WO2024038742A1 - トランス - Google Patents

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Publication number
WO2024038742A1
WO2024038742A1 PCT/JP2023/027327 JP2023027327W WO2024038742A1 WO 2024038742 A1 WO2024038742 A1 WO 2024038742A1 JP 2023027327 W JP2023027327 W JP 2023027327W WO 2024038742 A1 WO2024038742 A1 WO 2024038742A1
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WIPO (PCT)
Prior art keywords
coil
outer coil
transformer
wiring
conductor wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/027327
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English (en)
French (fr)
Japanese (ja)
Inventor
将信 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2024541474A priority Critical patent/JPWO2024038742A1/ja
Publication of WO2024038742A1 publication Critical patent/WO2024038742A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Definitions

  • the present disclosure relates to a transformer.
  • a transformer used to transmit signals and power includes a pair of coils arranged vertically to face each other (see, for example, Patent Document 1).
  • a transformer that is one aspect of the present disclosure includes a flat insulator, and an outer coil conductor wiring and an inner coil conductor wiring arranged in the insulator, and the outer coil conductor wiring has a first end and a first end. a first outer coil and a second outer coil each having two ends, a second end of the first outer coil and a second end of the second outer coil connected to each other; The second outer coil generates magnetic fluxes in opposite directions when a current flows from a first end of one outer coil to a first end of the other outer coil among the first outer coil and the second outer coil.
  • the inner coil conductor wiring includes a first inner coil and a second inner coil each having a first end and a second end, and in a plan view, the first inner coil is wound around the first outer coil.
  • the second inner coil is arranged inside the second outer coil so as not to overlap with the first outer coil, and the second inner coil is arranged inside the second outer coil so as not to overlap with the second outer coil.
  • FIG. 1 is a circuit diagram schematically showing the configuration of a signal transmission device including a transformer according to the first embodiment.
  • 2 is a schematic plan view schematically showing the signal transmission device of FIG. 1.
  • FIG. 3 is a schematic plan view of a transformer in the signal transmission device of FIG. 2.
  • FIG. 4 is a cross-sectional view taken along line F4-F4 in FIG.
  • FIG. 5 is a sectional view taken along the line F5-F5 in FIG.
  • FIG. 6 is an explanatory diagram of the operation in the transformer of the first embodiment.
  • FIG. 7 is a schematic cross-sectional view of a transformer of a comparative example.
  • FIG. 8 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 1 is a circuit diagram schematically showing the configuration of a signal transmission device including a transformer according to the first embodiment.
  • FIG. 3 is a schematic plan view of a transformer in the signal transmission device of FIG. 2.
  • FIG. 4 is a cross
  • FIG. 9 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 10 is a schematic perspective view showing outer coil conductor wiring in a modified example of the transformer shown in FIG.
  • FIG. 11 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 12 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 13 is a circuit diagram schematically showing the configuration of a modified signal transmission device.
  • FIG. 14 is a schematic plan view of the signal transmission device of FIG. 13.
  • FIG. 15 is a schematic plan view of a modified example of the transformer.
  • FIG. 16 is a schematic plan view of a modified example of the transformer.
  • FIG. 17 is a schematic plan view of a modified example of the transformer.
  • FIG. 18 is a circuit diagram schematically showing the configuration of a power transmission device including a transformer according to the second embodiment.
  • FIG. 19 is a schematic plan view schematically showing the power transmission device of FIG. 18.
  • FIG. 20 is a sectional view taken along the line F20-F20 in FIG. 19.
  • FIG. 21 is a sectional view taken along the line F21-F21 in FIG. 19.
  • FIG. 22 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 23 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 24 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 25 is a schematic cross-sectional view of a modified example of the transformer.
  • FIG. 20 is a sectional view taken along the line F20-F20 in FIG. 19.
  • FIG. 21 is a sectional view taken along the line F21-F21 in FIG. 19.
  • FIG. 22 is a schematic cross-sectional view of
  • FIG. 26 is a circuit diagram schematically showing the configuration of a power transmission device according to a modification.
  • FIG. 27 is a schematic plan view schematically showing the power transmission device of FIG. 26.
  • FIG. 28 is a circuit diagram schematically showing the configuration of a power transmission device according to a modification.
  • FIG. 29 is a circuit diagram schematically showing the configuration of a power transmission device according to a modification.
  • the expression “at least one” as used herein means “one or more” of the desired options.
  • the expression “at least one” as used herein means “only one option” or “both of the two options” if the number of options is two.
  • the expression “at least one” as used herein means “only one option” or “any combination of two or more options” if there are three or more options. means.
  • FIG. 1 is a circuit diagram schematically showing the configuration of a signal transmission device including a transformer according to the first embodiment.
  • 2 is a schematic plan view schematically showing the signal transmission device of FIG. 1.
  • FIG. The first embodiment is configured as a signal transmission device 10 including a transformer 15.
  • the signal transmission device 10 is a device that transmits a pulse signal while electrically insulating a primary terminal 11 and a secondary terminal 12.
  • Signal transmission device 10 is, for example, a digital isolator.
  • the signal transmission device 10 includes a primary circuit 13 electrically connected to a primary terminal 11, a secondary circuit 14 electrically connected to a secondary terminal 12, and a primary circuit 13.
  • a transformer 15 that electrically isolates the secondary circuit 14 is included.
  • the primary side circuit 13 is a circuit configured to operate when the first voltage V1 is applied.
  • the primary circuit 13 is electrically connected to, for example, an external control device (not shown).
  • the primary circuit 13 includes a transmitting circuit 13T.
  • the secondary side circuit 14 is a circuit configured to operate when a second voltage V2 different from the first voltage V1 is applied.
  • the second voltage V2 is higher than the first voltage V1, for example.
  • the first voltage V1 and the second voltage V2 are DC voltages.
  • the secondary circuit 14 is electrically connected to, for example, a drive circuit that is controlled by a control device.
  • An example of a drive circuit is a switching circuit.
  • the secondary circuit 14 includes a receiving circuit 14R. A ground for the primary circuit 13 and a ground for the secondary circuit 14 are provided independently.
  • the transformer 15 is connected between the transmitting circuit 13T and the receiving circuit 14R.
  • the transformer 15 includes a primary coil 16 and a secondary coil 17.
  • the secondary coil 17 includes a first coil 17A and a second coil 17B.
  • the first coil 17A and the second coil 17B are electrically connected to each other. Thereby, the first coil 17A and the second coil 17B of the secondary coil 17 are connected in series to the receiving circuit 14R.
  • a control signal from, for example, a control device is input to the transmission circuit 13T of the primary side circuit 13 through the primary side terminal 11.
  • the control signal is received by the receiving circuit 14R of the secondary circuit 14 from the transmitting circuit 13T of the primary circuit 13 via the transformer 15.
  • the signal transmitted to the secondary circuit 14 is output from the secondary circuit 14 to the drive circuit through the secondary terminal 12.
  • the primary side circuit 13 and the secondary side circuit 14 are electrically insulated by the transformer 15. More specifically, while the transformer 15 restricts the transmission of DC voltage between the primary circuit 13 and the secondary circuit 14, it allows the transmission of pulse signals.
  • the state where the primary side circuit 13 and the secondary side circuit 14 are insulated refers to the state where the transmission of DC voltage is cut off between the primary side circuit 13 and the secondary side circuit 14. This means that transmission of pulse signals from the primary circuit 13 to the secondary circuit 14 is permitted. In this way, the secondary circuit 14 is configured to receive the signal from the primary circuit 13.
  • the dielectric strength voltage of the signal transmission device 10 is, for example, 2500 Vrms or more and 7500 Vrms or less.
  • the dielectric strength voltage of the signal transmission device 10 of the first embodiment is approximately 5700 Vrms.
  • the specific numerical value of the dielectric strength voltage of the signal transmission device 10 is not limited to this and is arbitrary.
  • the signal transmission device 10 is a semiconductor device in which a plurality of semiconductor chips are packaged into one package.
  • the package format of the signal transmission device 10 is, for example, an SO (Small Outline) system, and in the first embodiment is an SOP (Small Outline Package). Note that the package format of the signal transmission device 10 can be changed arbitrarily.
  • the signal transmission device 10 includes a first chip 31, a second chip 32, and a transformer 40 as semiconductor chips.
  • the first chip 31 includes the primary side circuit 13 shown in FIG.
  • the second chip 32 includes the secondary side circuit 14 shown in FIG.
  • the transformer 40 includes the transformer 15 (the primary coil 16 and the secondary coil 17) shown in FIG.
  • the signal transmission device 10 includes a primary die pad 21 and a secondary die pad 22. Both the primary die pad 21 and the secondary die pad 22 are formed into a flat plate shape. Both the primary die pad 21 and the secondary die pad 22 are made of a conductive material.
  • each die pad 21, 22 is formed of a material containing Cu (copper). Note that each die pad 21, 22 may be formed of other metal materials such as Al (aluminum). Moreover, the material constituting each die pad 21, 22 is not limited to a conductive material.
  • each die pad 21, 22 may be made of ceramic such as alumina. That is, each die pad 21, 22 may be formed of a material having electrical insulation properties.
  • plan view means viewing from the z direction.
  • the first chip 31 and transformer 40 are mounted on the primary die pad 21.
  • the first chip 31 and the transformer 40 are bonded to the primary die pad 21 using bonding materials SD1 and SD2.
  • the bonding materials SD1 and SD2 are, for example, conductive bonding materials such as solder and Ag (silver) paste.
