the corner CP. That is, in the second modification, since the machining speed decreases near the corner CP when passing through the bending region, a case is exemplified in which excessive heat input at the corner CP is suppressed.
  • the output of the laser beam LB in the beam path BP1 on the right side in the diagram where the corner CP is located is The output is set to be lower than the output in the upper left beam path BP2. That is, the output control unit 155 outputs an output command signal that reduces the output of the laser beam LB while the rotation angle of the focal point FP is in the region of the beam path BP1.
  • the output of the laser beam LB in the beam path BP1 on the upper and lower sides in the figure where the corner CP is located changes to the upper side in the figure.
  • the output is set to be lower than the output in the beam path BP2. That is, the output control unit 155 outputs an output command signal that reduces the output of the laser beam LB while the rotation angle of the focal point FP is in the region of the beam path BP1.
  • machining is performed with a beam profile where the intensity distribution is smaller on the side with smaller heat capacity. By doing so, it is possible to prevent burn-through from occurring at the corner CP.
  • FIGS. 6A to 6C the case where the bending area is bent at a substantially right angle including the corner CP is illustrated, but when the bending area is bent at an arbitrary angle such as an acute angle or an obtuse angle, or a curved bending area is This may also include the case where it is formed on a processing path.
  • the laser processing apparatus and laser processing method rotate the focal point of the laser beam on the workpiece around a predetermined rotation axis, and rotate the focus point of the laser beam on the workpiece at a predetermined position.
  • the output of the laser beam is controlled according to the rotation angle of the focal point. Therefore, since there is no need for multiple laser oscillators or an additional optical system for separating or superimposing laser beams, the energy distribution (beam profile) of the laser beam can be controlled without increasing the size or complexity of the device configuration.
  • FIG. 7 is a partial sectional view showing an example of a specific configuration of a processing head included in a laser processing apparatus according to a second embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing a typical example of a processing path and a beam profile in the laser processing method according to the second embodiment.
  • parts that can have the same or common configurations as those in the first embodiment are denoted by the same reference numerals. The explanation of the repetition of is omitted.
  • the laser processing apparatus according to the second embodiment differs in configuration from the laser processing apparatus according to the first embodiment in that the processing head 220 additionally includes a mechanism for moving the wedge prism WP in a direction along the optical axis of the laser beam LB.
  • the laser processing apparatus 100 according to the second embodiment has the function of changing the position of the wedge prism WP in the direction along the optical axis of the laser beam LB within the processing head 220, thereby changing the rotation radius of the focal point FP on the workpiece W.
  • the processing head 220 includes a nozzle 222 that emits the laser beam LB introduced from one end (upper end) side, and a condenser that focuses the laser beam LB.
  • a lens moving mechanism 224 that moves the lens CL in a direction along the optical axis of the laser beam LB
  • a prism rotating mechanism 226 that rotates the wedge prism WP around the optical axis of the laser beam LB, and a rotational force is applied to the prism rotating mechanism 226.
  • a prism moving mechanism 229 that moves the prism rotation mechanism 226 in a direction along the optical axis of the laser beam LB.
  • the distance from the focal point FP to the rotation center RC (i.e., the rotation radius) can be changed arbitrarily. That is, when the wedge prism WP is located at a relative distance from the work W, the focal point FP rotates on the beam path BP with a rotation radius R1, as shown on the left side of the figure. On the other hand, when the wedge prism WP is located relatively close to the workpiece W, the focal point FP rotates on the beam path BP with a rotation radius R2, as shown on the right side of the figure.
  • the flow of assist gas can be improved by increasing the turning radius R1 of the focal point FP to artificially increase the size of the molten pool. You can increase the machining speed.
  • the turning radius R2 of the focal point FP when cutting a thin plate workpiece W, by reducing the turning radius R2 of the focal point FP to minimize the necessary heat input, it is possible to increase the processing speed and improve the yield. . Note that when cutting a thin plate whose diameter of the molten pool is approximately equal to the diameter of the focal point FP of the laser beam, the cutting may be performed without rotating the wedge prism WP.
  • the laser processing apparatus and laser processing method according to the second embodiment have the effects described in the first embodiment, as well as the effects of the wedge prism in the direction along the optical axis of the laser beam.
