WO2024048669A1

WO2024048669A1 - Package and lid member

Info

Publication number: WO2024048669A1
Application number: PCT/JP2023/031592
Authority: WO
Inventors: 亮太間嶌; 昭宏加藤
Original assignee: 日本電気硝子株式会社
Priority date: 2022-08-31
Filing date: 2023-08-30
Publication date: 2024-03-07

Abstract

A lid member 4 of this package 1 has a top plate part 8a that is configured in the form of a flat plate, a side wall part 8b that is linked to the top plate part 8a, and a frame part 7 that is formed surrounding the side wall part 8b. The side wall part 8b has an inner surface 8b1 that is linked to an inner surface 8a1 of the top plate part 8a, and an outer surface 8b2 that is linked to an outer surface 8a2 of the top plate part 8a. The side wall part 8b is inclined such that the inner surface 8b1 of the side wall part 8b forms an obtuse angle relative to the inner surface 8a1 of the top plate part 8a. The lid member 4 satisfies the relationship T1b < T2, where T1b is the thickness of a midway section of the side wall part, and T2 is the thickness of the frame part.

Description

Package and lid parts

The present invention relates to a package and a lid member for the package.

Some packages that house light-emitting elements include a base that supports the light-emitting element, and a lid member that is fixed to the base so as to cover the light-emitting element. Such a package is mounted on an optical member such as an LED lighting device. For example, in the package disclosed in Patent Document 1, the lid member includes a side wall portion (frame portion) welded to the base (base material), and a lid portion welded to the side wall portion so as to cover an opening at one end of the side wall portion. It is equipped with

Japanese Patent Application Publication No. 2022-18817

In the conventional package, the light from the light emitting element mainly passes through the lid of the lid member and is emitted to the outside. In addition, a part of the light from the light emitting element also reaches the side wall of the lid member and is emitted to the outside through this side wall. In order to improve the light extraction efficiency in the package, it is necessary to efficiently radiate the light that has reached not only the lid part of the lid member but also the side wall part to the outside.

A technical problem of the present invention is to improve the light extraction efficiency in a package including a light emitting element.

(1) The present invention is for solving the above problems, and includes a light emitting element, a base supporting the light emitting element, and a lid member fixed to the base so as to cover the light emitting element. In the package, the lid member includes a top plate portion configured in a flat plate shape, a side wall portion connected to the top plate portion, and a frame portion formed around the side wall portion; The plate portion has an inner surface and an outer surface, the side wall portion has an inner surface connected to the inner surface of the top plate portion, and an outer surface connected to the outer surface of the top plate portion, and the side wall portion has an inner surface connected to the inner surface of the top plate portion. , the inner surface of the side wall portion is inclined so as to form an obtuse angle with respect to the inner surface of the top plate portion, the thickness of the midway portion of the side wall portion is T1b, and the thickness of the frame portion is T2. , T1b<T2.

According to this configuration, by configuring the side wall portion in an inclined shape so that the inner surface of the side wall portion of the lid member forms an obtuse angle with respect to the inner surface of the top plate portion, the light from the light emitting element that emits radially is directed to the side wall. It becomes easier for the light to enter perpendicularly to the inner surface of the part. Thereby, the optical path length of the light inside the side wall portion can be made as short as possible, and the light extraction efficiency in the package can be improved. Furthermore, by making the thickness T1b of the middle part of the sidewall part thinner than the thickness T2 of the frame part (T1b<T2), the optical path length of the light inside the sidewall part can be made as short as possible. It becomes possible to improve the light extraction efficiency.

(2) In the configuration described in (1) above, it is preferable that a value T1b/T2 obtained by dividing the thickness T1b of the midway portion of the side wall portion by the thickness T2 of the frame portion is 0.6 to 0.95. . If the value of T1b/T2 is within the above range, the light extraction efficiency from the sidewall is improved by shortening the optical path length of the light inside the sidewall as much as possible while maintaining the strength of the sidewall. can be done. Moreover, if the value of T1b/T2 is within the above range, it is possible to avoid deterioration in the moldability of the top plate portion. To explain in detail, it becomes easier to make the thickness of the top plate portion uniform.

(3) In the structure described in (1) or (2) above, it is preferable that the thickness of the side wall portion becomes continuously thinner from the frame portion side toward the top plate portion side. According to this configuration, the thickness of the side wall portion can be made as small as possible as it approaches the top plate portion of the lid member, so that the efficiency of extracting light from the side wall portion can be improved. Furthermore, the thickness of the side wall portion can be made as large as possible as it approaches the frame portion. Therefore, it is possible to increase the strength of the boundary between the side wall and the frame, where stress concentration tends to occur.

(4) In the configuration described in any one of (1) to (3) above, if the thickness of the top plate portion is T3, it is preferable that the relationship T3<T1b is satisfied. According to this configuration, it is possible to improve the efficiency of extracting light from the top plate portion of the lid member.

(5) In the configuration described in any one of (1) to (4) above, a value T3/T1b obtained by dividing the thickness T3 of the top plate portion by the thickness T1b of the midway portion of the side wall portion is 0.5 to 0. Preferably, it is .95. If the value of T3/T1b is within the above range, the light extraction efficiency in the top plate can be improved by making the optical path length of the light inside the top plate as short as possible. Furthermore, by increasing the thickness of the side wall as much as possible, it is possible to maintain the strength of the side wall. Moreover, if the value of T3/T1b is within the above range, it is possible to avoid deterioration in the moldability of the top plate portion. To explain in detail, it becomes easier to make the thickness of the top plate portion uniform.

(6) In the configuration described in any one of (1) to (5) above, it is preferable that the side wall portion and the frame portion are integrally formed. For example, when the side wall portion and the frame portion are joined via a joint portion, there is a possibility that light extraction efficiency may be reduced due to scattering of light from the light emitting element by the joint portion at the boundary between the side wall portion and the frame portion. Furthermore, there is a possibility that the strength of the joint may be reduced. On the other hand, according to the above-mentioned configuration, by avoiding the scattering of the light of the light emitting element at the boundary between the side wall and the frame, the light extraction efficiency can be improved, and a decrease in strength due to the joint can be avoided. .

(7) In the configuration described in any one of (1) to (6) above, the side wall portion and the top plate portion may be integrally formed. For example, when the side wall portion and the top plate portion are joined via a joint portion, there is a possibility that the light extraction efficiency may be reduced due to scattering of light from the light emitting element by the joint portion at the boundary between the side wall portion and the top plate portion. Furthermore, there is a possibility that the strength of the joint may be reduced. On the other hand, according to the above-mentioned configuration, light extraction efficiency can be improved by avoiding scattering of light from the light emitting element at the boundary between the side wall part and the top plate part, and a decrease in strength due to the joint part can be avoided. can.

(8) In the configuration described in any one of (1) to (7) above, the outer surface of the top plate portion is preferably a polished surface. According to this configuration, light extracted from the package can be prevented from being scattered on the outer surface of the top plate portion, and the light extraction efficiency can be improved.

(9) In the configuration described in any one of (1) to (8) above, the package may include a joint portion that joins the frame portion and the base body. According to this configuration, the lid member can be easily and firmly fixed to the base body via the joint.

(10) In the configuration described in (9) above, the lid member includes a connecting part that connects the side wall part and the frame part, the connecting part has an inner surface and an outer surface, and the connecting part has an inner surface and an outer surface, The inner surface and the outer surface of the portion may be configured in a curved shape. In this way, the strength of the lid member can be improved by connecting the side wall portion and the frame portion with the connecting portion having the curved inner and outer surfaces.

