WO2024051235A1 - 一种平面变压器制作方法及平面变压器 - Google Patents

一种平面变压器制作方法及平面变压器 Download PDF

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Publication number
WO2024051235A1
WO2024051235A1 PCT/CN2023/098773 CN2023098773W WO2024051235A1 WO 2024051235 A1 WO2024051235 A1 WO 2024051235A1 CN 2023098773 W CN2023098773 W CN 2023098773W WO 2024051235 A1 WO2024051235 A1 WO 2024051235A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
magnetic
circuit
pressure
bearing plate
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PCT/CN2023/098773
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English (en)
French (fr)
Inventor
尹向阳
梁明龙
余志方
刘伟
刘杰
Original Assignee
广州华瑞升阳投资有限公司
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Publication of WO2024051235A1 publication Critical patent/WO2024051235A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F2027/348—Preventing eddy currents

Definitions

  • the invention belongs to the field of inductive devices, and specifically relates to a planar transformer manufacturing method and a planar transformer.
  • the technical problem to be solved by the present invention is to provide a planar transformer manufacturing method and a planar transformer, aiming to overcome at least one of the defects in the above-mentioned prior art, improve the coupling coefficient of the planar transformer in the buried magnetic PCB, and reduce the voltage. Defects in board warping during the bonding process.
  • the provided embodiments of the planar transformer manufacturing method are as follows:
  • a method for manufacturing a planar transformer including the following steps:
  • a first circuit board 11 and a second circuit board 12 are produced.
  • the first circuit board 11 is a copper-clad laminate with a first circuit 1111 provided on one surface
  • the second circuit board 12 is provided with a third circuit 1111 on one surface.
  • the first magnetic component 21 and the second magnetic component 22 are produced.
  • the first magnetic component 21 includes a first prepreg 211, a first magnetic sheet 212, a first pressure-bearing plate 213 and a first copper foil 214.
  • the sheet 212 is filled in the through-groove recess of the first prepreg 211, and the first pressure-bearing plate 213 and the first copper foil 214 are stacked in sequence on the first prepreg after filling the first magnetic sheet 212.
  • the second magnetic component 22 includes a second prepreg 221, a second magnetic sheet 222, a second pressure-bearing plate 223 and a second copper foil 224, and the second magnetic sheet 222 is filled in the first Two semi-cured sheets In the through-groove recess of 221, the second pressure-bearing plate 223 and the second copper foil 224 are stacked in sequence on one surface of the second prepreg 221 after filling the second magnetic sheet 222;
  • a third circuit board 13 is produced.
  • the third circuit board 13 is a laminated structure in which the first circuit board 11 and the first magnetic component 21 are pressed together through a third pressure-bearing plate 1301 , wherein the first The line 1111 and the first magnetic piece 212 are respectively located on both sides of the third pressure-bearing plate 1301;
  • a fourth circuit board 14 is produced.
  • the fourth circuit board 14 is based on the third circuit board 13 and is provided with a third circuit 1401 on the other surface of the first circuit board 11 and on the third circuit board 14 .
  • a first through hole 1402 is provided between the top and bottom layers of the circuit board 13;
  • a fifth circuit board 15 is produced.
  • the fifth circuit board 15 is a laminated structure in which the second circuit board 12 and the fourth circuit board 14 are pressed together through a fourth pressure-bearing plate 1501 , wherein the second circuit board 15 is Line 1211 and the third line 1401 are respectively located on both sides of the fourth pressure-bearing plate 1501;
  • a sixth circuit board 16 is produced.
  • the sixth circuit board 16 is based on the fifth circuit board 15 , with magnetic posts 1603 provided therein, and a magnetic column 1603 is provided on the other surface of the second circuit board 12 .
  • the fourth circuit 1604, the magnetic column 1603 is arranged in the fifth circuit board 15, and penetrates the second circuit board 12, the fourth pressure-bearing plate 1501, the first circuit board 11 and the
  • the third pressure-bearing plate 131 enables the first circuit 1111 , the second circuit 1211 , the third circuit 1401 and the fourth circuit 1604 to contact the magnetic column 1603 and the first magnetic piece 212 and the second magnetic piece 222 to form a concentrated magnetic circuit;
  • a seventh circuit board 17 is produced.
  • the seventh circuit board 17 is a laminated structure in which the second magnetic component 22 and the sixth circuit board 16 are pressed together through the fifth pressure-bearing plate 1701 , wherein the second The magnetic piece 222 and the fourth line 1604 are respectively located on both sides of the fifth pressure-bearing plate 1701;
  • the planar transformer is obtained by making an eighth circuit board 18.
  • the eighth circuit board 18 is provided with outer circuits 1801 on the basis of the seventh circuit board 17, and between the top and bottom layers of the seventh circuit board 17.
  • a second through hole 1802 is provided therebetween.
  • the production of the first magnetic component 21 and/or the second magnetic component 22 includes the following steps:
  • the manufacturing of the sixth circuit board 16 includes the following steps:
  • a receiving hole 1601 is opened on the fifth circuit board 15 , and the receiving hole 1601 penetrates the second circuit board 12 , the fourth pressure-bearing plate 1501 , the first circuit board 11 and the third pressure-bearing plate 1501 .
  • the magnetic powder-containing resin 1602 occupies a smaller volume in the receiving hole 1601 than the volume of the receiving hole 1601;
  • the fourth circuit 1604 is provided on the other surface of the second circuit board 12, thereby obtaining the sixth circuit board 16.
