WO2024021596A1 - Dispositif d'affichage à diodes électroluminescentes organiques et procédé de fabrication - Google Patents

Dispositif d'affichage à diodes électroluminescentes organiques et procédé de fabrication Download PDF

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Publication number
WO2024021596A1
WO2024021596A1 PCT/CN2023/078141 CN2023078141W WO2024021596A1 WO 2024021596 A1 WO2024021596 A1 WO 2024021596A1 CN 2023078141 W CN2023078141 W CN 2023078141W WO 2024021596 A1 WO2024021596 A1 WO 2024021596A1
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Prior art keywords
layer
emitting diode
organic light
display device
porous
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PCT/CN2023/078141
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English (en)
Chinese (zh)
Inventor
夏浩
陈俊
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武汉华星光电半导体显示技术有限公司
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Publication of WO2024021596A1 publication Critical patent/WO2024021596A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display technology, and in particular, to an organic light-emitting diode display device and a manufacturing method thereof.
  • OLED display technology is widely used due to its advantages of self-illumination, wide viewing angle, wide color gamut, foldability and bendability.
  • a known OLED display device includes a display panel and a Super Clean Foam (SCF) composite film located on the backlight side of the display panel.
  • SCF composite film can buffer the stress acting on the display panel, dissipate the heat generated when the display panel is working, and provide a certain protective effect on the display panel.
  • a known SCF composite film includes an adhesive layer, a buffer layer and a heat dissipation layer that are stacked in sequence.
  • the material of the adhesive layer is Embo glue, which is a reticulated glue that has the function of bonding and fitting exhaust gas.
  • the material of the buffer layer is foam, which plays a buffering role.
  • the material of the heat dissipation layer is copper foil, which has the functions of conduction, heat dissipation and shielding.
  • the manufacturing method of this SCF composite film is to separately manufacture Embo glue, foam and copper foil, and then laminate through the cutting factory lamination process. This kind of SCF composite membrane requires many processing steps, resulting in high cost and large thickness.
  • the present application provides an organic light-emitting diode display device and a manufacturing method thereof that can reduce manufacturing processes, reduce costs, and reduce thickness.
  • This application provides an organic light-emitting diode display device, which includes:
  • the display panel includes a first planar part, a second planar part and a bent part.
  • the first planar part is opposite to the second planar part.
  • the bent part is connected to the first planar part and the bent part. second plane part;
  • a first back plate is provided on the surface of the first planar part facing the second planar part;
  • the second back plate is disposed on the surface of the second planar part facing the first planar part;
  • a composite film disposed between the first backing plate and the second backing plate
  • the composite film includes a porous glue layer, cells are formed in the porous glue layer, and the porous glue layer is bonded to the first backing plate.
  • expanded particles are dispersed in the porous glue layer, and the cells are formed inside the expanded particles.
  • the inside of the cells is in a vacuum state or the cells are filled with gas.
  • the porous glue layer also contains a foaming agent.
  • the composite membrane further includes conductive particles dispersed in the porous glue layer.
  • the material of the porous glue layer includes acrylic or polyurethane, and the material of the conductive particles is selected from at least one of Al, Ag, Ni and Cu.
  • the porous glue layer includes opposing first and second surfaces, the first surface has a mesh pattern, the composite film further includes a conductive layer, and the conductive layer directly Disposed on the second surface of the porous glue layer, the material of the conductive layer includes conductive silver paste.
  • the porous adhesive layer includes opposing first and second surfaces, the first surface has a mesh pattern, and the composite membrane further includes a support layer and a conductive layer, The support layer is disposed on the second surface of the porous glue layer, and the conductive layer is disposed on the surface of the support layer away from the porous glue layer.
  • the present application provides a method for manufacturing an organic light-emitting diode display device as described above, which includes the following steps:
  • the first back plate and the second back plate are formed at intervals on the surface of the display panel
  • the manufacturing method of the composite membrane includes the following steps:
  • the slurry includes a matrix material and a solvent, and use the slurry to form a slurry layer on the substrate;
  • the slurry layer is foamed to form the porous glue layer.
  • the matrix material includes foamed particles
  • foaming the slurry layer to form the porous glue layer includes the steps:
  • High-temperature heating causes the expanded particles to expand and cells are formed inside the expanded particles.
  • the expanded particles are expandable microspheres, and the inside of the cells is in a vacuum state or the cells are filled with gas.
  • the slurry also contains a foaming agent.
  • the slurry further includes conductive particles, and the conductive particles are dispersed in the porous glue layer.
