WO2024002224A1 - 一种连续式晶圆抛光系统 - Google Patents

一种连续式晶圆抛光系统 Download PDF

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Publication number
WO2024002224A1
WO2024002224A1 PCT/CN2023/103745 CN2023103745W WO2024002224A1 WO 2024002224 A1 WO2024002224 A1 WO 2024002224A1 CN 2023103745 W CN2023103745 W CN 2023103745W WO 2024002224 A1 WO2024002224 A1 WO 2024002224A1
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WO
WIPO (PCT)
Prior art keywords
polishing
wafer
bracket
stage
polishing system
Prior art date
Application number
PCT/CN2023/103745
Other languages
English (en)
French (fr)
Inventor
徐枭宇
郑东州
Original Assignee
杭州众硅电子科技有限公司
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Application filed by 杭州众硅电子科技有限公司 filed Critical 杭州众硅电子科技有限公司
Publication of WO2024002224A1 publication Critical patent/WO2024002224A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/36—Single-purpose machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation

Definitions

  • the invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to a continuous wafer polishing system.
  • Chemical Mechanical Planarization (CMP) equipment usually includes a semiconductor equipment front-end module (EFEM), cleaning unit and polishing unit.
  • EFEM mainly includes a wafer storage cassette, a wafer transfer robot and an air purification system
  • the cleaning unit mainly includes a varying number of megasonic cleaning components, roller brush cleaning components, drying components and devices for transferring wafers between components, etc.
  • the polishing unit mainly includes polishing table, polishing head, polishing liquid supply system and polishing pad dressing system.
  • the present invention provides a continuous wafer polishing system that can move and transmit the wafer carrier between polishing tables, and has a stable moving transmission structure and a reasonable layout.
  • a continuous wafer polishing system including:
  • the polishing unit includes a polishing table located on one side of the bracket and a polishing arm connected to the bracket;
  • a transmission channel is provided parallel to the bracket
  • the wafer carrying device includes a wafer carrying stage for carrying wafers, a lifting drive mechanism for driving the wafer carrying table to rise and fall, and a lateral driving mechanism for driving the wafer carrying table to translate.
  • the lifting driving mechanism is connected to the wafer carrying table.
  • the transverse driving mechanism is located on the first side of the film stage;
  • a support guide rail is provided on the second side of the slide stage, and the second side is opposite to the first side;
  • the carrier table translates along the bracket under the joint action of the transverse drive mechanism and the support guide rail to accept wafers transferred from the polishing table by different polishing arms, or to provide wafers to different polishing arms for transfer to different polishing arms. tower.
  • the number of the wafer carrying devices is multiple, and the wafer carrying stages can independently control translation.
  • transverse driving mechanism is provided between the first side of the slide stage and the side wall of the bracket.
  • the transverse driving mechanism includes a slide rail, a driving member, and a transmission member that can move within the slide rail.
  • the slide rail is provided on the side of the transmission channel.
  • the slide rail is provided on the side wall of the bracket and has a side opening
  • the driving member is located in the slide rail
  • the transmission member is respectively connected to the lower surface of the first side of the slide stage and the driving member.
  • the transverse driving mechanism includes a mounting base connected to the bracket, a driving member, and a transmission member.
  • the driving member and the transmission member are respectively connected to the lower surface of the carrier stage and the mounting base.
  • the driving member is a screw, and the transmission member is a moving nut; or the driving member is a gear, and the transmission member is a straight tooth segment; or the driving member is a linear motor rotor, so
  • the transmission part is a linear motor stator.
  • the first side of the slide stage is provided with an auxiliary support guide rail, which is at least partially integrated with the transverse driving mechanism, or is provided independently from the transverse driving mechanism.
  • tops of the support guide rails, auxiliary support guide rails, or transverse drive mechanisms are flush to support the slide stage horizontally.
  • the support guide rail includes an upper body located on the second side of the slide stage and a lower body located on the bracket.
  • the lower body extends continuously or is intermittently arranged along the transmission channel.
  • a water receiving tank is provided below the transmission channel.
  • the number of the polishing units is multiple, which includes multiple polishing tables arranged along the length direction of the bracket.
