WO2024041345A1 - 一种摄像头模组及电子设备 - Google Patents

一种摄像头模组及电子设备 Download PDF

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Publication number
WO2024041345A1
WO2024041345A1 PCT/CN2023/111033 CN2023111033W WO2024041345A1 WO 2024041345 A1 WO2024041345 A1 WO 2024041345A1 CN 2023111033 W CN2023111033 W CN 2023111033W WO 2024041345 A1 WO2024041345 A1 WO 2024041345A1
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WO
WIPO (PCT)
Prior art keywords
light
shielding layer
lens
photosensitive
imaging
Prior art date
Application number
PCT/CN2023/111033
Other languages
English (en)
French (fr)
Inventor
任立
王伟
叶海水
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024041345A1 publication Critical patent/WO2024041345A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present application relates to the field of camera technology, and in particular to a camera module and electronic equipment.
  • the camera module achieves the imaging function by gathering and identifying the light reflected by the target object.
  • camera modules are widely used in electronic equipment, and the imaging quality of the camera module has become an important parameter for evaluating the imaging function of electronic equipment.
  • the presence of stray light often causes halos or spots in the formed image, seriously affecting the imaging quality of the camera module.
  • This application provides a camera module and electronic equipment that can effectively reduce the impact of stray light on the imaging quality of the camera module.
  • the present application provides a camera module.
  • the camera module includes a lens assembly and a photosensitive imaging assembly.
  • the lens assembly includes at least one optical lens.
  • At least one of the optical lenses includes a filter surface. The light surface is used to filter out infrared light;
  • the photosensitive imaging component includes an imaging area and a non-imaging area;
  • At least one light-shielding layer is provided on the lens assembly and/or the photosensitive imaging component.
  • the light-shielding layer is used to cut off the light on the first optical path.
  • the first optical path reaches the photosensitive lens through the at least one optical lens.
  • the non-imaging area of the imaging assembly is provided on the lens assembly and/or the photosensitive imaging component.
  • Embodiments of the present application provide a camera module.
  • the light-shielding layer provided on the lens assembly and/or the photosensitive imaging assembly can cut off the light on the first optical path and avoid the light on the first optical path.
  • the light reflected to the imaging area of the photosensitive imaging component affects the imaging effect of the camera module and improves the imaging quality of the camera module.
  • the lens assembly includes a lens barrel, and the light-shielding layer is provided at the bottom end of the lens barrel facing the photosensitive imaging component.
  • the light-shielding layer and the lens barrel are bonded through structural glue. Based on this optional method, the firmness between the light shielding layer and the lens barrel is enhanced.
  • the light-shielding layer is provided on at least one of the optical lenses.
  • the light-shielding layer and the optical lens are bonded through structural glue. Based on this optional method, the firmness of the light shielding layer on the optical lens is improved.
  • the light-shielding layer may be in the shape of a circular ring.
  • the light-shielding layer is provided on the optical lens closest to the photosensitive imaging component among at least one of the optical lenses.
  • the filter surface and the light shielding layer are located on the same optical lens.
  • the light shielding layer provided on the optical lens is used to block the light reflected in the non-imaging area and then enter the imaging area after being re-reflected or refracted by the optical lens, so as to reduce the stray light entering the imaging area and improve the performance of the camera module. Imaging quality.
  • the lens assembly includes a prism.
  • the prism is disposed at an end of the lens assembly close to the photosensitive imaging assembly.
  • the light incident on the lens assembly passes through the incident light of the prism in turn.
  • the lens assembly is ejected from behind the surface, reflective surface and light-emitting surface;
  • the light shielding layer is provided on at least one of the light incident surface, the reflective surface and the light exit surface.
  • the photosensitive imaging component includes a printed circuit board (PCB) and a photosensitive chip disposed on the PCB.
  • the photosensitive chip and the PCB are electrically connected through a metal structural member.
  • the light-shielding layer arranged on the metal structural member.
  • the metal structural member is located in the non-imaging area, and the light-shielding layer is provided in the non-imaging area.
  • a light shielding layer is provided in the non-imaging area of the photosensitive imaging component to block the light incident on the camera module from irradiating into the non-imaging area, so that the light irradiating into the non-imaging area cannot be reflected, that is, the light irradiating into the non-imaging area cannot be reflected.
  • the light in the non-imaging area will not affect the normal imaging of the camera module, effectively improving the imaging quality of the camera module.
  • the light-shielding layer includes any one of a glue layer, a silk screen, an ink layer, a black matrix, a light-shielding ring, and a light-shielding sheet.
  • the surface gloss of the light-shielding layer is 0-20%, and the light absorption rate of the light-shielding layer is greater than or equal to 90%.
  • the ink layer may be sprayed matte ink or black ink.
  • the light-shielding layer may be a structural layer that has been subjected to surface roughening treatment and matte ink spraying treatment.
  • inventions of the present application provide an electronic device.
  • the electronic device includes a housing and the aforementioned first aspect and the camera module described in any one of the first aspects provided in the housing.
  • the lens assembly includes a lens barrel, and the light-shielding layer is provided at the bottom end of the lens barrel facing the photosensitive imaging component.
  • the light-shielding layer is provided on at least one of the optical lenses.
  • the light-shielding layer is provided on the optical lens closest to the photosensitive imaging component among at least one of the optical lenses.
  • the filter surface and the light shielding layer are located on the same optical lens.
  • the lens assembly includes a prism.
  • the prism is disposed at an end of the lens assembly close to the photosensitive imaging assembly.
  • the light incident on the lens assembly passes through the incident light of the prism in turn.
  • the lens assembly is ejected from behind the surface, reflective surface and light-emitting surface;
  • the light shielding layer is provided on at least one of the light incident surface, the reflective surface and the light exit surface.
  • the photosensitive imaging component includes a printed circuit board (PCB) and a photosensitive chip disposed on the PCB.
  • the photosensitive chip and the PCB are electrically connected through a metal structural member.
  • the light-shielding layer arranged on the metal structural member.
  • the metal structural member is located in the non-imaging area, and the light-shielding layer is provided in the non-imaging area.
  • the light-shielding layer includes any one of a glue layer, a silk screen, an ink layer, a black matrix, a light-shielding ring, and a light-shielding sheet.
  • Figure 1 is a schematic structural diagram of an existing camera module provided by an embodiment of the present application.
  • Figure 2 is a schematic diagram of an imaging effect affected by stray light provided by an embodiment of the present application
  • Figure 3 is a schematic diagram of the exploded structure of a camera module provided by an embodiment of the present application.
  • Figure 4 is a schematic cross-sectional structural diagram of a camera module provided by an embodiment of the present application.
  • Figure 5 is a schematic top structural view of a photosensitive structural component provided by an embodiment of the present application.
  • Figure 6 is a schematic structural diagram of a light shielding layer provided on an optical lens according to an embodiment of the present application.
  • Figure 7 is a schematic diagram of the shape of the light shielding layer provided by the embodiment of the present application.
  • Figure 8 is a schematic diagram of another shape of the light shielding layer provided by the embodiment of the present application.
  • Figure 9 is a schematic diagram of another shape of the light shielding layer provided by the embodiment of the present application.
  • Figure 10 is a schematic diagram of the first shape of the light shielding layer provided on the optical lens according to the embodiment of the present application.
  • Figure 11 is a schematic diagram of the second shape of the light shielding layer provided on the optical lens according to the embodiment of the present application.
  • Figure 12 is a schematic diagram of the third shape of the light shielding layer provided on the optical lens according to the embodiment of the present application.
  • Figure 13 is a schematic diagram of the fourth shape of the light shielding layer provided on the optical lens according to the embodiment of the present application.
  • Figure 14 is a schematic diagram of an exploded structure of a light-shielding layer provided on a lens barrel provided by an embodiment of the present application;
  • Figure 15 is a schematic cross-sectional structural diagram of a light-shielding layer provided on a lens barrel provided by an embodiment of the present application;
  • Figure 16 is a schematic front structural view of a prism provided in the lens assembly provided by the embodiment of the present application.
  • Figure 17 is a schematic structural diagram showing multiple faces of a prism provided by an embodiment of the present application.
  • Figure 18 is a schematic structural diagram of a light shielding layer provided on the light exit surface of a prism according to an embodiment of the present application
  • Figure 19 is a schematic structural diagram of providing a light-shielding layer on a photosensitive imaging component according to an embodiment of the present application
  • Figure 20 is a schematic diagram of another exploded structure in which a light-shielding layer is provided on a photosensitive imaging component according to an embodiment of the present application;
  • FIG. 21 is a schematic diagram of another overall structure of a light-shielding layer provided on a photosensitive imaging component according to an embodiment of the present application.
  • first and second are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of this application, “plurality” means two or more than two, unless otherwise explicitly and specifically limited.
  • connection should be understood in a broad sense.
  • it can be a fixed connection, a detachable connection, or an integrated connection.
  • Ground connection can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, or an internal connection between two components or an interaction between two components.
  • Figure 1 shows an existing camera model See Figure 1 for a schematic structural diagram of the assembly.
  • the existing camera module mainly includes a lens assembly 1 and a photosensitive imaging assembly 2.
  • the lens assembly 1 may include an optical lens 11 and a lens barrel 12.
  • the optical lens 11 is arranged in the lens barrel 12.
  • the lens assembly 1 is used to collect the light reflected by the target object 3 (that is, the object being photographed); the photosensitive imaging component 2 mainly It includes a printed circuit board (PCB) and a photosensitive chip arranged on the PCB, where the photosensitive chip is used to convert optical signals into electrical signals, and the PCB is used to form an image based on the electrical signals received by the photosensitive chip.
  • PCB printed circuit board
  • the imaging principle of the above-mentioned camera module is to use the lens assembly 1 to collect the light reflected by the target object 3. After the light collected to the lens assembly 1 irradiates the photosensitive imaging component 2, the photosensitive imaging component 2 will receive the light signal. Convert into electrical signals to form corresponding images to achieve imaging functions.
  • FIG. 1 shows a schematic diagram of an imaging effect affected by stray light provided by an embodiment of the present application. Referring to Figure 2, there are relatively obvious halos and spots in the final image, and the imaging effect of the camera module is poor. Therefore, how to effectively reduce the impact of stray light on the imaging quality of the camera module has become an urgent technical problem to be solved.