  • the slurry material includes acrylic or polyurethane
  • the conductive particles are made of at least one material selected from Al, Ag, Ni, and Cu.
  • the substrate is a release film with a mesh pattern
  • the step further includes:
  • a conductive layer is formed on the surface of the porous glue layer away from the substrate.
  • the material of the conductive layer includes conductive silver paste.
  • the substrate is a release film with a mesh pattern
  • the step further includes:
  • a conductive layer is formed on the surface of the support layer away from the porous glue layer.
  • This application also provides an organic light-emitting diode display device, which includes:
  • the display panel includes a first planar part, a second planar part and a bent part.
  • the first planar part is opposite to the second planar part.
  • the bent part is connected to the first planar part and the bent part. second plane part;
  • a first back plate is provided on the surface of the first planar part facing the second planar part;
  • the second back plate is disposed on the surface of the second planar part facing the first planar part;
  • a composite film disposed between the first backing plate and the second backing plate
  • the composite film includes a porous glue layer, cells are formed in the porous glue layer, and the porous glue layer is bonded to the first backing plate,
  • Expanded particles are dispersed in the porous glue layer, and the cells are formed inside the foamed particles.
  • the interior of the cells is in a vacuum state or the cells are filled with gas.
  • the composite membrane further includes conductive particles dispersed in the porous glue layer.
  • the material of the porous glue layer includes acrylic or polyurethane, and the material of the conductive particles is selected from at least one of Al, Ag, Ni and Cu.
  • the porous glue layer includes opposing first and second surfaces, the first surface has a mesh pattern, the composite film further includes a conductive layer, and the conductive layer directly Disposed on the second surface of the porous glue layer, the material of the conductive layer includes conductive silver paste.
  • This application reduces the thickness of the existing SCF composite film layer by integrating the Emo glue layer and foam in the SCF composite film layer to form a porous glue layer, thereby reducing the thickness of the organic light-emitting diode display device, and the porous glue layer It can be formed by foaming the raw materials of the adhesive layer, instead of the prior art process of forming the Emo adhesive layer and foam independently and then laminating them together, thereby reducing process steps and manufacturing costs.
  • FIG. 1 is a schematic structural diagram of an organic light-emitting diode display device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an embodiment of the composite membrane of FIG. 1 .
  • FIG. 3 is a schematic structural diagram of another embodiment of the composite membrane of FIG. 1 .
  • FIG. 4 is a schematic structural diagram of another embodiment of the composite membrane of FIG. 1 .
  • FIG. 5 is a schematic structural diagram of yet another embodiment of the composite membrane of FIG. 1 .
  • FIG. 6 is a schematic diagram of the steps of a method for manufacturing an organic light-emitting diode display device according to an embodiment of the present application.
  • FIG. 7 is a schematic diagram of the steps of manufacturing a composite film in the manufacturing method of the organic light-emitting diode display device of FIG. 6 .
  • the first feature “above” or “below” the second feature may include the first and second features directly, or may include the first and second features not not directly connected but through additional characteristic contact between them.
  • the terms “above”, “above” and “above” a first feature on a second feature include the first feature being directly above and diagonally above the second feature, or simply mean that the first feature is higher in level than the second feature.
  • “Below”, “under” and “under” the first feature is the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature is less horizontally than the second feature.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more features.
  • the organic light-emitting diode display device in the embodiment of the present application can be a mobile phone, a tablet computer, an e-reader, an electronic display screen, a notebook computer, a mobile phone, an augmented reality (AR) ⁇ virtual reality (VR) device, Media players, wearable devices, digital cameras, car navigation systems, etc.
  • the organic light-emitting diode display device may be an active matrix organic light-emitting diode (AMOLED) display device or a passive matrix organic light-emitting diode (PMOLED) display device. .
  • the organic light emitting diode display device includes a display panel, a first backplane, a second backplane and a composite film.
  • the display panel includes a first planar part, a second planar part and a bent part.
  • the first planar part is opposite to the second planar part, and the bent part is connected to the first planar part and the second planar part.
  • the first back plate is disposed on the surface of the first planar part facing the second planar part.
  • the second back plate is disposed on the surface of the second planar part facing the first planar part.
  • the composite film is disposed between the first back plate and the second back plate. Wherein, the composite film includes a porous glue layer, cells are formed in the porous glue layer, and the porous glue layer is bonded to the first backing plate.
  • This application reduces the thickness of the existing SCF composite film layer by integrating the Emo glue layer and foam in the SCF composite film layer to form a porous glue layer, thereby reducing the thickness of the organic light-emitting diode display device and reducing the process steps. , reducing manufacturing costs.