(11) In the configuration according to any one of (1) to (10) above, the angle formed by the inner surface of the side wall portion and the inner surface of the top plate portion may be 120° or more and 160° or less. good. According to this configuration, the optical path length of the light from the light emitting element inside the side wall portion can be made as short as possible, and the light extraction efficiency is improved.

(12) In the configuration according to any one of (1) to (11) above, the lid member includes a connecting portion that connects the side wall portion and the top plate portion, and the connecting portion has an inner surface and and an outer surface, and the inner surface and the outer surface of the connecting portion may be configured in a curved shape. According to this configuration, the strength of the lid member can be improved by connecting the side wall portion and the top plate portion using the connecting portion having the curved inner and outer surfaces.

(13) In the configuration according to any one of (1) to (12) above, the top plate portion is located away from the light emitting element, and the distance between the top plate portion and the light emitting element is: It may be 20 μm or more and 100 μm or less. According to this configuration, it is possible to reduce the size of the optical member on which the package is mounted by reducing the height of the package as much as possible while avoiding the risk of the light emitting element and the top plate coming into contact with each other.

(14) The present invention is intended to solve the above-mentioned problems, and is a lid member used for a package, which includes a top plate portion configured in a flat plate shape, a side wall portion connected to the top plate portion, and a lid member used for a package. a frame portion formed around a side wall portion, the top plate portion having an inner surface and an outer surface, the side wall portion having an inner surface connected to the inner surface of the top plate portion, and a frame portion formed around the top plate portion; and an outer surface connected to the outer surface of the side wall section, the side wall section is inclined such that the inner surface of the side wall section forms an obtuse angle with the inner surface of the top plate section, and the side wall section has an outer surface connected to the outer surface of the side wall section. When the thickness is T1b and the thickness of the frame portion is T2, it is characterized by satisfying the relationship T1b<T2.

(15) In the configuration described in (14) above, it is preferable that a value T1b/T2 obtained by dividing the thickness T1b of the midway portion of the side wall portion by the thickness T2 of the frame portion is 0.6 to 0.95. . If the value of T1b/T2 is within the above range, the light extraction efficiency from the sidewall is improved by shortening the optical path length of the light inside the sidewall as much as possible while maintaining the strength of the sidewall. can be done. Moreover, if the value of T1b/T2 is within the above range, it is possible to avoid deterioration of the moldability of the top plate portion. To explain in detail, it becomes easier to make the thickness of the top plate portion uniform.

(16) In the structure described in (14) or (15) above, it is preferable that the thickness of the side wall portion becomes continuously thinner from the frame portion side toward the top plate portion side. According to this configuration, the thickness of the side wall portion can be made as small as possible as it approaches the top plate portion of the lid member, so that the efficiency of extracting light from the side wall portion can be improved. Furthermore, the thickness of the side wall portion can be made as large as possible as it approaches the frame portion. Therefore, it is possible to increase the strength of the boundary between the side wall and the frame, where stress concentration tends to occur.

(17) In the configuration described in any one of (14) to (16) above, it is preferable that the relationship T3<T1b is satisfied, where the thickness of the top plate portion is T3. According to this configuration, it is possible to improve the efficiency of extracting light from the top plate portion of the lid member.

(18) In the configuration described in any one of (14) to (17) above, a value T3/T1b obtained by dividing the thickness T3 of the top plate portion by the thickness T1b of the midway portion of the side wall portion is 0.5 to Preferably it is 0.95. If the value of T3/T1b is within the above range, the light extraction efficiency in the top plate can be improved by making the optical path length of the light inside the top plate as short as possible. Furthermore, by increasing the thickness of the side wall as much as possible, it is possible to maintain the strength of the side wall. Moreover, if the value of T3/T1b is within the above range, it is possible to avoid deterioration in the moldability of the top plate portion. To explain in detail, it becomes easier to make the thickness of the top plate portion uniform.

(19) In the configuration described in any one of (14) to (18) above, it is preferable that the side wall portion and the frame portion are integrally formed. For example, when joining a side wall part and a frame part through a joint part, there is a risk that the light extraction efficiency will decrease due to scattering of light from the light emitting element by the joint part at the boundary between the side wall part and the frame part. There is a possibility that the strength may decrease depending on the part. On the other hand, according to the above-mentioned configuration, by avoiding the scattering of the light of the light emitting element at the boundary between the side wall and the frame, the light extraction efficiency can be improved, and a decrease in strength due to the joint can be avoided. .

(20) In the configuration described in any one of (14) to (19) above, the side wall portion and the top plate portion may be integrally formed. For example, when the side wall portion and the top plate portion are joined via a joint portion, there is a possibility that the light extraction efficiency may be reduced due to scattering of light from the light emitting element by the joint portion at the boundary between the side wall portion and the top plate portion. Furthermore, there is a possibility that the strength of the joint may be reduced. On the other hand, according to the above-mentioned configuration, light extraction efficiency can be improved by avoiding scattering of light from the light emitting element at the boundary between the side wall part and the top plate part, and a decrease in strength due to the joint part can be avoided. can.

(21) In the configuration described in any one of (14) to (20) above, the outer surface of the top plate portion is preferably a polished surface. According to this configuration, light extracted from the package can be prevented from being scattered on the outer surface of the top plate portion, and the light extraction efficiency can be improved.

(22) In the configuration described in any one of (14) to (21) above, the lid member includes a connecting part that connects the side wall part and the frame part, and the connecting part has an inner surface and an outer surface. The inner surface and the outer surface of the connecting portion may have a curved shape. In this way, the strength of the lid member can be improved by connecting the side wall portion and the frame portion with the connecting portion having the curved inner and outer surfaces.

(23) In the configuration according to any one of (14) to (22) above, the angle formed by the inner surface of the side wall portion and the inner surface of the top plate portion may be 120° or more and 160° or less. good. According to this configuration, the optical path length of the light from the light emitting element inside the side wall portion can be made as short as possible, and the light extraction efficiency is improved.

(24) In the configuration described in any one of (14) to (23) above, the lid member includes a connecting portion that connects the side wall portion and the top plate portion, and the connecting portion has an inner surface and and an outer surface, and the inner surface and the outer surface of the connecting portion may be configured in a curved shape. According to this configuration, the strength of the lid member can be improved by connecting the side wall portion and the top plate portion using the connecting portion having the curved inner and outer surfaces.

(25) The lid member according to any one of (14) to (24) above may include a plurality of the top plate portions and the side wall portions. According to this configuration, the lid member can cover a plurality of light emitting elements.

According to the present invention, it is possible to improve the light extraction efficiency in a package including a light emitting element.

FIG. 3 is a cross-sectional view of the package. FIG. 3 is a cross-sectional view of the package. FIG. 3 is a cross-sectional view of the base. FIG. 3 is a plan view of the base. It is a sectional view of a lid member. It is a bottom view of a lid member. FIG. 3 is a cross-sectional view showing a preparation process of the package manufacturing method. FIG. 3 is a cross-sectional view showing a preparation process of the package manufacturing method. FIG. 3 is a cross-sectional view showing a film forming process in the package manufacturing method. FIG. 3 is a cross-sectional view showing a bonding step in the package manufacturing method. FIG. 3 is a cross-sectional view showing a bonding step in the package manufacturing method. It is a sectional view showing a glass substrate for manufacturing a lid member for a package. It is a sectional view showing other examples of a lid member. FIG. 7 is a plan view showing another example of the lid member. FIG. 7 is a plan view showing another example of the lid member. FIG. 7 is a cross-sectional view showing another example of the preparation process of the package manufacturing method. FIG. 7 is a sectional view showing another example of the package. It is a figure which shows the state where the side wall part of a lid member is irradiated with light.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. 1 to 18 illustrate one embodiment of a package according to the present invention.

