WO2024009843A1 - Method for producing circuit device and resin composition for sealing - Google Patents

Method for producing circuit device and resin composition for sealing Download PDF

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Publication number
WO2024009843A1
WO2024009843A1 PCT/JP2023/023766 JP2023023766W WO2024009843A1 WO 2024009843 A1 WO2024009843 A1 WO 2024009843A1 JP 2023023766 W JP2023023766 W JP 2023023766W WO 2024009843 A1 WO2024009843 A1 WO 2024009843A1
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WIPO (PCT)
Prior art keywords
solder paste
circuit board
resin composition
solder
resin
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PCT/JP2023/023766
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French (fr)
Japanese (ja)
Inventor
渓杜 大津
康剛 森
敏和 沼尾
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デクセリアルズ株式会社
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Publication of WO2024009843A1 publication Critical patent/WO2024009843A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a method for manufacturing a circuit device, specifically a semiconductor device, and a sealing resin composition used in the manufacturing method.
  • solder reflow processing is a process that can be expected to have a self-alignment effect.
  • a liquid sealing resin composition is supplied so as to seal the solder joint, and a resin seal is formed by heat curing treatment, thereby mounting.
  • Patent Document 1 it has been proposed to simultaneously perform heat curing treatment of the sealing resin composition (reflow curing treatment) during the reflow treatment.
  • either the bump electrode of the surface mount component or the mounting electrode of the circuit board is formed with solder
  • either the mounting electrode formation surface of the circuit board or the bump electrode formation surface of the surface mount component is formed with solder.
  • solder paste is not used, instead of forming either the mounting electrode of the circuit board or the bump electrode of the surface mount component with solder, solder paste is applied to the electrode pad of the circuit board. It has not been investigated what kind of results will be obtained if it is applied. For this reason, the present inventors discovered that when manufacturing a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part.
  • solder paste is placed between the electrodes of the circuit board and the electrodes of the mounting component, a sealing resin composition is placed around the periphery of the solder paste, and a reflow process is performed on the solder paste to form a solder joint.
  • a reflow process is performed on the solder paste to form a solder joint.
  • the purpose is to suppress the scattering of solder particles when forming a solder joint portion and a resin sealing portion, and also to prevent deterioration of self-alignment characteristics during reflow processing of the solder paste.
  • the present inventors have discovered that the cause of solder particle scattering is that the liquid resin component of the sealing resin composition diffuses into the solder paste during the reflow curing process, vaporizes near the solder particles in the solder paste, and becomes fine. It has been found that voids are formed, and these voids grow explosively during the reflow hardening process.
  • the present inventors also investigated the flux used in the solder paste based on the assumption that scattering of solder particles can be suppressed by suppressing the diffusion of the liquid resin component of the sealing resin composition into the solder paste.
  • the present inventors have discovered that the object of the present invention can be achieved by adjusting the difference between the solubility parameter of the solvent contained in the resin composition and the solubility parameter of the liquid resin component of the sealing resin composition, and have completed the present invention. .
  • the present invention is a method for manufacturing a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part, comprising: As a first manufacturing method, solder paste is placed on the electrodes of the circuit board, a sealing resin composition is placed on at least a portion of the periphery of the solder paste, and the electrodes of the mounting component are aligned with the electrodes of the circuit board. Then, a solder joint is formed by applying reflow treatment to the solder paste sandwiched between the electrodes of the circuit board and the electrodes of the mounting component, and the sealing resin composition is heated during the reflow treatment.
  • a manufacturing method for joining a circuit board and a mounting component by curing the material and forming a resin sealing part As a second manufacturing method, solder paste is placed on the electrodes of the circuit board, the electrodes of the mounting component are aligned with the electrodes of the circuit board, and a sealing resin composition is applied to at least part of the periphery of the mounting component. The solder paste sandwiched between the electrodes of the circuit board and the electrodes of the mounting component is then subjected to reflow treatment to form a solder joint, and the sealing resin is melted by heating during the reflow treatment.
  • a manufacturing method is provided in which a circuit board and a mounting component are bonded by curing a composition to form a resin sealing part.
  • the solubility parameter of the solvent contained in the flux of the solder paste is the "solvent SP value”
  • the solubility parameter of the liquid resin component of the sealing resin composition is the "resin SP value”.
  • the liquid resin component is a resin component (monomer, oligomer, or polymer) that flows at room temperature under atmospheric pressure.
  • the specific gravity of the solvent contained in the flux of the solder paste is defined as the "solvent specific gravity”
  • the liquid state of the sealing resin composition is
  • the specific gravity of the resin component is defined as “resin specific gravity”
  • the present invention also provides a resin-sealed portion of a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin-sealed portion.
  • a sealing resin composition for forming a sealant is provided.
  • This encapsulating resin composition has a solubility parameter of the solvent contained in the flux of the solder paste as the "solvent SP value", and a solubility parameter of the liquid resin component of the encapsulating resin composition as the "resin SP value". It is characterized by satisfying the following formula (1), preferably formula (2).
  • a solder joint is formed by subjecting a solder paste sandwiched between an electrode of a circuit board and an electrode of a mounting component to a reflow process.
  • this is a manufacturing method in which a circuit board and a mounting component are bonded by curing a sealing resin composition by heating during reflow processing to form a resin sealing part.
  • the solubility parameter of the solvent contained in the flux of the solder paste is defined as the "solvent SP value”
  • the solubility parameter of the liquid resin component of the sealing resin composition is defined as the "resin SP value.”
  • the value obtained by subtracting the resin SP value from the SP value is -0.25 or more (see equation (1) above).
  • FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention.
  • FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention.
  • FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention.
  • FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention.
  • 1 is a schematic cross-sectional view of a circuit device that is an object of the manufacturing method of the present invention. It is a process explanatory diagram of the 2nd manufacturing method of this invention. It is a process explanatory diagram of the 2nd manufacturing method of this invention. It is a process explanatory diagram of the 2nd manufacturing method of this invention. It is a process explanatory diagram of the 2nd manufacturing method of this invention.
  • 1 is a schematic cross-sectional view of a circuit device that is an object of the manufacturing method of the present invention.
  • circuit device that is the object of the first and second manufacturing methods of the present invention
  • the object of the first and second manufacturing methods of the present invention is that a circuit board 1 and a mounting component 2 are joined by a solder joint 3 derived from solder paste, and the solder
  • solder This is a circuit device 10 in which the periphery of a joint portion 3 is sealed with a resin sealing portion 4.
  • the solder joint portion 3 is arranged between the electrode pad 1a of the circuit board 1 and the bump electrode 2a of the mounting component 2.
  • Examples of the circuit board 1 include known substrates such as a semiconductor substrate, a flexible circuit board, a rigid wiring board, and a printed wiring board, among which semiconductor substrates are preferred.
  • the electrode pad 1a can be replaced with another type of electrode, such as a bump electrode.
  • the mounting component 2 various known components for surface mounting can be used, such as a semiconductor chip, a light emitting diode, a capacitor chip, a resistor element, etc. Among these, semiconductor chips are preferred.
  • the bump electrode 2a of the mounting component 2 a known bump electrode such as a gold bump or a solder bump can be used.
  • the bump electrode 2a can be replaced with another type of electrode, such as an electrode pad.
  • the solder joint portion 3 is formed by reflowing solder paste, and provides electrical continuity between the bump electrode 2a of the mounting component 2 and the electrode pad 1a of the circuit board 1. Furthermore, during solder paste reflow processing, the solder joints 3 tend to remain on the surface of the electrode pads 1a without spreading beyond the periphery of the electrode pads 1a. 2 can be self-aligned.
  • solder paste for forming the solder joint 3 can be appropriately selected from known solder pastes.
  • Solder paste is generally a uniform mixture of solder particles having an average particle size of 10 to 40 ⁇ m and flux for removing an oxide film on the solder surface.
  • As the flux a known flux prepared by mixing rosin or the like with a high boiling point solvent together with an activator such as an organic acid, a thixotropic agent, etc. can be used.
  • the high boiling point solvent that causes voids to occur in the solder joint 3 is selected in consideration of the reflow treatment temperature, etc., and carbitol-based solvents, particularly hexyl carbitol, can be preferably used.
  • the first method for manufacturing a circuit device of the present invention includes the following steps A1 to D1.
  • solder paste 3' is placed on the electrode pad 1a of the circuit board 1.
  • the solder paste 3' can be placed on the electrode pad 1a by a known method, for example, by using a precision dispenser.
  • a sealing resin composition 4' is placed on at least a portion of the periphery of the solder paste 3'.
  • the sealing resin composition 4' can be placed on at least a portion of the periphery of the solder paste 3' placed on the electrode pad 1a by a known method, and can be applied using a dispenser, for example.
  • those used as underfill agents can be used.
  • an epoxy resin composition, a (meth)acrylic resin composition, etc. can be applied.
  • These resin compositions contain a thermal acid generator, a thermal polymerization initiator, etc. depending on the type of resin. If necessary, a photopolymerization initiator and a photoacid generator can also be contained.
  • Step C1 Next, as shown in FIG. 1C, the mounting component 2 is placed on the circuit board 1. Specifically, the bump electrodes 2a of the mounting component 2 are aligned with the electrode pads 1a of the circuit board 1, and pressed lightly if necessary. As a result, the bump electrodes 2a of the mounting component 2 come into contact with the solder paste 3', and the space between the opposing surfaces of the circuit board 1 and the mounting component 2 is filled with the sealing resin composition 4'. In some cases, the surface side of the mounting component 2 can also be covered with the sealing resin composition 4'.
  • solder paste 3' sandwiched between the electrode pad 1a of the circuit board 1 and the bump electrode 2a of the mounting component 2 is subjected to a reflow process.
  • the solder paste 3' is heated to a temperature higher than the melting temperature of the solder particles, the oxide film on the surface of the solder particles is removed by flux, and the solder paste is spread wet between the electrode pad 1a and the bump electrode 2a.
  • a solder joint 3 is formed.
  • the sealing resin composition 4' is cured by heating during the reflow process to form the resin sealing portion 4.
  • the reflow process in the present invention has the meaning of a reflow curing process in which the reflow process of the solder paste and the curing process of the sealing resin composition are performed simultaneously. Note that during the reflow curing process, the solder paste and the sealing resin composition flow, and as a result, self-alignment can be realized in which the mounting component 2 moves to an appropriate position with respect to the circuit board 1. . Thereby, the circuit board 1 and the mounting component 2 can be joined, and a circuit device 10 having the structure shown in FIG. 1E is obtained.
  • the second method for manufacturing a circuit device of the present invention includes the following steps A2 to D2.
  • solder paste 3' is placed on the electrode pad 1a of the circuit board 1.
