WO2024001162A1 - 散热器及通信设备 - Google Patents

散热器及通信设备 Download PDF

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Publication number
WO2024001162A1
WO2024001162A1 PCT/CN2023/072113 CN2023072113W WO2024001162A1 WO 2024001162 A1 WO2024001162 A1 WO 2024001162A1 CN 2023072113 W CN2023072113 W CN 2023072113W WO 2024001162 A1 WO2024001162 A1 WO 2024001162A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
substrate
heat
phase
heat sink
Prior art date
Application number
PCT/CN2023/072113
Other languages
English (en)
French (fr)
Inventor
段凯文
聂志东
刘欣
汪艳
陈晓雪
刘帆
李帅
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2024001162A1 publication Critical patent/WO2024001162A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures

Definitions

  • the present application relates to the field of communication technology, in particular to a radiator and communication equipment.
  • Embodiments of the present application provide a heat sink and communication equipment.
  • a heat sink including: a heat dissipation substrate, the heat dissipation substrate is used to absorb heat from a heat source, and a substrate cavity and a barrier structure are provided inside the heat dissipation substrate.
  • the barrier structure The structure is used to divide the substrate cavity into multiple substrate cavities, and the refrigerant working medium in two adjacent substrate cavities does not flow; a plurality of heat dissipation teeth are connected to the heat dissipation substrate.
  • an embodiment of the present application provides a communication device, including the heat sink described in the first aspect.
  • FIG. 1 is a schematic diagram of a heat sink provided by an embodiment of the present application.
  • Figure 2 is a cross-sectional view of a heat sink provided by an embodiment of the present application.
  • Figure 3 is a horizontal cross-sectional view of the heat dissipation substrate of the heat sink provided by one embodiment of the present application;
  • Figure 4 is a schematic diagram of an independent two-phase cycle between the substrate cavity of the radiator and the two-phase pipeline of the heat dissipation teeth provided by one embodiment of the present application;
  • Figure 5 is a schematic diagram of the two-phase pipes of the heat dissipation teeth of the radiator and the substrate cavity interconnected to form a connected two-phase circulation structure according to an embodiment of the present application;
  • FIG. 6 is a schematic diagram of the barrier structure of the radiator provided by an embodiment of the present application, which is arranged parallel to the tooth length direction of the heat dissipation teeth;
  • Figure 7 is a schematic diagram of the barrier structure of the radiator provided by an embodiment of the present application, which is arranged vertically with respect to the tooth length direction of the heat dissipation teeth;
  • Figure 8 is a schematic diagram of the barrier structure of the radiator provided by an embodiment of the present application, which is arranged vertically with respect to the tooth length direction of the heat dissipation teeth;
  • FIG. 9 is a schematic diagram of the barrier structure of the radiator provided by an embodiment of the present application and is arranged obliquely relative to the tooth length direction of the heat dissipation teeth;
  • Figure 10 is a schematic diagram of a support column of a heat dissipation substrate of a heat sink provided by an embodiment of the present application;
  • Figure 11 is a schematic diagram of a support column of a heat dissipation substrate of a heat sink provided by another embodiment of the present application.
  • Figure 12 is a schematic diagram of the cover structure formed by the bent portion of the top of the heat sink of the heat sink provided by one embodiment of the present application;
  • FIG. 13 is a schematic diagram of the peripheral flange of the heat dissipation substrate of the heat sink provided by an embodiment of the present application.
  • This application provides a radiator and communication equipment, wherein the radiator includes a heat dissipation substrate and a plurality of heat dissipation teeth.
  • the heat dissipation substrate is used to absorb heat from the heat source.
  • a substrate cavity and a barrier structure are provided inside the heat dissipation substrate.
  • the partition structure is used to divide the substrate cavity into multiple substrate cavities, so that the refrigerant working medium in two adjacent substrate cavities does not flow; a plurality of heat dissipation teeth are connected to the heat dissipation substrate.
  • the design of the heat dissipation substrate into multiple substrate cavities is technologically easier to meet the sealing performance of each small substrate cavity than the design of an integrated cavity, and it is also easier to meet the requirements when encountering In the case of dry burning, there are also problems in some substrate cavities, which will not affect the heat dissipation capacity of the entire radiator. Therefore, the reliability and redundancy of the radiator designed with multiple substrate cavities are improved, and it can be used for different applications.
