WO2024014228A1 - サーマルプリントヘッド、サーマルプリンタおよびサーマルプリントヘッドの製造方法 - Google Patents

サーマルプリントヘッド、サーマルプリンタおよびサーマルプリントヘッドの製造方法 Download PDF

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Publication number
WO2024014228A1
WO2024014228A1 PCT/JP2023/022308 JP2023022308W WO2024014228A1 WO 2024014228 A1 WO2024014228 A1 WO 2024014228A1 JP 2023022308 W JP2023022308 W JP 2023022308W WO 2024014228 A1 WO2024014228 A1 WO 2024014228A1
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WIPO (PCT)
Prior art keywords
print head
thermal print
scanning direction
layer
head according
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2023/022308
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English (en)
French (fr)
Japanese (ja)
Inventor
智士 木本
明良 藤田
吾郎 仲谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Priority to JP2024533598A priority Critical patent/JPWO2024014228A1/ja
Publication of WO2024014228A1 publication Critical patent/WO2024014228A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Definitions

  • the present disclosure relates to a thermal print head, a thermal printer, and a method for manufacturing a thermal print head.
  • Patent Document 1 discloses an example of a thermal print head.
  • the thermal print head includes a substrate made of a single crystal semiconductor, a resistor layer disposed on the substrate, and a wiring layer provided on the resistor layer.
  • a current flows through the wiring layer, a plurality of heat generating parts of the resistor layer generate heat.
  • the wiring layer includes a common wiring that is electrically connected to the plurality of heat generating parts in common.
  • the common wiring has a portion arranged on one side in the sub-scanning direction with respect to the plurality of heat generating parts. All the currents flowing through the plurality of heat generating parts flow through this part. If the resistance value of the common wiring is not small enough, unintended heat generation and current shortages will occur.
  • An object of the present disclosure is to provide a thermal print head that is improved over conventional ones.
  • an object of the present disclosure is to provide a thermal printer including the thermal print head, and a method for manufacturing the thermal print head.
  • the present disclosure provides a thermal print head (and a method for manufacturing a thermal printer and a thermal print head) that can reduce the resistance of a conductive path leading to a plurality of heat generating parts. is the number one issue.
  • a thermal print head provided according to a first aspect of the present disclosure includes a substrate having a main surface facing one side in a thickness direction and a back surface facing the other side, supported on the one side of the substrate, and configured to perform main scanning.
  • the device includes a resistor layer including a plurality of heat generating parts arranged in a direction, a wiring layer electrically connected to the plurality of heat generating parts, and a protective layer covering the substrate, the plurality of heat generating parts and the wiring layer.
  • the wiring layer includes a plurality of individual wirings that individually connect to the plurality of heat generating parts from one side in the sub-scanning direction, and a common wiring that connects to the plurality of heat generating parts from the other side in the sub-scanning direction. including.
  • the substrate is located on the other side in the sub-scanning direction with respect to the plurality of heat generating parts, faces the one side in the thickness direction, and has a space between the main surface and the back surface in the thickness direction. and a recessed portion having a first surface located thereon.
  • the thermal print head further includes a conductive layer that includes a portion accommodated in the recess when viewed in the main scanning direction and is electrically connected to the common wiring.
  • the thermal printer provided by the second aspect of the present disclosure includes the thermal print head provided by the first aspect of the present disclosure.
  • a method for manufacturing a thermal print head includes the steps of: preparing a base material having a main surface facing one side in the thickness direction and a back surface facing the other side; forming a recess that is recessed from the main surface to the other side in the thickness direction; accommodating a metal-containing paste in the recess; and forming a conductive layer by firing the metal-containing paste; Equipped with
  • thermo print head and a method for manufacturing a thermal printer and a thermal print head that can reduce the resistance of the conduction path leading to the plurality of heat generating parts.
  • FIG. 1 is a plan view showing a thermal print head according to a first embodiment of the present disclosure.
  • FIG. 2 is a plan view of main parts showing a thermal print head according to a first embodiment of the present disclosure.
  • FIG. 3 is an enlarged plan view of essential parts of the thermal print head according to the first embodiment of the present disclosure.
  • FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1, and is a cross-sectional view showing a thermal print head and a thermal printer according to the first embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of main parts showing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 6 is an enlarged cross-sectional view of the main parts of the thermal print head according to the first embodiment of the disclosure.
  • FIG. 7 is a sectional view of a main part taken along line VII-VII in FIG.
  • FIG. 8 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 9 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 10 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 12 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 14 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 15 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 16 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 17 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 18 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 19 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to the first embodiment of the present disclosure.
  • FIG. 20 is an enlarged cross-sectional view of main parts showing a thermal print head according to a second embodiment of the present disclosure.
  • FIG. 21 is an enlarged cross-sectional view of main parts showing a thermal print head according to a third embodiment of the present disclosure.
  • FIG. 22 is a cross-sectional view of main parts showing a method for manufacturing a thermal print head according to a third embodiment of the present disclosure.
  • FIG. 23 is a plan view showing a thermal print head according to a fourth embodiment of the present disclosure.
  • FIG. 24 is a sectional view of a main part taken along line XXIV-XXIV in FIG. 23.
  • a thing A is formed on a thing B and "a thing A is formed on a thing B” mean “a thing A is formed on a thing B” unless otherwise specified.
  • "something A is placed on something B” and “something A is placed on something B” mean "something A is placed on something B” unless otherwise specified.