  • the bracket includes a left body and a right body arranged in parallel, and a middle body.
  • the transmission channel is located between the left body and the right body, and two or more parallel groups are arranged in the transmission channel. Assemble wafer carrier device.
  • the beneficial effects of the present invention are: 1)
  • the wafer carrier device can move in the transmission channel, cooperate with different polishing arms respectively, and transfer the wafers to different polishing tables for polishing processes in different processes or the same process.
  • the entire polishing process It can be carried out continuously or synchronously, which improves the polishing efficiency and simplifies the transmission structure. It is even possible to realize the continuous or synchronous polishing process of multiple polishing tables using only one wafer carrier device, reducing the use cost and increasing the machine polishing efficiency.
  • the output speed is increased; 2)
  • the wafer carrier needs to be docked with the polishing head, manipulator and other devices during the work process, and needs to be driven in the vertical direction through the lifting drive mechanism, and there is a water sink below the wafer carrier device, and the horizontal drive mechanism is located
  • the first side of the wafer carrier table solves the installation problem of the lateral drive mechanism of the wafer carrier device, and the layout design is reasonable; 3)
  • the cooperation of the lateral drive mechanism and the support guide rail allows it to withstand the own gravity of the wafer carrier device, And the contact force of hundreds of Newtons during the docking process between the polishing head and the wafer carrier device will prevent structural deformation after long-term use, ensuring the accurate position of the wafer and the docking effect of the polishing head and the wafer carrier device; 4)
  • the layout problem can be solved by simply changing the setting position of the lateral drive mechanism, which will not increase the weight of the wafer carrier device, simplify the overall structure, and will not have any adverse effects on the service life and
  • Figure 1 is a schematic front structural view of Embodiment 1 of the present invention.
  • Figure 2 is a schematic three-dimensional structural diagram in Embodiment 1 of the present invention.
  • FIG. 3 is a schematic front structural view of the cooperation between the wafer carrier device and the support guide rail in Embodiment 1 of the present invention.
  • FIG. 4 is a schematic three-dimensional structural diagram of two sets of wafer carrier devices disposed between brackets in Embodiment 1 of the present invention.
  • FIG. 5 is a schematic front structural view of two sets of wafer carrier devices disposed between brackets in Embodiment 1 of the present invention.
  • Figure 6 is a partial three-dimensional structural diagram in Embodiment 1 of the present invention.
  • Figure 7 is a schematic structural diagram of the driving mechanism in Embodiment 1 of the present invention.
  • Figure 8 is a partial front view structural diagram in Embodiment 1 of the present invention.
  • Figure 9 is a schematic three-dimensional structural diagram in Embodiment 2 of the present invention.
  • Figure 10 is a schematic front structural view of Embodiment 2 of the present invention.
  • Figure 11 is a schematic front view of the structure in Embodiment 3 of the present invention.
  • Figure 12 is a schematic diagram of a three-dimensional structure in Embodiment 3 of the present invention.
  • FIG. 13 is a second schematic diagram of the three-dimensional structure in Embodiment 3 of the present invention. At this time, there are two wafer carrier devices in the transmission channel.
  • Figure 14 is a partial front structural schematic diagram in Embodiment 4 of the present invention.
  • Figure 15 is a schematic diagram of a partial three-dimensional structure in Embodiment 4 of the present invention.
  • a continuous wafer polishing system includes a bracket 1, a polishing unit, a transmission channel 3 arranged parallel to the bracket 1, a wafer carrying device 5, and a support rail 6.
  • the polishing unit includes a plurality of polishing tables 22 arranged on one side of the bracket 1 and arranged along the length direction of the bracket 1, and a plurality of polishing arms 21 connected to the bracket 1.
  • the polishing tables 22 and the transmission channel 3 are distributed on the bracket 1 both sides.
  • the number of polishing units may be one, in which case the number of polishing tables 22 and polishing arms 21 is one.