  • planar transformer As a second aspect of the present invention, the provided embodiments of the planar transformer are as follows:
  • a planar transformer is produced by the planar transformer manufacturing method described in any one of the above first aspects.
  • the number of the magnetic columns 1603 is 1, the first magnetic piece 212, the second magnetic piece 222 and the magnetic column 1603 form an "I" shaped magnetic core structure, and the first line 1111 , the second line 1211, the third line 1401 and the fourth line 1604 surround the magnetic column 1603.
  • the number of the magnetic pillars 1603 is 3, one of which is a center pillar and two of which are side pillars.
  • the side pillars are arranged in parallel on the left and right sides of the center pillar, so that the first magnetic piece 212 and the The second magnetic piece 222 and the magnetic column 1603 form an inverted "sun" shaped magnetic core structure, and the first circuit 1111, the second circuit 1211, the third circuit 1401 and the fourth circuit 1604 Surrounding the area between the two side pillars and the center pillar.
  • Line A carrier through which current flows.
  • the production method is to use photoresist on the copper-clad board to determine the local etching area, then expose and develop, and pickle to remove the photoresist and excess copper foil to form a coil pattern;
  • Pre-cured sheet also known as "PP sheet", is one of the main materials in the production of multi-layer boards, mainly composed of resin and reinforcing materials;
  • Pressure-bearing board also called "PP sheet", it is also one of the main materials in the production of multi-layer boards, mainly made of trees. Composed of grease and reinforcing materials;
  • Concentrated magnetic circuit Under normal circumstances, magnetic flux is generated due to the electrification of the coil winding and circulates around the conductive coil.
  • the magnetic permeability of the air is 1, so the magnetic flux surrounding the conductive winding coil in the air will be dispersed around the winding. open, so that the magnetic circuit is not concentrated.
  • the magnetic permeability of the magnetic column is much greater than 1, providing a high-speed conductive magnetic path, so that the magnetic flux is concentrated in Circulation in the magnetic column is called a concentrated magnetic circuit.
  • Magnetic columns are added between the upper and lower magnetic sheets of the planar transformer with embedded magnets, thereby closing the magnetic circuit of the planar transformer, improving the coupling coefficient of the primary winding and the secondary winding, reducing coil eddy current losses, and improving PCB buried magnetism. Transmission efficiency of planar transformer;
  • circuit board is pressed in three steps, which can effectively reduce board warpage during the lamination process caused by the introduction of metal magnets with large expansion coefficients and asymmetric lamination.
  • Figure 1 is a schematic diagram of the pressing sequence of the PCB embedded magnet according to the present invention.
  • Figure 2 is a schematic diagram of manufacturing the first circuit board and the second circuit board in the embodiment of the planar transformer manufacturing method of the present invention
  • Figure 3 is a schematic structural diagram of the first prepreg and the second prepreg
  • Figure 4 is a schematic diagram of the first prepreg and the first adhesive film, and the second prepreg and the second adhesive film in the embodiment of the planar transformer manufacturing method of the present invention
  • Figure 5 is a schematic diagram of the first magnetic component and the second magnetic component in the embodiment of the planar transformer manufacturing method of the present invention
  • Figure 6 is a schematic diagram of the first lamination process to produce a third circuit board in the embodiment of the planar transformer manufacturing method of the present invention.
  • Figure 7 is a schematic diagram of manufacturing a fourth circuit board in an embodiment of the planar transformer manufacturing method of the present invention.
  • Figure 8 is a schematic diagram of the second lamination process to produce the fifth circuit board in the embodiment of the planar transformer manufacturing method of the present invention.
  • Figure 9 is a schematic diagram of opening a receiving hole on the fifth circuit board when manufacturing the sixth circuit board in the embodiment of the planar transformer manufacturing method of the present invention.
  • Figure 10 shows the receiving holes when making the sixth circuit board in the embodiment of the planar transformer manufacturing method of the present invention. Schematic diagram of filling resin containing magnetic powder and magnetic columns;
  • Figure 11 is a schematic diagram of arranging a fourth circuit on the other surface of the second circuit board when manufacturing the sixth circuit board in the embodiment of the planar transformer manufacturing method of the present invention
  • Figure 12 is a schematic diagram of the seventh circuit board produced by lamination for the third time in the embodiment of the planar transformer manufacturing method of the present invention.
  • Figure 13 is a schematic diagram of manufacturing the eighth circuit board in the embodiment of the planar transformer manufacturing method of the present invention.
  • Figure 14 is a cross-sectional view along the thickness direction when the planar transformer adopts an "I"-shaped magnetic core structure according to the embodiment of the present invention.
  • FIG. 15 is a cross-sectional view along the thickness direction of the planar transformer according to the embodiment of the present invention when it adopts a side "Sun"-shaped magnetic core structure.
  • Main component description 11. The first circuit board, 111. The first copper clad laminate, 1111. The first circuit; 12. The second circuit board, 121. The second copper-clad board, 1211. The second circuit; 13. The third circuit board, 1301. The third pressure-bearing board 14. The fourth circuit board, 1401. The third circuit, 1402. The first through hole 15. The fifth circuit board, 1501. The fourth pressure-bearing board; 16. The sixth circuit board, 1601. Accommodation hole, 1602. Resin containing magnetic powder, 1603. Magnetic column, 1604. The fourth circuit; 17. The seventh circuit board, 1701. The fifth pressure-bearing board; 18. The eighth circuit board, 1801. The fifth circuit; 1802. The second through hole; 21. The first magnetic component, 211. The first prepreg, 212.