  • the camera module includes a lens assembly 100 and a photosensitive imaging assembly 200, wherein the lens assembly 100 includes at least one optical lens 101, in which at least one optical lens 101 is provided with a filter surface for filtering out infrared light, by providing at least one light shielding layer 300 on the lens assembly 100 and/or the photosensitive imaging assembly 200 to cut off
  • the light on the first optical path prevents the light on the first optical path from entering the imaging area 2011 in the photosensitive imaging component 200 and affecting the imaging effect of the camera module, thereby effectively reducing the impact of stray light on the imaging quality of the camera module and improving the quality of the camera module.
  • the imaging quality of the module is provided.
  • Embodiments of the present application provide a camera module that can be used in a variety of electronic devices, including but not limited to cameras, mobile phones, personal digital assistants, tablet computers, vehicle-mounted computers, laptops, etc.
  • Computers laptop computers
  • smart screens ultra-mobile personal computers
  • handheld devices smart watches, driving recording devices, monitoring devices and other devices with camera and photo functions.
  • UMPC ultra-mobile personal computers
  • the electronic device may also include a housing, and the camera module provided by the embodiment of the present application is disposed in the housing.
  • FIG 3 is a schematic exploded structural diagram of a camera module provided by an embodiment of the present application.
  • Figure 4 is a schematic cross-sectional structural diagram of a camera module provided by an embodiment of the present application. See Figures 3-4 , the camera module includes a lens component 100 and a photosensitive imaging component 200, and the lens component 100 and the photosensitive imaging component 200 are connected.
  • the lens assembly 100 may include at least one optical lens 101, and the at least one optical lens 101 includes a filter surface, and the filter surface is used to filter out infrared light.
  • filter coatings can be provided on two surfaces or one surface of the optical lens 101 to form a filter surface to filter out infrared light passing through the optical lens 101.
  • the filter coating can be an infrared filter.
  • Optical film; materials that can filter out infrared light can also be added during the process of making the optical lens 101, so that the completed optical lens 101 has the property of filtering out infrared light when actually used.
  • the lens assembly 100 may include a lens barrel 102 in which at least one optical lens 101 is disposed.
  • the lens barrel 102 may also be called a lens base and is used to provide support for the optical lens 101 .
  • the arrangement of the optical lens 101 in the lens barrel 102 includes but is not limited to: the inner wall of the lens barrel 102 is provided with a groove corresponding to the above-mentioned optical lens 101, and the lens barrel 102 corresponds to the groove through the groove on the inner wall of the lens barrel 102.
  • the optical lens 101 is clamped so that the circumferential side wall of the optical lens 101 along the optical axis direction is in close contact with (or in contact with) the groove, thereby placing the optical lens 101 in the lens barrel 102 .
  • the number of grooves provided on the inner wall of the lens barrel 102 is consistent with the number of optical lenses 101.
  • the number of optical lenses 101 can be set according to actual application requirements. This application does not specify the number and shape of the optical lenses 101. , materials and the connection between the optical lens 101 and the lens barrel 102 are not limited.
  • the lens assembly 100 may also include a motor.
  • the motor is connected to the lens barrel 102, and the motor is used to provide driving force.
  • the lens barrel 102 can drive the optical lens 101 to move closer to or away from the photosensitive imaging component 200 to adjust the camera model.
  • the focal length of the group may also include a motor.
  • the lens assembly 100 may also include a first housing 104 .
  • the first housing 104 A through hole 1041 is provided on the lens barrel 104.
  • the lens barrel 102 can be disposed in the through hole 1041 of the first housing 104.
  • one end of the lens barrel 102 close to the photosensitive imaging component 200 is disposed in the through hole 1041 of the first housing 104 , and the other end of the lens barrel 102 away from the photosensitive imaging component 200 protrudes from the first housing 104 , and the lens barrel 102 is close to the photosensitive imaging component.
  • the outer side wall of one end of the assembly 200 is fixedly connected to the inner side wall of the first housing 104 close to the photosensitive imaging assembly 200 .
  • the fixed connection method between the end of the lens barrel 102 close to the photosensitive imaging component 200 and the first housing 104 includes but is not limited to screw connection, snap connection, bonding, etc.
  • the first housing 104 and the lens barrel 102 can also be made into an integrated structure by an integral molding process. This can not only save the processing steps of separately manufacturing the first housing 104 and the lens barrel 102, but also reduce the difficulty of processing. Saving production costs also allows the structural parts supporting the optical lens 101 (that is, the structural parts integrally formed by the first housing 104 and the lens barrel 102) to have stronger mechanical rigidity, thereby improving the stability of the structural parts supporting the optical lens 101.
  • the photosensitive imaging component 200 includes a photosensitive chip 201 and a PCB 202, and the photosensitive chip 201 and the PCB 202 are electrically connected.
  • the PCB 202 and the photosensitive chip 201 are electrically connected through metal structural members with good conductivity and strong oxidation resistance (such as gold or copper).
  • the structural design between the photosensitive chip 201 and the PCB 202 includes but is not limited to: a groove for accommodating the photosensitive chip 201 is provided on the side of the PCB 202 facing the lens assembly 100, and the photosensitive chip 201 is embedded in the groove.
  • FIG. 5 is a schematic top view structural diagram of a photosensitive imaging component 200 provided by an embodiment of the present application.
  • the photosensitive imaging component 200 includes an imaging area 2011 and a non-imaging area 2021.
  • the light reflected by the target object passes through the lens assembly 100.
  • At least one of the optical lenses 101 is imaged in the imaging area 2011 of the photosensitive imaging component 200.
  • the area used to receive optical signals is the imaging area 2011 of the photosensitive imaging component 200, that is, the imaging area 2011 of the photosensitive chip 201.
  • the imaging area 2011 is used to receive the optical signals required for imaging; the area surrounding the imaging area 2011 is the photosensitive area.
  • the non-imaging area 2021 also called the peripheral area of the imaging component 200, that is to say, the non-imaging area 2021 surrounds the imaging area 2011, and the non-imaging area 2021 is located outside the imaging area 2011.
  • the photosensitive imaging component 200 can be divided into imaging areas 2011 of the photosensitive chip 201 from the inside to the outside. , the logic area 2012 of the photosensitive chip 201, the transition area 2021a between the photosensitive chip 201 and the PCB 202, the pad area 2021b of the PCB 202, and the bottom plate area 2021c of the PCB 202, where the photosensitive chip 201 includes a logic area 2012 and an imaging area 2011.
  • the imaging area 2011 is the light-absorbing area of the photosensitive imaging component 200, which is used to receive light signals to implement the imaging function;
  • the non-imaging area 2021 includes areas other than the imaging area 2011, that is, the non-imaging area 2021 includes the photosensitive imaging component 200 except the photosensitive chip 201 Other areas outside the imaging area 2011, in other words, the non-imaging area 2021 of the photosensitive imaging component 200 includes the logic area 2012 of the photosensitive chip 201, the transition area 2021a between the photosensitive chip 201 and the PCB 202, the pad area 2021b of the PCB 202 and the PCB 202 The floor area of 2021c.
  • the base area 2021c refers to other areas in the photosensitive imaging component 200 except the imaging area 2011, the logic area 2012, the transition area 2021a and the pad area 2021b.
  • the above-mentioned photosensitive chip 201 can be an image sensor.
  • the image sensor may be a charge-coupled device (CCD) image sensor or a complementary metal-oxide semiconductor (Complementary metal-Oxide-Semiconductor, CMOS) image sensor.
  • CCD charge-coupled device
  • CMOS complementary metal-oxide semiconductor
  • the embodiment of the present application does not place any limitation on the type of the photosensitive chip 201.
  • the lens assembly 100 and the photosensitive imaging assembly 200 can be relatively fixed by screwing, snapping or bonding, which is not limited in this application.
  • the fixation method between the lens assembly 100 and the photosensitive imaging assembly 200 may be that the bottom end of the lens barrel 102 facing the photosensitive imaging assembly 200 is fixedly connected to the PCB 202 in the photosensitive imaging assembly 200 , or it may be that the lens assembly 100 is fixed to the PCB 202 in the photosensitive imaging assembly 200 .
  • the bottom end of the first housing 104 facing the photosensitive imaging assembly 200 is fixedly connected to the PCB 202 in the photosensitive imaging assembly 200 and so on.
  • the camera module in the embodiment of the present application The filter surface with the function of filtering infrared light can be set or not set according to the actual application requirements.
  • the camera module needs to have the function of filtering infrared light according to actual application requirements, in addition to providing a filter surface for filtering infrared light on at least one optical lens 101 provided by the embodiment of the present application , you can also filter out the red
  • the film that acts on external light is integrated into the photosensitive imaging component 200, so that the assembled camera module has the function of filtering out infrared light while reducing the size of the assembled camera module; if based on actual application requirements, no need
  • the camera module has the function of filtering infrared light.
  • the infrared filter disposed between the lens assembly 100 and the photosensitive imaging component 200 in the camera module is cancelled.
  • providing a filter surface on at least one optical lens 101 in the lens assembly 100 can effectively reduce the thickness of the assembled camera module by reducing the thickness of the infrared filter.
  • the lens assembly 100 and/or the photosensitive imaging assembly 200 At least one light-shielding layer 300 is disposed on the light-shielding layer 300 .
  • the light-shielding layer 300 can cut off the light on the first optical path.
  • the first optical path passes through at least one optical lens 101 and reaches the non-imaging area 2021 of the photosensitive imaging component 200 .
  • At least one light-shielding layer 300 can be provided on the lens assembly 100; at least one light-shielding layer 300 can also be provided on the photosensitive imaging component 200; at least one layer of light-shielding layer 300 can also be provided on the lens assembly 100.
  • the light-shielding layer 300 is also provided with at least one light-shielding layer 300 on the photosensitive imaging component 200 .
  • the first light path includes the light path of the light that is injected into the camera module and illuminates the non-imaging area 2021, the transmission path of the reflected light reflected by the non-imaging area 2021, and the above-mentioned reflected light illuminates the imaging area after reflection or refraction. 2011 light path.