  • the solder paste 3' can be placed on the electrode pad 1a by a known method, for example, by using a precision dispenser.
  • the mounting component 2 is placed on the circuit board 1. Specifically, the bump electrodes 2a of the mounting component 2 are aligned with the electrode pads 1a of the circuit board 1, and pressed lightly if necessary. Thereby, the bump electrode 2a of the mounting component 2 comes into contact with the solder paste 3'.
  • a sealing resin composition 4' is placed on at least a portion of the periphery of the mounting component 2.
  • the sealing resin composition 4' can be placed on at least a portion of the periphery of the mounting component 2 by a known method, and can be applied using a dispenser, for example.
  • those used as underfill agents can be used.
  • an epoxy resin composition, a (meth)acrylic resin composition, etc. can be applied.
  • These resin compositions contain a thermal acid generator, a thermal polymerization initiator, etc. depending on the type of resin. If necessary, a photopolymerization initiator and a photoacid generator can also be contained.
  • solder paste 3' sandwiched between the electrode pad 1a of the circuit board 1 and the bump electrode 2a of the mounting component 2 is subjected to a reflow process.
  • the solder paste 3' is heated to a temperature higher than the melting temperature of the solder particles, the oxide film on the surface of the solder particles is removed by flux, and the solder paste is spread wet between the electrode pad 1a and the bump electrode 2a.
  • a solder joint 3 is formed.
  • the sealing resin composition 4' is cured by heating during reflow processing to form the resin sealing part 4.
  • the reflow process in the present invention has the meaning of a reflow curing process in which the reflow process of the solder paste and the curing process of the sealing resin composition are performed simultaneously. Note that during the reflow curing process, the solder paste and the sealing resin composition flow, and as a result, self-alignment can be realized in which the mounting component 2 moves to an appropriate position with respect to the circuit board 1. . Thereby, the circuit board 1 and the mounting component 2 can be joined, and the circuit device 10 having the structure shown in FIG. 2E is obtained.
  • the solubility parameter by the Fedors method of the solvent contained in the flux of the solder paste is defined as the "solvent SP value”. It is characterized in that it satisfies the following formula (1), preferably formula (2), when the solubility parameter of the liquid resin component of the sealing resin composition is defined as a "resin SP value”.
  • the "solvent SP value” when multiple solvents are used together is the sum of the values obtained by multiplying the SP value of each solvent by its content ratio, and the encapsulating resin composition
  • the "resin SP value” is obtained by multiplying the SP value of each resin by its content ratio. is the sum of the calculated values.
  • Equation (1) is based on the fact that if the value obtained by subtracting the resin SP value from the solvent SP value is less than -0.25, it will not be possible to prevent solder particles from scattering during reflow processing and proper self-alignment will not be achieved. It is stipulated based on the following. In other words, the formula (1) states that if the value obtained by subtracting the resin SP value from the solvent SP value is -0.25 or more, it is possible to prevent solder particles from scattering during reflow processing, and to properly This has the significance of being able to achieve accurate self-alignment.
  • the upper limit is not specified in formula (1), this means that when the value obtained by subtracting the resin SP value from the solvent SP value increases, the amount of the liquid resin component of the sealing resin composition and the flux of the solder paste increases. This makes it difficult for the liquid resin component of the sealing resin composition to diffuse into the solder paste, making it possible to suppress scattering of solder particles and achieve proper self-alignment. This is because, since it is possible, there is little point in specifying an upper limit. However, taking into account the results of the examples described later, it is inferred that it is necessary to be at least 2.00 or less.
  • Formula (2) stipulates that if the value obtained by subtracting the resin SP value from the solvent SP value is 0.7 or more, the liquid resin component of the sealing resin composition and the solvent contained in the solder paste flux are become incompatible with each other, making it difficult for the liquid resin component of the sealing resin composition to diffuse into the solder paste.As a result, scattering of solder particles can be more effectively prevented during reflow processing, and This has the significance of being able to achieve proper self-alignment.
  • the specific gravity of the solvent contained in the flux of the solder paste and the sealing resin composition greatly influences the effects of the invention. That is, if the specific gravity of the liquid resin component of the sealing resin composition that covers the solder paste is lower than the specific gravity of the solvent contained in the flux of the solder paste, the liquid resin component (liquid monomer, liquid (oligomers, liquid polymers) become difficult to diffuse into the solder paste, and as a result, they vaporize not near the solder particles but near the surface of the sealing resin composition.
  • the "solvent specific gravity" when multiple solvents are used together in flux is the sum of the values obtained by multiplying the specific gravity of each solvent by its content ratio, and also the sum of the values obtained by multiplying the specific gravity of each solvent by its content ratio. Then, when liquid monomer, liquid oligomer, liquid polymer) are used together, the "resin specific gravity” is the sum of the values obtained by multiplying the specific gravity of each liquid resin component by its content ratio. .
  • the upper limit is not specified in formula (4), this is because the larger the value obtained by subtracting the resin specific gravity from the solvent specific gravity, the more difficult it is for the liquid resin component of the sealing resin composition to diffuse into the solder paste. This is because, as a result, scattering of solder particles can be suppressed and proper self-alignment can also be achieved, so there is little point in defining the upper limit. However, taking into consideration the results of the examples described later, it is inferred that it is necessary to be at least 0.1 or less.
  • a method for satisfying formula (1), (2), (3), or (4) is a method of selecting a solvent for the flux of the solder paste and selecting a composition of the sealing resin composition. can be mentioned.
  • the sealing resin composition applied to the manufacturing method of the present invention can be defined as follows, and is one embodiment of the present invention. That is, the sealing resin composition of the present invention can be applied to a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part.
  • liquid resin components liquid monomer, liquid oligomer, or liquid polymer
  • the solder paste has an alloy composition of 3.0% Ag-0.5% Cu-Sn (remainder), and the solvent in the flux is hexyl carbitol (solvent SP value: 10.22, solvent specific gravity: 0. 94) was used.
  • YX8000 High purity hydrogenated epoxy resin
  • Mitsubishi Chemical Corporation NK ester LC3 Tricyclodecane dimethanol dimethacrylate, Shin Nakamura Chemical Co., Ltd.
  • HDDA 1,6-hexanediol diacrylate
  • EXA-850CRP Bisphenol A type liquid epoxy resin
  • DIC Corporation 4HBA 4-Hydroxybutyl acrylate
  • HEA Hydroxyethyl acrylate
  • Perloyl L Dilauroyl peroxide
  • NOF Corporation Amicure AH-154 Dicyandiamide, Ajinomoto Fine Techno, Inc.
  • Examples 1 to 15, Comparative Examples 1 to 5 (Preparation of resin composition for sealing) A resin composition for sealing was prepared by uniformly mixing the liquid resin component of the resin composition for sealing shown in Table 1 and a curing agent at the mixing ratio shown in Table 1.
  • Table 1 also lists the resin SP value and resin specific gravity of the liquid resin component, and also shows the numerical values of "(solvent SP value) - (resin SP value)” and "(solvent specific gravity) - (resin specific gravity)”. )”.
  • the test mounting component was placed on the test circuit board by aligning the bump electrode of the test mounting component with the electrode pad of the board and pressing lightly.Next, the peripheral edge 4 of the test mounting component was placed on the test circuit board.
  • 80 mg of the sealing resin composition was applied to two adjacent sides in the middle, and the temperature was raised from room temperature to 170°C at a rate of 3°C/second in the atmosphere, held at 170°C for 90 seconds, and then heated at 2°C/second.
  • a reflow curing process was performed in which the temperature was raised to 250°C in seconds and cooled to room temperature at 2°C/second, thereby forming the solder joint and the resin sealing part.As a result, the structure shown in Figure 2E was formed. Created a circuit device.
  • Test circuit board used As a test circuit board, an FR-4 grade circuit board (20 x 40 x 0.6 (mm)) having copper wiring (1.0 x 7.2 (mm)) with gold plating on the surface was used. .
  • Test mounting parts used A semiconductor element (5 x 9.5 x 1 (mm)) having a (1.0 x 7.2 (mm)) bump electrode was used as a test mounting component.
  • the manufacturing method of the present invention when the solubility parameter of the solvent contained in the flux of the solder paste is defined as the "solvent SP value”, and the solubility parameter of the liquid resin component of the sealing resin composition is defined as the "resin SP value”,
  • the value obtained by subtracting the resin SP value from the solvent SP value is -0.25 or more (see equation (1) above). Therefore, when forming a solder joint and a resin sealing part through a single reflow curing process, it is necessary to suppress the scattering of solder particles and to prevent the self-alignment characteristics of the solder paste from deteriorating during the reflow process. Can be done. Therefore, the manufacturing method of the present invention is useful as a manufacturing method for circuit devices such as semiconductor devices.
  • Circuit board 1a Electrode pad of circuit board 2 Mounting component 2a Bump electrode of mounting component 3 Solder joint 3' Solder paste 4 Resin sealing part 4' Sealing resin composition 10 Circuit device

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Abstract

A method for producing a circuit device according to the present invention joins a circuit board and a mounting component to each other by: arranging a solder paste on an electrode of the circuit board; arranging a resin composition for sealing on at least a part of the periphery of the solder paste; aligning an electrode of the mounting component on the electrode of the circuit board; and forming a solder bonded part by subjecting the solder paste held between the electrode of the circuit board and the electrode of the mounting component to a reflow treatment, while forming a resin sealed part by curing the resin composition for sealing by means of the heating during the reflow treatment. Meanwhile, if (Solvent SP value) is the solubility parameter of a solvent that is contained in a flux of the solder paste and (Resin SP value) is the solubility parameter of a liquid resin component of the resin composition for sealing, the following formula (1) is satisfied. (1): (Solvent SP value) - (Resin SP value) ≥ -0.25

Description

回路装置の製造方法及び封止用樹脂組成物Method for manufacturing circuit device and resin composition for sealing
　本発明は、回路装置、具体的には半導体装置の製造方法、並びにその製造方法に使用する封止用樹脂組成物に関する。 The present invention relates to a method for manufacturing a circuit device, specifically a semiconductor device, and a sealing resin composition used in the manufacturing method.