  • the first magnetic sheet 213.
  • the first pressure-bearing plate 214.
  • the second magnetic component 221.
  • the second prepreg 222.
  • the second magnetic sheet 223.
  • the second pressure-bearing plate 224.
  • the second copper foil 301.
  • the first adhesive film 302. The second adhesive film.
  • the directional words used such as “up, down, left, right", etc. are usually directed to the direction shown in the drawings, or to the vertical position of the component itself. , vertical or gravity direction; similarly, for ease of understanding and description, “inside and outside” refers to the inside and outside relative to the outline of each component itself, but the above directional terms are not used to limit the present invention.
  • a step when a step is described as continuing to another step, the step may be directly connected to the other step, or may be connected to the other step through a third step. ;
  • a layer/component when a layer/component is described as being “laminated” to another layer/component, that layer/component can be “laminated directly” to the other layer/component, or it can be “laminated” through a third layer/component on that other layer/component.
  • FIG 1 is a schematic diagram of the pressing sequence of the PCB buried magnet of the present invention, including the first pressing Y1, the second pressing Y2 and the third pressing Y3.
  • the planar transformer of the present invention is produced below with reference to Figures 2 to 13. The embodiment of the method will be described in detail.
  • the planar transformer manufacturing method of the present invention includes the following steps:
  • Step S1 Make a first circuit board 11 and a second circuit board 12.
  • the first circuit board 11 is a copper-clad laminate with a first circuit 1111 provided on one surface
  • the second circuit board 12 is provided with a second circuit 1111 on one surface.
  • a first copper-clad board 111 and a second copper-clad board 121 are provided.
  • a first circuit 1111 is made on the first copper-clad board 111 as a primary side winding circuit of the planar transformer.
  • the first circuit board 11 is obtained, and in the second Make the second circuit 1211 on the copper-clad board 121 as the secondary winding circuit of the planar transformer to obtain the second circuit board 12;
  • Step S2 Make the first magnetic component 21 and the second magnetic component 22.
  • the first magnetic component 21 includes the first prepreg 211, the first magnetic sheet 212, the first pressure-bearing plate 213 and the first copper foil 214.
  • the first magnetic sheet 212 is filled in the through-groove recess of the first prepreg 211, and the first pressure-bearing plate 213 and the first copper foil 214 are stacked in sequence on one surface of the first prepreg 211 after filling the first magnetic piece 212;
  • the second magnetic component 22 It includes a second prepreg 221, a second magnet 222, a second pressure-bearing plate 223 and a second copper foil 224.
  • the second magnet 222 is filled in the through-groove recess of the second prepreg 221.
  • the second pressure-bearing plate 223 and the second copper foil 224 Two copper foils 224 are stacked in sequence on one surface of the second prepreg 221 after filling the second magnetic sheet 222;
  • the first prepreg 211 and the second prepreg 221 are provided with through-holes; the first adhesive film 301, the second adhesive film 302, the first adhesive film 301 and the second adhesive film 302 are sticky high-temperature adhesive films; the first copper foil 214 and the second copper foil 224; the first pressure-bearing plate 213 and the second pressure-bearing plate 223; the first magnetic sheet 212 and the second pressure-bearing plate 223.
  • Magnetic sheet 222 first cover the first adhesive film 301 on the first prepreg 211, then face the through-groove notch of the first prepreg 211 upward, fill the first magnetic piece 212 into the through-groove notch of the first prepreg 211, and then The first pressure-bearing plate 213 and the first copper foil 214 are stacked in sequence, and the first magnetic component 21 is formed by lamination. Finally, the first adhesive film 301 is removed; and the second magnetic component 22 is made by the same method;
  • a first circuit board 11, a third pressure-bearing plate 1301 and a first magnetic component 21 are provided.
  • the first circuit 1111 in the first circuit board 11 is placed upward, and the first magnetic component in the first magnetic component 21 is placed upward.
  • the piece 212 is placed downward, and then the third pressure-bearing plate 1301 and the first magnetic component 21 are stacked on the first circuit board 11 in sequence; the third circuit board 13 is formed by the first pressing Y1;
  • Step S4 Make a fourth circuit board 14.
  • the fourth circuit board 14 is based on the third circuit board 13, and is provided with a third circuit 1401 on the other surface of the first circuit board 11 and on the top of the third circuit board 13.
  • a first through hole 1402 is provided between the bottom layers, where the third line 1401 is the second half of the turns of the primary winding of the planar device, and the first through hole 1402 is used for the electrical connection between the primary winding and the top pad of the transformer;
  • Figure 7 is a cross-sectional view after completing the production of the third circuit 1401 and the setting of the first through hole 1402 based on the third circuit board 13 in Figure 6;
  • Step S5 Make a fifth circuit board 15.
  • the fifth circuit board 15 is a laminated structure in which the second circuit board 12 and the fourth circuit board 14 are pressed together through the fourth pressure-bearing plate 1501, in which the second circuit 1211 and the third circuit board 15 are pressed together.
  • the lines 1401 are located on both sides of the fourth pressure-bearing plate 1501;
  • Figure 8 provides a second circuit board 12, a fourth pressure-bearing plate 1501 and a fourth circuit board 14.
  • the second circuit 1211 on the second circuit board is placed upward, and the third circuit 1401 on the fourth circuit board 14 is placed upward. facing down Place, and then stack the fourth pressure-bearing plate 1501 and the fourth circuit board 14 sequentially on the second circuit board 12, and form the fifth circuit board 15 by pressing Y2 for the second time;
  • Step S6 Make a sixth circuit board 16.