  • the position and changing the radius of rotation of the focal point on the workpiece it becomes possible to control the diameter of the molten pool according to the thickness of the workpiece and improve the processing speed.
  • FIG. 9 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a third embodiment of the present invention.
  • FIG. 10 is a schematic diagram showing a typical example of a processing path and a beam profile in a laser processing method according to the third embodiment.
  • FIG. 11 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a first modified example of the third embodiment.
  • FIG. 12 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a second modified example of the third embodiment.
  • FIG. 13 is a front view showing an example of a blocking plate shown in FIG. 12.
  • FIG. 14 is a block diagram showing an example of a specific configuration of a laser oscillator included in a laser processing apparatus according to a third modified example of the third embodiment.
  • FIG. 15 is a front view showing an example of a blocking plate shown in FIG. 14.
  • the third embodiment in the schematic diagrams shown in FIGS. 1 to 8, those that can adopt the same or common configuration as the first and second embodiments are given the same reference numerals and repeated explanations of these are omitted.
  • the laser processing apparatus is different in that the control device 150 controls the output of the laser oscillator 300 by pulse oscillation instead of continuous oscillation. and laser processing methods. That is, in the laser processing apparatus 100 according to the third embodiment, a mechanism for pulse-oscillating the laser beam LB is added to the laser oscillator 300, and the control device 150 controls the operation of the added mechanism. It is configured.
  • the laser oscillator 310 includes a laser oscillation source 312, a drive power source 314 that supplies drive power to the laser oscillation source 312, and It includes a switching mechanism 316 that outputs the continuously emitted laser beam LB in a pulsed manner.
  • a solid-state laser is used as the laser oscillation source 312.
  • the laser oscillation source 312 includes a laser medium 312a that stimulatedly emits laser, a pair of electrodes 312b that discharges excitation light into the laser medium 312a, and a pair of mirrors 312c and 312d that resonate and amplify the stimulatedly emitted laser. including.
  • a laser medium 312a shown in FIG. 9 a YAG rod or the like as a solid medium can be exemplified.
  • the drive power supply 314 supplies drive power corresponding to a predetermined output value of the laser beam LB to the pair of electrodes 312b based on an output command signal from the output control unit 155 of the control device 150.
  • the pair of electrodes 312b discharge excitation light to the laser medium 312a while the driving power is supplied.
  • the switching mechanism 316 controls the emission timing of the laser beam LB emitted from the laser oscillation source 312 based on the cycle of pulse oscillation on/off information included in the output command signal from the output control unit 155.
  • the focal point FP of the laser beam LB intermittently rotates in the rotational direction RD along the beam path BP. Then, the laser beam LB irradiated onto the workpiece W in a pulsed manner moves in the processing progress direction TD while forming a molten pool MP, thereby forming a cut surface CS on the processing path.
  • a first modification of the third embodiment is, for example, as shown in FIG. 11, in which a gas laser is used as the laser oscillation source 312, and a forward/backward mechanism that moves the blocking plate 318a in and out is used as the switching mechanism 316. .
  • a laser oscillator 310 uses a discharge tube filled with a laser gas such as CO 2 gas as a laser medium as a laser oscillation source 312, and a pair of discharge tubes.
  • a shielding plate (slit) 318a made of a material that blocks the amplified laser is attached to a base member 318b between the mirrors 312c and 312d, and a slider 318c for moving the base member 318b is provided. .
  • the emission timing of the laser beam LB is controlled by moving the blocking plate 318a in and out based on the period of the pulse oscillation on/off information.
  • the laser oscillator 310 has a shielding plate 318a as a disk, and includes a motor 318e that rotates the shielding plate 318a as an advancing/retracting mechanism, as shown in FIG. 12, for example.
  • the blocking plate 318a periodically opens the blocking portion 319a corresponding to the off period Toff and the notch portion 319b corresponding to the on period Ton with respect to the oscillation period T of the pulse oscillation. It is constructed as a disk containing.
  • the shielding plate 318a formed in this way to the shaft member 318d and rotating it by the motor 318e, the shielding part 319a and the notch part 319b repeatedly move forward and backward with respect to the laser oscillation source 312 at a predetermined period.
  • the rotational speed of the motor 318e that rotates the blocking plate 318a and the rotational speed of the motor 128 that rotates the wedge prism WP are synchronized.
