WO2024057447A1 - Connector connection structure and method for manufacturing same - Google Patents

Connector connection structure and method for manufacturing same Download PDF

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Publication number
WO2024057447A1
WO2024057447A1 PCT/JP2022/034429 JP2022034429W WO2024057447A1 WO 2024057447 A1 WO2024057447 A1 WO 2024057447A1 JP 2022034429 W JP2022034429 W JP 2022034429W WO 2024057447 A1 WO2024057447 A1 WO 2024057447A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
conductive pattern
connector
connection terminal
external
Prior art date
Application number
PCT/JP2022/034429
Other languages
French (fr)
Japanese (ja)
Inventor
崇 中島
稔 飯塚
慎吾 北山
英明 横山
雄一 老田
清 藤巻
Original Assignee
エレファンテック株式会社
タカハタプレシジョン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレファンテック株式会社, タカハタプレシジョン株式会社 filed Critical エレファンテック株式会社
Priority to PCT/JP2022/034429 priority Critical patent/WO2024057447A1/en
Priority to JP2022571826A priority patent/JP7212340B1/en
Publication of WO2024057447A1 publication Critical patent/WO2024057447A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

Definitions

  • the present invention relates to a connector connection structure and a manufacturing method thereof.
  • a flexible board connector connection structure consisting of a housing and a connector part formed by a cover positioned to cover the housing, the flexible board and the reinforcing member are each provided with a hole, and the flexible board and the reinforcing member are provided with holes.
  • the members are fixedly held in the housing by heat processing into holes provided in each member, and each member has at least one terminal portion formed by a conductive pattern on one edge of the flexible board, and each connection terminal of the connector portion. is composed of a conductive pattern on an extension extending from a corresponding terminal portion of a flexible substrate, and each connection terminal of the connector portion is lined with a reinforcing member made of an insulating material. is known (Patent Document 1).
  • a side surface of a male connector housing that has a board insertion hole into which a flexible printed circuit board (FPC) is inserted.
  • the board insertion hole is formed from the back side of the male connector housing to the connector insertion hole on the front side.
  • the board insertion hole is formed from horizontal to gently downward and becomes horizontal again.
  • a locking protrusion is formed near the insertion opening of this board insertion hole, a lock fixing hole is formed in the FPC with which this locking protrusion engages, and a locking hole is formed in the FPC in the vicinity of the board insertion hole facing the connector insertion hole.
  • the present invention stabilizes the electrical connection between a deformable circuit board and external elements.
  • a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, One end of an external connection terminal electrically connected to the external element is exposed on the inner surface of an opening formed at the base end of the housing, and one end of the conductive pattern is inserted into the opening and connected to the external element.
  • a resin layer formed to cover the other surface of the circuit board opposite to the one surface while being in electrically conductive contact with one end of the connection terminal is integrated and fixed with the housing.
  • the invention according to claim 2 is the connector connection structure according to claim 1,
  • the resin layer is made of a synthetic resin that is compatible with the housing, It is characterized by
  • the connector connection structure includes: A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, One end of an external connection terminal electrically connected to the external element is exposed on the inner surface of the opening formed at the base end of the housing, and the other surface of the circuit board opposite to the one surface is a resin layer. One end of the conductive pattern is inserted into the opening in a covered state, and is held and fixed in contact with one end of the external connection terminal so as to be electrically conductive. It is characterized by
  • the connector connection structure includes: A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, one end of the conductive pattern is inserted into an opening formed in an external connection terminal electrically connected to the external element and held in contact with the external connection terminal so as to be electrically conductive; A resin layer formed to cover the other surface opposite to the one surface of the circuit board is integrally fixed with a housing surrounding the terminal so that the external connection terminal is exposed. It is characterized by
  • the invention according to claim 5 is the connector connection structure according to any one of claims 1 to 4,
  • the circuit board is provided with a reinforcing plate for suppressing bending deformation of the one end on the back side of a region where the one end of the conductive pattern is formed. It is characterized by
  • a method for manufacturing a connector connection structure includes: A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising: a step of preparing a base material; arranging the conductive pattern on the base material; a step of preparing a connector consisting of a housing and an external connection terminal; Inserting one end of the conductive pattern into an opening formed at the base end of the housing and maintaining contact so as to be electrically conductive with one end of the external connection terminal that is electrically connected to the external element.
  • a method for manufacturing a connector connection structure includes: A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising: a step of preparing a base material; arranging the conductive pattern on the base material; a step of preparing a connector consisting of a housing and an external connection terminal; a step of covering the other surface of the circuit board opposite to the one surface on which one end portion of the conductive pattern is formed with a resin layer; Inserting one end of the conductive pattern into an opening formed at the base end of the housing and maintaining contact so as to be electrically conductive with one end of the external connection terminal that is electrically connected to the external element. and fixing. It is characterized by
  • a method for manufacturing a connector connection structure includes: A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising: a step of preparing a base material; arranging the conductive pattern on the base material; preparing an external connection terminal to be electrically connected to the external element; a step of inserting one end of the conductive pattern into an opening formed in the external connection terminal and maintaining contact with the external connection terminal so as to be electrically conductive for connection; a step of integrally forming a housing that covers the other surface opposite to the one surface of the circuit board with a resin layer and surrounds the terminal so that the external connection terminal is exposed; It is characterized by
  • the electrical connection between the deformable circuit board and the external element can be easily stabilized.
  • the connector when the fixing portion is made of metal, the connector can be firmly fixed.
  • FIG. 1A is a schematic plan view showing an example of a circuit board equipped with a connector connection structure according to the first embodiment
  • FIG. 1B is a schematic cross-sectional view showing an example of the circuit board
  • FIG. 2A is a schematic plan view showing the configuration of the terminal portion
  • FIG. 2B is a schematic cross-sectional view showing the configuration of the terminal portion
  • FIG. 3A is a schematic cross-sectional view showing the configuration of the connector portion
  • FIG. 3B is a schematic vertical cross-sectional view showing the configuration of the connector portion.
  • FIG. 2 is a flowchart diagram illustrating an example of a schematic procedure of a method for manufacturing a circuit board equipped with a connector connection structure according to the first embodiment.
  • FIG. 1B is a schematic cross-sectional view showing an example of the circuit board
  • FIG. 2A is a schematic plan view showing the configuration of the terminal portion
  • FIG. 2B is a schematic cross-sectional view showing the configuration of the terminal portion
  • FIG. 3A is
  • FIG. 3 is a schematic partial cross-sectional view of a circuit board for explaining a manufacturing process of a circuit board equipped with a connector connection structure according to a first embodiment.
  • FIG. 7 is a schematic partial cross-sectional view of a circuit board for explaining a manufacturing process of a circuit board equipped with a connector connection structure according to a second embodiment.
  • FIG. 7 is a flowchart diagram illustrating an example of a schematic procedure of a method for manufacturing a circuit board equipped with a connector connection structure according to a second embodiment.
  • FIG. 7 is a schematic partial cross-sectional view of a circuit board for explaining a manufacturing process of a circuit board equipped with a connector connection structure according to a third embodiment.
  • FIG. 7 is a flowchart diagram illustrating an example of a schematic procedure of a method for manufacturing a circuit board equipped with a connector connection structure according to a third embodiment.
  • FIG. 1A is a schematic plan view showing an example of a circuit board 1 equipped with the connector connection structure according to the first embodiment
  • FIG. 1B is a schematic cross-sectional view showing an example of the circuit board 1.
  • 2A is a schematic plan view showing the structure of the terminal part 5
  • FIG. 2B is a schematic cross-sectional view showing the structure of the terminal part 5
  • FIG. 3A is a schematic cross-sectional view showing the structure of the connector part 6
  • FIG. 3B is a schematic cross-sectional view showing the structure of the connector part 6.
  • 3C is a diagram showing the connection between the connector part 6 and the terminal part 5.
  • the circuit board 1 includes a deformable base material 2, a conductive pattern 3 disposed on one surface 2a of the base material 2, and an electrically conductive pattern 3 provided on the base material 2.
  • the mounted component 4 that has been electrically connected to the terminal portion 5 having a plurality of connector connection pads 3Aa formed on one end of the conductive pattern 3 is held in contact with the terminal portion 5 so as to be electrically conductive.
  • a connector part 6 electrically connected to an external element, and a resin layer 7 formed to cover the other surface 2b opposite to the one surface 2a of the base material 2 and to be integrated with the housing 62 of the connector part 6. It is configured with the following.
  • the base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material.
  • the "deformable base material” is one that can be deformed after the conductive pattern 3 is disposed, that is, from a substantially flat two-dimensional shape to a substantially three-dimensional three-dimensional shape by thermoforming, vacuum forming, or pressure forming. Refers to a substrate that can be deformed into a shape.
  • Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides (PA) such as nylon 6-10 and nylon 46, polyetheretherketone (PEEK), and acrylic butadiene styrene ( Examples include thermoplastic resins such as ABS), polymethyl methacrylate (PMMA), and polyvinyl chloride (PVC).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PA polyamides
  • PEEK polyetheretherketone
  • PVC polyvinyl chloride
  • polyester is more preferred, and among these, polyethylene terephthalate (PET) is most preferred because of its good balance of economical efficiency, electrical insulation properties, chemical resistance, etc.
  • a surface treatment on one surface 2a of the base material 2 in order to uniformly apply catalyst ink such as metal nanoparticles.
  • catalyst ink such as metal nanoparticles.
  • the surface treatment for example, corona treatment, plasma treatment, solvent treatment, primer treatment, etc. can be used.
  • a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers the growth of metal plating is formed in a predetermined pattern.
  • the base layer is formed by applying catalyst ink such as metal nanoparticles onto the base material 2, followed by drying and firing.
  • the thickness ( ⁇ m) of the base layer is preferably 0.1 to 20 ⁇ m, more preferably 0.2 to 5 ⁇ m, and most preferably 0.5 to 2 ⁇ m. If the base layer is too thin, the strength of the base layer may decrease. Furthermore, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.
  • gold, silver, copper, palladium, nickel, etc. are used, and gold, silver, and copper are preferred from the viewpoint of electrical conductivity, and copper, which is cheaper than gold and silver, is most preferred.
  • the particle diameter (nm) of the catalyst particles is preferably 1 to 500 nm, more preferably 10 to 100 nm. If the particle size is too small, the reactivity of the particles may increase, which may adversely affect the storage life and stability of the ink. If the particle size is too large, it will be difficult to form a thin film uniformly, and there is a possibility that precipitation of ink particles will occur more easily.
  • the conductive pattern 3 is formed on the base layer by electroplating or electroless plating. Copper, nickel, tin, silver, gold, etc. can be used as the plating metal, but it is most preferable to use copper from the viewpoints of elongation, conductivity, and cost.
  • the thickness ( ⁇ m) of the plating layer is preferably 0.03 to 100 ⁇ m, more preferably 1 to 35 ⁇ m, and most preferably 3 to 18 ⁇ m. If the plating layer is too thin, there is a risk that the mechanical strength will be insufficient and that sufficient electrical conductivity will not be obtained for practical use. If the plating layer is too thick, the time required for plating may increase, leading to an increase in manufacturing costs.
  • a plurality of mounting components 4 are attached to the conductive pattern 3.
  • the mounted component 4 includes a main body portion 4a and a terminal portion 4b electrically connected to the connection pad 3a of the conductive pattern 3.
  • Mounted components 4 include control circuits, distortion, resistance, capacitance, touch sensing components such as TIR, photodetection components, tactile components or vibration components such as piezoelectric actuators or vibration motors, light emitting components such as LEDs, microphones, and Examples include sound producing or sound receiving devices such as speakers, memory chips, programmable logic chips, device operating parts such as CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, and the like.
  • DSP digital signal processors
  • the terminal portion 5 includes a conductive pattern 3A extending integrally from the conductive pattern 3 disposed on the base material 2, and a plurality of connector connection pads 3Aa are formed on the conductive pattern 3A.
  • the connector connection pad 3Aa is electrically connected to the anchor portion 61b of the external connection terminal 61 of the connector portion 6.
  • the back surface of the terminal portion 5 is lined with a reinforcing plate 51 in a region near the connector connection pad 3Aa.
  • the reinforcing plate 51 is made of an insulating material such as plastic, and is attached in close contact with the back surface of the terminal portion 5 to increase the rigidity of the terminal portion 5 and suppress bending deformation.
  • the connector part 6 includes an external connection terminal 61 that is electrically connected to the connector connection pad 3Aa of the terminal part 5 and electrically connected to an external element provided outside.
  • a housing 62 that holds an external connection terminal 61 is provided.
  • the external connection terminal 61 is formed into a square prism shape using, for example, a copper alloy.
  • the external connection terminal 61 may be plated with nickel on its surface, and plated with a metal such as gold (AU), tin (Sn), or an alloy containing these metals on top of the nickel plating. good.
  • the pitch of the external connection terminals 61 corresponds to the standard of the connector of the external element to which they are connected.
  • the external connection terminal 61 includes a connector terminal portion 61a and an anchor portion 61b joined to the connector connection pad 3Aa.
  • the housing 62 has an opening 63 formed at its base end.
  • the anchor part 61b of the external connection terminal 61 is exposed in the opening 63, and as shown in FIG. 3(c), the connector connection pad 3Aa of the terminal part 5 is inserted.
  • the anchor portion 61b of the external connection terminal 61 is electrically connected to the anchor portion 61b while being in contact with the anchor portion 61b.
  • the resin layer 7 covers the other surface 2b opposite to the one surface 2a of the base material 2 and is integrated with the housing 62 of the connector section 6, so that the terminal section 5 and the connector section 6 are electrically connected. is fixed.
  • the resin layer 7 is formed to cover the other surface 2b of the base material 2 opposite to the one surface 2a, and to be integrated with the housing 62 of the connector section 6.
  • the resin layer 7 that covers one surface of the base material 2 and is integrated with the housing 62 is a thermoplastic resin that is mutually compatible with the housing 62 and can be injection molded.
