WO2024001381A1 - 一种电路板功率接触件测温装置 - Google Patents

一种电路板功率接触件测温装置 Download PDF

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Publication number
WO2024001381A1
WO2024001381A1 PCT/CN2023/086060 CN2023086060W WO2024001381A1 WO 2024001381 A1 WO2024001381 A1 WO 2024001381A1 CN 2023086060 W CN2023086060 W CN 2023086060W WO 2024001381 A1 WO2024001381 A1 WO 2024001381A1
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Prior art keywords
circuit board
power contact
temperature sensor
measuring device
temperature measuring
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PCT/CN2023/086060
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English (en)
French (fr)
Inventor
古乐乐
李晨光
王伟
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中航光电科技股份有限公司
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Publication of WO2024001381A1 publication Critical patent/WO2024001381A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors

Definitions

  • the utility model belongs to the field of temperature detection, and specifically relates to a circuit board power contact temperature measuring device.
  • temperature sensors are usually integrated on the circuit board to measure the temperature of the power contacts.
  • the temperature sensor can easily be broken down by the high voltage of the power contact.
  • the high voltage of the power contact can even break down the low voltage on the circuit board through the pins of the temperature sensor.
  • inaccurate temperature measurement may easily occur.
  • the purpose of this utility model is to provide a circuit board power contact temperature measuring device, which forms a heat transfer channel from the power contact to the temperature sensor through an insulating thermal conductor.
  • the temperature sensor can Being close to the power contact can not only prevent the temperature sensor from being broken down by high voltage, but also ensure the accuracy of temperature measurement.
  • a circuit board power contact temperature measurement device which includes a circuit board, a power contact and a temperature sensor, and is connected to the position corresponding to the power contact on the circuit board.
  • a thermal conductive object made of insulating material.
  • the thermal conductive object is provided with a profiled heat conduction surface that fits the surface of the power contact piece and a sensor receiving groove spaced apart from the profiled heat conduction surface to accommodate the temperature sensor.
  • the temperature sensor The connector is connected to the circuit board.
  • the profiled heat-conducting surface is a closed cylindrical surface or a cylindrical surface with openings in the circumferential direction.
  • cylindrical surface is a cylindrical surface, a prism surface or a combination of both.
  • a fixing groove is provided on the opposite side of the heat conductor and the circuit board, and a mounting hole is provided on the circuit board. The mounting hole is engaged with the fixing groove of the heat conductor to realize the connection between the heat conductor and the circuit board.
  • the heat conductor is provided with a connecting post
  • the circuit board is provided with a connection hole.
  • the connection between the heat conductor and the circuit board is achieved by plugging the connection hole with the connection post.
  • the circuit board is provided with mounting holes, and the connecting holes are arranged around the mounting holes.
  • a fixing groove is provided on the side where the thermal conductor and the circuit board are butted, and the mounting hole is engaged with the fixing groove of the thermal conductor.
  • a boss is provided on the side where the heat conductor and the circuit board meet, and the fixing grooves are provided on both sides of the boss.
  • the temperature sensor is provided with a bendable pin, which is connected to a pad on the circuit board, and the measurement end of the temperature sensor is located in the sensor receiving groove.
  • the temperature sensor is a chip-type temperature sensor.
  • the chip-type temperature sensor is attached to the pad of the circuit board and wrapped in the sensor receiving groove.
  • the utility model places the measuring end of the temperature sensor in an insulating thermal conductor, and the thermal conductor forms good insulation for the temperature sensor.
  • the chip of the measuring end of the temperature sensor can be closer to the power contact. , avoid being broken down by high voltage, and can reduce the heat transmission distance, improve the temperature measurement accuracy, increase the creepage distance, and establish a transmission channel between the temperature sensor and the thermal conductor;
  • the thermal conductor is close to the power contact through the profiling thermal conductive surface, and can establish The heat transmission channel between the thermal conductor and the power contact piece, so that the heat of the power contact piece is conducted to the temperature sensor through the heat conduction of the thermal conductor, ensuring the accuracy of the temperature sensor.
  • the utility model can use either a temperature sensor with pins or a patch temperature sensor.
  • a temperature sensor with pins compared to the existing technology, the connection position of the temperature sensor pins on the circuit board can remain unchanged. At this time, you only need to bend the temperature sensor pins and connect the temperature sensor If the chip is placed in the thermal conductor sensor receiving groove, it can be closer to the power contact.
  • the thermal conductor provides insulation protection for the temperature sensor to avoid breakdown by high voltage.
  • the chip temperature sensor is attached to the pad of the circuit board close to the power contact and is wrapped in the sensor receiving groove.