  • the wafer carrying device 5 includes a wafer carrying stage 51 for carrying the wafer, a lifting drive mechanism 52 for driving the wafer carrying stage 51 to rise and fall, and a transverse driving mechanism 7 for driving the wafer carrying stage 51 to translate. 52 is connected below the slide stage 51 , and the transverse driving mechanism 7 is located on the first side of the slide stage 51 .
  • the continuous wafer polishing system also includes a water receiving tank 4 located at least partially below the transmission channel 3.
  • the water receiving tank 4 is used to catch various liquids that need to be ejected due to the polishing process.
  • the lifting drive mechanism 52 of the wafer carrier device 5 faces toward The top opening of the water receiving tank 4 is provided, and even part of the water receiving tank 4 extends into the water receiving tank 4 from the opening. Of course, the water receiving tank 4 does not need to be provided.
  • the support guide rail 6 is provided on the second side of the slide stage 51 , and the second side is opposite to the first side. In other words, the first side and the second side are respectively located on both sides of the lifting drive mechanism 52 .
  • the slide stage 51 translates along the bracket 1 to accept the wafers transferred from the polishing table 22 by different polishing arms 21 ; or, provides the wafers to different polishers. arm 21, thereby being transferred to different polishing stations 22 for polishing.
  • the bracket 1 includes a left body 11 and a right body 12 that are parallel and fixedly arranged, and the transmission channel 3 is located between the left body 11 and the right body 12 .
  • the first side of the slide stage 51 is the side close to the right body 12
  • the second side is the side close to the left body 11 . Therefore, taking the direction shown in FIG. 1 as an example, the support guide rail 6 is provided between the left body 11 and the stage 51 , and the transverse driving mechanism 7 is provided between the right body 12 and the stage 51 .
  • the number of polishing tables 22 is multiple, a corresponding number of polishing arms 21 can be connected to the right body 12 of the bracket 1 , and the number of wafer carrier devices 5 can be one, which is located along the bracket 1
  • the length direction of the wafer is continuously translated in the transmission channel 3 , so that the wafer can be transferred between different polishing stages 22 .
  • the number of wafer carrier devices 5 may be multiple, and the carrier stage 51 of each wafer carrier device 5 may independently control translation or elevation.
  • two parallel sets of wafer carrier devices 5 can also be provided in the transmission channel 3.
  • the bracket 1 includes a parallel and fixed left body 11 and a right body 12. and the middle body 13 located between the two.
  • One or more polishing tables can be provided on the side of the left body 11 away from the right body 12, and a corresponding number of polishing arms are connected to the left body 11.
  • One or more polishing tables are provided on the side of the body 12 away from the left body 11 , and a corresponding number of polishing arms are connected to the right body 12 .
  • the transmission channel 3 is divided into two parts.
  • One or more wafer carrier devices 5 are provided in the part of the transmission channel between the left body 11 and the middle body 13 for transporting wafers on the left polishing table.
  • One or more wafer carrier devices 5 are provided in part of the transmission channel between the part 12 and the middle part 13 for transporting wafers on the right polishing table.
  • the left body 11 is not shown at this time, and the transverse driving mechanism 7 is provided between the first side of the slide stage 51 and the side wall of the right body 12 of the bracket 1. It includes a slide rail 71, a driving member 72, and a transmission member 73 that can move within the slide rail 71.
  • the slide rail 71 is disposed on the side of the transmission channel 3, more specifically on the side of the water receiving tank 4.
  • the slide rail 71 is arranged on the side wall of the right body 12 of the bracket 1 and has a side opening, that is, the slide rail 71 opens toward the side where the water tank 4 is located.
  • the driving member 72 is located in the slide rail 71, specifically a screw and a transmission member. 73 respectively connects the lower surface of the first side of the slide stage 51 and the driving member 72 .
  • the transmission member 73 is driven by the screw of the driving member 72 to translate along the slide rail 71 , and due to the restriction of the slide rail 71 , it will not deviate and has high stability.
  • the translation of the wafer carrier device 5 is very smooth.
  • the support guide rail 6 is flush with the top of the transverse drive mechanism 7 , so that the wafer carrier stage 51 can be supported horizontally.
  • the support rail 6 includes an upper body 62 located on the second side of the slide stage 51 and a lower body 63 located on the left body 11 of the bracket 1 .