  • the housing 62 is made of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified Polyphenylene ether (m-PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or these
  • PC polycarbonate
  • PET polyethylene terephthalate
  • PMMA polymethyl methacrylate
  • PA acrylic butadiene styrene
  • ABS polyethylene
  • PE polypropylene
  • PP polypropylene
  • m-PPE modified Polyphenylene ether
  • m-PPO modified polyphenylene oxide
  • COC cycloolefin copolymer
  • COP cycloolef
  • polyester resin that is highly compatible with polybutylene terephthalate (PBT).
  • Polyester resins include alcohol-derived residues in the molecular structure, aliphatic residues such as trimethylene residues, pentene residues, neopentene residues, and hexene residues, cyclohexane dimethylene residues, cyclohexene residues, and cyclopentene residues. Resins containing alicyclic residues such as groups are preferred.
  • FIG. 4 is a flowchart diagram showing an example of a schematic procedure of a method for manufacturing the circuit board 1 equipped with the connector connection structure according to the first embodiment
  • FIG. 5 is a flow chart diagram according to the first embodiment.
  • FIG. 2 is a schematic partial cross-sectional view of the circuit board 1 for explaining the manufacturing process of the circuit board 1 provided with the connector connection structure.
  • the circuit board 1 is manufactured through a step S11 of preparing the base material 2, a wiring plating step S12 of arranging the conductive pattern 3 on the base material 2, and a step S13 of preparing the connector part 6 consisting of the external connection terminals 61 and the housing 62. Then, the terminal part 5 on which the connector connection pad 3Aa is formed is inserted into the opening 63 formed at the base end of the housing 62 and held in contact with the anchor part 61b of the external connection terminal 61 so as to be electrically conductive.
  • Base material preparation step S11 In the base material preparation step S11, first, metal plating is performed on the base material 2 in order to arrange the conductive pattern 3 on the substantially flat film-like base material 2 formed in a predetermined shape and size. A base layer made of catalyst particles such as metal nanoparticles that triggers growth is formed in a predetermined pattern. In order to uniformly apply the catalyst ink made of catalyst particles such as metal nanoparticles to the base material 2, it is preferable to perform a surface treatment such as corona treatment, plasma treatment, solvent treatment, or primer treatment.
  • a surface treatment such as corona treatment, plasma treatment, solvent treatment, or primer treatment.
  • Methods for applying catalyst ink made of catalyst particles such as metal nanoparticles onto the substrate 2 include inkjet printing, silk screen printing, gravure printing, offset printing, flexo printing, roller coater, and brush coating. Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method. In this embodiment, an inkjet printing method is used.
  • the solvent is evaporated to leave only the metal nanoparticles. Thereafter, the solvent is removed (drying) and the metal nanoparticles are sintered (calcination).
  • the firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the firing temperature is too low, the metal nanoparticles will not be sufficiently sintered with each other, and components other than the metal nanoparticles will remain, so there is a risk that adhesion may not be obtained. Furthermore, if the firing temperature is too high, there is a risk that the base material 2 will deteriorate or become distorted.
  • Wiring plating step S12 By performing electrolytic plating or electroless plating on the base layer formed on the base material 2, plating metal is deposited on the surface and inside of the base layer, and the conductive pattern 3 and the connector connection pad 3Aa are arranged (Fig. (See 5A).
  • the plating method is similar to known plating solutions and plating treatments, and specific examples include electroless copper plating and electrolytic copper plating.
  • connection terminal 61 is insert-molded into the housing 62 to create the connector section 6.
  • the external connection terminal 61 is formed into a predetermined shape by bending a metal plate member in the thickness direction. In this embodiment, depending on the connection direction of the connector part 6 with the external element, as shown in FIG. It is formed in any straight angle type shape that is drawn out in a direction perpendicular to the mounting surface of the board 1.
  • the housing 62 has an opening 63 formed at its base end into which the terminal portion 5 is inserted.
  • the opening 63 is formed so that the bent anchor part 61b of the external connection terminal 61 is exposed inside the opening 63, and the connector connection pad 3Aa of the terminal part 5 inserted into the opening 63 comes into contact with it to establish electrical continuity.
  • Housing 62 is formed from an injection moldable thermoplastic material.
  • the thermoplastic resin material is not particularly limited, but polybutylene terephthalate (PBT), which has excellent electrical properties, is preferred.
  • connection step S14 of the terminal portion 5 first, the reinforcing plate 51 is attached to the back surface of the terminal portion 5 near the connector connection pad 3Aa.
  • the reinforcing plate 51 is attached using a fixing member such as adhesive, pressure-sensitive adhesive, or double-sided tape. Then, the terminal part 5 with the reinforcing plate 51 attached and the bending rigidity improved is inserted into the opening 63 of the housing 62, and the connector connection pad 3Aa is connected to the anchor part 61b of the external connection terminal 61 exposed inside the opening 63. and maintain electrical continuity in contact (see Figure 5C).
  • a binder ink is applied to the other surface 2b of the substrate 2 opposite to the one surface 2a on which the conductive pattern 3 is arranged according to the combination of the resin materials of the substrate 2 and the resin layer 7.
  • An adhesive layer (not shown) is formed by coating.
  • binder ink (not shown) is also applied to the end surface 62a of the housing 62 where the housing 62 contacts the resin layer 7.
  • the binder ink contains an adhesive resin, is applied by screen printing, inkjet printing, spray coating, brush painting, etc., and improves the adhesion between the resin layer 7 to be injection molded, the base material 2, and the housing 62.
  • the mold K is closed and the cavity CA1 is filled with resin.
  • the resin filled in the cavity CA1 forms a resin layer 7 that covers the other surface 2b of the base material 2 and is integrated with the housing 62 of the connector section 6.
  • the terminal portion 4b of the mounted component 4 is positioned on the connection pad 3a of the conductive pattern 3, and the terminal portion 4b and the connection pad 3a are electrically joined with solder in a fixed state.
  • laser soldering using laser light or photobaking soldering may be used.
  • Laser soldering has the advantage of being able to radiate laser light from the soldering head of a soldering device and to mount components 4 on minute parts of circuit board 1 in a short time.
  • the mounting component 4 can be mounted without applying heat to the entire component. It becomes possible to do so.
  • circuit board 1 With the above steps, assembly of the circuit board 1 is completed (see FIG. 1B).
  • the terminal portion 5 of the deformable circuit board 1 is inserted into the connector portion 6 formed integrally with the base material 2, and the connector connection pad 3Aa is held in contact with the external connection terminal 61, so that the circuit board The electrical connection between 1 and external elements can be stabilized.
  • FIG. 6 is a schematic partial cross-sectional view of the circuit board 1A for explaining the manufacturing process of the circuit board 1A provided with the connector connection structure according to the second embodiment.
  • a connector connection structure according to a second embodiment will be described with reference to the drawings.
  • the circuit board 1A is configured to include a deformable base material 2, a conductive pattern 3 arranged on one surface 2a of the base material 2, a mounted component 4 provided on the base material 2 and electrically joined to the conductive pattern 3, a terminal portion 5 having a plurality of connector connection pads 3Aa formed at one end of the conductive pattern 3 with the other surface 2b of the base material 2 opposite to the one surface 2a being covered with a resin layer 7, and a connector portion 6 that is held in contact with the terminal portion 5 so as to be electrically conductive and is electrically connected to an external element.
  • the terminal portion 5 in which the plurality of connector connection pads 3Aa are formed at one end of the conductive pattern 3 is located on the side opposite to the one surface 2a of the base material 2.
  • the connector connection structure according to the first embodiment is different from the connector connection structure according to the first embodiment in that the other surface 2b is inserted into the opening 63 of the connector part 6 with the other surface 2b covered with the resin layer 7 and held in contact so as to be electrically conductive. This is different from the circuit board 1 provided. Therefore, the same reference numerals are given to the common parts with the first embodiment, and detailed explanation thereof will be omitted.
  • a plurality of connector connection pads 3Aa are formed at one end of the conductive pattern 3.
  • a reinforcing plate 51 is attached to the back surface of the area of the terminal portion 5 near the connector connection pad 3Aa, increasing the rigidity of the terminal portion 5 and suppressing bending deformation.
  • the other surface 2b of the base material 2 which is the back surface of the terminal portion 5 and which is opposite to the one surface 2a, is covered with the resin layer 7 except for the area where the connector portion 6 is inserted into the opening 63. , the rigidity of the circuit board 1A is increased.
  • the connector section 6 includes an external connection terminal 61 for electrically connecting to an external element provided outside, and a housing 62 that holds the external connection terminal 61.
  • the housing 62 has an opening 63 formed at its base end. As shown in FIG. 6B, in the opening 63, the anchor part 61b of the external connection terminal 61 is exposed in the opening 63, and when the terminal part 5 is inserted, the connector connection pad 3Aa of the terminal part 5 becomes the external connection terminal. It is electrically conductive while being in contact with the anchor portion 61b of 61.
  • the terminal portion 5 has its back surface reinforced with a reinforcing plate 51, and is covered with a resin layer 7 except for the area where it is inserted into the opening 63, increasing its rigidity and making the connection with the connector portion 6 strong.
  • FIG. 7 is a flowchart showing an example of a schematic procedure of a method of manufacturing the circuit board 1A provided with the connector connection structure according to the second embodiment.
  • the circuit board 1A includes a preparation step S21 for the base material 2, a wiring plating step S22 for arranging the conductive pattern 3 on the base material 2, and a step S23 for preparing the connector section 6 consisting of the external connection terminals 61 and the housing 62.
  • Base material preparation step S21 Metal plating is grown on a substantially flat film-like base material 2 formed in a predetermined shape and size, as in the first embodiment.
  • a base layer made of catalyst particles such as metal nanoparticles is formed in a predetermined pattern, and conductive patterns 3 and connector connection pads 3Aa are arranged through a wiring plating step S22. Then, a reinforcing plate 51 is attached to the back surface of the terminal portion 5 near the connector connection pad 3Aa.
  • connection terminal 61 is insert-molded into the housing 62 to create the connector section 6.
  • the external connection terminal 61 is formed into a predetermined shape by bending a metal plate member in the thickness direction.
  • the housing 62 has an opening 63 formed at its base end into which the terminal portion 5 is inserted.
  • the opening 63 is formed so that the bent anchor part 61b of the external connection terminal 61 is exposed inside the opening 63, and the connector connection pad 3Aa of the terminal part 5 inserted into the opening 63 comes into contact with it to establish electrical continuity. .
  • the resin layer forming step S24 In the resin layer forming step S24, the other surface 2b of the base material 2 opposite to the one surface 2a on which the conductive pattern 3 and the connector connection pad 3Aa are arranged is coated according to the combination of the resin materials of the base material 2 and the resin layer 7. Apply binder ink to form an adhesive layer.
  • the mold K With the base material 2 that has undergone the wiring plating step S22 positioned and set in the mold K (see FIG. 10E), the mold K is closed and the cavity CA1 is filled with resin.
  • the resin filled in the cavity CA1 forms a resin layer 7 that covers the other surface 2b of the base material 2.
  • the resin layer 7 is formed except for the area where the terminal portion 5 is inserted into the opening 63 of the connector portion 6 (see FIG. 6A).
  • connection process S25 In the terminal part 5 connection step S25, as shown in FIG. 6B, the terminal part 5 of the circuit board 1A on which the resin layer 7 is formed is inserted into the opening 63 of the housing 62 so that the connector connection pad 3Aa becomes an external connection terminal. 61 and is held in contact with the anchor portion 61b in an electrically conductive state to be fixed (see FIG. 6C).
  • the mounted component 4 positions the terminal portion 4b on the connection pad 3a of the conductive pattern 3, and electrically connects the terminal portion 4b to the connection pad 3a in a fixed state.
  • the terminal portion 5 of the deformable circuit board 1A is inserted into the connector portion 6 with its back surface covered with a resin layer 7, and is fixed in a state where the connector connection pad 3Aa is held in contact with the external connection terminal 61. Therefore, the electrical connection between the circuit board 1A and external elements can be stabilized.
  • FIG. 8 is a schematic partial cross-sectional view of the circuit board 1B for explaining the manufacturing process of the circuit board 1B provided with the connector connection structure according to the third embodiment.
  • a connector connection structure according to a third embodiment will be described with reference to the drawings.
  • the circuit board 1B includes a deformable base material 2, a conductive pattern 3 disposed on one surface 2a of the base material 2, and a conductive pattern 3 provided on the base material 2.
  • the electrically connected mounting component 4 and the connector connection pad 3Aa formed at one end of the conductive pattern 3 are inserted into the opening 61c and are electrically connected to an external element while being in contact with each other so as to be electrically conductive.
  • the resin layer 7 formed to cover the external connection terminal 61 to be connected to the base material 2 and the other surface 2b opposite to the one surface 2a of the base material 2 connects the external connection terminal 61 so that the external connection terminal 61 is exposed. It is configured to include a housing 62 that encloses it and a connector portion 6 that is integrated with it.
  • the circuit board 1B equipped with the connector connection structure according to the third embodiment has an external terminal portion 5 in which a plurality of connector connection pads 3Aa are formed at one end of the conductive pattern 3 and is electrically connected to an external element.
  • This is different from the circuit board 1 having the connector connection structure according to the first embodiment in that it is inserted into the opening 61c of the connection terminal 61 and held in contact for electrical continuity. Therefore, the same reference numerals are given to the common parts with the first embodiment, and detailed explanation thereof will be omitted.
  • the terminal portion 5 has a plurality of connector connection pads 3Aa formed at one end of the conductive pattern 3.
  • a reinforcing plate 51 is attached to the back surface of the area of the terminal portion 5 near the connector connection pad 3Aa, increasing the rigidity of the terminal portion 5 and suppressing bending deformation.
  • the connector section 6 includes an external connection terminal 61 for electrically connecting to an external element provided outside, and a housing 62 that holds the external connection terminal 61.
  • the external connection terminal 61 is formed into a predetermined shape by bending a metal plate member in the thickness direction, and an opening 61c is formed in the anchor portion 61b.
  • the terminal portion 5 is inserted into the opening portion 61c (see FIG. 8B), and the connector connection pad 3Aa is electrically connected to the anchor portion 61b while being in contact with the anchor portion 61b.
