WO2024052305A2 - Dispositif et procédé permettant d'imprimer un substrat avec un produit d'étanchéité et/ou un adhésif - Google Patents

Dispositif et procédé permettant d'imprimer un substrat avec un produit d'étanchéité et/ou un adhésif Download PDF

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Publication number
WO2024052305A2
WO2024052305A2 PCT/EP2023/074237 EP2023074237W WO2024052305A2 WO 2024052305 A2 WO2024052305 A2 WO 2024052305A2 EP 2023074237 W EP2023074237 W EP 2023074237W WO 2024052305 A2 WO2024052305 A2 WO 2024052305A2
Authority
WO
WIPO (PCT)
Prior art keywords
plate
sealant
adhesive
recess
substrate
Prior art date
Application number
PCT/EP2023/074237
Other languages
German (de)
English (en)
Other versions
WO2024052305A3 (fr
Inventor
Fabiano ICISACA INDICATTI
Michael RAEDLER
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2024052305A2 publication Critical patent/WO2024052305A2/fr
Publication of WO2024052305A3 publication Critical patent/WO2024052305A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
    • B41F19/002—Apparatus or machines for carrying out printing operations combined with other operations with means for applying specific material other than ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
    • B41F19/002—Apparatus or machines for carrying out printing operations combined with other operations with means for applying specific material other than ink
    • B41F19/004—Apparatus or machines for carrying out printing operations combined with other operations with means for applying specific material other than ink with means for applying adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0271—Sealing or supporting means around electrodes, matrices or membranes
    • H01M8/0286—Processes for forming seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles

Definitions

  • the invention relates to a device and a method for printing a substrate with a sealant and/or adhesive.
  • the substrate can in particular be a layer or a layer of an electrochemical cell, for example a mono- or bipolar plate, a separator plate and/or a membrane-electrode arrangement.
  • Printing the substrate with the sealant and/or adhesive serves in particular to form at least one seal of the electrochemical cell.
  • Electrochemical cells such as fuel cells, electrolysis cells or battery cells, have a multi-layer or multi-layer structure. This structure requires intermediate seals to separate the media supplied to a cell during operation. To form the seals, a sealant and/or adhesive is applied to a layer or layer of the cell. Dispensing or printing processes are particularly used here.
  • the mass production of electrochemical cells requires high processing speed, i.e. short cycle times, as well as high process stability. Stencil printing in particular meets these requirements.
  • the printing process for stencil printing is basically divided into the following three sub-processes:
  • the stencil thickness determines the layer height of the applied structure, with usual layer heights being in the range of 300 pm to 500 pm. However, for seals of electrochemical cells, layer heights of up to 1500 pm are required in order to achieve tolerance compensation and to be as free as possible in the design of the structures to be applied. Because - depending on the respective sealing concept - the structures to be applied can be large and/or complex.
  • the present invention is concerned with the task of reducing the risk of air bubbles and thus defects when printing a substrate with a sealant and/or adhesive.
  • the device with the features of claim 1 and the method with the features of claim 9 are proposed.
  • Advantageous developments of the invention can be found in the respective subclaims.
  • the proposed device for printing a substrate with a sealant and/or adhesive has a template with a top and a bottom and at least one recess extending from the top to the bottom for receiving the sealant and/or adhesive. At least one plate is arranged on the underside of the template as a spacer element.
  • the at least one plate arranged on the underside of the stencil causes a gap to remain between the stencil and the substrate when the stencil is placed on a substrate to be printed.
  • the recess in the template can be vented via the gap when it is filled with the sealant and/or adhesive, so that the risk of air bubbles forming is significantly reduced. Venting through the gap helps to avoid defects in the printed image, which is particularly important if the printing process is used to produce a seal.
  • the stencil thickness can be increased so that layer heights that are well above 300 pm can be achieved, for example at 1500 pm, as required for seals of electrochemical cells.
  • the position, shape and/or size of the at least one plate depends on various factors, in particular on the thickness of the template, the size and shape of the recess and on the rheological properties of the sealant and/or adhesive.
  • the direction of the squeegee is also relevant for the position of the at least one plate, i.e. the direction in which the squeegee is pulled over the stencil.
  • the squeegee direction can be predetermined from the outset, but it can also only result from the position of the at least one plate.
  • the at least one plate is arranged behind the at least one recess of the stencil in the squeegee direction, so that in particular any residual air remaining in the recess to be filled with the sealant and/or adhesive can escape via the gap. In this case, it is not necessary for the recess to be surrounded by a circumferential gap between the template and the substrate. This means that - at least in some areas - the template can continue to be in surface contact with the substrate.
  • At least one plate - regardless of the squeegee direction - can be arranged in an area of the at least one recess in the stencil that is particularly difficult to ventilate due to its shape. This can be, for example, an inner corner or an outer corner of the recess.
  • the stencil can rest directly on the substrate in some areas and can be raised relative to the substrate in some areas, different layer heights can result when printing on the substrate. However, if the height of the at least one plate is correspondingly low, the different layer heights are negligible.
  • the at least one plate is preferably arranged at a distance a from the at least one recess in the template.
  • the distance a ensures that the air can flow past the plate when the recess is vented.
  • the distance a is preferably at least 1 to 10 mm.
  • the at least one platelet preferably has a height h of 10 to 200 pm.
  • the ideal height h of the plate depends in particular on the layer height to be achieved. If the proposed device is used to produce a seal, in particular a seal of an electrochemical cell, the layer height to be achieved is approximately 1500 pm. Compared to the layer height to be achieved, the height h of the plate is so small that an increase in the layer height caused by the plate is not relevant. At the same time, the small height h of the plate ensures that the sealant and/or adhesive is in place When removing it with the help of the squeegee, it cannot get under the stencil and thus smearing cannot occur.
  • the at least one plate When viewed from above, the at least one plate preferably has a simple geometric shape, for example a round or square shape.
  • the platelet can therefore be produced easily and cost-effectively. If a round shape is chosen, the platelet can be optimally flowed around by the escaping air when the at least one recess in the template is vented.
  • the at least one plate can in particular be made of metal, for example steel or aluminum, or plastic.
  • the plate can also be made of a different material than the template.
  • a material is chosen that is particularly robust, so that the stencil can be used for a variety of printing processes.
  • the at least one plate be cohesively connected to the template, in particular welded or glued.
  • the cohesive connection ensures that the plate is still there even after thousands of printing and cleaning cycles.
  • the flow cross section of the gap remaining between the template and the substrate can be influenced by the number of platelets. Although the height of the gap does not change, its width does.
  • the distance b between the plates ensures that the air can flow through between the plates when the recess is vented.
  • the distance b is preferably at least 1 to 10 mm.
  • the device has a squeegee for removing the sealant and/or adhesive on the top of the stencil.
  • the at least one recess in the stencil is filled with the sealant and/or adhesive when it is removed.
  • the squeegee is preferably wider than the at least one recess, so that This can be filled with the sealant and/or adhesive in just one removal process.
  • the procedure includes the steps:
  • the position of the at least one plate determines the direction of the squeegee, i.e. the direction of movement of the squeegee. This is chosen so that the air present in the recess is pushed through the sealant and/or adhesive, which is pressed into the recess by the squeegee when it is removed, in the direction of the at least one plate or in the direction of the gap between the stencil and the Substrate is displaced. Since the gap remains until the recess is completely filled with the sealant and/or adhesive, the recess can be completely vented or completely filled with the sealant and/or adhesive. In this way, air bubbles and thus defects in the printed structure are avoided.
  • the recess in the area of the at least one plate is preferably filled last. This is particularly relevant if the gap remaining between the template and the substrate is not formed all around the recess due to the position of the at least one platelet and/or the number of platelets.
  • the squeegee is preferably placed at an end of the stencil that is furthest away from the at least one plate. When removing, the squeegee is first moved over the recess and then over the area of the stencil drawn, which has at least one plate on its underside. The recess can thus be completely vented.
  • FIG. 3 a a perspective view of a second device according to the invention for printing a substrate with a sealant and/or adhesive and b) an enlarged detail of FIG. 3a),
  • FIG. 4 a a perspective view of a third device according to the invention for printing a substrate with a sealant and/or adhesive and b) an enlarged detail of FIG. 4a),
  • FIG. 5 a a perspective view of a fourth device according to the invention for printing a substrate with a sealant and/or adhesive and b) an enlarged detail of FIG. 5a).
  • the substrate 1 can in particular be a layer or layer of an electrochemical cell, for example a bipolar plate or a membrane-electrode arrangement.
  • a seal of the electrochemical cell can in particular be formed.
  • Figures 2a) and 2b) show a first preferred embodiment of a device for printing a substrate 1 with a sealant and/or adhesive 2.
  • the device comprises a stencil 3 and a squeegee 12.
  • the stencil 3 is first used placed so that a plate 11 arranged on an underside 3.2 of the template 3 is in surface contact with the substrate 1.
  • the sealant and/or adhesive 2 is then applied to a top side 3.1 of the stencil 3 and removed with the help of the squeegee 12.
  • the squeegee 12 presses the sealant and/or adhesive 2 into at least one recess 4 formed in the stencil 3.
  • the squeegee 12 When removed, the squeegee 12 approaches the end of the recess 4 and thus the area of the stencil 3, which is on its underside 3.2 Plate 11 has. Until the recess 4 is completely filled with the sealant and/or adhesive 2, air present in the recess 4 can escape via the gap 5 created by the plate 11 between the template 3 and the substrate 1.
  • the air flow is shown in Figure 2a) using arrows as an example.
  • the thickness d of the stencil 3 determines the layer height of the applied sealant and/or adhesive 2 and thus the height of the later structure or seal (see Figure 2b)).
  • the layer height increases by the height h of the plate 11. Since the height h of the plate 11 is small compared to the height of the structure or seal to be produced, the height difference can be neglected. The low height h of the plate 11 also prevents the sealant and/or adhesive 2 from getting under the template 3 when it is removed.
  • the plate 11 is arranged on the underside 3.2 of the template 3 at a distance a from the recess 4.
  • the plate 11 has a length x, a width y and a height h.
  • the width y of the plate 11 essentially corresponds to the width of the recess 4.
  • the length x of the plate 11 is chosen to be slightly larger than the distance a. The distance a ensures that the air can flow past the plate when the recess 4 is vented.
  • a third embodiment is shown in Figures 4a) and 4b).
  • the template 3 has a circumferential recess 4, which divides the template 3 into two parts. The two parts are connected to one another via webs 15.
  • the webs 15 have a thickness that is less than the thickness d of the template 3, so that the substrate 1 can also be printed with the sealant and/or adhesive 2 in the area of the webs 15.
  • a plate 11 is arranged on the underside 3.2 of the template 3 and has a round shape. If the template 3 is placed on a substrate 1 with the plate 11 pointing downwards, the plate 11 rests on the substrate, so that the template 3 has no contact with the substrate 1 in this area.
  • a gap 5 therefore remains between the template 3 and the substrate 1, which allows the air present in the recess 4 to escape when the recess 4 is filled with the sealant and/or adhesive 2 with the aid of the rake 12 (not shown).
  • plates 11 can also be arranged on the underside 3.2 of the template 3.
  • four round plates 11 are each provided next to each other at a distance b.
  • the number and/or shape of the plates 11 can also vary compared to the example shown.
  • the at least one plate 11 prevents the gap 5 from being completely eliminated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Screen Printers (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