  • different substrate cavities can be structurally configured to match the heat source, which can enhance the local heat dissipation capability of the radiator in a targeted manner.
  • Figure 1 is a schematic diagram of a radiator provided by an embodiment of the present application
  • Figure 2 is a cross-sectional view of a radiator provided by an embodiment of the present application
  • Figure 3 is a schematic diagram of a radiator provided by an embodiment of the present application.
  • the example provides a horizontal cross-sectional view of the heat sink base plate of the heat sink.
  • the heat sink 100 includes a heat dissipation substrate 110 and a plurality of heat dissipation teeth 120.
  • the heat dissipation substrate 110 is used to absorb heat from the heat source.
  • the heat dissipation substrate 110 is provided with a substrate cavity and a barrier structure 210 inside.
  • the barrier structure 210 is used to separate the substrate cavity.
  • the design of the heat dissipation substrate 110 into multiple substrate cavities 220 is beneficial to improving the reliability and redundancy of the radiator 100, and can be adapted to different heat source requirements.
  • the substrate cavity 220 can be adapted to the heat source. By making matching structural settings, the local heat dissipation capability of the radiator 100 can be enhanced in a targeted manner.
  • the heat dissipation gear fin 120 may be an ordinary metal gear fin, or a two-phase heat dissipation gear fin with a two-phase pipe 410 and filled with refrigerant, which is not specifically limited in this embodiment.
  • connection method between the heat dissipation teeth 120 and the heat dissipation substrate 110 may be cogs, adhesive teeth, riveting, or welding, which is not specifically limited in this embodiment.
  • barrier structure 210 may be a baffle or a bar, and may be an integrated structure with the heat dissipation substrate, or may be a separate structure from the heat dissipation substrate, which is not specifically limited in this embodiment.
  • the heat dissipation teeth 120 can be ordinary metal teeth. In this case, only the refrigerant working medium is required in the cavity of the substrate, and the two-phase temperature is equalized to achieve heat expansion within the plane of the substrate.
  • the refrigerant working fluid may be injected into all the substrate cavities 220 , or the refrigerant working fluid may be injected into some of the substrate cavities 220 , and the refrigerant working fluid may not be injected into some of the substrate cavities 220 , which is not specifically limited in this embodiment. .
  • the heat dissipation gear 120 is a two-phase heat dissipation gear with a two-phase pipe 410 and filled with refrigerant inside. At this time, within the flat plate range of the heat dissipation substrate 110 (horizontally) and within the heat dissipation plane range of the heat dissipation gear 120 (vertical) Both have two-phase temperature equalization capabilities, allowing the heat source on the back of the substrate to expand heat in three-dimensional space. As shown in FIG. 4 , when the heat dissipation gear 120 is a two-phase heat dissipation gear, the two-phase pipe 410 of the heat dissipation gear 120 can be an independent pipeline, which is independent of the substrate cavity.
  • the substrate cavity and the heat dissipation gear are separated.
  • the two-phase pipeline 410 of the slice 120 is an independent two-phase circulation.
  • the divided cavity design of the substrate cavity and the two-phase pipe 410 design of the heat dissipation teeth are independent of each other, and the substrate cavity can be freely designed as required.
  • the two-phase pipe 410 of the heat dissipation gear 120 is connected to the substrate cavity of the heat dissipation substrate through an open pipe.
  • the two-phase pipe 410 of the heat dissipation gear 120 and the substrate cavity of the heat dissipation substrate 110 are mutually connected. connected to form a connected two-phase circulation structure.
  • the two-phase structure radiator 100 can use a design divided into multiple substrate cavities 220, which is easier to meet the sealing performance of each small substrate cavity 220 than the design of an integrated cavity, and when encountering dryness When burning occurs, there are also problems with some substrate cavities 220, which will not affect the heat dissipation capacity of the entire radiator.
  • the reliability and redundancy of the radiator designed with multiple substrate cavities 220 are improved; at the same time, according to the heat source
  • the location characteristics of the distribution and targeted split-cavity design are conducive to improving the two-phase heat dissipation efficiency.
  • multiple local high heat flux density areas are designed into multiple independent two-phase circulation areas to achieve independent two-phase isothermal dehydration characteristics in each high heat flux density area, which can effectively improve the overall heat dissipation efficiency.