  • the resin layer 7 forms a housing 62 that covers the other surface 2b opposite to the one surface 2a of the base material 2 and surrounds the external connection terminal 61 so that the external connection terminal 61 is exposed. It is formed so as to be integrated with the section 6.
  • FIG. 9 is a flowchart showing an example of a schematic procedure of a method of manufacturing circuit board 1B provided with the connector connection structure according to the third embodiment.
  • the circuit board 1B includes a preparation step S31 for the base material 2, a wiring plating step S32 for arranging the conductive pattern 3 on the base material 2, and a terminal portion 5 formed at one end of the conductive pattern 3 inserted.
  • the connector part 6 is manufactured through a step S35 of forming the resin layer 7 to be integrated with the connector part 6.
  • Base material preparation step S31 Metal plating is grown on a substantially flat film-like base material 2 formed in a predetermined shape and size, as in the first embodiment.
  • a base layer made of catalyst particles such as metal nanoparticles is formed in a predetermined pattern, and conductive patterns 3 and connector connection pads 3Aa are arranged through a wiring plating step S32.
  • a reinforcing plate 51 is attached to the back surface of the terminal portion 5 near the connector connection pad 3Aa (see FIG. 8A).
  • the external connection terminal 61 is prepared by bending a metal plate member in the thickness direction and forming it into a predetermined shape.
  • an opening 61c into which the terminal portion 5 is inserted is formed in the anchor portion 61b.
  • the opening 61c is formed at a height that allows the terminal section 5 to which the reinforcing plate 51 is attached to be press-fitted into the opening 61c, and the connector connection pad 3Aa of the terminal section 5 inserted into the opening 61c comes into contact with the terminal section 5 for electrical conduction. do.
  • connection step S34 In the terminal part 5 connection step S34, the terminal part 5 of the circuit board 1B is inserted into the opening 61c of the external connection terminal 61 (see FIG. 8B), and the connector connection pad 3Aa of the terminal part 5 is connected to the anchor of the external connection terminal 61. It is fixed by contacting and maintaining contact with the portion 61b in an electrically conductive state.
  • the resin layer forming step S35 In the resin layer forming step S35, the other surface 2b of the base material 2 opposite to the one surface 2a on which the conductive pattern 3 and the connector connection pad 3Aa are arranged is coated according to the combination of the resin materials of the base material 2 and the resin layer 7. A binder ink (not shown) is applied to form an adhesive layer. Further, binder ink (not shown) is also applied to the surface of the external connection terminal 61. Next, the base material 2 that has undergone the connection step S34 is positioned and set in a mold K (not shown), and the mold K is closed to fill the cavity CA1 (not shown) with resin.
  • the resin filled in the cavity CA1 forms the resin layer 7 covering the other surface 2b of the base material 2 and the housing 62 of the connector portion 6 (see FIG. 8C).
  • the mounted component 4 positions the terminal portion 4b on the connection pad 3a of the conductive pattern 3, and electrically connects the terminal portion 4b to the connection pad 3a in a fixed state.
  • the assembly of the circuit board 1B is completed.
  • the terminal portion 5 of the deformable circuit board 1B is inserted into the opening 61c of the external connection terminal 61 constituting the connector portion 6, and the connector connection pad 3Aa is held in contact with the external connection terminal 61 when the terminal portion 5 of the base material 2 is inserted.
  • the resin layer 7 formed to cover the other surface 2b opposite to the one surface 2a is integrated and fixed with the housing 62 surrounding the external connection terminal 61 so that the external connection terminal 61 is exposed. Electrical connection between the substrate 1B and external elements can be stabilized.

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Abstract

The present invention stabilizes an electric connection between a deformable circuit board and an external element.　This connector connection structure electrically connects one end portion of a conductive pattern disposed on one surface of the deformable circuit board, with an external element, wherein a resin layer is integrated and fixed to a housing, the resin layer being formed so as to expose one end of an external connection terminal to be electrically connected to the external element on the inner surface of an opening portion formed at a base end portion of the housing, and cover the other surface on the opposite side to the one surface of the circuit board in a contact-hold state in which the one end portion of the conductive pattern is inserted into the opening portion so as to be electrically conductive with the one end of the external connection terminal.

Description

コネクタ接続構造及びその製造方法Connector connection structure and its manufacturing method
　本発明は、コネクタ接続構造及びその製造方法に関する。 The present invention relates to a connector connection structure and a manufacturing method thereof.
　一側の端縁が傾斜したフレキシブル基板と、フレキシブル基板の下面に位置し、フレキシブル基板の傾斜した一側の端縁の形状に沿うように形成された補強部材と、補強部材の下面に位置するハウジングと、ハウジングを覆うように位置するカバーによって形成されたコネクタ部とからなるフレキシブル基板のコネクタ接続構造であって、フレキシブル基板および補強部材には、それぞれには孔が設けられ、フレキシブル基板と補強部材はそれぞれに設けられた孔への熱加工により、ハウジングに固定保持され、フレキシブル基板の、一側の端縁にて導電パターンにより形成された少なくとも一つの端子部と、コネクタ部の各接続端子が、フレキシブル基板の対応する端子部から突出して延びる延長部上の導電パターンから構成されており、コネクタ部の各接続端子が、絶縁材料から成る補強部材により裏打ちされているフレキシブル基板のコネクタ接続構造が知られている（特許文献１）。 A flexible substrate with an inclined edge on one side, a reinforcing member located on the lower surface of the flexible substrate and formed to follow the shape of the inclined edge on one side of the flexible substrate, and a reinforcing member located on the lower surface of the reinforcing member. A flexible board connector connection structure consisting of a housing and a connector part formed by a cover positioned to cover the housing, the flexible board and the reinforcing member are each provided with a hole, and the flexible board and the reinforcing member are provided with holes. The members are fixedly held in the housing by heat processing into holes provided in each member, and each member has at least one terminal portion formed by a conductive pattern on one edge of the flexible board, and each connection terminal of the connector portion. is composed of a conductive pattern on an extension extending from a corresponding terminal portion of a flexible substrate, and each connection terminal of the connector portion is lined with a reinforcing member made of an insulating material. is known (Patent Document 1).
　フレキシブルプリント基板（ＦＰＣ）が挿入される基板挿入穴を有するオスコネクタハウジングの背面側から前面側のコネクタ挿入穴にかけて形成される基板挿入穴を水平から緩やかに下方に向かい再び水平になるような側面Ｓ字状の溝に形成し、この基板挿入穴の挿入口近傍にロック突起を形成し、このロック突起が係合するロック固定穴をＦＰＣに形成し、コネクタ挿入穴に面した基板挿入穴の出口幅よりも広い基板突き当て部をＦＰＣに形成し、このＦＰＣの基板突き当て部の先に出口幅とほぼ同一幅のコンタクト部を形成したフレキシブルプリント基板のコネクタ接続構造も知られている（特許文献２）。 A side surface of a male connector housing that has a board insertion hole into which a flexible printed circuit board (FPC) is inserted.The board insertion hole is formed from the back side of the male connector housing to the connector insertion hole on the front side.The board insertion hole is formed from horizontal to gently downward and becomes horizontal again. A locking protrusion is formed near the insertion opening of this board insertion hole, a lock fixing hole is formed in the FPC with which this locking protrusion engages, and a locking hole is formed in the FPC in the vicinity of the board insertion hole facing the connector insertion hole. There is also known a flexible printed circuit board connector connection structure in which a board abutting part wider than the exit width is formed on the FPC, and a contact part with approximately the same width as the exit width is formed at the end of the board abutting part of the FPC ( Patent Document 2).
特開２０１１－２０４３８７号公報Japanese Patent Application Publication No. 2011-204387 特開２００６－３１３７０３号公報Japanese Patent Application Publication No. 2006-313703
　本発明は、変形可能な回路基板と外部素子との電気的接続を安定化させる。 The present invention stabilizes the electrical connection between a deformable circuit board and external elements.
　前記課題を解決するために、請求項１に記載のコネクタ接続構造は、
　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造であって、
　ハウジングの基端部に形成された開口部の内面に前記外部素子と電気的に接続される外部接続端子の一端が露出し、前記導電性パターンの一端部は前記開口部に挿入されて前記外部接続端子の一端と電気的に導通するように接触保持された状態で前記回路基板の一面とは反対側の他面を覆うように形成された樹脂層が前記ハウジングと一体化されて固定されている、
　ことを特徴とする。 In order to solve the problem, a connector connection structure according to claim 1 is provided,
A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element,
One end of an external connection terminal electrically connected to the external element is exposed on the inner surface of an opening formed at the base end of the housing, and one end of the conductive pattern is inserted into the opening and connected to the external element. A resin layer formed to cover the other surface of the circuit board opposite to the one surface while being in electrically conductive contact with one end of the connection terminal is integrated and fixed with the housing. There is,
It is characterized by
　請求項２に記載の発明は、請求項１に記載のコネクタ接続構造において、
　前記樹脂層は、前記ハウジングと互いに相溶性を有する合成樹脂を材料とする、
　ことを特徴とする。 The invention according to claim 2 is the connector connection structure according to claim 1,
The resin layer is made of a synthetic resin that is compatible with the housing,
It is characterized by
　前記課題を解決するために、請求項３に記載のコネクタ接続構造は、
　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造であって、
　ハウジングの基端部に形成された開口部の内面に前記外部素子と電気的に接続される外部接続端子の一端が露出し、前記回路基板は前記一面とは反対側の他面が樹脂層で覆われた状態で前記導電性パターンの一端部が前記開口部に挿入されて前記外部接続端子の一端と電気的に導通するように接触保持されて固定されている、
　ことを特徴とする。 In order to solve the problem, the connector connection structure according to claim 3 includes:
A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element,
One end of an external connection terminal electrically connected to the external element is exposed on the inner surface of the opening formed at the base end of the housing, and the other surface of the circuit board opposite to the one surface is a resin layer. One end of the conductive pattern is inserted into the opening in a covered state, and is held and fixed in contact with one end of the external connection terminal so as to be electrically conductive.
It is characterized by
　前記課題を解決するために、請求項４に記載のコネクタ接続構造は、
　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造であって、
　前記導電性パターンの一端部が前記外部素子と電気的に接続される外部接続端子に形成された開口部に挿入されて前記外部接続端子と電気的に導通するように接触保持された状態で、前記回路基板の一面とは反対側の他面を覆うように形成される樹脂層が前記外部接続端子が露出するように前記端子を囲うハウジングと一体化されて固定されている、
　ことを特徴とする。 In order to solve the problem, the connector connection structure according to claim 4 includes:
A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element,
one end of the conductive pattern is inserted into an opening formed in an external connection terminal electrically connected to the external element and held in contact with the external connection terminal so as to be electrically conductive; A resin layer formed to cover the other surface opposite to the one surface of the circuit board is integrally fixed with a housing surrounding the terminal so that the external connection terminal is exposed.
It is characterized by
　請求項５に記載の発明は、請求項１ないし４のいずれか１項に記載のコネクタ接続構造において、
　前記回路基板は、前記導電性パターンの一端部が形成された領域の裏面側に前記一端部の曲げ変形を抑制する補強板が設けられている、
　ことを特徴とする。 The invention according to claim 5 is the connector connection structure according to any one of claims 1 to 4,
The circuit board is provided with a reinforcing plate for suppressing bending deformation of the one end on the back side of a region where the one end of the conductive pattern is formed.
It is characterized by
　前記課題を解決するために、請求項６に記載のコネクタ接続構造の製造方法は、
　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造の製造方法であって、
　基材を準備する工程と、
　前記基材上に前記導電性パターンを配置する工程と、
　ハウジングと外部接続端子からなるコネクタを準備する工程と、
　前記ハウジングの基端部に形成された開口部に前記導電性パターンの一端部を挿入して前記外部素子と電気的に接続される前記外部接続端子の一端と電気的に導通するように接触保持する工程と、
　前記一端部を接触保持した状態で前記回路基板の一面とは反対側の他面を覆い前記ハウジングと一体化される樹脂層を形成する工程と、を含む、
　ことを特徴とする。 In order to solve the problem, a method for manufacturing a connector connection structure according to claim 6 includes:
A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising:
a step of preparing a base material;
arranging the conductive pattern on the base material;
a step of preparing a connector consisting of a housing and an external connection terminal;
Inserting one end of the conductive pattern into an opening formed at the base end of the housing and maintaining contact so as to be electrically conductive with one end of the external connection terminal that is electrically connected to the external element. The process of
forming a resin layer that covers the other surface opposite to the one surface of the circuit board and is integrated with the housing while the one end portion is held in contact with the other surface;
It is characterized by
　前記課題を解決するために、請求項７に記載のコネクタ接続構造の製造方法は、
　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造の製造方法であって、
　基材を準備する工程と、
　前記基材上に前記導電性パターンを配置する工程と、
　ハウジングと外部接続端子からなるコネクタを準備する工程と、
　導電性パターンの一端部が形成された回路基板の前記一面とは反対側の他面を樹脂層で覆う工程と、
　前記ハウジングの基端部に形成された開口部に前記導電性パターンの一端部を挿入して前記外部素子と電気的に接続される前記外部接続端子の一端と電気的に導通するように接触保持して固定する工程と、を含む、
　ことを特徴とする。 In order to solve the problem, a method for manufacturing a connector connection structure according to claim 7 includes:
A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising:
a step of preparing a base material;
arranging the conductive pattern on the base material;
a step of preparing a connector consisting of a housing and an external connection terminal;
a step of covering the other surface of the circuit board opposite to the one surface on which one end portion of the conductive pattern is formed with a resin layer;
Inserting one end of the conductive pattern into an opening formed at the base end of the housing and maintaining contact so as to be electrically conductive with one end of the external connection terminal that is electrically connected to the external element. and fixing.
