WO2024048414A1 - 固体電解コンデンサ、および固体電解コンデンサの製造方法 - Google Patents

固体電解コンデンサ、および固体電解コンデンサの製造方法 Download PDF

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Publication number
WO2024048414A1
WO2024048414A1 PCT/JP2023/030502 JP2023030502W WO2024048414A1 WO 2024048414 A1 WO2024048414 A1 WO 2024048414A1 JP 2023030502 W JP2023030502 W JP 2023030502W WO 2024048414 A1 WO2024048414 A1 WO 2024048414A1
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Prior art keywords
base electrode
electrode
electrolytic capacitor
solid electrolytic
capacitor
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English (en)
French (fr)
Japanese (ja)
Inventor
克朋 有富
芳正 吉野
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to CN202380061120.XA priority Critical patent/CN119744429A/zh
Priority to JP2024544181A priority patent/JP7794325B2/ja
Publication of WO2024048414A1 publication Critical patent/WO2024048414A1/ja
Priority to US19/048,237 priority patent/US20250182975A1/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other

Definitions

  • the present invention relates to a solid electrolytic capacitor equipped with a lead frame as an external electrode.
  • Patent Document 1 discloses a solid electrolytic capacitor that includes a capacitor element and a sealing member made of resin for sealing the capacitor element, and forms a sealing body (insulating resin body) by sealing the capacitor element.
  • a cathode terminal and an anode terminal are each drawn out from the capacitor element to the outside of the sealing body by a lead frame, and each terminal functions as an external electrode.
  • This solid electrolytic capacitor includes multiple capacitor elements.
  • Each capacitor element includes an electrode foil, a dielectric layer, and a solid electrolyte layer.
  • the surface layer of the electrode foil is porous.
  • a dielectric layer is formed on the surface of the porous body.
  • the solid electrolyte layer is formed on the surface of the electrode foil where the dielectric layer is formed.
  • the lead frame in the solid electrolytic capacitor described in Patent Document 1 is formed inside.
  • This lead frame is embedded in an insulating resin body, and a portion thereof is exposed from both end faces of the insulating resin body, and is formed across both end faces and the bottom face.
  • the lead frame on the side embedded in the insulating resin body is welded to the capacitor element. That is, this welded portion becomes a welding margin and functions as an electrode of the solid electrolytic capacitor.
  • this welding margin causes the functional part volume ratio of the solid electrolytic capacitor to decrease.
  • the area of this welding margin is made small, the capacitor element and the lead frame cannot be reliably connected, which may result in poor contact.
  • the capacitor element is made larger in order to increase the functional part volume ratio, the chip size as a solid electrolytic capacitor increases accordingly.
  • the functional part volume ratio in the present invention will be defined.
  • the functional part volume ratio is the ratio of the volume of the part that functions as a capacitor to the volume of the solid electrolytic capacitor. That is, by increasing this functional part volume ratio, a larger electrostatic capacitance can be realized within a determined external shape size of the solid electrolytic capacitor.
  • an object of the present invention is to provide a solid electrolytic capacitor with improved functional part volume ratio and high reliability.
  • the solid electrolytic capacitor of the present invention includes a capacitor element, a sealing body, a first base electrode, and a second base electrode.
  • the capacitor element has a flat film-like main body containing a valve metal, a dielectric layer formed on a cathode formation region, and a solid electrolyte layer formed on the dielectric layer. Further, the capacitor element has an anode terminal region in which a solid electrolyte layer is not formed on the main body, and a cathode formation region including a solid electrolyte layer.
  • the sealing body has a plurality of stacked capacitor elements, which are sealed with an insulating resin, and has a first end surface in which the end of the anode terminal region is exposed linearly.
  • the first base electrode is disposed on the first end surface and includes a first element.
  • the second base electrode covers the first base electrode and includes a first element and a second element. This second base electrode is an intermetallic compound of a first element and a second element.
  • a capacitor laminate can be formed by forming a first base electrode and a second base electrode on the first end face and welding a plurality of capacitor elements. That is, there is no need for a welding margin for connecting the capacitor element and the lead frame, and the formation area of the dielectric layer and solid electrolyte layer formed on the capacitor element can be increased. Therefore, the functional part volume ratio can be improved without increasing the size of the solid electrolytic capacitor.
  • the method for manufacturing a solid electrolytic capacitor of the present invention includes a capacitor element forming step, a sealing body forming step, a first base electrode forming step, a third base electrode forming step, and a first terminal electrode forming step.