  • the lower body 63 is along the length direction of the transmission channel 3 Setting, which can be continuous extension or intermittent setting, is set according to the actual application scenario.
  • the transverse driving mechanism 7 includes a mounting base 74 connected to the right body 12 of the bracket 1, a driving part 72, and a transmission part 73.
  • the driving part 72 and the transmission part 73 are respectively The lower surface of the slide stage 51 and the mounting base 74 are connected.
  • the driving member 72 is a gear provided below the carrier stage 51.
  • gears are provided under each carrier stage 51 to realize its independent control function.
  • the transmission member 73 It is a straight tooth segment arranged on the upper surface of the mounting base 74. The straight tooth segment extends along the length direction of the bracket 1. The gear rotates under the drive of the power source, thereby realizing the wafer carrier device through the meshing of the gear and the straight tooth segment. 5Mobile transmission within transmission channel 3.
  • the first side of the slide stage 51 is also provided with an auxiliary support guide rail 61, whose structure is the same as that of the support guide rail 6, except that The lower body is provided on the upper surface of the mounting base 74 .
  • the transverse driving mechanism 7 and the auxiliary support guide rail 61 are arranged independently of each other.
  • the transverse driving mechanism 7 only plays a driving role and does not have a supporting role.
  • the auxiliary support guide rail 61 and the transverse driving mechanism 7 can also be partially integrated. In other words, the transverse driving mechanism 7 plays both a driving role and a supporting role.
  • the tops of the support guide rail 6, the transverse drive mechanism 7, and the auxiliary support guide rail 61 are flush, so that the film-bearing stage 51 can be supported horizontally.
  • the structure of this embodiment is basically the same as that of the second embodiment.