It is characterized by
　前記課題を解決するために、請求項８に記載のコネクタ接続構造の製造方法は、
　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造の製造方法であって、
　基材を準備する工程と、
　前記基材上に前記導電性パターンを配置する工程と、
　前記外部素子と電気的に接続される外部接続端子を準備する工程と、
　前記外部接続端子に形成された開口部に前記導電性パターンの一端部を挿入して前記外部接続端子と電気的に導通するように接触保持して接続する工程と、
　前記回路基板の一面とは反対側の他面を樹脂層で覆うとともに前記外部接続端子が露出するように前記端子を囲うハウジングを一体形成する工程と、を含む、
　ことを特徴とする。 In order to solve the problem, a method for manufacturing a connector connection structure according to claim 8 includes:
A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising:
a step of preparing a base material;
arranging the conductive pattern on the base material;
preparing an external connection terminal to be electrically connected to the external element;
a step of inserting one end of the conductive pattern into an opening formed in the external connection terminal and maintaining contact with the external connection terminal so as to be electrically conductive for connection;
a step of integrally forming a housing that covers the other surface opposite to the one surface of the circuit board with a resin layer and surrounds the terminal so that the external connection terminal is exposed;
It is characterized by
　請求項１に記載の発明によれば、変形可能な回路基板と外部素子との電気的接続を安定化させることができる。 According to the invention described in claim 1, it is possible to stabilize the electrical connection between the deformable circuit board and the external element.
　請求項２に記載の発明によれば、導電性パターンの一端部と外部接続端子の電気的接続を安定化させることができる。 According to the invention described in claim 2, it is possible to stabilize the electrical connection between one end of the conductive pattern and the external connection terminal.
　請求項３に記載の発明によれば、変形可能な回路基板と外部素子との電気的接続を容易に安定化させることができる。 According to the third aspect of the invention, the electrical connection between the deformable circuit board and the external element can be easily stabilized.
　請求項４に記載の発明によれば、変形可能な回路基板と外部素子を電気的に接続するコネクタを一体化することができる。 According to the invention set forth in claim 4, it is possible to integrate the deformable circuit board and the connector that electrically connects the external element.
　請求項５に記載の発明によれば、固定部材の抜けを抑制することができる。 According to the invention set forth in claim 5, it is possible to suppress the fixing member from coming off.
　請求項６に記載の発明によれば、固定部が金属の場合、コネクタを強固に固定することができる。 According to the invention described in claim 6, when the fixing portion is made of metal, the connector can be firmly fixed.
　請求項７に記載の発明によれば、変形可能な回路基板と外部素子との電気的接続を安定化させることができる。 According to the invention set forth in claim 7, it is possible to stabilize the electrical connection between the deformable circuit board and the external element.
　請求項８に記載の発明によれば、変形可能な回路基板と外部素子との電気的接続を安定化させることができる。 According to the invention set forth in claim 8, it is possible to stabilize the electrical connection between the deformable circuit board and the external element.
　請求項９に記載の発明によれば、変形可能な回路基板と外部素子との電気的接続を安定化させることができる。 According to the invention described in claim 9, it is possible to stabilize the electrical connection between the deformable circuit board and the external element.
図１Ａは第１実施形態に係るコネクタ接続構造を備えた回路基板の一例を示す平面模式図、図１Ｂは回路基板の一例を示す断面模式図である。FIG. 1A is a schematic plan view showing an example of a circuit board equipped with a connector connection structure according to the first embodiment, and FIG. 1B is a schematic cross-sectional view showing an example of the circuit board. 図２Ａは端子部の構成を示す平面模式図、図２Ｂは端子部の構成を示す断面模式図である。FIG. 2A is a schematic plan view showing the configuration of the terminal portion, and FIG. 2B is a schematic cross-sectional view showing the configuration of the terminal portion. 図３Ａはコネクタ部の構成を示す横断面模式図、図３Ｂはコネクタ部の構成を示す縦断面模式である。FIG. 3A is a schematic cross-sectional view showing the configuration of the connector portion, and FIG. 3B is a schematic vertical cross-sectional view showing the configuration of the connector portion. 第１実施形態に係るコネクタ接続構造を備えた回路基板の製造方法の概略の手順の一例を示すフローチャート図である。FIG. 2 is a flowchart diagram illustrating an example of a schematic procedure of a method for manufacturing a circuit board equipped with a connector connection structure according to the first embodiment. 第１実施形態に係るコネクタ接続構造を備えた回路基板の製造過程を説明するための回路基板の部分断面模式図である。FIG. 3 is a schematic partial cross-sectional view of a circuit board for explaining a manufacturing process of a circuit board equipped with a connector connection structure according to a first embodiment. 第２実施形態に係るコネクタ接続構造を備えた回路基板の製造過程を説明するための回路基板の部分断面模式図である。FIG. 7 is a schematic partial cross-sectional view of a circuit board for explaining a manufacturing process of a circuit board equipped with a connector connection structure according to a second embodiment. 第２実施形態に係るコネクタ接続構造を備えた回路基板の製造方法の概略の手順の一例を示すフローチャート図である。FIG. 7 is a flowchart diagram illustrating an example of a schematic procedure of a method for manufacturing a circuit board equipped with a connector connection structure according to a second embodiment. 第３実施形態に係るコネクタ接続構造を備えた回路基板の製造過程を説明するための回路基板の部分断面模式図である。FIG. 7 is a schematic partial cross-sectional view of a circuit board for explaining a manufacturing process of a circuit board equipped with a connector connection structure according to a third embodiment. 第３実施形態に係るコネクタ接続構造を備えた回路基板の製造方法の概略の手順の一例を示すフローチャート図である。FIG. 7 is a flowchart diagram illustrating an example of a schematic procedure of a method for manufacturing a circuit board equipped with a connector connection structure according to a third embodiment.
　次に図面を参照しながら、本発明の実施形態の具体例を説明するが、本発明は以下の実施形態に限定されるものではない。
　尚、以下の図面を使用した説明において、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることに留意すべきであり、理解の容易のために説明に必要な部材以外の図示は適宜省略されている。 Next, specific examples of embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.
In the explanation using the drawings below, it should be noted that the drawings are schematic and the proportions of each dimension may differ from the actual ones. Illustrations of parts other than members are omitted as appropriate.
　「第１実施形態」
　（１）コネクタ接続構造の全体構成
　図１Ａは第１実施形態に係るコネクタ接続構造を備えた回路基板１の一例を示す平面模式図、図１Ｂは回路基板１の一例を示す断面模式図、図２Ａは端子部５の構成を示す平面模式図、図２Ｂは端子部５の構成を示す断面模式図、図３Ａはコネクタ部６の構成を示す横断面模式図、図３Ｂはコネクタ部６の構成を示す縦断面模式、図３Ｃはコネクタ部６と端子部５の接続を示す図である。
　以下、図面を参照しながら、第１実施形態に係るコネクタ接続構造の構成について説明する。 "First embodiment"
(1) Overall configuration of connector connection structure FIG. 1A is a schematic plan view showing an example of a circuit board 1 equipped with the connector connection structure according to the first embodiment, and FIG. 1B is a schematic cross-sectional view showing an example of the circuit board 1. 2A is a schematic plan view showing the structure of the terminal part 5, FIG. 2B is a schematic cross-sectional view showing the structure of the terminal part 5, FIG. 3A is a schematic cross-sectional view showing the structure of the connector part 6, and FIG. 3B is a schematic cross-sectional view showing the structure of the connector part 6. 3C is a diagram showing the connection between the connector part 6 and the terminal part 5. FIG.
Hereinafter, the configuration of the connector connection structure according to the first embodiment will be described with reference to the drawings.
　本実施形態においては、コネクタ接続構造の一例として実装部品４が基材２上に配置された導電性パターン３と電気的に接合された回路基板１の構成について説明する。
　回路基板１は、図１に示すように、変形可能な基材２と、基材２の一面２ａに配置された導電性パターン３と、基材２上に設けられ、導電性パターン３と電気的に接合された実装部品４と、導電性パターン３の一端部に複数のコネクタ接続パッド３Ａａが形成された端子部５と、端子部５が電気的に導通するように接触保持された状態で外部素子と電気的に接続されるコネクタ部６と、基材２の一面２ａとは反対側の他面２ｂを覆いコネクタ部６のハウジング６２と一体化されるように形成された樹脂層７と、を備えて構成されている。 In this embodiment, as an example of a connector connection structure, a configuration of a circuit board 1 in which a mounting component 4 is electrically connected to a conductive pattern 3 arranged on a base material 2 will be described.
As shown in FIG. 1, the circuit board 1 includes a deformable base material 2, a conductive pattern 3 disposed on one surface 2a of the base material 2, and an electrically conductive pattern 3 provided on the base material 2. The mounted component 4 that has been electrically connected to the terminal portion 5 having a plurality of connector connection pads 3Aa formed on one end of the conductive pattern 3 is held in contact with the terminal portion 5 so as to be electrically conductive. A connector part 6 electrically connected to an external element, and a resin layer 7 formed to cover the other surface 2b opposite to the one surface 2a of the base material 2 and to be integrated with the housing 62 of the connector part 6. It is configured with the following.
　（基材）
  本実施形態における基材２は、合成樹脂材料からなり変形可能な絶縁性のフィルム状の基材である。ここで、「変形可能な基材」は、導電性パターン３を配置後に変形できる、すなわち、熱成形、真空成形または圧空成形によって実質的に平坦な２次元形状から実質的に立体的な３次元形状に変形することができる基材を意味する。 (Base material)
The base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material. Here, the "deformable base material" is one that can be deformed after the conductive pattern 3 is disposed, that is, from a substantially flat two-dimensional shape to a substantially three-dimensional three-dimensional shape by thermoforming, vacuum forming, or pressure forming. Refers to a substrate that can be deformed into a shape.
  基材２の材質としては、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）などのポリエステル、ナイロン６－１０、ナイロン４６などのポリアミド（ＰＡ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、アクリルブタジエンスチレン（ＡＢＳ）、ポリメチルメタクリレート（ＰＭＭＡ）、ポリ塩化ビニル（ＰＶＣ）などの熱可塑性樹脂が挙げられる。
　特にポリエステルがより好ましく、さらにその中でもポリエチレンテレフタレート（ＰＥＴ）が経済性、電気絶縁性、耐薬品性等のバランスが良く最も好ましい。 Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides (PA) such as nylon 6-10 and nylon 46, polyetheretherketone (PEEK), and acrylic butadiene styrene ( Examples include thermoplastic resins such as ABS), polymethyl methacrylate (PMMA), and polyvinyl chloride (PVC).
In particular, polyester is more preferred, and among these, polyethylene terephthalate (PET) is most preferred because of its good balance of economical efficiency, electrical insulation properties, chemical resistance, etc.
　基材２の一面２ａには、金属ナノ粒子等の触媒インクを均一に塗布するために、表面処理を施すことが好ましい。表面処理としては、例えば、コロナ処理、プラズマ処理、溶剤処理、プライマー処理等を用いることができる。 It is preferable to perform a surface treatment on one surface 2a of the base material 2 in order to uniformly apply catalyst ink such as metal nanoparticles. As the surface treatment, for example, corona treatment, plasma treatment, solvent treatment, primer treatment, etc. can be used.
　（導電性パターン）
　基材２の一面２ａに導電性パターン３を配置する場合、さきに、金属めっき成長のきっかけとなる金属ナノ粒子等の触媒からなる下地層（不図示）を所定のパターン状に形成する。下地層は、基材２上に金属ナノ粒子等の触媒インクを塗布したあと、乾燥および焼成を行うことにより形成する。 (conductive pattern)
When disposing the conductive pattern 3 on one surface 2a of the base material 2, first, a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers the growth of metal plating is formed in a predetermined pattern. The base layer is formed by applying catalyst ink such as metal nanoparticles onto the base material 2, followed by drying and firing.
  下地層の厚み（μｍ）は、０．１～２０μｍが好ましく、０．２～５μｍがさらに好ましく、０．５～２μｍが最も好ましい。下地層が薄すぎると、下地層の強度が低下するおそれがある。また、下地層が厚すぎると、金属ナノ粒子は通常の金属よりも高価であるため、製造コストが増大する虞がある。 The thickness (μm) of the base layer is preferably 0.1 to 20 μm, more preferably 0.2 to 5 μm, and most preferably 0.5 to 2 μm. If the base layer is too thin, the strength of the base layer may decrease. Furthermore, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.
  触媒粒子の材料としては、金、銀、銅、パラジウム、ニッケルなどが用いられ、導電性の観点から金、銀、銅が好ましく、金、銀に比べて安価な銅が最も好ましい。 As the material for the catalyst particles, gold, silver, copper, palladium, nickel, etc. are used, and gold, silver, and copper are preferred from the viewpoint of electrical conductivity, and copper, which is cheaper than gold and silver, is most preferred.
 　触媒粒子の粒子径（ｎｍ）は１～５００ｎｍが好ましく、１０～１００ｎｍがより好ましい。粒子径が小さすぎる場合、粒子の反応性が高くなりインクの保存性・安定性に悪影響を与える虞がある。粒子径が大きすぎる場合、薄膜の均一形成が困難になるとともに、インクの粒子の沈殿が起こりやすくなる虞がある。 The particle diameter (nm) of the catalyst particles is preferably 1 to 500 nm, more preferably 10 to 100 nm. If the particle size is too small, the reactivity of the particles may increase, which may adversely affect the storage life and stability of the ink. If the particle size is too large, it will be difficult to form a thin film uniformly, and there is a possibility that precipitation of ink particles will occur more easily.
  導電性パターン３は、下地層の上に電解めっきまたは無電解めっきにより形成される。めっき金属としては、銅、ニッケル、錫、銀、金などを用いることができるが、伸長性、導電性および価格の観点から銅を用いることが最も好ましい。 · The conductive pattern 3 is formed on the base layer by electroplating or electroless plating. Copper, nickel, tin, silver, gold, etc. can be used as the plating metal, but it is most preferable to use copper from the viewpoints of elongation, conductivity, and cost.
  めっき層の厚さ（μｍ）は、０．０３～１００μｍが好ましく、１～３５μｍがより好ましく、３～１８μｍが最も好ましい。めっき層が薄すぎると、機械的強度が不足するとともに、導電性が実用上十分に得られない虞がある。めっき層が厚すぎると、めっきに必要な時間が長くなり、製造コストが増大する虞がある。 The thickness (μm) of the plating layer is preferably 0.03 to 100 μm, more preferably 1 to 35 μm, and most preferably 3 to 18 μm. If the plating layer is too thin, there is a risk that the mechanical strength will be insufficient and that sufficient electrical conductivity will not be obtained for practical use. If the plating layer is too thick, the time required for plating may increase, leading to an increase in manufacturing costs.