  • the main body includes a flat film-like main body containing a valve metal, a dielectric layer formed on a cathode forming region, and a solid electrolyte layer formed on the dielectric layer.
  • a capacitor element is formed having an anode terminal region in which no solid electrolyte layer is formed and a cathode formation region including a solid electrolyte layer.
  • a plurality of capacitor elements are stacked and sealed with an insulating resin to form a sealed body having a first end surface in which the end of the anode terminal region is exposed linearly.
  • a first base electrode that is disposed on the first end face and includes a first element is formed in the first base electrode forming step.
  • a third base electrode containing the second element is formed in the third base electrode forming step to cover at least a portion of the first base electrode.
  • a first terminal electrode forming step a first terminal electrode containing a second element is formed to cover at least a portion of the third base electrode.
  • a second base electrode containing the first element and the second element is formed by reacting with the first element and the second element.
  • This manufacturing method eliminates the need for a welding margin for connecting the capacitor element and the lead frame, and it is possible to enlarge the formation area of the dielectric layer and solid electrolyte layer formed in the capacitor element.
  • the second base electrode through the reaction between the first base electrode and the third base electrode, and between the first terminal electrode and the third base electrode, there is no need for a welding process to connect the capacitor element and the lead frame.
  • the capacitor element and the lead frame can be reliably connected.
  • FIG. 1 is a side sectional view of a solid electrolytic capacitor according to a first embodiment.
  • FIG. 2(A) is an enlarged view of a part of the capacitor element according to the first embodiment
  • FIG. 2(B) is a side sectional view of the capacitor element.
  • FIG. 3 is a side sectional view and a partially enlarged view of the solid electrolytic capacitor according to the first embodiment.
  • 4(A), FIG. 4(B), and FIG. 4(C) are diagrams specifically showing the structure of the electrode section.
  • FIG. 5 is a flowchart showing the procedure for forming the solid electrolytic capacitor according to the first embodiment.
  • 6(A), FIG. 6(B), and FIG. 6(C) are diagrams showing an outline for forming the solid electrolytic capacitor according to the first embodiment.
  • FIG. 1 is a side sectional view of a solid electrolytic capacitor according to a first embodiment.
  • FIG. 2(A) is an enlarged view of a part of the capacitor element according to the first embodiment
  • FIG. 7 is a diagram showing an outline of forming electrodes by the AD method on the capacitor element according to the first embodiment.
  • FIG. 8(A) is a side sectional view of a solid electrolytic capacitor of the present invention
  • FIG. 8(B) is a side sectional view of a solid electrolytic capacitor having a conventional configuration.
  • FIG. 1 is a side sectional view of a solid electrolytic capacitor according to a first embodiment.
  • FIG. 2(A) is a perspective view of the capacitor element according to the first embodiment, and
  • FIG. 2(B) is a side sectional view of the capacitor element.
  • FIG. 3 is a side sectional view of the solid electrolyte capacitor according to the first embodiment, and is a partially enlarged view.
  • the solid electrolytic capacitor 1 includes a capacitor assembly 10 , a first terminal electrode 20 , a second terminal electrode 30 , an insulating resin body 40 , and an electrode section 60 .
  • the first terminal electrode 20 and the second terminal electrode 30 correspond to the "external electrode" of the present invention.
  • the capacitor assembly 10 includes a plurality of capacitor elements 11 and a conductive member 19.
  • the conductive member 19 is preferably an electrode paste containing nickel, silver, or copper as a main component, for example.
  • the maximum thickness of the conductive member 19 is preferably 2 ⁇ m or more and 20 ⁇ m or less. Note that even if the conductive member 19 is not used, the conductive member 19 may be omitted if conductivity higher than the desired conductivity can be obtained between the plurality of capacitor elements 11 and the second terminal electrode 30, etc. It is also possible.
  • the number of capacitor elements 11 constituting the capacitor assembly 10 is not limited as long as it is plural. Note that details of the capacitor element 11 will be described later.
  • the plurality of capacitor elements 11 are stacked.
  • a capacitor assembly 10 is formed by stacking a plurality of capacitor elements 11. At this time, the plurality of capacitor elements 11 are formed so as to be substantially parallel to each other.
  • the capacitor assembly 10 is sealed with an insulating resin body 40.
  • a sealed body 400 is formed by this.