  • the material of the light-shielding layer 300 can be a polymer with a surface gloss of 0-20% or 60° and a light absorption rate greater than or equal to 90%, such as polyester film (also called polyester resin); It can be, for example, a plastic filled with low-reflective microparticles, or a composite material of plastic filled with low-reflective fibers. It can also be a metal material or an ink layer.
  • the above-mentioned light-shielding layer 300 can also be other structural layers whose surface is roughened and sprayed with matte ink so that the reflectivity is less than 10%.
  • the light-shielding layer 300 can also be any one of silk screen, ink layer (such as black ink), black matrix (black matirx, BM), light-shielding ring, and light-shielding sheet.
  • the above-mentioned light-shielding layer 300 may also be a glue layer.
  • the above-mentioned adhesive layer may be an adhesive that is black and has low reflectivity.
  • the glue layer has low fluidity and high viscosity when not solidified; after solidification, the glue layer can be stacked with a preset height to meet actual application requirements.
  • the specific material of the light-shielding layer 300 is specified in the embodiment of the present application. Without any qualification.
  • the light-shielding layer 300 is provided on at least one optical lens 101, that is, the light-shielding layer 300 is provided on at least one optical lens 101 of the lens assembly 100, as shown in FIG. 6 for the embodiment of the present application.
  • the lens assembly 100 may include multiple optical lenses 101.
  • the lens assembly 100 includes multiple optical lenses 101, at least one of the multiple optical lenses 101 may be A light shielding layer 300 is provided on the lens 101 .
  • the light-shielding layer 300 can be provided on optical lens A; it can also be provided on optical lens B.
  • Light-shielding layer 300 It is also possible to provide the light-shielding layer 300 on the optical lens A and the light-shielding layer 300 on the edge of the optical lens B.
  • the light shielding layer 300 can be disposed on the side of at least one optical lens 101 close to the photosensitive imaging component 200, and/or the light shielding layer 300 can be disposed on the side of at least one optical lens 101 away from the photosensitive imaging component 200.
  • the light-shielding layer 300 can be disposed on the side of at least one optical lens 101 close to the photosensitive imaging component 200; the light-shielding layer 300 can also be disposed on the side of at least one optical lens 101 far away from the photosensitive imaging component 200; the light-shielding layer 300 can also be both It is arranged on the side of at least one optical lens 101 that is close to the photosensitive imaging component 200 and is also arranged on the side of at least one optical lens 101 that is far away from the photosensitive imaging component 200 .
  • the light-shielding layer 300 and the filter surface can be provided on different optical lenses 101 or on the same optical lens 101 .
  • the lens assembly 100 includes two optical lenses 101, namely optical lens A and optical lens B, it can be A filter surface can be provided on optical lens A and a light-shielding layer 300 can be provided on optical lens B, or a filter surface can be provided on optical lens B and a light-shielding layer 300 can be provided on optical lens A; or a filter surface can be provided on optical lens A.
  • the light surface, and the light-shielding layer 300 is set on the optical lens A, or the light-filtering surface is set on the optical lens B, and the light-shielding layer 300 is set on the optical lens B; of course, it is also possible to set the light-shielding layer 300 on the optical lens A and the optical lens B at the same time. Both the filter surface and the light shielding layer 300 are provided on B.
  • the light-shielding layer 300 can be provided on the optical lens 101 closest to the photosensitive imaging component 200 among at least one optical lens 101.
  • the above-mentioned method of arranging the light-shielding layer 300 on at least one optical lens 101 can block the light reflected by the non-imaging area 2021 from entering the imaging area 2011 after being re-reflected or refracted by the optical lens 101, thereby reducing the stray light entering the imaging area 2011 and improving the efficiency of the imaging area.
  • the image quality of the camera module can block the light reflected by the non-imaging area 2021 from entering the imaging area 2011 after being re-reflected or refracted by the optical lens 101, thereby reducing the stray light entering the imaging area 2011 and improving the efficiency of the imaging area.
  • the laying shape of at least one light-shielding layer 300 on the optical lens 101 is a circular ring shape, such as a ring, a racetrack shape, etc. If the laying shape of the light-shielding layer 300 on the optical lens 101 is a circular ring shape, then The width of the light-shielding layer 300 laid on the optical lens 101 is sufficient to cut off the light reflected by the non-imaging area 2021 of the photosensitive imaging component 200. The width of the light-shielding layer 300 laid on the optical lens 101 refers to the inner radius and outer radius of the circular annulus. The difference between radii.
  • the shape of the light shielding layer 300 provided on the optical lens 101 may not only be a circular annular shape, but also may be as shown in FIGS. 7-9 Other annular shapes, this application does not impose any restrictions on the laying shape, laying width and arrangement thickness (referring to the height of the light shielding layer 300 along the optical axis direction of the optical lens 101) of the light shielding layer 300 on the optical lens 101.
  • the patterns of the light shielding layers 300 provided on the multiple optical lenses 101 may be the same or different, and this application does not impose any limitation on this.
  • any annular light-shielding layer 300 as shown in FIGS. 7-9 can be provided on the two optical lenses 101 respectively.
  • the lens assembly 100 includes two optical lenses 101, assuming that the two optical lenses 101 are optical lens A and optical lens B respectively, optical lens A and optical lens B are arranged side by side, and the light shielding layer provided on optical lens A
  • the pattern (or shape) of 300 can be as shown in Figure 10
  • the pattern of the light-shielding layer 300 provided on the optical lens B can be as shown in Figure 11
  • the pattern of the light-shielding layer 300 on the optical lens A can be as shown in Figure 12
  • the pattern of the light-shielding layer 300 on the optical lens B can be as shown in Figure 13.
  • the light-shielding layer 300 is on the optical lens A and the optical lens B.
  • the arrangement position can effectively cut off unnecessary light reflected by the non-imaging area 2021 of the photosensitive imaging component 200. This application does not limit the shape and size of the light shielding layer 300 provided on the optical lens A and the optical lens B.
  • a structural adhesive 400 can be provided between the light-shielding layer 300 and the optical lens 101 , that is, the light-shielding layer 300 passes through the structure.
  • the glue 400 is bonded to the optical lens 101 to enhance the practicality of the light-shielding layer 300 and improve the firmness of the light-shielding layer 300 on the optical lens 101.
  • Figure 14 is a schematic diagram of an exploded structure of a lens barrel 102 provided with a light-shielding layer 300 provided by an embodiment of the present application.
  • Figure 15 is a schematic diagram of a lens barrel with a light shielding layer 300 provided by an embodiment of the present application. 14 and 15.
  • the lens assembly 100 may include a lens barrel 102.
  • the light-shielding layer 300 is disposed at the bottom end of the lens barrel 102 facing the photosensitive imaging component 200, that is, at the bottom end of the lens barrel 102 facing the photosensitive imaging component 200.
  • a light shielding layer 300 is provided on the bottom end surface of the photosensitive imaging component 200 .
  • the light-shielding layer 300 can be provided at the bottom end of the lens barrel 102 facing the photosensitive imaging component 200.
  • the width of the light-shielding layer 300 along the first direction can block the light reflected by the non-imaging area 2021 of the photosensitive imaging component 200 from entering the imaging area 2011. That is, the first direction is a direction perpendicular to the optical axis direction of the optical lens 101 in the camera module.
  • the lens assembly 100 also includes a first housing 104, and the outer wall of the lens barrel 102 near the photosensitive imaging component 200 is fixedly connected to the inner wall of the first housing 104 near the photosensitive imaging component 200; or the first
  • the light shielding layer 300 can also be provided at the bottom end of the first housing 104 close to the photosensitive imaging component 200 .
  • the first housing 104 is provided with a step hole, which includes a small hole section and a large hole section, where the small hole section is a through hole 1041 for installing the lens barrel 102; the large hole
  • the light-shielding layer 300 is located between the through hole 1041 and the photosensitive imaging component 200.
  • the light-shielding layer 300 is disposed at the bottom end of the large hole section facing the photosensitive imaging component 200.
  • the laying width of the light-shielding layer 300 along the first direction can cut off non-imaging light through the photosensitive imaging component 200.
  • the light reflected by the area 2021 can enter the imaging area 2011.
  • part of the light shielding layer 300 is provided on the lens barrel 102 and/or the first housing 104, and the other part is provided on the lens barrel 102 and/or the first housing 104.
  • a portion extends along the first direction, wherein the portion extending toward the first direction is used to intercept light from the first optical path.
  • the light-shielding layer 300 can also be bonded to the bottom end of the lens barrel 102 facing the photosensitive imaging component 200 or the bottom of the first housing 104 close to the photosensitive imaging component 200 through the structural adhesive 400. end, in order to improve the structural strength of the light-shielding layer 300.
  • FIG. 16 is a schematic front view of the prism 103 provided in the lens assembly 100 provided by the embodiment of the present application, and as shown in FIG. 17 , the prism 103 provided by the embodiment of the present application is shown.
  • 18 is a schematic structural diagram of a light-shielding layer 300 provided on the light-emitting surface 1033 of the prism 103 according to an embodiment of the present application.
  • the lens assembly 100 may include Prism 103.
  • the above-mentioned prism 103 is arranged at one end of the lens assembly 100 close to the photosensitive imaging assembly 200.
  • the light incident on the lens assembly 100 passes through the light incident surface 1031, the reflective surface 1032 and the light exit surface 1033 of the prism 103 in sequence and then exits the lens assembly 100; light shielding
  • the layer 300 is disposed on at least one of the light incident surface 1031 of the prism 103 , the reflective surface 1032 of the prism 103 , and the light exit surface 1033 of the prism 103 .
  • the light incident surface 1031 of the prism 103 refers to the surface where light enters the prism 103
  • the reflective surface 1032 refers to the surface where the light incident into the prism 103 is reflected
  • the light exit surface 1033 refers to the surface where the light exits the prism 103 .
  • the above-mentioned prisms 103 include but are not limited to triangular prisms, four-prisms, or pentaprisms, etc.
  • the embodiment of the present application does not place any restrictions on the shape and number of the prisms 103 .