  • the difference is that the driving member 72 is a screw provided on the upper surface of the mounting base 74, and the transmission member 73 is installed on the carrier stage 51.
  • the moving nut below when there are multiple wafer carrier devices 5, a moving nut is provided below each wafer carrier 51.
  • the screw of the driving member 72 extends along the length direction of the bracket 1, and the screw can rotate, thereby realizing the movement and transmission of the wafer carrier device 5 in the transmission channel 3 through the cooperation of the screw and the moving nut.
  • the structure of this embodiment is basically the same as that of the second embodiment.
  • the difference is that the driving member 72 is a linear motor rotor disposed below the carrier stage 51.
  • a linear motor rotor is provided below each slide stage 51 to realize its independent control function.
  • the transmission member 73 is a linear motor stator provided on the upper surface of the mounting base 74.
  • the linear motor stator extends along the length direction of the bracket 1. , thereby controlling the position of the linear motor rotor through the cooperation of the linear motor stator and the linear motor rotor, thereby realizing the mobile transmission of the wafer carrier device 5 in the transmission channel 3 .
  • transverse driving mechanism 7 can also be other structures in the prior art, as long as it can achieve transverse movement.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

一种连续式晶圆抛光系统，包括支架（1）；抛光单元，包括抛光台（22）及抛光臂（21）；传输通道（3），与支架（1）平行设置；晶圆载片装置（5），包括载片台（51），升降驱动机构（52），及横向驱动机构（7），升降驱动机构（52）连接在载片台（51）下方，横向驱动机构（7）位于载片台（51）的第一侧；支撑导轨（6），设于载片台（51）的第二侧，其和第一侧相对设置；载片台（51）在横向驱动机构（7）和支撑导轨（6）的共同作用下沿支架（1）平移，以接受不同抛光臂（21）从抛光台（22）上传输过来的晶圆，或者，将晶圆提供给不同抛光臂（21）以传输至不同抛光台（22）。该晶圆载片装置（5）可以在传输通道（3）内移动，抛光工序可以连续进行，抛光效率提高，传输结构简化；横向驱动机构（7）位于载片台（51）的第一侧，布局设计合理；横向驱动机构（7）和支撑导轨（6）配合，传输结构更稳固。

Description

一种连续式晶圆抛光系统 技术领域
本发明属于半导体集成电路芯片制造技术领域，尤其是涉及一种连续式晶圆抛光系统。  
 背景技术
化学机械抛光平坦化（Chemical Mechanical Planarization，简称CMP）设备通常包括半导体设备前端模块（EFEM）、清洗单元和抛光单元。EFEM主要包括存放晶圆的片盒、传片机械手和空气净化系统等；清洗单元主要包括数量不等的兆声波清洗部件、滚刷清洗部件、干燥部件和各部件之间传输晶圆的装置等；抛光单元主要包括抛光台、抛光头、抛光供液系统和抛光垫修整系统等。