  • an insulating bonding material such as an epoxy resin may be used as the bonding materials SD1 and SD2.
  • the material of the bonding material SD1 of the first chip 31 and the material of the bonding material SD2 of the transformer 40 may be different from each other.
  • the second chip 32 is mounted on the secondary die pad 22.
  • the second chip 32 is bonded to the secondary die pad 22 by a bonding material SD3.
  • the bonding material SD3 is, for example, a conductive bonding material such as solder or Ag paste.
  • an insulating bonding material such as epoxy resin may be used as the bonding material SD3.
  • the signal transmission device 10 includes a plurality of primary leads 23 and a plurality of secondary leads 24.
  • FIG. 2 shows four primary leads 23A to 23D and four secondary leads 24A to 24D.
  • the primary leads 23A and 23D are connected to the primary die pad 21.
  • the primary leads 23B and 23C are connected to the first chip 31 by primary wires W11A and W11B.
  • the primary leads 23B and 23C are used for supplying operating voltage to the first chip 31, inputting signals, and the like.
  • the primary lead 23B or the primary lead 23C is used as the primary terminal 11 shown in FIG.
  • the first chip 31 is connected to the primary die pad 21 by a wire W12.
  • the number, shape, connection state, etc. of the primary leads 23 can be changed as appropriate.
  • Wires W11A, W11B, and W12 are bonding wires formed by a wire bonding device.
  • the wires W11A, W11B, and W12 are made of a conductor such as Au (gold), Al,
  • the secondary leads 24A and 24D are connected to the secondary die pad 22.
  • the secondary leads 24B and 24C are connected to the second chip 32 by secondary wires W17A and W17B.
  • the secondary leads 24B and 24C are used for supplying operating voltage to the second chip 32, outputting signals, and the like.
  • the secondary lead 24B or the secondary lead 24C is used as the secondary terminal 12 shown in FIG.
  • the second chip 32 is connected to the secondary die pad 22 by a wire W16.
  • the number, shape, connection state, etc. of the secondary leads 24 can be changed as appropriate.
  • Wires W16, W17A, and W17B are bonding wires formed by a wire bonding device.
  • the wires W16, W17A, and W17B are made of a conductor such as Au, Al, or Cu.
  • the first chip 31 is connected to the transformer 40 by wires W13A and W13B.
  • the transformer 40 is connected to the second chip 32 by wires W15A and W15B.
  • a wire W14 serving as a connecting member is connected to the transformer 40.
  • Wires W13A, W13B, W14, W15A, and W15B are bonding wires formed by a wire bonding device.
  • the wires W13A, W13B, W14, W15A, and W15B are made of a conductor such as Au, Al, or Cu.
  • the signal transmission device 10 further includes a sealing resin 27.
  • the sealing resin 27 seals a portion of each die pad 21, 22, each chip 31, 32, a transformer 40, and each lead 23, 24.
  • the sealing resin 27 is made of an electrically insulating material. A black epoxy resin is used as an example of such a material.
  • the sealing resin 27 is formed into a rectangular plate shape with the thickness direction in the z direction.
  • the transformer 40 is mounted on the primary die pad 21. That is, both the transformer 40 and the first chip 31 are mounted on the primary die pad 21.
  • the transformer 40 and the first chip 31 are arranged at a distance from each other in the x direction on the primary die pad 21. Therefore, it can be said that the first chip 31, the transformer 40, and the second chip 32 are arranged apart from each other in the x direction.
  • the first chip 31, the transformer 40, and the second chip 32 are arranged in this order. In other words, the transformer 40 is arranged between the first chip 31 and the second chip 32 in the x direction.
  • the distance between the primary die pad 21 and the secondary die pad 22 in the x direction is larger than the distance between the first chip 31 and the transformer 40 in the x direction. Therefore, the distance between the first chip 31 and the transformer 40 is smaller than the distance between the transformer 40 and the second chip 32 in the x direction. In other words, the transformer 40 is arranged closer to the first chip 31 than the second chip 32.
  • FIG. 3 is a schematic plan view of the transformer 40. 4 is a sectional view taken along the line F4-F4 in FIG. 3, and FIG. 5 is a sectional view taken along the line F5-F5 in FIG. In FIG. 3, the outer coil conductor wiring 60 and the inner coil conductor wiring 70 are shown in solid lines for easy understanding.
  • the transformer 40 is a transformer chip that includes an outer coil conductor wiring 60 and an inner coil conductor wiring 70.
  • the primary coil 16 shown in FIG. 1 includes an outer coil conductor wiring 60.
  • the secondary coil 17 shown in FIG. 1 includes an inner coil conductor wiring 70.
  • the secondary coil 17 includes a first coil 17A and a second coil 17B.
  • the inner coil conductor wiring 70 includes a first inner coil 71 that functions as the first coil 17A and a second inner coil 72 that functions as the second coil 17B.
  • the transformer 40 includes a chip main surface 41 and a chip back surface 42 facing opposite to the chip main surface 41. Furthermore, the transformer 40 includes four chip side surfaces 43, 44, 45, and 46 perpendicular to both the chip main surface 41 and the chip back surface 42.
  • the chip side surfaces 43 and 44 constitute both end surfaces of the transformer 40 in the x direction.
  • the chip side surfaces 45 and 46 constitute both end surfaces of the transformer 40 in the y direction.
  • the transformer 40 includes a substrate 51 and an insulator 52 disposed on the substrate 51.
  • the substrate 51 has a substrate main surface 51S and a substrate back surface 51R facing oppositely to each other in the z direction.
  • the substrate back surface 51R constitutes the chip back surface 42 of the transformer 40.
  • the substrate 51 is made of, for example, a semiconductor substrate.
  • the substrate 51 is a substrate formed from a material containing Si (silicon).
  • the substrate 51 may be made of a wide bandgap semiconductor or a compound semiconductor as a semiconductor substrate.
  • the substrate 51 may be an insulating substrate made of a material containing glass.
  • a wide band gap semiconductor is a semiconductor substrate having a band gap of 2.0 eV or more.
  • the wide bandgap semiconductor may be SiC (silicon carbide), GaN (gallium nitride), Ga 2 O 3 (gallium oxide), or the like.
  • the compound semiconductor may be a III-V compound semiconductor.
  • the compound semiconductor may include at least one of AlN (aluminum nitride), InN (indium nitride), GaN, and GaAs (gallium arsenide).
  • the insulator 52 is formed on the main substrate surface 51S of the substrate 51.
  • the insulator 52 is in contact with the substrate main surface 51S of the substrate 51.
  • Insulator 52 includes a plurality of insulating layers 53.
  • the insulator 52 includes a lowermost insulating layer 53D, an uppermost insulating layer 53U, and insulating layers 531 to 536 between the lowermost insulating layer 53D and the uppermost insulating layer 53U.
  • the insulating layers 53D, 531 to 536, and 53U are laminated in the z direction from the main substrate surface 51S of the substrate 51. Therefore, it can be said that the z direction is the thickness direction of the insulator 52. Further, the z direction can also be said to be the lamination direction of the plurality of insulating layers 53D, 531 to 536, and 53U included in the insulator 52.
  • the lowermost insulating layer 53D is in contact with the main substrate surface 51S of the substrate 51.
  • the upper surface of the uppermost insulating layer 53U constitutes a chip main surface 41 of the transformer 40.
  • the uppermost insulating layer 53U of the plurality of insulating layers 53D, 531 to 536, 53U will be referred to as the second insulating layer 53U, and the insulating layers 53D, 531 to 536 other than the second insulating layer 53U will be referred to as the second insulating layer 53U. They may be shown as first insulating layers 53D, 531-536.
  • the first insulating layers 53D, 531 to 536 are made of, for example, a material containing Si (silicon). As the material containing Si, SiO 2 (silicon oxide), SiN (silicon nitride), SiC, SiCN (nitrogen-doped silicon carbide), etc. can be used. Note that at least one of the first insulating layers 53D, 531 to 536 may be made of a different material. Furthermore, at least one of the first insulating layers 53D, 531 to 536 may be formed by laminating a plurality of films. The first insulating layers 53D, 531 to 536 may be composed of a thin film formed of a material containing SiN, SiC, SiCN, etc., and an interlayer insulating film formed of a material containing SiO 2 .
  • the second insulating layer 53U is made of, for example, a material containing resin having electrical insulation properties.
  • the second insulating layer 53U is formed of, for example, a passivation film including a nitride film and a resin film having electrical insulation properties.
  • the nitride film includes, for example, materials such as Si 3 N 4 , SiN, and SiCN.
  • the resin film includes, for example, polyimide (PI). Note that the second insulating layer 53U may be formed of a material containing Si, similar to the first insulating layers 53D and 531 to 536.
  • transformer 40 includes outer coil conductor wiring 60 and inner coil conductor wiring 70. As shown in FIGS. As shown in FIG. 4, the outer coil conductor wiring 60 and the inner coil conductor wiring 70 are embedded in the insulator 52.
  • the outer coil conductor wiring 60 includes a first outer coil 61 and a second outer coil 62.
  • the first outer coil 61 includes a first end 61A and a second end 61B opposite to the first end 61A.
  • the second outer coil 62 includes a first end 62A and a second end 62B opposite to the first end 62A.
  • the second end 61B of the first outer coil 61 and the second end 62B of the second outer coil 62 are electrically connected to each other.
  • the first outer coil 61 and the second outer coil 62 are each formed in a circular spiral shape in plan view.