  • the sealing body 400 has a substantially rectangular parallelepiped shape having a top surface 401 , a bottom surface 402 , a first end surface 403 , and a second end surface 404 .
  • the insulating resin body 40 corresponds to the "sealing member" in the present invention.
  • a portion of the plurality of capacitor elements 11 is exposed from the first end surface 403 of the sealing body 400.
  • a surface (first end surface 403 ) of the plurality of capacitor elements 11 exposed linearly from the insulating resin body 40 is connected to the first terminal electrode 20 via the electrode portion 60 .
  • the first terminal electrode 20 is formed along the sealing body 400. Specifically, the first terminal electrode 20 is arranged across the first end surface 403 and the bottom surface 402 of the sealing body 400.
  • connection layer (the conductive layer including the solid electrolyte layer 113 ) of the plurality of capacitor elements 11 is electrically and physically connected to the second terminal electrode 30 by the conductive member 19 .
  • This conductive member 19 is formed so as to be exposed from the sealing body 400.
  • the second terminal electrode 30 is formed along the sealing body 400. Specifically, the second terminal electrode 30 is arranged across the second end surface 404 and the bottom surface 402.
  • the first terminal electrode 20 and the second terminal electrode 30 are, for example, made of a Cu alloy (copper alloy) material or an iron alloy material, and are preferably formed of a metal material that is easy to bend and has high conductivity. preferable.
  • the first terminal electrode 20 and the second terminal electrode 30 are formed of a material cut out from a metal plate, for example. Note that the first terminal electrode 20 and the second terminal electrode 30 may be made of the same material or may be made of different materials.
  • the insulating resin body 40 is mainly made of resin and may contain filler.
  • the resin include epoxy resins, phenol resins, polyimide resins, silicone resins, polyamide resins, and liquid crystal polymers.
  • the form of the resin both solid resin and liquid resin can be used.
  • the corners are rounded by barrel polishing after resin sealing.
  • the filler for example, silica particles, alumina particles, metal particles, etc. are preferable.
  • the maximum diameter of the filler is preferably 30 ⁇ m or more and 40 ⁇ m or less, for example. More preferably, the material contains silica particles in the solid epoxy resin and phenol resin.
  • FIG. 2(A) is a plan view of the capacitor element
  • FIG. 2(B) is a side sectional view of the capacitor element
  • FIG. 2(B) is a cross-sectional view taken along a plane perpendicular to the flat membrane surface and the end surface of the capacitor element.
  • the capacitor element 11 includes an electrode foil 111, a dielectric layer 112, and a solid electrolyte layer 113.
  • the electrode foil 111 is made of, for example, a single metal such as aluminum, tantalum, niobium, titanium, zirconium, magnesium, or silicon, or an alloy containing these metals.
  • the surface layer portion of the electrode foil 111 is preferably a porous body.
  • the electrode foil 111 is preferably made of aluminum or an aluminum alloy.
  • the electrode foil 111 may be any valve metal that exhibits a so-called valve action.
  • a dielectric layer 112 is formed on the electrode foil 111.
  • the electrode foil 111 has a first surface F1 and a second surface F2 that face each other in the Z-axis direction.
  • the electrode foil 111 includes a third surface F3, a fourth surface F4, a fifth surface F5, and a sixth surface F6, which are connected to the first surface F1 and the second surface F2 and are parallel to the Z-axis direction.
  • the third surface F3 and the fourth surface F4 are surfaces parallel to the Y-axis direction.
  • the fifth surface F5 and the sixth surface F6 are surfaces parallel to the X axis.
  • the dielectric layer 112 covers the first surface F1, second surface F2, fourth surface F4, fifth surface F5, and sixth surface F6 of the electrode foil 111. Further, an electrode portion 60 is formed on the third surface F3. This third surface F3 becomes a part of the above-mentioned first end surface 403. The structure of the electrode section 60 will be described later.
  • the dielectric layer 112 is preferably made of an oxide film of the electrode foil 111.
  • the dielectric layer 112 is formed by oxidizing it in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or their sodium or ammonium salts.
  • the thickness of the dielectric layer 112 is preferably 10 nm or more and 100 nm or less.
  • the solid electrolyte layer 113 covers the outer surface of the dielectric layer 112 (at least the surface facing the surface that contacts the electrode foil 111).
  • the solid electrolyte layer 113 also fills a large number of holes covered with the dielectric layer 112.
  • the solid electrolyte layer 113 includes, for example, an inner layer and an outer layer.