  • the organic light emitting diode display device 1 includes:
  • the display panel 200 includes a first planar part 201, a second planar part 202 and a bent part 203.
  • the first planar part 201 and the second planar part 202 are arranged oppositely.
  • the bent part 203 is connected to the first planar part 201 and the second planar part 202. planar part 202;
  • the first back plate 300 is provided on the surface of the first planar part 201 facing the second planar part 202;
  • the second back plate 400 is disposed on the surface of the second planar portion 202 facing the first planar portion 201;
  • the composite film 100 is disposed between the first back plate 300 and the second back plate 400;
  • a stiffener 500 is provided between the composite film 100 and the second backing plate 400;
  • the porous glue layer 10 is bonded to the first back plate 300 .
  • the composite membrane 100 includes a porous adhesive layer 10 and a conductive layer 20 arranged in a stack.
  • the porous adhesive layer 10 can be textured adhesive.
  • the porous glue layer 10 includes opposite first surfaces 10a and second surfaces 10b.
  • the first surface 10a has a mesh pattern
  • the second surface 10b is a flat surface relative to the first surface 10a.
  • the porous glue layer 10 itself has viscosity
  • the conductive layer 20 is bonded to the second surface 10b of the porous glue layer 10 .
  • the conductive layer can be directly disposed on the second surface 10b.
  • the material of the porous glue layer 10 includes acrylic or polyurethane.
  • the matrix of the porous adhesive layer 10 composed of viscous acrylic or polyurethane plays the function of bonding and adhering to the exhaust gas.
  • Acrylic and polyurethane are used as the base material of the porous adhesive layer 10
  • their foaming strengths are different.
  • Acrylic has higher foaming strength and better cushioning properties.
  • Cells 11 are formed in the porous glue layer 10 .
  • the cells 11 in the porous glue layer 10 provide a buffering function for the porous glue layer 10 to replace the foam in the existing SCF composite membrane 100 layer.
  • the cells 11, also known as micropores are the smallest structural units that make up a single small hole in foam plastic.
  • the small holes are partially or completely surrounded by bubble walls. They are formed by the decomposition of the foaming agent or the mechanical introduction of gas, or the volatilization of volatilization, or the dissolution of soluble substances during the production of foam plastics.
  • the porous glue layer 10 of the present application can be formed in two ways: physical foaming and chemical foaming.
  • physical foaming methods are divided into two types: 1. Filling soluble solid particles or expandable microspheres to form foam; 2. Adding inert gas (such as nitrogen) to the slurry to be foamed.
  • Chemical foaming methods are also divided into two types: thermal decomposition foaming method and reaction foaming method. It should be noted that due to the difficulty in controlling chemical foaming and its high precision, physical foaming is preferred.
  • the cells 11 are formed by physical foaming filled with expandable microspheres. That is, the expanded particles P are dispersed in the porous glue layer 10 , and the cells 11 of the porous glue layer 10 are formed inside the expanded particles P.
  • the expanded particles P are expandable microspheres, and the shell wall materials of the expandable microspheres are mostly thermoplastic acrylic resin, polycarbonate or silicone resin.
  • expandable microspheres are particles below 3 microns before expansion. The expandable microspheres grow up at high temperatures, and the solid expandable microspheres transform into mesoporous materials at high temperatures.
  • cells 11 are formed inside the expandable microspheres, and the interior of the cells 11 is in a vacuum state.
  • the inside of the cells 11 can also be filled with gases such as helium and nitrogen.
  • the particle size of expandable microspheres ranges from 0.1 ⁇ m to 500 ⁇ m.
  • the porous glue layer 10 can be foamed by filling the slurry with foamed particles P that have been internally foamed.
  • the expanded particles P are microspheres having elastic material. The only difference between microspheres with elastic materials and expandable microspheres is the size of the spheres or the material and hardness of the walls.
  • the porous glue layer 10 is formed by filling the slurry with an inert gas.
  • the inert gas is nitrogen.
  • cells 11 are also formed in the porous glue layer 10 , but the cells 11 are filled with inert gas, and there are no expanded particles P in the porous glue layer 10 .
  • chemical foaming is used to release gas through the polymerization reaction or decomposition reaction of the foaming agent, so that the slurry is foamed to form the porous glue layer 10 .
  • the porous adhesive layer 10 may contain a foaming agent.
  • porous glue layer 10 of the present application can also be formed by mixing multiple foaming methods or using multiple foaming methods. This application does not limit this.
