WO2024027776A1 - 显示面板、显示装置及显示面板的制备方法 - Google Patents

显示面板、显示装置及显示面板的制备方法 Download PDF

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Publication number
WO2024027776A1
WO2024027776A1 PCT/CN2023/110841 CN2023110841W WO2024027776A1 WO 2024027776 A1 WO2024027776 A1 WO 2024027776A1 CN 2023110841 W CN2023110841 W CN 2023110841W WO 2024027776 A1 WO2024027776 A1 WO 2024027776A1
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Prior art keywords
sub
layer
substrate
encapsulation
packaging
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PCT/CN2023/110841
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English (en)
French (fr)
Inventor
张浩瀚
肖一鸣
姚远
杨博文
朱雪婧
倪柳松
Original Assignee
维信诺科技股份有限公司
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Priority to KR1020247007867A priority Critical patent/KR20240039198A/ko
Publication of WO2024027776A1 publication Critical patent/WO2024027776A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates

Definitions

  • the present application relates to the field of display, and specifically to a display panel, a display device, and a method for preparing a display panel.
  • the thin film packaging process is a key factor to ensure the display effect.
  • the quality of the packaging effect directly affects the service life of the display panel. Therefore, the stability of film packaging is crucial.
  • the packaging layer is too thick to form holes, resulting in poor packaging performance.
  • Embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, aiming to improve the problem of poor packaging performance.
  • a first embodiment of the present application provides a display panel.
  • the display panel includes: a substrate; a pixel definition layer located on the substrate.
  • the pixel definition layer includes an isolation portion and an image formed by the isolation portion.
  • the pixel opening, at least part of the pixel electrode is exposed from the pixel opening;
  • the pad layer is located on the substrate, the pad layer includes a first sub-part and a second sub-part located on the first sub-part facing the substrate, the first sub-part is in the orthographic projection area of the substrate It is larger than the orthographic projection area of the second sub-part on the substrate, and is surrounded by a high layer of padding to form an isolation space.
  • the high layer of padding is recessed toward the side wall of the isolation space to form a groove;
  • the light-emitting layer includes a light-emitting unit located in the isolation space; and
  • the packaging layer is located in the light-emitting space.
  • the encapsulation layer includes a first encapsulation part and a second encapsulation part arranged in a stack, at least part of the first encapsulation part is located in the groove, and the second encapsulation part is located on a side of the first encapsulation part away from the substrate.
  • the display panel further includes: a pixel definition layer located on the substrate, the pixel definition layer includes a pixel defining portion and a pixel opening surrounded by the pixel defining portion, at least part of the pixel electrode is exposed by the pixel opening .
  • the first electrode layer located on a side of the light-emitting unit away from the substrate, the first electrode layer includes a body part, and the body part and the second sub-part are connected to each other.
  • the first packaging part is located on a side of the body part away from the light-emitting unit, and the first packaging part is located on a side of the first sub-part facing the substrate.
  • the first packaging part includes a second covering part covering the side surface of the second sub-part.
  • the first packaging part includes a first covering part covering a surface of the body part facing away from the light-emitting unit; and a second covering part connected to the periphery of the first covering part. side.
  • the first packaging part further includes a third covering part connected to the peripheral side of the second covering part and covering the surface of the first sub-part facing the substrate.
  • the display panel further includes a filter unit, the filter unit is located between the body part of the first electrode layer and the first encapsulation part, the refractive index of the filter unit is n0, the first The refractive index n1 of the encapsulating part and the refractive index n2 of the second encapsulating part satisfy the following relationship:
  • the second packaging part is at least partially disposed in the isolation space.
  • the first part includes an integrally arranged first part and The second part, the first part is located in the isolation space, and the second part is located on the surface of the underlayment layer away from the substrate.
  • the thickness of the first packaging part is smaller than the thickness of the second packaging part.
  • the thickness of the first packaging part ranges from 0.1 ⁇ m to 0.5 ⁇ m.
  • the packaging layer further includes a third organic packaging part, and the third organic packaging part is located on a side of the second packaging part away from the substrate.
  • the display panel further includes a display area and a display area arranged around the display area.
  • the non-display area includes a blocking part, the blocking part is arranged around the display area, and the third organic packaging part is located in the area enclosed by the blocking part.
  • a second embodiment of the present application provides a display device, which includes the display panel of any of the above embodiments.
  • a third embodiment of the present application provides a method for manufacturing a display panel, including:
  • the underlayment layer includes a first subpart and a second subpart located on the first subpart facing the substrate.
  • the orthogonal projection area of the first subpart on the substrate is greater than the orthogonal projection area of the second subpart on the substrate.
  • the high cushion layer encloses an isolation space, and the side wall of the cushion layer is recessed toward the isolation space to form a groove;
  • a light-emitting layer and a packaging layer are prepared on the substrate.
  • the light-emitting layer includes a light-emitting unit located in an isolation space.
  • the packaging layer includes a first packaging part and a second packaging part that are stacked. The first packaging part is located in the isolation space, and the second packaging part is located in the isolation space. A side of the packaging part facing away from the substrate.
  • the method further includes:
  • a pixel definition layer is prepared on the substrate.
  • the pixel definition layer includes a pixel definition part and a pixel opening surrounded by the pixel definition part. At least part of the pixel electrode is exposed by the pixel opening.
  • the pixel opening includes a first pixel opening, a second pixel opening and a third pixel opening.
  • the light-emitting unit includes a first light-emitting unit located in the first pixel opening, a second light-emitting unit located in the second pixel opening, and a third light-emitting unit located in the third pixel opening
  • the first packaging part includes a first light-emitting unit located in the third pixel opening.
  • a first luminescent material layer and a first packaging sub-material layer are arranged on a side of the pixel definition layer facing away from the substrate, and the first luminescent material layer and the first packaging sub-material layer are patterned to form a first light-emitting unit and a first package. sub-part;
  • a second encapsulation part is prepared on the first encapsulation sub-part, the second encapsulation sub-part, the third encapsulation sub-part and the pixel definition layer.
  • the display panel includes a substrate, an underlayer layer provided on the substrate, a light-emitting layer, and an encapsulation layer located on a side of the light-emitting layer away from the substrate.
  • the second sub-section is located on the side of the first sub-section facing the substrate, and the orthographic projection area of the first sub-section on the substrate is greater than the orthographic projection area of the second sub-section on the substrate, which will cause at least part of the first sub-section to
  • the second sub-portion is arranged in the air, that is, the second sub-portion is concave relative to the first sub-portion to form a groove.
  • the first encapsulation part When preparing the first encapsulation part, the first encapsulation part is separated by a layer of underlayment and deposited in the isolation space, and at least part of the first encapsulation part is located in the groove to cover the side of the second sub-part facing the isolation space. Then, a second encapsulation part is prepared on the side of the first encapsulation part away from the substrate. The second encapsulation part is prepared over the entire surface and has better encapsulation properties, further improving the overall encapsulation performance of the encapsulation layer. The first encapsulation part and the second encapsulation part are prepared in one step.
  • the first encapsulation part can better cover the second sub-part, which can improve the simultaneous preparation of the first encapsulation layer and the second encapsulation layer.
  • the thickness is thicker, and it is easy to make the encapsulation layer and the pad Holes are formed between high layers, resulting in reduced packaging performance of the packaging layer.
  • Figure 1 is a schematic top view of a display panel provided by an embodiment of the present application.
  • Figure 2 is a cross-sectional view at BB in Figure 1;
  • Figure 3 is a partial enlarged view of Figure 2;
  • Figure 4 is a schematic flow chart of a method for preparing a display panel provided by an embodiment of the present application
  • Figure 5 is a schematic flowchart of a certain step in a method for preparing a display panel provided by an embodiment of the present application
  • 6 to 15 are schematic diagrams of the preparation process of a display panel preparation method provided by embodiments of the present application.
  • First encapsulation part 511. First covering part; 512. Second covering part; 513. The third covering part; 520. The second packaging part; 521. The first division; 522. The second division; 530. The third organic packaging part; 540; The fourth inorganic packaging part; 600. First electrode layer; 610. Body part; 700. Planarization layer; 710. Blocking portion; 800. Pixel electrode; 900. Filter unit; AA, display area; NA, non-display area.
  • a light-transmitting display area can be provided on the above-mentioned electronic device, and the photosensitive component is arranged on the back of the light-transmitting display area. In order to improve the photosensitive performance of the photosensitive component, its light transmittance needs to be increased.
  • the thin film packaging process is a key factor to ensure the display effect.
  • the quality of the packaging effect directly affects the service life of the display panel. Therefore, the stability of film packaging is crucial.
  • a full-thickness packaging layer is directly deposited. When the film is formed around the pad layer, holes will be formed on the side walls of the pad layer. After the etching of the packaging layer is completed, the holes will still exist, and the packaging performance will be compromised. Difference.
  • embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel.