  • the sixth circuit board 16 is based on the fifth circuit board 15, with magnetic pillars 1603 provided therein, and a fourth circuit is provided on the other surface of the second circuit board 12. 1604.
  • the fourth line 1604 is used for the second half of the turns of the secondary side coil winding.
  • the magnetic column 1603 is provided in the fifth circuit board 15 and penetrates the second circuit board 12, the fourth pressure-bearing plate 1501, the first
  • the circuit board 11 and the third pressure-bearing plate 131 enable the first line 1111, the second line 1211, the third line 1401 and the fourth line 1604 to form a concentration with the magnetic column 1603, the first magnetic piece 212 and the second magnetic piece 222.
  • a receiving hole 1601 is opened on the fifth circuit board 15, and the receiving hole 1601 penetrates the second circuit board 12, the fourth pressure-bearing plate 1501, the first circuit board 11 and the third pressure-bearing plate 1301;
  • a fourth circuit 1604 is provided on the other surface of the second circuit board 12, thereby obtaining the sixth circuit board 16;
  • Step S7 Make a seventh circuit board 17.
  • the seventh circuit board 17 is a laminated structure in which the second magnetic component 22 and the sixth circuit board 16 are pressed together through the fifth pressure-bearing plate 1701, in which the second magnetic piece 222 and the sixth circuit board 17 are pressed together.
  • the four lines 1604 are respectively located on both sides of the fifth pressure-bearing plate 1701;
  • a second magnetic assembly 22 a fifth pressure-bearing plate 1701 and a sixth circuit board 16 are provided.
  • the second magnetic piece 222 in the second magnetic assembly 22 is placed upward, and the fourth magnetic piece 222 in the sixth circuit board 16 is Place the circuit 1604 downward, stack the fifth pressure-bearing plate 1701 and the sixth circuit board 16 sequentially on the second magnetic component 22, and form the seventh circuit board 17 through the third pressing Y3;
  • Step S8 Make an eighth circuit board 18 to obtain the planar transformer of the present invention.
  • the eighth circuit board 18 is provided with outer circuits 1801 on the basis of the seventh circuit board 17 and is provided between the top and bottom layers of the seventh circuit board 17. Second through hole 1802.
  • the outer circuit 1801 is used for electrical connection with external circuits. It is generally set as a pad. It can also be used for other circuit wiring of devices used in planar transformers (such as switching power supplies, etc.).
  • the second pass Hole 1802 is used for the electrical connection of the secondary side coil winding to external traces or top pads and then also Soldering resist (ink), electroplating (electrode nickel plating/nickel target gold) and other operations can be performed to facilitate welding or improve reliability.