  • the prism 103 is disposed at an end of the lens barrel 102 close to the photosensitive imaging assembly 200, and the light reflected by the target object passes through the optical lens 101 and is irradiated on the light incident surface of the prism 103. 1031.
  • the light entering through the light incident surface 1031 of the prism 103 is reflected by its reflective surface 1032 and then emitted from the light exit surface 1033 of the prism 103.
  • a light shielding layer 300 can be provided on the light incident surface 1031 of the prism 103 to reduce other unnecessary Light (such as edge strong light, etc.) is emitted from the light incident surface 1031 of the prism 103; a light shielding layer 300 can also be provided on the reflective surface 1032 of the prism 103 to reduce other unnecessary light emitted from the reflective surface 1032 of the prism 103; A light-shielding layer 300 can also be provided on the light-emitting surface 1033 of the prism 103 to reduce other unnecessary light rays emitted from the light-emitting surface 1033 of the prism 103 .
  • the light-shielding layer 300 can also be provided on the light-incident surface 1031 of the prism 103, and the light-shielding layer 300 can be provided on the reflective surface 1032 of the prism 103;
  • the light-shielding layer 300 is provided on the light-emitting surface 1033; or the light-shielding layer 300 is provided on the reflective surface 1032 of the prism 103, and the light-shielding layer 300 is provided on the light-emitting surface 1033 of the prism 103; or the light-shielding layer 300 is provided on the light-incident surface 1031 of the prism 103, and at the same time
  • a light-shielding layer 300 is provided on the reflective surface 1032 of the prism 103, and a light-shielding layer 300 is provided on the light exit surface 1033 of the prism 103 to reduce other unnecessary light reflected by the non-imaging area 2021 of the photosensitive imaging component 200 from entering the imaging area 2011, effectively reducing The impact
  • the lens assembly 100 includes two prisms 103 , namely prism C and prism D
  • prism C can be disposed at an end of the lens assembly 100 away from the photosensitive imaging component 200
  • prism D can be disposed at the end of the lens assembly 100 Close to the other end of the photosensitive imaging component 200; or set the prism D at the end of the lens assembly 100 away from the photosensitive imaging component 200, and set the prism C at the other end of the lens assembly 100 close to the photosensitive imaging component 200.
  • At least one of the light incident surface 1031 of prism C and/or prism D, the reflective surface 1032 of prism C and/or prism D, and the light exit surface 1033 of prism C and/or prism D can be installed.
  • a light shielding layer 300 is provided on it.
  • the prism 103 provided at the end of the lens assembly 100 away from the photosensitive imaging assembly 200 may rotate with the movement of the reference light to achieve the anti-shake function.
  • the setting range of the light-shielding layer 300 needs to be determined according to the rotation angle of the prism 103. In this case, it is impossible to accurately design the light-shielding layer 300 on the prism 103 at the end of the lens assembly 100 away from the photosensitive imaging component 200 during the assembly process of the camera module. area.
  • the lens assembly 100 when the lens assembly 100 includes two prisms 103, the light incident surface 1031 of the prism 103 at the other end of the lens assembly 100 close to the photosensitive imaging assembly 200, the A light-shielding layer 300 is provided on at least one of the reflective surface 1032 and the light-emitting surface 1033 of the prism 103 .
  • the structural adhesive 400 can also be used to dispose the light-shielding layer 300 on at least one of the light incident surface 1031 of the prism 103 , the reflective surface 1032 of the prism 103 , and the light exit surface 1033 of the prism 103 .
  • the shape of the light-shielding layer 300 provided on the prism 103 may be a ring shape with an inner ring in a circle and an outer ring in a rectangular shape as shown in Figure 18, or it may also be as shown in Figures 7-8.
  • Ring-shaped, the laying shape of the light-shielding layer 300 on the prism 103 and the laying width of the light-shielding layer 300 along the second direction can enable the light-shielding layer 300 to block the light reflected from the non-imaging area 2021 of the photosensitive imaging component 200.
  • the second direction is a direction parallel to the light incident surface 1031 of the prism 103, or a direction parallel to the reflective surface 1032 of the prism 103, or a direction parallel to the light exit surface 1033 of the prism 103.
  • this application does not place any restrictions on the laying shape, laying width and laying thickness of the light shielding layer 300 on the prism 103.
  • the light-shielding layer 300 can also be disposed in the non-imaging area 2021, that is, the light-shielding layer 300 is disposed in the area of the photosensitive imaging component 200 except the imaging area 2011.
  • FIG. 19 is a schematic structural diagram of a light-shielding layer 300 provided on a photosensitive imaging component 200 according to an embodiment of the present application
  • FIG. 20 is a schematic diagram of a light-shielding layer 300 provided on a photosensitive imaging component 200 according to an embodiment of the present application.
  • Another exploded structural schematic diagram of disposing the light-shielding layer 300, as shown in Figure 21, is another schematic diagram of the overall structure of disposing the light-shielding layer 300 on the photosensitive imaging component 200 according to the embodiment of the present application. See Figures 19-21.
  • imaging can be performed in the photosensitive imaging assembly 200.
  • a light-shielding layer 300 is provided in other areas outside the area 2011. The light-shielding layer 300 can prevent the generation of other unnecessary light reflected by the non-imaging area 2021, and cut off other unnecessary light emitted from the lens assembly 100 to the non-imaging area 2021. The light enters the imaging area 2011 after being reflected and/or refracted, thereby improving the imaging effect of the camera module.
  • the metal structural parts used to realize the electrical connection between the photosensitive chip 201 and the PCB 202 generally have strong reflectivity, and these metal structural parts are mainly arranged in the logic area 2012 of the photosensitive chip 201 and the transition between the photosensitive chip 201 and the PCB 202 In the area 2021a and the pad area 2021b of the PCB 202, if the light is reflected on the metal structure, the reflected light will enter the imaging area 2011 after being reflected and/or refracted again to generate stray light, which will affect the performance of the camera module. Imaging quality.
  • the light shielding layer 300 can be disposed in the logic area 2012 of the photosensitive chip 201, the transition area 2021a between the photosensitive chip 201 and the PCB 202, and the pad area 2021b of the PCB 202 as shown in FIG. 5. It is used to cut off unnecessary light irradiated into the logic area 2012, the transition area 2021a and the pad area 2021b, so as to prevent the light irradiated in the above areas from being reflected and affecting the imaging quality of the camera module.
  • the light shielding layer 300 can also be provided in the logic area 2012 of the photosensitive chip 201, the transition area 2021a between the photosensitive chip 201 and the PCB 202, the pad area 2021b of the PCB 202, and the bottom plate area 2021c of the PCB 202. , this application does not make any restrictions on this.
  • the laying shape of the light-shielding layer 300 on the photosensitive imaging component 200 can be a shape as shown in FIGS. It is sufficient that the light is reflected. This application does not place any restrictions on the specific laying shape of the light-shielding layer 300 .
  • the laying shape of the light shielding layer 300 can cut off unnecessary light from being reflected and reflected in the camera module. / Or it can enter the imaging area 2011 after refraction.
  • a structural glue 400 is disposed between the light-shielding layer 300 and the photosensitive imaging component 200.
  • the structural glue 400 is used to fix the light-shielding layer 300 on the photosensitive imaging component 200.
  • the metal structural member used to electrically connect the photosensitive chip 201 and the PCB 202 is located in the non-imaging area 2021, and the light-shielding layer 300 can also be provided on the metal structural member. Superior.
  • the light-shielding layer 300 By arranging the light-shielding layer 300 on the metal structural parts, the light that passes through the optical lens 101 and reaches the metal structural parts of the photosensitive imaging component 200 can be reduced, thereby preventing the light irradiating on the metal structure from being reflected and entering the imaging area 2011, thereby improving the Improve the imaging effect of the camera module.
  • the glue layer covering the metal structural part takes advantage of its low fluidity and high viscosity characteristics when it is not solidified, and the glue layer is coated in the non-imaging area 2021 On the metal structural parts inside, prevent the glue layer from overflowing into the imaging area 2011; the glue layer can be stacked higher than the metal structural parts after solidification, so that the glue layer can wrap the metal structural parts in the non-imaging area 2021.
  • This application does not limit the height, shape and specific coating process of the adhesive layer.
  • the light shielding layer 300 can also be coated on the inner side wall of the lens barrel 102 and/or the inner side wall of the first housing 104 by providing at least one of a glue layer, a silk screen, an ink layer, and a BM. , to prevent unnecessary light from entering the imaging area 2011 after being reflected on the inner wall of the lens barrel 102, so as to reduce the impact of stray light on the imaging quality of the camera module.