　（実装部品）
　導電性パターン３には、複数の実装部品４が取り付けられている。実装部品４は、本体部４ａと、導電性パターン３の接続パッド３ａに電気的に接合される端子部４ｂからなる。
　実装部品４としては、制御回路、歪み、抵抗、静電容量、ＴＩＲなどの接触感知、および光検出部品、圧電アクチュエータまたは振動モータなどの触知部品または振動部品、ＬＥＤなどの発光部品、マイクおよびスピーカーなどの発音または受音、メモリチップ、プログラマブルロジックチップおよびＣＰＵなどのデバイス操作部品、デジタル信号プロセッサ（ＤＳＰ）、ＡＬＳデバイス、ＰＳデバイス、処理デバイス、ＭＥＭＳ等が挙げられる。 (Mounting parts)
A plurality of mounting components 4 are attached to the conductive pattern 3. The mounted component 4 includes a main body portion 4a and a terminal portion 4b electrically connected to the connection pad 3a of the conductive pattern 3.
Mounted components 4 include control circuits, distortion, resistance, capacitance, touch sensing components such as TIR, photodetection components, tactile components or vibration components such as piezoelectric actuators or vibration motors, light emitting components such as LEDs, microphones, and Examples include sound producing or sound receiving devices such as speakers, memory chips, programmable logic chips, device operating parts such as CPUs, digital signal processors (DSP), ALS devices, PS devices, processing devices, MEMS, and the like.
　（端子部）
　端子部５は、基材２上に配置された導電性パターン３から一体に延びる導電性パターン３Ａを備えており、その導電性パターン３Ａに複数のコネクタ接続パッド３Ａａが形成されている。コネクタ接続パッド３Ａａは、コネクタ部６の外部接続端子６１のアンカー部６１ｂに電気的に導通している。
　端子部５は、裏面がコネクタ接続パッド３Ａａ付近の領域において、図２に示すように、補強板５１により裏打ちされている。補強板５１は、例えばプラスチック等の絶縁材料から成り、端子部５の裏面に密着して取り付けられ、端子部５の剛性を高め曲げ変形を抑制している。 (terminal part)
The terminal portion 5 includes a conductive pattern 3A extending integrally from the conductive pattern 3 disposed on the base material 2, and a plurality of connector connection pads 3Aa are formed on the conductive pattern 3A. The connector connection pad 3Aa is electrically connected to the anchor portion 61b of the external connection terminal 61 of the connector portion 6.
As shown in FIG. 2, the back surface of the terminal portion 5 is lined with a reinforcing plate 51 in a region near the connector connection pad 3Aa. The reinforcing plate 51 is made of an insulating material such as plastic, and is attached in close contact with the back surface of the terminal portion 5 to increase the rigidity of the terminal portion 5 and suppress bending deformation.
　（コネクタ部）
　コネクタ部６は、図３（ａ）に示すように、端子部５のコネクタ接続パッド３Ａａと電気的に接続され外部に設けられた外部素子と電気的に接続するための外部接続端子６１と、外部接続端子６１を保持するハウジング６２とを備える。 (Connector part)
As shown in FIG. 3(a), the connector part 6 includes an external connection terminal 61 that is electrically connected to the connector connection pad 3Aa of the terminal part 5 and electrically connected to an external element provided outside. A housing 62 that holds an external connection terminal 61 is provided.
　外部接続端子６１は、例えば、銅の合金などを用いて四角柱形状に形成されている。なお外部接続端子６１は、一例として、表面にニッケルメッキを施し、そのニッケルメッキの上に、金（ＡＵ）、錫（Ｓｎ）などの金属やそれら金属を含む合金などのメッキが施されても良い。外部接続端子６１のピッチは、接続先である外部素子のコネクタの規格に応じている。外部接続端子６１は、コネクタ端子部６１ａと、コネクタ接続パッド３Ａａと接合されるアンカー部６１ｂとからなる。 The external connection terminal 61 is formed into a square prism shape using, for example, a copper alloy. For example, the external connection terminal 61 may be plated with nickel on its surface, and plated with a metal such as gold (AU), tin (Sn), or an alloy containing these metals on top of the nickel plating. good. The pitch of the external connection terminals 61 corresponds to the standard of the connector of the external element to which they are connected. The external connection terminal 61 includes a connector terminal portion 61a and an anchor portion 61b joined to the connector connection pad 3Aa.
　ハウジング６２は、図３に示すように、基端部に開口部６３が形成されている。開口部６３では外部接続端子６１のアンカー部６１ｂが開口部６３内に露出し、図３（ｃ）に示すように、端子部５が挿入されることで、端子部５のコネクタ接続パッド３Ａａが外部接続端子６１のアンカー部６１ｂと接触保持した状態で電気的に導通する。
　そして、樹脂層７が基材２の一面２ａとは反対側の他面２ｂを覆うとともにコネクタ部６のハウジング６２と一体化されることで端子部５とコネクタ部６が電気的に導通した状態で固定される。 As shown in FIG. 3, the housing 62 has an opening 63 formed at its base end. In the opening 63, the anchor part 61b of the external connection terminal 61 is exposed in the opening 63, and as shown in FIG. 3(c), the connector connection pad 3Aa of the terminal part 5 is inserted. The anchor portion 61b of the external connection terminal 61 is electrically connected to the anchor portion 61b while being in contact with the anchor portion 61b.
Then, the resin layer 7 covers the other surface 2b opposite to the one surface 2a of the base material 2 and is integrated with the housing 62 of the connector section 6, so that the terminal section 5 and the connector section 6 are electrically connected. is fixed.
　（樹脂層）
　樹脂層７は、基材２の一面２ａとは反対側の他面２ｂを覆いコネクタ部６のハウジング６２と一体化されるように形成されている。
　このように基材２の一面を覆うとともにハウジング６２と一体化される樹脂層７は、ハウジング６２と互いに相溶性を有し、射出成形可能な熱可塑性樹脂である。具体的には、ハウジング６２が、ポリカーボネート（ＰＣ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリメチルメタクリレート（ＰＭＭＡ）、ポリアミド（ＰＡ）、アクリルブタジエンスチレン（ＡＢＳ）、ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、変性ポリフェニレンエーテル（ｍ－ＰＰＥ）、変性ポリフェニレンオキサイト（ｍ－ＰＰＯ）、シクロオレフィンコポリマー（ＣＯＣ）、シクロオレフィンポリマー（ＣＯＰ）、ポリテトラフルオロエチレン（ＰＴＦＥ）、ポリ塩化ビニル（ＰＶＣ）、またはこれらの混合物を含む熱可塑性樹脂である場合、これらと相溶性がある樹脂材料を用いることが好ましい。
　特に、ハウジング６２が、電気特性に優れるポリブチレンテレフタレート（ＰＢＴ）で形成されている場合、ポリブチレンテレフタレート（ＰＢＴ）と相溶性の高いポリエステル系樹脂を用いることが好ましい。ポリエステル系樹脂としては、分子構造中のアルコール由来の残基にトリメチレン残基、ペンテン残基、ネオペンテン残基、ヘキセン残基等の脂肪族残基、シクロヘキサンジメチレン残基、シクロヘキセン残基、シクロペンテン残基等の脂環族残基を含む樹脂が好ましい。 (resin layer)
The resin layer 7 is formed to cover the other surface 2b of the base material 2 opposite to the one surface 2a, and to be integrated with the housing 62 of the connector section 6.
The resin layer 7 that covers one surface of the base material 2 and is integrated with the housing 62 is a thermoplastic resin that is mutually compatible with the housing 62 and can be injection molded. Specifically, the housing 62 is made of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified Polyphenylene ether (m-PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or these In the case of a thermoplastic resin containing a mixture, it is preferable to use a resin material that is compatible with these.
In particular, when the housing 62 is made of polybutylene terephthalate (PBT), which has excellent electrical properties, it is preferable to use a polyester resin that is highly compatible with polybutylene terephthalate (PBT). Polyester resins include alcohol-derived residues in the molecular structure, aliphatic residues such as trimethylene residues, pentene residues, neopentene residues, and hexene residues, cyclohexane dimethylene residues, cyclohexene residues, and cyclopentene residues. Resins containing alicyclic residues such as groups are preferred.
　（２）コネクタ接続構造の製造方法
　図４は第１実施形態に係るコネクタ接続構造を備えた回路基板１の製造方法の概略の手順の一例を示すフローチャート図、図５は第１実施形態に係るコネクタ接続構造を備えた回路基板１の製造過程を説明するための回路基板１の部分断面模式図である。 (2) Manufacturing method of connector connection structure FIG. 4 is a flowchart diagram showing an example of a schematic procedure of a method for manufacturing the circuit board 1 equipped with the connector connection structure according to the first embodiment, and FIG. 5 is a flow chart diagram according to the first embodiment. FIG. 2 is a schematic partial cross-sectional view of the circuit board 1 for explaining the manufacturing process of the circuit board 1 provided with the connector connection structure.
　回路基板１は、基材２の準備工程Ｓ１１と、基材２上に導電性パターン３を配置する配線用めっき工程Ｓ１２と、外部接続端子６１とハウジング６２からなるコネクタ部６を準備する工程Ｓ１３と、ハウジング６２の基端部に形成された開口部６３にコネクタ接続パッド３Ａａが形成された端子部５を挿入して外部接続端子６１のアンカー部６１ｂと電気的に導通するように接触保持する接続工程Ｓ１４と、端子部５を接触保持した状態で基材２の一面２ａとは反対側の他面２ｂを覆いハウジング６２と一体化される樹脂層７を形成する工程Ｓ１５と、を経て製造される。 The circuit board 1 is manufactured through a step S11 of preparing the base material 2, a wiring plating step S12 of arranging the conductive pattern 3 on the base material 2, and a step S13 of preparing the connector part 6 consisting of the external connection terminals 61 and the housing 62. Then, the terminal part 5 on which the connector connection pad 3Aa is formed is inserted into the opening 63 formed at the base end of the housing 62 and held in contact with the anchor part 61b of the external connection terminal 61 so as to be electrically conductive. Manufactured through a connecting step S14 and a step S15 of forming a resin layer 7 that covers the other surface 2b opposite to the one surface 2a of the base material 2 and is integrated with the housing 62 while holding the terminal portion 5 in contact with each other. be done.
　（基材の準備工程Ｓ１１）
　基材の準備工程Ｓ１１においては、まず、所定の形状及び大きさに形成された実質的に平坦なフィルム状の基材２に導電性パターン３を配置するために、基材２上に金属めっき成長のきっかけとなる金属ナノ粒子等の触媒粒子からなる下地層を所定のパターン状に形成する。尚、基材２には、金属ナノ粒子等の触媒粒子からなる触媒インクを均一に塗布するために、例えば、コロナ処理、プラズマ処理、溶剤処理、プライマー処理等の表面処理を施すことが好ましい。 (Base material preparation step S11)
In the base material preparation step S11, first, metal plating is performed on the base material 2 in order to arrange the conductive pattern 3 on the substantially flat film-like base material 2 formed in a predetermined shape and size. A base layer made of catalyst particles such as metal nanoparticles that triggers growth is formed in a predetermined pattern. In order to uniformly apply the catalyst ink made of catalyst particles such as metal nanoparticles to the base material 2, it is preferable to perform a surface treatment such as corona treatment, plasma treatment, solvent treatment, or primer treatment.
　基材２上に金属ナノ粒子等の触媒粒子からなる触媒インクを塗布する方法としては、インクジェット印刷方式、シルクスクリーン印刷方式、グラビア印刷方式、オフセット印刷方式、フレキソ印刷方式、ローラーコーター方式、刷毛塗り方式、スプレー方式、ナイフジェットコーター方式、パッド印刷方式、グラビアオフセット印刷方式、ダイコーター方式、バーコーター方式、スピンコーター方式、コンマコーター方式、含浸コーター方式、ディスペンサー方式、メタルマスク方式が挙げられるが、本実施形態においてはインクジェット印刷方式を用いている。 Methods for applying catalyst ink made of catalyst particles such as metal nanoparticles onto the substrate 2 include inkjet printing, silk screen printing, gravure printing, offset printing, flexo printing, roller coater, and brush coating. Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method. In this embodiment, an inkjet printing method is used.
　具体的には、１０００ｃｐｓ以下、例えば、２ｃｐｓから３０ｃｐｓの低粘度の触媒インクをインクジェット印刷方式で塗布した後、溶媒を揮発させ金属ナノ粒子のみを残す。その後、溶媒を除去し（乾燥）、金属ナノ粒子を焼結させる（焼成）。
　焼成温度は、１００°Ｃ～３００°Ｃが好ましく、１５０°Ｃ～２００°Ｃがより好ましい。焼成温度が低すぎると、金属ナノ粒子同士の焼結が不十分となるとともに、金属ナノ粒子以外の成分が残ることで、密着性が得られない虞がある。また、焼成温度が高すぎると、基材２の劣化や歪みが発生する虞がある。 Specifically, after applying a catalyst ink with a low viscosity of 1000 cps or less, for example, 2 cps to 30 cps using an inkjet printing method, the solvent is evaporated to leave only the metal nanoparticles. Thereafter, the solvent is removed (drying) and the metal nanoparticles are sintered (calcination).
The firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the firing temperature is too low, the metal nanoparticles will not be sufficiently sintered with each other, and components other than the metal nanoparticles will remain, so there is a risk that adhesion may not be obtained. Furthermore, if the firing temperature is too high, there is a risk that the base material 2 will deteriorate or become distorted.
　（配線用めっき工程Ｓ１２）
　基材２上に形成された下地層に対し、電解めっきまたは無電解めっきを行うことにより、下地層の表面および内部にめっき金属を析出させ導電性パターン３及びコネクタ接続パッド３Ａａを配置する（図５Ａ　参照）。めっき方法は公知のめっき液およびめっき処理と同様であり、具体的に無電解銅めっき、電解銅めっきが挙げられる。 (Wiring plating step S12)
By performing electrolytic plating or electroless plating on the base layer formed on the base material 2, plating metal is deposited on the surface and inside of the base layer, and the conductive pattern 3 and the connector connection pad 3Aa are arranged (Fig. (See 5A). The plating method is similar to known plating solutions and plating treatments, and specific examples include electroless copper plating and electrolytic copper plating.