　従来、回路基板に実装部品、例えば半導体チップを実装する方法の１つとして、ハンダリフロー法を採用して実装する方法がある。この方法では、回路基板の電極パッドにハンダペーストを塗布し、ハンダペースト上に半導体チップをそのバンプ電極が電極パッドに対応するように載置し、セルフアライメント作用を期待できる処理であるハンダリフロー処理によりハンダ接合部を形成した後、液状の封止用樹脂組成物をハンダ接合部を封止するように供給し、加熱硬化処理により樹脂封止部を形成することで実装している。しかし、この方法では、セルフアライメント作用が期待できるものの、ハンダリフロー処理と封止用樹脂組成物の加熱硬化処理とが別々の工程で行われているため、生産性が低下し、実装コストの低減が困難という問題がある。 Conventionally, one method for mounting components, such as semiconductor chips, on a circuit board is to use a solder reflow method. In this method, solder paste is applied to the electrode pads of the circuit board, and the semiconductor chip is placed on the solder paste so that its bump electrodes correspond to the electrode pads. Solder reflow processing is a process that can be expected to have a self-alignment effect. After forming a solder joint, a liquid sealing resin composition is supplied so as to seal the solder joint, and a resin seal is formed by heat curing treatment, thereby mounting. However, although this method can be expected to have a self-alignment effect, the solder reflow treatment and the heat curing treatment of the encapsulating resin composition are performed in separate processes, which reduces productivity and reduces mounting costs. The problem is that it is difficult.
　そこで、リフロー処理の際に、同時に封止用樹脂組成物の加熱硬化処理も行うこと（リフロー硬化処理）が提案されている（特許文献１）。この特許文献１では、表面実装部品のバンプ電極と回路基板の実装用電極のいずれか一方をハンダで形成し、回路基板の実装用電極形成面又は表面実装部品のバンプ電極形成面のいずれか一方に電極を覆わないようにアンダーフィル用液状エポキシ樹脂組成物を塗布した後、回路基板の実装用電極と表面実装部品のバンプ電極とが対向するように、回路基板に表面実装部品を載置し、リフロー硬化処理している。 Therefore, it has been proposed to simultaneously perform heat curing treatment of the sealing resin composition (reflow curing treatment) during the reflow treatment (Patent Document 1). In Patent Document 1, either the bump electrode of the surface mount component or the mounting electrode of the circuit board is formed with solder, and either the mounting electrode formation surface of the circuit board or the bump electrode formation surface of the surface mount component is formed with solder. After applying a liquid epoxy resin composition for underfill so as not to cover the electrodes, place the surface mount component on the circuit board so that the mounting electrode of the circuit board and the bump electrode of the surface mount component face each other. , reflow hardening process.
特開２０１５－１０８１５５号公報Japanese Patent Application Publication No. 2015-108155
　しかしながら、特許文献１では、ハンダペーストを使用していないため、回路基板の実装用電極と表面実装部品のバンプ電極のいずれかをハンダで形成することに代えて、回路基板の電極パッドにハンダペーストを塗布した場合にどのような結果が得られるのかは検討されていない。このため、本発明者らは、回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置を製造する際に、回路基板の電極と実装用部品の電極との間にハンダペーストを配し、ハンダペーストの周縁に封止用樹脂組成物を配し、ハンダペーストに対してリフロー処理を施すことによりハンダ接合部を形成すると共に、リフロー処理の際の加熱により封止用樹脂組成物を硬化させて樹脂封止部を形成することにより、回路基板と実装用部品とを接合することを試みたところ、以下のような問題が発生した。 However, in Patent Document 1, since solder paste is not used, instead of forming either the mounting electrode of the circuit board or the bump electrode of the surface mount component with solder, solder paste is applied to the electrode pad of the circuit board. It has not been investigated what kind of results will be obtained if it is applied. For this reason, the present inventors discovered that when manufacturing a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part. First, solder paste is placed between the electrodes of the circuit board and the electrodes of the mounting component, a sealing resin composition is placed around the periphery of the solder paste, and a reflow process is performed on the solder paste to form a solder joint. When we attempted to bond the circuit board and the mounting component by forming a resin sealing part and curing the sealing resin composition by heating during reflow treatment, we found the following results. A problem like this occurred.
　即ち、リフロー処理の際に、対向電極間に挟持されているハンダペーストに意図しないボイドが生じるため、バンダペーストに含有されている微細なハンダ粒子が封止用樹脂組成物と共に、本来接続に関与すべきハンダ接合部の外側まで飛散するという問題があった。そのようなハンダ粒子の飛散が発生すると、接続すべき対向電極間のハンダ粒子濃度が低下し、導通信頼性が損なわれることが懸念されるだけでなく、ハンダリフロー処理によるセルフアライメント特性が低下することも懸念される。 In other words, during the reflow process, unintended voids are created in the solder paste sandwiched between opposing electrodes, so that the fine solder particles contained in the bander paste, together with the sealing resin composition, are originally involved in the connection. There was a problem in that the solder was scattered to the outside of the solder joint. When such scattering of solder particles occurs, the concentration of solder particles between opposing electrodes to be connected decreases, and there is a concern that continuity reliability may be impaired, as well as self-alignment characteristics due to solder reflow processing deteriorate. This is also a concern.
　本発明の目的は、回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置を、一度のリフロー硬化処理によりハンダ接合部と樹脂封止部とを形成する際に、ハンダ粒子の飛散を抑制すると共に、ハンダペーストのリフロー処理時のセルフアライメント特性を低下させないことである。 It is an object of the present invention to process a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part, through a one-time reflow hardening process. The purpose is to suppress the scattering of solder particles when forming a solder joint portion and a resin sealing portion, and also to prevent deterioration of self-alignment characteristics during reflow processing of the solder paste.
　本発明者らは、ハンダ粒子の飛散が生ずる要因が、リフロー硬化処理中に封止用樹脂組成物の液状樹脂成分がハンダペースト内に拡散し、ハンダペースト内のハンダ粒子近傍で気化して微細なボイドが形成され、更にそのボイドがリフロー硬化処理中に爆発的に大きくなることにあることを知見した。また、本発明者らは、封止用樹脂組成物の液状樹脂成分のハンダペースト内への拡散を抑制すればハンダ粒子の飛散を抑制できるとの仮定の下、ハンダペーストに用いられているフラックスに含有されている溶剤の溶解度パラメータと、封止用樹脂組成物の液状樹脂成分の溶解度パラメータとの差を調整することにより本願発明の目的を達成できることを見出し、本発明を完成させるに至った。 The present inventors have discovered that the cause of solder particle scattering is that the liquid resin component of the sealing resin composition diffuses into the solder paste during the reflow curing process, vaporizes near the solder particles in the solder paste, and becomes fine. It has been found that voids are formed, and these voids grow explosively during the reflow hardening process. The present inventors also investigated the flux used in the solder paste based on the assumption that scattering of solder particles can be suppressed by suppressing the diffusion of the liquid resin component of the sealing resin composition into the solder paste. The present inventors have discovered that the object of the present invention can be achieved by adjusting the difference between the solubility parameter of the solvent contained in the resin composition and the solubility parameter of the liquid resin component of the sealing resin composition, and have completed the present invention. .
　即ち、本発明は、回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置の製造方法であって、
　第１の製造方法として、回路基板の電極にハンダペーストを配し、ハンダペーストの周縁の少なくとも一部に封止用樹脂組成物を配し、回路基板の電極に実装用部品の電極を位置合わせし、回路基板の電極と実装用部品の電極との間に挟持されたハンダペーストに対してリフロー処理を施すことによりハンダ接合部を形成すると共に、リフロー処理の際の加熱により封止用樹脂組成物を硬化させて樹脂封止部を形成することにより、回路基板と実装用部品とを接合する製造方法を提供し、
　第２の製造方法として、回路基板の電極にハンダペーストを配し、回路基板の電極に実装用部品の電極を位置合わせし、実装用部品の周縁の少なくとも一部に封止用樹脂組成物を配し、回路基板の電極と実装用部品の電極との間に挟持されたハンダペーストに対してリフロー処理を施すことによりハンダ接合部を形成すると共に、リフロー処理の際の加熱により封止用樹脂組成物を硬化させて樹脂封止部を形成することにより、回路基板と実装用部品とを接合する製造方法を提供する。 That is, the present invention is a method for manufacturing a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part, comprising:
As a first manufacturing method, solder paste is placed on the electrodes of the circuit board, a sealing resin composition is placed on at least a portion of the periphery of the solder paste, and the electrodes of the mounting component are aligned with the electrodes of the circuit board. Then, a solder joint is formed by applying reflow treatment to the solder paste sandwiched between the electrodes of the circuit board and the electrodes of the mounting component, and the sealing resin composition is heated during the reflow treatment. Provides a manufacturing method for joining a circuit board and a mounting component by curing the material and forming a resin sealing part,
As a second manufacturing method, solder paste is placed on the electrodes of the circuit board, the electrodes of the mounting component are aligned with the electrodes of the circuit board, and a sealing resin composition is applied to at least part of the periphery of the mounting component. The solder paste sandwiched between the electrodes of the circuit board and the electrodes of the mounting component is then subjected to reflow treatment to form a solder joint, and the sealing resin is melted by heating during the reflow treatment. A manufacturing method is provided in which a circuit board and a mounting component are bonded by curing a composition to form a resin sealing part.
　本発明の第１及び第２の製造方法は、ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、以下の式（１）、好ましくは式（２）を満たすことを特徴としている。ここで、液状樹脂成分とは、大気圧下、室温で流動する樹脂成分（モノマー、オリゴマー、またはポリマー）である。 In the first and second manufacturing methods of the present invention, the solubility parameter of the solvent contained in the flux of the solder paste is the "solvent SP value", and the solubility parameter of the liquid resin component of the sealing resin composition is the "resin SP value". '', it is characterized by satisfying the following formula (1), preferably formula (2). Here, the liquid resin component is a resin component (monomer, oligomer, or polymer) that flows at room temperature under atmospheric pressure.
Figure JPOXMLDOC01-appb-M000006
Figure JPOXMLDOC01-appb-M000006
　なお、本発明の第１及び第２の製造方法が、以下の式（３）を満たすとき、ハンダペーストのフラックスに含まれる溶剤の比重を「溶剤比重」とし、封止用樹脂組成物の液状樹脂成分の比重を「樹脂比重」としたときに、以下の式（４）を満たすことが好ましい。 In addition, when the first and second manufacturing methods of the present invention satisfy the following formula (3), the specific gravity of the solvent contained in the flux of the solder paste is defined as the "solvent specific gravity", and the liquid state of the sealing resin composition is When the specific gravity of the resin component is defined as "resin specific gravity", it is preferable that the following formula (4) is satisfied.
Figure JPOXMLDOC01-appb-M000007
Figure JPOXMLDOC01-appb-M000007
　また、本発明は、回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置の当該樹脂封止部を形成するための封止用樹脂組成物を提供する。この封止用樹脂組成物は、ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、以下の式（１）、好ましくは式（２）を満たすことを特徴としている。 The present invention also provides a resin-sealed portion of a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin-sealed portion. Provided is a sealing resin composition for forming a sealant. This encapsulating resin composition has a solubility parameter of the solvent contained in the flux of the solder paste as the "solvent SP value", and a solubility parameter of the liquid resin component of the encapsulating resin composition as the "resin SP value". It is characterized by satisfying the following formula (1), preferably formula (2).