  • the first outer coil 61 and the second outer coil 62 are connected to each other when a current flows from a first end of one of the first outer coil 61 and second outer coil 62 to a first end of the other outer coil. They are wound so that magnetic fluxes are generated in opposite directions.
  • the first outer coil 61 and the second outer coil 62 have a symmetrical shape, and are formed in a point symmetrical shape.
  • the first end 61A is arranged inside the spiral, and the second end 61B is arranged outside the spiral. That is, the first outer coil 61 is wound in a spiral shape with the first end 61A as the inner end and the second end 61B as the outer end.
  • the first end 62A is located inside the spiral, and the second end 62B is located outside the spiral.
  • the second outer coil 62 is wound in a spiral shape, with the first end 62A being the inner end and the second end 62B being the outer end.
  • the first outer coil 61 and the second outer coil 62 are electrically connected to each other at second ends 61B and 62B, which are the respective outer peripheral edge portions.
  • the outer coil conductor wiring 60 is provided on the uppermost first insulating layer 536.
  • the outer coil conductor wiring 60 is formed of a material containing one or more appropriately selected from Ti (titanium), TiN (titanium nitride), Au, Ag, Cu, Al, and W (tungsten). There is.
  • the outer coil conductor wiring 60 of the first embodiment is formed of a material containing Al.
  • the inner coil conductor wiring 70 includes a first inner coil 71 and a second inner coil 72.
  • the first inner coil 71 includes a first end 71A and a second end 71B opposite to the first end 71A.
  • the second inner coil 72 includes a first end 72A and a second end 72B opposite to the first end 71A.
  • the first inner coil 71 is arranged inside the first outer coil 61.
  • the first inner coil 71 is arranged so as not to overlap the first outer coil 61 in plan view.
  • the second inner coil 72 is arranged inside the second outer coil 62.
  • the second inner coil 72 is arranged so as not to overlap the second outer coil 62 in plan view.
  • the first inner coil 71 and the second inner coil 72 are each formed in a circular spiral shape in plan view.
  • the first inner coil 71 and the second inner coil 72 have a symmetrical shape, and are formed in a point symmetrical shape.
  • the first inner coil 71 In the spiral-shaped first inner coil 71, the first end 71A is arranged inside the spiral, and the second end 71B is arranged outside the spiral. That is, the first inner coil 71 is wound in a spiral shape with the first end 71A as the inner end and the second end 71B as the outer end. Similarly, in the spiral second inner coil 72, the first end 72A is located inside the spiral, and the second end 72B is located outside the spiral. In other words, the second inner coil 72 is wound in a spiral shape with the first end 72A as the inner end and the second end 72B as the outer end. Note that the first inner coil 71 and the second inner coil 72 may have first ends 71A, 72A as outer circumferential ends and second ends 71B, 72B as inner circumferential ends.
  • the first inner coil 71 and second inner coil 72 of the inner coil conductor wiring 70 are provided on the first insulating layer 536 as the uppermost layer.
  • the first inner coil 71 and the second inner coil 72 are formed of a material containing one or more appropriately selected from Ti, TiN, Au, Ag, Cu, Al, and W.
  • the inner coil conductor wiring 70 of the first embodiment is formed of a material containing Al.
  • the transformer 40 includes a first wiring section 80 and a second wiring section 90.
  • the first wiring section 80 and the second wiring section 90 are electrically connected to the outer coil conductor wiring 60.
  • the first wiring section 80 is electrically connected to the first end 61A of the first outer coil 61 of the outer coil conductor wiring 60.
  • the second wiring section 90 is electrically connected to the first end 62A of the second outer coil 62 of the outer coil conductor wiring 60.
  • the first wiring section 80 includes a connection wiring 81, vias 82 and 83, and a terminal section 84.
  • the first wiring section 80 is formed of a material containing one or more appropriately selected from Ti, TiN, Au, Ag, Cu, Al, and W.
  • the terminal portion 84 is arranged near the chip side surface 43.
  • the terminal portion 84 is arranged at the same position in the y direction as the first end 61A of the first outer coil 61 in plan view. Note that the arrangement position of the terminal portion 84 may be changed arbitrarily.
  • connection wiring 81 is arranged below the first outer coil 61.
  • the connection wiring 81 is provided in the first insulating layer 534 two layers below the first insulating layer 536 on which the first outer coil 61 is provided.
  • the connection wiring 81 is formed to extend toward the chip side surface 43 from the first end 81A connected to the first outer coil 61.
  • the connection wiring 81 extends from the first end 61A of the first outer coil 61 to the terminal portion 84 in plan view.
  • the first end 81A of the connection wiring 81 is electrically connected to the first end 61A of the first outer coil 61 via the via 82.
  • the second end 81B of the connection wiring 81 is electrically connected to the terminal portion 84 via the via 83.
  • the second wiring section 90 includes a connection wiring 91, vias 92 and 93, and a terminal section 94.
  • the second wiring section 90 is formed of a material containing one or more appropriately selected from Ti, TiN, Au, Ag, Cu, Al, and W.
  • the connection wiring 91, vias 92, 93, and terminal portion 94 of the second wiring portion 90 are arranged in the same manner as the connection wiring 81, vias 82, 83, and terminal portion 84 of the first wiring portion 80.
  • connection wiring 91 The first end 91A of the connection wiring 91 is electrically connected to the first end 62A of the second outer coil 62 through the via 92, and the second end 91B of the connection wiring 91 is electrically connected to the terminal portion 94 through the via 93. It is connected.
  • the second insulating layer 53U includes openings 53U1 and 53U2 that expose portions of the first wiring section 80 and the second wiring section 90, respectively.
  • the openings 53U1 and 53U2 are formed to expose the terminal parts 84 and 94 of the first wiring part 80 and the second wiring part 90.
  • Wires W13A and W13B are connected to the terminal portions 84 and 94 exposed through the openings 53U1 and 53U2.
  • the terminal portions 84 and 94 exposed through the openings 53U1 and 53U2 can be said to be connection pads that connect the wires W13A and W13B.
  • wires W13A and W13B are connected to the first chip 31. Therefore, the terminal portions 84 and 94 exposed through the openings 53U1 and 53U2 can also be called connection pads that connect the transformer 40 to the first chip 31.
  • the second insulating layer 53U includes a plurality of openings 53U3, 53U4, 53U5, and 53U6 that expose a portion of the inner coil conductor wiring 70.
  • the opening 53U3 is formed to expose the first end 71A of the first inner coil 71.
  • the opening 53U4 is formed to expose the second end 71B of the first inner coil 71.
  • the opening 53U5 is formed to expose the first end 72A of the second inner coil 72.
  • the opening 53U6 is formed to expose the second end 72B of the second inner coil 72.
  • the wire W15A is connected to the second end 71B of the first inner coil 71 exposed through the opening 53U4.
  • the first end W14A of the wire W14 is connected to the first end 71A of the first inner coil 71 exposed through the opening 53U3, and the second end W14B of the wire W14 is connected to the second inner coil 72 exposed through the opening 53U5. is connected to the first end 72A of.
  • a wire W15B is connected to the second end 72B of the second inner coil 72 exposed through the opening 53U6.
  • first ends 71A, 72A exposed through the openings 53U3, 53U5 and the second ends 71B, 72B exposed through the openings 53U4, 53U6 are connection pads that connect the wires W14, W15A, W15B.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 are electrically insulated from each other and configured to be magnetically coupled.
  • the transformer 40 of the first embodiment is configured such that the outer coil conductor wiring 60 and the inner coil conductor wiring 70 can be magnetically coupled along a plane parallel to the substrate main surface 51S of the substrate 51.
  • the first inner coil 71 of the inner coil conductor wiring 70 is arranged inside the first outer coil 61 of the outer coil conductor wiring 60. Therefore, a current flows in the first inner coil 71 in a direction that corresponds to the direction of the magnetic flux generated by the current flowing in the first outer coil 61.
  • the second inner coil 72 of the inner coil conductor wiring 70 is arranged inside the second outer coil 62 of the outer coil conductor wiring 60. Therefore, a current flows in the second inner coil 72 in a direction that corresponds to the direction of the magnetic flux generated by the current flowing in the second outer coil 62.
  • the wire W14 connects the first inner coil 71 and the second inner coil 72. Therefore, the wire W14 is connected so that the current flowing through the first inner coil 71 and the current flowing through the second inner coil 72 are taken out by the wires W15A and W15B.
  • the direction of the current is the same as the direction of the current generated in the second inner coil 72. connected like this.
  • a wire W15A is connected to the second end 71B of the first inner coil 71 exposed through the opening 53U4. Further, a wire W15B is connected to the second end 72B of the second inner coil 72 exposed through the opening 53U6. These wires W15A and W15B are connected to the second chip 32, as shown in FIG. Therefore, the second ends 71B and 72B exposed through the openings 53U4 and 53U6 can also be called connection pads that connect the transformer 40 to the second chip 32.
  • the outer coil conductor wiring 60 includes a first outer coil 61 and a second outer coil 62.
  • the first outer coil 61 and the second outer coil 62 are formed on the same first insulating layer 536 of the first insulating layers 53D, 531 to 536 stacked on the substrate 51. Therefore, the distance D61 from the substrate 51 to the first outer coil 61 is equal to the distance D62 from the substrate 51 to the second outer coil 62.
  • the inner coil conductor wiring 70 includes a first inner coil 71 and a second inner coil 72.