　（コネクタ部の準備工程Ｓ１３）
　コネクタ部６の準備工程Ｓ１３においては、外部接続端子６１をハウジング６２にインサート成形してコネクタ部６を作成する。
　外部接続端子６１は金属板部材を板厚方向に屈曲して所定の形状に形成される。本実施形態においては、コネクタ部６の外部素子との接続方向に応じて、図５Ｂに示すように、挿抜方向が回路基板１の実装面に沿ったライトアングルタイプ、接続した端子部５が回路基板１の実装面に対し直交方向に引き出されるストレートアングルタイプのいずれかの形状で形成される。 (Connector part preparation step S13)
In the preparation step S13 for the connector section 6, the external connection terminal 61 is insert-molded into the housing 62 to create the connector section 6.
The external connection terminal 61 is formed into a predetermined shape by bending a metal plate member in the thickness direction. In this embodiment, depending on the connection direction of the connector part 6 with the external element, as shown in FIG. It is formed in any straight angle type shape that is drawn out in a direction perpendicular to the mounting surface of the board 1.
　ハウジング６２は、基端部に端子部５が挿入される開口部６３が形成される。開口部６３は、その内側に外部接続端子６１の屈曲したアンカー部６１ｂが露出するように形成され、開口部６３に挿入される端子部５のコネクタ接続パッド３Ａａが接触して電気的に導通する。
　ハウジング６２は、射出成形可能な熱可塑性樹脂材料で形成される。熱可塑性樹脂材料としては、特に限定されないが、電気特性に優れるポリブチレンテレフタレート（ＰＢＴ）が好ましい。 The housing 62 has an opening 63 formed at its base end into which the terminal portion 5 is inserted. The opening 63 is formed so that the bent anchor part 61b of the external connection terminal 61 is exposed inside the opening 63, and the connector connection pad 3Aa of the terminal part 5 inserted into the opening 63 comes into contact with it to establish electrical continuity. .
Housing 62 is formed from an injection moldable thermoplastic material. The thermoplastic resin material is not particularly limited, but polybutylene terephthalate (PBT), which has excellent electrical properties, is preferred.
　（接続工程Ｓ１４）
　端子部５の接続工程Ｓ１４においては、まず、端子部５のコネクタ接続パッド３Ａａ付近の裏面に補強板５１を取り付ける。補強板５１は、例えば接着剤、粘着剤あるいは両面テープ等の固定部材により取り付けられる。
　そして、補強板５１が取り付けられて曲げ剛性が向上した端子部５をハウジング６２の開口部６３に挿入してコネクタ接続パッド３Ａａが開口部６３の内側で露出した外部接続端子６１のアンカー部６１ｂと接触して電気的に導通した状態で保持する（図５Ｃ　参照）。 (Connection process S14)
In the connection step S14 of the terminal portion 5, first, the reinforcing plate 51 is attached to the back surface of the terminal portion 5 near the connector connection pad 3Aa. The reinforcing plate 51 is attached using a fixing member such as adhesive, pressure-sensitive adhesive, or double-sided tape.
Then, the terminal part 5 with the reinforcing plate 51 attached and the bending rigidity improved is inserted into the opening 63 of the housing 62, and the connector connection pad 3Aa is connected to the anchor part 61b of the external connection terminal 61 exposed inside the opening 63. and maintain electrical continuity in contact (see Figure 5C).
　（樹脂層形成工程Ｓ１５）
　樹脂層形成工程Ｓ１５では、まず、基材２の導電性パターン３が配置された一面２ａとは反対側の他面２ｂに基材２と樹脂層７の樹脂素材の組み合わせに応じてバインダーインクを塗布して接着層（不図示）を形成する。また、ハウジング６２が樹脂層７と接するハウジング６２の端面６２ａにもバインダーインク（不図示）を塗布する。バインダーインクは、接着性樹脂を含み、スクリーン印刷、インクジェット印刷、スプレーコート、筆塗り等で塗布され、射出成形される樹脂層７と基材２及びハウジング６２との接着性を向上させる。 (Resin layer forming step S15)
In the resin layer forming step S15, first, a binder ink is applied to the other surface 2b of the substrate 2 opposite to the one surface 2a on which the conductive pattern 3 is arranged according to the combination of the resin materials of the substrate 2 and the resin layer 7. An adhesive layer (not shown) is formed by coating. Furthermore, binder ink (not shown) is also applied to the end surface 62a of the housing 62 where the housing 62 contacts the resin layer 7. The binder ink contains an adhesive resin, is applied by screen printing, inkjet printing, spray coating, brush painting, etc., and improves the adhesion between the resin layer 7 to be injection molded, the base material 2, and the housing 62.
　次にコネクタ部６に端子部５が挿入された回路基板１を金型Ｋに位置決めしてセットした状態（図５Ｄ　参照）で金型Ｋを閉じて樹脂をキャビティＣＡ１に充填する。キャビティＣＡ１に充填された樹脂により、基材２の他面２ｂを覆いコネクタ部６のハウジング６２と一体化される樹脂層７が形成される。 Next, with the circuit board 1 with the terminal part 5 inserted into the connector part 6 positioned and set in the mold K (see FIG. 5D), the mold K is closed and the cavity CA1 is filled with resin. The resin filled in the cavity CA1 forms a resin layer 7 that covers the other surface 2b of the base material 2 and is integrated with the housing 62 of the connector section 6.
　次に、実装部品４を、端子部４ｂを導電性パターン３の接続パッド３ａ上に位置決めして固定状態で端子部４ｂと接続パッド３ａとをはんだで電気的に接合する。
　実装部品４の端子部４ｂと導電性パターン３の接続パッド３ａとの接合には、レーザー光を用いたレーザーはんだ付けや光焼成はんだ付けを用いてもよい。レーザーはんだ付けは、はんだ付け装置のはんだ付けヘッドからレーザー光を照射し、回路基板１の微細な部位に実装部品４を短時間で実装することができるという利点がある。また、電気的接合を行いたい部分に選択的にレーザー光を照射することができるため、フロー式やリフロー式と比較して、実装部品４の実装時に、部品全体に熱を加えずに実装を行うことが可能となる。 Next, the terminal portion 4b of the mounted component 4 is positioned on the connection pad 3a of the conductive pattern 3, and the terminal portion 4b and the connection pad 3a are electrically joined with solder in a fixed state.
For joining the terminal portion 4b of the mounted component 4 and the connection pad 3a of the conductive pattern 3, laser soldering using laser light or photobaking soldering may be used. Laser soldering has the advantage of being able to radiate laser light from the soldering head of a soldering device and to mount components 4 on minute parts of circuit board 1 in a short time. In addition, since the laser beam can be selectively irradiated to the part where electrical bonding is desired, compared to the flow method or reflow method, the mounting component 4 can be mounted without applying heat to the entire component. It becomes possible to do so.
　以上で、回路基板１の組立が完了する（図１Ｂ　参照）。この場合、変形可能な回路基板１の端子部５は、基材２と一体に形成されたコネクタ部６に挿入されてコネクタ接続パッド３Ａａが外部接続端子６１と接触保持されているので、回路基板１と外部素子との電気的接続を安定化させることができる。 With the above steps, assembly of the circuit board 1 is completed (see FIG. 1B). In this case, the terminal portion 5 of the deformable circuit board 1 is inserted into the connector portion 6 formed integrally with the base material 2, and the connector connection pad 3Aa is held in contact with the external connection terminal 61, so that the circuit board The electrical connection between 1 and external elements can be stabilized.
　「第２実施形態」
　　図６は第２実施形態に係るコネクタ接続構造を備えた回路基板１Ａの製造過程を説明するための回路基板１Ａの部分断面模式図である。
　以下、図面を参照しながら、第２実施形態に係るコネクタ接続構造について説明する。 “Second embodiment”
FIG. 6 is a schematic partial cross-sectional view of the circuit board 1A for explaining the manufacturing process of the circuit board 1A provided with the connector connection structure according to the second embodiment.
Hereinafter, a connector connection structure according to a second embodiment will be described with reference to the drawings.
　（１）回路基板１Ａの構成
　回路基板１Ａは、変形可能な基材２と、基材２の一面２ａに配置された導電性パターン３と、基材２上に設けられ、導電性パターン３と電気的に接合された実装部品４と、導電性パターン３の一端に基材２の一面２ａとは反対側の他面２ｂが樹脂層７で覆われた状態で複数のコネクタ接続パッド３Ａａが形成された端子部５と、端子部５が電気的に導通するように接触保持され外部素子と電気的に接続されるコネクタ部６と、を備えて構成されている。 (1) Structure of Circuit Board 1A The circuit board 1A is configured to include a deformable base material 2, a conductive pattern 3 arranged on one surface 2a of the base material 2, a mounted component 4 provided on the base material 2 and electrically joined to the conductive pattern 3, a terminal portion 5 having a plurality of connector connection pads 3Aa formed at one end of the conductive pattern 3 with the other surface 2b of the base material 2 opposite to the one surface 2a being covered with a resin layer 7, and a connector portion 6 that is held in contact with the terminal portion 5 so as to be electrically conductive and is electrically connected to an external element.
　すなわち、第２実施形態に係るコネクタ接続構造を備えた回路基板１Ａは、導電性パターン３の一端に複数のコネクタ接続パッド３Ａａが形成された端子部５が基材２の一面２ａとは反対側の他面２ｂを樹脂層７で覆われた状態でコネクタ部６の開口部６３に挿入されて電気的に導通するように接触保持されている点で、第１実施形態に係るコネクタ接続構造を備えた回路基板１と相違している。したがって、第１実施形態との共通部分については同一の符号を付してその詳細な説明は省略する。 That is, in the circuit board 1A having the connector connection structure according to the second embodiment, the terminal portion 5 in which the plurality of connector connection pads 3Aa are formed at one end of the conductive pattern 3 is located on the side opposite to the one surface 2a of the base material 2. The connector connection structure according to the first embodiment is different from the connector connection structure according to the first embodiment in that the other surface 2b is inserted into the opening 63 of the connector part 6 with the other surface 2b covered with the resin layer 7 and held in contact so as to be electrically conductive. This is different from the circuit board 1 provided. Therefore, the same reference numerals are given to the common parts with the first embodiment, and detailed explanation thereof will be omitted.
　端子部５は、導電性パターン３の一端に複数のコネクタ接続パッド３Ａａが形成されている。端子部５のコネクタ接続パッド３Ａａ付近の領域の裏面には補強板５１が取り付けられ、端子部５の剛性を高めて曲げ変形を抑制している。
　図６Ａに示すように、端子部５の裏面となる基材２の一面２ａとは反対側の他面２ｂは、コネクタ部６の開口部６３への挿入範囲を除いて樹脂層７で覆われ、回路基板１Ａとして剛性が高められている。 In the terminal portion 5, a plurality of connector connection pads 3Aa are formed at one end of the conductive pattern 3. A reinforcing plate 51 is attached to the back surface of the area of the terminal portion 5 near the connector connection pad 3Aa, increasing the rigidity of the terminal portion 5 and suppressing bending deformation.
As shown in FIG. 6A, the other surface 2b of the base material 2, which is the back surface of the terminal portion 5 and which is opposite to the one surface 2a, is covered with the resin layer 7 except for the area where the connector portion 6 is inserted into the opening 63. , the rigidity of the circuit board 1A is increased.
　コネクタ部６は、外部に設けられた外部素子と電気的に接続するための外部接続端子６１と、外部接続端子６１を保持するハウジング６２とを備える。
　ハウジング６２は、基端部に開口部６３が形成されている。図６Ｂに示すように、開口部６３では外部接続端子６１のアンカー部６１ｂが開口部６３内に露出し、端子部５が挿入されることで、端子部５のコネクタ接続パッド３Ａａが外部接続端子６１のアンカー部６１ｂと接触保持した状態で電気的に導通する。端子部５は、裏面が補強板５１で補強され、開口部６３への挿入範囲を除いて樹脂層７で覆われて剛性が高められコネクタ部６との接続が強固になっている。 The connector section 6 includes an external connection terminal 61 for electrically connecting to an external element provided outside, and a housing 62 that holds the external connection terminal 61.
The housing 62 has an opening 63 formed at its base end. As shown in FIG. 6B, in the opening 63, the anchor part 61b of the external connection terminal 61 is exposed in the opening 63, and when the terminal part 5 is inserted, the connector connection pad 3Aa of the terminal part 5 becomes the external connection terminal. It is electrically conductive while being in contact with the anchor portion 61b of 61. The terminal portion 5 has its back surface reinforced with a reinforcing plate 51, and is covered with a resin layer 7 except for the area where it is inserted into the opening 63, increasing its rigidity and making the connection with the connector portion 6 strong.
　（２）回路基板１Ａの製造方法
　図７は第２実施形態に係るコネクタ接続構造を備えた回路基板１Ａの製造方法の概略の手順の一例を示すフローチャート図である。
　回路基板１Ａは、基材２の準備工程Ｓ２１と、基材２上に導電性パターン３を配置する配線用めっき工程Ｓ２２と、外部接続端子６１とハウジング６２からなるコネクタ部６を準備する工程Ｓ２３と、導電性パターン３の一端に端子部５が形成された基材２の一面２ａとは反対側の他面２ｂを樹脂層７で覆う工程Ｓ２４と、ハウジング６２の基端部に形成された開口部６３に端子部５を挿入して外部素子と電気的に接続される外部接続端子６１のアンカー部６１ｂと電気的に導通するように接触保持して固定する接続工程Ｓ２５と、を経て製造される。 (2) Method of manufacturing the circuit board 1A FIG. 7 is a flowchart showing an example of a schematic procedure of a method of manufacturing the circuit board 1A provided with the connector connection structure according to the second embodiment.