  • a display panel a display device, and a method for manufacturing a display panel.
  • An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.
  • a display panel which may be an organic light emitting diode (OLED) display panel.
  • FIG. 1 is a schematic top view of a display panel provided by an embodiment of the present application
  • FIG. 2 is a cross-sectional view at B-B in FIG. 1
  • FIG. 3 is a partial enlarged view of FIG. 2 .
  • the first embodiment of the present application provides a display panel 10 .
  • the display panel 10 includes: a substrate 100 ; an underlayment layer 300 located on the substrate 100 .
  • the underlayment layer 300 includes a first sub-section 310 and The second sub-section 320 is located in the first sub-section 310 and faces the isolation space 330.
  • the orthographic projection area of the first sub-section 310 on the substrate 100 is larger than the orthographic projection area of the second sub-section 320 on the substrate 100.
  • the cushion layer 300 is enclosed to form isolation.
  • the side wall of the cushion layer 300 is recessed toward the isolation space 330 to form a groove 340;
  • the light-emitting layer 400 includes the light-emitting unit 410 located in the isolation space 330;
  • the packaging layer 500 is located on the side of the light-emitting layer 400 away from the substrate 100, encapsulating
  • the layer 500 includes a stacked first encapsulation part 510 and a second encapsulation part 520 , at least part of the first encapsulation part 510 is located in the groove 340 , and the second encapsulation part 520 is located on a side of the first encapsulation part 510 away from the substrate 100 .
  • the display panel 10 includes a substrate 100 , an underlay layer 300 provided on the substrate 100 , a luminescent layer 400 , and an encapsulation layer 500 located on a side of the luminescent layer 400 away from the substrate 100 .
  • the second sub-section 320 is located on the side of the first sub-section 310 facing the substrate 100, and the orthographic projection area of the first sub-section 310 on the substrate 100 is larger than the orthographic projection area of the second sub-section 320 on the substrate 100. This will therefore, at least part of the first sub-portion 310 is disposed in the air, that is, the second sub-portion 320 is concave relative to the first sub-portion 310 to form a groove 340 .
  • the first encapsulation part 510 When preparing the first encapsulation part 510, the first encapsulation part 510 is separated by the underlayer layer 300 and deposited in the isolation space 330. At least part of the first encapsulation part 510 is located in the groove 340 to cover the second sub-part 320 toward the isolation. Side of space 330. Then, a second packaging part 520 is prepared on the side of the first packaging part 510 away from the substrate 100. The second packaging part 520 is prepared over the entire surface and has better encapsulation properties, further improving the overall packaging performance of the packaging layer 500. The first encapsulation part 510 and the second encapsulation part 520 are prepared in steps.
  • the first encapsulation part 510 can better cover the second sub-part 320, which can improve the ease of preparation of a thicker encapsulation layer with the same material at one time. Holes are formed between the encapsulation layer 500 and the cushion layer 300 , resulting in a problem of reduced encapsulation performance of the encapsulation layer 500 .
  • the underlayer layer 300 includes an isolation structure, which is used to isolate the light-emitting layer 400 to form mutually spaced light-emitting units 410 when preparing the light-emitting layer 400 .
  • the display panel 10 includes a pixel definition layer 200 located on the substrate 100 .
  • the pixel definition layer 200 includes a pixel defining portion 210 , a pixel opening 220 enclosed by the pixel defining portion 210 , and at least part of the pixel electrode 800 . Exposed by the pixel opening 220 , the pixel opening 220 is used to set the light-emitting unit 410 to realize the display panel 10 to emit light, and the pixel defining portion 210 is used to define the light-emitting area of the display panel 10 .
  • the thickness of the first packaging part 510 is smaller than the thickness of the second packaging part 520 .
  • the thickness of the first encapsulation part 510 is smaller, so that the first encapsulation part 510 has better diffraction.
  • the first encapsulation part 510 is in the groove 340
  • the inner layer and the cushion layer 300 are more closely adhered to each other, thereby reducing the possibility of holes.
  • the second encapsulation part 520 is thicker and has better encapsulation properties, which can improve the overall encapsulation performance of the encapsulation layer 500 .
  • the first packaging part 510 includes silicon oxide or silicon oxynitride.
  • the silicon oxide or silicon oxynitride material can improve the optical performance of the display panel 10 .
  • the second packaging part 520 includes silicon nitride, which has better encapsulation properties and improves packaging performance.
  • the display panel 10 further includes a pixel definition layer 200 located on the substrate 100.
  • the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 enclosed by the pixel defining portion 210, at least part of the pixel electrode. 800 is exposed by the pixel opening 220 , the pixel defining portion 210 defines the light-emitting area of the display panel 10 , and the pixel opening 220 is used to set the light-emitting unit 410 to realize the light-emitting display of the display panel 10 .
  • the distance between the surface of the first sub-part 310 facing the substrate 100 and the substrate 100 is a first distance
  • the distance between the surface of the first packaging part 510 away from the substrate 100 and the substrate 100 is a second distance
  • the second distance is The distance is less than or equal to the first distance, that is, the first packaging part 510 is completely located on the side of the first sub-part 310 facing the substrate 100, which improves the bonding reliability between the first packaging part 510 and the second sub-part 320 and reduces holes. of production.
  • the display panel 10 further includes a first electrode layer 600 located on a side of the light-emitting unit 410 facing away from the substrate 100 .
  • the first electrode layer 600 includes a body part 610 , and the body part 610 and The second sub-sections 320 are connected to each other.
  • the material of the second sub-part 320 includes metal material.
  • the body portions 610 on two adjacent light-emitting units 410 can To be connected to each other through the second sub-portion 320 , that is, the body portions 610 on two adjacent light-emitting units 410 can be electrically connected as surface electrodes through the underlay layer 300 .
  • the first encapsulating part 510 is located on a side of the body part 610 away from the light emitting unit 410 , and the first encapsulating part 510 is located on a side of the first sub-part 310 facing the substrate 100 .
  • the first encapsulation part 510 is located on the side of the first sub-part 310 facing the substrate 100 to prevent water vapor from entering the light-emitting unit 410, further improving the packaging effect and improving the risk of water vapor intrusion into the light-emitting unit 410. .
  • the first packaging part 510 includes a second covering part 512 covering the side surface of the second sub-part 320 .
  • the first packaging part 510 may also include a first covering part 511 that covers the surface of the body part 610 facing away from the light-emitting unit 410; and a second covering part 512 connected to the periphery of the first covering part 511. side.
  • the first covering part 511 is used to encapsulate the body part 610 and the light emitting unit 410, and the second covering part 512 covers the side surface of the second sub-part 320, so that when the second encapsulating part 520 is prepared, The second encapsulation part 520 covers the side of the first encapsulation part 510 away from the substrate 100 to prevent the encapsulation layer 500 from forming holes on the side of the second sub-part 320 due to the groove being too deep, thereby degrading the encapsulation performance.
  • the first packaging part 510 further includes a third covering part 513 , which is connected to the peripheral side of the second covering part 512 and covers the surface of the first sub-part 310 facing the substrate 100 .
  • a third covering part 513 is connected to the peripheral side of the second covering part 512 and covers the surface of the first sub-part 310 facing the substrate 100 .
  • the display panel 10 further includes a filter unit.
  • the filter unit 900 is located between the body part 610 of the first electrode layer 600 and the first encapsulation part 510.
  • the refractive index of the filter unit 900 is n0.
  • the refractive index n1 of the first encapsulation part 510 and the refractive index n2 of the second encapsulation part 520 satisfy the following relationship:
  • the light emitting unit 410 when the refractive index n0 of the filter unit 900 , the refractive index n1 of the first encapsulation part 510 , and the refractive index n2 of the second encapsulation part 520 satisfy the above relationship, the light emitting unit 410 The light extraction efficiency is the highest.
  • the second packaging portion 520 is at least partially located within the isolation space 330 .
  • the second packaging part 520 may be completely located in the isolation space 330 , or the second packaging part 520 may include a first sub-part 521 and a second sub-part 522 that are integrally provided.
  • the first sub-part 521 Located in the isolation space 330 , the second subsection 522 is located on a surface of the underlayment layer 301 facing away from the substrate 100 .
  • the first portion 521 is filled in the isolation space 330 to further improve the packaging effect in the isolation space 330, and the first portion 521 is deposited on the side of the first packaging portion 510 away from the substrate 100, This prevents the encapsulation layer 500 from forming holes on the side of the second sub-part 320 and reducing the encapsulation performance.
  • the second subsection 522 is located on the side of the first subsection 310 away from the substrate 100 and covers the pad layer 300 and the first subsection 310 to further improve the packaging performance of the packaging layer 500 .
  • the thickness of the first packaging part 510 is smaller than the thickness of the second packaging part 520 .
  • the second encapsulation part 520 is deposited on the side of the first encapsulation part 510 away from the substrate 100. Since the thickness of the first encapsulation part 510 is small, the second encapsulation part 520 is After the part 520 is deposited, the packaging layer 500 will not generate holes around the second sub-part 320, and the packaging performance is improved.