Figure JPOXMLDOC01-appb-M000008
Figure JPOXMLDOC01-appb-M000008
　本発明の回路装置の第１及び第２の製造方法は、回路基板の電極と実装用部品の電極との間に挟持されたハンダペーストに対してリフロー処理を施すことによりハンダ接合部を形成すると共に、リフロー処理の際の加熱により封止用樹脂組成物を硬化させて樹脂封止部を形成することにより、回路基板と実装用部品とを接合する製造方法である。これらの製造方法では、ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、溶剤ＳＰ値から樹脂ＳＰ値を差し引いた値が－０．２５以上（前出の式（１）参照）となっている。このため、一度のリフロー硬化処理によりハンダ接合部と樹脂封止部とを形成する際に、ハンダ粒子の飛散を抑制すると共に、ハンダペーストのリフロー処理時のセルフアライメント特性を低下させないようにすることができる。 In the first and second manufacturing methods of a circuit device of the present invention, a solder joint is formed by subjecting a solder paste sandwiched between an electrode of a circuit board and an electrode of a mounting component to a reflow process. In addition, this is a manufacturing method in which a circuit board and a mounting component are bonded by curing a sealing resin composition by heating during reflow processing to form a resin sealing part. In these manufacturing methods, the solubility parameter of the solvent contained in the flux of the solder paste is defined as the "solvent SP value," and the solubility parameter of the liquid resin component of the sealing resin composition is defined as the "resin SP value." The value obtained by subtracting the resin SP value from the SP value is -0.25 or more (see equation (1) above). Therefore, when forming a solder joint and a resin sealing part through a single reflow curing process, it is necessary to suppress the scattering of solder particles and to prevent the self-alignment characteristics of the solder paste from deteriorating during the reflow process. Can be done.
本発明の第１の製造方法の工程説明図である。FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention. 本発明の第１の製造方法の工程説明図である。FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention. 本発明の第１の製造方法の工程説明図である。FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention. 本発明の第１の製造方法の工程説明図である。FIG. 3 is a process explanatory diagram of the first manufacturing method of the present invention. 本発明の製造方法の目的物である回路装置の概略断面図である。1 is a schematic cross-sectional view of a circuit device that is an object of the manufacturing method of the present invention. 本発明の第２の製造方法の工程説明図である。It is a process explanatory diagram of the 2nd manufacturing method of this invention. 本発明の第２の製造方法の工程説明図である。It is a process explanatory diagram of the 2nd manufacturing method of this invention. 本発明の第２の製造方法の工程説明図である。It is a process explanatory diagram of the 2nd manufacturing method of this invention. 本発明の第２の製造方法の工程説明図である。It is a process explanatory diagram of the 2nd manufacturing method of this invention. 本発明の製造方法の目的物である回路装置の概略断面図である。1 is a schematic cross-sectional view of a circuit device that is an object of the manufacturing method of the present invention.
　以下、本発明を図面を参照しつつ詳細に説明する。なお、各図中、同一符号は、同一又は同等の構成要素を表している。 Hereinafter, the present invention will be explained in detail with reference to the drawings. Note that in each figure, the same reference numerals represent the same or equivalent components.
（本発明の第１及び第２の製造方法の目的物である回路装置）
　本発明の第１及び第２の製造方法の目的物は、それぞれ図１Ｅ及び図２Ｅに示すように、回路基板１と実装用部品２とがハンダペースト由来のハンダ接合部３で接合され、ハンダ接合部３の周囲が樹脂封止部４で封止されている回路装置１０である。ハンダ接合部３は、回路基板１の電極パッド１ａと実装用部品２のバンプ電極２ａとの間に配置されている。 (Circuit device that is the object of the first and second manufacturing methods of the present invention)
As shown in FIGS. 1E and 2E, respectively, the object of the first and second manufacturing methods of the present invention is that a circuit board 1 and a mounting component 2 are joined by a solder joint 3 derived from solder paste, and the solder This is a circuit device 10 in which the periphery of a joint portion 3 is sealed with a resin sealing portion 4. The solder joint portion 3 is arranged between the electrode pad 1a of the circuit board 1 and the bump electrode 2a of the mounting component 2.
　回路基板１としては、半導体基板、フレキシブル回路基板、リジッド配線基板、プリント配線基板等の公知の基板を挙げることができ、中でも半導体基板を好ましく挙げることができる。回路基板１の電極パッド１ａとしては、銅パッド、アルミパッド等の公知の電極パッドを採用することができる。電極パッド１ａは、他の形態の電極、例えばバンプ電極などで代用することが可能である。 Examples of the circuit board 1 include known substrates such as a semiconductor substrate, a flexible circuit board, a rigid wiring board, and a printed wiring board, among which semiconductor substrates are preferred. As the electrode pad 1a of the circuit board 1, a known electrode pad such as a copper pad or an aluminum pad can be used. The electrode pad 1a can be replaced with another type of electrode, such as a bump electrode.
　実装用部品２としては、表面実装用の公知の各種部品を適用することができ、半導体チップ、発光ダイオード、コンデンサチップ、抵抗素子等を挙げることができる。中でも半導体チップを好ましく挙げることができる。実装用部品２のバンプ電極２ａとしては、金バンプやハンダバンプ等の公知のバンプ電極を採用することができる。バンプ電極２ａは、他の形態の電極、例えば電極パッドなどで代用することが可能である。 As the mounting component 2, various known components for surface mounting can be used, such as a semiconductor chip, a light emitting diode, a capacitor chip, a resistor element, etc. Among these, semiconductor chips are preferred. As the bump electrode 2a of the mounting component 2, a known bump electrode such as a gold bump or a solder bump can be used. The bump electrode 2a can be replaced with another type of electrode, such as an electrode pad.
　ハンダ接合部３は、ハンダペーストをリフロー処理することで形成されるものであり、実装用部品２のバンプ電極２ａと回路基板１の電極パッド１ａとの間を導通させるものである。また、ハンダ接合部３は、ハンダペーストのリフロー処理の際に、電極パッド１ａの周縁を超えて広がらずに、電極パッド１ａの表面に留まろうとするため、回路基板１に対して実装用部品２をセルフアライメントすることが可能となる。 The solder joint portion 3 is formed by reflowing solder paste, and provides electrical continuity between the bump electrode 2a of the mounting component 2 and the electrode pad 1a of the circuit board 1. Furthermore, during solder paste reflow processing, the solder joints 3 tend to remain on the surface of the electrode pads 1a without spreading beyond the periphery of the electrode pads 1a. 2 can be self-aligned.
　ハンダ接合部３を形成するためのハンダペーストとしては、公知のハンダペーストの中から適宜選択して使用することができる。ハンダペーストは、一般に、平均粒径が１０～４０μｍのハンダ粒子と、ハンダ表面の酸化膜除去のためのフラックスとを均一に混合したものである。フラックスとしては、ロジン等に高沸点溶剤を有機酸などの活性化剤やチクソ剤などと共に混合した公知のものを使用することができる。ハンダ接合部３にボイドを発生させる要因となる高沸点溶剤としては、リフロー処理温度等を考慮して選択されるが、カルビトール系溶剤、特にヘキシルカルビトールを好ましく使用することができる。 The solder paste for forming the solder joint 3 can be appropriately selected from known solder pastes. Solder paste is generally a uniform mixture of solder particles having an average particle size of 10 to 40 μm and flux for removing an oxide film on the solder surface. As the flux, a known flux prepared by mixing rosin or the like with a high boiling point solvent together with an activator such as an organic acid, a thixotropic agent, etc. can be used. The high boiling point solvent that causes voids to occur in the solder joint 3 is selected in consideration of the reflow treatment temperature, etc., and carbitol-based solvents, particularly hexyl carbitol, can be preferably used.
（回路装置の第１の製造方法）
　本発明の回路装置の第１の製造方法は、以下の工程Ａ１～工程Ｄ１を有する。 (First manufacturing method of circuit device)
The first method for manufacturing a circuit device of the present invention includes the following steps A1 to D1.
（工程Ａ１）
　図１Ａに示すように、回路基板１の電極パッド１ａにハンダペースト３′を配する。ハンダペースト３′は、公知の方法により電極パッド１ａに配することができ、例えば、精密ディスペンサーを用いて塗布することができる。 (Step A1)
As shown in FIG. 1A, solder paste 3' is placed on the electrode pad 1a of the circuit board 1. As shown in FIG. The solder paste 3' can be placed on the electrode pad 1a by a known method, for example, by using a precision dispenser.
（工程Ｂ１）
　次に、図１Ｂに示すように、ハンダペースト３′の周縁の少なくとも一部に封止用樹脂組成物４′を配する。封止用樹脂組成物４′は、公知の方法により電極パッド１ａに配されたハンダペースト３′の周縁の少なくとも一部に配することができ、例えば、ディスペンサーを用いて塗布することができる。封止用樹脂組成物４′としては、アンダーフィル剤として用いられているものを適用することができる。例えば、エポキシ樹脂組成物や（メタ）アクリル樹脂組成物等を適用することができる。これらの樹脂組成物は、樹脂の種類に応じて、熱酸発生剤、熱重合開始剤等を含有する。必要により、光重合開始剤や光酸発生剤を含有することもできる。 (Process B1)
Next, as shown in FIG. 1B, a sealing resin composition 4' is placed on at least a portion of the periphery of the solder paste 3'. The sealing resin composition 4' can be placed on at least a portion of the periphery of the solder paste 3' placed on the electrode pad 1a by a known method, and can be applied using a dispenser, for example. As the sealing resin composition 4', those used as underfill agents can be used. For example, an epoxy resin composition, a (meth)acrylic resin composition, etc. can be applied. These resin compositions contain a thermal acid generator, a thermal polymerization initiator, etc. depending on the type of resin. If necessary, a photopolymerization initiator and a photoacid generator can also be contained.
（工程Ｃ１）
　次に、図１Ｃに示すように、回路基板１に実装用部品２を載置する。具体的には、回路基板１の電極パッド１ａに実装用部品２のバンプ電極２ａを位置合わせし、必要に応じて軽くプレスする。これにより、実装用部品２のバンプ電極２ａがハンダペースト３′と接触すると共に、回路基板１と実装用部品２の対向面間が封止用樹脂組成物４′で満たされる。場合により、実装用部品２の表面側も封止用樹脂組成物４′で覆うことができる。 (Step C1)
Next, as shown in FIG. 1C, the mounting component 2 is placed on the circuit board 1. Specifically, the bump electrodes 2a of the mounting component 2 are aligned with the electrode pads 1a of the circuit board 1, and pressed lightly if necessary. As a result, the bump electrodes 2a of the mounting component 2 come into contact with the solder paste 3', and the space between the opposing surfaces of the circuit board 1 and the mounting component 2 is filled with the sealing resin composition 4'. In some cases, the surface side of the mounting component 2 can also be covered with the sealing resin composition 4'.
