WO2024040649A1 - 麦克风芯片 - Google Patents

麦克风芯片 Download PDF

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Publication number
WO2024040649A1
WO2024040649A1 PCT/CN2022/119299 CN2022119299W WO2024040649A1 WO 2024040649 A1 WO2024040649 A1 WO 2024040649A1 CN 2022119299 W CN2022119299 W CN 2022119299W WO 2024040649 A1 WO2024040649 A1 WO 2024040649A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
back plate
microphone chip
sealing member
chip according
Prior art date
Application number
PCT/CN2022/119299
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English (en)
French (fr)
Inventor
王凯杰
赵转转
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to JP2022577174A priority Critical patent/JP7545496B1/ja
Priority to US18/072,661 priority patent/US20240073625A1/en
Publication of WO2024040649A1 publication Critical patent/WO2024040649A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present application relates to the technical field of condenser microphones, and in particular to a microphone chip.
  • the condenser microphone includes a diaphragm and a backplate, which form a MEMS sound sensing capacitor, and the MEMS sound sensing capacitor is further connected to the processing chip through the connection pad to output the sound sensing signal to the processing chip for signal processing.
  • MEMS microelectromechanical system
  • the purpose of this application is to provide a microphone chip designed to reduce the risk of microphone attenuation.
  • the present application provides a microphone chip, including a substrate with a front cavity and a capacitor system disposed on the substrate and connected to the substrate.
  • the capacitor system includes a diaphragm located on the upper part of the substrate and a diaphragm connected to the diaphragm. Back plates are arranged at intervals, and an air gap is formed between the diaphragm and the back plate,
  • the microphone chip includes a fixing part, and the diaphragm and the back plate are connected to the base through the fixing part;
  • the diaphragm includes an inner membrane part, an outer membrane part and a support part, the inner membrane part and the outer membrane part are separated by a slit, and the support part is connected to the fixed part;
  • the microphone chip further includes a sealing member connected to the back plate and located between the back plate and the diaphragm, and the sealing member is disposed close to the outer periphery of the inner membrane portion.
  • the back plate is provided with an air outlet, and the air outlet is located in a region of the back plate surrounded by the seal.
  • the back plate is provided with a vent hole, and the vent hole is located outside the area of the back plate surrounded by the seal.
  • the support part extends outward along the edge of the inner membrane part and is connected to the fixing part.
  • the number of supporting parts is one or more.
  • the microphone chip further includes an electrode sheet, and the electrode sheet includes an electric level body and a lead-out part, and the number of lead-out parts is one or more.
  • the electrode sheet is disposed on a side of the back plate close to the diaphragm, and the electrode body is located in the seal;
  • the sealing member is provided with one or more notches, and one or more of the lead-out portions can respectively extend outward along the notches.
  • the height of the notch is equal to the height of the sealing member.
  • the height of the notch is less than the height of the sealing member, and the notch is disposed close to the back plate.
  • the electrode sheet is disposed on a side of the back plate away from the diaphragm;
  • the lead-out portion extends outward along the electrode body.
  • the beneficial effects of this application are: by processing the diaphragm, it is divided into an inner diaphragm part, an outer diaphragm part and a supporting part, the inner diaphragm part and the outer diaphragm part are separated by a slit, and the supporting part is connected to the fixing part to fix the diaphragm. This puts the diaphragm in a cantilevered state, ensuring that the stress of the diaphragm material is fully released and increasing the compliance of the diaphragm.
  • the inner membrane is attracted to the seal by electrostatic force, and the seal supports the inner membrane to reach the working state, while reducing the low attenuation of the microphone.
  • Figure 1 is a cross-sectional view of the microphone chip provided by the present application in a specific embodiment
  • Figure 2 is a schematic structural diagram of the diaphragm and the fixed part in Figure 1;
  • FIG 3 is a schematic structural diagram of the electrode plate and seal in Figure 1;
  • Figure 4 is an enlarged view of part A of Figure 3;
  • Figure 5 is a cross-sectional view of the microphone chip provided by the present application in another specific embodiment
  • Figure 6 is a schematic structural diagram of the electrode and backplate in Figure 5;
  • Figure 7 is a schematic structural diagram of Figure 6 from another perspective.
  • This embodiment provides a microphone chip 1, aiming to reduce the risk of microphone attenuation.
  • the microphone chip 1 includes a substrate 11 with a front cavity 111 and a capacitor system disposed on the substrate 11 and connected to the substrate 11 .
  • the capacitor system includes a diaphragm 12 located on the upper part of the substrate 11 and a capacitor system connected to the substrate 11 .