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  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)

Abstract

本申请提供一种摄像头模组及电子设备，涉及摄像技术领域，能够有效减少杂散光的形成，提升摄像头模组的成像质量，其中，摄像头模组包括：镜头组件和感光成像组件，所述镜头组件包括至少一个光学透镜，至少一个所述光学透镜包括滤光面，所述滤光面用于滤除红外光；所述感光成像组件包括成像区和非成像区；所述镜头组件和/或所述感光成像组件上设置至少一层遮光层，所述遮光层用于截止第一光路上的光线，所述第一光路通过所述至少一个光学透镜到达所述感光成像组件的所述非成像区。

Description

一种摄像头模组及电子设备
本申请要求于2022年08月25日提交国家知识产权局、申请号为202211027958.0、申请名称为“一种摄像头模组及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及摄像技术领域，尤其涉及一种摄像头模组及电子设备。
背景技术
摄像头模组是通过聚集并识别目标物体反射的光线而实现成像功能。随着成像技术的快速发展，摄像头模组被广泛应用在电子设备中，摄像头模组的成像质量随之也成为了评价电子设备摄像功能的重要参数，但是，在摄像头模组的实际成像过程中往往会由于杂散光的存在导致形成的图像中产生光晕或光斑，严重影响摄像头模组的成像质量。
发明内容
本申请提供一种摄像头模组及电子设备，能够有效降低杂散光对摄像头模组成像质量的影响。
为达到上述目的，本申请采用如下技术方案：
第一方面，本申请提供一种摄像头模组，所述摄像头模组包括镜头组件和感光成像组件，所述镜头组件包括至少一个光学透镜，至少一个所述光学透镜包括滤光面，所述滤光面用于滤除红外光；所述感光成像组件包括成像区和非成像区；
所述镜头组件和/或所述感光成像组件上设置至少一层遮光层，所述遮光层用于截止第一光路上的光线，所述第一光路通过所述至少一个光学透镜到达所述感光成像组件的所述非成像区。
本申请实施例提供一种摄像头模组，在摄像头模组成像的过程中，设置在镜头组件和/或感光成像组件上的遮光层能够截止第一光路上的光线，避免了第一光路上的光线反射到感光成像组件的成像区影响摄像头模组的成像效果，提升了摄像头模组的成像质量。
在一种可能的实施方式中，所述镜头组件包括镜筒，所述遮光层设置在所述镜筒面向所述感光成像组件的底端。
可选地，所述遮光层与所述镜筒之间通过结构胶进行粘接。基于该可选的方式增强遮光层与镜筒之间的牢固性。
在一种可能的实施方式中，所述遮光层设置在至少一个所述光学透镜上。
可选地，所述遮光层和所述光学透镜之间通过结构胶进行粘接。基于该可选的方式提高遮光层在光学透镜上的牢固性。
可选地，所述遮光层可以为圆形环状。
在一种可能的实施方式中，所述遮光层设置在至少一个所述光学透镜中距离所述感光成像组件最近的所述光学透镜上。
在一种可能的实施方式中，所述滤光面和所述遮光层位于同一所述光学透镜上。
基于上述可选的方式，利用在光学透镜上设置的遮光层截止非成像区反射的光线经光学透镜的再次反射或折射后进入成像区，以减少进入成像区的杂散光，提高摄像头模组的成像质量。
在一种可能的实施方式中，所述镜头组件包括棱镜，所述棱镜设置在所述镜头组件靠近所述感光成像组件的一端，射入所述镜头组件的光线依次经所述棱镜的入光面、反射面和出光面后射出所述镜头组件；
所述遮光层设置在所述入光面、所述反射面和所述出光面中的至少一面上。
基于上述可选的方式，通过在棱镜的入光面、反射面和出光面中的至少一面上设置遮光层，避免了照射至非成像区的光线经反射后照射至成像区而影响摄像头模组的成像，有效降低了杂散光对摄像头模组成像质量的影响。
在一种可能的实施方式中，所述感光成像组件包括印制电路板PCB和设置在所述PCB上的感光芯片，所述感光芯片与所述PCB通过金属结构件电连接，所述遮光层设置在所述金属结构件上。
基于该可选的方式，通过在感光芯片和PCB电连接的金属结构件上设置遮光层，能够减少进入摄像头模组的光线照射在金属结构件上，避免照射在金属结构件上的光线发生反射而射入成像区，提升了摄像头模组的成像效果。
在一种可能的实施方式中，所述金属结构件位于所述非成像区，所述遮光层设置在所述非成像区。
基于上述可选的方式，通过在感光成像组件的非成像区设置遮光层，以截止射入摄像头模组的光线照射至非成像区，使得照射至非成像区的光线无法发生反射，即照射至非成像区的光线不会影响摄像头模组的正常成像，有效提升了摄像头模组的成像质量。
在一种可能的实施方式中，所述遮光层包括胶层、丝印、油墨层、黑矩阵、遮光环、遮光片中的任意一种。
可选地，所述遮光层的表面光泽度为0～20％，所述遮光层的光线吸收率大于或等于90％。
可选地，所述油墨层可以是喷涂的消光油墨或者黑色油墨。
示例性的，所述遮光层可以是经表面粗糙化处理、消光油墨喷涂处理后的结构层。
第二方面，本申请实施例提供一种电子设备，该电子设备包括壳体和设置在所述壳体内的前述第一方面以及第一方面中的任意一项所述摄像头模组。
在一种可能的实施方式中，所述镜头组件包括镜筒，所述遮光层设置在所述镜筒面向所述感光成像组件的底端。
在一种可能的实施方式中，所述遮光层设置在至少一个所述光学透镜上。
在一种可能的实施方式中，所述遮光层设置在至少一个所述光学透镜中距离所述感光成像组件最近的所述光学透镜上。
在一种可能的实施方式中，所述滤光面和所述遮光层位于同一所述光学透镜上。
在一种可能的实施方式中，所述镜头组件包括棱镜，所述棱镜设置在所述镜头组件靠近所述感光成像组件的一端，射入所述镜头组件的光线依次经所述棱镜的入光面、反射面和出光面后射出所述镜头组件；
所述遮光层设置在所述入光面、所述反射面和所述出光面中的至少一面上。
在一种可能的实施方式中，所述感光成像组件包括印制电路板PCB和设置在所述PCB上的感光芯片，所述感光芯片与所述PCB通过金属结构件电连接，所述遮光层设置在所述金属结构件上。
在一种可能的实施方式中，所述金属结构件位于所述非成像区，所述遮光层设置在所述非成像区。
在一种可能的实施方式中，所述遮光层包括胶层、丝印、油墨层、黑矩阵、遮光环、遮光片中的任意一种。
本申请提供的第二方面的技术效果可以参见上述第一方面的各个可选方式的技术效果，此处不再赘述。
附图说明
图1为本申请实施例提供的一种现有摄像头模组的结构示意图；
图2为本申请实施例提供的一种受杂散光影响的成像效果示意图；
图3为本申请实施例提供的一种摄像头模组的爆炸结构示意图；
图4为本申请实施例提供的一种摄像头模组的剖面结构示意图；
图5为本申请实施例提供的感光结构组件的俯视结构示意图；
图6为本申请实施例提供的在一个光学透镜上设置遮光层的结构示意图；
图7为本申请实施例提供的遮光层的一种形状示意图；
图8为本申请实施例提供的遮光层的另一种形状示意图；
图9为本申请实施例提供的遮光层的又一种形状示意图；
图10为本申请实施例提供的在光学透镜上设置的遮光层的第一种形状示意图；
图11为本申请实施例提供的在光学透镜上设置的遮光层的第二种形状示意图；
图12为本申请实施例提供的在光学透镜上设置的遮光层的第三种形状示意图；
图13为本申请实施例提供的在光学透镜上设置的遮光层的第四种形状示意图；
图14为本申请实施例提供的在镜筒上设置遮光层的爆炸结构示意图；
图15为本申请实施例提供的在镜筒上设置遮光层的剖面结构示意图；
图16为本申请实施例提供的镜头组件中设置棱镜的主视结构示意图；
图17为本申请实施例提供的表示棱镜多个面的结构示意图；
图18为本申请实施例提供的在棱镜的出光面上设置遮光层的结构示意图；
图19为本申请实施例提供的在感光成像组件上设置遮光层的一种结构示意图；
图20为本申请实施例提供的在感光成像组件上设置遮光层的另一种爆炸结构示意图；
图21为本申请实施例提供的在感光成像组件上设置遮光层的另一种整体结构示意图。
附图标记：
1、镜头组件；11、光学透镜；12、镜筒；2、感光成像组件；21、成像区；22、非成像区；3、
目标物体；
100、镜头组件；101、光学透镜；102、镜筒；103、棱镜；1031、入光面；1032、反射面；
1033、出光面；104、第一壳体；1041、通孔；
200、感光成像组件；201、感光芯片；2011、成像区；2012、逻辑区；202、PCB；2021、非
成像区；2021a、过渡区；2021b、焊盘区；2021c、底板区；
300、遮光层；
400、结构胶。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请的描述中，需要理解的是，术语“上”、“下”、“侧”、“前”、“后”等指示的方位或位置关系为基于安装的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
还需说明的是，本申请实施例中以同一附图标记表示同一组成部分或同一零部件，对于本申请实施例中相同的零部件，图中可能仅以其中一个零件或部件为例标注了附图标记，应理解的是，对于其他相同的零件或部件，附图标记同样适用。
随着互联网技术的不断发展，摄像头模组的整体结构设计越来越趋于小型化，多数的摄像头模组取消了红外滤光片，以减少摄像头模组的整体厚度。例如，如图1所示为一种现有摄像头模 组的结构示意图，参见图1，现有摄像头模组主要包括镜头组件1和感光成像组件2。其中，镜头组件1中可以包括光学透镜11和镜筒12，光学透镜11设置在镜筒12内，镜头组件1用于聚集目标物体3(即被拍摄物体)反射的光线；感光成像组件2主要包括印制电路板(Printed Circuit Board，PCB)和设置在PCB上的感光芯片，其中，感光芯片用于将光信号转换为电信号，PCB用于根据感光芯片接收到的电信号形成图像。
参见图1，上述摄像头模组的成像原理具体是利用镜头组件1聚集目标物体3反射的光线，聚集至镜头组件1的光线照射到感光成像组件2后，感光成像组件2将接收到的光信号转换为电信号形成相应的图像，实现成像功能。
现有摄像头模组在实际应用中，除了目标物体3上反射的光线(即图1中的正常成像光线路径)会被聚集至镜头组件1内之外，例如边缘强光线等其他不必要的光线(即杂散光)也会被聚集至镜头组件1内，进入镜头组件1内的不必要的光线通过光学透镜11后照射在感光成像组件2的非成像区22，照射在非成像区22的光线经反射后会照射在感光成像组件2的成像区21内，严重影响了摄像头模组的正常成像。如图2所示为本申请实施例提供的一种受杂散光影响的成像效果示意图，参见图2，最终形成的图像中存在较为明显的光晕、光斑，摄像头模组的成像效果较差。因此，如何有效降低杂散光对摄像头模组成像质量的影响成为了亟待解决的技术问题。