  • the first inner coil 71 and the second inner coil 72 are formed on the same first insulating layer 536 among the first insulating layers 53D, 531 to 536 stacked on the substrate 51. Therefore, the distance D71 from the substrate 51 to the first inner coil 71 is equal to the distance D72 from the substrate 51 to the second inner coil 72.
  • the first inner coil 71 and the second inner coil 72 are arranged at the same position as the first outer coil 61 and the second outer coil 62 in the z direction. Therefore, the distances D71 and D72 from the substrate 51 to the first inner coil 71 and the second inner coil 72 are equal to the distances D61 and D62 from the substrate 51 to the first outer coil 61 and the second outer coil 62.
  • Connection wires 81 and 91 of the first wiring portion 80 and the second wiring portion 90 connected to the outer coil conductor wiring 60 are arranged in the first insulating layer 534 under the outer coil conductor wiring 60. Therefore, the distance D80 from the board 51 to the connection wiring 81 is the distance D61, D62 from the board 51 to the first outer coil 61 and the second outer coil 62, and the distance D62 is from the board 51 to the first inner coil 71 and the second inner coil 72. is smaller than the distances D71 and D72. Further, the distance D90 from the substrate 51 to the connection wiring 91 is smaller than the distances D61, D62, D71, and D72.
  • the distance D80 is the shortest distance between the first outer coil 61 and the first inner coil 71 to the substrate 51 in the z direction.
  • the distance D90 is the shortest distance between the second outer coil 62 and the second inner coil 72 to the substrate 51 in the z direction.
  • the distances D11 and D12 between the first outer coil 61 and the first inner coil 71 are equal to each other.
  • the distances D11 and D12 are the first shortest distances between the first outer coil 61 and the first inner coil 71.
  • the distances D21 and D22 between the second outer coil 62 and the second inner coil 72 are equal to each other.
  • the distances D21 and D22 are the second shortest distances between the second outer coil 62 and the second inner coil 72.
  • the distances D11 and D12 between the first outer coil 61 and the first inner coil 71 and the distances D21 and D22 between the second outer coil 62 and the second inner coil 72 are equal to each other.
  • each distance D11, D12, D21, D22, D80, and D90 from the substrate 51 affects the dielectric strength voltage of the transformer 40.
  • the outer coil conductor wiring 60 (primary coil 16) is electrically connected to the first chip 31 including the primary circuit 13. ing. Both the first chip 31 and the transformer 40 are mounted on the primary die pad 21. Therefore, the common voltage of the substrate 51 of the transformer 40 and the primary circuit 13 of the first chip 31 is the same.
  • the outer coil conductor wiring 60 (first outer coil 61 and second outer coil 62) of the transformer 40 is connected to the first chip 31. Therefore, the common voltage of the outer coil conductor wiring 60 (the first outer coil 61 and the second outer coil 62) is the same as the common voltage of the primary circuit 13 of the first chip 31.
  • the dielectric strength of the transformer 40 is determined by the shortest distance between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 (the first shortest distance, the second shortest distance), and the distance between the outer coil conductor wiring 60 and the substrate 51. Determined by the shortest thickness between.
  • the shortest distance can be adjusted by the shapes of the outer coil conductor wiring 60 and the inner coil conductor wiring 70, that is, the layout design of the transformer 40. That is, the dielectric strength of the transformer 40 can be adjusted by designing the layout of the transformer 40. Therefore, the dielectric strength voltage of the transformer 40 can be easily changed.
  • transformer 40X as a comparative example with respect to the transformer 40 of the first embodiment will be described.
  • the same reference numerals are given to the same components as those of the transformer 40 of the first embodiment.
  • FIG. 7 shows a cross-sectional structure of a transformer 40X of a comparative example.
  • a primary coil 16X and a secondary coil 17X are arranged in an overlapping manner in the thickness direction of an insulator 52 on a substrate 51. That is, the transformer 40X of the comparative example includes a primary coil 16X and a secondary coil 17X that are arranged to be magnetically coupled in the thickness direction of the insulator 52.
  • the transformer 40X of the comparative example is mounted on the primary die pad 21 shown in FIG. In this case, the primary coil 16X is arranged closer to the substrate 51 than the secondary coil 17X.
  • a parasitic capacitor C1X is generated between the primary coil 16X and the substrate 51. This parasitic capacitor C1X has a capacitance value that corresponds to the distance D1X between the substrate 51 and the primary coil 16X and the opposing area between the substrate 51 and the primary coil 16X.
  • a parasitic capacitor C2X is generated between the primary coil 16X and the secondary coil 17X. This parasitic capacitor C2X has a capacitance value that corresponds to the distance D2X between the primary coil 16X and the secondary coil 17X and the opposing area between the primary coil 16X and the secondary coil 17X.
  • the wiring resistance value can be reduced by widening the wiring width of the primary coil 16X and the secondary coil 17X.
  • the wiring width is increased, the opposing area between the substrate 51 and the primary coil 16X increases, and the capacitance value of the parasitic capacitor C1X increases.
  • the opposing area between the primary coil 16X and the secondary coil 17X increases, and the capacitance value of the parasitic capacitor C2X increases.
  • Increasing the wiring thickness of the primary coil 16X and the secondary coil 17X affects the thickness of the insulating layer 53 that embeds the primary coil 16X and the secondary coil 17X, that is, the manufacturing process, and also affects the substrate. 51 and the primary coil 16X, and the distance between the primary coil 16X and the secondary coil 17X, that is, the dielectric strength voltage of the transformer 40 is affected. In order to obtain a dielectric strength voltage higher than a certain value, it is necessary to thicken the insulator 52, that is, increase the number of insulating layers constituting the insulator 52, which affects the manufacturing process of the transformer 40.
  • the transformer 40 of the first embodiment includes an outer coil conductor wiring 60, and the outer coil conductor wiring 60 includes both a first outer coil 61 and a second outer coil 62. .
  • the first outer coil 61 and the second outer coil 62 have second ends 61B and 62B electrically connected to each other.
  • the first outer coil 61 and the second outer coil 62 generate magnetic fluxes in opposite directions when current flows from the first end 61A of the first outer coil 61 to the first end 62A of the second outer coil 62. It is rolled up like this. For example, as shown in FIG. 6, an upward magnetic flux is generated in the first outer coil 61, and a downward magnetic flux is generated in the second outer coil 62.
  • the magnetic flux M1 generated by the outer coil conductor wiring 60 forms a smaller loop than the transformer 40X of the comparative example. Therefore, the magnetic flux crossing the inner coil conductor wiring 70 is larger than that of the comparative example transformer 40X. Therefore, the efficiency of magnetic coupling between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 can be improved. As a result, the transfer characteristics between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 of the transformer 40 can be improved.
  • the magnetic flux M1 generated by the outer coil conductor wiring 60 forms a smaller loop than the transformer 40X of the comparative example.
  • the magnetic flux generated in this manner passes through the substrate 51 along the main substrate surface 51S of the substrate 51. Therefore, eddy currents are less likely to occur in the substrate 51 compared to the transformer 40X of the comparative example. Therefore, in the transformer 40 of the first embodiment, loss with respect to the magnetic flux M1 can be reduced. In addition, the influence on the efficiency of magnetic coupling in the transformer 40 can be reduced. As a result, the transfer characteristics between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 of the transformer 40 can be improved.
  • the wiring resistance values of the outer coil conductor wiring 60 and the inner coil conductor wiring 70 affect the amount of current flowing through the outer coil conductor wiring 60 and the inner coil conductor wiring 70, respectively, and the degree of magnetic coupling.
  • the wiring resistance value of the outer coil conductor wiring 60 is obtained by widening the wiring width of the outer coil conductor wiring 60 and decreasing the aspect ratio of the wiring thickness to the wiring width.
  • the wiring resistance value of the inner coil conductor wiring 70 can be obtained by increasing the wiring width of the inner coil conductor wiring 70 and decreasing the aspect ratio of the wiring thickness to the wiring width.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 face each other in the x direction and the y direction. Therefore, even if the wiring width is increased, the opposing area between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 does not change. That is, the capacitance values of the parasitic capacitors C11, C12, C21, and C22 between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 do not change. That is, compared to the transformer 40X of the comparative example, the wiring resistance value can be reduced without increasing the capacitance values of the parasitic capacitors C11, C12, C21, and C22 between the coils.
  • the capacitance value of the parasitic capacitor C60 between the substrate 51 and the outer coil conductor wiring 60 depends on the distance from the substrate 51 to the outer coil conductor wiring 60, assuming that the wiring width is constant. As the distance increases, the capacitance value decreases.
  • the insulator 52 has the same thickness as the transformer 40X of the comparative example, in the transformer 40 of the first embodiment, the distances D61 and D62 from the substrate 51 to the outer coil conductor wiring 60, and the distances D61 and D62 from the substrate 51 to the inner coil conductor wiring 70.
  • the distances D71 and D72 are larger than those of the comparative example transformer 40X. Therefore, the capacitance values of parasitic capacitors C60 and C70 can be reduced. If the capacitance values of the parasitic capacitors C60 and C70 are the same as those of the transformer 40X of the comparative example, the insulator 52 can be made thinner, that is, the transformer 40 can be made thinner.
  • the transformer 40 of the first embodiment provides the following effects.
  • (1-1) The transformer 40 of the first embodiment includes an outer coil conductor wiring 60, and the outer coil conductor wiring 60 includes both a first outer coil 61 and a second outer coil 62.
  • the first outer coil 61 and the second outer coil 62 have second ends 61B and 62B electrically connected to each other.