  • a certain surface A faces (one side or the other side of) the direction B is not limited to the case where the angle of the surface A with respect to the direction B is 90 degrees; Including cases where it is tilted to the opposite direction.
  • the thermal print head A10 of this embodiment includes a substrate 1, an insulating layer 2, a resistor layer 3, a wiring layer 4, a first protective layer 5, a conductive layer 6, and a second protective layer 69.
  • the thermal print head A10 also includes a wiring board 71, a heat radiation member 72, a plurality of drive elements 73, a plurality of first wires 74, a plurality of second wires 75, a sealing resin 76, and a connector 77.
  • the first protective layer 5, the second protective layer 69, and the sealing resin 76 are omitted.
  • the first protective layer 5 is omitted for convenience of understanding.
  • FIG. 1 is a plan view showing the thermal print head A10.
  • FIG. 2 is a plan view of essential parts of the thermal print head A10.
  • FIG. 3 is an enlarged plan view of the main parts of the thermal print head A10.
  • FIG. 4 is a sectional view taken along line IV-IV in FIG. 1, and is a sectional view showing the thermal print head A10 and the thermal printer B10.
  • FIG. 5 is a sectional view of a main part of the thermal print head A10.
  • FIG. 6 is an enlarged cross-sectional view of the main parts of the thermal print head according to the first embodiment of the disclosure.
  • FIG. 7 is a sectional view of a main part taken along line VII-VII in FIG.
  • the thickness direction of the substrate 1 is defined as the thickness direction z. Further, one direction perpendicular to the thickness direction z is defined as a main scanning direction x. Further, a direction perpendicular to the thickness direction z and the main scanning direction x is defined as a sub-scanning direction y.
  • the substrate 1 is joined to the heat dissipation member 9. Further, the wiring board 71 is located next to the board 1 in the sub-scanning direction y. The wiring board 71 is fixed to the heat radiating member 9 like the board 1.
  • a plurality of heat generating parts 31 (details will be described later) are formed, which form part of the resistor layer 3 and are arranged in the main scanning direction x.
  • the plurality of heat generating parts 31 selectively generate heat by the plurality of drive elements 73 mounted on the wiring board 71.
  • the plurality of driving elements 73 are driven according to print signals transmitted from the outside via the connector 77.
  • the thermal printer B10 includes a thermal print head A10 and a platen roller 79, as shown in FIG.
  • the platen roller 79 is a roller-like mechanism that feeds out a recording medium such as thermal paper.
  • a recording medium such as thermal paper.
  • a non-roller-like mechanism can be used instead of the platen roller 79.
  • the mechanism has a flat surface.
  • the flat surface includes a curved surface having a small curvature.
  • a roller-like mechanism such as the platen roller 79 and this mechanism are collectively referred to as a "platen.”
  • the substrate 1 has a strip shape extending in the main scanning direction x when viewed in the thickness direction z (in plan view).
  • the material of the substrate 1 is not limited at all. Examples of the material of the substrate 1 include semiconductor materials and ceramics.
  • the substrate 1 is made of a semiconductor material.
  • the semiconductor material includes a single crystal material whose composition is silicon (Si).
  • the thickness of the substrate 1 in the thickness direction z is not limited at all, and is, for example, 200 ⁇ m or more and 725 ⁇ m or less.
  • the substrate 1 has a main surface 10, a back surface 13, and an end surface 14.
  • the plane orientations of the main surface 10 and the back surface 13 based on the crystal structure of the substrate 1 are both (100) planes.
  • the main surface 10 and the back surface 13 face oppositely to each other in the thickness direction z.
  • the main surface 10 faces the z1 side, and the back surface 13 faces the z2 side.
  • the main surface 10 faces the platen roller 79, and the back surface 13 faces the heat radiating member 9.
  • the end surface 14 is a surface facing the y2 side in the sub-scanning direction y. In the illustrated example, the end surface 14 is perpendicular to the sub-scanning direction y.
  • the substrate 1 has a convex portion 12 and a concave portion 15. Note that the substrate 1 may have a configuration without the convex portion 12.
  • the convex portion 12 protrudes from the main surface 10 toward the z1 side in the thickness direction z.
  • the convex portion 12 extends along the main scanning direction x.
  • the convex portion 12 has a top surface 121 and a pair of inclined surfaces 122.
  • the top surface 121 is located away from the main surface 10 in the thickness direction z and is parallel to the main surface 10 .
  • the pair of inclined surfaces 122 are located apart from each other in the sub-scanning direction y.
  • a pair of inclined surfaces 122 are connected to the top surface 121 and the main surface 10. Note that the configuration of the convex portion 12 is not limited at all, and may have another surface interposed between the top surface 121 and the inclined surface 122, for example.
  • the pair of inclined surfaces 122 are inclined with respect to the main surface 10 so as to approach each other from the main surface 10 to the top surface 121.
  • the angle of inclination of each of the pair of inclined surfaces 122 with respect to the main surface 10 is the same, for example, 54.7°.
  • the convex portions 12 do not reach both ends of the substrate 1 in the main scanning direction x. That is, the main surface 10 includes portions located on both sides of the convex portion 12 in the main scanning direction x.
  • the height of the convex portion 12 in the thickness direction z is not limited at all, and is, for example, 100 ⁇ m or more and 400 ⁇ m or less.
  • the recess 15 is recessed from the main surface 10 toward the z2 side in the z direction.