  • the present invention also provides a planar transformer produced by the above planar transformer production method. Please refer to Figure 13 for the structure of the produced transformer.
  • the number of magnetic columns in Figure 13 is 1, so the magnetic core is an I-shaped magnetic core composed of the first magnetic piece 212, the second magnetic piece 222 and the magnetic column 1603.
  • the first line 1111, the second line 1211, the third The line 1401 and the fourth line 1604 surround the magnetic column 1603. See Figure 14 for a cross-sectional view along the thickness direction of a planar transformer using this magnetic core structure.
  • the planar transformer in the embodiment of the present invention can also form other magnetic core structures by setting the number and position of the magnetic columns 1603.
  • the number of magnetic columns 1603 is 3, one of which is the middle column, two of which are side columns, and the side columns are arranged in parallel.
  • the first magnetic piece 212, the second magnetic piece 222 and the magnetic column 1603 form an inverted "sun" shaped magnetic core structure.
  • the first line 1111, the second line 1211, the third line 1401 and The fourth line 1604 surrounds the area where the center column is disposed between the two side columns. See Figure 15 for a cross-sectional view along the thickness direction of a planar transformer using this magnetic core structure.

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  • Coils Or Transformers For Communication (AREA)

Abstract

本发明公开了一种平面变压器的制作方法，其包括以下步骤：制作包含第一线路的第一线路板和包含第二线路的第二线路板；利用半固化片、磁片、承压板和铜箔堆叠制作第一磁性组件和第二磁性组件；将第一线路板通过第三承压板与第一磁性组件压合在一起制作第三线路板；在第三线路板上设置第三线路和第一通孔制作第四线路板；将第二线路板通过第四承压板与第四线路板压合在一起制作第五线路板；在第五线路板中设置磁柱制作第六线路板；将第二磁性组件通过第五承压板与第六线路板压合在一起制作第七线路板；在第七线路板的基础上设置外层线路及第二通孔获得所述平面变压器。本发明能提高埋磁PCB中平面变压器的耦合系数，并降低压合制程中的板翘不良。

Description

一种平面变压器制作方法及平面变压器 技术领域
本发明属于感性器件领域，具体涉及一种平面变压器制作方法及平面变压器。
背景技术
目前，随着开关电源PCB技术的发展，使用埋磁工艺技术替代传统的表面贴装技术来制作平面变压器的方案应运而生，其具有小体积，无需变压器贴片的技术优点；但目前行业内埋入磁块的工艺暂未完全成熟，埋入磁块的形状也比较单一，如单一埋入磁片或者磁柱，其中单一埋入磁片在导电线圈绕组的上下层，因缺乏贯穿线圈的磁中柱，磁路为半闭合状态，磁片间的磁场紊乱，一次侧和二侧线圈的耦合系数低，变压器的传输效率差；另一方面，因在线路板内埋入了与PCB板材膨胀系数差异很大的金属氧化物磁块(磁片或磁柱)，很容易因为压合不对称，造成制程过程中严重的板翘不良。
发明内容
有鉴如此，本发明要解决的技术问题是提供一种平面变压器制作方法及平面变压器，旨在克服上述现有技术中至少一种缺陷，提高埋磁PCB中平面变压器的耦合系数，并降低压合制程中的板翘不良。
作为本发明的第一个方面，所提供的平面变压器制作方法的实施例如下：
一种平面变压器制作方法，包括如下步骤：
制作第一线路板11和第二线路板12，所述第一线路板11为其一个表面上设置有第一线路1111的覆铜板，所述第二线路板12为其一个表面上设置有第二线路1211的覆铜板；
制作第一磁性组件21和第二磁性组件22，所述第一磁性组件21包括第一半固化片211、第一磁片212、第一承压板213和第一铜箔214，所述第一磁片212填充在所述第一半固化片211的贯通槽凹口内，所述第一承压板213和所述第一铜箔214依次堆叠在填充所述第一磁片212后的所述第一半固化片211的一个表面上；所述第二磁性组件22包括第二半固化片221、第二磁片222、第二承压板223和第二铜箔224，所述第二磁片222填充在所述第二半固化片 221的贯通槽凹口内，所述第二承压板223和所述第二铜箔224依次堆叠在填充所述第二磁片222后的所述第二半固化片221的一个表面上；
制作第三线路板13，所述第三线路板13为所述第一线路板11通过第三承压板1301与所述第一磁性组件21压合在一起的层叠结构，其中所述第一线路1111和所述第一磁片212分别位于所述第三承压板1301的两侧；