The circuit board 1A includes a preparation step S21 for the base material 2, a wiring plating step S22 for arranging the conductive pattern 3 on the base material 2, and a step S23 for preparing the connector section 6 consisting of the external connection terminals 61 and the housing 62. and a step S24 of covering the other surface 2b opposite to the one surface 2a of the base material 2 on which the terminal portion 5 is formed at one end of the conductive pattern 3 with the resin layer 7; Manufactured through a connection step S25 of inserting the terminal portion 5 into the opening 63 and holding and fixing it in contact with the anchor portion 61b of the external connection terminal 61 to be electrically connected to an external element so as to be electrically conductive. be done.
　（基材の準備工程Ｓ２１、配線用めっき工程Ｓ２２）
　基材の準備工程Ｓ２１においては、所定の形状及び大きさに形成された実質的に平坦なフィルム状の基材２に、第１実施形態におけると同様に、基材２上に金属めっき成長のきっかけとなる金属ナノ粒子等の触媒粒子からなる下地層を所定のパターン状に形成し、配線用めっき工程Ｓ２２を経て導電性パターン３及びコネクタ接続パッド３Ａａを配置する。
　そして、端子部５のコネクタ接続パッド３Ａａ付近の裏面に補強板５１を取り付ける。 (Base material preparation step S21, wiring plating step S22)
In the base material preparation step S21, metal plating is grown on a substantially flat film-like base material 2 formed in a predetermined shape and size, as in the first embodiment. A base layer made of catalyst particles such as metal nanoparticles is formed in a predetermined pattern, and conductive patterns 3 and connector connection pads 3Aa are arranged through a wiring plating step S22.
Then, a reinforcing plate 51 is attached to the back surface of the terminal portion 5 near the connector connection pad 3Aa.
　（コネクタ部の準備工程Ｓ２３）
　コネクタ部６の準備工程Ｓ２３においては、外部接続端子６１をハウジング６２にインサート成形してコネクタ部６を作成する。
　外部接続端子６１は金属板部材を板厚方向に屈曲して所定の形状に形成される。
　ハウジング６２は、基端部に端子部５が挿入される開口部６３が形成される。開口部６３は、その内側に外部接続端子６１の屈曲したアンカー部６１ｂが露出するように形成され、開口部６３に挿入される端子部５のコネクタ接続パッド３Ａａが接触して電気的に導通する。 (Connector part preparation step S23)
In the preparation step S23 for the connector section 6, the external connection terminal 61 is insert-molded into the housing 62 to create the connector section 6.
The external connection terminal 61 is formed into a predetermined shape by bending a metal plate member in the thickness direction.
The housing 62 has an opening 63 formed at its base end into which the terminal portion 5 is inserted. The opening 63 is formed so that the bent anchor part 61b of the external connection terminal 61 is exposed inside the opening 63, and the connector connection pad 3Aa of the terminal part 5 inserted into the opening 63 comes into contact with it to establish electrical continuity. .
　（樹脂層形成工程Ｓ２４）
　樹脂層形成工程Ｓ２４では、基材２の導電性パターン３及びコネクタ接続パッド３Ａａが配置された一面２ａとは反対側の他面２ｂに基材２と樹脂層７の樹脂素材の組み合わせに応じてバインダーインクを塗布して接着層を形成する。
　次に配線用めっき工程Ｓ２２を経た基材２を金型Ｋに位置決めしてセットした状態（図１０Ｅ　参照）で金型Ｋを閉じて樹脂をキャビティＣＡ１に充填する。キャビティＣＡ１に充填された樹脂により、基材２の他面２ｂを覆う樹脂層７が形成される。ここで、樹脂層７は、端子部５のコネクタ部６の開口部６３への挿入範囲を除いて形成される（図６Ａ　参照）。 (Resin layer forming step S24)
In the resin layer forming step S24, the other surface 2b of the base material 2 opposite to the one surface 2a on which the conductive pattern 3 and the connector connection pad 3Aa are arranged is coated according to the combination of the resin materials of the base material 2 and the resin layer 7. Apply binder ink to form an adhesive layer.
Next, with the base material 2 that has undergone the wiring plating step S22 positioned and set in the mold K (see FIG. 10E), the mold K is closed and the cavity CA1 is filled with resin. The resin filled in the cavity CA1 forms a resin layer 7 that covers the other surface 2b of the base material 2. Here, the resin layer 7 is formed except for the area where the terminal portion 5 is inserted into the opening 63 of the connector portion 6 (see FIG. 6A).
　（接続工程Ｓ２５）
　端子部５の接続工程Ｓ２５においては、図６Ｂに示すように、樹脂層７が形成された回路基板１Ａの端子部５をハウジング６２の開口部６３に挿入してコネクタ接続パッド３Ａａが外部接続端子６１のアンカー部６１ｂと接触して電気的に導通した状態で接触保持して固定する（図６Ｃ　参照）。
　実装部品４は、端子部４ｂを導電性パターン３の接続パッド３ａ上に位置決めして固定状態で端子部４ｂを接続パッド３ａに電気的に接合する。 (Connection process S25)
In the terminal part 5 connection step S25, as shown in FIG. 6B, the terminal part 5 of the circuit board 1A on which the resin layer 7 is formed is inserted into the opening 63 of the housing 62 so that the connector connection pad 3Aa becomes an external connection terminal. 61 and is held in contact with the anchor portion 61b in an electrically conductive state to be fixed (see FIG. 6C).
The mounted component 4 positions the terminal portion 4b on the connection pad 3a of the conductive pattern 3, and electrically connects the terminal portion 4b to the connection pad 3a in a fixed state.
　以上で、回路基板１Ａの組立が完了する。変形可能な回路基板１Ａの端子部５は、裏面が樹脂層７で覆われた状態でコネクタ部６に挿入されてコネクタ接続パッド３Ａａが外部接続端子６１と接触保持された状態で固定されているので、回路基板１Ａと外部素子との電気的接続を安定化させることができる。 With the above steps, the assembly of the circuit board 1A is completed. The terminal portion 5 of the deformable circuit board 1A is inserted into the connector portion 6 with its back surface covered with a resin layer 7, and is fixed in a state where the connector connection pad 3Aa is held in contact with the external connection terminal 61. Therefore, the electrical connection between the circuit board 1A and external elements can be stabilized.
　「第３実施形態」
　　図８は第３実施形態に係るコネクタ接続構造を備えた回路基板１Ｂの製造過程を説明するための回路基板１Ｂの部分断面模式図である。
　以下、図面を参照しながら、第３実施形態に係るコネクタ接続構造について説明する。 “Third embodiment”
FIG. 8 is a schematic partial cross-sectional view of the circuit board 1B for explaining the manufacturing process of the circuit board 1B provided with the connector connection structure according to the third embodiment.
Hereinafter, a connector connection structure according to a third embodiment will be described with reference to the drawings.
　（１）回路基板１Ｂの構成
　回路基板１Ｂは、変形可能な基材２と、基材２の一面２ａに配置された導電性パターン３と、基材２上に設けられ、導電性パターン３と電気的に接続された実装部品４と、導電性パターン３の一端部に形成されたコネクタ接続パッド３Ａａが開口部６１ｃに挿入されて電気的に導通するように接触保持した状態で外部素子と電気的に接続される外部接続端子６１と、基材２の一面２ａとは反対側の他面２ｂを覆うように形成される樹脂層７が外部接続端子６１が露出するように外部接続端子６１を囲うハウジング６２と一体化されたコネクタ部６と、を備えて構成されている。 (1) Configuration of circuit board 1B The circuit board 1B includes a deformable base material 2, a conductive pattern 3 disposed on one surface 2a of the base material 2, and a conductive pattern 3 provided on the base material 2. The electrically connected mounting component 4 and the connector connection pad 3Aa formed at one end of the conductive pattern 3 are inserted into the opening 61c and are electrically connected to an external element while being in contact with each other so as to be electrically conductive. The resin layer 7 formed to cover the external connection terminal 61 to be connected to the base material 2 and the other surface 2b opposite to the one surface 2a of the base material 2 connects the external connection terminal 61 so that the external connection terminal 61 is exposed. It is configured to include a housing 62 that encloses it and a connector portion 6 that is integrated with it.
　すなわち、第３実施形態に係るコネクタ接続構造を備えた回路基板１Ｂは、導電性パターン３の一端に複数のコネクタ接続パッド３Ａａが形成された端子部５が外部素子と電気的に接続される外部接続端子６１の開口部６１ｃに挿入されて電気的に導通するように接触保持されている点で、第１実施形態に係るコネクタ接続構造を備えた回路基板１と相違している。したがって、第１実施形態との共通部分については同一の符号を付してその詳細な説明は省略する。 That is, the circuit board 1B equipped with the connector connection structure according to the third embodiment has an external terminal portion 5 in which a plurality of connector connection pads 3Aa are formed at one end of the conductive pattern 3 and is electrically connected to an external element. This is different from the circuit board 1 having the connector connection structure according to the first embodiment in that it is inserted into the opening 61c of the connection terminal 61 and held in contact for electrical continuity. Therefore, the same reference numerals are given to the common parts with the first embodiment, and detailed explanation thereof will be omitted.
　端子部５は、図８Ａに示すように、導電性パターン３の一端に複数のコネクタ接続パッド３Ａａが形成されている。端子部５のコネクタ接続パッド３Ａａ付近の領域の裏面には補強板５１が取り付けられ、端子部５の剛性を高めて曲げ変形を抑制している。 As shown in FIG. 8A, the terminal portion 5 has a plurality of connector connection pads 3Aa formed at one end of the conductive pattern 3. A reinforcing plate 51 is attached to the back surface of the area of the terminal portion 5 near the connector connection pad 3Aa, increasing the rigidity of the terminal portion 5 and suppressing bending deformation.
　コネクタ部６は、外部に設けられた外部素子と電気的に接続するための外部接続端子６１と、外部接続端子６１を保持するハウジング６２とを備える。
　外部接続端子６１は、図８Ｂに示すように、金属板部材を板厚方向に屈曲して所定の形状に形成され、アンカー部６１ｂには開口部６１ｃが形成されている。開口部６１ｃには、端子部５が挿入され（図８Ｂ　参照）コネクタ接続パッド３Ａａがアンカー部６１ｂと接触保持した状態で電気的に導通する。 The connector section 6 includes an external connection terminal 61 for electrically connecting to an external element provided outside, and a housing 62 that holds the external connection terminal 61.
As shown in FIG. 8B, the external connection terminal 61 is formed into a predetermined shape by bending a metal plate member in the thickness direction, and an opening 61c is formed in the anchor portion 61b. The terminal portion 5 is inserted into the opening portion 61c (see FIG. 8B), and the connector connection pad 3Aa is electrically connected to the anchor portion 61b while being in contact with the anchor portion 61b.
　樹脂層７は、図８Ｃに示すように、基材２の一面２ａとは反対側の他面２ｂを覆い外部接続端子６１が露出するように外部接続端子６１を囲うハウジング６２を形成してコネクタ部６と一体化するように形成されている。 As shown in FIG. 8C, the resin layer 7 forms a housing 62 that covers the other surface 2b opposite to the one surface 2a of the base material 2 and surrounds the external connection terminal 61 so that the external connection terminal 61 is exposed. It is formed so as to be integrated with the section 6.
　（２）回路基板１Ｂの製造方法
　図９は第３実施形態に係るコネクタ接続構造を備えた回路基板１Ｂの製造方法の概略の手順の一例を示すフローチャート図である。
　回路基板１Ｂは、基材２の準備工程Ｓ３１と、基材２上に導電性パターン３を配置する配線用めっき工程Ｓ３２と、導電性パターン３の一端に形成された端子部５が挿入されて電気的に導通する外部接続端子６１を準備する工程Ｓ３３と、外部接続端子６１のアンカー部６１ｂに形成された開口部６１ｃに端子部５を挿入して外部接続端子６１と電気的に導通するように接触保持する接続工程Ｓ３４と、導電性パターン３の一端に端子部５が形成された基材２の一面２ａとは反対側の他面２ｂを覆うとともに外部接続端子６１を囲うハウジング６２を形成してコネクタ部６と一体化される樹脂層７を形成する工程Ｓ３５と、を経て製造される。 (2) Method of manufacturing circuit board 1B FIG. 9 is a flowchart showing an example of a schematic procedure of a method of manufacturing circuit board 1B provided with the connector connection structure according to the third embodiment.
The circuit board 1B includes a preparation step S31 for the base material 2, a wiring plating step S32 for arranging the conductive pattern 3 on the base material 2, and a terminal portion 5 formed at one end of the conductive pattern 3 inserted. Step S33 of preparing an electrically conductive external connection terminal 61, and inserting the terminal portion 5 into the opening 61c formed in the anchor portion 61b of the external connection terminal 61 to establish electrical conduction with the external connection terminal 61. a connecting step S34 of contacting and holding the conductive pattern 3, and forming a housing 62 that covers the other surface 2b opposite to the one surface 2a of the base material 2 on which the terminal portion 5 is formed at one end of the conductive pattern 3 and surrounds the external connection terminal 61. The connector part 6 is manufactured through a step S35 of forming the resin layer 7 to be integrated with the connector part 6.
　（基材の準備工程Ｓ３１、配線用めっき工程Ｓ３２）
　基材の準備工程Ｓ３１においては、所定の形状及び大きさに形成された実質的に平坦なフィルム状の基材２に、第１実施形態におけると同様に、基材２上に金属めっき成長のきっかけとなる金属ナノ粒子等の触媒粒子からなる下地層を所定のパターン状に形成し、配線用めっき工程Ｓ３２を経て導電性パターン３及びコネクタ接続パッド３Ａａを配置する。そして、端子部５のコネクタ接続パッド３Ａａ付近の裏面に補強板５１を取り付ける（図８Ａ　参照）。 (Base material preparation step S31, wiring plating step S32)
In the base material preparation step S31, metal plating is grown on a substantially flat film-like base material 2 formed in a predetermined shape and size, as in the first embodiment. A base layer made of catalyst particles such as metal nanoparticles is formed in a predetermined pattern, and conductive patterns 3 and connector connection pads 3Aa are arranged through a wiring plating step S32. Then, a reinforcing plate 51 is attached to the back surface of the terminal portion 5 near the connector connection pad 3Aa (see FIG. 8A).