  • the diaphragms 12 are spaced apart from the back plate 13 , and an air gap is formed between the diaphragms 12 and the back plate 13 .
  • the diaphragm 12 When external sound is transmitted to the diaphragm 12 through the front cavity 111, the diaphragm 12 senses the external sound pressure and vibrates, causing the distance between the diaphragm 12 and the back plate 13 to change, thereby causing a change in capacitance, thereby realizing the conversion of sound signals into electrical signals. Convert.
  • the microphone chip 1 includes a fixing part 14, and the diaphragm 12 and the back plate 13 are connected to the base 11 through the fixing part 14.
  • the diaphragm 12 includes an inner membrane part 121 , an outer membrane part 122 and a support part 123 .
  • the inner membrane part 121 and the outer membrane part 122 are separated by a slit, and the support part 123 is connected to the fixing part 14 .
  • the diaphragm 12 is processed so that the diaphragm 12 forms an inner membrane part 121, an outer membrane part 122 and a support part 123.
  • the outer membrane part 122 is arranged to surround the inner membrane part 121, and the inner membrane part 121 and the outer membrane part 122 pass through it.
  • the supporting part 123 is connected to the fixing part 14 at a slit interval to fix the diaphragm 12, so that the diaphragm 12 is in a cantilevered state, ensuring that the stress of the diaphragm material is fully released and increasing the compliance of the diaphragm.
  • the microphone chip 1 also includes a sealing member 15.
  • the sealing member 15 is connected to the back plate 13 and is located between the back plate 13 and the diaphragm 12.
  • the sealing member 15 is disposed close to the outer periphery of the inner membrane portion 121. In the working state, the inner membrane portion 121 can be adsorbed on the sealing member 15 .
  • the back plate 13 is provided with an air outlet 131 .
  • the air outlet 131 is used to conduct sound and balance sound pressure.
  • the air outlet 131 is located in the area of the back plate 13 surrounded by the seal 15 .
  • the sealing member 15 has a certain height.
  • the diaphragm 12 is separated from the back plate 13 and the sealing member 15 .
  • the inner membrane portion 121 is attracted by the electrostatic force and adsorbed on the sealing member 15 .
  • the inner membrane part 121 and the back plate 13 form a closed space, blocking the communication between the front cavity 111 and the inner membrane part 121 and the back plate 13, and the seal 15 supports
  • the inner membrane part 121 can reach the working state while reducing the risk of microphone attenuation.
  • a certain number of vent holes may also be provided outside the area of the back plate 13 surrounded by the seal 15 . That is, with the seal 15 as the boundary, the back plate 13 can be provided with vent holes from the seal 15 to the edge of the back plate 13.
  • the number of vent holes in this range can be set according to needs to adjust the low attenuation value of the microphone.
  • the supporting portion 123 extends outward along the edge of the inner membrane portion 121 and is connected to the fixing portion 14 .
  • the inner membrane part 121 is in a cantilevered state, so that the stress of the diaphragm 12 is released and the compliance of the diaphragm is increased.
  • the diaphragm 12 can be connected and fixed with a single arm, which further ensures that the stress of the diaphragm 12 is released and increases the compliance of the diaphragm.
  • the diaphragm 12 may also be provided with two, three, etc. multiple support parts 123 according to installation requirements, which are not specifically limited here.
  • the microphone chip 1 further includes an electrode sheet 16 .
  • the electrode sheet 16 is disposed on the side of the back plate 13 close to the diaphragm 12 , and the electrode sheet 16 is located in the sealing member 15 . Since the electrode sheet 16 is disposed inside the sealing member 15, the electrode sheet 16 is blocked by the sealing member 15 and cannot be drawn out.
  • a notch 151 is provided in the seal 15.
  • the electrode sheet 16 includes a connected electrode body 161 and a lead-out portion 162. There are one or more lead-out portions 162, so that the lead-out portion 162 can extend outward along the notch 151.
  • the electrode sheet 16 is led out along the notch 151 .
  • the number of notches 151 is not specifically limited, and can be set to 1, 2, 3, etc. according to the requirement of the number of lead-out parts.
  • the height of the notch 151 may be equal to the height of the sealing member 15 .
  • the height of the notch 151 is smaller than the height of the sealing member 15 , that is, the height of the notch 151 only needs to match the height of the electrode sheet 16 .
  • the notch 151 is disposed close to the back plate 13 to prevent the diaphragm 12 from being adsorbed on the sealing member 15 and causing a gap between the diaphragm 12 and the sealing member 15 due to the notch 151 on the sealing member 15 .
  • the electrode sheet 16 is disposed on the side of the back plate 13 away from the diaphragm 12 .