As shown in FIGS. 1 and 2, the package 1 includes a base 2, a light emitting element 3 supported by the base 2, a transparent lid member 4 fixed to the base 2 so as to cover the light emitting element 3, and a lid. A sealing portion 5 that airtightly fixes the member 4 to the base 2 is provided.

3 and 4 show the base 2 before the lid member 4 is joined. The base body 2 has a first main surface 2a that supports the light emitting element 3, a second main surface 2b located on the opposite side of the first main surface 2a, and a metal layer 6 formed on the first main surface 2a. .

Examples of the material of the base body 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics and glass powder, Fe-Ni-Co alloy, and Cu-W alloy. , Kovar (registered trademark), and the like.

As shown in FIG. 4, the metal layer 6 has a frame shape surrounding the light emitting element 3. Although the metal layer 6 has a rectangular shape, it is not limited to this shape. The metal layer 6 may be configured to have a circular shape, for example, so as to surround the light emitting element 3.

The metal layer 6 includes three layers: a base layer, an intermediate layer, and a surface layer in order from the first principal surface 2a side. Examples of metals used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. Examples of the metal used for the intermediate layer include Ni, Pt, and Pd. Examples of metals used for the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used for the metal layer 6 may be a single substance or an alloy.

Examples of the method for forming the metal layer 6 on the first main surface 2a of the base 2 include a sputtering method, a vacuum evaporation method, a vacuum evaporation method using ion assist or ion plating, and a CVD method. Can be mentioned.

The light emitting element 3 is fixed to the first main surface 2a of the base 2. In this embodiment, a package 1 using an ultraviolet irradiation LED as the light emitting element 3 is illustrated, but the light emitting element 3 according to the present invention is not limited to this embodiment, and may employ an infrared LED or a visible light LED. can do.

5 and 6 show the lid member 4 before being joined to the base 2. The lid member 4 is manufactured by molding a part of plate glass. The glass used for the lid member 4 is preferably alkali-free glass, borosilicate glass, aluminosilicate glass, quartz glass, or crystallized glass. If alkali-free glass, borosilicate glass, or aluminosilicate glass is used, it is possible to achieve both high transmittance and high processability during molding. In addition, quartz glass can have significantly high transmittance in the ultraviolet region while maintaining workability during molding. Further, if it is a crystallized glass, it is possible to achieve both high transmittance and high breaking strength.

When the glass is borosilicate glass, aluminosilicate glass, or alkali-free glass, the glass composition, in mass %, is SiO ₂ : 50 to 75%, Al ₂ O ₃ : 1 to 25%, B ₂ O ₃ : 1. It is preferable to contain up to 30%, Li ₂ O+Na ₂ O+K ₂ O: 0 to 20%, and MgO+CaO+SrO+BaO: 0 to 20%. If the composition of the glass is within the above composition range, it falls under these glass types.

In the case of crystallized glass, the glass composition in mass % is SiO ₂ : 60-80%, Al ₂ O ₃ : 3-30%, Li ₂ O+Na ₂ O+K ₂ O: 1-20%, MgO+CaO+SrO+BaO: 5-20. % and in which β-quartz solid solution or β-spodumene is precipitated as crystals from inside the glass. Here, low thermal expansion refers to a thermal expansion coefficient of -10×10 ^-7 /°C to 20×10 ^-7 /°C in a temperature range of 30 to 300°C.

As shown in FIGS. 2 and 5, the lid member 4 includes a plate-shaped frame 7, a protrusion 8 protruding from the frame 7, and a connecting portion 9 connecting the frame 7 and the protrusion 8. A first anti-reflection film 10a and a second anti-reflection film 10b are provided.

The frame portion 7 is a plate-shaped portion configured to surround the protrusion portion 8 . The frame portion 7 has, for example, a constant thickness, but is not limited to this aspect. The thickness of the frame portion 7 is, for example, 0.2 mm or more and 2 mm or less. The frame portion 7 has a first main surface 7a and a second main surface 7b located on the opposite side of the first main surface 7a. The surface roughness (arithmetic mean roughness) Ra of the first main surface 7a and the second main surface 7b is preferably 1 nm or less, more preferably 0.5 nm or less, still more preferably 0.3 nm or less.

The protrusion 8 is for forming a housing space for the light emitting element 3 together with the first main surface 2a of the base 2. Although the protruding portion 8 is formed at the center position of the frame portion 7, the present invention is not limited to this aspect.

The protruding portion 8 includes a top plate portion 8a having a flat plate shape, a side wall portion 8b connected to the top plate portion 8a, and a connecting portion 8c connecting the top plate portion 8a and the side wall portion 8b.

The top plate portion 8a has a rectangular shape in plan view or bottom view (see FIG. 6), but is not limited to this shape. The top plate portion 8a has an inner surface 8a1 and an outer surface 8a2. The inner surface 8a1 and the outer surface 8a2 are configured by, for example, flat surfaces. The surface roughness (arithmetic mean roughness) Ra of the inner surface 8a1 and the outer surface 8a2 is preferably 1 nm or less, more preferably 0.5 nm or less, still more preferably 0.3 nm or less. The inner surface 8a1 and the outer surface 8a2 of the top plate portion 8a are configured to be substantially parallel. The outer surface 8a2 of the top plate portion 8a is preferably a polished surface. The polished surface refers to a surface polished by mechanical polishing or chemical polishing.

The area of the top plate portion 8a in a plan view is larger than the area of the light emitting element 3 in a plan view. The ratio (A1/A2) between the area (A1) of the light emitting element 3 and the area (A2) of the top plate portion 8a is, for example, 0.7 to 0.8, but is not limited to this range.

The top plate portion 8a is located away from the light emitting element 3. The distance D between the top plate portion 8a and the light emitting element 3 (see FIG. 2) is 20 μm or more and 100 μm or less, preferably 30 μm or more and 90 μm or less, and most preferably 40 μm or more and 60 μm or less.

It is preferable that the distance in the thickness direction between the inner surface 8a1 of the top plate portion 8a and the first main surface 7a of the frame portion 7 is, for example, 0.1 mm or more and 1.0 mm or less. Thereby, the height of the package 1 can be made as low as possible while avoiding the possibility that the light emitting element 3 and the top plate part 8a come into contact with each other, and the optical member on which the package is mounted can be made smaller.

One end of the side wall portion 8b is connected to the top plate portion 8a by a connecting portion 8c, and the other end is connected to the frame portion 7 by a connecting portion 9. The side wall portion 8b is inclined with respect to the frame portion 7 and the top plate portion 8a. The side wall portion 8b has an inner surface 8b1 and an outer surface 8b2. The surface roughness (arithmetic mean roughness) Ra of the inner surface 8b1 and outer surface 8b2 of the side wall portion 8b is preferably 1 nm or less, more preferably 0.5 nm or less, still more preferably 0.3 nm or less.

The inner surface 8b1 of the side wall portion 8b is connected to the first main surface 7a of the frame portion 7 via a connecting portion 9 that connects the frame portion 7 and the protruding portion 8. The inner surface 8b1 of the side wall portion 8b is inclined at an angle θ1 with respect to the reference line BL drawn along the first main surface 7a of the frame portion 7. It is preferable that this inclination angle θ1 is, for example, 20° or more and 60° or less.

The inner surface 8b1 of the side wall portion 8b is connected to the inner surface 8a1 of the top plate portion 8a via the connecting portion 8c. The side wall portion 8b is inclined such that the inner surface 8b1 of the side wall portion 8b forms an obtuse angle with respect to the inner surface 8a1 of the top plate portion 8a. It is preferable that the angle θ2 that the inner surface 8b1 of the side wall portion 8b makes with respect to the inner surface 8a1 of the top plate portion 8a is, for example, 120° or more and 160° or less.