  • the rotation angle of the focal point FP of the laser beam LB and the oscillation period T of pulse oscillation can be synchronized.
  • the laser oscillator 310 includes a combination of shaft members 318d1 and 318d2 and motors 318e1 and 318e2 that rotate shielding plates 318a1 and 318a2 having the same shape, as shown in FIG. 14, for example.
  • Two sets are provided, and these two sets are arranged in series between a pair of mirrors 312c and 312d, and are controlled to rotate in the same direction independently of each other.
  • the motors 318e1 and 318e2 to rotate while shifting the positions of the notches 319b to have a phase difference ⁇ , the on-off state in the oscillation period T of the pulse oscillation is controlled.
  • the timing (duty ratio) of the period Ton and the off period Toff can be adjusted arbitrarily.
  • the rotation control for the two motors 318e1 and 318e2 in the third modification can be adjusted independently during processing. For example, by making the rotational speed of the motor 318e1 and the motor 318e2 variable during laser processing, the on-period Ton can be shortened in a region where the output of the laser beam LB is desired to be low, and conversely, in a region where the output is desired to be high. Since the on-period Ton can be set to be longer in the beam spot, more detailed control of heat input is possible for each beam spot region.
  • the laser processing apparatus and laser processing method according to the third embodiment can achieve the effects described in the first and second embodiments by using a pulsed laser beam.
  • a pulsed laser beam In order to form a molten pool on the workpiece, it is possible to irradiate the workpiece with a laser beam that requires minimal heat input, and as a result, it is possible to suppress excessive heat input and improve processing accuracy.
  • the present invention is not limited to the above embodiments, and can be modified as appropriate without departing from the spirit.
  • any component of the embodiments may be modified or any component of the embodiments may be omitted.
  • the specific examples shown in the first to third embodiments may be applied by combining their respective characteristics.
  • Laser processing device 110 Laser oscillator 112 Transmission path 120 Processing head 122 Nozzle 124 Lens moving mechanism 126 Prism rotation mechanism 128 Motor 130 Work holding mechanism 140 Head transport mechanism 150 Control device 151 Main control section 152 Program analysis section 153 Irradiation position control section 154 Rotation angle control section 155 Output control section 156 Display section 157 Interface 220 Processing head 222 Nozzle 224 Lens movement mechanism 226 Prism rotation mechanism 228 Motor 229 Prism movement mechanism 310 Laser oscillator 312 Laser oscillation source 312a Laser medium 312b Electrode 312c Mirror 312d mirror 314 Drive power source 316 Switching mechanism 318a Shutoff plate 318a1 Shutoff plate 318a2 Shutoff plate 318b Base member 318c Slider 318d Shaft member 318d1 Shaft member 318d2 Shaft member 318e Motor 318e1 Motor 318e2 Motor 319a Shutoff portion 319b Notch BP Beam path CL Condenser lens FP Condenser Point LB Laser beam MP Mol

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un appareil de traitement laser qui effectue un traitement tout en changeant le profil de faisceau d'un faisceau laser appliqué à une pièce et qui comprend un oscillateur laser qui émet un faisceau laser, une tête de traitement qui guide le faisceau laser de façon à l'appliquer à la pièce, un mécanisme de maintien de pièce qui maintient la pièce et déplace la pièce par rapport à la tête de traitement, et un dispositif de commande qui commande le fonctionnement de chaque composant de l'appareil de traitement laser. La tête de traitement comprend au moins un prisme en coin sur le trajet optique du faisceau laser, le prisme en coin provoquant le pivotement du point de focalisation du faisceau laser sur la pièce autour d'un axe de pivotement prédéterminé. Le dispositif de commande comprend en outre une unité de commande d'angle de pivotement qui commande l'angle de pivotement du point de focalisation et une unité de commande de sortie qui commande la sortie du faisceau laser en fonction de l'angle de pivotement.
PCT/JP2022/035041 2022-09-20 2022-09-20 Appareil de traitement laser et procédé de traitement laser WO2024062542A1 (fr)

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Citations (9)

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JPS60260177A (ja) * 1984-06-07 1985-12-23 Amada Co Ltd レ−ザビ−ムの変調方法および装置
JPH08132267A (ja) * 1994-11-02 1996-05-28 Toshiba Corp レ−ザ光走査装置
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