  • the electrode sheet 16 includes a connected electrode body 161 and a lead-out portion 162 .
  • the lead-out portion 162 extends along the electrode body. 161 extends outward to lead out the electrode sheet 16 .

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本申请涉及一种麦克风芯片，包括具有前腔的基底以及设置于基底上与基底相连的电容系统，电容系统包括位于基底上部的振膜以及与振膜间隔设置的背板，振膜与背板之间形成空气间隔，其中振膜与背板通过固定部与基底连接，振膜包括内膜部、外膜部以及支撑部，内膜部与外膜部通过狭缝间隔，支撑部与固定部连接；麦克风芯片还包括密封件，密封件与背板连接，位于背板与振膜之间，密封件靠近内膜部的外周设置。麦克风芯片的内膜部与外膜部通过狭缝间隔，支撑部与固定部连接以固定振膜，从而使得振膜处于悬臂状态；通过在背板与振膜之间设置密封件，使内膜部受静电力吸引吸附在密封件，密封件支撑内膜部以达到工作状态，同时降低麦克风的低衰。

Description

麦克风芯片 技术领域
本申请涉及电容式麦克风技术领域，尤其涉及一种麦克风芯片。
 背景技术
随着无线通讯的发展，全球移动电话用户越来越多，用户对移动电话的要求已不仅满足于通话，而且要能够提供高质量的通话效果，尤其是目前移动多媒体技术的发展，移动电话的通话质量更显重要，移动电话的麦克风作为移动电话的语音拾取装置，其设计好坏直接影响通话质量。
目前常用的麦克风主要有电容式麦克风及MEMS（微电机系统）麦克风，它们广泛应用于各种终端设备中。电容式麦克风包括振膜和背板，二者构成MEMS声传感电容，且MEMS声传感电容进一步通过连接盘连接到处理芯片以将声传感信号输出给处理芯片进行信号处理。现有技术中麦克风的前腔到后腔出现泄气现象，容易导致麦克风出现低衰。
 技术问题
现有技术中麦克风的前腔到后腔出现泄气现象，容易导致麦克风出现低衰。
 技术解决方案
本申请的目的在于提供了一种麦克风芯片，旨在降低麦克风低衰的风险。
本申请提供了一种麦克风芯片，包括具有前腔的基底以及设置于所述基底上与所述基底相连的电容系统，所述电容系统包括位于所述基底上部的振膜以及与所述振膜间隔设置的背板，所述振膜与所述背板之间形成空气间隔，
所述麦克风芯片包括固定部，所述振膜与所述背板通过所述固定部与所述基底连接；
所述振膜包括内膜部、外膜部以及支撑部，所述内膜部与所述外膜部通过狭缝间隔，所述支撑部与所述固定部连接；
所述麦克风芯片还包括密封件，所述密封件与所述背板连接，位于所述背板与所述振膜之间，所述密封件靠近所述内膜部的外周设置。
在一种可能的设计中，所述背板设置有出气孔，所述出气孔位于所述背板被所述密封件包围的区域内。
在一种可能的设计中，所述背板设置有泄气孔，所述泄气孔位于所述背板被所述密封件包围的区域外。
在一种可能的设计中，所述支撑部沿所述内膜部的边缘向外延伸，并与所述固定部连接。
在一种可能的设计中，所述支撑部设置为一个或多个。
在一种可能的设计中，所述麦克风芯片还包括电极片，所述电极片包括电级本体和引出部，所述引出部为一个或多个。
在一种可能的设计中，所述电极片设置于所述背板靠近所述振膜的一侧，且所述电极本体位于所述密封件内；
所述密封件设有一个或多个缺口，一个或多个所述引出部分别能够沿所述缺口向外延伸。
在一种可能的设计中，沿所述麦克风芯片的厚度方向，所述缺口的高度等于所述密封件的高度。
在一种可能的设计中，沿所述麦克风芯片的厚度方向，所述缺口的高度小于所述密封件的高度，且所述缺口靠近所述背板设置。
在一种可能的设计中，所述电极片设置于所述背板远离所述振膜的一侧；
所述引出部沿所述电极本体向外延伸。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
 有益效果
本申请的有益效果在于：通过对振膜加工使其分为内膜部、外膜部与支撑部，内膜部与外膜部通过狭缝间隔，支撑部与固定部连接以固定振膜，从而使得振膜处于悬臂状态，保证振膜材料的应力充分释放，增大振膜顺性。通过在背板与振膜之间设置密封件，使麦克风工作时，内膜部受静电力吸引吸附在密封件，密封件支撑内膜部以达到工作状态，同时降低麦克风的低衰。
 附图说明
图1为本申请所提供麦克风芯片在一种具体实施例中的剖视图；
图2为图1中振膜与固定部的结构示意图；
图3为图1中电极板与密封件的结构示意图；
图4为图3的A部放大图；
图5为本申请所提供麦克风芯片在另一种具体实施例中的剖视图；
图6为图5中电极与背板的结构示意图；