It is preferable that the side wall portion 8b and the top plate portion 8a are not formed by joining individual members, but are integrally formed by heat-forming a part of a plate glass. Thereby, at the boundary between the side wall portion 8b and the top plate portion 8a, it is possible to improve the light extraction efficiency by avoiding scattering of the light of the light emitting element 3 due to the joint portion, and also to avoid a decrease in strength due to the joint portion. Can be done.

The outer surface 8b2 of the side wall portion 8b is connected to the outer surface 8a2 of the top plate portion 8a via the connecting portion 8c. The outer surface 8b2 of the side wall portion 8b is connected to the second main surface 7b of the frame portion 7 via the connecting portion 9.

The connecting portion 8c has an inner surface 8c1 and an outer surface 8c2. The surface roughness (arithmetic mean roughness) Ra of the inner surface 8c1 and outer surface 8c2 of the connecting portion 8c is preferably 1 nm or less, more preferably 0.5 nm or less, still more preferably 0.3 nm or less.

The inner surface 8c1 and outer surface 8c2 of the connecting portion 8c are configured in a curved shape. The radius of curvature of the inner surface 8c1 and the outer surface 8c2 is, for example, 0.1 mm or more and 0.5 mm or less, but is not limited to this range and can be set as appropriate depending on the size of the protrusion 8.

As shown in FIGS. 2 and 5, the connecting portion 9 has an inner surface 9a and an outer surface 9b. The surface roughness (arithmetic mean roughness) Ra of the inner surface 9a and outer surface 9b of the connecting portion 9 is preferably 1 nm or less, more preferably 0.5 nm or less, still more preferably 0.3 nm or less.

The inner surface 9a and outer surface 9b of the connecting portion 9 are configured in a curved shape. The radius of curvature of the inner surface 9a and outer surface 9b of the connecting portion 9 is, for example, 0.1 mm or more and 0.5 mm or less, but is not limited to this range and can be set as appropriate depending on the size of the protrusion 8.

The thickness of the side wall portion 8b becomes continuously (gradually) thinner from the frame portion 7 side toward the top plate portion 8a side. As shown in FIG. 2, the side wall portion 8b has a lower portion 8b3, a middle portion 8b4, and an upper portion 8b5.

The lower portion 8b3, midway portion 8b4, and upper portion 8b5 of the side wall portion 8b are defined as follows. That is, as shown in FIG. 2, the boundary between the outer surface 8b2 of the side wall portion 8b and the outer surface 9b of the connecting portion 9 (hereinafter referred to as "first boundary") is S1. Further, the boundary between the outer surface 8b2 of the side wall portion 8b and the outer surface 8c2 of the connecting portion 8c (hereinafter referred to as "second boundary") is S2.

The outer surface 8b2 of the side wall portion 8b from the first boundary portion S1 to the second boundary portion S2 is divided into six equal parts. As a result, the position of the boundary part X1 closest to the frame part 7 among the boundary parts of the six equally divided parts is set as the lower part 8b3 of the side wall part 8b. Further, the position of the boundary Y1 that bisects the outer surface 8b2 of the side wall 8b from the first boundary S1 to the second boundary S2 is defined as a midway portion 8b4 of the side wall 8b. Furthermore, the position of the boundary part Z1 closest to the top plate part 8a is assumed to be the upper part 8b5 of the side wall part 8b.

As shown in FIG. 2, a straight line perpendicular to the inner surface of the side wall 8b is drawn from the boundary X1 at the lower part 8b3 of the side wall 8b. At this time, the intersection of this straight line and the inner surface 8b1 of the side wall portion 8b is defined as X2. The distance from the boundary X1 to the intersection X2 is referred to as the thickness of the lower portion 8b3, and is indicated by the symbol T1a. The thickness T1a of the lower portion 8b3 is preferably 0.1 mm or more and 2 mm or less, more preferably 0.1 mm or more and 1.5 mm or less.

At the midway portion 8b4 of the side wall 8b, draw a straight line perpendicular to the inner surface 8b1 of the side wall 8b from the boundary Y1. At this time, the intersection of this straight line and the inner surface 8b1 of the side wall portion 8b is defined as Y2. The distance from the boundary Y1 to the intersection Y2 is referred to as the thickness of the midway portion 8b4, and is indicated by the symbol T1b. The thickness T1b of the midway portion 8b4 is preferably 0.08 mm or more and 1.8 mm or less, more preferably 0.08 mm or more and 1.3 mm or less.

As shown in FIG. 2, when the thickness of the frame portion 7 is T2, the relationship between the thickness T2 of the frame portion 7 and the thickness T1b of the midway portion 8b4 is preferably T1b<T2. The value T1b/T2 obtained by dividing the thickness T1b of the middle portion 8b4 of the side wall portion 8b by the thickness T2 of the frame portion 7 is preferably 0.6 or more and 0.95 or less, more preferably 0.6 or more and 0.85. It is as follows.

As shown in FIG. 2, when the thickness of the top plate part 8a is T3, the relationship between the thickness T3 of the top plate part 8a and the thickness T1b of the middle part 8b4 of the side wall part 8b is T3<T1b. is preferred. The value T3/T1b obtained by dividing the thickness T3 of the top plate portion 8a by the thickness T1b of the midway portion 8b4 of the side wall portion 8b is preferably 0.5 or more and 0.95 or less, more preferably 0.5 or more and 0.85. It is as follows.

At the upper part 8b5 of the side wall 8b, a straight line perpendicular to the inner surface 8b1 of the side wall 8b is drawn from the boundary Z1. At this time, the intersection of this straight line and the inner surface of the side wall portion 8b is defined as Z2. The distance from the boundary Z1 to the intersection Z2 is referred to as the thickness of the upper portion 8b5, and is indicated by the symbol T1c. The thickness T1c of the upper portion 8b5 is preferably 0.03 mm or more and 1.6 mm or less, more preferably 0.03 mm or more and 1.4 mm or less.

Each of the

antireflection films

10a and 10b has a multilayer film structure that alternately includes, for example, a silicon oxide film (SiO ₂ ) as a first film and a hafnium oxide film (HfO ₂ ) as a second film. The thickness of each

antireflection film

10a, 10b is preferably 0.15 μm or more and 0.8 μm or less.

The first anti-reflection film 10a is coated on the inner surface of the protruding portion 8 (each inner surface 8a1, 8b1, 8c1 of the top plate portion 8a, side wall portion 8b, and connecting portion 8c), the first main surface 7a of the frame portion 7, and the connecting portion. The inner surface 9a of 9 is coated.

The first antireflection film 10a includes an antireflection portion 10a1 formed on the inner surface of the protruding portion 8 and the inner surface 9a of the connecting portion 9, and a buffer portion 10a2 formed on the first main surface 7a of the frame portion 7. . The buffer portion 10a2 has a function of not only preventing reflection of ultraviolet rays but also relieving stress acting on the frame portion 7 when the lid member 4 is joined to the base body 2.

The second anti-reflection film 10b is coated on the outer surface of the protruding portion 8 (the outer surfaces 8a2, 8b2, 8c2 of the top plate portion 8a, side wall portion 8b, and connecting portion 8c), the second main surface 7b of the frame portion 7, and the connecting portion. The outer surface 9b of 9 is coated.