  • the recess 15 of this embodiment has a shape that extends long in the main scanning direction x.
  • the recess 15 has a first surface 151, a second surface 152, and a third surface 153.
  • the depth of the recess 15 in the thickness direction z is not limited at all, and is, for example, 50 ⁇ m or more and 300 ⁇ m or less.
  • the first surface 151 is located on the y2 side in the sub-scanning direction y with respect to the convex portion 12 (a plurality of heat generating portions 31 to be described later).
  • the first surface 151 faces the z1 side in the z direction, and is parallel to the main surface 10 in this embodiment.
  • the first surface 151 is located between the main surface 10 and the back surface 13 in the z direction.
  • the first surface 151 extends long in the main scanning direction x.
  • the second surface 152 is connected to the y1 side in the sub-scanning direction y with respect to the first surface 151.
  • the second surface 152 is located between the main surface 10 and the first surface 151 in the z direction.
  • the second surface 152 extends long in the main scanning direction x.
  • the angle of inclination of the second surface 152 with respect to the main surface 10 is, for example, 54.7°.
  • the second surface 152 is smoothly connected to the inclined surface 122. Note that the second surface 152 and the inclined surface 122 are smoothly connected, for example, as shown in FIG. are connected to each other at the same angle so as not to create any steps or corners.
  • the third surface 153 is connected to the y2 side of the sub-scanning direction y with respect to the first surface 151.
  • the third surface 153 is located between the main surface 10 and the first surface 151 in the z direction.
  • the third surface 153 extends long in the main scanning direction x.
  • the angle of inclination of the third surface 153 with respect to the main surface 10 is, for example, 54.7°.
  • the third surface 153 is spaced apart from the end surface 14.
  • the third surface 153 is connected to a portion of the main surface 10 located between the end surface 14 and the recess 15.
  • the insulating layer 2 covers the substrate 1 from the main surface 10 side.
  • the insulating layer 2 covers the main surface 10 and the recess 15.
  • the substrate 1 is electrically insulated from the resistor layer 3 and the wiring layer 4 by the insulating layer 2 .
  • the insulating layer 2 is made of silicon dioxide (SiO 2 ) made from tetraethyl orthosilicate (TEOS), for example.
  • An example of the thickness of the insulating layer 2 is 1 ⁇ m or more and 15 ⁇ m or less.
  • the resistor layer 3 is arranged on the main surface 10 of the substrate 1, as shown in FIGS. 5 and 6.
  • the resistor layer 3 is in contact with the insulating layer 2.
  • the insulating layer 2 is sandwiched between the substrate 1 and the resistor layer 3.
  • the resistor layer 3 is made of tantalum nitride (TaN), for example.
  • An example of the thickness of the resistor layer 3 is 0.02 ⁇ m or more and 0.1 ⁇ m or less.
  • the resistor layer 3 includes a plurality of heat generating parts 31.
  • the plurality of heat generating parts 31 are parts exposed from the wiring layer 4.
  • the plurality of heat generating parts 31 locally heat the recording medium.
  • the plurality of heat generating parts 31 are arranged in the main scanning direction x.
  • two heat generating parts 31 adjacent to each other in the main scanning direction x are located apart from each other.
  • the plurality of heat generating parts 31 overlap with the convex part 12 when viewed in the thickness direction z.
  • the plurality of heat generating parts 31 overlap the top surface 121 when viewed in the thickness direction z. As shown in FIG. 4, in the thermal printer B10, the plurality of heat generating parts 31 are opposed to the platen roller 79. In the convex portion 12 , the plurality of heat generating portions 31 may be formed straddling the top surface 121 and either of the pair of inclined surfaces 122 .
  • the wiring layer 4 is formed on the resistor layer 3, as shown in FIGS. 5 and 6.
  • the wiring layer 4 forms a conductive path for supplying electricity to the plurality of heat generating parts 31 of the resistor layer 3.
  • the electrical resistivity of the wiring layer 4 is smaller than that of the resistor layer 3.
  • the wiring layer 4 is a metal layer containing copper (Cu), for example.
  • An example of the thickness of the wiring layer 4 is 0.3 ⁇ m or more and 2.0 ⁇ m or less.
  • the wiring layer 4 may be configured to include two metal layers: a titanium (Ti) layer laminated on the resistor layer 3 and a copper layer laminated on the titanium layer.
  • An example of the thickness of the titanium layer in this case is 0.1 ⁇ m or more and 0.2 ⁇ m or less.
  • the wiring layer 4 includes a common wiring 41 and a plurality of individual wirings 42.
  • the common wiring 41 is connected to the plurality of heat generating parts 31 of the resistor layer 3 from the y2 side in the sub-scanning direction y.
  • the plurality of individual wirings 42 are connected to the plurality of heat generating parts 31 from the y1 side in the sub-scanning direction y.
  • the plurality of regions of the resistor layer 3 sandwiched between the common wiring 41 and the plurality of individual wirings 42 are the plurality of heat generating parts 31 when viewed in the thickness direction z.
  • the common wiring 41 has a base portion 411, a plurality of extension portions 412, and two side portions 413.
  • the base portion 411 is spaced apart from the plurality of heat generating portions 31 of the resistor layer 3 in the sub-scanning direction y.
  • the base portion 411 has a band shape extending in the main scanning direction x when viewed in the thickness direction z. In this embodiment, the base 411 overlaps the recess 15 when viewed in the thickness direction z. In the illustrated example, the base 411 covers the recess 15 .