  • the inner layer is a layer on the dielectric layer 112 side of the solid electrolyte layer 113, and is made of, for example, a conductive polymer having a backbone of pyrroles, thiophenes, anilines, etc., or a conductive polymer having a backbone of thiophenes. It may be a layer of PEDOT:PSS which is realized by PEDOT [poly(3,4-ethylenedioxythiophene)] or the like and is composited with polystyrene sulfonic acid (PSS) as a dopant.
  • PEDOT poly(3,4-ethylenedioxythiophene)
  • the inner layer is formed by coating the surface of the dielectric layer 112 with poly(3,4- It is formed by a method of forming a polymer film such as ethylenedioxythiophene), or a method of applying a dispersion of a polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric part and drying it. .
  • the outer layer is a layer formed outside the inner layer.
  • the outer layer is a layer formed to cover the entire inner layer after forming the inner layer that fills the fine recesses of the porous portion.
  • the thickness of the outer layer is preferably 2 ⁇ m or more and 20 ⁇ m or less.
  • the outer layer is preferably a carbon layer, a graphene layer, or a silver layer formed by applying a conductive paste such as carbon paste, graphene paste, or silver paste. It may be a composite layer in which a silver layer is provided on a carbon layer or a graphene layer, or a mixed layer in which carbon paste, graphene paste, and silver paste are mixed.
  • a conductive adhesive layer may be provided as a layer further after the outer layer.
  • a material constituting the conductive adhesive layer for example, a mixture of an insulating resin such as an epoxy resin or a phenol resin and conductive particles such as carbon or silver may be used.
  • the capacitor element 11 becomes a flat film solid electrolytic capacitor.
  • electrode foil 111 corresponds to an anode
  • solid electrolyte layer 113 corresponds to a cathode.
  • the region of the electrode foil 111 where the solid electrolyte layer 113 is not formed corresponds to the "anode terminal region" in the present invention, and the solid electrolyte layer 113 corresponds to the "cathode formation region” in the present invention.
  • the electrode foil 111 corresponds to the "main body" in the present invention.
  • the electrode section 60 includes a first base electrode 61 and a second base electrode 62.
  • the first base electrode 61 is formed on the third surface F3 of the capacitor element 11 (the end surface of the electrode foil 111).
  • the first base electrode 61 is formed with a predetermined thickness (height) from the third surface F3.
  • the first base electrode 61 is a Cu layer formed on the third surface F3 using the AD method.
  • the second base electrode 62 covers at least the first base electrode 61. As a result, the first base electrode 61 and the second base electrode 62 protrude outward from the third surface F3.
  • the first terminal electrode 20 is formed so as to come into contact with the second base electrode 62.
  • the first terminal electrode 20 is connected to the electrode part 60 using FIGS. 4(A), 4(B), and 4(C). A more specific configuration will be explained.
  • a Cu layer is formed on the third surface F3 of the capacitor element 11 using the AD method.
  • This Cu layer becomes the first base electrode 61.
  • a third base electrode 63 is formed on the first base electrode 61 using an AD method.
  • the third base electrode 63 is a Sn layer. Note that the "first element” in the present invention is Cu that constitutes the first base electrode 61, and the “second element” is Sn that constitutes the third base electrode 63.
  • the first terminal electrode 20 is formed so as to come into contact with the third base electrode 63.
  • the first terminal electrode 20 is pressed against the third surface F3 on which the third base electrode 63 is formed while being heated.
  • heat is transferred to the first base electrode 61 (Cu) and the third base electrode 63, and the first base electrode 61 (Cu) and the third base electrode 63 (Sn) are melted. That is, the Cu layer of the first base electrode 61 and the third base electrode 63 react to form an intermetallic compound layer of Cu 3 Sn.
  • This Cu 3 Sn intermetallic compound layer is the second base electrode 62 .
  • the first terminal electrode 20 and the third base electrode 63 react.
  • the first terminal electrode 20 is made of a Cu alloy. That is, the third base electrode 63 reacts with the first terminal electrode 20, and the second base electrode 62 (Cu 3 Sn intermetallic compound layer) is formed. In other words, the third base electrode 63 forms the second base electrode 62 (Cu 3 Sn intermetallic compound layer) by eroding into the first terminal electrode 20 .
  • the bond between the first base electrode 61, the second base electrode 62, and the first terminal electrode 20 becomes strong. Note that a specific method of forming the electrode portion 60 and a specific shape thereof will be described later.