  • the first outer coil 61 and the second outer coil 62 generate magnetic fluxes in opposite directions when current flows from the first end 61A of the first outer coil 61 to the first end 62A of the second outer coil 62. It is rolled up like this.
  • the magnetic flux M1 generated by the outer coil conductor wiring 60 forms a smaller loop than the transformer 40X of the comparative example.
  • the magnetic flux crossing the inner coil conductor wiring 70 is larger than that of the comparative example transformer 40X. Therefore, the efficiency of magnetic coupling between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 can be improved. As a result, the transfer characteristics between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 of the transformer 40 can be improved.
  • the magnetic flux M1 generated by the outer coil conductor wiring 60 forms a smaller loop than the transformer 40X of the comparative example.
  • the magnetic flux generated in this manner passes through the substrate 51 along the main substrate surface 51S of the substrate 51. Therefore, eddy currents are less likely to occur in the substrate 51 compared to the transformer 40X of the comparative example. Therefore, in the transformer 40 of the first embodiment, loss with respect to the magnetic flux M1 can be reduced. In addition, the influence on the efficiency of magnetic coupling in the transformer 40 can be reduced. As a result, the transfer characteristics between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 of the transformer 40 can be improved.
  • the wiring resistance values of the outer coil conductor wiring 60 and the inner coil conductor wiring 70 affect the amount of current flowing through the outer coil conductor wiring 60 and the inner coil conductor wiring 70, respectively, and the degree of magnetic coupling.
  • the wiring resistance value of the outer coil conductor wiring 60 is obtained by widening the wiring width of the outer coil conductor wiring 60 and decreasing the aspect ratio of the wiring thickness to the wiring width.
  • the wiring resistance value of the inner coil conductor wiring 70 can be obtained by increasing the wiring width of the inner coil conductor wiring 70 and decreasing the aspect ratio of the wiring thickness to the wiring width.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 face each other in the x direction and the y direction. Therefore, even if the wiring width is increased, the opposing area between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 does not change. That is, the capacitance values of the parasitic capacitors C11, C12, C21, and C22 between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 do not change. That is, compared to the transformer 40X of the comparative example, the wiring resistance value can be reduced without increasing the capacitance values of the parasitic capacitors C11, C12, C21, and C22 between the coils.
  • the capacitance value of the parasitic capacitor C60 between the substrate 51 and the outer coil conductor wiring 60 depends on the distance from the substrate 51 to the outer coil conductor wiring 60, assuming that the wiring width is constant. As the distance increases, the capacitance value decreases.
  • the insulator 52 has the same thickness as the transformer 40X of the comparative example, in the transformer 40 of the first embodiment, the distances D61 and D62 from the substrate 51 to the outer coil conductor wiring 60, and the distances D61 and D62 from the substrate 51 to the inner coil conductor wiring 70.
  • the distances D71 and D72 are larger than those of the comparative example transformer 40X. Therefore, the capacitance values of parasitic capacitors C60 and C70 can be reduced. If the capacitance values of the parasitic capacitors C60 and C70 are the same as those of the transformer 40X of the comparative example, the insulator 52 can be made thinner, that is, the transformer 40 can be made thinner.
  • each distance D11, D12, D21, D22, D80, and D90 from the substrate 51 affects the dielectric strength voltage of the transformer 40.
  • the outer coil conductor wiring 60 (primary coil 16) is electrically connected to the first chip 31 including the primary circuit 13. ing. Both the first chip 31 and the transformer 40 are mounted on the primary die pad 21. Therefore, the common voltage of the substrate 51 of the transformer 40 and the primary circuit 13 of the first chip 31 is the same.
  • the outer coil conductor wiring 60 (first outer coil 61 and second outer coil 62) of the transformer 40 is connected to the first chip 31. Therefore, the common voltage of the outer coil conductor wiring 60 (the first outer coil 61 and the second outer coil 62) is the same as the common voltage of the primary circuit 13 of the first chip 31.
  • the dielectric strength of the transformer 40 is determined by the shortest distance between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 (the first shortest distance, the second shortest distance), and the distance between the outer coil conductor wiring 60 and the substrate 51. Determined by the shortest thickness between.
  • the shortest distance can be adjusted by the shapes of the outer coil conductor wiring 60 and the inner coil conductor wiring 70, that is, the layout design of the transformer 40. That is, the dielectric strength of the transformer 40 can be adjusted by designing the layout of the transformer 40. Therefore, the dielectric strength voltage of the transformer 40 can be easily changed.
  • the signal of the primary circuit 13 is efficiently transmitted to the secondary circuit 14 (reception circuit 14R). be able to.
  • the first embodiment described above can be modified as follows, for example.
  • the first embodiment and each of the following modified examples can be combined with each other as long as no technical contradiction occurs.
  • the same parts as in the first embodiment are given the same reference numerals as in the first embodiment, and the explanation thereof will be omitted.
  • the outer coil conductor wiring 60 includes a first outer coil 61 and a second outer coil 62 formed on two first insulating layers 536 and 538.
  • the first outer coils 61 of the first insulating layers 536 and 538 are connected in parallel by vias 65 .
  • the second outer coils 62 of the first insulating layers 536, 538 are connected in parallel by vias 66.
  • the number of first insulating layers forming the first outer coil 61 and the second outer coil 62 can be three or more.
  • the inner coil conductor wiring 70 includes a first inner coil 71 and a second inner coil 72 formed on two first insulating layers 536 and 538.
  • the first inner coil 71 and the second inner coil 72 of the first insulating layers 536 and 538 are connected in parallel by a via 75.
  • the number of first insulating layers forming the first inner coil 71 and the second inner coil 72 can be three or more.
  • the outer coil conductor wiring 60 includes a first outer coil 61, a second outer coil 62, and a third outer coil 63 connected to the first outer coil 61. and a fourth outer coil 64 connected to the second outer coil 62.
  • the third outer coil 63 is arranged so as to overlap the first outer coil 61 when viewed from the z direction.
  • the third outer coil 63 includes coil portions 631 and 632 formed in two first insulating layers 536 and 538, respectively.
  • the coil portions 631 and 632 are connected in series between the first end 61A of the first outer coil 61 and the first wiring portion 80.
  • the fourth outer coil 64 is arranged so as to overlap the second outer coil 62 when viewed from the z direction.
  • the fourth outer coil 64 includes coil portions 641 and 642 formed in the two first insulating layers 536 and 538, respectively.
  • the coil portions 641 and 642 are connected in series between the first end 62A of the second outer coil 62 and the second wiring portion 90.
  • the third outer coil 63 and the first outer coil 61 are connected in series between the first wiring section 80 and the second outer coil 62. Further, a second outer coil 62 and a fourth outer coil 64 are connected in series between the first outer coil 61 and the second wiring section 90. Therefore, the number of turns of the outer coil conductor wiring 60 disposed outside each of the first inner coil 71 and the second inner coil 72 can be increased. Thereby, the amount of magnetic flux generated by the outer coil conductor wiring 60 can be increased.
  • the third outer coils 63 (631, 632) formed on the two first insulating layers 536, 538 may be connected in parallel.
  • the fourth outer coils 64 (641, 642) formed on the two first insulating layers 536, 538 may be connected in parallel.
  • the first outer coil 61 and the second outer coil 62 may be formed in a plurality of first insulating layers and connected in parallel, as shown in FIG. 8 .
  • the inner coil conductor wiring 70 (first inner coil 71 and second inner coil 72) is arranged in the first insulating layer 538.
  • the first insulating layer 53 on which the inner coil conductor wiring 70 is arranged can be arbitrarily changed.
  • the modified transformer 40C shown in FIG. 11 is different from the transformer 40B shown in FIG. It is arranged so as not to overlap with the coil portion 631 arranged on the first insulating layer 536 when viewed from the z direction.
  • the first outer coil 61 and the third outer coil 63 in this manner, the opposing area in the z direction is reduced, and the capacitance of the parasitic capacitor can be reduced.
  • the fourth outer coil 64 by arranging the coil portion 642 so as not to overlap the second outer coil 62 and the coil portion 641 in plan view, the opposing area in the z direction is reduced, and the parasitic capacitor is reduced. Capacity can be reduced.
  • the first insulating layer 535 is different from the first insulating layer 537.
  • the inner coil conductor wiring 70 By arranging the inner coil conductor wiring 70 in this manner, the opposing area between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 is reduced, and the capacitance of the parasitic capacitor can be reduced.
  • the first inner coil 71 and the second inner coil 72 of the inner coil conductor wiring 70 only need to be arranged in the first insulating layer 53 different from the first insulating layer 537 in which the outer coil conductor wiring 60 is arranged. For example, it may be placed on the first insulating layer 536.
  • FIG. 13 is a circuit diagram schematically showing the configuration of the signal transmission device 10A as a modified example.
  • FIG. 14 is a schematic plan view of the signal transmission device 10A of FIG. 13.
  • the signal transmission device 10A of this modification differs from the signal transmission device 10 of the first embodiment in the configuration of the receiving circuit 14RA of the secondary circuit 14A.
  • the connection between the transformer 40 and the second chip 32A is different.
  • a wire W18A is connected to the first end 71A (see FIG. 4) of the first inner coil 71 exposed through the opening 53U3.
  • a wire W18B is connected to the first end 72A (see FIG. 4) of the second inner coil 72 exposed through the opening 53U5.