  • the plurality of extension parts 412 are band-shaped and extend from the end of the base part 411 on the y1 side in the sub-scanning direction y toward the plurality of heat generating parts 31.
  • the plurality of extension parts 412 are arranged along the main scanning direction x. A portion of each of the plurality of extending portions 412 is formed on the inclined surface 122 located on the y2 side in the sub-scanning direction y.
  • the two side parts 413 are arranged on both sides of the plurality of common wiring lines 41 in the main scanning direction x.
  • the two common wirings 41 are located on both sides of the convex portion 12 in the main scanning direction x, and are formed on the main surface 10 .
  • the side portion 413 extends in the sub-scanning direction y, and includes a portion located on the common wiring 41 in the sub-scanning direction y and a portion located on the y2 side with respect to the convex portion 12. include.
  • the side portion 413 may be configured to straddle the convex portion 12 .
  • the wiring layer 4 may have a configuration having only one side portion 413. In the common wiring 41 , current flows from the base 411 to the plurality of heat generating parts 31 via the plurality of extension parts 412 .
  • each of the plurality of individual wirings 42 has a base portion 421 and an extension portion 422.
  • the base portion 421 is located farthest from the plurality of heat generating portions 31 of the resistor layer 3 .
  • the base portions 421 of the plurality of individual wirings 42 are arranged in a staggered manner with respect to the main scanning direction x.
  • the extending portion 422 has a band shape extending toward the plurality of heat generating portions 31 from the end of the base portion 421 facing the convex portion 12 of the substrate 1 in the sub-scanning direction y.
  • the extending portions 422 of the plurality of individual wirings 42 are arranged along the main scanning direction x.
  • each of the plurality of individual wirings 42 is formed on the inclined surface 122 located on the y1 side in the sub-scanning direction y.
  • a current flows from one of the plurality of heat generating parts 31 to the base 421 via the extension part 422.
  • each of the plurality of heat generating parts 31 is sandwiched between one of the plurality of extensions 422 of the plurality of individual wirings 42 and one of the plurality of extensions 412 of the common wiring 41.
  • the first protective layer 5 covers a part of the substrate 1, the plurality of heat generating parts 31 of the resistor layer 3, and the wiring layer 4, as shown in FIGS. 5 and 6.
  • the first protective layer 5 has electrical insulation properties.
  • the first protective layer 5 includes silicon in its composition.
  • the first protective layer 5 is made of silicon dioxide, silicon nitride (Si 3 N 4 ), or silicon carbide (SiC), for example.
  • the first protective layer 5 may be a laminate made of a plurality of these materials.
  • An example of the thickness of the first protective layer 5 is 1.0 ⁇ m or more and 10 ⁇ m or less.
  • the first protective layer 5 has a wiring opening 51 and a plurality of through holes 52.
  • the wiring opening 51 penetrates the first protective layer 5 in the thickness direction z. From the wiring opening 51, the base portions 421 of the plurality of individual wirings 42 and a portion of each of the extending portions 422 of the plurality of individual wirings 42 are exposed.
  • Each of the plurality of through holes 52 penetrates the first protective layer 5 in the thickness direction z.
  • the plurality of through holes 52 overlap with the recess 15 when viewed in the thickness direction z, and in the illustrated example, overlap with the first surface 151.
  • the plurality of through holes 52 are arranged in the main scanning direction x. Note that the arrangement of the plurality of through holes 52 is not limited at all. Further, the shape of the through hole 52 is not limited at all, and may be, for example, a small hole when viewed in the thickness direction z, or may be, for example, a slit shape extending in the main scanning direction x. For example, when the through hole 52 has a slit shape, the first protective layer 5 may have only one through hole 52. A portion of the base 411 is exposed from the first protective layer 5 through the plurality of through holes 52 .
  • the conductive layer 6 includes a portion accommodated in the recess 15 when viewed in the main scanning direction x, as shown in FIGS. 1, 2, and 4 to 7.
  • the conductive layer 6 includes a portion that swells from the recess 15 toward the z1 side in the thickness direction z.
  • the conductive layer 6 may have a configuration in which the entire conductive layer 6 is accommodated in the recess 15 .
  • the conductive layer 6 overlaps the recess 15 when viewed in the thickness direction z.
  • the conductive layer 6 is formed on the first protective layer 5 in the recess 15 .
  • the conductive layer 6 is electrically connected to the common wiring 41. Specifically, the conductive layer 6 is in contact with the base 411 of the common wiring 41 through the plurality of through holes 52 of the first protective layer 5 .
  • the conductive layer 6 is made of a conductive material, and includes metals such as silver (Ag), copper (Cu), and gold (Au).
  • the conductive layer 6 contains silver (Ag), and is made of low-temperature fired silver, for example.
  • low-temperature fired silver is formed by firing a paste containing silver (Ag) at a temperature of, for example, about 100°C to 250°C.
  • the second protective layer 69 covers the conductive layer 6, as shown in FIGS. 4 to 7.
  • the second protective layer 69 is made of an insulating material.
  • the material of the second protective layer 69 is not limited at all, and is, for example, polyimide resin.
  • the second protective layer 69 covers all of the conductive layer 6 when viewed in the thickness direction z; however, the second protective layer 69 may be configured to partially cover the conductive layer 6, for example. You can.