图7为图6另一视角的结构示意图。
附图标记：
1-麦克风芯片；
  11-基底；
    111-前腔；
  12-振膜；
    121-内膜部；
    122-外膜部；
    123-支撑部；
  13-背板；
    131-出气孔；
  14-固定部；
15-密封件；
  151-缺口；
  16-电极片；
161-电极本体；
162-引出部。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
 本发明的最佳实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
应当明确，所描述的实施例仅仅是本申请一部分实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
本实施例提供了一种麦克风芯片1，旨在降低麦克风低衰的风险。
具体地，如图1和图5所示，麦克风芯片1包括具有前腔111的基底11以及设置于基底11上与基底11相连的电容系统，电容系统包括位于基底11上部的振膜12以及与振膜12间隔设置的背板13，振膜12与背板13之间形成空气间隔。当外界声音通过前腔111传递至振膜12，振膜12感受到外界声压产生振动，使得振膜12与背板13之间的距离发生变化从而产生电容变化，实现声音信号到电信号的转换。
麦克风芯片1包括固定部14，振膜12与背板13通过固定部14与基底11连接。振膜12包括内膜部121、外膜部122以及支撑部123，内膜部121与外膜部122通过狭缝间隔，支撑部123与固定部14连接。具体地，对振膜12进行加工，使振膜12形成内膜部121、外膜部122与支撑部123，外膜部122包围内膜部121设置，内膜部121与外膜部122通过狭缝间隔，支撑部123与固定部14连接以固定振膜12，从而使得振膜12处于悬臂状态，保证振膜材料的应力充分释放，增大振膜顺性。
如图1和图5所示，麦克风芯片1还包括密封件15，密封件15与背板13连接，位于背板13与振膜12之间，密封件15靠近内膜部121的外周设置，在工作状态时，内膜部121能够吸附于密封件15。背板13设置有出气孔131，出气孔131用于传导声音及平衡声压，出气孔131位于背板13被密封件15包围的区域内。
本实施例中，密封件15具有一定的高度，麦克风在未工作时，振膜12与背板13以及密封件15处于分离状态。麦克风在工作时，在偏压下，内膜部121受到静电力吸引吸附在密封件15上。通过将出气孔131设置在背板13被密封件15包围的区域以内，即，以密封件15为界，背板13从密封件15到背板13的边缘部之间完全不设置出气孔131，使内膜部121工作吸附在密封件15上时，内膜部121与背板13形成了一个密闭空间，阻断前腔111与内膜部121和背板13的连通，密封件15支撑内膜部121以达到工作状态，同时降低麦克风低衰的风险。
在一些实施例中，背板13被密封件15包围的区域外也可以设置有一定数量的泄气孔（图中未示出）。即，以密封件15为界，背板13从密封件15到背板13的边缘部之间可设置泄气孔，该范围内的泄气孔的数量可根据需求设置，以来调整麦克风低衰值。
如图2所示，支撑部123沿内膜部121的边缘向外延伸，并与固定部14连接。通过设置支撑部123来固定内膜部121，内膜部121处于悬臂状态，使振膜12的应力得到释放，增大振膜顺性。
其中，支撑部123设置为一个。即，振膜12可以单臂连接固定，进一步保证振膜12的应力得到释放，增大振膜顺性。或者，振膜12也可根据设置需求设置2个、3个等多个支撑部123，在此不作具体限定。
进一步地，如图3和图4所示，麦克风芯片1还包括电极片16，电极片16设置于背板13靠近振膜12的一侧，且电极片16位于密封件15内。因电极片16设置在密封件15的内侧，电极片16被密封件15堵截，无法引出。为此，本实施例在密封件15设置缺口151，电极片16包括相连接的电极本体161和引出部162，引出部162为一个或多个，使引出部162能够沿缺口151向外延伸，实现将电极片16沿缺口151向外引出。本实施例对于缺口151的数量不作具体限定，可以根据引出部数量的需求设置为1个、2个、3个等。
其中，如图4所示，沿麦克风芯片1的厚度方向，缺口151的高度可以等于密封件15的高度。或者，沿麦克风芯片1的厚度方向，缺口151的高度小于密封件15的高度，即缺口151的高度与电极片16的高度相配合即可。并且，缺口151靠近背板13设置，避免振膜12吸附在密封件15上时，因密封件15上的缺口151导致振膜12与密封件15之间出现缝隙。
又或者，如图5至图7所示，将电极片16设置于背板13远离振膜12的一侧，电极片16包括相连接的电极本体161与引出部162，引出部162沿电极本体161向外延伸，以实现将电极片16引出。