  • the material of the conductive layer 20 is selected from at least one of Al, Ag, Ni and Cu.
  • the conductive layer 20 also has heat dissipation and shielding functions.
  • the conductive layer 20 is a conductive silver paste layer or a copper foil layer.
  • the conductive silver paste layer can be formed by coating, so that the surface of the porous adhesive layer 10 has heat dissipation and shielding functions, and at the same time, the thickness of the conductive silver paste layer is smaller, which can further reduce the thickness of the composite film.
  • a support layer is also provided between the conductive layer 20 and the foam.
  • the material of the support layer is polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the Embo glue can be prevented from overflowing.
  • the porous glue layer 10 is foamed and molded, glue overflow can be effectively avoided, so the PET layer can be omitted.
  • PET can also be provided as the supporting layer 30 between the conductive layer 20 and the porous adhesive layer 10 to improve the strength of the composite membrane 100 .
  • Figure 5 is a schematic structural diagram of another embodiment of the composite membrane of the present application.
  • the composite membrane 100 includes a porous adhesive layer 10 .
  • the material of the porous glue layer 10 includes acrylic or polyurethane.
  • the matrix of the porous adhesive layer 10 composed of viscous acrylic or polyurethane plays the function of bonding and adhering to the exhaust gas.
  • acrylic and polyurethane are used as the base material of the porous adhesive layer 10, their foaming strengths are different. Acrylic has higher foaming strength and better cushioning properties.
  • Cells 11 are formed in the porous adhesive layer 10 .
  • the cells 11 in the porous glue layer 10 provide a buffering function for the porous glue layer 10 to replace the foam in the existing SCF composite membrane 100 layer.
  • the composite membrane 100 also includes conductive particles 12 dispersed in the porous glue layer 10 .
  • the material of the conductive particles 12 is selected from at least one kind selected from the group consisting of Al, Ag, Ni and Cu.
  • the conductive particles 12 are added to the slurry of the porous glue layer 10 in advance, and are evenly distributed in the slurry through a stirring process.
  • the conductive particles 12 can not only conduct electricity, but also function as heat dissipation and shielding.
  • the composite film 100 integrates Embo glue, foam and conductive layer (heat dissipation layer) into a whole, further reducing the thickness of the composite film 100 and eliminating the lamination step, further reducing the manufacturing process and reducing the cost. cost.
  • This application also provides a method for manufacturing an organic light-emitting diode display device as described above, which includes the following steps:
  • the manufacturing method of the composite membrane includes the following steps:
  • the slurry includes a matrix material and a solvent, and use the slurry to form a slurry layer on the substrate.
  • the substrate may be a release film with a textured pattern to form a textured porous adhesive layer.
  • the substrate may also be a substrate without a mesh pattern. Since the slurry with low modulus and strong fluidity is easy to form, a release film with a mesh pattern can be attached after molding. For a slurry with a high modulus and weak fluidity, a release film with a mesh pattern can be attached first. membrane.
  • the slurry layer is formed by coating.
  • the slurry also includes acrylic or polyurethane as the base material of the porous glue layer.
  • the matrix material in the slurry can be synthesized by known means.
  • the solvent in the slurry is used to dissolve the matrix material to facilitate the formation of a slurry layer on the substrate.
  • the solvent can be selected according to the subsequent volatilization temperature. If the solvent volatilization temperature is high, a high boiling point solvent can be used. If the solvent volatilization temperature is low, a low boiling point solvent can be used. In order to facilitate solvent volatilization, low boiling point solvents are preferred, such as methanol, ethanol or hydrocarbon solvents.
  • the slurry also includes expanded particles, that is, soluble solid particles or expandable microspheres.
  • the foamed particles may not be included in the slurry.
  • a foaming agent needs to be included in the slurry.
  • conductive particles may also be included in the slurry.
  • the material of the conductive particles is at least one selected from the group consisting of Al, Ag, Ni and Cu.
  • the buffering performance of the porous adhesive layer is controlled by the pore size, density, molecular weight of the slurry and other parameters of the foamed particles so that it has specific buffering performance requirements.
  • the thickness of the slurry layer is determined by the thickness of the porous glue layer finally formed. Due to the subsequent baking to remove the solvent, the thickness of the slurry layer formed is greater than the thickness of the porous glue layer. For example, if you want to manufacture a porous glue The thickness of the layer is 100 microns, then the thickness of the slurry layer needs to be 300 microns.
  • the slurry may also contain other additives such as cross-linking agents.
