WO2024009844A1 - 金属化フィルム製造装置、金属化フィルム、およびフィルムコンデンサ - Google Patents

金属化フィルム製造装置、金属化フィルム、およびフィルムコンデンサ Download PDF

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Publication number
WO2024009844A1
WO2024009844A1 PCT/JP2023/023789 JP2023023789W WO2024009844A1 WO 2024009844 A1 WO2024009844 A1 WO 2024009844A1 JP 2023023789 W JP2023023789 W JP 2023023789W WO 2024009844 A1 WO2024009844 A1 WO 2024009844A1
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WIPO (PCT)
Prior art keywords
film
width
metallized film
dielectric film
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/023789
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English (en)
French (fr)
Japanese (ja)
Inventor
淳史 川畑
智生 稲倉
甲児 ▲高▼垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Original Assignee
Murata Manufacturing Co Ltd
Shizuki Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd, Shizuki Electric Co Inc filed Critical Murata Manufacturing Co Ltd
Priority to JP2024532056A priority Critical patent/JPWO2024009844A1/ja
Priority to CN202380051023.2A priority patent/CN119384709A/zh
Publication of WO2024009844A1 publication Critical patent/WO2024009844A1/ja
Priority to US19/005,773 priority patent/US20250149265A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/015—Special provisions for self-healing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/145—Organic dielectrics vapour deposited
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • the present invention relates to a metallized film manufacturing apparatus, a metallized film, and a film capacitor.
  • Patent Document 1 describes a metallized film capacitor in which a first vapor-deposited electrode is arranged on one side of a dielectric film and a second vapor-deposited electrode is arranged on the other side of the dielectric film.
  • the first vapor-deposited electrode and the second vapor-deposited electrode are divided by a partition margin extending in the width direction to have a first divided electrode and a second divided electrode.
  • Patent Document 1 The metallized film capacitor described in Patent Document 1 still has room for improvement in terms of suppressing variations in capacitance.
  • the present invention provides a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can suppress variations in capacitance.
  • a metallized film manufacturing apparatus includes: a supply unit that supplies the dielectric film in the longitudinal direction; a printing roll having a rotation axis in the width direction of the dielectric film and printing an insulating pattern on the surface of the dielectric film; a vapor deposition section forming a metal vapor deposition electrode at a position on the surface of the dielectric film excluding the insulating pattern; Equipped with The printing roll has a convex portion formed extending in the axial direction on the outer peripheral surface of the printing roll and corresponding to the insulating pattern, A reinforcing portion is formed at one end of the convex portion in the axial direction of the printing roll.
  • the metallized film according to one aspect of the present invention is dielectric film; a metal vapor-deposited electrode formed on the surface of the dielectric film so that an insulation margin is provided at one end in the width direction of the dielectric film; Equipped with The metal vapor deposited electrode includes a plurality of divided electrodes divided by slits provided along the width direction of the dielectric film, Each of the plurality of divided electrodes is provided with a notch at a corner on the side facing the insulating margin.
  • the film capacitor according to one embodiment of the present invention is the metallized film described above; a pair of end face electrodes disposed at both ends of the metallized film; Equipped with
  • a metallized film manufacturing apparatus it is possible to provide a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can suppress variations in capacitance.
  • FIG. 4 Schematic diagram showing a metallized film manufacturing apparatus of FIG. 4
  • Film capacitors are known that are formed by winding or laminating dielectric films on which vapor-deposited electrodes are formed.
  • pattern margins are sometimes formed on the deposited electrodes to improve safety.
  • vapor-deposited electrodes are divided by section margins extending in the width direction.
  • the section margin is a portion that does not contribute to the capacitance of the film capacitor. Therefore, reducing the width of the section margin is effective in increasing the capacitance of the film capacitor and realizing miniaturization and cost reduction of the film capacitor.
  • the compartment margin is formed by applying oil to the portion of the compartment margin that will form the pattern before metal is deposited on the dielectric film.
  • a printing roll is used to apply the oil, but by narrowing the partition margin, the pattern width of the printing roll also becomes smaller, which may cause distortion in the printing roll.