制作第四线路板14，所述第四线路板14为在所述第三线路板13的基础上，于所述第一线路板11另一个表面上设置第三线路1401、于所述第三线路板13的顶底层之间设置第一通孔1402；
制作第五线路板15，所述第五线路板15为所述第二线路板12通过第四承压板1501与所述第四线路板14压合在一起的层叠结构，其中所述第二线路1211和所述第三线路1401分别位于所述第四承压板1501的两侧；
制作第六线路板16，所述第六线路板16为所述第五线路板15的基础上，在其中设置有磁柱1603，并在所述第二线路板12的另一个表面上设置有第四线路1604，所述磁柱1603设置于所述第五线路板15中，并贯通所述第二线路板12、所述第四承压板1501、所述第一线路板11和所述第三承压板131，使得所述第一线路1111、所述第二线路1211、所述第三线路1401和所述第四线路1604能与所述磁柱1603、所述第一磁片212和所述第二磁片222形成集中磁路；
制作第七线路板17，所述第七线路板17为所述第二磁性组件22通过第五承压板1701与所述第六线路板16压合在一起的层叠结构，其中所述第二磁片222和所述第四线路1604分别位于所述第五承压板1701的两侧；
制作第八线路板18获得所述平面变压器，所述第八线路板18为在所述第七线路板17的基础上设置外层线路1801，并在所述第七线路板17的顶底层之间设置第二通孔1802。
进一步地，第一磁性组件21和/或所述第二磁性组件22的制作包括如下步骤：
把胶膜覆贴在半固化片上；
将所述半固化片贯通槽凹口朝上，把磁片填入所述半固化片贯通槽凹口内；
将承压板和铜箔依次堆叠在填充所述磁片后的所述半固化片的一个表面上，然后进行压合；
撕除所述胶膜。
进一步地，所述第六线路板16的制作包括如下步骤：
在所述第五线路板15上开设收容孔1601，所述收容孔1601贯通所述第二线路板12、所述第四承压板1501、所述第一线路板11和所述第三承压板1301；
在所述收容孔1601中一次性填入含磁粉树脂1602，所述含磁粉树脂1602在所述收容孔1601中所占的体积小于所述收容孔1601的体积；
在所述收容孔1601中填入所述磁柱1603；
在所述第二线路板12的另一个表面上设置所述第四线路1604，从而获得所述第六线路板16。
作为本发明的第二个方面，所提供的平面变压器的实施例如下：
一种平面变压器，由上述第一个方面中任一项所述平面变压器制作方法所制得。
进一步地，所述磁柱1603的数量为1，所述第一磁片212、所述第二磁片222和所述磁柱1603组成“工”字型磁芯结构，所述第一线路1111、所述第二线路1211、所述第三线路1401和所述第四线路1604环绕于所述磁柱1603。
进一步地，所述磁柱1603数量为3，其中一个为中柱，两个为边柱，所述边柱平行设置于所述中柱的左右两侧，使得所述第一磁片212、所述第二磁片222和所述磁柱1603组成倒“日”字型磁芯结构，所述第一线路1111、所述第二线路1211、所述第三线路1401和所述第四线路1604环绕于所述中柱设置在所述两个边柱之间的区域。
进一步地，所述磁柱1603与所述第二磁片222之间留有气隙。
术语说明：
线路：流过电流的载体，制作方法为在覆铜板上使用光刻胶确定局部蚀刻区域，然后曝光显影，酸洗去除光刻胶和多余铜箔，形成线圈图形；
半固化片：又称“PP片”，是多层板生产中的主要材料之一，主要由树脂和增强材料组成；
承压板：也称“PP片”，同样是多层板生产中的主要材料之一，主要由树 脂和增强材料组成；
集中磁路：在通常情况下，磁通因线圈绕组带电而产生，且环绕着导电线圈流通，空气的磁导率为1，因此环绕在空气中的绕组线圈导电后的磁通会围绕绕组分散开来，从而磁路不集中，当在两个磁片中间增加高磁导率磁柱之后，因磁柱磁导率远大于1，提供了一个高速导通的磁路径，从而使磁通量集中在磁柱中流通，称为集中磁路。
与现有技术相比，本发明的有益效果在于：
(1)在埋磁的平面变压器中上下磁片间加入了磁柱，从而使平面变压器的磁路闭合，提高一次侧绕组和二次侧绕组的耦合系数，降低线圈涡流损耗，改善PCB埋磁平面变压器的传输效率；
(2)线路板分三次压合，可有效降低因导入膨胀系数差异大的金属磁块和不对称压合造成的压合制程中板翘不良。
附图说明
图1为本发明的PCB埋磁的压合顺序示意图；
图2为本发明平面变压器制作方法实施例中制作第一线路板和第二线路板的示意图；
图3为第一半固化片和第二半固化平的结构示意图；
图4为本发明平面变压器制作方法实施例中第一半固化片与第一胶膜覆贴、第二半固化片与第二胶膜覆贴的示意图；
图5为本发明平面变压器制作方法实施例中第一磁性组件和第二磁性组件的示意图；
图6为本发明平面变压器制作方法实施例中第一次压合制作第三线路板的示意图；
图7为本发明平面变压器制作方法实施例中制作第四线路板的示意图；
图8为本发明平面变压器制作方法实施例中第二次压合制作第五线路板的示意图；
图9为本发明平面变压器制作方法实施例中制作第六线路板时在第五线路板上开设收容孔的示意图；
图10为本发明平面变压器制作方法实施例中制作第六线路板时在收容孔 中填入含磁粉树脂和磁柱的示意图；
图11为本发明平面变压器制作方法实施例中制作第六线路板时在第二线路板的另一个表面上设置第四线路的示意图；
图12为本发明平面变压器制作方法实施例中第三次压合制作第七线路板的示意图；
图13为本发明平面变压器制作方法实施例中制作第八线路板的示意图；
图14为本发明实施例的平面变压器采用“工”字型磁芯结构时沿厚度方向的剖视图；
图15为本发明实施例的平面变压器采用侧“日”字型磁芯结构时沿厚度方向的剖视图。
主要构件说明：
11.第一线路板，111.第一覆铜板，1111.第一线路；
12.第二线路板，121.第二覆铜板，1211.第二线路；
13.第三线路板，1301.第三承压板
14.第四线路板，1401.第三线路，1402.第一通孔
15.第五线路板，1501.第四承压板；
16.第六线路板，1601.收容孔，1602.含磁粉树脂，1603.磁柱，1604.第四
线路；
17.第七线路板，1701.第五承压板；
18.第八线路板，1801.第五线路；1802.第二通孔；
21.第一磁性组件，211.第一半固化片，212.第一磁片，213.第一承压板，
214.第一铜箔；
22.第二磁性组件，221.第二半固化片，222.第二磁片，223.第二承压板，
224.第二铜箔；
301.第一胶膜，302.第二胶膜。
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本发明。
除非另有指明，本申请使用的所有技术和科学术语具有与本申请所属技术 领域的普通技术人员通常理解的相同含义。