  • the thermal conductor can also be provided for the chip temperature sensor. Insulation protection to avoid breakdown by high voltage.
  • Figure 1 is an exploded view of the structure of the present utility model in Embodiment 1;
  • FIG. 2 is a schematic structural diagram of the thermal conductor in Embodiment 1;
  • Figure 3 is a side cross-sectional view of the utility model in Embodiment 2;
  • Circuit board Marked in the figure: 1. Circuit board, 2. Mounting hole, 3. Connection hole, 4. Temperature sensor, 5. Thermal conductor, 501. Via hole, 502. Profiled thermal conductive surface, 503. Sensor receiving groove, 504. Protrusion Platform, 505, fixed groove, 506, connecting column, 6, power contact.
  • Embodiment 1 As shown in Figures 1 and 2, a circuit board power contact temperature measurement device includes a circuit board 1, a temperature sensor 4, a thermal conductor 5 and a power contact 6.
  • the thermal conductor 5 is made of insulating and thermally conductive material. , such as rubber can be used to make thermal conductors.
  • the temperature sensor used in this embodiment has a bendable pin.
  • the circuit board 1 is provided with a mounting hole 2 and a connecting hole 3.
  • the thermal conductor 5 is installed in the mounting hole 2 and is fixedly connected to the circuit board 1 through the connection structure provided on the thermal conductor 5.
  • the thermal conductor 5 has The inner wall of the through hole 501 for the power contact 6 to pass through serves as a profiled heat conduction surface 502.
  • the profiled heat conduction surface 502 closely fits the surface of the power contact 6, so that the heat generated by the power contact 6 It can be conducted to the thermal conductor 5 through the profiling heat conduction surface 502; the end of the thermal conductor 5 away from the profiling heat conduction surface 502 is provided with a sensor accommodating groove 503. Put the measuring end of the temperature sensor 4 into the sensor accommodating groove 503.
  • the pin 4 is the connection end. The pin is bent at a certain angle and then welded to the pad of the circuit board 1.
  • the via hole 501 on the thermal conductor 5 is a circular through hole, and the hole wall is a closed cylindrical surface.
  • the first one is two connecting columns 506 provided on the side of the thermal conductor 5 facing the circuit board 1.
  • the ends of the connecting columns 506 are provided with conical heads, and the large diameter of the conical heads is The diameter of the end face is larger than the diameter of the connecting column 506, so that an annular stop surface surrounding the connecting column 506 is formed on the large diameter end face.
  • the tapered head is elastic.
  • the circuit board In the process of assembling the thermal conductor 5 on the circuit board 1, the circuit board The connecting hole 3 on 1 squeezes the conical head, causing the conical head to deform and pass through the connecting hole 3. Then the conical head recovers and is stuck around the connecting hole 3 of the circuit board 1 to realize the connection between the heat conductor 5 and the circuit board 1.
  • the second type is the boss 504 provided on the side of the heat conductor 5 facing the circuit board and the fixing grooves 505 provided on both sides of the boss 504.
  • the boss 504 has a certain elasticity.
  • the mounting hole 2 on the circuit board 1 squeezes the boss 504, so that the boss 504 deforms and crosses the mounting hole 2, and the edge of the mounting hole 2 snaps into the two fixing grooves 505 of the boss 504.
  • connection structures are used at the same time, and the boss 504 is arranged between the two connection columns 506.
  • boss 504 is arranged between the two connection columns 506.
  • the shape of the contoured heat conduction surface 502 on the heat conductor 5 depends on the shape of the portion of the power contact 6 that is in contact with the heat conductor.
  • the via hole 501 of the thermal conductor 5 is a circular through hole, and its profiled thermal conductive surface 502 is a circumferentially closed cylindrical surface.
  • the profiled thermal conductive surface 502 may be a circumferentially closed prism surface or a combined cylindrical surface including a cylindrical surface and a prism surface.
  • the utility model can move the measuring end of the temperature sensor 4 closer to the power contact 6 without changing the connection position of the existing temperature sensor 4 on the circuit board 1 .
  • the distance from the connection position to power contact 6 is 6mm. This distance can ensure that temperature sensor 4 will not be broken down by the high voltage of the power contact.
  • the measurement accuracy of the temperature sensor 4 will be adversely affected; after adopting the solution of the present utility model, the distance between the pin and the power contact 6 remains unchanged, and the pin is bent so that the measurement end of the temperature sensor 4 enters the heat conductor 5 In the installation hole 2, at this time, the measuring end of the temperature sensor 4 can be closer to the power contact 6, which can reach 2mm. Under the insulation protection of the heat conductor 5, the temperature sensor 4 is prevented from being broken down by high voltage, and at the same time the temperature sensor 4 is improved. Measurement accuracy.
  • the profiled heat conduction surface 502 can also be a cylindrical surface with openings in the circumferential direction, and can also be a cylindrical surface, a prism surface, or a cylindrical surface composed of both.
  • the temperature sensor 4 may also be a chip-type temperature sensor.
  • the chip-type temperature sensor is attached to the pad of the circuit board 1 and is wrapped in the sensor receiving groove 503 .
  • the thermal conductor 5 is embedded in the groove on the surface of the circuit board 1 to achieve connection with the circuit board 1 .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