需要指出的是，本专利申请文件的一部分包含受著作权保护的内容。除了对专利局的专利文件或记录的专利文档内容制作副本以外，著作权人保留著作权。

Claims (10)

  1. 一种麦克风芯片，包括具有前腔的基底以及设置于所述基底上与所述基底相连的电容系统，所述电容系统包括位于所述基底上部的振膜以及与所述振膜间隔设置的背板，所述振膜与所述背板之间形成空气间隔，其特征在于，
    所述麦克风芯片包括固定部，所述振膜与所述背板通过所述固定部与所述基底连接；
    所述振膜包括内膜部、外膜部以及支撑部，所述内膜部与所述外膜部通过狭缝间隔，所述支撑部与所述固定部连接；
    所述麦克风芯片还包括密封件，所述密封件与所述背板连接，位于所述背板与所述振膜之间，所述密封件靠近所述内膜部的外周设置。
  2. 根据权利要求1所述的麦克风芯片，其特征在于，所述背板设置有出气孔，所述出气孔位于所述背板被所述密封件包围的区域内。
  3. 根据权利要求2所述的麦克风芯片，其特征在于，所述背板设置有泄气孔，所述泄气孔位于所述背板被所述密封件包围的区域外。
  4. 根据权利要求1所述的麦克风芯片，其特征在于，所述支撑部沿所述内膜部的边缘向外延伸，并与所述固定部连接。
  5. 根据权利要求4所述的麦克风芯片，其特征在于，所述支撑部设置为一个或多个。
  6. 根据权利要求1~5任一项所述的麦克风芯片，其特征在于，所述麦克风芯片还包括电极片，所述电极片包括电级本体和引出部，所述引出部为一个或多个。
  7. 根据权利要求6所述的麦克风芯片，其特征在于，所述电极片设置于所述背板靠近所述振膜的一侧，且所述电极本体位于所述密封件内；
    所述密封件设有一个或多个缺口，一个或多个所述引出部分别能够沿所述缺口向外延伸。
  8. 根据权利要求7所述的麦克风芯片，其特征在于，沿所述麦克风芯片的厚度方向，所述缺口的高度等于所述密封件的高度。
  9. 根据权利要求7所述的麦克风芯片，其特征在于，沿所述麦克风芯片的厚度方向，所述缺口的高度小于所述密封件的高度，且所述缺口靠近所述背板设置。
  10. 根据权利要求6所述的麦克风芯片，其特征在于，所述电极片设置于所述背板远离所述振膜的一侧；
    所述引出部沿所述电极本体向外延伸。
PCT/CN2022/119299 2022-08-25 2022-09-16 麦克风芯片 WO2024040649A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060280319A1 (en) * 2005-06-08 2006-12-14 General Mems Corporation Micromachined Capacitive Microphone
CN101841758A (zh) * 2010-03-08 2010-09-22 瑞声声学科技(深圳)有限公司 电容mems麦克风
CN107484051A (zh) * 2017-09-29 2017-12-15 瑞声声学科技(深圳)有限公司 Mems麦克风
CN207910959U (zh) * 2018-01-31 2018-09-25 瑞声声学科技(深圳)有限公司 麦克风
CN214177566U (zh) * 2020-12-30 2021-09-10 瑞声声学科技(深圳)有限公司 电容式麦克风
CN114885264A (zh) * 2022-07-11 2022-08-09 苏州敏芯微电子技术股份有限公司 一种麦克风组件及电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060280319A1 (en) * 2005-06-08 2006-12-14 General Mems Corporation Micromachined Capacitive Microphone
CN101841758A (zh) * 2010-03-08 2010-09-22 瑞声声学科技(深圳)有限公司 电容mems麦克风
CN107484051A (zh) * 2017-09-29 2017-12-15 瑞声声学科技(深圳)有限公司 Mems麦克风
CN207910959U (zh) * 2018-01-31 2018-09-25 瑞声声学科技(深圳)有限公司 麦克风
CN214177566U (zh) * 2020-12-30 2021-09-10 瑞声声学科技(深圳)有限公司 电容式麦克风
CN114885264A (zh) * 2022-07-11 2022-08-09 苏州敏芯微电子技术股份有限公司 一种麦克风组件及电子设备

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