  • FIG. 4(B), and FIG. 4(C) show an example in which the third base electrode 63 and a part of the first base electrode 61 react to form the second base electrode 62.
  • the third base electrode 63 may remain inside the second base electrode 62.
  • the third base electrode 63 may remain so as to cover at least a portion of the second base electrode 62 (between the second base electrode 62 and the first terminal electrode 20).
  • the solid electrolytic capacitor 1 is realized.
  • FIG. 5 is a flowchart showing an example of a schematic flow of the method for manufacturing a solid electrolytic capacitor according to the present embodiment.
  • 6(A), FIG. 6(B), and FIG. 6(C) are diagrams showing states of the solid electrolytic capacitor according to the present embodiment in each process.
  • FIG. 7 is a diagram of an apparatus for forming a base electrode using the AD method.
  • a capacitor element 11 is formed (S11). Specifically, as shown in FIGS. 2(A), 2(B), and 6(A), a dielectric layer 112 and a solid electrolyte layer 113 are formed on a plurality of electrode foils 111.
  • a conductive member 19 is formed on the solid electrolyte layer 113 of the capacitor element 11. Furthermore, the capacitor assembly 10 is formed by stacking the capacitor elements 11 (S12).
  • the capacitor assembly 10 is sealed with an insulating resin body 40 (S13). Specifically, as shown in FIG. 6(B), a sealed body 400 is formed by stacking a plurality of capacitor aggregates 10 and sealing the capacitor aggregates 10 with an insulating resin body 40.
  • the first end surface 403 (electrode foil 111) of the capacitor element 11 is exposed (S14). More specifically, as shown in FIG. 6C, the sealing body 400 is fixed and ground so that the electrode foil 111 on the first end surface 403 is exposed in a linear manner.
  • step S15 can be omitted.
  • the first base electrode 61 is formed on the electrode foil 111 exposed in step S12 (S16).
  • a sealing body 400 with a plurality of capacitor elements 11 exposed is fixed on a stage 92 and placed in a chamber 91. At least the tip (the ejection end) of the aerosol generator 93 is inserted into the chamber 91 .
  • the aerosol generator 93 generates an aerosol by introducing copper powder (Cu powder) 610 into the carrier gas, and sprays the aerosol onto the first end surface 403 of the sealing body 400 .
  • the copper powder 610 can be
  • the first base electrode 61 is stacked on the third surface F3 of the plurality of electrode foils 111 at a predetermined height (predetermined thickness).
  • the particle size of the copper powder 610 is, for example, about 3 ⁇ m, but may be 2 ⁇ m or less.
  • a third base electrode 63 is formed using the AD method on the first base electrode 61 formed in step S16 (S17).
  • the sealing body 400 on which the first base electrode 61 is formed is fixed on the stage 92 and placed in the chamber 91. At least the tip (the ejection end) of the aerosol generator 93 is inserted into the chamber 91 .
  • the aerosol generator 93 generates an aerosol by introducing Sn powder into the carrier gas, and sprays the aerosol onto the first end surface 403 of the sealing body 400 and the first base electrode 61 .
  • the Sn powder 620 can be
  • the third base electrode 63 is stacked on the third surface F3 of the plurality of electrode foils 111 and the first base electrode 61 at a predetermined height (predetermined thickness).
  • the first terminal electrode 20 is formed on the first end surface 403 and the second terminal electrode 30 is formed on the second end surface 404, thereby forming a lead frame (LF) for the solid electrolytic capacitor 1 (S18). More specifically, the first terminal electrode 20 and the second terminal electrode 30 are brought into contact with the sealing body 400 and heated and pressurized.
  • LF lead frame
  • the first base electrode 61 and the third base electrode 63 are formed to have irregularities using the AD method (see FIG. 4(A)). That is, the first base electrode 61 and the third base electrode 63 are bonded more firmly due to the anchor effect. As shown in FIGS. 3, 4(A), 4(B), and 4(C), when heat is applied to the first terminal electrode 20, the first base electrode 61 and the third base electrode 63 As a result, an intermetallic compound (Cu 3 Sn) is formed in the region where the first base electrode 61 and the third base electrode 63 are in contact with each other.