  • the wiring board 71 is located on the y1 side of the board 1 in the sub-scanning direction y. As shown in FIG. 1, when viewed in the thickness direction z, the plurality of individual wirings 42 are located between the plurality of heat generating parts 31 of the resistor layer 3 and the wiring board 71 in the sub-scanning direction y. The area of the wiring board 71 is larger than the area of the board 1 when viewed in the thickness direction z. Further, when viewed in the thickness direction z, the wiring board 71 has a rectangular shape whose longitudinal direction is the main scanning direction x.
  • the wiring board 71 is, for example, a PCB (Printed Circuit Board) board.
  • the wiring board 71 may be, for example, an FPC (Flexible Printed Circuits) board.
  • a plurality of drive elements 73 and a connector 77 are mounted on the wiring board 71.
  • the heat dissipation member 9 faces the back surface 13 of the substrate 1, as shown in FIG.
  • the back surface 13 is bonded to the heat radiating member 9 with an adhesive or the like (not shown).
  • the wiring board 71 is fixed to the heat dissipation member 9 with a fastening member such as a screw.
  • a portion of the heat generated from the plurality of heat generating parts 31 of the resistor layer 3 is conducted to the heat radiating member 9 via the substrate 1.
  • the heat conducted to the heat radiating member 9 is radiated to the outside.
  • the heat radiation member 9 is made of aluminum (Al), for example.
  • the plurality of drive elements 73 are mounted on the wiring board 71 via an electrically insulating die bonding material (not shown).
  • Each of the plurality of driving elements 73 is a semiconductor element configured with various circuits.
  • One end of each of the plurality of first wires 74 and one end of each of the plurality of second wires 75 are joined to each of the plurality of drive elements 73.
  • the other ends of the plurality of first wires 74 are individually joined to the base portions 421 of the plurality of individual wirings 42.
  • the other end of each of the plurality of second wires 75 is connected to a wiring (not shown) provided on the wiring board 71 and electrically connected to the connector 77 .
  • the print signal, the control signal, and the voltage supplied to the plurality of heat generating parts 31 of the resistor layer 3 are inputted from the outside to the plurality of drive elements 73 via the connector 77.
  • the plurality of drive elements 73 selectively apply voltages to the plurality of individual wirings 42 based on these electric signals.
  • the plurality of heat generating parts 31 selectively generate heat.
  • the side portion 413 is connected to the wiring board 71 by wires similar to the first wire 74 and the second wire 75.
  • the sealing resin 76 covers the plurality of drive elements 73, the plurality of first wires 74, the plurality of second wires 75, and a portion of each of the substrate 1 and the wiring board 71. There is.
  • the sealing resin 76 has electrical insulation properties.
  • the sealing resin 76 is, for example, a black synthetic resin.
  • the connector 77 is mounted on the end of the wiring board 71 on the y1 side in the sub-scanning direction y.
  • Connector 77 is connected to thermal printer B10.
  • Connector 77 has multiple pins (not shown). Some of the plurality of pins are electrically connected to wiring (not shown) to which the plurality of second wires 75 are joined on the wiring board 71. Furthermore, another part of the plurality of pins is electrically connected to a wiring (not shown) that is electrically connected to the side portion 413 of the common wiring 41 on the wiring board 71.
  • thermal print head A10 Next, an example of a method for manufacturing the thermal print head A10 will be described below with reference to FIGS. 8 to 19.
  • a base material 1A is prepared.
  • the base material 1A is made of a semiconductor material.
  • the semiconductor material includes a single crystal material whose composition is silicon.
  • the base material 1A is a silicon wafer.
  • a plurality of regions corresponding to a plurality of substrates 1 connected in a row in a direction perpendicular to the thickness direction z corresponds to the base material 1A.
  • the base material 1A has a main surface 10A and a back surface 13.
  • the main surface 10A and the back surface 13 face oppositely to each other in the thickness direction z.
  • the plane orientations of the main surface 10A and the back surface 13 based on the crystal structure of the base material 1A are both (100) planes.
  • a first mask layer 891 is formed on the main surface 10A of the base material 1A.
  • the treatment on the back surface 13 side of the base material 1A will be omitted.
  • a mask layer (not shown) covering the entire surface of the back surface 13 may be formed.
  • the first mask layer 891 is made of, for example, silicon dioxide or a photoresist material.
  • the first mask layer 891 is formed in a region corresponding to the top surface 121 of the substrate 1 .
  • wet etching is performed on the main surface 10A using a potassium hydroxide (KOH) aqueous solution using the first mask layer 891 as an etching mask.
  • KOH potassium hydroxide
  • the convex portion 12 has the above-mentioned top surface 121 and a pair of inclined surfaces 122.
  • the angle between the inclined surface 122 and the main surface 10 is 54.7° when wet etching using a potassium hydroxide (KOH) aqueous solution is used.
  • a second mask layer 892 is formed.
  • the second mask layer 892 covers appropriate parts of the main surface 10 and the convex portions 12, and is made of the same material as the first mask layer 891, for example.
  • the second mask layer 892 exposes a portion of the main surface 10.
  • the second mask layer 892 covers all or part of the inclined surface 122 located on the y2 side in the sub-scanning direction y. It is preferable that the second mask layer 892 touches the boundary between the inclined surface 122 and the main surface 10 located on the y2 side in the sub-scanning direction y, or exposes the boundary.
  • wet etching is performed on the main surface 10 using a potassium hydroxide (KOH) aqueous solution using the second mask layer 892 as an etching mask. As a result, a recess 15 is formed as shown in FIG. 11.