为了有效降低杂散光对摄像头模组成像质量的影响，提升摄像头模组的成像质量，本申请实施例提供一种摄像头模组，摄像头模组包括镜头组件100和感光成像组件200，其中，镜头组件100包括至少一个光学透镜101，在至少一个光学透镜101中设置有用于滤除红外光的滤光面，通过在镜头组件100和/或感光成像组件200上设置至少一层遮光层300，以截止第一光路上的光线，避免了第一光路上的光线进入感光成像组件200中的成像区2011影响摄像头模组的成像效果，从而有效降低杂散光对摄像头模组成像质量的影响，提升了摄像头模组的成像质量。
本申请实施例提供一种摄像头模组可以应用于多种电子设备中，该电子设备包括但不限于摄像机、手机(phone)、个人数字助理(personal digital assistant)、平板电脑、车载电脑、膝上电脑(laptop computer)、智慧屏、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持设备、智能手表(smart watch)、行车记录设备、监控设备以及其他具有摄像、拍照功能的设备。
应理解，电子设备中还可以包括壳体，壳体内设置有本申请实施例提供的摄像头模组。
如图3所示为本申请实施例提供的一种摄像头模组的爆炸结构示意图，如图4所示为本申请实施例提供的一种摄像头模组的剖面结构示意图，参见图3-图4，该摄像头模组包括镜头组件100和感光成像组件200，镜头组件100和感光成像组件200连接。其中，镜头组件100可以包括至少一个光学透镜101，至少一个光学透镜101包括滤光面，滤光面用于滤除红外光。
应理解，可以在光学透镜101的两个表面或者一个表面上设置滤光涂层，形成滤光面，以滤除穿过该光学透镜101的红外光，例如，滤光涂层可以为红外滤光膜；也可以在制作光学透镜101的过程添加可以滤除红外光的材料，以使制作完成的光学透镜101在实际使用时具有滤除红外光的特性。
镜头组件100可以包括镜筒102，至少一个光学透镜101设置在镜筒102内，其中，镜筒102也可以称为镜座，用于为光学透镜101提供支撑。
应理解，光学透镜101在镜筒102内的设置方式包括但不限于：镜筒102的内侧壁上设置有与上述光学透镜101对应的凹槽，镜筒102通过其内侧壁上的凹槽对应卡接光学透镜101，使得光学透镜101沿光轴方向的周向侧壁与凹槽实现紧密贴合(或者接触)，从而将光学透镜101设置在镜筒102内。
不难理解的，基于上述示例，镜筒102内侧壁上设置凹槽的数量与光学透镜101的数量一致，光学透镜101的数量可以根据实际应用需求设置，本申请对光学透镜101的数量、形状、材质以及光学透镜101与镜筒102之间的连接不作限定。
可选地，镜头组件100还可以包括马达。其中，马达与镜筒102连接，马达用于提供驱动力，在马达的驱动下，镜筒102能够带动光学透镜101朝靠近感光成像组件200或远离感光成像组件200的方向移动，以调节摄像头模组的焦距。
可选地，镜头组件100还可以包括第一壳体104。在一种可能的实施方式中，第一壳体104 上设置有通孔1041，镜筒102可以设置在第一壳体104的通孔1041内，镜筒102靠近感光成像组件200一端的外侧壁与第一壳体104靠近感光成像组件200一端的内侧壁固定连接。
或者镜筒102靠近感光成像组件200的一端设置在第一壳体104的通孔1041内，镜筒102远离感光成像组件200的另一端凸出于第一壳体104，镜筒102靠近感光成像组件200一端的外侧壁与第一壳体104靠近感光成像组件200一端的内侧壁固定连接。
其中，镜筒102靠近感光成像组件200的一端与第一壳体104之间的固定连接方式包括但不限于螺接、卡接、粘接等。
应理解，除上述方式外，第一壳体104与镜筒102也可以由一体成型工艺制成一体结构，这样不仅能够节省单独制作第一壳体104与镜筒102加工工序，降低加工难度，节约制作成本，还能使支撑光学透镜101的结构件(即由第一壳体104与镜筒102一体成型结构件)具有更强的机械刚度，提高支撑光学透镜101的结构件的稳定性。
感光成像组件200中包括感光芯片201与PCB202，感光芯片201与PCB202之间电连接。一般地，PCB202与感光芯片201通过导电性能好、抗氧化性强的金属结构件(例如金或铜)实现电连接。
感光芯片201与PCB202之间的结构设计包括但不限于：PCB202面向镜头组件100的一面设置有用于容纳感光芯片201的凹槽，感光芯片201被嵌设在凹槽内。
如图5所示为本申请实施例提供的一种感光成像组件200的俯视结构示意图，参见图5，感光成像组件200包括成像区2011和非成像区2021，目标物体反射的光线经镜头组件100中的至少一个光学透镜101后在感光成像组件200的成像区2011内成像。
其中，用于接收光信号的区域为感光成像组件200的成像区2011，也即感光芯片201的成像区2011，成像区2011用于接收成像所需的光信号；围绕成像区2011的区域为感光成像组件200的非成像区2021(也称周边区)，也就是说非成像区2021环绕成像区2011，非成像区2021位于成像区2011的外侧。
具体地，参见图5，假设在感光成像组件200中感光芯片201所在的位置称为内，那么本申请实施例中，感光成像组件200由内而外可以依次划分为感光芯片201的成像区2011、感光芯片201的逻辑区2012、感光芯片201与PCB202之间的过渡区2021a、PCB202的焊盘区2021b以及PCB202的底板区2021c，其中，感光芯片201包括逻辑区2012和成像区2011，成像区2011也就是感光成像组件200的吸光区，用于接收光信号以实现成像功能；非成像区2021包括除成像区2011之外的区域，即非成像区2021包括感光成像组件200中除感光芯片201的成像区2011之外的其他区域，换言之，感光成像组件200的非成像区2021包括感光芯片201的逻辑区2012、感光芯片201与PCB202之间的过渡区2021a、PCB202的焊盘区2021b以及PCB202的底板区2021c。
应理解，底板区2021c是指感光成像组件200中除成像区2011、逻辑区2012、过渡区2021a以及焊盘区2021b之外的其他区域。
不难理解的，上述感光芯片201可以为图像传感器。作为示例而非限定，该图像传感器可以是电耦合(Charge-coupled device，CCD)图像传感器或者是互补式金属氧化物半导体(Complementary metal-Oxide-Semiconductor，CMOS)图像传感器。本申请实施例对感光芯片201的类型不作任何限定。
本申请实施例中，镜头组件100与感光成像组件200可以通过螺接、卡接或者粘接等方式实现二者的相对固定，本申请对此不作限定。
示例性的，镜头组件100和感光成像组件200之间的固定方式可以是镜筒102面向感光成像组件200一面的底端与感光成像组件200中的PCB202固定连接，也可以是镜头组件100中的第一壳体104面向感光成像组件200一面的底端与感光成像组件200中的PCB202固定连接等等。
值得说明的是，为了满足摄像头模组的实际应用需求，降低摄像头模组的厚度，使组装完成的摄像头模组满足越来越小型化的实际应用需求，本申请实施例中的摄像头模组中可以根据实际应用需求进行设置或者不设置具有滤除红外光功能的滤光面。
示例性的，若根据实际应用需求，需要该摄像头模组具有滤除红外光的功能，则除了本申请实施例提供的在至少一个光学透镜101上设置用于滤除红外光的滤光面外，还可以将具有滤除红 外光作用的薄膜集成至感光成像组件200中，在减少组装后的摄像头模组的尺寸的情况下，使得组装后的摄像头模组具有滤除红外光的功能；若根据实际应用需求，不需要该摄像头模组具有滤除红外光的功能，例如，需要基于红外成像原理采集对应的红外图像，则可以不再在摄像头模组中镜头组件100的至少一个光学透镜101上设置具有滤除红外光作用的滤光面。基于本申请实施例，取消了设置在摄像头模组中镜头组件100和感光成像组件200之间的红外滤光片，相对于在镜头组件100与感光成像组件200之间设置红外滤光片的现有摄像头模组，在镜头组件100中至少一个光学透镜101上设置滤光面能够通过减少红外滤光片的设置厚度有效降低组装后的摄像头模组的厚度。
为了减少其他不必要的光线进入成像区2011，有效降低杂散光对摄像头模组成像质量的影响，提升摄像头模组的成像质量，本申请实施例中，在镜头组件100和/或感光成像组件200上设置有至少一层遮光层300，该遮光层300能够截止第一光路上的光线，第一光路通过至少一个光学透镜101到达感光成像组件200的非成像区2021。
应理解，本申请实施例中可以在镜头组件100上设置至少一层遮光层300；也可以在感光成像组件200上设置至少一层遮光层300；还可以既在镜头组件100上设置至少一层遮光层300，又在感光成像组件200上也设置至少一层遮光层300。
应理解，第一光路包括射入摄像头模组中的光线照射至非成像区2021的光线路径、经非成像区2021反射的反射光线的传输路径以及上述反射光线经反射或折射后照射至成像区2011的光线路径。
本申请实施例中，遮光层300的材质可以是表面光泽度为0～20％或者60°以及光线吸收率大于或等于90％的聚合物，例如聚酯薄膜(也称聚酯树脂)；也可以是例如填充了低反射微颗粒的塑料，或者填充了低反射纤维的塑料的复合材料，还可以是金属材质或者油墨层。
不同的实际应用场景中，上述遮光层300还可以是表面经粗糙化并经消光油墨喷涂处理后反射率小于10％的其他结构层。当然，遮光层300还可以是丝印、油墨层(例如黑色油墨)、黑矩阵(black matirx，BM)、遮光环、遮光片中的任意一种。
在一种可能的实施方式中，上述遮光层300还可以为胶层。其中，上述胶层可以是呈黑色且具有低反射率的胶粘剂。在实际使用过程中，该胶层在未凝固时具有低流动性、高粘度；在凝固后能够堆叠预设高度的胶层，以符合实际应用需求，本申请实施例对遮光层300的具体材质不作任何限定。
下面以具体地实施例对本申请提供的摄像头模组中遮光层300的设置位置进行详细说明。
在一种可能的实施方式中，遮光层300设置在至少一个光学透镜101上，即在镜头组件100的至少一个光学透镜101上设置遮光层300，如图6所示为本申请实施例提供的在一个光学透镜101上设置遮光层300的结构示意图。