中国专利CN 105479324公开了《研磨装置及处理方法，抛光处理装置及方法》，其在附图25中显示，抛光台一侧设置有载片台，通过机械手将晶圆传递至载片台，抛光臂从载片台上取走晶圆进行抛光处理。由于载片台固定设置在抛光台的侧边，因此载片台的数量与抛光台一致或者多于抛光台的数量。
 发明内容
为了克服现有技术的不足，本发明提供一种载片台可以在抛光台之间移动传输，且移动传输结构稳定，布局合理的连续式晶圆抛光系统。
本发明解决其技术问题所采用的技术方案是：一种连续式晶圆抛光系统，包括：
支架；
抛光单元，包括设于支架一侧的抛光台，及连接在支架上的抛光臂；
传输通道，与所述支架平行设置；
晶圆载片装置，包括用于承载晶圆的载片台，用于驱动载片台升降的升降驱动机构，及用于驱动载片台平移的横向驱动机构，所述升降驱动机构连接在载片台下方，所述横向驱动机构位于载片台的第一侧；
支撑导轨，设于载片台的第二侧，该第二侧和第一侧相对设置；
所述载片台在横向驱动机构和支撑导轨的共同作用下沿支架平移，以接受不同抛光臂从抛光台上传输过来的晶圆，或者，将晶圆提供给不同抛光臂以传输至不同抛光台。
进一步的，所述晶圆载片装置的数量为多个，其载片台可独立控制平移。
进一步的，所述横向驱动机构设于载片台的第一侧和支架侧壁之间。
进一步的，所述横向驱动机构包括滑轨，驱动件，及可于滑轨内移动的传动件，所述滑轨设于传输通道的侧方。
进一步的，所述滑轨设于支架的侧壁，且具有侧方开口，所述驱动件位于滑轨内，所述传动件分别连接载片台第一侧的下表面和驱动件。
进一步的，所述横向驱动机构包括与支架相连的安装座，驱动件，及传动件，所述驱动件和传动件分别连接于所述载片台的下表面和安装座。
进一步的，所述驱动件为丝杠，所述传动件为移动螺帽；或者，所述驱动件为齿轮，所述传动件为直齿段；或者，所述驱动件为直线电机转子，所述传动件为直线电机定子。
进一步的，所述载片台的第一侧设有辅助支撑导轨，其至少部分与横向驱动机构一体设置，或者与横向驱动机构独立设置。
进一步的，所述支撑导轨，或辅助支撑导轨，或横向驱动机构的顶部齐平，以水平支承所述载片台。
进一步的，所述支撑导轨包括位于载片台第二侧的上部体，及位于支架的下部体，所述下部体沿传输通道连续延伸或间断设置。
进一步的，所述传输通道下方设有接水槽。
进一步的，所述抛光单元的数量为多个，其包括多个沿支架长度方向布设的抛光台。
进一步的，所述支架包括平行设置的左部体和右部体，及中间部体，所述传输通道位于左部体和右部体之间，且传输通道内设有并列的两组或多组晶圆载片装置。
本发明的有益效果是：1）晶圆载片装置可以在传输通道内移动，分别与不同的抛光臂配合，将晶圆传输给不同抛光台进行不同工序或相同工序的抛光工艺，整个抛光工序可以连续或同步进行，提高了抛光效率，同时简化了传输结构，甚至可以仅仅使用一个晶圆载片装置就能实现多个抛光台抛光工艺的连续或同步进行，使用成本降低，机台抛光产出速度提高；2）载片台在工作过程中需要与抛光头、机械手等装置对接，需要通过升降驱动机构驱动器沿竖直方向移动，而晶圆载片装置下方存在接水槽，横向驱动机构位于载片台的第一侧解决了晶圆载片装置的横向驱动机构的安装问题，布局设计合理；3）横向驱动机构和支撑导轨的配合，使得其可以承受晶圆载片装置的自身重力，以及抛光头与晶圆载片装置对接的过程中数百牛的接触力，在长时间使用后不会发生结构形变，保证晶圆的准确位置，以及抛光头与晶圆载片装置对接效果；4）横向驱动机构只是改变设置位置就能解决布局问题，不会增加晶圆载片装置的重量，简化整体结构，对使用寿命和运动精度都不会产生不利影响。
 附图说明
图1为本发明实施例一中的主视结构示意图。
图2为本发明实施例一中的立体结构示意图。
图3为本发明实施例一中晶圆载片装置和支撑导轨的配合主视结构示意图。
图4为本发明实施例一中支架之间设置两组晶圆载片装置的立体结构示意图。
图5为本发明实施例一中支架之间设置两组晶圆载片装置的主视结构示意图。
图6为本发明实施例一中局部立体结构示意图。
图7为本发明实施例一中驱动机构的结构示意图。
图8为本发明实施例一中局部主视结构示意图。
图9为本发明实施例二中的立体结构示意图。
图10为本发明实施例二中的主视结构示意图。
图11为本发明实施例三中的主视结构示意图。
图12为本发明实施例三中的立体结构示意图一。
图13为本发明实施例三中的立体结构示意图二，此时传输通道内有两个晶圆载片装置。
图14为本发明实施例四中局部主视结构示意图。
图15为本发明实施例四中局部立体结构示意图。
 实施方式
为了使本技术领域的人员更好的理解本发明方案，下面将结合本发明实施例中的附图，对发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
实施例
如图1-图5所示，一种连续式晶圆抛光系统，包括支架1，抛光单元，与支架1平行设置的传输通道3，晶圆载片装置5，及支撑导轨6。
抛光单元包括设置在支架1一侧、沿着支架1的长度方向布设的多个抛光台22，及连接在支架1上的多个抛光臂21，抛光台22和传输通道3分布在支架1的两侧。当然，在其他实施例中，抛光单元的数量可以是一个，此时抛光台22和抛光臂21的数量为一个。