  • the way the substrate cavity 220 communicates with the two-phase pipeline 410 may be that one substrate cavity 220 is independently connected to one two-phase pipeline 410, or that one substrate cavity 220 is independently connected to multiple two-phase pipelines 410. It is also possible that two substrate cavities 220 are connected to one two-phase pipeline 410, which is not specifically limited in this embodiment.
  • each substrate cavity 220 and the corresponding two-phase pipe 410 form an independent circuit, as shown in Figure 6. If the blocking structure 210 is arranged parallel to the tooth length direction of the heat dissipation fins 120, each substrate cavity 220 and the two-phase pipes 410 of all the heat dissipation fins 120 in the corresponding area together form a plurality of independent two-phase circulations. area; or, as shown in FIGS.
  • the two-phase pipe 410 of the heat dissipation tooth plate 120 also needs to be divided according to the areas on the heat dissipation substrate 110
  • the substrate cavity 220 is provided with multiple independent two-phase pipes 410, so that the two-phase pipes 410 of the heat dissipation fins 120 and the substrate cavity together form a two-phase circulation area corresponding to multiple non-connected substrate cavities 220; or, As shown in FIG.
  • the two-phase pipes 410 of the heat dissipation fins 120 also need to be arranged according to the substrate cavity 220 divided on the heat dissipation substrate 110 .
  • the number of two-phase pipes 410 in the two-phase heat dissipation fins is the same as the number of the substrate cavities 220 connected to the two-phase heat dissipation fins, or may be greater than the number of the two-phase heat dissipation fins.
  • the number of the substrate cavities 220 that the teeth are connected to, that is, one heat dissipation gear 120 is provided with multiple two-phase pipes 410 in the same substrate cavity 220 .
  • a two-phase pipeline 410 refers to a pipeline that is continuously connected.
  • the shape of the two-phase pipeline 410 can be diverse, and this embodiment does not specifically limit it.
  • grooves are provided on the inner cavity surface of the heat dissipation substrate 110, especially the inner cavity surface of the heat source coverage area, to form a local liquid storage structure; the condensate is During gravity reflux, after passing through the groove, it will be temporarily stagnated in the groove due to its blocking effect; the condensate temporarily stored in the groove will be heated by the heat source on the back of the corresponding substrate, and will quickly evaporate and take away the heat, so it can effectively alleviate local problems. Dry burning problem in heat source area.
  • the inner cavity of the substrate cavity 220 in the heat dissipation substrate 110 corresponding to the middle and upper heat source can be Grooves are provided within the surface area; when the condensate at the bottom is carried upward by the upward steam, or when the condensate from the two-phase radiator fins flows back there to form replenishing liquid, the above grooves can produce liquid storage, which will flow through The liquid on the groove surface is temporarily retained, so that it can stay for a longer time and infiltrate the inner cavity surface of the heat dissipation substrate 110 in this area, thereby alleviating the problem of dry burning of the upper part of the substrate during counter-gravity applications.
  • the interior of the groove with the liquid storage function can be provided with micro-channels, sintered capillaries and other capillary structures.
  • the heat dissipation problem of the heat source in the middle and upper part of the heat dissipation substrate 110 can be better improved.
  • the inner cavity surface of the heat dissipation substrate 110 is a rough surface, and the rough surface can be generated by a sand blasting process and/or a metal particle cold spray process.
  • the surface microstructural features are formed to enhance boiling heat transfer.
  • the surface microstructural features are based on the center of the heat source and expand 1.5 times the heat source area as the surface treatment area to achieve the purpose of local enhanced heat dissipation of the chip.
  • sandblasting is a material removal process.
  • the inner cavity surface is impacted and worn by high-speed sand particles, forming countless small pits in the corresponding area, that is, groups of micro-pits; the pits are more likely to form vaporization cores during the heating process and produce bubbles, thereby significantly increasing the evaporation rate of the local refrigerant working fluid.
  • metal particle cold spraying is an additive process. Small-sized metal particles (copper, aluminum) are impacted at high speed so that they adhere to the surface of the inner cavity to form a group of tiny capillary particles; Different pits can also achieve the purpose of increasing the vaporization core; when the heat dissipation substrate 110 absorbs heat, the heat is transferred to the above-mentioned metal particles through the substrate. At this time, the liquid refrigerant working fluid immersed in the pits is heated by the surface of the powder particles. Small bubbles are gradually generated from the pockets, significantly increasing the local evaporation rate. It should be noted that surface microstructural features that enhance boiling heat transfer can also be provided inside the pits with liquid storage function.