  • These wires W18A and W18B are connected to the second chip 32A. Therefore, the first ends 71A and 72A exposed through the openings 53U3 and 53U5 can also be called connection pads that connect the transformer 40 to the second chip 32A.
  • the transformer 40 includes second chips 32 having different configurations, such as the second chip 32 including the receiving circuit 14R shown in FIG. 2 and the second chip 32A including the receiving circuit 14RA shown in FIG.
  • the signal of the first chip 31 can be transmitted to 32A.
  • one type of transformer 40 can be used for two types of signal transmission devices 10 and 10A with different configurations.
  • outer coil conductor wiring 60 and the inner coil conductor wiring 70 in plan view can be arbitrarily changed.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 may be formed in a rectangular shape.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 may be formed in a rectangular shape with corners rounded into arc shapes.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 may be formed in an elliptical shape.
  • FIG. 17 shows an elliptical shape that is longer in the x direction than in the y direction, it may also be an elliptical shape that is longer in the y direction than in the x direction.
  • the first outer coil 61 and the second outer coil 62 of the outer coil conductor wiring 60 may be provided on different insulating layers.
  • second outer coil 62 may be disposed on first insulating layer 536.
  • the second end 61B of the first outer coil 61 and the second end 62B of the second outer coil 62 are formed to overlap each other in plan view.
  • the second end 61B of the first outer coil 61 and the second end 62B of the second outer coil 62 are directly electrically connected.
  • the first inner coil 71 and the second inner coil 72 may be provided in different insulating layers.
  • the wires W13A and W13B may be configured to be directly connected to the outer coil conductor wiring 60 (the first outer coil 61 and the second outer coil 62).
  • the distance between the first end 61A of the first outer coil 61 of the outer coil conductor wiring 60 and the inner coil conductor wiring 70 (first inner coil 71) is greater than or equal to the distance required for the withstand voltage of the transformer 40.
  • the wire W13A can be connected to the first end 61A of the first outer coil 61.
  • the second outer coil 62 and the wire W13B are the wire W13B.
  • FIG. 18 is a circuit diagram schematically showing the configuration of a power transmission device including a transformer according to the second embodiment.
  • FIG. 19 is a schematic plan view schematically showing the power transmission device of FIG. 18.
  • the second embodiment is configured as a power transmission device 100 including a transformer 101.
  • the transformer 101 of the second embodiment is configured as a printed wiring board (PCB).
  • power transmission device 100 is a device that transmits power from AC power source 111 to load 112 while electrically insulating between AC power source 111 and load 112.
  • Power transmission device 100 includes a transformer 101, diodes 102, 103, 104, 105, and a smoothing capacitor 106.
  • AC power supply 111 is connected to primary terminal 101A of transformer 101.
  • the diodes 102 to 104 are connected to the secondary terminal 101B of the transformer 101, and are connected to rectify the AC power transmitted by the transformer 101.
  • the transformer 101 of the second embodiment includes a primary coil 121 and a secondary coil 122.
  • the secondary coil 122 includes a first coil 122A and a second coil 122B, similar to the transformer 40 of the first embodiment.
  • the secondary coil 17 of the first embodiment is shown as two coils as shown in FIG. 2 .
  • the secondary coil 122 of the second embodiment is shown as one coil, as shown in FIG.
  • FIG. 19 is a schematic plan view schematically showing the power transmission device 100.
  • FIG. 20 is a sectional view taken along the line F20-F20 in FIG. 19.
  • FIG. 21 is a sectional view taken along the line F21-F21 in FIG. 19.
  • the transformer 130 includes an insulator 140, an outer coil conductor wiring 60, and an inner coil conductor wiring 70.
  • the insulator 140 is formed into a flat plate shape.
  • the insulator 140 includes a substrate main surface 141 and a substrate back surface 142 facing opposite to the substrate main surface 141.
  • the insulator 140 includes four substrate side surfaces 143, 144, 145, and 146 that are perpendicular to both the substrate main surface 141 and the substrate back surface 142.
  • the direction in which the main surface 141 of the substrate faces is defined as the z direction, and the two directions perpendicular to the z direction and mutually orthogonal are defined as the x direction and the y direction.
  • the substrate side surfaces 143 and 144 constitute both end surfaces in the x direction.
  • the substrate side surfaces 145 and 146 constitute both end surfaces in the y direction.
  • the insulator 140 is made of an electrically insulating material.
  • this material for example, a synthetic resin based on epoxy resin or the like can be used. Further, the material may contain a filler such as glass.
  • the insulator 140 of the second embodiment is made of glass epoxy resin.
  • the insulator 140 of the second embodiment is a resin substrate having insulation properties.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 are embedded in the insulator 140.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 are arranged at the center of the insulator 140 in the z direction.
  • the outer coil conductor wiring 60 and the inner coil conductor wiring 70 are formed of a material containing Cu. That is, the transformer 130 of the second embodiment is configured as a printed wiring board (PCB).
  • the outer coil conductor wiring 60 includes a first outer coil 61 and a second outer coil 62.
  • the first outer coil 61 includes a first end 61A and a second end 61B opposite to the first end 61A.
  • the second outer coil 62 includes a first end 62A and a second end 62B opposite to the first end 62A.
  • the second end 61B of the first outer coil 61 is electrically connected to the second end 62B of the second outer coil 62.
  • the first outer coil 61 and the second outer coil 62 are each formed in a rectangular spiral shape in plan view.
  • the first outer coil 61 and the second outer coil 62 are connected to each other when a current flows from a first end of one of the first outer coil 61 and second outer coil 62 to a first end of the other outer coil. They are wound so that magnetic fluxes are generated in opposite directions.
  • the first outer coil 61 and the second outer coil 62 have a symmetrical shape, and are formed in a point symmetrical shape.
  • the first end 61A is arranged inside the spiral, and the second end 61B is arranged outside the spiral. That is, the first outer coil 61 is wound in a spiral shape with the first end 61A as the inner end and the second end 61B as the outer end.
  • the first end 62A is located inside the spiral, and the second end 62B is located outside the spiral.
  • the second outer coil 62 is wound in a spiral shape, with the first end 62A being the inner end and the second end 62B being the outer end.
  • the first outer coil 61 and the second outer coil 62 are electrically connected to each other at second ends 61B and 62B, which are the respective outer peripheral edge portions.
  • the inner coil conductor wiring 70 includes a first inner coil 71 and a second inner coil 72.
  • the first inner coil 71 includes a first end 71A and a second end 71B opposite to the first end 71A.
  • the second inner coil 72 includes a first end 72A and a second end 72B opposite to the first end 72A.
  • the first inner coil 71 is arranged inside the first outer coil 61 in plan view.
  • the first inner coil 71 is arranged so as not to overlap the first outer coil 61 in plan view.
  • the second inner coil 72 is arranged inside the second outer coil 62 in plan view.
  • the second inner coil 72 is arranged so as not to overlap the second outer coil 62 in plan view.
  • the first inner coil 71 and the second inner coil 72 are each formed in a rectangular spiral shape in plan view.
  • the first inner coil 71 and the second inner coil 72 are arranged so that when a current flows from the first end of one of the first inner coil 71 and the second inner coil 72 to the first end of the other inner coil, They are wound so that magnetic fluxes are generated in opposite directions.
  • the first inner coil 71 and the second inner coil 72 have a symmetrical shape, and are formed in a point symmetrical shape.
  • the first end 71A is arranged inside the spiral, and the second end 71B is arranged outside the spiral. That is, the first inner coil 71 is wound in a spiral shape with the first end 71A as the inner end and the second end 71B as the outer end.
  • the first end 72A is located inside the spiral, and the second end 72B is located outside the spiral.
  • the second inner coil 72 is wound in a spiral shape with the first end 72A as the inner end and the second end 72B as the outer end.
  • the transformer 130 includes a first primary wiring 180 and a second primary wiring 190.
  • the primary side first wiring 180 and the primary side second wiring 190 are electrically connected to the outer coil conductor wiring 60.
  • the primary side first wiring 180 is electrically connected to the first end 61A of the first outer coil 61 of the outer coil conductor wiring 60.
  • the primary side second wiring 190 is electrically connected to the first end 62A of the second outer coil 62 of the outer coil conductor wiring 60.
  • the primary side first wiring 180 includes a connection wiring 181, a terminal portion 182, and through wirings 183 and 184.
  • the primary side first wiring 180 is formed of a material containing Cu.
  • the connection wiring 181 is provided on the back surface 142 of the substrate.
  • the connection wiring 181 is in contact with the back surface 142 of the substrate.
  • the connection wiring 181 extends from the first end 61A of the first outer coil 61 in the x direction.
  • the connection wiring 181 includes a first end 181A and a second end 181B opposite to the first end 181A.
  • the first end 181A of the connection wiring 181 overlaps the first end 61A of the first outer coil 61 in plan view. As shown in FIG.
  • the through wiring 183 electrically connects the first end 61A of the first outer coil 61 and the first end 181A of the connection wiring 181.
  • the through wiring 184 penetrates the insulator 140 from the main surface 141 of the substrate to the back surface 142 of the substrate.
  • the through wiring 184 is connected to the second end 181B of the connection wiring 181.
  • the through wirings 183 and 184 are formed as vias or through holes.
  • the terminal portion 182 is provided on the main surface 141 of the substrate and is electrically connected to the through wiring 184.
  • the terminal portion 182 extends from the through wiring 184 toward the substrate side surface 143.
  • the primary side second wiring 190 includes a connection wiring 191, a terminal portion 192, and through wirings 193 and 194.