  • the thickness of the first packaging part 510 ranges from 0.1 ⁇ m to 0.5 ⁇ m.
  • the thickness of the first packaging part 510 is greater than or equal to 0.1 ⁇ m, so as to prevent the thickness of the first packaging part 510 from being too small and the thickness of the deposited second packaging part 520 to be larger. Finally, holes will be generated in the second packaging part 520 around the second sub-part 320, reducing packaging performance. The thickness of the first packaging part 510 is less than or equal to 0.5 ⁇ m to prevent the first packaging part 510 from being too thick. After the first packaging part 510 is deposited, holes will be generated in the first packaging part 510 around the second sub-part 320, which reduces the Packaging performance.
  • the encapsulation layer 500 also includes a third organic encapsulation part 530.
  • the third organic encapsulation part 530 is located on a side of the second encapsulation part 520 away from the substrate 100.
  • the display panel 10 also It includes a display area AA and a non-display area NA arranged around the display area AA.
  • the non-display area NA includes a blocking part 710 .
  • the blocking part 710 is arranged around the display area AA.
  • the third organic packaging part 530 is located in the enclosed area of the blocking part 710 .
  • the third organic sealing portion 530 is blocked by the blocking portion, which can improve the performance of the organic material layer in the display area AA due to water vapor passing from the non-display area NA to the display area AA. and other problems, the sealing performance of the display panel 10 can be improved.
  • the encapsulation layer 500 further includes a fourth inorganic encapsulation part 540 , and the fourth inorganic encapsulation part 540 is located on a side of the third organic encapsulation part 530 away from the substrate 100 .
  • the fourth inorganic encapsulation part 540 covers the third organic encapsulation part 530 to further enhance the encapsulation performance of the encapsulation layer 500.
  • the third organic packaging part 530 is provided integrally.
  • the fourth inorganic packaging part 540 is provided integrally.
  • the orthographic projection of the first encapsulating part 510 and the second encapsulating part 520 on the substrate 100 is located within the orthographic projection of the third organic encapsulating part 530 on the substrate 100 .
  • the orthographic projection of the third organic encapsulating part 530 on the substrate 100 is located within the orthographic projection of the fourth inorganic encapsulating part 540 on the substrate 100 .
  • the third organic encapsulation part 530 is provided integrally, and the fourth inorganic encapsulation part 540 is provided integrally.
  • the encapsulation performance is better, and on the other hand, it is convenient for the third organic encapsulation layer 500 and the fourth inorganic encapsulation layer 500 to be integrated.
  • the second encapsulation part 520 completely covers the first encapsulation part 510
  • the third organic encapsulation part 530 completely covers the second encapsulation part 520
  • the fourth inorganic encapsulation part 540 completely covers the third organic encapsulation part 530 , further improving the encapsulation layer 500 packaging performance.
  • the display panel 10 has a length direction, a width direction, and a thickness direction.
  • the blocking portion 710 can be provided in various shapes.
  • the blocking portion 710 can extend in a strip shape along the length direction and be located on one side of the display area AA in the width direction.
  • the blocking portion 710 can extend in a strip shape along the width direction and be located on one side of the display area AA.
  • the display area AA is on one side in the length direction.
  • the blocking portion 710 forms a closed ring around the display area AA.
  • the blocking portion 710 is arranged in a ring shape, so that the organic material layer can be broken at different positions around the display area AA, which can better improve the problem of water vapor spreading to the display area AA and improve the display panel. 10 sealing performance.
  • the number of blocking parts 710 may be one.
  • the number of blocking portions 710 is two or more, and the two or more blocking portions 710 are spaced apart in a direction away from the display area AA. Providing multiple blocking portions 710 can further improve the sealing effect of the display panel 10 .
  • the substrate 100 can be an array substrate.
  • the substrate 100 includes a substrate and a driving circuit layer provided on the substrate.
  • the driving circuit layer can be located in the display area AA, and the blocking portion 710 can be directly formed on the substrate. superior.
  • the display panel 10 further includes a planarization layer 700 , and the pixel electrode 800 is disposed between the planarization layer 700 and the pixel definition layer 200 .
  • the blocking portion 710 can be provided in the same layer and material as the planarization layer 700 to further simplify the manufacturing process of the display panel 10 and improve the manufacturing efficiency of the display panel 10 .
  • the light-emitting unit 410 includes a first light-emitting unit 411, a second light-emitting unit 412 and a third light-emitting unit 413.
  • the first light-emitting unit 411, the second light-emitting unit 412 and the third light-emitting unit 413. 413 are respectively a red light-emitting unit, a green light-emitting unit and a blue light-emitting unit to realize color display of the display panel 10 .
  • a second aspect embodiment of the present application also provides a display device, including the display panel 10 of any of the above-mentioned first aspect embodiments. Since the display device provided by the second embodiment of the present application includes the display panel 10 of any embodiment of the first aspect, the display device provided by the second embodiment of the present application has the display panel 10 of any embodiment of the first aspect. 10 has beneficial effects that will not be repeated here.
  • Display devices in the embodiments of this application include but are not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control, smart landline phones, consoles and other devices with display functions. .
  • PDAs personal digital assistants
  • tablet computers e-books
  • televisions access control
  • smart landline phones consoles and other devices with display functions.
  • FIG. 4 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application.
  • the third embodiment of the present application also provides a method of manufacturing the display panel 10.
  • the display panel 10 can be the display panel 10 provided in any of the above-mentioned first embodiments. Please refer to Figures 1 to 4 for the preparation method. include:
  • Step S01 Prepare an underlayment layer on the substrate.
  • the underlayment layer includes a first subpart and a second subpart located on the first subpart facing the substrate.
  • the orthogonal projected area of the first subpart on the substrate is greater than the orthogonal projected area of the second subpart on the substrate.
  • the projected area, the high layer of cushioning is enclosed to form an isolation space, and the high layer of cushioning is recessed toward the side wall of the isolation space to form a groove.
  • Step S02 Prepare a luminescent layer and an encapsulation layer on the substrate.
  • the luminescent layer includes a layer located in an isolation space.
  • the packaging layer includes a stacked first packaging part and a second packaging part, the first packaging part is located in the isolation space, and the second packaging part is located on a side of the first packaging part away from the substrate.
  • the substrate 100 and the underlayment layer 300 are prepared through step S01.
  • the pad layer 300 includes a first sub-portion 310 and a second sub-portion 320 located on the first sub-portion 310 facing the substrate 100 .
  • the light-emitting layer 400 and the encapsulating layer 500 are prepared through step S02.
  • the second sub-section 320 is located on the side of the first sub-section 310 facing the substrate 100, and the orthographic projection area of the first sub-section 310 on the substrate 100 is larger than the orthographic projection area of the second sub-section 320 on the substrate 100.
  • the first sub-portion 310 is disposed in the air, that is, the second sub-portion 320 is concave relative to the first sub-portion 310 to form a groove 340 .
  • the first encapsulation part 510 is separated by the underlayer layer 300 and deposited in the isolation space 330. At least part of the first encapsulation part 510 is located in the groove 340 to cover the second sub-part 320 toward the isolation. Side of space 330. Then, a second packaging part 520 is prepared on the side of the first packaging part 510 away from the substrate 100.
  • the second packaging part 520 is prepared over the entire surface and has better encapsulation properties, further improving the overall packaging performance of the packaging layer 500.
  • the first encapsulation part 510 and the second encapsulation part 520 are prepared in steps.
  • the first encapsulation part 510 can better cover the second sub-part 320, which can improve the ease of preparation of a thicker encapsulation layer with the same material at one time. Holes are formed between the encapsulation layer 500 and the cushion layer 300 , resulting in a problem of reduced encapsulation performance of the encapsulation layer 500 .
  • Figure 5 is a schematic flow chart of a certain step in a method for preparing a display panel provided by an embodiment of the present application.
  • the method further includes:
  • a pixel definition layer 200 is prepared on the substrate 100 .
  • the pixel definition layer 200 includes a pixel definition part 210 and a pixel opening 220 surrounded by the pixel definition part 210 . At least part of the pixel electrode 800 is exposed by the pixel opening 220 .
  • the pixel opening 220 includes a first The pixel opening 221, the second pixel opening 222 and the third pixel opening 223.
  • the light-emitting unit 410 includes a first light-emitting unit 411 located in the first pixel opening 221, a second light-emitting unit 412 located in the second pixel opening 222 and a third light-emitting unit 412 located in the second pixel opening 222.
  • the first packaging part 510 includes a first packaging sub-part 501 located on the side of the first light-emitting unit 411 facing away from the substrate 100, and a third packaging sub-section 501 located on the side of the second light-emitting unit 412 facing away from the substrate 100.