  • an intermetallic compound Cu 3 Sn
  • This intermetallic compound (Cu 3 Sn) is the second base electrode 62, and the electrode foil 111 and the first terminal electrode 20 are electrically and physically connected through the first base electrode 61 and the second base electrode 62. be done. In particular, the formation of intermetallic compounds improves the bonding strength. Similarly, the second terminal electrode 30 is connected to the capacitor element 11 via the conductive member 19.
  • sealing resin is further applied to the portion of each end face of the sealing body 400 that is not covered by the lead frame, and the sealing body 400 It may also be designed to prevent moisture from entering the inside of the container. Furthermore, as shown in the enlarged view of FIG. 3, there is a slight gap between the porous portion (surface layer) of the electrode foil 111 and the lead frame, and this gap also becomes a path for moisture to enter. There is a possibility. In order to block such moisture intrusion routes, even if the width of the lead frame is not narrower than the width of the sealing body 400, the portions of each end face of the sealing body 400 that are not covered by the lead frame are A sealing resin may also be applied. These measures can improve the moisture resistance of the solid electrolytic capacitor 1.
  • FIG. 8(A) is a side sectional view of the solid electrolytic capacitor 1 showing the configuration according to the present invention.
  • FIG. 8(B) is a side sectional view of a solid electrolytic capacitor 1A in a conventional configuration.
  • the functional part volume ratio in the configuration of the present invention is approximately 1.5 times the functional part volume ratio in the conventional configuration. More specifically, in FIG. 8(A), since the first terminal electrode 20 is not formed inside the solid electrolytic capacitor 1, it is possible to form a large functional part volume ratio. On the other hand, since the external shape of the solid electrolytic capacitor 1 and the external shape of the solid electrolytic capacitor 1A are the same, the volume of the solid electrolytic capacitor 1 and the volume of the solid electrolytic capacitor 1A are the same.
  • the functional part volume ratio of the portion that essentially functions as a capacitor can be made larger than in the conventional configuration. Therefore, when the solid electrolytic capacitor 1 configured according to the present invention and the solid electrolytic capacitor 1A have the same size, the solid electrolytic capacitor 1 has an improved functional part volume ratio.
  • the capacitor element 11 and the first terminal electrode 20 are physically and electrically connected by the electrode section 60. That is, the connection between the capacitor element 11 and the first terminal electrode 20 can be established reliably. In particular, the formation of an intermetallic compound in the electrode portion 60 improves the bonding strength. Therefore, a highly reliable solid electrolytic capacitor 1 can be provided.
  • the solid electrolytic capacitor is not limited to the structure shown in the above structure in which a plurality of flat film capacitor elements are stacked in the thickness direction of the solid electrolytic capacitor.
  • a configuration may be adopted in which a flat film-shaped capacitor element is wound and housed in a cylindrical housing.

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PCT/JP2023/030502 2022-08-31 2023-08-24 固体電解コンデンサ、および固体電解コンデンサの製造方法 Ceased WO2024048414A1 (ja)

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JP2024544181A JP7794325B2 (ja) 2022-08-31 2023-08-24 固体電解コンデンサ、および固体電解コンデンサの製造方法
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021049056A1 (ja) * 2019-09-11 2021-03-18 株式会社村田製作所 電解コンデンサ
WO2021085555A1 (ja) * 2019-10-31 2021-05-06 パナソニックＩｐマネジメント株式会社 電解コンデンサ
WO2022131021A1 (ja) * 2020-12-16 2022-06-23 株式会社村田製作所 電解コンデンサ及び電解コンデンサの製造方法
WO2022163645A1 (ja) * 2021-01-29 2022-08-04 パナソニックＩｐマネジメント株式会社 電解コンデンサ
WO2022168769A1 (ja) * 2021-02-02 2022-08-11 株式会社村田製作所 電解コンデンサ及び電解コンデンサの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021049056A1 (ja) * 2019-09-11 2021-03-18 株式会社村田製作所 電解コンデンサ
WO2021085555A1 (ja) * 2019-10-31 2021-05-06 パナソニックＩｐマネジメント株式会社 電解コンデンサ
WO2022131021A1 (ja) * 2020-12-16 2022-06-23 株式会社村田製作所 電解コンデンサ及び電解コンデンサの製造方法
WO2022163645A1 (ja) * 2021-01-29 2022-08-04 パナソニックＩｐマネジメント株式会社 電解コンデンサ
WO2022168769A1 (ja) * 2021-02-02 2022-08-11 株式会社村田製作所 電解コンデンサ及び電解コンデンサの製造方法

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