  • KOH potassium hydroxide
  • the recess 15 has the above-described first surface 151, second surface 152, and third surface 153.
  • the second mask layer 892 is configured to touch or expose the boundary between the inclined surface 122 and the main surface 10 located on the y2 side in the sub-scanning direction y, so that the second surface 152 is a sloped surface. It is smoothly connected to 122.
  • an insulating layer 2 is formed to cover the main surface 10 side (z1 side) of the base material 1A.
  • the insulating layer 2 is formed, for example, by laminating a plurality of silicon dioxide thin films formed by plasma CVD using tetraethyl orthosilicate (TEOS) as a raw material gas. Thereby, the insulating layer 2 covers the main surface 10 and the recess 15.
  • TEOS tetraethyl orthosilicate
  • the resistor layer 3 includes a plurality of heat generating parts 31 arranged in the main scanning direction x.
  • the wiring layer 4 is electrically connected to the plurality of heat generating parts 31 .
  • the process of forming the wiring layer 4 includes the process of forming a common wiring 41 and a plurality of individual wirings 42.
  • a resistor film is formed to cover the insulating layer 2, for example.
  • This resistor film is formed by laminating a thin film of tantalum nitride (TaN) on the insulating layer 2 by, for example, a sputtering method.
  • a conductive film is formed to cover the resistor film. This conductive film is formed, for example, by laminating a thin copper film on the resistor film multiple times using a sputtering method.
  • a method may be adopted in which a thin titanium film is laminated on the resistor film by sputtering, and then a thin copper film is laminated multiple times on the titanium thin film by sputtering. good.
  • a portion of the conductive layer is removed.
  • the removal is performed, for example, by wet etching using a mixed solution of sulfuric acid (H 2 SO 4 ) and hydrogen peroxide (H 2 O 2 ).
  • H 2 SO 4 sulfuric acid
  • H 2 O 2 hydrogen peroxide
  • a wiring layer 4 having a common wiring 41 and a plurality of individual wirings 42 is formed. Therefore, the formation of the wiring layer 4 is completed in this step.
  • a part of the resistor film is removed. The removal is performed by reactive ion etching. As a result, the resistor layer 3 is formed.
  • a plurality of heat generating parts 31 appear on the top surface 121 of the base material 1A.
  • a first protective layer 5 covering a part of the main surface 10 side (z1 side) of the base material 1A, the plurality of heat generating parts 31 of the resistor layer 3, and the wiring layer 4 is coated.
  • the first protective layer 5 is formed, for example, by laminating silicon nitride thin films by plasma CVD.
  • a wiring opening 51 and a plurality of through holes 52 penetrating in the thickness direction z are formed in the first protective layer 5.
  • the wiring opening 51 and the plurality of through holes 52 are formed by performing lithography patterning on the first protective layer 5 and then removing a portion of the first protective layer 5. This removal is performed, for example, by reactive ion etching.
  • a portion of the plurality of individual wirings 42 (the base portion 421 of the plurality of individual wirings 42 shown in FIG. 5 and a portion of each of the extension portions 422 of the plurality of individual wirings 42 shown in FIG. 5) are exposed from the wiring opening 51.
  • the base portion 411 of the common wiring 41 of the wiring layer 4 is exposed through the plurality of through holes 52 .
  • a metal-containing paste 60 is applied onto the first protective layer 5.
  • the metal-containing paste 60 is a paste containing silver (Ag), for example, and is a material that becomes the conductive layer 6 by being fired at a low temperature.
  • the method of applying the metal-containing paste 60 is not limited at all, and for example, a method using a dispenser nozzle, a printing method, or the like may be employed as appropriate.
  • the metal-containing paste 60 is applied so as to fill the space defined by the recess 15 with the metal-containing paste 60.
  • the amount of the metal-containing paste 60 to be applied is not limited at all, and in the illustrated example, the metal-containing paste 60 is raised toward the z1 side from the main surface 10 in the thickness direction z. Further, the metal-containing paste 60 is also filled in the plurality of through holes 52 of the first protective layer 5 and is in contact with the base 411 of the common wiring 41 of the wiring layer 4 .
  • the metal-containing paste 60 is fired at a temperature of, for example, about 100°C to 250°C. As a result, a conductive layer 6 is formed as shown in FIG. 18.
  • a second protective layer 69 is formed.
  • the second protective layer 69 is formed, for example, by applying a polyimide resin or a paste containing a material that becomes a polyimide resin so as to cover the conductive layer 6, and curing the paste.
  • the base material 1A is cut and divided into a plurality of substrates 1.
  • the base material 1A is cut, for example, along the cutting line CL in FIG. 19.
  • the cutting line CL in this embodiment is set at a position away from the recess 15 on the y2 side in the sub-scanning direction y.
  • the conductive layer 6 connected in parallel to the base 411 is provided as a conduction path leading to the plurality of heat generating parts 31. Therefore, the resistance of the conduction path leading to the plurality of heat generating parts 31 can be reduced.
  • the conductive layer 6 includes a portion accommodated in the recess 15 when viewed in the main scanning direction x. Thereby, it is possible to suppress excessive protrusion of the conductive layer 6 toward the z1 side in the thickness direction z. Thereby, interference between the thermal print head A10 and the recording medium can be suppressed.
  • the conductive layer 6 is covered with a second protective layer 69. Thereby, unintended conduction between the conductive layer 6 and an external object or the like can be suppressed.