　（外部接続端子の準備工程Ｓ３３）
　外部接続端子６１の準備工程Ｓ３３においては、金属板部材を板厚方向に屈曲して所定の形状に形成した外部接続端子６１を準備する。外部接続端子６１は、アンカー部６１ｂに端子部５が挿入される開口部６１ｃが形成される。開口部６１ｃは、補強板５１が取り付けられた端子部５がその内側に圧入できる高さで形成され、開口部６１ｃに挿入される端子部５のコネクタ接続パッド３Ａａが接触して電気的に導通する。 (External connection terminal preparation step S33)
In the step S33 of preparing the external connection terminal 61, the external connection terminal 61 is prepared by bending a metal plate member in the thickness direction and forming it into a predetermined shape. In the external connection terminal 61, an opening 61c into which the terminal portion 5 is inserted is formed in the anchor portion 61b. The opening 61c is formed at a height that allows the terminal section 5 to which the reinforcing plate 51 is attached to be press-fitted into the opening 61c, and the connector connection pad 3Aa of the terminal section 5 inserted into the opening 61c comes into contact with the terminal section 5 for electrical conduction. do.
　（接続工程Ｓ３４）
　端子部５の接続工程Ｓ３４においては、回路基板１Ｂの端子部５を外部接続端子６１の開口部６１ｃに挿入して（図８Ｂ　参照）端子部５のコネクタ接続パッド３Ａａが外部接続端子６１のアンカー部６１ｂと接触して電気的に導通した状態で接触保持して固定する。 (Connection process S34)
In the terminal part 5 connection step S34, the terminal part 5 of the circuit board 1B is inserted into the opening 61c of the external connection terminal 61 (see FIG. 8B), and the connector connection pad 3Aa of the terminal part 5 is connected to the anchor of the external connection terminal 61. It is fixed by contacting and maintaining contact with the portion 61b in an electrically conductive state.
　（樹脂層形成工程Ｓ３５）
　樹脂層形成工程Ｓ３５では、基材２の導電性パターン３及びコネクタ接続パッド３Ａａが配置された一面２ａとは反対側の他面２ｂに基材２と樹脂層７の樹脂素材の組み合わせに応じてバインダーインク（不図示）を塗布して接着層を形成する。また、外部接続端子６１の表面にもバインダーインク（不図示）を塗布する。
　次に接続工程Ｓ３４を経た基材２を金型Ｋ（不図示）に位置決めしてセットした状態で金型Ｋを閉じて樹脂をキャビティＣＡ１（不図示）に充填する。キャビティＣＡ１に充填された樹脂により、基材２の他面２ｂを覆う樹脂層７及びコネクタ部６のハウジング６２が形成される（図８Ｃ　参照）。
　実装部品４は、端子部４ｂを導電性パターン３の接続パッド３ａ上に位置決めして固定状態で端子部４ｂを接続パッド３ａに電気的に接合する。 (Resin layer forming step S35)
In the resin layer forming step S35, the other surface 2b of the base material 2 opposite to the one surface 2a on which the conductive pattern 3 and the connector connection pad 3Aa are arranged is coated according to the combination of the resin materials of the base material 2 and the resin layer 7. A binder ink (not shown) is applied to form an adhesive layer. Further, binder ink (not shown) is also applied to the surface of the external connection terminal 61.
Next, the base material 2 that has undergone the connection step S34 is positioned and set in a mold K (not shown), and the mold K is closed to fill the cavity CA1 (not shown) with resin. The resin filled in the cavity CA1 forms the resin layer 7 covering the other surface 2b of the base material 2 and the housing 62 of the connector portion 6 (see FIG. 8C).
The mounted component 4 positions the terminal portion 4b on the connection pad 3a of the conductive pattern 3, and electrically connects the terminal portion 4b to the connection pad 3a in a fixed state.
　以上で、回路基板１Ｂの組立が完了する。変形可能な回路基板１Ｂの端子部５は、コネクタ部６を構成する外部接続端子６１の開口部６１ｃに挿入されてコネクタ接続パッド３Ａａが外部接続端子６１と接触保持された状態で基材２の一面２ａとは反対側の他面２ｂを覆うように形成される樹脂層７が外部接続端子６１が露出するように外部接続端子６１を囲うハウジング６２と一体化されて固定されているので、回路基板１Ｂと外部素子との電気的接続を安定化させることができる。 With the above steps, the assembly of the circuit board 1B is completed. The terminal portion 5 of the deformable circuit board 1B is inserted into the opening 61c of the external connection terminal 61 constituting the connector portion 6, and the connector connection pad 3Aa is held in contact with the external connection terminal 61 when the terminal portion 5 of the base material 2 is inserted. The resin layer 7 formed to cover the other surface 2b opposite to the one surface 2a is integrated and fixed with the housing 62 surrounding the external connection terminal 61 so that the external connection terminal 61 is exposed. Electrical connection between the substrate 1B and external elements can be stabilized.
１、１Ａ、１Ｂ・・・回路基板
　２・・・基材
　　２ａ・・・一面（導電性パターン３側）、２ｂ・・・他面
　３、３Ａ・・・導電性パターン
　　３Ａａ・・・コネクタ接続パッド
　４・・・実装部品
　５・・・端子部
　６・・・コネクタ部、６１・・・外部接続端子、６２・・・ハウジング
　７・・・樹脂層
Ｋ・・・射出成形用金型
ＣＡ１・・・キャビティ 1, 1A, 1B... Circuit board 2... Base material 2a... One side (conductive pattern 3 side), 2b... Other side 3, 3A... Conductive pattern 3Aa... Connector connection Pad 4... Mounting component 5... Terminal part 6... Connector part, 61... External connection terminal, 62... Housing 7... Resin layer K... Injection mold CA1. ··cavity

Claims (8)

  1. 　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造であって、
    　ハウジングの基端部に形成された開口部の内面に前記外部素子と電気的に接続される外部接続端子の一端が露出し、前記導電性パターンの一端部は前記開口部に挿入されて前記外部接続端子の一端と電気的に導通するように接触保持された状態で前記回路基板の一面とは反対側の他面を覆うように形成された樹脂層が前記ハウジングと一体化されて固定されている、
    　ことを特徴とするコネクタ接続構造。     A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element,
    One end of an external connection terminal electrically connected to the external element is exposed on the inner surface of an opening formed at the base end of the housing, and one end of the conductive pattern is inserted into the opening and connected to the external element. A resin layer formed to cover the other surface of the circuit board opposite to the one surface while being in electrically conductive contact with one end of the connection terminal is integrated and fixed with the housing. There is,
    A connector connection structure characterized by:
  2. 　前記樹脂層は、前記ハウジングと相溶性を有する合成樹脂を材料とする、
    　ことを特徴とする請求項１に記載のコネクタ接続構造。     The resin layer is made of a synthetic resin that is compatible with the housing.
    The connector connection structure according to claim 1, characterized in that:
  3. 　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造であって、
    　ハウジングの基端部に形成された開口部の内面に前記外部素子と電気的に接続される外部接続端子の一端が露出し、前記回路基板は前記一面とは反対側の他面が樹脂層で覆われた状態で前記導電性パターンの一端部が前記開口部に挿入されて前記外部接続端子の一端と電気的に導通するように接触保持されて固定されている、
    　ことを特徴とするコネクタ接続構造。     A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element,
    One end of an external connection terminal electrically connected to the external element is exposed on the inner surface of the opening formed at the base end of the housing, and the other surface of the circuit board opposite to the one surface is a resin layer. One end of the conductive pattern is inserted into the opening in a covered state, and is held and fixed in contact with one end of the external connection terminal so as to be electrically conductive.
    A connector connection structure characterized by:
  4. 　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造であって、
    　前記導電性パターンの一端部が前記外部素子と電気的に接続される外部接続端子に形成された開口部に挿入されて前記外部接続端子と電気的に導通するように接触保持された状態で、前記回路基板の一面とは反対側の他面を覆うように形成される樹脂層が前記外部接続端子が露出するように前記外部接続端子を囲うハウジングと一体化されて固定されている、
    　ことを特徴とするコネクタ接続構造。     A connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element,
    one end of the conductive pattern is inserted into an opening formed in an external connection terminal electrically connected to the external element and held in contact with the external connection terminal so as to be electrically conductive; A resin layer formed to cover the other surface opposite to the one surface of the circuit board is integrated and fixed with a housing surrounding the external connection terminal so that the external connection terminal is exposed.
    A connector connection structure characterized by:
  5. 　前記回路基板は、前記導電性パターンの一端部が形成された領域の裏面側に前記一端部の曲げ変形を抑制する補強板が設けられている、
    　ことを特徴とする請求項１ないし４のいずれか１項に記載のコネクタ接続構造。     The circuit board is provided with a reinforcing plate for suppressing bending deformation of the one end on the back side of a region where the one end of the conductive pattern is formed.
    The connector connection structure according to any one of claims 1 to 4.
  6. 　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造の製造方法であって、
    　基材を準備する工程と、
    　前記基材上に前記導電性パターンを配置する工程と、
    　ハウジングと外部接続端子からなるコネクタを準備する工程と、
    　前記ハウジングの基端部に形成された開口部に前記導電性パターンの一端部を挿入して前記外部素子と電気的に接続される前記外部接続端子の一端と電気的に導通するように接触保持する工程と、
    　前記一端部を接触保持した状態で前記回路基板の一面とは反対側の他面を覆い前記ハウジングと一体化される樹脂層を形成する工程と、を含む、
    　ことを特徴とするコネクタ接続構造の製造方法。     A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising:
    a step of preparing a base material;
    arranging the conductive pattern on the base material;
    a step of preparing a connector consisting of a housing and an external connection terminal;
    Inserting one end of the conductive pattern into an opening formed at the base end of the housing and maintaining contact so as to be electrically conductive with one end of the external connection terminal that is electrically connected to the external element. The process of
    forming a resin layer that covers the other surface opposite to the one surface of the circuit board and is integrated with the housing while the one end portion is held in contact with the other surface;
    A method for manufacturing a connector connection structure, characterized in that:
  7. 　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造の製造方法であって、
    　基材を準備する工程と、
    　前記基材上に前記導電性パターンを配置する工程と、
    　ハウジングと外部接続端子からなるコネクタを準備する工程と、
    　導電性パターンの一端部が形成された回路基板の前記一面とは反対側の他面を樹脂層で覆う工程と、
    　前記ハウジングの基端部に形成された開口部に前記導電性パターンの一端部を挿入して前記外部素子と電気的に接続される前記外部接続端子の一端と電気的に導通するように接触保持して固定する工程と、を含む、
    　ことを特徴とするコネクタ接続構造の製造方法。     A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising:
    a step of preparing a base material;
    arranging the conductive pattern on the base material;
    a step of preparing a connector consisting of a housing and an external connection terminal;
    a step of covering the other surface of the circuit board opposite to the one surface on which one end portion of the conductive pattern is formed with a resin layer;
    Inserting one end of the conductive pattern into an opening formed at the base end of the housing and maintaining contact so as to be electrically conductive with one end of the external connection terminal that is electrically connected to the external element. and fixing.
    A method for manufacturing a connector connection structure, characterized in that:
  8. 　変形可能な回路基板の一面に配置された導電性パターンの一端部を外部素子と電気的に接続するコネクタ接続構造の製造方法であって、
    　基材を準備する工程と、
    　前記基材上に前記導電性パターンを配置する工程と、
    　前記外部素子と電気的に接続される外部接続端子を準備する工程と、
    　前記外部接続端子に形成された開口部に前記導電性パターンの一端部を挿入して前記外部接続端子と電気的に導通するように接触保持して接続する工程と、
    　前記回路基板の一面とは反対側の他面を樹脂層で覆うとともに前記外部接続端子が露出するように前記外部接続端子を囲うハウジングを一体形成する工程と、を含む、
    　ことを特徴とするコネクタ接続構造の製造方法。     A method for manufacturing a connector connection structure that electrically connects one end of a conductive pattern arranged on one surface of a deformable circuit board to an external element, the method comprising:
    a step of preparing a base material;
    arranging the conductive pattern on the base material;
    preparing an external connection terminal to be electrically connected to the external element;
    a step of inserting one end of the conductive pattern into an opening formed in the external connection terminal and maintaining contact with the external connection terminal so as to be electrically conductive for connection;
    a step of integrally forming a housing that covers the other surface of the circuit board opposite to the one surface with a resin layer and surrounds the external connection terminal so that the external connection terminal is exposed;
    A method for manufacturing a connector connection structure, characterized in that:
PCT/JP2022/034429 2022-09-14 2022-09-14 Connector connection structure and method for manufacturing same WO2024057447A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0644037U (en) * 1992-11-24 1994-06-10 株式会社潤工社 Connection structure for flat cable
JPH08279667A (en) * 1995-04-06 1996-10-22 Murata Mfg Co Ltd Flexible board
JP2008218118A (en) * 2007-03-02 2008-09-18 Jst Mfg Co Ltd Flexible printed circuit board and connector for the same
US20160028174A1 (en) * 2014-07-22 2016-01-28 Samsung Display Co., Ltd. Fpcb cable and cable connector assembly
WO2019208091A1 (en) * 2018-04-27 2019-10-31 住友電気工業株式会社 Connector and substrate
JP7117705B1 (en) * 2022-01-14 2022-08-15 エレファンテック株式会社 electronic device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0644037U (en) * 1992-11-24 1994-06-10 株式会社潤工社 Connection structure for flat cable
JPH08279667A (en) * 1995-04-06 1996-10-22 Murata Mfg Co Ltd Flexible board
JP2008218118A (en) * 2007-03-02 2008-09-18 Jst Mfg Co Ltd Flexible printed circuit board and connector for the same
US20160028174A1 (en) * 2014-07-22 2016-01-28 Samsung Display Co., Ltd. Fpcb cable and cable connector assembly
WO2019208091A1 (en) * 2018-04-27 2019-10-31 住友電気工業株式会社 Connector and substrate
JP7117705B1 (en) * 2022-01-14 2022-08-15 エレファンテック株式会社 electronic device

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