  • the structural strength of the heat sink 100 needs to be improved; during application, the heat dissipation substrate 110
  • the refrigerant in the substrate cavity 220 is heated and evaporates, which will cause the pressure of the substrate cavity 220 to increase suddenly, which will easily form a bulge in the middle of the heat dissipation substrate 110; the bulging in the middle of the heat dissipation substrate 110 will cause the connection between the heat dissipation substrate 110 and the heat dissipation teeth 120.
  • the area is warped, resulting in multiple deformation, damage, and failure problems.
  • support columns 1010 can be provided through the substrate cavity to enhance the structural strength of the radiator 100. Different diameters can be used for different needs.
  • the support columns 1010 are jointly arranged for structural strengthening; for example, as shown in Figure 10, a strengthening plan is used to arrange large-diameter support columns 1010 in the middle and small-diameter support columns 1010 on both sides; or, as shown in Figure 10 As shown in 11, small-diameter support columns 1010 are used in a large area, large-diameter support columns 1010 are used in a small area, and the large and small support columns 1010 are staggered. Through the above strengthening method, large-diameter support columns 1010 are used to strengthen the structure. Strength, while using small-diameter support pillars 1010 to reduce the coverage area of the solid area and increase the coverage area of the cavity, thereby achieving the dual effects of structural strength and heat dissipation enhancement.
  • diameters of the plurality of support pillars 1010 may be the same or different, depending on the specific structural configuration of the heat sink 100, which is not specifically limited in this embodiment.
  • the top of the heat dissipation fins 120 can be bent to obtain a bent portion 1210, and a plurality of adjacent heat dissipation fins 120
  • the bent portions 1210 are connected to each other to form a cover structure.
  • the coverage of the two-phase pipe 410 of the heat sink fin 120 is extended to the bending part 1210, so that the cover plate participates in the two-phase heat dissipation.
  • the heat diffusion range of the two-phase uniform temperature can be further expanded.
  • the heat diffusion area is closer to the external cold source, that is, the overall two-phase heat dissipation efficiency of the radiator 100 is higher.
  • the walls on both sides of the weld need to be of equal thickness to facilitate the pressing and fixing of the welding tool. ; Otherwise, since the material around the weld will melt into a liquid state during the welding process, the liquid material can flow freely and will form depressions on unequal height surfaces, thus affecting the appearance of the weld and the welding quality; Generally speaking, when the heat dissipation substrate When the thickness of 110 exceeds the required thickness of the welding depth, an outer peripheral flange 1310 can be set.
  • the thickness of the outer peripheral flange 1310 is consistent with the welding depth, and the width of the outer peripheral flange 1310 is consistent with the friction stir welding influence range; as shown in Figure 13 , through the design of the thinner peripheral flange 1310, the structural thickness of the radiator 100 and the outer shell around the weld can be reasonably thinned, which is beneficial to the overall lightweight design of the device.
  • embodiments of the present application provide a communication device that includes the heat sink in the above embodiments.
  • the communication device can implement various embodiments of the above heat sink, the technical means used, the technical problems solved, and The technical effects achieved are consistent and will not be described in detail here. For details, please refer to each embodiment of the radiator mentioned above.
  • the radiator includes a heat dissipation substrate and a plurality of heat dissipation teeth.
  • the heat dissipation substrate is used to absorb heat from a heat source.
  • a substrate cavity and a barrier structure are provided inside the heat dissipation substrate.
  • the barrier structure The structure is used to divide the substrate cavity into multiple substrate cavities, and the refrigerant working fluid in two adjacent substrate cavities does not flow; multiple heat dissipation teeth are connected to the heat dissipation substrate.
  • most radiators on the market are designed with an integrated cavity. However, the cavity of this type of radiator is large, and it is difficult to ensure its sealing during the manufacturing process. The finished product has problems of low sealing and low reliability.
  • the design of multiple substrate cavities for the heat dissipation substrate is technologically easier to meet the sealing performance of each small substrate cavity than the design of an integrated cavity, and in case of In the case of dry burning, there are also problems in some substrate cavities, which will not affect the heat dissipation capacity of the entire radiator. Therefore, the reliability and redundancy of the radiator designed with multiple substrate cavities are improved, and it can be used for different purposes.