  • the primary-side second wiring 190 is formed of a material containing Cu.
  • the connection wiring 191 is provided on the back surface 142 of the substrate.
  • the connection wiring 191 is in contact with the back surface 142 of the substrate.
  • the connection wiring 191 extends from the first end 62A of the second outer coil 62 in the x direction.
  • the connection wiring 191 includes a first end 191A and a second end 191B opposite to the first end 191A.
  • the first end 191A of the connection wiring 191 overlaps the first end 62A of the second outer coil 62 in plan view.
  • the through wiring 193 electrically connects the first end 62A of the second outer coil 62 and the first end 191A of the connection wiring 191.
  • the through wiring 194 penetrates the insulator 140 from the main surface 141 of the substrate to the back surface 142 of the substrate.
  • the through wiring 194 is connected to the second end 191B of the connection wiring 191.
  • the through wirings 193 and 194 are formed as vias or through holes.
  • the terminal portion 192 is provided on the main surface 141 of the substrate and is electrically connected to the through wiring 194 .
  • the terminal portion 192 extends from the through wiring 194 toward the substrate side surface 143.
  • the terminal portions 182 and 192 are connected to the AC power source 111. That is, the terminal portions 182 and 192 are provided as connection terminals (external connection pads) for connecting the AC power source 111 to the transformer 130. Note that the AC power source 111 can also be connected to the connection wirings 181 and 191 on the back surface 142 of the substrate. In this case, a portion of each of the connection wires 181 and 191 is provided as a connection terminal (external connection pad).
  • the transformer 130 includes a connecting member 200.
  • the connection member 200 is a conductive wiring and includes a wiring part 201 and through wirings 202 and 203.
  • the connecting member 200 is made of a material containing Cu.
  • the wiring section 201 is provided on the main surface 141 of the substrate.
  • the wiring portion 201 is in contact with the main surface 141 of the substrate.
  • the wiring section 201 includes a first end 201A and a second end 201B opposite to the first end 201A.
  • the first end 201A of the wiring portion 201 overlaps the first end 71A of the first inner coil 71 in plan view.
  • the second end 201B of the wiring portion 201 overlaps the first end 72A of the second inner coil 72 in plan view.
  • the through wiring 202 electrically connects the first end 71A of the first inner coil 71 and the first end 201A of the wiring section 201.
  • the through wiring 203 electrically connects the first end 72A of the second inner coil 72 and the second end 201B of the wiring portion 201.
  • the transformer 130 includes a first secondary wiring 210 and a second secondary wiring 220.
  • the first secondary wiring 210 and the second secondary wiring 220 are electrically connected to the inner coil conductor wiring 70.
  • the secondary first wiring 210 is electrically connected to the second end 71B of the first inner coil 71 of the inner coil conductor wiring 70.
  • the secondary side second wiring 220 is electrically connected to the second end 72B of the second inner coil 72 of the inner coil conductor wiring 70.
  • the secondary side first wiring 210 includes a connection wiring 211 and a through wiring 212.
  • the secondary side first wiring 210 is formed of a material containing Cu.
  • the connection wiring 211 is provided on the main surface 141 of the substrate.
  • the connection wiring 211 is in contact with the main surface 141 of the substrate.
  • the connection wiring 211 includes a first portion 211C extending in the x direction from the second end 71B of the first inner coil 71, and a second portion 211D extending in the y direction from the tip of the first portion 211C.
  • the connection wiring 211 includes a first end 211A and a second end 211B opposite to the first end 211A.
  • connection wiring 211 overlaps the second end 71B of the first inner coil 71 in plan view.
  • the through wiring 212 electrically connects the second end 71B of the first inner coil 71 and the first end 211A of the connection wiring 211.
  • the secondary side second wiring 220 includes a connection wiring 221 and a through wiring 222.
  • the secondary side second wiring 220 is formed of a material containing Cu.
  • the connection wiring 221 is provided on the main surface 141 of the substrate.
  • the connection wiring 221 is in contact with the main surface 141 of the substrate.
  • the connection wiring 221 includes a first portion 221C extending in the x direction from the second end 72B of the second inner coil 72, and a second portion 221D extending in the y direction from the tip of the first portion 221C.
  • the connection wiring 221 includes a first end 221A and a second end 221B opposite to the first end 221A.
  • the first end 221A of the connection wiring 221 overlaps the second end 72B of the second inner coil 72 in plan view.
  • the through wiring 222 electrically connects the second end 72B of the second inner coil 72 and the second end 221B of the connection wiring 221.
  • diodes 102 to 105 are connected between the second end 211B of the connection wiring 211 and the second end 221B of the connection wiring 221.
  • the four diodes 102 to 105 constitute a full-wave rectifier circuit on the secondary side of the transformer 130. That is, the second ends 211B and 221B of the connection wirings 211 and 221 are provided as connection terminals (external connection pads) that connect the diodes 102 to 105 to the transformer 130.
  • the power transmission device 100 including the transformer 130 of the second embodiment is, for example, attached to a metal base plate or housed in a metal casing. Similar to the comparative example transformer 40X shown in FIG. 7, in a transformer in which the primary coil and secondary coil are arranged in the thickness direction of the insulator, the base plate Since eddy currents occur in the transformer and the housing, losses occur in the magnetic flux of the transformer. On the other hand, in the transformer 130 of the second embodiment, magnetic flux similar to that of the transformer 40 of the first embodiment is generated, so that eddy currents are less likely to occur in the base plate or the casing. Therefore, in the transformer 130 of the second embodiment, loss with respect to magnetic flux can be reduced. In addition, the influence on the efficiency of magnetic coupling in the transformer 130 can be reduced. As a result, the transfer characteristics between the outer coil conductor wiring 60 and the inner coil conductor wiring 70 of the transformer 130 can be improved.
  • the transformer 130 of the second embodiment provides the following effects.
  • (2-1) The transformer 130 of the second embodiment provides effects similar to the effects (1-1) to (1-6) of the transformer 40 of the first embodiment.
  • the outer coil conductor wiring 60 includes two first outer coils 61 and a second outer coil 62 arranged in the thickness direction (z direction) of the insulator 140. .
  • the two first outer coils 61 are connected in parallel to each other by vias 65.
  • the two second outer coils 62 are connected in parallel to each other by vias 66.
  • three or more first outer coils 61 and three or more second outer coils 62 may be arranged in the thickness direction (z direction) of the insulator 140. With this configuration, the wiring resistance value of the outer coil conductor wiring 60 can be reduced.
  • the inner coil conductor wiring 70 includes three first inner coils 71 and three second inner coils 72 arranged in the thickness direction (z direction) of the insulator 140.
  • the three first inner coils 71 and the second inner coils 72 are connected in parallel by vias 75. Note that two or more of the first inner coils 71 and the second inner coils 72 may be arranged in the thickness direction (z direction) of the insulator 140. With this configuration, the wiring resistance value of the inner coil conductor wiring 70 can be reduced.
  • the outer coil conductor wiring 60 connects the first outer coil 61, the second outer coil 62, the third outer coil 63 connected to the first outer coil 61, and and a fourth outer coil 64 connected to the second outer coil 62 .
  • the third outer coil 63 is arranged so as to overlap the first outer coil 61 when viewed from the z direction.
  • the third outer coil 63 includes two coil portions 631 and 632 arranged in the z direction.
  • the coil portions 631 and 632 are connected in series between the first end 61A of the first outer coil 61 and the primary-side first wiring 180.
  • the fourth outer coil 64 is arranged so as to overlap the second outer coil 62 when viewed from the z direction.
  • the fourth outer coil 64 includes two coil portions 641 and 642 arranged in the z direction.
  • the coil portions 641 and 642 are connected in series between the first end 62A of the second outer coil 62 and the primary-side second wiring 190.
  • the third outer coil 63 and the first outer coil 61 are connected in series between the primary side first wiring 180 and the second outer coil 62. Further, a second outer coil 62 and a fourth outer coil 64 are connected in series between the first outer coil 61 and the primary-side second wiring 190. Therefore, the number of turns of the outer coil conductor wiring 60 disposed outside each of the first inner coil 71 and the second inner coil 72 can be increased. Thereby, the amount of magnetic flux generated by the outer coil conductor wiring 60 can be increased.
  • the two coil portions 631 and 632 arranged in the z direction may be connected in parallel.
  • two coil portions 641, 642 arranged in the z direction may be connected in parallel.
  • the first outer coil 61 and the second outer coil 62 may be formed in a plurality of first insulating layers and connected in parallel, as shown in FIG. 8 .
  • the modified transformer 130C shown in FIG. 24 differs from the transformer 130B shown in FIG.
  • the coil portion 632 is arranged so as not to overlap when viewed from the z direction with respect to the coil portion 632 arranged closer to the coil portion 142.
  • the coil portion 641 located at the center of the insulator 140 in the z direction is arranged so as not to overlap the second outer coil 62 and the coil portion 642 located closer to the back surface 142 of the substrate when viewed from the z direction. It is located in By arranging the first outer coil 61 and the third outer coil 63 and the second outer coil 62 and the fourth outer coil 64 in this way, the opposing area in the z direction is reduced, and the capacitance of the parasitic capacitor is reduced. be able to.
  • the outer coil conductor wiring 60 is arranged closer to the substrate main surface 141 with respect to the inner coil conductor wiring 70 in the z direction. Further, the inner coil conductor wiring 70 is arranged closer to the substrate back surface 142 with respect to the outer coil conductor wiring 60 in the z direction.