  • the second surface 152 and the inclined surface 122 are smoothly connected. As a result, there is no step or the like at the boundary between the second surface 152 and the inclined surface 122. Therefore, it is possible to prevent the resistor layer 3 and the wiring layer 4 from being formed in steps, etc., and it is possible to more reliably ensure proper conduction between the resistor layer 3 and the wiring layer 4.
  • the conductive layer 6 is formed by low temperature firing. Thereby, in the process of forming the conductive layer 6, it is possible to suppress deterioration of other constituent members.
  • FIG. 20 shows a thermal print head according to a second embodiment of the present disclosure.
  • the thermal print head A20 of this embodiment is different from the above-described embodiments in the relationship between the second surface 152 of the recess 15 and the inclined surface 122 of the convex portion 12.
  • the second surface 152 and the inclined surface 122 are not connected smoothly. Specifically, the second surface 152 and the inclined surface 122 are separated from each other in the sub-scanning direction y. A part of the main surface 10 is interposed between the second surface 152 and the inclined surface 122.
  • the second mask layer 892 shown in FIG. It can be formed when wet etching is performed using an aqueous potassium hydroxide (KOH) solution while the protruding layer is protruding from the surface.
  • KOH potassium hydroxide
  • the specific shape of the recess 15 and the relationship between the recess 15 and the main surface 10 and the projection 12 are not limited at all.
  • FIG. 21 shows a thermal print head according to a third embodiment of the present disclosure.
  • the thermal print head A30 of the present disclosure differs from the embodiment described above mainly in the configurations of the recess 15, the conductive layer 6, and the second protective layer 69.
  • the recess 15 of this embodiment has a first surface 151 and a second surface 152, and does not have the third surface 153 described above.
  • the first surface 151 is connected to the end surface 14. That is, the recessed portion 15 of this embodiment has a shape that is open on the y2 side in the sub-scanning direction y.
  • the insulating layer 2, the resistor layer 3, the wiring layer 4, and the first protective layer 5 have reached the position of the end surface 14 in the sub-scanning direction y.
  • the conductive layer 6 has a conductive layer end surface 61.
  • the conductive layer end surface 61 faces the y2 side in the sub-scanning direction y, and is flush with the end surface 14. In other words, the end surface 14 and the conductive layer end surface 61 are aligned in position in the sub-scanning direction y, and overlap each other in the thickness direction z.
  • the second protective layer 69 has a portion that covers the conductive layer end surface 61 of the conductive layer 6 in addition to a portion that covers the z1 side of the conductive layer 6 in the thickness direction z. Further, the second protective layer 69 covers the end faces of the insulating layer 2, the resistor layer 3, the wiring layer 4, and the first protective layer 5, and a part of the end face 14.
  • FIG. 22 shows a method for manufacturing the thermal print head A30.
  • the position of the cutting line CL is different in this embodiment.
  • the cutting line CL is set at a position overlapping the conductive layer 6 when viewed in the thickness direction z, as shown in FIG.
  • the cutting line CL is set at a position overlapping the first surface 151 of the recess 15 when viewed in the thickness direction z.
  • the cutting line CL is closer to the y2 side than the plurality of through holes 52 in the sub-scanning direction y.
  • the second protective layer 69 is formed after cutting the base material 1A.
  • the conductive layer end face 61, the end faces of the insulating layer 2, the resistor layer 3, the wiring layer 4, and the first protective layer 5, and a part of the end face 14 can be covered with the second protective layer 69.
  • the concave portion 15 does not have the third surface 153 and the first surface 151 is connected to the end surface 14, the concave portion 15 has a larger area in the sub-scanning direction than the convex portion 12 (the plurality of heat generating portions 31) of the substrate 1. It is possible to reduce the portion located on the y2 side of y, which is advantageous for downsizing the thermal print head A30.
  • the conductive layer 6 has a conductive layer end face 61 on the y2 side in the sub-scanning direction y, the conductive layer end face 61 is covered with a second protective layer 69. Thereby, it is possible to reduce the resistance of the conduction path and to prevent conduction of the conductive layer 6 to an unintended external object.
  • thermal print head A40 of this embodiment differs from the embodiments described above mainly in the configurations of the recess 15, the common wiring 41, the conductive layer 6, and the second protective layer 69.
  • the recess 15 has two fourth surfaces 154.
  • the two fourth surfaces 154 are connected to both end portions of the first surface 151 in the main scanning direction x, and extend toward the y1 side in the sub-scanning direction y.
  • the fourth surface 154 includes a portion located on the y1 side in the sub-scanning direction y and a portion located on the y2 side with respect to the convex portion 12 (the plurality of heat generating portions 31) in the sub-scanning direction y. That is, the recess 15 has a U-shape when viewed in the thickness direction z.
  • the side portion 413 has a portion that overlaps with the fourth surface 154 when viewed in the thickness direction z.
  • the first protective layer 5 has a through hole 53 .
  • the through hole 53 penetrates the first protective layer 5 in the thickness direction z, and overlaps the fourth surface 154 when viewed in the thickness direction z.
  • the conductive layer 6 is filled in the recess 15 and has a U-shape when viewed in the thickness direction z.
  • the conductive layer 6 is in contact with the side portion 413 of the common wiring 41 of the wiring layer 4 through the through hole 53 .
  • the second protective layer 69 covers the entire conductive layer 6.