  • different substrate cavities can be structurally configured to match the heat source, which can enhance the local heat dissipation capability of the radiator in a targeted manner.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本申请公开了一种散热器(100)及通信设备，该散热器(100)包括散热基板(110)和多个散热齿片(120)，散热基板(110)用于吸收热源热量，散热基板(110)的内部设置有基板空腔和挡隔结构(210)，挡隔结构(210)用于将基板空腔分割为多个基板腔体(220)，相邻两个基板腔体(220)中的冷媒工质不流通；多个散热齿片(120)，与散热基板(110)连接。

Description

散热器及通信设备
相关申请的交叉引用
本申请基于申请号为202210736640.3、申请日为2022年06月27日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及通信技术领域，尤其是一种散热器及通信设备。
背景技术
随着电力电子技术的高速发展，电子设备越来越向大容量、大功率、高集成、轻量化方向发展，由此导致了设备系统的热耗密度越来越大，环境适应性需求越来越高，电子设备的高可靠性散热问题已经逐渐成为遏制各相关行业发展的瓶颈。目前的散热器主要通过两相翅片的高导热、高均温特性，用以替代传统散热器的金属翅片，虽然可以显著提升散热效率，但是当基板局部热耗过高时，两相散热齿片依然难以解决高热流密度处的局部超温问题，而且可靠性不足。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种散热器及通信设备。
第一方面，本申请实施例提供了一种散热器，包括：散热基板，所述散热基板用于吸收热源热量，所述散热基板的内部设置有基板空腔和挡隔结构，所述挡隔结构用于将所述基板空腔分割为多个基板腔体，相邻两个所述基板腔体中的冷媒工质不流通；多个散热齿片，与所述散热基板连接。
第二方面，本申请实施例提供了一种通信设备，包括第一方面所述的散热器。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1是本申请一个实施例提供的散热器的示意图；
图2是本申请一个实施例提供的散热器的截面图；
图3是本申请一个实施例提供的散热器的散热基板水平截面图；
图4是本申请一个实施例提供的散热器的基板空腔与散热齿片的两相管道为独立两相循环的示意图；
图5是本申请一个实施例提供的散热器的散热齿片的两相管道与基板空腔相互连通形成连通式两相循环结构的示意图；
图6是本申请一个实施例提供的散热器的挡隔结构相对于散热齿片的齿长方向平行设置的示意图；
图7是本申请一个实施例提供的散热器的挡隔结构相对于散热齿片的齿长方向垂直设置的示意图；
图8是本申请一个实施例提供的散热器的挡隔结构相对于散热齿片的齿长方向垂直设置的示意图；
图9是本申请一个实施例提供的散热器的挡隔结构相对于散热齿片的齿长方向倾斜设置的示意图；
图10是本申请一个实施例提供的散热器的散热基板的支撑柱的示意图；
图11是本申请另一个实施例提供的散热器的散热基板的支撑柱的示意图；
图12是本申请一个实施例提供的散热器的通过散热齿片顶部的折弯部形成盖板结构的示意图；
图13是本申请一个实施例提供的散热器的散热基板的外周凸缘的示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
需要说明的是，说明书和权利要求书及上述附图中的术语“多个”指的是两个或者两个以上。
本申请提供了一种散热器及通信设备，其中，该散热器包括散热基板和多个散热齿片，散热基板用于吸收热源热量，散热基板的内部设置有基板空腔和挡隔结构，挡隔结构用于将基板空腔分割为多个基板腔体，相邻两个基板腔体中的冷媒工质不流通；多个散热齿片，与散热基板连接。在本实施例的技术方案中，对散热基板的分多个基板腔体设计，在工艺上相对于一体式腔体的设计更容易满足每个小的基板腔体的密封性，而且在遇到干烧情况时也是部分基板腔体存在问题，不会影响到整个散热器的散热能力，因此该分多个基板腔体设计的散热器的可靠性、冗余性得到提高，而且可以针对不同的热源要求，不同的基板腔体可以针对热源做匹配的结构设置，能够针对性地强化散热器的局部散热能力。