  • FIG. 26 is a circuit diagram schematically showing the configuration of the power transmission device 100A as a modified example.
  • FIG. 27 is a schematic plan view of the power transmission device 100A of FIG. 26.
  • the neutral point of the secondary coil 122 (the connection point between the first coil 122A and the second coil 122B) has a load 112 ground.
  • the power transmission device 100A of this modification includes a first connection member 231 that connects the first inner coil 71 and the second inner coil 72 to each other, and a first end connected to the first connection member 231.
  • 232A is connected thereto, and includes a second connecting member 232 extending in the x direction.
  • the load 112 and the smoothing capacitor 106 are connected to the second end 232B of the second connection member 232.
  • the first connection member 231 and the second connection member 232 serve as a neutral point that connects the connection point between the first inner coil 71 and the second inner coil 72 to the load 112.
  • connection wiring 211 of the secondary side first wiring 210 and the connection wiring 221 of the secondary side second wiring 220 include only a portion extending in the x direction.
  • the anode of the diode 105 is connected to the second end 211B of the connection wiring 211 of the secondary side first wiring 210, and the anode of the diode 103 is connected to the second end 221B of the connection wiring 221 of the secondary side second wiring 220. Connected.
  • the transformer 130E includes a load connection wiring 240 arranged on the main surface 141 of the substrate.
  • the load connection wiring 240 is connected to the cathodes of the diodes 103 and 105, and is also connected to the load 112 and the smoothing capacitor 106.
  • FIG. 28 is a circuit diagram showing an example of the configuration of a power transmission device 300 according to a modification.
  • This power transmission device 300 includes a control circuit 301, an oscillator 302, a transformer 15 (40), diodes 303, 304, 305, 306, and a smoothing capacitor 307.
  • the control circuit 301, the oscillator 302, the transformer 15 (40), the diodes 303 to 306, and the smoothing capacitor 307 are sealed with the sealing resin 27 similarly to the signal transmission device 10 of the first embodiment.
  • a DC power supply 311 is connected to the control circuit 301.
  • Oscillator 302 is controlled by control circuit 301 and outputs an AC signal.
  • This AC signal is transmitted by transformer 40.
  • a DC voltage is supplied to the load 312 by diodes 303 to 306 and a smoothing capacitor 307. That is, this power transmission device 300 works as a DC voltage conversion circuit (DC-DC converter) that converts the voltage of the DC power supply 311 into the operating voltage of the load 312.
  • DC-DC converter DC voltage conversion circuit
  • FIG. 29 is a circuit diagram showing an example of the configuration of a power transmission device 320 according to a modification.
  • This power transmission device 320 includes a control circuit 301, an oscillator 302, a transformer 40, diodes 304 and 306, and a smoothing capacitor 307.
  • a neutral point between the first coil 17A and the second coil 17B that constitute the secondary coil 17 of the transformer 40 is electrically connected to the secondary terminal 322B.
  • a load 312 is connected to the secondary terminals 322A and 322B.
  • This power transmission device 320 works as a direct current voltage conversion circuit (DC-DC converter) that converts the voltage of the direct current power supply 311 into the operating voltage of the load 312.
  • DC-DC converter direct current voltage conversion circuit
  • the term “on” includes both “on” and “above” unless the context clearly indicates otherwise.
  • the phrase “the first layer is formed on the second layer” refers to the fact that in some embodiments the first layer may be directly disposed on the second layer in contact with the second layer, but in other embodiments. It is contemplated that the first layer may be placed above the second layer without contacting the second layer. That is, the term “on” does not exclude structures in which other layers are formed between the first layer and the second layer.
  • the z direction used in this disclosure does not necessarily have to be the vertical direction, nor does it need to completely coincide with the vertical direction. Accordingly, various structures according to the present disclosure (e.g., the structure shown in FIG. 4) are different from each other in that "upper” and “lower” in the Z-axis direction described herein are “upper” and “lower” in the vertical direction. Not limited to one thing.
  • the x direction may be a vertical direction, or the y direction may be a vertical direction.
  • the outer coil conductor wiring (60) includes a first outer coil (61) and a second outer coil (62) each having a first end (61A, 62A) and a second end (61B, 62B), A second end (61B) of the first outer coil (61) and a second end (62B) of the second outer coil (62) are connected to each other.
  • the outer coil (62) generates magnetic fluxes in opposite directions when a current flows from a first end of one of the first outer coil and the second outer coil to a first end of the other outer coil.
  • the inner coil conductor wiring (70) includes a first inner coil (71) and a second inner coil (72) each having a first end (71A, 72A) and a second end (71B, 72B),
  • first inner coil (71) is arranged inside the first outer coil (61) so as not to overlap with the first outer coil (61)
  • the second inner coil (72) is arranged inside the first outer coil (61) so as not to overlap with the first outer coil (61).
  • a plurality of the first outer coils (61) and a plurality of the second outer coils (62) are provided in the thickness direction (z) of the insulator (52), and the plurality of first outer coils (61) are mutually The transformer according to appendix 1 or 2, wherein the plurality of second outer coils (62) are connected to each other.
  • the outer coil conductor wiring (60) is connected to a third outer coil (63) connected to a first end of the first outer coil (61) and a first end of the second outer coil (62). a fourth outer coil (64);
  • the transformer according to any one of Supplementary Notes 1 to 3, comprising:
  • the third outer coil (63) is arranged so as to overlap the first outer coil (61) when viewed from the thickness direction (z) of the insulator (52),
  • the fourth outer coil (64) is arranged to overlap the second outer coil (62) when viewed from the thickness direction (z) of the insulator (52).
  • a plurality of the third outer coils (63) and the fourth outer coils (64) are each provided in the thickness direction (z) of the insulator (52), and the plurality of third outer coils (63) The transformer according to appendix 4 or 5, wherein the plurality of fourth outer coils (64) are connected to each other.
  • the first inner coil (71) and the second inner coil (72) are formed in a spiral shape when viewed from the thickness direction (z) of the insulator (52).
  • a plurality of the first inner coils (71) and the second inner coils (72) are each provided in the thickness direction (z) of the insulator (52), and the plurality of first inner coils (71) The transformer according to any one of appendices 1 to 7, wherein the plurality of second inner coils (72) are connected to each other.
  • the inner coil conductor wiring includes a third inner coil connected to a second end of the first inner coil (71) and a fourth inner coil connected to a second end of the second inner coil (72). , the transformer according to any one of Supplementary Notes 1 to 8.
  • the third inner coil is arranged so as to overlap the first inner coil (71) when viewed from the thickness direction (z) of the insulator (52),
  • the fourth inner coil is arranged to overlap the second inner coil (72) when viewed from the thickness direction (z) of the insulator (52).
  • a plurality of the third inner coils and a plurality of the fourth inner coils are provided in the thickness direction (z) of the insulator (52), the plurality of third inner coils are connected to each other, and the plurality of the fourth inner coils are connected to each other.
  • the insulator (52) has an upper surface and a lower surface facing opposite to the upper surface in the thickness direction (z) of the insulator (52),
  • the transformer according to any one of Supplementary Notes 1 to 11, wherein both the outer coil conductor wiring and the inner coil conductor wiring are arranged closer to the upper surface of the insulator (52).
  • the first outer coil (61) and the second outer coil (62) are connected to at least one of the first inner coil (71) and the second inner coil (72) and the insulator (52).
  • the transformer according to any one of Supplementary Notes 1 to 12, which is located at the same position in the thickness direction (z) and arranged on the same plane perpendicular to the thickness direction (z).
  • the first outer coil (61) and the second outer coil (62) are connected to the insulator (52) with respect to at least one of the first inner coil (71) and the second inner coil (72). ) are arranged at different positions in the thickness direction (z) of the transformer according to any one of Supplementary Notes 1 to 12.
  • Appendix 18 The transformer according to any one of appendices 1 to 17, including a connecting member that connects the second end of the first inner coil (71) and the second end of the second inner coil (72).

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159953A (ja) * 2010-01-05 2011-08-18 Fujitsu Ltd 電子回路及び電子機器
US20130278372A1 (en) * 2012-04-20 2013-10-24 Infineon Technologies Austria Ag Semiconductor Component with Coreless Transformer
JP2014022484A (ja) * 2012-07-17 2014-02-03 Nippon Telegr & Teleph Corp <Ntt> ソレノイドインダクタ
WO2014097425A1 (ja) * 2012-12-19 2014-06-26 ルネサスエレクトロニクス株式会社 半導体装置
US20200402698A1 (en) * 2019-06-24 2020-12-24 Nxp B.V. High Current Integrated Circuit-Based Transformer
JP2020205342A (ja) * 2019-06-17 2020-12-24 ローム株式会社 チップ部品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159953A (ja) * 2010-01-05 2011-08-18 Fujitsu Ltd 電子回路及び電子機器
US20130278372A1 (en) * 2012-04-20 2013-10-24 Infineon Technologies Austria Ag Semiconductor Component with Coreless Transformer
JP2014022484A (ja) * 2012-07-17 2014-02-03 Nippon Telegr & Teleph Corp <Ntt> ソレノイドインダクタ
WO2014097425A1 (ja) * 2012-12-19 2014-06-26 ルネサスエレクトロニクス株式会社 半導体装置
JP2020205342A (ja) * 2019-06-17 2020-12-24 ローム株式会社 チップ部品
US20200402698A1 (en) * 2019-06-24 2020-12-24 Nxp B.V. High Current Integrated Circuit-Based Transformer

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