If the light extraction efficiency in the package 1 is sufficient, there is no need to form the second antireflection film 10b. However, when glass with low weather resistance, such as borosilicate glass, is used for the lid member 4, there is a possibility that the lid member 4 will deteriorate due to the external environment, resulting in a decrease in light extraction efficiency. In this case, instead of forming the second antireflection film 10b on the lid member 4, it is also possible to form a SiO ₂ film or an Al ₂ O ₃ film as a weather-resistant film. Furthermore, it is also possible to form a weather-resistant film such as an SiO ₂ film or an Al ₂ O ₃ film to be laminated on the second antireflection film 10b.

As shown in FIGS. 2 and 5, a metal layer 11 and a bonding portion 12 are formed in the buffer portion 10a2 of the first antireflection film 10a. The Young's modulus of the buffer portion 10a2 is preferably 250 GPa or less, more preferably 200 GPa or less, still more preferably 150 GPa or less, particularly preferably 100 GPa or less. By defining the upper limit of Young's modulus in this way, the buffering performance of the buffer portion 10a2 can be improved, and the effect of relieving stress caused by the difference in thermal expansion coefficient between the joint portion 12 and the lid member 4 (frame portion 7) is achieved. You can get . Note that the thermal expansion coefficient of the frame portion 7 is smaller than that of the joint portion 12. Further, the thermal expansion coefficient of the frame portion 7 is smaller than that of the base body 2.

As shown in FIG. 5, the metal layer 11 is formed to overlap the buffer portion 10a2. The metal layer 11 is formed on the surface of the buffer section 10a2 opposite to the surface of the buffer section 10a2 that contacts the first main surface 7a of the frame section 7. As shown in FIG. 6, the metal layer 11 has a rectangular frame shape corresponding to the shape of the metal layer 6 of the base 2. As shown in FIG. The shape of the metal layer 11 is not limited to this embodiment. The metal layer 11 may have a circular shape or other various frame shapes. The metal layer 11 includes three layers, a base layer, an intermediate layer, and a surface layer, in order from the buffer portion 10a2 side.

Examples of metals used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. When Cr is used for the base layer, the Young's modulus of the base layer is preferably 279 GPa or less. Examples of the metal used for the intermediate layer include Ni, Pt, and Pd. Examples of metals used for the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used for the metal layer 11 may be a single substance or an alloy.

As shown in FIGS. 5 and 6, the joint portion 12 is configured in a layered manner so as to overlap the metal layer 11. As shown in FIG. 5, the joint portion 12 is in contact with a portion of the metal layer 11 that is opposite to the portion that is in contact with the buffer portion 10a2. As shown in FIG. 6, the joint portion 12 has a rectangular frame shape corresponding to the shapes of the buffer portion 10a2 and the metal layer 11. The shape of the joint portion 12 is not limited to this embodiment, and may be circular or other various frame shapes.

The joint portion 12 is made of a metal-based joint material. As the metal bonding material, those commercially available as solder materials and brazing materials can be used. Examples of the metal bonding material include Au--Sn alloy, Pb--Sn alloy, Au--Ge alloy, Sn--Ni alloy, and the like. In this embodiment, a case will be described in which an Au--Sn alloy is used as the metal-based bonding material.

The sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 11 of the lid member 4 at the joint portion 12.

Next, a method for manufacturing the package 1 will be explained. This method includes a preparation step of preparing the base body 2 and the lid member 4, and a joining step of joining the base body 2 and the lid member 4.

In the preparation step, after forming the metal layer 6 on the first main surface 2a of the base 2, the light emitting element 3 is mounted on the first main surface 2a.

Furthermore, in the preparation process, after the lid member 4 is formed by molding the protrusion 8 on a plate glass, the

antireflection films

10a and 10b are formed on the lid member 4. Thereafter, a metal layer 11 and a bonding portion 12 are formed on the buffer portion 10a2 of the first antireflection film 10a.

Hereinafter, the process of manufacturing the lid member 4 will be explained with reference to FIGS. 7 to 9. This process includes a molding process and a film forming process.

Figure 7 shows a molding device used in the molding process. The forming device 13 includes a support stand 14 that supports the plate glass GS, a forming member 15 that forms the plate glass GS, a heating source (not shown) arranged above the support stand 14, and fixes the plate glass GS to the support stand 14. It mainly includes a fixing member P.

The support stand 14 has a support part 14a that supports the glass plate GS, and a space part 14b that has an opening surrounded by the support part 14a and allows thermal deformation of a part of the glass plate GS. The support part 14a of the support stand 14 has a support surface that supports a part of the main surface of the glass plate GS.

The molded member 15 is accommodated in the space 14b of the support base 14. The molding member 15 has a molding surface 15a that contacts the glass plate GS, and a suction part 15b that sucks the glass plate GS. The molding member 15 can change its relative position with the support base 14 so as to adjust the distance between the molding surface 15a and the support portion 14a of the support base 14.

The molding surface 15a is configured as a flat surface in order to mold the top plate portion 8a of the lid member 4. The surface roughness (arithmetic mean roughness) Ra of the molding surface 15a is, for example, 0.1 nm or more and 10 nm or less.

The suction part 15b includes a plurality of holes passing through the molded member 15. The suction section 15b is connected to a suction pump (not shown).

The fixing member P is configured to press the end of the glass plate GS from its upper surface. The fixing member P fixes the glass plate GS to the support base 14 by sandwiching the end of the glass plate GS together with the support portion 14a of the support base 14.

In the forming process, as shown in FIG. 7, the plate glass GS is placed on the support stand 14. The support stand 14 supports the plate glass GS by the support part 14a. Thereafter, the glass plate GS is heated by the heat source, and the air present in the space 14b of the support stand 14 is sucked by the suction part 15b of the support stand 14.

As shown in FIG. 8, the central part of the glass plate GS is deformed by heating by the heating source and suction by the suction part 15b. As a result, a protrusion 8 is formed in the center of the glass plate GS, and the portion of the glass plate GS supported by the support portion 14a of the support stand 14 becomes the frame portion 7.

Specifically, the center portion of the glass plate GS contacts the molding surface 15a of the molding member 15. Thereby, the top plate part 8a of the protrusion part 8 is formed in the center part of the glass plate GS. Further, a side wall portion 8b is formed in an inclined shape between the top plate portion 8a and the frame portion 7. At the same time, a connecting portion 8c of the protruding portion 8 and a connecting portion 9 connecting the frame portion 7 and the side wall portion 8b of the protruding portion 8 are formed on the glass plate GS. Thereby, this plate glass GS becomes a lid member before forming

antireflection films

10a and 10b.

In the molding process, the thickness (T2) of the frame portion 7 does not change because it is fixed by the fixing member P. On the other hand, the thicknesses (T1a to T1c, T3) of the top plate portion 8a and the side wall portions 8b change depending on the molding process. That is, through the molding process, the top plate portion 8a is deformed so that its thickness becomes thinner. Furthermore, since the top plate portion 8a is molded by the molding surface 15a of the molding member 15, its thickness becomes approximately constant. Further, the side wall portion 8b is stretched by the suction portion 15b and deforms so that its thickness gradually decreases from the frame portion 7 side toward the top plate portion 8a side.

The above molding device 13 can adjust the angle of the side wall portion 8b with respect to the frame portion 7 or the top plate portion 8a of the lid member 4. That is, the inclination angle of the side wall portion 8b of the lid member 4 can be adjusted by adjusting the heating temperature by the heating source, the heating time, the suction force by the suction part 15b, or the position of the molded member 15 with respect to the support base 14. .

After the molding process is completed, a film forming process is performed. FIG. 9 shows a film forming apparatus used in the film forming process. In this embodiment, a sputtering apparatus such as a magnetron sputtering apparatus is exemplified as a film forming apparatus, but the present invention is not limited to this configuration, and a film forming apparatus that performs other physical vapor deposition methods such as a vacuum evaporation method may be used. You may.