（工程Ｄ１）
　次に、図１Ｄに示すように、回路基板１の電極パッド１ａと実装用部品２のバンプ電極２ａとの間に挟持されたハンダペースト３′に対してリフロー処理を施す。リフロー処理は、ハンダ粒子の溶融温度よりも高い温度にハンダペースト３′を加熱し、ハンダ粒子表面の酸化被膜をフラックスにより除去し、電極パッド１ａとバンプ電極２ａとの間に濡れ拡がらせてハンダ接合部３を形成する。そのハンダ接合部３の形成と共に、リフロー処理の際の加熱により封止用樹脂組成物４′を硬化させて樹脂封止部４を形成する。本発明におけるリフロー処理は、ハンダペーストのリフロー処理と封止用樹脂組成物の硬化処理とを同時に行うリフロー硬化処理という意義を有する。なお、リフロー硬化処理の際には、ハンダペーストと封止用樹脂組成物とが流動し、その結果、実装用部品２が回路基板１に対して適正な位置に移動するというセルフアライメントを実現できる。これにより、回路基板１と実装用部品２とを接合することができ、図１Ｅに示す構造の回路装置１０が得られる。 (Process D1)
Next, as shown in FIG. 1D, the solder paste 3' sandwiched between the electrode pad 1a of the circuit board 1 and the bump electrode 2a of the mounting component 2 is subjected to a reflow process. In the reflow process, the solder paste 3' is heated to a temperature higher than the melting temperature of the solder particles, the oxide film on the surface of the solder particles is removed by flux, and the solder paste is spread wet between the electrode pad 1a and the bump electrode 2a. A solder joint 3 is formed. At the same time as the solder joint portion 3 is formed, the sealing resin composition 4' is cured by heating during the reflow process to form the resin sealing portion 4. The reflow process in the present invention has the meaning of a reflow curing process in which the reflow process of the solder paste and the curing process of the sealing resin composition are performed simultaneously. Note that during the reflow curing process, the solder paste and the sealing resin composition flow, and as a result, self-alignment can be realized in which the mounting component 2 moves to an appropriate position with respect to the circuit board 1. . Thereby, the circuit board 1 and the mounting component 2 can be joined, and a circuit device 10 having the structure shown in FIG. 1E is obtained.
（回路装置の第２の製造方法）
　本発明の回路装置の第２の製造方法は、以下の工程Ａ２～工程Ｄ２を有する。 (Second manufacturing method of circuit device)
The second method for manufacturing a circuit device of the present invention includes the following steps A2 to D2.
（工程Ａ２）
　図２Ａに示すように、回路基板１の電極パッド１ａにハンダペースト３′を配する。ハンダペースト３′は、公知の方法により電極パッド１ａに配することができ、例えば、精密ディスペンサーを用いて塗布することができる。 (Step A2)
As shown in FIG. 2A, solder paste 3' is placed on the electrode pad 1a of the circuit board 1. The solder paste 3' can be placed on the electrode pad 1a by a known method, for example, by using a precision dispenser.
（工程Ｂ２）
　次に、図２Ｂに示すように、回路基板１に実装用部品２を載置する。具体的には、回路基板１の電極パッド１ａに実装用部品２のバンプ電極２ａを位置合わせし、必要に応じて軽くプレスする。これにより、実装用部品２のバンプ電極２ａがハンダペースト３′と接触する。 (Process B2)
Next, as shown in FIG. 2B, the mounting component 2 is placed on the circuit board 1. Specifically, the bump electrodes 2a of the mounting component 2 are aligned with the electrode pads 1a of the circuit board 1, and pressed lightly if necessary. Thereby, the bump electrode 2a of the mounting component 2 comes into contact with the solder paste 3'.
（工程Ｃ２）
　次に、図２Ｃに示すように、実装用部品２の周縁の少なくとも一部に封止用樹脂組成物４′を配する。封止用樹脂組成物４′は、公知の方法により実装用部品２の周縁の少なくとも一部に配することができ、例えば、ディスペンサーを用いて塗布することができる。封止用樹脂組成物４′としては、アンダーフィル剤として用いられているものを適用することができる。例えば、エポキシ樹脂組成物や（メタ）アクリル樹脂組成物等を適用することができる。これらの樹脂組成物は、樹脂の種類に応じて、熱酸発生剤、熱重合開始剤等を含有する。必要により、光重合開始剤や光酸発生剤を含有することもできる。 (Step C2)
Next, as shown in FIG. 2C, a sealing resin composition 4' is placed on at least a portion of the periphery of the mounting component 2. The sealing resin composition 4' can be placed on at least a portion of the periphery of the mounting component 2 by a known method, and can be applied using a dispenser, for example. As the sealing resin composition 4', those used as underfill agents can be used. For example, an epoxy resin composition, a (meth)acrylic resin composition, etc. can be applied. These resin compositions contain a thermal acid generator, a thermal polymerization initiator, etc. depending on the type of resin. If necessary, a photopolymerization initiator and a photoacid generator can also be contained.
（工程Ｄ２）
　次に、図２Ｄに示すように、回路基板１の電極パッド１ａと実装用部品２のバンプ電極２ａとの間に挟持されたハンダペースト３′に対してリフロー処理を施す。リフロー処理は、ハンダ粒子の溶融温度よりも高い温度にハンダペースト３′を加熱し、ハンダ粒子表面の酸化被膜をフラックスにより除去し、電極パッド１ａとバンプ電極２ａとの間に濡れ拡がらせてハンダ接合部３を形成する。そのハンダ接合部３の形成と共に、リフロー処理の際の加熱により封止用樹脂組成物４′を硬化させて樹脂封止部４を形成する。この硬化に先立って、回路基板１と実装用部品２の対向面間に加熱により流動させた封止用樹脂組成物４′を満たすことも可能であり、場合により、実装用部品２の表面全面を封止用樹脂組成物４′で覆うこともできる。本発明におけるリフロー処理は、ハンダペーストのリフロー処理と封止用樹脂組成物の硬化処理とを同時に行うリフロー硬化処理という意義を有する。なお、リフロー硬化処理の際には、ハンダペーストと封止用樹脂組成物とが流動し、その結果、実装用部品２が回路基板１に対して適正な位置に移動するというセルフアライメントを実現できる。これにより、回路基板１と実装用部品２とを接合することができ、図２Ｅに示す構造の回路装置１０が得られる。 (Process D2)
Next, as shown in FIG. 2D, the solder paste 3' sandwiched between the electrode pad 1a of the circuit board 1 and the bump electrode 2a of the mounting component 2 is subjected to a reflow process. In the reflow process, the solder paste 3' is heated to a temperature higher than the melting temperature of the solder particles, the oxide film on the surface of the solder particles is removed by flux, and the solder paste is spread wet between the electrode pad 1a and the bump electrode 2a. A solder joint 3 is formed. At the same time as the solder joint 3 is formed, the sealing resin composition 4' is cured by heating during reflow processing to form the resin sealing part 4. Prior to this curing, it is also possible to fill the opposing surfaces of the circuit board 1 and the mounting component 2 with a sealing resin composition 4' that has been made to flow by heating, and in some cases, the entire surface of the mounting component 2 may be filled. can also be covered with a sealing resin composition 4'. The reflow process in the present invention has the meaning of a reflow curing process in which the reflow process of the solder paste and the curing process of the sealing resin composition are performed simultaneously. Note that during the reflow curing process, the solder paste and the sealing resin composition flow, and as a result, self-alignment can be realized in which the mounting component 2 moves to an appropriate position with respect to the circuit board 1. . Thereby, the circuit board 1 and the mounting component 2 can be joined, and the circuit device 10 having the structure shown in FIG. 2E is obtained.
（本発明の第１及び第２の製造方法の特徴）
　以上が本発明の第１及び第２の製造方法の工程の説明であるが、本発明のこれらの製造方法は、ハンダペーストのフラックスに含まれる溶剤のｆｅｄｏｒｓ法による溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、以下の式（１）、好ましくは式（２）を満たすことを特徴としている。ここで、複数の溶剤が併用されている場合の「溶剤ＳＰ値」は、各溶剤のＳＰ値にその含有割合を乗じて得られた数値の和であり、また、封止用樹脂組成物が複数の液状樹脂成分（換言すれば、液状のモノマ―、液状のオリゴマー、液状のポリマー）を併用している場合の「樹脂ＳＰ値」は、各樹脂のＳＰ値にその含有割合を乗じて得られた数値の和である。 (Characteristics of the first and second manufacturing methods of the present invention)
The above is an explanation of the steps of the first and second manufacturing methods of the present invention. In these manufacturing methods of the present invention, the solubility parameter by the Fedors method of the solvent contained in the flux of the solder paste is defined as the "solvent SP value". It is characterized in that it satisfies the following formula (1), preferably formula (2), when the solubility parameter of the liquid resin component of the sealing resin composition is defined as a "resin SP value". Here, the "solvent SP value" when multiple solvents are used together is the sum of the values obtained by multiplying the SP value of each solvent by its content ratio, and the encapsulating resin composition When multiple liquid resin components (in other words, liquid monomers, liquid oligomers, and liquid polymers) are used together, the "resin SP value" is obtained by multiplying the SP value of each resin by its content ratio. is the sum of the calculated values.
Figure JPOXMLDOC01-appb-M000009
Figure JPOXMLDOC01-appb-M000009
　式（１）の規定は、溶剤ＳＰ値から樹脂ＳＰ値を差し引いた数値が－０．２５未満になると、リフロー処理の際にハンダ粒子の飛散を防げず、適正なセルフアライメントも実現できないという事実を根拠に規定されたものである。換言すれば、式（１）の規定は、溶剤ＳＰ値から樹脂ＳＰ値を差し引いた数値が－０．２５以上であれば、リフロー処理の際にハンダ粒子の飛散を防ぐことができると共に、適正なセルフアライメントも実現できるという意義を有する。 Equation (1) is based on the fact that if the value obtained by subtracting the resin SP value from the solvent SP value is less than -0.25, it will not be possible to prevent solder particles from scattering during reflow processing and proper self-alignment will not be achieved. It is stipulated based on the following. In other words, the formula (1) states that if the value obtained by subtracting the resin SP value from the solvent SP value is -0.25 or more, it is possible to prevent solder particles from scattering during reflow processing, and to properly This has the significance of being able to achieve accurate self-alignment.