  • the second packaging sub-part 502 and the third packaging sub-part 503 located on the side of the third light-emitting unit 413 facing away from the substrate 100, step S02 also includes:
  • Step S021 Set a first luminescent material layer and a first packaging sub-material layer on the side of the pixel definition layer 200 facing away from the substrate 100, and pattern the first luminescent material layer and the first packaging sub-material layer to form a first luminescent material.
  • Unit 411 and first package subsection 501
  • Step S022 Continue to provide a second luminescent material layer and a second packaging sub-material layer on the side of the pixel definition layer 200 away from the substrate 100, and pattern the second luminescent material layer and the second packaging sub-material layer to form a second The light emitting unit 412 and the second package sub-part 502 .
  • Step S023 Continue to provide a third luminescent material layer and a third packaging sub-material layer on the side of the pixel definition layer 200 away from the substrate 100, and pattern the third luminescent material layer and the third packaging sub-material layer to form a first The light emitting unit 411 and the first package sub-part 501.
  • the first package sub-material layer located on the side wall of the first sub-part 310 is etched away, reducing the actual grooves of the second package part during the deposition process. deep.
  • Step S024 Prepare a second encapsulation part 520 on the first encapsulation sub-part 501, the second encapsulation sub-part 502, the third encapsulation sub-part 503 and the pixel definition layer 200.
  • the second package part 520 is deposited on the first package part.
  • Part 501, second packaging sub-part 502, and third packaging sub-part 503 are on the side facing away from the substrate 100.
  • the first packaging part 510 and the second packaging part 520 are prepared separately to avoid the packaging layer 500 being too thick to form holes, which may affect the packaging performance. reduce the problem.
  • the preparation method of the display panel 10 provided in the embodiment of the present application includes:
  • Step 1 as shown in FIG. 6 , a planarization material layer is provided on the substrate 100 , and the planarization material layer is patterned to form a planarization layer 700 and a barrier portion 710 .
  • Step 2 As shown in FIG. 7 , a pixel electrode 800 is prepared on the planarization layer 700 .
  • Step three continue to provide a pixel definition material layer on the substrate 100, and pattern the pixel definition material layer to form the pixel definition layer 200 located in the display area AA.
  • Step 4 continue to provide the second sub-material layer and the first sub-material layer on the substrate 100, and pattern the first sub-material layer and the second sub-material layer to form a layer located in the pixel defining portion 210.
  • first step a photoresist is set on the side of the first sub-material layer facing away from the second sub-material layer. Use photoresist to etch the first sub-material layer away from the second sub-material layer to form the first sub-portion 310; in the second step, continue to etch the second sub-material layer sideways to form the second sub-portion 320.
  • Step 5 continue to provide the first luminescent material layer, the first electrode material layer and the first package sub-material layer on the substrate 100, and simultaneously arrange the first luminescent material layer, the first electrode material layer and the first package material layer.
  • a package material layer is patterned to form the first light-emitting unit 411, the body portion 610 and the first package portion 501.
  • the first luminescent material layer, the first electrode material layer and the first packaging sub-material layer are continued to be provided on the substrate 100, and at the same time, the first luminescent material layer, the first electrode material layer and the first packaging sub-material are The layers are patterned to form the first light-emitting unit 411, the body part 610 and the first package sub-part 501, including:
  • the first luminescent material, the first electrode material and the first package sub-material are sequentially deposited on the substrate 100, and the first luminescent material layer and the first electrode material are formed in the first pixel opening, the second pixel opening and the third pixel opening. layer and the first package sub-material layer;
  • the first light-emitting material layer, the first electrode material layer and the first package sub-material layer in the second pixel opening and the third pixel opening are etched away, and the first photoresist is removed to form the first light-emitting unit 411, the body part 610 and The first package sub-section 501.
  • Step six continue to provide the second luminescent material layer, the second electrode material layer and the second package sub-material layer on the substrate 100, and simultaneously The two package sub-material layers are patterned to form the second light-emitting unit 412, the body part 610 and the second package sub-part 502.
  • the second luminescent material layer, the second electrode material layer and the second packaging sub-material layer are continued to be disposed on the substrate 100, and the second luminescent material layer, the second electrode material layer and the second packaging sub-material layer are simultaneously
  • the patterning process to form the second light-emitting unit 412, the body part 610 and the second package sub-part 502 includes:
  • the second luminescent material, the second electrode material and the second packaging sub-material are sequentially deposited on the substrate 100
  • a second luminescent material layer, a second electrode material layer and a second packaging sub-material layer are formed on the second pixel opening, the third pixel opening and the side of the first packaging sub-part 201 away from the substrate 100;
  • Step seven as shown in Figure 12, form a third luminescent material layer, a third electrode material layer and a third package sub-material layer on the substrate 100, and simultaneously The packaging sub-material layer is patterned to form the third light-emitting unit 413, the body part 610 and the third packaging sub-part 503.
  • a third luminescent material layer, a third electrode material layer and a third packaging sub-material layer are formed on the substrate 100, and the third luminescent material layer, the third electrode material layer and the third packaging sub-material layer are patterned at the same time.
  • Chemical processing to form the third light-emitting unit 413, the body part 610 and the third package sub-part 503 includes:
  • a third luminescent material, a third electrode material and a third encapsulation sub-material are sequentially deposited on the substrate 100, on the side of the first encapsulation sub-part 501 and the second encapsulation sub-part 502 away from the substrate 100 and within the third pixel opening. Forming a third luminescent material layer, a third electrode material layer and a third packaging sub-material layer;
  • Step eight prepare a second encapsulation part 520 on the first encapsulation sub-part 501, the second encapsulation sub-part 502, the third encapsulation sub-part 503 and the pixel definition layer 200.
  • the first package sub-part 501, the second package sub-part 502, and the third package sub-part 503 respectively correspond to second package sub-parts 501, 502, and 503.
  • the encapsulation part 520 can also be formed in steps, that is, after step six and before step seven, the second encapsulation part above the first encapsulation sub-part 501 is formed, and after step seven and before step eight, the second encapsulation part above the second encapsulation sub-part 501 is formed.
  • the encapsulation part 520 forms the second encapsulation part 520 corresponding to the third encapsulation sub-part after step eight.
  • Step nine as shown in FIG. 14 , a third organic encapsulating part 530 is provided in the area enclosed by the blocking part 710 .
  • Step ten as shown in FIG. 15 , continue to provide the fourth inorganic packaging part 540 on the substrate 100 .
  • the second encapsulation part 520 is deposited on the first encapsulation sub-part 501 , the side of the second packaging sub-part 502 and the third packaging sub-part 503 facing away from the substrate 100, the first packaging part 510 and the second packaging part 520 are prepared separately to avoid the packaging layer 500 being too thick to form holes, resulting in reduced packaging performance. question.