一种电路板功率接触件测温装置，包括电路板（1）、功率接触件（6）和温度传感器（4），在电路板（1）上与功率接触件（6）相对应的位置连接有导热物（5），导热物（5）上设有与功率接触件（6）表面贴合的仿形导热面（502）以及与该仿形导热面（502）间隔设置的传感器容纳槽（503），以容纳该温度传感器（4），温度传感器（4）的连接部和电路板（1）连接。该测温装置通过绝缘的导热物（5）形成从功率接触件（6）到温度传感器（4）的热传递通道，在对温度传感器（4）形成绝缘的前提下，使得温度传感器（4）可以靠近功率接触件（6），既可以避免温度传感器（4）被高压击穿，又可以确保测温的准确度。

Description

一种电路板功率接触件测温装置 技术领域
本实用新型属于温度检测领域，具体涉及一种电路板功率接触件测温装置。
背景技术
电动汽车直流充电插座信号集成是行业发展方向，直流充电插座中通常将温度传感器集成在电路板上，对功率接触件进行测温。但是，为了测温更准确，将温度传感器靠近功率接触件安装，则温度传感器容易被功率接触件的高压击穿，甚至功率接触件的高压可以通过温度传感器的引脚击穿电路板上的低压部分，而为了避免温度传感器被击穿，如果将温度传感器远离功率接触件安装，则容易出现测温不准确的情况。
实用新型内容
本实用新型的目的是提供一种电路板功率接触件测温装置，通过绝缘的导热物形成从功率接触件到温度传感器的热传递通道，在对温度传感器形成绝缘的前提下，使得温度传感器可以靠近功率接触件，既可以避免温度传感器被高压击穿，又可以确保测温的准确度。
为了实现上述目的，本实用新型所采用的技术方案是：一种电路板功率接触件测温装置，包括电路板、功率接触件和温度传感器，在电路板上与功率接触件相对应的位置连接有绝缘材料制成的导热物，导热物上设有与功率接触件表面贴合的仿形导热面以及与所述仿形导热面间隔设置的传感器容纳槽，以容纳所述温度传感器，温度传感器的连接部和电路板连接。
作为一种实施方式，所述仿形导热面为闭合的柱面或周向设有开口的柱面。
进一步的，所述柱面为圆柱面、棱柱面或二者的组合。
作为另一种实施方式，所述导热物和电路板相对的一面设有固定槽，电路板上设有安装孔，安装孔和导热物的固定槽卡接以实现导热物和电路板的连接。
作为另一种实施方式，所述导热物上设有连接柱，所述电路板上设有连接孔，通过连接孔与连接柱的插接配合实现导热物和电路板的连接。
进一步的，所述电路板上设有安装孔，所述连接孔设置在安装孔的周围。
更进一步的，所述导热物和电路板对接的一面设有固定槽，安装孔和导热物的固定槽卡接。
作为一种选择，所述导热物和电路板对接的一面设有凸台，所述固定槽设置在凸台的两侧。
上述方案中，所述温度传感器设置有能够弯曲的引脚，引脚和电路板上的焊盘连接，温度传感器的测量端位于所述传感器容纳槽内。
上述方案中，所述温度传感器为贴片式温度传感器，贴片式温度传感器贴在电路板的焊盘上，并被包覆在所述传感器容纳槽内。
本实用新型的有益效果是：本实用新型将温度传感器的测量端放在绝缘的导热物内，由导热物对温度传感器形成良好的绝缘，这样可以将温度传感器的测量端的芯片更靠近功率接触件，避免被高压击穿，而且可以减少热量传输距离，提高温度测量精度，同时增加爬电距离，建立温度传感器与导热物的传输通道；导热物通过仿形导热面紧贴功率接触件，可以建立导热物和功率接触件的热量传输通道，从而功率接触件的热量通过导热物的热传导，传导至温度传感器，确保温度传感器的准确性。
本实用新型既可以使用带有引脚的温度传感器，也可以使用贴片式温度传感器。当使用带有引脚的温度传感器时，相较于现有技术，温度传感器的引脚在电路板上的连接位置可以保持不变，此时只需要弯折温度传感器的引脚，将温度传感器的芯片置于导热物传感器容纳槽内，就可以更加靠近功率接触件，由导热物为温度传感器提供绝缘保护，避免被高压击穿。当采用贴片式温度传感器时，贴片式温度传感器靠近功率接触件贴在电路板的焊盘上，并被包覆在所述传感器容纳槽内，导热物同样可以为贴片式温度传感器提供绝缘保护，避免被高压击穿。