晶圆载片装置5包括用于承载晶圆的载片台51，用于驱动载片台51升降的升降驱动机构52，及用于驱动载片台51平移的横向驱动机构7，升降驱动机构52连接在载片台51的下方，横向驱动机构7则位于载片台51的第一侧。
连续式晶圆抛光系统还包括至少部分位于传输通道3下方的接水槽4，接水槽4用于接住由于抛光工艺需要喷出的各种液体，晶圆载片装置5的升降驱动机构52朝着接水槽4的顶部开口设置，甚至有部分会从开口伸入接水槽4内。当然，也可以不设置接水槽4。
支撑导轨6设置在载片台51的第二侧，该第二侧和第一侧相对设置，换句话说，第一侧和第二侧分别位于升降驱动机构52的两侧。
载片台51在横向驱动机构7和支撑导轨6的共同作用下，沿着支架1平移，从而接受不同抛光臂21从抛光台22上传输过来的晶圆；或者，将晶圆提供给不同抛光臂21，从而传输至不同抛光台22进行抛光。
具体的，支架1包括平行、固定设置的左部体11和右部体12，传输通道3位于左部体11和右部体12之间。载片台51的第一侧为靠近右部体12的一侧，其第二侧为靠近左部体11的一侧。因此，以图1所示方向为例进行说明，支撑导轨6设置在左部体11和载片台51之间，横向驱动机构7设置在右部体12和载片台51之间。
此时，如果抛光台22的数量为多个，则可以在支架1的右部体12上连接相应数量的抛光臂21，而晶圆载片装置5的数量可以是一个，其沿着支架1的长度方向在传输通道3内连续平移，从而可以将晶圆在不同抛光台22之间传递。
当然在其他实施例中，晶圆载片装置5的数量可以为多个，每个晶圆载片装置5的载片台51可以独立控制平移或升降。
如图4、图5所示，也可以在传输通道3内设置有并列的两组晶圆载片装置5，此时，支架1包括平行、固定设置的左部体11、右部体12，和位于两者之间的中间部体13， 可以在左部体11远离右部体12的一侧设置一个或多个抛光台，在左部体11上连接相应数量的抛光臂，在右部体12远离左部体11的一侧设置一个或多个抛光台，在右部体12上连接相应数量的抛光臂。传输通道3被分为两部分，左部体11和中间部体13之间的部分传输通道内设置有一个或多个晶圆载片装置5，用于左侧抛光台晶圆的传输，右部体12和中间部体13之间的部分传输通道内设置有一个或多个晶圆载片装置5，用于右侧抛光台晶圆的传输。
具体的，如图6-图8所示，此时未示出左部体11，横向驱动机构7设置在载片台51的第一侧和支架1右部体12的侧壁之间，其包括滑轨71，驱动件72，及可以在滑轨71内移动的传动件73，滑轨71设置在传输通道3的侧方，更具体地说设置在接水槽4的侧方。
滑轨71设置在支架1右部体12的侧壁上，且具有侧方开口，即滑轨71开口朝向水槽4所在一侧，驱动件72位于滑轨71内，具体为丝杠，传动件73分别连接载片台51第一侧的下表面和驱动件72。换句话说，传动件73在驱动件72丝杠的驱动下沿着滑轨71平移，且由于受到滑轨71的限制，其不会产生偏移，平稳性较高。
再配合支撑导轨6，晶圆载片装置5的平移非常平稳，支撑导轨6和横向驱动机构7的顶部齐平，从而可以水平支承载片台51。具体的，如图3所示，支撑导轨6包括位于载片台51第二侧的上部体62，及位于支架1左部体11的下部体63，下部体63沿着传输通道3的长度方向设置，其可以是连续延伸，也可以是间断设置，具体根据实际应用场景设置。
实施例
如图9、图10所示，在本实施例中，横向驱动机构7包括与支架1右部体12相连的安装座74，驱动件72，及传动件73，驱动件72和传动件73分别连接载片台51的下表面和安装座74。
具体的，驱动件72为设置在载片台51下方的齿轮，当有多个晶圆载片装置5时，每个载片台51下方均设置齿轮，实现其独立控制的功能，传动件73为设置在安装座74上表面的直齿段，直齿段沿着支架1的长度方向延伸，齿轮在动力源的驱动下旋转，从而通过齿轮和直齿段的啮合，实现晶圆载片装置5在传输通道3内的移动传输。
本实施例与实施例一的不同之处还在于，载片台51的第一侧除了设置有横向驱动机构7，还设置有辅助支撑导轨61，其结构与支撑导轨6的结构相同，只不过下部体设置在安装座74上表面。
上述结构中，横向驱动机构7和辅助支撑导轨61相互独立设置，横向驱动机构7只起到驱动作用，不起支撑作用。当然，在其他实施例中，辅助支撑导轨61和横向驱动机构7还可以部分一体设置，换句话说，横向驱动机构7既起到驱动作用，还起到支撑作用。
此时，支撑导轨6、横向驱动机构7、辅助支撑导轨61的顶部齐平，从而可以水平支承载片台51。
其他结构与实施例一相同，不再赘述。
实施例
如图11-图13所示，本实施例与实施例二结构基本相同，不同之处在于，驱动件72为设置在安装座74上表面的丝杠，传动件73为安装在载片台51下方的移动螺帽，当有多个晶圆载片装置5时，每个载片台51下方均设置移动螺帽，丝杠转动时，多个移动螺帽可以实现同步运动，既多个载片台51同步平移。驱动件72丝杠沿着支架1的长度方向延伸，丝杠可以转动，从而通过丝杠和移动螺帽的配合，实现晶圆载片装置5在传输通道3内的移动传输。