  • the distortion generated in the printing roll also causes distortion in the partition margin formed on the dielectric film, which reduces the area of the deposited electrode and causes a decrease in the capacitance of the film capacitor.
  • the present inventors have studied a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can reduce the distortion of section margins and suppress variations in capacitance, and have arrived at the following invention. Ta.
  • FIG. 1A is a schematic diagram showing a metallized film 11 according to Embodiment 1 of the present invention.
  • FIG. 1B is an enlarged view of region E1 in FIG. 1A.
  • the metallized film 11 is a film in which a metal vapor-deposited electrode 13 is formed on the surface of a dielectric film 12. By laminating or winding the metallized film 11, a film capacitor 1 shown in FIG. 2, which will be described later, is formed.
  • the dielectric film 12 is, for example, a plastic film containing a thermoplastic resin such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate, or a hydroxyl group (OH group) possessed by the first organic material and an isocyanate possessed by the second organic material. It is formed from a plastic film containing a thermosetting resin such as a cured product obtained by reacting with a group (NCO group).
  • the metal vapor deposited electrode 13 is made of metal such as aluminum or zinc, for example.
  • the metal vapor-deposited electrode 13 is divided into a plurality of divided electrodes 13a by a plurality of slits 14 provided along the width direction W of the dielectric film 12.
  • the metal vapor-deposited electrode 13 includes a connecting portion 13b extending along the longitudinal direction L of the dielectric film 12 at one end of the dielectric film 12 in the width direction W.
  • Each of the plurality of divided electrodes 13a is connected to a connecting portion 13b via a fuse 15.
  • an insulating margin 16 in which no metal vapor-deposited electrode is formed is provided.
  • An insulating margin 16 is connected to each of the slits 14.
  • a notch 17 is provided at the corner of each of the plurality of divided electrodes 13a on the side facing the insulating margin 16. As shown in FIG. 1B, each notch 17 is formed at the end of the slit 14 in the direction toward the insulation margin 16 so that the width of the slit 14 becomes wider toward the insulation margin 16. In other words, the slit 14 is formed to widen from the width d1 to the width d2 toward the insulation margin 16 at the end on the insulation margin 16 side. Further, in this embodiment, the notch 17 is formed in a C-plane shape.
  • the slit width d1 of the slit 14 is formed to be 0.2 mm or less.
  • the slit 14 is a portion of the dielectric film 12 where the metal vapor deposited electrode 13 is not formed, and does not contribute to the capacitance of the film capacitor 1. Therefore, in order to increase the capacitance of the film capacitor 1 as much as possible, the slit width d1 is desirably small, and is preferably 0.2 mm or less. By setting the slit width d1 to 0.2 mm or less, the film capacitor 1 can be made smaller.
  • the ratio of the first slit width d1 of the slit 14 to the second slit width d2, which is wider than the slit width d1, is preferably 2 times or more and 42 times or less.
  • the second slit width d2 indicates the distance between the ends of adjacent divided electrodes 13a on the insulation margin 16 side.
  • the ratio of the distance d2 between the ends of the adjacent divided electrodes 13a on the insulation margin 16 side to the slit width d1 is preferably 2 times or more and 42 times or less.
  • the notch 17 is formed so that the ratio of the first slit width d1 to the second slit width d2 is 2 times or more and 42 times or less.
  • FIG. 2 is a schematic diagram showing the film capacitor 1 according to the first embodiment of the present invention.
  • the film capacitor 1 includes a wound body 10 in which a pair of metallized films 11 are wound one on top of the other, and a pair of end surface electrodes 20 arranged at both ends of the wound body 10.
  • FIG. 3 is a schematic diagram showing a pair of metallized films 11 included in the rolled body 10.
  • the rolled body 10 is formed by winding a pair of metallized films 11 stacked one on top of the other in the thickness direction. Note that the wound body 10 may be formed by laminating a plurality of metallized films 11.