  • the recess 15 has the fourth surface 154, and the conductive layer 6 includes a portion overlapping with the fourth surface 154. Thereby, it is possible to further promote lowering of the resistance of the conduction path leading to the plurality of heat generating parts 31.
  • thermal print head, thermal printer, and method for manufacturing a thermal print head according to the present disclosure are not limited to the embodiments described above.
  • the specific configurations of the thermal print head, thermal printer, and method of manufacturing the thermal print head according to the present disclosure can be modified in various designs.
  • the present disclosure includes the embodiments described in the appendix below.
  • a substrate having a main surface facing one side in the thickness direction and a back surface facing the other side; a resistor layer supported on the one side of the substrate and including a plurality of heat generating parts arranged in the main scanning direction; a wiring layer electrically connected to the plurality of heat generating parts; a protective layer covering the substrate, the plurality of heat generating parts, and the wiring layer;
  • the wiring layer includes a plurality of individual wirings that individually connect to the plurality of heat generating parts from one side in the sub-scanning direction, and a common wiring that connects to the plurality of heat generating parts from the other side in the sub-scanning direction.
  • the substrate is located on the other side in the sub-scanning direction with respect to the plurality of heat generating parts, faces the one side in the thickness direction, and has a space between the main surface and the back surface in the thickness direction. further comprising a recess having a first surface located thereon;
  • the thermal print head further includes a conductive layer that includes a portion accommodated in the recess when viewed in the main scanning direction and is electrically connected to the common wiring. Additional note 2.
  • Appendix 3 The thermal print head according to appendix 1 or 2, wherein the conductive layer contains Ag. Appendix 4.
  • the recess further has a second surface connected to the one side in the sub-scanning direction with respect to the first surface and located between the main surface and the first surface in the thickness direction.
  • the thermal print head according to any one of 3 to 3.
  • Appendix 5 The thermal print head according to appendix 4, wherein the conductive layer overlaps the second surface when viewed in the thickness direction.
  • Appendix 6. The thermal print head according to appendix 4 or 5, wherein the substrate further has a convex portion that protrudes from the main surface to the one side in the thickness direction and overlaps with the plurality of heat generating parts when viewed in the thickness direction.
  • the convex portion has an inclined surface located on the other side in the sub-scanning direction, The thermal print head according to appendix 6, wherein the second surface and the inclined surface are smoothly connected.
  • the convex portion has an inclined surface located on the other side in the sub-scanning direction,
  • Supplementary note 4 wherein the recess further includes a third surface connected to the other side in the sub-scanning direction with respect to the first surface and located between the main surface and the first surface in the thickness direction. 9.
  • the substrate further has an end face facing the other side in the sub-scanning direction,
  • the thermal print head according to appendix 9 or 10 wherein the main surface has a portion located between the third surface and the end surface in the sub-scanning direction.
  • the substrate further has an end face facing the other side in the sub-scanning direction,
  • Appendix 13 The thermal print head according to appendix 12, wherein the conductive layer has a conductive layer end face that is flush with the end face.
  • the recess further includes a fourth surface that is spaced apart from the plurality of heat generating parts in the main scanning direction, connected to the first surface, and extending in the sub-scanning direction, 16.
  • a thermal printer comprising the thermal print head according to any one of appendices 1 to 16.
  • Appendix 18 preparing a base material having a main surface facing one side in the thickness direction and a back surface facing the other side; forming a recess in the base material that is recessed from the main surface toward the other side in the thickness direction; accommodating a metal-containing paste in the recess; forming a conductive layer by firing the metal-containing paste;
  • a method for manufacturing a thermal print head comprising:

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04179555A (ja) * 1990-11-14 1992-06-26 Matsushita Electric Ind Co Ltd サーマルヘッドおよびその製造方法
JPH05330110A (ja) * 1992-05-29 1993-12-14 Kyocera Corp サーマルヘッドの製造方法
JPH0852890A (ja) * 1994-08-11 1996-02-27 Toshiba Corp サーマルプリントヘッド
JPH0858126A (ja) * 1994-08-23 1996-03-05 Toshiba Corp サーマルプリントヘッド
JPH0858129A (ja) * 1994-08-23 1996-03-05 Toshiba Corp サーマルヘッド
JPH10250127A (ja) * 1997-03-07 1998-09-22 Alps Electric Co Ltd サーマルヘッド
JP2016101719A (ja) * 2014-11-28 2016-06-02 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
JP2022090328A (ja) * 2020-12-07 2022-06-17 ローム株式会社 サーマルプリントヘッド

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04179555A (ja) * 1990-11-14 1992-06-26 Matsushita Electric Ind Co Ltd サーマルヘッドおよびその製造方法
JPH05330110A (ja) * 1992-05-29 1993-12-14 Kyocera Corp サーマルヘッドの製造方法
JPH0852890A (ja) * 1994-08-11 1996-02-27 Toshiba Corp サーマルプリントヘッド
JPH0858126A (ja) * 1994-08-23 1996-03-05 Toshiba Corp サーマルプリントヘッド
JPH0858129A (ja) * 1994-08-23 1996-03-05 Toshiba Corp サーマルヘッド
JPH10250127A (ja) * 1997-03-07 1998-09-22 Alps Electric Co Ltd サーマルヘッド
JP2016101719A (ja) * 2014-11-28 2016-06-02 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
JP2022090328A (ja) * 2020-12-07 2022-06-17 ローム株式会社 サーマルプリントヘッド

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