应理解，在摄像头模组的实际装配过程中，镜头组件100中可以包括多个光学透镜101，当镜头组件100中包括多个光学透镜101时，可以在多个光学透镜101中的至少一个光学透镜101上设置遮光层300。
例如，假设在镜头组件100的镜筒102中设置有2个光学透镜101，分别为光学透镜A和光学透镜B，那么可以在光学透镜A上设置遮光层300；也可以在光学透镜B上设置遮光层300；还可以是既在光学透镜A上设置遮光层300，又在光学透镜B边缘上设置遮光层300。
不难理解的，遮光层300可以设置在至少一个光学透镜101靠近感光成像组件200一面上，和/或遮光层300可以设置在至少一个光学透镜101远离感光成像组件200的一面上。也就是说，遮光层300可以设置在至少一个光学透镜101靠近感光成像组件200一面上；遮光层300也可以设置在至少一个光学透镜101远离感光成像组件200的一面上；遮光层300还可以既设置在至少一个光学透镜101靠近感光成像组件200一面上，又设置在至少一个光学透镜101远离感光成像组件200的一面上。
需要说明的是，在实际设计过程中，遮光层300和滤光面可以设置在不同的光学透镜101上，也可以设置同一光学透镜101上。
示例性的，假设镜头组件100包括两个光学透镜101，分别为光学透镜A和光学透镜B，可 以在光学透镜A上设置滤光面，在光学透镜B设置遮光层300，或者在光学透镜B上设置滤光面，在光学透镜A设置遮光层300；也可以既在光学透镜A上设置滤光面，又在光学透镜A上设置遮光层300，或者，既在光学透镜B上设置滤光面，又在光学透镜B上设置遮光层300；当然，还可以同时在光学透镜A和光学透镜B上既设置滤光面，又设置遮光层300。
为了减少摄像头模组的装配流程，便于遮光层300的设置，在一种可能的实施方式中，遮光层300可以设置在至少一个光学透镜101中距离感光成像组件200最近的光学透镜101上。
上述在至少一个光学透镜101上设置遮光层300的方式，能够截止非成像区2021反射的光线经光学透镜101的再次反射或折射后进入成像区2011，以减少进入成像区2011的杂散光，提高摄像头模组的成像质量。
作为示例而非限定，至少一个遮光层300在光学透镜101上的铺设形状呈现圆形环状，例如圆环、跑道形等，若遮光层300在光学透镜101铺设形状为圆形环状，则遮光层300在光学透镜101上的铺设宽度能够截止经感光成像组件200的非成像区2021反射的光线即可，其中，遮光层300在光学透镜101铺设宽度是指圆形环状内半径与外半径之间的差值。
可选地，随着镜头组件100中光学透镜101的形状变化，在光学透镜101上设置的遮光层300的形状除了可以是圆形环状外，也可以是如图7-图9所示的其他环状，本申请中对遮光层300在光学透镜101上的铺设形状、铺设宽度以及配设厚度(指遮光层300沿光学透镜101的光轴方向的设置高度)不作任何限定。
应理解，镜头组件100包括多个光学透镜101时，多个光学透镜101上设置的遮光层300的图形可以相同，也可以不同，本申请对此不作任何限定。例如，当镜头组件100包括两个光学透镜101时，则可以在上述两个光学透镜101上分别设置如图7-图9所示的任一环状的遮光层300。
又如，当镜头组件100包括两个光学透镜101时，假设两个光学透镜101分别为光学透镜A和光学透镜B，光学透镜A和光学透镜B并排设置，在光学透镜A上设置的遮光层300的图形(或者形状)可以如图10所示，在光学透镜B上设置的遮光层300的图形可以如图11所示；或者光学透镜A上的遮光层300的图形可以如图12所示，光学透镜B上的遮光层300的图形可以如图13所示，虽然在光学透镜A和光学透镜B上设置的遮光层300的图形不同，但是遮光层300在光学透镜A和光学透镜B上的设置位置能够有效截止经感光成像组件200的非成像区2021反射的不必要的光线，本申请对在光学透镜A和光学透镜B上设置的遮光层300的形状、尺寸大小不作限定。
可选地，为了便于遮光层300的固定，避免遮光层300在长期使用过程中掉落，参见图6，可以在遮光层300与光学透镜101之间设置结构胶400，即遮光层300通过结构胶400与光学透镜101粘接，以增强遮光层300的实用性，提升遮光层300在光学透镜101上的牢固性。
在一种可能的实施方式中，如图14所示为本申请实施例提供的在镜筒102上设置遮光层300的爆炸结构示意图，如图15所示为本申请实施例提供的在镜筒102上设置遮光层300的剖面结构示意图，参见图14、图15，镜头组件100可以包括镜筒102，遮光层300设置在镜筒102面向感光成像组件200的底端，即在镜筒102面向感光成像组件200的底部端面上设置遮光层300。
应理解，可以在镜筒102面向感光成像组件200的底端设置遮光层300，遮光层300沿第一方向的铺设宽度能够截止经感光成像组件200的非成像区2021反射的光线进入成像区2011即可，其中，第一方向是与摄像头模组中光学透镜101的光轴方向垂直的方向。
值得说明的是，在镜头组件100还包括第一壳体104，镜筒102靠近感光成像组件200一端的外侧壁与第一壳体104靠近感光成像组件200一端的内侧壁固定连接；或者第一壳体104与镜筒102由一体成型工艺制成一体结构的情况下，基于上述可能的实施例，遮光层300还可以设置在第一壳体104靠近感光成像组件200的底端。
示例性的，参见图15，第一壳体104上设置有台阶孔，该台阶孔包括小孔段和大孔段，其中，小孔段为通孔1041，用于安装镜筒102；大孔段位于通孔1041与感光成像组件200之间，遮光层300设置在大孔段面向感光成像组件200的底端，遮光层300沿第一方向的铺设宽度能够截止经感光成像组件200的非成像区2021反射的光线进入成像区2011即可。
值得一提的是，该实施方式中，遮光层300一部分设置在镜筒102和/或第一壳体104上，另 一部分沿着第一方向延伸，其中，向第一方向延伸的部分用于截止第一光路的光线。
可选地，在遮光层300的组装工艺中，也可以通过结构胶400将遮光层300粘接在镜筒102面向感光成像组件200的底端或者第一壳体104靠近感光成像组件200的底端，以便提高遮光层300的结构强度。
在另一种可能的实施方式中，如图16所示为本申请实施例提供的镜头组件100中设置棱镜103的主视结构示意图，如图17所示为本申请实施例提供的表示棱镜103的多个面的结构示意图，如图18所示为本申请实施例提供的一种在棱镜103的出光面1033上设置遮光层300的结构示意图，参见图16-图18，镜头组件100可以包括棱镜103，上述棱镜103设置在镜头组件100靠近感光成像组件200的一端，射入镜头组件100的光线依次经棱镜103的入光面1031、反射面1032和出光面1033后射出镜头组件100；遮光层300设置在棱镜103的入光面1031、棱镜103的反射面1032和棱镜103的出光面1033中的至少一面上。
应理解，棱镜103的入光面1031是指光线入射棱镜103的面，反射面1032是指入射至棱镜103中的光线发生反射的面；出光面1033是指光线射出棱镜103的面。
可选地，上述棱镜103包括但不限于三棱镜、四棱镜或者五棱镜等，本申请实施例对棱镜103的形状以及数量不作任何限定。
示例性的，若镜头组件100中包括一个棱镜103，那么该棱镜103设置在镜筒102靠近感光成像组件200的一端，目标物体反射的光线经光学透镜101后照射在该棱镜103的入光面1031，通过棱镜103的入光面1031进入的光线经其反射面1032反射后从棱镜103的出光面1033射出，可以在该棱镜103的入光面1031设置遮光层300，以减少其他不必要的光线(如边缘强光线等)从棱镜103的入光面1031射出；也可以在该棱镜103的反射面1032设置遮光层300，减少从该棱镜103的反射面1032出射的其他不必要的光线；还可以在该棱镜103的出光面1033设置遮光层300，减少从该棱镜103的出光面1033出射的其他不必要的光线。
当然，还可以在该棱镜103的入光面1031设置遮光层300，同时在该棱镜103反射面1032设置遮光层300；或者在该棱镜103入光面1031设置遮光层300，同时在该棱镜103出光面1033设置遮光层300；或者在该棱镜103反射面1032设置遮光层300，同时在该棱镜103出光面1033设置遮光层300；又或者在该棱镜103入光面1031设置遮光层300，同时在该棱镜103反射面1032设置遮光层300，且在该棱镜103出光面1033设置遮光层300，减少经感光成像组件200的非成像区2021反射的其他不必要的光线进入成像区2011，有效降低其他不必要光线对摄像头模组正常成像的影响，提升摄像头模组的成像质量。
需要说明的是，若镜头组件100中包括两个棱镜103，分别为棱镜C和棱镜D，那么可以将棱镜C设置在镜头组件100远离感光成像组件200的一端，将棱镜D设置在镜头组件100靠近感光成像组件200的另一端；或者将棱镜D设置在镜头组件100远离感光成像组件200的一端，将棱镜C设置在镜头组件100靠近感光成像组件200的另一端。在本申请实施例中，可以分别在棱镜C和/或棱镜D的入光面1031、棱镜C和/或棱镜D的反射面1032以及棱镜C和/或棱镜D的出光面1033中的至少一面上设置遮光层300。
设置有两个棱镜103的摄像头模组中，由于其在实际使用过程中，设置在镜头组件100远离感光成像组件200的一端的棱镜103可能会随参照光线的移动而转动，实现防抖功能，遮光层300的设置范围需要根据棱镜103转动的角度来确定，这种情况下，在摄像头模组的组装过程中无法准确设计遮光层300在镜头组件100远离感光成像组件200的一端的棱镜103上的区域，因此，在一种可能的实施方式中，当镜头组件100中包括两个棱镜103时，在镜头组件100靠近感光成像组件200的另一端的棱镜103的入光面1031、棱镜103的反射面1032以及棱镜103的出光面1033中的至少一面上设置遮光层300。
可选地，也可以利用结构胶400将遮光层300设置在棱镜103的入光面1031、棱镜103的反射面1032以及棱镜103的出光面1033中的至少一面上。
可选地，在棱镜103上设置的遮光层300的形状可以是如图18所示的内环呈圆形、外环呈矩形的环状外，还可以是如图7-图8所示的环状，遮光层300在棱镜103上的铺设形状、遮光层300沿第二方向的铺设宽度能够使遮光层300截止从感光成像组件200的非成像区2021反射的光线进 入成像区2011即可，其中第二方向是与棱镜103的入光面1031平行的方向，或者是与棱镜103的反射面1032平行的方向，又或者是与棱镜103的出光面1033平行的方向，本申请对遮光层300在棱镜103上的铺设形状、铺设宽度以及铺设厚度不作任何限定。