　なお、式（１）では上限が規定されていないが、これは、溶剤ＳＰ値から樹脂ＳＰ値を差し引いた数値が大きくなると、封止用樹脂組成物の液状樹脂成分とハンダペーストのフラックスに含まれている溶剤とが互いに相溶し難くなり、それに伴い、封止用樹脂組成物の液状樹脂成分がハンダペースト内へ拡散し難くなり、ハンダ粒子の飛散を抑制できると共に適正なセルフアライメントも実現できるため、上限を規定する意義が希薄だからである。ただ、後述する実施例の結果を参酌すれば、少なくとも２．００以下であることが必要と推察される。 Although the upper limit is not specified in formula (1), this means that when the value obtained by subtracting the resin SP value from the solvent SP value increases, the amount of the liquid resin component of the sealing resin composition and the flux of the solder paste increases. This makes it difficult for the liquid resin component of the sealing resin composition to diffuse into the solder paste, making it possible to suppress scattering of solder particles and achieve proper self-alignment. This is because, since it is possible, there is little point in specifying an upper limit. However, taking into account the results of the examples described later, it is inferred that it is necessary to be at least 2.00 or less.
　式（２）の規定は、溶剤ＳＰ値から樹脂ＳＰ値を差し引いた数値が０．７以上であれば、封止用樹脂組成物の液状樹脂成分とハンダペーストのフラックスに含まれている溶剤とが互いに非相溶となり、封止用樹脂組成物の液状樹脂成分がハンダペースト内へ拡散し難くなり、その結果、リフロー処理の際にハンダ粒子の飛散をより効果的に防ぐことができると共に、適正なセルフアライメントも実現できるという意義を有する。 Formula (2) stipulates that if the value obtained by subtracting the resin SP value from the solvent SP value is 0.7 or more, the liquid resin component of the sealing resin composition and the solvent contained in the solder paste flux are become incompatible with each other, making it difficult for the liquid resin component of the sealing resin composition to diffuse into the solder paste.As a result, scattering of solder particles can be more effectively prevented during reflow processing, and This has the significance of being able to achieve proper self-alignment.
　ところで、以上の式（１）を満たすが、式（２）を満たさない場合、即ち、以下の式（３）を満たす場合、ハンダペーストのフラックスに含まれる溶剤の比重と封止用樹脂組成物の液状樹脂成分の比重との関係性が、発明の効果に大きく影響を与えることを、本発明者らは知見した。即ち、ハンダペーストを覆う封止用樹脂組成物の液状樹脂成分の比重がハンダペーストのフラックスに含まれる溶剤の比重よりも小さいと、封止用樹脂組成物の液状樹脂成分（液状のモノマー、液状のオリゴマー、液状のポリマー）がハンダペースト内へ拡散しにくくなり、結果的にハンダ粒子の近傍ではなく、封止用樹脂組成物の表面近傍で気化するために、リフロー処理の際にハンダ粒子の飛散が生じにくくなることが知見された。この知見に基づき、ハンダペーストのフラックスに含まれている溶剤の比重を「溶剤比重」とし、封止用樹脂組成物の液状樹脂成分の比重を「樹脂比重」としたときに、以下の式（４）を満たさない場合には、満たした場合に比べ、リフロー処理の際にハンダ粒子の飛散を防ぎ難くなり、適正なセルフアライメントも実現し難くなる傾向がある。ここで、フラックスに複数の溶剤が併用されている場合の「溶剤比重」は、各溶剤の比重にその含有割合を乗じて得られた数値の和であり、また、複数の液状樹脂成分（換言すれば、液状のモノマ―、液状のオリゴマー、液状のポリマー）が併用されている場合の「樹脂比重」は、各液状樹脂成分の比重にその含有割合を乗じて得られた数値の和である。 By the way, when the above formula (1) is satisfied but the formula (2) is not satisfied, that is, when the following formula (3) is satisfied, the specific gravity of the solvent contained in the flux of the solder paste and the sealing resin composition The present inventors have discovered that the relationship between the specific gravity of the liquid resin component and the specific gravity of the liquid resin component greatly influences the effects of the invention. That is, if the specific gravity of the liquid resin component of the sealing resin composition that covers the solder paste is lower than the specific gravity of the solvent contained in the flux of the solder paste, the liquid resin component (liquid monomer, liquid (oligomers, liquid polymers) become difficult to diffuse into the solder paste, and as a result, they vaporize not near the solder particles but near the surface of the sealing resin composition. It was found that scattering becomes less likely to occur. Based on this knowledge, the following formula ( If 4) is not satisfied, it becomes more difficult to prevent solder particles from scattering during reflow processing, and it tends to be more difficult to achieve proper self-alignment than when 4) is satisfied. Here, the "solvent specific gravity" when multiple solvents are used together in flux is the sum of the values obtained by multiplying the specific gravity of each solvent by its content ratio, and also the sum of the values obtained by multiplying the specific gravity of each solvent by its content ratio. Then, when liquid monomer, liquid oligomer, liquid polymer) are used together, the "resin specific gravity" is the sum of the values obtained by multiplying the specific gravity of each liquid resin component by its content ratio. .
Figure JPOXMLDOC01-appb-M000010
Figure JPOXMLDOC01-appb-M000010
　なお、式（４）では上限が規定されていないが、これは、溶剤比重から樹脂比重を差し引いた数値が大きくなると、封止用樹脂組成物の液状樹脂成分がハンダペースト内へより拡散し難くなり、その結果、ハンダ粒子の飛散を抑制できると共に適正なセルフアライメントも実現できるため、上限を規定する意義が希薄だからである。ただ、後述する実施例の結果を参酌すれば、少なくとも０．１以下であることが必要と推察される。 Although the upper limit is not specified in formula (4), this is because the larger the value obtained by subtracting the resin specific gravity from the solvent specific gravity, the more difficult it is for the liquid resin component of the sealing resin composition to diffuse into the solder paste. This is because, as a result, scattering of solder particles can be suppressed and proper self-alignment can also be achieved, so there is little point in defining the upper limit. However, taking into consideration the results of the examples described later, it is inferred that it is necessary to be at least 0.1 or less.
　本発明において、式（１）、（２）、（３）又は（４）を満足させる方法としては、ハンダペーストのフラックスの溶剤の選択と、封止用樹脂組成物の組成の選択を行う方法が挙げられる。 In the present invention, a method for satisfying formula (1), (2), (3), or (4) is a method of selecting a solvent for the flux of the solder paste and selecting a composition of the sealing resin composition. can be mentioned.
（封止用樹脂組成物）
　本発明の製造方法に適用する封止用樹脂組成物は、以下のように規定することができ、本発明の一態様である。即ち、本発明の封止用樹脂組成物は、回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置の当該樹脂封止部を形成するための封止用樹脂組成物である。その特徴は、前述した式（１）、好ましくは式（２）を満たすことである。なお、前述の式（３）を満たす場合には、追加的に式（４）を満たすことが好ましい。 (Sealing resin composition)
The sealing resin composition applied to the manufacturing method of the present invention can be defined as follows, and is one embodiment of the present invention. That is, the sealing resin composition of the present invention can be applied to a circuit device in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part. This is a sealing resin composition for forming the resin sealing portion. Its feature is that it satisfies the above-mentioned formula (1), preferably formula (2). In addition, when the above-mentioned formula (3) is satisfied, it is preferable that formula (4) is additionally satisfied.
　本発明の封止用樹脂組成物を規定する用語の意味は、本発明の回路装置の製造方法で説明した通りである。 The meanings of the terms defining the sealing resin composition of the present invention are as explained in the method for manufacturing a circuit device of the present invention.
　以下、本発明を実施例と比較例とにより具体的に説明する。なお、実施例と比較例で使用した封止用樹脂組成物の液状樹脂成分（液状のモノマー、液状のオリゴマー又は液状のポリマー）を以下に示す。また、ハンダペーストは、合金組成がＡｇ３．０％－Ｃｕ０．５％－Ｓｎ(残部)のものであり、フラックス中の溶剤はヘキシルカルビトール（溶剤ＳＰ値：１０．２２、溶剤比重：０．９４）を使用した。 Hereinafter, the present invention will be specifically explained using Examples and Comparative Examples. The liquid resin components (liquid monomer, liquid oligomer, or liquid polymer) of the sealing resin compositions used in Examples and Comparative Examples are shown below. The solder paste has an alloy composition of 3.0% Ag-0.5% Cu-Sn (remainder), and the solvent in the flux is hexyl carbitol (solvent SP value: 10.22, solvent specific gravity: 0. 94) was used.
　２ＥＨＡ：　２－エチルヘキシルアクリレート
　ＢＡ：　ブチルアクリレート
　ＩＳＴＡ：　イソステアリルアクリレート
　ＩＢＸＡ：　イソボルニルアクリレート
　ＩＢＸＭＡ：　イソボルニルメタクリレート
　デナコールＥＸ－１２１：　２－エチルヘキシルグリシジルエーテル、ナガセケムテックス(株)
　デナコールＥＸ－１９２：　Ｃ１２,Ｃ１３混合アルコールグリシジルエーテル、ナガセケムテックス(株)
　デナコールＥＸ－１４６Ｐ：　ｐ-ｔｅｒｔ-ブチルフェニルグリシジルエーテル、ナガセケムテックス(株)
　ＹＸ８０００：　高純度水添エポキシ樹脂、三菱ケミカル(株)
　ＮＫエステルＬＣ３：　トリシクロデカンジメタノールジメタアクリレート、新中村化学工業(株)
　ＨＤＤＡ：　１，６－ヘキサンジオールジアクリレート
　ＥＸＡ－８５０ＣＲＰ：　ビスフェノールＡ型液状エポキシ樹脂、ＤＩＣ(株)
　４ＨＢＡ：　４－ヒドロキシブチルアクリレート
　ＨＥＡ：　ヒドロキシエチルアクリレート
　パーロイルＬ：　ジラウロイルパーオキサイド、日油(株)
　アミキュアＡＨ－１５４：　ジシアンジアミド、味の素ファインテクノ(株) 2EHA: 2-ethylhexyl acrylate BA: butyl acrylate ISTA: isostearyl acrylate IBXA: isobornyl acrylate IBXMA: isobornyl methacrylate Denacol EX-121: 2-ethylhexyl glycidyl ether, Nagase ChemteX Corporation
Denacol EX-192: C12, C13 mixed alcohol glycidyl ether, Nagase ChemteX Co., Ltd.
Denacol EX-146P: p-tert-butylphenyl glycidyl ether, Nagase ChemteX Co., Ltd.