附图说明
图1为实施例1中本实用新型的结构爆炸图；
图2为实施例1中导热物的结构示意图；
图3为实施例2中本实用新型的侧面剖视图；
图中标记：1、电路板，2、安装孔，3、连接孔，4、温度传感器，5、导热物，501、过孔，502、仿形导热面，503、传感器容纳槽，504、凸台，505、固定槽，506、连接柱，6、功率接触件。
具体实施方式
下面结合附图和实施例对本实用新型作进一步的详细说明，但并不作为对实用新型做任何限制的依据。
实施例1：如图1、2所示，一种电路板功率接触件测温装置，包括电路板1、温度传感器4、导热物5和功率接触件6，导热物5为绝缘导热材料制成，如可以利用橡胶制作导热物。本实施例采用的温度传感器具有能够折弯的引脚。
所述电路板1上设有安装孔2和连接孔3，所述导热物5安装在安装孔2内，并通过导热物5上设置的连接结构和电路板1固定连接，导热物5上具有供所述功率接触件6穿过的过孔501，过孔501的内壁作为仿形导热面502，仿形导热面502与功率接触件6的表面紧密贴合，使得功率接触件6产生的热量能够通过仿形导热面502传导至导热物5上；导热物5上远离仿形导热面502的一端设置有传感器容纳槽503，将温度传感器4的测量端放入传感器容纳槽503内，温度传感器4的引脚为连接端，引脚通过弯折一定的角度后焊接在电路板1的焊盘上。
继续参考图2所示，导热物5上的过孔501为圆形通孔，其孔壁为闭合的圆柱面。导热物5上连接结构有两种，第一种是设置在导热物5朝向电路板1一侧的两个连接柱506，连接柱506的端部设置有锥形头，锥形头的大径端端面直径大于连接柱506的直径，从而在大径端端面形成围绕连接柱506的环形止挡面，锥形头具有弹性，在将导热物5装配在电路板1上的过程中，电路板1上的连接孔3挤压锥形头，使得锥形头形变而穿过连接孔3，随后锥形头复原卡在电路板1的连接孔3周围，实现导热物5和电路板1的连接；第二种是设置在导热物5朝向电路板一侧的凸台504以及设置在凸台504两侧的固定槽505，凸台504具有一定的弹性，在将导热物5装配在电路板1上的过程中，电路板1上的安装孔2挤压凸台504，使得凸台504变形后越过安装孔2，安装孔2的孔沿卡入凸台504的两个固定槽505中，实现导热物5和电路板1的连接。
本实施例中，同时采用了这两种连接结构，将凸台504设置在两个连接柱506之间。在实际使用中，可以根据实际情况，只采用第一种或第二种连接结构也是可行的。
导热物5上仿形导热面502的形状取决于功率接触件6上与导热物接触的部分的形状。本实施例中，导热物5的过孔501为圆形通孔，其仿形导热面502为周向闭合的圆柱面。
在其他实施方式中，仿形导热面502可以是周向闭合的棱柱面或者是包括圆柱面和棱柱面的组合柱面。
本实用新型可以在不改变现有温度传感器4在电路板1上的连接位置，将温度传感器4的测量端更加靠近功率接触件6。例如：温度传感器4的引脚连接在电路板1的焊盘上后，连接位置到功率接触件6的距离为6mm，此距离可以保证温度传感器4不会被功率接触件的高压所击穿，但是温度传感器4的测量准确度会受到不良影响；采用本实用新型的方案后，该引脚到功率接触件6的距离不变，将引脚弯折，使得温度传感器4测量端进入导热物5的安装孔2内，此时温度传感器4的测量端可以更靠近功率接触件6，可以达到2mm，在导热物5的绝缘保护下，避免温度传感器4被高压击穿，同时提高温度传感器4的测量准确度。
实施例2：本实施例中，仿形导热面502还可以是周向设有开口的柱面，同样也可以是圆柱面、棱柱面或两者组合成的柱面。温度传感器4还可以是贴片式温度传感器，贴片式温度传感器贴在电路板1的焊盘上，并被包覆在所述传感器容纳槽503内。导热物5嵌设在电路板1表面的凹槽内，实现与电路板1的连接。
以上实施例仅用以说明本实用新型的技术方案而非对其进行限制，所属领域的普通技术人员应当理解，参照上述实施例可以对本实用新型的具体实施方式进行修改或者等同替换，这些未脱离本实用新型精神和范围的任何修改或者等同替换均在申请待批的权利要求保护范围之内。