  • the pair of metallized films 11 are stacked on top of each other with a displacement width As in the width direction W of the dielectric film 12. Further, the connection portions 13b of the respective metallized films 11 are stacked so as to be disposed on opposite sides in the width direction W of the dielectric film 12. After winding the pair of metallized films 11, the connecting portion 13b of one metallized film 11 is connected to one of the pair of end face electrodes 20, and the connecting portion 13b of the other metallized film 11 is connected to the pair of end electrodes 20. It is connected to the other end face electrode 20 .
  • connection part 13b Since the insulation margin 16 is formed at the end of the metallized film 11 opposite to the connection part 13b, a short circuit occurs between the connection part 13b of one metallized film 11 and the end surface electrode 20 of the other side. can be prevented.
  • FIG. 4 is a schematic diagram showing a metallized film manufacturing apparatus 100 according to Embodiment 1 of the present invention.
  • FIG. 5 is a perspective view showing the printing roll 40 of the metallized film manufacturing apparatus 100 of FIG. 4.
  • FIG. 6A is a plan view of the convex portion 41 of the printing roll 40 of FIG. 5 developed.
  • FIG. 6B is a diagram showing an insulation pattern printed by the convex portions 41 of the printing roll 40.
  • the metallized film manufacturing apparatus 100 includes a supply section 30, a printing roll 40, and a vapor deposition section 50.
  • the supply unit 30 supplies the dielectric film 12 to the metallized film manufacturing apparatus 100.
  • the printing roll 40 forms an insulating pattern on which no metal is deposited by applying oil to the surface of the dielectric film 12.
  • the vapor deposition section 50 vapor-deposits metal on the portions that are not coated with oil by the printing roll 40.
  • the dielectric film 12 is supplied from the supply unit 30 in the direction of arrow S1, that is, in the longitudinal direction L of the dielectric film 12, and the printing roll 40 forms an insulating pattern on the surface of the dielectric film 12.
  • oil is applied.
  • the metal vapor deposition electrode 13 is formed by the vapor deposition section 50 at a position on the surface of the dielectric film 12 excluding the insulating pattern.
  • the metallized film 11 on which the metal vapor-deposited electrode 13 is formed is sent in the direction of arrow S2 and wound up by the winding section 60.
  • An intermediate roller 61 is arranged between the supply section 30 and the winding section 60.
  • the printing roll 40 has a rotation axis Ax along the width direction W of the dielectric film 12 that is supplied in the longitudinal direction L. That is, the printing roll 40 has a rotation axis Ax in a direction intersecting the direction in which the dielectric film 12 is supplied, and applies oil to the surface of the dielectric film 12 to form an insulating pattern.
  • the insulation pattern shows areas where oil is applied, such as slits 14 and insulation margins 16, to provide areas on the surface of dielectric film 12 where no metal is deposited.
  • the printing roll 40 is formed into a generally cylindrical shape.
  • a slit forming portion 41 corresponding to the insulating pattern is provided on the outer peripheral surface of the printing roll 40.
  • the slit forming part 41 corresponds to the "convex part" of the present invention.
  • the slit forming portions 41 are formed to extend in the axial direction of the printing roll 40, and in this embodiment, a plurality of slit forming portions 41 are arranged at intervals in the circumferential direction of the printing roll 40.
  • Each of the slit forming portions 41 corresponds to each of the slits 14 of the metallized film 11.
  • the slit forming portions 41 are formed in two rows in the axial direction of the printing roll 40. By forming the slit forming portions 41 in two rows, two metallized films can be formed at once. Note that the slit forming portions 41 may be formed in one row, or may be formed in three or more rows.
  • the slit forming portion 41 is formed to be elongated along the axial direction Ax of the printing roll 40 and the width direction W of the dielectric film 12. Further, in order to reduce the slit width d1 of the slit 14, the width is formed small. For this reason, a reinforcing portion 42 is provided to prevent distortion from occurring at the end of the slit forming portion 41.
  • the reinforcing portion 42 is formed at one end of the slit forming portion 41 in the axial direction Ax of the printing roll 40 .
  • a notch 17 is formed at the corner of the divided electrode 13a of the metallized film 11, as shown in FIG. 1A. In other words, the reinforcing portion 42 corresponds to the notch 17 provided in the divided electrode 13a.