其他结构与实施例二相同，不再赘述。
实施例
如图14、图15所示，本实施例与实施例二结构基本相同，不同之处在于，驱动件72为设置在载片台51下方的直线电机转子，当有多个晶圆载片装置5时，每个载片台51下方均设置直线电机转子，实现其独立控制的功能，传动件73为设置在安装座74上表面的直线电机定子，直线电机定子沿着支架1的长度方向延伸，从而通过直线电机定子和直线电机转子的配合，对直线电机转子位置进行控制，实现晶圆载片装置5在传输通道3内的移动传输。
其他结构与实施例二相同，不再赘述。
当然，横向驱动机构7也可以是现有技术中别的结构，只要能实现横向移动就行。
上述具体实施方式用来解释说明本发明，而不是对本发明进行限制，在本发明的精神和权利要求的保护范围内，对本发明作出的任何修改和改变，都落入本发明的保护范围。

Claims (13)

  1. 一种连续式晶圆抛光系统，其特征在于，包括：
    支架（1）；
    抛光单元，包括设于支架（1）一侧的抛光台（22），及连接在支架（1）上的抛光臂（21）；
    传输通道（3），与所述支架（1）平行设置；
    晶圆载片装置（5），包括用于承载晶圆的载片台（51），用于驱动载片台（51）升降的升降驱动机构（52），及用于驱动载片台（51）平移的横向驱动机构（7），所述升降驱动机构（52）连接在载片台（51）下方，所述横向驱动机构（7）位于载片台（51）的第一侧；
    支撑导轨（6），设于载片台（51）的第二侧，该第二侧和第一侧相对设置；
    所述载片台（51）在横向驱动机构（7）和支撑导轨（6）的共同作用下沿支架（1）平移，以接受不同抛光臂（21）从抛光台（22）上传输过来的晶圆，或者，将晶圆提供给不同抛光臂（21）以传输至不同抛光台（22）。
  2. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述晶圆载片装置（5）的数量为多个，其载片台（51）可独立控制平移。
  3. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述横向驱动机构（7）设于载片台（51）的第一侧和支架（1）侧壁之间。
  4. 根据权利要求1或3所述的连续式晶圆抛光系统，其特征在于：所述横向驱动机构（7）包括滑轨（71），驱动件（72），及可于滑轨（71）内移动的传动件（73），所述滑轨（71）设于传输通道（3）的侧方。
  5. 根据权利要求4所述的连续式晶圆抛光系统，其特征在于：所述滑轨（71）设于支架（1）的侧壁，且具有侧方开口，所述驱动件（72）位于滑轨（71）内，所述传动件（73）分别连接载片台（51）第一侧的下表面和驱动件（72）。
  6. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述横向驱动机构（7）包括与支架（1）相连的安装座（74），驱动件（72），及传动件（73），所述驱动件（72）和传动件（73）分别连接于所述载片台（51）的下表面和安装座（74）。
  7. 根据权利要求6所述的连续式晶圆抛光系统，其特征在于：所述驱动件（72）为丝杠，所述传动件（73）为移动螺帽；或者，所述驱动件（72）为齿轮，所述传动件（73）为直齿段；或者，所述驱动件（72）为直线电机转子，所述传动件（73）为直线电机定子。
  8. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述载片台（51）的第一侧设有辅助支撑导轨（61），其至少部分与横向驱动机构（7）一体设置，或者与横向驱动机构（7）独立设置。
  9. 根据权利要求8所述的连续式晶圆抛光系统，其特征在于：所述支撑导轨（6），或辅助支撑导轨（61），或横向驱动机构（7）的顶部齐平，以水平支承所述载片台（51）。
  10. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述支撑导轨（6）包括位于载片台（51）第二侧的上部体（62），及位于支架（1）的下部体（63），所述下部体（63）沿传输通道（3）连续延伸或间断设置。
  11. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述传输通道（3）下方设有接水槽（4）。
  12. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述抛光单元的数量为多个，其包括多个沿支架（1）长度方向布设的抛光台（22）。
  13. 根据权利要求1所述的连续式晶圆抛光系统，其特征在于：所述支架（1）包括平行设置的左部体（11）和右部体（12），及中间部体（13），所述传输通道（3）位于左部体（11）和右部体（12）之间，且传输通道（3）内设有并列的两组或多组晶圆载片装置（5）。
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