在一种可能的实施方式中，遮光层300还可以设置在非成像区2021，即遮光层300设置在感光成像组件200中除成像区2011之外的区域。
示例性的，如图19所示为本申请实施例提供的在感光成像组件200上设置遮光层300的一种结构示意图，如图20所示为本申请实施例提供的在感光成像组件200上设置遮光层300的另一种爆炸结构示意图，如图21所示为本申请实施例提供的在感光成像组件200上设置遮光层300的另一种整体结构示意图，参见图19-图21，无论镜头组件100中包括棱镜103、镜筒102以及第一壳体104，还是镜头组件100中包括至少一个光学透镜101、镜筒102以及第一壳体104，均可以在感光成像组件200中除成像区2011之外的其他区域内设置遮光层300，该遮光层300能够防止经非成像区2021反射的其他不必要的光线的产生，截止从镜头组件100出射至非成像区2021的其他不必要的光线经反射和/或折射后进入成像区2011，提高了摄像头模组的成像效果。
应理解，用于实现感光芯片201和PCB202电连接的金属结构件一般具有较强的反射率，而这些金属结构件主要设置于感光芯片201的逻辑区2012、感光芯片201与PCB202之间的过渡区2021a以及PCB202的焊盘区2021b内，若光线照射至金属结构件上后会发生反射，反射光线经再次反射和/或折射后会进入成像区2011而产生杂散光，进而影响摄像头模组的成像质量。因此，在一种可能的实施方式中，遮光层300可以设置在如图5所示的感光芯片201的逻辑区2012、感光芯片201与PCB202之间的过渡区2021a、PCB202的焊盘区2021b，用于截止照射至逻辑区2012、过渡区2021a以及焊盘区2021b内的不必要的光线，避免照射在上述区域内的光线发生反射，影响摄像头模组的成像质量。
不难理解的，在实际制作过程中，遮光层300也可以设置在感光芯片201的逻辑区2012、感光芯片201与PCB202之间的过渡区2021a、PCB202的焊盘区2021b以及PCB202的底板区2021c，本申请对此不作任何限定。
不难理解，遮光层300在感光成像组件200上的铺设形状可以是如图7-图9所示的形状，能够截止(或吸收)照射至感光成像组件200的非成像区2021的不必要的光线发生反射即可，本申请对遮光层300的具体铺设形状不作任何限定。
值得说明的是，随着感光成像组件200中感光芯片201与PCB202之间的装配关系，或者二者各自结构的变化，遮光层300的铺设形状能够截断不必要光线在摄像头模组中发生反射和/或折射后进入成像区2011即可。
可选地，遮光层300与感光成像组件200之间设置有结构胶400，结构胶400用于将遮光层300固定在感光成像组件200上。
为了减少遮光层300的设置面积，节省成本，在一种可能的实施方式中，用于电连接感光芯片201和PCB202的金属结构件位于非成像区2021，遮光层300还可以设置在金属结构件上。通过在金属结构件上设置遮光层300，能够减少穿过光学透镜101到达感光成像组件200的金属结构件上的光线，进而避免照射在金属结构上的光线发生反射而射入成像区2011，提升了摄像头模组的成像效果。
值得说明的是，当上述遮光层300为胶层时，覆盖在金属结构件上的胶层利用其在未凝固时具有低流动性、高粘度的特性，将胶层涂覆在非成像区2021内的金属结构件上，避免胶层溢至成像区2011；该胶层在凝固后堆胶高度能够高于金属结构件，以使得胶层可以包裹非成像区2021内的金属结构件。本申请对胶层的设置高度、设置形状以及具体的涂覆过程不作限定。
不难理解，还可以通过设置胶层、丝印、油墨层、BM中的至少一种遮光层300的方式涂覆在镜筒102的内侧壁上，和/或第一壳体104的内侧壁上，避免不必要的光线在镜筒102的内侧壁上发生反射后产生的光线进入成像区2011，以降低杂散光对摄像头模组成像质量的影响。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种摄像头模组，其特征在于，所述摄像头模组包括镜头组件(100)和感光成像组件(200)，所述镜头组件(100)包括至少一个光学透镜(101)，至少一个所述光学透镜(101)包括滤光面，所述滤光面用于滤除红外光；所述感光成像组件(200)包括成像区(2011)和非成像区(2021)；
    所述镜头组件(100)和/或所述感光成像组件(200)上设置至少一层遮光层(300)，所述遮光层(300)用于截止第一光路上的光线，所述第一光路通过所述至少一个光学透镜(101)到达所述感光成像组件(200)的所述非成像区(2021)。
  2. 根据权利要求1所述的摄像头模组，其特征在于，所述镜头组件(100)包括镜筒(102)，所述遮光层(300)设置在所述镜筒(102)面向所述感光成像组件(200)的底端。
  3. 根据权利要求1或2所述的摄像头模组，其特征在于，所述遮光层(300)设置在至少一个所述光学透镜(101)上。
  4. 根据权利要求3所述的摄像头模组，其特征在于，所述遮光层(300)设置在至少一个所述光学透镜(101)中距离所述感光成像组件(200)最近的所述光学透镜(101)上。
  5. 根据权利要求1-4中任一项所述的摄像头模组，其特征在于，所述滤光面和所述遮光层(300)位于同一所述光学透镜(101)上。
  6. 根据权利要求1-5中任一项所述的摄像头模组，其特征在于，所述镜头组件(100)包括棱镜(103)，所述棱镜(103)设置在所述镜头组件(100)靠近所述感光成像组件(200)的一端，射入所述镜头组件(100)的光线依次经所述棱镜(103)的入光面(1031)、反射面(1032)和出光面(1033)后射出所述镜头组件(100)；
    所述遮光层(300)设置在所述棱镜(103)的入光面(1031)、所述棱镜(103)的反射面(1032)和所述棱镜(103)的出光面(1033)中的至少一面上。
  7. 根据权利要求1-6中任一项所述的摄像头模组，其特征在于，所述感光成像组件(200)包括印制电路板PCB(202)和设置在所述PCB(202)上的感光芯片(201)，所述感光芯片(201)与所述PCB(202)通过金属结构件电连接，所述遮光层(300)设置在所述金属结构件上。
  8. 根据权利要求7所述的摄像头模组，其特征在于，所述金属结构件位于所述非成像区(2021)，所述遮光层(300)设置在所述非成像区(2021)。
  9. 根据权利要求1-8中任一项所述的摄像头模组，其特征在于，所述遮光层(300)包括胶层、丝印、油墨层、黑矩阵、遮光环、遮光片中的任意一种。
  10. 一种电子设备，其特征在于，包括壳体和设置在所述壳体内的如权利要求1-9任一项所述的摄像头模组。
  11. 根据权利要求10所述的电子设备，其特征在于，所述摄像头模组包括镜头组件(100)和感光成像组件(200)，所述镜头组件(100)包括至少一个光学透镜(101)，至少一个所述光学透镜(101)包括滤光面，所述滤光面用于滤除红外光；所述感光成像组件(200)包括成像区(2011)和非成像区(2021)；
    所述镜头组件(100)和/或所述感光成像组件(200)上设置至少一层遮光层(300)，所述遮光层(300)用于截止第一光路上的光线，所述第一光路通过所述至少一个光学透镜(101)到达所述感光成像组件(200)的所述非成像区(2021)。
  12. 根据权利要求11所述的电子设备，其特征在于，所述镜头组件(100)包括镜筒(102)，所述遮光层(300)设置在所述镜筒(102)面向所述感光成像组件(200)的底端。
  13. 根据权利要求11或12所述的电子设备，其特征在于，所述遮光层(300)设置在至少一个所述光学透镜(101)上。
  14. 根据权利要求13所述的电子设备，其特征在于，所述遮光层(300)设置在至少一个所述光学透镜(101)中距离所述感光成像组件(200)最近的所述光学透镜(101)上。
  15. 根据权利要求11-14中任一项所述的电子设备，其特征在于，所述滤光面和所述遮光层(300)位于同一所述光学透镜(101)上。
  16. 根据权利要求11-15中任一项所述的电子设备，其特征在于，所述镜头组件(100)包括棱 镜(103)，所述棱镜(103)设置在所述镜头组件(100)靠近所述感光成像组件(200)的一端，射入所述镜头组件(100)的光线依次经所述棱镜(103)的入光面(1031)、反射面(1032)和出光面(1033)后射出所述镜头组件(100)；
    所述遮光层(300)设置在所述棱镜(103)的入光面(1031)、所述棱镜(103)的反射面(1032)和所述棱镜(103)的出光面(1033)中的至少一面上。
  17. 根据权利要求11-16中任一项所述的电子设备，其特征在于，所述感光成像组件(200)包括印制电路板PCB(202)和设置在所述PCB(202)上的感光芯片(201)，所述感光芯片(201)与所述PCB(202)通过金属结构件电连接，所述遮光层(300)设置在所述金属结构件上。
  18. 根据权利要求17所述的电子设备，其特征在于，所述金属结构件位于所述非成像区(2021)，所述遮光层(300)设置在所述非成像区(2021)。
  19. 根据权利要求11-18中任一项所述的电子设备，其特征在于，所述遮光层(300)包括胶层、丝印、油墨层、黑矩阵、遮光环、遮光片中的任意一种。
PCT/CN2023/111033 2022-08-25 2023-08-03 一种摄像头模组及电子设备 WO2024041345A1 (zh)

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US20100157143A1 (en) * 2008-12-24 2010-06-24 Samsung Electro-Mechanics Co., Ltd. Camera module package
CN207764526U (zh) * 2017-09-28 2018-08-24 宁波舜宇光电信息有限公司 摄像模组及其感光组件和电子设备
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