下面结合附图，对本申请实施例作进一步阐述。
如图1、图2、图3所示，图1是本申请一个实施例提供的散热器的示意图，图2是本申请一个实施例提供的散热器的截面图，图3是本申请一个实施例提供的散热器的散热基板的水平截面图。散热器100包括散热基板110和多个散热齿片120，散热基板110用于吸收热源热量，散热基板110的内部设置有基板空腔和挡隔结构210，挡隔结构210用于将基板空腔分割为多个基板腔体220，相邻两个基板腔体220中的冷媒工质不流通；多个散热齿片120，与散热基板110连接。在本实施例的技术方案中，散热基板110的分多个基板腔体220设计有利于提高散热器100的可靠性、冗余性，而且可以针对不同的热源要求，基板腔体220可以针对热源做匹配的结构设置，能够针对性地强化散热器100的局部散热能力。
需要说明的是，散热齿片120可以是普通金属齿片，也可以是带有两相管道410并内部充注有冷媒的两相散热齿片，本实施例对其不作具体限定。
需要说明的是，散热齿片120与散热基板110的连接方式可以是嵌齿，可以是粘齿，可以是铆接，还可以是焊接，本实施例对其不作具体限定。
需要说明的是，挡隔结构210可以是挡板，也可以是档条，可以和散热基板为一体式结构，也可以和散热基板为分体式结构，本实施例对其不作具体限定。
如图1所示，散热齿片120可以为普通金属齿片，此时仅需要在基板空腔内具有冷媒工质，两相均温在基板平面范围内实现热量扩展。
需要说明的是，可以是全部基板腔体220均注入冷媒工质，也可以是部分基板腔体220注入冷媒工质，部分基板腔体220不注入冷媒工质，本实施例对其不作具体限定。
散热齿片120为带有两相管道410并内部充注有冷媒的两相散热齿片，此时，在散热基板110平板范围内(水平)、散热齿片120的散热平面范围内(垂直)均具有两相均温能力，使基板背面的热源能够在三维空间进行热量扩展。如图4所示，当散热齿片120为两相散热齿片时，散热齿片120的两相管道410可以采用独立式管路，与基板空腔相互独立，此时基板空腔与散热齿片120的两相管道410为独立两相循环。基板空腔的分腔设计与散热齿的两相管道410设计相互独立，基板空腔可按需自由设计。
如图5所示，散热齿片120的两相管道410采用开放式管路与散热基板的基板空腔相连通，此时散热齿片120的两相管道410与散热基板110的基板空腔相互连通，形成连通式两相循环结构。该两相结构的散热器100可以利用分成多个基板腔体220的设计在工艺上相对于一体式腔体的设计更容易满足每个小的基板腔体220的密封性，而且在遇到干烧情况时也是部分基板腔体220存在问题，不会影响到整个散热器的散热能力，因此该分多个基板腔体220设计的散热器的可靠性、冗余性得到提高；同时，根据热源分布的位置特性，针对性开展分腔设计，有利于提升两相散热效率。例如，将多位置的局部高热流密度区域，分别设计为多个独立两相循环区域，以实现各高热流密度区的独立两相均温解热特性，能够有效提升整体散热效率。需要说明的是，基板腔体220与两相管道410连通的方式可以是一个基板腔体220与一个两相管道410独立连通，可以是一个基板腔体220与多个两相管道410独立连通，还可以是两个基板腔体220与一个两相管道410连通，本实施例对其不作具体限定。
在散热齿片120的两相管道410与散热基板110的基板空腔相互连通的情况下，每一个所述基板腔体220与对应的两相管道410形成独立的回路，如图6所示，若挡隔结构210相对于散热齿片120的齿长方向平行设置时，则各基板腔体220与其对应区域内的所有散热齿片120的两相管道410共同构成多个各自独立的两相循环区域；或者，如图7、8所示，若挡隔结构210相对于散热齿片120的齿长方向垂直设置时，则散热齿片120的两相管道410也需要按照散热基板110上划分的基板腔体220设置多个独立的两相管道410，从而使得散热齿片120的两相管道410与基板空腔共同组成互不连通的多个基板腔体220对应的两相循环区域；或者，如图9所示，若挡隔结构210相对于散热齿片120的齿长方向倾斜设置时，则散热齿片120的两相管道410也需要按照散热基板110上划分的基板腔体220设置多个独立的两相管道410，从而使得散热齿片120的两相管道410与基板空腔共同组成互不连通的多个基板腔体220对应的两相循环区域。需要说明的是，两相散热齿片中的两相管道410的数量与所述两相散热齿片连通的所述基板腔体220的数量相同，也可以是大于与所述两相散热 齿片连通的所述基板腔体220的数量，即一个散热齿片120在同一个基板腔体220中设置多个两相管道410。可以理解的是，本实施例中一个两相管道410指的是不间断连通的管道，两相管道410的形状可以是多样的，本实施例对其不作具体限定。