在本发明中，在未作相反说明的情况下，使用的方位词如“上、下、左、右”等通常是针对附图所示的方向而言的，或者是针对部件本身在竖直、垂直或重力方面的方向而言的；同样地，为便于理解和描述，“内、外”是指相对于各部件本身的轮廓的内、外，但上述方位词并不用于限制本发明。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“步骤S1”、“步骤S2”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述本申请的实施例。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或结构的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或结构，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或结构。
应该理解的是，在说明书、权利要求书以及说明书附图中，当描述有步骤接续至另一步骤时，该步骤可直接接续至该另一步骤，或者通过第三步骤接续至该另一步骤；当描述有板层/部件“层叠”于另一板层/部件时，该板层/部件可“直接层叠”于该另一板层/部件，或者通过第三板层/部件“层叠”于该另一板层/部件。
图1为本发明的PCB埋磁的压合顺序示意图，包括第一次压合Y1、第二次压合Y2和第三次压合Y3，下面结合图2至图13对本发明的平面变压器制作方法的实施例进行详细说明，本发明的平面变压器制作方法包括如下步骤：
步骤S1，制作第一线路板11和第二线路板12，第一线路板11为其一个表面上设置有第一线路1111的覆铜板，第二线路板12为其一个表面上设置有第二线路1211的覆铜板；
请参考图2，提供第一覆铜板111以及第二覆铜板121，在第一覆铜板111上制作第一线路1111，作为平面变压器一次侧绕组线路，获得第一线路板11，以及在第二覆铜板121上制作第二线路1211，作为平面变压器二次侧绕组线路，获得第二线路板12；
步骤S2，制作第一磁性组件21和第二磁性组件22，第一磁性组件21包括第一半固化片211、第一磁片212、第一承压板213和第一铜箔214，第一磁片 212填充在第一半固化片211的贯通槽凹口内，第一承压板213和第一铜箔214依次堆叠在填充第一磁片212后的第一半固化片211的一个表面上；第二磁性组件22包括第二半固化片221、第二磁片222、第二承压板223和第二铜箔224，第二磁片222填充在第二半固化片221的贯通槽凹口内，第二承压板223和第二铜箔224依次堆叠在填充第二磁片222后的第二半固化片221的一个表面上；
请参考图3至图5，准备第一半固化片211、第二半固化片221，第一半固化片211和第二半固化片221开有贯通槽孔；第一胶膜301、第二胶膜302，第一胶膜301和第二胶膜302为带粘性的高温胶膜；第一铜箔214、第二铜箔224；第一承压板213,、第二承压板223；第一磁片212、第二磁片222；首先把第一胶膜301覆贴在第一半固化片211上，然后第一半固化片211贯通槽凹口朝上，把第一磁片212填入第一半固化片211贯通槽凹口内，再依次叠放第一承压板213和第一铜箔214，并通过压合形成第一磁性组件21，最后撕除第一胶膜301；并通过同样的方法制作第二磁性组件22；
请参考图6，提供第一线路板11、第三承压板1301和第一磁性组件21，第一线路板11中的第一线路1111朝上放置，第一磁性组件21中的第一磁片212朝下放置，然后在第一线路板11上依次叠放第三承压板1301和第一磁性组件21；通过第一次压合Y1形成第三线路板13；
步骤S4，制作第四线路板14，第四线路板14为在第三线路板13的基础上，于第一线路板11另一个表面上设置第三线路1401、于第三线路板13的顶底层之间设置第一通孔1402，其中第三线路1401为平面器一次侧绕组的第二半部分圈数，第一通孔1402用于一次侧绕组与变压器顶部焊盘的电气连接；
请参考图7，为在图6第三线路板13的基础上，完成第三线路1401制作，同时完成第一通孔1402设置后的截面图；
步骤S5，制作第五线路板15，第五线路板15为第二线路板12通过第四承压板1501与第四线路板14压合在一起的层叠结构，其中第二线路1211和第三线路1401分别位于第四承压板1501的两侧；
请参考图8，提供第二线路板12、第四承压板1501和第四线路板14，第二线路板上的第二线路1211朝上放置，第四线路板14上的第三线路1401朝下 放置，然后在第二线路板12上依次叠放第四承压板1501和第四线路板14，通过第二次压合Y2形成第五线路板15；
步骤S6，制作第六线路板16，第六线路板16为第五线路板15的基础上，在其中设置有磁柱1603，并在第二线路板12的另一个表面上设置有第四线路1604，第四线路1604用于二次侧线圈绕组的第二半部分圈数，磁柱1603设置于第五线路板15中，并贯通第二线路板12、第四承压板1501、第一线路板11和第三承压板131，使得第一线路1111、第二线路1211、第三线路1401和第四线路1604能与磁柱1603、第一磁片212和第二磁片222形成集中磁路；
请参考图9，在第五线路板15上开设收容孔1601，收容孔1601贯通第二线路板12、第四承压板1501、第一线路板11和第三承压板1301；
请参考图10，在收容孔1601中填入含磁粉树脂1602，含磁粉树脂1602在收容孔1601中所占的体积小于收容孔1601的体积；然后在收容孔1601中填入磁柱1603；
请参考图11，在第二线路板12的另一个表面上设置第四线路1604，从而获得第六线路板16；
步骤S7，制作第七线路板17，第七线路板17为第二磁性组件22通过第五承压板1701与第六线路板16压合在一起的层叠结构，其中第二磁片222和第四线路1604分别位于第五承压板1701的两侧；
请参考图12，提供第二磁性组件22、第五承压板1701和第六线路板16，第二磁性组件22中的第二磁片222朝上放置，第六线路板16中的第四线路1604朝下放置，在第二磁性组件22上依次叠放第五承压板1701和第六线路板16，通过第三次压合Y3压合形成第七线路板17；
步骤S8，制作第八线路板18获得本发明的平面变压器，第八线路板18为在第七线路板17的基础上设置外层线路1801，并在第七线路板17的顶底层之间设置第二通孔1802。
请参考图13，外层线路1801用于用于与外部电路的电气连接，一般设置为焊盘，也可为平面变压器所应用的装置(如开关电源等)的其他电路走线，第二通孔1802用于二次侧线圈绕组与外部线路或顶部焊盘的电气连接，然后还 可以进行阻焊(油墨)、电镀(电极镀镍/镍靶金)等操作，以方便焊接或提高可靠性。
本发明还提供通过上述平面变压器制作方法制作的平面变压器，所制得的变压器的结构请参考图13。