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Abstract

一种显示面板（10）、显示装置及显示面板（10）的制备方法，显示面板（10）包括基板（100）、设置于基板（100）的垫高层（300）、发光层（400）和位于发光层（400）远离基板（100）的一侧的封装层（500）。垫高层（300）包括第一子部（310）和第二子部（320）。第二子部（320）位于第一子部（310）朝向基板（100）的一侧，且第一子部（310）在基板（100）上的正投影面积大于第二子部（320）在基板（100）上的正投影面积，即第二子部（320）相对于第一子部（310）内凹形成凹槽（340）。第一封装部（510）沉积在隔离空间（330）内，至少部分第一封装部（510）位于凹槽（340）内。然后在第一封装部（510）背离基板（100）的一侧制备第二封装部（520），第二封装部（520）整面制备，具有较好的包覆性，进一步提高封装层（500）的整体封装性能。第一封装部（510）和第二封装部（520）分步制备，能够改善封装层（500）与垫高层（300）之间形成孔洞，导致封装层（500）封装性能降低的问题。

Description

显示面板、显示装置及显示面板的制备方法
相关申请的交叉引用
本申请要求享有于2022年08月02日提交的名称为“显示面板、显示装置及显示面板的制备方法”的中国专利申请第202210923525.7号和于2023年08月01日提交的名称为“显示面板、显示装置及显示面板的制备方法”的中国专利申请第202310955134.8号的优先权，这些申请的全部内容通过引用并入本文中。
技术领域
本申请涉及显示领域，具体涉及一种显示面板、显示装置及显示面板的制备方法。
背景技术
随着电子设备的快速发展，用户对显示效果的要求越来越高，使得电子设备的屏幕显示受到业界越来越多的关注。
为了提高电子设备屏幕的显示效果，在显示面板中，薄膜封装工艺是保证显示效果的关键因素，封装效果的好坏直接影响到显示面板的使用寿命。因此，薄膜封装的稳定性至关重要。而在现有技术中，封装层由于厚度过厚形成孔洞，封装性能差。
发明内容
本申请实施例提供一种显示面板、显示装置及显示面板的制备方法，旨在改善封装性能差的问题。
本申请第一方面实施例提供一种显示面板，显示面板包括：基板；像素定义层，位于基板上，像素定义层包括隔离部、由隔离部围合形成的像 素开口，至少部分像素电极由像素开口露出；垫高层，位于基板上，垫高层包括第一子部和位于第一子部朝向基板的第二子部，第一子部在基板的正投影面积大于第二子部在基板的正投影面积，垫高层围合形成隔离空间，垫高层朝向隔离空间的侧壁凹陷形成有凹槽；发光层，包括位于隔离空间的发光单元；封装层，位于发光层远离基板的一侧，封装层包括层叠设置的第一封装部和第二封装部，至少部分第一封装部位于凹槽，第二封装部位于第一封装部背离基板的一侧。
根据本申请第一方面的实施方式，显示面板还包括：像素定义层，位于基板上，像素定义层包括像素限定部、由像素限定部围合形成的像素开口，至少部分像素电极由像素开口露出。根据本申请第一方面前述任一实施方式，还包括位于发光单元背离基板的一侧的第一电极层，第一电极层包括本体部，本体部和第二子部相互连接。
根据本申请第一方面前述任一实施方式，第一封装部位于本体部背离发光单元的一侧，且第一封装部位于第一子部朝向基板的一侧。
根据本申请第一方面前述任一实施方式，第一封装部包括第二覆盖部，覆盖第二子部的侧表面。
根据本申请第一方面前述任一实施方式，所述第一封装部包括第一覆盖部，第一覆盖部覆盖本体部背离发光单元的表面；第二覆盖部，连接于第一覆盖部的周侧。
根据本申请第一方面前述任一实施方式，第一封装部还包括第三覆盖部，连接于第二覆盖部的周侧并覆盖第一子部朝向基板的表面。
根据本申请第一方面前述任一实施方式，显示面板还包括滤光单元，滤光单元位于第一电极层的本体部与第一封装部之间，滤光单元的折射率为n0、第一封装部的折射率为n1、第二封装部的折射率为n2满足如下关系式：
根据本申请第一方面前述任一实施方式，第二封装部至少部分设置在所述隔离空间内。
根据本申请第一方面前述任一实施方式，包括一体设置的第一分部和 第二分部，第一分部位于隔离空间内，第二分部位于垫高层背离基板的表面。
根据本申请第一方面前述任一实施方式，第一封装部的厚度小于第二封装部的厚度。
根据本申请第一方面前述任一实施方式，第一封装部的厚度范围为0.1μm-0.5μm。
根据本申请第一方面前述任一实施方式，封装层还包括第三有机封装部，第三有机封装部位于第二封装部远离基板的一侧，显示面板还包括显示区和围绕显示区设置的非显示区，非显示区包括阻挡部，阻挡部围绕显示区设置，第三有机封装部位于阻挡部的围合区域内。
隔离空间本申请第二方面的实施例提供一种显示装置，其包括上述任一实施方式的显示面板。
本申请第三方面的实施例提供一种显示面板的制备方法，包括：
在基板上制备垫高层，垫高层包括第一子部和位于第一子部朝向基板的第二子部，第一子部在基板的正投影面积大于第二子部在基板的正投影面积，垫高层围合形成隔离空间，垫高层朝向隔离空间的侧壁凹陷形成凹槽；
在基板上制备发光层和封装层，发光层包括位于隔离空间的发光单元，封装层包括层叠设置的第一封装部和第二封装部，第一封装部位于隔离空间，第二封装部位于第一封装部背离基板的一侧。
根据本申请第三方面前述任一实施方式，方法还包括：
在基板上制备像素定义层，像素定义层包括像素定义部、由像素定义部围合形成的像素开口，至少部分像素电极由像素开口露出，像素开口包括第一像素开口、第二像素开口和第三像素开口，发光单元包括位于第一像素开口内的第一发光单元、位于第二像素开口内的第二发光单元和位于第三像素开口内的第三发光单元，第一封装部包括位于第一发光单元背离基板一侧的第一封装子部、位于第二发光单元背离基板一侧的第二封装子部和位于第三发光单元背离基板一侧的第三封装子部，
在基板上制备发光层和封装层的步骤中：
在像素定义层背离基板的一侧设置第一发光材料层及第一封装子材料层，并对第一发光材料层和第一封装子材料层进行图案化处理形成第一发光单元和第一封装子部；
在像素定义层背离基板的一侧继续设置第二发光材料层及第二封装子材料层，并对第二发光材料层和第二封装子材料层进行图案化处理形成第二发光单元和第二封装子部；
在像素定义层背离基板的一侧继续设置第三发光材料层及第三封装子材料层，并对第三发光材料层和第三封装子材料层进行图案化处理形成第一发光单元和第一封装子部；
在第一封装子部、第二封装子部、第三封装子部和像素定义层上制备第二封装部。
根据本申请实施例的显示面板，显示面板包括基板、设置于基板的垫高层、发光层和位于发光层远离基板的一侧的封装层。第二子部位于第一子部朝向基板的一侧，且第一子部在基板上的正投影面积大于第二子部在基板上的正投影面积，这就会使得至少部分第一子部悬空设置，即第二子部相对于第一子部内凹形成凹槽。在制备第一封装部时，第一封装部被垫高层隔断并沉积在隔离空间内，至少部分第一封装部位于凹槽内，以包覆第二子部朝向隔离空间的侧面。然后在第一封装部背离基板的一侧制备第二封装部，第二封装部整面制备，具有较好的包覆性，进一步提高封装层的整体封装性能。第一封装部和第二封装部分步制备，第一封装部能够较好包覆第二子部，能够改善第一封装层和第二封装层同时制备，厚度较厚，容易使得封装层与垫高层之间形成孔洞，导致封装层封装性能降低的问题。
附图说明
通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，其中，相同或相似的附图标记表示相同或相似的特征，附图并未按照实际的比例绘制。
图1是本申请实施例提供的一种显示面板的俯视示意图；
图2是图1中B-B处的剖视图；
图3是图2的局部放大图；
图4是本申请实施例提供的一种显示面板的制备方法流程示意图；
图5是本申请实施例提供的一种显示面板的制备方法中某步骤的流程示意图；
图6至图15是本申请实施例提供的一种显示面板的制备方法的制备过程示意图。
附图标记说明：
10、显示面板；
100、基板；
200、像素定义层；210、像素限定部；220、像素开口；221、第一像
素开口；222、第二像素开口；223、第三像素开口；
300、垫高层；310、第一子部；320、第二子部；330、隔离空间；
340、凹槽；
400、发光层；410、发光单元；411、第一发光单元；412、第二发光
单元；413、第三发光单元；
500、封装层；501、第一封装子部；502、第二封装子部；503、第三
封装子部；510、第一封装部；511、第一覆盖部；512、第二覆盖部；513、第三覆盖部；520、第二封装部；521、第一分部；522、第二分部；530、第三有机封装部；540；第四无机封装部；
600、第一电极层；610、本体部；
700、平坦化层；710、阻挡部；
800、像素电极；
900、滤光单元；
AA、显示区；NA、非显示区。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅被配 置为解释本申请，并不被配置为限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
应当理解，在描述部件的结构时，当将一层、一个区域称为位于另一层、另一个区域“上面”或“上方”时，可以指直接位于另一层、另一个区域上面，或者在其与另一层、另一个区域之间还包含其它的层或区域。并且，如果将部件翻转，该一层、一个区域将位于另一层、另一个区域“下面”或“下方”。