Claims (10)

  1. 一种电路板功率接触件测温装置，包括电路板(1)、功率接触件(6)和温度传感器(4)，其特征在于：在电路板(1)上与功率接触件(6)相对应的位置连接有绝缘材料制成的导热物(5)，导热物(5)上设有与功率接触件(6)表面贴合的仿形导热面(502)以及与所述仿形导热面(502)间隔设置的传感器容纳槽(503)，以容纳所述温度传感器(4)，温度传感器(4)的连接部和电路板(1)连接。
  2. 根据权利要求1所述的一种电路板功率接触件测温装置，其特征在于：所述仿形导热面(502)为闭合的柱面或周向设有开口的柱面。
  3. 根据权利要求2所述的一种电路板功率接触件测温装置，其特征在于：所述柱面为圆柱面、棱柱面或二者的组合。
  4. 根据权利要求1所述的一种电路板功率接触件测温装置，其特征在于：所述导热物(5)上和电路板(1)相对的一面设有固定槽(505)，电路板(1)上设有安装孔(2)，安装孔(2)和导热物(5)的固定槽(505)卡接以实现导热物(5)和电路板(1)的连接。
  5. 根据权利要求1所述的一种电路板功率接触件测温装置，其特征在于：所述导热物(5)上设有连接柱(506)，所述电路板(1)上设有连接孔(3)，通过连接孔(3)与连接柱(506)的插接配合实现导热物(5)和电路板(1)的连接。
  6. 根据权利要求5所述的一种电路板功率接触件测温装置，其特征在于：所述电路板(1)上设有安装孔(2)，所述连接孔(3)设置在安装孔(2)的周围。
  7. 根据权利要求6所述的一种电路板功率接触件测温装置，其特征在于：所述导热物(5)上和电路板(1)相对的一面设有固定槽(505)，安装孔(2)和导热物(5)的固定槽(505)卡接。
  8. 根据权利要求4或7所述的一种电路板功率接触件测温装置，其特征在于：所述导热物(5)上和电路板(1)对接的一面设有凸台(504)，所述固定槽(505)设置在凸台(504)的两侧。
  9. 根据权利要求1～7任一项所述的一种电路板功率接触件测温装置，其特征在于：所述温度传感器(4)设置有能够弯曲的引脚，引脚和电路板(1)上的焊盘连接，温度传感器(4)的测量端位于所述传感器容纳槽(503)内。
  10. 根据权利要求1～7任一项所述的一种电路板功率接触件测温装置，其特征在于：所述温度传感器(4)为贴片式温度传感器，贴片式温度传感器贴在电路板(1)的焊盘上，并被包覆在所述传感器容纳槽(503)内。
PCT/CN2023/086060 2022-07-01 2023-04-04 一种电路板功率接触件测温装置 WO2024001381A1 (zh)

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