YX8000: High purity hydrogenated epoxy resin, Mitsubishi Chemical Corporation
NK ester LC3: Tricyclodecane dimethanol dimethacrylate, Shin Nakamura Chemical Co., Ltd.
HDDA: 1,6-hexanediol diacrylate EXA-850CRP: Bisphenol A type liquid epoxy resin, DIC Corporation
4HBA: 4-Hydroxybutyl acrylate HEA: Hydroxyethyl acrylate Perloyl L: Dilauroyl peroxide, NOF Corporation
Amicure AH-154: Dicyandiamide, Ajinomoto Fine Techno, Inc.
　　実施例１～１５，比較例１～５
（封止用樹脂組成物の調製）
　表１に示した封止用樹脂組成物の液状樹脂成分と硬化剤とを、表１の配合割合で均一に混合することにより封止用樹脂組成物を調製した。なお、表１に液状樹脂成分の樹脂ＳＰ値と樹脂比重とを併せて記載し、更に、「（溶剤ＳＰ値）－（樹脂ＳＰ値）」の数値と、「（溶剤比重）－（樹脂比重）」の数値とを示す。 Examples 1 to 15, Comparative Examples 1 to 5
(Preparation of resin composition for sealing)
A resin composition for sealing was prepared by uniformly mixing the liquid resin component of the resin composition for sealing shown in Table 1 and a curing agent at the mixing ratio shown in Table 1. Table 1 also lists the resin SP value and resin specific gravity of the liquid resin component, and also shows the numerical values of "(solvent SP value) - (resin SP value)" and "(solvent specific gravity) - (resin specific gravity)". )”.
（リフロー硬化処理の際の「ハンダ粒子の飛散」試験）
　試験用回路基板として以下のＦＲ－４グレードの回路基板を用い、また、試験用実装用部品として以下の半導体素子を用いて、「ハンダ粒子の飛散」試験用の回路装置を作成した。具体的には、試験用回路基板の電極パッドに、千住金属工業株式会社製造のハンダペースト（「Ｍ７０５－ＧＲＮ３６０－Ｋ２－Ｖ」（ハンダ粒子：ＡＧ３．０％－Ｃｕ０．５％－Ｓｎ(残部)：フラックス中の溶剤＝ヘキシルカルビトール（溶剤ＳＰ値：１０．２２、溶剤比重：０．９４））を、１５０μｍ厚となるように精密ディスペンサーで塗布し、ハンダペーストが塗布された試験用回路基板の電極パッドに対し、試験用実装用部品のバンプ電極を位置合わせし、軽くプレスすることにより試験用回路基板に試験用実装用部品を載置した。次に試験用実装用部品の周縁４辺中の隣接する２辺に、封止用樹脂組成物を８０ｍｇ塗布し、大気下にて常温から１７０℃まで３℃／秒で昇温し、１７０℃で９０秒間保持した後、２℃／秒で２５０℃まで昇温し、２℃／秒で常温へ冷却するリフロー硬化処理を行い、これによりハンダ接合部と樹脂封止部とを形成した。これにより、図２Ｅに示すような構造の回路装置を作成した。 ("Solder particle scattering" test during reflow hardening process)
A circuit device for the "solder particle scattering" test was created using the following FR-4 grade circuit board as the test circuit board and the following semiconductor element as the test mounting component. Specifically, solder paste ("M705-GRN360-K2-V") manufactured by Senju Metal Industry Co., Ltd. (solder particles: AG3.0%-Cu0.5%-Sn (the remainder ): Solvent in flux = hexyl carbitol (solvent SP value: 10.22, solvent specific gravity: 0.94)) was applied with a precision dispenser to a thickness of 150 μm, and a test circuit with solder paste applied. The test mounting component was placed on the test circuit board by aligning the bump electrode of the test mounting component with the electrode pad of the board and pressing lightly.Next, the peripheral edge 4 of the test mounting component was placed on the test circuit board. 80 mg of the sealing resin composition was applied to two adjacent sides in the middle, and the temperature was raised from room temperature to 170°C at a rate of 3°C/second in the atmosphere, held at 170°C for 90 seconds, and then heated at 2°C/second. A reflow curing process was performed in which the temperature was raised to 250°C in seconds and cooled to room temperature at 2°C/second, thereby forming the solder joint and the resin sealing part.As a result, the structure shown in Figure 2E was formed. Created a circuit device.
（使用した試験用回路基板）
　試験用回路基板として、表面に金メッキ加工を施した銅配線（１．０×７．２（ｍｍ））を有するＦＲ－４グレード回路基板（２０×４０×０．６（ｍｍ））を使用した。 (Test circuit board used)
As a test circuit board, an FR-4 grade circuit board (20 x 40 x 0.6 (mm)) having copper wiring (1.0 x 7.2 (mm)) with gold plating on the surface was used. .
（使用した試験用実装用部品）
　試験用実装用部品として、（１．０×７．２（ｍｍ））のバンプ電極を有する半導体素子（５×９．５×１（ｍｍ））を使用した。 (Test mounting parts used)
A semiconductor element (5 x 9.5 x 1 (mm)) having a (1.0 x 7.2 (mm)) bump electrode was used as a test mounting component.
「ハンダ粒子の飛散」評価
　作成した回路装置をＸ線により観察し、以下の評価基準に従って評価した。評価結果を表１に示す。 Evaluation of "Solder Particle Scattering" The prepared circuit device was observed using X-rays and evaluated according to the following evaluation criteria. The evaluation results are shown in Table 1.
（「ハンダ粒子の飛散」の評価基準）
　ランク：　基準
　Ａ：　回路装置１台あたりの飛散したハンダ粒子の数が２０個未満
ＡＢ：　回路装置１台あたりの飛散したハンダ粒子の数が２０個以上４０個未満
　Ｂ：　回路装置１台あたりの飛散したハンダ粒子の数が４０個以上６０個未満
ＢＣ：　回路装置１台あたりの飛散したハンダ粒子の数が６０個以上１００個未満
　Ｃ：　回路装置１台あたりの飛散したハンダ粒子の数が１００個以上 (Evaluation criteria for "Solder particle scattering")
Rank: Criteria A: The number of scattered solder particles per circuit device is less than 20.AB: The number of scattered solder particles per circuit device is 20 or more and less than 40.B: The number of scattered solder particles per circuit device is less than 20. The number of scattered solder particles is 40 or more and less than 60.BC: The number of scattered solder particles per circuit device is 60 or more and less than 100.C: The number of scattered solder particles per circuit device is 100. pcs or more
（リフロー硬化処理の際の「セルフアライメント」試験）
　「ハンダ粒子の飛散」試験の場合と同様に回路装置を作成した。 (“Self-alignment” test during reflow hardening process)
A circuit device was created in the same manner as in the "solder particle scattering" test.
「セルフアライメント」評価
　作成した回路基板を研磨後、ハンダ接合部の断面を観察し、以下の評価基準に従って評価した。評価結果を表１に示す。 "Self-alignment" evaluation After polishing the produced circuit board, the cross section of the solder joint was observed and evaluated according to the following evaluation criteria. The evaluation results are shown in Table 1.
（「セルフアライメント」の評価基準）
　ランク：　基準
　Ａ：　回路基板の電極パッドならびに実装用部品のバンプ電極がハンダ接合部３により電気的に接合されている
　Ｃ：　回路基板の電極パッドならびに実装用部品のバンプ電極がハンダ接合部３により電気的に接合されていない (Evaluation criteria for “self-alignment”)
Rank: Criteria A: The electrode pad of the circuit board and the bump electrode of the mounting component are electrically connected by the solder joint 3. C: The electrode pad of the circuit board and the bump electrode of the mounting component are electrically connected by the solder joint 3. not electrically connected
Figure JPOXMLDOC01-appb-T000011
Figure JPOXMLDOC01-appb-T000011
＜結果の考察＞
　実施例１～１５の封止用樹脂組成物と、千住金属工業株式会社製造のハンダペースト（「Ｍ７０５－ＧＲＮ３６０－Ｋ２－Ｖ」（ハンダ粒子：ＡＧ３．０％－Ｃｕ０．５％－Ｓｎ(残部)：フラックス中の溶剤＝ヘキシルカルビトール（溶剤ＳＰ値：１０．２２、溶剤比重：０．９４））とを用いて回路装置を作成した場合、「ハンダ粒子の飛散」の評価が、Ａ、ＡＢ又はＢであり、実用上問題のない評価であった。「セルフアライメント」の評価もＡ評価であった。 <Discussion of results>
The sealing resin compositions of Examples 1 to 15 and the solder paste manufactured by Senju Metal Industry Co., Ltd. ("M705-GRN360-K2-V" (solder particles: AG3.0%-Cu0.5%-Sn (remainder ): Solvent in flux = hexyl carbitol (solvent SP value: 10.22, solvent specific gravity: 0.94)) When a circuit device is created, the evaluation of "solder particle scattering" is A, The evaluation was AB or B, which caused no practical problems.The evaluation for "self-alignment" was also A.
　なお、実施例１０、１１、１２、１５の場合、「ハンダ粒子の飛散」評価が、実用上問題が無いものの、ＡＢ又はＢ評価であった。この理由は、「（溶剤ＳＰ値）－（樹脂ＳＰ値）」の数値が－０．２５以上であるが０．７未満であるため、ハンダペーストのフラックスの溶剤と封止用樹脂組成物の液状樹脂成分との間の相溶性が向上し、その結果、液状樹脂成分がハンダペースト中に拡散し易くなるためと考えられる。その反面、これらの実施例では、「（溶剤比重）－（樹脂比重）」の数値が、－０．２５未満となっていないため、比重差の点から拡散が抑制され、その結果、「ハンダ粒子の飛散」の評価がＡＢ又はＢ評価になったと考えられる。 In addition, in the case of Examples 10, 11, 12, and 15, the "solder particle scattering" evaluation was AB or B, although there was no practical problem. The reason for this is that the value of "(solvent SP value) - (resin SP value)" is -0.25 or more but less than 0.7. This is thought to be because the compatibility with the liquid resin component is improved, and as a result, the liquid resin component is easily diffused into the solder paste. On the other hand, in these examples, since the value of "(solvent specific gravity) - (resin specific gravity)" is not less than -0.25, diffusion is suppressed from the point of view of the specific gravity difference, and as a result, "solder It is considered that the evaluation for "Scattering of particles" became AB or B.