在一实施例中，基于上述的实施例的散热器100结构中，针对散热基板110的内腔面，尤其是热源覆盖区域的内腔面设置有凹槽以形成局部储液结构；冷凝液受重力回流时，经过凹槽后会受其阻滞作用暂时停滞在凹槽中；暂存在凹槽中的冷凝液受对应基板背面的热源加热，将快速蒸发并带走热量，因此可以有效缓解局部热源区域的干烧问题。
当散热基板110在竖直状态下应用时，受重力影响，基板上部容易发生热蒸汽积聚从而导致干烧；此时，可以在中上部热源对应的散热基板110中的基板腔体220的内腔面区域范围内设置凹槽；当下部冷凝液受上行蒸汽的携带作用上冲，或两相散热齿片的冷凝液回流至该处形成补液时，上述凹槽能够产生储液作用，将流经凹槽面的液体暂时性留住，使其可以有更长时间停留并浸润该区域的散热基板110的内腔面，从而能够缓解逆重力应用时的基板上部干烧问题。
需要说明的是，具有储液功能的凹槽的内部可设置微槽道、烧结毛细等毛细结构，配合凹槽特征，能够更好地提升散热基板110中上部热源散热问题。
在一实施例中，基于上述的实施例的散热器100结构中，针对散热基板110的内腔面为粗糙面，该粗糙面可以是通过喷砂工艺和/或金属颗粒冷喷工艺生成的以形成强化沸腾换热的表面微结构特征，表面微结构特征以热源中心为基准，外扩1.5倍热源面积作为表面处理区域，达到芯片局部强化散热目的。
一方面，喷砂属于去材工艺，内腔面受高速砂粒冲击、磨损，在相应区域内形成无数个小凹坑，即微小凹坑群；凹坑在受热过程中更容易形成汽化核心并产生气泡，从而显著增加局部的冷媒工质的蒸发速率。
另一方面，金属颗粒冷喷属于增材工艺，将小粒径的金属颗粒(铜、铝)通过高速撞击，使其附着于内腔面的表面，形成微小毛细颗粒群；各个颗粒间形成大小不一的凹坑，同样能够达到增加汽化核心目的；当散热基板110吸热后，热量通过基板传递至上述金属颗粒，此时浸润在凹坑中的液态的冷媒工质受粉末颗粒表面加热，逐渐从凹穴中生成小气泡，从而显著增加局部的蒸发速率。需要说明的是，具有储液功能的凹坑的内部也可设置强化沸腾换热的表面微结构特征。
在一实施例中，基于上述的实施例的散热器100结构中，为了进一步提高散热器100的可靠性问题，需要对散热器100的结构强度进行提高处理；在应用过程中，散热基板110的基板腔体220内的冷媒受热蒸发，会导致基板腔体220的压力骤增，从而极易在散热基板110的中部形成鼓胀；散热基板110中部鼓胀会导致散热基板110与散热齿片120的连接区域发生翘曲，从而出现多处变形、破损、失效的问题；针对上述问题，可以通过基板空腔设置有若干个支撑柱1010，加强散热器100结构强度，针对不同的需要，可采用不同直径的支撑柱1010联合排布以进行结构强化；例如，如图10所示，中部采用大直径的支撑柱1010排布、双侧采用小直径的支撑柱1010排布的强化方案；或者，如图11所示，大范围采用小直径的支撑柱1010、小范围采用大直径的支撑柱1010，大小支撑柱1010间交错排布的强化方案；通过上述强化方式，利用大直径的支撑柱1010加强结构强度，同时利用小直径支撑柱1010减小实体区域覆盖面积，并增加空腔覆盖面积，从而达成结构强度与散热强化的双重效果。
需要说明的是，多个支撑柱1010的直径可以是相同的，也可以是不相同的，根据散热器100的具体结构设置，本实施例对其不作具体限定。
在一实施例中，为了进一步提升散热器100的散热性能，如图12所示，可以将散热齿片120的顶部进行折弯处理，得到折弯部1210，多个相邻的散热齿片120的所述折弯部1210相互连接以形成盖板结构。在一实施例中，将散热齿片120的两相管道410覆盖范围延伸至折弯部1210，从而使盖板参与两相散热，那么此时，两相均温的热扩散范围能够进一步扩大，并且使得热扩散区域距离外部冷源更近，即散热器100整体的两相散热效率更高。