图13中的磁柱数量为1，从而磁芯为包括第一磁片212、第二磁片222和磁柱1603组成的工字型磁芯，第一线路1111、第二线路1211、第三线路1401和第四线路1604环绕于磁柱1603，采用此种磁芯结构的平面变压器沿厚度方向的剖视图请参见图14。
本发明实施例的平面变压器通过设置磁柱1603的数量和位置，还可以形成其它的磁芯结构，例如磁柱1603数量为3，其中一个为中柱，两个为边柱，边柱平行设置于中柱的左右两侧，使得第一磁片212、第二磁片222和磁柱1603组成倒“日”字型磁芯结构，第一线路1111、第二线路1211、第三线路1401和第四线路1604环绕于中柱设置在两个边柱之间的区域，采用此种磁芯结构的平面变压器沿厚度方向的剖视图请参见图15。
进一步地，磁柱1603与第二磁片222之间留有气隙，从而能提高平面变压器的抗饱和能力，使得变压器可以承受更大的工作电流及降低PCB压合对磁片带来的机械应力使感量下降的影响。
以上仅为本发明的优选可行的实施例，非因此局限本发明的保护范围，故运用本发明说明书及附图内容所做的等效技术变化，均包含于本发明的保护范围内。

Claims (7)

  1. 一种平面变压器制作方法，其特征在于，包括如下步骤：
    制作第一线路板(11)和第二线路板(12)，所述第一线路板(11)为其一个表面上设置有第一线路(1111)的覆铜板，所述第二线路板(12)为其一个表面上设置有第二线路(1211)的覆铜板；
    制作第一磁性组件(21)和第二磁性组件(22)，所述第一磁性组件(21)包括第一半固化片(211)、第一磁片(212)、第一承压板(213)和第一铜箔(214)，所述第一磁片(212)填充在所述第一半固化片(211)的贯通槽凹口内，所述第一承压板(213)和所述第一铜箔(214)依次堆叠在填充所述第一磁片(212)后的所述第一半固化片(211)的一个表面上；所述第二磁性组件(22)包括第二半固化片(221)、第二磁片(222)、第二承压板(223)和第二铜箔(224)，所述第二磁片(222)填充在所述第二半固化片(221)的贯通槽凹口内，所述第二承压板(223)和所述第二铜箔(224)依次堆叠在填充所述第二磁片(222)后的所述第二半固化片(221)的一个表面上；
    制作第三线路板(13)，所述第三线路板(13)为所述第一线路板(11)通过第三承压板(1301)与所述第一磁性组件(21)压合在一起的层叠结构，其中所述第一线路(1111)和所述第一磁片(212)分别位于所述第三承压板(1301)的两侧；
    制作第四线路板(14)，所述第四线路板(14)为在所述第三线路板(13)的基础上，于所述第一线路板(11)另一个表面上设置第三线路(1401)、于所述第三线路板(13)的顶底层之间设置第一通孔(1402)；
    制作第五线路板(15)，所述第五线路板(15)为所述第二线路板(12)通过第四承压板(1501)与所述第四线路板(14)压合在一起的层叠结构，其中所述第二线路(1211)和所述第三线路(1401)分别位于所述第四承压板(1501)的两侧；
    制作第六线路板(16)，所述第六线路板(16)为所述第五线路板(15)的基础上，在其中设置有磁柱(1603)，并在所述第二线路板(12)的另一个表面上设置有第四线路(1604)，所述磁柱(1603)设置于所述第五线路板(15)中，并贯通所述第二线路板(12)、所述第四承压板(1501)、所述第一线路板(11)和所述第三承压板(131)，使得所述第一线路(1111)、所述第二线路(1211)、 所述第三线路(1401)和所述第四线路(1604)能与所述磁柱(1603)、所述第一磁片(212)和所述第二磁片(222)形成集中磁路；
    制作第七线路板(17)，所述第七线路板(17)为所述第二磁性组件(22)通过第五承压板(1701)与所述第六线路板(16)压合在一起的层叠结构，其中所述第二磁片(222)和所述第四线路(1604)分别位于所述第五承压板(1701)的两侧；
    制作第八线路板(18)获得所述平面变压器，所述第八线路板(18)为在所述第七线路板(17)的基础上设置外层线路(1801)，并在所述第七线路板(17)的顶底层之间设置第二通孔(1802)。
  2. 根据权利要求1所述平面变压器制作方法，其特征在于，第一磁性组件(21)和/或所述第二磁性组件(22)的制作包括如下步骤：
    把胶膜覆贴在半固化片上；
    将所述半固化片贯通槽凹口朝上，把磁片填入所述半固化片贯通槽凹口内；
    将承压板和铜箔依次堆叠在填充所述磁片后的所述半固化片的一个表面上，然后进行压合；
    撕除所述胶膜。
  3. 根据权利要求1所述平面变压器制作方法，其特征在于，所述第六线路板(16)的制作包括如下步骤：
    在所述第五线路板(15)上开设收容孔(1601)，所述收容孔(1601)贯通所述第二线路板(12)、所述第四承压板(1501)、所述第一线路板(11)和所述第三承压板(1301)；
    在所述收容孔(1601)中一次性填入含磁粉树脂(1602)，所述含磁粉树脂(1602)在所述收容孔(1601)中所占的体积小于所述收容孔(1601)的体积；
    在所述收容孔(1601)中填入所述磁柱(1603)；
    在所述第二线路板(12)的另一个表面上设置所述第四线路(1604)，从而获得所述第六线路板(16)。
  4. 一种平面变压器，其特征在于：由权利要求1至3任一项所述平面变压器制作方法所制得。
  5. 根据权利要求4所述平面变压器，其特征在于：所述磁柱(1603)的数量为1，所述第一磁片(212)、所述第二磁片(222)和所述磁柱(1603)组成“工”字型磁芯结构，所述第一线路(1111)、所述第二线路(1211)、所述第三线路(1401)和所述第四线路(1604)环绕于所述磁柱(1603)。
  6. 根据权利要求4所述平面变压器，其特征在于：所述磁柱(1603)数量为3，其中一个为中柱，两个为边柱，所述边柱平行设置于所述中柱的左右两侧，使得所述第一磁片(212)、所述第二磁片(222)和所述磁柱(1603)组成倒“日”字型磁芯结构，所述第一线路(1111)、所述第二线路(1211)、所述第三线路(1401)和所述第四线路(1604)环绕于所述中柱设置在所述两个边柱之间的区域。
  7. 根据权利要求5所述的一种平面变压器，其特征在于：
    所述磁柱(1603)与所述第二磁片(222)之间留有气隙。
PCT/CN2023/098773 2022-09-05 2023-06-07 一种平面变压器制作方法及平面变压器 WO2024051235A1 (zh)

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