L'invention concerne un dispositif permettant d'imprimer un substrat (1) avec un produit d'étanchéité et/ou un adhésif (2), ledit dispositif comprenant un gabarit (3) qui présente une face supérieure (3.1) et une face inférieure (3.2) ainsi qu'au moins un évidement (4) s'étendant de la face supérieure (3.1) jusqu'à la face inférieure (3.2) et destiné à recevoir le produit d'étanchéité et/ou l'adhésif (2), au moins une plaquette (11) étant disposée en tant qu'élément d'écartement sur la face inférieure (3.2) du gabarit (3). L'invention concerne en outre un procédé permettant d'imprimer un substrat (1) avec un produit d'étanchéité et/ou un adhésif (2) au moyen d'un dispositif selon l'invention.
PCT/EP2023/074237 2022-09-05 2023-09-05 Dispositif et procédé permettant d'imprimer un substrat avec un produit d'étanchéité et/ou un adhésif WO2024052305A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022209197.3 2022-09-05
DE102022209197.3A DE102022209197A1 (de) 2022-09-05 2022-09-05 Vorrichtung und Verfahren zum Bedrucken eines Substrats mit einem Dicht- und/oder Klebstoff

Publications (2)

Publication Number Publication Date
WO2024052305A2 true WO2024052305A2 (fr) 2024-03-14
WO2024052305A3 WO2024052305A3 (fr) 2024-07-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2023/074237 WO2024052305A2 (fr) 2022-09-05 2023-09-05 Dispositif et procédé permettant d'imprimer un substrat avec un produit d'étanchéité et/ou un adhésif

Country Status (2)

Country Link
DE (1) DE102022209197A1 (fr)
WO (1) WO2024052305A2 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10006447A1 (de) 2000-02-14 2001-08-16 Epcos Ag Bauelement mit konstant verspannter Verklebung und Verfahren zur Verklebung
DE102005023102A1 (de) 2005-05-13 2006-11-16 Unaxis Balzers Ag Verfahren zum strukturierten Verkleben von Oberflächen
DE102007059794A1 (de) 2007-12-11 2009-06-25 Nb Technologies Gmbh Schablone für den technischen Siebdruck
DE102009002119A1 (de) 2009-04-02 2010-10-14 Robert Bosch Gmbh Klebemontageverfahren eines biegsamen Substrats und Substratanordnung
DE102013007703A1 (de) 2013-05-03 2014-11-06 Forschungszentrum Jülich GmbH Verfahren zur Herstellung einer Glaslot-Gründichtung

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Publication number Publication date
DE102022209197A1 (de) 2024-03-07

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