  • the printing roll 40 is formed with an insulating margin forming portion 43 that extends in the circumferential direction.
  • the insulating margin forming portion 43 corresponds to the insulating margin 16 of the metallized film 11 .
  • an insulating pattern 14a is an insulating pattern for forming the slit 14 shown in FIG. 1A.
  • the insulating pattern 17a is an insulating pattern for forming the notch 17 shown in FIG. 1A.
  • the insulation pattern 16a is an insulation pattern for forming the insulation margin 16 shown in FIG. 1A. In this way, the slit forming portion 41, the reinforcing portion 42, and the insulation margin forming portion 43 are formed in shapes that correspond to the insulation pattern.
  • FIG. 7 is a schematic diagram showing the process of forming an insulating pattern in the metallized film manufacturing apparatus 100 of FIG. 4.
  • Dielectric film 12 is supplied in the direction of arrow A1.
  • the oil 70 is supplied to the tip of the slit forming part 41.
  • the oil 70 attached to the tip of the slit forming part 41 is transferred to the dielectric film 12, and an insulating pattern is formed on the dielectric film 12.
  • the oil 70 is also supplied to the reinforcing portion 42 of the slit forming portion 41, and the insulation pattern is formed in a shape corresponding to the slit 14.
  • oil is also applied to a position corresponding to the insulation margin 16.
  • the width of the slit forming portion 41 is preferably 0.2 mm or less so as to correspond to the slit width d1. Further, the width of the slit forming portion 41 is formed such that the width gradually increases toward one end of the slit forming portion 41. Therefore, one end side of the slit forming portion 41 is formed so that the width increases toward the outside.
  • the ratio of the width of the end portion of the reinforcing portion 42 to the width of the slit forming portion 41 is preferably 2 times or more and 42 times or less. This corresponds to the ratio of the distance between the ends of adjacent divided electrodes 13a to the slit width d1.
  • the other end of the slit forming portion 41 is formed with a constant width.
  • the metal vapor deposited electrode 13 is formed by the vapor deposition section 50. At this time, metal is not deposited on the portion where the insulating pattern is formed, and becomes the slit 14 and the insulating margin 16. Since the slit forming part 41 is provided with the reinforcing part 42, the notch 17 is formed at the corner of the divided electrode 13a of the metal vapor deposited electrode 13, as shown in FIG. 1A.
  • the end portion of the slit forming portion 41 can be reinforced and distortion at the end portion of the slit forming portion 41 can be reduced.
  • the metallized film 11 on which the metal vapor-deposited electrode 13 is formed by the vapor deposition section 50 is wound up by the winding section 60.
  • FIG. 8 is a table showing the relationship between the slit width d1, the distance between the ends of adjacent divided electrodes on the insulation margin side, and the occurrence of distortion in the divided electrodes.
  • the electrode width d3 (see FIG. 1A) of the divided electrode 13a was kept constant at 2 mm, and the slit width d1 was changed to 0.1 mm, 0.2 mm, and 0.05 mm. Furthermore, the distance d2 between the ends of adjacent divided electrodes 13a on the insulation margin 16 side (indicated by "end distance d2" in FIG. 8) was changed. By changing the chamfer dimension d4 shown in FIG. 1A, the end distance d2 is changed.
  • the chamfer dimension d4 indicates the size of the notch 17 in the width direction of the divided electrode 13a (longitudinal direction L of the dielectric film 12) at the end of the divided electrode 13a on the insulating margin 16 side.
  • the end distance d2/slit width d1 is 11 times. That is, the ratio of the distance d2 between the ends of the adjacent divided electrodes 13a on the insulation margin 16 side to the slit width d1 is 11 times.
  • the end distance d2/slit width d1 is twice, and when the slit width d1 is 0.05 mm and the end distance d2 is 2.
  • the end distance d2/slit width d1 is 42 times, and when the slit width d1 is 0.1 mm and the end distance d2 is 0.15 mm, the end distance d2/slit width d1 is 1. It is 5 times more.