在诸如手机、平板电脑等电子设备上，需要在设置显示面板的一侧集成诸如前置摄像头、红外光传感器、接近光传感器等感光组件。在一些实施例中，可以在上述电子设备上设置透光显示区，将感光组件设置在透光显示区背面，为了提高感光组件感光性能，需提高其透光率。
为了提高电子设备屏幕的显示效果，在显示面板中，薄膜封装工艺是保证显示效果的关键因素，封装效果的好坏直接影响到显示面板的使用寿命。因此，薄膜封装的稳定性至关重要。而在现有技术中，在制备发光单元后，直接沉积全厚封装层，在垫高层周围成膜时会在垫高层侧壁位置形成孔洞，在封装层刻蚀完成后孔洞仍存在，封装性能差。
为解决上述问题，本申请实施例提供了一种显示面板、显示装置及显示面板的制备方法，以下将结合附图对显示面板、显示装置及显示面板的制备方法的各实施例进行说明。
本申请实施例提供一种显示面板，该显示面板可以是有机发光二极管(Organic Light Emitting Diode，OLED)显示面板。
请一并参阅图1至图3，图1是本申请实施例提供的一种显示面板的俯视示意图；图2是图1中B-B处的剖视图；图3是图2的局部放大图。
如图1至图3所示，本申请第一方面实施例提供一种显示面板10，显示面板10包括：基板100；垫高层300，位于基板100上，垫高层300包括第一子部310和位于第一子部310朝向隔离空间330的第二子部320，第一子部310在基板100的正投影面积大于第二子部320在基板100的正投影面积，垫高层300围合形成隔离空间330，垫高层300朝向隔离空间330的侧壁凹陷形成有凹槽340；发光层400，包括位于隔离空间330的发光单元410；封装层500，位于发光层400远离基板100的一侧，封装层500包括层叠设置的第一封装部510和第二封装部520，至少部分第一封装部510位于凹槽340，第二封装部520位于第一封装部510背离基板100的一侧。
根据本申请实施例的显示面板10，显示面板10包括基板100、设置于基板100的垫高层300、发光层400和位于发光层400远离基板100的一侧的封装层500。第二子部320位于第一子部310朝向基板100的一侧，且第一子部310在基板100上的正投影面积大于第二子部320在基板100上的正投影面积，这就会使得至少部分第一子部310悬空设置，即第二子部320相对于第一子部310内凹形成凹槽340。在制备第一封装部510时，第一封装部510被垫高层300隔断并沉积在隔离空间330内，至少部分第一封装部510位于凹槽340内，以包覆第二子部320朝向隔离空间330的侧面。然后在第一封装部510背离基板100的一侧制备第二封装部520，第二封装部520整面制备，具有较好的包覆性，进一步提高封装层500的整体封装性能。第一封装部510和第二封装部520分步制备，第一封装部510能够较好包覆第二子部320，能够改善一次性以同种材料制备厚度较厚的封装层时，容易使得封装层500与垫高层300之间形成孔洞，导致封装层500封装性能降低的问题。
可选的，垫高层300包括隔离结构，隔离结构用于在制备发光层400时，将发光层400隔断以形成相互间隔的发光单元410。
可选的，显示面板10包括像素定义层200，像素定义层200位于基板100上，像素定义层200包括像素限定部210、由像素限定部210围合形成的像素开口220，至少部分像素电极800由像素开口220露出，像素开口220用于设置发光单元410以实现显示面板10发光，像素限定部210用于限定显示面板10的发光区域。在一些可选的实施例中，第一封装部510的厚度小于第二封装部520的厚度。
在这些可选的实施例中，第一封装部510的厚度较小，使得第一封装部510得到绕射性更好，当制备第一封装部510时，第一封装部510在凹槽340内与垫高层300之间贴合更加紧密，减少孔洞产生的可能性。第二封装部520厚度较厚，具有较好的包覆性，能够提升封装层500的整体封装性能。可选的，第一封装部510包括氧化硅或者氮氧化硅，氧化硅或者氮氧化硅材料能够提高显示面板10的光学性能。
可选的，第二封装部520包括氮化硅，具有较好的包覆性，提高封装性能。
可选的，显示面板10还包括像素定义层200，像素定义层200位于基板100上，像素定义层200包括像素限定部210和由像素限定部210围合形成的像素开口220，至少部分像素电极800由像素开口220露出，像素限定部210定义显示面板10的发光区域，像素开口220用于设置发光单元410，以实现显示面板10的发光显示。
可选的，第一子部310朝向基板100的表面与基板100之间的距离为第一距离，第一封装部510远离基板100的表面与基板100之间的距离为第二距离，第二距离小于或者等于第一距离，即第一封装部510完全位于第一子部310朝向基板100的一侧，提高第一封装部510与第二子部320之间的贴合可靠性，减少孔洞的产生。
请参阅图3，在一些可选的实施例中，显示面板10还包括位于发光单元410背离基板100的一侧的第一电极层600，第一电极层600包括本体部610，本体部610和第二子部320相互连接。
可选的，第二子部320的材料包括金属材料。
在这些可选的实施例中，相邻的两个发光单元410上的本体部610可 以通过第二子部320相互连接，即相邻两个发光单元410上的本体部610可以通过垫高层300电连接为面电极。
在一些可选的实施例中，第一封装部510位于本体部610背离发光单元410的一侧，且第一封装部510位于第一子部310朝向基板100的一侧。
在这些可选的实施例中，第一封装部510位于第一子部310朝向基板100的一侧，用于阻止水汽进入发光单元410，进一步提高封装效果，改善发光单元410被水汽入侵的风险。
如图3所示，在一些可选的实施例中，第一封装部510包括第二覆盖部512，所述第二覆盖部512覆盖第二子部320的侧表面。具体的，所述第一封装部510还可以包括第一覆盖部511，第一覆盖部511覆盖本体部610背离发光单元410的表面；第二覆盖部512，连接于第一覆盖部511的周侧。
在这些可选的实施例中，第一覆盖部511用于封装本体部610和发光单元410，第二覆盖部512覆盖第二子部320的侧表面，使得在制备第二封装部520时，第二封装部520覆盖在第一封装部510背离基板100的一侧，避免因凹槽的槽深过深、封装层500在第二子部320侧面形成孔洞，降低封装性能。
可选的，第一封装部510还包括第三覆盖部513，连接于第二覆盖部512的周侧并覆盖第一子部310朝向基板100的表面。当第二封装部520沉积时，顺着第一子部310侧面和第三覆盖513部向下沉积，减少产生孔洞的可能，提高封装性能。
在一些可选的实施例中，显示面板10还包括滤光单元，滤光单元900位于第一电极层600的本体部610与第一封装部510之间，滤光单元900的折射率为n0、第一封装部510的折射率为n1、第二封装部520的折射率为n2满足如下关系式：
在这些可选的实施例中，当滤光单元900的折射率为n0、第一封装部510的折射率为n1、第二封装部520的折射率为n2满足上述关系式时，发光单元410的出光效率最高。
在一些可选的实施例中，第二封装部520至少部分位于隔离空间330内。具体的，可以是所述第二封装部520完全位于隔离空间330内，也可以是所述第二封装部520包括一体设置的第一分部521和第二分部522，第一分部521位于隔离空间330内，第二分部522位于垫高层301背离基板100的表面。
在这些可选的实施例中，第一分部521填充于隔离空间330，进一步提高隔离空间330内的封装效果，且第一分部521沉积在第一封装部510背离基板100的一侧，避免封装层500在第二子部320侧面形成孔洞，降低封装性能。第二分部522位于第一子部310背离基板100的一侧，覆盖垫高层300和第一子部310，进一步提高封装层500的封装性能。
可选的，第一封装部510的厚度小于第二封装部520的厚度。当第一封装部510沉积在隔离空间330内并刻蚀完后，在第一封装部510背离基板100的一侧沉积第二封装部520，由于第一封装部510厚度较小，第二封装部520沉积后，封装层500在第二子部320周侧不会产生孔洞，封装性能提高。
在一些可选的实施例中，第一封装部510的厚度范围为0.1μm-0.5μm。
在这些可选的实施例中，第一封装部510的厚度大于或等于0.1μm，避免第一封装部510因厚度过小，沉积的第二封装部520厚度较大，第二封装部520沉积后，在第二子部320周侧第二封装部520会产生孔洞，降低封装性能。第一封装部510的厚度小于或等于0.5μm，避免第一封装部510因厚度过大，第一封装部510沉积后，在第二子部320周侧第一封装部510会产生孔洞，降低封装性能。
请继续参阅图2，在一些可选的实施例中，封装层500还包括第三有机封装部530，第三有机封装部530位于第二封装部520远离基板100的一侧，显示面板10还包括显示区AA和围绕显示区AA设置的非显示区NA，非显示区NA包括阻挡部710，阻挡部710围绕显示区AA设置，第三有机封装部530位于阻挡部710的围合区域内。
在这些可选的实施例中，第三有机封部530被阻挡部阻隔，能够改善水汽由非显示区NA至显示区AA从而影响显示区AA有机材料层的性能 等问题，能够提高显示面板10的密封性能。
在一些可选的实施例中，封装层500还包括第四无机封装部540，第四无机封装部540位于第三有机封装部530远离基板100的一侧。