The film forming apparatus 16 includes a vacuum chamber 17 and

targets

18a and 18b that scatter particles that become the film forming material for the

antireflection films

10a and 10b.

The vacuum chamber 17 accommodates

targets

18a and 18b therein. The internal space of the vacuum chamber 17 is set to a predetermined degree of vacuum by a vacuum pump. An inert gas such as argon gas may be supplied into the vacuum chamber 17 .

The

targets

18a and 18b include a first target 18a for forming the first antireflection film 10a on the lid member 4, and a second target 18b for forming the second antireflection film 10b on the lid member 4. . In addition to these

targets

18a and 18b, targets (not shown) for forming the metal layer 11 are arranged in the vacuum chamber 17.

The first target 18a and the second target 18b are a plurality of targets in order to form the first film (SiO ₂ ) and second film (HfO ₂ ) in the first antireflection film 10a and the second antireflection film 10b. including.

As shown in FIG. 9, in the film forming process, the lid member 4 is housed in the vacuum chamber 17. Thereafter, particles scattered from the first target 18a are attached to one surface of the lid member 4, thereby forming the first antireflection film 10a. Similarly, particles scattered from the second target 18b are attached to the other surface of the lid member 4, thereby forming the second antireflection film 10b.

After forming the

antireflection films

10a and 10b on the lid member 4, a metal layer 11 is formed so as to overlap the buffer portion 10a2 of the first antireflection film 10a. The metal layer 11 is formed by causing particles scattered from a target (not shown) for forming the metal layer 11 to adhere to the buffer portion 10a2 using the film forming apparatus 16 described above. The metal layer 11 is formed into a frame shape by attaching particles to the buffer portion 10a2 through a mask member.

After that, the bonding portion 12 is formed so as to overlap the metal layer 11. The joint portion 12 is formed, for example, by a process (coating process) of applying a paste-like metal-based bonding material so as to overlap the metal layer 11 . Specific examples of the coating process include a printing method using a mask (screen printing method), a coating method using a dispenser, and the like.

The method for forming the bonding portion 12 is not limited to the above method. For example, a molded body of a metal bonding material formed in advance into a predetermined frame shape may be arranged so as to overlap the metal layer 11 on the first main surface 7a of the frame portion 7. It may also be formed by

When the metal-based bonding material for the bonding portion 12 is applied to the metal layer 11, a heat treatment step is performed to fix the metal-based bonding material to the metal layer 11. The heat treatment process includes a heating process and a cooling process.

In the heating step, the metal bonding material can be melted by heating the lid member 4 using a heating device such as a reflow oven. The heating step may be performed, for example, with the furnace filled with nitrogen. In the heating step, the lid member 4 is heated to a temperature of 300° C. or higher.

In the cooling process, the metal-based bonding material melted on the first main surface 7a of the frame portion 7 is solidified by being cooled. In the cooling step, it is preferable to perform slow cooling at a cooling rate of 50° C./min. In the cooling process, stress is generated in the lid member 4 due to the difference in thermal expansion coefficient between the frame portion 7 and the joint portion 12, but the buffer portion 10a2 of the first antireflection film 10a can relieve this stress. .

As shown in FIG. 10, in the bonding process, the lid member 4 manufactured through the preparation process is stacked on the base body 2. Specifically, the first main surface 7a of the frame 7 of the lid member 4 is opposed to the base 2, and the joint portion 12 is brought into contact with the metal layer 6 formed on the first main surface 2a of the base 2.

Next, as shown in FIG. 11, the pressing member 19 is placed on the frame 7 of the lid member 4. The pressing member 19 includes a weight 19a and a support member 19b that supports the weight 19a. The weight 19a and the support member 19b are made of metal or ceramic, for example.

The support member 19b has a first support part 19b1 that supports the weight 19a, and a second support part 19b2 that supports the first support part 19b1.

The first support portion 19b1 has a support surface (upper surface) on which the weight 19a is placed. The second support portion 19b2 includes a plurality of rod-shaped members. The second support portion 19b2 protrudes downward from the lower surface of the first support portion 19b1.

The second support portion 19b2 has a contact portion 19b3 that contacts the frame portion 7 of the lid member 4. The contact portion 19b3 has a pointed shape. The contact portion 19b3 contacts the second main surface 7b of the frame portion 7 via the second antireflection film 10b.

The pressing member 19 presses the lid member 4 while standing on the lid member 4 by each contact portion 19b3 of the plurality of second support portions 19b2 contacting the frame portion 7. By pressing the lid member 4 with the pressing member 19, the joint portion 12 formed on the frame portion 7 of the lid member 4 and the metal layer 6 formed on the first main surface 2a of the base body 2 are brought into close contact. be able to.

Thereafter, the metal layer 6 and the bonding portion 12 are heated in a state in which they are brought into pressure contact (heating step). As a result, the metal-based bonding material of the bonding portion 12 is in a molten state. Note that in this heating step, since the pointed contact portion 19b3 of the second support portion 19b2 contacts the frame portion 7 of the lid member 4, the contact area between the contact portion 19b3 and the frame portion 7 is made as small as possible. can do. Thereby, heat transfer from the frame portion 7 to the second support portion 19b2 of the pressing member 19 can be minimized.

Thereafter, the molten metal-based bonding material is solidified by cooling (cooling step). In the cooling process, stress is generated in the frame part 7 due to the difference in thermal expansion coefficient between the base body 2 and the frame part 7 of the lid member 4. In this case, the buffer portion 10a2 of the first antireflection film 10a relieves this stress. Thereby, damage to the frame portion 7 can be reduced.

When the cooling process is completed, the sealing part 5 is formed by joining the metal layer 6 of the base 2 and the metal layer 11 of the lid member 4 together at the joint part 12. Through the above steps, the package 1 whose airtightness is maintained is completed.

FIG. 12 shows an example of a glass substrate for manufacturing the lid member 4. The glass substrate G includes a frame portion 7, a plurality of protruding portions 8 (a plurality of top plate portions 8a and a plurality of side wall portions 8b) protruding from the frame portion 7, a connecting portion 9, and

antireflection films

10a and 10b. Equipped with Each protrusion 8 has the same configuration as the protrusion 8 of the lid member 4 described above. Each of the protrusions 8 is formed by thermally deforming a plurality of locations of the large plate glass GS using the above-mentioned molding device 13. By cutting this glass substrate G along the cutting line CL, a plurality of lid members having the frame portion 7, the protruding portion 8, the connecting portion 9, and the

antireflection films

10a and 10b can be efficiently manufactured. Note that the first antireflection film 10a may include a metal layer 11 and a bonding portion 12.

FIG. 13 shows another example of the lid member. In this example, the lid member 4 includes a frame portion 7, a plurality of protruding portions 8 (a plurality of top plate portions 8a and a plurality of side wall portions 8b) protruding from the frame portion 7, a connecting portion 9, and an antireflection film 10a. , 10b, a metal layer 11 and a joint portion 12. Each component of this lid member 4 has the same configuration as the lid member 4 described above (FIG. 5). When a plurality of light emitting elements 3 are mounted on the base 2, this lid member 4 can individually seal each light emitting element 3 with a plurality of protrusions 8.

14 and 15 are plan views showing other examples of the lid member. In this example, the lid member 4 includes a frame 7, a plurality of protrusions 8 arranged in double rows and double rows,

antireflection films

10a and 10b (the first antireflection film 10a is not shown), It has a metal layer 11 (not shown) and a bonding part 12 (not shown). The lid member 4 shown in FIG. 14 has a plurality of protrusions 8 that are circular in plan view. On the other hand, the lid member 4 shown in FIG. 15 has a plurality of protrusions 8 having a rectangular shape in plan view. Note that for the lid member 4 having a plurality of protrusions 8 arranged in double rows and double rows, a scribe line is inserted into the smooth surface between adjacent protrusions 8, and the lid member 4 is inserted along this scribe line. By cutting or dicing using a blade dicing method or a laser ablation method, a plurality of lid members can be obtained, and a lid member of an arbitrary shape can be obtained.