　また、実施例１～９、１３～１４の場合、「ハンダ粒子の飛散」評価が、「（溶剤比重）－（樹脂比重）」の比重差に依存することなく、Ａ評価であった。この理由は、「（溶剤ＳＰ値）－（樹脂ＳＰ値）」の数値が０．７以上であり、ハンダペーストのフラックスの溶剤と封止用樹脂組成物の液状樹脂成分との間の非相溶性が向上し、その結果、液状樹脂成分がハンダペースト中に拡散し難くなるためと考えられる。 In addition, in the case of Examples 1 to 9 and 13 to 14, the evaluation of "solder particle scattering" was rated A regardless of the specific gravity difference of "(solvent specific gravity) - (resin specific gravity)". The reason for this is that the value of "(solvent SP value) - (resin SP value)" is 0.7 or more, and there is a non-compatibility between the solvent of the flux of the solder paste and the liquid resin component of the sealing resin composition. This is thought to be because the solubility is improved, and as a result, the liquid resin component becomes difficult to diffuse into the solder paste.
　なお、比較例１～５の封止用樹脂組成物と、千住金属工業株式会社製造のハンダペースト（「Ｍ７０５－ＧＲＮ３６０－Ｋ２－Ｖ」（ハンダ粒子：ＡＧ３．０％－Ｃｕ０．５％－Ｓｎ(残部)：フラックス中の溶剤＝ヘキシルカルビトール（溶剤ＳＰ値：１０．２２、溶剤比重：０．９４））とを用いて回路装置を作成した場合、「（溶剤ＳＰ値）－（樹脂ＳＰ値）」の数値が－０．２５未満であったため、「ハンダ粒子の飛散」の評価が、ＢＣ又はＣであり、実用上問題のある評価であった。しかも、「セルフアライメント」もＣ評価であった。 In addition, the sealing resin compositions of Comparative Examples 1 to 5 and the solder paste manufactured by Senju Metal Industry Co., Ltd. ("M705-GRN360-K2-V" (solder particles: AG3.0%-Cu0.5%-Sn (Remainder): When a circuit device is created using the solvent in flux = hexyl carbitol (solvent SP value: 10.22, solvent specific gravity: 0.94), Since the value of "Solder particle scattering" was less than -0.25, the evaluation for "Solder particle scattering" was BC or C, which was a practically problematic evaluation. Moreover, "Self-alignment" was also evaluated as C. Met.
　本発明の製造方法では、ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、溶剤ＳＰ値から樹脂ＳＰ値を差し引いた値が－０．２５以上（前出の式（１）参照）となっている。このため、一度のリフロー硬化処理によりハンダ接合部と樹脂封止部とを形成する際に、ハンダ粒子の飛散を抑制すると共に、ハンダペーストのリフロー処理時のセルフアライメント特性を低下させないようにすることができる。従って、本発明の製造方法は、半導体装置等の回路装置の製造方法として有用である。 In the manufacturing method of the present invention, when the solubility parameter of the solvent contained in the flux of the solder paste is defined as the "solvent SP value", and the solubility parameter of the liquid resin component of the sealing resin composition is defined as the "resin SP value", The value obtained by subtracting the resin SP value from the solvent SP value is -0.25 or more (see equation (1) above). Therefore, when forming a solder joint and a resin sealing part through a single reflow curing process, it is necessary to suppress the scattering of solder particles and to prevent the self-alignment characteristics of the solder paste from deteriorating during the reflow process. Can be done. Therefore, the manufacturing method of the present invention is useful as a manufacturing method for circuit devices such as semiconductor devices.
　１　回路基板
　１ａ　回路基板の電極パッド
　２　実装用部品
　２ａ　実装用部品のバンプ電極
　３　ハンダ接合部
　３′ハンダペースト
　４　樹脂封止部
　４′　封止用樹脂組成物
１０　回路装置 1 Circuit board 1a Electrode pad of circuit board 2 Mounting component 2a Bump electrode of mounting component 3 Solder joint 3' Solder paste 4 Resin sealing part 4' Sealing resin composition 10 Circuit device

Claims (8)

  1. 　回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置の製造方法であって、
    　回路基板の電極にハンダペーストを配し、ハンダペーストの周縁の少なくとも一部に封止用樹脂組成物を配し、回路基板の電極に実装用部品の電極を位置合わせし、回路基板の電極と実装用部品の電極との間に挟持されたハンダペーストに対してリフロー処理を施すことによりハンダ接合部を形成すると共に、リフロー処理の際の加熱により封止用樹脂組成物を硬化させて樹脂封止部を形成することにより、回路基板と実装用部品とを接合する製造方法において、
    　ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、以下の式（１）を満たす製造方法。
    Figure JPOXMLDOC01-appb-M000001
         A method for manufacturing a circuit device, in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part, the method comprising:
    Place solder paste on the electrodes of the circuit board, place a sealing resin composition on at least a portion of the periphery of the solder paste, align the electrodes of the mounting component with the electrodes of the circuit board, and then place the solder paste on the electrodes of the circuit board. A solder joint is formed by applying a reflow process to the solder paste sandwiched between the electrodes of the mounting component, and the sealing resin composition is cured by heating during the reflow process to create a resin seal. In a manufacturing method for joining a circuit board and a mounting component by forming a stop portion,
    When the solubility parameter of the solvent contained in the flux of the solder paste is the "solvent SP value" and the solubility parameter of the liquid resin component of the sealing resin composition is the "resin SP value", the following equation (1) can be calculated. Manufacturing methods that meet your needs.
    Figure JPOXMLDOC01-appb-M000001
  2. 　回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置の製造方法であって、
    　回路基板の電極にハンダペーストを配し、回路基板の電極に実装用部品の電極を位置合わせし、実装用部品の周縁の少なくとも一部に封止用樹脂組成物を配し、回路基板の電極と実装用部品の電極との間に挟持されたハンダペーストに対してリフロー処理を施すことによりハンダ接合部を形成すると共に、リフロー処理の際の加熱により封止用樹脂組成物を硬化させて樹脂封止部を形成することにより、回路基板と実装用部品とを接合する製造方法において、
    　ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、以下の式（１）を満たす製造方法。
    Figure JPOXMLDOC01-appb-M000002
         A method for manufacturing a circuit device, in which a circuit board and a mounting component are joined by a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin sealing part, the method comprising:
    Place solder paste on the electrodes of the circuit board, align the electrodes of the mounting component with the electrodes of the circuit board, place a sealing resin composition on at least part of the periphery of the mounting component, and place the electrode of the circuit board A solder joint is formed by performing a reflow process on the solder paste sandwiched between the solder paste and the electrode of the mounting component, and the sealing resin composition is cured by heating during the reflow process to form a resin. In a manufacturing method for joining a circuit board and a mounting component by forming a sealing part,
    When the solubility parameter of the solvent contained in the flux of the solder paste is the "solvent SP value" and the solubility parameter of the liquid resin component of the sealing resin composition is the "resin SP value", the following equation (1) can be calculated. Manufacturing methods that meet your needs.
    Figure JPOXMLDOC01-appb-M000002
  3. 　以下の式（２）を満たす請求項１又は２記載の製造方法。：
    Figure JPOXMLDOC01-appb-M000003
         The manufacturing method according to claim 1 or 2, which satisfies the following formula (2). :
    Figure JPOXMLDOC01-appb-M000003
  4. 　以下の式（３）を満たすとき、ハンダペーストのフラックスに含まれる溶剤の比重を「溶剤比重」とし、封止用樹脂組成物の液状樹脂成分の比重を「樹脂比重」としたときに、以下の式（４）を満たす請求項１又は２記載の製造方法。
    Figure JPOXMLDOC01-appb-M000004
         When the following formula (3) is satisfied, the specific gravity of the solvent contained in the flux of the solder paste is defined as "solvent specific gravity", and the specific gravity of the liquid resin component of the sealing resin composition is defined as "resin specific gravity", and the following: The manufacturing method according to claim 1 or 2, which satisfies formula (4).
    Figure JPOXMLDOC01-appb-M000004
  5. 　実装用部品が半導体チップであり、回路基板が半導体基板である請求項１又は２記載の製造方法。 The manufacturing method according to claim 1 or 2, wherein the mounting component is a semiconductor chip and the circuit board is a semiconductor substrate.
  6. 　ハンダペーストのフラックスに含まれる溶剤が、ヘキシルカルビトールである請求項１又は２記載の製造方法。 The manufacturing method according to claim 1 or 2, wherein the solvent contained in the flux of the solder paste is hexyl carbitol.
  7. 　回路基板と実装用部品とがハンダペースト由来のハンダ接合部で接合され、ハンダ接合部の周囲が樹脂封止部で封止されている回路装置の当該樹脂封止部を形成するための封止用樹脂組成物であって、
    　ハンダペーストのフラックスに含まれる溶剤の溶解度パラメータを「溶剤ＳＰ値」とし、封止用樹脂組成物の液状樹脂成分の溶解度パラメータを「樹脂ＳＰ値」としたときに、以下の式（１）を満たす封止用樹脂組成物。
    Figure JPOXMLDOC01-appb-M000005
         Sealing for forming a resin-sealed part of a circuit device in which a circuit board and a mounting component are joined with a solder joint derived from solder paste, and the periphery of the solder joint is sealed with a resin-sealed part. A resin composition for
    When the solubility parameter of the solvent contained in the flux of the solder paste is the "solvent SP value" and the solubility parameter of the liquid resin component of the sealing resin composition is the "resin SP value", the following equation (1) can be calculated. A sealing resin composition that satisfies
    Figure JPOXMLDOC01-appb-M000005
  8. 　ハンダペーストのフラックスに含まれる溶剤が、ヘキシルカルビトールである請求項７記載の封止用樹脂組成物。 The sealing resin composition according to claim 7, wherein the solvent contained in the flux of the solder paste is hexyl carbitol.
PCT/JP2023/023766 2022-07-06 2023-06-27 Method for producing circuit device and resin composition for sealing WO2024009843A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008111345A1 (en) * 2007-03-09 2008-09-18 Nec Corporation Electronic device, and electronic device manufacturing method
JP2009032732A (en) * 2007-07-24 2009-02-12 Sunstar Engineering Inc Underfill material
WO2014103751A1 (en) * 2012-12-26 2014-07-03 ハリマ化成株式会社 Flux and solder paste
JP2022034224A (en) * 2020-08-18 2022-03-03 旭化成株式会社 Master batch-type thermosetting resin composition and thermosetting resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008111345A1 (en) * 2007-03-09 2008-09-18 Nec Corporation Electronic device, and electronic device manufacturing method
JP2009032732A (en) * 2007-07-24 2009-02-12 Sunstar Engineering Inc Underfill material
WO2014103751A1 (en) * 2012-12-26 2014-07-03 ハリマ化成株式会社 Flux and solder paste
JP2022034224A (en) * 2020-08-18 2022-03-03 旭化成株式会社 Master batch-type thermosetting resin composition and thermosetting resin composition

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