在这些可选的实施例中，第四无机封装部540覆盖第三有机封装部530，进一步加强封装层500的封装性能。
可选的，第三有机封装部530为一体设置。
可选的，第四无机封装部540为一体设置。
可选的，第一封装部510和第二封装部520在基板100的正投影位于第三有机封装部530在基板100的正投影之内。
可选的，第三有机封装部530在基板100的正投影位于第四无机封装部540在基板100的正投影之内。
在这些可选的实施例中，第三有机封装部530一体设置，第四无机封装部540一体设置，一方面，封装性能更好，另一方面，便于第三有机封装层500和第四无机封装层500的制备。第二封装部520将第一封装部510完全覆盖，第三有机封装部530将第二封装部520完全覆盖，第四无机封装部540将第三有机封装部530完全覆盖，进一步提高封装层500的封装性能。
显示面板10具有长度方向、宽度方向和厚度方向。阻挡部710的形状设置有多种，例如阻挡部710可以沿长度方向延伸呈条状并位于显示区AA在宽度方向上的一侧，或者，阻挡部710可以沿宽度方向延伸呈条状并位于显示区AA在长度方向上的一侧。
在另一些实施例中，阻挡部710环绕显示区AA呈封闭环状。
在这些可选的实施例中，阻挡部710呈环状设置，使得有机材料层能够在显示区AA周侧的不同位置断裂，更好的改善水汽蔓延至显示区AA的问题，能够提高显示面板10的密封性能。
阻挡部710的个数设置方式有多种，阻挡部710的个数可以为一个。
或者，阻挡部710的个数为两个以上，两个以上的阻挡部710在远离显示区AA的方向上间隔分布。设置多个阻挡部710能够进一步提高显示面板10的密封效果。
基板100的设置方式有多种，例如基板100可以为阵列基板，基板100包括衬底和设置于衬底的驱动电路层，驱动电路层可以位于显示区AA，阻挡部710可以直接形成于衬底上。
可选的，显示面板10还包括平坦化层700，像素电极800设置于平坦化层700和像素定义层200之间。阻挡部710可以与平坦化层700同层同材料设置，以进一步简化显示面板10的制备工艺，提高显示面板10的制备效率。
可选的，在上述任一实施例中，发光单元410包括第一发光单元411、第二发光单元412和第三发光单元413，第一发光单元411、第二发光单元412和第三发光单元413分别为红色发光单元、绿色发光单元及蓝色发光单元，以实现显示面板10的彩色化显示。
本申请第二方面的实施例还提供一种显示装置，包括上述任一第一方面实施例的显示面板10。由于本申请第二方面实施例提供的显示装置包括上述第一方面任一实施例的显示面板10，因此本申请第二方面实施例提供的显示装置具有上述第一方面任一实施例的显示面板10具有的有益效果，在此不再赘述。
本申请实施例中的显示装置包括但不限于手机、个人数字助理(Personal Digital Assistant，简称：PDA)、平板电脑、电子书、电视机、门禁、智能固定电话、控制台等具有显示功能的设备。
请参阅图4，图4是本申请实施例提供的一种显示面板的制备方法流程示意图。
本申请第三方面的实施例还提供一种显示面板10的制备方法，显示面板10可以为上述任一第一方面实施例提供的显示面板10，请一并参阅图1至图4，制备方法包括：
步骤S01：在基板上制备垫高层，垫高层包括第一子部和位于第一子部朝向基板的第二子部，第一子部在基板的正投影面积大于第二子部在基板的正投影面积，垫高层围合形成隔离空间，垫高层朝向隔离空间的侧壁凹陷形成凹槽。
步骤S02：在基板上制备发光层和封装层，发光层包括位于隔离空间 的发光单元，封装层包括层叠设置的第一封装部和第二封装部，第一封装部位于隔离空间，第二封装部位于第一封装部背离基板的一侧。
根据本申请第三方面实施例提供的制备方法，通过步骤S01制备基板100和垫高层300。垫高层300包括第一子部310和位于第一子部310朝向基板100的第二子部320。通过步骤S02制备发光层400和封装层500。第二子部320位于第一子部310朝向基板100的一侧，且第一子部310在基板100上的正投影面积大于第二子部320在基板100上的正投影面积，这就会使得至少部分第一子部310悬空设置，即第二子部320相对于第一子部310内凹形成凹槽340。在制备第一封装部510时，第一封装部510被垫高层300隔断并沉积在隔离空间330内，至少部分第一封装部510位于凹槽340内，以包覆第二子部320朝向隔离空间330的侧面。然后在第一封装部510背离基板100的一侧制备第二封装部520，第二封装部520整面制备，具有较好的包覆性，进一步提高封装层500的整体封装性能。第一封装部510和第二封装部520分步制备，第一封装部510能够较好包覆第二子部320，能够改善一次性以同种材料制备厚度较厚的封装层时，容易使得封装层500与垫高层300之间形成孔洞，导致封装层500封装性能降低的问题。
请参阅图5，图5是本申请实施例提供的一种显示面板的制备方法中某步骤的流程示意图
在一些可选的实施例中，方法还包括：
在基板100上制备像素定义层200，像素定义层200包括像素定义部210、由像素定义部210围合形成的像素开口220，至少部分像素电极800由像素开口220露出，像素开口220包括第一像素开口221、第二像素开口222和第三像素开口223，发光单元410包括位于第一像素开口221内的第一发光单元411、位于第二像素开口222内的第二发光单元412和位于第三像素开口223内的第三发光单元413，第一封装部510包括位于第一发光单元411背离基板100一侧的第一封装子部501、位于第二发光单元412背离基板100一侧的第二封装子部502和位于第三发光单元413背离基板100一侧的第三封装子部503，步骤S02还包括：
步骤S021：在像素定义层200背离基板100的一侧设置第一发光材料层及第一封装子材料层，并对第一发光材料层和第一封装子材料层进行图案化处理形成第一发光单元411和第一封装子部501。
步骤S022：在像素定义层200背离基板100的一侧继续设置第二发光材料层及第二封装子材料层，并对第二发光材料层和第二封装子材料层进行图案化处理形成第二发光单元412和第二封装子部502。具
步骤S023：在像素定义层200背离基板100的一侧继续设置第三发光材料层及第三封装子材料层，并对第三发光材料层和第三封装子材料层进行图案化处理形成第一发光单元411和第一封装子部501。
具体的，在图案化处理过程中，位于所述第一子部310侧壁的第一封装子材料层被刻蚀掉，减少所述第二封装部在沉积的过程中，实际凹槽的槽深。
步骤S024：在第一封装子部501、第二封装子部502、第三封装子部503和像素定义层200上制备第二封装部520。
在这些可选的实施例中，由于第一封装子部501、第二封装子部502、第三封装子部503和第二封装部520分别制备，第二封装部520沉积在第一封装子部501、第二封装子部502、第三封装子部503背离基板100的一侧，第一封装部510和第二封装部520分开制备，避免封装层500厚度过厚形成孔洞，导致封装性能降低的问题。
下面以图2的实施例为例，并结合图6至图15对本申请实施例提供的制备方法进行举例说明。本申请实施例提供的显示面板10的制备方法包括：
步骤一，如图6所示，在基板100上设置平坦化材料层，对平坦化材料层进行图案化处理形成平坦化层700和阻挡部710。
步骤二，如图7所示，在平坦化层700上制备像素电极800。
步骤三，如图8所示，在基板100上继续设置像素定义材料层，对像素定义材料层进行图案化处理形成位于显示区AA的像素定义层200。
步骤四，如图9所示，基板100上继续设置第二子材料层和第一子材料层，并对第一子材料层和第二子材料层进行图案化处理，形成位于像素限定部210上的第一子部310和第二子部320。
在对第一子材料层和第二子材料层进行图案化处理时，可以分为两步进行，第一步先在第一子材料层背离第二子材料层的一侧设置光刻胶，利用光刻胶对第一子材料层背离第二子材料层进行正刻，形成第一子部310；第二步继续对第二子材料层进行侧刻形成第二子部320。
步骤五，如图10所示，在基板100上继续设置第一发光材料层、第一电极材料层和第一封装子材料层，并同时对第一发光材料层、第一电极材料层和第一封装子材料层进行图案化处理形成第一发光单元411、本体部610和第一封装子部501。
具体的，所述在基板100上继续设置第一发光材料层、第一电极材料层和第一封装子材料层，并同时对第一发光材料层、第一电极材料层和第一封装子材料层进行图案化处理形成第一发光单元411、本体部610和第一封装子部501包括：
在基板100上依次沉积第一发光材料、第一电极材料和第一封装子材料，在第一像素开口、第二像素开口及第三像素开口内均形成第一发光材料层、第一电极材料层和第一封装子材料层；
在所述第一像素开口的第一封装子材料层背离所述基板100的一侧形成光刻胶；
刻蚀去除第二像素开口和第三像素开口内的第一发光材料层、第一电极材料层和第一封装子材料层，去除第光刻胶，形成第一发光单元411、本体部610和第一封装子部501。
步骤六，如图11所示，在基板100上继续设置第二发光材料层、第二电极材料层和第二封装子材料层，并同时对第二发光材料层、第二电极材料层和第二封装子材料层进行图案化处理形成第二发光单元412、本体部610和第二封装子部502。
具体的，在基板100上继续设置第二发光材料层、第二电极材料层和第二封装子材料层，并同时对第二发光材料层、第二电极材料层和第二封装子材料层进行图案化处理形成第二发光单元412、本体部610和第二封装子部502包括：