FIG. 16 shows another example of the lid member manufacturing method (preparation step in the package manufacturing method). This example shows a step of forming a bonding portion 12 on a glass substrate G on which

antireflection films

10a and 10b and a metal layer 11 are formed. Specifically, a case will be described in which the glass substrate G is fixed to the support device 20 when forming the joint portion 12 by a screen printing method.

The support device 20 includes a support plate 21 that supports the glass substrate G, and a suction table 23 that supports the support plate 21.

The support plate 21 is configured to be detachable from the suction table 23. The support plate 21 has an opening 22 into which the protruding part 8 and the connecting part 9 of the glass substrate G can be inserted. The support plate 21 can be inserted into the opening 22 with the protrusion 8 of the glass substrate G with the protrusion 8 facing downward, without coming into contact with the protrusion 8 and the coupling part 9. Only the frame portion 7 of the glass substrate G can be supported.

The suction stand 23 includes a support part 24 that supports the support plate 21 and a suction port 25 for fixing the glass substrate G to the support plate 21. The support portion 24 has a support surface 24a that supports the peripheral edge of the support plate 21.

The suction table 23 has a space 23 a between the support plate 21 supported by the support part 24 and the suction port 25 . The suction port 25 is connected to a suction device (exhaust device) such as a pump (not shown).

The suction table 23 makes the inside of the space 23a negative by discharging the gas present in the space 23a from the suction port 25 while the support plate 21 on which the glass substrate G is placed is supported by the support part 24. Pressure. Thereby, the glass substrate G is fixed to the support plate 21 by being sucked toward the space 23a through the opening 22 of the support plate 21. Thereafter, a paste-like metal-based bonding material for the bonding portion 12 is applied by screen printing so as to overlap the metal layer 11 of the glass substrate G.

By supporting the glass substrate G with the support device 20 as described above, it becomes possible to form the bonding portion 12 with high precision.

FIG. 17 shows another example of the package. The package 1 in this example includes a base 2 on which a plurality of light emitting elements 3 are mounted, and a lid member 4 illustrated in FIG. 13. This lid member 4 individually seals each light emitting element 3 mounted on the base 2 with a plurality of protrusions 8 and a sealing part 5. Thereafter, the package 1 is cut into individual pieces by dicing.

According to the package 1 according to the present embodiment described above, the side wall portion 8b is formed in an inclined shape so that the inner surface 8b1 of the side wall portion 8b of the lid member 4 forms an obtuse angle with respect to the inner surface 8a1 of the top plate portion 8a. This makes it easier for the light from the light emitting element 3 to enter perpendicularly to the inner surface 8b1 of the side wall portion 8b.

FIG. 18 shows the side wall part 8b of the lid member 4 in this embodiment with a solid line, and the side wall part of the lid member 4 that is not inclined with respect to the top plate part, that is, the side wall part that makes 90 degrees with respect to the top plate part. The part is indicated by a chain double-dashed line and the code 8B.

The light LB1 irradiated perpendicularly to the inner surface 8b1 of the side wall 8b travels in the thickness direction Ta of the side wall 8b and exits from the outer surface 8b2, as indicated by the symbol LB1a. On the other hand, the light LB2 irradiated onto the inner surface 8B1 of the side wall portion 8B, which is not inclined, travels in a direction inclined with respect to the thickness direction Tb of the side wall portion 8B, as indicated by the symbol LB2a, and from the outer surface 8B2. Emits light.

In this case, the optical path length of the light LB1a passing through the side wall 8b (the length of the arrow LB1a) is shorter than the optical path length of the light LB2a passing through the side wall 8B (the length of the arrow LB2a). Thereby, the package 1 according to the present embodiment can extract more energy from the lid member 4 compared to a conventional package in which the side wall portion of the lid member is not inclined. Therefore, the package 1 according to this embodiment can improve the light extraction efficiency compared to the conventional package.

Furthermore, by making the thickness T1b of the middle part 8b4 of the side wall 8b thinner than the thickness T2 of the frame 7 (T1b<T2), the lid member 4 can increase the optical path length of light inside the side wall 8b as much as possible. The length can be shortened, and the light extraction efficiency in the package 1 can be improved.

The light extraction efficiency in the package 1 is determined by measuring the energy EN1 of the light emitted from the light emitting element 3 without passing through the lid member 4, and calculating the energy when the light emitted from the light emitting element 3 is transmitted through the lid member 4. EN2 can be measured and calculated by the ratio of these energies (EN2/EN1).

According to the package 1 of this embodiment, the strength of the lid member 4 can be increased by manufacturing the lid member 4 by molding a single plate glass GS. That is, by forming a connecting part 8c having a curved inner surface 8c1 and an outer surface 8c2 between the top plate part 8a and the side wall part 8b of the protruding part 8, a connection part 8c is formed between the top plate part 8a and the side wall part 8b. It becomes possible to form a high-strength protrusion 8 without forming a joint using adhesive or welding. Similarly, the strength of the lid member 4 can be increased by forming a connecting portion 9 having a curved inner surface 9a and an outer surface 9b between the side wall portion 8b of the protruding portion 8 and the frame portion 7 in the lid member 4. can.

Note that the present invention is not limited to the configuration of the embodiments described above, nor is it limited to the effects described above. The present invention can be modified in various ways without departing from the gist of the invention.

The lid member 4 of the package 1 may form the protruding portion 8 without forming the connecting portion 8c. That is, the lid member 4 may be constructed by separately preparing the top plate portion 8a and the side wall portion 8b of the lid member 4, and welding them together using an adhesive or by laser irradiation or the like. Similarly, the lid member 4 having the frame portion 7 may be configured without forming the connecting portion 9.

Hereinafter, the present invention will be explained in detail based on Examples. However, the present invention is not limited to the following examples at all, and can be implemented with appropriate modifications within the scope of the gist thereof.

In order to confirm the effects of the present invention, the present inventors measured the light extraction efficiency of the lid member and conducted a strength test of the lid member.

Tables 1 to 3 show test conditions and measurement results for Examples of the present invention (Samples Nos. 1 to 7, 9 to 13) and Comparative Examples (Samples Nos. 8 and 14).

The lid member used in the test was manufactured as follows.

First, the glass composition, in mass %, is SiO ₂ : 50%, B ₂ O ₃ : 25%, Al ₂ O ₃ : 7%, Na ₂ O: 5%, K ₂ O: 5%, MgO: 5%. A glass substrate made of borosilicate glass containing 3% of CaO was prepared.

The glass substrates according to the example were prepared in two types: one with a thickness of 0.20 mm and one with a thickness of 2.00 mm. Using the molding apparatus shown in FIG. 7, as shown in FIG. 8, the central part of the glass substrate was deformed by heating with a heating source and suction with a suction part, to produce a lid member having a protruding part. On the other hand, in a comparative example, a gob (lump) made of the above-mentioned borosilicate glass was placed in a mold having a predetermined shape, and press-molded at 1200° C. to produce a lid member having a protrusion.

The outer shape of the frame in the lid member is a square with one side of 100 mm. The inner surface shape of the connecting portion in the lid member is circular.

In a lid member whose frame thickness is 0.20 mm, the inner diameter of the connecting portion is 5 mm. Further, in a lid member whose frame portion has a thickness of 2.00 mm, the inner diameter of the connecting portion is 10 mm. Note that the angles θ1, θ2 and thickness values in each example are as described in Tables 1 to 3.