  • the No. in the table of FIG. No. 4 is a comparative example in which there is no reinforcing portion. 1 ⁇ No. 3 and no. 5 is an example in which a reinforcing portion is provided. No. In Example 5, distortion occurred because the reinforcing portion was small, but the degree of distortion was smaller than in the case without the reinforcing portion.
  • the metal vapor deposited electrode 13 can be formed as designed using the printing roll 40.
  • the metal vapor deposited electrode 13 can be formed as designed. Therefore, the shape of the divided electrodes 13a can be stabilized, and when the film capacitor 1 is formed using the metallized film 11, a decrease in capacitance can be suppressed.
  • the metallized film 11 includes a dielectric film 12 and a metal vapor-deposited electrode 13.
  • the metal vapor deposited electrode 13 is formed on the surface of the dielectric film 12 so that an insulation margin 16 is provided at one end of the dielectric film 12 in the width direction, and a slit is provided along the width direction of the dielectric film 12. It includes a plurality of divided electrodes 13a divided by 14. Each of the plurality of divided electrodes 13a is provided with a notch 17 at a corner on the side facing the insulating margin 16.
  • the width d1 of the slit 14 is 0.2 mm or less.
  • the capacitance of the film capacitor can be increased by reducing the slit width.
  • the ratio of the distance between the ends of the adjacent divided electrodes 13a on the insulation margin 16 side to the width d1 of the slit 14 is 2 times or more and 42 times or less.
  • the notch 17 is formed in a C-plane shape.
  • the film capacitor 1 includes the above-described metallized film 11 and end electrodes 20. End surface electrodes 20 are arranged at both ends of metallized film 11 .
  • the metallized film manufacturing apparatus 100 includes a supply section 30, a printing roll 40, and a vapor deposition section 50.
  • the supply unit 30 supplies the dielectric film 12 in the longitudinal direction.
  • the printing roll 40 has a rotation axis in the width direction of the dielectric film 12 and prints an insulating pattern on the surface of the dielectric film 12.
  • the vapor deposition section 50 forms the metal vapor deposited electrode 13 at a position on the surface of the dielectric film 12 excluding the insulating pattern.
  • the printing roll 40 is formed to extend in the axial direction on the outer peripheral surface of the printing roll 40, and has a convex portion 41 corresponding to the insulating pattern.
  • a reinforcing portion 42 is formed at one end of the convex portion 41 in the width direction of the dielectric film 12 .
  • the reinforcing portion 42 is formed so that its width gradually increases toward one end of the convex portion 41.
  • the width of the portion of the protrusion 41 where the reinforcing portion 42 is not formed is 0.2 mm or less.
  • the width d1 of the slit 14 of the metallized film 11 can be reduced, and the capacitance of the film capacitor 1 can be increased.
  • the ratio of the width of the reinforcing part 42 on one end side of the protrusion 41 to the width of the protrusion 41 is 2 times or more and 42 times or less.
  • the other end of the convex portion 41 in the width direction of the dielectric film 12 is formed with a constant width.
  • the area of the divided electrodes 13a can be made as large as possible, and the capacitance of the film capacitor 1 can be increased.
  • FIG. 9 is a schematic diagram showing a metallized film according to Modification 1 of Embodiment 1. As shown in FIG. 9, in the metallized film 111, the notch 117 is formed larger than the notch 17 of the metallized film 11 according to the first embodiment, and the tip of the divided electrode 113a is formed in a sharp shape. You can leave it there.
  • FIG. 10 is a schematic diagram showing a metallized film according to a second modification of the first embodiment.
  • the notch 217 may be formed in a rounded shape.
  • the corners of the divided electrode 213a have a rounded shape, and distortion of the divided electrode 213a can be further suppressed. stomach.
  • FIG. 11 is a schematic diagram showing a metallized film according to Modification 3 of Embodiment 1.
  • the notch 317 may be formed in a rounded shape, and the end portions of the divided electrodes 313a may be formed in an arc shape.
  • the metallized film manufacturing apparatus of the present invention has a supply unit that supplies the dielectric film in the longitudinal direction, a rotating shaft in the width direction of the dielectric film, and prints an insulating pattern on the surface of the dielectric film.