在基板100上依次沉积第二发光材料、第二电极材料和第二封装子材 料，在第二像素开口、第三像素开口以及第一封装子部201背离所述基板100的一侧均形成对第二发光材料层、第二电极材料层和第二封装子材料层；
在第二像素开口的第二封装子材料层背离基板100的一侧形成光刻胶；
刻蚀去掉第一封装子部远离基板100一侧的第二发光材料层、第二电极材料层和第二封装子材料层以及第三像素开口内的第二发光材料层、第二电极材料层和第二封装子材料层，去除光刻胶，形成第二发光单元412、本体部610和第二封装子部502。
步骤七，如图12所示，在基板100上形成第三发光材料层、第三电极材料层和第三封装子材料层，并同时对第三发光材料层、第三电极材料层和第三封装子材料层进行图案化处理形成第三发光单元413、本体部610和第三封装子部503。
具体的，在基板100上形成第三发光材料层、第三电极材料层和第三封装子材料层，并同时对第三发光材料层、第三电极材料层和第三封装子材料层进行图案化处理形成第三发光单元413、本体部610和第三封装子部503包括：
在基板100上依次沉积第三发光材料、第三电极材料和第三封装子材料，在第一封装子部501和第二封装子部502远离基板100的一侧以及所述第三像素开口内形成第三发光材料层、第三电极材料层和第三封装子材料层；
在所述第三像素开口的第三封装子材料层远离基板100的一侧形成光刻胶；
刻蚀去掉第一封装子部远离基板100一侧的第三发光材料层、第三电极材料层和第三封装子材料层以及第二封装子部远离基板100一侧的第三发光材料层、第三电极材料层和第三封装子材料层，去除光刻胶，形成第三发光单元413、本体部610和第三封装子部503。
步骤八，如图13所示，在第一封装子部501、第二封装子部502、第三封装子部503和像素定义层200上制备第二封装部520。需要说明的是，第一封装子部501、第二封装子部502、第三封装子部503分别对应的第二 封装部520也可以分步骤形成，即在步骤六以后、步骤七之前形成第一封装子部501上方的第二封装部，在步骤七以后、步骤八以前形成第二封装子部上方的第二封装部520，在步骤八以后形成第三封装子部对应的第二封装部520。
步骤九，如图14所示，在阻挡部710围合形成的区域内设置有第三有机封装部530。
步骤十，如图15所示，在基板100上继续设置第四无机封装部540。
在本申请实施例中，由于第一封装子部501、第二封装子部502、第三封装子部503和第二封装部520分别制备，第二封装部520沉积在第一封装子部501、第二封装子部502、第三封装子部503背离基板100的一侧，第一封装部510和第二封装部520分开制备，避免封装层500厚度过厚形成孔洞，导致封装性能降低的问题。
本领域技术人员应能理解，上述实施例均是示例性而非限制性的。在不同实施例中出现的不同技术特征可以进行组合，以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上，应能理解并实现所揭示的实施例的其他变化的实施例。在权利要求书中，术语“包括”并不排除其他装置或步骤；物品没有使用数量词修饰时旨在包括一个/种或多个/种物品，并可以与“一个/种或多个/种物品”互换使用；术语“第一”、“第二”用于标示名称而非用于表示任何特定的顺序。权利要求中的任何附图标记均不应被理解为对保护范围的限制。权利要求中出现的多个部分的功能可以由一个单独的硬件或软件模块来实现。某些技术特征出现在不同的从属权利要求中并不意味着不能将这些技术特征进行组合以取得有益效果。

Claims (20)

  1. 一种显示面板，所述显示面板包括：
    基板；
    垫高层，位于所述基板上，所述垫高层包括第一子部和位于所述第一子部朝向所述基板的第二子部，所述第一子部在所述基板的正投影面积大于所述第二子部在所述基板的正投影面积，所述垫高层围合形成隔离空间，所述垫高层朝向所述隔离空间的侧壁凹陷形成凹槽；
    发光层，包括位于所述隔离空间的发光单元；
    封装层，位于所述发光层远离所述基板的一侧，所述封装层包括层叠设置的第一封装部和第二封装部，至少部分所述第一封装部位于所述凹槽，所述第二封装部位于所述第一封装部背离所述基板的一侧。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    像素定义层，位于所述基板上，所述像素定义层包括像素限定部、由所述像素限定部围合形成的像素开口，至少部分像素电极由所述像素开口露出。
  3. 根据权利要求1所述的显示面板，其中，所述第一封装部厚度小于所述第二封装部的厚度。
  4. 根据权利要求1所述的显示面板，其中，所述第一封装部包括氧化硅或者氮氧化硅。
  5. 根据权利要求1所述的显示面板，其中，所述第二封装部包括氮化硅。
  6. 根据权利要求1所述的显示面板，其中，所述第一子部朝向所述基板的表面与所述基板之间的距离为第一距离，所述第一封装部远离所述基板的表面与所述基板之间的距离为第二距离，所述第二距离小于或者等于所述第一距离。
  7. 根据权利要求1所述的显示面板，其中，还包括位于所述发光单元背离所述基板的一侧的第一电极层，所述第一电极层包括本体部，所述本体部和所述第二子部相互连接。
  8. 根据权利要求7所述的显示面板，其中，所述第一封装部位于所述本体部背离所述发光单元的一侧，且所述第一封装部位于所述第一子部朝向所述基板的一侧。
  9. 根据权利要求7所述的显示面板，其中，所述第一封装部包括：
    第二覆盖部，覆盖所述第二子部的侧表面。
  10. 根据权利要求9所述的显示面板，其中，所述第一封装部还包括第一覆盖部，所述第一覆盖部覆盖所述本体部背离所述发光单元的表面，所述第二覆盖部连接于所述第一覆盖部的周侧。
  11. 根据权利要求9所述的显示面板，其中，所述第一封装部还包括第三覆盖部，连接于所述第二覆盖部的周侧并覆盖所述第一子部朝向所述基板的表面。
  12. 根据权利要求7所述的显示面板，其中，所述显示面板还包括滤光单元，所述滤光单元位于所述第一电极层的本体部与所述第一封装部之间，所述滤光单元的折射率为n0、所述第一封装部的折射率为n1、所述第二封装部的折射率为n2满足如下关系式：
  13. 根据权利要求1所述的显示面板，其中，所述第二封装部至少部分位于所述隔离空间内。
  14. 根据权利要求1所述的显示面板，其中，所述第二封装部包括一体设置的第一分部和第二分部，所述第一分部位于所述隔离空间内，所述第二分部位于所述垫高层背离所述基板的表面。
  15. 根据权利要求1所述的显示面板，其中，所述第一封装部的厚度小于所述第二封装部的厚度。
  16. 根据权利要求1所述的显示面板，其中，所述第一封装部的厚度范围为0.1μm-0.5μm。
  17. 根据权利要求1所述的显示面板，其中，所述封装层还包括第三有机封装部，所述第三有机封装部位于所述第二封装部远离所述基板的一侧，所述显示面板还包括显示区和围绕所述显示区设置的非显示区，所述非显示区包括阻挡部，所述阻挡部围绕所述显示区设置，所述第三有机封装部 位于所述阻挡部的围合区域内。
  18. 一种显示装置，包括权利要求1-17任一项所述的显示面板。
  19. 一种显示面板的制备方法，包括：
    在基板上制备垫高层，所述垫高层包括第一子部和位于所述第一子部朝向所述基板的第二子部，所述第一子部在所述基板的正投影面积大于所述第二子部在所述基板的正投影面积，所述垫高层围合形成隔离空间，所述垫高层朝向所述隔离空间的侧壁凹陷形成凹槽；
    在所述基板上制备发光层和封装层，所述发光层包括位于所述隔离空间的发光单元，所述封装层包括层叠设置的第一封装部和第二封装部，至少部分所述第一封装部位于所述凹槽，所述第二封装部位于所述第一封装部背离所述基板的一侧。
  20. 根据权利要求19所述的制备方法，其中，所述方法还包括：
    在所述基板上制备像素定义层，所述像素定义层包括像素定义部、由所述像素定义部围合形成的像素开口，至少部分像素电极由所述像素开口露出，所述像素开口包括第一像素开口、第二像素开口和第三像素开口，所述发光单元包括位于所述第一像素开口内的第一发光单元、位于所述第二像素开口内的第二发光单元和位于所述第三像素开口内的第三发光单元，所述第一封装部包括位于所述第一发光单元背离所述基板一侧的第一封装子部、位于所述第二发光单元背离所述基板一侧的所述第二封装子部和位于所述第三发光单元背离所述基板一侧的第三封装子部；
    在所述基板上制备发光层和封装层的步骤中，所述方法还包括：
    在所述像素定义层背离所述基板的一侧设置第一发光材料层及第一封装子材料层，并对所述第一发光材料层和所述第一封装子材料层进行图案化处理形成第一发光单元和第一封装子部；
    在所述像素定义层背离所述基板的一侧继续设置第二发光材料层及第二封装子材料层，并对所述第二发光材料层和所述第二封装子材料层进行图案化处理形成第二发光单元和第二封装子部；
    在所述像素定义层背离所述基板的一侧继续设置第三发光材料层及第三封装子材料层，并对所述第三发光材料层和所述第三封装子材料层进行 图案化处理形成第一发光单元和第一封装子部；
    在所述第一封装子部、所述第二封装子部、所述第三封装子部和所述像素定义层上制备第二封装部。
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