The light extraction efficiency is determined by measuring the energy EN1 of the light (wavelength 265 nm) emitted from the light emitting element without passing through the lid member, and calculating the energy when the light (wavelength 265 nm) emitted from the light emitting element is transmitted through the lid member. Energy EN2 was measured and calculated by the ratio of these energies (EN2/EN1). Note that at this time, the distance between the light emitting element and the energy measuring device was kept constant.

The "light extraction efficiency" in Tables 1 to 3 was evaluated as follows.

In Tables 1 and 2, sample No. Based on the light extraction efficiency (EN2/EN1) according to Comparative Example 8, in Examples, those whose light extraction efficiency is 1.1 times or more than the standard are rated as good "○", and those whose light extraction efficiency is less than 1.1 times the standard. Those with a mark were determined to be defective with a "x" mark. Similarly, in Table 3, sample No. Based on the light extraction efficiency (EN2/EN1) of Comparative Examples 14, those with light extraction efficiency of 1.1 times or more than the standard in the examples are rated as good, and those with less than 1.1 times the standard are rated as good. The item was determined to be defective with an "x" mark.

For the strength test, the frame of the lid member is fixed to the fixed member, a load parallel to the second main surface of the frame is applied to the outer surface of the lower part of the protrusion, and the load when the protrusion is broken is measured on the lid. It was measured as the strength of the member.

In Tables 1 and 2, sample No. Based on the strength of the lid member in Comparative Example No. 8, those in which the strength was maintained at 0.7 times or more of the standard in Examples were rated as good, and those less than 0.7 times the standard were rated as poor. I judged it. In addition, in Table 3, sample No. Based on the strength of the comparative example according to No. 14, those in the examples whose strength maintained 0.7 times or more of the standard were judged as good "○", and those whose strength was less than 0.7 times the standard were judged as bad "x". .

As shown in Tables 1 to 3, in the lid member according to the example, the angle (θ2) formed between the side wall portion and the top plate portion is an obtuse angle, and the thickness T1b of the midway portion of the side wall portion and the thickness T2 of the frame portion are By setting the relationship T1b<T2, the light extraction efficiency was improved while maintaining the intensity ratio at 0.7 times or more when compared with the comparative example.

1 Package 2 Base 3 Light emitting element 4 Lid member 7 Frame 8a Top plate 8a1 Inner surface of top plate 8a2 Outer surface of top plate 8b Side wall 8b1 Inner surface of side wall 8b2 Outer surface of side wall 8b4 Midway part of side wall 8c Top Connection portion that connects the plate portion and side wall portion 8c1 Inner surface of the connection portion 8c2 Outer surface of the connection portion 9 Connection portion that connects the side wall portion and the frame portion 9a Inner surface of the connection portion 9b Outer surface of the connection portion 12 Joint portion D Top plate portion Distance between and the light emitting element θ2 Angle between the inner surface of the side wall and the inner surface of the top plate

Claims

A package comprising a light emitting element, a base supporting the light emitting element, and a lid member fixed to the base so as to cover the light emitting element,
The lid member has a top plate portion configured in a flat plate shape, a side wall portion connected to the top plate portion, and a frame portion formed around the side wall portion,
The top plate portion has an inner surface and an outer surface,
The side wall portion has an inner surface connected to the inner surface of the top plate portion, and an outer surface connected to the outer surface of the top plate portion,
The side wall portion is inclined such that the inner surface of the side wall portion forms an obtuse angle with respect to the inner surface of the top plate portion,
A package characterized in that the relationship T1b<T2 is satisfied, where the thickness of the middle part of the side wall part is T1b and the thickness of the frame part is T2.
The package according to claim 1, wherein a value T1b/T2 obtained by dividing the thickness T1b of the middle part of the side wall part by the thickness T2 of the frame part is 0.6 to 0.95.
The package according to claim 1 or 2, wherein the thickness of the side wall portion becomes thinner continuously from the frame side toward the top plate side.
The package according to claim 1 or 2, characterized in that, assuming that the thickness of the top plate portion is T3, the relationship T3<T1b is satisfied.
The package according to claim 1 or 2, characterized in that a value T3/T1b obtained by dividing the thickness T3 of the top plate portion by the thickness T1b of the midway portion of the side wall portion is 0.5 to 0.95. .
The package according to claim 1 or 2, wherein the side wall portion and the frame portion are integrally formed.
The package according to claim 1 or 2, wherein the side wall portion and the top plate portion are integrally formed.
The package according to claim 1 or 2, wherein the outer surface of the top plate portion is a polished surface.
The package according to claim 1 or 2, further comprising a joint portion that joins the frame portion and the base body.
The lid member includes a connecting part that connects the side wall part and the frame part,
The connecting portion has an inner surface and an outer surface,
The package according to claim 1 or 2, wherein the inner surface and the outer surface of the connecting portion are curved.
The package according to claim 1 or 2, wherein the angle formed by the inner surface of the side wall portion and the inner surface of the top plate portion is 120° or more and 160° or less.
The lid member includes a connecting portion that connects the side wall portion and the top plate portion,
The connecting portion has an inner surface and an outer surface,
The package according to claim 1 or 2, wherein the inner surface and the outer surface of the connecting portion are curved.
The top plate portion is located away from the light emitting element,
The package according to claim 1 or 2, wherein a distance between the top plate portion and the light emitting element is 20 μm or more and 100 μm or less.
A lid member used for a package,
comprising a top plate configured in a flat plate shape, a side wall connected to the top plate, and a frame formed around the side wall,
The top plate portion has an inner surface and an outer surface,
The side wall portion has an inner surface connected to the inner surface of the top plate portion, and an outer surface connected to the outer surface of the top plate portion,
The side wall portion is inclined such that the inner surface of the side wall portion forms an obtuse angle with the inner surface of the top plate portion,
A lid member characterized in that the relationship T1b<T2 is satisfied, where the thickness of the middle part of the side wall part is T1b and the thickness of the frame part is T2.
The lid member according to claim 14, wherein a value T1b/T2 obtained by dividing the thickness T1b of the middle part of the side wall part by the thickness T2 of the frame part is 0.6 to 0.95.
The lid member according to claim 14 or 15, wherein the thickness of the side wall portion becomes thinner continuously from the frame portion toward the top plate portion.
The lid member according to claim 14 or 15, characterized in that, assuming that the thickness of the top plate portion is T3, the relationship T3<T1b is satisfied.
The lid member according to claim 14 or 15, characterized in that a value T3/T1b obtained by dividing the thickness T3 of the top plate part by the thickness T1b of the middle part of the side wall part is 0.5 to 0.95. .
The lid member according to claim 14 or 15, wherein the side wall portion and the frame portion are integrally formed.
The lid member according to claim 14 or 15, wherein the side wall portion and the top plate portion are integrally formed.
The lid member according to claim 14 or 15, wherein the outer surface of the top plate portion is a polished surface.
comprising a connecting part that connects the side wall part and the frame part,
The connecting portion has an inner surface and an outer surface,
The lid member according to claim 14 or 15, wherein the inner surface and the outer surface of the connecting portion are curved.
The lid member according to claim 14 or 15, wherein the angle formed by the inner surface of the side wall portion and the inner surface of the top plate portion is 120° or more and 160° or less.
comprising a connecting part that connects the side wall part and the top plate part,
The connecting portion has an inner surface and an outer surface,
The lid member according to claim 14 or 15, wherein the inner surface and the outer surface of the connecting portion are curved.
The lid member according to claim 14 or 15, comprising a plurality of the top plate portions and the side wall portions.