  • the printing roll includes a printing roll and a vapor deposition part forming a metal vapor deposition electrode at a position on the surface of the dielectric film other than the insulation pattern, and the printing roll is formed extending in the axial direction on the outer peripheral surface of the printing roll, and the insulation pattern is formed on the outer peripheral surface of the printing roll. It has a corresponding convex portion, and a reinforcing portion is formed at one end of the convex portion in the axial direction of the printing roll.
  • the reinforcing portion may be formed so that the width gradually increases toward one end of the convex portion in the axial direction of the printing roll.
  • the width of the portion of the convex portion where the reinforcing portion is not formed may be 0.2 mm or less.
  • the ratio of the width of one end side of the convex part of the reinforcing part to the width of the convex part is 2 times or more and 42 times or less. Good too.
  • the other end of the convex portion in the width direction of the dielectric film may be formed with a constant width.
  • the metallized film of the present invention includes a dielectric film and a metal vapor-deposited electrode formed on the surface of the dielectric film so that an insulation margin is provided at one end in the width direction of the dielectric film.
  • the metal vapor-deposited electrode includes a plurality of divided electrodes divided by slits provided along the width direction of the dielectric film, and each of the plurality of divided electrodes has a notch at the corner facing the insulation margin. It is provided.
  • the width of the slit may be 0.2 mm or less.
  • the ratio of the distance between the ends of the adjacent divided electrodes on the insulation margin side to the width of the slit may be 2 times or more and 42 times or less.
  • the notch may be formed in a C-plane shape.
  • the notch may be formed in a rounded shape.
  • the film capacitor of the present invention includes the metallized film of any one of (6) to (10) and a pair of end face electrodes arranged at both ends of the metallized film.
  • the present invention can be widely applied to metallized films for forming film capacitors and manufacturing equipment thereof.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2023/023789 2022-07-07 2023-06-27 金属化フィルム製造装置、金属化フィルム、およびフィルムコンデンサ Ceased WO2024009844A1 (ja)

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JP2024532056A JPWO2024009844A1 (https=) 2022-07-07 2023-06-27
CN202380051023.2A CN119384709A (zh) 2022-07-07 2023-06-27 金属化薄膜制造装置、金属化薄膜以及薄膜电容器
US19/005,773 US20250149265A1 (en) 2022-07-07 2024-12-30 Metallized film manufacturing device, metallized film, and film capacitor

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JP2022-109957 2022-07-07
JP2022109957 2022-07-07

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US19/005,773 Continuation US20250149265A1 (en) 2022-07-07 2024-12-30 Metallized film manufacturing device, metallized film, and film capacitor

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Publication number Priority date Publication date Assignee Title
JPH0189727U (https=) * 1987-12-04 1989-06-13
US5061837A (en) * 1989-05-02 1991-10-29 Webex, Inc. Method and apparatus for selectively demetallizing a metallized film
JP2000345318A (ja) * 1999-06-02 2000-12-12 Toyo Metallizing Co Ltd コンデンサ用蒸着フィルムの製造方法
JP2002504747A (ja) * 1998-02-17 2002-02-12 エプコス アクチエンゲゼルシャフト 自己回復型シートコンデンサのための金属化部
JP2017143170A (ja) * 2016-02-10 2017-08-17 パナソニックＩｐマネジメント株式会社 金属化フィルムとこの金属化フィルムを用いた金属化フィルムコンデンサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7296734B2 (ja) * 2019-01-23 2023-06-23 株式会社指月電機製作所 金属化フィルム及び金属化フィルムコンデンサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189727U (https=) * 1987-12-04 1989-06-13
US5061837A (en) * 1989-05-02 1991-10-29 Webex, Inc. Method and apparatus for selectively demetallizing a metallized film
JP2002504747A (ja) * 1998-02-17 2002-02-12 エプコス アクチエンゲゼルシャフト 自己回復型シートコンデンサのための金属化部
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JP2017143170A (ja) * 2016-02-10 2017-08-17 パナソニックＩｐマネジメント株式会社 金属化フィルムとこの金属化フィルムを用いた金属化フィルムコンデンサ

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