在一实施例中，当采用焊接工艺(激光焊、搅拌摩擦焊等)使散热器100与外部壳体相连接时，通常焊缝两侧壁面需要等厚，以方便焊接工装的顶压和固定；否则，由于在焊接过程中焊缝周围材料会熔成液态，液态的材料能够自由流动，会在不等高面处形成凹陷，从而影响焊缝外观及焊接质量；通常来说，当散热基板110厚度超过焊深需求厚度时，可设置外周凸缘1310，其中，外周凸缘1310的厚度与焊接深度保持一致，外周凸缘1310的宽度与搅拌摩擦焊影响范围保持一致；如图13所示，通过厚度较薄的外周凸缘1310设计，可以合理地减薄散热器100及外壳体在焊缝周围的结构厚度尺寸，从而有利于设备总体的轻量化设计。
另外，本申请的实施例提供了一种通信设备，该通信设备包括上述实施例中的散热器，通信设备能够实现上述散热器的各个实施例，其所使用的技术手段、解决的技术问题以及达到的技术效果一致，此处不作具体赘述，详见上述散热器的各个实施例。
本申请实施例的一种散热器及通信设备，该散热器包括散热基板和多个散热齿片，散热基板用于吸收热源热量，散热基板的内部设置有基板空腔和挡隔结构，挡隔结构用于将基板空腔分割为多个基板腔体，相邻两个基板腔体中的冷媒工质不流通；多个散热齿片，与散热基板连接。目前，市场上大部分都是一体式腔体设计的散热器，而该类散热器的腔体体积大，制造过程中难以保证其密封性，成品存在密封性低、可靠性低的问题，需要经常维护。而在本实施例的技术方案中，对散热基板的分多个基板腔体设计，在工艺上相对于一体式腔体的设计更容易满足每个小的基板腔体的密封性，而且在遇到干烧情况时也是部分基板腔体存在问题，不会影响到整个散热器的散热能力，因此该分多个基板腔体设计的散热器的可靠性、冗余性得到提高，而且可以针对不同的热源要求，不同的基板腔体可以针对热源做匹配的结构设置，能够针对性地强化散热器的局部散热能力。
以上是对本申请的若干实施进行了具体说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请本质的前提下还可作出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (14)

  1. 一种散热器，包括：
    散热基板，所述散热基板用于吸收热源热量，所述散热基板的内部设置有基板空腔和挡隔结构，所述挡隔结构用于将所述基板空腔分割为多个基板腔体，相邻两个所述基板腔体中的冷媒工质不流通；
    多个散热齿片，与所述散热基板连接。
  2. 根据权利要求1所述的散热器，其中，所述散热齿片为两相散热齿片。
  3. 根据权利要求2所述的散热器，其中，所述两相散热齿片中的两相管道与所述基板腔体连通。
  4. 根据权利要求3所述的散热器，其中，每一个所述基板腔体与对应的所述两相管道形成独立的回路。
  5. 根据权利要求4所述的散热器，其中，所述两相散热齿片中的两相管道的数量与所述两相散热齿片连通的所述基板腔体的数量相同。
  6. 根据权利要求2所述的散热器，其中，所述两相散热齿片的两相管道与所述基板腔体不连通。
  7. 根据权利要求1所述的散热器，其中，所述散热基板的内腔面设置有凹槽，以形成局部储液结构。
  8. 根据权利要求1所述的散热器，其中，所述散热基板的内腔面为粗糙面。
  9. 根据权利要求8所述的散热器，其中，所述粗糙面通过喷砂工艺生成，和/或通过颗粒冷喷工艺生成。
  10. 根据权利要求1所述的散热器，其中，所述基板空腔设置有若干个支撑柱。
  11. 根据权利要求10所述的散热器，其中，所述支撑柱的数量为多个，至少两个所述支撑柱的直径不同。
  12. 根据权利要求1所述的散热器，其中，至少部分所述散热齿片的顶部设置有折弯部，多个相邻的散热齿片的所述折弯部形成盖板结构。
  13. 根据权利要求1所述的散热器，其中，所述散热基板还设置有外周凸缘，所述外周凸缘用于与外部壳体进行连接。
  14. 一种通信设备，包括权利要求1至13任意一项所述的散热器。
PCT/CN2023/072113 2022-06-27 2023-01-13 散热器及通信设备 WO2024001162A1 (zh)

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