  • step 202 the substrate formed with the slurry layer is placed in an oven for pre-baking to remove the solvent.
  • the pre-baking temperature can be 80 degrees Celsius to 100 degrees Celsius.
  • step 203 the conditions for foaming the slurry to form a porous glue layer are different according to the foaming method.
  • high-temperature heating causes the expanded particles to expand and cells are formed inside the expanded particles.
  • inert gas such as nitrogen
  • inert gas needs to be introduced into the slurry during the foaming process.
  • the foaming agent is reacted at high temperature and stirred to release gas to form a porous adhesive layer.
  • the conductive particles are evenly distributed in the porous glue layer by stirring.
  • step 203 the following steps are also included after step 203:
  • the conductive layer is made of at least one material selected from the group consisting of Al, Ag, Ni and Cu. Specifically, conductive silver paste can be coated on the surface of the porous adhesive layer away from the substrate to form a conductive layer, or copper foil can be bonded on the surface of the porous adhesive layer away from the substrate to form the conductive layer.
  • step 203 the following steps are also included after step 203:
  • step 203 the following steps are also included after step 203:
  • the conductive layer is made of at least one material selected from the group consisting of Al, Ag, Ni and Cu. Specifically, conductive silver paste can be coated on the surface of the porous adhesive layer away from the substrate to form a conductive layer, or copper foil can be bonded on the surface of the porous adhesive layer away from the substrate to form the conductive layer.
  • step 203 when the substrate is a substrate without a mesh pattern, the following steps are included after step 203:
  • the manufacturing method of the composite membrane of the present application includes the following steps:
  • the slurry includes a matrix material and a solvent, and use the slurry to form a slurry layer on the substrate.
  • the substrate is a release film with a reticulated pattern to form a reticulated porous adhesive layer. Coat the slurry on the substrate to form a slurry layer.
  • the slurry consisted of acrylic acid and the solvent was methanol.
  • the slurry also includes expandable microspheres as expanded particles and Al as conductive particles.
  • the thickness of the slurry layer is 300 microns.
  • step 302 the substrate with the slurry layer formed in it is placed in an oven for pre-baking to remove the solvent.
  • the pre-baking temperature can be 80 degrees Celsius.
  • step 303 the substrate with the slurry layer is placed at a high temperature of 150 degrees Celsius to expand and serve the expandable microspheres to obtain a foamed and sticky porous glue layer.
  • the conductive particles are evenly distributed in the porous glue layer by stirring. middle.
  • the composite membrane provided in this application is manufactured by adding foamed particles to the Embo glue slurry. After the slurry is coated on the substrate, the Embo glue is foamed to form a porous glue layer, thereby obtaining a porous Embo glue with buffering function.
  • the process is further simplified and the cost is reduced.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un dispositif d'affichage à diodes électroluminescentes organiques et un procédé de fabrication associé. Le dispositif d'affichage à diodes électroluminescentes organiques comprend un panneau d'affichage, une première plaque arrière, une seconde plaque arrière et un film composite. La première plaque arrière est disposée sur une première partie plane du panneau d'affichage, la seconde plaque arrière est disposée sur une seconde partie plane du panneau d'affichage, et le film composite est disposé entre la première plaque arrière et la seconde plaque arrière. Le film composite comprend une couche adhésive poreuse, des trous de mousse étant formés dans la couche adhésive poreuse, et la couche adhésive poreuse étant liée à la première plaque arrière.
PCT/CN2023/078141 2022-07-26 2023-02-24 Dispositif d'affichage à diodes électroluminescentes organiques et procédé de fabrication WO2024021596A1 (fr)

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CN202210882291.6A CN115148938A (zh) 2022-07-26 2022-07-26 有机发光二极管显示装置及其制造方法
CN202210882291.6 2022-07-26

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CN115148938A (zh) * 2022-07-26 2022-10-04 武汉华星光电半导体显示技术有限公司 有机发光二极管显示装置及其制造方法

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CN111028682A (zh) * 2019-11-21 2020-04-17 武汉华星光电半导体显示技术有限公司 柔性显示装置
CN113990915A (zh) * 2021-11-03 2022-01-28 合肥维信诺科技有限公司 缓冲膜、缓冲膜的制备方法和显示面板
CN114093274A (zh) * 2021-12-09 2022-02-25 武汉华星光电半导体显示技术有限公司 显示装置及显示终端
CN115148938A (zh) * 2022-07-26 2022-10-04 武汉华星光电半导体显示技术有限公司 有机发光二极管显示装置及其制造方法

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